| 25th week of 2010 patent applcation highlights part 57 |
| Patent application number | Title | Published |
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| 20100159693 | Method of Forming Via Recess in Underlying Conductive Line - A method of fabricating a semiconductor device includes forming a via in a dielectric layer that opens to a conductive line underlying the dielectric layer, and forming a via recess in the conductive line at the via. The via recess in the conductive line has a depth ranging from about 100 angstroms to about 600 angstroms. Via-fill material fills the via recess and at least partially fills the via, such that the via-fill material is electrically connected to the conductive line. The via recess may have a same size or smaller cross-section area than that of the via, for example. Such via structure may be part of a dual damascene structure in an intermetal dielectric structure, for example. | 2010-06-24 |
| 20100159694 | METHOD FOR DEPOSITING THIN TUNGSTEN FILM WITH LOW RESISTIVITY AND ROBUST MICRO-ADHESION CHARACTERISTICS - Methods of forming low resistivity tungsten films with good uniformity and good adhesion to the underlying layer are provided. The methods involve forming a tungsten nucleation layer using a pulsed nucleation layer process at low temperature and then treating the deposited nucleation layer prior to depositing the bulk tungsten fill. The treatment operation lowers resistivity of the deposited tungsten film. In certain embodiments, the depositing the nucleation layer involves a boron-based chemistry in the absence of hydrogen. Also in certain embodiments, the treatment operations involve exposing the nucleation layer to alternating cycles of a reducing agent and a tungsten-containing precursor. The methods are useful for depositing films in high aspect ratio and/or narrow features. The films exhibit low resistivity at narrow line widths and excellent step coverage. | 2010-06-24 |
| 20100159695 | METHOD OF FABRICATING DISPLAY DEVICE - Disclosed is a method of fabricating a display device. The method includes providing a substrate in which a display region and a pad region formed around the display region are defined, forming a conductive layer on the substrate, forming a mask pattern by rolling a roller on the conductive layer, and patterning the conductive layer using the mask pattern to form a line in the display region and a pad in the pad region. The pad is formed of a pattern having a second width corresponding to a first width of the line. | 2010-06-24 |
| 20100159696 | MICROLENS MASK OF IMAGE SENSOR AND METHOD FOR FORMING MICROLENS USING THE SAME - Provided are a microlens mask of an image sensor and a method for forming a microlens using the same. In the method, an insulating layer is formed on a semiconductor substrate comprising a photodiode and a transistor. A passivation layer is formed on the insulating layer. A color filter layer is formed on the insulating layer vertically corresponding to the photodiode through the passivation layer. A microlens photoresist layer is formed over an entire surface of the semiconductor substrate. A microlens mask is formed on the microlens photoresist corresponding to the color filter layer. A one-time exposure process is performed at a light intensity of about 450/0 to about 550/0 dose/focus. The microlens photoresist layer is patterned to form a patterned microlens photoresist layer by removing the photoresist subjected to the exposure process. The patterned microlens photoresist layer is reflowed to form the microlens. | 2010-06-24 |
| 20100159697 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device may include forming a first oxide film, a nitride film and/or a second oxide film over a substrate, and may include forming a trench over a semiconductor substrate by etching a portion of a first oxide film, a nitride film, a second oxide film and/or a semiconductor substrate. A method of manufacturing a semiconductor device may include performing wet etching to form a divot, which may be performed over a semiconductor substrate having a trench, and/or which may expose a portion of a nitride film. A method of manufacturing a semiconductor device may include removing a second oxide film having a portion thereof etched and a portion of a first oxide film exposed by a divot, while rounding upper edge portions of a trench using a mixed solution of deionized water and HF. A semiconductor device formed by a method is disclosed. | 2010-06-24 |
| 20100159698 | Combination, Method, and Composition for Chemical Mechanical Planarization of A Tungsten-Containing Substrate - A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high. | 2010-06-24 |
| 20100159699 | SANDBLAST ETCHING FOR THROUGH SEMICONDUCTOR VIAS - To provide selective exposure of the TSV tip through a semiconductor wafer without undercut, the inventor has developed a new method of semiconductor device formation. An embodiment of the present teachings can include the use of sandblasting to remove a portion of the semiconductor wafer to expose the TSV tip without the need for additional wet and/or dry etching. | 2010-06-24 |
| 20100159700 | Method for Fabricating Cylinder Type Capacitor - A method for fabricating a cylinder type capacitor includes forming connection contacts passing through a lower layer over a semiconductor substrate; forming a mold layer covering the connection contacts; forming a first floated pinning layer with a stress in a first direction over the mold layer; forming a second floated pinning layer for stress relief with a stress in a second direction over the first floated pinning layer, said second direction being opposite to the first direction; forming opening holes passing through the first and second floated pinning layers and the mold layer and exposing the connection contacts; forming storage nodes following a profile of the opening holes; removing portions of the first and second floated pinning layers to form a floated pinning layer pattern, the floated pinning layer pattern exposing a portion of the mold layer and contacting upper tips of the storage nodes; exposing outer walls of the storage nodes by selectively removing the exposed mold layer; and forming a dielectric layer and an upper electrode over the storage node. | 2010-06-24 |
| 20100159701 | EXPOSURE MASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A method for manufacturing a semiconductor device comprises performing an exposing and developing process using an exposure mask including shading patterns and assistant patterns arranged in parallel to the shading patterns to prevent a scum phenomenon generated when a main pattern is formed in a cell region over a semiconductor substrate, thereby improving characteristics, reliability and yield of the semiconductor device. As a result, the method enables high-integration of the semiconductor device. | 2010-06-24 |
| 20100159702 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A first film and a second film are formed on a semiconductor substrate in this order. A resist pattern is formed on the second film. An opening is formed by removing the second film exposed between the resist pattern at a state where the second film remains on the bottom. A first removal preventing film is formed on the side wall of the opening and the residual film is removed at a state where the projecting part of the second film protruding from the side wall to the opening remains. The first film exposed in the opening is removed. A second removal preventing film is formed on the first removal preventing film and the surface of the semiconductor substrate exposed in the opening is removed at a state where the projecting part of the semiconductor substrate protruding from the side wall to the opening remains and a round part is formed at the projecting part of the semiconductor substrate. The semiconductor substrate exposed in the opening is further removed. | 2010-06-24 |
| 20100159703 | METHODS AND APPARATUS FOR DUAL CONFINEMENT AND ULTRA-HIGH PRESSURE IN AN ADJUSTABLE GAP PLASMA CHAMBER - A plasma processing system having a plasma processing chamber configured for processing a substrate is provided. The plasma processing system includes at least an upper electrode and a lower electrode for processing the substrate. The substrate is disposed on the lower electrode during plasma processing, where the upper electrode and the substrate forms a first gap. The plasma processing system also includes an upper electrode peripheral extension (UE-PE). The UE-PE is mechanically coupled to a periphery of the upper electrode, where the UE-PE is configured to be non-coplanar with the upper electrode. The plasma processing system further includes a cover ring. The cover ring is configured to concentrically surround the lower electrode, where the UE-PE and the cover ring forms a second gap. | 2010-06-24 |
| 20100159704 | METHOD FOR ETCHING A SAMPLE - The invention provides a method for performing mass production processing of etching a sample capable of maintaining a stable processing profile. The method for performing mass production processing of etching for subjecting a wafer carried into a vacuum processing reactor to plasma processing uses an apparatus comprising a vacuum processing chamber, a gas supply apparatus, a plasma generating means for generating plasma, an emission spectroscope for monitoring the plasma emission, and a device for storing the emission spectrum, wherein a non-operating time of the apparatus (idling SS) occurs in which the mass production processing of the wafer is temporarily stopped, wherein during cleaning steps S | 2010-06-24 |
| 20100159705 | METHOD OF PLASMA ETCHING GA-BASED COMPOUND SEMICONDUCTORS - A method of plasma etching Ga-based compound semiconductors includes providing a process chamber and a source electrode adjacent thereto. The chamber contains a Ga-based compound semiconductor sample in contact with a platen which is electrically connected to a first power supply, and the source electrode is electrically connected to a second power supply. SiCl | 2010-06-24 |
| 20100159706 | METHOD OF PLASMA ETCHING GA-BASED COMPOUND SEMICONDUCTORS - A method of plasma etching Ga-based compound semiconductors includes providing a process chamber and a source electrode adjacent to the process chamber. The process chamber contains a sample comprising a Ga-based compound semiconductor. The sample is in contact with a platen which is electrically connected to a first power supply, and the source electrode is electrically connected to a second power supply. The method includes flowing SiCl | 2010-06-24 |
| 20100159707 | GAS DISTRIBUTION SYSTEM HAVING FAST GAS SWITCHING CAPABILITIES - A gas distribution system for supplying different gas compositions to a chamber, such as a plasma processing chamber of a plasma processing apparatus is provided. The gas distribution system can include a gas supply section, a flow control section and a switching section. The gas supply section provides first and second gases, typically gas mixtures, to the flow control section, which controls the flows of the first and second gases to the chamber. The chamber can include multiple zones, and the flow control section can supply the first and second gases to the multiple zones at desired flow ratios of the gases. The gas distribution system can continuously supply the first and second gases to the switching section and the switching section is operable to switch the flows of the first and second gases, such that one of the first and second process gases is supplied to the chamber while the other of the first and second gases is supplied to a by-pass line, and then to switch the gas flows. The switching section preferably includes fast switching valves operable to quickly open and close to allow fast switching of the first and second gases, preferably without the occurrence of undesirable pressure surges or flow instabilities in the flow of either gas. | 2010-06-24 |
| 20100159708 | Method for forming required pattern on semiconductor substrate by thermal reflow technique - The invention is disclosed that pattern on semiconductor substrate is fabricated by thermal reflow technique. Also, the pattern on semiconductor substrate having different sub-micron spacings can be fabricated by using different time for the thermal reflow technique process. | 2010-06-24 |
| 20100159709 | MASK PATTERN CORRECTING METHOD, MASK PATTERN INSPECTING METHOD, PHOTO MASK MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A pattern correcting method for correcting a design pattern to form a desired pattern on a wafer is disclosed, which comprises defining an allowable dimensional change quantity of each of design patterns, defining a pattern correction condition for the each design pattern based on the allowable dimensional change quantity defined for the each design pattern, and correcting the each design pattern based on the pattern correction condition defined for the each design pattern. | 2010-06-24 |
| 20100159710 | Semiconductor manufacturing apparatus, liquid container, and semiconductor device manufacturing method - A semiconductor manufacturing apparatus comprises a discharge portion discharging a coating liquid onto a substrate; a gas supply tube supplying an inert gas into a liquid container that contains the coating liquid, and pressurizing an interior of the liquid container; a coating liquid supply tube airtightly supplying the coating liquid from the liquid container to the discharge portion using pressurization from the gas supply tube; a first connecting portion capable of attaching and detaching the liquid container to and from the coating liquid supply tube; a second connecting portion capable of attaching and detaching the liquid container to and from the gas supply tube; and a solvent supply tube supplying a solvent, which can dissolve the coating liquid, to the first connecting portion. | 2010-06-24 |
| 20100159711 | PRECURSOR ADDITION TO SILICON OXIDE CVD FOR IMPROVED LOW TEMPERATURE GAPFILL - Methods of depositing silicon oxide layers on substrates involve flowing a silicon-containing precursor, an oxidizing gas, water and an additive precursor into a processing chamber such that a uniform silicon oxide growth rate is achieved across the substrate surface. The surface of silicon oxide layers grown according to embodiments may have a reduced roughness when grown with the additive precursor. In other aspects of the disclosure, silicon oxide layers are deposited on a patterned substrate with trenches on the surface by flowing a silicon-containing precursor, an oxidizing gas, water and an additive precursor into a processing chamber such that the trenches are filled with a reduced quantity and/or size of voids within the silicon oxide filler material. | 2010-06-24 |
| 20100159712 | Method of determining a target mesa configuration of an electrostatic chuck - A method of modifying the heat transfer coefficient profile of an electrostatic chuck by configuring the areal density of a mesa configuration of an insulating layer of the chuck is provided. A method of modifying the capacitance profile of an electrostatic chuck by adjustment or initial fabrication of the height of a mesa configuration of an insulating layer of the chuck is further provided. The heat transfer coefficient at a given site can be measured by use of a heat flux probe, whereas the capacitance at a given site can be measured by use of a capacitance probe. The probes are placed on the insulating surface of the chuck and may include a plurality of mesas in a single measurement. A plurality of measurements made across the chuck provide a heat transfer coefficient profile or a capacitance profile, from which a target mesa areal density and a target mesa height are determined. The target density and height are achieved mechanically; the target density by mechanically adjusting the areal density of existing mesas; and the target height by creating or deepening low areas surrounding planned or existing mesas, respectively. This can be accomplished using any of known techniques for controlled material removal such as laser machining or grit blast machining on an X-Y table. | 2010-06-24 |
| 20100159713 | APPARATUS FOR AND METHOD OF MAGNETICALLY COUPLING STANDARD ELECTRICAL PLUGS - An adapter includes a device-side component and a wall-side component. The device-side component has a male socket receptacle to receive an electrical plug and a male socket opposite the male socket receptacle. The wall-side component has a female socket plug to insert into an electrical outlet and a female socket opposite the female socket plug. The male socket is configured to interface with the female socket, regardless of orientation of the male socket with respect to the female socket. | 2010-06-24 |
| 20100159714 | APPARATUS AND METHODS - Apparatus configured to be foldable from an unfolded configuration into an in-use folded configuration. The apparatus, when in the unfolded configuration, comprising: a flexible substrate having first and second opposing ends with respective first and second connectors located at respective first and second opposing ends; and a third connector located on the flexible substrate between the first and second opposing ends. The apparatus is configured to be folded from the unfolded configuration into the in-use folded configuration to bring the first and second connectors together. | 2010-06-24 |
| 20100159715 | CONNECTOR WITH STORAGE FUNCTION - A connector with storage function includes a housing, a seat body, a terminal group, a storage module, and a cover. The housing has a receptacle at a front end, and an opening at a rear end. The seat body is disposed in the housing, and includes a block. The block has a supporting portion and a plurality of slots. The terminal group is disposed on the supporting portion and in the slot. The terminal group further includes a hollow opening at a rear end. The storage module electrically connects with the terminal group, and has a printed circuit board disposed thereon. The printed circuit board electrically connects with a storage unit. The cover has a first cover and a second cover and is disposed in the hollow opening of the seat body. The connector not only stores data required by electronic product, but also increases storage capacity of the electronic product. | 2010-06-24 |
| 20100159716 | Connector For Interconnecting Surface-Mount Devices and Circuit Substrates - The invention relates to a connector for electrically connecting at least one terminal arranged on a surface of a surface-mount device to a corresponding substrate contact of a circuit substrate. The connector for electrically includes at least one resilient electrically conductive interconnection element being connectable to the at least one substrate contact and configured to establish a releasable electrical contact with the at least one terminal, and a connector housing for mounting the at least one interconnection element. The interconnection element is affixed to the housing by means of a foil-shaped carrier. | 2010-06-24 |
| 20100159717 | Board-To-Board Connector - A board-to-board connector is disclosed. The connector has first and second connectors. The first connector has concave insertion portions in which first terminals are arranged. The second connector is configured to be engaged, by fitting, with the first connector. The second connector has convex insertion portions in which second terminals are arranged and which are inserted in the concave insertion portions. | 2010-06-24 |
| 20100159718 | Coaxial Connector - A coaxial connector for connecting a first printed circuit board to a second printed circuit board is disclosed. The coaxial connector has an inner conductor, an outer conductor, and a dielectric at least partially disposed between the inner conductor and the outer conductor. Each of the inner conductor, the outer conductor, and the dielectric is compressible. | 2010-06-24 |
| 20100159719 | PACKAGE STRUCTURE - A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board. | 2010-06-24 |
| 20100159720 | ELECTRICAL CONNECTOR CONFIGURED WITH CONVERTIBLE COVER MEMBER - An electrical connector adapted for being mounted on a printed circuit board includes a base member loaded with a plurality of contacts therein and defining a mounting face confronting with the printed circuit board on which the base member is mounted, a cover member pivotally supported at a rear end of the base member and rotating between a closed position and an opened position. The cover member covers on the base member in a closed position and rotates to the opened position to define a mating cavity adapted for receiving a counter connector. The mating cavity includes a first mating face defined on the base member and parallel to the mounting face and a second mating face defined on the cover member defined on the cover member and parallel to the mounting face. | 2010-06-24 |
| 20100159721 | Electrical Metal Clad Connectors and Methods of Use - A cable connector may be disclosed. The connector may include a connector housing having a first threaded portion and an insert having compression voids. The insert may be configured for insertion into the connector housing. The connector may also include a compression nut configured to engage the first threaded portion. The compression nut may be configured to compress the insert to close the compression voids when the compression nut engages the first threaded portion. The cable connector may also include an end stop having an adjustable throat diameter configured to adjust in proportion to an adjustable inner diameter of the cable connector as the connector engages or armor of an armored cable. | 2010-06-24 |
| 20100159722 | SAFETY SOCKET - The present invention pertains to a safety socket including a housing providing a top cover shell, a plurality of metal electrodes therein adapted for prongs of a plug as well as sets of jacks on the top cover shell relative to the electrode. Wherein, on the reverse side of the top cover shell, protected panels and resumption assemblies are pivoted thereon. The protected panels further have apertures arranged adapted for the jacks, and the resumption assemblies are positioned at an orientation against ramps to render the jacks closed while there is a juxtaposition between the ramps on the protected panels and the jacks. By the blocked jacks under the cooperation of the protected panels and the resumption assemblies, children would not desire to poke the jacks with articles, so as to efficiently prevent them from touching electricity-friendly elements and from the accident of electric shock. | 2010-06-24 |
| 20100159723 | CARD EDGE CONNECTOR - A card edge connector comprises an insulating housing provided with a plurality of terminals, an actuator, an engaging member and a force transmitter. The insulating housing comprises at least one end tower disposed at an end thereof The actuator includes a push arm substantially linearly movable within the end tower. The engaging member, pivoted to rotate within the end tower, is configured to secure an inserted card and to eject the inserted card. The force transmitter, pivoted to rotate within the end tower, is able to engage with the push arm of the actuator and the engaging member. The force transmitter is actuated by the actuator to apply a force to rotate the engaging member and change a direction of the force in response to rotation of the engaging member. | 2010-06-24 |
| 20100159724 | Card connector with double cam - A card connector includes a housing having a receptacle to receive therein a card in an insertion direction and the card has a terminal member. A connection terminal is secured to the housing and is configured to contact the terminal member of the card. A card ejecting action detecting switch is configured to detect when the card is ejected from the housing. A card guide mechanism is provided with an urging member for urging the card in a direction opposite the insertion direction. The card guide mechanism is configured to hold the card at a locked position to ensure that the terminal member of the card is in contact with the connection terminal and to permit movement of the card in the opposite direction by a pushing force exerted on the card in the insertion direction. The card guide mechanism ejects the card after performing a pushing action on the card a plurality of times. | 2010-06-24 |
| 20100159725 | Separable Loadbreak Connector and System for Reducing Damage Due to Fault Closure - Separable loadbreak connectors include an interference element spaced about the contact tube that is configured to engage a portion of a connector piston. | 2010-06-24 |
| 20100159726 | WIRING SYSTEM AND CONNECTOR THEREFOR - A wiring system that allows easy installation into a vehicle and includes a connector that allows functional signals to perform a function in a connector while passing through the connector. | 2010-06-24 |
| 20100159727 | Positioning and grounding structure for ring connectors - A positioning and grounding structure for ring connectors. A cutting part is formed by cutting one side of the ring connector. The connecting base has a grounding part. Using the relative position between the grounding part and the electrical connecting part as well as the cutting part for double positioning, the ring connector can be quickly fixed on a circuit board. The grounding part can quickly connect noises or electrostatics to the ground. The structure solves the problem of connectors in the prior art that lacks positioning and grounding designs. The provided ring connector can quickly position and ground. | 2010-06-24 |
| 20100159728 | ELECTRICAL CONNECTOR WITH A ROTATING METAL SHELL - An electrical connector includes: an insulating housing defining a mounting face for being mounted on a PCB and a pair of engaging portions at two opposite ends of the insulating housing; a number of contacts retained in the insulating housing; a metal shell assembled on the insulating housing along an assembly direction slanting to the mounting face, the metal shell having a locking portion with a gap through which the engaging portion is inserted in the locking portion and a stopper portion. The stopper portion exceeds the mounting face when the metal shell assembled on the insulating housing along the assembly direction before the electrical connector is mounted on the PCB, while the stopper portion is pressed by the PCB to offset the assembly direction when the electrical connector is mounted on the PCB so as to prevent the engaging portion from deflecting from the locking portion through the gap. | 2010-06-24 |
| 20100159729 | SIM CARD FIXING ASSEMBLY - A SIM card fixing assembly is used for fixing a SIM card to an electronic device. The electronic device includes a housing. The SIM card fixing assembly includes a receiving portion defined in the housing, a rotary member and a latching member. The rotary member is rotatable relative to the housing. The latching member is slidably fixed to the rotary member. A side surface of the receiving portion defines a retaining groove to receive an end of the SIM card. The rotary member includes a latching portion. The latching member includes a first plate and a second plate extending from an edge of the first plate. The first plate includes a resilient hook extending toward to the second plate. The second plate defines a latching slot to receive the other end of the SIM card. When the latching member is slid relative to the rotary member, the other end of the SIM card is latched into the latching slot, the resilient hook is engaged with the latching portion. | 2010-06-24 |
| 20100159730 | WIRE BALE INDEPENDENT LOAD MECHANISM - Electronic assemblies are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a load mechanism including a first lever arm and a second lever arm. The load mechanism also includes a first axis portion extending from a first longitudinal end of the first lever arm, the first axis portion pivotally coupled to the circuit board, and a second axis portion extending from a first longitudinal end of the second lever arm, the second axis portion pivotally coupled to the circuit board. The load mechanism also includes a first load arm region extending from the first axis portion and the second axis portion and positioned between the first and second lever arms. The load mechanism also includes a first handle region at a second longitudinal end of the first lever arm, and a second handle region at a second longitudinal end of the second lever arm. The load mechanism also includes a second load arm region extending from the first handle region, and a third load arm region extending from the second handle region, the second and third load arm regions positioned between the first and second lever arms. The load mechanism also includes a gap positioned between an end of the second load arm and an end of the third load arm. The load mechanism is coupled to the circuit board. Other embodiments are described and claimed. | 2010-06-24 |
| 20100159731 | SEMICONDUCTOR DEVICE SOCKET - A semiconductor device socket including lever members connected to a pressing member movably supported by a pressing member support body. The lever members are operated in conjunction with rotation of an engaging pin of an operating lever supported by a common support shaft with the pressing member support body. | 2010-06-24 |
| 20100159732 | SOCKET CONNECTOR HAVING METALLIC POSITIONING MEMBER SECURING ELECTRONIC DEVICE THEREIN - A socket connector for receiving an electronic device includes an insulative housing with sidewalls extending upwardly and a plurality of contacts retained in the insulative housing. The sidewalls define a receiving space for the electronic device. At least one side wall is provided with a protrusion. An elastic positioning member is mounted within the protrusion and has an engaging section extending into the receiving space. | 2010-06-24 |
| 20100159733 | Extension cord lock and in line tap - An electrical, circuit breaker protected, extension cord in-line tap, securement device for securing tandemly connected electrical extension cords. The securement device includes opposing proximal and distal open-ended eyelets each having a hinged locking flap for receiving therein a looped end of the associated extension cord thereby preventing unintended separation of the extension cords. The in-line tap further includes a pair of circuit breaker protected auxiliary electrical outlets on opposing sides for powering additional extension cords. | 2010-06-24 |
| 20100159734 | CONNECTOR - A connector assembly has a male connector ( | 2010-06-24 |
| 20100159735 | CONNECTOR WITH SIMPLIFIED MOUNTING FOR A MULTIPLE CONDUCTOR CABLE - The invention relates to a connector to be mounted on a cable (K) with a plurality of insulated connectors (C), and including a comb ( | 2010-06-24 |
| 20100159736 | PLUG - An electrical connector for terminating a cable formed of twisted pairs, including a termination assembly having a divider for dividing and guiding the pairs to a respective termination location and a pair of contacts positioned adjacent each location where wires of each pair are separated for termination. The electrical connector is preferably an RJ plug and the divider is preferably mounted on a printed circuit board which is provided with a laser trimmed tuneable circuit to compensate for crosstalk. | 2010-06-24 |
| 20100159737 | CONNECTOR ARRANGEMENT FOR BRAINDED CONDUCTORS - An electrical connector for electrically connecting a hollow bus bar member with an insulated multi-wire or braided conductor inserted axially therein, including a conductive contact screw that is threadably connected within a first opening contained in the bus bar member wall for axial displacement from a retracted position toward a fully penetrating position, thereby to cause a pointed end of the contact screw to successively pierce the adjacent insulation layer, extend diametrically through the multi-wire conductor, pierce the adjacent layer of insulation, and extend into a second opening contained in the adjacent bus bar member wall. The bus bar member may be soldered to a printed circuit board, thereby to connect the multi-wire conductor with conductors on the printed circuit board. Alternatively, plurality of bus bar members may be formed by stamping and bending from a common conductive metal sheet, with the bus bar members being interconnected by integral straps. | 2010-06-24 |
| 20100159738 | Connector Arrangement for Flat Conductors - A connector arrangement includes a flat conductor component having a flat engagement portion, a conductive bus bar component having a flat engagement portion, and a conductive contact screw connecting the conductor and bus bar flat engagement portions in contiguous surface-to-surface electrical engagement. The contact screw has a pointed tip and is axially displaceable from a retracted position normal to and spaced from the flat conductor and bus bar engagement portions toward a connected position in which a pointed end of the screw penetrates or extends through openings in the bus bar and flat conductor engagement portions, and into a bore contained in a housing support surface. The housing support surface supports the flat engagement portions in either a horizontal orientation or a slightly inclined orientation relative to the horizontal upper surface of electrical panel component to which the flat conductor is connected and upon which the housing is mounted. | 2010-06-24 |
| 20100159739 | Connector back shells having a plurality of cable exit angles - A wiring connector back shell having a plurality of cable exit angles is disclosed. The back shell has a single transition element with a number of holes fashioned therein, which allow a cable retaining device to be fastened thereto. The cable retaining device provides strain relief for the cable exiting the back shell, as well as determining the exit angle of the cable. The cable retaining device has integral pins which mate with hole patterns in the transition element, and are locked in place with a retaining collar. Alternatively, cable ties or tie wraps may be utilized to fasten the cable to the transition element. The system provides a high reliability, low mass method for cable back shells wherein cable exit angles are easily changed or chosen in the field. | 2010-06-24 |
| 20100159740 | CABLE ASSEMBLY HAVING HOLD-DOWN ARRANGEMENT - Provided is a cable assembly comprises an insulative housing having a plurality of contact terminals disposed therein. A plurality of conductive wires each is terminated with the plurality of contact terminals. And a hold-down arrangement is securely attached to the housing, and includes a metallic base portion substantially covering interconnection between the contact terminals and the conductive wires. The arrangement includes a first anchors interlocked to the housing, and a second anchors extending beyond a mating interface of the housing. | 2010-06-24 |
| 20100159741 | Magnetic Cord Management System - A cord management apparatus comprises one or more magnets, configurable to be coupled to an electronic cord. The apparatus comprises one or more sheaths configured to be coupled to at least a portion of the electronic cord, wherein the one or more sheaths are configured to be magnetically attached to the magnet. A cord management device comprising one or more pliable sheaths is described also. | 2010-06-24 |
| 20100159742 | PATCH PANEL ASSEMBLY - A patch panel assembly is provided including an angle module having one or more RJ modules, one or more insulation displacement contact (IDC) modules and a printed circuit board. Each of the RJ modules includes a base, an RJ plug receiving opening and spring contacts extending from the base into the RJ plug receiving opening. The IDC modules each include an IDC housing with an IDC module base and insulation displacement contacts (IDCs) with IDC contact pins extending from the IDC module base. The printed circuit board has RJ contact holes receiving the spring contacts with the RJ module mounted to the printed circuit board and has IDC contact holes receiving the IDC contact pins with the IDC module mounted to the printed circuit board as well as circuit traces connecting the RJ contact holes to the IDC contact holes. The plug receiving openings each have a plug insertion opening at an angle to the printed circuit board between to 0° and not equal to 90°. A front panel is provided including a front face with a plurality of RJ module openings. The angle module is connected to the frame with the one or more RJ modules extending through RJ module openings and with each the plug insertion opening at an angle to the front face between 0° and 90°. | 2010-06-24 |
| 20100159743 | CONNECTOR - A terminal comprising a plate shaped electrical connector including an engagement portion and an equipment portion, a ring shaped support member intimately attached to an outer periphery of the equipment portion and abutting to the engagement portion, and a ring shaped elastic seal intimately attached to the outer periphery of the equipment portion and adjacent to the support member from a side of the support member opposite a side abutting the engagement portion. Also, a connector comprising the terminal and a connector housing including a terminal space into which the terminal is inserted, the terminal space having an inner peripheral wall. | 2010-06-24 |
| 20100159744 | SHIELDED CONNECTOR - In order to simplify the assembly of a shielded connector, it is proposed that an electrically insulating base body provided as a carrier for electric contacts features a mounting surface with two openings, wherein a recess that respectively features an integral collar on its inner side is respectively arranged around these openings. | 2010-06-24 |
| 20100159745 | RECEPTACLE CONNECTOR - A receptacle connector comprises an insulated housing, plural first contact pins, plural second contact pins and a metal casing. The first contact pin complies with a USB 3.0 interface, comprises a contact pin, a connected portion, a second contact pin and an arch and mounts parallel with the first terminal on the insulated housing. The second contact pin complies with a USB 2.0 interface, comprises a protruded end, an elongated portion and a first pin and mounts on the insulated housing. The metal casing mounts around the insulated housing. The receptacle connector transmits data steady at a high transmission rate. | 2010-06-24 |
| 20100159746 | RECEPTACLE CONNECTOR ASSEMBLY - A receptacle connector assembly comprises an insulative housing, two sets of first contact pins, two sets of second contact pins, a metal contact and a metal shell. The first and the second contact pin respectively comply with specification of USB 3.0 and USB 2.0 and transmit data stability at high transmission rate. | 2010-06-24 |
| 20100159747 | CONNECTOR WITH CONTROL AND STORAGE FUNCTIONS - A connector with control and storage functions includes a housing, a base, a terminal set, a control module and a cover. The housing includes an interface and an opening formed at front and rear ends of the housing respectively. The base inside the housing includes a stop block, a load carrying portion on the stop block, and through holes formed on the stop block. The terminal set in the load carrying portion and the through hole includes a slot at a rear side of the terminal set. The storage module electrically coupled to the terminal set includes a printed circuit board electrically coupled to a control unit and a storage unit. The cover includes first and second cover plates connected into the slot. The control module is provided for controlling the electronic product, storing data required by the electronic product, and increasing the storage capacity of the electronic product. | 2010-06-24 |
| 20100159748 | CONNECTING DEVICE HAVING A BUILD-IN DIGITAL TELEVISION TUNER - A connecting device having a built-in digital television tuner includes a base, a digital television tuner, a cover plate and a connector. The base has two ports. One of the two ports is assembled with the digital television tuner. The inner walls of both sides of the port have two symmetrical grooves. Rails provided on both sides of the cover plate are assembled in the grooves, so that the cover plate can slide in the port. The other port of the base is assembled with the connector. When being electrically connected to an electronic device, the connecting device of the present invention allows transmission lines of different functions to be inserted therein and receives digital television signals, whereby a user can watch digital television programs. | 2010-06-24 |
| 20100159749 | CONNECTOR - A connector prevents a terminal from short circuiting when the terminal is elastically deformed with movement of a movable housing. The length in the width direction at one end of each terminal is larger than the length in the width direction at the other end, so the distance between the terminals at the other end is larger than the distance between the terminals at one end, thereby preventing adjacent terminals from contacting each other when movable terminal portions are elastically deformed. | 2010-06-24 |
| 20100159750 | SATA CONNECTOR CAPABLE OF TRANSMITTING ELECTRIC POWER - A SATA connector capable of transmitting electric power directly includes female and male connectors. The female connector includes a body and two first power pins. A front end of the body includes a first interface with two sidewalls. An end of the first power pin is disposed on two sidewalls of the first interface, and another end of the first power pin is extended out of a rear end of the body. The male connector includes a body and two second power pins. Both sides of the body have a side groove, and the side groove has an external sidewall. The sidewall includes a notch for exposing an end of the second power pin, and another end of the second power pin is extended out of the body. When the male and female connectors are connected, the second and first power pins constitute an electric connection for transmitting electric power. | 2010-06-24 |
| 20100159751 | USB CONNECTOR AND CONTACT ARRAY THEREOF - Disclosed herein is a contact array of a universal serial bus (USB) connector including a first signal differential pair, a second signal differential pair and a third signal differential pair, wherein the second signal differential pair is disposed between the first and third signal differential pairs, and at least one power contact or ground contact is disposed between the first and second signal differential pairs, or between the second and third signal differential pairs. | 2010-06-24 |
| 20100159752 | COUPLER CONNECTOR - A coupler connector and cross talk reducing network for coupling a first cable and a second cable in electrically conducting relation to each other, the first cable and the second cable respectively terminated by a first modular plug and a second modular plug each comprising respectively a first plurality of contact terminals and a second plurality of contact terminals. | 2010-06-24 |
| 20100159753 | ELECTRICAL CONTACT HAVING STAMPED CONTACT PINS MOVABLY ASSEMBLED WITHIN ENCLOSURE MEMBER THEREOF - An electrical contact comprises an enclosure member having a tubular portion defining grooves on thereof, an upper contact pin movable assembled on one end of the enclosure member, a lower contact pin movable assembled on another end of the enclosure member, and a spring inserted within the enclosure member and between the upper and lower contact pins. The upper contact pin has a base portion, an upper contacting portion extending upwardly from the base portion, and a pair of supporting slides extending outwardly from two sides of the base portion. The lower contact pin comprises a main body, a lower contacting portion extending downwardly from the main body, and a pair of supporting slides extending outwardly from two sides of the main body. The supporting slides of the upper contact pin and the lower contact pin being received in the grooves of the enclosure member and movable up and down along the grooves in a vertical direction. | 2010-06-24 |
| 20100159754 | BUSBAR ASSEMBLY - A busbar assembly is disclosed. The busbar assembly includes a conducting bar. The conducting bar includes a port adapted to retain and conduct electricity to a cable. The busbar assembly additionally includes a cover adapted to allow the cable to be inserted and removed from the port in a first position and to retain the cable in the port in a second position. | 2010-06-24 |
| 20100159755 | Compact Device Housing and Assembly Techniques Therefor - High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing. | 2010-06-24 |
| 20100159756 | Cable terminal connector - This invention is a cable terminal connector, primarily comprising of a U-shaped contact body at the front end of the connector, with a compressible slot located between its upper and lower faces, forming upper and lower resilient clamping faces above and below the compressible slot. When the cable terminal connector's U-shaped contact body is held in place by the cap, the resilient clamping faces on the U-shaped contact body spring back to hold the cap in place, preventing it loosening and increasing the stability of conduction, thereby making it a more effective cable terminal connector. | 2010-06-24 |
| 20100159757 | AMPHIBIOUS SURFACE VEHICLE WITH SYNCHRO-PHASED ROTARY ENGAGEMENT DEVICES - This invention is directed to a novel amphibious surface vehicle ( | 2010-06-24 |
| 20100159758 | Accoustic Buoy - A buoy provided preferably for ascending in the water from an initial submerged position. The buoy comprises a buoyancy element positioned at an upper portion of the buoy in the ascending direction. Further the buoy comprises a storing structure for an elongated member positioned below the buoyancy element in the ascending direction, wherein one end of the elongated member is connected to the buoy and the other end of the elongated member is connected to an object submerged in the water. The buoyancy element is provided to obtain a rotation of the buoy around its central axis thereby paying out the elongated member while the buoy is ascending essentially vertically in the water. | 2010-06-24 |
| 20100159759 | Shark fin - A shark fin comprising a specially designed, glue-on modification to foam surfboards and foam body boards that encompasses an attachable, directional skeg or fin is provided. | 2010-06-24 |
| 20100159760 | PRESS FABRIC FOR A MACHINE FOR THE PRODUCTION OF WEB MATERIAL AND METHOD TO PRODUCE SAID PRESS FABRIC - A press fabric for a machine for the production of web material, especially paper or cardboard, includes a carrying structure and at least one layer of fibrous material on one web material contact side of the carrying structure, whereby at least some of the fibers of the at least one layer of fibrous material are coated at least partially with a film of a first polymeric material and whereby a permeable composite structure is formed by a second polymeric material in the at least one fibrous layer, in that the hollow spaces which are formed between fibers of the at least one fibrous layer are filled partially with the second polymeric material. | 2010-06-24 |
| 20100159761 | ASPHALT-MINERAL COMPOSITIONS - The present invention is related to asphalt and asphalt-mineral compositions including at least one cationic organosilicon compound selected from a group consisting of: | 2010-06-24 |
| 20100159762 | Manufacture of Complex Composite Parts - The present invention relates to an automated method for manufacturing layer by layer a composite part with rotational symmetry and complex cross-section, comprising the following stages:
| 2010-06-24 |
| 20100159763 | "Storage Stable Solutions of Optical Brighteners" - The instant invention relates to storage stable solutions of optical brighteners based on certain salt forms of anilino-substituted bistriazinyl derivatives of 4,4′-diaminostilbene-2,2′-disulphonic acid which do not need extra solubilising additives. | 2010-06-24 |
| 20100159764 | VEHICLE INTERIOR MATERIAL COATING COMPOSITION AND VEHICLE INTERIOR MATERIAL - A coating composition comprising 100 pbw as solids of a synthetic resin emulsion and 1-300 pbw of a non-halogen flame retardant in which phosphorus and nitrogen-containing non-halogen flame retardant particles are surface coated with a functional group-containing organosilicon resin is applicable to vehicle interior materials such as car seats, floor mats and ceiling members. | 2010-06-24 |
| 20100159765 | PREPREG AND RESIN FOR PREPARING THE SAME - A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin. | 2010-06-24 |
| 20100159766 | PTFE FABRIC ARTICLES AND METHODS OF MAKING SAME - Unique PTFE fabric and laminate structures, and methods for making the same, are described. Particularly, the invention comprises a laminate of a fabric comprising a plurality of PTFE fibers overlapping at intersections, wherein at least a portion of the intersections have PTFE masses extending from at least one of the overlapping PTFE fibers, and which lock the overlapping PTFE fibers together, bonded to a membrane by at least said PTFE masses. Such reinforced membranes exhibit exceptionally high bond strength, a particularly valuable attribute in applications in which durability is important. | 2010-06-24 |
| 20100159767 | (METH)ACRYLIC ESTERS OF POLY(TRIMETHYLENE ETHER) GLYCOL AND USES THEREOF - Processes and products utilizing (meth)acrylic esters of poly(trimethylene ether) glycol are provided. Products that can be made include ceramic materials, personal care products, inks, coatings, fabrics, and other articles that can be made from reaction products of (meth)acrylic ester of poly(trimethylene ether) glycol with certain monomers. | 2010-06-24 |
| 20100159768 | Moisture Sensitive Auxetic Material - An auxetic fiber and corresponding material that not only responds to an external force, but also responds to moisture. The auxetic fiber is made in part from a moisture activated shrinking filament. Even if no external force is applied to the fiber, a pseudo tensile force is created by wetting the auxetic fiber. | 2010-06-24 |
| 20100159769 | PLASTICIZER FOR THERMOPLASTIC MATERIALS - A thermoplastic polymeric composition including a xanthene or xanthenes-based compound as a plasticizer, a method to modify the thermoplastic polymeric materials to increase their relative plasticity, and various articles of manufacture that can be made using the polymer composition are described. | 2010-06-24 |
| 20100159770 | NONWOVEN WEB AND FILTER MEDIA CONTAINING PARTIALLY SPLIT MULTICOMPONENT FIBERS - The present invention provides a nonwoven web prepared from multicomponent fibers which are partially split. The partially split multicomponent fibers have at least one component of the multicomponent fiber separated from the remaining components of the multicomponent fiber along a first section of the longitudinal length of the multicomponent fibers. Along a second section of the longitudinal length of the multicomponent fibers the components of the multicomponent fibers remain together as a unitary fiber structure. In addition, part of the second section of the multicomponent fibers is bonded to part of a second section of an adjacent multicomponent fiber. | 2010-06-24 |
| 20100159771 | BASE MATERIAL FOR ARTIFICIAL LEATHER AND METHOD OF PRODUCING THE SAME - A substrate for artificial leathers which is composed of a united laminate of a nonwoven fabric layer A made of bundles of microfine fibers having an average single fiber fineness of 0.5 dtex or less and a cushion layer B made of an elastic polymer sheet. A part of the microfine fibers constituting the nonwoven fabric layer A is allowed to penetrate through the cushion layer B to form a microfine fiber layer C on the outer surface of the cushion layer B. The inner surface of the elastic polymer sheet is undulated with a height difference of 100 μm or more in a thickness direction. Between the undulated surface of the elastic polymer sheet and the nonwoven fabric layer A, voids having a height of 100 μm or more in a thickness direction are formed. Using the substrate for artificial leathers, grain-finished artificial leathers which combine a softness without resistance and a stiff hand resembling natural sheep leathers and have bent wrinkles with fullness are produced. | 2010-06-24 |
| 20100159772 | GRAIN LEATHER-LIKE SHEET HAVING EXCELLENT SCRATCH RESISTANCE AND ABRASION RESISTANCE - A grain-finished leather-like sheet having a fibrous substrate layer, a polyurethane non-porous layer and a polyurethane surface layer which are successively laminated in this order. The polyurethane surface layer contains a binder polyurethane and polyurethane fine particles having a particle size of 1 to 50 μm. The total thickness of the polyurethane non-porous layer and the polyurethane surface layer is 150 μm or more. The polyurethane surface layer contains the polyurethane fine particles in an amount of 10 to 40 parts by mass per 100 parts by mass of the binder polyurethane. The polyurethane fine particles are not exposed to the surface. The grain-finished leather-like sheet characterized by the above features has a smooth and luster surface, a good hand, and excellent scratch resistance, abrasion resistance and buckling wrinkle resistance. The sheet hardly damages or soils an object which is in contact with its surface by friction. | 2010-06-24 |
| 20100159773 | Multifunctional antistatic non-woven fabric and fabrication method thereof - The invention provides a conductive powder composite including a bamboo charcoal powder pre-processed with a pulverizing procedure and a refining procedure of 900 to 1500° C. and a conductive carbon black powder, wherein the bamboo charcoal powder and the conductive carbon black powder are blended by a high speed mechanical granulating machine to form the conductive powder composite. The conductive powder composite can simultaneously and effectively improve the poor conductivity of the bamboo charcoal powder and the embrittlement characteristic of the conductive carbon black powder in the conventional technology. The invention also provides a conductive masterbatch and a fabrication method thereof, and a multifunctional antistatic non-woven fabric and a fabrication method thereof. | 2010-06-24 |
| 20100159774 | NONWOVEN COMPOSITE AND METHOD FOR MAKING THE SAME - A nonwoven composite and a method of making a nonwoven composite including lightly bonding and hydroentangling a continuous filament nonwoven web to improve its integrity for subsequent processing steps, such as adding a first layer to the continuous filament nonwoven web and hydroentangling the first layer and the continuous filament nonwoven web together. | 2010-06-24 |
| 20100159775 | Nonwoven Composite And Method For Making The Same - A nonwoven composite and a method of making a nonwoven composite including lightly bonding and hydroentangling a continuous filament nonwoven web to improve its integrity and fiber mobility for subsequent processing steps, such as adding a first layer to the continuous filament nonwoven web and hydroentangling the first layer and the continuous filament nonwoven web together. | 2010-06-24 |
| 20100159776 | MULTILAYER MICROPOROUS FILMS AND COMPOSITES FOR BARRIER PROTECTIVE MATERIALS, AND METHODS - Embodiments of a breathable multilayer microporous film comprise a first outer film layer, a second inner film layer, and a third outer film layer, wherein each film layer comprises at least one pore-forming filler and one thermoplastic polymer. Each film layer is rendered microporous and breathable by stretching each film layer having the pore-forming filler therein, wherein the first and third outer film layers have first and third maximum pore sizes, respectively, and the second inner film layer has a second maximum pore size different than the respective maximum pore sizes of the first and third outer film layers of the multilayer film. The multilayer microporous film passes ASTM F 1671-03 test. | 2010-06-24 |
| 20100159777 | Thermoplastic Starch Formed from an Enzymatically Debranched Starch - A thermoplastic starch for use in a melt-processed composition (e.g., fiber, nonwoven web, etc.) is provided. The thermoplastic starch contains an enzymatically debranched starch and a plasticizer. By selectively controlling certain parameters of the enzymatic modification process (e.g., temperature, enzyme and starch concentrations, reaction time, isolation method, etc.), the present inventors have discovered that a native starch may be hydrolyzed in a highly efficient manner to form compositions having a comparably lower weight average molecular weight and viscosity, which are particularly suitable for use in the formation of thermoplastic starches for use in melt processing applications. | 2010-06-24 |
| 20100159778 | CONFORMABLE ATTACHMENT STRUCTURE FOR FORMING A SEAL WITH THE SKIN - The present invention is directed to an article suitable for attachment to the skin of a user, the article including a compressible material and a means for attaching the compressible material to skin, wherein the compressible material has Compressibility under a 1.4 kilopascal load greater than about 14 percent, and further wherein the compressible material has an Initial Shear Modulus in a first direction less than about 200 kilopascals. | 2010-06-24 |
| 20100159779 | MULTIFUNCTIONAL ANTISTATIC NON-WOVEN FABRIC AND FABRICATION METHOD THEREOF - The invention provides a conductive powder composite including a bamboo charcoal powder pre-processed with a pulverizing procedure and a refining procedure of 900 to 1500° C. and a conductive carbon black powder, wherein the bamboo charcoal powder and the conductive carbon black powder are blended by a high speed mechanical granulating machine to form the conductive powder composite. The conductive powder composite can simultaneously and effectively improve the poor conductivity of the bamboo charcoal powder and the embrittlement characteristic of the conductive carbon black powder in the conventional technology. The invention also provides a conductive masterbatch and a fabrication method thereof, and a multifunctional antistatic non-woven fabric and a fabrication method thereof. | 2010-06-24 |
| 20100159780 | PRODUCTION METHOD FOR DISCHARGE LAMPS - The present invention relates to a method for producing a discharge lamp using a two-stage filling process. | 2010-06-24 |
| 20100159781 | METHOD OF MANUFACTURING ELECTRON-EMITTING DEVICE AND METHOD OF MANUFACTURING IMAGE DISPLAY APPARATUS - An electron-emitting device manufacturing method includes a first step of forming a conductive film on an insulating layer having an upper surface and a side surface connected to the upper surface via a corner portion so as to extend from the side surface to the upper surface and cover at least a part of the corner portion, and a second step of etching the conductive film in a film thickness direction. At the first step, the conductive film is formed so that film density of the conductive film on the side surface of the insulating layer becomes the same as or higher than film density of the conductive film on the upper portion of the insulating film. | 2010-06-24 |
| 20100159782 | METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE - A method of fabricating a liquid crystal display device includes: a first step of attaching a polarizing plate to an outer surface of a liquid crystal panel; a second step of attaching a tape carrier package (TCP) to the liquid crystal panel; a third step of coating a resin onto a rear surface of the TCP and a connection portion of the liquid crystal panel and the TCP; a fourth step of inspecting the TCP and the liquid crystal display panel; a fifth step of inserting the liquid crystal panel into a transferring means; a sixth step of transferring the transferring means; a seventh step of extracting the liquid crystal panel from the transferring means; a eighth step of attaching the TCP to a printed circuit board (PCB); a ninth step of inspecting the PCB, the TCP and the liquid crystal panel; and a tenth step of assembling the liquid crystal panel and a backlight unit with a plurality of frames. | 2010-06-24 |
| 20100159783 | METHOD FOR PRODUCING ELECTRON-EMITTING DEVICE AND METHOD FOR PRODUCING IMAGE DISPLAY APPARATUS INCLUDING THE SAME - A method for producing an electron-emitting device includes forming a first conductive film on a side surface of an insulation layer including the side surface and a top surface connected to the side surface; forming a second conductive film from the top surface to the side surface and on the first conductive film; and etching the second electrically conductive film. | 2010-06-24 |
| 20100159784 | METHOD FOR PRODUCING ELECTRON-EMITTING DEVICE AND METHOD FOR PRODUCING IMAGE DISPLAY APPARATUS INCLUDING THE SAME - A method for producing an electron-emitting device includes forming an electrode above a top surface of an insulation layer including the top surface and a side surface connected to the top surface; forming a first conductive film on the insulation layer so as to be separated from the electrode and extend from the top surface to the side surface; forming a second conductive film on the first conductive film so as to extend from the top surface to the side surface; and etching the second conductive film. | 2010-06-24 |
| 20100159785 | IN-PLANE SWITCHING MODE LIQUID CRYSTAL DISPLAY DEVICE - An IPS mode LCD device is disclosed in which a common voltage drop and delay is decreased. The LCD includes gate and data lines crossing each other to define pixel regions. Thin film transistors are formed at crossing portions of the gate and data lines. Common lines are parallel with the gate lines and common electrodes project from the common lines parallel with the data lines. Pixel electrodes connected with drain electrodes of the thin film transistors are formed in the pixel regions between the parallel common electrodes. A first common voltage supplying line applies a first common voltage or a second common voltage to a closed circuit formed by grouping the adjacent odd numbered common lines. A second common voltage supplying line applies the second common voltage or the first common voltage to a closed circuit formed by grouping the adjacent even numbered common lines. | 2010-06-24 |
| 20100159786 | System and method for dispensing liquid crystal material and method for fabricating liquid crystal display device using the same - A liquid crystal dispensing system in which dispensing of a liquid crystal material is paused when an earthquake or the like occurs, while restarting the dispensing of the liquid crystal material when the earthquake stops, the liquid crystal dispensing system comprising a liquid crystal dispensing apparatus for dispensing a liquid crystal material onto a substrate, a detecting unit for detecting an abnormal dispensing, and a controller for controlling the liquid crystal dispensing apparatus to pause dispensing of the liquid crystal material when an abnormal dispensing of liquid crystal material is detected. | 2010-06-24 |
| 20100159787 | METHOD AND APPARATUS FOR MANUFACTURING SEALED PANEL AND METHOD AND APPARATUS FOR MANUFACTURING PLASMA DISPLAY PANEL - A method for manufacturing a sealed panel having a first substrate and a second substrate, including: a melting step of melting a sealing material which does not contain a binder for making the sealing material into paste form; a coating step of applying the melted sealing material onto a surface of the second substrate; and a sealing step of laminating the first substrate and the second substrate via the sealing material applied onto the surface of the second substrate. | 2010-06-24 |
| 20100159788 | Printing device, patterning method using the same, and method of fabricating a liquid crystal display device using the same - A printing device, a patterning method using the same and a method of fabricating an LCD device using the same are disclosed. The printing device includes a printing roll having a blanket adhered to an outer surface thereof; and an absorption nozzle to absorb solvent from the blanket. The absorption nozzle may include an absorber having a slit, a vacuum controller connected to the absorber, and a pipe connected to the vacuum controller. | 2010-06-24 |
| 20100159789 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A liquid crystal display device and a method of fabricating the same are disclosed in the present invention. The liquid crystal display device includes first and second substrates including a plurality of liquid crystal display panel regions, each liquid crystal display panel region having an active region and a dummy region, a sealant outside the liquid crystal display panel regions, a dummy column spacer on the dummy region to control a liquid crystal flow, a buffer region between the sealant and the dummy column spacer to accommodate a liquid crystal, and a liquid crystal layer between the first and second substrates. | 2010-06-24 |
| 20100159790 | METHOD OF MANUFACTURING ELECTRON-EMITTING DEVICE AND METHOD OF MANUFACTURING IMAGE DISPLAY APPARATUS USING THE SAME - A method of manufacturing an electron-emitting device includes a first step of forming a conductive film on an insulating layer having an upper surface and a side surface connected to the upper surface via a corner portion so as to extend from the side surface to the upper surface and cover at least a part of the corner portion, and a second step of etching the conductive film. At the first step, the conductive film is formed so that film density of a portion on the side surface of the insulating layer becomes lower than film density of a portion on the corner portion of the insulating layer. | 2010-06-24 |
| 20100159791 | Method for introducing an accurately dosable amount of mercury - A method for introducing an accurately dosable amount of mercury into the discharge vessel of a fluorescent lamp, wherein both sides of the discharge vessel are connected to a lamp receptacle; and the discharge vessel is charged with a gas stream via the lamp receptacle and is filled, with a predetermined amount of mercury. During or after dosing the amount of mercury to be introduced, the mercury is brought in a dosed volume in the form of a single, coalescing drop, then the entire amount of mercury to be introduced is transported into the discharge vessel, while still maintaining the previously formed drop. A change-over mechanism guides the gas stream past the drop via a bypass channel and blocks the bypass channel such that while the bypass channel is blocked, the gas stream is guided over the dosed volume and drags the drop along with it into the discharge vessel. | 2010-06-24 |
| 20100159792 | ENCAPSULATED WHITE OLEDS HAVING ENHANCED OPTICAL OUTPUT - Methods of making an integrated barrier stack and optical enhancement layer for protecting and improving the light out coupling of encapsulated white OLEDs are described. The method includes optimizing the thickness of various layers including one or more of the plasma protective layer, the initial organic layer, the initial inorganic barrier layer, and the inorganic barrier layer and polymeric decoupling layer for the barrier stack. The thickness is optimized for at least one of total efficiency, or intentional color point shift so that the encapsulated OLED has enhanced light outcoupling compared to the bare OLED. | 2010-06-24 |
