29th week of 2012 patent applcation highlights part 16 |
Patent application number | Title | Published |
20120181678 | LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY - Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board. | 2012-07-19 |
20120181679 | SEMICONDUCTOR MODULE - A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area. | 2012-07-19 |
20120181680 | IC PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An IC package is provided. The IC package comprises a leadframe comprising a metal strip( | 2012-07-19 |
20120181681 | Stacked Half-Bridge Package with a Current Carrying Layer - According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to an output terminal, and a control gate for being driven by a driver IC. The stacked half-bridge package also includes a sync transistor having a sync drain for connection to the output terminal, a sync source coupled to a low voltage input, and a sync gate for being driven by the driver IC. A current carrying layer is situated on the sync drain; the control transistor and the sync transistor being stacked on one another, where the current carrying layer provides a high current connection between the sync drain and the control source. | 2012-07-19 |
20120181682 | SEMICONDUCTOR DEVICE - In some aspects of the invention, an insulating substrate fixed onto a metal base plate can include an insulating plate and metal foils. A semiconductor element can be disposed on each of the metal foils. External connection terminals can be fixed to a set of ends of terminal holders, respectively. The other ends of the terminal holders can be bonded to the metal foils, respectively. External connection terminals which are main terminals through which main current flows are disposed on a lid. By preparing a plurality of lids having different layouts of the external connection terminals, in which the external connection terminals are connected to the terminal holders in the resin case, respectively, and exchanging the lids, the positions of the external connection terminals can be easily changed. | 2012-07-19 |
20120181683 | THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCORPORATION BY REFERENCE - A three-dimensionally integrated semiconductor device includes a flexible circuit substrate which has a lower portion, an upper portion, and at least one side portion, a support body which supports the upper portion of the flexible circuit substrate, and at least two devices mounted on the flexible circuit substrate and wherein at least one of the devices is mounted on an upper surface of the lower portion of the flexible circuit substrate, at least one of the other devices is mounted on a lower surface of the upper portion of the flexible circuit substrate, and a gap is provided between the device mounted on the upper surface of the lower portion of the flexible circuit substrate and the device mounted on the lower surface of the upper portion of the flexible circuit substrate. | 2012-07-19 |
20120181684 | Semiconductor Structure and Method for Manufacturing the Same - A semiconductor structure and a method for manufacturing the same are provided. The method comprises following steps. A first silicon-containing conductive material is formed on a substrate. A second silicon-containing conductive material is formed on the first silicon-containing conductive material. The first silicon-containing conductive material and the second silicon-containing conductive material have different dopant conditions. The first silicon-containing conductive material and the second silicon-containing conductive material are thermally oxidized for turning the first silicon-containing conductive material wholly into an insulating oxide structure, and the second silicon-containing conductive material into a silicon-containing conductive structure and an insulating oxide layer. | 2012-07-19 |
20120181685 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device wherein the adhesion of resin to a substrate is improved at a low cost. A semiconductor element and one or two substrates opposing one or both of the surfaces of the semiconductor element are sealed by a resin, a resin bonding coat which is formed by spraying a metal powder by a cold spray method is formed on one or both of the substrates, and recess portions which are widened from a film surface in a depth direction are formed on the resin bonding coat. | 2012-07-19 |
20120181686 | METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE - A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package. | 2012-07-19 |
20120181687 | MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING - Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening. | 2012-07-19 |
20120181688 | PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE - A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad and a thickness of the stress buffer metal layer being 1-20 μm, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure. | 2012-07-19 |
20120181689 | Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices - A semiconductor wafer contains a plurality of semiconductor die each having a peripheral area around the die. A recessed region with angled or vertical sidewall is formed in the peripheral area. A conductive layer is formed in the recessed region. A first stud bump is formed over a contact pad of the semiconductor die. A second stud bump is formed over the first conductive layer within the recessed region. A bond wire is formed between the first and second stud bumps. A third stud bump is formed over the bond wire and first stud bump. A dicing channel partially formed through the peripheral area. The semiconductor wafer undergoes backgrinding to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die. The semiconductor die can be disposed in a semiconductor package with other components and electrically interconnected through the bond wire and stud bumps. | 2012-07-19 |
20120181690 | Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers - A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface of the first recessed conductive layer and an upper surface of the first raised conductive layer. The device includes a second recessed conductive layer embedded and recessed into a second surface of the substrate. The second surface of the substrate is opposite the first surface. The device includes a second raised conductive layer disposed beneath the second surface and an interconnect structure disposed on the first recessed and raised conductive layers and the second recessed and raised conductive layers. A second vertical offset exists between a lower surface of the second recessed conductive layer and a lower surface of the second recessed conductive layer. | 2012-07-19 |
20120181691 | PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP - The present invention relates to a package structure, a packaging substrate and a chip. The package structure includes: a chip including a plurality of electrode pads on a surface thereof; a packaging substrate including a plurality of first conductive pads on a surface thereof; and a plurality of connecting units through which the electrode pads electrically communicate with the first conductive pads, in which the chip or the packaging substrate further includes a first surface finish layer over the electrode pads or the first conductive pads, and the first surface finish layer includes a Ni—Pd alloy layer. Accordingly, the surface finish method applied in a package structure, a packaging substrate and a chip has advantages of simple manufacture, low cost and high reliability. | 2012-07-19 |
20120181692 | HYBRID CONTACT STRUCTURE WITH LOW ASPECT RATIO CONTACTS IN A SEMICONDUCTOR DEVICE - In sophisticated semiconductor devices, superior contact resistivity may be accomplished for a given contact configuration by providing hybrid contact elements, at least a portion of which may be comprised of a highly conductive material, such as copper. To this end, a well-established contact material, such as tungsten, may be used as buffer material in order to preserve integrity of sensitive device areas upon depositing the highly conductive metal. | 2012-07-19 |
20120181693 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device may include an upper interconnection on a substrate and an anti-reflection pattern disposed on the upper interconnection. The anti-reflection pattern may include a compound including a metal, carbon and nitrogen. | 2012-07-19 |
20120181694 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The semiconductor device includes an interlayer insulating film, a wiring provided in the interlayer insulating film, and a SiN film provided over the interlayer insulating film and over the wiring. The peak positions of Si—N bonds of the SiN film, which are measured by FTIR, are within the range of 845 cm | 2012-07-19 |
20120181695 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, an oxygen-containing insulating film disposed above the above-described semiconductor substrate, a concave portion disposed in the above-described insulating film, a copper-containing first film disposed on an inner wall of the above-described concave portion, a copper-containing second film disposed above the above-described first film and filled in the above-described concave portion, and a manganese-containing oxide layer disposed between the above-described first film and the above-described second film. Furthermore, a copper interconnection is formed on the above-described structure by an electroplating method and, subsequently, a short-time heat treatment is conducted at a temperature of 80° C. to 120° C. | 2012-07-19 |
20120181696 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package carrier is provided. A substrate having an upper and lower surface is provided. A first opening communicating the upper and lower surface of the substrate is formed. A heat conducting element is disposed inside the first opening, wherein the heat conducting element is fixed in the first opening via an insulating material. At least a through hole passing through the substrate is formed. A metal layer is formed on the upper and lower surface of the substrate and inside the through hole. The metal layer covers the upper and lower surface of the substrate, the heat conducting element and the insulating material. A portion of the metal layer is removed. A solder mask is formed on the metal layer. A surface passivation layer is formed and covers the metal layer exposed by the solder mask and the metal layer located inside the through hole. | 2012-07-19 |
20120181697 | METHOD TO CONTROL METAL SEMICONDUCTOR MICRO-STRUCTURE - A method of forming a metal semiconductor alloy that includes forming an intermixed metal semiconductor region to a first depth of a semiconductor substrate without thermal diffusion. The intermixed metal semiconductor region is annealed to form a textured metal semiconductor alloy. A second metal layer is formed on the textured metal semiconductor alloy. The second metal layer on the textured metal semiconductor alloy is then annealed to form a metal semiconductor alloy contact, in which metal elements from the second metal layer are diffused through the textured metal semiconductor alloy to provide a templated metal semiconductor alloy. The templated metal semiconductor alloy includes a grain size that is greater than 2× for the metal semiconductor alloy, which has a thickness ranging from 15 nm to 50 nm. | 2012-07-19 |
20120181698 | FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS - The present invention provides a method for forming a three-dimensional wafer stack having a single metallized stack via with a variable cross-sectional shape. The method uses at least first and silicon wafers. Each wafer has one or more integrated circuits formed thereon. One or more through-vias are formed in each silicon wafer followed by oxide formation on at least an upper and lower surface of the silicon wafer. The wafers are aligned such that each wafer through via is aligned with a corresponding through via in adjacent stacked wafers. Wafers are bonded to form a three-dimensional wafer stack having one or more stack vias formed from the alignment of individual wafer vias. Via metallization is performed by depositing a seed layer in each of the stack vias followed by copper electroplating to form a continuous and homogeneous metallization path through the three-dimensional wafer stack. | 2012-07-19 |
20120181699 | Semiconductor Structure and Manufacturing Method of the Same - A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a substrate, a first stacked structure, a second stacked structure, a dielectric element, and a conductive line. The first stacked structure and the second stacked structure are disposed on the substrate. Each of the first stacked structure and the second stacked structure includes conductive strips and insulating strips stacked alternately. The conductive strips are separated from each other by the insulating strips. The dielectric element is disposed on the first stacked structure and the second stacked structure and includes a second dielectric portion. The first stacked structure and the second stacked structure are separated from each other by only the second dielectric portion. The conductive line is disposed on the stack sidewalls of the first stacked structure and the second stacked structure far from the second dielectric portion. | 2012-07-19 |
20120181700 | INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILICON VIA-INDUCED STRESS - Embodiments of the invention provide an integrated circuit (IC) having reduced through silicon via (TSV)-induced stresses and related IC design structures and methods. In one embodiment, the invention includes a method of designing an integrated circuit (IC) having reduced substrate stress, the method including: placing in an IC design file a plurality of through silicon via (TSV) placeholder cells, each placeholder cell having an undefined TSV orientation; replacing a first portion of the plurality of TSV placeholder cells with a first group of TSV cells having a first orientation; and replacing a second portion of the plurality of TSV placeholder cells with a second group of TSV cells having a second orientation substantially perpendicular to the first orientation, wherein TSV cells having the first orientation and TSV cells having the second orientation are interspersed to reduce a TSV-induced stress in an IC substrate. | 2012-07-19 |
20120181701 | Multilayer Connection Structure and Making Method - A method provides electrical connections to a stack of contact levels of an interconnect region for a 3-D stacked IC device. Each contact level comprises conductive and insulation layers. A portion of any upper layer is removed to expose a first contact level and create contact openings for each contact level. A set of N masks is used to etch the contact openings up to and including 2 | 2012-07-19 |
20120181702 | PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME - Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin. | 2012-07-19 |
20120181703 | PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator. | 2012-07-19 |
20120181704 | SEMICONDUCTOR MODULE WITH MICRO-BUFFERS - The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die. | 2012-07-19 |
20120181705 | PITCH DIVISION PATTERNING TECHNIQUES - Embodiments of the invention comprise pitch division techniques to extend the capabilities of lithographic techniques beyond their minimum pitch. The pitch division techniques described herein employ additional processing to ensure pitch divided lines have the spatial isolation necessary to prevent shorting problems. The pitch division techniques described herein further employ processing acts to increase the structural robustness of high aspect ratio features. | 2012-07-19 |
20120181706 | POWER SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode. The second conductive sheet is electrically connected to the third main power electrode. The third conductive sheet is electrically connected to the first control electrode. At least a part of the first control electrode is non-covered by the second power chip along a projection direction, which is perpendicular to the carrier. | 2012-07-19 |
20120181707 | Distributed Metal Routing - A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias. | 2012-07-19 |
20120181708 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 2012-07-19 |
20120181709 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME - Disclosed is a photosensitive adhesive composition including:
| 2012-07-19 |
20120181710 | Semiconductor Chip and Method for Fabricating the Same - A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound. | 2012-07-19 |
20120181711 | HIGH-CONCENTRATION OXYGEN-DISSOLVING APPARATUS USING ULTRASONIC WAVES - The present invention relates to a high-concentration oxygen-dissolving apparatus using ultrasonic waves. More particularly, the present invention relates to a high-concentration oxygen-dissolving apparatus using ultrasonic waves in which, when liquid is introduced via an inlet port, a sediment filter filters out foreign substances, a pre-carbon filter filters out harmful chemical substances, a UF membrane filter filters out impurities, a post-carbon filter filters out gas components and odorous components, the filtered liquid is stored in a storage tank, the liquid stored in the storage tank passes through a cooling device to be cooled to a low temperature, the liquid compressed to high pressure by means of a high pressure pump and a Venturi tube is introduced into an ultrasonic wave irradiating unit, oxygen is dissolved into the liquid by ultrasonic waves irradiated from the ultrasonic wave irradiating unit, the liquid flows to the storage tank through a flow pipe, and the liquid having an oxygen concentration higher than a predetermined level is discharged through an outlet pipe. | 2012-07-19 |
20120181712 | Humidifier for Fuel Cell Systems - A humidifier for a fuel cell system comprises a stack of thin plates having planar sealing surfaces at their edges. A water permeable membrane is provided between each pair of plates. Each plate defines a gas flow passage along its top and bottom surfaces, with an inlet and outlet defined along edges of the plate, and a flow field extending between the inlet and outlet openings. Inlet and outlet passages connect the inlet and outlet openings to the flow field, and the planar sealing surfaces on both sides of the plate include bridging portions which extend across the inlet and outlet passages. Support structures are provided throughout the flow field and the inlet and outlet passages to support the membrane and diffusion medium layer(s). The support structures may optionally be connected together by webs having holes for flow distribution between the top and bottom of each plate. | 2012-07-19 |
20120181713 | Fluid Inlet and Distribution System for Volatile Organic Compound Removal Device - A fluid inlet and distribution system for a volatile organic removal device includes a cabinet having an upper wall and multiple downcomer assemblies positioned within the cabinet accessible through a cabinet access. The multiple downcomer assemblies are divisible into first and second cabinet compartments isolated from each other by a dividing wall. A flow distribution duct assembly connected to the upper wall of the cabinet includes upper, bottom, outward facing and inward facing substantially flat containment walls defining a generally rectangular shaped flow passage. A contaminated fluid inlet is connected to one of the upper, inward facing, or outward facing containment walls. A discharge duct connected to the bottom containment wall is positioned above a receiving chamber operating to equally divide a flow of a contaminated fluid containing a volatile organic compound discharged through the discharge duct equally to the first and second cabinet compartments. | 2012-07-19 |
20120181714 | METHOD FOR MANUFACTURING MASTER PLATE FOR OPTICAL DISC - Disclosed herein is a method for manufacturing a master plate of an optical disc. The method comprises the step of: (a) forming an inorganic resist layer on a substrate; (b) forming an organic photoresist layer on and in contact with the inorganic resist layer; (c) irradiating both the organic photoresist layer and the inorganic resist layer with a laser beam to form a first exposed region of the inorganic resist layer and a second exposed region of the organic photoresist layer; (d) removing the inorganic resist layer of the first exposed region and the organic photoresist layer of the second exposed region; (e) removing the patterned organic photoresist layer from the patterned inorganic resist layer; (f) conformally forming a release layer to cover the patterned inorganic resist layer; (g) plating a metal layer on the release layer; and (h) separating the metal layer and the release layer. | 2012-07-19 |
20120181715 | ADVANCED CONTROL SYSTEM AND METHOD FOR MAKING POLYETHYLENE TEREPHTHALATE SHEETS AND OBJECTS - A system for making PET objects including a means for reacting a first PET precursor and a second PET precursor to produce a PET melt; a means for flowing the PET melt to a valve having at least two outlets; a means for flowing the PET melt from at least one of the at least two outlets to at least one die forming line and one pelletizing (cutter) line. A means for controlling individually the mass flow of the PET melt in each of the at least two system lines independently of the other and a means for forming the PET objects from the PET melt. The control scheme is a combination of a feed forward system as well as a feedback loop. The entire control scheme is part of the overall system PLC. The fine tuning of the pressure at the outlet of the die forming loop is controllers to less than +/−1 bar to obtain maximum control of formed part. | 2012-07-19 |
20120181716 | Method Of Producing A Thermoplastically Moldable Fiber-Reinforced Semifinished Product - A continuous method for producing a thermoplastically moldable semifinished product of a thermoplastic material and reinforcing fibers, comprises blending thermoplastic fibers and reinforcing fibers together to form a nonwoven blend, consolidating the nonwoven blend by needling or by a thermal treatment, heating the consolidated nonwoven blend to a temperature above the softening temperature of the thermoplastic, compressing the consolidated nonwoven blend successively in a heated compression mold and in a cooled compression mold at a pressure of less than 0.8 bar for at least 3 seconds, and optionally applying functional layers to the semifinished product. The preferred product is a thermoplastically moldable semifinished product of a thermoplastic material and reinforcing fibers with an average length of 20 to 60 mm and an air pore content of 35 to 65 vol %. | 2012-07-19 |
20120181717 | PROCESS FOR THE PREPARATION OF SUPERHYDROPHOBIC FILM - Process for the preparation of a superhydrophobic film comprising the steps of applying a hydrophobic polymer in the liquid phase on a surface so as to form a layer of hydrophobic polymer, applying on said layer of hydrophobic polymer a membrane having a porosity of between 10 | 2012-07-19 |
20120181718 | Method for Making Foam-In-Place Cushions With Selective Distribution of Foam - A method for making a foam-in-place cushion in which a foam-forming composition is dispensed between two plastic film portions in a predetermined fashion to selectively control the distribution of the foam in the cushion. A foam dispenser can be moved in a transverse direction as foam is dispensed. A dispersion device can be employed to apply pressure on predetermined areas of the film portions towards each other so as to cause the composition to be redistributed in position in a predetermined manner while the composition is in a less than fully expanded state. The plastic film can then be sealed closed to form an expanding foam cushion that can be placed into a shipping carton where the cushion expands to fill void space, or into a mold where the cushion expands and is molded into a desired shape. | 2012-07-19 |
20120181719 | APPARATUS AND MOLD ASSEMBLY FOR MOLDING AND DEMOLDING CEMENTITIOUS PRODUCTS AND METHODS THEREFOR - An assembly for molding and demolding hardened cementitious products comprises a flexible mold and a demolding apparatus. The flexible mold has a top side with separate openings for receiving cementitious material therein for hardening thereof, an opposite closed rear side and a perimeter. The apparatus for demolding the hardened cementitious products from the flexible mold comprises a conveyor, a holding member, a clamp, and a movable member. The conveyor conveys the flexible mold. The clamp grips a portion of the perimeter. The holding member engages the mold. The ovable member moves the clamp and the clamped portion of the mold about the holding member thereby disengaging the flexible mold from the cementitious material. | 2012-07-19 |
20120181720 | SULFOPOLYESTER BINDERS - A versatile binder comprising at least one or more sulfopolyesters is provided. These sulfopolyester binders can enhance the dry tensile strength, wet tensile strength, tear force, and burst strength of the nonwoven articles in which they are incorporated. Additionally, the water permeability of these binders can be modified as desired by blending different types of sulfopolyesters to produce the binder. Therefore, the binder can be used in a wide array of nonwoven end products and can be modified accordingly based on the desired properties sought in the nonwoven products. | 2012-07-19 |
20120181721 | TIE MANUFACTURING METHOD - A tie manufacturing method includes steps of: mixing materials of polymer material, calcium carbon compound and filling; further mixing the mixture of the materials and an additive with each other as compositions of the tie and feeding the mixture of the compositions of the tie into an extruder for extruding the mixture; forming an elastic structure body from the extruded compositions of the tie; and cutting the elastic structure body to form the tie products. The materials of the ties can be uninterruptedly supplied and formed and directly cut into elastic tie products. Accordingly, the manufacturing cost is lowered and the production rate is increased. Moreover, the tie can be more conveniently and diversely used. | 2012-07-19 |
20120181722 | METHOD FOR PRODUCING FLEXIBLE SHEET - A method for producing a flexible sheet includes a stretching step in which a base sheet ( | 2012-07-19 |
20120181723 | METHOD OF PRODUCING PLASTIC STAMP - A method of producing a plastic stamp includes the steps of mixing a thermoplastic resin and a cross-linking agent to obtain a molding material; placing the molding material in a molding die; and performing a direct pressure molding at 160° C. to 190° C. for 5 to 10 minutes for performing a cross-linking reaction to produce the plastic stamp. | 2012-07-19 |
20120181724 | DIRECT PRODUCTION OF A NEGATIVE MOLD FOR PRODUCING WIND TURBINE BLADES - A method for producing a negative mold for casting a wind turbine blade is provided. The described method comprises directly producing the negative mold based on three dimensional data of the negative mold, wherein for producing the negative mold a milling machine is used. It is further described a manufacturing method for a wind turbine blade by means of the described negative mold. Further, it is described such a negative mold and a wind turbine blade, which has been produced with such a negative mold. | 2012-07-19 |
20120181725 | SELF-HEALING VITREOUS COMPOSITION, METHOD FOR PREPARING SAME, AND USES THEREOF - The present invention relates to a self-healing vitreous composition containing a particulate vandium additive, to a method for preparing same, and to the use thereof as a self-healing material, in particular for making seals in devices operating at a high temperature such as fuel oils and steam electrolyzers. | 2012-07-19 |
20120181727 | DEVICE FOR EXPANDING HOLLOW BODIES - A device for expanding a hollow body includes a plurality of sector-shaped expandable jaws disposed in a holder and distributed about a central axis: The expandable jaws extend along the axis to a free end and are radially movable with respect to the axis. Each of the expandable jaws includes: a cylindrical surface having a radius corresponding to a radius of the expanded hollow body and an inward radial taper at an area of the free end; and a plurality of projections and recesses disposed in a joint region and arranged in an alternating manner with each other along the axis and at least partially extending into the area of the free end. The cylindrical surfaces are rounded off to transition to respective outer surfaces of the projections. The outer surfaces of the projections extend, at least at ends of the projections, radially inward with respect the cylindrical surfaces. | 2012-07-19 |
20120181728 | INJECTION MOLDING NOZZLE - An injection molding nozzle for dispensing of molten material includes an elongated body member having an outer surface, a first portion at a proximal end, a second portion at a distal end, and a central passageway extending longitudinally therethrough from the first portion to the second portion. The central passageway includes an inlet defined at the proximal end and splits outwardly at the second portion to form a radially extending passageway leading to an outlet. A tip member is coupled to the outlet to facilitate dispensing of molten material into a mold cavity. A groove is defined on the outer surface of the body member that winds from the first portion to a heated section of the second portion that is positioned adjacent to the tip member. | 2012-07-19 |
20120181729 | Method Of Fabricating An Injection Molded Component - A method of fabricating a foamed, injection-molded component is provided. The method includes the step of introducing a liquid, a nucleating agent and a polymer into an injection barrel of an injection molding machine. The liquid, the nucleating agent and the polymer are injected into a mold corresponding in shape to the component and the component is released from the mold. | 2012-07-19 |
20120181730 | CUTTING TOOL AND METHOD - A cutting tool has: a rotatable hollow tube with an inlet at a distal end of the tube and a cutting edge at the perimeter of the inlet, the tube being arranged so as to rotate when in use so as to cut a work piece with the cutting edge; and an auger housed within the hollow tube, the auger being arranged so as to rotate when in use so as to feed cut material from the inlet along the hollow tube, wherein a distal end of the auger is set back from the cutting edge of the tube. | 2012-07-19 |
20120181731 | Method of Producing a Composite Component - A method of producing a composite component, in which a hollow section is expanded, at least in regions, by internal high pressure. In a first step a region of the hollow section is expanded until it comes to lie against an edge region of a cavity of a combined hydroforming and injection mold. In a second step the cavity is filled with an injection molding compound. In a third step the hollow section, at least in regions, is expanded further, which increases the internal high pressure. | 2012-07-19 |
20120181732 | TUBING EXPANSION - A tubing expansion device is adapted to be advanced axially, without rotation, through tubing to be expanded. The device comprises a body and a plurality of expansion members mounted on the body, the expansion members being independently radially movable. The expansion members may be rotatable, or may be non-rotating. | 2012-07-19 |
20120181733 | LOW CARBON COATINGS AND SLIPS FOR MEMBRANE DEPOSITION - A metal powder slip composition includes a metal powder, a polycarbonate binder, and a liquid carrier. The slip composition can be debound after slip casting without generating residual carbon. The slip composition can be formed into a porous metal layer on a porous substrate object, the porous metal layer having low residual carbon content, without requiring a step of removing residual carbon. A corresponding method of making a porous metal layer is also provided. | 2012-07-19 |
20120181734 | DAMPER HAVING MODULAR FLEXIBLE LIGAMENTS AND VARIABLE GAPS - A module flexible ligament damper includes an cylindrical inner structure with a central axis and an outer cylindrical surface. An outer casing with an inner cylindrical surface is positioned around the inner structure. A modular ligament with an inner flange and an outer flange connected by a web is positioned between the inner structure and the casing. The inner flange is connected to the inner structure and the outer flange is connected to the casing to support the inner structure within the casing, and to permit free orbital movement of the inner structure on a plane perpendicular to the axis of the inner structure. In one embodiment, the web is straight but does not intersect the axis of the inner structure for flexing in a radial direction. In other embodiments, the web is curved for radial flexing. | 2012-07-19 |
20120181735 | WORKPIECE ELEVATING SUPPORT DEVICE - A workpiece elevating support device which can be utilized by being installed in a carriage-type conveying apparatus for conveying an automobile body while changing the height thereof in each section in an automobile assembly line. The workpiece elevating support device includes at least two center-folding double link mechanisms arranged in parallel on a base, each of which is composed of a lower parallel link, an intermediate link member, an upper parallel link, and an upper link member. The upper link member is consecutively provided with a workpiece support. There is juxtaposed a lock means to hold the center-folding double link mechanisms in an expanding-rising posture, which is taken when the upper link members are vertically raised to a predetermined height. | 2012-07-19 |
20120181736 | MOUNTING APPARATUS FOR ELECTRONIC DEVICES - A mounting apparatus for securing electronic devices is disclosed. The mounting apparatus comprises a base; two supports secured to the base; a positioning member located in each of the two supports, wherein the positioning member and each of the two supports are configured to move relative to each other along an axis parallel to a surface of the base, and the positioning member has a tooth-faced side with a plurality of first teeth; a securing member having a plurality of second teeth, wherein the securing member is adapted to engage with the positioning member by meshing the plurality of second teeth and the plurality of first teeth, and the securing member is slidable towards the base along the position member; and two resilient members located in each of the two supports, wherein the two resilient members maintains engagement between the plurality of first teeth and the plurality of second teeth. | 2012-07-19 |
20120181737 | POSITIONING FIXTURE - A positioning fixture for positioning a workpiece includes a base, a support mounted on the base and for receiving the workpiece, two toggle clamps mounted on two opposite sides of the base and the support and an upper cover placed on the support. The upper cover cooperates with the two toggle clamps to position the workpiece on the support. | 2012-07-19 |
20120181738 | ELECTRONIC PART POSITIONING JIG - An electronic part positioning jig is provided, which includes a positioning member which is made of carbon and positions an element part, and a platform which supports the positioning member on a plane. The platform includes a frame member which receives the positioning member, and a body portion which fixes the frame member. The positioning member is sandwiched between the frame member and the body portion so as to be displaceable on the body portion by the frame member being fixed to the body portion by a joining member. | 2012-07-19 |
20120181739 | ADJUSTABLE CONVEYOR APPARATUS AND METHOD FOR BOOK BLOCK FINISHING MACHINE - An apparatus for conveying a plurality of sheets into a receiving member includes receiving member and a conveyor for conveying a plurality of sheets into the receiving member so that the sheets are stacked one upon another to form a book block. The conveyor can have a downstream end that is moveable relative to the stack of sheets in the receiving member. The apparatus can also include an actuator connected to the conveyor that is operable to move the downstream end of the conveyor relative to the stack of sheets in the receiving member. | 2012-07-19 |
20120181740 | DEVICE AND METHOD FOR RECEIVING, HOLDING AND/OR HANDLING TWO-DIMENSIONAL OBJECTS - A receiving, holding and/or handling device for two-dimensional objects, with at least two controllable suction grippers. The suction grippers are arranged and connected to free ends of movable cantilever arms, which are elastically deformable at least in some sections. The cantilever arm are mounted and supported on a bridge. The cantilever arms each include at least one lower pull and one upper pull which meet at the free end of the cantilever arm and are connected there. An actuating device is assigned to the upper pull. The actuating device generates a pulling force with at least one horizontal direction component which is approximately parallel to the longitudinal extension direction of the cantilever arm. A method is also disclosed. | 2012-07-19 |
20120181741 | SHEET DETECTING APPARATUS AND IMAGE FORMING APPARATUS - The present invention provides a sheet detecting apparatus that detects a sheet, the sheet detecting apparatus comprising: a lever member; a biasing portion that biases the lever member for a first position where the abutting surface abuts against the leading end of the sheet; a supporting mechanism that movably supports the lever member to move in an order of the first position, a second position to which the lever member moves by the sheet against the biasing force of the biasing member, and a third position where the lever member abuts on a surface of the sheet and waits in order to move to the first position when a trailing end of the sheet passes the lever member, while keeping a abutting surface of lever member facing upstream; an interlocking portion that interlocks with the lever member; and a detector that detects a position of the interlocking portion. | 2012-07-19 |
20120181742 | SHEET DISCHARGE DEVICE - In a sheet discharge device, sheets are sequentially discharged by a sheet discharge roller with a leading end of each of the sheets in the lead in a sheet discharge direction and stacked on a sheet receiving tray inclining relative to a vertical direction. A sheet reverse member is disposed at such a position relative to the sheet receiving tray and the sheet discharge roller that a trailing end of a first sheet discharged by the sheet discharge roller reaches the sheet reverse member before a leading end of a second sheet discharged subsequently to the first sheet collides with the first sheet when a sheet time interval between the trailing end of the first sheet and the leading end of the second sheet is set to a minimum sheet time interval available in continuous sheet discharge in the sheet discharge device. | 2012-07-19 |
20120181743 | SHEET TRANSPORT DEVICE, SHEET TRANSPORT CONTROL METHOD, AND PRINTER - According to one aspect of the embodiment, a sheet transport device includes a detecting unit configured to detect skew with respect to a transport direction of a sheet that is supplied, a transport unit configured to transport the sheet using a plurality of transport members disposed on the right and on the left at different intervals from an upstream side toward a downstream side in the transport direction and a control unit configured to cause rotation velocities of transport members on the right among the plurality of transport members to be different from rotation velocities of transport members on the left among the plurality of transport members in accordance with the skew of the sheet detected by the detecting unit. | 2012-07-19 |
20120181744 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - The present invention relates to a sheet conveying apparatus, comprising: a conveying portion conveying a sheet; a shutter member having an abutting surface for abutting the sheet to correct skew feeding; a biasing member for biasing the shutter member to position at a first position where the leading end abuts against the abutting surface; and a support mechanism which movably supports the shutter member to move in an order of the first position, a second position to which the shutter member moves by the sheet against biasing from the biasing member, and a third position where the shutter member abuts the sheet and stands by to move to the first position when a trailing end of the sheet passes the shutter member, while keeping the abutting surface facing upstream. | 2012-07-19 |
20120181745 | Media Stack Compression - Embodiments provide methods, apparatuses, and systems for compressing media in a media stack. In various embodiments, a paddle moves between various positions. During the move, the paddle is configured to compress the media stack. | 2012-07-19 |
20120181746 | METHOD AND APPARATUS FOR DETERMINING THE POSITION OF ADJUSTABLE FEEDER TRAY SIDE GUIDES IN AN IMAGE PRODUCTION DEVICE - A method and apparatus for determining the position of adjustable feeder tray side guides in an image production device is disclosed. The method may include detecting an amount of a continuously variable sloped shape marker, determining a position of the adjustable feeder tray side guide of a feeder tray based on the detected amount of the continuously variable sloped shape marker, and outputting the determined position of the adjustable feeder tray side guide of a feeder tray to a user interface of the image production device. | 2012-07-19 |
20120181747 | CARD HANDLING DEVICES AND RELATED METHODS - Card handling devices comprise a card handling zone. A card infeed tray is configured to pass cards to the card handling zone and a separate a card output tray is configured to receive cards from the card handling zone. A control system of the card handling device comprises at least one electronic signal processor, at least one memory device in electrical communication with the electronic signal processor, and a computer program stored in memory of the memory device. The computer program is programmed to cause the control system to selectively control at least one of a card infeed system, the card handling zone, and a card output system of the card handling device and to receive an input from a user input to selectively perform at least one of a shuffling operation, a sorting operation, and a dealing operation using the card handling device. | 2012-07-19 |
20120181748 | Racing table game - The present invention comprises a racing table game and method for playing. Game components include, but are not limited to: a table gaming surface having a plurality of lanes with start and finish lines; a plurality of racers; at least two dice; and a plurality of race tickets each corresponding to a racer. In one embodiment of a method of play, game setup and dealer selection occurs. The dealer then randomizes and distributes the race tickets. A player rolls the dice and acts either by paying chip(s) into a purse or moving a racer, as instructed by the dice. Play continues with each player rolling the dice and acting, until a winner is determined with a racer crossing the finish line. That race is over and the purse is divided into shares and distributed to winning ticket holders. When the role of the dealer is transferred, the next race commences. | 2012-07-19 |
20120181749 | Kan pia baccarat - Kan Pia is a traditional baccarat card game playing with a two steps wagering method with the side bets such as, engage bet, tie and blackjack, by using at least one deck or multi decks standard playing card. It provides players a choice to raise the bet or fold the hand. | 2012-07-19 |
20120181751 | Predetermined and Identified Bonus Enhancement for Game Card Game - This invention relates to a predetermined bonus feature for use in conjunction with a designated underlying game of chance, wherein the individual game card and master game card or master bonus game card include symbols that predetermine and identify which player(s) is eligible to win the bonus prize upon the occurrence of another event. A predetermined winning bonus symbol on a master game card or master bonus game card made known prior to or after conclusion of play of the designated underlying game. Players who have a symbol on their individual game card that matches the predetermined winning bonus symbol know, in advance, that they are eligible to participate to win the bonus prize. The winner(s) of the designated underlying game will win the bonus prize if s/he is able to match a symbol on the individual game card with the winning bonus symbol. | 2012-07-19 |
20120181752 | PORTABLE FIRING BERM - A portable firing berm adapted to capture bullets fired at the berm. The portable berm has a frame assembly defining exterior boundaries of the berm and forming an opening through which bullets fired at the berm enter the berm. A bullet containment portion is communicating with the opening, the bullet containment portion arranged such that unspent bullets received in the bullet containment portion impact against, are stopped and contained by the bullet containment portion. The frame assembly has a moveable wall moveable from a first position to a second position, without removal from the frame assembly, so that the berm is configurable between a transport and placement configuration of the berm and an operating configuration of the berm substantially without disassembly of the frame assembly. | 2012-07-19 |
20120181753 | METHOD FOR SEALING AND ASSEMBLING COMPONENTS OF A DRIVE TRAIN - A method is described for sealing and assembling components of a drive train by means of silicon elastomers prepared using silicon compositions that do not contain any metal catalyst such as, for example, tin, and cross-linking by polycondensation reactions in the presence of water (for example, ambient moisture). | 2012-07-19 |
20120181754 | GASKET FOR ELECTRIC CABLES - A gasket for electric cables includes a main portion made of elastic material; a through hole that passes longitudinally through the main body and constitutes the seat of a cable to be insulated; a longitudinal slit passes through the body of the gasket and connects the through seat to the outside, allowing, by virtue of the elastic deformability of the material of the gasket, the insertion of the cable in the through seat. | 2012-07-19 |
20120181755 | SUMPSEALER - Many existing sump covers have large access slots to accommodate the location of the sump pump discharge pipe. The exposed slot can allow undesirable soil gases to enter a home. | 2012-07-19 |
20120181756 | ANNULAR SEAL WITH TRAPEZOIDAL CROSS-SECTION - An annular seal for sealing between a cylindrical probe and a bore includes a radially inward-facing sealing portion having a first contact height, a radially outward-facing sealing portion having a second contact height, where the first contact height is greater than the second contact height. The seal further includes a vertical-loading portion, and a sloped deformation portion that extends between the vertical-loading portion and the radially outward-facing sealing portion. | 2012-07-19 |
20120181757 | Counter-Rotating Motors with Linear Output - An active suspension for a vehicle includes an actuator which incorporates a first rotary motor, a second rotary motor, and a transmission coupled to the first and second rotary motors to convert rotary motion to linear motion. A compensation force is determined to compensate for the rotary inertia of the system. A force feedback loop can be employed to reduce the error between the output force of the actuator and a force command supplied by an active suspension system controller. | 2012-07-19 |
20120181758 | Retractable and automatic positioning wheels for snowmobiles - A device allowing positioning of wheels of a snowmobile when skis leave a snowy path to continue on a road. The device comprises at least two parallel wheels positioned near each ski, a pair of cylinders placed in connection with each wheel, and controlled by a control box by a driver activating pistons to move the wheels from an upward position to a downward ground position. The upward position corresponds to wheels elevated over the ski when the piston is contracted; and the downward position corresponds to wheels in touch with the ground when the piston is extended. Means of clutch move horizontally the wheels to an external position. A spike located on an arm which supports a wheel is positioned to scratch ground ice for creating a mist when a wheel is in a scratching position. | 2012-07-19 |
20120181759 | Snow sled - A snow sled is provided for use on snow. The sled has a seating portion having a lower portion that is configured to slide on snow, and an upper portion that has a membrane for supporting a person, the seating portion including a frame that defines the upper and lower portions. The sled also includes a steering portion formed separately from the seating portion and having a ski support, a single front ski, and an arm having opposing ends that are pivotably coupled to the ski support and the front ski. The sled further includes a steering mechanism pivotably coupling the seating portion and the ski support of the steering portion. The pivotable couplings between the arm and the ski support and the front ski, together with the pivotable couplings between the steering mechanism and the seating portion and the ski support, are configured to allow for the front ski to be folded and stored under the seating portion. A braking member can also be provided at each end of the opposing ends of the ski support. | 2012-07-19 |
20120181760 | DROP DECK TRAILER - This invention relates to a trailer comprising a body, a wheel assembly on each side of and floating relative to the trailer body, a linear actuator driving means adapted to selectively raise and lower body relative to its wheel assemblies whilst keeping the body substantially parallel to the ground throughout its range of movement and providing a mechanical advantage to the actuator. | 2012-07-19 |
20120181761 | Straw trapper for wheelbarrow - A wheelbarrow includes a straw trapper for enclosing straw and debris in a bin of the wheelbarrow for shipment and storage. The straw trapper includes a dispenser of a panel of fabric or flexible plastic to cover the open top of the wheelbarrow bin. The dispenser is mounted on a first side wall of the wheelbarrow bin and includes an engagement member assembly mounted on a second, opposite side wall of the wheelbarrow which engages a free end of the panel. Fixed and adjustable handles mounted on both rear and front walls of the wheelbarrow bin to allow two users working together to unload straw from the bin over a side wall of the bin into a debris collection receptacle, such as a dumpster or compost container. | 2012-07-19 |
20120181762 | Quick-disconnect handle for lifting and dumping of wheelbarrow cart - A second quick-disconnect wide handle is attached to the front of a stable wheelbarrow cart to enable two persons to quickly lift and dump the contents of a full wheelbarrow cart into a dumpster or walled compost bin. This accessory handle is easily removed when not in use. The handle has other uses such as moving plywood panels or table-tops, doors, or other large flat items. The quick-disconnect feature uses a quick disconnect clamp with the addition of an elongated handle and attachment of a rod attachment to it; whereby one such clamp is used at each rod end attaching the handle to the bin of the wheelbarrow cart. | 2012-07-19 |
20120181763 | STABILISER FOR A PACKAGED ARTICLE - A stabiliser for a wheeled packaged article, the stabiliser configured for direct attachment to the packaging of a packaged article by a clamp connector that engages an inner surface of the packaging, wherein the stabiliser comprises: anti-rolling means; a base plate, to which the anti-rolling means is coupled, and which base plate comprises means to enable the stabiliser to be attached to the packaging of a packaged article by a clamp connector; wherein the base plate comprises an aperture, so that when the device is attached to the packaging of a packaged article by a clamp connector, the clamp connector engages the surface of the base plate that is not in contact with the packaging. | 2012-07-19 |
20120181764 | Cart accessory handle for lifting and dumping - A dual handled liftable wheelbarrow with a bin and a wheel assembly has a fixed handle mounted on a rear wall thereof. A bracket is mounted on an outside of the front wall for mounting an adjustable handle with an elongated resilient grip having end arms swiveling about and mounted on said forwardly extending members of the bracket, so that the handle is rotatable between a parked position flush downwardly against the outside of said front wall, and an upwardly extending deployed position with said resilient grip above the open top of said bin. The fixed and adjustable handles are mounted at substantially equal heights on the rear and front walls, respectively, of the bin to allow two users working together to unload debris from the bin over a side wall of the bin into a collection box. | 2012-07-19 |
20120181765 | Free-to-lean three-wheeled passenger vehicle, power plant controller and body therefor - A three-wheeled leaning passenger vehicle comprises a frame rigidly mounting a passenger seat; a drive wheel rotatably mounted on the frame preferably in a rearward region thereof; a frame-mounted rotary drive cooperatively coupled with the drive wheel for rotation of the drive wheel relative to the frame; and a frame-mounted coast/steer system including two rotatable and preferably front wheels freely rotatable relative to the frame in a forward region thereof, and a handlebar coupled with the two front wheels for turning the two rotatable wheels in a plane defined by their rotational axes substantially parallel with one another to corner, the vehicle being configured to substantially freely lean left and right in a natural response to a driver thereof in the driver seat steering the vehicle and leaning respectively left and right, and, alternatively or additionally, to have controlled leaning in response to a hydraulically or otherwise provisioned leaning, suspension, and stand-up mechanisms. The rotary drive includes a frame-mounted power plant operatively couple-able with the drive wheel, the rotary drive including an internal combustion engine and an electric motor selectively operatively couple-able with the drive wheel to power the vehicle. The power plant is selectively operable to power the vehicle in three modes of operation including a hybrid mode characterized by operation of the internal combustion engine and the electric motor coordinated substantially to optimize fuel economy, an electric-only mode characterized by operation only of the electric motor, and a sport mode characterized by concurrent operation of the internal combustion engine and the electric motor. | 2012-07-19 |
20120181766 | DAMPER TUBE REINFORCEMENT SLEEVE - A strut assembly includes an upper mount assembly, a shock absorber and a knuckle. The upper mount assembly is attached to a piston rod which is a part of the shock absorber. The knuckle is attached to an outer tube of the shock absorber which can be a reserve tube of a dual-tube shock absorber or a pressure tube of a single tube shock absorber. A reinforcement member increases the strength of the outer tube in the area that interfaces with the knuckle. | 2012-07-19 |
20120181767 | SUSPENSION DEVICE - A suspension device (S) of the present invention includes: a member ( | 2012-07-19 |
20120181768 | VEHICLE WITH MOVABLE AND INWARDLY TILTING SAFETY BODY - Enhanced vehicle handling is achieved by the improved suspension systems constructed in accordance with aspects of the present invention, in which not only do the roll couple and jacking couple oppose each other, thereby causing the body roll to counteract the jacking effect, but also the pitch couple and the pitching couple oppose each other, thereby causing the body pitch to counteract the pitching effect. This results in the improvement of the cornering traction of the vehicle, the braking traction of the vehicle, the acceleration traction of the vehicle (especially in a front-wheel-drive vehicle), the simultaneous cornering and braking traction of the vehicle, and the simultaneous cornering and acceleration traction of the vehicle. | 2012-07-19 |
20120181769 | MULTI-PERSON TRICYCLE - Various embodiments of a multi-person tricycle are disclosed. In at least one embodiment, the multi-person tricycle includes two front drive wheel assemblies, each having an independent drive train assembly, and includes a rear wheel assembly operably connected to a steering mechanism which may be simultaneously or independently operated by one or more riders. In at least one embodiment, the multi-person tricycle may be configured or designed to enable two front riders to sit side-by-side, and further may be configured or designed to enable each rider to independently exert and/or vary his or her own pedaling force and/or pedaling cadence without substantially affecting steering of the vehicle. | 2012-07-19 |
20120181770 | CYCLE HAVING AN ARM DRIVE AND A LEG DRIVE - The invention relates to a two-wheeled cycle having an arm crank drive and a leg crank drive. The cycle has steering by means of shaft legs, wherein the cycle is steered by tilting, and the cycle has at least one steering support element which dampens, limits, or fixes the steering motion or exerts a restoring force in the straight-ahead position of the steering wheel. In addition, the geometry of the steering axis and of the fork offset are optimized. | 2012-07-19 |
20120181771 | Systems and Methods for Assisting a Seated Person to a Standing Position - A walker device including a walking aid and a lifting arm attached to, and extending in an approximate vertical direction from, the walking aid. The walking aid may include two front legs and two back legs. The walking aid may include two or more wheels attached to the bottom of the two front legs and/or two back legs. The walking aid may be a multiple-legged cane. The walking aid may be a wheeled mobility device. The lifting arm may include a gripping handle positioned at its approximate distal end. | 2012-07-19 |
20120181772 | COLLAPSIBLE VEHICLE - A vehicle with a collapsible body. With this construction a one-person's vehicle can be folded together to a very compact size with the dimensions of an average suitcase. The body comprises two halves: a front and back part. Each of these parts contains a lower and upper hollow section. Each upper hollow section can slide telescopically in and out the lower hollow section, thus enlarging or reducing the length of the corresponding part. In the collapsed state both parts with all their sections are nested into each other. A further reduction of the volume of the collapsed vehicle can be achieved by using a chassis with two retractable slidable frame parts. | 2012-07-19 |
20120181773 | INFANT SCOOTER - A vehicle for infants includes a footboard, a front and rear chassis support fixed to it, wherein each chassis support supports at least one wheel, a steering bar which is connected to the front chassis support, and gripping at the upper portion of the steering bar. The vehicle furthermore includes a seat which is preferably fixed to the steering bar. The invention furthermore relates to a vehicle for infants with two front wheels and at least one, preferably two, rear wheels, wherein the vehicle includes a seat which is preferably fixed to a steering bar of the vehicle, and wherein the vehicle includes gripping at the steering bar which, however, does not function as handle bar, and wherein at least the front chassis support of the vehicle includes a steering mechanism which permits to steer the vehicle by ways of shifting of weight. | 2012-07-19 |
20120181774 | FRONT WHEEL SUSPENSION FOR A SINGLE-TRACK VEHICLE - The invention relates to a front wheel suspension for a single-track vehicle, wherein a front wheel is rotatably supported on a fork-like wheel carrier and the wheel carrier is coupled to a frame and a steering bar of the vehicle connected to a handlebar, wherein the steering bar is coupled to the wheel carrier by means of a lever connection. Furthermore the wheel carrier is coupled to at least one frame bar by means of an articulated connection, and the articulated connection has a substantially vertical pivot axis. Moreover the steering bar is comprised of a fork bar partially encompassing the front wheel, which fork bar is coupled to the wheel carrier via the lever connection. Thereby a front wheel suspension having improved characteristics in regard to the suspension, the direct handling of the steering, and a reduction of the load of the frame can be provided. | 2012-07-19 |
20120181775 | BICYCLE REAR WHEEL AXLE POSITIONING DEVICE - A bicycle rear wheel axle positioning device includes a rod having a curved surface and a flat surface. The rod is connected with a seat stay and a chain stay. A clamp member has a clamp portion and the rod extends through a passage in the clamp portion, wherein the periphery of the passage is corresponding to the curved surface and the flat surface. A first resilient portion and a second resilient portion extend from the clamp portion, respectively. The rear wheel axle is inserted into one side of the clamp portion and the clamp member is movable along the rod. The other side of the clamp portion includes a protrusion which is engaged with one of positioning grooves defined in the curved surface of the rod when the axle is moved to a desired position and a fastening member extends through the two resilient portions. | 2012-07-19 |
20120181776 | WIDTH ADJUSTER FOR MOTORCYCLE STAND - The leverage device is intended to be installed on motorcycle stands that currently use a hex head machine screw for width adjustment. It consists of a) a female hex portion to mate with the hex head of the machine screw, b) a lever portion to be actuated by the user and c) a flat bottom to keep it captive to the machine screw. The device allows the user to loosen the screw slightly for width adjustment then re-tighten it without the use of tools. The low profile device is installed on the motorcycle stand to become a permanent part of the stand, unlike a wrench that is separate. | 2012-07-19 |
20120181777 | SPOON SKIS AND SNOWBOARDS - According to the invention, a ski is provided. The ski may be a longitudinal member having lengthwise edges, a convex base, and a first and second pair of undulations. Each lengthwise edge may have a sidecut portion, where the longitudinal member is thinner near a middle portion of the sidecut portion than at an end of the sidecut portion. The convex base, in an un-deformed state, may have lengthwise edges which are elevated compared to a bottom-most portion of the convex base. The first pair of undulations may be located at a first end of the sidecut portion, one undulation of the first pair per lengthwise edge. The second pair of undulations may be located at a second end of the sidecut portion, one undulation of the second pair per lengthwise edge. The undulations may be a downward depression of the base compared to proximate portions of the convex base. | 2012-07-19 |
20120181778 | TOOL-FREE ADJUSTABLE BINDING FOR SPORTS BOARD - A binding is adapted for coupling footwear, such as a boot, to a sports board. The binding permits easy adjustment of the binding's position on the board, while also allowing for removal of the binding from the board for improved utility of storage or transport. Adjustment, engagement between binding and board, and removal functions may be accomplished without the use of tools or ancillary components. The binding includes a movable coupler element or elements that removably couple to a retaining disc to secure the binding to the retaining disc and the board. | 2012-07-19 |
20120181779 | WHEELCHAIR AND BED - In a bed including a wheelchair and a bed main body portion, the wheelchair has a seating bottom portion composed of bendably coupling a plurality of divided members, a chair bottom support member supporting the seating bottom portion, the chair bottom support member for changing a shape of a leg bottom part in conjunction with inclination of a back bottom part, a chair base portion fixing the chair bottom support member, front casters provided in the chair base portion, the front casters being capable of freely changing the direction, both side wheel bottom support members axially supported on the chair base portion, rear casters provided in one ends of the both side wheel bottom support members, the rear casters being capable of freely changing the direction, traveling wheels provided in the other ends of the both side wheel bottom support members, whose traveling direction is fixed to the straight-moving direction, and caster links coupling parts of the both side wheel bottom support members on the side of the rear casters and the back bottom part of the chair bottom support member. | 2012-07-19 |