29th week of 2010 patent applcation highlights part 14 |
Patent application number | Title | Published |
20100181658 | Semiconductor device which exposes die pad without covered by interposer and its manufacturing method - A semiconductor device, includes a lead frame including a die pad of which back side surface is exposed to the back side of a package, as well as a plurality of land terminals, a resin filled between the die pad and each of the land terminals so as to enable the die pad and each of the land terminals to be fastened mutually, and a semiconductor chip having a plurality of pads and being mounted on a top side of the die pad. The semiconductor device further includes an interposer having a bonding stitch on its top side, being disposed on the top side surface of the lead frame, and relaying an electrical connection of at least any one of the plurality of pads to at least any one of the land terminals, and a first bonding wire bonded to the bonding stitch of the interposer and one of the plurality of pads of the semiconductor chip. | 2010-07-22 |
20100181659 | Lead frames with improved adhesion to plastic encapsulant - A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups. | 2010-07-22 |
20100181660 | Multi-Chip Semiconductor Package - Semiconductor packages that contain multiple stacked chips and methods for making such semiconductor packages are described. The semiconductor packages contain a full land pad array and multiple chips that are stacked vertically. Some of the chips are separated by routing leads which are connected to the land pad array. The chips can be directly connected to an inner part of the land pad array and a second and third chip are respectively connected to the middle and outer part of the land pad array through the routing leads that are connected to solder balls. The semiconductor packages therefore have a high input/output capability with a small package footprint, and a flexible routing capability. Other embodiments are also described. | 2010-07-22 |
20100181661 | SEMICONDUCTOR DEVICE - A semiconductor device includes a chip unit mounted on a wiring board. The chip unit includes of semiconductor chips having electrode pads and an interposer having test pads exposed and electrode pads wired from the test pads. The semiconductor chips and the interposer are stacked in a step-like shape so as to be positioned the interposer in an uppermost level. The electrode pads of the semiconductor chips and the interposer are electrically connected by first connecting members, and the electrode pads of the semiconductor chips or the interposer and the wiring board are electrically connected by second connecting members. | 2010-07-22 |
20100181662 | STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE - Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package. | 2010-07-22 |
20100181663 | LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMULATION FOR THERMAL INTERFACE MATERIAL AND PACKAGE - An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less. | 2010-07-22 |
20100181664 | INTEGRATED CIRCUIT CHIP PACKAGE MODULE - An integrated circuit (IC) package module includes a carrier, an IC chip, a number of wires, a number of pins, a seal member, and a thermal conductor. The IC chip is attached on a top surface of the carrier. The number of pins is connected to the IC chip via the number of wires. The seal member contains the carrier, the IC chip, and the number of wires. The thermal conductor is located over or located on a top surface of the IC chip. Parts of each of the number of pins and the thermal conductor are projected out of the seal member. | 2010-07-22 |
20100181665 | System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package - A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package. | 2010-07-22 |
20100181666 | Semiconductor device having lead free solders between semiconductor chip and frame and gabrication method thereof - A semiconductor device includes a semiconductor chip having a current path between a first principal surface and a second principal surface opposite from the first principal surface, a first conductive frame having an opposite region to the first principal surface, and a second conductive frame electrically connected via electrical connection member to a pad formed on the second principal surface. In a gap between the first principal surface and the first conductive frame, there are arranged multiple column-shaped lead-free solders which are arranged within a circle drawn around a center of the opposite region and having a diameter corresponding to a narrow side of the opposite region, and which electrically connects the first conductive frame with the semiconductor chip, and a filler which is filled between the multiple column-shaped lead-free solders. | 2010-07-22 |
20100181667 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided. | 2010-07-22 |
20100181668 | Semiconductor Device and Electronic Apparatus Equipped with the Semiconductor Device - A semiconductor device comprises an IC chip body and a package substrate that has thereon many external electrodes arranged in a two-dimensional grid configuration. Groups of signal lines that are likely to emit noise (noisy signal lines) are separated and spaced apart from groups of signal lines that are susceptible to noise (noise susceptible signal lines). Each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated IC pad group separated and spaced apart from other IC pad groups. Further, each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated external electrode group selected from the multiplicity of external electrodes arranged in a two-dimensional grid configuration on the package substrate. Thus, groups of potentially interfering signal lines are mutually separated and spaced apart from one another, thereby suppressing the noise. | 2010-07-22 |
20100181669 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In order to improve a bonding reliability of a semiconductor device, in the semiconductor device, the wiring patterns on the substrate surface and the connection electrodes are electrically connected by face-down mounting. The connection electrodes are formed on the connecting surface of the semiconductor element and made from a conductive material, and a part of the wiring patterns has such a width that allows the connection electrodes formed on the part of said wiring patterns to have a fillet shape. | 2010-07-22 |
20100181670 | CONTACT STRUCTURE FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE SAME - A semiconductor component comprising a substrate with a first side and a second side a multi-layer contact structure arranged on at least one side of the substrate, the contact structure exhibiting a barrier layer to prevent the diffusion of ions from the side of barrier layer opposite to the substrate into the substrate. | 2010-07-22 |
20100181671 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A semiconductor device can include an insulation layer on that is on a substrate on which a plurality of lower conductive structures are formed, where the insulation layer has an opening. A barrier layer is on a sidewall and a bottom of the opening of the insulation layer, where the barrier layer includes a first barrier layer in which a constituent of a first deoxidizing material is richer than a metal material in the first barrier layer and a second barrier layer in which a metal material in the second barrier layer is richer than a constituent of a second deoxidizing material. An interconnection is in the opening of which the sidewall and the bottom are covered with the barrier layer, the interconnection is electrically connected to the lower conductive structure. | 2010-07-22 |
20100181672 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE FOR REDUCING PARASITIC CAPACITANCE BETWEEN BIT LINES AND SEMICONDUCTOR DEVICE FABRICATED THEREBY - In a method of fabricating a semiconductor device capable of reducing parasitic capacitance between bit lines and a semiconductor device fabricated by the method, the semiconductor device includes a semiconductor substrate having buried contact landing pads and direct contact landing pads. A lower interlayer insulating layer is disposed on the semiconductor substrate. A plurality of parallel bit line patterns are disposed on the lower interlayer insulating layer to fill the direct contact holes. A passivation layer that conformally covers the lower interlayer insulating layer and the bit line patterns is formed. An upper interlayer insulating layer for covering the semiconductor substrate having the passivation layer is formed. Buried contact plugs are disposed in the upper interlayer insulating layer between the bit line patterns and extended to contact the respective buried contact landing pads through the passivation layer and the lower interlayer insulating layer. Voids are formed in the upper interlayer insulating layer between the bit line patterns and between the buried contact plugs. | 2010-07-22 |
20100181673 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device, includes forming a dielectric film above a substrate; forming an opening in the dielectric film; forming a first film containing a metal whose energy for forming silicide thereof is lower than that of Cu silicide inside the opening; forming a second film that is conductive and contains copper (Cu) in the opening in which the first film containing the metal is formed; and forming a compound film containing Cu and silicon (Si) selectively on the second film in an atmosphere in which a temperature of the substrate is below 300° C. | 2010-07-22 |
20100181674 | ELECTRICAL CONTACTS FOR CMOS DEVICES AND III-V DEVICES FORMED ON A SILICON SUBSTRATE - A semiconductor structure having a substrate, a seed layer over the substrate; a silicon layer disposed on the seed layer; a transistor device in the silicon layer; a III-V device disposed on the seed layer; and a plurality of electrical contacts, each one of the electrical contacts having a layer of TiN or TaN and a layer of copper or aluminum on the layer of TaN or TiN, one of the electrical contacts being electrically connected to the transistor and another one of the electrical contacts being electrically connected to the III-V device. | 2010-07-22 |
20100181675 | SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP - A semiconductor package with wedge bonded chip. One embodiment provides a semiconductor chip, a wire bond and a metal element. The chip includes a bond pad with a copper layer. The wire bond is wedge bonded to the bond pad and ball bonded to the metal element. | 2010-07-22 |
20100181676 | SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL - A method that in one embodiment is useful in bonding a first substrate to a second substrate includes forming a layer including metal over the first substrate. The layer including metal in one embodiment surrounds a semiconductor device, which can be a micro electromechanical system (MEMS) device. On the second substrate is formed a first layer comprising silicon. A second layer comprising germanium and silicon is formed on the first layer. A third layer comprising germanium is formed on the second layer. The third layer is brought into contact with the layer including metal. Heat (and pressure in some embodiments) is applied to the third layer and the layer including metal to form a mechanical bond material between the first substrate and the second substrate in which the mechanical bond material is electrically conductive. In the case of the mechanical bond surrounding a semiconductor device such as a MEMS, the mechanical bond can be particularly advantageous as a hermetic seal for protecting the MEMS. | 2010-07-22 |
20100181677 | STRUCTURE WITH SELF ALIGNED RESIST LAYER ON AN INSULATING SURFACE AND METHOD OF MAKING SAME - A structure is provided with a self-aligned resist layer on an insulator surface and non-lithographic method of fabricating the same. The non-lithographic method includes applying a resist on a structure comprising at least one of interconnects formed in an insulator material. The method further comprises exposing the resist to energy and developing the resist to expose surfaces of the interconnects. The method further comprises depositing metal cap material on the exposed surfaces of the interconnects. | 2010-07-22 |
20100181678 | STRUCTURE WITH SELF ALIGNED RESIST LAYER ON AN INTERCONNECT SURFACE AND METHOD OF MAKING SAME - A structure is provided with a self-aligned resist layer on a surface of metal interconnects for use in forming air gaps in an insulator material and method of fabricating the same. The non-lithographic method includes applying a resist on a structure comprising at least one metal interconnect formed in an insulator material. The method further includes blanket-exposing the resist to energy and developing the resist to expose surfaces of the insulator material while protecting the metal interconnects. The method further includes forming air gaps in the insulator material by an etching process, while the metal interconnects remain protected by the resist. | 2010-07-22 |
20100181679 | 3D INTEGRATION OF VERTICAL COMPONENTS IN RECONSTITUTED SUBSTRATES - A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips. | 2010-07-22 |
20100181680 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE - A semiconductor device includes: a mounted body in which a wiring pattern is formed on a first main surface; a semiconductor chip mounted on the surface of the mounted body on which the wiring pattern is formed; an underfill material which is filled between the mounted body and the semiconductor chip and forms a fillet on an outer peripheral part of the semiconductor chip; and an injection section which is disposed on the mounted body and on an outside of a side section, on which the fillet is formed to be longest, of four side sections defining a chip mount area on which the semiconductor chip is mounted, and guides the underfill material to between the mounted body and the semiconductor chip. | 2010-07-22 |
20100181681 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - With a recent shrinking semiconductor process, insulating layers formed between interconnect layers are becoming thin. To avoid parasitic capacitance between them, materials of a low dielectric constant have been used for an insulating layer in a multilevel interconnect. Low-k materials, however, have low strength compared with the conventional insulating layers. Porous low-k materials are structurally fragile. The invention therefore provides a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer. According to the method, in a two-step cutting system dicing in which after formation of a groove in a semiconductor water with a tapered blade, the groove is divided with a straight blade thinner than the groove width, the multilevel interconnect layer portion is cut while being covered with a tapered face and then the wafer is separated with a thin blade which is not brought into contact with the multilevel interconnect layer portion. The wafer can be diced without damaging a relatively fragile low-k layer. | 2010-07-22 |
20100181682 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device, includes forming an insulating film of a material having a low relative dielectric constant on a substrate, forming an SiOCH film on the insulating film in a chamber, forming an SiO | 2010-07-22 |
20100181683 | VIA DEFINITION FOR SEMICONDUCTOR DIE - A semiconductor die includes a first set of metal lines and a second set of metal lines. The first set of metal lines and the second set of metal lines are placed in alternate planes and are orthogonal to each other. A via is used to connect a first metal line from the first set of metal lines with a second metal line from the second set of metal lines. The via location is offset such that a side of the first metal line is aligned with a side of the second metal line. Consequently, a metal line adjacent to the first metal line does not need to detour around the via. | 2010-07-22 |
20100181684 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE - A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer. | 2010-07-22 |
20100181685 | INTEGRATED CLOCK AND POWER DISTRIBUTION - An integrated clock and power distribution network in a semiconductor device includes assigning a first tile to a location on a placement grid corresponding to a top metal layer. An orientation is assigned to the first tile relative to the top metal layer placement grid. The first tile is placed on a representation corresponding to the top metal layer in accordance with the assignments. A second tile is assigned to a location on a placement grid corresponding to a top-1 metal layer. The orientation is assigned to the second tile relative to the top-1 metal layer placement grid. The second tile is placed on a representation corresponding to the top-1 metal layer in accordance with the assignments. The first and second tile are arranged as a full-dense-mesh distribution structure. The first tile includes an integrated clock and power distribution structure. The second tile includes a low impedance underpass structure. | 2010-07-22 |
20100181686 | Semiconductor Device - A semiconductor device | 2010-07-22 |
20100181687 | SEMICONDUCTOR DEVICE INCLUDING SINGLE CIRCUIT ELEMENT - A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate. | 2010-07-22 |
20100181688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip, and an encapsulation resin which covers and encapsulates the semiconductor chip, the semiconductor chip having a recess formed in the surficial portion thereof; the recess having, on the deeper side than a predetermined portion thereof, a portion having a larger width than the predetermined portion has; and the encapsulation resin being anchored in the recess. | 2010-07-22 |
20100181689 | Actuating device for a choke valve - In order to provide an actuating device for a choke valve of a carburettor for motorized equipment, in particular a cut-off grinder, wherein the choke valve is movable between at least a closed position and an open position by an operating element via a mechanical coupling from the operating element to the choke valve, which overcomes the disadvantages of the prior art, it is proposed that the mechanical coupling has a separating arrangement which is in operative connection with the motorized equipment such that the mechanical coupling between the operating element and the choke valve can be interrupted or respectively closed as a function of different operating states of the motorized equipment. | 2010-07-22 |
20100181690 | HUMIDITY CONTROLLER - According to a humidity controller ( | 2010-07-22 |
20100181691 | METHOD OF MOLDING, PROCESS FOR PRODUCING LENS, MOLDING APPARATUS, PROCESS FOR PRODUCING STAMPER, MASTER PRODUCTION APPARATUS, STAMPER PRODUCTION SYSTEM, AND STAMPER PRODUCTION APPARATUS - Molded articles, such as a lens, are produced by multiple repetitions of a transfer process composed of the transformation step of bringing a transfer member ( | 2010-07-22 |
20100181692 | METHOD AND APPARATUS FOR MOLDING RESIN FOAM PRODUCT - An example molding method includes: feeding a molten foamable resin by injection in a cavity formed in a molding die; allowing the molten foamable resin to flow in the cavity; and foaming and solidifying the molten foamable resin to mold a resin foam product. The example molding method performs flow rate control by controlling a flow rate of the molten foamable resin at a welding portion to be equal to or higher than a flow rate of the molten foamable resin at an upstream portion adjacent to the welding portion. | 2010-07-22 |
20100181693 | METHODS OF MANUFACTURING MULTI-COLORED LANDSCAPING RINGS - Methods of manufacturing multi-colored mulch pads include providing a mold; mixing together a rubber component, a binder and a first coloring agent to form a matrix having a first colored surface; and introducing a second coloring agent onto the matrix to create a multicolored skirt having a second colored surface opposite the first colored surface. | 2010-07-22 |
20100181694 | Device and Method for Manufacturing End Mill - A device and a method for manufacturing an end mill in which the amount of grinding of a blank end mill is small. The device for manufacturing an end mill includes: upper and lower punches; a die; a feed box for supplying a powder of material for the end mill; and a cleaner for eliminating the powder from a top surface of the die. The upper and lower punches are movable up and down relative to each other and have a lengthwise molding cavity formed thereon. The die has a penetrating slit sized to be approximated to the width of the upper and lower punches. The penetrating slit allows the up-and-down movements of the upper and lower punches. The feed box supplies the powder into a space formed by the wall of the penetrating slit and the lower punch. | 2010-07-22 |
20100181695 | MALE SURFACE FASTENER MEMBER FOR USE IN A CUSHION BODY MOLD AND MANUFACTURING METHOD THEREOF - Various embodiments include a male surface fastener member configured for being molded onto a surface of a foaming resin mold body. The male surface fastener member includes a plurality of male surface fastener strips connected with each other in an end-to-end relationship via a connecting portion that is integrally formed with at least the end portions of each male surface fastener strips. Each male surface fastener strip includes a base material having a first surface from which a plurality of engaging elements extend upwardly and first and second substantially lateral resin intrusion prevention walls that upwardly from the first surface along a width direction of the base material between the first and second longitudinal resin intrusion prevention walls. Each of the lateral resin intrusion prevention walls comprises a plurality of engaging elements that are arranged in series in a width direction of the first surface. | 2010-07-22 |
20100181696 | HALOGEN-FREE FLAME RETARDANTS - The invention relates to a halogen-free flame retardant obtainable by polycondensation of phosphoric monomers with esterifying monomers. The phosphoric monomer is an adduct of 9,10-dihydro-9-oxa-10-phospha-phenanthrene-10-oxide (DOPO) and ring-substituted DOPO derivatives to unsaturated carboxylic acids. Monovalent and polyvalent alcohols are used as esterifying monomers. The flame retardant has an average molecular weight of more than 20,000 and an average degree of polymerization P | 2010-07-22 |
20100181697 | PROCESS FOR PRODUCING A PROTON-CONDUCTING, POLYAZOLE-CONTAINING MEMBRANE - A method for producing a proton-conducting, polyazole-containing membrane, in which
| 2010-07-22 |
20100181698 | METHODS OF FORMING A PART USING SHAPE MEMORY POLYMERS - One method of forming a part includes deforming a shape memory polymer from a permanent shape into a temporary shape, where the permanent shape of the shape memory polymer is a predetermined part shape and the temporary shape is a shape larger than the predetermined part shape. The shape memory polymer in each of the permanent shape and the temporary shape defines a cavity therein. The method further includes introducing a molding material into the cavity of the shape memory polymer, and reverting the shape memory polymer back into its permanent shape. Other methods for forming the part are also disclosed herein. | 2010-07-22 |
20100181699 | CONCRETE SLEEPER AND METHOD FOR PRODUCING THE SAME - Method of manufacturing a concrete sleeper, comprising the following steps: insertion of pre-stressing rods into a sleeper mould, simultaneous automated tensioning of the individual pre-stressing rods, filling of the sleeper mould with concrete, leaving of the concrete to harden, removal of the concrete sleeper from the mould, wherein for one concrete sleeper more than four, in particular five to eight, pre-stressing rods are used and the pre-stressing rods are tensioned individually yet simultaneously. | 2010-07-22 |
20100181700 | METHOD AND APPARATUS FOR TENSIONING COMPOSITE MATERIAL - An apparatus and method for tensioning material ( | 2010-07-22 |
20100181701 | COLD CASTING METHOD AND APPARATUS - Method of cold casting a composite product, a pressure curing apparatus for use in curing a composite mixture under pressure, and use of the pressure curing apparatus in the present method. The method of cold casting a composite product includes the step of curing a composite resin mixture under pressure to eliminate the appearance of bubbles in the composite product. The pressure curing apparatus comprises, amongst other things, a pressure chamber that is sized and shaped to conform with the size and shape of a mold inserted therein to minimize wasted space and reduce the amount of energy required to pressurize the chamber. | 2010-07-22 |
20100181702 | OPTICAL FILM, POLARIZING PLATE AND DISPLAY DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF - The present invention is to provide an optical film which exhibits low hygroscopicity, high transparency, high heat resistance and markedly lowered brittleness, and particularly to provide an optical film which is appropriately employed as a polarizing plate protective film for large liquid crystal display devices and outdoor liquid crystal display devices. The above optical film is characterized in that acrylic resin (A) and cellulose ester resin (B) are incorporated at a weight ratio of 95:5-30:70, weight average molecular weight Mw of aforesaid acrylic resin (A) is at least 80,000, total substitution degree (T) of the acyl group of aforesaid cellulose ester resin (B) is 2.0-3.0, the substitution degree of the acyl group having 3-7 carbon atoms is 1.2-3.0, and weight average molecular weight Mw of aforesaid cellulose ester resin (B) is at least 75,000. It is characterized that the total substitution degree of the acyl group other than carbon atoms of 3-7 of the cellulose ester resin (B) is at most 1.3. | 2010-07-22 |
20100181703 | BYPASS COOLING REDUCTION ON HIGH PRESSURE DIE CAST MACHINES - Within an improved method of maintaining a die during interruptions in production and of subsequently returning the die to an optimal operating temperature, instead of having a manual control valve in the bypass loop of cooling medium, a PLC controlled valve is provided which can automatically allow or stop the flowrate through the bypass loop. Instead of circulating cooling medium through the die continuously, and at a reduced rate, during the interruption, the cooling medium is not circulated at all initially during the interruption. When the restart of production is desired, the first two preheat shots produced are made without the circulation of any cooling medium through the die. The valve within the bypass loop is then opened to let some cooling medium circulate through the die, however the circulation rate is less than the rate associated with normal production. The bypass loop is then left open while the valve in the primary loop is reopened. | 2010-07-22 |
20100181704 | Method and Apparatus for Manufacturing Blow Molded Containers - A method for forming a container includes receiving a parison, enclosing the parison with a mold that includes a cavity, and inflating the parison in said mold to form a blow molded container with a moveable region at the cavity. The method further includes repositioning the moveable region before filling the blow molded container. | 2010-07-22 |
20100181705 | STAR DISTRIBUTOR - The present invention relates to a device for distributing tablet blanks to the dies of a tablet press. The present invention moreover relates to a system consisting of the device according to the invention and a tablet press and to a method for forming tablets from tablet blanks. | 2010-07-22 |
20100181706 | Radiation Arrangement - The invention relates in general level to radiation transference techniques as applied for utilisation of material handling. The invention relates to a radiation source arrangement comprising a path of radiation transference, or an improved path of radiation transference, which path comprises a turbine scanner or an improved turbine scanner. The invention also concerns a target material suitable for vaporization and/or ablation. The invention concerns an improved turbine scanner. The invention concerns also to a vacuum vaporization/ablation arrangement that has a radiation source arrangement according to invention. The invention concerns also a target material unit, to be used in coating and/or manufacturing target material. | 2010-07-22 |
20100181707 | Sol-Gel Composition for Fabricating Conductive Fibers - Disclosed herein are sol-gel compositions for fabricating conductive fibers in an electrospinning process and methods for producing the same. | 2010-07-22 |
20100181708 | DEVICE FOR SPRINGING A MASS, AND METHOD FOR ADJUSTING AND/OR OPERATING A FLUID SPRING - A device for springing a mass including a fluid spring and a frame, in which the fluid spring is arranged between the mass and the frame in such a way that the mass is mounted on the frame in a sprung and/or damped manner. An add-on-fluid volume device for providing an additional fluid volume for the fluid spring includes at least two fluid volume chambers that can be fluidically connected to one another and which have a common, displaceable chamber wall. | 2010-07-22 |
20100181709 | ADJUSTABLE BLOW-OFF SUSPENSION - Altering the damping rate of a vehicle suspension damper. A pressure of a damping fluid is exerted against a second valve mechanism connected to the vehicle suspension damper. The pressure of the damping fluid is increased beyond a threshold of the second valve mechanism that is adjustable by an adjustment member. The adjustment member is exposed through a high pressure side of the vehicle suspension damper. The second valve mechanism is then opened. | 2010-07-22 |
20100181710 | Pull Action Clamp with Toggle Lock - A clamp used for clamping a work piece to a fixture. The clamp includes a base for mounting to the fixture and a handle having a body portion and an arm portion. The handle includes a pivotal connection to the base. The clamp further includes a holding member and a latch. The holding member has a holding position for clamping the work piece to the fixture and a pivotal connection to the handle. The latch includes a first end portion and a second end portion. The first end portion is engaged with the base for locking the holding member in the holding position and becomes disengaged from the base by moving the second end portion in a direction generally away from the arm portion of the handle. The latch has a pivotal connection to the handle. | 2010-07-22 |
20100181711 | Cutting support - A cutting support including a first section and a second section. The first section has a top side with at least two recesses extending into the first section from the top side. A first one of the recesses has a first shape. A second one of the recesses has a different second shape. The first shape comprises a generally semi-circular section. The second shape comprises at least one generally right-angle corner. The second section is connected to the first section for connecting the cutting support to another member. | 2010-07-22 |
20100181712 | METHOD FOR THE SUPPORT OF A ROTATING WORKPIECE DURING GRINDING AND A HYDRODYNAMIC STEADY REST - In a method for the hydrodynamic support and centering of a rotating workpiece during grinding and a steady rest usable for this purpose the bearing to be supported is impinged upon by a contact pressure which changes in accordance with rotational speed from a minimum pressure when the shaft is started from a standstill, to a maximum value during the processing rotational speed. The steady rest has an opening of a transversebore in a central bore receiving a supply line by which a lubricant can be supplied as hydraulic fluid to the bearing. The method is particularly suitable for the processing of camshafts and crankshafts. | 2010-07-22 |
20100181713 | PROFILE RAIL FOR POSITIONING A FIXING ELEMENT AND METHOD FOR PRODUCING A MULTIPLE GLAZING UNIT - The invention relates to a method for producing a multiple glazing unit ( | 2010-07-22 |
20100181714 | Vice Jaw System for Clamping Machinable Work-pieces - A gripping element comprises a generally cylindrical grip body having a top and a center hole disposed on the grip body and arranged to pass generally through a centerline of the body and being disposed generally perpendicular to and extending downwards from the top. The grip body further includes two gripping edges, each located opposite the other arranged on the top. Each gripping edge, in turn, adapts to penetrate a linear portion of the work-piece without requiring a preparation operation on the work-piece. Each gripping edge comprises a pair of teeth. Each tooth being defined by the second a top edge and an oppositely disposed fin tapering from the top edge toward the grip body, the fin intersecting with an outward taper feature and the taper feature terminating on a shoulder disposed on the grip body. | 2010-07-22 |
20100181715 | DOCUMENT IMAGING SYSTEM AND METHOD - A document imaging system includes a document transport system that transports an original document through an imaging zone in optical communication with an image recording device. A document guide directs the original document toward the imaging zone and a document biasing device urges the trailing edge of the original document toward the document transport system. A printing system utilizing a document imaging system and a method of imaging an original document are also included. | 2010-07-22 |
20100181716 | SHEET SUPPLY APPARATUS - A sheet supply apparatus includes: an endless belt which has a plurality of vents penetrating from a front surface to a rear surface and is stretched around a plurality of rollers including a drive roller and driven by the drive roller; a suction section having a suction port which suctions air and faces to a rear surface of the belt, wherein the sheet supply apparatus suctions a sheet to the front surface of the belt through vents of the belt facing to the suction port and carries the sheet, and the sheet supply apparatus further includes a guide member which guides a leading edge of the sheet being conveyed to a down stream side of the suction port in a conveyance direction, in a direction separating from the front surface of the belt. | 2010-07-22 |
20100181717 | SHEET-CONVEYING DEVICE AND IMAGE-FORMING APPARATUS INCLUDING THE SAME - A sheet-conveying device designed to feed a sheet fed thereto through a fixing device toward a discharge unit includes first and second conveyance guides facing each other so as to define a sheet conveyance path and each having a conveying member designed to feed the sheet. The first conveyance guide includes a blower opening facing the sheet conveyance path for blowing air onto the sheet conveyance path, an exhaust opening provided on a downstream side in a sheet feeding direction with respect to the blower opening for removing air that has been blown onto the sheet conveyance path and discharging it outside the device. | 2010-07-22 |
20100181718 | Cups and Games of Skill Involving Such Cups - Cups and games of skill involving such cups are provided. A representative cup includes: an aperture communicating with a cavity; and a barrier extending partially about the periphery of the aperture such that a portion of the cup lacking the barrier forms a lateral entrance to the cavity, the barrier having an upwardly and outwardly sloping first portion and a downwardly and outwardly sloping second portion, the first portion being located between the second portion and the aperture. | 2010-07-22 |
20100181719 | BOUNCING BALL AMUSEMENT DEVICE - A bouncing ball type of amusement device has a buoyant die floating in a water-filled, transparent rubber ball. The die has a plurality of faces with written material thereon. When bounced after asking a yes or no type of question, the die will float to the top of the ball and one of its faces will contact the inside surface of the ball and be viewable by a user. | 2010-07-22 |
20100181720 | Action Figure Battle Game with Movement Mechanisms - Various embodiments of an action figure battle game including figures with movement mechanisms are disclosed. A method for playing an action figure battle game, the game involving a first action figure and a second action figure, each of the first action figure and the second action figure having its own movement function and its own attack function is also disclosed. | 2010-07-22 |
20100181721 | RELATIONSHIP BOARD GAME FOR USE BY COUPLES - A board game comprises at least a first and a second playing piece. The board game further comprises a game board. The game board comprises at least one track along which the first and second playing pieces are movable. The track comprises a plurality of track areas. The board game further comprises a plurality of card members. The card members comprise at least one of game information relating to a past relationship offense, game information relating to family law, game information related to a relationship asset, and an indicia of a relationship asset. The board game further comprises at least a first movement control piece configured to display an indicia in response to a manipulation of the first movement control piece. | 2010-07-22 |
20100181722 | Methods and Devices for On-The-Roll Sports Games - A realistic professional team sports board game, including an On-The-Roll mechanism where, once play begins, real time play continues, generally against a clock, opposing teams continue to roll dice continuing sub-play actions or elements, until a play is completed, as by a touchdown, tackle and a series of rules and charts, based on statistical compilation that maps various combinations of offensive and defensive strategies and dice rolls into realistic game situations and the progression among them. Both teams: secretly choose a strategy, generally by selecting a card placed face down; roll dice; reveal strategy choices by turning cards face up; determine a situation chart to consult, and further determine which result is selected from within the chart, based on some combination of which cards were played and the results of the dice rolls. A variety of play cards affect the overall game momentum of either team. | 2010-07-22 |
20100181723 | Board Game: Six in a Dream - Disclosed is an amusement device having a board or other field and game-pieces movable over said board or field by contestants according to pre-set rules. | 2010-07-22 |
20100181724 | METHODS, SYSTEMS, AND APPARATUS UTILIZING ELECTROLUMINESCENT LIGHTING - A collectible card for use in a collectible card game includes indicia associated with the collectible card game; an EL panel including an EL area associated with a game play attribute; an IC; an input member; a power source; and a random sequence controller. A base adapted to receive a collectible card includes a hard connection point adapted to mate with a hard connection point of a collectible card; an IC; an input member; and a random sequence controller. A card holder includes an IC; and an input member, and is configured to retain a card therein such that a side of the card is visible from an exterior of the card holder. A playing surface includes a hard connection point adapted to mate with a hard connection point of a collectible card; an IC; an input member; a power source; and a random sequence controller. | 2010-07-22 |
20100181725 | BALL-STRIKING GAME - Disclosed is a system for simulating a ball-striking game for a batter in a game area. The system includes a fluorescent bat, a fluorescent ball, a tracking device, and a data computing device. The fluorescent bat is adapted to be held by the batter. The fluorescent ball is adapted to be delivered to the batter for hitting the fluorescent ball with the fluorescent bat. The tracking device is capable of detecting a first set and a second set of parameters associated with the fluorescent ball. Further, the tracking device is capable of wirelessly transmitting the first set and the second set of parameters to the data computing device. The data computing device is capable of generating a score for the batter based on the first set and the second set of parameters. | 2010-07-22 |
20100181726 | PORTABLE HORSESHOE/RING TOSS GAME - A portable horseshoe game suitable for use in connection with an existing bags game. The game includes a rod which may be secured within the opening of the bags game. More specifically, the rod may be secured in a generally perpendicular position with respect to the target surface of the bags game. In an alternative embodiment, the rod may be secured in a generally perpendicular position with respect to the ground. The game has a first plate and a second plate secured to the rod wherein the first plate covers the top side of the opening of the target surface of the bags game and the second plate covers the bottom side of the opening of the target surface of the bags game. Once the rod is secured within the opening, users may play horseshoes on the existing bags target surface. The game may be played indoors or outdoors. | 2010-07-22 |
20100181727 | THREADED JOINT WITH ENERGIZABLE SEAL - A threaded joint has a sealing ring radially positioned between a pin and a box and axially positioned on a portion of the pin on an opposite side of the threads of the pin from the nose of the pin. The sealing ring has two protruding annular lips positioned at a skewed angle to the longitudinal axis, two or more radial annular ribs on an external surface, an internal surface, and an at least partly embedded reinforcement ring. When the joint is made up, the sealing ring is in sealing contact with an annular groove of the box by the annular ribs and in sealing contact with the pin by the internal surface. The internal surface of the sealing ring can have a uniform diameter or have radially protruding annular ribs. | 2010-07-22 |
20100181728 | PUSH PLUG SYSTEM AND METHOD - A push plug designed to interact with and seal an open end of a length of conduit containing a cable. The plug is comprised of a cap, a neck, and a body. The body contains a number of saw-toothed annular ridges. The plug is manufactured from an elastomeric material which allows the plug to be inserted into a conduit opening of a diameter smaller than the diameter of the saw toothed ridges which creates a frictional seal which resists removal of the plug. The plug body further contains passages running longitudinally through the center of the plug. These passages allow cable run through the conduit to be drawn through the plug and inserted through a thin, flexible membrane covering the plug cap. | 2010-07-22 |
20100181729 | Downhole Seal Element Formed From a Nanocomposite Material - A seal element ( | 2010-07-22 |
20100181730 | BEARING SEAL - A non-contacting sealing device for a bearing includes a labyrinth seal with a static shut-off device. The non-contacting sealing, or isolator, device includes stator, a rotor and the static shut-office device, which includes at least one deformable toroidal member adjacent to the stator surface and adjacent to the rotor surface. The deformable toroidal member engages both the stator surface and the rotor surface when the rotor is static and disengages at least one of the stator surface and the rotor surface when the rotor is operational. The seal may be an integral part of the bearing, or a substantially attachable member to a bearing. | 2010-07-22 |
20100181731 | WIRE FOR I-SHAPE OIL RINGS AND PRODUCING METHOD OF THE SAME - Provided is a wire rod for an I-type oil ring, which includes right and left rail portions and a web portion connecting the rail portions, which has an oil hole or a molten through hole formed in the web portion, and which has a circumscribing circle diameter of 10 mm or less in its transverse contour. The molten through hole has such a remolten portion formed on its exit side as encloses the exit of the molten through hole. The remolten portion exceeds such a molten portion in the transverse section along the center of the molten through hole as is formed in the molten through hole, and is formed to have 200 μm or less from the outer circumference of the molten through hole and 100 μm or less in the depth direction of the molten through hole. | 2010-07-22 |
20100181732 | SEAL - A seal includes a supporting body; a disk-shaped sealing element fixed to the supporting body so as to form a static seal and to include a free end; and a sealing body disposed at the free end so as to form a dynamic sealing edge, wherein the sealing body includes a material that is a different from a material of the sealing element. | 2010-07-22 |
20100181733 | ROLLBACK SEAL - A rollback seal, which is used in a space between a piston and a housing of a hydraulic brake configured to brake a wheel by clamping a disc rotor fixedly attached to the wheel, is arranged in an annular groove of the housing, has a substantially rectangular sectional shape, has an annular recess formed in one end face thereof at the side where hydraulic pressure acts on the piston, and has a chamfered section formed at a piston side corner of the other end face thereof at the opposite side to that where the recess is formed, thereby to reduce total weight of brake system, secure sufficient amount of rollback at low temperature, and reliably return a piston from brake position to release position with improved sealing characteristics over a longer service life. | 2010-07-22 |
20100181734 | Metal seals for weld-deformed high temperature pneumatic ducting joints - A single-ply sheet metal seal ring with a convoluted, V/E-shaped cross-section having planar-circumferential flexibility is shown to be more capable of conforming to the sealing face contours of warped, weld-deformed flanges than thin layer, multiple-ply seals developed to replace earlier E-shaped seals for this purpose. The basis of the improved flexibility of the new seal lies mainly in the discovery of geometric relationships that permit a reduction in the thickness of the sheet material employed in the construction of the seal while maintaining its pressure containing capabilities. | 2010-07-22 |
20100181735 | FORCE INCREASING SELF-LOCKING DRILL CHUCK AND SELF-LOCKING MECHANISM THEREOF - The present invention discloses a self-locking mechanism for use in a drill chuck, comprising: clutch tooth sleeves, fixedly connected with the chuck body of the drill chuck and forming teeth; an oval deformation ring, having a substantially circular first shape and a substantially oval second shape, wherein the oval deformation ring has teeth on the side wall, with the teeth engaging with the teeth of the clutch tooth sleeve when the oval deformation ring is in the second shape; and a control sleeve, for controlling the conversion of the oval deformation sleeve between the first shape and the second shape. The present invention also discloses a force increasing self-locking drill chuck with said self-locking mechanism. The self-locking mechanism according to the present invention can be used in drill chucks of multiple structures, and provides a brand-new thought for the designs of the self-locking mechanisms of drill chucks. | 2010-07-22 |
20100181736 | Collapsible dolly - A collapsible dolly is movable between an extended use position and a compact storage position. The dolly has a right leg and a left leg that form a supportive A-frame when fully extended. Hinges and sliding components are capable of collapsing the dolly into a collapsed position for storage and/or transportation. | 2010-07-22 |
20100181737 | Transportation cart for power tools - A transportation cart for power tools includes at least two wheels arranged coaxially to each other, a load-bearing structure, a guide structure that has at least one handle and that is joined to the load-bearing structure, as well as several cylindrical receptacles as a holding device for tools. A holding element including a spring element is arranged in each cylindrical receptacle. | 2010-07-22 |
20100181738 | Collapsible dolly for use with a truss - A foldable dolly for use with a truss. The dolly is also extendable. | 2010-07-22 |
20100181739 | SPINDLE FOR CONTROLLING WHEEL END ENDPLAY AND PRELOAD - A spindle includes an inner bearing shoulder to seat an inner bearing and an outer bearing shoulder to seat an outer bearing. The inner and outer bearing shoulders are spaced apart by a controlled distance such that the outboard bearing is accurately positioned relative to the inboard bearing to control endplay and preload without requiring bearing adjustment. | 2010-07-22 |
20100181740 | WHEEL SUSPENSION SYSTEM FOR A STEERABLE WHEEL - [Task] Provided is a double-joint type wheel suspension system for a steerable wheel that can reduce the required steering torque. | 2010-07-22 |
20100181741 | Truck Bed Step and Method - The present disclosure is a truck bed step that has a mounting device secured to an inside wall of a tailgate. The truck bed step further has at least one collapsible step hingedly coupled to the mounting device that hingedly collapses and attaches to the mounting device while not in use. | 2010-07-22 |
20100181742 | CHAIN ADJUSTMENT APPARATUS FOR MOTORCYCLE - A chain adjustment apparatus for a motorcycle includes a substantially C-shaped adjustment recess formed in an end piece member attached to a rear end portion of a rear fork. An adjustment member is slidably fitted in the adjustment recess. The adjustment member includes a projecting member having a substantially V-shaped projecting slope, and a recessed member having a substantially V-shaped recessed slope. The projecting member fits in the recessed member. When a wheel axle is passed through the adjustment member and the end piece member, the projecting member is brought into wedged engagement with the recessed member by axial force on the wheel axle, and upper and lower split bodies of the recessed member are moved, and pressed onto upper and lower face walls of the end piece member for increasing a coupling rigidity of the adjustment member with the end piece member. | 2010-07-22 |
20100181743 | Trailer steering mechanism - The trailer steering mechanism automatically steers the trailer wheels in accordance with the tow vehicle steering and articulation between the tow vehicle and trailer during backing maneuvers to facilitate backing maneuvers and to prevent or greatly reduce the possibility of jackknifing between tow vehicle and trailer. The mechanism includes a pivotally attached steering frame connected between the steerable wheels of the trailer and one or more hydraulic cylinders that, when locked, create a very strong link between the tow vehicle and the trailer and its steering system. An alternative embodiment employs two non-powered hydraulic cylinders in tandem. The cylinders are able to withstand great loads, and more importantly, are able to disengage while under great load without jamming. The cylinders provide links that exert lateral force to the trailer to push or pull the trailer into a turn while backing, in addition to controlling the steering mechanism of the trailer. | 2010-07-22 |
20100181744 | COATED AIRBAG - A coated airbag is provided. In another aspect, a method of extrusion coating an air impermeable material onto a one-piece woven airbag fabric is employed. Another aspect preheats a fabric such that the fabric remains hot during a coating application thereon. Furthermore, a machine for making and coating an airbag fabric is also provided. | 2010-07-22 |
20100181745 | KNEE-RESTRAINING AIRBAG DEVICE - [PROBLEMS] To improve expansion performance of an airbag. | 2010-07-22 |
20100181746 | AIRBAG MODULE HOUSING - A passenger airbag module that includes an airbag and a tubular inflator. The tubular inflator produces a quantity of inflation gas sufficient to inflate the airbag. The module also includes a housing that receives the inflator; and a retainer positioned within the airbag. The retainer clamps the airbag and the inflator to the housing, thereby creating a retainer/housing assembly having an annular gap proximate the inflator, the gap allowing the gas to exit the inflator and enter the airbag. In some situations, the gap will gap circumscribe the inflator. | 2010-07-22 |
20100181747 | AIRBAG INFLATOR MANIFOLD - An example airbag inflator manifold assembly includes a cap portion establishing a plurality of apertures that are operative to communicate flow from an inflator to an airbag interior. A baffle portion redirects at least some of the flow from the plurality of apertures. A mounting face extends radially from the cap portion and is securable to a flange extending radially from the inflator to hold the cap portion and the baffle portion relative to the inflator. | 2010-07-22 |
20100181748 | Squib, Gas Generation for Inflating Air Bag and Gas Generator for Seat Belt Pretensioner - A squib comprising a cup body, a cup body cover, and a header for holding a plurality of electrode pins insulated from one another and closing the opening portion of the cup body, wherein the internal of the cup body has an ignition powder, and a heating element connected to the electrode pins for igniting the ignition powder by externally applying electric current arranged in contact with the ignition powder, wherein a metal cylindrical or ring restraining member is provided in the outer periphery of the cup body and covered around with the cup body cover. | 2010-07-22 |
20100181749 | Side airbag and side airbag device - A side airbag is formed by a first panel portion facing an occupant and a second panel portion facing a side opposite the occupant and connected to the first panel portion. The side airbag is inflated and deployed on a side of the occupant, and includes an upper chamber for receiving at least a breast of the occupant, a lower chamber for receiving a hip of the occupant, and a first tether having a first edge portion connected to the first panel portion and a second edge portion connected to the second panel portion. The first tether separates the upper chamber and the lower chamber such that connected positions of the first edge portion and the second edge portion are offset from each other. A cylindrical inflating portion defined by the first tether is provided on a rear side in the lower chamber in a vehicle front-rear direction. | 2010-07-22 |
20100181750 | SHOULDER ANCHOR DEVICE - A shoulder anchor device is provided with a shoulder anchor ( | 2010-07-22 |
20100181751 | Book with Multiple Containers - An interactive book has a front cover, a back cover, bound text pages and multiple accompanying containers that are attached. Each container is adapted to hold an object or a set of objects such as toys that may relate to a certain stage of the story of the book. | 2010-07-22 |
20100181752 | SKETCHBOOK SPINE CONSTRUCTION - A removable spine for a book having pages bound together by a binder coil includes a base supporting a pair of spaced arms, the base and arms being of a length generally corresponding to a height of the binder book. The base has a width substantially equal to a width of the binder coil, while each of the arms joined together have a distal portion oriented to engage a portion of an outer surface of the book and a proximal portion in a clearance orientation with respect to the binder coil. The spine may be slid over the coil for mounting on the book, and may be easily removed from the book. The arms may be pivotally affixed to the base to allow the book to be opened with the spine in place. | 2010-07-22 |
20100181753 | Intaglio Printing Inks - The present invention relates to printing inks for the intaglio printing process, also referred to as engraved steel die printing process. In particular, oxidatively curing inks comprising a combination of fusible wax and a UV curing binder component are disclosed. These inks can be printed on a standard printing press, and, through a short UV irradiation after printing, allow to significantly reduce or eliminate the undesired set-off which can occur after printing and stacking the printed sheets. Using the inks of the present invention results in less set-off contaminated printed sheets, allowing for a higher pile-stacking of the printed good, for the use of increased engraving depths, of a more challenging intaglio design, and for the printing on less porous substrates, whilst enabling the printing on a standard printing press, and offering the possibility of using a lower printing plate temperature. | 2010-07-22 |
20100181754 | Increasing Thermal Conductivity of Host Polymer Used With Laser Engraving Methods and Compositions - the invention provides a composition having laser engraving properties, comprising a host material and a laser enhancing additive. The host material comprises a material, such as a polymer, modified by a first process, whereby the host material as modified by the first process has increased thermal conductivity as compared to the host material before the first process. The laser enhancing additive comprises a first quantity of at least one of copper potassium iodide (CuKI | 2010-07-22 |
20100181755 | Lottery transaction mechanisms - Described are a number of mechanisms that can reduce transaction costs and increase the economic viability of a number of products. Included is a combination instant lottery ticket and debit card that makes it possible to issue prepaid debit cards having a relatively low monetary value. Also included is a combination on-line ticket/receipt and debit card that can automate the prize paying process, simplifying the retailer's responsibilities while reducing the potential for fraud. Various cash flow and authentication techniques such as age and location verification, nano payment methods and spam filters based on these mechanisms are also described. In addition, instant lottery tickets, and in particular, losing tickets can be provided with a small residual value by placing account information on the ticket. In another version, a lottery ticket can be combined with a payment card that operates as a closed payment system whereby the payment card can only be used with a specified vendor. | 2010-07-22 |
20100181756 | SECURE PHARMACY DISPENSING UNI-FORM FOR DIGITAL PRINTERS - A method and resulting multi-layered media product including a printed layer and a liner layer having inner surfaces adhered together with a clear poly material sandwiched therebetween. The multi-layered media product includes a first section separable from a remainder of the product and containing printed indicia thereon, a second section separable from a remainder of the product and having a removable printed label thereon, and a third section convertible to an envelope. The third section contains printed indicia on one side thereof and a window of the clear poly material on another side thereof. In operation, the sections of the multi-layered media product are separated and a labeled container can be placed in the envelope and the envelope sealed to prevent tampering. | 2010-07-22 |
20100181757 | WATER-CONDUCTING HOUSEHOLD APPLIANCE - Water-conducting household appliance, in particular dishwasher, comprising a circulation pump ( | 2010-07-22 |