22nd week of 2009 patent applcation highlights part 40 |
Patent application number | Title | Published |
20090137086 | METHOD FOR MAKING A DEVICE INCLUDING PLACING A SEMICONDUCTOR CHIP ON A SUBSTRATE - A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed. | 2009-05-28 |
20090137087 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, FILM DEPOSITION METHOD, AND FILM DEPOSITION APPARATUS - An object is to provide a film deposition apparatus in which the amount of leakage from the outside of the chamber to the inside of the chamber is reduced. Even if leakage occurs from the outside of the chamber to the inside of the chamber, oxygen and nitrogen included in an atmosphere that surrounds the outer wall of the chamber are reduced as much as possible and the atmosphere is filled with a noble gas or hydrogen, whereby the inside of the chamber is kept cleaner at 1/100 or less, preferably, 1/1000 or less of oxygen concentration and nitrogen concentration than those in the air. Since the space with high airtightness is provided adjacent to the outside of the chamber, the chamber is covered with a bag and a high-purity argon gas is supplied to the bag. | 2009-05-28 |
20090137088 | JFET Having a Step Channel Doping Profile and Method of Fabrication - A junction field effect transistor comprises a semiconductor substrate, a source region formed in the substrate, a drain region formed in the substrate and spaced apart from the source region, and a gate region formed in the substrate. The transistor further comprises a first channel region formed in the substrate and spaced apart from the gate region, and a second channel region formed in the substrate and between the first channel region and the gate region. The second channel region has a higher concentration of doped impurities than the first channel region. | 2009-05-28 |
20090137089 | SEMICONDUCTOR MOS TRANSISTOR DEVICE AND METHOD FOR MAKING THE SAME - A method of manufacturing a metal-oxide-semiconductor (MOS) transistor device is disclosed. A gate dielectric layer is formed on an active area of a substrate. A gate electrode is patterned on the gate dielectric layer. The gate electrode has vertical sidewalls and a top surface. A liner is formed on the vertical sidewalls of the gate electrode. A nitride spacer is formed on the liner. An ion implanted is performed to form a source/drain region. After salicide process, an STI region that isolates the active area is recessed, thereby forming a step height at interface between the active area and the STI region. The nitride spacer is removed. A nitride cap layer that borders the liner is deposited. The nitride cap layer has a specific stress status. | 2009-05-28 |
20090137090 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device is provided. A first active region and a second active region are defined in a substrate. An electrode covering the first active region and the second active region is formed on the substrate. A first sacrificial layer is formed on the second active layer. A first work function electrode is formed on the first active layer by performing a first doping process to a portion of the electrode. The first sacrificial layer is removed. A second sacrificial layer is formed on the first active layer. | 2009-05-28 |
20090137091 | Methods of manufacturing semiconductor devices - A plurality of nanowires is grown on a first substrate in a first direction perpendicular to the first substrate. An insulation layer covering the nanowires is formed on the first substrate to define a nanowire block including the nanowires and the insulation layer. The nanowire block is moved so that each of the nanowires is arranged in a second direction parallel to the first substrate. The insulation layer is partially removed to partially expose the nanowires. A gate line covering the exposed nanowires is formed. Impurities are implanted into portions of the nanowires adjacent to the gate line. | 2009-05-28 |
20090137092 | Method for manufacturing semiconductor device - A method for manufacturing a semiconductor device includes forming a plurality of trenches for element isolation and a plurality of trenches for alignment mark on a substrate. The substrate has an active region. The method also includes laminating an oxide film on the substrate and over both of the trenches. The method also includes etching the oxide film using a resist mask that masks the element isolation trenches, so that the oxide film laminated in the active region and the oxide film laminated in the alignment mark trenches are removed. The method also includes polishing a surface of the substrate to planarize or smooth the surface of the substrate. Accordingly, those portions of the oxide film which project from the substrate surface are eliminated and the oxide film remains only inside the element isolation trenches. This divides the active region into a plurality of individual active regions for the respective semiconductor elements. The method also includes positioning the resist mask using the alignment mark trenches. The resist mask is used to fabricate the semiconductor elements in the active regions of the substrate. | 2009-05-28 |
20090137093 | METHOD OF FORMING FINFET DEVICE - A method of forming a FINFET device includes providing a substrate with a plurality of trench devices arranged in array therein, each of the trench devices comprising a plug protruding above the substrate; forming a plurality of isolation structures along a first direction in the substrate adjacent to the trench devices so as to define an active area exposing the substrate; forming a spacer on each of the plug to define a reactive area between the active area and the spacer; and removing the isolation structures on the reactive area to form a fin structure in the active area. | 2009-05-28 |
20090137094 | METHOD OF FILLING A TRENCH IN A SUBSTRATE - A method of filling a trench includes: providing a substrate having an upper surface, and a trench extending therein from the upper surface; forming a deposition layer on the substrate in a manner in which the layer partially fills the trench and has a portion which overhangs the trench at the upper surface of the substrate; etching, in a processing chamber, the portion of the deposition layer which overhangs the trench, including by inducing a reaction in the processing chamber using plasma; and subsequently depositing material on the substrate within the partially filled trench, including by inducing a reaction in the processing chamber using plasma. | 2009-05-28 |
20090137095 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING APPARATUS - An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmpspheric pressure; and performing heat treatment. | 2009-05-28 |
20090137096 | Clamp ring for wafer and method of manufacturing semiconductor apparatus - A clamp ring includes an abutting part abutting on the entire outer periphery of the main surface of a wafer when the wafer is fixed, and a brim part extending from the upper part of the abutting part to the inside of the wafer and provided so as not to abut on the main surface even when the wafer is fixed. The abutting part includes a first abutting section and a second abutting section, and a width of the first abutting section in a radial direction is greater than the width of the second abutting section in a radial direction. | 2009-05-28 |
20090137097 | METHOD FOR DICING WAFER - A method for dicing a wafer including the following steps is provided. First, a carrier tape is attached to a first side of the wafer. Then, a patterned photoresist layer exposing a scribe line region of the wafer is formed on a second side of the wafer, in which the second side is the opposite side of the first side. After that, a cutting process is performed to the scribe line region from the second side of the wafer to the first side of the wafer through non-mechanical force. | 2009-05-28 |
20090137098 | Method of manufacturing semiconductor element - A step of forming a first auxiliary groove in a semiconductor element structure provided on a semiconductor substrate, a step of forming a second auxiliary groove in the semiconductor element structure, and a step of dividing the semiconductor substrate and the semiconductor element structure in a direction along the first auxiliary groove and the second auxiliary groove are provided, and in the dividing direction, a plurality of the second auxiliary grooves are arranged spaced apart from each other, and at least two first auxiliary grooves are arranged spaced apart from each other between at least a pair of adjacent second auxiliary grooves, and in the dividing step, a separation region interposed between the two first auxiliary grooves is divided, so as to improve such accuracy and suppress the problems such as a damage of the end surface due to cleavage of the substrate. | 2009-05-28 |
20090137099 | MBE DEVICE AND METHOD FOR THE OPERATION THEREOF - A molecular beam epitaxy (MBE) device ( | 2009-05-28 |
20090137100 | Tellurium Precursors for GST Films in an ALD or CVD Process - The present invention is a process of making a germanium-antimony-tellurium alloy film using a process selected from the group consisting of atomic layer deposition and chemical vapor deposition, wherein a silyltellurium precursor is used as a source of tellurium for the alloy film and is reacted with an alcohol during the deposition process. | 2009-05-28 |
20090137101 | METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE - To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam. | 2009-05-28 |
20090137102 | METHOD FOR MAKING QUANTUM DOTS - A method for forming at least one quantum dot at least one predetermined location on a substrate is disclosed. In one aspect, the method comprises providing a layer of semiconductor material on an insulating layer on the substrate. The layer of semiconductor material is patterned so as to provide at least one line of semiconductor material having a width (w | 2009-05-28 |
20090137103 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In order to improve the quality of a microcrystalline semiconductor film which is formed at an early stage of deposition, a microcrystalline semiconductor film near an interface with a base insulating film is formed under a deposition condition in which a deposition rate is low but the quality of a film to be formed is high; then, a microcrystalline semiconductor film is further deposited at a deposition rate which is increased stepwise or gradually. The microcrystalline semiconductor film is formed in a reaction chamber which is provided in a deposition chamber with space around the reaction chamber, by a chemical vapor deposition method. Further, a scaling gas is supplied into the space to help place the reaction chamber in an ultrahigh vacuum, whereby the concentration of an impurity in the microcrystalline semiconductor film near the interface with the base insulating film is reduced. | 2009-05-28 |
20090137104 | Method of fabricating polycrystalline semiconductor - Disclosed is a method of providing a poly-Si layer used in fabricating poly-Si TFT's or devices containing poly-Si layers. Particularly, a method utilizing at least one metal plate covering the amorphous silicon layer or the substrate, and applying RTA (Rapid Thermal Annealing) for light illuminating process, then the light converted into heat by the metal plate will further be conducted to the amorphous silicon layer to realize rapid thermal crystallization. Thus the poly-Si layer of the present invention is obtained. | 2009-05-28 |
20090137105 | SYSTEMS AND METHODS FOR PREPARING EPITAXIALLY TEXTURED POLYCRYSTALLINE FILMS - The disclosed subject matter relates to systems and methods for preparing epitaxially textured polycrystalline films. In one or more embodiments, the method for making a textured thin film includes providing a precursor film on a substrate, the film includes crystal grains having a surface texture and a non-uniform degree of texture throughout the thickness of the film, wherein at least a portion of the this substrate is transparent to laser irradiation; and irradiating the textured precursor film through the substrate using a pulsed laser crystallization technique at least partially melt the film wherein the irradiated film crystallizes upon cooling to form crystal grains having a uniform degree of texture. | 2009-05-28 |
20090137106 | USING ION IMPLANTATION TO CONTROL TRENCH DEPTH AND ALTER OPTICAL PROPERTIES OF A SUBSTRATE - A method for using ion implantation to create a precision trench in a mask or semiconductor substrate and to alter the optical properties of a mask or semiconductor substrate. In one embodiment, the method may include providing a semiconductor substrate or a mask, forming a damage layer in semiconductor substrate or the mask via ion implantation; wherein the damage layer is formed to a desired depth of the trench; etching the semiconductor substrate or mask to create the trench to the desired depth. In another embodiment, ion implantation is used to alter the optical properties of a mask. | 2009-05-28 |
20090137107 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device according to an embodiment of the invention includes forming patterns on a substrate, depositing a light absorption layer on the patterns, processing the light absorption layer to form a first region which includes a first type of pattern included in the patterns and is coated with the light absorption layer having a first thickness, a second region which includes a second type of pattern included in the patterns and is coated with the light absorption layer having a second thickness thinner than the first thickness, and a third region which includes a third type of pattern included in the patterns and is coated with the light absorption layer having a third thickness thinner than the second thickness, and annealing the substrate by radiating light on the substrate. | 2009-05-28 |
20090137108 | Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer - A method of forming a multi-layered insulation film includes forming a first insulation layer using a first feed gas, the first insulation layer including methyl silsesquioxane (MSQ), forming a second insulation layer using a second feed gas, the second insulation layer including a polysiloxane compound having an Si—H group such that the second insulation layer is in contact with a top of the first insulation layer, and forming a third insulation layer including an inorganic material such that the third insulation layer is in contact with a top of the second insulation layer. | 2009-05-28 |
20090137109 | COMPRESSIVE NITRIDE FILM AND METHOD OF MANUFACTURING THEREOF - Embodiments of the invention provide a method of forming a compressive stress nitride film overlying a plurality of p-type field effect transistor gate structures produced on a substrate through a high-density plasma deposition process. Embodiments include generating an environment filled with high-density plasma using source gases of at least silane, argon and nitrogen; biasing the substrate to a high frequency power of varying density, in a range between 0.8 W/cm | 2009-05-28 |
20090137110 | LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE - The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elastomer. A barrier/seed layer is deposited, a first photoresist mask is created exposing the barrier/seed layer where this layer overlies the contact pad and, contiguous therewith, over a surface area that is adjacent to the contact pad and emanating in one direction from the contact pad. The exposed surface of the barrier/seed layer is electroplated for the creation of interconnect traces. The first photoresist mask is removed from the surface of the barrier/seed layer. A second photoresist mask, defining the solder bump, is created exposing the surface area of the barrier/seed layer that is adjacent to the contact pad and emanating in one direction from the contact pad. The solder bump is created in accordance with the second photoresist mask, the second photoresist mask is removed from the surface of the barrier/seed layer, exposing the electroplating and the barrier/seed layer with the metal plating overlying the barrier/seed layer. The exposed barrier/seed layer is etched in accordance with the pattern formed by the electroplating, reflow of the solder bump is optionally performed. | 2009-05-28 |
20090137111 | METHOD OF FABRICATING METAL INTERCONNECTION AND METHOD OF FABRICATING IMAGE SENSOR USING THE SAME - A method of fabricating a metal interconnection and a method of fabricating image sensor using the same are provided. The method of fabricating a metal interconnection including forming a interlayer dielectric layer on a substrate, forming an interconnection formation region in the interlayer dielectric layer, performing an ultraviolet (UV) treatment on the substrate after the interconnection formation region is formed and forming a metal interconnection in the interconnection formation region. | 2009-05-28 |
20090137112 | METHOD OF MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY DEVICES - A method of manufacturing nonvolatile semiconductor memory devices comprises forming a first wiring material; and stacking memory cell materials on the first wiring material, which configure memory cells each including a variable resistor operative to nonvolatilely store information in accordance with variation in resistance. The method also comprises forming a plurality of first parallel trenches in the first wiring material and the stacked memory cell materials, the first trenches extending in a first direction, thereby forming first lines extending in the first direction and memory cell materials self-aligned with the first lines and separated by the first trenches. The method further comprises burying an interlayer insulator in the first trenches to form a block body and stacking a second wiring material on the block body. The method also comprises forming a plurality of second parallel trenches in the block body with the second wiring material stacked thereon, the second trenches extending in a second direction crossing the first direction and having a depth reaching the upper surface of the first wiring material, thereby forming second lines extending in the second direction and memory cells self-aligned with the second lines and separated by the first and second trenches. | 2009-05-28 |
20090137113 | Method for fabricating a Microstructure - A method for fabricating a microstructure is to form at least one insulation layer including a micro-electro-mechanical structure therein over an upper surface of a silicon substrate. The micro-electro-mechanical structure includes at least one microstructure and a metal sacrificial structure that are independent with each other. In the metal sacrificial structure are formed a plurality of metal layers and a plurality of metal via layers connected to the respective metal layers. A barrier layer is formed over an upper surface of the insulation layer, and an etching stop layer is subsequently formed over a lower surface of the silicon substrate. An etching operation is carried out from the lower surface of the silicon substrate to form a space corresponding to the micro-electro-mechanical structure, and then the metal sacrificial structure is etched, thus achieving a microstructure suspension. | 2009-05-28 |
20090137114 | METHOD OF MAKING SEMICONDUCTOR DEVICE - A semiconductor device is manufactured by a method including forming a first interlayer insulating film. A first etching stopper film is formed on the first interlayer insulating film. A conductive layer is formed on the first etching stopper film. A second etching stopper film is formed to cover the conductive layer, an upper surface of the conductive layer and both side surfaces of the conductive layer. A second interlayer insulating film is formed on the second etching stopper film. A hole is formed penetrating the second interlayer insulating film in a direction of thickness and reaching the conductive layer. An interconnect is formed in the hole. The step of forming a hole includes etching the second interlayer insulating film under a first etching condition, and etching the second etching stopper film under a second etching condition different from the first etching condition. The second etching condition includes using an etching gas containing C, F, and H. | 2009-05-28 |
20090137115 | METHOD OF MANUFACTURING METAL INTERCONNECTION - A method of manufacturing a metal interconnection that includes forming a via hole and a trench in an insulating layer, and then filling the via hole and the trench with a first metal layer using a first base metal having an oxidation potential higher than a standard hydrogen potential, and then simultaneously removing the first metal layer while filling the via and the trench with a second metal layer composed of a second base metal having an oxidation potential lower than the standard hydrogen potential and an ionization tendency lower than an ionization tendency of the first base metal. | 2009-05-28 |
20090137116 | ISOLATING CHIP-TO-CHIP CONTACT - An apparatus has two slabs of substrate material joined to each other, the two slabs including a pair of contacts joined to each other having a shape separating a first area from a second area. | 2009-05-28 |
20090137117 | Method Forming Contact Plug for Semiconductor Device Using H2 Remote Plasma Treatment - Provided are methods of forming a contact plug of a semiconductor device. Methods of forming a contact plug of a semiconductor device may include forming an interlayer insulating layer on a semiconductor substrate on which a lower structure is formed, forming a contact hole in the interlayer insulating layer, the contact hole exposing the lower structure, and forming a W layer and then a WN layer to form a W/WN barrier layer in the contact hole. Methods may include H | 2009-05-28 |
20090137118 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Initially, an interconnection | 2009-05-28 |
20090137119 | NOVEL SEAL ISOLATION LINER FOR USE IN CONTACT HOLE FORMATION - A method is disclosed for etching a contact hole in a stack of dielectric layers. The method minimizes bridging defects between the contact hole and adjacent conductive structures. A substrate has a conductive material layer and an active device disposed thereon. An etch stop layer covers the device and the conductive material, A layer of interlevel dielectric and antireflective coating layers are then provided. A hole is etched through the stack using patterned photoresist. Ashing is used to remove all but the etch stop layer and the interlevel dielectric layer. An isolation liner is deposited over the interlevel dielectric layer, the sidewall surfaces of the hole and the exposed upper surface of the etch stop layer. Another etch removes the isolation liner disposed over the exposed upper surface of the etch stop layer, and removes the underlying etch stop layer to expose an upper surface of the conductive material layer. | 2009-05-28 |
20090137120 | DAMPING POLYURETHANE CMP PADS WITH MICROFILLERS - A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP slurry; and a curative, preferably including an aromatic diamine and a triol. To produce the microcellular material, the froth can be combined with the filler, e.g., PVP, followed by curing the resulting mixture. The microcellular material has a low rebound and can dissipate irregular energy and stabilize polishing to yield improved uniformity and less dishing. CMP pads using the microcellular material have pores created by inert gas frothing throughout the pad polymer body and additional surface pores created by dissolution of fillers during polishing, providing flexibility in surface softness and pad stiffness. | 2009-05-28 |
20090137121 | Three-Dimensional Network in CMP Pad - The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm | 2009-05-28 |
20090137122 | METHOD OF PASSIVATING CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER FILM PLANARIZATION PROCESSES - A method of passivating a CMP composition by dilution and determining the relationship between the extent of dilution and the static etch rate of copper. Such relationship may be used to control the CMP composition during the CMP polish to minimize the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions in the CMP composition and at the copper/CMP composition interface. | 2009-05-28 |
20090137123 | Polishing Composition and Polishing Method - A polishing composition contains at least one water soluble polymer selected from the group consisting of polyvinylpyrrolidone and poly(N-vinylformamide), and an alkali, and preferably further contains at least one of a chelating agent and an abrasive grain. The water soluble polymer preferably has a weight average molecular weight of 6,000 to 4,000,000. The polishing composition is mainly used in polishing of the surfaces of semiconductor wafers such as silicon wafers, especially used in preliminary polishing of the surfaces of such wafers. | 2009-05-28 |
20090137124 | POLISHING COMPOSITION AND METHOD FOR HIGH SILICON NITRIDE TO SILICON OXIDE REMOVAL RATE RATIOS - The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, a carboxylic acid, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide. | 2009-05-28 |
20090137125 | ETCHING METHOD AND ETCHING APPARATUS - Disclosed is an etching method for etching a target layer formed on a surface of a target object, including: a resist forming step for forming a resist layer uniformly on the surface of the target object; a mask forming step for forming a patterned etching mask by forming an etching recess on the resist layer; a plasma resistant film forming step for forming a plasma resistant film on the entire surface of the etching mask including a bottom and a sidewall of the etching recess; a bottom plasma resistant film removing step for removing the plasma resistant film formed on the bottom of the etching recess; and a main etching step for etching the target layer by using the etching mask as a mask, after the bottom plasma resistant film removing step. | 2009-05-28 |
20090137126 | METHOD OF FORMING A SPACER - A sacrificial layer and wet etch are used to form a sidewall spacer so as to prevent damage to the structure on which the spacer is formed and to the underlying substrate as well. Once the structure is formed on the substrate a spacer formation layer is formed to cover the structure, and a sacrificial layer is formed on the spacer formation layer. The sacrificial layer is wet etched to form a sacrificial layer pattern on that portion of the spacer formation layer extending along a sidewall of the structure. The spacer is formed on the sidewall of the structure by wet etching the spacer formation layer using the sacrificial layer pattern as a mask. | 2009-05-28 |
20090137127 | PLASMA ETCHING METHOD AND STORAGE MEDIUM - A plasma etching method that can increase the selection ratio of a stop layer to an interlayer insulation film. The plasma etching method is carried out on a substrate that has the interlayer insulation film formed of CwFx (x and w are predetermined natural numbers) and a stop layer that stops etching and is exposed at the bottom of a hole or a trench formed in the interlayer insulation film. The interlayer insulation film and the stop layer are exposed at the same time to plasma generated from CyFz (y and z are predetermined natural numbers) gas and hydrogen-containing gas. | 2009-05-28 |
20090137128 | Substrate Processing Apparatus and Semiconductor Device Producing Method - Disclosed is a substrate processing apparatus including: a reaction tube to accommodate at least one substrate; at least a pair of electrodes disposed outside the reaction tube; and a dielectric member, wherein a plasma generation region is formed at least in a space between an inner wall of the reaction tube and an outer circumferential edge of the substrate, the member includes a main face extending in a radial direction of the substrate and in a substantially entire circumferential direction of the substrate in a horizontal plane parallel to a main face of the substrate, and is disposed in an outer circumferential region of the substrate, and gas activated in the plasma generation region is supplied through a surface region of the main face of the member to the substrate. | 2009-05-28 |
20090137129 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine. | 2009-05-28 |
20090137130 | Method For Forming A Multiple Layer Passivation Film And A Device Incorporating The Same - A method of forming a multiple layer passivation film on a semiconductor device surface comprises placing a semiconductor device in a chemical vapor deposition reactor, introducing a nitrogen source into the reactor, introducing a carbon source into the reactor, depositing a layer of carbon nitrogen on the semiconductor device surface, introducing a silicon source into the reactor after the carbon source, and depositing a layer of silicon carbon nitrogen on the carbon nitrogen layer. A semiconductor device incorporating the multiple layer passivation film is also described. | 2009-05-28 |
20090137131 | THIN FILM TRANSISTOR, METHOD OF MANUFACTURING SAME, DISPLAY DEVICE, METHOD OF MODIFYING AN OXIDE FILM, METHOD OF FORMING AN OXIDE FILM, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a manufacturing method of a thin film transistor ( | 2009-05-28 |
20090137132 | DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION - Methods for forming silicon nitride hard masks are provided. The silicon nitride hard masks include carbon-doped silicon nitride layers and undoped silicon nitride layers. Carbon-doped silicon nitride layers that are deposited from a mixture comprising a carbon source compound, a silicon source compound, and a nitrogen source in the presence of RF power are provided. Also provided are methods of UV post-treating silicon nitride layers to provide silicon nitride hard masks. The carbon-doped silicon nitride layers and UV post-treated silicon nitride layers have desirable wet etch rates and dry etch rates for hard mask layers. | 2009-05-28 |
20090137133 | F-type right angle jack - F-type right angle jack of tap assembly manufactured in a few steps lowering signal loss ratio comprises a bayonet mount, a male connector axially disposed inside the bayonet mount, a right angle connector is in-line coupled to the male connector, a cubic coupling box, corner legs of a metallic frame inserted onto printed circuit board (PCB). The coupling box is directly formed between the bayonet mount and the male connector by injection molding. The coupling box wraps around a tapered tube of the bayonet mount filled with insulation material. A joint of the right angle connector and the male connector is wrapped around by the coupling box, but a proximal end of the right angle connector is exposed outside the coupling box. And a metallic frame squarish in shape formed by stamping and bending is wrapped around the coupling box to facilitate coaxial cable carries signals without loss. | 2009-05-28 |
20090137134 | BOARD TO BOARD CONNECTOR AND STACK STRUCTURE FOR STACKING PRINTED CIRCUIT BOARDS USING BOARD TO BOARD CONNECTOR - A board to board connector ( | 2009-05-28 |
20090137135 | Connector for board and electrical junction box - A connector for a board and an electrical junction box that utilizes the connector are provided. The connector prevents adjacent terminal metals from causing a short circuit. Each connector housing includes a hood section having an inner wall. Protrusions are provided on an outer surface of each inner wall to project outward in a thickness direction of the inner wall. Openings around adjacent through-holes are shifted in the thickness direction of the inner wall. Thus, it is possible to increase a distance on surface between adjacent terminal metals inserted into the adjacent through-holes. The distance on the surface between adjacent terminal metals prevents water adhering to the terminals metals from short-circuiting the adjacent terminal metals. | 2009-05-28 |
20090137136 | Housing, Terminal and Connector Using Housing and Terminal - A connector for connecting a card to a printed circuit board is provided. The connector includes a housing Z and a plurality of terminals. The housing includes a plurality of slots and at least one trench disposed in the vicinity of each of the plurality of slots. Each of the plurality of terminals includes a contact portion to be in contact with the card, an anchoring portion, four feet extending vertically from the anchoring portion, and a soldering portion extending from the anchoring portion and to be soldered to the printed circuit board. The terminal is mounted on the housing with at least one of the feet of the terminal inserted in at least one trench. The soldering portion is offset from the contact portion so that the contact portion will not come into contact with the soldering portion (when the contact portion is pressed towards the soldering portion, thereby providing a low-profile connector. | 2009-05-28 |
20090137137 | PORTABLE MEMORY DEVICE SUPPORTING A PLURALITY OF INTERFACES - A portable memory device supporting a plurality of interfaces includes a body, a first connector disposed on an end of the body, a slider adjacent to the body so as to slide back and forth between a first position exposing the first connector and a second position covering the first connector, a second connector disposed on an end of the slider to connect the portable memory device to another electronic device via an interface different from an interface that the first connector supports, and a memory disposed inside the body and connected to the first connector and the second connector. | 2009-05-28 |
20090137138 | CONNECTOR - The present invention provides a connector capable of preventing contacts from being touched by fingers or things through an opening of a connector housing, and of thereby improving connection reliability. A plug connector comprising a connector housing and PCB having contacts contained in the connector housing with a contacting surface exposed at one end and which functions as an interface capable of transmitting electric signal or light signal by being fitted to a receptacle connector to connect respective contacts to each other, characterized in that a shutter is provided as a part of a bottom wall of the connector housing to be freely opened or closed at a position covering the contacts formed in PCB, and that, before fitting of the connector, the shutter is in a closed state, and during and after fitting of the connector, the shutter is in a opened state. | 2009-05-28 |
20090137139 | Fool-proof card connector - A fool-proof card connector includes a housing that has an opening, a card-receiving space, a chamber in a sidewall at one side of the chamber, a stop block that is pivotally mounted in the chamber and has a stop face, and a spring member mounted in the chamber for biasing the stop block toward the outside of the chamber to a biased position where the stop face of the stop block is suspending in the card-receiving space to stop incorrect insertion of a MS memory card. | 2009-05-28 |
20090137140 | FLOATING-TYPE CONNECTOR - In a connector adapted to be connected to and disconnected from a mating object in a connecting/disconnecting direction, the connector includes an alignment member, a rear housing coupled to the alignment member, and a front housing adapted to receive the mating object and is movable with respect to the alignment member and the rear housing. A contact is held by the front housing and the rear housing. The alignment member and the rear housing include a stopper mechanism which three-dimensionally defines a movable range of the front housing. | 2009-05-28 |
20090137141 | CONNECTOR FOR FLAT TERMINAL - A connector for a flat terminal includes a lever, a housing and contact. The lever has pivots. The housing is formed with a terminal recess and provided with bearings. The contact has a contact point and is located in the terminal recess. The housing includes guide ribs for separating the base end of the lever from the contact point in the process of attaching the lever to the housing. The contact point is located between the guide ribs. The guide ribs are formed on the bottom of the terminal recess in the housing, and stick out more than the contact point from the bottom of the terminal recess. | 2009-05-28 |
20090137142 | POSITIVE LOCK CONNECTOR - A connector assembly ( | 2009-05-28 |
20090137143 | CONNECTOR MOUNTING STRUCTURE - An electrical component ( | 2009-05-28 |
20090137144 | PRESS-CLAMPING STRUCTURE AND PRESS-CLAMPING TERMINAL - A press-clamping structure includes: a wire; and a press-clamping terminal which includes a conductor press-clamping portion having a generally U-shaped cross-section. The conductor press-clamping portion includes a bottom plate and a pair of conductor caulking pieces which are bent inwardly to embrace the conductor of the wire and caulk the conductor. Distal end portions of the conductor caulking pieces are bent outwardly in a opposite direction to each other. When P1 represents a point closest to the bottom plate on an area in which the outer surfaces of the conductor caulking pieces are contacted with each other, and P2 represents a point closest to the bottom plate on the distal end portion of each of the conductor caulking piece, a formula Lh2009-05-28 | |
20090137145 | Floating Connector for Microwave Surgical Device - A floating connector adapted for use with microwave surgical instruments is presented. The disclosure provides for the use of cost-effective and readily available non-floating connectors in a floating housing which can compensate for dimensional variations and misalignments between the connectors. Multiple connectors of varying types can therefore be used within a single support housing without requiring the costly precision manufacturing processes normally associated with such multiple connector assemblies. The floating connector is suitable for use with electrical connections as well as fluidic connections. | 2009-05-28 |
20090137146 | Flexible cable positioning device - A flexible cable positioning device is disclosed. The flexible cable positioning device comprises a baseboard, a positioning housing, a cover and a flexible cable. The baseboard has a plurality of contact points. The positioning housing is located on the baseboard and corresponded to the contact points. The cover is mounted on the positioning housing, and has a plurality of protruding parts corresponding to the contact points. The flexible cable is accommodated removably in the positioning housing, and the flexible cable has a contact part disposed between the contact points and the protruding parts. The cover is for pressing and fixing the flexible cable into the positioning housing, and the protruding parts are for fixing the contact part of the flexible cable to the contact points of the baseboard. Therefore, the contact part of the flexible cable is electrically connected with the contact points of the baseboard firmly and stably. | 2009-05-28 |
20090137147 | Electric connector module - An electric connector module is disclosed. The electric connector module comprises a circuit board, an electric connector and a flexible flat cable. The electric connector is soldered to the circuit board which has a plurality of board terminal points. The electric connector has a pressing member and a positioning housing which has a body and lateral positioning arms located on each side of the body for forming a positioning space therebetween to accommodate the flexible flat cable. The pressing member is rotatably mounted between positioning arms by a rotating device. The pinch points are arranged evenly on the pressing member and their location are corresponding to the board terminal points. The pinch points are pressed onto the flexible cable for making the wire terminal points contact with the board terminal points tightly when the pressing member is placed in a closed position. | 2009-05-28 |
20090137148 | Universal Insert - A molded plastic insert having a socket and groove formed on an outer surface to cooperate with spring loaded plungers on one of a pair of mating parts to couple the mating parts. A pair of indentations formed on the outer edge of the insert to accommodate any electrical leads between the mating parts. | 2009-05-28 |
20090137149 | CONNECTOR MODULE - A connector module includes a bracket and a housing. The bracket includes a top end portion having a resilient latch with a free end portion and a protrusion outwardly extending from the free end portion and a bottom end portion defining a gap between a base of the bracket and a ridge of the bracket. The housing includes a front wall having a plurality of connector openings, a first end that extends outwardly from the front wall, and an oppositely disposed second end that extends outwardly from the front wall. The first end includes a lip that is configured to be selectively received in the gap of the bracket. The second end defines a cavity that is adapted to selectively receive the protrusion of the resilient latch. The housing further includes a plurality of identification areas disposed on the front wall adjacent to the connector openings. | 2009-05-28 |
20090137150 | Terminal structure for coaxial cable - A terminal structure for a coaxial cable includes a casing having a passage defined axially therethrough and a plurality of stops extend from an inner periphery of the passage. An axle has a connection end and a plurality of protrusions extend from an outer periphery of the connection end. The connection end of the axle is inserted into the passage and the protrusions are stopped by the stops. A non-conductive material is filled in a partition of the passage and connects the axle and the casing. The non-conductive material is filled in the partition of the passage by way of injection. | 2009-05-28 |
20090137151 | Receptacle connector assembly for ic card and ic card connector - Disclosed is a receptacle connector assembly for an IC card, comprising: a connector housing ( | 2009-05-28 |
20090137152 | MEMORY CARD SOCKET - A memory card socket has a plate-like antenna block having a coil-like secondary antenna which is opposed to an antenna incorporated in a memory card in a state where the memory card is attached to the card receiving portion. Openings as cavities are formed in portions of the antenna block inside of the coil of the secondary antenna. With this structure, it is possible to obtain a memory card socket having a compact and simple structure and having a non-contact communication function capable of preventing producing cost from increasing. | 2009-05-28 |
20090137153 | ELECTROMAGNETIC WAVE SHIELD CONNECTOR - The invention provides an electromagnetic wave shield connector assuring water resistance without increasing the overall height. An electromagnetic wave shield connector including a L-shaped terminal with an electric wire including a electric connection part and a wire connection part, an inner housing including a first storing part in which the first storing part is inserted, and a second storing part in which the second storing part is accommodated an outer housing accommodating the first storing part, and a shield member-covering the outer housing assembled with the inner housing. The first storing part having a through-part into which the first storing part is inserted and a first gasket mounted on a periphery of the first storing part. The first storing part is cylinder shaped. The outer housing having an opening whose inner periphery comes by intimate contact with the first gasket. | 2009-05-28 |
20090137154 | Communications Connectors with Self-Compensating Insulation Displacement Contacts - Communications connectors are disclosed that include a housing having an upper end and a lower end, the upper end of the housing including a plurality of slits that define a plurality of pillars. First and second pairs of tip and ring insulation displacement contacts (IDCs) are mounted in the housing. Each of the IDCs has an upper end that has a first slot, a lower end that has a second slot and an intermediate portion between the upper end and the lower end, the lower end being offset from the upper end. The first slot of each IDC is aligned with a respective one of the slits. The housing further includes through slots that are separated by dividers, where each of the through slots is sized to receive the upper end of a respective one of the IDCs, and each slit of the plurality of slits exposes inner edges of the first slot of a respective one of the IDCs. | 2009-05-28 |
20090137155 | Connection arrangement for image and antenna signals of an automotive display - A connection arrangement for image and antenna signals of an automotive display includes a male connector disposed within a positioning base of the seat back and a female connector embedded into the rear side of the display. The male connector is positioned at the bottom of the slot of the positioning base and consists of a plurality of male terminals horizontally arranged and electrically coupled to an automotive audio/video player. An antenna plug is respectively fitted at both sides of the male terminals. The female connector includes an upper row of insertion holes, a lower row of insertion holes, and antenna jacks for a practical connection to the male connector in an obverse direction and a reverse direction. The front and rear sides of the face end of a control circuit board includes first signal contacts and second signal contacts opposing to the rear end of the female terminals of the insertion holes of the upper and lower rows. The signal contacts are adapted to be a detection module to detect if the female connector is in an obverse direction and a reverse direction, thereby determining if the display is in an obverse direction and a reverse direction. Thus, an automatic turning process can be carried out for the adjustment of the image output. In this way, the image and antenna connection modules are integrated into a body. | 2009-05-28 |
20090137156 | BATTERY CHARGING ASSEMBLY - A battery charging assembly for charging a battery of a mobile device includes a charging unit, an output assembly and an input assembly. The input assembly is detachably associated with the charging unit and includes an adapter for removable attachment to the charging unit, a power cord, and a plug configured to mate with a style of electrical outlet such that the charging unit is positionable at a remote location from the electrical outlet. The adapter has a latching mechanism for latching the adapter in a receptacle defined in the charging unit. | 2009-05-28 |
20090137157 | ELECTRICAL CONNECTOR HAVING SIGNAL AND POWER CONTACTS - An electrical connector includes a dielectric housing having a tongue including an upper surface, a lower surface, and opposite side surfaces. A plurality of signal contacts are held by the housing and are exposed along the upper surface. At least one power contact is held by the housing and is exposed along one of the opposite side surfaces. Optionally, the tongue and signal contacts define an eSATA mating interface configured for mating with a plug of a serial cable defining an eSATA plug interface. | 2009-05-28 |
20090137158 | CONNECTION DEVICE FOR ELECTRICAL OR ELECTRONIC CONNECTIONS - Connection device for electrical or electronic connections, comprising a socket connector ( | 2009-05-28 |
20090137159 | Patch panel with a motherboard for connecting communications jacks - An active jack, which is a powered device, is installed as the network connection at a workstation which provides the capability to determine the physical location of a destination device, such as a VOIP phone, in real time. Uninterruptible power supplies may be used to provide power to network components, for example during an emergency. Power-and-data deployments are shown for powering network components and destination devices. | 2009-05-28 |
20090137160 | CONTACT-MAKING UNIT, ATTACHMENT METHOD AND SCREWING TOOL FOR CARRYING OUT THE METHOD - A contact-making unit including a holding unit and a screw with a head and a shank. The holding unit includes a connection part-holding section into which at least one connection part can be inserted, and a screw-holding section into which the screw is inserted in a longitudinal direction of the holding unit in such a way that the screw is held captively in the screw-holding section in the longitudinal direction but in a rotatable fashion, and in that a connection part which is inserted into the connection part-holding section can make electrical contact with the inserted screw. A radially protruding bearing section is formed on the head of the screw, and the screw-holding section has a shoulder section which axially supports the bearing section on the holding unit. | 2009-05-28 |
20090137161 | ELECTRICAL CONTACT WITH RETENTION LATCH - An electrical contact for use with electronic devices is provided. This electrical contact includes a mating portion; a wire retaining portion; and body portion formed integrally with the wire retaining portion. The body portion further includes a central axis running lengthwise therethrough and at least one outwardly biased retention member, wherein the retention member is formed from the same material as the body portion and is integral therewith, and wherein the angle of deflection of the retention member is substantially perpendicular to the central axis of the body. | 2009-05-28 |
20090137162 | Terminal and a Method for Inserting the Terminal into a Compression Connector Housing - A terminal for a compression connector, a terminal strip of interconnected terminals for compression connectors and a method for inserting a terminal into a compression connector housing. The terminal including a solder portion including an elongate main body extending along a first direction and a solder tail formed at one end of the main body and extending substantially perpendicular to said first direction; and a supporting member attached to the main body of the solder portion and extending substantially in said first direction. | 2009-05-28 |
20090137163 | INFRASTRUCTURE DEVICE WITH MODULAR REPLACEABLE SENSORS - The present invention is directed to a system and method which allows a user to renew, expand, or reduce a utility device by changing, adding, or subtracting only the module that needs to be renewed, added, or removed as opposed to replacing the entire device. In one embodiment, the device is constructed in modular format such that the user need only replace the module portion of the device that has expired (or been used) instead of being required to replace the entire device. | 2009-05-28 |
20090137164 | MANUALLY OPERATED BOAT - A manually operated boat includes a propelling device including an upright driving rod extending through and rotatable relative to a floating member and having opposite upper and lower end portions that extend outwardly of the floating member, an operating member connected fixedly to the upper end portion of the driving rod, and a paddle member connected fixedly to the lower end portion of the driving rod so as to allow co-rotation of the operating member with the paddle member. The paddle member has a resilient paddle body having first and second paddle surfaces opposite to each other in a direction perpendicular to the driving rod. | 2009-05-28 |
20090137165 | NEWTONIAN THRUST COWL ARRAY - The three-way valve allows fluid flow to be selectively directed to a run outlet, a bypass outlet or both at the same time. The three-way valve includes a flow diffuser with a primary valve seat positioned opposite a bypass valve seat. Choke points and flow restrictions, strategically positioned in the flow diffuser create a substantially flat velocity profile downstream of the bypass outlet. Larger versions of this three-way valve may be used in Vertical Takeoff and Landing (“VTOL”) aircraft. Other versions may be used in ships and other watercraft. | 2009-05-28 |
20090137166 | Multi-use adjustable bellows-shaped aperture strap - A strap with tapered-apertures for open-heeled swim fins is stretched from a first end connection to a conventional boss-button and boss-post structure, whereby the strap will apply a desired level of force as a holding-pressure against the heel of a swimmer. The strap's tapered-apertures are cast to link the tapered dimensions of aperture walls to an easy passage of the strap over the boss button and to a highly resistant passage of the strap-top to a designed seat against the top's raised arches. The manufactured formation of the unique aperture shapes result in an unexpected elasticity of the strap. The combination of aperture structure within the raised arches guide the orifice walls of the aperture into compression, instead of tension, greatly resisting forces to release the strap from the boss-posts and buttons. | 2009-05-28 |
20090137167 | Suntan sprinkler mattress - This pool apparatus functions as a floating platform on the pool that a person can relax or recreated with or set on a solid area to lounge on. The main functions are the timed or manually controlled sprinkler mechanism that is intended to cool a person off while they are relaxing on it, a speaker system that will enable a user to hear sound such as music, optional maneuverability through manual or remote control. | 2009-05-28 |
20090137168 | Thermoplastic roofing membranes - A membrane comprising at least one polymeric layer including i) a plastomer, ii) a low density polyethylene, iii) a propylene-based polymer, and optionally iv) flame retardant. | 2009-05-28 |
20090137169 | COATED TEXTILE WITH SELF-CLEANING SURFACE - Textiles coated with self-cleaning surfaces which contain hydrophobic nanostructured particles protruding from a coating having hydrophilic properties are provided. | 2009-05-28 |
20090137170 | Non-Woven Colour-Catcher Fabric and Method for its Preparation - Procedure for preparing a non-woven colour-catcher fabric comprising the following steps: a) a cationic dye sequestering agent is applied on a non-woven fabric; b) the non-woven fabric is dried at a temperature comprised between 120 and 180° C.; c) a printing paste comprising an anionic polyacrylic dispersant or a sulfonated aromatic-formaldehyde condensation product having dispersing properties is applied on the non-woven fabric by printing technique. | 2009-05-28 |
20090137171 | FINISHING OF TEXTILE FIBERS, TISSUES AND FABRICS - A method is provided for the application of a finishing layer to a textile support material. A water repellent or oil repellent layer, a so-called finishing layer, is applied to a textile support material selected from the group of fibers, tissues and fabrics. The water repellent or oil repellent finishing layer comprises at least two water repellent or oil repellent components wherein a first component comprises one or more dispersants and a second component comprises one or more dispersed phases or colloids, and wherein the dispersant and the dispersed phase are present in the gel state. Additionally, textile articles are proved having the novel water repellent or oil repellent finishing layer which are equal on a high level or even superior with respect to their functional properties to products prepared according to known finishing methods and at the same time allow a complete or partial substitution of the health and environmentally hazardous standard chemicals employed nowadays by novel compounds which have not been used to date. | 2009-05-28 |
20090137172 | COLORANT MEDIA AND ARTICLES HAVING PHOTO-STABLE AND SURFACE-FUNCTIONALIZABLE COLORANT PARTICLES - A composition and method for encapsulating colorant molecules in polymeric particles are described. Colorant molecules, such as dye, are doped or embedded in a particle, at least in part, composed of a halogen-containing polymeric matrix that can effectively isolate the dye molecules from reaction with photo-oxidizing or reducing agents. The isolated colorant molecule is protected from photo-bleaching and other color degradation, and show superior photo-stability. The encapsulating polymer matrix can be cross-linked and can have a variety of surface functional groups, which may be adapted to help achieve either strong ionic or covalent binding to desired substrates. Also described are methods for producing protective particles, and ink mediums for applying the particles to substrates. | 2009-05-28 |
20090137173 | INCOMBUSTIBLE INSULATION MATERIAL - Invention is about an incombustible insulation material used for the purposes of heat and sound insulation, absorption of humidity and prevention and delay of spread of fires that may occur in dwellings, offices, schools, theatres, cinemas, concert halls, hospitals, in land, air and marine public transport vehicles, in all military and industrial applications, in rockets, jet engines and gas turbines. | 2009-05-28 |
20090137174 | FLAME-RETARDANT POLYMERIC COMPOSITIONS - A flame-retarded polymeric composition is provided which contains a) a polyolefin, b) a mixture of a halogenated flame-retardant and zeolite, and optionally c) a synergist. Also provided is a flame and smoke-retarded polymeric composition containing a polyolefin and a mixture of a hydrated metal oxide and zeolite. | 2009-05-28 |
20090137175 | Sizing Composition For Glass Fibers, Sized Glass Fibers, And Reinforced Products Comprising The Same - The present invention provides aqueous sizing compositions for application to glass fibers as well as polymeric resins reinforced with glass fibers at least partially coated with the aqueous sizing compositions. In some embodiments, sizing compositions of the present invention demonstrate advantageous properties resulting from the presence of an acid-amine component therein. | 2009-05-28 |
20090137176 | TWO-LAYER FABRIC AND HEAT-RESISTANT PROTECTIVE CLOTHING CONTAINING THE SAME - A two-layer fabric according to the present invention has an integral structure containing a base cloth on the upper side and a reinforcing cloth for reinforcing the entire fabric on the under side, wherein (a) the base cloth of the two-layer fabric is flame-retardant and contains a warp yarn and a weft yarn containing 30% by weight or more of a flame-retardant fiber having a limiting oxygen index (LOI) of 26 or more and a tensile strength of 8 cN/dtex or less, (b) the reinforcing cloth of the two-layer fabric contains a warp yarn and a weft yarn containing a heat-resistant high-strength fiber having a tensile strength of 15 cN/dtex or more as a main component, and (c) the base cloth and the reinforcing cloth are connected by the warp yarn and/or the weft yarn of the base cloth, to form the integral structure. | 2009-05-28 |
20090137177 | Oil Absorbent Blanket and Method for Manufacturing the Same - In one embodiment of the present application, a method is disclosed for manufacturing an oil absorbent blanket, wherein particles having a high oil absorption capacity are incorporated in a fibre structure. The blanket is a nonwoven blanket which is manufactured by the method including: arranging the fibres in a flat structure, in which the fibres extend substantially perpendicularly to the plane of the structure; adding the oil absorbent particles to the fibre material; rotating the fibres from the aforesaid perpendicular direction to a direction substantially parallel to the plane of the structure; and compressing the fibre structure, so that a coherent blanket is obtained. | 2009-05-28 |
20090137178 | Display Device and Method of Manufacturing Thereof - A novel display device with higher reliability having a structure of blocking moisture and oxygen, which deteriorate the characteristics of the display device, from penetrating through a sealing region and a method of manufacturing thereof is provided. According to the present invention, a display device and a method of manufacturing the same comprising: a display portion formed by aligning a light-emitting element using an organic light-emitting material between a pair of substrate, wherein the display portion is formed on an insulating layer formed on any one of the substrates, the pair of substrates is bonded to each other with a sealing material formed over the insulating layer while surrounding a periphery of the display portion, at least one layer of the insulating layer is made of an organic resin material, the periphery has a first region and a second region, the insulating layer in the first region has an opening covered with a protective film, the sealing material is formed in contact with the opening and the protective film, an outer edge portion of the insulating layer in the second region is covered with the protective film or the sealing material. | 2009-05-28 |
20090137179 | FIELD EMISSION DISPLAY AND METHOD OF MANUFACTURING THE SAME - A field emission display and a method of manufacturing the same are provided. The field emission display includes an anode plate where an anode electrode and a fluorescent layer are formed, a cathode plate where an electron emission source emitting electrons toward the fluorescent material layer and a gate electrode having a gate hole through which the electrons travel are formed, a mesh grid having an electron control hole corresponding to the gate hole and adhered to the cathode plate, and an insulation layer formed on a surface of the mesh grid facing the cathode plate, and spacers provided between the anode plate and the mesh grid so that the mesh grid can be adhered to the cathode plate due to a negative pressure existing between the anode plate and the cathode plate. | 2009-05-28 |
20090137180 | MASK ASSEMBLY FOR THIN FILM VAPOR DEPOSITION OF FLAT PANEL DISPLAY - A mask assembly for thin film vapor deposition of a flat panel display is disclosed. In the mask assembly, a cleansing solution remaining in the gap between a unit mask and a frame after cleansing the mask assembly may be minimized. The mask assembly includes a frame and a plurality of unit masks. The frame includes a pair of first supporting portions and a pair of second supporting portions that surround an opening. The plurality of unit masks have at least one set of pattern openings, and the unit masks are fixed on the first supporting portion while having a tensile force applied thereto. The first supporting portion includes a first surface and a second surface. The unit masks are fixed on the first surface, and the second surface has a height difference to the first surface along a thickness direction of the unit masks from the first surface. | 2009-05-28 |
20090137181 | Toy plane powered by hydraulic power - A toy plane includes a body made by light material such as polylone and a pressurized container is securely engaged with a groove defined in an underside of the body. The pressurized container includes a closed front end and a nozzle which connected to a rear end of the pressurized container. Water and pressurized air are received in the pressurized container. The wings and stabilizers on the body are well secured by any known method so that they do not separated from the body when the pressurized container releases the pressure to launch the plane. | 2009-05-28 |
20090137182 | Launcher for a toy glider - A method for making an affordable toy glider and launcher with intrinsic cross-sectional strength and extended useful life, each made from a sheet of corrugated paperboard. The sheets have a patterned layout of a complete set of glider and launcher parts that are printed on a printable side of the corrugated paperboard. All parts are precut and retained in place. The central body (fuselage) has two mirror imaged sides foldable along scored guide lines to form a three sided “U” shaped structure. A nose pack with coin weights used for balance, is placed at the nose section between the sides. A wing and stabilizer cutouts are inserted in slots with tabs used to center and fix the cutouts in place. Included is a pistol grip launcher which is universal in its use for launching all types of toy gliders. | 2009-05-28 |
20090137183 | PORTABLE PUPPET THEATER, STAGE, OR PLAYHOUSE APPARATUS AND METHODS - A portable puppet theater, stage or playhouse comprises hanging wall structure for hanging the puppet theater or playhouse from a door or other vertical surface, enclosure structure for suspending from the hanging wall structure, the enclosure structure being shaped to form an enclosure, and shaping means associated with the enclosure structure for extending the enclosure structure away from a door or other vertical surface. The shaping structure within the enclosure structure may be disposed to be pivotable between a first position extending the enclosure structure away from the door or other vertical surface, and a second position maintaining the enclosure structure substantially flush against the door or other vertical surface. | 2009-05-28 |
20090137184 | INTERLOCKING CROSSBAR DEVICE AND SYSTEM - What is disclosed is a versatile interlocking crossbar device and system for coupling modular components of toy assemblages, educational models, hobby constructions, component attachments, or the like together using one or more connectors, configured with a set of male connector parts and a set of female connector parts, configured to enable the selective attachment of such parts. The disclosed system is exemplified in this application as a toy vehicle and a ball and demonstrates how the parts and interlocking crossbar device interrelate to one another in a plurality of ways to create varying embodiments. The unique interrelationships spoken of are, for the most part, capable of creation because similar sized openings and recesses are indexed within each body member such that the pieces and interlocking crossbar conform thereto. | 2009-05-28 |
20090137185 | System, Method, and Apparatus for Interactive Play - A system, method and apparatus for interactive play is provided. In an exemplary embodiment, an interactive toy is provided. The interactive toy is configured to store a plurality of codes and display codes on a display on the toy. The codes can authenticate the toy and unlock functionality within a virtual world. In one embodiment, the interactive toy is configured to communicate with a user computer. Another embodiment provides methods for interactive play with an interactive toy and a virtual world. A further embodiment provides a computing device configured to participate in the interactive play system. This Abstract is provided for the purpose of complying with the Abstract requirement rules that allow a reader to quickly ascertain the subject matter of the disclosure contained herein. This Abstract is submitted with understanding that it will not be used to interpret or to limit the scope or the meaning of the claims. | 2009-05-28 |