24th week of 2013 patent applcation highlights part 16 |
Patent application number | Title | Published |
20130147017 | BIPOLAR JUNCTION TRANSISTORS WITH A LINK REGION CONNECTING THE INTRINSIC AND EXTRINSIC BASES - Methods for fabricating bipolar junction transistors, bipolar junction transistors made by the methods, and design structures for a bipolar junction transistor. The bipolar junction transistor includes a dielectric layer on an intrinsic base and an extrinsic base at least partially separated from the intrinsic base by the dielectric layer. An emitter opening extends through the extrinsic base and the dielectric layer. The dielectric layer is recessed laterally relative to the emitter opening to define a cavity between the intrinsic base and the extrinsic base. The cavity is filled with a semiconductor layer that physically links the extrinsic base and the intrinsic base together. | 2013-06-13 |
20130147018 | Structure for Reducing Integrated Circuit Corner Peeling - A crack prevention structure that reduces integrated circuit corner peeling and reduces cracking is disclosed. The crack prevention structure comprises a semiconductor substrate; a first plurality of dielectric layers of a first material disposed over the semiconductor substrate; a second plurality of dielectric layers of a second material different than the first material, disposed on the first plurality of dielectric layers, wherein the first plurality of dielectric layers and the second plurality of dielectric layers meet at an interface; and a plurality of metal structures and a plurality of via structures formed through the interface of the first plurality of dielectric layers and the second plurality of dielectric layers. | 2013-06-13 |
20130147019 | Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die - A plurality of semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. A portion of the encapsulant is designated as a saw street between the die, and a portion of the encapsulant is designated as a substrate edge around a perimeter of the encapsulant. The carrier is removed. A first insulating layer is formed over the die, saw street, and substrate edge. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first conductive layer and first insulating layer. The encapsulant is singulated through the first insulating layer and saw street to separate the semiconductor die. A channel or net pattern can be formed in the first insulating layer on opposing sides of the saw street, or the first insulating layer covers the entire saw street and molding area around the semiconductor die. | 2013-06-13 |
20130147020 | Component Having a Via and Method for Manufacturing It - An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer. | 2013-06-13 |
20130147021 | MULTI-LAYER SUBSTRATE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - A method for manufacturing a multi-layer substrate structure such as a CSOI wafer structure (cavity-SOI, silicon-on-insulator) comprising obtaining a first and second wafer, such as two silicon wafers, wherein at least one of the wafers may be optionally provided with a material layer such as an oxide layer ( | 2013-06-13 |
20130147022 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A semiconductor device may include an interlayer insulating layer containing hydrogen and a first passivation layer configured to prevent or inhibit an out-gassing of the hydrogen. In the method, a second passivation layer configured to control a warpage characteristic of a wafer may be formed on the first passivation layer. | 2013-06-13 |
20130147023 | INTEGRATED CIRCUIT GROUND SHIELDING STRUCTURE - The present disclosure provides an Integrated Circuit (IC) device. The IC device includes a first die that contains an electronic component. The IC device includes second die that contains a ground shielding structure. The IC device includes a layer disposed between the first die and the second die. The layer couples the first die and the second die together. The present disclosure also involves a microelectronic device. The microelectronic device includes a first die that contains a plurality of first interconnect layers. An inductor coil structure is disposed in a subset of the first interconnect layers. The microelectronic device includes a second die that contains a plurality of second interconnect layers. A patterned ground shielding (PGS) structure is disposed in a subset of the second interconnect layers. The microelectronic device includes an underfill layer disposed between the first and second dies. The underfill layer contains one or more microbumps. | 2013-06-13 |
20130147024 | BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - An integrated circuit package structure includes a bottom portion having a cavity, an integrated circuit attached to a top surface of the stepped cavity, a leadframe attached to the bottom portion, wire bonding for electrically coupling the integrated circuit to the leadframe, and a top portion conformally covering the integrated circuit and the bottom portion. | 2013-06-13 |
20130147025 | METHOD OF STACKING FLIP-CHIP ON WIRE-BONDED CHIP - A first chip is mounted on a substrate and includes a plurality of bump pads located on an active surface of the first chip. A wire bonds a first bump pad to the substrate. An intermediate layer is disposed on a portion of the active surface of the first chip, and a via within the intermediate layer extends to a second bump pad. A second chip is disposed on the intermediate layer, and wherein the second chip includes a third bump pad located on an active surface of the second chip and aligned with the via formed in the intermediate layer. A corresponding bump is disposed on one or more of the second bump pad and the third bump pad, and within the via, wherein the corresponding bump electrically connects the second bump pad with the third bump pad. | 2013-06-13 |
20130147026 | HEATSINK INTERPOSER - According an embodiment, a package-on-package heatsink interposer for use between a top package and a bottom package of a package-on-package device, may include a top heatsink below the top package; an interposer substrate below the top heatsink; a bottom heatsink below the interposer substrate; a first interposer substrate metal layer between the interposer substrate and the top heatsink; a second interposer substrate metal layer between the interposer substrate and the bottom heatsink; and interposer solder balls between the second interposer substrate metal layer and the bottom package. | 2013-06-13 |
20130147027 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package. | 2013-06-13 |
20130147028 | HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS - Various heat spreaders and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a heat spreader that has a surface adapted to establish thermal contact with a first semiconductor chip and a second semiconductor chip on a substrate. The surface includes a first portion adapted to thermally contact a solder-based thermal interface material and a second portion having an opening adapted to hold an organic thermal interface material. | 2013-06-13 |
20130147029 | ULTRA-SMALL CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Some embodiments of the present disclosure provide the design and manufacture of an ultra-small chip assembly. The ultra-small chip assembly comprises a die, a plate-like back electrode disposed on the back-side of the die, and one or more plate-like positive electrodes disposed on the front-side of the die. The ultra-small chip assembly is configured such that one end of the plate-like back electrode extends beyond a first side of the die, and each of the one or more plate-like positive electrodes includes an end which extends beyond a second side of the die. By attaching both the plate-like back electrode and the plate-like positive electrodes on the surfaces of the die, and directly using the exposed ends of the plate-like electrodes as the lead-out electrodes for the chip assembly, the electrical connections outside of the die only occupy a very small volume. | 2013-06-13 |
20130147030 | Landing Areas of Bonding Structures - A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The metal trace includes a portion having an edge, wherein the edge is not parallel to the lengthwise direction of the metal trace. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface and the edge of the portion of the metal trace. | 2013-06-13 |
20130147031 | SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERCONNCET - A semiconductor device includes a post-passivation interconnect (PPI) structure having a landing pad region. A polymer layer is formed on the PPI structure and patterned with a first opening and a second opening to expose portions of the landing pad region. The second opening is a ring-shaped opening surrounding the first opening. A bump structure is formed on the polymer layer to electrically connect the landing pad region through the first opening and the second opening. | 2013-06-13 |
20130147032 | PASSIVATION LAYER FOR PACKAGED CHIP - The embodiments described above provide mechanisms for forming metal bumps on metal pads with testing pads on a packaged integrated circuit (IC) chip. A passivation layer is formed to cover the testing pads and possibly portions of metal pads. The passivation layer does not cover surfaces away from the testing pad region and the metal pad region. The limited covering of the testing pads and the portions of the metal pads by the passivation layer reduces interface resistance for a UBM layer formed between the metal pads and the metal bumps. Such reduction of interface resistance leads to the reduction of resistance of the metal bumps. | 2013-06-13 |
20130147033 | POST-PASSIVATION INTERCONNECT STRUCTURE - A semiconductor device includes a passivation layer overlying a semiconductor substrate, and an interconnect structure overlying the passivation layer. The interconnect structure includes a landing pad region and a dummy region electrically separated from each other. A protective layer overlies the interconnect structure and includes a first opening exposing a portion of the landing pad region and a second opening exposing a portion of the dummy region. A metal layer is formed on the exposed portion of landing pad region and the exposed portion of the dummy region. A bump is formed on the metal layer overlying the landing pad region. | 2013-06-13 |
20130147034 | BUMP STRUCTURE DESIGN FOR STRESS REDUCTION - Low stress bumps can be used to reduce stress and strain on bumps bonded to a substrate with different coefficients of thermal expansion (CTEs) from the die. The low stress bumps include multiple polymer layers. More than one type of bump is coupled to a die, with low stress bumps placed on areas subjected to high stress. | 2013-06-13 |
20130147035 | Semiconductor Device and Method of Forming Recesses in Conductive Layer to Detect Continuity for Interconnect Between Semiconductor Die and Substrate - A semiconductor device has a semiconductor die with composite bump structures over a surface of the semiconductor die. A conductive layer is formed over the substrate. The conductive layer has a channel in an interconnect site of the conductive layer. The channel extends beyond a footprint of the composite bump structures. The semiconductor die is disposed over the substrate. The bump material of the composite bump structures is melted. The composite bump structures are pressed over the interconnect site of the conductive layer so that the melted bump material flows into the channel. Electrical continuity between the composite bump structures and conductive layer is detected by a presence of the bump material in the channel. No electrical continuity between the composite bump structures and conductive layer is detected by an absence of the bump material in the channel. The electrical continuity can be detected by visual inspection or X-ray. | 2013-06-13 |
20130147036 | Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed through the semiconductor die with a first insulating layer around the conductive vias. A recess is formed in the first insulating layer around the conductive vias by LDA. A portion of the semiconductor wafer is removed by LDA after forming the recess in the first insulating layer so that the conductive vias extend above a surface of the semiconductor wafer. The first insulating layer extends to the surface of the semiconductor wafer or above the surface of the semiconductor wafer. A second insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the second insulating layer is removed by LDA, while leaving a second portion of the second insulating layer over the surface of the semiconductor wafer around the conductive vias. An electroless plated bump is formed over the conductive vias. | 2013-06-13 |
20130147037 | SEMICONDUCTOR STRUCTURE - A semiconductor structure is provided. The semiconductor structure includes a substrate, at least two pads, a passivation layer, at least two under bump metallization (UBM) layers and at least two bumps. The pads are disposed adjacent to each other on the substrate along the first direction. The passivation layer covers the substrate and the peripheral upper surface of each pad to define an opening. Each of the openings defines an opening projection along the second direction. The opening projections are disposed adjacent to each other but not overlapping with each other. Furthermore, the first direction is perpendicular to the second direction. The UBM layers are disposed on the corresponding openings, and the bumps are respectively disposed on the corresponding UBM layers. With the above arrangements, the width of each bump of the semiconductor structure of the present invention could be widened without being limited by the bump pitch. | 2013-06-13 |
20130147038 | SEMICONDUCTOR DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS WITHOUT OCCURRING OF CRACK - A device includes first and second semiconductor chips. The first semiconductor chip includes an edge defining a periphery of the first semiconductor chip. The second semiconductor chip is greater in size than the first semiconductor chip. The second semiconductor chip is stacked over the first semiconductor chip so that the second semiconductor chip hangs over from the edge of the first semiconductor chip. The second semiconductor chip includes a plurality of wiring patterns including a first wiring pattern that positions over the edge of the first semiconductor chip, an insulating film which covers the wiring patterns and which includes on or more holes that expose one or more the wiring patterns, and one or more bump electrodes formed on the one or more the wiring patterns. Remaining one or ones of the wiring patterns is kept covered by the insulating layer and includes the first wiring pattern. | 2013-06-13 |
20130147039 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring board that has a conductive pattern formed on at least one principal surface, and an IC chip that is mounted on the wiring board. The IC chip includes a plurality of electrodes to make conductor connection with the wiring board. The conductive pattern includes a lead line pattern and a heat dissipation pattern. The lead line pattern is connected with at least one of the plurality of electrodes through a conductor. The heat dissipation pattern is physically spaced from the IC chip and the lead line pattern and has a larger surface area than the lead line pattern. Further, the lead line pattern and the heat dissipation pattern are placed opposite to each other with a gap therebetween, and their opposite parts respectively have interdigitated shapes and are arranged with the respective interdigitated shapes engaging with each other with the gap therebetween. | 2013-06-13 |
20130147040 | MEMS CHIP SCALE PACKAGE - A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing. | 2013-06-13 |
20130147041 | STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A stack package structure is provided, including: a substrate; an insulating layer formed on the substrate and having openings for exposing die attach pads and conductive pads of the substrate, respectively; a plurality of first and second conductive terminals formed on the insulating layer and electrically connected to the die attach pads and the conductive pads, respectively; a dielectric layer formed on the insulating layer and having a cavity for exposing the first conductive terminals and a plurality of openings exposing the second conductive terminals; copper pillars formed respectively in the openings of the dielectric layer; a semiconductor chip disposed in the cavity and electrically connected to the first conductive terminals; solder balls formed respectively on the copper pillars that are located proximate to the die attach area; and a package structure disposed on and electrically connected to the solder balls. | 2013-06-13 |
20130147042 | SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias. | 2013-06-13 |
20130147043 | SUBSTRATE WITH EMBEDDED STACKED THROUGH-SILICON VIA DIE - A substrate with an embedded stacked through-silicon via die is described. For example, an apparatus includes a first die and a second die. The second die has one or more through-silicon vias disposed therein (TSV die). The first die is electrically coupled to the TSV die through the one or more through-silicon vias. The apparatus also includes a coreless substrate. Both the first die and the TSV die are embedded in the coreless substrate. | 2013-06-13 |
20130147044 | MULTI-CHIP PACKAGE HAVING A STACKED PLURALITY OF DIFFERENT SIZED SEMICONDUCTOR CHIPS, AND METHOD OF MANUFACTURING THE SAME - Provided is a multi-chip package in which a plurality of semiconductor chips having different sizes are stacked. A multi-chip package may include a substrate, and a plurality of semiconductor chips stacked on the substrate, each of the plurality of semiconductor chips having a different size. Each of the plurality of semiconductor chips including a pad group and a reference region associated with the pad group, each pad group having a plurality of pads, and the plurality of pads in each pad group located at same coordinates with respect to the associated reference region, and each of the plurality of semiconductor chips having their reference regions vertically aligned. | 2013-06-13 |
20130147045 | Flash Memory Having Multi-Level Architecture - Subject matter disclosed herein relates to a multi-level flash memory and a process flow to form same. | 2013-06-13 |
20130147046 | Integrated Technology for Partial Air Gap Low K Deposition - A semiconductor device includes a semiconductor body and a low K dielectric layer overlying the semiconductor body. A first portion of the low K dielectric layer comprises a dielectric material, and a second portion of the low K dielectric layer comprise an air gap, wherein the first portion and the second portion are laterally disposed with respect to one another. A method for forming a low K dielectric layer is also disclosed and includes forming a dielectric layer over a semiconductor body, forming a plurality of air gaps laterally disposed from one another in the dielectric layer, and forming a capping layer over the dielectric layer and air gaps. | 2013-06-13 |
20130147047 | Integrated Circuit and Method of Forming an Integrated Circuit - An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 μm and a ratio of average grain size to thickness of less than 0.7. | 2013-06-13 |
20130147048 | INTEGRATED CIRCUIT DEVICES INCLUDING ELECTRODE SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME - A semiconductor device includes a plurality of electrode structures perpendicularly extending on a substrate, and at least one support unit extending between the plurality of electrode structures. The support unit includes at least one support layer including a noncrystalline metal oxide contacting a part of the plurality of electrode structures. Related devices and fabrication methods are also discussed. | 2013-06-13 |
20130147049 | Circuit Probing Structures and Methods for Probing the Same - A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component. | 2013-06-13 |
20130147050 | SEMICONDUCTOR HAVING INTEGRALLY-FORMED ENHANCED THERMAL MANAGEMENT - A semiconductor structure and method of manufacturing that has integrally-formed enhanced thermal management. During operation of a semiconductor device, electron flow between the source and the drain creates localized heat generation. A containment gap is formed by selectively removing a portion of the back side of the semiconductor device substrate directly adjacent to a localized heat generation area. A thermal management material is filled in the containment gap. This thermal management material enhances the thermal management of the semiconductor device by thermally coupling the localized heat generation area to a heat sink. The thermal management material may be a Phase Change Material (PCM) having a heat of fusion effective for absorbing heat generated in the localized heat generation area by the operation of the semiconductor device for reducing a peak operating temperature of the semiconductor device. | 2013-06-13 |
20130147051 | METHOD OF PROTECTING AGAINST VIA FAILURE AND STRUCTURE THEREFOR - A method is for forming a decoy via and a functional via. The method includes forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer. The method further includes forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of the third interconnect level. | 2013-06-13 |
20130147052 | OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES - An integrated circuit die has a dielectric layer positioned over all the contact pads on the integrated circuit die. Openings are provided in the dielectric layer over each of the contact pads of the integrated circuit die in order to permit electrical coupling to be made between the integrated circuit and circuit boards outside of the die. For those contact pads located in the central region of the die, the opening in the dielectric layer is in a central region of the contact pad. For those contact pads located in a peripheral region of the die, spaced adjacent the perimeter die, the opening in the dielectric layer is offset from the center of the contact pad and is positioned closer to the central region of the die than the center of the contact pad is to the central region of the die. | 2013-06-13 |
20130147053 | Semiconductor Device and Method of Making Single Layer Substrate with Asymmetrical Fibers and Reduced Warpage - A semiconductor device includes a first carrier having a first resin disposed over the first carrier. A fabric is disposed over the first resin. A second resin is formed over the first resin and around the fabric to form an asymmetrical pre-impregnated (PPG) substrate. The first carrier is removed. A second carrier is provided and a first conductive layer is formed over the second carrier. A portion of the first conductive layer is removed. The first conductive layer is transferred from the second carrier to the first resin. The first conductive layer is oriented asymmetrically such that the first conductive layer is offset with respect to the fabric to minimize warpage. The second carrier is removed. A via is formed through the second resin and fabric to expose the first conductive layer. A second conductive layer formed in the via over the first conductive layer. | 2013-06-13 |
20130147054 | Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP - A semiconductor device has a semiconductor die mounted to a carrier. A first encapsulant is deposited over the semiconductor die and carrier. A stiffening support member can be disposed over the carrier around the semiconductor die. A plurality of channels or recesses is formed in the first encapsulant. The recesses can be formed by removing a portion of the first encapsulant. Alternatively, the recesses are formed in a chase mold having a plurality of extended surfaces. A second encapsulant can be deposited into the recesses of the first encapsulant. The carrier is removed and an interconnect structure is formed over the semiconductor die and first encapsulant. The thickness of the first encapsulant provides sufficient stiffness to reduce warpage while the recesses provide stress relief during formation of the interconnect structure. A portion of the first encapsulant and recesses are removed to reduce thickness of the semiconductor device. | 2013-06-13 |
20130147055 | Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV through Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. An insulating lining is formed around the conductive vias and a conductive layer is formed over the insulating lining. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the first insulating layer is removed and a second portion of the first insulating layer remains as guard rings around the conductive vias. A conductive layer is formed over the conductive vias. A second insulating layer is formed over the surface of the semiconductor wafer, guard rings, and conductive vias. A portion of the second insulating layer is removed to expose the conductive vias and a portion of the guard rings. | 2013-06-13 |
20130147056 | RESIZED WAFER WITH A NEGATIVE PHOTORESIST RING AND DESIGN STRUCTURES THEREOF - A resized wafer using a negative photoresist ring, methods of manufacture and design structures thereof are disclosed. The method includes forming a ring within a radius of a wafer. The method also includes patterning a photoresist formed on the wafer, by exposing the photoresist to energy. Additionally, the method includes forming troughs in a substrate of the wafer based on the patterning of the photoresist, wherein the ring blocks formation of the troughs underneath the ring. The method also includes filling the troughs with a metal and resizing the wafer at an area of the ring. | 2013-06-13 |
20130147057 | THROUGH SILICON VIA (TSV) ISOLATION STRUCTURES FOR NOISE REDUCTION IN 3D INTEGRATED CIRCUIT - Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in | 2013-06-13 |
20130147058 | CHIP PACKAGE AND CHIP PACKAGE METHOD - A chip package includes a substrate, a pad positioned on the substrate, a base board, at least one adhesive layer and at least one chip. The base board is positioned on the pad. At least one mounting hole is defined through the base board. The at least one adhesive layer is received in the at least one mounting hole. The at least one chip is received in the at least one mounting hole and adhere to the pad via the at least one adhesive layer. | 2013-06-13 |
20130147059 | CHIP-TO-WAFER BONDING METHOD AND THREE-DIMENSIONAL INTEGRATED SEMICONDUCTOR DEVICE - A chip-to-wafer bonding method and a three-dimensional integrated semiconductor device are provided. The method comprises providing a chip and a wafer having a bonding region of the same size and shape as the chip; preparing hydrophilic areas and hydrophobic areas on the chip; preparing in the bonding region hydrophilic areas and hydrophobic areas respectively corresponding to the hydrophilic and hydrophobic areas on the chip; adding a liquid drop onto the hydrophilic areas in the bonding region; and pre-aligning and placing the chip on the bonding region of the wafer, such that the hydrophilic areas on the chip each contacts the corresponding hydrophilic area in the bonding region via the liquid. The sum of perimeters of the hydrophilic areas on the chip is larger than a perimeter of the chip. The sum of perimeters of the hydrophilic areas in the bonding region is larger than a perimeter of the bonding region. | 2013-06-13 |
20130147060 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate, a first semiconductor chip module attached to the substrate, a conductive connection member attached to the first semiconductor chip module, and a second semiconductor chip module attached to the conductive connection member. The first and second semiconductor chip modules are formed to have step like shapes and extend laterally in opposite directions so as to define a zigzag arrangement together. | 2013-06-13 |
20130147061 | Trap Rich Layer with Through-Silicon-Vias in Semiconductor Devices - An integrated circuit chip is formed with a circuit layer, a trap rich layer and through-semiconductor-vias. The trap rich layer is formed above the circuit layer. The through-semiconductor-vias are also formed above the circuit layer. In some embodiments, the circuit layer is included in a wafer, and the trap rich layer and through-semiconductor-vias are included in another wafer. The two wafers are bonded together after formation of the trap rich layer and through-semiconductor-vias. Additionally, in some embodiments, yet another wafer may also be bonded to the wafer that includes the trap rich layer and through-semiconductor-vias. Furthermore, in some embodiments, another circuit layer may be formed in the wafer that includes the trap rich layer and through-semiconductor-vias. | 2013-06-13 |
20130147062 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion. Thus, the protrusion may not be deflected. | 2013-06-13 |
20130147063 | METHODS OF FABRICATING FAN-OUT WAFER LEVEL PACKAGES AND PACKAGES FORMED BY THE METHODS - A fan-out wafer level package may include at least two semiconductor chips; an insulating layer covering portions of a first semiconductor chip; a mold layer covering portions of a second semiconductor chip; a redistribution line pattern in the insulating layer; and/or an external terminal on the insulating layer. The first semiconductor chip may be stacked relative to the second semiconductor chip. The redistribution line pattern may be electrically connected to the at least two semiconductor chips. The external terminal may be electrically connected to the redistribution line pattern. A fan-out wafer level package may include at least three semiconductor chips; an insulating layer covering portions of first semiconductor chips; a mold layer covering portions of a second semiconductor chip; a redistribution line pattern in the insulating layer; and/or an external terminal on the insulating layer. The first semiconductor chips may be stacked relative to the second semiconductor chip. | 2013-06-13 |
20130147064 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. | 2013-06-13 |
20130147065 | Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material - A semiconductor device has a flipchip or PoP semiconductor die mounted to a die attach area interior to a substrate. The substrate has a contact pad area around the die attach area and flow control area between the die attach area and contact pad area. A first channel is formed in a surface of the substrate within the flow control area. The first channel extends around a periphery of the die attach area. A first dam material is formed adjacent to the first channel within the flow control area. An underfill material is deposited between the die and substrate. The first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area. A second channel can be formed adjacent to the first dam material. A second dam material can be formed adjacent to the first channel. | 2013-06-13 |
20130147066 | STRUCTURE AND METHOD FOR E-BEAM IN-CHIP OVERLAY MARK - The present disclosure provides an integrated circuit structure that includes a semiconductor substrate having a first region and a second region having an area less than about 10 micron×10 micron; a first material layer over the semiconductor substrate and patterned to have a first circuit feature in the first region and a first mark in the second region; and a second material layer over the first material layer and patterned to have a second circuit feature in the first region and a second mark in the second region. The first mark includes first mark features oriented in a first direction, and second mark features oriented in a second direction perpendicular to the first direction. The second mark includes third mark features oriented in the first direction, and fourth mark features oriented in the second direction. | 2013-06-13 |
20130147067 | LOCALLY TAILORING CHEMICAL MECHANICAL POLISHING (CMP) POLISH RATE FOR DIELECTRICS - A method of manufacturing a semiconductor structure includes varying local chemical mechanical polishing (CMP) abrading rates of an insulator film by selectively varying a carbon content of the insulator film. | 2013-06-13 |
20130147068 | METHODS AND APPARATUS FOR CONTROLLED SCRUBBING AND AERATION OF LIQUID MEDIUM - An apparatus and method for controlled ventilation and aeration of liquid medium includes a dome supported by a flotation device, a lower housing supported by the flotation device, the lower housing connected to the dome, wherein a sealed space is defined under the dome and above the flotation liquid, one or more orifices, the orifices configured in the dome, and an aeration apparatus positioned within the sealed space and partially submerged in the flotation liquid, wherein the aeration apparatus comprises one or more parallel shafts, at least one first disc positioned axially on one of the shafts, at least one second disc positioned axially on another of the shafts, wherein the second disc is interleaved relative to the first disc, and wherein a surface of the first disc rotates in a direction opposite a surface of the second disc relative to each other resulting in a mixing area therebetween. | 2013-06-13 |
20130147069 | Carburetor air intake housing and air flow enhancing securement plate - An air intake housing and flow enhancing plate for a carburetor with a fluted and contoured air intake opening that flushly aligns with and matches the shape of the carburetor air intake opening. The low profile plate is made of metal for durability and heat resistance. The centrally located air intake opening of the plate has a clover leaf or undulating shape that conforms to the shape of the carburetor air intake opening. The plate is secured directly over the top of the carburetor, and extends radially outward to provide a larger area for securing its fiberglass housing. The housing holds a conventional ring shaped air filter located around the carburetor air intake opening. The plate provides smooth transitions between surfaces to decrease turbulence and improve air flow. | 2013-06-13 |
20130147070 | DIE TOOL, DEVICE AND METHOD FOR PRODUCING A LENS WAFER - This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses. | 2013-06-13 |
20130147071 | Method for Writing High Power Resistant Bragg Gratings Using Short Wavelength Ultrafast Pulses - A method for writing a Bragg grating in a glass optical waveguide is provided. Ultrafast optical pulses are generated, preferably in the femtosecond range and having a writing wavelength in the range of 300 nm to 700 nm and an intensity sufficient to induce a change of refractive index in the waveguide through densification. The optical pulses are diffracted using a phase mask, to generate an interference pattern having a pitch providing a fundamental Bragg resonance corresponding to the target wavelength to be reflected by the grating. The interference pattern is impinged on a region of the waveguide, which is heated to a temperature above a threshold and for a predetermined heating period. Advantageously, the heating step allows the reduction of photoinduced losses which would otherwise be present in the waveguiding properties of the waveguide. Optionally, gratings may be written through the polymer jacket of an optical fiber. | 2013-06-13 |
20130147072 | Method of Treating a Lens Forming Surface of at Least One Mold Half of a Mold for Molding Ophthalmic Lenses - A method of treating of a lens forming surface ( | 2013-06-13 |
20130147073 | OPTICAL DISK MANUFACTURING APPARATUS AND OPTICAL DISK MANUFACTURING METHOD - In an optical disk manufacturing apparatus, a movement mechanism changes the movement speed of a laser beam irradiation component from a first to a second speed at a first radial position located within where the laser beam irradiation component moves from an inner peripheral region of the optical disk to an identification information recording region of the optical disk, and changes the movement speed from the second to a third speed at a second radial position at which the laser beam irradiation component has reached the identification information recording region at the second speed. The second speed is lower than the first speed and the third speed. The laser beam irradiation component records the identification information by irradiating with a laser beam while alternating between a first power level and a second power level low enough not to crystallize the recording layer, when moving through the identification information recording region. | 2013-06-13 |
20130147074 | METHOD AND APPARATUS FOR GENERATING PARTICLES - A method and an apparatus for generating particles are provided. The method may be a method for generating particles from a flowable medium, the method involving forming drops from the flowable medium, arranging the drops on a particle forming surface and solidifying the drops, thereby forming the particles. The apparatus may be an apparatus for generating particles from a flowable medium with a drop generator and a particle forming surface, the drop generator being formed to arrange drops on the particle forming surface and the particle forming surface may be adapted to contact the drops when the particles are being formed. | 2013-06-13 |
20130147075 | REMEDIATION OF CROSSTIE CRACKS - The invention relates to a method and sealing agent for sealing cracks in concrete crossties of a railway rail, in particular in concrete crossties of a ballastless track, wherein the cracks have a width equal to or less than 1 mm. According to the invention, a mixture of an epoxy resin binder with quartz sand is used, wherein the quartz sand has a grain size of 0.1 mm to 1 mm. | 2013-06-13 |
20130147076 | METHOD OF DETECTING A COMPONENT OF AN ARTICLE AND METHOD OF PREPARING A COMPONENT FOR DETECTION - A method of detecting the presence or position of a first component in an article is disclosed. The first component, which has a predefined response to incident light, includes a microporous film of a semi-crystalline polyolefin and a beta-nucleating agent. The method includes irradiating the article with incident light, detecting light received from the irradiated article; and identifying the predefined response of the first component in the light received from the irradiated article to detect the presence or the position of the first component. A method for preparing a mechanical fastening component for use in an article is also disclosed. The method includes stretching a film backing containing beta-spherulites and having upstanding fastening elements to provide a microporous film backing with sufficient porosity to allow it to be detected when subjected to an inspection system comprising a light detector. | 2013-06-13 |
20130147077 | IN-MOLD VIBRATILE INJECTION COMPRESSION MOLDING METHOD AND MOLDING APPARATUS THEREOF - An in-mold vibratile injection compression molding method and molding apparatus thereof are described. While performing a filling stage, a first piezoelectric actuator and a second piezoelectric actuator are use to vibrate the molding material along at least two directions for precisely filling the molding material into the micro-structure in order to avoid the form error, to increase the groove filling rate and to improve the residual stress. | 2013-06-13 |
20130147078 | MOLDING MACHINE CONTROLLING APPARATUS AND METHOD OF CONTROLLING MOLDING MACHINE - A pressure detector which detects a pressure of a material in a cylinder, and a pressure compensator which compares, in injection control, a preset value of an injection pressure with an actual measurement value of the injection pressure detected by the pressure detector, generates an injection speed command to a servo motor based on a comparison value, and varies a proportional gain based on a deviation of the actual measurement value of the injection pressure from the preset value of the injection pressure. | 2013-06-13 |
20130147079 | CASING STRUCTURES FOR ELECTRONIC DEVICES - An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed. | 2013-06-13 |
20130147080 | Articles Containing Nanofibers Produced from Low Melt Flow Rate Polymers - The present invention is directed to hygiene articles comprising nanofibers. The nanofibers are made from a melt film fibrillation process with a polymer composition having a melt flow rate of less than about 400 decigram per minute. The nanofibers, having a diameter of less than 1 micron, must comprise a significant number of the fibers in one layer of the web contained by the hygiene article. The hygiene articles include diapers, training pants, adult incontinence pads, catamenials products such as feminine care pads and pantiliners, tampons, personal cleansing articles, personal care articles, and personal care wipes including baby wipes, facial wipes, and feminine wipes. | 2013-06-13 |
20130147081 | METHOD OF PRODUCING POWDER MAGNETIC CORE AND METHOD OF PRODUCING MAGNETIC CORE POWDER - The invention includes: powder preparation step of obtaining magnetic core powders by mixing, of magnetic powders with thermosetting resin powders in hot state; powder filling step of filling the obtained magnetic core powders into a die; a compaction step of compacting magnetic core powders; and compact heating step of heating, compacts to the elevated temperature state at which the thermosetting resin hardens after compaction. | 2013-06-13 |
20130147082 | Die and Method for Impregnating Fiber Rovings - A die and method for impregnating at least one fiber roving with a polymer resin are disclosed. The die includes an impregnation section. The impregnation section includes an impregnation zone configured to impregnate the roving with the resin. The impregnation zone includes a plurality of contact surfaces. At least one of the plurality of contact surfaces is configured such that a normal force of the roving is less than or equal to a lift force of the resin at an impregnation location on the contact surface during impregnation of the roving with the resin by the contact surface. | 2013-06-13 |
20130147083 | Impregnation Section of Die for Impregnating Fiber Rovings - A die and a method for impregnating at least one fiber roving with a polymer resin are disclosed. The die includes an impregnation section comprising an impregnation zone configured to impregnate the roving with the resin. The die further includes a passage at least partially defined in the impregnation section and in fluid communication with the impregnation zone, and a pump in fluid communication with the passage. The method includes coating at least one fiber roving with a polymer resin, traversing the coated roving through an impregnation zone of an impregnation section to impregnate the roving with the resin, and applying an external pressure to the impregnation zone. | 2013-06-13 |
20130147084 | Impregnation Section and Method for Impregnating Fiber Rovings - An impregnation section of a die and a method for impregnating at least one fiber roving with a polymer resin are disclosed. The impregnation section includes an impregnation zone configured to impregnate the roving with the resin. The impregnation zone includes a plurality of contact surfaces, at least one of the plurality of contact surfaces defining a cut-away portion downstream in a run direction of the roving of a point-of-contact for the at least one of the plurality of contact surfaces. The at least one of the plurality of contact surfaces further includes an edge defined by the cut-away portion. Excess material build up is reduced by the cut-away portion. | 2013-06-13 |
20130147085 | ONE STEP PRODUCTION OF POLYVINYL CHLORIDE - Disclosed is an extrusion process for improving heat extortion temperature of a PVC in which the process is a one-step process comprising introducing an imidized acrylic resin and an ethylene copolymer into a back feeding device of an extruder; feeding a PVC resin into the extruder; producing a mixture comprising the imidized acrylic resin, the ethylene copolymer, and the PVC resin; extruding the mixture through a die to an extrudate; and optionally pelletizing the extrudate into pellets wherein the location for feeding the PVC is at about ¼ to ¾ of the length of the extruder, measured from the die. | 2013-06-13 |
20130147086 | Extrusion of PVDC - Adding a small amount [trace] of finely ground polyethylene to pvdc prior to extrusion, protects the pvdc from decomposing to hydrogen and carbon. This enables longer extruder run times, lower waste, and a higher quality product. | 2013-06-13 |
20130147087 | MANUFACTURING METHOD OF BIODEGRADABLE NET-SHAPED ARTICLES - A manufacturing method of biodegradable net-shaped articles includes: (a) preparing a biodegradable mixture; (b) granulating the mixture into plastic grains; (c) baking the plastic grains in an oven at 60° C. to 70° C. for 3 to 4 hours; (d) melting and extruding the plastic grains by a screw-type extruder so as to obtain a net-shaped preform; and (e) cooling and thereby finalizing the net-shaped preform in a cooling bath at 15° C. to 30° C. so as to obtain the net-shaped article. | 2013-06-13 |
20130147088 | METHOD FOR FABRICATING BATTERY SHELL - A non-contact input apparatus for computer peripheral includes an induction module and a pointing module. The induction module includes an electric supply coil and an induction element, and the pointing module includes an energy coil and a non-linear element. The electric supply coil is used to send a first oscillation signal. The energy coil receives the first oscillation signal. The non-linear element converts the first oscillation signal to be a second oscillation signal having multiple higher harmonics. The induction element generates a control signal based on the second oscillation signal. | 2013-06-13 |
20130147089 | TRANSPARENT CONDUCTIVE MATERIAL, DISPERSION LIQUID, TRANSPARENT CONDUCTIVE FILM, AND METHODS FOR MANUFACTURING SAME - According to one embodiment, a transparent conductive material is used for a transparent conductive film. The transparent conductive material includes nanographene having a polar group at a surface of the nanographene. | 2013-06-13 |
20130147090 | DOUBLE BELT PRESS AND METHOD FOR PRODUCING A PLATE-LIKE PRODUCT USING A DOUBLE BELT PRESS - A double belt press having a first, lower circulating plastic belt and a second, upper circulating plastic belt. The plastic belts have a first, low flexural strength, and a product gap is formed between facing strands of the plastic belts for forming a plate-like product. A first circulating lower steel belt and a second circulating upper steel belt are provided and have a second flexural strength which is high in comparison to the flexural strength of the plastic belts. A forming section is formed between the facing strands of the steel belts, which forms part of the product gap. The first, lower steel belt runs parallel and bears against a rear face of the first plastic belt in the forming section during operation, and the second upper steel belt runs parallel and bears against a rear face of the second plastic belt in the forming section during operation. | 2013-06-13 |
20130147091 | VALVE PIN ACTUATOR - A valve pin actuator for an injection molding system includes a housing defining a chamber, the chamber having a nozzle opening portion and a nozzle closing portion. A piston is axially slideable within the chamber between a nozzle open position and a nozzle close position. The piston secures a valve pin to translate axial movements of the piston into axial movements of the pin. The nozzle opening portion of the chamber is configured to receive a first fluid to pressurize the nozzle opening portion to urge the piston towards the nozzle open position. The nozzle closing portion of the chamber is configured to receive a second fluid to pressurize the nozzle closing portion to urge the piston towards the nozzle close position. A fluid passage defined by the piston allows fluid communication between the nozzle opening portion and the nozzle closing portion. | 2013-06-13 |
20130147092 | Multi-Property Injection Molding Nozzle for Hot-Runner System - A hot-runner system having a manifold and a nozzle, wherein the manifold or nozzle or both may be multi-material apparatuses of unitary construction. The nozzle may be thermally graded for temperature transmission between a heating sleeve and the melt. The nozzle may also include a melt flow channel apparatus that alters the flow of the melt before entering the mold. The nozzle and manifold may have a unitary construction that reduces fitting problems between the two apparatuses. | 2013-06-13 |
20130147093 | BENDING PVC PROFILES USING LASER AND PLC CONTROLLING SYSTEM - PVC profile bending using laser and PLC controlling system is a part of the arched PVC joinery, where the bending of the PVC profiles is completely automatized thus removing any possible human error caused by operating the machine manually. PLC controlling system includes encoder with a wheel X ( | 2013-06-13 |
20130147094 | LASER-IMAGEABLE FLEXOGRAPHIC PRINTING PRECURSORS AND METHODS OF RELIEF IMAGING - A laser-engravable composition comprises one or more EPDM elastomeric rubbers, at least one of which comprises at least 8 weight % polyene recurring units. This laser-engravable composition of elastomeric rubbers can be quickly crosslinked using sulfur-containing vulcanizing compositions to provide laser-engravable compositions and layers in flexographic printing plate precursors. These precursors can be laser-engraved to provide relief images for flexographic printing. | 2013-06-13 |
20130147095 | METHOD AND APPARATUS FOR MANUFACTURING A MAGNETORHEOLOGICAL ELASTOMER - Disclosed is a method and electromagnetic device for manufacturing an anisotropic magneto-rheological elastomer (MRE) with an improved magneto-rheological effect. The electromagnetic device includes upper and lower electromagnets, and a test piece located therebetween. The upper and lower electromagnets are configured to apply a magnetic field of variable strength, which may be controlled by current applied from a power controller, to the test piece in a desired direction or orientation. More specifically, the device is designed in such a manner that carbonyl iron powder (CIP) (magnetic-responsive particles) dispersed in a magneto-rheological elastomer using natural rubber as a matrix can be oriented in the application direction of the magnetic field. A MRE produced by the method and electromagnetic device of the invention prevents formation of bubbles within a test piece, thereby improving the arrangement/orientation of CIP with the matrix. | 2013-06-13 |
20130147096 | Imprinting Stamp And Nano-Imprinting Method Using The Same - An imprinting stamp and a nano-imprinting method using the imprinting stamp are provided. The imprinting stamp includes a first substrate; one or more field regions on the first substrate, the first substrate including nano-patterns; and a first dummy pattern region on the first substrate and adjacent to the field region, the dummy pattern region including first dummy patterns having greater dimensions than that of the nano-patterns, the first dummy patterns being a plurality of polygons, each of the polygons having a vertex pointing in a first direction proceeding from the field region toward the first dummy pattern region. | 2013-06-13 |
20130147097 | METHOD FOR FORMING A PREFORM FOR A CONTAINER - A preform for use in a system for simultaneously forming and filling a container. The preform includes a finish region, a stretch initiation region adjacent to and descending from the finish region, a transition region adjacent to and descending from the stretch initiation region, a body region adjacent to and descending from the transition region, and an end cap region enclosing an end of the body region to define an interior for receiving a forming fluid. The stretch initiation region defines a wall thickness less than a wall thickness of the body region to encourage initial localized stretching in response to the forming fluid prior to stretching within the transition region or body region. | 2013-06-13 |
20130147098 | ROLLING CONTACT MEMBER, ROLLING BEARING, AND METHOD OF PRODUCING ROLLING CONTACT MEMBER - An outer ring, an inner ring and a ball that are a rolling contact member formed of sintered β sialon inexpensive and capable of reliably ensuring sufficient durability, is constituted of a sintered body containing β sialon as a main component and having a remainder formed of an impurity, and the outer ring, the inner ring and the ball have raceway/rolling contact surfaces, i.e., an outer ring raceway surface, an inner ring raceway surface and a ball rolling contact surface included in a portion having an outer ring high density layer, an inner ring high density layer and a ball high density layer higher in density than an inner portion. | 2013-06-13 |
20130147099 | PNEUMATIC SPRING STRUT HAVING A RESILIENT PISTON BEARING - A pneumatic spring strut for a vehicle, having a working chamber which is at least partially enclosed by a pneumatic spring bellows and having a centrally arranged telescopic damper, wherein the pneumatic spring bellows is fastened to the pneumatic spring cover and to a pneumatic spring piston connected to the damper cylinder and can roll on the outer side of the pneumatic spring piston, wherein the pneumatic spring piston is connected, at its top end and above the roll fold, to the damper cylinder by an elastic bearing, and the elastic bearing is composed of an elastomer body which is provided between a collar, which is situated on the damper cylinder, and a flange, which is arranged on the pneumatic spring piston, wherein the collar situated on the damper cylinder is arranged below the piston-rod-side end of the damper cylinder. | 2013-06-13 |
20130147100 | Air Spring - An air spring has a rolling-lobe flexible member terminating in a conically-shaped bead defining a conically-shaped opening of the flexible member. A-roll-off piston has an end facing toward the flexible member and has a conical seat formed thereon for receiving the bead of the flexible member to conjointly define therewith an airtight force fit connection. The roll-off piston further has a support shoulder beneath the conical seat whereon the flexible member is supported when deflected and the roll-off piston has an annular groove formed therein between the end thereof and the conical seat. An annular locking member is seatable in the annular groove after assembly of the flexible member on the conical seat so as to hinder the bead from slipping off of the conical seat. | 2013-06-13 |
20130147101 | VACUUM CUP ASSEMBLY - The present invention relates to a vacuum cup assembly designed to quickly and easily remove and mount a suction pad. The assembly comprises: a pipe-shaped body having a first passage for discharging air; a vacuum cup coupled to a lower end of the body; and a movable holder disposed between the body and the vacuum cup. Here, the vacuum cup includes a ring-shaped fastener, and a suction pad mounted on an outer surface flange of the fastener, wherein the holder resiliently presses and fixes the mounted suction pad against the fastener. Here, the inner space of the suction pad is in communication with the first passage of the body. The pressed and fixed state is negated when the holder is moved upwards, whereupon the suction pad can be easily removed and mounted. | 2013-06-13 |
20130147102 | PIPE FITTING SYSTEM - The present invention is a pipe fitting system to fit a selected one of one or more pipes, one or more flanges and one or more fittings that includes one or more fitting cradles, a fitting rest with a pair of apertures, the fitting rest is removably secured to the bottom fitting bed and a plurality of cinch chains each with a first end, the cinch chains are used to secure one or more fitting cradles to a fitting beam. The system also includes a high tensile steel racquet wrench to loosen and to tighten the bolts of the pipe fitting system. | 2013-06-13 |
20130147103 | CLAMPING MECHANISM FOR SURFACE BLASTING - A clamping mechanism for surface blasting of workpieces includes a base seat, a following assembly and a linking assembly. The following assembly is mounted on the base seat. The linking assembly is mounted on the following assembly, in which the linking assembly includes a lower rod, an upper rod, at least two linking bars and a plurality of loading members; the lower rod, the upper rod and the at least two linking rods cooperatively forming a four-bar linkage mechanism. The plurality of loading members are fixed to the at least two linking bars, such that the plurality of loading members are capable of turning over workpieces for surface blasting without requiring any positional readjustment of the workpieces by hand. | 2013-06-13 |
20130147104 | PENCIL SHARPENER - A pencil sharpener that has a strong clamping force, does not leave marks on the surface of the pencil due to clamping, and is easy to manufacture. The pencil sharpener includes a housing having a pencil insertion hole and a plurality of pivot parts arranged in a concentric circle around the pencil insertion hole, a frame body having a plurality of arc-shaped grooves, and a plurality of cam-shaped members that are pivotably attached to the pivot parts. When the frame body pivots, the cam-shaped members relatively move while being guided by the grooves, and their distal ends swing in a direction in which they move closer to or away from an insertion hole, and thereby a pencil that has been inserted is fixed or released. | 2013-06-13 |
20130147105 | SHEET HANDLING APPARATUS AND IMAGE FORMING SYSTEM - A sheet handling apparatus includes a sheet folding unit configured to perform folding on a sheet; and a sheet stacking unit configured to stack the folded sheet on a sheet stacking surface having an inclined surface and a nearly horizontal surface in order from upstream to downstream in a sheet conveying direction. A downstream end of the inclined surface is higher than an upstream end of the inclined surface with respect to a horizontal plane. The sheet handling apparatus also includes a discharging unit configured to discharge the folded sheet to the sheet stacking unit; a sheet conveying unit configured to convey the discharged sheet from the inclined surface to the nearly horizontal surface; and a conveying force applying unit configured to apply a conveying force to the sheet in contact with an upper surface of the sheet from above the inclined surface. | 2013-06-13 |
20130147106 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus includes an overlap conveying unit that conveys two or more sheets in an overlapping manner; a stacking unit that stacks therein the sheets conveyed in the overlapping manner; an aligning unit that includes a rotating body and a regulating member and is configured to bring the rotating body into contact with a topmost sheet among the stacked sheets, so as to make the sheet abut the regulating member and align ends of the sheets; and a controller that controls the overlap conveying unit. The controller is configured to determine, according to sheet information, whether to make the topmost sheet overlap in a condition of projecting from the other sheets. | 2013-06-13 |
20130147107 | SHEET FEEDER FOR FEEDING SHEET AND IMAGE PROCESSING APPARATUS WITH SHEET FEEDER - A sheet feeder includes a sheet placing portion, a feeding member, a supporting body, a driver, an electromagnetic clutch and a retraction controller. The supporting body is capable of changing a posture between a sheet feeding posture of the feeding member and a retracting posture for retracting the feeding member. The electromagnetic clutch is capable of changing a state between an engaged state in which a drive force is transmitted to the supporting body and a disengaged state in which the drive force is not transmitted to the supporting body. The retraction controller stops the output of a drive force after the electromagnetic clutch is set in the engaged state and the supporting body is set to the retracting posture by the drive force, and sets the electromagnetic clutch in the disengaged state when an engagement keeping time elapses after the output of the drive force is stopped. | 2013-06-13 |
20130147108 | SHEET FEEDER WITH TWO SUCTION WHEELS - A sheet feeder for separating sheets from a stack and for feeding the sheets to a downstream sheet processing machine includes a first suction wheel and a second suction wheel. The first suction wheel is disposed above the stack and the second suction wheel is disposed downstream of the stack and below a sheet travel plane. The first suction wheel separates a respective sheet from the stack and the second suction wheel accelerates the sheet. | 2013-06-13 |
20130147109 | NON-CIRCULAR SUCTION WHEEL AND SHEET FEEDER - A suction wheel attracts sheets by suction and transports them. The suction wheel contains a suction wheel body rotatable about an axis of rotation and provided with a plurality of suction openings formed in the circumferential surface of the suction wheel body. Accordingly, the suction wheel body is of a non-circular shape. In particular, the suction wheel includes an attraction area for attracting a sheet, a retaining area for retaining and conveying a sheet, and a release area for releasing a sheet. A sheet feeder ideally incorporates such a suction wheel. | 2013-06-13 |
20130147110 | MULTI-FUNCTION PERIPHERAL - A multi-function peripheral (MFP) including a machine body, a paper feeding cassette, and a sensing module is provided. The paper feeding cassette is assembled to the machine body, and multiple pieces of paper are suited for being stacked on a supporting surface of the paper feeding cassette. The sensing module includes a holder and a sensor. The holder is disposed at a side of the paper feeding cassette and capable of moving along a normal of the supporting surface. The sensor is disposed on the holder. A sensing surface of the sensor faces the supporting surface and keeps a distance from a top piece of the paper. | 2013-06-13 |
20130147111 | Display for a Pinball Game - A pinball machine or other entertainment device is provided that includes a video display and one or more sensors proximal to the display that can detect proximity of or contact with an object such as a pinball. Graphical images and/or animations can then be shown on the display, such that the images appear to directly interact with, or result from apparent contact with, the pinball or other object to provide an enhanced gameplay experience for the player. | 2013-06-13 |
20130147112 | TRAP DOOR AMUSEMENT GAME - An amusement game is disclosed that includes a skilled based feature that allows players to try to time the activation of a pressure sensitive switch at the same time a light is illuminated at a target position, and if the player accurately times the activation of the switch, a central proceeding unit sends a signal to a stepper motor to energized and completely open a door that is mounted in a horizontal plane by pivoting downwardly. The door is designed to supports a prize that will be distributed to a player. If the timing is not precise, a signal is sent to a central proceeding unit to incrementally open the door. As the door continues to be opened, any prize that is supported by the door will eventually distributed as the door is allowed to be directed to the prize to a receiving area. Sensors provided on the door detect the absence of a prize on the door and send a signal to a central processing unit to activate a claw mechanism that transfers prizes from a retaining area to a position on said door. | 2013-06-13 |
20130147113 | SHUFFLED PLAYING CARDS AND MANUFACTURING METHOD THEREOF - The present invention provides shuffled playing cards which eliminate the need for a game host to shuffle cards before games by taking a lot of time as well as eliminate the possibility of cheating. A shuffled playing cards ( | 2013-06-13 |
20130147114 | Multi-skill jigsaw puzzle - A multi-skill jigsaw puzzle intended for the entertainment of two or more people and having at least two puzzle piece sizes in a pre-determined spacial relationship, the larger size puzzle pieces for those less skilled in working jigsaw puzzles, and the smaller puzzle pieces requiring a higher degree of puzzle working skill. Intermediate puzzle pieces occupy an area that separates and joins the at least two puzzle sections. The intermediate puzzle pieces are larger than the at least two (2) puzzle piece sizes and includes a first side of protrusions and recesses sized to mate with puzzle pieces in the first section, and a second side, opposite the first side, of protrusions and recesses sized to mate with puzzle pieces in the second section. | 2013-06-13 |
20130147115 | STRATEGIC BOARD GAME - The present invention dates to a board game in which a three piece rivalry system allows for interaction of player pieces in a battle simulation type game. | 2013-06-13 |
20130147116 | SHUFFLER AND METHOD OF SHUFFLING CARDS - A playing card shuffling device includes a visual display in information communication with the playing card shuffling device. At least one processor is programmed to provide displayable information to the visual display indicative of an amount of time remaining or time expired in a procedure performed by the playing card shuffling device. | 2013-06-13 |