25th week of 2012 patent applcation highlights part 53 |
Patent application number | Title | Published |
20120156855 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES - A method of manufacturing a semiconductor device includes forming a plurality of strings spaced a first distance from each other, each string including first preliminary gate structures spaced a second distance, smaller than the first distance, between second preliminary gate structures, forming a first insulation layer to cover the first and second preliminary gate structures, forming an insulation layer structure to fill a space between the strings, forming a sacrificial layer pattern to partially fill spaces between first and second preliminary gate structures, removing a portion of the first insulation layer not covered by the sacrificial layer pattern to form a first insulation layer pattern, reacting portions of the first and second preliminary gate structures not covered by the first insulation layer pattern with a conductive layer to form gate structures, and forming a capping layer on the gate structures to form air gaps between the gate structures. | 2012-06-21 |
20120156856 | PROCESS MARGIN ENGINEERING IN CHARGE TRAPPING FIELD EFFECT TRANSISTORS - Embodiments of the present technology are directed toward charge trapping region process margin engineering for charge trapping field effect transistor. The techniques include forming a plurality of shallow trench isolation regions on a substrate, wherein the tops of the shallow trench isolation regions extend above the substrate by a given amount. A portion of the substrate is oxidized to form a tunneling dielectric region. A first set of one or more nitride layers are deposited on the tunneling dielectric region and shallow trench isolation regions, wherein a thickness of the first set of nitride layers is approximately half of the given amount that the tops of the shallow trench isolation regions extend above the substrate. A portion of the first set of nitride layers is etched back to the tops of the trench isolation regions. A second set of one or more nitride layers is deposited on the etched back first set of nitride layers. The second set of nitride layers is oxidized to form a charge trapping region on the tunneling dielectric region and a blocking dielectric region on the charge trapping region. A gate region is then deposited on the blocking dielectric region. | 2012-06-21 |
20120156857 | CONTINUOUS METAL SEMICONDUCTOR ALLOY VIA FOR INTERCONNECTS - Methods of forming a semiconductor structure including a semiconductor nanowire or epitaxial semiconductor material which extends from at least a surface of source region and the drain region are provided. The methods include converting an upper portion of the source region and the drain region and the semiconductor nanowire or epitaxial semiconductor material into a continuous metal semiconductor alloy. The continuous metal semiconductor alloy includes a lower portion that is contained within an upper surface of each of the source region and the drain region, and a vertical pillar portion extending upwardly from the lower portion. | 2012-06-21 |
20120156858 | OPTICAL DEVICE WAFER PROCESSING METHOD - A wafer processing method transfers an optical device layer (ODL) in an optical device wafer (ODW) to a transfer substrate. The ODL is formed on the front side of an epitaxy substrate through a buffer layer, and is partitioned by a plurality of crossing streets to define a plurality of regions where optical devices are formed. The transfer substrate is bonded to the front side of the ODL. The transfer substrate and the ODL cut along the streets. The transfer substrate is attached to a supporting member, and a laser beam is applied to the epitaxy substrate from the back side of the epitaxy substrate to the unit of the ODW and the transfer substrate. The focal point of the laser beam is set in the buffer layer, thereby decomposing the buffer layer. The epitaxy substrate is then peeled off from the ODL. | 2012-06-21 |
20120156859 | PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS - Front-side integrated parts of integrated-circuit chips are produced at locations on a substrate wafer. The front-side parts have a front side. A support wafer having a bearing side is mounted with the bearing side on top of said front-side parts. The support wafer includes at least one weak surface layer. This weak surface layer is attached to the substrate wafer using a retaining adhesive. In one implementation, the weak surface layer is attached to a front surface of the wafer. In another implementation, the weak surface layer is attached to a peripheral edge of the wafer. After attaching the support wafer, back-side integrated parts of the integrated-circuit chips are produced on the substrate wafer. The weak surface layer is then destroyed so as to demount the support wafer from the substrate wafer. | 2012-06-21 |
20120156860 | PRESSURIZED TREATMENT OF SUBSTRATES TO ENHANCE CLEAVING PROCESS - A method of cleaving a substrate is disclosed. A species, such as hydrogen or helium, is implanted into a substrate to form a layer of microbubbles. The substrate is then annealed a pressure greater than atmosphere. This annealing may be performed in the presence of the species that was implanted. This diffuses the species into the substrate. The substrate is then cleaved along the layer of microbubbles. Other steps to form an oxide layer or to bond to a handle also may be included. | 2012-06-21 |
20120156861 | QUASI-HYDROPHOBIC Si-Si WAFER BONDING USING HYDROPHILIC Si SURFACES AND DISSOLUTION OF INTERFACIAL BONDING OXIDE - Methods for removing or reducing the thickness of a material layer remaining at Si-Si interfaces after silicon wafer bonding. The methods include an anneal which is performed at a temperature sufficient to dissolve oxide, yet not melt silicon. | 2012-06-21 |
20120156862 | HIGH EFFICIENCY RECTIFIER - A method for forming a rectifier device is provided. The method forms a first layer on a substrate, a second layer is formed on the first layer and a photoresist layer is deposited on the second layer in which a plurality of trench patterns are formed. A plurality of trenches are formed in the first layer and the second layer by etching based on the trench patterns in the photoresist. The method then laterally etches the second layer to expose a corner portion of the first layer at mesas formed in between the two trenches. A portion of the second layer is preserved at an edge of the rectifier device. | 2012-06-21 |
20120156863 | SUBSTRATE PRETREATMENT FOR SUBSEQUENT HIGH TEMPERATURE GROUP III DEPOSITIONS - Embodiments of the present invention relate to apparatus and method for pretreatment of substrates for manufacturing devices such as light emitting diodes (LEDs) or laser diodes (LDs). One embodiment of the present invention comprises pretreating the aluminum oxide containing substrate by exposing a surface of the aluminum oxide containing substrate to a pretreatment gas mixture, wherein the pretreatment gas mixture comprises ammonia (NH | 2012-06-21 |
20120156864 | Formation of a Channel Semiconductor Alloy by a Nitride Hard Mask Layer and an Oxide Mask - When forming sophisticated high-k metal gate electrode structures, the uniformity of the device characteristics may be enhanced by growing a threshold adjusting semiconductor alloy on the basis of a hard mask regime, which may result in a less pronounced surface topography, in particular in densely packed device areas. To this end, in some illustrative embodiments, a deposited hard mask material may be used for selectively providing an oxide mask of reduced thickness and superior uniformity. | 2012-06-21 |
20120156865 | Enhanced Patterning Uniformity of Gate Electrodes of a Semiconductor Device by Late Gate Doping - When forming sophisticated semiconductor-based gate electrode structures of transistors, the pre-doping of one type of gate electrode structure may be accomplished after the actual patterning of the electrode material by using an appropriate mask or fill material for covering the active regions and using a lithography mask. In this manner, a high degree of flexibility is provided with respect to selecting an appropriate patterning regime, while at the same time a uniform and superior cross-sectional shape for any type of gate electrode structure is obtained. | 2012-06-21 |
20120156866 | METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE - A method of forming patterns of a semiconductor device includes forming a hard mask layer over stack layers including first to third regions, forming first patterns on the hard mask layer of the first region and second and third patterns, including first auxiliary layers and spacers formed on both sides of the first auxiliary layer, on the hard mask layer of the second and the third regions, forming hard mask patterns by etching the hard mask layer exposed through the first to third patterns, and forming word lines in the first region, a dummy word line in the second region, and select lines in the third region by etching the stack layers exposed through the hard mask patterns. | 2012-06-21 |
20120156867 | METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a gate structure through a first insulating interlayer on a substrate such that the gate structure includes a spacer on a sidewall thereof, forming a first hard mask on the gate structure, partially removing the first insulating interlayer using the first hard mask as an etching mask to form a first contact hole such that the first contact hole exposes a top surface of the substrate, forming a metal silicide pattern on the top surface of the substrate exposed by the first contact hole, and forming a plug electrically connected to the metal silicide pattern. | 2012-06-21 |
20120156868 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH BURIED WORD LINE - A method for fabricating a semiconductor device includes etching a substrate to form a plurality of bodies isolated by a first trench, forming a buried bit line gap-filling a portion of the first trench, etching the top portions of the bodies to form a plurality of pillars isolated by a plurality of second trenches extending across the first trench, forming a passivation layer gap-filling a portion of the second trenches, forming an isolation layer that divides each of the second trenches into isolation trenches over the passivation layer, and filling a portion of the isolation trenches to form a buried word line extending in a direction crossing over the buried bit line. | 2012-06-21 |
20120156869 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH BURIED GATE - A method for fabricating a semiconductor device includes forming a hard mask pattern over a substrate, forming an isolation layer for defining an active region by using the hard mask pattern, forming a buried gate in and across the active region and the isolation layer over the substrate, forming an inter-layer dielectric layer over the substrate, forming a storage node contact hole that exposes the hard mask pattern by selectively etching the inter-layer dielectric layer, extending the storage node contact hole to expose the active region by removing the hard mask pattern exposed under the storage node contact hole, and forming a storage node contact plug that fills the extended storage node contact hole. | 2012-06-21 |
20120156870 | Chip Pad Resistant to Antenna Effect and Method - A chip pad structure of an integrated circuit (IC) and the method of forming are disclosed. The chip pad comprises a main pad portion and a ring pad portion. During a charging process involved in forming the chip pad structure, electrical connections from the gate electrodes of MOS transistors in the IC substrate generally are made only to the ring pad portion that has an antenna-to-gate area ratio substantially below a predetermined antenna design rule ratio, and thus is resistant or immune to antenna effect. The main pad portion and the ring pad portion are coupled together through metal bridges formed in an upper interconnect metal layer or in the top conductive pad layer. The chip pad may be used as probe pads on a parametric testline or bonding pads on an IC. | 2012-06-21 |
20120156871 | METHODS FOR FORMING CONDUCTIVE VIAS IN SEMICONDUCTOR DEVICE COMPONENTS - A method for forming conductive vias in a substrate of a semiconductor device component includes forming one or more holes, or apertures or cavities, in the substrate so as to extend only partially through the substrate. A barrier layer, such as an insulative layer, may be formed on surfaces of each hole. Surfaces within each hole may be coated with a seed layer, which facilitates adhesion of conductive material within each hole. Conductive material is introduced into each hole. Introduction of the conductive material may be effected by deposition or plating. Alternatively, conductive material in the form of solder may be introduced into each hole. | 2012-06-21 |
20120156872 | METHODS FOR DEPOSITING MATERIALS IN HIGH ASPECT RATIO FEATURES - Methods for depositing materials in high aspect ratio features are disclosed herein. In some embodiments, a method of processing a substrate may include providing a substrate having an opening formed in a first surface of the substrate and extending into the substrate towards an opposing second surface of the substrate, the opening having an aspect ratio of height to width of at least 3:1, forming a barrier layer atop the first surface of the substrate and along sidewalls and a bottom surface of the opening, the barrier layer having a first thickness atop the first surface of the substrate, and forming a seed layer atop the barrier layer, wherein a ratio of the second thickness to the first thickness ranges from about 2:1 to about 5:1. | 2012-06-21 |
20120156873 | METHOD FOR RESTRICTING LATERAL ENCROACHMENT OF METAL SILICIDE INTO CHANNEL REGION - A method for restricting lateral encroachment of the metal silicide into the channel region, comprising: providing a semiconductor substrate, a gate stack being formed on the semiconductor substrate, a source region being formed in the semiconductor on one side of the gate stack, and a drain region being formed in the semiconductor substrate on the other side of the gate stack; forming a sacrificial spacer around the gate stack and on the semiconductor substrate; depositing a metal layer for covering the semiconductor substrate, the gate stack and the sacrificial spacer; performing a thermal treatment on the semiconductor substrate, thereby causing the metal layer to react with the sacrificial spacer and the semiconductor substrate in the source region and the drain region; removing the sacrificial spacer, reaction products of the sacrificial spacer and the metal layer, and a part of the metal layer which does not react with the sacrificial spacer. | 2012-06-21 |
20120156874 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME - A slurry composition for chemical mechanical polishing, including 0.1% to 20% by weight of an aminosilane-surface treated polishing agent; 0.001% to 5% by weight of an additive selected from amino acids, amino acid derivatives, salts thereof, and combinations thereof; 0.0001% to 0.5% by weight of a corrosion inhibitor; and 0.01% to 5% by weight of an oxidizing agent, with the balance being a solvent, is provided. The slurry composition for chemical mechanical polishing has a conspicuously high polishing rate for silicon oxide films, is capable of selectively preventing the removal of silicon nitride films, does not cause an imbalance in polishing, gives an excellent degree of planarization, has excellent stability over time and dispersion stability, causes less generation of particles and scratches, and produces very satisfactory polished surfaces of barrier metal films and oxide films. | 2012-06-21 |
20120156875 | LASER BASED PROCESSING OF LAYERED MATERIALS - Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated. | 2012-06-21 |
20120156876 | SELF-ALIGNED NAND FLASH SELECT-GATE WORDLINES FOR SPACER DOUBLE PATTERNING - A method for double patterning is disclosed. In one embodiment the formation a pair of select gate wordlines on either side of a plurality of core wordlines begins by placing a spacer pattern around edges of a photoresist pattern is disclosed. The photoresist pattern is stripped away leaving the spacer pattern. A trim mask is placed over a portion of the spacer pattern. Portions of the spacer pattern are etched away that are not covered by the trim mask. The trim mask is removed, wherein first remaining portions of the spacer pattern define a plurality of core wordlines. A pad mask is placed such that the pad mask and second remaining portions of the spacer pattern define a select gate wordline on either side of the plurality of core wordlines. Finally at least one pattern transfer layer is etched through using the mad mask and the first and second remaining portions of the spacer pattern to etch the select gate wordlines and the plurality of core wordlines into a poly silicon layer. | 2012-06-21 |
20120156877 | Showerhead for Processing Chamber - A top assembly for a processing chamber having a back plate and a hub is provided. The back plate has a first portion and a second portion. The first portion is connected to the second portion through a central region of the back plate, wherein a gap is defined between opposing surfaces of the first and second portions outside the central region. The first portion includes an embedded heating element. The hub is affixed to a top surface of the second portion of the back plate over the central region. The hub has a top surface with a plurality of channel openings defined within a central region of the hub and a bottom surface having a central extension with a plurality of channels defined therethrough. The bottom surface includes an annular extension spaced apart from the central extension. | 2012-06-21 |
20120156878 | METHOD FOR PRODUCING EPITAXIAL SILICON WAFER - Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface. | 2012-06-21 |
20120156879 | RESIST PATTERN IMPROVING MATERIAL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - To provide a resist pattern improving material, containing: a compound represented by the following general formula (1), or a compound represented by the following general formula (2), or both thereof; and water: | 2012-06-21 |
20120156880 | RAPID AND UNIFORM GAS SWITCHING FOR A PLASMA ETCH PROCESS - An inductively coupled plasma processing apparatus includes a processing chamber in which a semiconductor substrate is processed, a substrate support, a dielectric window forming a wall of the chamber, an antenna operable to generate and maintain a plasma in the processing chamber, and a showerhead plate of dielectric material adjacent the dielectric window. The showerhead plate includes gas holes in fluid communication with a plenum below the dielectric window, the plenum having a gas volume of no greater than 500 cm | 2012-06-21 |
20120156881 | METHOD FOR DEFINING A SEPARATING STRUCTURE WITHIN A SEMICONDUCTOR DEVICE - A method includes depositing a material layer over a semiconductor substrate and using a first mask in a first exposure/patterning process to pattern the material layer thereby forming a plurality of first and second features. The first features include patterns for the semiconductor device and the second features include printing assist features. The method includes using a second mask in a second exposure/patterning process to effectively remove the second features from the material layer and to define at least one separating structure between two first features. | 2012-06-21 |
20120156882 | METHOD FOR FABRICATING LARGE-AREA NANOSCALE PATTERN - A method for fabricating a large-area nanoscale pattern includes: forming multilayer main thin films isolated by passivation layers; patterning a first main thin film to form a first main pattern; forming a first spacer pattern with respect to the first main pattern; and forming a second main pattern by transferring the first spacer pattern onto a second main thin film. By using multilayer main thin films isolated by different passivation films, spacer lithography capable of reducing a pattern pitch can be repetitively performed, and the pattern pitch is repetitively reduced without shape distortion after formation of micrometer-scale patterns, thereby forming nanometer-scale fine patterns uniformly over a wide area. | 2012-06-21 |
20120156883 | METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE - A method of forming patterns of a semiconductor device includes forming partition patterns on a hard mask layer; forming a first auxiliary layer on the entire structure including a surface of the partition patterns; forming auxiliary patterns to cover a portion of the first auxiliary layer formed over sidewalls of the partition pattern formed in second region, where each of the auxiliary patterns in the second region has a width greater than a thickness of the first auxiliary layer; forming spacers on sidewalls of the partition patterns, so that a portion of the partition patterns and a portion of the hard mask layer are exposed; removing the auxiliary patterns; etching the partition patterns exposed between the spacers; and removing remaining regions of the partition patterns and the hard mask layer exposed between the spacers. | 2012-06-21 |
20120156884 | FILM FORMING METHOD OF AMORPHOUS CARBON FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME - Disclosed is a film forming method of an amorphous carbon film, including: disposing a substrate in a processing chamber; supplying a processing gas containing carbon, hydrogen and oxygen into the processing chamber; and decomposing the processing gas by heating the substrate in the processing chamber and depositing the amorphous carbon film on the substrate. | 2012-06-21 |
20120156885 | METHOD AND SYSTEM FOR PROCESSING SEMICONDUCTOR WAFER - In a method for processing a semiconductor wafer formed with a copper conductor, the semiconductor wafer is etched in an etching chamber to expose the copper conductor. The etched semiconductor wafer is transmitted from the etching chamber to a buffer zone, where a gas inert to the semiconductor wafer is introduced for a period of time. Then the semiconductor wafer is moved out of the buffer zone to a loading module. Nitrogen is one of the suitable options as the gas, and argon is another option. | 2012-06-21 |
20120156886 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Production efficiency of a substrate (in particular, a substrate on which a SiC epitaxial film is formed) is improved and formation of the film inside a gas supply port is suppressed. This is accomplished by a substrate processing apparatus including a reaction chamber configured to accommodate a plurality of substrates | 2012-06-21 |
20120156887 | VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD - A vacuum processing apparatus, comprising: a processing chamber | 2012-06-21 |
20120156888 | SLIMMING METHOD OF CARBON-CONTAINING THIN FILM AND OXIDATION APPARATUS - A slimming method includes transferring an object to be processed on which a patterned carbon-containing thin film is formed into a process chamber in an oxidation apparatus; and oxidizing and removing the surface of the carbon-containing thin film by an oxidizing gas while supplying moisture into the process chamber, to reduce widths of the protruded portions on the pattern of the carbon-containing thin film. | 2012-06-21 |
20120156889 | METHODS FOR FORMING HIGH-K CRYSTALLINE FILMS AND RELATED DEVICES - This disclosure provides a method of fabricating a semiconductor stack and associated device, such as a capacitor or DRAM cell. In such a device, a high-K zirconia-based layer may be used as the primary dielectric together with a relatively inexpensive metal electrode based on titanium nitride. To prevent corruption of the electrode during device formation, a thin barrier layer can be used seal the electrode prior to the use of a high temperature process and a (high-concentration or dosage) ozone reagent (i.e., to create a high-K zirconia-based layer). In some embodiments, the barrier layer can also be zirconia-based, for example, a thin layer of doped or un-doped amorphous zirconia. Fabrication of a device in this manner facilitates formation of a device with dielectric constant of greater than 40 based on zirconia and titanium nitride, and generally helps produce less costly, increasingly dense DRAM cells and other semiconductor structures. | 2012-06-21 |
20120156890 | IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE - A method and apparatus for forming low-k dielectric layers that include air gaps is provided. In one embodiment, a method of processing a substrate is provided. The method comprises disposing a substrate within a processing region, reacting an organosilicon compound, with an oxidizing gas, and a porogen providing precursor in the presence of a plasma to deposit a porogen containing low-k dielectric layer comprising silicon, oxygen, and carbon on the substrate, depositing a porous dielectric capping layer comprising silicon, oxygen and carbon on the porogen containing low-k dielectric layer, and ultraviolet (UV) curing the porogen containing low-k dielectric layer and the porous dielectric capping layer to remove at least a portion of the porogen from the porogen containing low-k dielectric layer through the porous dielectric capping layer to convert the porogen containing low-k dielectric layer to a porous low-k dielectric layer having air gaps. | 2012-06-21 |
20120156891 | SILICON DIOXIDE FILM FABRICATING PROCESS - A silicon dioxide film fabricating process includes the following steps. Firstly, a substrate is provided. A rapid thermal oxidation-in situ steam generation process is performed to form a silicon dioxide film on the substrate. An annealing process is performed to anneal the substrate in a first gas mixture at a temperature in the range of 1000° C. to 1100° C. | 2012-06-21 |
20120156892 | SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE - The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. | 2012-06-21 |
20120156893 | METHOD FOR PRODUCING SILICEOUS FILM AND POLYSILAZANE COATING TREATMENT LIQUID USED THEREFOR - The present invention provides a method for forming a siliceous film. According to the method, a siliceous film having a hydrophilic surface can be formed from a polysilazane compound at a low temperature. In the method, a composition containing a polysilazane compound and a silica-conversion reaction accelerator is applied on a substrate surface to form a polysilazane film, and then a polysilazane film-treatment solution is applied thereon so that the polysilazane compound can be converted into a siliceous film at 300° C. or less. The polysilazane film-treatment solution contains a solvent, hydrogen peroxide and an alcohol. | 2012-06-21 |
20120156894 | MONOSILANE OR DISILANE DERIVATIVES AND METHOD FOR LOW TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS USING THE SAME - This invention relates to silicon precursor compositions for forming silicon-containing films by low temperature (e.g., <550° C.) chemical vapor deposition processes for fabrication of ULSI devices and device structures. Such silicon precursor compositions comprise at least a silane or disilane derivative that is substituted with at least one alkylhydrazine functional groups and is free of halogen substitutes. | 2012-06-21 |
20120156895 | CHEMICAL VAPOR DEPOSITION PROCESS FOR ALUMINUM SILICON NITRIDE - A chemical vapor deposition method for forming an aluminum-silicon nitride layer upon a substrate uses an aluminum precursor, a silicon precursor and a nitrogen precursor under chemical vapor deposition conditions to deposit the aluminum-silicon nitride layer upon the substrate. The aluminum-silicon nitride layer has an index of refraction interposed between silicon nitride and aluminum nitride. The aluminum-silicon nitride layer also has a bandgap from about 4.5 to about 6 eV and a permittivity from about 6×10̂-11 to about 8×10̂-11 F/m. The aluminum-silicon nitride layer may be further thermally annealed to reduce a hydrogen content of the aluminum-silicon nitride layer. | 2012-06-21 |
20120156896 | PIN ADAPTER WITH LED - A pin adapter to connect a master electrical system of a towing vehicle with a subservient electrical system of a towed vehicle is disclosed. In particular, the pin adapter allows for connection of a different master electrical interface with a different subservient electrical interface. The pin adapter may include a body, the body having a first electrical interface capable of electrically engaging the electrical system of the towing vehicle, and a second electrical interface capable of electrically engaging the electrical system of the towed vehicle. The second electrical interface may include a plurality of terminals. The pin adapter may further include a cover attached to the body, the cover capable of engaging only one of the plurality of terminals of the second electrical interface. | 2012-06-21 |
20120156897 | LAMP PLUGS PROVIDING ENHANCED FUNCTIONALITY - Lamp plugs are disclosed, in which single intensity marker lamps that are desired to be flashed can be connected to a lamp driver employing an exclusive OR (XOR) logic circuit. In one embodiment, the lamp plug is an overmolded subsystem that is installed between the lamp and the lamp driver and allows the installer to use existing wire harnesses. In some embodiments, the overmolded subsystem is installed under a standard lamp where a plug is typically plugged in; therefore staying on the vehicle and not needing to be replaced with the lamp. Other embodiments are disclosed. | 2012-06-21 |
20120156898 | Connection Of Printed Circuit Boards - In order to mechanically and electrically connect two printed circuit boards ( | 2012-06-21 |
20120156899 | LAND GRID ARRAY INTERCONNECT - A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads. | 2012-06-21 |
20120156900 | CABLE ASSEMBLY HAVING BALANCED SUPPORTING RIBS - A cable assembly includes a PCB, a rear housing, a front housing assembled with the rear housing and a locking member. The printed circuit board includes a mating end formed with a plurality of first conductive pads and rear end formed with a plurality of second conductive pads. The rear housing is over molded around the rear end of the PCB. The front housing encloses a part of the PCB. The front housing defines a receiving slot and an engaging portion. The locking member is assembled to the engaging portion. The front housing further has two restricting portions extending upwardly from the upper surface thereof, each restricting portion has a supporting portion, an extension portion forwardly extending from a rear end of the supporting portion and spaced from the supporting portion so that a receiving groove is formed between the supporting portion and the extension portion. | 2012-06-21 |
20120156901 | Portable Electronic Device Having a Concealed Jack Socket - The present disclosure provides a portable electronic device having a concealed jack socket. In accordance with one example embodiment, the portable electronic device comprises: a housing including a main body and a hatch movable between a fully open position and a fully closed position; a jack socket received within the housing, the jack socket defining a cavity for receiving a jack plug; wherein the hatch is pivotably connected to the main body to move from the fully closed position to the fully open position in response to insertion of the jack plug, wherein the jack socket is hidden in the fully closed position and exposed in the fully open position. | 2012-06-21 |
20120156902 | METHOD FOR RF CONNECTOR GROUNDING - The present invention relates to radio frequency and microwave connectors, and more particularly to grounding methods for printed wiring board edge-launch connectors. The grounding method comprises conducting tabs secured to a PWB and to an attached connector frame holding coaxial connectors. The conducting tabs thus provide a ground connection between the connector frame and one or more ground conductors on the PWB. | 2012-06-21 |
20120156903 | CONTACT NODE OF PORTABLE TERMINAL - A contact node of a portable terminal includes: a body fixed on a main board of the portable terminal; at least one first contact piece protruding through one side surface of the body; and at least one second contact piece protruding through another side surface of the body, wherein one of the first contact piece and second contact piece is disposed toward an outer side surface of the portable terminal. | 2012-06-21 |
20120156904 | CONNECTOR - A connector has an insulating housing of which two opposite ends extended frontward to form a pair of supporting arms, terminals mounted in the insulating housing having soldering portions projected out of a bottom of the insulating housing, and a positioning member. The positioning member has a base slice. A rear of a side edge the base slice is extended downward to form a holding slice movably received in a through slot recessed at the supporting arm. A front of the side edge of the base slice is extended downward and then bent perpendicularly to form a soldering slice. As the height between the base slice and the soldering slice is bigger than that of the supporting arm, the positioning member is capable of moving up-and-down to adjust the relative position between the soldering slice and the soldering portions of the terminals. | 2012-06-21 |
20120156905 | CONNECTOR - A connector soldered to a PCB has an insulating housing of which two opposite ends recessed to form a pair of fixing recesses, terminals mounted in the insulating housing having soldering portions projected out of a bottom of the insulating housing, a latch member and a positioning member. The latch member has a base slice inserted in the fixing recess. A top of the base plate extends sideward and then is bent downward to form a folded plate apart facing the base plate to define an interval therebetween. The positioning member movably mounted to the latch member has a base slice inserted in the interval and a soldering slice perpendicularly connected at a bottom of the base slice for being soldered with the PCB. The base slice of is capable of moving up-and-down in the interval to adjust the soldering slice to be level with the soldering portions. | 2012-06-21 |
20120156906 | ELECTRICAL RECEPTACLE FOR OUTWARD FACING GROUND PLUGS - A multiplex electrical receptacle adapted for receiving at least a pair of power cords, such that the ground prongs of the power cords are directed outward from the center of the multiplex electrical receptacle in a “grounds out” configuration. The electrical receptacle of this invention includes an electrical outlet receptacle having a receptacle body, a conductive mounting strap, a conductive live blade receiving assembly, a conductive neutral blade receiving assembly, and a non-conductive housing. | 2012-06-21 |
20120156907 | TWO-PART JACK SOCKET FOR A PORTABLE ELECTRONIC DEVICE - The present disclosure provides a two-part jack socket for a portable electronic device and a portable electronic device having the same. In accordance with one example embodiment, the jack socket comprises: a first part having a contact surface; a second part having a contact surface and being moveable with respect to the first part between a first position and a second position, the contact surfaces of the first part and second part defining a cavity, the cavity having a retracted state when the second part is in the first position and an expanded state for receiving a jack plug when the second part is in the second position; and one or more contacts located in the contact surface of the first part or second part. | 2012-06-21 |
20120156908 | SIGNAL TRANSMISSION DEVICE - A signal transmission device is provided. The signal transmission device comprises a linked unit, a switch button, a data connector and a lock fastener. The linked unit includes a first shaft, a second shaft, a first elastomer and a second elastomer. The switch button is attached/disposed on the linked unit. The data connector rotates and expands according to the first shaft and the first elastomer. The lock fastener rotates and moves according to the second shaft and the second elastomer. | 2012-06-21 |
20120156909 | POWER CONNECTOR ASSEMBLY - A power connector includes a holder having a cavity and a tab extending into the cavity. Power contacts are received within the cavity in a stacked configuration. The power contacts have a first end and a second end. The power contacts have a first receptacle section at the first end configured to receive a power terminal therein and a second receptacle section at the second end configured to receive a power terminal therein. The power contacts have an opening, wherein the tab is received in the openings to position the contacts within the cavity. | 2012-06-21 |
20120156910 | Waterproof Connector and Method of Assembly of Waterproof Connector - A water-proof connector has a inner housing, a wire seal, and an outer housing. The outer housing has a plurality of electrical wire insertion passageways and a plurality of first boss pins disposed along an outer periphery of a region in which electrical wire insertion passageways are formed. The plurality of first boss pins include tip end parts with a tapered surface only in a portion facing outward from the region in which the electrical wire insertion passageways are formed. | 2012-06-21 |
20120156911 | ROTATABLE AND POSITIVE LOCKABLE CIRCULAR CONNECTOR ADAPTER - A rotatable and positive lockable circular connector including a spin coupling having an axial bore therethrough; a cylindrical connection interface inserted into the axial bore of the spin coupling; and an adapter body having an internal bore into which the spin coupling is axially inserted, thereby placing the spin coupling, connection interface, and adapter body into axial alignment. The adapter body includes a shielded branch for passing conductor wires. A locking system permits selective rotation of the spin coupling in relation to the adapter body when the apparatus is in an unlocked position, and positively locks the spin coupling in relation to the adapter body when the apparatus is in a locked position. Grounding elements maintain a ground path from the branch shielding to a connector shell coupled to the spin coupling. | 2012-06-21 |
20120156912 | CARD EDGE CONNECTOR - A card edge connector for mating with a corresponding daughter card | 2012-06-21 |
20120156913 | QUICK RELEASE RETENTION MECHANISM FOR SOCKETED MICROELECTRONIC DEVICES - The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets. | 2012-06-21 |
20120156914 | ELECTRICAL CONNECTOR ASSEMBLY WITH AN ANTI-MISMATING MECHANISM - An electrical connector assembly ( | 2012-06-21 |
20120156915 | POWER ADAPTER ASSEMBLY - The invention provides a power adapter assembly including an adapter body, a replaceable plug and a rotation locking collar. The adapter body comprises a cylindrical casing and a circular plug receiving base fixed on top of the cylindrical casing. The plug receiving base has a recess on the top thereof and a circular peripheral surface, wherein the recess has an engagement block on the side wall thereof. The circular peripheral surface has a flange with an indentation on the top edge thereof, and a guiding groove formed from the indentation and extending downward to the bottom edge thereof. The replaceable plug is detachably mounted onto the plug receiving base and comprises a cylindrical support base comprising an upper portion and a lower portion sized to fit into the recess of the plug receiving base. The upper portion has an elongated engagement groove along its peripheral surface with one end extending to the bottom edge thereof and alignable with the guiding groove. The lower portion has an engagement groove adapted to engage with the engagement block. The rotation locking collar is detachably sleeved onto the plug receiving base and the support base, wherein the locking collar has a tab member on the inner top edge thereof adapted to enter the guiding groove and said one end of the elongated engagement groove. The tab member is further allowed to rotate into and engage with the elongated engagement groove by rotation of the locking collar. | 2012-06-21 |
20120156916 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members that are aligned and housed in the first terminal housing, a connecting member for collectively fixing and electrically connecting the plurality of first connecting terminals and the plurality of second connecting terminals at each contact point by pressing one of the plurality of insulating members adjacent to the connecting member, and an insulating member assembly including the plurality of insulating members assembled such that the plurality of insulating members are each restricted from moving in a fitting direction thereof, and moving in a width direction perpendicular to a lamination direction of the laminated structure and to the fitting direction. | 2012-06-21 |
20120156917 | CONNECTOR - A lock arm ( | 2012-06-21 |
20120156918 | CONNECTOR ASSEMBLY - A connector assembly includes a first connector with a positioning portion and a second connector with a latch. A blocking portion is located on a second side of the first connector. The latch defines an oblique latching plane, the positioning portion defines an oblique sliding plane, and the blocking portion defines an oblique blocking plane. If the latch is aligned with the positioning portion and is slid towards the first connector, the oblique direction of the second latching plane is substantially the same as the oblique positioning plane. If the latch is aligned with the blocking portion and is slid towards the first connector, an acute angle is defined between the oblique direction of the second latching plane and the oblique direction of the blocking plane. | 2012-06-21 |
20120156919 | SOCKET ASSEMBLY WITH PICK UP CAP - A socket assembly comprises an insulating housing receiving a plurality of contacts, a pick up cap assembled on the insulating housing and a loading plate covering the insulating housing and the pick up cap. The pick up cap is pivotally assembled to one of the sidewalls of the insulative housing at an end thereof and has an operating portion at an opposite end thereof. The loading plate is provided with a latching piece to latch with the operating portion of the pick up cap, so that the loading plate can bring the pick up cap to open. | 2012-06-21 |
20120156920 | LED Connector Assembly and Connector - An LED connector assembly having a LED module, a base, and a connector. The LED module includes a substrate provided with a conductor pattern and an LED device disposed on a surface of the substrate and connecting to the conductor pattern. The base includes an attachment side larger than the LED module and attaching with the LED module such that a bottom surface of the LED module faces the attachment side. The connector that includes a housing fixed to the base, wherein the housing includes a a cylindrical section with a conductor receiving passageway at a tip thereof to which the cylindrical section penetrates the base from the attachment side there through, and a contact having one end that connects to the conductor pattern and extend inside the cylindrical section for connection with an electrical wire insertable into the cylindrical section. | 2012-06-21 |
20120156921 | CONNECTOR FOR A PRINTED CIRCUIT BOARD - A connector having a body, at least one contact accommodated in the body with an insulator being interposed, a casing defining a housing designed to accommodate all or part of the body, and an armature placed around at least one portion of the casing, at least one portion of the body being accommodated in the portion of the casing, the armature having feet for fastening the connector to a printed circuit board, wherein the feet project beyond that portion of the casing around which the armature is placed and wherein the armature is placed in a set-in manner relative to the casing. | 2012-06-21 |
20120156922 | HANDLE ASSEMBLY FOR ELECTRICAL CONNECTION WITH A GROUNDING MECHANISM - A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position. | 2012-06-21 |
20120156923 | CONNECTION LINE - A connection line includes a first plug connected to an electronic device, a second plug connected to a socket, a cable connected between the first plug and the second plug, a first light-emitting diode (LED), a switch, and a second LED. A cathode of the first LED is connected to a ground terminal of the cable. An anode of the second LED is connected to a power terminal of the cable. A cathode of the second LED is connected to an anode of the first LED through the switch. The first LED and the switch are located on the cable and near the first plug. The second LED is located on the cable and near the second plug. | 2012-06-21 |
20120156924 | ELELCTRICAL CONNECTOR ASSEMBLY WITH LED DISPLAY - An electrical connector assembly includes a bracket arranged along a longitudinal direction thereof with a plurality of connector ports and a LED port opening forwards, a plurality of electrical connectors retained in the connector ports, a shading board disposed with a plurality of cavities and a circuit board retained behind and parallel to the shading board and disposed with a plurality of LEDs on a front face thereof. The plurality of LEDs is received in corresponding cavities of the shading board. The shading board with the circuit board is retained in the LED port by the shading board in a height direction perpendicular to the longitudinal direction. | 2012-06-21 |
20120156925 | Cross Connect Patch Guidance System - An intelligent network patch field management system and specialized cross-connect cable are provided to help guide, monitor, and report on the process of connecting and disconnecting patch cords plugs in a cross-connect patching environment. The system is also capable of monitoring patch cord connections to detect insertions or removals of patch cords or plugs. The cross-connect cable is provided with LEDs in both of the cable plugs. When only one plug of the cross-connect cable is plugged into a port, the LED associated with that plug is switched out of the circuit, while the LED in the unplugged plug remains in the circuit and can still be illuminated by the system. | 2012-06-21 |
20120156926 | CONNECTION MEMBER, METHOD OF MANUFACTURING THE SAME AND CONNECTION STRUCTURE - A connection member which is electrically connected to a conductive fabric having conductive threads, a method for manufacturing the connection member, and a connection structure are provided. The connection member includes a band-shaped part including conductive wires which extend in a longitudinal direction, and a connection terminal which is attached to an end portion of the conductive wires. The method includes forming an original band-shaped member by weaving while using the conductive wires for a part of warp and using at least non-conductive threads for weft; exposing the conductive wires at an end portion of the original band-shaped member; | 2012-06-21 |
20120156927 | Wire Seal and Waterproof Connector - A waterproof connector is provided with a connector housing and a wire seal. The connector housing includes a plurality of first contact insertion passageways. The wire seal includes a wire seal body and at least one projection. The wire seal body includes a plurality of second contact insertion passageways disposed at positions corresponding to the plurality of first contact insertion passageways and receive a plurality of contacts pressed tightly against edges of inner perimeters of the plurality of second contact insertion passageways to seal the plurality of second contact insertion passageways when the contacts are inserted through the plurality of second contact insertion passageways. The at least one projection extends from the wire seal body and is disposed along positions corresponding to any of the plurality of first contact insertion passageways. The plurality of second contact insertion passageways are insertable through the first contact insertion passageway. | 2012-06-21 |
20120156928 | Connector Hat with Extended Mounting Posts for Securing a Connector Shell to a Circuit Board - Concepts and technologies described herein provide for securing a connector shell to a circuit board using a separate connector hat with elongated mounting posts. According to one aspect of the disclosure provided herein, a connector hat includes a one-piece body with a top surface and a pair of mounting posts. The mounting posts extend downwards from opposing side edges of the top surface. The posts are of sufficient length to extend beyond a bottom surface of a connector shell to which the connector hat is configured to attach, and through a bottom surface of an associated circuit board. The two-piece connector assembly design utilizing the connector hat with mounting posts allows the mounting posts to be manufactured at any desirable length to facilitate installation of the connector assembly to a circuit board. | 2012-06-21 |
20120156929 | Connector with Improved Shielding in Mating Contact Region - An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction. | 2012-06-21 |
20120156930 | ELECTRICAL CONNECTOR HAVING IMPROVED ARRANGEMENT OF MAGNETIC MODULE - An electrical connector ( | 2012-06-21 |
20120156931 | ELECTRICAL CONNECTOR HAVING A RESISTOR - An electrical connector includes a body having a terminating end and a mating end. A power contact extends from the mating end of the body. The power contact is configured to be engaged by a power contact of a mating connector connected to a predominantly capacitive load. An auxiliary contact extends from the mating end of the body. The auxiliary contact is coupled in series with a resistor. The auxiliary contact configured to be engaged by an auxiliary contact of the mating connector. The auxiliary contact in series with the resistor is configured to engage the mating connector before the power contact to resist a surge current due to the capacitive load from the mating connector. | 2012-06-21 |
20120156932 | Method and System for Reducing Internal Crosstalk and Common Mode Signal Generation Within a Plug/Jack Combination - A communication connector is described that includes a plug and a jack, into which the plug is inserted. The plug terminates a length of twisted pair cable. The jack includes a sled to support contacts for connecting to wires within the cable, a rigid circuit board that connects to the contacts, and a flex board that contacts the plug interface contacts. The jack also includes circuitry to compensate for crosstalk between wire pairs of the cable by adding capacitance values within the sled, rigid circuit board and/or flex board between traces carrying signals from the wire pairs so that crosstalk caused by the plug between wire pairs that have signals in phase cancels with crosstalk caused by the plug between signals out of phase, and so that the capacitance values added between each trace are about equal. The compensation is performed to reduce differential to common mode signal conversion. | 2012-06-21 |
20120156933 | Biosensor Interface Apparatus for a Mobile Communication Device - A bio sensor interface apparatus that utilizes pre-existing or standard electrical connectors of mobile devices such as smart phones, mobile media players, and tablets. The interface device transforms the input bio sensor signals to compatible electrical signals for input to one or more of the mobile's connectors. That signals are then conducted via one or more input conductors in the connectors to the mobile's microprocessor, which may display or transmit the biosensor signals and derive further measurements from them. | 2012-06-21 |
20120156934 | EXTERNAL CONNECTOR FOR SOLID INSULATED LOAD BREAK SWITCHGEAR - Disclosed is an external connector for a solid insulated load break switchgear. A semi-conductive layer for uniformly distributing an inner field is formed in a body part of a connector to uniformly distribute an inner field. This may prevent partial lowering of an insulating performance of the connector to enhance the insulating performance of the connector. Furthermore, a semi-conductive layer for uniformly distributing an outer field is formed between the connector and a bushing coupled to an upper end of the connector, and between the connector and a plug coupled to a lower end of the connector. This may allow an electric field to be uniformly distributed to a part connected to a ground surface of an arc extinguishing part. | 2012-06-21 |
20120156935 | ELECTRICAL CONNECTOR ASSEMBLY WITH AN IMPROVED METALLIC SHELL - An electrical connector assembly ( | 2012-06-21 |
20120156936 | CABLE CONNECTOR ASSEMBLY WITH AN IMPROVED SPACER - A cable connector assembly ( | 2012-06-21 |
20120156937 | ELECTRIC CONNECTOR WITH A LINEARLY AND CIRCULARLY DISPLACEABLE PLUG - An electric connector connecting one plug with several sockets in a housing, arranged to allow rotating the plug relative to the housing, as well as linearly moving the plug along the housing, while keeping the connector functional. The plug pins are movably connected to round flat tracks, which are movably connected to linear tracks that are connected via straps to the corresponding sockets' slots. | 2012-06-21 |
20120156938 | PLUG CONNECTOR WITH IMPROVED CIRCUIT CARD TO LOWER CROSS-TALKING THEREIN - An electrical connector includes an insulating seat loaded with a circuit card therein. The circuit card includes a mating end intended to engage with a complementary connector and a terminal end intended to connect with cables. The mating end includes a row of conductive pad exploding to a first surface thereof. The row of conductive pad includes grounding pads and pairs of differential signal pads between every two of the grounding pads. The terminal end includes a row of conductive pads corresponding connected with the conductive pads of the mating end. The circuit card further is embedded a single piece grounding bar spacing apart from the row of the conductive pads with a gap and connected with the grounding pads of the row of the conductive pads. | 2012-06-21 |
20120156939 | ELECTRICAL CONNECTOR - An electrical connector that includes: an insulating body, having a plurality of receiving slots running through the insulating body, a plurality of terminals, respectively received in the receiving slots, in which the terminal has a base fixed in the receiving slot, two first abutting segments extending downwards from the base, two second abutting segments extending forwards the two first abutting segments, the two second abutting segments are exposed from the receiving slot and abut against the bottom surface of the insulating body, the width between the two second abutting segments is smaller than the diameter of a solder ball, a plurality of stop blocks, respectively disposed in the receiving slots, and a plurality of solder balls, respectively received in the receiving slots. | 2012-06-21 |
20120156940 | CABLE CONNECTOR ASSEMBLY WITH IMPROVED CONTACTS - A cable connector assembly ( | 2012-06-21 |
20120156941 | CABLE CONNECTOR ASSEMBLY WITH IMPROVED CONTACTS AND SPACER - A cable connector assembly ( | 2012-06-21 |
20120156942 | PLUG - A plug is used for connecting a first speaker. The first speaker includes a first magnet, a first vibrating element, and a first electromagnetic inductor. The first vibrating element vibrates relatively to the first magnet for sounding. The first electromagnetic inductor generates electricity induced by a magnetic field of the first magnet. The plug includes a first audio terminal, a pair of first power terminals, and a ground terminal. The first audio terminal is used for electrically connecting the first vibrating element. The pair of first power terminals is used for electrically connecting the first electromagnetic inductor, so as to output the electricity generated by the first electromagnetic inductor. The ground terminal is used for connecting the first vibrating element. | 2012-06-21 |
20120156943 | CABLE CONNECTOR ASSEMBLY WITH IMPROVED CONTACTS - A cable connector assembly ( | 2012-06-21 |
20120156944 | SOCKET FOR WEDGE BULB - Disclosed is a socket for a wedge bulb to maintain excellent grounding performance despite vibration encountered in use. The wedge bulb includes a light emitting element and a connector protruding from a lower end of the light emitting element and provided at each of a front surface and a rear surface thereof with a pair of parallel elastic terminals. The socket includes an elastic supporting terminal unit provided at an inner wall surface of a coupling recess defined in the socket and serving to elastically support the connector inserted into the coupling recess while achieving electrical connection with the electric terminals. Any one of each pair of the electric terminals is pressed and supported by the elastic supporting terminal unit at a different height from the neighboring electric terminal provided at the same surface of the connector and the other electric terminals provided at the opposite surface of the connector. | 2012-06-21 |
20120156945 | CONNECTOR - To provide a connector in which a lance beak part will not be broken, even though a large load is applied by a front holder. | 2012-06-21 |
20120156946 | ELECTRICAL CONNECTION SYSTEM - A photovoltaic module lead foil connection system includes a wire having a fastener. | 2012-06-21 |
20120156947 | RECEPTACLE TERMINAL - A receptacle terminal includes a terminal body with a cable end configured to be terminated to a cable and a mating end configured to be mated with a blade terminal. The terminal body includes a receptacle at the mating end. The receptacle has a first wall and a second wall generally parallel to, and spaced apart from, the first wall. The receptacle has a receiving space between the first and second walls configured to receive the blade terminal. A contact spring is separately provided from, and coupled to, the terminal body and has a spring wall received in the receiving space that is positioned between the first wall and the blade terminal. The spring wall has an inner surface and an outer surface. The inner surface is spring biased against the first wall. The outer surface is configured to be spring biased against the blade terminal. | 2012-06-21 |
20120156948 | SUBSTRATE CONNECTING STRUCTURE AND ELECTRONIC DEVICE - There is provided a board connection structure capable of preventing occurrence of a connection failure, which would otherwise be caused by an uneven temperature increase in connection region of circuit boards during thermo-compression bonding. | 2012-06-21 |
20120156949 | SYSTEM, METHOD, AND ARTICLE OF MANUFACTURE FOR COOLING AND FILTERING ENGINE INTAKE AIR - Various methods and systems are provided for an air induction system for an engine. In one example, the air induction system includes an intake conduit and an assembly coupled to the intake conduit which includes a water spray for removing particulates from, and for cooling, intake air flowing through the water spray. | 2012-06-21 |
20120156950 | PRONE POSITION WATERCRAFT - A personal watercraft is designed to be ridden in a prone position. The craft is generally shaped like a kayak, including a bow and a stern, and includes a shaped, recessed cavity within the boat to accommodate and conform to the riders body disposed in a prone position, so that the rider can propel and navigate the craft using his arms and hands. The recessed cavity is an ergonomically designed space for the rider's body to be cradled within the craft in a prone position, creating a stable and dynamic platform for water exploits, lowering the center of gravity, and allowing the rider to guide the craft through fast running water by leaning in a desired direction. | 2012-06-21 |
20120156951 | UNDERWATER VIEWING FACILITY - An underwater viewing facility consisting of a buoyant platform, having a through-hole, the hole employs an underwater observation device in form of a transparent viewing chamber, preferred of a semi-spherical configuration, a chamber in which a person lying prone on the platform, can insert his entire head or at least his face, enjoying a panoramic wide angle sight. | 2012-06-21 |
20120156952 | METHOD TO CREATE AN ENVIRONMENTALLY RESISTANT SOFT ARMOR COMPOSITE - Fibrous substrates and articles that retain their superior ballistic resistance performance after exposure to liquids such as sea water and organic solvents, such as gasoline and other petroleum-based products. The fibrous substrates are coated with a multilayer polymeric coating including at least two polymer layers wherein the first polymer and the second polymer forming said respective layers are the same and optionally comprise fluorine. | 2012-06-21 |
20120156953 | CURABLE FIBERGLASS BINDER COMPRISING SALT OF INORGANIC ACID - A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an aldehyde or ketone and an amine salt of an inorganic acid. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products. | 2012-06-21 |
20120156954 | CURABLE FIBERGLASS BINDER - A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products. | 2012-06-21 |