| 37th week of 2012 patent applcation highlights part 17 |
| Patent application number | Title | Published |
|---|
| 20120228750 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes a semiconductor chip having a front surface and a rear surface, a sealing resin layer stacked on the front surface of the semiconductor chip, a post passing through the sealing resin layer in the thickness direction and having a side surface flush with a side surface of the sealing resin layer and a forward end surface flush with a front surface of the sealing resin layer, and an external connecting terminal provided on the forward end surface of the post. | 2012-09-13 |
| 20120228751 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and method of manufacture are provided. The semiconductor package may include a package substrate, a semiconductor chip, a molding member and a grounding member. The package substrate may include a ground pad and a signal pad. The semiconductor chip may be arranged on an upper surface of the package substrate. The semiconductor chip may be electrically connected with the signal pad of the package substrate. The molding member may be formed on the upper surface of the package substrate to cover the semiconductor chip. The grounding member may be arranged on a surface of the molding member. The grounding member may be electrically connected with the ground pad. | 2012-09-13 |
| 20120228752 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer. | 2012-09-13 |
| 20120228753 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH UNDERFILLING STRUCTURES AND METHOD OF MANUFACTURE THEREOF - A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity. | 2012-09-13 |
| 20120228754 | CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME - The various embodiments of the present invention provide a novel chip-last embedded structure, wherein an IC is embedded within a one to two metal layer substrate. The various embodiments of the present invention are comparable to other two-dimensional and three-dimensional WLFO packages of the prior art as the embodiments have similar package thicknesses and X-Y form factors, short interconnect lengths, fine-pitch interconnects to chip I/Os, a reduced layer count for re-distribution of chip I/O pads to ball grid arrays (BGA) or land grid arrays (LGA), and improved thermal management options. | 2012-09-13 |
| 20120228755 | SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF - A semiconductor module includes a high frequency chip, an insulating cap, a through electrode, interconnections, and an insulating layer. The insulating cap forms a hollow with the chip to cover the chip. The through electrode passes through a first plane of the cap and a second plane of the cap, the first plane facing the chip, the second plane being on a side opposite to the first plane. The interconnections are provided on the cap and connected to the through electrode. The insulating layer is provided on the cap and fills a portion between the interconnections therewith. | 2012-09-13 |
| 20120228756 | SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUCTOR HOUSING - A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body. | 2012-09-13 |
| 20120228757 | COOLING STRUCTURE OF SEMICONDUCTOR DEVICE - A cooling structure of a semiconductor device includes an output electrode, a semiconductor element and a semiconductor element disposed to face each other with the output electrode interposed therebetween, a radiator disposed for the semiconductor element on a side opposite to the output electrode, and a radiator disposed for the semiconductor element on the side opposite to the output electrode. The output electrode includes an element mounting portion and a heat transport portion. The element mounting portion is electrically connected to the semiconductor element and the semiconductor element, and is formed of a conductive material. The heat transport portion is disposed to extend from the element mounting portion toward the radiator and the radiator. With this structure, a cooling structure of a semiconductor device with which excellent cooling efficiency is realized can be provided. | 2012-09-13 |
| 20120228758 | ELECTRON BEAM INDUCED DEPOSITION OF INTERFACE TO CARBON NANOTUBE - A system and method are provided for fabricating a low electric resistance ohmic contact, or interface, between a Carbon Nanotube (CNT) and a desired node on a substrate. In one embodiment, the CNT is a Multiwalled, or Multiwall, Carbon Nanotube (MWCNT), and the interface provides a low electric resistance ohmic contact between all conduction shells, or at least a majority of conduction shells, of the MWCNT and the desired node on the substrate. In one embodiment, a Focused Electron Beam Chemical Vapor Deposition (FEB-CVD) process is used to deposit an interface material near an exposed end of the MWCNT in such a manner that surface diffusion of precursor molecules used in the FEB-CVD process induces lateral spread of the deposited interface material into the exposed end of the MWCNT, thereby providing a contact to all conduction shells, or at least a majority of the conduction shells, of the MWCNT. | 2012-09-13 |
| 20120228759 | SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES - A semiconductor package having dual parallel wires is disclosed. A chip is attached on a substrate where the chip and the substrate are electrically connected by a bonding wire. The bonding wire consists of a first metal wire, a second metal wire, and an insulating body where the insulating body encapsulates the first and the second metal wires to make both metal wires parallel to each other. The insulating body forms a constant gap between the first and the second metal wires so that both metal wires do not contact to each other. Therefore, the electrical performance of the package can greatly be enhanced with the same productivity. | 2012-09-13 |
| 20120228760 | SYSTEMS INCLUDING AN I/O STACK AND METHODS FOR FABRICATING SUCH SYSTEMS - Systems including an input/output (I/O) stack and methods for fabricating such systems are described. In one implementation, the methods include stacking an I/O die including I/O elements and excluding a logic element. Also in one implementation, the methods further include stacking an integrated circuit die with respect to the I/O die. The integrated circuit includes logic elements and excludes an I/O element. The separation of the I/O die from the integrated circuit die provides various benefits, such as independent development of each of the dies and more space for the I/O elements on an I/O substrate of the I/O die compared to that in a conventional die. The increase in space allows new process generation of the integrated circuit die in which an increasing number of logic elements are fitted within the same surface area of a substrate of the integrated circuit die. | 2012-09-13 |
| 20120228761 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a first substrate and a second substrate being bonded to each other, a posterior interconnect layer interposed between the first and second substrates, a weld pad disposed in the posterior interconnect layer, and a first annular opening disposed in the first substrate. The device further includes a dielectric layer formed in the first opening, a via surrounded by the first annular opening, and an interconnect layer disposed in the via. The device also includes a conductive bump disposed on the interconnect layer and electrically connected to the weld pad through the interconnect layer. | 2012-09-13 |
| 20120228762 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less. | 2012-09-13 |
| 20120228763 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device including a pillar formed in a highly reliable manner and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a semiconductor chip including an internal circuit area and an I/O area disposed outside the internal circuit area, a package substrate coupled in a flip-chip manner to the semiconductor chip, and an electrically conductive pillar disposed between the semiconductor chip and the package substrate such that the electrically conductive pillar is located over two or more wirings in an uppermost wiring layer of the semiconductor chip and such that the two or more wirings are coupled together via the electrically conductive pillar. | 2012-09-13 |
| 20120228764 | PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND PACKAGE-ON-PACKAGE DEVICE THEREBY - A package structure, a method of fabricating the package structure, and a package-on-package device are provided, where the package structure includes a metal sheet having perforations and a semiconductor chip including an active surface having electrode pads thereon, where the semiconductor chip is combined with the metal sheet via an inactive surface thereof. Also, a protective buffer layer is formed on the active surface to cover the conductive bumps, and the perforations are arranged around a periphery of the inactive surface of the semiconductor chip. Further, an encapsulant is formed on the metal sheet and in the perforations, for encapsulating the semiconductor chip and exposing the protective buffer layer; and a circuit fan-out layer is formed on the encapsulant and the protective buffer layer and having conductive vias penetrating the protective buffer layer and electrically connecting to the conductive bumps. | 2012-09-13 |
| 20120228765 | SOLDER BUMP INTERCONNECT - A semiconductor package includes a device pad on a substrate. A first polymer layer overlies the substrate, and the first polymer layer has an opening to expose the device pad. In one embodiment, a redistribution layer (RDL) comprises a landing pad, and the RDL is positioned on the first polymer layer and conductively coupled to the device pad. A second polymer layer is on the RDL, and an under bump metal pad (UBM) is on the landing pad and extends onto a top surface of the second polymer layer. In one embodiment, a shortest distance from a center of the landing pad to an outer edge of the landing pad, and a shortest distance from a center of the UBM to an outer edge of the UBM are in a ratio that ranges from 0.5:1 up to 0.95:1. | 2012-09-13 |
| 20120228766 | Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch - A semiconductor device has a semiconductor die with die bump pads and substrate with trace lines having integrated bump pads. A solder mask patch is formed interstitially between the die bump pads or integrated bump pads. The solder mask patch contains non-wettable material. Conductive bump material is deposited over the integrated bump pads or die bump pads. The semiconductor die is mounted over the substrate so that the conductive bump material is disposed between the die bump pads and integrated bump pads. The bump material is reflowed without a solder mask around the integrated bump pads to form an interconnect between the semiconductor die and substrate. The solder mask patch confines the conductive bump material within a footprint of the die bump pads or integrated bump pads during reflow. The interconnect can have a non-fusible base and fusible cap. | 2012-09-13 |
| 20120228767 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKABLE DEVICES AND A METHOD OF MANUFACTURE THEREOF - An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed. | 2012-09-13 |
| 20120228768 | INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF - An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a bond pad; a B-stage polymer, having a dispersion of conductive particles therein, on the bond pad; and a bond ball inserted into the B-stage polymer for forming intermetallic structures between the bond ball and the bond pad. | 2012-09-13 |
| 20120228769 | CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design. | 2012-09-13 |
| 20120228770 | METAL CAP FOR BACK END OF LINE (BEOL) INTERCONNECTS, DESIGN STRUCTURE AND METHOD OF MANUFACTURE - A structure is provided with a metal cap for back end of line (BEOL) interconnects that substantially eliminates electro-migration (EM) damage, a design structure and a method of manufacturing the IC. The structure includes a metal interconnect formed in a dielectric material and a metal cap selective to the metal interconnect. The metal cap includes RuX, where X is at Boron, Phosphorous or a combination of Boron and Phosphorous. | 2012-09-13 |
| 20120228771 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH MULTI-LAYERED SEED LAYER PROVIDING ENHANCED RELIABILITY AND MINIMIZING ELECTROMIGRATION - An interconnect structure and method for forming a multi-layered seed layer for semiconductor interconnections are disclosed. Specifically, the method and structure involves utilizing sequential catalytic chemical vapor deposition, which is followed by annealing, to form the multi-layered seed layer of an interconnect structure. The multi-layered seed layer will improve electromigration resistance, decrease void formation, and enhance reliability of ultra-large-scale integration (ULSI) chips. | 2012-09-13 |
| 20120228772 | Diode Array and Method for Producing a Diode Array - The present invention relates to a diode arrangement ( | 2012-09-13 |
| 20120228773 | LARGE-GRAIN, LOW-RESISTIVITY TUNGSTEN ON A CONDUCTIVE COMPOUND - A layered structure and semiconductor device and methods for fabricating a layered structure and semiconductor device. The layered structure includes: a base layer including a material containing titanium nitride, tantalum nitride, or a combination thereof; a conductive layer including a material containing: tantalum aluminum nitride, titanium aluminum nitride, tantalum silicon nitride, titanium silicon nitride, tantalum hafnium nitride, titanium hafnium nitride, hafnium nitride, hafnium carbide, tantalum carbide, vanadium nitride, niobium nitride, or any combination thereof; and a tungsten layer. The semiconductor device includes: a semiconductor substrate; a base layer; a conductive layer; and a tungsten layer. | 2012-09-13 |
| 20120228774 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A barrier insulating film is constituted from a first SiCN film formed with a tetramethylsilane gas flow rate lower than usual, a second SiCN film formed over the first SiCN film and formed with a usual tetramethylsilane gas flow rate, and a SiCO film formed over the second SiCN film. | 2012-09-13 |
| 20120228775 | AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING - The present invention provides a method of fabricating an airgap-containing interconnect structure in which a patternable low-k material replaces the need for utilizing a separate photoresist and a dielectric material. Specifically, this invention relates to a simplified method of fabricating single-damascene and dual-damascene airgap-containing low-k interconnect structures with at least one patternable low-k dielectric and at least one inorganic antireflective coating. | 2012-09-13 |
| 20120228776 | SEMICONDUCTOR DEVICE - A semiconductor device is formed by molding using a resin with a semiconductor element and one or two heat dissipating plates contained therein, said one or two heat dissipating plates being disposed to face one surface or both the surfaces of the semiconductor element. An intermediate layer is formed by spraying a metal powder to the semiconductor element and to one of or both of the heat dissipating plates using a cold spray method, and the semiconductor element and the heat dissipating plate are bonded together using a solder with the intermediate layer therebetween. | 2012-09-13 |
| 20120228777 | THROUGH SILICON VIA GUARD RING - The present disclosure relates to forming a plurality of through silicon vias guard rings proximate the scribes streets of a microelectronic device wafer. The microelectronic device wafer includes a substrate wherein the through silicon via guard ring is fabricated by forming vias extending completely through the substrate. The through silicon via guard rings act as crack arresters, such that defects caused by cracks resulting from the dicing of the microelectronic wafer are substantially reduced or eliminated. | 2012-09-13 |
| 20120228778 | SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES - A through via ( | 2012-09-13 |
| 20120228779 | AIR-GAP C4 FLUIDIC I/O INTERCONNECTS AND METHODS OF FABRICATING SAME - An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect. | 2012-09-13 |
| 20120228780 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor device including a through via plug and a method of manufacturing the same. In the semiconductor device, since a redistributed interconnection pattern is disposed on a protection film of a convex-concave structure having a protrusion and a recessed portion, the semiconductor device may have improved reliability while preventing a leakage current. In the method of manufacturing the semiconductor device, since an end surface of through via structure is exposed by removing a protection film and an insulating film liner using a selective etching process, damage to the through via structure is minimized, thereby preventing copper contamination in a substrate. | 2012-09-13 |
| 20120228781 | STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (TWI) WITH COMPRESSED WIRE - A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a compressed wire in the via bonded to the substrate contact, and a contact on the wire. A stacked semiconductor component includes the semiconductor substrate, and a second semiconductor substrate stacked on the substrate and bonded to a through wire interconnect on the substrate. | 2012-09-13 |
| 20120228782 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE - Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate | 2012-09-13 |
| 20120228783 | MIXED WIRE BONDING PROFILE AND PAD-LAYOUT CONFIGURATIONS IN IC PACKAGING PROCESSES FOR HIGH-SPEED ELECTRONIC DEVICES - A method and apparatus for mixed wire bonding and staggered bonding pad placement. A first plurality of bonding pads is arranged on a semiconductor device. A second plurality of bonding pads is also arranged on the semiconductor device. The bonding pads of the second plurality of bonding pads are arranged in a staggered pattern, such that the first and second pluralities of bonding pads form one of a plurality of double rows of bonding pads on the semiconductor device. | 2012-09-13 |
| 20120228784 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device configured by encapsulating a semiconductor element, partially or entirely covered with a polyimide, using an epoxy resin composition for encapsulating semiconductor device which contains an epoxy resin (A), a phenol resin (B), a curing accelerator (C), an inorganic filler (D), and a silane coupling agent (E) represented by the formula (1): | 2012-09-13 |
| 20120228785 | WATER FILTERING DEVICE EQUIPPED WITH WATER LEVEL ADJUSTMENT UNIT - A water filtering device equipped with a water level adjustment unit is provided. The water filtering device includes an external air inlet through which dust-containing air flows in, a dust separator communicating with the external air inlet and separating dust in the inflow air, exhaust outlets communicating with the dust separator and discharging the air from which the dust has been separated, a dust container communicating with the dust separator and being filled with water, and a water level adjustment unit installed in the dust container to adjust the level of the water in the dust container. The water level adjustment unit includes a supercharged water drainage tube installed on a bottom of the dust container, and a manual opening/closing device for adjusting the level of the water through the supercharged water drainage tube. | 2012-09-13 |
| 20120228786 | HUMIDIFYING AND FRESH-KEEPING DEVICE FOR REFRIGERATOR - A humidifying and fresh-keeping device for a refrigerator is provided, including a device container and a top cover. The container has a drawer for storing fruits and vegetables, and a containing chamber is disposed at one side of the container. A drawer-type water tank is disposed in the containing chamber, with a water storing box at one end and an ultrasonic humidifying device at the other end. A supply air box is disposed at a wind outlet of the ultrasonic humidifying device, and an atomizing air duct is distributed in the container. An inlet of the atomizing air duct corresponds to an outlet of the supply air box, and outlets of the atomizing air duct are provided in the containertop cover. As a result, the fruits and vegetables preserved in the container have an environment humidity of 90-95%, and can be kept fresh in seven days. | 2012-09-13 |
| 20120228787 | FAN COOLING TOWER DESIGN AND METHOD - A hybrid cooling tower apparatus that extends along a vertical axis is provided. The cooling tower includes a first housing structure having an inlet and a first outlet located a first position along the vertical axis, wherein the housing structure includes a base and opposing side walls that extend along the vertical axis away from the base. The tower also includes a heat exchanger disposed in the housing structure, wherein the heat exchanger is positioned adjacent the first outlet and extends at least partially all the way across the first outlet. Finally the hybrid tower employs an air current generator positioned in a plane normal to the vertical axis and oriented to direct an air stream toward the base and through the heat exchanger and the first outlet. | 2012-09-13 |
| 20120228788 | METHOD FOR PREPARING A POROUS NUCLEAR FUEL BASED ON AT LEAST ONE MINOR ACTINIDE - A method for manufacturing a porous fuel comprising uranium, optionally plutonium and at least one minor actinide is provided. The method may comprise the following successive steps: a) a step for compacting as pellets a mixture of powders comprising uranium oxide, optionally plutonium oxide and at least one oxide of a minor actinide, at least one portion of the uranium oxide being in the form of triuranium octaoxide U | 2012-09-13 |
| 20120228789 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface. | 2012-09-13 |
| 20120228790 | MODULAR CLAMP STATION WITH VARIABLE PITCH - A method and modular mold clamp assembly for use in a molding machine. The assembly has a frame with a base member. The base member has end members provided thereon. Radial adjustment mechanisms are mounted on the end members, with the radial adjustment members configured to cooperate with turntables of the molding machine. At least one support bracket extends from the frame. The support bracket is configured to cooperate with at least one support fixture of the molding machine. The radial adjustment mechanisms and the at least one support bracket allow the modular mold clamp assembly to be moved toward and away from the center of a wheel of the molding machine. | 2012-09-13 |
| 20120228791 | METHOD OF CONTROLLING PRODUCT VOLUME IN A FIXED VOLUME MOLD - A method for precisely controlling the volume of a product such as a tire tread or tire that is placed into a mold is provided. This method includes providing a tread or tire that is built upon a portable mold core by laying a series of layers on the portable mold core. The outer diameter of the lire tread or lire is initially built to be purposely smaller than the interior surfaced of the mold in order to prevent any interference from occurring between the mold and the tire tread once the tire tread and core are placed within the mold and the mold is closed. The weight of the tire tread or tire is measured to see if the volume of the tire tread or tire is within acceptable parameters to fit within the mold. If not, additional material is added to the tire or tire tread. | 2012-09-13 |
| 20120228792 | Post Processing Filled Microporous Membranes - A porous membrane may be manufactured with a high content of filler material and a polymer binder. After forming the membrane, the membrane may be post processed to reform the polymer binder into a stronger yet still porous membrane. The post processing may include bringing the membrane above the melt temperature of the polymer or by immersing the membrane in a solvent. Photomicrographs show that the structure may change, yet the performance of the material in batteries and other electrochemical cells may remain the same or even improve. | 2012-09-13 |
| 20120228793 | METHOD OF FORMING BLOWN POLYMERIC FOAM FILM - A method of forming a blown polymeric foam film is described herein. As described further below, equipment design (e.g., die design) and processing conditions may be controlled to form blown films having desired characteristics. | 2012-09-13 |
| 20120228794 | METHOD AND APPARATUS FOR PELLETIZING BIOMATERIAL COMPOSITES - A process for preparing low moisture content polymer biomaterial composites and expandable polymer biomaterial composites by extrusion through a die plate into a waterbox and pelletizing with cutter blades. Polyolefins or condensation polymers are melt blended with a solid or semi-solid biomaterial component, such as polysaccharides, including cellulosics and starches, or proteinaceous materials, including polypeptides, and are extruded, pelletized underwater, and processed with accelerated drying to achieve moisture levels as low as one percent or less. | 2012-09-13 |
| 20120228795 | CERAMIC SUBSTRATE SUPPORTING MEMBER AND METHOD OF MANUFACTURING CERAMIC MEMBER - There is provided a ceramic substrate supporting member configured to support a ceramic substrate at a tip portion thereof and used for forming a ceramic member coat on the ceramic substrate to manufacture a ceramic member in a reaction furnace. The ceramic substrate supporting member includes a core formed of graphite, and a supporting member coat formed at a surface including at least the tip portion with a pyrolytic carbon layer interposed between the core and the supporting member coat. | 2012-09-13 |
| 20120228796 | APPARATUS AND METHOD FOR MANUFACTURING MULTIPLEX INTERLAYER FOR SAFETY GLASS - Provided is a method for manufacturing a multilayered interlayer for safety glass that allows for reliable and easy formation of inserted layers having a larger coloring layer. The method for manufacturing includes processes for respectively delivering, from a first and a second extruding machine, thermoplastic resin composition(s) for the outermost and inserted layers formation in a molten state to the first and second delivering hole of the guide for layer disposition; a process for simultaneously forcing the thermoplastic resin composition(s) to respectively arrive in the outlets for the outermost and inserted layers formation through the flow paths for the outermost and inserted layers formation; and a process for extruding the thermoplastic resin composition(s) for the outermost and inserted layers formation as a multilayer film in a condition where the thermoplastic resin composition for the inserted layer formation is disposed between the thermoplastic resin compositions for the outermost layers formation. | 2012-09-13 |
| 20120228797 | Methods of Continuously Manufacturing Polymide Fibers - Methods for making high quality polyimide fibers suitable for continuous industrial production are described. Polyimide fibers are continuously prepared from a polyamic acid solution through sequentially spinning the polyamic acid solution by either a wet or a dry-wet process, coagulating, drying or drying after washing, thermally treating and stretching the resulting polyamic acid fibers to obtain polyimide fibers, and winding polyimide fibers as prepared into rolls. | 2012-09-13 |
| 20120228798 | Manufacturing Method For Rubber Band - The present invention relates to a manufacturing method for a rubber band, comprising preparing a production raw material: mixing and stirring by weight percent 50%-80% vinyl-terminated polydimethylmethylvinylsiloxane, 19%-40% silica and 1%-10% hydroxy-terminated polydimethylsiloxane into a paste ready for use; feeding the aforementioned production raw material into forming molds to produce rough rubber bands; soaking the rough rubber bands in a surface treatment solution for a certain time period, wherein the surface treatment solution comprises by weight percent 40%-50% methyl vinyl silicone rubber, 30%-35% deodorized kerosene, 7%-10% oxygen-containing silicon oil and 10%-20% silicon powder; taking the soaked rough rubber bands out of the solution after soaking and baking them at a high temperature of 200-250° C. A rubber band made according to the above-described method has good elasticity, a non-slip property, no cracks after stretching, is not easy to be broken, durable, non-toxic, environmentally friendly and nondeformable for multiple times of use. | 2012-09-13 |
| 20120228799 | POSITION-LOCKING METHOD FOR INSERT AND OVER MOLDING OF DELICATE COMPONENTS - Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part. | 2012-09-13 |
| 20120228800 | Process for Manufacturing Improved Dispensing Devices - The present invention relates to a method for the manufacture of a lavatory dispensing device useful for the delivery of at least one treatment composition, preferably a cleaning composition and/or a sanitizing composition to a sanitary appliance. | 2012-09-13 |
| 20120228801 | INJECTION METHOD FOR HOLLOW PRODUCTS, ITS FUSIBLE CORE AND THE METHOD FOR MAKING THE FUSIBLE CORE THEREOF - An injection method for hollow products, a fusible core and the method for making the fusible core comprises putting a fusible Sn—Bi alloy core into a mold core, then both the product and the fusible core are taken out from the die. The fusible core is turned from solid to liquid state and is apart from the product. The inner wall of the core can be made using this method, and the plastic product can be with more shape in one-step molding to replace the metal in many fields. Complex core-pulling mechanism is not needed, thus the core structure is simplified, and the shape of die can be simplified. The fusible core is not needed to be maintenance for it will not be worn, because after each injection, the fusible core is recycled to make a new fusible core. | 2012-09-13 |
| 20120228802 | DEVICE AND METHOD FOR FOCUSING A BEAM OF LIGHT WITH REDUCED FOCAL PLANE DISTORTION - A system for focusing a light beam may be used for multi-photon stereolithography. It comprises a collimator or expander for adjusting the beam divergence and a scanner for directing the beam onto a focusing device to focus the beam to a focal point or beam waist and to scan the focused beam. A controller controls adjustment of the beam divergence so that the focal point or beam waist is scanned substantially in a plane. A light source may be provided to generate the light beam. The expander may comprise a diverging lens and a converging lens for expanding the beam to produce a collimated beam. The divergence of the collimated beam is dependent on the distance between the diverging lens and the converging lens, which may be adjusted to adjust the beam divergence. The focusing device may comprise a dry objective lens to focus the collimated beam onto the target material to induce multi-photon absorption in the target material at the beam waist of the focused beam. | 2012-09-13 |
| 20120228803 | METHODS FOR FABRICATING HIGH TEMPERATURE CASTABLE ARTICLES AND GAS TURBINE ENGINE COMPONENTS - Embodiments of a method are provided for fabricating a high temperature castable article, such as a casting mold or a core. In one embodiment, the method includes the steps of providing a suspension containing a plurality of ceramic particles and a photo-curable monomer; photo-curing selected portions of the suspension to produce a green body coated, at least partially, with uncured suspension; and removing the uncured suspension from the green body under process conditions at which the viscosity of the uncured suspension is reduced. The process conditions include exposing the green body to one of the group consisting of: (i) microwave energy sufficient to excite a dipole moment of the uncured suspension and (ii) sonic energy sufficient to induce shear-thinning of the uncured suspension. The green body is then heat treated to produce the high temperature castable article. | 2012-09-13 |
| 20120228804 | NEAR-FIELD EXPOSURE MASK, RESIST PATTERN FORMING METHOD, DEVICE MANUFACTURING METHOD, NEAR-FIELD EXPOSURE METHOD, PATTERN FORMING METHOD, NEAR-FIELD OPTICAL LITHOGRAPHY MEMBER, AND NEAR-FIELD NANOIMPRINT METHOD - A near-field exposure mask according to an embodiment includes: a silicon substrate; and a near-field light generating unit that is formed on the silicon substrate, the near-field light generating unit being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials. | 2012-09-13 |
| 20120228805 | FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME - Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated. | 2012-09-13 |
| 20120228806 | PROCESS AND DEVICE FOR PRODUCING FIBER COMPOSITE MATERIAL - A technique with which a nanofibrous resin spun by electrospinning can be introduced into inner parts of fibers. The process for fiber composite material production is a process which comprises spinning a nanofibrous resin toward split fibers continuously conveyed along a given conveyance route and thereby combining the split fibers with the resin to produce a fiber composite material. The process involves a resin spinning step in which the nanofibrous resin spun with an electrospinning device is flown toward the split fibers. In the resin spinning step, the direction in which the nanofibrous resin proceeds is made to be the same as the conveying direction of the split fibers by blowing an air stream from a blower on the nanofibrous resin. | 2012-09-13 |
| 20120228807 | Method for Creating an Object, by Means of Laser Treatment, From at Least Two Different Powder Materials, and Corresponding Facility - According to said method, a first passage ( | 2012-09-13 |
| 20120228808 | METHOD FOR MANUFACTURING HOUSINGS - A method for manufacturing a housing is provided. A fiber film is placed on a first mold, and a second mold presses the fiber film to make it deform slightly. When the first mold and the second mold are not closed completely, the melt plastic material is injected from the second mold to the fiber film to press down the fiber film. Then, the molds are assembled while the melt plastic material is injected to form a molding product. Furthermore, the edge of the fiber film near the corner is cut off to obtain a housing with a well-attached fiber film. | 2012-09-13 |
| 20120228809 | EMBOSSED DECORATIVE INJECTION-MOLDED PRODUCT AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a decorated injection molded article having an embossed pattern comprising a surface layer comprising an acryl resin film, a printing layer provided on an inside of the surface layer, an adhesive layer provided on an inside of the printing layer and an injected resin layer, wherein a concavo-convex pattern is provided on the surface of the surface layer at a front face part and a side face part of the injection molded article by emboss processing and further to a method for producing the same, and the present invention provides a decorated injection molded article having an embossed pattern, in which a concavo-convex pattern is easily formed on the surface and which is imparted with a steric design property having a higher grade feeling. | 2012-09-13 |
| 20120228810 | METHODS FOR FABRICATING POLYMER-BIOCERAMIC COMPOSITE IMPLANTABLE MEDICAL DEVICES - Methods relating to polymer-bioceramic composite implantable medical devices are disclosed. | 2012-09-13 |
| 20120228811 | METHOD OF FEEDING FUEL GAS INTO THE REACTION SHAFT OF A SUSPENSION SMELTING FURNACE AND A CONCENTRATE BURNER - The invention relates to a method of feeding a fuel gas into the reaction shaft of a suspension smelting furnace and to a concentrate burner for feeding a reaction gas and fine solid matter into the reaction shaft of the suspension smelting furnace. In the method, fuel gas ( | 2012-09-13 |
| 20120228812 | COVER OPENING-AND-CLOSING SUPPORT MECHANISM EMPLOYING GAS SPRING, AND AUTOMATIC TRANSACTION APPARATUS - A cover opening-and-closing support mechanism is provided that reliably locks a gas spring, and in which a rod section of a gas spring is not damaged by a stopper portion. The cover opening-and-closing support mechanism includes: a gas spring equipped with pivot points at both end portions and including a cylinder section and a rod section; a stopper portion rotatably provided at the pivot point at a first of the end portions, the stopper portion making contact with the cylinder section when the gas spring has been extended so as to lock the gas spring; a gas spring stopper including a limiter portion that makes contact with the cylinder section before the stopper portion makes contact with the rod section; and a release handle portion for releasing the locking, provided at the gas spring stopper on substantially an opposite side to the stopper portion, such that the gas spring stopper swings towards substantially the opposite side to the stopper portion due to a weight of the release handle portion. | 2012-09-13 |
| 20120228813 | LIQUID-SEALED ANTIVIBRATION DEVICE - A valve member formed of an elastomeric membrane for opening and closing a second orifice flow passage is mounted on a partition element such that the valve member is arranged orthogonal to the flow direction of the second orifice flow passage. A valve portion for closing openings of the second orifice flow passage due to flexural deformation of a flexible membrane portion caused by liquid flow in the second orifice flow passage is arranged on the flexible membrane, and communication holes for bring the second orifice flow passage into communication are formed in the flexible membrane portion. A cylindrical buffer portion projecting from the flexible membrane portion for surrounding the openings when the flexible membrane portion is deformed by flexure is provided to the valve portion, and a projection height of the cylindrical buffer portion is set larger than a wall thickness thereof. | 2012-09-13 |
| 20120228814 | RUBBER STOPPER - The present invention provides a rubber stopper that can set a shape suitable for mounting and set a desired stopper characteristic. Specifically, a holding fitting | 2012-09-13 |
| 20120228815 | CASE CLAMP - A case clamp is used to properly align two or more cabinet sides and/or gable ends, such as those of European-style cabinet units. The clamp comprises a frame with an upper jaw, a lower jaw, and an alignment wall connected to the upper and lower jaws. The clamp further includes an upper engagement member associated with the upper jaw for movement in a first direction and a side engagement member associated with the lower jaw for movement in a second direction generally perpendicular to the first direction. Corners of the workpieces are placed adjacent to each other and the clamp is applied to the corners. The engagement members are advanced to press the corners into alignment with each other. A surface of the clamp frame also provides an alignment function, resulting in three-dimensional alignment of the workpieces. | 2012-09-13 |
| 20120228816 | Image Forming Apparatus - An image forming apparatus which may include an apparatus body, a feed tray, an image forming unit, an eject section and a first transport mechanism forming a first transport path extending between the feed tray and the eject section via the image forming unit. The image forming apparatus may also include a second transport mechanism forming a second transport path that extends between a branch position located downstream of the image forming unit on the first transport path and a merge position located upstream of the image forming unit on the first transport path. The second transport mechanism may be configured to transport the recording medium along the second transport path and reintroduce the recording medium to the first transport path from the merge position. At least one part of the second transport mechanism and the feed tray may be incorporated in a detachable unit. | 2012-09-13 |
| 20120228817 | SHEET FEEDER AND IMAGE FORMING APPARATUS - A sheet feeder includes: an attraction separation unit including an attraction belt stretched between rollers and facing the upper surface of a sheet bundle to attract an uppermost sheet thereof, rotatably supported by a support member at a position upstream of the attraction belt in a sheet feeding direction, and supporting the rollers to be released from the support upon contact of the rollers with the uppermost sheet via the attraction belt; and a swing device for swinging the attraction separation unit around the support member as a pivot to move the attraction belt between an attraction position and a feed position more distant from the sheet bundle than the attraction position, and swinging, after the uppermost sheet has been attracted to the attraction belt at the attraction position, the attraction belt to the feed position to be rotated to feed the uppermost sheet. | 2012-09-13 |
| 20120228818 | SHEET FEEDER AND IMAGE FORMING APPARATUS USING THE SAME - A sheet feeder including a sheet container on which sheets are placed, a transfer roller to transfer the sheets to an image forming unit via a transfer path; a friction pad to transfer the sheets together with the transfer roller; and a movable portion provided on the transfer path to alter a direction of the transfer path based on the sheets. | 2012-09-13 |
| 20120228819 | SHEET FEEDING APPARATUS - A sheet feeding apparatus includes a sheet feeding channel, a sheet feeding structure, a sheet stopping structure, plural sensing arms, an optical sensor and a controller. By the sheet feeding structure, a paper sheet is fed into the sheet feeding channel. The sheet stopping structure is used for stopping the paper sheet from being moved forwardly. During the process of feeding the paper sheet, the plural sensing arms are pushed by the paper sheet to be rotated. According to the rotating statuses of the sensing arms, the optical sensor issues different signals to the controller. According to these signals, the controller will control the operations of the sheet stopping structure and the sheet feeding structure, thereby correcting the skew condition. | 2012-09-13 |
| 20120228820 | Recording-Sheet Retaining Device - A placement plate for placing a recording sheet is provided in a case to be movable upward and downward. A regulating member is supported by the case to be slidable in the width direction of the recording sheet. A locking section is provided on at least one of the placement plate and the regulating member so as to lock the placement plate with respect to the regulating member when the regulating member is located in an area different from an area between the maximum size and the minimum size at the edge of the recording sheet in the width direction. | 2012-09-13 |
| 20120228821 | PAPER SUPPLY UNIT AND IMAGE FORMING APPARATUS - A disclosed paper supply unit includes a paper supply cassette having a bottom plate for placing stacked recording media therein and a sending out part. When the paper supply cassette is loaded at a paper supply position, the sending out part faces the bottom plate, the bottom plate is lifted and the recording media come into contact with the sending out part. A support member is rotatably fitted to the paper supply cassette. An elastic member is fastened between the support member and the bottom plate. The support member has plural fastening parts for fastening the elastic member. The elastic force of the elastic member is changeable using the plural fastening parts. | 2012-09-13 |
| 20120228822 | SHEET TRANSPORT APPARATUS - A sheet transport apparatus for transporting a sheet along a transport path has a sheet transport mechanism having a plurality of transport rollers that transports a sheet, and a jam clearing mechanism to remove a sheet which causes a transport failure and is jammed on the transport path. The jam clearing mechanism has a coupling member coupled to a transport roller, a jam clearing dial that transfers a rotation force to the transport roller via the coupling member, and a switching device for switching so that the coupling member separates from the transport roller in transporting a sheet, while being coupled to the transport roller in clearing a jam. | 2012-09-13 |
| 20120228823 | DOCUMENT FEEDING DEVICE AND IMAGE FORMING APPARATUS - A document feeding device includes a document reader, a drive roller and a plurality of driven rollers. The document reader is configured to read a document fed in a feeding direction. The drive roller is disposed upstream of the document reader in the feeding direction. The plurality of driven rollers is disposed opposite to the drive roller to form nips therebetween. The plurality of driven rollers is supported by one common shaft extending in a direction orthogonal to the feeding direction. A position of at least one nip formed by at least one of the plurality of driven rollers is offset downstream or upstream of other nips formed by other driven rollers. | 2012-09-13 |
| 20120228824 | Apparatus for Electronically Diverting Signatures - An apparatus for diverting incoming printed products is provided. The apparatus includes a roll, a first motor coupled to the roll and a controller coupled to the first motor for controlling the rotation of the roller for diverting printed products along one of two different paths, each path associated with a direction of rotation of the roll. This apparatus may also include a shaft with at least one flipper mounted thereon and a second motor coupled to the shaft. | 2012-09-13 |
| 20120228825 | TWO-DIMENSIONAL TILING PUZZLE HAVING THREE-DIMENSIONAL FEATURES - A tiling puzzle having a first two-dimensional portion and a second three-dimensional portion that extends away from the plane of the first two-dimensional portion. | 2012-09-13 |
| 20120228826 | METHOD OF PLAYING A POKER-TYPE CARD GAME - The present invention provides a method of playing a poker-type card game where one or more players place an initial wager, receive three cards, discard one card, place optional side bets and one additional required bet prior to a five-card community flop, with the outcome being resolved by a predetermined payout schedule. Another aspect of the present invention involves the dealer assessing a player's hole cards in combination with the community cards, allowing a player's hole cards to match rank with the community cards, and awarding payouts according to a predetermined payout schedule based on whether one or both of the player's hole cards are included in the highest-ranking five-card poker hand using standard poker hand rankings. | 2012-09-13 |
| 20120228827 | APPARATUS AND METHOD FOR TRACKING AN ALL-IN PLAYING CARD GAME - An apparatus to track one or more all-in bets in a game with a standard deck of playing cards that includes a set of at least a first marker and a second marker, the first marker of the set of markers to identify an all-in pot a player is playing to win, the second marker of the set of markers to identify the player that is playing to win the all-in pot and at least one additional identifier on the first and second markers of the set to indicate that they are related to each other. There is also a method for tracking an all-in playing card game. | 2012-09-13 |
| 20120228828 | AMUSEMENT MACHINE INCLUDING A CRANE GAME IN COMBINATION WITH A WIN EVERY TIME GAME AND A GAME OF CHANCE - Coin operated amusement device including a crane game, a game of chance, and a simulated slot machine in combination. A player deposits coins, and is able to play three games. One game is a traditional crane game. A second game requires a player to press a button to stop moving, flashing lights on an area to win a prize. The second game is located on the corners of the cabinet and above the marquee on the top of the crane game machine cabinet. In a third game, the player plays a slot machine game located on the marquee of the crane machine and pulls a one-arm bandit handle to start the game. If the player wins the slot machine game, the prize is tickets that can be redeemed via an online website/store. Games are played in any order and combination and the prizes adjusted by the operator. | 2012-09-13 |
| 20120228829 | RADIAL SHAFT SEAL, RADIAL SHAFT SEAL ASSEMBLY AND METHOD OF INSTALLATION - A radial shaft seal configured for receipt in a housing and about a shaft to sealingly isolate an air side of the seal from an oil side of the seal is provided. The seal includes a mounting portion and a seal lip having a sealing surface extending between an oil side end and a free air side end. An annular bridge is connected to the oil side end of the seal lip by a first hinge and to the mounting portion by a second hinge. The bridge extends in radially overlying relation to the seal lip. A projection extends from the first hinge away from the bridge. A plurality of ribs extend radially inwardly from the projection. The ribs minimize friction between the seal and the shaft during installation and prevent the seal lip from inverting during the oil-side installation assembly. | 2012-09-13 |
| 20120228830 | LABYRINTH SEAL AND METHOD FOR PRODUCING A LABYRINTH SEAL - A labyrinth seal for sealing a sealing region between a rotor and stator of a rotary machine includes, a base, and a plurality of sealing rings. The sealing rings are formed on the base, project into the sealing region and form, between them labyrinth valleys bounded, laterally, by the sealing rings and, in the floor of the valleys, by the base. The sealing rings, in at least one region, include at least one material which is different from that of the base. | 2012-09-13 |
| 20120228831 | PISTON RING - A piston ring, in particular a compression piston ring, includes a running surface, upper and lower flank areas, an inner peripheral area and a joint. The wall thickness of the piston ring is uniform over its periphery and at least the running surface is provided with a PVD coating or a CVD layer in such a manner that the running surface layer has a lesser layer thickness in the peripheral area close to the joint than in the remaining peripheral area of the running surface. | 2012-09-13 |
| 20120228832 | Flexible flow control bushing - A flexible flow control bushing is comprised of flexible, high temperature resistant, self-lubricating composite material and has a unique configuration, which, viewed cross-sectionally, before installation has a squared off sine wave configuration with a uniform amplitude and gap. A fluid seal arrangement is also disclosed. | 2012-09-13 |
| 20120228833 | Seal for an control device of a supercharger with valve means in the form of a waste gate - In a sealing arrangement for an control device of a charging device which sealing arrangement includes a bearing bushing in which an control shaft is rotatably supported by the bushing in a housing opening of the charging device, the control shaft is provided with a collar disposed in the housing opening at an axial end of the bushing and the collar includes a groove accommodating a seal ring which is in direct contact with the wall of the opening for sealing the shaft supported in the bushing directly with respect to the opening wall. | 2012-09-13 |
| 20120228834 | Mounting Guard Ring - A mounting guard ring for a sealing ring with at least one sealing lip, surrounding a sleeve-shaped protective ring with a supporting surface for the sealing lip disposed at the outer periphery and a holding device shaped as a grip, the protective ring being provided in at least one peripheral region with a first predetermined breaking site and being capable of being severed along the first predetermined breaking site by pulling on the holding device, the protective ring being closed off in sealing manner by a disk-shaped lid. | 2012-09-13 |
| 20120228835 | METAL CYLINDER HEAD GASKET WITHOUT A SPACING LAYER - One aspect of the invention relates to a cylinder head gasket provided with at least one opening corresponding to a combustion chamber of an internal combustion engine. The gasket has a function layer with a full bead and an annular support with a bead. The bead of the annular support is arranged on the side of the full bead which is oriented away from the combustion chamber. Another aspect of the invention relates to a cylinder head gasket having an upper functional layer, an annular support and a lower functional layer. The annular support is arranged between the upper and lower functional layers and is adjacent to the lower functional layer. The upper functional layer comprises one full bead, and the lower functional layer has a bead arranged on the side of the full bead which is oriented away from the combustion chamber. | 2012-09-13 |
| 20120228836 | SIMPLIFIED LOW INSERTION FORCE SEALING DEVICE CAPABLE OF SELF RESTRAINT AND JOINT DEFLECTION - A conduit coupling system, sealing device, bell and method of use are disclosed herein. The system comprises at least two piping components, and a sealing device. A first component has a bell and a second component has a spigot, the spigot is adapted to mate with the bell. The bell comprises a first end and a second end, the first end coupled to the first component. The bell has a concave annular inner surface and a diameter of the annular inner surface adjacent to the first end of the bell is greater than a diameter of the annular inner surface adjacent to the second end of the bell. The sealing device comprises a locking segment comprising a convex outer surface and a K-type gasket coupled to a locking segment or a non-restraining anti-extrusion segment. The sealing device is adapted to fit between the bell and the spigot. | 2012-09-13 |
| 20120228837 | MOLDED GAP SEAL APPARATUS WITH INWARD POINTING FIBRILLATIONS - A cover for the gap in an automobile automatic gear shift assembly is presented. The gap cover is formed from a single molded housing with inward pointing fibrillations. These fibrillations act as fingers to cover the hole created when the multi position mechanism is moved from one position to another. The fibrillations are assisted back to their original position through (1) physical properties of the advanced polymeric substance used to mold the housing and (2) through the interactions of assisting tabs formed on the back side of the fibrillations, which act as springs. | 2012-09-13 |
| 20120228838 | CAMERA DOLLY JACK - Apparatus and methods allow the wheels of a camera dolly to be quickly and easily changed by a single person. A dolly jack may have a leg attached to a foot and pivotable relative to the foot about a first axis. A jack rod is attached to the leg spaced apart from the first axis. An arm may be pivotally attached to the leg as desired, to provide greater mechanical advantage in lifting the camera dolly. Dolly wheels may be changed by inserting a jack rod into a receptacle on one side of the camera dolly, with the foot of the jack on the ground and with the jack leg substantially in a non-vertical position. The jack leg rotated into a second position wherein the jack leg is substantially vertical, with the dolly rolling slightly in the direction of the rotation. This lifts the side of the dolly sufficiently so that the front and back wheels, or wheel pairs, on the one side of the dolly are lifted off of the ground, allowing the wheels to be changed. | 2012-09-13 |
| 20120228839 | CARRIAGE FOR TRANSPORT OF AN AIRCRAFT ENGINE MODULE - A carriage configured to transport an aircraft engine module from a preparation station to an assembly station includes, on a dolly, a reinforcement structure configured to be made horizontally mobile by sliding on balls, two vertically mobile brackets, and moving fingers to slide under the module's supports. The module is then supported by the carriage in a safe manner, can be raised and transported, and can also be temporarily overturned to check that its interior is empty. | 2012-09-13 |
| 20120228840 | Foldable laptop trolley - A foldable laptop trolley includes a table top, two side frames for supporting the table top, a table top assembly supported on the top supporting members, a wheel assembly which includes a plurality of lockable wheels coupling with the below supporting members, and a foldable frame operatively coupled with the side frames to fold the foldable laptop trolley between an unfolded position and a folded position, wherein the foldable frame includes two supporting elements pivotally coupled with each other two inner ends thereof and pivotally coupled with the side frames at inner edges of uppers of the first supporting members. | 2012-09-13 |
| 20120228841 | ROLLING TOOL BAG - A rolling tool bag is described. The tool bag can include a tool bag body comprising an open topped storage volume. The tool bag body including interior facings, exterior facings enclosing first and second body reinforcing members that reinforce a bottom wall, a back wall, a right side wall, a front wall, and a left side wall of the tool bag body. The interior and exterior facings are coupled to form first and second compartments with the first and second body reinforcing members disposed therein. The tool bag also includes an axle-handle stabilizing member attached to the tool bag body; an axle coupled to the axle-handle stabilizing member; and a handle rigidly coupled to said axle-handle stabilizing member. First and second wheels are attached to opposite ends of the axle. The wheels are located outside the right side wall and the left side wall, respectively. | 2012-09-13 |
| 20120228842 | BLADE LIFT TOOL - This is directed to systems, processes, machines, and other means that allow a single user to lift a motor grader blade. The invention can allow a user to safely maneuver a motor grader blade. | 2012-09-13 |
| 20120228843 | STROLLER CONNECTABLE WITH A CAR SEAT - A stroller is connectable with a car seat, and includes a frame, and a stroller seat disposed on the frame. The stroller further includes a pair of opposing connecting rods mounted on the frame for supporting the stroller seat. The stroller seat is convertible between an upright position whereat the stroller seat is substantially vertical and connectable with the car seat, and a horizontal position whereat the stroller seat is substantially horizontal and adapted to be seated. The stroller seat includes a support frame operable to extend beyond and rise above the stroller seat to engage the car seat in the upright position, and operable to be moved to be lower than the stroller seat in the horizontal position. | 2012-09-13 |
| 20120228844 | Mobile cart for metal decking sheets - A forward moving powered cart configured to receive a bundle of roof decking sheets, and which cart rides on the each of three spaced adjacent trusses after being crane lifted onto the said roof trusses. The cart has two sets of spaced casters that ride on the 1 | 2012-09-13 |
| 20120228845 | SCOOTER ASSEMBLIES AND SCOOTER DECK ASSEMBLIES - A deck assembly for a scooter comprises a deck having a top surface, a bottom surface, and two side surfaces, and a grind plate having a front end, a rear end, a mating surface, and a grinding surface. The grind plate may be slidably attachable to the deck such that the mating surface of the grind plate mates with the bottom surface of the deck, and the bottom surface of the deck and at least a portion of each side surface of the deck are covered by the grind plate. A scooter assembly may further comprise a neck, a handlebar assembly, and steer tube extending through a down tube. The steer tube may be a butted tube member having a first wall thickness near a bottom portion of the butted tube member and a second wall thickness near a top portion of the butted tube member, the first wall thickness being greater than the second wall thickness. The steer tube may define a linear slot at or near the bottom portion of the steer tube and a key adapted to fit into the linear slot. | 2012-09-13 |
| 20120228846 | STABILIZER, AND METHOD OF PRODUCING A STABILIZER - In a method of producing a stabilizer for installation in a bearing unit of a motor vehicle, each end portion of a strip-shaped metal element is provided with a closing contour. The metal element is shaped to assume an undulating configuration having a wave portion. After being placed in a tool, a stabilizer bar is pressed against a circumference of the wave portion of the undulating metal element and the wave portion is formed onto the stabilizer bar such that the wave portion has at least one section which is ironed and the ironed section is urged into forced contact with the stabilizer bar. The metal element is then bent to embrace the stabilizer bar, and the end portions of the metal element are connected by engaging the closing contours of the end portions with a defined incline to thereby form a closed limiter ring fixed to the stabilizer bar. | 2012-09-13 |
| 20120228847 | WHEEL AXLE SUSPENSION HAVING CLAMP BODIES WITH A PROTRUSION FOR ATTACHING AN INDENTED TUBULAR AXLE TO TRAILING ARMS - A wheel axle suspension having on both sides of a vehicle a trailing arm which extends in the longitudinal direction of the vehicle, a thin walled tubular axle body, which has attachment regions where the axle body is attached to the trailing arms. Each trailing arm is hingedly connected at the front, viewed in the direction of travel of the vehicle, to a bearing bracket which is arranged on the vehicle chassis. The suspension also comprises a pneumatic spring operational between each of the trailing arms and the chassis, and clamp bodies for clamping the axle body at the attachment regions thereof so as to attach the axle body to the trailing arms, as well as tensioning elements for providing the clamp force for the clamp bodies. | 2012-09-13 |
| 20120228848 | Moveable step for assisting entry into vehicles - A side bar and steps attached to the side bar attached to a vehicle or to the side of the vehicle by welds, brazing, or bolting to brackets welded to the side bar or vehicle. A step is constructed by attaching a curved or flat member to the top of an L-shaped support bar that is in turn connected to the side bar or vehicle. The steps are movably affixed to a tab that is welded to the side bar or vehicle. The L-shaped supports have a plurality of engagement points so that the step can be adjusted upward and downward using the different attachment points. In this manner steps can be moved for different users depending on the height of the vehicle or user preference. The L-shaped support bars may be flared outward and provided with a plate for mounting the step thereon. | 2012-09-13 |
| 20120228849 | STEERING DAMPER WITH ACTIVE ADJUSTMENT OF DAMPING CHARACTERISTICS - A steering damper varies damping based upon the input source: the steering device or the ground contact parts. The device comprises a housing fixed on an attaching part that couples the steering device and the ground contact parts. A main chamber is partitioned into a first and second damping chamber and flow is at least partially controlled by a main valve unit. The opening area of the main valve unit is determined by a relative motion between the attaching part and the steering device. | 2012-09-13 |
