23rd week of 2013 patent applcation highlights part 42 |
Patent application number | Title | Published |
20130143393 | APPARATUS FOR MANUFACTURING COMPOUND SEMICONDUCTOR, METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR, AND COMPOUND SEMICONDUCTOR - Provided is an apparatus for manufacturing a compound semiconductor, which forms a compound semiconductor layer using a metal-organic chemical vapor deposition method. The apparatus is characterized in that: the apparatus is provided with a reaction container, a holder, which is disposed in the reaction container and has placed thereon a subject, on which the layer is to be formed, the subject having facing up the subject surface where the layer is to be formed, and a raw material supply port, through which the raw material gas of the compound semiconductor is supplied to the inside of the reaction container from the outside; the holder is in contact with the lower surface of the subject, the contact being inside of the outer circumferential portion of the subject to the center of the upper surface of the holder; and that the holder has a supporting portion, which supports the subject such that a predetermined interval is maintained between the upper surface of the holder and the lower surface of the subject. In the manufacture of the compound semiconductor using the MOCVD method, temperature distribution on the substrate surface to be deposited with a compound semiconductor crystal, and deviation of in-plane averaged light emission wavelength from a target value are suppressed using the apparatus. | 2013-06-06 |
20130143394 | SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING - A method of forming a semiconductor substrate including forming a base layer of a Group 13-15 material on a growth substrate during a growth process, forming a mask having mask regions and gap regions overlying the base layer during the growth process, and preferentially removing a portion of the base layer underlying the mask during the growth process. | 2013-06-06 |
20130143395 | STABLE AMORPHOUS METAL OXIDE SEMICONDUCTOR - A thin film semiconductor device has a semiconductor layer including a mixture of an amorphous semiconductor ionic metal oxide and an amorphous insulating covalent metal oxide. A pair of terminals is positioned in communication with the semiconductor layer and define a conductive channel, and a gate terminal is positioned in communication with the conductive channel and further positioned to control conduction of the channel. The invention further includes a method of depositing the mixture including using nitrogen during the deposition process to control the carrier concentration in the resulting semiconductor layer. | 2013-06-06 |
20130143396 | Pretreatment Method for Reduction and/or Elimination of Basal Plane Dislocations Close to Epilayer/Substrate Interface in Growth of SiC Epitaxial - Non-destructive pretreatment methods are generally provided for a surface of a SiC substrate with substantially no degradation of surface morphology thereon. In one particular embodiment, a molten mixture (e.g., including KOH and a buffering agent) is applied directly onto the surface of the SiC substrate to form a treated surface thereon. An epitaxial film (e.g., SiC) can then be grown on the treated surface to achieve very high (e.g., up to and including 100%) BPD to TED conversion rate close to the epilayer/substrate interface. | 2013-06-06 |
20130143397 | USE OF AN ORGANIC PLANARIZING MASK FOR CUTTING A PLURALITY OF GATE LINES - An organic planarizing layer (OPL) is formed atop a semiconductor substrate which includes a plurality of gate lines thereon. Each gate line includes at least a high k gate dielectric and a metal gate. A patterned photoresist having at least one pattern formed therein is then positioned atop the OPL. The at least one pattern in the photoresist is perpendicular to each of the gate lines. The pattern is then transferred by etching into the OPL and portions of each of the underlying gate lines to provide a plurality of gate stacks each including at least a high k gate dielectric portion and a metal gate portion. The patterned photoresist and the remaining OPL layer are then removed utilizing a sequence of steps including first contacting with a first acid, second contacting with an aqueous cerium-containing solution, and third contacting with a second acid. | 2013-06-06 |
20130143398 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a MOSFET includes the steps of: preparing a substrate made of silicon carbide; forming a drain electrode making ohmic contact with the substrate; and forming a backside pad electrode on and in contact with the drain electrode. The drain electrode formed in the step of forming the drain electrode is made of an alloy containing Ti and Si. Further, the backside pad electrode formed is maintained at a temperature of 300° C. or smaller until completion of the MOSFET. Accordingly, the manufacturing process can be efficient while achieving excellent adhesion between the electrodes. | 2013-06-06 |
20130143399 | Method for Forming a Reliable Solderable Contact - A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites. | 2013-06-06 |
20130143400 | METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE - A through-substrate via (TSV) structure that is immune to metal contamination due to a backside planarization process is provided. After forming a through-substrate via (TSV) trench, a diffusion barrier liner is conformally deposited on the sidewalls of the TSV trench. A dielectric liner is formed by depositing a dielectric material on vertical portions of the diffusion barrier liner. A metallic conductive via structure is formed by subsequently filling the TSV trench. Horizontal portions of the diffusion barrier liner are removed. The diffusion barrier liner protects the semiconductor material of the substrate during the backside planarization by blocking residual metallic material originating from the metallic conductive via structure from entering into the semiconductor material of the substrate, thereby protecting the semiconductor devices within the substrate from metallic contamination. | 2013-06-06 |
20130143401 | METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS - Disclosed methods cap exposed surfaces of copper lines with a layer of metal or metal-containing compound combined with silicon. In some cases, the metal or metal-containing compound forms an atomic layer. In certain embodiments, the methods involve exposing the copper surface first to a metal containing precursor to form an atomic layer of adsorbed precursor or metal atoms, which may optionally be converted to an oxide, nitride, carbide, or the like by, e.g., a pinning treatment. Subsequent exposure to a silicon-containing precursor may proceed with or without metallic atoms being converted. | 2013-06-06 |
20130143402 | Method of forming Cu thin film - The disclosure provides a method for forming a dense Cu thin film by atomic layer deposition, comprising the following steps of: (A) providing an additive gas; (B) choosing a copper-containing metal-organic complex as a precursor; (C) using a carrier gas to introduce the additive gas into the precursor cell mixing with the precursor; (D) pre-depositing the precursor on the surface of the substrate with a TaN | 2013-06-06 |
20130143403 | TEXTURE-ETCHANT COMPOSITION FOR CRYSTALLINE SILICON WAFER AND METHOD FOR TEXTURE-ETCHING (1) - Disclosed herein is an etching composition for texturing a crystalline silicon wafer, comprising, based on a total amount of the composition: (A) 0.1 to 20 wt % of an alkaline compound; (B) 0.1 to 50 wt % of a cyclic compound having a boiling point of 100° C. or more; (C) 0.00001 to 10 wt % of a silica-containing compound; and (D) residual water. The etching composition can maximize the absorbance of light of the surface of a crystalline silicon wafer. | 2013-06-06 |
20130143404 | SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE - The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b).
| 2013-06-06 |
20130143405 | SILICON WAFER PROCESSING SOLUTION AND SILICON WAFER PROCESSING METHOD - A silicon-wafer processing fluid used for processing a silicon wafer contains a friction modifier containing a nitrogen-containing compound, pH of the nitrogen-containing compound being in a range from 2 to 8 when a mass ratio with water (i.e. nitrogen-containing compound/water) is 1/99. The nitrogen-containing compound is preferably a heterocyclic compound. The silicon-wafer processing fluid restrains an abrasion of abrasive grains rigidly attached to a wire and generation of hydrogen. | 2013-06-06 |
20130143406 | TECHNIQUES PROVIDING PHOTORESIST REMOVAL - A method for manufacturing a semiconductor device includes forming a patterned photoresist layer over a substrate, performing a plasma ashing process to the patterned photoresist layer, thereby removing a portion of the patterned photoresist layer, exposing the patterned photoresist layer to broadband ultraviolet radiation and ozone, thereby removing other portions of the patterned photoresist layer, and performing a cleaning of the patterned photoresist layer after exposing the patterned photoresist layer to broadband ultraviolet radiation and ozone. | 2013-06-06 |
20130143407 | METHOD FOR PRODUCING A THIN SINGLE CRYSTAL SILICON HAVING LARGE SURFACE AREA - The present invention relates to a method for producing a thin single crystal silicon having large surface area, and particularly relates to a method for producing a silicon micro and nanostructure on a silicon substrate (or wafer) and lifting off the silicon micro and nanostructure from the silicon substrate (or wafer) by metal-assisted etching. In this method, a thin single crystal silicon is produced in the simple processes of lifting off and transferring the silicon micro and nanostructure from the substrate by steps of depositing metal catalyst on the silicon wafer, vertically etching the substrate, laterally etching the substrate. And then, the surface of the substrate is processed, for example planarizing the surface of the substrate, to recycle the substrate for repeatedly producing thin single crystal silicons. Therefore, the substrate can be fully utilized, the purpose of decreasing the cost can be achieved and the application can be increased. | 2013-06-06 |
20130143408 | ETCH RESISTANT ALUMINA BASED COATINGS - Method of forming a protective hard mask layer on a substrate in a semiconductor etch process, comprising the step of applying by solution deposition on the substrate a solution or colloidal dispersion of an alumina polymer, said solution or dispersion being obtained by hydrolysis and condensation of monomers of at least one aluminium oxide precursor in a solvent or a solvent mixture in the presence of water and a catalyst. The invention can be used for making a hard mask in a TSV process to form a high aspect ratio via a structure on a semiconductor substrate. | 2013-06-06 |
20130143409 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURES USING SELECTIVELY-FORMED SIDEWALL SPACERS - Methods for forming semiconductor structures using selectively-formed sidewall spacers are provided. One method comprises forming a first structure and a second structure. The second structure has a height that is greater than the first structure's height. A first sidewall spacer-forming material is deposited overlying the first structure and the second structure. A second sidewall spacer-forming material is deposited overlying the first sidewall spacer-forming material. A composite spacer is formed about the second structure, the composite spacer comprising the first sidewall spacer-forming material and the second sidewall spacer-forming material. The second sidewall spacer-forming material is removed from the first structure and the first sidewall spacer-forming material is removed from the first structure. | 2013-06-06 |
20130143410 | Non-Uniformity Reduction in Semiconductor Planarization - Provided is a method of planarizing a semiconductor device. The method includes providing a substrate. The method includes forming a first layer over the substrate. The method includes forming a second layer over the first layer. The first and second layers have different material compositions. The method includes forming a third layer over the second layer. The method includes performing a polishing process on the third layer until the third layer is substantially removed. The method includes performing an etch back process to remove the second layer and a portion of the first layer. Wherein an etching selectivity of the etch back process with respect to the first and second layers is approximately 1:1. | 2013-06-06 |
20130143411 | SYSTEMS AND METHODS FOR IMPROVING FRONT-SIDE PROCESS UNIFORMITY BY BACK-SIDE METALLIZATION - Disclosed are systems and methods for improving front-side process uniformity by back-side metallization. In some implementations, a metal layer can be formed on the back side of a semiconductor wafer prior to certain process steps such as plasma-based processes. Presence of such a back-side metal layer reduces variations in, for example, thickness of a deposited and/or etched layer resulting from the plasma-based processes. Such reduction in thickness variations can result from reduced variation in radio-frequency (RF) coupling during the plasma-based processes. Various examples of wafer types, back-side metal layer configurations, and plasma-based processes are disclosed. | 2013-06-06 |
20130143412 | METHODS FOR PREPARING THIN SAMPLES FOR TEM IMAGING - A method and apparatus for preparing thin TEM samples in a manner that reduces or prevents bending and curtaining is realized. Embodiments of the present invention deposit material onto the face of a TEM sample during the process of preparing the sample. In some embodiments, the material can be deposited on a sample face that has already been thinned before the opposite face is thinned, which can serve to reinforce the structural integrity of the sample and refill areas that have been over-thinned due to a curtaining phenomena. In other embodiments, material can also be deposited onto the face being milled, which can serve to reduce or eliminate curtaining on the sample face. | 2013-06-06 |
20130143413 | WAFER PROCESSING METHOD - The back side of a wafer having a plurality of devices formed on the front side thereof is ground to thereby reduce the thickness of the wafer. A resin layer is formed on the front side of the wafer and is cured. The resin layer is planarized while the back side of the wafer is held on a chuck table and the resin layer formed on the front side of the wafer is exposed. The resin layer is bonded to a hard plate through a bonding member, and the back side of the wafer is ground by using a grinding unit of a grinding apparatus to thereby reduce the thickness of the wafer to a predetermined thickness while the hard plate bonded to the wafer is held on a chuck table of the grinding apparatus. | 2013-06-06 |
20130143414 | NANOSTRUCTURED ELECTRODES AND ACTIVE POLYMER LAYERS - Embodiments of methods for fabricating polymer nanostructures and nanostructured electrodes are disclosed. Material layers are deposited onto polymer nanostructures to form nanostructured electrodes and devices including the nanostructured electrodes, such as photovoltaic cells, light-emitting diodes, and field-effect transistors. Embodiments of the disclosed methods are suitable for commercial-scale production of large-area nanostructured polymer scaffolds and large-area nanostructured electrodes. | 2013-06-06 |
20130143415 | Multi-Component Film Deposition - Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising a plurality of elongate gas ports including at least one first reactive gas port in fluid communication with a first reactive gas and at least one second reactive gas port in fluid communication with a gas manifold. The gas manifold is in fluid communication with at least a second reactive gas different from the first reactive gas and a purge gas. Also provided are atomic layer deposition apparatus and methods including linear energy sources in one or more of region before the gas distribution plate and a region after the gas distribution plate. | 2013-06-06 |
20130143416 | LASER ABLATION WITH EXTRACTION OF THE ABLATED MATERIAL - A technique comprising: using a laser beam to ablate a target surface ( | 2013-06-06 |
20130143417 | CRYSTALLIZATION PROCESSING FOR SEMICONDUCTOR APPLICATIONS - A method and apparatus for forming a crystalline semiconductor layer on a substrate are provided. A semiconductor layer is formed by vapor deposition. A pulsed laser melt/recrystallization process is performed to convert the semiconductor layer to a crystalline layer. Laser, or other electromagnetic radiation, pulses are formed into a pulse train and uniformly distributed over a treatment zone, and successive neighboring treatment zones are exposed to the pulse train to progressively convert the deposited material to crystalline material. | 2013-06-06 |
20130143418 | RAPID THERMAL ANNEALING TO REDUCE PATTERN EFFECT - A method of performing rapid thermal annealing on a substrate including heating the substrate to a first temperature in a rapid thermal annealing system having a front-side heating source and a backside heating source. The method further includes raising the temperature of the substrate from the first temperature to a second temperature greater than the first temperature. The backside heating source provides a greater amount of heat than the front-side heating source during the raising of the temperature of the substrate. | 2013-06-06 |
20130143419 | ELECTRONIC APPARATUS ASSEMBLY - An electronic apparatus assembly including an electronic apparatus and a detachable connector is provided. The electronic apparatus has a cavity, a first magnetic element and a set of first terminals. The first magnetic element and the set of first terminals are disposed in the cavity. The detachable connector has an inserting portion, a body portion, a second magnetic element and a set of second terminals. The inserting portion is adapted to be inserted into the cavity. The body portion is connected to the inserting portion. The second magnetic element and the set of second terminals are disposed on the inserting portion. When the inserting portion is inserted into the cavity, the first magnetic element and the second magnetic element are mutually attracted. The two sets of terminals are mutually contacted, and the body portion is adapted to be supported on a plane to stand the electronic apparatus on the plane. | 2013-06-06 |
20130143420 | Electrical Connector and Method of Making It - The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection. | 2013-06-06 |
20130143421 | USB CONNECTOR - The present invention relates to a USB connector, which comprises: a connector main body having its front being downwardly extended thereby forming a stop part having a first lead angle; and a substrate having plural first contact pads and plural second contact pads, so as to form a USB connector. Said USB connector allows a USB2.0 connector and a USB3.0 connector to be respectively inserted. | 2013-06-06 |
20130143422 | Power Connector - Disclosed herein is a power connector. The power connector includes a body, a power source terminal provided in the body, and connected with a power source line, a ground terminal provided in the body, and connected with a ground line, and an interference removal unit connected between the power source terminal and the ground terminal to remove electromagnetic interference. Here, a stop band filter is formed inside the power connector, so that parasitic component signals generated in the internal power source line are prevented from being transmitted as a constant power source even though a separate EMI filter is not formed inside the system. | 2013-06-06 |
20130143423 | POLARITY PROTECTION FOR ELECTRIFIED GRID AND MATING CONNECTOR - A connector, an electrified grid element and the combination. First and second contacts with first and second contact portions are secured in the housing of the connector. The second contact portion is offset from a first surface of the connector a greater distance that the first contact portion. An electrified grid has a first conductor and a second conductor, with the first conductor having an opposite polarity to the second conductor. A first insulator member is positioned proximate the first conductor and a second insulator member is positioned proximate the second conductor. The first and second insulator members prevent the mating of the connector to the electrified grid unless the connector is properly oriented in the electrified grid, thereby insuring proper polarity between the connector and the electrified grid. | 2013-06-06 |
20130143424 | ELECTRICAL PLUG CONNECTOR - In an electrical plug connector comprising an insulating contact adapter the contact adapter has a first wing which can be pivoted between an open and a closed position. The contact adapter is designed to enclose a metal contact element between the first wing and a wall of the contact adapter when the first wing is in the closed position. | 2013-06-06 |
20130143425 | CONNECTION ASSEMBLY FOR CLOSING AN ELECTRIC CONTACT - The invention relates to a connection assembly ( | 2013-06-06 |
20130143426 | BUS BAR, METHOD OF MANUFACTURING THE SAME, AND BUS BAR AND CONNECTOR - A busbar of the present invention increases yield per metal material in comparison to plate-shaped bus bars, enables provision of protrusions on a member located inside relative to a conductor, and enables formation of the busbar in a bent shape. The busbar of the present invention is provided with a busbar insulator ( | 2013-06-06 |
20130143427 | ELECTRICAL WIRE AND SHEET-METAL CONNECTOR - Electrical connector assemblies, light bases with one or more electrical connector assemblies, and methods for connecting one or more electrical wires to one or more sheet-metal connectors are disclosed. An electrical connector assembly for an electrical distribution system is disclosed, which includes an electrically insulated housing with a wire-connection port and a blade-connection port. The wire-connection port is designed to receive an electrical wire, while the blade-connection port is designed to receive an electrically conductive blade. An electrical conductor is disposed within the housing, extending between the blade-connection and wire-connection ports. A first threadless fastener secures the wire in the wire-connection port and electrically couples the wire to the electrical conductor. A second threadless fastener secures the blade in the blade-connection port and electrically couples the blade to the electrical conductor. The wire-connection port may be configured to open and release the electrical wire without the use of a tool. | 2013-06-06 |
20130143428 | LOCKING SOCKET - A locking socket includes a shell and a buckle mechanism. The shell forms a slot and plug holes adapted for receiving a plug. The buckle mechanism is pivotably disposed to the shell and is exposed out of the shell via the slot. The buckle mechanism further forms a buckle portion which is able to alternatively lock on or release the plug when the buckle mechanism pivots so that the locking socket of the present invention is adapted for the plug to insert in. Also, the buckle mechanism alternatively abuts against the plug to prevent the plug from detachment. Thereby, the present invention provides a locking socket with simpler structure, improved structure intensity, and better positioning. | 2013-06-06 |
20130143429 | ELECTRIC CONNECTOR - To prevent, with a simple structure, damage on a component such as a conductive contact at the time of operation of an actuator, an actuator pinching a signal transmission medium by being moved to a connection acting position facing a wiring board is provided with a protective projection protruding toward the wiring board with the actuator being moved to the connection acting position. With this, a gap between the actuator and the printed wiring board is covered with the protective projection from outside, the components such as conductive contacts disposed inside the gap between the actuator and the printed wiring board are prevented from being in contact with a nail of an operator. | 2013-06-06 |
20130143430 | COAXIAL RADIOFREQUENCY CONNECTOR - The invention relates to a coaxial connector with a female and a male connector part. The two connector parts each have an inner ventilation channel which extends in the longitudinal direction of the connector and which opens out into at least one outwardly extending, stepped (when viewed in the longitudinal section) ventilation channel. | 2013-06-06 |
20130143431 | TRANSFER PLUG ASSEMBLY - A transfer plug assembly includes a first plug, first flexible link, second flexible link, and a second plug. A first end of each the first flexible link and the second flexible link are connected to two lateral sides of the first plug respectively. A second end of each the first flexible link and the second flexible link are connected to two lateral sides of the second plug respectively. The second plug serves to connect the first plug. Through the linking of the first and second flexible links, the second plug will hang around the first plug and is accessible nearby. The flexible linking of the first and second links will provide free movability between the first plug and the second plug. | 2013-06-06 |
20130143432 | CHARGING PORT STRUCTURE AND STRADDLED VEHICLE - A straddled vehicle is provided which is equipped with a charging port structure in which a charging port is fixedly disposed within a recess provided in a wall member, a base end part of a cover member that is capable of closing the charging port is pivotably supported at a position adjacent to the charging port, and a lid that is capable of closing the recess so as to cover the cover member from the outside is pivotably supported on the wall member, wherein retaining means ( | 2013-06-06 |
20130143433 | CONNECTION TERMINAL - A connection terminal includes a bushar, wherein at least one insertion opening for accommodating a bridging device is formed on the bushar, wherein the insertion opening is designed in the form of a material passage having a hole collar, wherein the hole collar of the material passage encircles the insertion opening. The hole collar extends away from the surface of the bushar in the opposite direction to the insertion direction of the bridging device. | 2013-06-06 |
20130143434 | CONNECTOR FOR ELECTRIFIED CEILING GRID - A connector assembly for installation on a ceiling grid having conductors therein. Contacts are mounted in a housing of the connector, with the contacts having contact portions. Mounting members are mounted in the housing, with the mounting members having grid mounting sections. A cam member is provided in the housing, with the cam member being movable between a first position and a second position. As the cam member is moved from the first position to the second position, the cam member biases the contact portions of the contacts into electrical engagement with the conductors of the ceiling grid and biases the grid mounting sections of the mounting members into mechanical engagement with the ceiling grid to provide a mechanical connection between the ceiling grid and the connector. | 2013-06-06 |
20130143435 | SOCKET MODULE AND TERMINAL HAVING THE SAME - A terminal in accordance with one exemplary embodiment of the present disclosure includes a terminal body, a substrate mounted onto the terminal body, and a socket module coupled to the substrate to transfer an electrical signal by being electrically connected to an inserted plug, and the socket module includes a housing having an opening at one surface thereof, the plug being inserted into the opening, and a coupling unit formed at at least one side of the housing, and slidable with respect to the substrate upon being coupled to the substrate. This may allow a substrate assembly coupled with the socket module to become slimmer by a thickness of the substrate, resulting in providing a more size-reduced terminal. | 2013-06-06 |
20130143436 | CONNECTOR FOR ELECTRIFIED CEILING GRID AND METHOD OF INSTALLING THE SAME - A connector for installation on a grid having conductors therein and a method of installation therefore. The connector has a housing with at least one contact mounted in the housing which makes an electrical connection with the conductors of the grid when the connector is mated with the grid. At least one mounting member is movable between a first position in which a grid mounting section of the at least one mounting member is positioned in the housing and a second position in which the grid mounting section extends beyond a top surface of the housing to provide a mechanical connection between the grid and the connector. | 2013-06-06 |
20130143437 | COAXIAL CONNECTOR PLUG AND MANUFACTURING METHOD THEREOF - An outer conductor portion includes an outer conductor and a pair of outer terminals. The outer conductor is formed into a substantially cylindrical shape extending in the z-axis direction. The outer terminals are drawn toward the positive z-axis direction side of the outer conductor. In a plan view in the z-axis direction, the outer terminals are each bent in a direction outwardly from the outer conductor, and face each other across the outer conductor. An insulator has two sides, an upper surface in contact with a positive z-axis direction-side end portion of the outer conductor, and a lower surface in contact with the outer terminals at the sides, and thereby is nipped by the outer conductor portion in the z-axis direction. A central conductor is attached to the insulator, and is provided in a region surrounded by the outer conductor. | 2013-06-06 |
20130143438 | COAXIAL CABLE CONTINUITY DEVICE - A jumper sleeve configured to be installed on an outer side of a male F-connector to facilitate easy connection of and maintain ground continuity across the male F-connector and a female F-connector. In one embodiment, a conductive element is installed on an inner surface of the jumper sleeve and conductively engages an outer surface of the male F-connector to maintain ground continuity across the male and female F-connectors. | 2013-06-06 |
20130143439 | CONNECTOR ASSEMBLY HAVING DEFORMABLE CLAMPING SURFACE - A coaxial cable connector comprising a connector body having a first end and a second end, wherein the connector body is configured to receive a coaxial cable through the second end, a first cooperating surface disposed within the connector body, wherein the first cooperating surface is a surface of a clamp, the clamp is configured to threadably engage an outer conductor of the coaxial cable, and a second cooperating surface, wherein the second cooperating surface cooperates with the first cooperating surface to collapse an outer conductor of the coaxial cable, wherein at least a portion of the second cooperating surface malleably deforms to a variable axial thickness of a non-uniform collapsed portion of the outer conductor is provided. An associated method is also provided. | 2013-06-06 |
20130143440 | CONNECTOR - A terminal fitting is inserted into a terminal holding chamber of a front member. A guide recess is in an opposing wall face opposing a lance, of inner faces of a terminal accommodation chamber, an escape recess continuous with the guide recess is in a receiving face of the terminal holding chamber, a guide projection protruding from a position rearward of the front end of an angular tube portion and making sliding contact with a bottom face of the guide recess is in an opposing outer face of the angular tube portion. The length from the guide projection to the front end of the angular tube portion is larger than the distance between the front end of the guide recess and the rear end of the receiving face, and the height of the receiving face relative to the bottom face is smaller than the height of the opposing outer face. | 2013-06-06 |
20130143441 | UNIVERSAL SERIAL BUS CONNECTOR - A universal serial bus (USB) connector includes a shell, a body and an elastic portion. The body is provided inside the shell and can be moved therein. The body includes a first conductive terminal provided on a first surface and a second conductive terminal provided on a second surface, the first surface disposed opposite to the second surface. The elastic portion is connected to both leading edges of the first surface and the second surface for keeping the body in position inside the shell. | 2013-06-06 |
20130143442 | ELECTRICAL CONNECTOR ASSEMBLY WITH IMPROVED SHIELD AND SHIELD COUPLING - An electrical connector provides shielded signal pathways. The electrical connector includes a shield plate, a first finger that extends from an edge of the shield plate, and a second finger that extends from the edged of the shield and that is adjacent to the first finger. A channel is formed between the first finger and the second finger. A coupling is placed within the channel adjacent the first finger. The coupling includes a contact, a first connecting arm extending from a first end of the contact to a first portion of the first finger, and a second connecting arm extending from a second end of the contact to a second portion of the first finger. The first connecting arm and the second connecting arm provide at least two current paths from the contact to the first finger. | 2013-06-06 |
20130143443 | CARD CONNECTOR - A card connector includes an insulating housing defining a card recess, first electrical terminals and second electrical terminals disposed in the insulating housing. Each first electrical terminal has a base strip, a first fixing arm, a first elastic arm extending forward and inclining upward from the first fixing arm, a second elastic arm slantwise extending forward and upward from a substantial middle of the base strip and apart located under the first elastic arm, and a contact portion protruding upward from a front end of the base strip and apart located under the second elastic arm. A distal end of the first elastic arm elastically stretches upward into the card recess, and can be pressed downward to resist against the second elastic arm so as to make the second elastic arm further contact with the contact portion when an electronic card is inserted into the card recess. | 2013-06-06 |
20130143444 | Receptacle Connector - A receptacle connector is provided and includes an insulating case, a securing device and a cover. The insulating casing includes a plurality of terminal receiving passageways, a plug receiving space, a pair of protrusions on two sides of the plug receiving space. A securing device receiving space is disposed on one of the two sides. The securing device includes a horizontal portion, a first vertical portion and a second vertical portion extending downward from the horizontal portion, a first soldering portion extending horizontally from the first vertical portion, a second soldering portion extending horizontally from the second vertical portion. An engagement portion is positioned between the first vertical portion and the second vertical portion. The cover is pivotally connected to the insulating casing and includes a first protrusion receiving passageway and a second protrusion receiving passageway which communicate with each other and correspond in position with the pair of protrusions. | 2013-06-06 |
20130143445 | INTERCONNECT SUBSTRATE AND ELECTRONIC DEVICE - Provided is an interconnect substrate that includes a laminated body including an electric conductor and an insulator, over which an electronic element ( | 2013-06-06 |
20130143446 | CELL-VOLTAGE DETECTION CONNECTOR - To provide a technique by which an accumulated tolerance caused by the arrangement of terminal fittings is eliminated to improve the workability in a multipole cell-voltage detection connector. When all of receptacle terminals ( | 2013-06-06 |
20130143447 | ELECTRICAL CONNECTOR WITH IMPROVED HIGH FREQUENCY SIGNAL TRANSMISSION ENVIRONMENT - An electrical connector defining a receiving cavity for receiving a corresponding plug includes an insulative housing and a number of contacts retained in the insulative housing. The contacts include a number of first contacts which are arranged in a row along a transverse direction of the insulative housing. The first contacts include two pairs of differential signal contacts and a grounding contact between said two pairs of differential signal contacts. Each first contact has a contact portion extending into the receiving cavity, a tail portion extending out of the insulative housing and a connecting portion between the contact portion and the tail portion. The connecting portion of the grounding contact is wider than that of the differential signal contacts in the transverse direction. | 2013-06-06 |
20130143448 | FINGER PROTECTION FOR 90.degree. HEADER - The present invention relates to an electrical plug-in connector ( | 2013-06-06 |
20130143449 | BATTERY CONNECTOR - A battery connector is disclosed. The battery connector is disposed in a mounting side of a motherboard, and an input/output port is positioned on the mounting side for inserting outer connectors. Wherein, the elertric connector includes a connector body having a battery accommodating space for accommodating the battery. The connector body is located on the mounting side and the input/output port is positioned on the mounting side. The computer case has a slot near the input/output port, and the slot is disposed corresponding to the battery accommodating space. | 2013-06-06 |
20130143450 | Electrical Connection Bus - Connecting bus including an electrical conductive bar including two electrical connection means. At least one of the two electrical connection means includes a female connector including one or several electrically conductive spring tongues. | 2013-06-06 |
20130143451 | Electrical Connector Terminal - An electrical connector terminal comprises a resilient contact end) for electrically contacting with an insertion end of a mating electrical connector terminal. At least one side of the resilient contact end contacts with the insertion end at a plurality of electrical contact portions separated from each other in a longitudinal direction. | 2013-06-06 |
20130143452 | TERMINAL STRUCTURE - In a terminal structure, at least one pair of left and right clamp pieces are formed in a terminal in which an electrode is slide-inserted. The left and right clamp pieces elastically press the electrode from both right and left sides when the electrode is inserted in the terminal. A contact piece is formed on at least one of left and right sides of the terminal, and is separated in the slide-insertion direction by a slit from a clamp piece-formed portion where the clamp piece is formed. The clamp piece is elastically deformed to contact the contact piece when the electrode is inserted in the terminal. | 2013-06-06 |
20130143453 | WIRE CONNECTING TERMINAL FOR ENAMELED WIRES - A wire connecting terminal for enameled wires includes an insulating plate ( | 2013-06-06 |
20130143454 | CRIMP TERMINAL - A conductor crimp portion ( | 2013-06-06 |
20130143455 | Detectable Warning Mat made from Recycled Tire Rubber incorporating a Mesh Reinforcement - Improvements in a warning mat are with a mesh reinforcement disclosed. The improvements include using recycled tire rubber allows for use of a material that is not used in a landfill and the warning mat. The tires are chopped into fine pellets or strips, metal belting material is usually removed and the rubber is combined with a binding agent to recombine the rubber elements while still leaving some air spaces that improve the cushioning effect of the warning mat. A mesh reinforcement of typically expanded metal is sandwiched into the rubber particles to bond through the openings of the expanded metal whereby encapsulating the mesh reinforcement within the warning mat. The mesh reinforcement is extremely dimensionally stable and maintains the dimensions of the warning mat. Fairly large sections of warning mat can be fabricated for transportation and installation. | 2013-06-06 |
20130143456 | Laminated Cloth with Heat Accumulation and Temperature Maintaining Effect - A laminated cloth includes a cloth layer having a first side and a second side opposite to the first side. A thermally insulating rubber sheet includes a first surface and a second surface opposite to the first surface. An adhesive layer is bonded between the second side of the cloth layer and the first surface of the thermally insulating rubber sheet. A cloth containing titanium includes a first face and a second face opposite to the first face. A ceramic powders/adhesive layer is bonded between the second surface of the thermally insulating rubber sheet and the first face of the cloth containing titanium. | 2013-06-06 |
20130143457 | Formulated Benzoxazine Based System for Transportation Applications - The present disclosure provides a halogen-free thermosetting composition including a benzoxazine compound, a monobenzoxazine monomer, and a naphthalene epoxy. The halogen-free thermosetting composition is especially suited for use in aerospace, automobile, rail and marine applications. | 2013-06-06 |
20130143458 | CARBODIIMIDATON METHOD - The present invention relates to aqueous dispersions containing hydrophilized polycarbodiimides, methods for producing the aqueous dispersions according to the invention, their use as a constituent of binders in adhesives, lacquers, paints, paper coating compounds or in fibre nonwovens and articles made of wood, metal, textile, leather or plastic, which are treated with the aqueous dispersion according to the invention. | 2013-06-06 |
20130143459 | Glass Compositions And Fibers Made Therefrom - Some embodiments of the present invention provide fiberizable glass compositions formed from batch compositions comprising amounts of one or more glassy minerals, including perlite and/or pumice. Some embodiments of the present invention related to glass fibers formed from such batch compositions, and composites and other materials incorporating such glass fibers. | 2013-06-06 |
20130143460 | HIGH PERFORMANCE COMPOSITE FABRIC - Methods and apparatus are provided for a durable, wear resistant composite fabric. In one exemplary embodiment the composite fabric comprises an outer layer of a woven synthetic fabric, and a backing layer of a woven fabric made from high tenacity fibers. The backing layer may be consolidated with the outer layer. | 2013-06-06 |
20130143461 | Polymer Compositions and Nonwoven Compositions Prepared Therefrom - Propylene-based polymer compositions are provided comprising propylene and from about 5 wt % to about 20 wt % of one or more C | 2013-06-06 |
20130143462 | ASSEMBLED INTERMEDIATE COMPRISING A COILED-FILAMENT NONWOVEN WEB AND ARTICLES - An assembled intermediate is described comprising a fluid transport element proximate an absorbent material. The fluid transport element comprises a thermoplastic nonwoven web comprising a plurality of coiled filaments having an average diameter of 200 to 500 microns interengaged by means of intermittent bonds. The web preferably has certain properties such as a thickness of 3 to 20 mm, a density ranging from 0.02 to 0.10, and a work of compression of no greater than 20 kJ/m | 2013-06-06 |
20130143463 | MANUFACTURING METHOD OF DISPLAY PANEL - A manufacturing method for a display panel includes: forming a first display panel including a plurality of pixel electrodes, gate lines and data lines connected to the pixel electrodes, a first pad unit connected to the gate lines, and a second pad unit connected to the data lines; forming a second display panel including a common electrode; forming a first short point connected to the first pad unit; forming a second short point connected to the second pad unit; adhering the first display panel and the second display panel; dividing the second display panel into a plurality of regions insulated from each other, a first region corresponding to the first short point, a second region corresponding to the second short point, and a third region; and applying a first voltage to the first region, a second voltage to the second region, and a third voltage to the third region. | 2013-06-06 |
20130143464 | Method of Fabricating Lightweight and Thin Liquid Crystal Display - In a method for fabricating a lightweight and thin liquid crystal display (LCD), a first mother substrate, a subsidiary substrate and a thin second mother substrate are provided. An edge cut is formed by cutting edges of the first and second mother substrates and the subsidiary substrate to be inclined at a predetermined angle. An array process is performed on the first mother substrate. The subsidiary substrate is attached to the second mother substrate. A color filter process is performed on the second mother substrate having the subsidiary substrate attached thereto. The first and second mother substrates are attached together. The subsidiary substrate is separated from the first and second substrates by spraying air between the second mother substrate and the subsidiary substrate, in which the edge cut is formed. | 2013-06-06 |
20130143465 | METHOD FOR MAKING FIELD EMISSION CATHODE DEVICE - A method for making a field emission cathode device is provided. A filler, a substrate, and a metal plate are provided. The metal plate has a first surface and a second surface opposite to the first surface, and defines at least one through hole extending through from the first surface to the second surface. At least one electron emitter is inserted into the at least one through hole. The first surface of the metal plate is attached to the substrate. At least a part of the at least one electron emitter is located between the first surface and the substrate. The at least one through hole is filled with the filler to firmly fix the at least one electron emitter. | 2013-06-06 |
20130143466 | ASSEMBLY TOY - Provided is an assembly toy which includes a first molded member and a second molded member which are aligned with and face each other, wherein: a projection is formed in the first molded member on a surface which faces the second molded member; a hole in which the projection is fit is formed in the second molded member on a surface which faces the first molded member; an outer peripheral shape of the projection along a cross-section perpendicular to the direction in which the projection projects is other than a circle; a peripheral shape of the hole on a surface which faces the first molded member corresponds to the outer peripheral shape of the projection; and the projection fits in the hole without rotating about the central axis thereof. | 2013-06-06 |
20130143467 | TOY BUILDING BLOCKS - A toy building block set includes multiple polyhedron blocks of different lengths removably attachable together. Each block includes at least a top and four side walls. At least one connector extends from the top and includes opposing interior and exterior surfaces. A recessed area is provided at the bottom of each block. Engagement projections or depressions are provided on the connector and the remaining engagement structure are provided in the recessed area of each block where they might fully or partially engage or not engage with structures on the connector. The mechanical interference engagements and resulting engagement forces provided between any two of the blocks are less than three and even less than two times the number of engagements and resulting engagement forces provided by a mated pair of the smallest polyhedron blocks of the set. | 2013-06-06 |
20130143468 | METHOD AND SYSTEM OF MANAGING A GAME SESSION - A learning plaything set to communicate with similar learning playthings during a game session. The learning plaything comprises a reader which reads a plurality of data marks indicative of a plurality of playing abilities, a memory for storing the plurality of playing abilities, a communication unit which establishes at least one wireless connection with another communication unit of at least one other learning plaything during a game session, a management module which uses the at least one wireless connection to coordinate an outcome to the game session with the at least one other learning plaything according to the stored plurality of playing abilities, and at least one presentation unit which presents at least one plaything action according to the outcome. | 2013-06-06 |
20130143469 | BRASSIERE FOR CONTAINING DRESSINGS AND/OR FOR CORRECTING ASYMMETRIES - A brassiere comprising two cups, each one shaped like a shell containing inside a detachable padding. The outer shell is pre-shaped, that is without seams, made of natural or synthetic tissue and has no inserts made of metallic material in order not to exert any compression onto the mammary region. The inner shell is made of breathable and extensible elastic fibres, to allow supporting the healthy breast and keeping in seat the dressing without constricting. The cup shape is so as to be similar to that of a usual brassiere wholly containing the mamma, so as not to reveal the presence of dressing or shape or volume asymmetries even under light dresses. | 2013-06-06 |
20130143470 | HUMIDITY CONTROL FOR ABRASIVE BLASTING SYSTEMS - An abrasive blasting system includes an air subsystem being adapted to provide pressurized air, a fluid subsystem being adapted to provide fluid, a mixer being adapted to mix the fluid with the pressurized air, and a media subsystem being adapted to provide abrasive media. The method includes pressurizing the air, mixing the fluid with the air, thereby changing the relative humidity of the air, and blasting a surface of a structure with abrasive media mixed with the fluid and the pressurized air. | 2013-06-06 |
20130143471 | GEAR GRINDING MACHINE AND GEAR GRINDING METHOD - The actual axial center position of a helical gear relative to the axial center position of a rotary table is calculated on the basis of input gear dimensions and information from a touch probe. Correction values for the positions and motions of the rotary table and a grindstone are calculated on the basis of the actual axial center position of the helical gear. Operation values for the rotary table, a column, a saddle, and a grindstone head are calculated by adding the correction values to reference values for the positions and motions of the rotary table and the grindstone. Motors are controlled in such a way that operation is carried out at the operation values to thereby carry out form grinding. | 2013-06-06 |
20130143472 | PARTS CARRIER ASSEMBLY FOR GRINDING MACHINE - A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis. | 2013-06-06 |
20130143473 | APPARATUS FOR TREATING A PLATE-LIKE MEMBER AND METHOD OF TREATING THE SAME - The present invention provides an apparatus for removing the unnecessary thin-film layer on the periphery of the substrate of the plate-like member having a square shape, on the surface of which substrate is formed a thin-film layer. The apparatus comprises a chamber to treat the peripheral part where the peripheral part of the plate-like member is inserted and where the unnecessary thin-film layer on the peripheral part of the plate-like member is removed; and a means to move the plate-like member. The chamber to treat the peripheral part comprises a cover to prevent the scattering of the sprayed particles and the dust for treating the peripheral part, the cover having one of its end-sides that forms a ceiling being closed and having the other end-side that is opposed to the ceiling being open and a suctioning cover for treating the peripheral part, having an opening that has the same shape as the opening of the cover to prevent the scattering of the dust. In the chamber to treat the peripheral part, a blasting nozzle for spraying particles for treating the peripheral part is disposed on the cover to prevent the scattering of the dust, so that the mouth of the blasting nozzle is covered by the wall of the cover to prevent the scattering of the sprayed particles and the dust. | 2013-06-06 |
20130143474 | Slurry Sluppy System for CMP Process - The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping. | 2013-06-06 |
20130143475 | DUAL WHEEL GRINDER FOR METAL WORKPIECE - The invention relates to a polishing device ( | 2013-06-06 |
20130143476 | METAL-BONDED DIAMOND GRINDING WHEEL PREPARED BY SELF-PROPAGATING PRESSURE-LESS SINTERING AND A PREPARATION METHOD THEREOF - The invention discloses a metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering and a preparation method thereof. The metal bonded diamond grinding wheel mainly comprises a working layer and a non-working layer, wherein the working layer comprises metal bond and grinded diamond, the non-working layer is metal bond, and the metal bond in the working layer and non-working layer have the same components that comprise metal powders of Cu, Al, Ni, Ti, Sn, and Co. To prepare the metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering solves the problems of high energy consumption and low manufacture efficiency in the current sintering processes of the metal bonded diamond grinding wheel, and improves the binding force of the metal bond to the grinded diamond by forming carbides between the bond and the grinded diamond. | 2013-06-06 |
20130143477 | SAFETY CABINET - A safety cabinet adaptable for a variation in body height of a worker using the safety cabinet, that is, a safety cabinet which prevents various bacteria from proceeding from the outside of the safety cabinet into a working space of the safety cabinet and prevents bacteria or virus from proceeding from the working space to the outside of the safety cabinet irrespective of a change in opening area of a front opening, is provided. | 2013-06-06 |
20130143478 | TRIANGLE FLAP ARC VENT - An arc blast vent for an electrical equipment enclosure has a plate forming a part of the enclosure with triangular cutouts arranged within a regular polygonal area of the plate and having a frame of the plate material in between them. Substantially identical triangle shaped flaps, each having hold downs along and adjacent to a first leg of the triangle for attachment to the plate, and in from the first leg have a line of perforations through the triangle forming a weakened area for a deformable hinge. Each of the triangle shaped metal flaps have the second and third legs with their edges resting without tenacious engagement on the frame of the plate material. | 2013-06-06 |
20130143479 | HEATING VENTILATOR FOR BATHROOM - A heating ventilator for bathroom includes a frame, a motor mounted with fan blades, a volute casing, an air path switching plate located at the air outlet of the volute casing for switching the air outlet of a ventilator main body, a heater, and a control electric circuit mechanism for operating the motor, the air path switching plate and the heater. The air path switching plate and the heater are configured in a separate and overlapping manner in the height direction of the ventilator main body. The center line of the fan blades and a tongue of the volute casing are both offset from the center line of the main body and are located at the same side. The center line of the main body is horizontally aligned and overlapped with the center line of the air path switching plate and the center line of the heater. | 2013-06-06 |
20130143480 | LOCALISED PERSONAL AIR CONDITIONING - A sleeping space air conditioner including a quiet low powered air conditioner | 2013-06-06 |
20130143481 | CEILING-EMBEDDED VENTILATION FAN - In a ceiling-embedded ventilation fan, a connection opening is formed in a side surface of a circuit case, an upper part of the connection opening and a side surface of the circuit case are covered with a shade, a bottom part of the shade is arranged at a position lower than an insertion hole of the connection opening, a drain board is arranged under the insertion hole in a frontal view of the insertion hole viewed from an end face of the shade in parallel with the top surface, and the drain board has a downward slope from a side of the connection terminal to a side of the power supply electric wire. | 2013-06-06 |
20130143482 | Media Delivery System and a Portable Communications Module for Audio and Remote Control of Interactive Toys or Devices - A portable communications module ( | 2013-06-06 |
20130143483 | MAINTAINING REPEATER STABILITY IN A MULTI-REPEATER SCENARIO - A wireless repeater in a multi-repeater environment operates to detect the presence of neighboring repeaters and to maintain repeater stability in the presence of a neighboring repeater. In some embodiments, the repeater transmits a known signal sequence to discover the presence of a neighboring repeater. When a neighboring repeater is detected, the repeater may apply mitigation measures to maintain operational stability at the repeater. | 2013-06-06 |
20130143484 | SYSTEM AND METHOD FOR MEASURING OF RADIO FREQUENCY IN INTERPLANETARY SPACE - A system and method for observing a radio wave in an interplanetary space are provided. The system may include a tile unit to observe a Radio Frequency (RF) signal generated from a cosmic radio source in the interplanetary space, and to generate observation data, a node unit to digitalize the generated observation data, and to store the digitalized observation data, and a data analyzing unit to analyze the digitalized observation data and to compute a characteristic of a solar wind. | 2013-06-06 |
20130143485 | CELLULAR PHONE PROVIDED WITH KEY LOCK FUNCTION - A mobile phone includes: an operation module configured to receive an input from a user; a display module configured to display information; a lighting module configured to illuminate the display module; and a control module configured to control the lighting module by a first method, if the input is received by the operation module while the mobile phone is in a key lock state, and control the lighting module by a second method that uses more power than the first method, if the mobile phone is released from the key lock state. | 2013-06-06 |
20130143486 | MOBILE WIRELESS COMMUNICATIONS DEVICE HAVING NFC SENSOR AND MAGNETIC SENSOR AND ASSOCIATED METHODS - A mobile wireless communications device includes a near field communications (NFC) device, and a magnetic sensor. A processor is coupled to the NFC device and the magnetic sensor, and is switchable between an active mode and an idle mode based upon the magnetic sensor. The processor is configured to remain in the active mode based upon communication via the NFC device irrespective of the magnetic sensor. | 2013-06-06 |
20130143487 | REDUCING NFC PEER MODE CONNECTION TIMES - Methods, apparatuses, systems, and computer-readable media for reducing Near Field Communication (NFC) Peer Mode connection times are presented. According to one or more aspects, a mode switching interval associated with an NFC device discovery loop may be defined. A first portion of the mode switching interval may be assigned to polling operations. A second portion of the mode switching interval may be assigned to listening operations. The first portion and the second portion of the mode switching interval respectively may occupy less than all of the mode switching interval, and the second portion of the mode switching interval may be shifted in position within the mode switching interval for respective iterations of the NFC device discovery loop. | 2013-06-06 |
20130143488 | Detecting a Presence of Near Field Communications (NFC) Devices - A near field communications (NFC) device is disclosed that detects a presence of another NFC capable device within its magnetic field. The NFC device observes signal metrics of an observed detection signal at various intervals. The NFC device determines a statistical relationship based upon at least two first signal metrics from among the signal metrics to determine an estimate of at least one second signal metric from among the signal metrics. The NFC device compares a difference between the estimate of the signal metric of the at least one second signal metric and the at least one second signal metric. The NFC capable device makes a first determination that another NFC device is present within its magnetic field when the difference indicates that the at least one second signal metric is non-linearly related to the at least two first signal metrics. | 2013-06-06 |
20130143489 | NEAR FIELD COMMUNICATION EQUIPPED DEVICE - The present application relates to a near field communication (NFC) equipped device such as a mobile telephone. The device includes an NFC controller for controlling NFC operations of the device and a secure element for NFC applications and sensitive data. The secure element includes non-volatile memory which is used by the device to store non-volatile NFC data. The non-volatile NFC data is transferred between the secure element and the NFC controller by means of a single wire protocol interface and dedicated proprietary gates of a host controller interface, which dedicated gates are used for transferring the non-volatile NFC data to the secure element memory and retrieving the non-volatile NFC data from the secure element memory. | 2013-06-06 |
20130143490 | DATA TRANSMITTING AND RECEIVING APPARATUS AND METHOD, AND SOLID STATE DRIVE INCLUDING THE SAME - A data transmitting and receiving apparatus includes a coil configured to transmit and receive data through inductive coupling, where a voltage drop across the coil constitutes a sensing signal. The apparatus further includes an input unit configured to generate transmission data and a replica signal in accordance with an input data signal, the transmission data being supplied to the coil. The apparatus still further includes a replica unit configured to generate a compensation signal in accordance with the replica signal, and an output unit configured to extract reception data from the sensing signal using the compensation signal. | 2013-06-06 |
20130143491 | Data Communication and Object Localization Using Inductive Coupling - An apparatus and method are disclosed for a software and hardware configuration that uses inductive coupling to allow a physical object to determine information describing another physical object. An inductor capacitor circuit acts as a transmitter as well as a receiver of inductive field. A voltage signal provided to an inductor in an object causes the inductor to generate inductive field received by another inductor in a second object. An object receiving inductive field from another object analyzes the inductive field to receive arbitrary data, including but not limited to data that can allow the receiving object to determine the identity of the object transmitting the inductive field. The object receiving the inductive field can also determine the distance between the receiving object and the transmitting object based on the strength of a signal generated by the inductive field. | 2013-06-06 |
20130143492 | COMMUNICATION SYSTEM, COMMUNICATION METHOD, AND DATA PROCESSING APPARATUS - A communication system and communication method enable various types of near field communication. NFC communication apparatuses have two features in that each can perform communication in two communication modes and that each can perform data transmission at a plurality of transfer rates. The two communication modes consist of a passive mode and an active mode. In the passive mode, between the NFC communication apparatuses, for example, a first NFC communication apparatus transmits data to a second NFC communication apparatus by modulating electromagnetic waves generated by itself, while the second NFC communication apparatus transmits data to the first NFC communication apparatus by performing load modulation on the electromagnetic waves generated by the first NFC communication apparatus. Alternatively, in the active mode, either of the NFC communication apparatuses transmits data by modulating electromagnetic waves generated by itself. The present innovation can be applied to, for example, an IC card system, etc. | 2013-06-06 |