33rd week of 2012 patent applcation highlights part 14 |
Patent application number | Title | Published |
20120205604 | Apparatus for Forming Temporary Guardrail on Stairs - An apparatus for use in erecting a temporary guardrail on a stair, having a stair stringer. The apparatus has an elongated stanchion. A first jaw assembly is operatively attached to the stanchion for engaging one side of the stringer, proximal the bottom edge thereof, and includes a first compression assembly to operatively urge the stanchion against the stringer. A second axially spaced, jaw assembly is operatively attached to the stanchion for engaging the one side of the stringer proximal a top edge thereof, and includes a second compression assembly to urge the stanchion against the stringer, and a bracket attached to the stanchion, and being adapted to receive a temporary guardrail member. | 2012-08-16 |
20120205605 | ORGANIC REDOX ACTIVE COMPOUNDS WITH REVERSIBLE STORAGE OF CHARGES AND SUBSTRATES AND MOLECULAR MEMORY DEVICES COMPRISING THEM - An organic redox active compound with reversible storage of charge is disclosed. The material characterized by a formula R-M-Y-T. According to some aspects, R represents a deconjugating group, M represents an organic redox active fragment, not comprising any metal ion or metal, capable of reversibly storing at least one charge, T represents a tripod group comprising three groups F, capable of being chemically grafted to a surface of a solid substrate, and Y represents a spacer group separating M from T. A substrate on which the compounds are grafted, a molecular memory device including the compound or the substrate, and an electronic apparatus including the molecular memory device are also disclosed. | 2012-08-16 |
20120205606 | Nonvolatile Memory Device Using The Resistive Switching of Graphene Oxide And The Fabrication Method Thereof - Disclosed are an oxide-based nonvolatile memory with superior resistive switching characteristics and a method for preparing the same. More particularly, the disclosure relates to a nonvolatile memory device having a metal/reduced graphene oxide (r-GO) thin film/metal structure and a method for preparing the same. | 2012-08-16 |
20120205607 | PHASE-CHANGE RANDOM ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME - A PRAM device includes a lower electrode, a phase-change nanowire and an upper electrode. The phase-change nanowire may be electrically connected to the lower electrode and includes a single element. The upper electrode may be electrically connected to the phase-change nanowires. | 2012-08-16 |
20120205608 | NONVOLATILE VARIABLE RESISTANCE DEVICE AND METHOD OF MANUFACTURING THE NONVOLATILE VARIABLE RESISTANCE ELEMENT - According to one embodiment, a nonvolatile variable resistance device includes a first electrode, a second electrode, a first layer, and a second layer. The second electrode includes a metal element. The first layer is arranged between the first electrode and the second electrode and includes a semiconductor element. The second layer is inserted between the second electrode and the first layer and includes the semiconductor element. The percentage of the semiconductor element being unterminated is higher in the second layer than in the first layer. | 2012-08-16 |
20120205609 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a memory device includes a lower electrode layer, a nanomaterial assembly layer, a protective layer and an upper electrode layer. The nanomaterial assembly layer is provided on the lower electrode layer and includes a plurality of fine conductors assembled via a gap. The protective layer is provided on the nanomaterial assembly layer, is conductive, is in contact with the fine conductors, and includes an opening. The upper electrode layer is provided on the protective layer and is in contact with the protective layer. | 2012-08-16 |
20120205610 | RESISTIVE SWITCHING MEMORY ELEMENT INCLUDING DOPED SILICON ELECTRODE - A resistive switching memory element including a doped silicon electrode is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching and has a bandgap of greater than 4 eV, and the memory element switches from a low resistance state to a high resistance state and vice versa. | 2012-08-16 |
20120205611 | HETEROJUNCTION OXIDE NON-VOLATILE MEMORY DEVICE - A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer. The formation of the first metal oxide layer has a Gibbs free energy that is lower than the Gibbs free energy for the formation of the second metal oxide layer | 2012-08-16 |
20120205612 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A nonvolatile semiconductor memory device comprises a semiconductor substrate; a cell array block formed on the semiconductor substrate and including plural stacked cell array layers each with a plurality of first lines, a plurality of second lines crossing the plurality of first lines, and memory cells connected at intersections of the first and second lines between both lines; and a plurality of via-holes extending in the stacked direction of the cell array layers to individually connect the first or second line in the each cell array layer to the semiconductor substrate. The via-holes are formed continuously through the plural cell array layers, and multiple via-holes having equal lower end positions and upper end positions are connected to the first or second lines in different cell array layers. | 2012-08-16 |
20120205613 | High Efficiency Broadband Semiconductor Nanowire Devices and Methods of Fabricating without Foreign Catalysis - Amongst the candidates for very high efficiency solid state light sources and full solar spectrum solar cells are devices based upon InGaN nanowires. Additionally these nanowires typically require heterostructures, quantum dots, etc which all place requirements for these structures to be grown with relatively few defects and in a controllable reproducible manner. Additionally flexibility according to the device design requires that the nanowire at the substrate may be either InN or GaN. According to the invention a method of growing relatively defect free nanowires and associated structures for group IIIA-nitrides is presented without the requirement for foreign metal catalysts and overcoming the non-uniform growth of prior art non-catalyst growth techniques. According to other embodiments of the invention self-organizing dot-within-a-dot nanowire and dot-within-a-dot-within-a-well nanowire structures are presented. | 2012-08-16 |
20120205614 | METHOD FOR MANUFACTURING A VERY-HIGH-RESOLUTION SCREEN USING A NANOWIRE-BASED EMITTING ANISOTROPIC CONDUCTIVE FILM - A method for producing an emissive pixel screen includes forming an active pixel matrix along which an electrode forming layer runs and having pixels arranged according to a distribution, forming an anisotropic substrate that includes a set of light emitting diodes constituted by parallel nanowires and arranged in an insulating matrix transversely with respect to a substrate thickness and having a density higher than a density of the pixels irrespective of the pixel distribution, connecting the substrate to the active pixel matrix by connecting only sub-groups of the parallel nanowires by a first end to separate pixel electrodes defined in the electrode forming layer according to the distribution of the pixels in the matrix, and connecting the sub-groups, by another end, to a common electrode, and delimiting the sub-groups by rendering the nanowires of the substrate that are arranged between the sub-groups emissively inactive. | 2012-08-16 |
20120205615 | ORGANIC PHOTOVOLTAIC CELL - An organic photovoltaic cell ( | 2012-08-16 |
20120205616 | DEFECT-CONTROLLING STRUCTURE FOR EPITAXIAL GROWTH, LIGHT EMITTING DEVICE CONTAINING DEFECT-CONTROLLING STRUCTURE, AND METHOD OF FORMING THE SAME - A method for reducing dislocations or other defects in a light emitting device, such as light emitting diode (LED), by in-situ introducing nanoparticles into at least one of a defect-controlling layer, an n-type layer, a p-type layer, and a quantum well of the light emitting device. A light emitting device is provided, and nanoparticles are dispensed in-situ in at least one of a defect-controlling layer, an n-type layer, a p-type layer, and a quantum well of the light emitting device. | 2012-08-16 |
20120205617 | NON-POLAR SEMICONDUCTOR LIGHT EMISSION DEVICES - A light emitting device includes a silicon substrate having a (100) upper surface. The (100) upper surface has a recess, the recess being defined in part by (111) surfaces of the silicon substrate. The light emitting device includes a GaN crystal structure over one of the (111) surfaces which has a non-polar plane and a first surface along the non-polar plane. Light emission layers over the first surface have at least one quantum well comprising GaN. | 2012-08-16 |
20120205618 | GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR - The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance and high electrostatic breakdown voltage. The Group III nitride semiconductor light-emitting device has a layered structure in which an n-type contact layer, an ESD layer, an n-type cladding layer, a light-emitting layer, a p-type cladding layer, and a p-type contact layer are deposited on a sapphire substrate. The ESD layer has a pit. The n-type cladding layer and the light-emitting layer are formed without burying the pit. The pit has a diameter of 110 nm to 150 nm at an interface between the n-type cladding layer and the light-emitting layer. The barrier layer of the light-emitting layer is formed of AlGaN having an Al composition ratio of 3% to 7%. | 2012-08-16 |
20120205619 | Light Emitting Device with Dislocation Bending Structure - A solution for reducing a number of dislocations in an active region of an emitting device is provided. A dislocation bending structure can be included in the emitting device between the substrate and the active region. The dislocation bending structure can be configured to cause dislocations to bend and/or annihilate prior to reaching the active region, e.g., due to the presence of a sufficient amount of strain. The dislocation bending structure can include a plurality of layers with adjacent layers being composed of a material, but with molar fractions of an element in the respective material differing between the two layers. The dislocation bending structure can include at least forty pairs of adjacent layers having molar fractions of an element differing by at least five percent between the adjacent layers. | 2012-08-16 |
20120205620 | METHOD FOR FABRICATION OF SEMIPOLAR (Al, In, Ga, B)N BASED LIGHT EMITTING DIODES - A yellow Light Emitting Diode (LED) with a peak emission wavelength in the range 560-580 nm is disclosed. The LED is grown on one or more III-nitride-based semipolar planes and an active layer of the LED is composed of indium (In) containing single or multi-quantum well structures. The LED quantum wells have a thickness in the range 2-7 nm. A multi-color LED or white LED comprised of at least one semipolar yellow LED is also disclosed. | 2012-08-16 |
20120205621 | LIGHT EMITTING DIODE COMPRISING SEMICONDUCTOR NANOCRYSTAL COMPLEXES - A light emitting diode (LED) formed by depositing an LED chip and coupling a stability layer to the LED chip. Semiconductor nanocrystals are placed in a first matrix material to form a nanocrystal complex layer. The nanocrystal complex layer is deposited on top of the stability layer. A thickness of the stability layer is chosen to maximizes a power of a light output by the nanocrystal complex layer. The matrix material and the stability layer can be of the same type of material. Additional layers of matrix material can be deposited on top of the nanocrystal complex layer. These additional layers can comprise matrix material only or can comprise matrix material and semiconductor nanocrystals to form another nanocrystal complex layer. | 2012-08-16 |
20120205622 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes a plurality of first conductive type semiconductor layers; a plurality of second conductive type semiconductor layers; an active layer between the first and second conductive type semiconductor layers, wherein the active layer includes a plurality of quantum barrier layers and a plurality of quantum well layers; a first electrode connected to the first conductive type semiconductor layers; and a second electrode connected to the second conductive type semiconductor layers, wherein the first conductive type semiconductor layers includes a first and second AlGaN based layers, and the plurality of quantum well layers of the active layer include an InAlGaN layer. | 2012-08-16 |
20120205623 | NON-POLAR (Al,B,In,Ga)N QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES - A method for forming non-polar (Al,B,In,Ga)N quantum well and heterostructure materials and devices. Non-polar (11 | 2012-08-16 |
20120205624 | PHOTODETECTORS AND PHOTOVOLTAICS BASED ON SEMICONDUCTOR NANOCRYSTALS - A composite material is described. The composite material comprises semiconductor nanocrystals, and organic molecules that passivate the surfaces of the semiconductor nanocrystals. One or more properties of the organic molecules facilitate the transfer of charge between the semiconductor nanocrystals. A semiconductor material is described that comprises p-type semiconductor material including semiconductor nanocrystals. At least one property of the semiconductor material results in a mobility of electrons in the semiconductor material being greater than or equal to a mobility of holes. A semiconductor material is described that comprises n-type semiconductor material including semiconductor nanocrystals. At least one property of the semiconductor material results in a mobility of holes in the semiconductor material being greater than or equal to a mobility of electrons. | 2012-08-16 |
20120205625 | (Al, In, Ga, B)N DEVICE STRUCTURES ON A PATTERNED SUBSTRATE - A nitride light emitting diode, on a patterned substrate, comprising a nitride interlayer having at least two periods of alternating layers of In | 2012-08-16 |
20120205626 | SEMICONDUCTOR CHIP WITH GRAPHENE BASED DEVICES IN AN INTERCONNECT STRUCTURE OF THE CHIP - A semiconductor structure includes a first dielectric material including at least one first conductive region contained therein. The structure also includes at least one graphene containing semiconductor device located atop the first dielectric material. The at least one graphene containing semiconductor device includes a graphene layer that overlies and is in direct with the first conductive region. The structure further includes a second dielectric material covering the at least one graphene containing semiconductor device and portions of the first dielectric material. The second dielectric material includes at least one second conductive region contained therein, and the at least one second conductive region is in contact with a conductive element of the at least one graphene containing semiconductor device. | 2012-08-16 |
20120205627 | SEMICONDUCTOR SWITCHING CIRCUIT EMPLOYING QUANTUM DOT STRUCTURES - A semiconductor circuit includes a plurality of semiconductor devices, each including a semiconductor islands having at least one electrical dopant atom and located on an insulator layer. Each semiconductor island is encapsulated by dielectric materials including at least one dielectric material portion. Conductive material portions, at least one of which abut two dielectric material portions that abut two distinct semiconductor islands, are located directly on the at least one dielectric material layer. At least one gate conductor is provided which overlies at least two semiconductor islands. Conduction across a dielectric material portion between a semiconductor island and a conductive material portion is effected by quantum tunneling. The conductive material portions and the at least one gate conductor are employed to form a semiconductor circuit having a low leakage current. A design structure for the semiconductor circuit is also provided. | 2012-08-16 |
20120205628 | SEMICONDUCTING COMPOSITION - A compound of Formula (I): | 2012-08-16 |
20120205629 | SEMICONDUCTOR COMPOUND - A semiconducting tetrahydroacridinoacridine compound of Formula (I): | 2012-08-16 |
20120205630 | SEMICONDUCTOR COMPOUND - A thiaxanthenothiaxanthene compound of Formula (I): | 2012-08-16 |
20120205631 | Display Device and Method for Manufacturing Thereof - It is a problem to provide an electric apparatus less in consumption power and long in life by the manufacture using the display device. An insulating bank is provided in a form surrounding the pixel portions on first electrodes over a substrate. The entire surface is applied, by a wet scheme (method), with an organic conductive film which has a thickness form of T | 2012-08-16 |
20120205632 | LIGHT-EMITTING ELEMENT - A light-emitting element having high external quantum efficiency is provided. A light-emitting element having a long lifetime is provided. A light-emitting element is provided which includes a light-emitting layer containing a phosphorescent compound, a first organic compound, and a second organic compound between a pair of electrodes, in which a combination of the first organic compound and the second organic compound forms an exciplex (excited complex). The light-emitting element transfers energy by utilizing an overlap between the emission spectrum of the exciplex and the absorption spectrum of the phosphorescent compound and thus has high energy transfer efficiency. Therefore, a light-emitting element having high external quantum efficiency can be obtained. | 2012-08-16 |
20120205633 | Light-Emitting Device and Manufacturing Method Thereof - An object of the present invention is to decrease the conductivity of a hole-injection layer (or a hole-transport layer) containing molybdenum oxide without decreasing the amount of molybdenum oxide so that crosstalk is prevented from occurring. A light-emitting element includes, between an anode and a cathode, an EL layer including at least a hole-injection layer and a light-emitting layer. In the light-emitting element, the hole-injection layer is provided between the anode and the light-emitting layer, and the hole-injection layer contains molybdenum oxide and an additive. The additive may be an alkali metal, an alkaline earth metal, a substance having a LUMO level of lower than or equal to −5.8 eV, or a substance having a hole mobility of lower than or equal to 10 | 2012-08-16 |
20120205634 | Light Emitting Unit, Light Emitting Device, and Lighting Device - The light-emitting unit has at least a first light-emitting element, a second light-emitting element, and a separation layer. The separation layer has a leg portion and a stage portion which protrudes outside of a bottom surface of the leg portion over the leg portion. An upper electrode of the first light-emitting element is electrically connected to a lower electrode of the second light-emitting element in a region where the upper electrode and the lower electrode overlap with the stage portion of the separation layer. By providing the separation layer, the light-emitting unit can be formed without using a metal mask. The upper electrode can be a composite material including an organic compound and a metal oxide or a stacked layer of the composite material and a metal material or a light-transmitting conductive material. | 2012-08-16 |
20120205635 | MONOAMINE COMPOUND, CHARGE TRANSPORT MATERIAL, COMPOSITION FOR CHARGE TRANSPORT FILM, ORGANIC ELECTROLUMINESCENT ELEMENT, ORGANIC EL DISPLAY, AND ORGANIC EL LIGHTING - A monoamine compound characterized by being represented by the following general formula (1). | 2012-08-16 |
20120205636 | COMPOUND FOR ORGANIC PHOTOELECTRIC DEVICE AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE SAME - A compound for an organic photoelectric device an organic photoelectric device, and a display device, the compound being represented by the following Chemical Formula 1: | 2012-08-16 |
20120205637 | LIQUID COMPOSITIONS FOR INKJET PRINTING OF ORGANIC LAYERS OR OTHER USES - A method of forming an organic layer by using a liquid composition comprising a small molecule organic semiconductor material mixed in a ketone solvent. The liquid composition is deposited on a surface to form the organic layer. The ketone solvent may be an aromatic ketone solvent, such as a tetralone solvent. The organic semiconductor material may be cross-linkable to provide a cross-linked organic layer. The method can be used to make organic electronic devices, such as organic light emitting devices. In another aspect, the liquid composition comprises a small molecule organic semiconductor material mixed in an aromatic ether solvent. Also, provided are liquid compositions which can be used to make organic layers. | 2012-08-16 |
20120205638 | ELECTROLUMINESCENT DEVICE USING AZOMETHINE-LITHIUM-COMPLEX AS ELECTRON INJECTION LAYER - In OLEDs, improved efficiency is obtained by compounds which can form inter alia electron injection layers of the formula (I) | 2012-08-16 |
20120205639 | ORGANIC LIGHT EMITTING DEVICE - Provided is an organic light emitting device with enhanced durability during continuous driving. The organic light emitting device includes: an anode, a cathode, and an organic compound layer being placed between the anode and the cathode and including at least a hole transport layer and an emission layer, in which: the emission layer contains a blue light emitting material; the hole transport layer contains a plurality of kinds of organic compounds; and an organic compound having the smallest ionization potential among the organic compounds includes a compound having no absorption spectrum peak in a blue color wavelength region in a radical cation state. | 2012-08-16 |
20120205640 | ORGANIC ELECTROLUMINESCENT DEVICE - Disclosed is an organic electroluminescent device (organic EL device) which is improved in luminous efficiency, fully secure of driving stability, and of a simple configuration. The organic EL device comprises organic layers comprising a hole-transporting layer and a light-emitting layer sandwiched between an anode and a cathode. The light-emitting layer contains a fluorescent light-emitting material and an electron- and/or exciton-blocking layer containing an indolocarbazole derivative represented by general formula (2) is disposed between the hole-transporting layer and the light-emitting layer so as to be adjacent to the light-emitting layer. In general formula (2), ring B is a heterocyclic ring fused to the adjacent rings and represented by formula (1c), Z is an n-valent aromatic hydrocarbon group or aromatic heterocyclic group, and n is 1 or 2. | 2012-08-16 |
20120205641 | PHOTOVOLTAIC CELL - The present invention provides a photovoltaic cell having a large short-circuit current density and a large photoelectric conversion efficiency. | 2012-08-16 |
20120205642 | ORGANIC ELECTROLUMINESCENT DEVICE - A high-efficiency, high-durability organic electroluminescent device, particularly a phosphorescent organic electroluminescent device is provided by using an organic compound of excellent characteristics that exhibits excellent hole-injecting/transporting performance and has high triplet exciton confining capability with an electron blocking ability, and that has high stability in the thin-film state and high luminous efficiency. | 2012-08-16 |
20120205643 | ORGANIC ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is an organic electronic device exhibiting excellent conductivity and transparency of an electrode, and low driving voltage, together with en excellent storing property and excellent lifetime. Also disclosed is an organic electronic device possessing a transparent substrate and provided thereon, a first transparent electrode, a second electrode and an organic functional layer provided between the first transparent electrode and the second electrode, wherein the first transparent electrode and the second electrode are opposed to each other, and a transparent conductive layer containing a conductive polymer and an aqueous binder is provided between the first transparent electrode and the organic functional layer. | 2012-08-16 |
20120205644 | PHOTOVOLTAIC CELL - The present invention provides a photovoltaic cell having a large short-circuit current density and a large photoelectric conversion efficiency. | 2012-08-16 |
20120205645 | HETEROLEPTIC CARBENE COMPLEXES AND THE USE THEREOF IN ORGANIC ELECTRONICS - The present invention relates to heteroleptic complexes comprising a phenylimidazole or phenyltriazole unit bonded via a carbene bond to a central metal atom, and phenylimidazole ligands attached via a nitrogen-metal bond to the central atom, to OLEDs which comprise such heteroleptic complexes, to light-emitting layers comprising at least one such heteroleptic complex, to a device selected from the group consisting of illuminating elements, stationary visual display units and mobile visual display units comprising such an OLED, to the use of such a heteroleptic complex in OLEDs, for example as emitter, matrix material, charge transport material and/or charge blocker. | 2012-08-16 |
20120205646 | DISPLAY WITH PHOTO SENSOR AND MANUFACTURING METHOD THEREOF - A display with a photo sensor is provided, wherein the photo sensor is integrated with an active device array substrate of the display and fabricated through an existing process to reduce the manufacturing cost. A photosensitive silicon-rich dielectric layer or any other photosensitive material layer having similar photosensitive characteristics (for example, a photosensitive semiconductor layer) is adopted to form the photo sensor with a lower electrode and a transparent upper electrode. Thereby, the fill factor of the photo sensor is maximized and noises caused by a backlight source electrode are eliminated. | 2012-08-16 |
20120205647 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device includes: a substrate having a transistor region and a thin-film transistor having a gate electrode, a source/drain electrode and an active layer sequentially formed on the transistor region, wherein a portion of the source/drain electrode is between the active layer and substrate. | 2012-08-16 |
20120205648 | THIN-FILM TRANSISTOR, DISPLAY APPARATUS AND ELECTRONIC APPARATUS - Disclosed herein is a thin-film transistor having a gate electrode; a source electrode and a drain electrode which form a source/drain-electrode pair; and a channel layer which is provided between the gate electrode and the source/drain-electrode pair, includes a poly-crystal oxide semiconductor material and has a film thickness smaller than the average diameter of crystal grains of the poly-crystal oxide semiconductor material. | 2012-08-16 |
20120205649 | PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC APPARATUS - A photoelectric conversion device includes circuit portions disposed on a substrate, a first electrode electrically connected to one of the circuit portions, an optically transparent second electrode opposing the first electrode, and a photoelectric conversion portion disposed between the first electrode and the second electrode. The photoelectric conversion portion has a multilayer structure including a light absorption layer made of a p-type compound semiconductor film having a chalcopyrite structure, an amorphous oxide semiconductor layer, and a window layer made of an n-type semiconductor film. | 2012-08-16 |
20120205650 | METHODS FOR FORMING MATERIALS USING MICRO-HEATERS AND ELECTRONIC DEVICES INCLUDING SUCH MATERIALS - Nano-sized materials and/or polysilicon are formed using heat generated from a micro-heater, the micro-heater may include a substrate, a heating element unit formed on the substrate, and a support structure formed between the substrate and the heating element unit. Two or more of the heating element units may be connected in series. | 2012-08-16 |
20120205651 | LIQUID CRYSTAL DISPLAY AND METHOD OF MANUFACTURING THE SAME - A liquid crystal display and a method of manufacturing the same are provided. The liquid crystal display includes an insulating substrate, a gate electrode formed on the insulating substrate, an oxide semiconductor layer formed on the gate electrode, an etch stopper formed on the oxide semiconductor layer in a channel area, a common electrode formed on the insulating substrate, source and drain electrodes separated from each other on the etch stopper and extending to an upper portion of the oxide semiconductor layer, a passivation layer formed on the etch stopper, the common electrode, the source and drain electrodes, and a pixel electrode formed on the passivation layer and connected to the drain electrode. | 2012-08-16 |
20120205652 | THIN FILM, METHOD OF FORMING THE SAME, AND SEMICONDUCTOR LIGHT-EMITTING ELEMENT COMPRISING THE THIN FILM - It is an object of the present invention to stably form an N-doped ZnO-based compound thin film. In the present invention, a gas containing oxygen and nitrogen and a nitrogen gas together with an organometallic material gas are supplied into a low-electron-temperature high-density plasma which is excited by microwave, thereby forming the N-doped ZnO-based compound thin film on a substrate as a film forming object. | 2012-08-16 |
20120205653 | PRESSURE SENSOR AND METHOD FOR MANUFACTURING PRESSURE SENSOR - A pressure sensor | 2012-08-16 |
20120205654 | SILICON LAYERS FORMED FROM POLYMER-MODIFIED LIQUID SILANE FORMULATIONS - The invention relates to a formulation which contains at least one silane and at least one carbon polymer in a solvent, and to the production of a silicon layer on a substrate which is coated with such a formulation. | 2012-08-16 |
20120205655 | METHOD TO TEXTURE A LAMINA SURFACE WITHIN A PHOTOVOLTAIC CELL - It is advantageous to create texture at the surface of a photovoltaic cell to reduce reflection and increase travel length of light within the cell. A method is disclosed to create texture at the surface of a silicon body by reacting a silicide-forming metal at the surface, where the silicide-silicon interface is non-planar, then stripping the silicide, leaving behind a textured surface. Depending on the metal and the conditions of silicide formation, the resulting surface may be faceted. The peak-to-valley height of this texturing will generally be between about 300 and about 5000 angstroms, which is well-suited for use in photovoltaic cells comprising a thin silicon lamina. | 2012-08-16 |
20120205656 | Thin-Film Electronic Devices Including Pre-Deformed Compliant Substrate - A thin-film layered electronic device, or array of devices, is formed over a layer structure comprising a flexible substrate, a buffer layer, and a metal layer. The layer structure is annealed to permanently deform the layer structure beyond its plastic deformation limit. The thin-film electronic device is formed thereover by a process according to which all steps are performed at a temperature below that at which further plastic deformation of the buffer layer occurs. In-process strain and runout are reduced, improving device yield on flexible substrates. The metal layer forms a first layer of the thin-film layered device, or array of devices. | 2012-08-16 |
20120205657 | METHOD FOR MAKING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS OBTAINED BY THE METHOD, METHOD FOR MAKING THIN FILM TRANSISTOR SUBSTRATE AND THIN FILM TRANSISTOR SUBSTRATE OBTAINED BY THE METHOD, AND METHOD FOR MAKING DISPLAY APPARATUS AND DISPLAY APPARATUS OBTAINED BY THE METHOD - A semiconductor apparatus having a substrate and a laminate structure formed on the substrate, the laminate structure including an insulating film made of a metal oxide and a semiconductor thin film, both the insulating film and the semiconductor thin film being crystallized. | 2012-08-16 |
20120205658 | SEMICONDUCTOR DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor display device is formed including an interlayer insulating. Specifically, a TFT is formed and then a nitrogen-containing inorganic insulating film that transmits less moisture compared to organic resin film is formed so as to cover the TFT. Next, organic resin including photosensitive acrylic resin is applied and an opening is formed by partially exposing the organic resin film to light. The organic resin film where the opening is formed, is then covered with a nitrogen-containing inorganic insulating film which transmits less moisture than organic resin film does. Thereafter, the gate insulating film and the two layers of the nitrogen-containing inorganic insulating films are partially etched away in the opening of the organic resin film to expose the active layer of the TFT. | 2012-08-16 |
20120205659 | CRYSTALLIZATION APPARATUS, CRYSTALLIZATION METHOD, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - An organic light-emitting display apparatus includes a substrate, a thin film transistor, a reflective layer, and an organic emission device. The thin film transistor includes an active layer patterned on the substrate at a predetermined interval, a gate electrode, and source/drain electrodes. The reflective layer is between the substrate and the active layer. The organic emission device has sequentially stacked therein a pixel electrode electrically connected to the TFT, an intermediate layer including an emission layer, and an opposing electrode. | 2012-08-16 |
20120205660 | METHOD OF MANUFACTURING THIN FILM TRANSISTOR, THIN FILM TRANSISTOR, AND DISPLAY UNIT - A thin film transistor having a crystalline silicon film that is formed over an insulating substrate with a gate electrode and a gate insulating film in between, and has a channel region in a region corresponding to the gate electrode; an insulating channel protective film that is selectively formed in a region corresponding to the channel region on the crystalline silicon film; an n+ silicon film having a source region and a drain region that sandwich a region corresponding to the channel region on the channel protective film and the crystalline silicon film; and a metal film having a source electrode and a drain electrode that respectively correspond to the source region and the drain region. | 2012-08-16 |
20120205661 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a supporting substrate, a conductive layer placed on the supporting substrate, and at least one group III nitride semiconductor layer placed on the conductive layer. Of the group III nitride semiconductor layers, a conductive-layer-neighboring group III nitride semiconductor layer has n type conductivity, dislocation density of at most 1×10 | 2012-08-16 |
20120205662 | SEMICONDUCTOR DEVICE, POWER SUPPLY DEVICE, AMPLIFIER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor layer formed over a substrate; an insulating film formed over the semiconductor layer; and an electrode formed over the insulating film, wherein the insulating film includes an amorphous film including carbon. | 2012-08-16 |
20120205663 | SEMICONDUCTOR DEVICE, POWER-SUPPLY UNIT, AMPLIFIER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device, includes a semiconductor layer formed above a substrate; an insulating film formed on the semiconductor layer; and an electrode formed on the insulating film. The insulating film has a membrane stress at a side of the semiconductor layer lower than a membrane stress at a side of the electrode. | 2012-08-16 |
20120205664 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided is a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises: an active layer; a first nitride semiconductor layer on the active layer; a first delta-doped layer on the first nitride semiconductor layer; a second nitride semiconductor layer on the first delta-doped layer; a second delta-doped layer on the second nitride semiconductor layer; a third nitride semiconductor layer on the second delta-doped layer. | 2012-08-16 |
20120205665 | HIGH-QUALITY NON-POLAR/SEMI-POLAR SEMICONDUCTOR DEVICE ON POROUS NITRIDE SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF - Provided are a high-quality non-polar/semi-polar semiconductor device having reduced defect density of a nitride semiconductor layer and improved internal quantum efficiency and light extraction efficiency, and a manufacturing method thereof. The method for manufacturing a semiconductor device is to form a template layer and a semiconductor device structure on a sapphire, SiC or Si substrate having a crystal plane for a growth of a non-polar or semi-polar nitride semiconductor layer. The manufacturing method includes: forming a nitride semiconductor layer on the substrate; performing a porous surface modification such that the nitride semiconductor layer has pores; forming the template layer by re-growing a nitride semiconductor layer on the surface-modified nitride semiconductor layer; and forming the semiconductor device structure on the template layer. | 2012-08-16 |
20120205666 | JUNCTION TERMINATION STRUCTURES INCLUDING GUARD RING EXTENSIONS AND METHODS OF FABRICATING ELECTRONIC DEVICES INCORPORATING SAME - An electronic device includes a semiconductor layer, a primary junction in the semiconductor layer, a lightly doped region surrounding the primary junction and a junction termination structure in the lightly doped region adjacent the primary junction. The junction termination structure has an upper boundary, a side boundary, and a corner between the upper boundary and the side boundary, and the lightly doped region extends in a first direction away from the primary junction and normal to a point on the upper boundary by a first distance that is smaller than a second distance by which the lightly doped region extends in a second direction away from the primary junction and normal to a point on the corner. At least one floating guard ring segment may be provided in the semiconductor layer outside the corner of the junction termination structure. Related methods are also disclosed. | 2012-08-16 |
20120205667 | Semiconductor Device with Low-Conducting Field-controlling Element - A semiconductor device including a low conducting field-controlling element is provided. The device can include a semiconductor including an active region, and a set of contacts to the active region. The field-controlling element can be coupled to one or more of the contacts in the set of contacts. The field-controlling element can be formed of a low conducting layer having a sheet resistance between approximately 10 | 2012-08-16 |
20120205668 | SWITCHING SEMICONDUCTOR DEVICES AND FABRICATION PROCESS - A switching semiconductor device is provided, in which a negative gate voltage can be applied to the semiconductor device in an OFF state so as to increase a breakdown voltage of the gate junction without impairing a normally-off function of the semiconductor device and the ON-resistance. The switching semiconductor device is fabricated by using a semiconductor substrate with a band gap of 2.0 eV or more. In a JFET structure where a p | 2012-08-16 |
20120205669 | POWER SEMICONDUCTOR DEVICE - In a semiconductor device according to the present invention, a p-type well region disposed in an outer peripheral portion of the power semiconductor device is divided into two parts, that is, an inside and an outside, and a field oxide film having a greater film thickness than the gate insulating film is provided on a well region at the outside to an inside of an inner periphery of the well region. Therefore, it is possible to prevent, in the gate insulating film, a dielectric breakdown due to the voltage generated by the flow of the displacement current in switching. | 2012-08-16 |
20120205670 | SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCTION THEREOF - A semiconductor device | 2012-08-16 |
20120205671 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A high reliability semiconductor display device is provided. A semiconductor layer in the semiconductor display device has a channel forming region, an LDD region, a source region, and a drain region, and the LDD region overlaps a first gate electrode, sandwiching a gate insulating film. | 2012-08-16 |
20120205672 | SEMICONDUCTOR CHIP MODULE AND SEMICONDUCTOR PACAKGE HAVING THE SAME - A semiconductor chip module includes a first semiconductor chip possessing a first surface and a second surface which faces away from the first surface, and having a first transmission and reception unit which includes at least two light emitting sections and at least two light receiving sections arranged in a form of a matrix on the first surface and configured to transmit and receive optical signals; and a second semiconductor chip disposed over the first surface of the first semiconductor chip, and having a second transmission and reception unit which includes at least two light emitting sections and at least two light receiving sections arranged in a form of a matrix on a surface of the second semiconductor chip facing the first semiconductor chip and configured to transmit and receive optical signals. | 2012-08-16 |
20120205673 | Organic Light-Emitting Display Device - An organic light-emitting display device. The organic light-emitting display device includes a substrate, a semiconductor layer arranged on the substrate, an insulating film arranged on the semiconductor layer and a conductive layer arranged on the insulating film, wherein the semiconductor layer comprises a plurality of protrusion lines extending in a first direction, the protrusion lines being parallel to a peripheral edge of the conductive layer. | 2012-08-16 |
20120205674 | LIGHT EMITTING DEVICE HAVING SURFACE-MODIFIED SILICATE LUMINOPHORES - Exemplary embodiments of the present invention relate to a light emitting device including a light emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a silicate luminophore and a fluorinated coating arranged on the silicate luminophore. | 2012-08-16 |
20120205675 | LIGHT-EMITTING DEVICE AND LIGHTING DEVICE - To provide a light-emitting device including the plurality of light-emitting elements having a structure in which a light-emitting area is large and defects in patterning of light-emitting elements are suppressed. To provide a lighting device including the light-emitting device. The light-emitting device includes a first wiring provided over a substrate having an insulating surface, an insulating film provided over the first wiring, a second wiring provided over the insulating film, and a light-emitting element unit including a plurality of light-emitting elements provided over the first wiring with the insulating film provided therebetween. The plurality of light-emitting elements each include a first electrode layer having a light-blocking property, a layer containing an organic compound in contact with the first electrode layer, and a second electrode layer having a light-transmitting property in contact with the layer containing an organic compound. The layers containing an organic compound are separated by a separation layer. | 2012-08-16 |
20120205676 | Light-Emitting Device and Display Device - A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is to the electrode having a reflective property, the longer the wavelength of light emitted from the light-emitting layer is. | 2012-08-16 |
20120205677 | LED MODULE - An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes. | 2012-08-16 |
20120205678 | Light-Emitting Device and Manufacturing Method Thereof, Lighting Device, and Display Device - In a light-emitting device, an insulating separation layer whose upper portion protrudes more than a bottom portion in a direction parallel to a substrate is provided on and in contact with a common wiring provided over the substrate. An EL layer provided over the separation layer on the common wiring is physically divided by the separation layer. An upper electrode layer formed in the same position is also physically divided by the separation layer and is in contact with the common wiring in a region overlapped with the most protruding portion of the separation layer. Such a common wiring may be used as an auxiliary wiring. Further, such a light-emitting device may be applied to a lighting device and a display device. | 2012-08-16 |
20120205679 | Light-Emitting Module, Light-Emitting Panel, and Lighting Device - An object is to provide a light-emitting module in which a light-emitting element suffering a short-circuit failure does not cause wasteful electric power consumption. Another object is to provide a light-emitting panel in which a light-emitting element suffering a short-circuit failure does not allow the reliability of an adjacent light-emitting element to lower. Focusing on heat generated by a light-emitting element suffering a short-circuit failure, provided is a structure in which electric power is supplied to a light-emitting element through a positive temperature coefficient thermistor (PTC thermistor) thermally coupled with the light-emitting element. | 2012-08-16 |
20120205680 | SEMICONDUCTOR LIGHT EMITTING DEVICE, OPTICAL PICKUP UNIT AND INFORMATION RECORDING/REPRODUCTION APPARATUS - A semiconductor light emitting device downsized by devising arrangement of connection pads is provided. A second light emitting device is layered on a first light emitting device. The second light emitting device has a stripe-shaped semiconductor layer formed on a second substrate on the side facing to a first substrate, a stripe-shaped p-side electrode supplying a current to the semiconductor layer, stripe-shaped opposed electrodes that are respectively arranged oppositely to respective p-side electrodes of the first light emitting device and electrically connected to the p-side electrodes of the first light emitting device, connection pads respectively and electrically connected to the respective opposed electrodes, and a connection pad electrically connected to the p-side electrode. The connection pads are arranged in parallel with the opposed electrodes. | 2012-08-16 |
20120205681 | DISPLAY APPARATUS - Provided is a display apparatus and a method of manufacture. The display apparatus includes a first substrate with a plurality of organic electroluminescence devices, a second substrate with a color filter, the second substrate facing the first substrate, and an adhesive layer disposed between the first substrate and the second substrate so as to cover the plurality of organic electroluminescence devices, the adhesive layer being made of a material selected from the group consisting of a phenol resin, a melanin resin, an unsaturated polyester resin, an epoxy resin, a silicon resin and a polyurethane resin. | 2012-08-16 |
20120205682 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 2012-08-16 |
20120205683 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 2012-08-16 |
20120205684 | Light Emitting Element and Light Emitting Device Using the Element - A first light emitting element | 2012-08-16 |
20120205685 | Light-Emitting Element, Light-Emitting Device, and Display Device - A light-emitting element with which a reduction in power consumption and an improvement in productivity of a display device can be achieved is provided. A technique of manufacturing a display device with high productivity is provided. The light-emitting element includes an electrode having a reflective property, and a first light-emitting layer, a charge generation layer, a second light-emitting layer, and an electrode having a light-transmitting property stacked in this order over the electrode having a reflective property. The optical path length between the electrode having a reflective property and the first light-emitting layer is one-quarter of the peak wavelength of the emission spectrum of the first light-emitting layer. The optical path length between the electrode having a reflective property and the second light-emitting layer is three-quarters of the peak wavelength of the emission spectrum of the second light-emitting layer. | 2012-08-16 |
20120205686 | Light-Emitting Device and Display Device - A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is positioned to the electrode having a reflective property, the shorter the wavelength of light emitted from the light-emitting layer is. | 2012-08-16 |
20120205687 | LIGHT-EMITTING BODY, LIGHT-EMITTING LAYER, AND LIGHT-EMITTING DEVICE - An organic light-emitting element having high efficiency and long lifetime is provided. An organic light-emitting body is provided which includes a host having a high electron-transport property (n-type host), a host having a high hole-transport property (p-type host), and a guest such as an iridium complex and in which the n-type host and the p-type host are located so as to be adjacent to each other. When an electron and a hole are injected to such a light-emitting body, the electron is trapped by the n-type host and the hole is trapped by the p-type host. Then, both the electron and the hole are injected to the guest, and thus the guest is brought into an excited state. In this process, less thermal deactivation occurs and the working rate of the guest is high; thus, highly efficient light emission can be obtained. | 2012-08-16 |
20120205688 | LIGHT EMITTING DEVICE - Light-emitting elements have a problem that their light-extraction efficiency is low due to scattered light or reflected light inside the light-emitting elements. The light-extraction efficiency of the light-emitting elements needs to be enhanced by a new method. According to the present invention, a light-emitting element includes a first layer generating holes, a second layer including a light-emitting layer for each emission color and a third layer generating electrons between an anode and a cathode, and the thickness of the first layer is different depending on each layer including the light-emitting layer for each emission color. A layer in which an organic compound and a metal oxide are mixed is used as the first layer, and thus, the driving voltage is not increased even when the thickness is increased, which is preferable. | 2012-08-16 |
20120205689 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion. | 2012-08-16 |
20120205690 | GROUP III-NITRIDE BASED SEMICONDUCTOR LED - A group III-nitride based semiconductor LED includes a sapphire substrate, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer grown sequentially on the sapphire substrate. An n-type strain lattice structure is arranged between the n-type semiconductor layer and the active layer. A lattice constant of the n-type strain lattice structure exceeds that of the active layer, and is less than that of the n-type semiconductor layer. | 2012-08-16 |
20120205691 | Controlling Pit Formation in a III-Nitride Device - A device includes a semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region and a plurality of layer pairs disposed within one of the n-type region and the p-type region. Each layer pair includes an InGaN layer and pit-filling layer in direct contact with the InGaN layer. The pit-filling layer may fill in pits formed in the InGaN layer. | 2012-08-16 |
20120205692 | LIGHT EMITTING DIODE WITH NANOSTRUCTURES AND METHOD OF MAKING THE SAME - A light emitting diode (LED) is provided along with a method of making the same. The LED includes a conductive n-type region formed on a substrate; an active region formed on the n-type region; a first p-type region formed on the active region; a plurality of nanostructures formed on the first p-type region to carry out light extraction from the active region, the nanostructures having a diameter less than 500 nm; a second p-type region regrown on the first p-type region to form a non-planar surface in combination with the nanostructures; and a p-type electrode formed on the non-planar surface. | 2012-08-16 |
20120205693 | NARROW VIEWING ANGLE PLASTIC LEADED CHIP CARRIER - A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package enables a narrow viewing angle without requiring a second lens. In particular, the PLCC package is provided with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage. | 2012-08-16 |
20120205694 | METHOD OF FORMING A LIGHT EMITTING DIODE EMITTER SUBSTRATE WITH HIGHLY REFLECTIVE METAL BONDING - The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding. | 2012-08-16 |
20120205695 | LIGHT-EMITTING DIODE DEVICE - A light-emitting diode device is provided, including a submount, a light-emitting diode (LED) chip mounted on the submount, a first transparent insulating layer formed on the submount and the LED chip, a transparent conductive layer formed on the first transparent insulating layer, a phosphor layer formed on the first transparent conductive layer covering the LED chip, and a transparent passivation layer formed on the phosphor layer and over the transparent conductive layer. | 2012-08-16 |
20120205696 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF - There are provided a light emitting device package and a method of manufacturing thereof. The light emitting device package including a first lead frame including amounting area and a heat radiating area surrounding the mounting area, the mounting area being protruded upwardly so as to be located higher than the heat radiating area; a second lead frame disposed to be spaced apart from the first lead frame; at least one light emitting device disposed on the mounting area of the first lead frame; a molding part formed so as to fix the first and second lead frame leads thereto; and a lens part disposed over the at least one light emitting device and the molding part, and the method of manufacturing the light emitting device package are provided. | 2012-08-16 |
20120205697 | FLIP CHIP LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - A flip chip light emitting device (LED) package and a manufacturing method thereof are provided. The flip chip LED package includes a package substrate including a cavity that exposes a circuit pattern, and a chip mounting portion disposed on a bottom surface of the cavity; a solder layer disposed on the circuit pattern; a bonding tape layer disposed on the chip mounting portion; and an LED including a bonding object region and a plurality of electrode pads disposed on one surface, being mounted on the package substrate such that the plurality of electrode pads are bonded to the solder layer and the bonding object region is bonded to the bonding tape layer | 2012-08-16 |
20120205698 | LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING THE SAME - It is known that a light-emitting element utilizing organic EL deteriorates due to moisture. Therefore, a sealing technique to prevent moisture permeation is important. A light-emitting device including a light-emitting element utilizing organic EL is manufactured over a support substrate having flexibility and a high heat dissipation property (e.g., stainless steel or duralumin), and the light-emitting device is sealed with a stack body having moisture impermeability and a high light-transmitting property or with glass having moisture impermeability and a high light-transmitting property and having a thickness greater than or equal to 20 μm and less than or equal to 100 μm. | 2012-08-16 |
20120205699 | LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member. | 2012-08-16 |
20120205700 | Light-Emitting Device and Manufacturing Method Thereof, Lighting Device, and Display Device - The present invention focuses on a structure in which an auxiliary wiring for increasing the conductivity of an upper electrode is provided on the substrate side. The conductive auxiliary wiring of a light-emitting device is provided over a substrate, and an upper portion of the auxiliary wiring protrudes in a direction parallel to the substrate. Further, an EL layer formed in a region including a lower electrode layer and the auxiliary wiring is physically divided by the auxiliary wiring. An upper electrode layer formed in a manner similar to that of the lower electrode layer may be electrically connected to at least part of a side surface of the auxiliary wiring. Such an auxiliary wiring may be used in a lighting device and a display device. | 2012-08-16 |
20120205701 | Light-Emitting Element, Display Device, Lighting Device, and Method for Manufacturing the Same - A light-emitting element disclosed includes a first electrode layer; a second electrode layer which transmits light; and a light-emitting layer interposed between the first electrode layer and the second electrode layer. The first electrode layer includes a first conductive layer which is able to reflect light, a second conductive layer provided over the first conductive layer and including titanium, and a third conductive layer which transmits light and contains a metal oxide having work function higher than that of a material of the first conductive layer. | 2012-08-16 |
20120205702 | Light-Emitting Device - An organic EL light-emitting device with excellent total luminous flux or with reduced emission unevenness and low power consumption is provided. Light from an organic EL layer in a region sandwiched between a light-transmitting conductive film of a lower electrode and a light-reflecting conductive film of an upper electrode is selectively emitted to the lower electrode side, and extracted outside by a first optical structure body. Light from the organic EL layer in a region sandwiched between a light-reflecting conductive film of the lower electrode and a light-transmitting conductive film of the upper electrode is selectively emitted to the upper electrode side, and extracted outside by a second optical structure body. The first optical structure body and the second optical structure body are formed on different planes and can overlap with each other; thus, light from the organic EL layer can be efficiently extracted outside. | 2012-08-16 |
20120205703 | Light-Emitting Diode Package Device and Method for Making the Same - A light-emitting diode package device includes: a base unit defining a packaging space; a light-emitting diode die that is disposed inside the packaging space to electrically connect to the base unit and that is capable of emitting light; and an encapsulant that is filled in the packaging space to encapsulate the light-emitting diode die and that includes an upper surface to be exposed to external environment, and a plurality of microstructures formed on the upper surface. | 2012-08-16 |