29th week of 2013 patent applcation highlights part 14 |
Patent application number | Title | Published |
20130181323 | Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate - A semiconductor device has a first insulating layer formed over a first surface of a polymer matrix composite substrate. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. The second conductive layer is wound to exhibit inductive properties. A third conductive layer is formed between the first conductive layer and second conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. A bump is formed over the second conductive layer. A fourth insulating layer can be formed over a second surface of the polymer matrix composite substrate. Alternatively, the fourth insulating layer can be formed over the first insulating layer prior to forming the first conductive layer. | 2013-07-18 |
20130181324 | SEMICONDUCTOR DEVICE - A semiconductor device sends and receives electrical signals. The semiconductor device includes a first substrate provided with a first circuit region containing a first circuit; a multi-level interconnect structure provided on the first substrate; a first inductor provided in the multi-level interconnect structure so as to include the first circuit region; and a second inductor provided in the multi-level interconnect structure so as to include the first circuit region, wherein one of the first inductor and the second inductor is connected to the first circuit and the other of the first inductor and the second inductor is connected to a second circuit. | 2013-07-18 |
20130181325 | Through-Assembly Via Modules and Methods for Forming the Same - A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias. | 2013-07-18 |
20130181326 | MULTILAYER MIM CAPACITOR - An improved semiconductor capacitor and method of fabrication is disclosed. A MIM stack, comprising alternating first-type and second-type metal layers (each separated by dielectric) is formed in a deep cavity. The entire stack can be planarized, and then patterned to expose a first area, and selectively etched to recess all first metal layers within the first area. A second selective etch is performed to recess all second metal layers within a second area. The etched recesses can be backfilled with dielectric. Separate electrodes can be formed; a first electrode formed in said first area and contacting all of said second-type metal layers and none of said first-type metal layers, and a second electrode formed in said second area and contacting all of said first-type metal layers and none of said second-type metal layers. | 2013-07-18 |
20130181327 | EPITAXIAL SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - Provided is a crack-free epitaxial substrate having a small amount of dislocations in which a silicon substrate is used as a base substrate. An epitaxial substrate includes a substrate made of (111) single crystal silicon and a base layer group in which a plurality of base layers are laminated. Each of the plurality of base layers includes a first group-III nitride layer made of AlN and a second group-III nitride layer made of Al | 2013-07-18 |
20130181328 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed that has enhanced its electric charge resistance. A first parallel p-n layer is disposed in an element activating part, and a second parallel p-n layer is disposed in an element peripheral edge part. An n | 2013-07-18 |
20130181329 | SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A semiconductor device includes: a substrate in which a product region and scribe regions are defined; a 1st insulation film formed above the substrate; a metal film in the 1st insulation film, disposed within the scribe regions in such a manner as to surround the product region; a 2nd insulation film formed on the 1st insulation film and the metal film; a 1st groove disposed more inside than the metal film in such a manner as to surround the product region, and reaching from a top surface of the 2nd insulation film to a position deeper than a top surface of the metal film; and a 2nd groove disposed more outside than the metal film in such a manner as to surround the metal film, and reaching from the top surface of the 2nd insulation film to a position deeper than the top surface of the metal film. | 2013-07-18 |
20130181330 | INTEGRATING THROUGH SUBSTRATE VIAS INTO MIDDLE-OF-LINE LAYERS OF INTEGRATED CIRCUITS - A semiconductor wafer has an integrated, through substrate, via (TSV). The semiconductor wafer includes a substrate. A dielectric layer may be formed on a first side of the substrate. A through substrate via may extend through the dielectric layer and the substrate. The through substrate via may include a conductive material and an isolation layer. The isolation layer may at least partially surround the conductive material. The isolation layer may have a tapered portion. | 2013-07-18 |
20130181331 | ATMOSPHERIC-PRESSURE PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION - Provided are silicon-containing films with a refractive index suitable for antireflection, articles having a surface comprising the films, and atmospheric-pressure plasma-enhanced chemical vapor deposition (AE-PECVD) processes for the formation of surface films and coatings. The processes generally include providing a substrate, providing a precursor comprising silicon, and reacting the precursor with a gas comprising nitrogen (N2) in a low-temperature plasma at atmospheric pressure, wherein the products of the reacting form a film on the substrate. An antireflection coating made by the process can have a refractive index of about 1.5 to about 2.2. Articles are provided having a surface that includes the antireflection coating. | 2013-07-18 |
20130181332 | PACKAGE LEADFRAME FOR DUAL SIDE ASSEMBLY - Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance interconnect and good current carrier between the bondpads on one device or between the bondpads on different devices above and/or below the leadframe. | 2013-07-18 |
20130181333 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor package structure is provided. A supporting plate and multiple padding patterns on an upper surface of the supporting plate define a containing cavity. Multiple leads electrically insulated from one another are formed on the padding patterns, extend from top surfaces of the padding patterns along side surfaces to the upper surface and are located inside the containing cavity. A chip is mounted inside the containing cavity, electrically connected to the leads. A molding compound is formed to encapsulate at least the chip, a portion of the leads and a portion of the supporting plate, fill the containing cavity and gaps among the padding patterns, and exposes a portion of the leads on the top surface. The supporting plate is removed to expose a back surface of each padding pattern, a bottom surface of the molding compound and a lower surface of each lead. | 2013-07-18 |
20130181334 | CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE - A connector for electrically connecting a chip electrode of a semiconductor element to a lead constituting an external leading terminal of the chip electrode, includes a first connecting part having an interface joined to the chip electrode; a second connecting part having an interface joined to a base end part of the lead; and a plate-shape coupling part for connecting the first connecting part and the second connecting part to each other, and having a step formed on the interface of the first connecting part in a direction away from the chip electrode by a half blanking process. | 2013-07-18 |
20130181335 | LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME - Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof. | 2013-07-18 |
20130181336 | SEMICONDUCTOR PACKAGE WITH IMPROVED THERMAL PROPERTIES - A semiconductor package, comprises an encapsulant which contains a semiconductor substrate, the package lower side being mountable on a surface. The semiconductor substrate backside is in close proximity of the semiconductor package lower side for improved thermal conductivity to the surface. The active side of the semiconductor substrate, facing the upper side of the semiconductor package, has a plurality of die contacts. A plurality of electrically conductive interconnects are connected to the die contacts and extend to the lower side of the semiconductor package for connecting the die contacts to the surface. | 2013-07-18 |
20130181337 | Power Routing with Integrated Decoupling Capacitance - An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network ( | 2013-07-18 |
20130181338 | Package on Package Interconnect Structure - A structure comprises a post passivation interconnect layer formed over a semiconductor substrate, a metal bump formed over the post passivation interconnect layer and a molding compound layer formed over the semiconductor substrate. A lower portion of the metal bump is embedded in the molding compound layer and a middle portion of the metal bump is surrounded by a concave meniscus molding compound protection layer. | 2013-07-18 |
20130181339 | MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP BONDING - A method and structure for mechanical self-alignment of semiconductor device features, for example multi-chip module features. Alignment of the features can be performed using mechanical alignment grooves within a layer of a first device and mechanical alignment pedestals of a second device. The alignment accuracy is limited by the patterning resolution of the semiconductor processing, which is in sub-micron scale. Flip-chip bonding can be used as the bonding process between chips to increase the alignment precision. | 2013-07-18 |
20130181340 | SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS - A method forms a connecting pillar to a bonding pad of an integrated circuit. A seed layer is formed over the bond pad. Photoresist is deposited over the integrated circuit. An opening is formed in the photoresist over the bond pad. The connecting pillar is formed in the opening by plating. | 2013-07-18 |
20130181341 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package structure and a method for manufacturing the same are provided, in which a semiconductor die is disposed in a spacer structure for packaging, and a connection pad, a first metallic layer, an insulating layer, a wiring layer, a pin base, a conductive via and a metallic bump are formed on the semiconductor die, wherein the wiring layer can be formed as a single layer or multiple layers, and the connection pad is electrically connected with an outer pin. Moreover, the positioning structures are also formed to overcome the conventional misalignment problems caused by the thermal expansion and the cooling contraction. The alignment of the conductive via with the connection pad can be more accurately achieved, which ensures that the connection pad is reliably connected with the outer pin. | 2013-07-18 |
20130181342 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate having first and second surfaces which face each other, a semiconductor chip mounted on the first surface, a first encapsulant formed on the first surface and at least partially encapsulating the semiconductor chip. A second encapsulant is formed on the second surface and first external connection terminals formed on the second surface to penetrate the second encapsulant. The external connection terminals have first ends in contact with the second surface. Second external connection terminals are attached to second ends of the first external connection terminals. | 2013-07-18 |
20130181343 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surfaceand the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive. | 2013-07-18 |
20130181344 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS - Bump electrodes and wiring layers are formed by selectively removing a copper sheet while the copper sheet is being held on a supporting base by an adhesion layer. Subsequently, a device mounting board is formed by laminating an insulating resin layer in such a manner that Au/Ni layers are exposed on the bump electrodes and the adhesion layer. The device mounting board and a semiconductor device held on the supporting base are temporarily press-bonded to each other and then the supporting base and the adhesion layer are removed. Then the device mounting board and the semiconductor device are finally and permanently press-bonded together. | 2013-07-18 |
20130181345 | SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROUGH SEMICONDUCTOR SUBSTRATE - Disclosed herein is a device that includes: a semiconductor substrate having a first surface on which a plurality of circuit elements are formed and a second surface opposite to the first surface; an insulating layer covering the second surface of the semiconductor substrate; and a penetration electrode having a body section that penetrates through the semiconductor substrate and a protruding section that is connected to one end of the body section and protrudes from the second surface of the semiconductor substrate. The second surface of the semiconductor substrate is covered with the protruding section of the penetration electrode without intervention of the insulating layer. | 2013-07-18 |
20130181346 | BUMPING PROCESS AND STRUCTURE THEREOF - A bumping process includes providing a silicon substrate, forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first areas and a plurality of second areas, forming a photoresist layer on the titanium-containing metal layer, patterning the photoresist layer to form a plurality of opening slots, forming a plurality of bottom coverage layers at the opening slots, proceeding a heat procedure, forming a plurality of external coverage layers to make each of the external coverage layers connect with each of the bottom coverage layers, wherein said external coverage layer and said bottom coverage layer form a wrap layer and completely surround the copper bump, forming a plurality of connective layers on the external coverage layers, removing the photoresist layer, removing the second areas and enabling each of the first areas to form an under bump metallurgy layer. | 2013-07-18 |
20130181347 | Bump Pad Structure - An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad. | 2013-07-18 |
20130181348 | SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METHOD FOR FABRICATING THE SAME - Present embodiments relate to a semiconductor device having a backside redistribution layer and a method for forming such a layer. Specifically, one embodiment includes providing a substrate comprising a via formed therein. The substrate has a front side and a backside. The embodiment may further include forming a trench on the backside of the substrate, disposing an insulating material in the trench, and forming a trace over the insulating material in the trench. | 2013-07-18 |
20130181349 | SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIA - According to an embodiment, a semiconductor device includes a first circuit block, a first through-substrate via, and a back surface wiring. The first circuit block is provided on a surface side of a semiconductor substrate. The first through-substrate via is provided along a circumference of the first circuit block so as to separate the first circuit block from other circuit blocks. The first circuit block is provided so as to penetrate the surface of the semiconductor substrate. The first circuit block is isolated from the surroundings. The first circuit block has conductivity. The back surface wiring is provided on the back surface side of the semiconductor substrate. The back surface wiring is connected to the first through-substrate via. The back surface wiring connects the first through-substrate via to a power supply terminal or a shield potential terminal. | 2013-07-18 |
20130181350 | SEMICONDUCTOR DEVICES WITH NONCONDUCTIVE VIAS - An electric device with vias that include dielectric structures to prevent conductive material in the vias from electrically connecting conductive structures on a top of the vias with conductive structures on the bottom of the vias. The dielectric structures are formed in selected vias where other vias do not include the dielectric structures. | 2013-07-18 |
20130181351 | Semiconductor Device Package with Slanting Structures - A semiconductor device package structure includes a substrate with a via contact pad on top surface of the substrate, a terminal pad on bottom surface of the substrate and a conductive through hole through the substrate, wherein the conductive through hole electrically couples the via contact pad and the terminal pad on the substrate; a die having bonding pads thereon, wherein the die is formed on the top surface of the substrate; a slanting structure formed adjacent to at least one side of the die for carrying conductive traces; and a conductive trace formed on upper surface of the slanting structure to offer path between the bonding pads and the via contact pad. | 2013-07-18 |
20130181352 | Method of Growing Carbon Nanotubes Laterally, and Lateral Interconnections and Effect Transistor Using the Same - Provided are a method of growing carbon nanotubes laterally, including forming catalyst dots to grow carbon nanotubes on a substrate, forming a sacrificial layer including a plurality of nanochannels including regions having the catalyst dots formed therein, and growing carbon nanotubes through the nanochannels, and a field effect transistor using the method. | 2013-07-18 |
20130181353 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package includes a semiconductor device and a substrate, the semiconductor device including a straight line portion on an outer periphery and the substrate supporting the semiconductor device. A foil positioning pattern is formed on a front surface of the substrate, the positioning pattern touching the straight line portion of the semiconductor device to regulate a position of the semiconductor device. | 2013-07-18 |
20130181354 | Semiconductor Interposer Having a Cavity for Intra-Interposer Die - A semiconductor package may include a substrate, and a semiconductor interposer having a cavity and a plurality of through semiconductor vias. The semiconductor interposer is situated over the substrate. An intra-interposer die is disposed within the cavity of the semiconductor interposer. A thermally conductive adhesive is disposed within the cavity and contacts the intra-interposer die. Additionally, a top die is situated over the semiconductor interposer. In one implementation, the semiconductor interposer is a silicon interposer. In another implementation, the semiconductor interposer is flip-chip mounted to the substrate such that the intra-interposer die disposed within the cavity faces the substrate. In yet another implementation, the cavity in the semiconductor interposer may extend from a top surface of the semiconductor interposer to a bottom surface of the semiconductor interposer and a thermal interface material may be disposed between the intra-interposer die and the substrate. | 2013-07-18 |
20130181355 | Support Structure for TSV in MEMS Structure - An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure. | 2013-07-18 |
20130181356 | MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES - Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate. | 2013-07-18 |
20130181357 | MANUFACTURING METHOD FOR AN ELECTRONIC SUBSTRATE - The manufacturing method for electronic substrate includes: forming an active region on a first face of a substrate; forming a first part of an interconnection pattern as a passive element on a second face of the substrate; forming an insulating layer as a stress-relieving layer on the second face of the substrate; and forming a second part of the interconnection pattern as the passive element on the insulating layer. | 2013-07-18 |
20130181358 | SEMICONDUCTOR DEVICE INCLUDING A FIRST WIRING HAVING A BENDING PORTION A VIA - A first wiring ( | 2013-07-18 |
20130181359 | Methods and Apparatus for Thinner Package on Package Structures - Methods and apparatus for thinner package on package (“PoP”) structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first substrate and a plurality of package on package connectors extending from a bottom surface; and a second integrated circuit package including at least another integrated circuit device mounted on a second substrate and a plurality of lands on an upper surface coupled to the plurality of package on package connectors, and a plurality of external connectors extending from a bottom surface; wherein at least the second substrate is formed of a plurality of layers of laminated dielectric and conductors. In another embodiment a cavity is formed on the bottom surface of the first substrate and a portion of the another integrated circuit extends partially into the cavity. Methods for making the PoP structures are disclosed. | 2013-07-18 |
20130181360 | INTEGRATED CIRCUIT CONNECTIVITY USING FLEXIBLE CIRCUITRY - An integrated circuit (IC) structure can include an internal element and a flexible circuitry directly coupled to the internal element. The flexible circuitry can be configured to exchange signals between the internal element and a node external to the IC structure. | 2013-07-18 |
20130181361 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND ENCAPSULATED SEMICONDUCTOR DEVICE - A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable. | 2013-07-18 |
20130181362 | UNCOATED, CORROSION RESISTANT RESIN DELIVERY SYSTEM - An apparatus and method for producing defect-critical articles from a molding resin comprising at least 98% clear polymer and additives including a heat stabilizer and a UV blocker in an injection molding machine. According to the apparatus, there is provided an injection molding machine in combination with a molding resin. The injection molding machine's resin delivery assembly is made from a powder metallurgy formed into solid non-coated parts having a Chromium-Vanadium (Cr/V) blend. As the molding resin interacts with the resin delivery assembly, the resin only contacts the solid non-coated parts whereby the resin experiences less degradation and provides improved quality for the defect-critical articles. The method includes the steps of plasticizing, injecting, and cooling. During the plasticizing and injecting steps, the molding resin only contacts solid non-coated parts made from a powder metallurgy material containing a Chromium-Vanadium (Cr/V) blend thereby producing reduced defect articles. | 2013-07-18 |
20130181363 | PROCESS FOR MANUFACTURING POLYSILOXANE MICROCAPSULES THAT ARE FUNCTIONALIZED AND ARE NOT VERY POROUS - A method is provided for encapsulating products that can have lipophilic or hydrophilic, including volatile, properties in a polysiloxane membrane that is particularly impervious. A method is also provided for evaluating the imperviousness of capsules. The present method includes the following steps:
| 2013-07-18 |
20130181364 | METHOD AND APPARATUS FOR HELICAL CUTTING OF A TUBULAR FILM - A method of forming a film ( | 2013-07-18 |
20130181365 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An apparatus for bringing a mold having a pattern region and a first mark into contact with an imprint material on a substrate having a second mark, includes a deforming mechanism configured to deform the mold such that a portion of the mold where the first mark is formed protrudes toward the substrate, a driving mechanism configured to adjust a distance between the mold and the substrate, and a detecting unit configured to detect, after the driving mechanism starts an operation of reducing the distance, the first mark and the second mark in a state in which the portion of the mold and the imprint material on the substrate are in contact with each other but a whole of the pattern region is not in contact with the imprint material. | 2013-07-18 |
20130181366 | USE OF CELLULAR CONCRETE AGGREGATES AND MANUFACTURING PROCESS - Cellular concrete aggregates sized between 2 and 25 mm and having a bulk density in the dry state of between 200 and 600 kg/m | 2013-07-18 |
20130181367 | BUTYL RUBBER CONVERSION TO DISPERSION AND BUTYL RUBBER DIPPED GLOVE - Butyl rubber based coating agents for preparing a coated article, such as a glove, wherein a butyl rubber solution is in the form of a dispersion, and methods of using butyl rubber based coating agents. | 2013-07-18 |
20130181368 | METHOD AND DEVICE FOR FORCIBLY INSERTING DROP INTO COMPRESSION MOLDING MACHINE, AND MOLDING DIE FOLLOW-UP TYPE METHOD AND DEVICE FOR SUPPLYING DROP - A method and device for continuously supplying molten synthetic resin drops into female moldings which are rotatingly movable for manufacturing moldings, wherein synthetic resin in molten condition extruded from an extrusion opening is cut by a cutter attached to a holding mechanism to form the molten resin into drops in a determined quantity, the drops are held and conveyed by the holding mechanism, and the drops are forcibly inserted and supplied into the concaves of the female moldings. At that time the holding mechanism on the rotary-and movable type drop supply is made to approach the rotating molding die and the rotation path of the holding mechanism is made to overlap with that of the molding die within a determined area to make the movement of the holding mechanisms follow that of the molding die. | 2013-07-18 |
20130181369 | ASSEMBLY AND PROCESS FOR CREATING AN EXTRUDED PIPE FOR USE IN A GEOTHERMAL HEAT RECOVERY OPERATION - The present invention discloses an assembly and process for creating a co-extruded pipe which includes the steps of extruding a first elongated component exhibiting an open interior. Additional process steps include co-extruding at least one, and typically a pair, of additional elongated components each having an arcuate or lobe cross sectional shape or profile. The additional components are bonded to exterior locations of the first component to establish a pair of additional open interiors between the components and prior to cooling and hardening. | 2013-07-18 |
20130181370 | METHOD AND A SYSTEM FOR HANDLING PROCESSED WET CLAY BRICKS - The various embodiments herein provide a method and system for handling wet clay bricks. The wet clay bricks are sectioned on the section table. The sectioned wet clay bricks are erected by an erect maker machine. The erect maker machine is connected to a stock maker machine to store a preset number of wet clay bricks. The wet clay bricks are loaded from the stock maker machine to an automatic loading and unloading tools, which is fixed to a shifting machine. The wet clay bricks are shifted through shifting vehicle to sunshiny locations and the wet clay bricks are unloaded to the ground from the shifting vehicle. Thus the embodiments herein provides a simple way to erect, load and unload wet clay bricks in a cost effective manner and also reduces the number of workers. | 2013-07-18 |
20130181371 | X-RAY DETECTABLE PLASTICS - Extrusion and compression molding methods for making X-ray detectable, resin-based material in stock shapes such as rods and sheets. The rods and sheets include barium sulfate in a concentration such that the structural properties of the resin are not materially altered from those of pure resin, but relatively small fragments of the material are X-ray detectable by conventional equipment, even at high line speeds. | 2013-07-18 |
20130181372 | MANUFACTURING PROCESS FOR FORMING A CHAIR BACK - An improved chair back is formed of a molded construction uses multiple mold shots of mold materials to develop different performance characteristics in selected areas of the chair back. The chair back has the appearance of a unitary molded panel, but is formed from multiple mold shots which preferably are performed at multiple stations on a mold tool. By providing multiple mold shots and selected materials to form different areas of the chair back, different performance characteristics are generated including the provision of a peripheral frame providing structural rigidity to the chair back, a lumbar support panel which provides localized support to the lumbar region of the chair occupant, and a thin sheet-like support panel extending between the frame and enclosing the interior region defined between the peripheral frame to provide a more flexible and pliant surface providing more comfortable contact with the occupant's back. | 2013-07-18 |
20130181373 | PROCESS FOR THE PRODUCTION OF A FIBER COMPOSITE COMPONENT OR HYBRID COMPONENT, AND ARRANGEMENT THEREFOR - A process and an arrangement for the production of a fiber composite or hybrid component comprising a preparation station in which an insert portion can be processed, a closing unit of an injection molding machine, having a cavity in which the processed insert portion is or can be arranged, an injection unit of the injection molding machine for the injection of molten plastic material into the cavity, with injection thereof around the insert portion arranged in the cavity, and a transport device by which the insert portion can be transported into the preparation station and into the cavity of the closing unit, wherein the insert portion remains in connected relationship with the transport device during processing in the preparation station, during transport to the closing unit and during injection therearound in the cavity. | 2013-07-18 |
20130181374 | MOLDING TOOL AND METHOD FOR MANUFACTURING A FIBER REINFORCED PLASTIC AERODYNAMIC AIRCRAFT COMPONENT - A molding tool for manufacturing a fiber-reinforced plastic aerodynamic aircraft component, which aircraft component, in order to form several bays arranged on the inside and delimited by an outer skin and spars arranged spaced apart from each other, in each case includes a multi-part mold core that matches the shape of the respective bay, wherein to conform to local skin reinforcements and/or spar reinforcements that extend into at least one of the bays, the multi-part mold core includes four or five core parts, of which two core parts comprising a triangular cross section are arranged along opposing edges of the bay, which edges interact with two or three core parts that fill the space between the two triangular core parts, which space extends diagonally relative to the bay. | 2013-07-18 |
20130181375 | METHOD OF FORMING A FRONTAL TOOTHING ON AN INNER RING OF A WHEEL HUB - A method including the steps of forming an inner ring of a wheel hub, by joining a spindle and an insert ring fitted onto the spindle, on a side of a first end of the spindle; axially blocking the insert ring on the spindle by plastically deforming the first end of the spindle that forms an upset collar therewith, which axially protrudes from the insert ring; frontally obtaining on the collar, on the side opposite to the insert ring, a frontal toothing by means of a single creator tool, towards the collar, with a toothing complementary to that to be obtained, by axially impressing onto the collar, in sequence, one or more teeth of the complementary toothing by eccentrically pushing the creator tool against the collar while the creator tool is held substantially coaxial to the wheel hub, thus acting peripherally in sequence on the whole creator tool. | 2013-07-18 |
20130181376 | METHOD OF FORMING A FRONTAL TOOTHING ON AN INNER RING OF A WHEEL HUB - A method including the steps of forming an inner ring of a wheel hub, by joining a spindle and an insert ring fitted onto the spindle, on a side of a first end of the spindle; axially blocking the insert ring on the spindle by plastically deforming the first end of the spindle to form an upset collar therewith, which axially protrudes from the insert ring; and after forming the upset collar, frontally obtaining on the collar, on the side opposite to the insert ring a frontal toothing by means of a single creator tool provided, towards the collar, with a toothing which is complementary to that to be obtained, by impressing onto the collar, in sequence, one or more teeth of the complementary toothing, which have ridges with a rounded profile having a curvature radius (R) varying in the direction of an axis of symmetry (A | 2013-07-18 |
20130181377 | SEALING OR DAMPING PROFILED ELEMENT - A sealing or damping profiled element for use in tunnel construction, construction at or below ground level, track superstructures and/or window façades and also a method for the production thereof. The sealing or damping profiled element ( | 2013-07-18 |
20130181378 | METHOD AND APPARATUS FOR MOLDING AN ARTICLE - An apparatus for molding an article. The apparatus includes a mold and a mold plate slidable between a first position and a second position within the mold. In the first position the mold plate creates an undercut feature in a molded article in the second position the molded article with the undercut feature may be easily removed from the mold without damaging the mold or the article. | 2013-07-18 |
20130181379 | Method of Electron-Beam Lithography with Correction of Corner Roundings - A method of electron-beam lithography by direct writing solves the reliability of design of etched components through rounding of the corners of contiguous patterns, notably in patterns to be etched of critical dimension of the order of 35 nm. The method determines critical patterns, and correction patterns by subtracting patterns of corrections of dimensions and of locations as a function of rounding of external or internal corners to be corrected and etching of the corrected design. The corrections may be by a correction model taking account of the parameters of the critical patterns. A correction of the proximity effects specific to these methods is also performed, by resizing of edges of blocks to be etched in combination optimized by the energy latitude with a modulation of the radiated doses. A rescaling and negation functions and eRIF functions may be used to optimize the parameters and the realization of the extrusion. | 2013-07-18 |
20130181380 | Method of Making a Polymeric Stent - An endoprosthesis is made by radially expanding and axially extending a polymer tube. Next, portions of the polymer tube are removed to form an open framework of struts that define a tubular body. The tubular body has an end segment and an intermediate segment adjoining the end segment. The end segment includes a circumferential series of closed cells having a first W-shape closed cell. The intermediate segment includes a circumferential series of closed cells having a second W-shape closed cell. There are linear link struts at opposite ends of the individual first and second W-shape closed cells. The linear link struts of the first W-shape closed cell are longer than linear link struts of the second W-shape closed cell. | 2013-07-18 |
20130181381 | POLYMER COMPOSITE MATERIAL WITH BIOCIDE FUNCTIONALITY - The present invention relates to a novel process for preparing organically modified sheet silicates in high purity. The process of the invention uses ion exchange resins for this purpose. | 2013-07-18 |
20130181382 | Use of a Polyvinyl Alcohol Sheet in a Thermoforming Process for Manufacturing Containers - Use of a poly(vinyl alcohol) sheet having either i) a thickness of at least 200 μm as a substrate having a reduced tendency to shrink back compared with the same poly(vinyl alcohol) sheet having a lesser thickness in a thermoforming process or ii) having a thickness of no more than 200 μm as a substrate in a vacuum forming process, to produce a pocket in a mould, wherein the mould comprises at least one protrusion or depression on at least one surface and further wherein any protrusion does not extend to or above the upper surface of the mould is provided. Also provided is process of producing a rigid pocket by a thermo-forming process or a non-rigid pocket by a vacuum-forming process. | 2013-07-18 |
20130181383 | MELT METALLURGICAL INSTALLATION COMPRISING A CHARGING ELEMENT - A melt metallurgical installation has a melting furnace for melting scrap metal and a charging region for the melting furnace which is located above the melting furnace. The installation further has a charging element, which has been filled with scrap metal intended for the melting furnace and can be moved in a movement direction into the charging region where it can be emptied and then moved again, in the empty state, against the movement direction out of the charging region. The charging region is enclosed by a hood such that the charging region, including the charging element which has been placed in the charging region, is closed at the top and on the sides. The hood has at least one upper extraction opening through which the waste gases and dust developing in the hood can be extracted out of the hood. | 2013-07-18 |
20130181384 | STAVE AND BRICK CONSTRUCTIONS HAVING REFRACTORY WEAR MONITORS AND IN PROCESS THERMOCOUPLES - A stave/brick construction, comprising: a stave having a plurality of ribs and a plurality of channels, wherein a front face of the stave defines a first opening into each of the channels; a plurality of bricks wherein each brick is insertable into one of the plurality of channels via its first opening to a position, upon rotation of the brick, partially disposed in the one channel such that one or more portions of the brick at least partially engage one or more surfaces of the one channel and/or of a first rib of the plurality of ribs whereby the brick is locked against removal from the one channel through its first opening via linear movement without first being rotated; and one or more wear monitors and/or thermocouples, wherein each wear monitor and thermocouple is disposed through or adjacent to the stave and/or one or more of the bricks. | 2013-07-18 |
20130181385 | LOG YOKE OR CUP - A workpiece support features a plurality of yokes ( | 2013-07-18 |
20130181386 | PNEUMATIC COUPLING MODULE, IN PARTICULAR FOR A ZERO-POINT CLAMPING SYSTEM FOR A MACHINE TOOL - The invention relates to a pneumatic coupling module, in particular for a zero-point clamping system, with a least one pneumatically operable coupling device, to which the pneumatic medium can be fed via a supply channel and which is constructed in such a manner that the coupling device occupies a release position in its pressurized state and a locked position in its non-pressurized state, wherein the coupling module comprises an interface area for coupling another pneumatic coupling module or a pneumatically operable working module. According to the invention, a directional valve is provided in the supply channel, comprising a first port, which is connected to a first part of the supply channel, which feeds the pneumatic medium, a second port, which is connected to a second part of the supply channel, which leads from the directional valve to the coupling device, and a third port, which is connected to a supply coupling channel, the at least one outlet opening of which is arranged in the interface area in such a manner that the outlet opening can be coupled in a substantially sealed manner to at least one inlet opening of a supply channel or a manifold supply channel of an additional pneumatic coupling module or pneumatically operated working device, wherein the directional valve connects the first and the second ports in a first switching position (“INTERNAL”) in such a manner that the first and second parts of the supply channel are connected and the coupling device is controlled to assume its release position and wherein the directional valve disconnects the first port from the third port in the first switching position, whereby no pneumatic medium can be fed to the supply coupling channel, and wherein the directional valve disconnects the second port from the first port in a second switching position (“EXTERNAL”) and connects the first and third ports in such a manner that the first part of the supply channel is connected to the supply coupling channel and pneumatic medium can be fed to the supply coupling channel and that no pneumatic medium can be fed via the second part of the supply channel to the coupling device and it is controlled to assume the locked position. The invention further pertains to a modular clamping position consisting of such coupling modules. | 2013-07-18 |
20130181387 | MACHINE HAVING AN AIR BEARING AND METHOD FOR OPERATING SUCH A MACHINE - A machine has a frame structure for moving a machine head in one or more spatial directions. The frame structure comprises an actuator and an air bearing for moving the head. The machine also comprises a compressed air feed connected to the air bearing for providing a compressed air flow. A restrictor defines the compressed air flow to the air bearing. The machine has a first operating state, in which a high compressed air flow is defined and in which the actuator can be actuated. The machine has a second operating state, in which a compressed air flow lower than the high compressed air flow is defined. In the second operating state, the actuator is secured against actuation from a closed-loop position controller, while the closed-loop position controller is maintained in operation. | 2013-07-18 |
20130181388 | EXPANDABLE WORKBENCH AND A METHOD OF USE - An expandable workbench that includes one or more expansion members slidingly connected to a frame, with the one or more expansion members expandable in a plane P between a first retracted position and a second expanded position. The workbench also includes a plurality of receiving members, each of which includes a receiving groove with a longitudinal axis L, with the longitudinal axis of the receiving grooves being at least pair wise parallel to each other and the plane P, and each of the one or more expansion members being equipped with one of the plurality of receiving members, such that the expansion members expand diagonally from the center of the frame. | 2013-07-18 |
20130181389 | PRINTING SYSTEM WITH SHEET CONVEYING DEVICE - A printing system includes a marking engine for applying a marking substance onto a sheet and a sheet conveying device. The sheet conveying device includes a belt arranged to carry sheets from an upstream end to a downstream end of a transport path, the belt having an array of perforations; an array of suction nozzles arranged below the belt for sucking-in ambient air through the perforations of the belt; and at least one blow nozzle arranged at the downstream end of the transport path for blowing out a gas through the perforations of the belt. The conveying device further includes an array of anti-friction blow nozzles interleaved with the array of suction nozzles and connected to a blower for blowing-out a gas towards the bottom surface of the belt during the traverse of the sheet along the marking engine. | 2013-07-18 |
20130181390 | IMAGE FORMING APPARATUS, CONTROL METHOD THEREFOR, AND COMPUTER-READABLE MEDIUM - An image forming apparatus which includes a plurality of feeding units each formed by an exchangeable part, and selects one of the plurality of feeding units based on priority levels of the plurality of feeding units in a feed operation, comprises: a monitoring unit which monitors a consumed level of the part forming the feeding unit; a notification unit which sends a notification to a user in a case where the monitoring unit detects that a life-time of the part has been reached; an ordering unit which orders the part before the monitoring unit detects that the life-time of the part has been reached; and a changing unit which changes the priority level of the feeding unit formed by the part being ordered to be lower than the priority levels of other feeding units. | 2013-07-18 |
20130181391 | MEDIUM FEEDING DEVICE AND RECORDING APPARATUS - A medium feeding device includes a first feeding unit feeds the medium to be fed to a downstream side of a feeding direction. A second feeding unit then feeds the medium to a upstream side and a downstream side on the basis of a feeding direction of the first feeding unit. A friction member is positioned opposite to the first feeding unit. A displacement member converts between a first state in which the displacement member protrudes upwardly in a stacked direction with respect to the friction member and a second state in which the displacement member retracts downwardly. The displacement member is set as the second state when one remaining sheet of the medium is fed to the downstream side by the first feeding unit, and the displacement member is set as the first state when a trailing end of the one remaining sheet passes through the friction member. | 2013-07-18 |
20130181392 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - The present invention is directed to a sheet feeding apparatus including a sheet feeding unit capable of feeding sheets stacked on a sheet stacking face of a sheet stack tray, wherein the sheet feeding unit includes a feeding roller configured to feed the sheets, a driving motor configured to rotate the feeding roller, a lifting member configured to move at least edges of the sheets in a direction of the feeding roller, a sheet-shaped member connected to a front end of the lifting member at the downstream side, and a counter member disposed opposite to the feeding roller to pinch the sheet-shaped member, wherein, when the feeding roller is rotated, the sheet-shaped member is moved to the downstream side to cause the lifting member to move, and when the sheets are brought into contact with the feeding roller, the contacted uppermost sheet is fed by the feeding roller. | 2013-07-18 |
20130181393 | MEDIUM TRANSPORT DEVICE, POST-PROCESSING DEVICE, AND IMAGE FORMING APPARATUS - A medium transport device includes a stack portion having a stack surface, a medium being stacked on the stack surface, a guide portion provided at the stack surface, the guide portion extending in a width direction intersecting with a transport direction, the medium being transported in the transport direction, an alignment member supported movably along the guide portion, the alignment member contacting the medium and aligning a position of the medium stacked on the stack surface, and an urging member arranged between the alignment member and the stack portion, the urging member urging the alignment member to the stack surface. | 2013-07-18 |
20130181394 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus, including: a sheet conveying path; a reconveying path, which is branched from the sheet conveying path; a sheet conveying portion which conveys a sheet, which is conveyed through the sheet conveying path, selectively between in a forward direction and in a reverse direction toward the reconveying path; and a control portion which controls the sheet conveying portion to temporarily convey, in the middle that the sheet conveying portion conveys a preceding sheet in the reverse direction toward the reconveying path, the preceding sheet in the forward direction together with a succeeding sheet, and thereafter convey the preceding sheet in the reverse direction toward the reconvening path and the succeeding sheet in the forward direction respectively. | 2013-07-18 |
20130181395 | METHOD FOR FEEDING SHEETS TO A PRINTING TECHNOLOGY MACHINE - A method for feeding sheets to a printing technology machine improves reliability of feeding sheets and reduces an acceleration time from a base speed to a production speed. The sheets are conveyed onto a feed table in shingled formation by a first drive and are individually and successively conveyed from the feed table to a first processing station of the machine by a second drive. The sheets are conveyed onto the feed table before an acceleration of the second drive to production speed is completed and the first drive is accelerated to the production speed when the processing station has reached the production speed. | 2013-07-18 |
20130181396 | Automatic Online Defective Elements-Checking-and-Removing Device for Flexographic Printing Presses - The invention of automatic online defective elements checking and removing device relates to flexographic printing presses. Between a first vacuum conveying platform and a second vacuum and separating-conveying platform on the top of a mobile frame is provided a defective elements remover including a defective removing air ejector operated by a valve, which receives output signal from the online computerized visual QC station at the flexographic printing press and a receiver for carrying the ejected elements away from the platforms. Under the mobile frame is provided a vacuum pump and vacuum distribution tube connected each other with steel wire enforced hose and a ball valve is used to adjust the vacuum in order to prevent the printed labels from drifting on the conveyor belts. Both of the platforms are separately driven by motors and via toothed belts. | 2013-07-18 |
20130181397 | Apparatus and Method for Triple-Gate Diverter - Apparatus and methods for handling items of currency using a triple gate diverter are provided. An apparatus is provided that comprises first, second and third diverter members ( | 2013-07-18 |
20130181398 | Pinball Machine with Controllable Lighting Elements - Pinball machines with controllable lighting components. In some embodiments, a method may include electronically determining a physical property of a ball, the ball configured to move within a playfield of a pinball machine during a pinball game, and modifying a characteristic of a light emitted by a pinball target in response to an evaluation of the physical property. In other embodiments, a pinball machine may be configured to identify a state or mode of a game, and to control a light emitted by a pinball target located within the playfield in response to the state or mode, thus providing a visual indication of the state or mode. In yet other embodiments, a pinball target may include a substrate configured to receive impact from a ball during a game and a light element embedded within the substrate, the light element configurable to emit a light having a controllable property. | 2013-07-18 |
20130181399 | Deploying Components in a Pinball Machine - Systems and methods for deploying components within pinball machines. In some embodiments, a device may include a physical object coupled to an actuator via a flexible link, the physical object configured to interact with a pinball within a playfield of a pinball machine under control of the actuator. In other embodiments, a pinball machine may include a physical object configured to directly or indirectly interact with a pinball during a pinball game, the physical object coupled to an area within a playfield of the pinball machine other than a playable surface accessible to the pinball during a pinball game, the physical object suspended above the playable surface. In yet other embodiments, a pinball machine may include a plastic playfield cover configured to cover a playfield of the pinball machine, the plastic playfield cover configured to provide a player with access to one or more physical objects within the playfield. | 2013-07-18 |
20130181400 | Game Machine - A game machine includes: an entertainment button that can move up and down from a normal operation position to a protruding position; an assigned object determining part that determines an assigned object; a prize determining part that determines a prize to be given to a player, when the assigned object determining part determines an assigned object; a prize display part that displays a prize symbol corresponding to the prize determined by the prize determining part; a movement determining part that determines whether or not to move the entertainment button from the normal operation position to the protruding position; a drive control part to move the entertainment button from the normal operation position to the protruding position, when the movement determining part determines to move the entertainment button from the normal operation position to the protruding position; and a push operation detecting part that detects the entertainment button being pushed down. | 2013-07-18 |
20130181401 | Multi-Tier Card Shuffler - A random number generator for a game of chance includes a plurality of rotating structures. Each of the plurality of rotating structures includes a plurality of slots uniformly spaced about a center axis thereof. The random number generator includes a set of cards that are equal in number to the total number of slots such that one card is disposed in each of the slots. The generator also includes at least one detent mechanism for identifying a single card on at least one of the plurality of rotating structures. | 2013-07-18 |
20130181402 | MUSICAL PITCH BOARD GAME - Musical pitch board games are described. One embodiment includes a game having a game board with a first rectangular path of colored musical notation spaces including a start space, a plurality of groups of musical notation spaces, each group having a different color, one or more rest spaces, at least one pair of repeat bars, and a winner space. The game board can also have a second rectangular path of colored musical notation spaces, the second rectangular path having fewer spaces between the start space and the winner space than the first rectangular path. The game can also include a plurality of playing pieces, a plurality of song word question cards and a note remote device. Players can advance on the game board by successfully choosing the correct pitch of a song lyric word as recorded by the original record artist of the song. | 2013-07-18 |
20130181403 | GAME - A game is disclosed. The game includes two or more tiers or levels in which a player must achieve certain benchmarks or goals at each tier to advance to the next tier, whereby each tier of the game represents a certain phase or definable segment in a person's life based upon one or more of the following: career goals; personal goals; educational goals or geographic location. | 2013-07-18 |
20130181404 | Baccarat Game With Insurance Side Bet - A method of playing a baccarat game having an additional insurance offering step providing an opportunity to place an insurance wager before a player hand and a banker hand are dealt. Any insurance wager placed by a participant is resolved according to a plurality of insurance side bet rules including: paying out any insurance wager in response to a primary wager being placed on a player win and an ultimate banker victory resulting from the banker hand score of nine, paying out any insurance wager in response to the primary wager being placed on a banker win and an ultimate player victory resulting from the player hand score of nine, and a push of any insurance wager in response to a tie resulting from the player hand score and the banker hand score of nine. | 2013-07-18 |
20130181405 | Method of Conducting a Racing Series - A method of conducting a racing series for competitors and team owners is disclosed. The racing series has a plurality of races divided into a first and second set of races with competitors racing in both sets of races. The competitors and team owners are awarded points after each race, with those points being adjusted between the two sets of races. The points of only a predetermined number of competitors and/or team owners are adjusted between the sets of races. Awards, including a championship, are awarded based on the points accumulated during the racing series. | 2013-07-18 |
20130181406 | APPARATUS AND METHODS FOR PLACING AND ATTACHING FORMED FILTERS INTO BREWING CUPS - A filter setting and sealing apparatus includes a wobble plate mounted to press a filter edge into a plane defined by the top rim of a brew cup. A sealer defined by expandable sealer jaws is moveable into the filter. The jaws are actuated for radial outward expansion to seal the filter to the cup proximate the filter rim and cup edge. A second sealer is used to seal any gaps remaining in the seal after initial sealing. Methods are disclosed. | 2013-07-18 |
20130181407 | APPARATUS FOR ATTACHING SUBSTRATES AND GAP CONTROL UNIT THEREOF - An apparatus for attaching substrates includes a first chamber for supporting a first substrate and a second chamber for supporting a second substrate. A main seal member is placed between the first chamber and the second chamber so as to maintain a seal and a gap between the chambers. An alignment control part is placed between the first chamber and the second chamber so as to maintain the seal, and also to allow the second chamber to move with respect to the first chamber in order to align the substrates. The alignment control part may also control a gap between the chambers, to thereby maintain a uniform gap between the substrates. | 2013-07-18 |
20130181408 | BRUSH SEAL ARRANGEMENT COMBINED WITH HONEYCOMB SEAL - A hybrid seal carrier for establishing a seal between a rotating component and a stationary component substantially surrounding the rotating component includes a first seal element held between forward and aft end plates and adapted to be seated within a first slot formed in the stationary component. A second seal element is seated within a second slot formed in one of the forward or aft end plate; wherein said first seal element comprises a plurality of bristles forming a brush seal; and said second seal element comprises at least one honeycomb seal. | 2013-07-18 |
20130181409 | PISTON RING HAVING A THERMALLY SPRAYED COATING AND METHOD FOR PRODUCING SAME - A method for producing a piston ring for an internal combustion engine includes providing, a substrate and applying a coating by means of thermal spraying of a powder including solid lubricants on the substrate, having the elemental proportions of 15-30% by weight of iron, Fe; 15-30% by weight tungsten, W; 25-35% by weight of chromium, Cr; 10-35% by weight of nickel, Ni; 1-5% by weight of molybdenum, Mo; 0.2-3% by weight of aluminum, Al; 3-20% by weight of copper, Cu; 1-10% by weight of carbon, C; 0.1-2% by weight of sulfur, S; and 0.1-2% by weight of silicon, Si. The resultant piston ring and coating are also provided. | 2013-07-18 |
20130181410 | INTERNAL COMBUSTION ENGINE OIL RING - A high-quality internal combustion engine oil ring which stably keeps oil consumption low for a long period and in which the shapes of an upper rail and a lower rail can be formed at low cost with high accuracy. The internal combustion engine oil ring has a recessed stepped portion formed at a corner of a sliding surface of an outer peripheral sliding projection in sliding contact with a cylinder inner wall surface of at least one of a first rail and a second rail constituting an oil ring main body, in a shape in vertical cross-section along a sliding direction of the first rail and second rail, and a wall surface of the recessed stepped portion has an arcuate surface having a radius of curvature of 0.02 mm to 0.08 mm. | 2013-07-18 |
20130181411 | METHOD FOR PRODUCING A PISTON RING - A piston ring, is produced by providing, on the radially outer circumferential surface of a ring-shaped metallic main body, a recess, the metallic main body having a radially outer circumferential surface, a radially inner circumferential surface, and flank surfaces interposed therebetween providing the recess with a contour that deviates from a cylindrical shape at least on the bottom of the recess, providing at least one wear-resistant layer on the outer circumferential surface, including the recess, and at least partially removing an area of the at least one wear-resistant layer on the outer circumferential surface and including an area corresponding to a scraping edge, thereby forming a land having a predefinable width. | 2013-07-18 |
20130181412 | SHAFT SEALING APPARATUS AND ROTATING MACHINE EQUIPPED THEREWITH - Provided is a shaft sealing apparatus that is installed in an annular space between a rotor and a stator in a rotating machine and that divides the annular space into a low-pressure side region and a high-pressure side region in an axial direction of the rotor. The shaft sealing apparatus includes a seal body formed by stacking a plurality of thin seal pieces, which extend from the stator toward a radial inner side of the rotor, in a circumferential direction of the rotor, and lateral plates having a surface facing the axial direction and curved and extending in a circumferential direction of the annular space. The seal body is welded to the surfaces of the lateral plates which face the axial direction so that the seal body follows a curved shape of the lateral plates. | 2013-07-18 |
20130181413 | SPRING LOADED SEAL ASSEMBLY FOR TURBINES - A spring loaded seal assembly is disclosed for sealing a gap between adjacent turbine components. The seal assembly may generally include a turbine seal and a spring member. The turbine seal may extend between the adjacent turbine components and may be configured to seal the gap defined between the turbine components. The spring member may be configured to engage the turbine seal so as to maintain the seal in sealing engagement with the adjacent turbine components. | 2013-07-18 |
20130181414 | Articulating Oscillating Power Tool - An oscillating power tool includes a tool head which can be articulated through a range of positions including zero to ninety degrees. The tool head can accept a variety of accessory tools which move in a reversing angular displacement as well as articulate throughout the range of positions. | 2013-07-18 |
20130181415 | TELESCOPING CYLINDER DEVICE AND VEHICLE - A telescoping cylinder device including double-walled cylinders is disclosed. By way of a pressure medium, the cylinders are displaceable relative to each other by moving inside the space formed between the two walls. A central through hole extends axially through the cylinders and provide a passage for transmission. A vehicle including a plurality of telescoping cylinder devices is also disclosed. | 2013-07-18 |
20130181416 | TARPAULIN HAULING DEVICE - A tarpaulin has a forward hauling rig comprising a light weight bar attached to and reinforcing the forward edge. A rigid metal hauling bar is connected by springs to the forward edge. A hauling rig has a chain and steel ring which attaches to a motorized lawn mower or tractor for hauling. An extension hauling rig has a hook attached to the ring and another chain and ring which attaches to a belt worn by an animal or person for hauling. Elongated elements at a back end of the tarpaulin form the back end into a funnel tube for emptying the tarpaulin. | 2013-07-18 |
20130181417 | SNOWBOARD TRAINING DEVICE - A snowboard training device, including: a board; a first wheel assembly connected to an underside of the board and including first and second pairs of rotatable wheels with first and second axis of rotation, respectively; and a second wheel assembly connected to the underside of the board and including third and fourth pairs of rotatable wheels with third and fourth axis of rotation, respectively. The first and second axis are non-parallel. The third and fourth axis are non-parallel. The first and second portions of the first and second wheel assemblies, respectively, are displaceable with respect to the board. | 2013-07-18 |
20130181418 | Hand Truck - A hand truck for carrying and lifting a load comprising spaced vertical columns each having a channel. Rollers are captured in each of said channels that are capable of vertical movement along its respective channel. A first toe plate is affixed to said columns and adapted to extend horizontally during use. A second toe plate is attached to the rollers and adapted to move vertically along said columns between upper and lower positions. The first and second toe plates are in nesting relationship when the second toe plate is in its lower position. | 2013-07-18 |
20130181419 | FOOD PAN CARRIER - A food pan carrier has a pan carrier body with a wheeled dolly attached thereto. The wheeled dolly is connected with at least one fastener. The wheeled dolly is removably connected to the food pan carrier body so that it may be easily connected and disconnected therefrom. | 2013-07-18 |
20130181420 | THREE-WHEELED MOTOR VEHICLE WITH HIGH SAFETY - A three-wheeled motor vehicle includes a main body, two shafts, two wheel bases, a blocking structure fixed to the main body and a linkage module. Each shaft has first, second and third pivot points. The third pivot point between the first and second pivot points is pivoted to the main body. One wheel base is pivoted to the first pivot points. The other wheel base is pivoted to the second pivot points. The wheel bases and the shafts form a parallelogram four bar mechanism. The linkage module is coupled between the main body and the parallelogram four bar mechanism. When the main body tilts as the three-wheeled motor vehicle turning, the linkage module changes from a first state to a second state to drive the wheel bases to tilt. | 2013-07-18 |
20130181421 | PIVOT BEARING WITH TURNED DAMPER CLAMPING - Pivot bearing for a wheel suspension, in particular for a front axle of a motor vehicle, containing a wheel bearing receiver, a steering arm, a spring strut receiver with a damper clamping and a carrier rib, wherein the damper clamping of the spring strut receiver faces the vehicle outside and the pivot bearing has an opening in the region between the wheel bearing receiver and the damper clamping. | 2013-07-18 |
20130181422 | TRAILING BEAM MOUNTING AND ALIGNMENT APPARATUS - The present invention provides an eccentric pivot member for effecting fore and aft movement of a leading end of a trailing beam member of a trailing beam suspension in response to rotation of the pivot member. Ratchet collars are provided which act between the eccentric pivot member and a suspension hanger to mechanically secure the assembly against rotation and any associated inadvertent misalignment. | 2013-07-18 |