25th week of 2009 patent applcation highlights part 46 |
Patent application number | Title | Published |
20090155987 | METHOD OF FABRICATING GALLIUM NITRIDE SUBSTRATE - A method of fabricating a gallium nitride (GaN) substrate provides a GaN thick film without causing bending and cracks which may occur in a growing process. To this end, a nitride embedding layer having a plurality of voids therein is embedded between a GaN layer and a base substrate. The method includes preparing a base substrate, growing, on the base substrate, the nitride embedding layer having a plurality of indium-rich parts at a first temperature, and growing a GaN layer on the nitride embedding layer at a second temperature higher than the first temperature so as to metallize the indium-rich part to form a plurality of voids in the nitride embedding layer. | 2009-06-18 |
20090155988 | ELEMENT OF LOW TEMPERATURE POLY-SILICON THIN FILM AND METHOD OF MAKING POLY-SILICON THIN FILM BY DIRECT DEPOSITION AT LOW TEMPERATURE AND INDUCTIVELY-COUPLED PLASMA CHEMICAL VAPOR DEPOSITION EQUIPMENT THEREFOR - A low temperature poly-silicon thin film element, method of making poly-silicon thin film by direct deposition at low temperature, and the inductively-coupled plasma chemical vapor deposition equipment utilized, wherein the poly-silicon material is induced to crystallize into a poly-silicon thin film at low temperature by means of high density plasma and substrate bias voltage. Furthermore, the atom structure of the poly-silicon thin film is aligned in regular arrangement by making use of the induction layer having optimal orientation and lattice constant close to that of the silicon, thus raising the crystallization quality of the poly-silicon thin film and reducing the thickness of the incubation layer. | 2009-06-18 |
20090155989 | NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING SAME - A nitride semiconductor crystal substrate is produced by forming a network mask repeating a closed loop unit shape upon an undersubstrate, growing a nitride semiconductor crystal in vapor phase, producing convex facet hills covered with facets on exposed parts Π, forming outlining concavities on mask-covered parts | 2009-06-18 |
20090155990 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE AND METHOD FOR CREATING A LAYOUT THEREOF - A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity. | 2009-06-18 |
20090155991 | Methods of fabricating a semiconductor device - A method of fabricating a contact plug of a semiconductor device is provided, the method includes forming a gate pattern on a substrate, forming a capping pattern to cover an upper surface and sidewalls of the gate pattern, forming an interlayer insulation layer on the substrate such that the interlayer insulation layer exposes an upper surface of the capping pattern, and removing a portion of the capping pattern and the interlayer insulation layer such that the upper surface of the capping pattern is planarized. | 2009-06-18 |
20090155992 | HIGH K STACK FOR NON-VOLATILE MEMORY - A memory device may include a source region and a drain region formed in a substrate and a channel region formed in the substrate between the source and drain regions. The memory device may further include a first oxide layer formed over the channel region, the first oxide layer having a first dielectric constant, and a charge storage layer formed upon the first oxide layer. The memory device may further include a second oxide layer formed upon the charge storage layer, a layer of dielectric material formed upon the second oxide layer, the dielectric material having a second dielectric constant that is greater than the first dielectric constant, and a gate electrode formed upon the layer of dielectric material. | 2009-06-18 |
20090155993 | TERMINAL PAD STRUCTURES AND METHODS OF FABRICATING SAME - Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal pads subtractively or by a damascene process. | 2009-06-18 |
20090155994 | FORMING THIN FILM TRANSISTORS USING ABLATIVE FILMS WITH PRE-PATTERNED CONDUCTORS - An ablative film comprising a substrate; at least one ablative layer that is removable by exposure to radiation; one or more deposited conductors; and an active layer including a semiconductor material surrounded at least partially by a dielectric. | 2009-06-18 |
20090155995 | Self-aligned contact formation utilizing sacrificial polysilicon - In general, in one aspect, a method includes forming a spacer layer over a substrate having patterned stacks formed therein and trenches between the patterned stacks. A sacrificial polysilicon layer is deposited over the substrate to fill the trenches. A patterning layer is deposited over the substrate and patterned to define contact regions over at least a portion of the trenches. The sacrificial polysilicon layer is etched using the patterned patterning layer to form open regions. | 2009-06-18 |
20090155996 | PLATING SEED LAYER INCLUDING AN OXYGEN/NITROGEN TRANSITION REGION FOR BARRIER ENHANCEMENT - An interconnect structure which includes a plating seed layer that has enhanced conductive material, preferably, Cu, diffusion properties is provided that eliminates the need for utilizing separate diffusion and seed layers. Specifically, the present invention provides an oxygen/nitrogen transition region within a plating seed layer for interconnect metal diffusion enhancement. The plating seed layer may include Ru, Ir or alloys thereof, and the interconnect conductive material may include Cu, Al, AlCu, W, Ag, Au and the like. Preferably, the interconnect conductive material is Cu or AlCu. In more specific terms, the present invention provides a single seeding layer which includes an oxygen/nitrogen transition region sandwiched between top and bottom seed regions. The presence of the oxygen/nitrogen transition region within the plating seed layer dramatically enhances the diffusion barrier resistance of the plating seed. | 2009-06-18 |
20090155997 | METHOD FOR FORMING Ta-Ru LINER LAYER FOR Cu WIRING - A method of forming a Ta—Ru metal liner layer for Cu wiring includes: (i) conducting atomic deposition of Ta X times, each atomic deposition of Ta being accomplished by a pulse of hydrogen plasma, wherein X is an integer such that a surface of an underlying layer is not covered with Ta particles; (ii) after step (i), conducting atomic deposition of Ru Y times, each atomic deposition of Ru being accomplished by a pulse of hydrogen plasma, wherein Y is an integer such that the Ta particles are not covered with Ru particles; and (iii) repeating steps (i) and (ii) Z times, thereby forming a Ta—Ru metal liner layer on a Cu wiring substrate. | 2009-06-18 |
20090155998 | Atomic layer deposited tantalum containing adhesion layer - Apparatus and methods of fabricating an atomic layer deposited tantalum containing adhesion layer within at least one dielectric material in the formation of a metal, wherein the atomic layer deposition tantalum containing adhesion layer is sufficiently thin to minimize contact resistance and maximize the total cross-sectional area of metal, including but not limited to tungsten, within the contact. | 2009-06-18 |
20090155999 | METHOD FOR FABRICATING METAL SILICIDE - A method for fabricating a metal silicide film is described. After providing a silicon material layer, a metal alloy layer is formed to cover the silicon material layer. A thermal process is performed to form a metal alloy silicide layer in a self-aligned way. A wet etching process is performed by using a cleaning solution including sulfuric acid and hydrogen peroxide to remove the residual metals and unreacted metal alloy. | 2009-06-18 |
20090156000 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is provided, which includes forming a coated film by coating a solution containing a solvent and an organic component above an insulating film located above a semiconductor substrate and having a recess, baking the coated film at a first temperature which does not accomplish cross-linking of the organic component to obtain an organic film precursor, polishing the organic film precursor using a first slurry containing first resin particles and a water-soluble polymer to planarize a surface of the organic film precursor, and polishing the organic film precursor where the surface is planarized using a second slurry containing second resin particles and a water-soluble polymer to leave the organic film precursor in the recess, thereby exposing the insulating film, an average particle diameter of the second resin particles being smaller than that of the first resin particles. | 2009-06-18 |
20090156001 | Structure for reducing stress for vias and fabricating method thereof - A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block. | 2009-06-18 |
20090156002 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE - A wafer is placed on a lower electrode disposed in a reaction chamber; process gas is introduced into the reaction chamber; a magnetic field is applied at a position spaced from a surface of the wafer to be processed; plasma is generated by applying a high-frequency voltage between the lower electrode and an upper electrode disposed to face the lower electrode; the magnetic field is removed after the plasma is stabilized; and the wafer is plasma-processed. | 2009-06-18 |
20090156003 | METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITION TECHNIQUES - In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes forming a tungsten-containing layer by sequentially exposing a substrate to a processing gas and a tungsten-containing gas during an atomic layer deposition process, wherein the processing gas comprises a boron-containing gas and a nitrogen-containing gas, and forming a tungsten bulk layer over the tungsten-containing layer by exposing the substrate to a deposition gas comprising the tungsten-containing gas and a reactive precursor gas during a chemical vapor deposition process. In one example, the tungsten-containing layer and the tungsten bulk layer are deposited within the same processing chamber. | 2009-06-18 |
20090156004 | METHOD FOR FORMING TUNGSTEN MATERIALS DURING VAPOR DEPOSITION PROCESSES - In one embodiment, a method for forming a tungsten material on a substrate surface is provide which includes positioning a substrate within a deposition chamber, heating the substrate to a deposition temperature, and exposing the substrate sequentially to diborane and a tungsten precursor gas to form a tungsten nucleation layer on the substrate during an atomic layer deposition (ALD) process. The method further provides exposing the substrate to a deposition gas comprising hydrogen gas and the tungsten precursor gas to form a tungsten bulk layer over the tungsten nucleation layer during a chemical vapor deposition (CVD) process. Examples are provided which include ALD and CVD processes that may be conducted in the same deposition chamber or in different deposition chambers. | 2009-06-18 |
20090156005 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith - It is disclosed a cleaning liquid used in a process for forming a dual damascene structure comprising steps of etching a low dielectric layer (low-k layer) accumulated on a substrate having thereon a metallic layer to form a first etched-space; charging a sacrifice layer in the first etched-space; partially etching the low dielectric layer and the sacrifice layer to form a second etched-space connected to the first etched-space; and removing the sacrifice layer remaining in the first etched-space with the cleaning liquid, wherein the cleaning liquid comprises (a) 1-25 mass % of a quaternary ammonium hydroxide, such as TMAH and choline, (b) 30-70 mass % of a water soluble organic solvent, and (c) 20-60 mass % of water. The cleaning liquid attains in a well balanced manner such effects that a sacrifice layer used for forming a dual damascene structure is excellently removed, and a low dielectric layer is not damaged upon formation of a metallic wiring on a substrate having a metallic layer (such as a Cu layer) and the low dielectric layer formed thereon. | 2009-06-18 |
20090156006 | COMPOSITIONS AND METHODS FOR CMP OF SEMICONDUCTOR MATERIALS - The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semi-conductor materials. The composition comprises an abrasive, an organic amino compound, an acidic metal complexing agent and an aqueous carrier A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed. | 2009-06-18 |
20090156007 | Polishing slurry and polishing method - The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor. | 2009-06-18 |
20090156008 | Polishing Composition and Polishing Method Using The Same - A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of semiconductor substrates in a suitable manner. | 2009-06-18 |
20090156009 | Method for manufacturing semiconductor device - Provided is a method of manufacturing a semiconductor device capable of providing a stable trench depth, including: forming, on a semiconductor substrate, a first film having a high etching selectivity with respect to the semiconductor substrate; forming, on the first film, a second film having a high etching selectivity with respect to the first film; etching a region of a part of the second film and the first film to expose a surface of the semiconductor substrate in the region; and etching the exposed surface of the semiconductor substrate to form a trench. | 2009-06-18 |
20090156010 | THIN FILM ETCHING METHOD AND SEMICONDUCTOR DEVICE FABRICATION USING SAME - A method for etching a thin film and fabricating a semiconductor device includes etching the thin film on a substrate, while monitoring the removal of an endpoint detection layer remotely located from the substrate, such that precise control of the thin film etching is provided by monitoring the removal of the endpoint detection layer. The endpoint detection layer is formed on a surface of an etching apparatus that is exposed to the same etching conditions as the thin film to be etched. The etching of the thin film is stopped when a predetermined amount of the endpoint detection layer has removed from the surface of the etching apparatus. | 2009-06-18 |
20090156011 | Method of controlling CD bias and CD microloading by changing the ceiling-to-wafer gap in a plasma reactor - In a plasma etch process, critical dimension (CD), CD bias and CD bias microloading are controlled independently of plasma process conditions or parameters, such as RF power levels, pressure and gas flow rate, by depressing or elevating the workpiece support pedestal to vary the gap between the workpiece and the chamber ceiling facing the workpiece, using an axially adjustable workpiece support. | 2009-06-18 |
20090156012 | METHOD FOR FABRICATING LOW K DIELECTRIC DUAL DAMASCENE STRUCTURES - Methods for forming dual damascene structures in low-k dielectric materials that facilitate reducing photoresist poison issues are provided herein. In some embodiments, such methods may include plasma etching a via through a first mask layer into a low-k dielectric material disposed on a substrate. The first mask layer may then be removed using a process including exposing the first mask layer to a first plasma comprising an oxygen containing gas and at least one of a dilutant gas or a passivation gas, and subsequently exposing the first mask layer to a second plasma comprising an oxygen containing gas and formed using one of either plasma bias power or plasma source power. An anti-reflective coating may then be deposited into the via and atop the low-k dielectric material. A trench may then be plasma etched through a second mask layer formed atop the anti-reflective coating into the low-k dielectric material. | 2009-06-18 |
20090156013 | Method and apparatus for removing polymer from the wafer backside and edge - Polymer is removed from the backside of a wafer held on a support pedestal in a reactor using an arcuate side gas injection nozzle extending through the reactor side wall with a curvature matched to the wafer edge and supplied with plasma by-products from a remote plasma source. | 2009-06-18 |
20090156014 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device of the present invention includes: forming a first film, a second film and a third film in sequence on a silicon substrate; patterning a resist film formed on the third film by conducting an exposure and developing process for the resist film employing an exposure mask including a phase shifter; selectively dry-etching the third film through a mask of the resist film employing the second film as an etch stop to process the third film into a first pattern; further dry-etching the third film employing the second film as an etch stop to partially remove the third film, thereby processing the third film into a second pattern; patterning the second film employing the third film having the second pattern as a mask; and patterning the first film employing the patterned second film as a mask. | 2009-06-18 |
20090156015 | DEPOSITION APPARATUS - A deposition apparatus configured to form a thin film on a substrate includes: a reactor wall; a substrate support positioned under the reactor wall; and a showerhead plate positioned above the substrate support. The showerhead plate defines a reaction space together with the substrate support. The apparatus also includes one or more gas conduits configured to open to a periphery of the reaction space at least while an inert gas is supplied therethrough. The one or more gas conduits are configured to supply the inert gas inwardly toward the periphery of the substrate support around the reaction space. This configuration prevents reactant gases from flowing between a substrate and the substrate support during a deposition process, thereby preventing deposition of an undesired thin film and impurity particles on the back side of the substrate. | 2009-06-18 |
20090156016 | METHOD FOR TRANSFER OF A THIN LAYER - A method for transferring a thin layer from an initial substrate includes forming an assembly of the initial substrate with one face of a silicone type polymer layer, this face having been treated under an ultraviolet radiation, and processing the initial substrate to form the thin layer on the silicone type polymer layer. | 2009-06-18 |
20090156017 | METHOD FOR FORMING DIELECTRIC FILM USING SILOXANE-SILAZANE MIXTURE - A method of forming a dielectric film, includes: introducing a siloxane gas essentially constituted by Si, O, C, and H and a silazane gas essentially constituted by Si, N, H, and optionally C into a reaction chamber where a substrate is placed; depositing a siloxane-based film including Si—N bonds on the substrate by plasma reaction; and annealing the siloxane-based film on the substrate in an annealing chamber to remove Si—N bonds from the film. | 2009-06-18 |
20090156018 | Laser mask and crystallization method using the same - A crystallization method includes providing a substrate having a silicon thin film; positioning a laser mask having first to fourth blocks on the substrate, each block having a periodic pattern including a plurality of transmitting regions and a blocking region; and crystallizing the silicon thin film by irradiating a laser beam through the laser mask. A polycrystalline silicon film crystallized by this method is substantially free from a shot mark, and has uniform crystalline characteristics. | 2009-06-18 |
20090156019 | Substrate processing apparatus and method - A substrate processing apparatus is used for radiating UV rays onto a target film formed on a target surface of a substrate to perform a curing process of the target film. The apparatus includes a hot plate configured to heat the substrate to a predetermined temperature, a plurality of support pins disposed on the hot plate to support the substrate, and a UV radiating device configured to radiate UV rays onto the target surface of the substrate supported on the support pins. The support pins are preset to provide a predetermined thermal conductivity to conduct heat of the substrate to the hot plate. The hot plate is preset to have a predetermined thermal capacity sufficient to absorb heat conducted through the support pins. | 2009-06-18 |
20090156020 | Connector - The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections. | 2009-06-18 |
20090156021 | Electrical contact used in electrical connector - An electrical connector includes an insulative housing defining a number of passageways and a plurality of electrical contacts received in corresponding passageways of the insulative housing. Each contact is formed with a base portion, a solder portion bended from a bottom edge of the base portion, a spring portion and a connecting portion linking the base portion and the spring portion. The spring portion has a tip portion at a top end thereof, which is twisted and protrudes out of the insulative housing. | 2009-06-18 |
20090156022 | Contact Member and Connector Including Same - A contact member is disclosed that includes a trunk part into which a strip-shaped part is formed substantially annularly; a first contact part at a first end of the trunk part; and a second contact part at a second end of the trunk part, the second contact part being positioned inside the first contact part. The first contact part and the second contact part face each other. The strip-shaped part is configured to be elastically twisted to cause the second contact part to come into contact with the first contact part in response to the second contact part being pressed in a direction of the axis of the trunk part. The strip-shaped part includes multiple turn-around parts between the first contact part and the second contact part. | 2009-06-18 |
20090156023 | RECEPTACLE CONNECTOR FOR A BATTERY IN THE MOBILE ELECTRIC DEVICE - Provided is a receptacle connector for a battery in a mobile electric device. The receptacle connector includes a contact terminal, a connection terminal, and an extension portion. The contact terminal electrically contacts a plug connector of the mobile electric device. The connection terminal is fit and soldered in a through hole of a battery PCB, and is integrally formed with the contact terminal. The extension portion is bent and extends from a front end of the connection terminal to form a solder receiving space for receiving solder flowing through the through hole of the PCB together with the connection terminal while a soldering operation is performed on the connection terminal. The extension portion together with the connection terminal is fit and soldered in the through hole of the PCB. | 2009-06-18 |
20090156024 | Electrical junction box - An electrical junction box that can enhance reliability in connection between terminal metals and a circuit board includes a casing, a circuit board contained in the casing, a plurality of fuse side terminal metals including board connecting portions electrically coupled to the circuit board, terminal portions adapted to detachably receive fuses in a direction along a surface of the circuit board; and a holder for holding the plural terminal metals in an alignment manner. Each of the fuse side terminal metals is provided with a leg projecting toward the circuit board and is disposed forward of each board connecting portion in a detachable direction of each fuse. The circuit board is provided with through-holes that receive the legs. | 2009-06-18 |
20090156025 | ELECTRONIC APPARATUS WITH A PIN MOUNT - An electronic apparatus has an electronic component and a pin mount. The electronic component has a working surface and two pins protruding from the working surface and each pin being bent to form an L-shape with a proximal part and a distal part. The pin mount has a flat bottom, a rear, two through holes and two communicating recesses. The through holes are defined through the pin mount in parallel, are formed from the front to the rear and receiving the proximal parts of the pins. The communicating recesses are formed in parallel in the front from the through holes toward the bottom of the pin mount, communicate respectively with the through holes and receiving the distal parts of the pins. The pin mount immobilizes the electronic component to prevent the pins from being detached from the electronic component or the PCB to retain the lifetime of the pins. | 2009-06-18 |
20090156026 | CONTACT AND CONNECTING DEVICE - The present invention provides a contact for connection with an electronic component. The contact includes: a base part; a supporting part, provided on top of the base part for supporting a lead terminal of the electronic component; and at least two clamp parts, provided on top of the base part so as to be located on respective outer sides of the supporting part. The clamp parts are adapted to sandwich the lead terminal of the electronic component between themselves and the supporting part. | 2009-06-18 |
20090156027 | Electrical Connector - The present invention discloses an electrical connector comprising: a housing; a base body having a tongue, whose one surface is disposed with a plurality of first terminal slots and whose other surface is disposed with a plurality of second terminal slots; a first terminal assembly whose each first terminal is disposed with a leg and a contact portion slightly perpendicular to the leg, respectively, with the legs being alternately arranged; and a second terminal assembly whose each second terminal is disposed with a leg and a contact portion slightly perpendicular to the leg and then bending downward, respectively. | 2009-06-18 |
20090156028 | COMPLIANT INTERCONNECT APPARATUS WITH LAMINATE INTERPOSER STRUCTURE - Apparatus to electrically connect a first electrical contact to a second electrical contact includes opposed upper and lower elastomer layers formed on either side of an electrically insulating intermediate layer together forming a laminate interposer structure having a thickness. An electrically conducting elastic column to provide a localized conductive path is formed through the thickness of the laminate interposer structure. The upper and lower elastomer layers provide compliance between the upper and lower elastomer layers and the elastic column, and the intermediate layer provides reduced compliance between the intermediate layer and the elastic column relative to the compliance between the upper and lower elastomer layers and the elastic column. | 2009-06-18 |
20090156029 | Separable electrical connectors using isotropic conductive elastomer interconnect medium - An electrical connector using an isotropic conductive elastomer as the interconnect medium. | 2009-06-18 |
20090156030 | UNIT WITH BUILT-IN CONTROL CIRCUIT - The present invention provides a unit with a built-in control circuit capable of cost reduction. The unit of the present invention is an unit with built-in control circuit comprising a ground line, a control circuit including a plurality of terminals to be connected to an IC-chip, and a plurality of protect elements connected to the terminal and the ground line. | 2009-06-18 |
20090156031 | Coupler Assembly for a Scalable Computer System and Scalable Computer System - The invention relates to a coupler assembly for electrically coupling at least two boards ( | 2009-06-18 |
20090156032 | Interrupter For An Electrical Wire - The invention relates to an interrupter for an electrical wire | 2009-06-18 |
20090156033 | Connector arrangement - A connector arrangement comprises a rigid inner conductor ( | 2009-06-18 |
20090156034 | ROTARY CONNECTOR - A rotary connector includes a stator housing in which an outer tubular body is erected at an outer edge of a bottom plate having a center hole, an upper rotor having a top plate facing the bottom plate and an inner tubular body facing the outer tubular body, and rotatably mounted on the stator housing, a lower rotor having a tubular portion inserted through the center hole towards the top plate from the bottom plate and fixed to the inner tubular body, and an annular flange protruding radially outward from the tubular portion and faces the bottom plate, and a flexible cable housed within an annular housing space formed between the stator housing and the upper rotor so as to be able to be wound and rewound, and having one end attached to the stator housing and the other end attached to the rotor. An inner edge of the bottom plate is provided with an erected portion erected in an axial direction, and the erected portion is made to face the tubular portion such that an inner peripheral surface of the erected portion becomes a sliding surface of the tubular portion, and the erected portion is arranged between a bottom of the inner tubular body and the annular flange such that axial movement of the upper rotor and the lower rotor is suppressed by the erected portion. | 2009-06-18 |
20090156035 | INTERCOUPLING ELECTRICAL DEVICES - A terminal includes a resilient member extending from a first end to a second end, the first end including a contact portion configured to engage a male contact and the second end including a retention feature configured to hold the male contact in place against a first force applied to the male contact by the first end. A plurality of such terminals can be included within an assembly that includes: a first insulative support member defining a first plurality of apertures extending from first surface of the first insulative support member to an opposite second surface of the first insulative support member; with the plurality of terminals received in the apertures. | 2009-06-18 |
20090156036 | MULTIMEDIA CABLE - A multimedia cable includes a casing, a terminal pin, an audio signal unit, a video signal unit, and a control lever. The terminal pin is mounted to the casing so as to be rotated with respect to a rotary shaft, and is configured such that first and second four-conductor terminals are arranged on respective sides of the rotary shaft. A audio signal unit comprising three-conductor connection pins each one end of which is rotatably mounted in the casing and audio cables each of which is connected with said each one end of the three-conductor connection pins respectively. A video signal unit comprising four-conductor connection pins mounted opposite the three-conductor connection pins, each one end of which is rotatably mounted in the casing and video cables which are connected with said each one end of the four-conductor connection pins. The control lever is connected to both the three-conductor connection pins and the four-conductor connection pins to connect either the three-conductor connection pins or the four-conductor connection pins to the terminal pin. | 2009-06-18 |
20090156037 | SNAP-LOCK CONNECTOR - An end cap may include an end cap body that is tubular in shape, an end cap face provided at a first end of the end cap body, a plurality of end cap terminals provided on the end cap face, and a clip notch provided on an exterior side of the end cap body. The second end of the end cap body may be open and structured to receive the lamp therein. A socket may include a socket body that is generally tubular in shape, a socket face provided at a first end of the socket body, a receiving wall extending from an outer periphery of the socket face and extending in a direction away from the socket body, a plurality of socket terminals provided on the socket, and a resilient clip provided on an inner side of the receiving wall. | 2009-06-18 |
20090156038 | Connector structure - The invention relates to a connector comprising at least a contact element, which has at least an unconnected state and a connected state; and a pre-loading element, which has at least a first position and a second position. When the pre-loading element is in the first position, it forces the contact element into the unconnected state and when the pre-loading element is in the second position, it allows the contact element to transfer to the connected state. | 2009-06-18 |
20090156039 | STRUCTURE OF POWER TERMINAL FOR ABS CONNECTOR - The present invention features a power terminal for ABS connector. Preferably, the power terminal for ABS connector is inserted into and secured to an insertion pipe of a male connector for an ABS and has a conductive terminal body. The conductive terminal body has, at one end thereof, a mounting element for mounting a first waterproofing member and a first barrel for securing a power wire, guide projections, projectedly formed at a middle portion thereof, for guiding insertion of the conductive terminal body, and, at the other end thereof, a hook for maintaining an inserted state of the conductive terminal body using an elastic property thereof. The portion of the conductive terminal body that is positioned between the guide projections and the hook is lengthened, a second waterproofing member is mounted to the portion, and a second barrel for securing one end of the second waterproofing member is formed on the conductive terminal body. | 2009-06-18 |
20090156040 | Electrical leadthrough module and method for production thereof - In order to connect together the conductors of the leadthroughs of an electrical leadthrough module in a dependable and simple manner, the invention specifies an electrical leadthrough module that comprises at least two separated electrical leadthroughs, each with at least one conductor passing through an insulating element and protruding on both sides of the insulating element, wherein the conductors of the electrical leadthroughs are connected electrically together by a rod arranged to be axially displaceable with respect to the conductors. | 2009-06-18 |
20090156041 | Electrical Connector For Connection To Multiple Conductors - The present invention provides an electrical connector for connection to multiple conductors. The connector comprises a connector housing and at least two spring clamps in the housing. Each spring clamp has an open position to permit insertion of a conductor and a closed position in which the spring clamp engages the conductor to establish an electrical connection therewith. The connector further comprises a cam shaft having at least two axially spaced cam positions thereon. One of the cam positions is aligned with each spring clamp to open the spring clamps when the cam shaft is turned to an open position and to allow the spring clamps to close when the cam shaft is turned to a closed position. The connector further comprises a lever on said cam shaft for turning the cam shaft between the open and closed positions. The connector further comprises passageways in the connector housing, one for each spring clamp, leading a conductor inserted into the passageway into the corresponding spring clamp when the spring clamp is in the open position. | 2009-06-18 |
20090156042 | Electrical Connecting Device Having Mating State Indication Means - This connecting device has a connector and a counterpart connector suitable to mate therewith, and at least one RFID tag attached to one of said connectors and suitable to communicate with reader, said RFID tag including an antenna. The device further includes a switch adapted to put the RFID tag either in a first communication state or in a second communication state, depending on the full or incomplete mating state of the connectors. | 2009-06-18 |
20090156043 | Connector with an anti-unlocking system - A connector comprising:
| 2009-06-18 |
20090156044 | Electrical Connector and Contact Insertion Guide - The invention relates to a contact insertion guide structure having a contact and an insulative housing. The contact has a mating portion for contacting a mating contact at one end, a terminal portion for connecting to a circuit board on an opposite end, and a press-fit section between the mating portion and the terminal portion. The housing has a contact receiving passageway through which the contact is inserted, and a securing section which is formed in an inner wall of the contact receiving passageway and into which the press-fit section is received. The housing further includes a wide section that does not contact the contact and is formed in an inner wall of the contact receiving passageway proximate to the securing section. A contact support section is formed in the inner wall of the contact receiving passageway. The contact support section guides the contact while coming in contact with it at the time of insertion. The contact support section also supports a portion of the contact between the mating portion and the press-fit section. | 2009-06-18 |
20090156045 | CONNECTOR FOR SENSOR ASSEMBLY - A connector for a sensor assembly having sensing element with a non-conductive body including a plurality of spaced conductive contact pads arranged on opposite faces. A plurality of terminal contacts, each of which is in contact with one of the contact pads are supported in overlying relation to the contact pads on carriers. A separable biasing containment bracket is disposed in surrounding relation to the carriers and includes spring elements urging the carriers and terminal contacts toward the contact pads. A retaining band is interposed between the carriers and the spring elements. | 2009-06-18 |
20090156046 | Connector assembly with improved latch - An electrical connector includes a board connector ( | 2009-06-18 |
20090156047 | Electrical connector with blocking portions for preventing latching arms from tilting - An electrical connector ( | 2009-06-18 |
20090156048 | Electrical Connector And Contact Insertion Guide - The invention relates to a contact insertion guide structure having a contact and an insulative housing. The contact having a mating portion for contacting a mating contact at one end, a terminal portion for connecting to a circuit board on an opposite end, and a press-fit section between the mating portion and the terminal portion. The housing having a contact receiving passageway through which the contact is inserted, and a securing section which is formed in an inner wall of the contact receiving passageway and into which the press-fit section is received. The contact further includes a first narrow section formed closer to the terminal portion than the press-fit section and thinner than the press-fit section, and a second narrow section formed closer to the terminal portion than the first narrow section and further thinner than the first narrow section. The housing further comprising a wide section that is formed in the contact receiving passageway at a more downstream side in a direction where the contact is inserted than a position where the securing section is formed. The wide section has a larger width than that of the first narrow section of the contact. The housing further including a contact support section that is formed in the contact receiving passageway at a more downstream side in the direction where the contact is inserted than a position where the wide section is formed, and the contact supporting section supporting the first narrow section of the contact. | 2009-06-18 |
20090156049 | CARD CONNECTOR WITH A CARD INSERTION GUIDE - A card connector includes an electrically insulative frame base, which defines a card insertion space and a sliding slot at one side of the card insertion space, a metal shielding cover, which covers the card insertion space and has an elongated guide hole corresponding to the sliding slot, a slide slidably mounted in the sliding slot, an elastic member connected between the slide and the rear side of the electrically insulative frame base, a guide rod fastened to the rear side of the electrically insulative frame base to guide movement of the slide along the sliding slot, and a limiter member fastened to the slide and movable along the elongated guide hole of the metal shielding cover for guiding an electronic card into the card insertion space and holding the inserted electronic card in positive contact with respective metal terminals in the electrically insulative frame base. | 2009-06-18 |
20090156050 | PORTABLE ELECTRONIC APPARATUS, POWER DETECTION JACK AND POWER DETECTION METHOD - A power detection jack can be connected with a plurality of power output jacks respectively to receive different power levels. Each of the power output jacks has a first insulation element, and the lengths of the first insulation elements are different from each other. The power detection jack includes a first electrode, a second electrode and a power detection element. The first electrode is disposed inside the power detection jack. The second electrode is disposed outside the power detection jack. The power detection element is disposed between the first electrode and the second electrode. When the power detection jack is connected with one of the power output jacks, the power level provided by the power output jack is determined according to a connection state of the power detection element and the first insulation element. | 2009-06-18 |
20090156051 | HDMI source detection - A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. | 2009-06-18 |
20090156052 | Battery connector with contact terminal having improved retaining force - A battery connector adapted to hold a battery, comprises an insulative housing, a first conductive contact and a second conductive contact. The insulative housing defines a receiving chamber which having a horizontal bottom. The first conductive contact comprises a retention portion retained in the periphery of the receiving chamber, a resilient portion extending in a horizontal direction from the retention portion and pivotal about an axis of the retention portion along a vertical direction, a hook portion extending from a distal end of the resilient portion, and a spring arm extending from a location adjacent the distal end of the resilient portion. The second conductive contact is disposed in the bottom and having a resilient contacting portion for electrically engaging with the battery. | 2009-06-18 |
20090156053 | Electrical power apparatus with retractable cords and moveable sockets - An electrical power apparatus is provided, the apparatus comprises: a housing comprising a top portion, a bottom portion and side walls creating an external surface generally perpendicular to said top and bottom portions and an internal cavity, said housing having at least one slot situated at the top portion and at least one indentation situated on said side walls, the indentation is situated adjacent to the slot; and at least one socket component connected to an extendable cord, the socket component is situated within the indentation of the housing at a first position generally perpendicular to the top or bottom portion of the housing and moveable to the slot of the housing at a second position generally parallel to the top or bottom portion of the housing. | 2009-06-18 |
20090156054 | WALL PLATE ASSEMBLY - A wall plate assembly includes a wall plate having an insertion slot, and a signal adapter that is affixed to the back side of the wall plate and has a HDMI jack attached to the insertion slot of the wall plate for receiving a HDMI plug of a HDMI cable and an adapter module with RJ type module jacks electrically connected to the HDMI jack for the connection of RJ type cables for long distance signal transmission without signal attenuation. | 2009-06-18 |
20090156055 | BIDIRECTIONAL USB PORT FOR VEHICLE - Disclosed herein is a bidirectional USB port for a vehicle. In order to allow a USB memory stick to be inserted into a USB port in either direction, two PCBs are provided in the USB port and are arranged in opposite directions such that the USB memory stick can be bidirectionally inserted into the USB port. | 2009-06-18 |
20090156056 | DEVICE FOR REMOVING FOREIGN SUBSTANCES FROM USB PORT FOR VEHICLES - A device for removing foreign substances from a USB port for vehicles includes a removal plate, a toothed rod, a gear assembly, a reversible rotation motor, and a control unit. The removal plate is installed to a lower end in the USB port in such a way as to be movable up and down. The toothed rod is mounted to a bottom portion of the removal plate so as to be able to move the removal plate up and down, with teeth being provided on a surface of the toothed rod. The gear assembly engages with the teeth for moving the toothed rod up and down. The reversible rotation motor rotates the gear assembly in two opposite directions. The control unit controls the operation of the motor. The device allows users to remove foreign substances in a simpler way. | 2009-06-18 |
20090156057 | SINGLE POLE CABLE CONNECTOR - A single pole cable connector includes an insulating sleeve defining a channel and a non-circular contact positioned in the channel. The insulating sleeve may further include a non-circular, nonmetallic locking sleeve defining a portion of the channel. The channel and contact may be hexagonal-shaped in some cases. The insulating sleeve may have an exterior surface having two flat surfaces disposed opposite each other. | 2009-06-18 |
20090156058 | ELECTRONIC MODULE WITH ANTI-EMI METAL GASKET - An electronic module ( | 2009-06-18 |
20090156059 | Cable assembly having outer cover robutsly supported - A cable assembly in accordance with the present invention comprises an electrical connector including an insulative housing defining a mating portion and a pair of positioning portions extending rearwardly from the mating portion, a plurality of terminals received in the insulative housing and at least one metal shell surrounded the insulative housing; a cable electrically terminated to the terminals; and a rear cover substantially enveloping the insulative housing and snugly supported by the positioning portions. | 2009-06-18 |
20090156060 | ELECTRICAL CONNECTOR, CABLE AND APPARATUS UTILIZING SAME - An electrical connector, such as a circuit board connector, includes a housing having therein a divided multi-connector element. The electrical connector is adapted to electrically connect with a substrate, such as a circuit board. The divided multi-connector element includes a divided electrical contact configuration that includes a first group or subassembly of electrical contacts physically separate from an adjacent and second group or subassembly of contacts. The first group of electrical contacts and second group of electrical contacts each include a row of lower contacts and upper contacts. The second group of electrical contacts has an identical but mirrored configuration as the first group of electrical contacts. | 2009-06-18 |
20090156061 | NON-LINEAR POWER OUTLET EXPANDER AND ASSOCIATED METHODS - A multiple socket electrical outlet device includes a bell shaped housing having an arcuate side wall with a domed upper end and an outwardly flared lower end. The arcuate sidewall forms a perimeter around the bell shaped housing. A plurality of protrusions extends away from the sidewall. Each of the protrusions has a face oriented in a different radial direction around the perimeter of the bell shaped housing. An electrical socket is disposed in the face of each of the plurality of protrusions. The plurality of protrusions are positioned on the sidewall between the domed upper end and the outwardly flared lower end to form a depression between the arcuate side wall and each of the plurality of protrusions with the depression extending between each of the protrusions. | 2009-06-18 |
20090156062 | NON-MECHANICAL MEANS FOR CONNECTOR POLARIZATION FOR A LIGHTING SYSTEM - A lighting system and method for connector polarization, wherein the lighting system includes a lighting module having a substrate, a light source disposed on the substrate, a first connector adapted to provide electrical communication with a source of electrical energy, a conductive path including a supply path and a plurality of return paths, the conductive path providing electrical communication between the light source and the connector, and a diode disposed in at least one of the return paths, wherein the diode militates against a current flowing in an undesirable direction; and a controller having a second connector adapted to provide electrical communication with the lighting module. | 2009-06-18 |
20090156063 | Device for Connecting a Connector to a Solenoid Driving an Injector - The invention concerns a device for connecting a mechanical, hydraulic and electric connector ( | 2009-06-18 |
20090156064 | CONNECTOR AND CIRCUIT-BOARD-MOUNTING CASE HAVING CONNECTOR - A connector assembly includes a metal terminal, a lead wire, a connector housing and a sealing member. The metal terminal defines a longitudinal direction. The metal terminal comprises: a lead-wire connection portion located on a front end side; a counterpart connection portion located on a rear end side; and a press-fit portion located between the lead-wire connection portion and the counterpart connection portion. The press-fit portion comprises a curved portion which curves around an imaginary axis extending in the longitudinal direction. The lead wire comprises an end portion connected to the lead-wire connection portion of the metal terminal and comprising an outer circumferential surface. The connector housing comprises a press-fit hole having a wall surface. The press-fit portion of the metal terminal is press-fit into the press-fit hole. The sealing member provides a seal between the outer circumferential surface of the lead wire and the wall surface of the press-fit hole. | 2009-06-18 |
20090156065 | MULTIPLE GROUND TERMINAL ASSEMBLY FOR VEHICLES - Disclosed herein is a multiple ground terminal assembly for vehicles. The multiple ground terminal assembly includes a multiple ground terminal unit | 2009-06-18 |
20090156066 | ELECTRIC SOCKET - An electric socket includes a base provided with two electrodes and conduction members beside the electrodes. Each of the conduction members is connected to a power source and keeps a predetermined distance away from the electrodes. An upper casing has two apertures corresponding to the electrodes respectively. A power control unit includes a control block beside the conduction members and a control shaft having an end connected to the control block and an opposite end extended out of the upper casing. Two shutter members are pivoted on the base to shut the aperture. When a plug is inserted into the electric socket of the present invention, prongs of the slug will move away the shutter first, and then press the control shaft to make the control block bending the conduction members toward the electrodes that makes the conduction members contacting the electrodes respectively. | 2009-06-18 |
20090156067 | Electronic Communication System - An electronic communication system including: (a) a fastener | 2009-06-18 |
20090156068 | HYBRID PROPULSION SYSTEMS - A hybrid propulsion and energy management system for use in marine vessels and other variable demand propulsion applications monitors and draws energy from various energy sources dynamically to implement multiple operating modes and provide efficient system operation across a range of propulsive demands, altering the operation and output of various energy sources in response to propulsive load demands, hotel loads and auxiliary energy demands. The propulsion system incorporates at least two propulsive sources, including at least one main propulsive engine and at least one motor-generator unit arranged to drive a common output shaft, and the energy management system dynamically shifts operation of each of the two sources to satisfy propulsive demands. The main propulsive engine and the motor-generator unit are capable of driving the common output shaft both independently and simultaneously. The motor-generator unit(s) are available to operate either as a motor driving the output shaft or as a generator supplying energy to the energy distribution system. | 2009-06-18 |
20090156069 | Amphibious vehicle - The amphibious vehicle is a motorized vehicle capable of travel on land as well as in the water. The amphibious vehicle has a boat-like hull and a caterpillar track assembly mounted along each side by a respective pair of rotating supports. The tracks are arranged so that the tracks can be rotated between a lowered position supporting the amphibious vehicle and providing traction and propulsion during land operation, and a raised position, where the tracks rest vertically above the hull's deck during marine operation. With the caterpillar track assemblies in the raised position, the caterpillar track assemblies are fully removed from the water to improve performance and maneuverability therein. The track assemblies are hydraulically driven to rotate the wheels and tracks between the lowered and raised positions. | 2009-06-18 |
20090156070 | MARINE EXHAUST MANIFOLD - A marine exhaust manifold comprises a collector for receiving exhaust gases from an engine, at least two exhaust runners for conducting exhaust gas from said engine to the collector, and a cooling jacket to cool said collector and exhaust runners. In one aspect at least one exhaust runner is adapted to expel exhaust gas into the collector so that the expelled exhaust gas is forced across the gas outlet end of at least one other exhaust runner, thereby creating a pressure drop within said at least one other exhaust runner. In another aspect there are at least three exhaust runners and the gas outlet ends of the exhaust runners are provided in the collector in a substantially single plane, which is substantially parallel to the direction of expulsion of the exhaust gas into the collector. In another aspect the manifold is provided with a sacrificially corroding element, such as a sacrificial anode. | 2009-06-18 |
20090156071 | ENGINE EXHAUST BYPASS SYSTEM FOR OCEAN VESSEL - A primary exhaust bypass for a water-borne vessel having a seat member and a closure member coupled to the seat member, wherein the seat and closure members are configured to seal against exhaust leakage in the closed position and to allow exhaust leakage in the opened condition, and a locking mechanism, wherein the bypass is configured to open when the vessel lists a predetermined amount. A method of bypassing a blocked primary exhaust system may include establishing a bypass exhaust route, providing a normally-closed bypass mechanism at a distal portion of the bypass exhaust route, and changing the orientation of the bypass mechanism with respect to gravity, which may allow the bypass mechanism to open. | 2009-06-18 |
20090156072 | BODY SURFING METHOD AND APPARATUS - A buoyant device that enhances water activities and surfing by providing increased thrust from incident waves through utilization of a surface or volume to propel the buoyant device. A buoyant enclosure with an internal hand grip has surfaces that promote hydroplaning, flotation and the reduction of friction through the shape, materials and laminations used to manufacture the device. At least one of the surfaces can engage moving water allowing a user to benefit from the thrust of a wave to increase propulsion. A shape that combines a planar bottom surface with planar area to at least one side surface forms a wave wall to enhance propulsion from the force of a wave. Hydroplaning is enhanced using material with increased buoyancy to improve the body surfing experience. The devices are hand held by the user and can be used independently or combined to function as a single device. A “bow” like shape can be created by placing devices on both the left and right hand components together as a method of utilizing the system to efficiently cut through the water while simultaneously hydroplaning. | 2009-06-18 |
20090156073 | FIRE RESISTANT CELLULOSIC MATERIALS AND METHOD OF MAKING THE SAME - The invention relates to a fire resistant composition and a method of making fire resistant cellulosic materials comprising the fire resistant composition. More specifically, the invention relates to liquid compositions, including liquid compositions comprising urea and a boron-containing compound for imparting fire resistance to cellulosic products. The boron-containing compound typically comprises boric acids; borates (i.e., boric acid salts); boric oxides (i.e., any compound containing boron and oxygen), and mixtures thereof. | 2009-06-18 |
20090156074 | MICROSPHERE PRESSURE SENSITIVE ADHESIVE COMPOSITION - The present invention provides an adhesive made from a reaction product of: (a) a polymerizable monomer derived at least in part from non-petroleum resources; (b) an initiator; (c) a polymeric stabilizer, wherein the reaction occurs in water to yield a microsphere adhesive. The microsphere adhesive can be formulated into a pressure sensitive adhesive composition that can be applied to various substrates such as paper and polymeric film to produce repositionable adhesive coated articles such as tapes, notes, flags, easels and the like. | 2009-06-18 |
20090156075 | Multicomponent fiber with polyarylene sulfide component - This invention relates to a multicomponent fiber having an exposed outer surface, comprising at least a first component of polyarylene sulfide polymer, and at least a second component of a thermoplastic polymer free of polyarylene sulfide polymer, wherein said thermoplastic polymer forms the entire exposed surface of the multicomponent fiber. | 2009-06-18 |
20090156076 | FLUID RESISTANT COMPOSITE SANDWICH PANEL - A composite sandwich panel a first facing and a second facing over a core layer, the first and second facings having at least one fiberglass layer between an inner and an outer graphite layer. | 2009-06-18 |
20090156077 | Non-woven web having isotropic mechanical properties and preparation method of the same - The present invention relates to a non-woven web useful for the manufacture of suede-like fabric for a car seat cover and a preparation method thereof. The non-woven web according to the present invention is prepared from a copolymer of polyethylene terephthalate and polytrimethylene terephthalate by dispersion in water using a surfactant and crosslinking using flowing water, and has superior mechanical properties including touch, dyeability, wear resistance, etc. Particularly, with superior isotropic mechanical properties over existing materials, it is suitable to be used as car seat cover material. | 2009-06-18 |
20090156078 | Polycarboxy emulsion copolymer binder compositions - The present invention provides flexible binder compositions comprising one or more polycarboxy emulsion copolymer has a measured Tg of 40° C. or less, such as from −45° C. to 25° C., and a polyol crosslinker. In one embodiment, the binder compositions comprising the polycarboxy emulsion copolymer can be used in making pultruded composites, such as sheets, for example, flexible gypsum board facing sheets, and flexible non-woven articles such as, for example, carpet backing. | 2009-06-18 |
20090156079 | ANTISTATIC BREATHABLE NONWOVEN LAMINATE HAVING IMPROVED BARRIER PROPERTIES - A nonwoven web or laminate having improved antistatic properties and alcohol repellency properties is generally provided, along with methods of making the same. The method includes forming a nonwoven web from a thermoplastic mixture of an antistatic agent and a thermoplastic polymer. A high energy treatment is applied to a surface of the nonwoven web. Then, a fluorinated agent is grafted to the surface of the spunbond web utilizing a monomer deposition process. The monomer deposition process can generally include evaporating a liquid fluorinated agent in a vacuum chamber, followed by depositing the fluorinated agent gas on a surface of the spunbond web, and exposing the surface to radiation. | 2009-06-18 |
20090156080 | Binder composition - A binder composition comprising an emulsion copolymer, and a polyol crosslinker. | 2009-06-18 |
20090156081 | PLASMA DISPLAY PANEL CUTTING METHOD, PLASMA DISPLAY PANEL RECYCLING METHOD AND PLASMA DISPLAY PANEL CUTTING APPARATUS - In a method of cutting a plasma display panel, a front glass substrate and a rear glass substrate are sealed so as to face each other. The front glass substrate and the rear glass substrate are sandwiched between pairs of rotating cutters, and the pairs of rotating cutters are pressed onto the front glass substrate and the rear glass substrate to be in contact therewith so that the rotating cutters are run thereon in order to cut the substrates. | 2009-06-18 |
20090156082 | Apparatus for Transferring Substrate - An apparatus for transferring at least one substrate includes a base, a plurality of forks and at least one fastener. The base has a side surface. The forks are disposed on the side surface of the base and parallel to each other. The fastener is disposed on each of the forks. | 2009-06-18 |
20090156083 | METHOD OF MANUFACTURING DISPLAY APPARATUS WITH SAW TOUCH SENSOR - First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. After the step of forming the first electrodes, piezoelectric elements functioning a SAW touch sensor is formed on a second major surface of the transparent substrate. Furthermore, after the step of forming the piezoelectric elements, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed. | 2009-06-18 |
20090156084 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - Disclosed is a light emitting device manufacturing apparatus including a plurality of processing chambers for performing a substrate processing for forming, on a target substrate, a light emitting device having multiple layers including an organic layer, wherein each of the plurality of processing chambers is configured to perform a substrate process on the target substrate while maintaining the target substrate such that its device forming surface, on which the light emitting device is to be formed, is oriented toward a direction opposite to a direction of gravity. | 2009-06-18 |
20090156085 | BUBBLE MAKER - A device includes a body portion having a cavity therein. A reservoir is positioned within the body portion. A portion of the reservoir forms an abdominal region of the animal shaped body. An actuating mechanism is further coupled to the body. A motorized bubble making unit is disposed within the cavity to expel a stream of bubbles from the animal shaped body. The actuating mechanism activates the motorized bubble making unit to expel a stream of bubbles from the animal shaped body. | 2009-06-18 |
20090156086 | Noodle and web construction toy system - A flotation apparatus has a plurality of axially elongated flotation elements and a flexible web with a plurality of slits that accommodate the elongated flotation elements as a woven array. The slits each have a semicircular, S-like, or wave-like configurations. Respectively associated pairs of slits are oriented in inverted manner with respect to one another to form a supportive region between each pair of slits. At least one flexible web element is configured in some embodiments to have an elongated central portion with first and second slits therethrough for accommodating respective ones of first and second end terminations of the flexible web element after wrapping around respective ones of the first and second noodle elements. One or two flexible web elements wrap snugly around the respective ones of the first and second noodle elements. | 2009-06-18 |