25th week of 2009 patent applcation highlights part 13 |
Patent application number | Title | Published |
20090152686 | Film Forming Method for Dielectric Film - The present invention is a film forming method for an SiOCH film, comprising a unit-film-forming step including: a deposition step of depositing an SiOCH film element by using an organic silicon compound as a raw material and by using a plasma CVD method; and a hydrogen plasma processing step of providing a hydrogen plasma process to the deposited SiOCH film element, wherein the unit-film-forming step is repeated several times so as to form an SiOCH film on a substrate. | 2009-06-18 |
20090152687 | METHOD OF OPENING PAD IN SEMICONDUCTOR DEVICE - A method of opening a pad in a semiconductor device. A protective film on a pad may be etched with a pad opening pattern as a mask. Dielectric heating may be performed on the pad opened by etching the protective film. Organic material containing C and F groups on the pad may be removed by heating with molecular vibration and/or microwaves, which may substantially prevent and/or minimize corrosion. | 2009-06-18 |
20090152688 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INTERFERENCE - An integrated circuit package system comprising: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element. | 2009-06-18 |
20090152689 | Integrated Circuit Package for High-Speed Signals - An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board (PCB) transmission line to which the packaged chip is attached by, for example, solder balls. In one exemplary embodiment, a three-segment transmission line transformer provides improved broadband performance with the advantage of having a middle segment with a flexible length for easier routing. The length of each end segment of the three-segment transformer is adjusted to provide at least partial cancellation of reflections between the PCB and the transformer, and between the transformer and a circuit on the integrated circuit, respectively. Further, the inductive reactance of the solder balls and via wiring may be cancelled out by the transformed chip impedance to provide a non-inductive termination to the PCB transmission line at approximately one-half the highest data rate of the channel. | 2009-06-18 |
20090152690 | Semiconductor Chip Substrate with Multi-Capacitor Footprint - Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of the plural conductor pads. Each of the plural openings has a footprint corresponding to a footprint of a smallest size terminal of a capacitor adapted to be coupled to the semiconductor chip substrate. A conductor material is placed in the plural openings to establish plural capacitor pads. | 2009-06-18 |
20090152691 | LEADFRAME HAVING DIE ATTACH PAD WITH DELAMINATION AND CRACK-ARRESTING FEATURES - One aspect of the invention pertains to a semiconductor package having a die and a die attach pad with a plurality of spaced apart pedestals supported by a web. A die is mounted on the die attach pad such that the die is supported by at least a plurality of the pedestals. Selected edge regions of the die are arranged to overlie recessed regions of the die attach pad between adjacent pedestals. The die is electrically connected to at least some of the contact leads. An adhesive is arranged to secure the die to the die attach pad, with the thickness of the adhesive between the web of the die attach pad and the die being greater than the thickness of the adhesive between the die and the top surfaces of the pedestals that support the die. The die attach pad may have rounded peripheral corners between adjacent edge surfaces of the die attach pad. In another aspect of the invention, a method of packaging integrated circuits is described, wherein the resulting packages include at least some of the aforementioned leadframe structures. | 2009-06-18 |
20090152692 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKING - An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electrical interconnect between bond pad and the carrier; and forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered. | 2009-06-18 |
20090152693 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring board having: plural stacked insulating layers; test pads and external connection pads which are disposed on a face of the plural stacked insulating layers located on the side opposite to that where another wiring board is connected; first wiring patterns which electrically connect internal connection pads with the test pads; and second wiring patterns which electrically connect semiconductor element mounting pads with the external connection pads. The external connection pads are placed on the inner side of the test pads. | 2009-06-18 |
20090152694 | Electronic device - Embodiments provide an electronic device. The electronic device includes a leadframe having a first face that defines an island and multiple leads configured to communicate with a chip attached to the island, a first structure element separate from and coupled to a first face of the leadframe, at least one electrical connector coupled between the chip and the first structure element, and at least one electrical connector coupled between the first structure element and one of the multiple leads. | 2009-06-18 |
20090152695 | SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid-crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates. | 2009-06-18 |
20090152696 | SEMICONDUCTOR DEVICE - A semi-conductor device ( | 2009-06-18 |
20090152697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post. | 2009-06-18 |
20090152698 | INTEGRATED MATCHING NETWORKS AND RF DEVICES THAT INCLUDE AN INTEGRATED MATCHING NETWORK - An integrated matching network includes a first die on a substrate, a second die on the substrate, and a metallization layer on the first and second dies. The second die has a capacitance, the metallization layer has an inductance, and the capacitance and inductance together provide a shunt impedance from the first die to the substrate. The integrated matching network includes a first die having a power amplifier, a second die having a capacitor, and a metal interconnect coupled to the power amplifier and the first capacitor. The metal interconnect has an inductance. The capacitor and metal interconnect form a shunt impedance. | 2009-06-18 |
20090152699 | PACKAGING APPARATUS OF TERAHERTZ DEVICE - There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device. | 2009-06-18 |
20090152700 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTABLE INTEGRATED CIRCUIT DIE - A mountable integrated circuit package system includes: mounting an integrated circuit die over a package carrier; connecting a first internal interconnect between the integrated circuit die and the package carrier; and forming a package encapsulation over the package carrier and the first internal interconnect, with the integrated circuit die partially exposed within a recess of the package encapsulation. | 2009-06-18 |
20090152701 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION - An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed. | 2009-06-18 |
20090152702 | Coupling wire to semiconductor region - A first device has a surface and includes a micrometer-scale or smaller geometry doped semiconductor region extending along the surface. A second device has a surface opposite the surface of the first device and includes a micrometer-scale or smaller wire extending through the second device to a position in proximity to the surface of the second device. The first and second devices are displaceable between first and second positions relative to each other. The wire is not substantially electrically coupled to the doped semiconductor region in the first position and the wire is substantially electrically coupled to the doped semiconductor region in the second position. A potential applied to the wire affects the conductivity of the doped semiconductor region in the second position. | 2009-06-18 |
20090152703 | Semiconductor Components Having Through Interconnects And Backside Redistribution Conductors - A semiconductor component includes a semiconductor substrate having a circuit side with integrated circuits and substrate contacts and a back side, a plurality of through interconnects in the substrate, and redistribution conductors on the back side of the substrate. Each through interconnect includes a via aligned with a substrate contact, and a conductive layer at least partially lining the via in physical and electrical contact with the substrate contact. Each redistribution conductor is formed by a portion of the conductive layer. A system includes a supporting substrate and at least one semiconductor substrate having the through interconnects and the redistribution conductors. | 2009-06-18 |
20090152704 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER - An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot. | 2009-06-18 |
20090152705 | Micromechanical Component and Method for Fabricating a Micromechanical Component - A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive regions of the structure layer within the first and/or second substrate. | 2009-06-18 |
20090152706 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT LOCK - An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier. | 2009-06-18 |
20090152707 | METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS - Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device area includes an array of metallized contacts. Dice are mounted onto each device area and electrically connected to the array of contacts. The surface of the substrate including the dice, contacts and electrical connections is then encapsulated. The semiconductor wafer is then sacrificed leaving portions of the contacts exposed allowing the contacts to be used as external contacts in an IC package. In various embodiments, other structures, including saw street structures, may be incorporated into the device areas as desired. By way of example, structures having thicknesses in the range of 10 to 20 microns are readily attainable. | 2009-06-18 |
20090152708 | SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed. | 2009-06-18 |
20090152709 | SEMICONDUCTOR DEVICE - A semiconductor device with semiconductor chips stacked thereon is provided. The semiconductor device is reduced in size and thickness. In a first memory chip and a second memory chip, first pads of the first memory chip located at a lower stage and hidden by the second memory chip located at an upper stage are drawn out by re-wiring lines, whereby the first pads projected and exposed from the overlying second memory chip and second pads of the second memory chip can be coupled together through wires. Further, a microcomputer chip and third pads formed on re-wiring lines are coupled together through wires over the second memory chip, whereby wire coupling of the stacked memory chips can be done without intervention of a spacer. | 2009-06-18 |
20090152710 | QUAD FLAT NO-LEAD (QFN) PACKAGES - Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material. | 2009-06-18 |
20090152711 | RECTIFICATION CHIP TERMINAL STRUCTURE - The present invention includes a base, a rectification chip, a conductive element and a coupling collar. The base has an installation pedestal to hold the rectification chip surrounded by an insulation portion. The conductive element has a root portion to connect the rectification chip. The root portion is extended to form a buffer section. The coupling collar is located at one end of the base to hold the package. The installation pedestal and the inner rim of the base are interposed by a gap. At least one hook portion is formed between the installation pedestal and the bottom of the gap. Thus the base does not turn against the package. The coupling collar has two ends formed an area different from any cross section area of the inner wall thereof. | 2009-06-18 |
20090152712 | Packaging apparatus for optical-electronic semiconductors and a packaging method therefor - A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air-vent and the mold base has a predetermined width. The encapsulating module includes a plate engaged with the mold base, a plurality of molding bodies penetrating the plate and received in the receiving space, and a plurality of supporting members connected to the molding bodies. The fixing member has a plurality of holding slots to hold the supporting members so that the supporting members are more stable. Furthermore, the width of the mold base is optimized with the dimension of a furnace so that the production rate is increased and the stability of the packaging structure is improved. | 2009-06-18 |
20090152713 | INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX - Embodiments of a thermal interface material layer comprised of an oil or a wax are disclosed. The thermal interface material may be used to thermally couple an integrated circuit die to a thermal component, such as a heat spreader. Other embodiments are described and claimed. | 2009-06-18 |
20090152714 | Semiconductor device and method for manufacturing the same - An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface. | 2009-06-18 |
20090152715 | Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer - A semiconductor device is made by first forming a protective layer over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer. | 2009-06-18 |
20090152716 | WIRING SUBSTRATE AND ELECTRONIC COMPONENT MOUNTING STRUCTURE - A wiring substrate on which an electronic component is flip-chip bonded, including a substrate main body, a solder resist which is formed on the substrate main body and having an opening, and a plurality of conductive pattern formed on the substrate main body, including exposure surfaces exposed from the opening of the solder resist. The conductive patterns include, a narrow interval group, a wide interval group, an interval between the adjacent conductive patterns belonging to the narrow interval group is narrower than an interval between the adjacent conductive patterns belonging to the wide interval group, an exposure length of the conductive patterns of the narrow interval group is shorter than an exposure length of the conductive patterns of the wide interval group. | 2009-06-18 |
20090152717 | METHOD OF FORMING STACKED DIE PACKAGE - A method of packaging semiconductor integrated circuits, including the steps of providing a transfer film and forming a patterned, conductive layer on a surface of the transfer film. A first semiconductor integrated circuit (IC) then is attached to the transfer film, where an active side of the first IC is attached to the transfer film. A second semiconductor IC then is attached to the first IC, where a bottom side of the second IC is attached to a bottom side of the first IC. Die pads on an active surface of the second IC are electrically connected to the conductive layer with wires and then a resin material is provided on one side of the transfer film to encapsulate the first and second ICs, the wires and a portion of the conductive layer. Next the transfer film is removed, which exposes the active side of the first IC and the conductive layer. An electrical distribution layer is formed over the active side of the first IC and the conductive layer and conductive balls are attached to the electrical distribution layer. The conductive balls allow electrical interconnection to the first and second integrated circuits. | 2009-06-18 |
20090152718 | STRUCTURE WITH DIE PAD PATTERN - A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads. | 2009-06-18 |
20090152719 | METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES - A method is disclosed which includes forming a layer of conductive material above a substrate, forming a masking layer above the layer of conductive material, performing a first etching process on the layer of conductive material with the masking layer in place, removing the masking layer and, after removing the masking layer, performing an isotropic etching process on the layer of conductive material to thereby define a plurality of piercing bond structures positioned on the substrate. | 2009-06-18 |
20090152720 | MULTILAYER CHIP SCALE PACKAGE - A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP. | 2009-06-18 |
20090152721 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first passivation layer, a first metal layer, a second passivation layer, a second metal layer and a third metal layer. The substrate has a surface having at least one first pad and at least one second pad. The first passivation layer covers the surface of the substrate and exposes the first pad and the second pad. The first metal layer is formed on the first passivation layer and is electrically connected to the second pad. The second passivation layer is formed on the first metal layer and exposes the first pad and part of the first metal layer. The second metal layer is formed on the second passivation layer and is electrically connected to the first pad. The third metal layer is formed on the second passivation layer and is electrically connected to the first metal layer. | 2009-06-18 |
20090152722 | Synergy Effect of Alloying Materials in Interconnect Structures - A method of forming an integrated circuit structure, the method includes providing a semiconductor substrate; forming a dielectric layer over the semiconductor substrate; forming an opening in the dielectric layer; forming a seed layer in the opening; forming a copper line on the seed layer, wherein at least one of the seed layer and the copper line comprises an alloying material; and forming an etch stop layer on the copper line. | 2009-06-18 |
20090152723 | INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME - An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon. | 2009-06-18 |
20090152724 | IC INTERCONNECT FOR HIGH CURRENT - IC interconnect for high current device, design structure thereof and method are disclosed. One embodiment of the IC interconnect includes a first via positioned in a dielectric and coupled to a high current device at one end; a buffer metal segment positioned in a dielectric and coupled to the first via at the other end thereof; and a plurality of second vias positioned in a dielectric and coupled to the buffer metal segment at one end and to a metal power line at the other end thereof, wherein the buffer metal segment is substantially shorter in length than the metal power line. | 2009-06-18 |
20090152725 | Thick metal interconnect with metal pad caps at selective sites and process for making the same - The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same. | 2009-06-18 |
20090152726 | METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A metal line includes a lower metal line pattern having a first width formed over the dielectric pattern and an upper metal line pattern formed over and contacting the lower metal line pattern such that the upper metal line pattern has a second width less than the first width. | 2009-06-18 |
20090152727 | BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME - A bonding pad includes a conductive layer formed over an insulation layer, and a dummy pattern penetrating the insulation layer and stuck in the conductive layer, wherein a bonding process is performed. | 2009-06-18 |
20090152728 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance wiring is formed occupying a predetermined region. A first wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a first copper wiring layer, each of which has a rectangular shape extending in a first direction. A second wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a second copper wiring layer adjacent to the first copper wiring layer, each of which has a rectangular shape extending in a second direction orthogonal to the first direction. The region occupied by the first wiring pattern and that occupied by the second wiring pattern are arranged such that they at least overlap. The first wiring pattern and the second wiring pattern are electrically connected so as to have the same electric potential. | 2009-06-18 |
20090152729 | Semiconductor device - An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire. | 2009-06-18 |
20090152730 | Interconnected structure for TFT-array substrate - An exemplary interconnected structure for transferring a voltage signal to a thin film transistor (TFT) array substrate includes a first metal layer ( | 2009-06-18 |
20090152731 | SEMICONDUCTOR PACKAGE - In a semiconductor package, at least two of connection pads are formed into different-shape pads which are different in planar shape from other connection pads, and one different-shape pad and another different-shape pad are disposed in a manner that, when the position of the one different-shape pad is rotated about the center point of the semiconductor package, the position does not coincide with the disposition position of the other different-shape pad. | 2009-06-18 |
20090152732 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - By covering inner surfaces of a wiring groove | 2009-06-18 |
20090152733 | DEEP CONTACTS OF INTEGRATED ELECTRONIC DEVICES BASED ON REGIONS IMPLANTED THROUGH TRENCHES - An embodiment of an integrated circuit includes first and second semiconductor layers and a contact region disposed in the second layer. The first semiconductor layer is of a first conductivity, and the second semiconductor layer is disposed over the first layer and has a surface. The contact region is contiguous with the surface, contacts the first layer, includes a first inner conductive portion, and includes an outer conductive portion of the first conductivity. The contact region may extend deeper than conventional contact regions, because where the inner conductive portion is formed from a trench, doping the outer conductive portion via the trench may allow one to implant the dopants more deeply than conventional techniques allow. | 2009-06-18 |
20090152734 | Super-Self-Aligned Contacts and Method for Making the Same - A number of first hard mask portions are formed on a dielectric layer to vertically shadow a respective one of a number of underlying gate structures. A number of second hard mask filaments are formed adjacent to each side surface of each first hard mask portion. A width of each second hard mask filament is set to define an active area contact-to-gate structure spacing. A first passage is etched between facing exposed side surfaces of a given pair of neighboring second hard mask filaments and through a depth of the semiconductor wafer to an active area. A second passage is etched through a given first hard mask portion and through a depth of the semiconductor wafer to a top surface of the underlying gate structure. An electrically conductive material is deposited within both the first and second passages to respectively form an active area contact and a gate contact. | 2009-06-18 |
20090152735 | Metal Interconnection and Method for Manufacturing the Same in a Semiconductor Device - Provided is a method for manufacturing a metal interconnection in a semiconductor device. The semiconductor device fabricated according to one embodiment comprises a copper interconnection having reduced sheet and contact resistance. In the method for manufacturing the copper interconnection, a dielectric comprising a via hole is formed on a semiconductor substrate. A diffusion barrier is deposited in the via hole of the dielectric using a process including a plasma enhanced atomic layer deposition (PEALD) process. A copper metal layer can be formed on the via hole through an electroplating process. | 2009-06-18 |
20090152736 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device includes forming an insulating film above a semiconductor substrate, forming a concave portion in the insulating film, forming a precursor film including a predetermined metallic element on a surface of the insulating film, carrying out a heat treatment on the precursor film and the insulating film to react with each other, thereby forming an insulative barrier film mainly comprising a compound of the predetermined metallic element and a constituent element of the insulating film in a self-aligned manner at a boundary surface between the precursor film and the insulating film, removing an unreacted part of the precursor film after forming the barrier film, forming a conductive film comprising at least one of Ru and Co on the barrier film, depositing a wiring material film on the conductive film, and forming a wiring from the wiring material film to provide a wiring structure. | 2009-06-18 |
20090152737 | MEMORY DEVICES HAVING CONTACT FEATURES - Annular, linear, and point contact structures are described which exhibit a greatly reduced susceptibility to process deviations caused by lithographic and deposition variations than does a conventional circular contact plug. In one embodiment, a standard conductive material such as carbon or titanium nitride is used to form the contact. In an alternative embodiment, a memory material itself is used to form the contact. These contact structures may be made by various processes, including chemical mechanical planarization and facet etching. | 2009-06-18 |
20090152738 | INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER - Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed. | 2009-06-18 |
20090152739 | METHOD AND SYSTEM FOR FILTERS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE - Methods and systems for filters embedded in an integrated circuit package are disclosed and may include controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to the integrated circuit. The one or more filter components may be electrically coupled to one or more switchable capacitors within the integrated circuit. The filter components may include transmission line devices, microstrip filters, transformers, surface mount devices, inductors, and/or coplanar waveguide filters. The filter components may be fabricated utilizing metal conductive layers and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package. The integrated circuit may be electrically coupled to the multi-layer package utilizing a flip-chip bonding technique. | 2009-06-18 |
20090152740 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP - An integrated circuit package system includes: mounting a flip chip over a carrier with a non-active side of the flip chip facing the carrier; mounting a substrate over the flip chip; connecting an internal interconnect between the flip chip and the carrier; and encapsulating the flip chip and the internal interconnect over the carrier with the substrate exposed. | 2009-06-18 |
20090152741 | CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF - A chip structure including a chip, a first dielectric layer and at least one first conductive layer is provided. The chip has an active surface, a backside and at least one bonding pad disposed on the active surface. The first dielectric layer is disposed on the active surface and has at least one first opening, wherein the first opening correspondingly exposes the bonding pad. The first conductive layer covers an inner wall of the first opening and the bonding pad so as to form a concave structure in the first opening. When the chip structure is bonded to a substrate, the solder bump of the substrate is inlaid into the concave structure of the chip. Moreover, a fabrication process of the chip structure, a flip chip package structure and a fabrication process thereof, a package structure of a light emitting/receiving device and a chip stacked structure are also provided. | 2009-06-18 |
20090152742 | Method of manufacturing semiconductor package and semiconductor plastic package using the same - A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs. | 2009-06-18 |
20090152743 | ROUTING LAYER FOR A MICROELECTRONIC DEVICE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF FORMING A MULTI-THICKNESS CONDUCTOR IN SAME FOR A MICROELECTRONIC DEVICE - A routing layer for a microelectronic device includes a first region ( | 2009-06-18 |
20090152744 | REACTION VESSEL ASSEMBLY WITH GAS EXCHANGE MEANS - A reaction vessel assembly achieves enhanced aeration or gas exchange in its gas-in-liquid multiphase mixing reaction through the use of its mixing energy and gas-lift venting, and without the traditionally practiced external line gas sparging. It combines the best of both shake flask and stirred tank reactor vessel and possesses some of the key generic features like cost and parallel experiment advantages of the traditional flasks and shaker hybrid but without their shortcomings like limited gas exchange and uncharacteristic mixing. | 2009-06-18 |
20090152745 | METHOD AND SYSTEM FOR MANUFACTURING INTEGRATED MOLDED CONCENTRATOR PHOTOVOLTAIC DEVICE - A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a cavity region. The cavity region forms a first concentrator region overlying a vicinity of the first photovoltaic region and a second concentrator region overlying a vicinity of the second photovoltaic region. The method includes transferring a molding compound in a fluidic state into the cavity region to fill the cavity region with the molding compound and initiating a curing process of the molding compound to form a first concentrator element and a second concentrator element overlying the respective photovoltaic regions. | 2009-06-18 |
20090152746 | MULTI-STAGE INJECTION OVER-MOLDING SYSTEM WITH INTERMEDIATE SUPPORT AND METHOD OF USE - An over-molding tool is provided for over-molding an over-mold onto a fiber optic cable assembly. The over-molding tool includes first and second mold tool sets. The first mold tool set applies a first portion of the over-mold onto the fiber optic cable assembly. The second mold tool set then applies a second portion of the over-mold onto the fiber optic cable assembly. In preferred embodiments, the first and the second portions of the over-mold fuse to each other. By employing the first and the second mold tool sets, the fiber optic cable assembly can be supported at closer intervals along its length when being over-molded in comparison to a single, longer mold tool set. In addition, a lower capacity injection pump can be used when applying the over-mold in two portions. In other embodiments, additional mold tool sets can be added that sequentially apply additional portions of the over-mold. | 2009-06-18 |
20090152747 | Polarized Lens and Method of Making Polarized Lens - Method of making eyeglass lens are disclosed where the lens are made of layers which include an outer, convex hard coating, a layer of hard epoxy, a laminated PVA film where one of the layer of the PVA film is coated with Photochromic powder, a layer of soft epoxy, a base material, and an inner, concave hard coating. Other methods configuration of lens also include a camouflaged patterned lens, a layer of hard epoxy, a polyurethane mixture, a laminated PVA film where one of the layer of the PVA film is coated with Photochromic powder, a layer of soft epoxy, a base material, and an inner, concave hard coating. | 2009-06-18 |
20090152748 | Polarizer Films and Methods of Making the Same - In general, in one aspect, the invention features methods that include forming a roll of a first material into a substrate and forming a plurality of rows of a second material on the substrate, where the second material includes a metal, the rows of the second material extend along a first direction, the rows are spaced apart from one another, and adjacent rows are spaced apart by about 400 nm or less. | 2009-06-18 |
20090152749 | METHOD FOR EVAPORATING IR CUT-OFF FIRM UPON A PLASTIC OPTICAL LENS - A method for evaporating an IR cut-off firm upon a plastic optical lens with control of ion gun and electronic gun; wherein: retaining a plastic optical lens at a normal temperature without heating; controlling a power of an ion gun to be between 350 W to 850 W in evaporating a film of high refraction coefficient; and a power of an ion gun to be below 500 W in evaporating a film of low refraction coefficient. in evaporating process, the temperature of the plastic optical lens is controlled to be between 80° C.˜150° C. so that no deformation occurs. A plastic optical lens is as a substrate and ion gun and electronic gun use as assistant in evaporation so as to have the effect of evaporating more layers upon the plastic optical lens. | 2009-06-18 |
20090152750 | Vacuum Drug Pellet Molding - A mold apparatus includes a container, a temperature control device, a distribution manifold, a plurality of dispensers, a mold, a bottom plate for the mold, and a vacuum chamber. The temperature control device at least partially surrounds the container. The distribution manifold is located downstream from the container. The plurality of dispensers are coupled to the distribution manifold. The mold has a plurality of cavities for receiving a mixture from the plurality of dispensers. The bottom plate is located on a bottom surface of the mold. The vacuum chamber keeps the container, distribution manifold, plurality of dispensers and mold in a vacuum. A drug and compound mixture are brought to a temperature other than room temperature and dispensed into the mold under a vacuum to form pellets. | 2009-06-18 |
20090152751 | METHOD FOR TESTING MULTILAYER TABLETS - The present invention is related to a method for testing multilayer tablets in a multiple rotary press, in which die holes of a circulating die plate are successively filled with tablet material of different layers in succeeding filling devices, and the tablet material is compressed one layer after the foregoing layer into pressed articles having n layers by means of synchronously circulating compression punches, and the pressed articles are subsequently ejected in an unloading station and taken out, in which in a testing procedure, pressed articles with m layers are taken out after the compression in a respective unloading station and are conveyed to a testing station, wherein applies 1<=m<=n, wherein before taking out the pressed articles, at least the m-th layer is compressed more strongly than during the normal manufacture of the multilayer tablets, wherein applies m2009-06-18 | |
20090152752 | Method of Forming Crash Panel for Vehicles - Disclosed herein is a method of forming a crash panel for vehicles, which prevents a tear line from discoloring, prevents sink marks from occurring, and additionally has a reduced manufacturing cost. The method includes injecting and charging molten resin into a mold having a core and a cavity so as to form a crash panel integrated with an airbag door through injection molding, maintaining a pressure acting on the resin in the mold constant, in addition to preventing backflow of the charged resin, adjusting a section using an air nozzle so as to determine a section of a tear line at which the crash panel is separated from the airbag door, blowing air through the air nozzle which is inserted into an air path defined in the core, thus controlling a thickness of the tear line, and cooling the molten resin. | 2009-06-18 |
20090152753 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 2009-06-18 |
20090152754 | THERMOPLASTIC ELASTOMER COMPOSITION FOR FOAM INJECTION MOLDING, FOAM BODY, AND PROCESS FOR PRODUCING FOAM BODY - A thermoplastic elastomer composition for foam injection molding is provided that includes component (A), component (B), component (C), and component (D) below, relative to 100 parts by weight of component (A), component (B) having a content of 5 to 150 parts by weight, component (C) having a content of 5 to 300 parts by weight, and component (D) having a content of 5 to 150 parts by weight. (A): A hydrogenated product of a block copolymer comprising a block composed of an aromatic vinyl compound-based monomer unit and a block composed of a conjugated diene compound-based monomer unit, the hydrogenated product having a weight-average molecular weight of not more than 200,000, (B): a propylene resin, (C): a mineral oil, and (D): an ethylene-propylene copolymer rubber having a Mooney viscosity (ML | 2009-06-18 |
20090152755 | Molecular Sieve/Polymer Hollow Fiber Mixed Matrix Membranes - The present invention discloses a method for making mixed matrix membranes (MMMs) and methods for using these membranes. These MMMs contain a continuous polymer matrix and dispersed microporous molecular sieve particles. This invention also pertains to control the thickness of the thin dense selective mixed matrix layer equal to or greater than the particle size of the largest molecular sieve particles for making large scale asymmetric MMMs. In particular, the invention is directed to make asymmetric hollow fiber MMM by a phase inversion technique. The MMMs of the present invention exhibit at least 20% increase in selectivity compared to the polymer membranes prepared from their corresponding continuous polymer matrices. The MMMs of the present invention are suitable for a variety of liquid, gas, and vapor separations. | 2009-06-18 |
20090152756 | Phase Transition Pharmaceutical Mold For Producing Pellets For Injection Device - A mold assembly includes a mold base plate and a mold. The mold base plate has a bottom plate located in a recess. The mold can be inserted into and removed from the recess and is located on top of the bottom plate. The mold has a first section that is separable from a second section. When the first section and the second section are located adjacent to each other in the recess, a plurality of cavities is formed, each cavity for receiving a quantity of a drug and compound mixture when the mold base plate and mold are at a temperature other than room temperature | 2009-06-18 |
20090152757 | Method and apparatus for making a spunbond - A method of making a spunbond fleece from continuous filaments wherein at least some of the filaments produced have natural crimp. The filaments are deposited in the deposition station of a conveyor creating a filament mass and the conveyor transports the filament mass toward a consolidating device. A gas stream is produced that flows along the upper surface of the filament mass in the travel direction of the filament mass. | 2009-06-18 |
20090152758 | METHOD FOR PRODUCING DEHYDRATING SHEET - The present invention provides a method for producing a dehydrating sheet comprising two films at least one of which is a polyvinyl alcohol film, and a high osmotic pressure material interposed between the films, wherein the polyvinyl alcohol film is formed by a stretching treatment after extrusion molding, followed by a heat treatment at 150 to 250° C. and a water treatment. According to the present invention, it is possible to provide a dehydrating sheet comprising a polyvinyl alcohol film which has excellent water permeability, is prevented from forming pinholes, and is not significantly expanded or shrunk due to the absorption of water. | 2009-06-18 |
20090152759 | SHAPING DIE AND ITS USE IN A SOLID STATE DRAWING PROCESS - A solid state drawing die having a body with opposing entrance and exit ends, a shaping channel providing fluid communication entirely through the body from the entrance to exit end and having a converging profile, and at least one portion of the body that serves as a static protrusion extending into the but not all the way across the shaping channel is useful in a solid state drawing process for preparing oriented polymer compositions having indented or grooved profiles. | 2009-06-18 |
20090152760 | RUBBER COMPOSITION FOR TIRE AND PNEUMATIC TIRE USING THE SAME - A rubber composition used for a tire, in which friction on ice is improved, which includes 0.5 to 30 parts by weight of a filler having at least two protuberances and a non-metal fiber based on 100 parts by weight of a diene rubber. | 2009-06-18 |
20090152761 | Process for preparation of modified poly - An improved process is provided for making a shaped article of a modified poly(trimethylene terephthalate) polymer wherein the intrinsic viscosity of the modified poly(trimethylene terephthalate) present in the shaped article is at least 95% that of the intrinsic viscosity of the poly(trimethylene terephthalate) prior to modification. | 2009-06-18 |
20090152762 | METHOD AND DEVICE FOR MELT SPINNING AND DEPOSITING SYNTHETIC FILAMENTS INTO A NON-WOVEN MATERIAL - A method and a device for melt spinning and depositing synthetic filaments into a nonwoven material are described. The synthetic filaments are extruded and pulled off here simultaneously next to one another in several filament groups and deposited jointly on a belt. Taking into consideration a later final processing of the nonwoven material, the filaments of the filament groups are deposited next to one another to form separate filament webs which are guided next to and parallel to one another. Narrower nonwoven webs can be produced even from very large production widths. For this purpose, the extrusion means and the pull-off means are disposed above the belt in such a manner that the filaments of the filament groups can be laid to form separate nonwoven webs. | 2009-06-18 |
20090152763 | Molecular Sieve/Polymer Asymmetric Flat Sheet Mixed Matrix Membranes - The present invention discloses an approach for making mixed matrix membranes (MMMS) and methods for using these membranes. These MMMs contain a continuous polymer matrix and dispersed microporous molecular sieve particles. This invention also pertains to control of the thickness of the thin dense selective mixed matrix membrane layer that is equal to or greater than the particle size of the largest molecular sieve particles for making large scale asymmetric MMMs. In particular, the invention is directed to making asymmetric flat sheet MMM by a phase inversion technique. The MMMs of the present invention exhibit at least 20% increase in selectivity compared to the polymer membranes prepared from their corresponding continuous polymer matrices. The MMMs of the present invention are suitable for a variety of liquid, gas, and vapor separations. | 2009-06-18 |
20090152764 | METHODS FOR MAKING COMPOSITE CONTAINMENT CASINGS - Method for making a composite containment casing having an integrated abradable system involving providing a mandrel having a pocket, positioning a sandwich structure into the pocket, applying at least one ply of a material about the mandrel having the pocket containing the sandwich structure therein to produce a containment casing preform, infusing a resin into the containment casing preform, curing the containment casing preform to produce a containment casing, and applying at least one abradable layer to the sandwich structure of the containment casing to produce the containment casing having the integrated abradable system. | 2009-06-18 |
20090152765 | Block press equipment having translating fluid injection apparatus and method of forming building blocks using same - In one embodiment of the present invention, a method comprises a plurality of operations. An operation is performed for depositing a quantity of article-forming media within a media receiving cavity of article forming equipment. After depositing at least a portion of the article-forming media within the media receiving cavity, an operation performed for depositing a volume of a prescribed fluid into the media receiving cavity. Depositing the prescribed fluid includes moving a first fluid delivery device through the quantity of the article-forming media while injecting the prescribed fluid through the first fluid delivery device into the quantity of the article-forming media. | 2009-06-18 |
20090152766 | METHODS OF MAKING COMPOSITE PROSTHETIC DEVICES HAVING IMPROVED BOND STRENGTH - A method of making a composite prosthetic device, such as a hernia repair device, includes providing a support layer, juxtaposing a layer of an absorbable material with the support layer, and disposing an absorbable adhesive between the support layer and the layer of an absorbable material. The method includes heating the layers for melting the absorbable adhesive so as to bond the support layer with the layer of the absorbable material. Before the heating step, the moisture content of at least one of the layers is increased for improving thermal conductivity between the layers so as to enhance the strength of the bonds formed between the layers. The moisture content may be increased by exposing at least one of the layers to an environment having elevated relative humidity. In one embodiment, the support layer is polypropylene mesh, the layer of the absorbable material is oxidized regenerated cellulose, and the absorbable adhesive is polydioxanone. | 2009-06-18 |
20090152767 | Method of manufacturing radiator grill for vehicle - The present invention provides a method of manufacturing a radiator grill for a vehicle using a glossy metal film and acrylonitrile styrene acrylate (ASA) resin having excellent weatherability by a film insert molding process. | 2009-06-18 |
20090152768 | CONTROL SYSTEM FOR DYNAMIC FEED COINJECTION PROCESS - Coinjection molding system control apparatus and method preferably includes flow control structure and/or steps configured to reduce pressure on a second melt, preferably causing a relatively small portion of a first melt to flow from a distal portion of a first melt channel in the coinjection nozzle into a distal end of a second melt channel in the coinjection nozzle. This prevents substantial amounts of the second melt from being dragged into the mold cavity when the next shot of the first melt is injected. | 2009-06-18 |
20090152769 | APPARATUS AND METHOD FOR MANUFACTURING VEHICLE DOOR TRIM AND VEHICLE DOOR TRIM MANUFACTURED USING THE METHOD - A first mold has a core passage, and first and second cavities in fluid communication with each other at the core passage. A second mold has first and second nozzles therein that inject first and second resins to the first and second cavities, respectively. The core member is slidable within the core passage to provide or block the fluid communication between the cavities, and has a third nozzle therein to inject a third resin to the core passage. The first and second resins are injected into the cavities. The core member is moved to block the fluid communication between the cavities, before injecting the first and second resins is completed. The third resin is injected while moving the core member to provide the fluid communication, after injecting the first and second resins is completed. The molds are separated, thereby yielding a single molded product, such as a vehicle door trim. | 2009-06-18 |
20090152770 | MECHANICALLY COLLAPSIBLE CORE FOR INJECTION MOLDING - The invention relates to a mechanically-collapsible core device includes a central pin having a plurality of engaging members, a plurality of first collapsible core members each having an engaging member that engages with a respective engaging member of the central pin, a base member having a plurality of engaging members, and a plurality of second collapsible core members each having an engaging member that engages with a respective engaging member of the base member. The pin is retracted from a home position, thereby causing the first core members to collapse inward. The base member is then retracted, thereby causing the second core members to translate inward and linearly. The result is that the core device collapses inward in size so as to permit the device to be removed from the inside of a molded article. | 2009-06-18 |
20090152771 | Method of manufacturing three-dimensional objects by laser sintering - A method of manufacturing three-dimensional objects by laser sintering is provided, the object is formed by solidifying powder material layer by layer at locations in each layer corresponding to the object by means of laser radiation, wherein an IR-radiation image in an applied powder layer is detected, characterized in that defects and/or geometrical irregularities in the applied powder layer are determined on the basis of the IR-radiation image. | 2009-06-18 |
20090152772 | METHOD OF FABRICATING ELECTRO-OPTICAL DEVICES WITH POLYMER-STABILIZED LIQUID CRYSTAL MOLECULES - In a preparation method, a chiral or cholesteric liquid crystal, a photoreactive monomer, and a photoinitiator are disposed in a liquid crystal cell. A principal surface of the liquid crystal cell is illuminated with ultraviolet light selected to have a non-uniform ultraviolet light intensity profile in the liquid crystal cell. The illuminating cooperates with the photoinitiator to polymerize at least a portion of the photoreactive monomer near the principal surface to generate a polymer network having a density corresponding to the non-uniform ultraviolet light intensity profile. The polymer network biases the liquid crystal toward a selected helical alignment direction. In some embodiments, the illuminating includes illuminating with first and second ultraviolet light intensity profiles to produce surface and volume polymer network components. | 2009-06-18 |
20090152773 | Controlled Electrospinning of Fibers - Electrospinning apparatus and methods for spinning a polymer fiber from a fluid comprising a polymer in the presence of an electric field established between at least one collector and a jet supply device, in a first embodiment comprising: a) forming an electrospinning jet stream of the fluid directed toward the at least one collector; b) controlling dispersion characteristics of the fluid by applying a magnetic field between the jet supply device and the at least one collector; c) forming at least one polymer fiber at the at least one collector; and in a second embodiment comprising: a) forming an electrospinning jet stream of the fluid directed toward a plurality of collectors; b) controlling dispersion characteristics of the fluid by applying different voltages to at least two collectors of the plurality of collectors; c) forming at least one polymer fiber at least one collector of the plurality of collectors. | 2009-06-18 |
20090152774 | Method For Molding A Fluid-Filled Structure - A mold may include mold portions that each includes a surface, a cavity formed in the surface, and a movable frame that extends around the cavity. In manufacturing a fluid-filled chamber, a parison may be located between the mold portions. The mold portions are moved toward the parison such that the frames contact and compress opposite sides of the parison to form a first bond between the opposite sides of the parison. The parison is also compressed between the mold portions such that opposite sides of the parison are shaped within the cavities to define the chamber and form a second bond immediately adjacent to the chamber. | 2009-06-18 |
20090152775 | METHOD AND APPARATUS FOR MANUFACTURING OF AN ARTICLE INCLUDING AN EMPTY SPACE - A tool assembly including a male tool including an inner shape tool including a bag having a connection connectable to a depressurization source for providing a vacuum in the bag such that beads therein form a body of firm cohesion providing the inner shape tool rigid. The male tool further includes a flexible, hollow curing support arranged around the rigid inner shape tool, the inner shape tool is arranged to be removable from the flexible, hollow curing support by rupturing the vacuum. | 2009-06-18 |
20090152776 | Core/Shell Polymer and Fluoropolymer Blending Blown Film Process - A process for extruding a partially crystalline melt-fabricable perfluoropolymer. The process comprises blowing film from a perfluoropolymer having polytetrafluoroethylene sub-micrometer particles dispersed therein. The perfluoropolymer composition is a core/shell polymer or a dispersion blend or a melt-mixed polymer. | 2009-06-18 |
20090152777 | METHOD FOR MANUFACTURING A MIXER-SETTLER AND A MIXER-SETTLER - The invention relates to a method for manufacturing a mixer-settler used in hydrometallurgical metal processes, such as liquid-liquid extraction, and to a mixer-settler structure where chemically resistant material, such as plate-like wall elements made of reinforced plastic, is used. | 2009-06-18 |
20090152778 | Stopper Rod - A stopper rod for controlling the flow of molten steel from a tundish has a metal carrier element partly received in an internal passageway of the stopper rod, the carrier element compressing sealing means between a frustoconical undersurface of a laterally enlarged portion thereof and a complementary seating surface of the stopper rod passageway, there being an insert threadedly engaged with one of the carrier element and stopper rod body at a position above a laterally enlarged portion of the carrier element, with further sealing means disposed between said insert and the carrier element. Preferably the insert is a nut screwed down onto a washer which compresses the further sealing means. | 2009-06-18 |
20090152779 | High-Friction Fluid Seal and Shock Absorber - A high-friction fluid seal used for high-friction sealing, comprising a fluid seal lip provided on the working fluid filling side to intercept a working fluid; and a dust lip provided on the working fluid non-filling side (the outer side) of the fluid seal lip to intercept dust coming from the outside, wherein the thickness of a working fluid film formed on the extension stroke by the dust lip is smaller than the thickness of a working fluid film formed on the extension stroke by the fluid seal lip. | 2009-06-18 |
20090152780 | METHOD FOR CALIBRATING AN ELASTOMER SPRING OF A MOUNT, AND MOUNT PRODUCED ACCORDING TO THE METHOD - A mount has a housing and a mount core. An elastomer spring supports the mount core on a housing and a receiving part is vulcanized into the elastomer spring. The receiving part has a receiving opening for the mount core. As the mount core is inserted, a preload is applied to the elastomer spring. The receiving part has at least one first core guide and a second core guide, between which the mount core is held. The receiving part also has a web which connects the core guides to one another in a first state and which is removed before or during the insertion of the mount core. The production of a mount of this type is simplified in this way. | 2009-06-18 |
20090152781 | Vibration-Isolating Device for Steering Wheel of Traveling Working Vehicle with Wheel Steering Mechanism - A vibration-isolating device for a steering wheel of a travelling working vehicle equipped with a wheel steering mechanism includes a first steering shaft ( | 2009-06-18 |
20090152782 | USER INTERFACE WITH CONTROLLABLE DUAL SPRING RATE RETURN TO NULL CANTILEVER SPRINGS - A spring-return-to-null assembly, which may be used with various types of hand controllers or other human-machine interfaces, includes a cantilever spring and a pivot assembly. The cantilever spring is adapted to be coupled to a shaft and is configured to supply a torque thereto. The pivot assembly engages the cantilever spring and is configurable to exhibit either equal or dual spring rates, depending on the direction in which the torque is supplied to the shaft. | 2009-06-18 |
20090152783 | Post holder - The post holder is a hinged clamp mechanism having three hinge plates, including a back plate and two side plates. The two side plates are hinged to opposite edges of the back plate, and can be folded to form a hollow triangular prism open at both ends and secured by inserting a locking hinge pin through aligned knuckles along the edges of the side plates. Elongated, rod-shaped handles extend from the side plates. The back plate has spaced slots defined therein adapted for engaging studs protruding from a T-post. The locking hinge pin may be tethered to one of the plates, and handgrips may cushion the ends of the handles. | 2009-06-18 |
20090152784 | SWING CLAMP | 2009-06-18 |
20090152785 | ALIGNMENT APPARATUS AND ORIGINAL POINT RETURNING METHOD OF ALIGNMENT APPARATUS, TURNING TABLE, TRANSLATIONAL TABLE, MACHINE INCLUDING ALIGNMENT APPARATUS AND MACHINE CONTROL SYSTEM - There is provided an alignment apparatus of rotating a table by translational driving to be able to operate the table in XYθ, Yθ, or θ accurately. | 2009-06-18 |