22nd week of 2009 patent applcation highlights part 14 |
Patent application number | Title | Published |
20090134481 | Molded Sensor Package and Assembly Method - A method of forming a molded sensor includes providing a sensor assembly having a sensor, and a cap coupled to a portion of the sensor, the cap having an opening and forming an interior area. The method also includes blocking the opening in the cap, and molding a moldable material around a portion of the sensor assembly and a portion of a base such that the moldable material is coupled to the sensor assembly and the base, the interior area being substantially free of the moldable material. | 2009-05-28 |
20090134482 | Power semiconductor module having a substrate and a pressure device - A power semiconductor module having a substrate, a housing and a pressure device. The substrate further includes a body formed of an insulating material and structured conductor tracks which are arranged thereon and have load and auxiliary potentials. The substrate also includes recesses in the region of the structured conductor tracks in at least two areas that are not covered by a power semiconductor component. Furthermore, the pressure device has latching lugs, which are disposed in the recesses and are arranged therein in a form-fitting and/or frictional manner, at least two points on the side of the pressure device which faces the substrate. | 2009-05-28 |
20090134483 | ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE - An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed. | 2009-05-28 |
20090134484 | Image sensor with correcting lens and fabrication thereof - An image sensor with at least one correcting lens and a method for fabricating the same are described. The image sensor includes a substrate with an array of microlenses thereon and at least one correcting lens disposed over the substrate covering the microlens array. In the fabricating method, a substrate having formed with a microlens array thereon is provided, and then at least one correcting lens is disposed over the substrate covering the microlens array. The at least one correcting lens can, in use of the image sensor, shift the incident direction of light to a microlens in edge parts of the array of microlenses toward the normal line direction of the image sensor. | 2009-05-28 |
20090134485 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME - An image sensor includes a semiconductor substrate including a pixel region and a peripheral circuit region; interlayer insulating films including metal wires arranged on the pixel region and the peripheral circuit region; and a photodiode and an upper electrode disposed on the interlayer insulating film of the pixel region. Further, the image sensor includes a protective layer disposed on the semiconductor substrate including the upper electrode and the interlayer insulating film of the peripheral circuit region and having a sloping portion in a region corresponding to the sidewall of the photodiode; via holes disposed on the protective layer so as to selectively expose the upper electrode and the metal wires of the peripheral circuit region; and upper wiring disposed on the protective layer including the via holes. | 2009-05-28 |
20090134486 | PHOTODIODE, METHOD FOR MANUFACTURING SUCH PHOTODIODE, OPTICAL COMMUNICATION DEVICE AND OPTICAL INTERCONNECTION MODULE - Both high light receiving sensitivity and high speed of a photodiode are achieved at the same time. The photodiode is provided with a semiconductor layer ( | 2009-05-28 |
20090134487 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor includes a first substrate, a lower metal line, a circuitry, a first insulating layer, a crystalline semiconductor layer, a photodiode, and a contact line. The lower metal line and the circuitry are formed on and/or over the first substrate and the first insulating layer is formed on and/or over the lower metal line. The crystalline semiconductor layer contacts the first insulating layer and is bonded to the first substrate. The photodiode is formed in the crystalline semiconductor layer. The contact line electrically connects the photodiode to the lower metal line. | 2009-05-28 |
20090134488 | Immersion Liquid, Exposure Apparatus, and Exposure Process - An immersion liquid is provided comprising an ion-forming component, e.g. an acid or a base, that has a relatively high vapor pressure. Also provided are lithography processes and lithography systems using the immersion liquid. | 2009-05-28 |
20090134489 | SYSTEM INCLUDING AN INTER-CHIP COMMUNICATION SYSTEM - A system including an inter-chip communication system is disclosed. One embodiment includes a base chip including a base chip transceiver network. At least one chip is stacked on the base chip, the at least one stacked chip including a substrate, a cavity formed in the substrate, a first surface, and a stacked chip transceiver network disposed on the first surface adjacent to the cavity. | 2009-05-28 |
20090134490 | ELECTRONIC COMPONENT MODULE - A ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer are laminated, the ferrite substrate has a ferrite first protruding part that protrudes into the ferrite resin layer from the surface thereof, the winding inside the ferrite resin layer is arranged winding around the first protruding part, and the IC overlaps the first protruding part in the resin layer. According to this configuration, high integration can be achieved, and the IC is arranged at a site where the ferrite first protruding part, the height of which fluctuates little as a result of thermal expansion, overlaps the ferrite resin layer, the thickness of which is thinned by the first protruding part and varies little as a result of thermal expansion, minimizing variations in the gap between the winding and the IC as a result of thermal expansion, and achieving greater stability of electrical characteristics. | 2009-05-28 |
20090134491 | Semiconductor Constructions, Methods of Forming Capacitors, And Methods of Forming DRAM Arrays - Some embodiments include methods of forming capacitors. A first section of a capacitor may be formed to include a first storage node, a first dielectric material, and a first plate material. A second section of the capacitor may be formed to include a second storage node, a second dielectric material, and a second plate material. The first and second sections may be formed over a memory array region, and the first and second plate materials may be electrically connected to first and second interconnects, respectively, that extend to over a region peripheral to the memory array region. The first and second interconnects may be electrically connected to one another to couple the first and second plate materials to one another. Some embodiments include capacitor structures, and some embodiments include methods of forming DRAM arrays. | 2009-05-28 |
20090134492 | METHODS AND DEVICES FOR FABRICATING TRI-LAYER BEAMS - Methods and devices for fabricating tri-layer beams are provided. In particular, disclosed are methods and structures that can be used for fabricating multilayer structures through the deposition and patterning of at least an insulation layer, a first metal layer, a beam oxide layer, a second metal layer, and an insulation balance layer. | 2009-05-28 |
20090134493 | Semiconductor device and method of manufacturing the same - Provided is a semiconductor device including a MIM capacitor, and having excellent waterproof property and antioxidant property even when being formed between wiring layers. The semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a first wiring layer embedded in the first insulating film, a wiring cap film for covering the first wiring layer, the MIM capacitor formed on the wiring cap film, a hydrogen barrier film for covering the MIM capacitor, a second insulating film formed on the hydrogen barrier film, conductive plugs passing through the second insulating film and the hydrogen barrier film, one of which being connected to an upper electrode of the MIM capacitor and the other of which being connected to a lower electrode of the MIM capacitor, and a second wiring layer connected to the conductive plugs, and the upper and lower electrodes of the MIM capacitor. | 2009-05-28 |
20090134494 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention includes: a semiconductor element | 2009-05-28 |
20090134495 | Method of designing semiconductor device - A design method of a semiconductor device comprising forming a base wafer by using a plurality of semiconductor chips including a plurality of functional macros, generating macro test information by testing the plurality of function macros of the plurality of semiconductor devices; and picking a macro that is prohibited from being used out of the plurality of function macros based on the macro test information and a net list of user circuit. Since tests are carried out at the phase of a base wafer, it is possible to improve yield rates in the manufacture of semiconductor integrated circuits. | 2009-05-28 |
20090134496 | WAFER AND METHOD OF FORMING ALIGNMENT MARKERS - A wafer comprises a multi-layer structure. The multi-layer structure includes a first device structure neighbouring an area for receiving alignment markers. A plurality of alignment markers extend into the multi-layer structure and are located within the area for receiving alignment markers. The plurality of alignment markers is arranged to prevent propagation of a crack, when occurring, beyond a material-dependent critical length in a part of the multi-layer structure corresponding to the area for receiving the alignment structure. The material-dependent critical length is associated with the part of the multi-layer structure. | 2009-05-28 |
20090134497 | Through Substrate Via Semiconductor Components - A structure and method of forming landing pads for through substrate vias in forming stacked semiconductor components are described. In various embodiments, the current invention describes landing pad structures that includes multiple levels of conductive plates connected by vias such that the electrical connection between a through substrate etch and landing pad is independent of the location of the bottom of the through substrate trench. | 2009-05-28 |
20090134498 | SEMICONDUCTOR APPARATUS - The present invention includes a semiconductor element provided with an electrode passing through front and back sides. The electrode is formed as a cylinder including a hollow portion, and stress relaxing material is provided in the hollow portion, which is used to reduce stress that is induced between the semiconductor element and the electrode. The stress relaxing material is an elastic body made of resin material. | 2009-05-28 |
20090134499 | ATOMIC LAYER DEPOSITION OF Hf3N4/HfO2 FILMS AS GATE DIELECTRICS - The use of atomic layer deposition (ALD) to form a dielectric layer of hafnium nitride (Hf | 2009-05-28 |
20090134500 | Structures for Preventing Cross-talk Between Through-Silicon Vias and Integrated Circuits - A semiconductor chip includes a through-silicon via (TSV), a device region, and a cross-talk prevention ring encircling one of the device region and the TSV. The TSV is isolated from substantially all device regions comprising active devices by the cross-talk prevention ring. | 2009-05-28 |
20090134501 | DEVICE AND METHOD INCLUDING A SOLDERING PROCESS - A device and method of making a device is disclosed. One embodiment provides a substrate. A semiconductor chip is provided having a first surface with a roughness of at least 100 nm. A diffusion soldering process is performed to join the first surface of the semiconductor chip to the substrate. | 2009-05-28 |
20090134502 | LEADFRAME BASED FLASH MEMORY CARDS - A leadframe design for forming leadframe-based semiconductor packages having curvilinear shapes is disclosed. The leadframes may each include one or more curvilinear slots corresponding to curvilinear edges in the finished and singulated semiconductor package. After encapsulation, the integrated circuit packages on the panel may be singulated by cutting the integrated circuits from the leadframe panel into a plurality of individual integrated circuit packages. The slots in the leadframe advantageously allow each leadframe to be singulated using a saw blade making only straight cuts. | 2009-05-28 |
20090134503 | Semiconductor power device package having a lead frame-based integrated inductor - A semiconductor power device package having a lead frame-based integrated inductor is disclosed. The semiconductor power device package includes a lead frame having a plurality of leads, a inductor core attached to the lead frame such that a plurality of lead ends are exposed through a window formed in the inductor core, a plurality of bonding wires, ones of the plurality of bonding wires coupling each of the plurality of lead ends to adjacent leads about the inductor core to form the inductor, and a power integrated circuit coupled to the inductor. In alternative embodiments, a top lead frame couples each of the plurality of lead ends to adjacent leads about the inductor core by means of a connection chip. | 2009-05-28 |
20090134504 | Semiconductor package and packaging method for balancing top and bottom mold flows from window - A window-type semiconductor package to balance top and bottom moldflows and its method are revealed. The package primarily comprises a substrate having a slot, a chip, and an encapsulant. After die attaching, an input opening and an output opening are formed and exposed from both ends of the slot. The slot is off-center designed so that the dimension of the input opening is smaller than the one of the output opening. The encapsulant has a top molding portion formed on the top surface of the substrate and a smaller bottom molding portion formed on the bottom surface of the substrate. The mold-flowing speeds between the top molding portion and the bottom molding portion are balanced to eliminate trapped air bubbles in the top mold and to avoid the flooding of the molding compound in the bottom mold. | 2009-05-28 |
20090134505 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to the present invention, protrusions | 2009-05-28 |
20090134506 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND FLEXIBLE SUBSTRATE FOR MOUNTING SEMICONDUCTOR - A semiconductor device includes a second semiconductor package, which includes a substrate and at least one semiconductor package. The substrate includes a terminal group formed on a surface thereof. At least one first semiconductor package is stacked on the substrate, and includes a plurality of flexible substrates, each of which includes a wiring group on a surface thereof and each of which is bending-deformable. At least one first semiconductor package includes a plurality of semiconductor elements mounted on a plurality of flexible substrates. Electric conduction through the second semiconductor package is established by connecting the wiring group on each of a plurality of flexible substrates to the terminal group on the substrate. Further, at least one terminal of the terminal group on the substrate is electrically connected to all of the plurality of semiconductor elements on at least one first semiconductor package, and at least one other terminal of the terminal group is electrically connected only to particular semiconductor elements of the plurality of semiconductor elements. | 2009-05-28 |
20090134507 | Adhesive on wire stacked semiconductor package - A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof. | 2009-05-28 |
20090134508 | Integrated circuit with flexible planar leads - A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme thermal cycling between −20° C. to +80° C. encountered in terrestrial applications. Advantageously, the microelectronic device is adapted to be both weldable and solderable. The invention may comprise a solar cell diode, which is flexible and so thin that it can be affixed directly to the solar panel proximate the solar cell. | 2009-05-28 |
20090134509 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed. | 2009-05-28 |
20090134510 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME, AND ELECTRONIC DEVICE USING THE SEMICONDUCTOR PACKAGE - A semiconductor package and method of fabricating the same. The semiconductor package includes a first semiconductor package, a second semiconductor package stacked on the first semiconductor package, and a first electrical connector interposed between the first and second semiconductor packages to electrically connect the first and second semiconductor packages. | 2009-05-28 |
20090134511 | Multiple Size Package Socket - Various sockets for multiple sizes of chip package substrates are disclosed. In one aspect, an apparatus is provided that includes a socket that has a peripheral wall defining an interior space adapted to receive either of a first semiconductor chip package substrate and a second semiconductor chip package substrate. The first semiconductor chip package substrate has a first size and a first plurality of structural features and the second semiconductor chip package substrate has a second size different than the first size and a second plurality of structural features. The socket has a third plurality of structural features operable to engage the structural features of either of semiconductor chip package substrates to selectively enable the first semiconductor chip package substrate to be located at a first preselected position in the interior space and the second semiconductor chip package substrate to be located at a second preselected position in the interior space. | 2009-05-28 |
20090134512 | METHOD OF PRODUCING MULTIPLE SEMICONDUCTOR DEVICES - A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce multiple semiconductor devices. | 2009-05-28 |
20090134513 | METHOD AND STRUCTURES FOR FABRICATING MEMS DEVICES ON COMPLIANT LAYERS - Methods and structures for fabricating MEMS devices on compliant layers are provided. In particular, disclosed are methods and structures that can include the use of a sacrificial layer composed of a material having material properties relative to one or more other layers. These methods and structures can reduce final device shape sensitivity to process parameters, deposition temperature differences, specific material, time, and/or geometry. Further, such methods and structures can improve the final as-built shape of released devices, reduce variability in the as-built shape, eliminate decoupling of the deposited layers from the substrate, and reduce variability across a product array, die, or wafer. | 2009-05-28 |
20090134514 | METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER - A method for fabricating electrical bonding pads on one face of a wafer includes the production of electrically conductive areas and electrical connection branches connecting these conductive areas. A layer of mask material is deposited and openings are produced in this mask layer which extend above said conductive areas and at least some of which extend at least partly beyond the peripheral edges of the underlying conductive areas. Blocks made of a solder material are produces in the openings by electrodeposition in a bath. The mask material is then removed along with the connection branches. The wafer is passed through or placed in an oven so as to shape, on the conductive areas, the blocks into substantially domed electrical bonding pads. | 2009-05-28 |
20090134515 | SEMICONDUCTOR PACKAGE SUBSTRATE - A semiconductor package substrate includes a main body with a surface having a first circuit layer thereon and a dielectric layer covering the first circuit layer, with a plurality of vias on a portion of the first circuit layer; a plurality of first conductive vias disposed in the vias; a plurality of first electrically connecting pads on the first conductive vias and completely exposed on the dielectric layer having no extending circuits for a semiconductor chip to be mounted thereon, the first electrically connecting pad being electrically connected to the first circuit layer of the first conductive via; and an insulating protective layer disposed on the main body with an opening for completely exposing the first electrically connecting pads, whereby the circuit layout density is increased without disposing circuits between the electrically connecting pads. | 2009-05-28 |
20090134516 | Method of manufacturing semiconductor device and semiconductor device - According to an embodiment of the present invention, a method of manufacturing a semiconductor device, comprising forming a conducting layer on a substrate; forming a resist mask having an opening in a prescribed position on the conducting layer; forming a first plated film in the opening by supplying an electric current to the conducting layer; increasing the interval between an inner side surface of the resist mask forming the opening and the first plated film by setting back the inner side surface; and forming a second plated film in the opening resulting from the setback of the inner side surface to cover the first plated film by supplying an electric current to the conducting layer. | 2009-05-28 |
20090134517 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A first insulating film is formed on a semiconductor substrate. A first interconnection is formed in a trench formed in the first insulating film. A first barrier film is formed between the first interconnection and first insulating film. A second insulating film is formed on the upper surface of the first interconnection, and in a first hollow portion between the side surface of the first barrier film and the first insulating film. The second insulating film is formed from the upper surface of the first interconnection to a depth higher than the bottom surface of the first interconnection. The first hollow portion is formed below the bottom surface of the second insulating film. | 2009-05-28 |
20090134518 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device of the present invention is provided with a substrate; an insulating film made of a fluorine-containing carbon film and formed on the substrate; a copper wiring buried in the insulating film; and a barrier film formed between the insulating film and the copper wiring. The barrier film includes a first film made of titanium for suppressing a diffusion of fluorine, and a second film made of tantalum for suppressing a diffusion of copper and formed between the first film and the copper wiring. | 2009-05-28 |
20090134519 | SEMICONDUCTOR DEVICE - Embodiments relate to a semiconductor device. In embodiments, the semiconductor device may include a semiconductor substrate having a first metal line; a pre-metal dielectric (PMD) layer over the first metal line on the semiconductor substrate; a first metal layer formed in a first contact hole in the PMD layer; a second metal layer formed in a second contact hole in the PMD layer; and a second metal line electrically connected to the first and second metal layers, respectively, over the PMD layer, wherein the first and second metal layers are located at prescribed positions and configured to be electrically connected to the first metal line. | 2009-05-28 |
20090134520 | PROCESS INTEGRATION SCHEME TO LOWER OVERALL DIELECTRIC CONSTANT IN BEOL INTERCONNECT STRUCTURES - Back-End of Line (BEoL) interconnect structures, and methods for their manufacture, are provided. The structures are characterized by narrower conductive lines and reduced overall dielectric constant values. Conformal diffusion barrier layers, and selectively formed capping layers, are used to isolate the conductive lines and vias from surrounding dielectric layers in the interconnect structures. The methods of the invention employ techniques to narrow the openings in photoresist masks in order to define narrower vias. More narrow vias increase the amount of misalignment that can be tolerated between the vias and the conductive lines. | 2009-05-28 |
20090134521 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF COPPER GERMANIDE AND COPPER SILICIDE AS COPPER CAPPING LAYER - A method is provided for forming a capping layer comprising Cu, N, and also Si and/or Ge onto a copper conductive structure, said method comprising the sequential steps of: forming, at a temperature range between 200° C. up to 400° C., at least one capping layer onto said copper conductive structure by exposing said structure to a GeH | 2009-05-28 |
20090134522 | Micro-Electromechanical System Memory Device and Method of Making the Same - A method of manufacturing a non-volatile memory bitcell comprises the steps of depositing a first layer of conductive material on a substrate and patterning and etching the first layer of conductive material to form three non-linearly disposed electrodes. The method also comprises the steps of depositing a first layer of sacrificial material on the electrodes and the substrate and providing an elongate cantilever structure on the first layer of sacrificial material such that the cantilever structure and at least a portion of each electrode overlap each other. The method also includes the steps of depositing a second layer of sacrificial material on the cantilever structure and the first layer of sacrificial material and providing a capping layer on the second layer of sacrificial material and providing holes in the capping layer such that at least a portion of the second layer of sacrificial material is exposed. Finally, the method provides the step of removing the first and second layers of sacrificial material through the holes provided in the capping layer, thereby defining a cavity in which the cantilever structure is suspended. | 2009-05-28 |
20090134523 | Semiconductor device and method of manufacturing the same - A semiconductor chip includes a semiconductor chip region provided with a plurality of internal circuits, and a plurality of electrode pads provided proximate to an outer edge of the semiconductor chip region and each electrically connected to any one of the plurality of internal circuits. The plurality of electrode pads include: a long pad including a probe region with which a probe is brought into contact, and a bonding region provided in a position different from a position of the probe region, for bonding a wire; and a short pad for high frequency, which is formed to have a smaller pad area compared with the long pad and inputs/outputs a high frequency signal by employing a structure including the bonding region but the probe region. | 2009-05-28 |
20090134524 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a microstrip structure composed of a signal line and a ground plate, the capacitance between wires is reduced and the characteristic impedance can be increased by forming holes in the signal line or in the ground plate. The coupling between a plurality of signal lines can also be reduced. | 2009-05-28 |
20090134525 | Semiconductor device having a filling pattern around a storage structure and method of forming the same - A semiconductor device includes an interlayer insulating layer on a semiconductor substrate, at least one plug on the semiconductor substrate, the plug extending through the interlayer insulating layer toward an upper portion of the semiconductor substrate, the plug having a lower part with a first diameter and an upper part with a second diameter different from the first diameter, a filling pattern on the interlayer insulating layer, the filling pattern surrounding the upper part of the plug, and an upper surface of the filling pattern being substantially coplanar with an upper surface of the plug, the upper surface of the plug facing away from the semiconductor substrate, and a protection pattern on the upper part of the plug, the protection pattern being between the plug, the filling pattern, and the interlayer insulating layer. | 2009-05-28 |
20090134526 | Interconnect Structure to Reduce Stress Induced Voiding Effect - An interconnect structure that may reduce or eliminate stress induced voids is provided. In an embodiment, a via is formed below a conductive line to provide an electrical connection to an underlying conductive region. The conductive line includes a widened region above the via. The widened region serves to reduce or eliminate stress induced voids between the via and the underlying conductive region. In another embodiment, one or more redundant lines are formed extending from a conductive region, such as a contact pad, such that the redundant line does not electrically couple the conductive region to an underlying conductive region. In a preferred embodiment, the redundant lines extend from a conductive region on a side adjacent to a side having a conductive line coupled to a via. | 2009-05-28 |
20090134527 | STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME - This invention provides a structure of three-dimensional stacked dice with vertical electrical self-interconnections and a method for manufacturing the same. A respective electrical conductive layer is formed in a buried layer of each of the stacked dice, and being extended and exposed to a sidewall of the respective die. An electroless plating process is performed to deposit metal on exposed portions of the respective electrical conductive layers. The metal isotropically grows along the sidewalls of the stacked dice to form a vertical electrical conductive wire connecting the respective conductive layers. The vertical electrical self-interconnections of the three dimensional stacked dice are established. | 2009-05-28 |
20090134528 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - Provided are a semiconductor package, an electronic device including the semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package includes semiconductor chips mounted on a carrier, a first insulating layer sealing the semiconductor chips, first via-holes which are formed in the first insulating layer and expose a portion of each of the semiconductor chips, a first conductive pattern which is filled in the first via-holes and electrically connected to each of the semiconductor chips, and an external terminal which is electrically connected to the first conductive pattern. The semiconductor package is manufactured by performing an encapsulating process and a via-hole process. | 2009-05-28 |
20090134529 | CIRCUIT BOARD MODULE, ELECTRIC DEVICE, AND METHOD FOR PRODUCING CIRCUIT BOARD MODULE - A circuit board module includes: a printed wiring board that is provided with a plurality of solder bonding pads; a semiconductor package that is provided with a plurality of solder bonding portions on a back face thereof to be mounted on the printed wiring board by soldering the solder bonding portions onto the respective solder bonding pads on the printed wiring board; a plurality of reinforcement pads that are provided on the printed wiring board at positions along peripheral edges of the semiconductor package, each of the reinforcement pads having a solder coated layer formed thereon; and a plurality of reinforcing adhesive agents that are disposed on each of the reinforcement pads to adhere the semiconductor package to the reinforcement pads. | 2009-05-28 |
20090134530 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - There is provided a wiring substrate. The wiring substrate includes a wiring member and a reinforcing layer. The wiring member is formed by layering insulating layers and wiring layers and has connection pads thereon. The reinforcing layer is provided on the wiring member to surround the connection pads and has a plurality of concave-convex portions thereon. | 2009-05-28 |
20090134531 | OVERLAY MARK AND METHOD FOR FORMING THE SAME - The invention is directed to an overlay mark in a first material layer in an overlay alignment region of a wafer and the first material layer is made from a first material. The overlay mark includes a plurality of mark regions and each of the mark regions comprises a plurality mark elements embedded in the first material layer. Each of the mark elements is made of a second material different from the first material of the first material layer and the mark elements evenly distribute in the mark region. | 2009-05-28 |
20090134532 | Aerating device for aquarium - A water aerating device for an aquarium includes a carrier, a pumping device attached to the carrier and having a motorized impeller for pumping a water, a siphon tube coupled to the pumping device and having a tube member engaged into the aquarium for allowing the water to be drawn into the siphon tube and drawn into the carrier by the impeller, and a number of rods disposed in the carrier for agitating the water and for minimizing an air contained in the water into smaller air bubbles. One or more air minimizing devices or helical spring members may further agitate the water and minimize the air contained in the water for supplying the reduced air bubbles to the water plants or the water weeds. | 2009-05-28 |
20090134533 | Contact tray for a mass transfer column - The valve cover has a pair of tabs at the ends that are inserted into end sections of an orifice in the tray deck. The tabs of the valve cover abut against the underside of the tray deck while a pair of sloped portions of the valve cover rest on the top side of the tray deck in order to hold the valve cover in place. | 2009-05-28 |
20090134534 | Device and A method for producing a diffractive microstructure - Micro-protrusions, which constitute a diffractive microstructure, are produced by embossing the surface layer of a substrate by an embossing member having microgrooves in such a way that the cross-sectional area of a produced micro-protrusion is substantially smaller than the cross-sectional area of the microgroove producing said micro-protrusion. Thus, the embossing pressure is small, the risk of adhesion is reduced, it is possible to use a low embossing temperature, and microstructures may be produced at a high speed. Furthermore, the same embossing member may be used for producing a low microstructure, a normal microstructure, and a high microstructure. | 2009-05-28 |
20090134535 | Method of manufacturing an intrinsic polarizer - An improved method of forming an intrinsic polarizer, referred to as a K-type polarizer, includes stretching a polymeric film a first stretching step. The polymeric film comprises a hydroxylated linear polymer which is converted after the first stretching step to form dichroic, copolymer polyvinylene blocks aligned in the polymeric film. The polymeric film is stretched in a second stretching step while converting the hydroxylated linear polymer. This method produces an improved K-type polarizer with excellent polarizing and color characteristics. For example, the dichroic ratio is higher than 100, the color shift for light passed through the polarizer in a crossed configuration is low, and the absorption of light in the blue region of the visible spectrum is more than one half of the absorption for light in the middle of the visible spectrum. | 2009-05-28 |
20090134536 | Granulator and method of granulation using the same - A granulator, having: a granulation unit having a bottom floor with a perforated plate as its bottom part; an upper air-supplying pipe for supplying a fluidizing air to the bottom floor of the granulation unit; a lower air-supplying pipe; air-spouting pipes, each of which is branched from the lower air-supplying pipe, and has an opening in the bottom floor of the perforated plate, for jetting the air into the granulation unit; and spray nozzles for spraying a granulation raw material liquid, which each are provided in the center of an air outlet of the air-spouting pipe, or a granulator, having: the bottom floor; the air-supplying pipe; and spray nozzles for spraying a granulation raw material liquid, which each are provided in an opening in the bottom floor of the perforated plate, and use a high-pressure atomizing air as an auxiliary gas, wherein, in each granulator, the spray nozzles are formed in triangular arrangement. | 2009-05-28 |
20090134537 | Method and apparatus for making crystalline polymeric pellets and granules - A method and apparatus for underwater pelletizing and subsequent drying of crystallizing polymers to crystallize the polymer pellets without subsequent heating is shown in FIG. | 2009-05-28 |
20090134538 | METHOD FOR PRODUCING MULTI-LAYER, MICROPOROUS POLYOLEFIN MEMBRANE - A multi-layer, microporous polyolefin membrane comprising a polypropylene layer and a polyethylene resin layer and having well-balanced permeability, mechanical strength, heat shrinkage resistance, shutdown properties and meltdown properties can be obtained by (1) forming a sheet comprising a gel-like polypropylene layer containing a membrane-forming solvent or a polypropylene layer containing no membrane-forming solvent and a gel-like polyethylene resin layer containing a membrane-forming solvent, stretching the sheet at two-stage temperatures, and then removing the membrane-forming solvent, or (2) forming a gel-like polypropylene sheet containing a membrane-forming solvent or a polypropylene sheet containing no membrane-forming solvent, and a gel-like polyethylene resin sheet containing a membrane-forming solvent, stretching them at two-stage temperatures, removing the membrane-forming solvent, and then laminating the resultant microporous polypropylene membrane and the resultant microporous polyethylene membrane. | 2009-05-28 |
20090134539 | TECHNIQUES FOR SENSING MATERIAL FLOW RATE IN AUTOMATED EXTRUSION - An extrusion construction system may include an extrusion nozzle configured to extrude construction material through an outlet onto an external surface, the extrusion nozzle including an excess flow port disposed substantially adjacent an edge of the outlet, an imaging device coupled to the extrusion nozzle, and a controller configured to adjust the rate of material flow through the extrusion nozzle in response to receiving one or more images captured by the imaging device showing excess material being extruded through the excess flow port. | 2009-05-28 |
20090134540 | TECHNIQUES FOR SENSING MATERIAL FLOW RATE IN AUTOMATED EXTRUSION - An extrusion construction system may include an extrusion nozzle, a channeling element coupled to the extrusion nozzle and to a source of construction material, the channeling element configured to transport the material to the extrusion nozzle for extruding the material onto a surface, wherein a surface of the channeling element comprises a transparent substrate such that a flow of the material is viewable through the substrate, an imaging device configured to capture a plurality of images through the substrate of the material flow, and a controller configured to estimate a flow rate based on the plurality of images. | 2009-05-28 |
20090134541 | Method for Foam Injection Molding of Thermoplastic Resin - A method for injection foaming molding of a thermoplastic resin includes the steps of (1) injecting the foaming-agent-containing plasticized resin from an injection apparatus | 2009-05-28 |
20090134542 | Preparation and Sterilization of Green State Devices Using a Supercritical Fluid Sterilant - The invention relates to a method for forming a molded article during sterilization and under high pressure utilizing a supercritical fluid as a sterilization fluid, whereby the pressurization and depressurization rates are controlled to form molded articles. | 2009-05-28 |
20090134543 | Vacuum Film Forming Apparatus and Vacuum Film Forming Method - A vacuum film forming apparatus includes a target chamber in which a target is disposed for performing a vacuum film forming; a first mold at a side of the target chamber; and a second mold that includes a workpiece chamber in which a workpiece is capable of being disposed. The first mold and the second mold are structured such that a film being formed onto the workpiece is capable of being carried out by die matching between the first mold and the second mold, and a shutter device for opening and closing the target chamber is provided to the first mold. | 2009-05-28 |
20090134544 | MOULD MEMBER FOR MOULDING THREE-DIMENSIONAL PRODUCTS, SYSTEM AND METHODS OF MANUFACTURING A MOULD MEMBER - A mould member for moulding three-dimensional products from a mass of one or more food starting materials, which are suitable for consumption, in particular human consumption, comprises a body having a porous structure and a plurality of mould cavities, which mould cavities each have a mould cavity wall defined by the body and an opening in a surface of the body, wherein the body comprises at least one essentially fluid tight barrier. | 2009-05-28 |
20090134545 | Process For The Manufacture of Lightweight Construction Materials Containing Clay - Process for the manufacture of lightweight construction materials starting from clay by extrusion molding wherein a source of hydrogen peroxide is used as gas generating agent. The use of hydrogen peroxide in such a process allows to reduce the power of extrusion at constant moisture content, and to reduce the amount of added water at constant extrusion pressure. | 2009-05-28 |
20090134546 | Oligomerization of Isobutene-Containing Feedstocks - The invention relates to the use of isobutene-containing olefin feedstock in oligomerization reactions, particularly in the production of octenes as feedstock for the manufacture of plasticizer alcohols, the process comprising contacting a feed comprising isobutene with a molecular sieve at a temperature in excess of 240° C. to produce a product low in triple-branched octenes. | 2009-05-28 |
20090134547 | Process for the production of an extruded plastic film and use of the plastic film - Process for the production of an extruded mono- or multilayer plastic film, where at least sections of the plastic film are provided with a pattern during or after extrusion, and use of a film produced by this process for packaging purposes. | 2009-05-28 |
20090134548 | Method for Producing a Signal Plate and Traffic Signal With Such a Signal Plate - To produce a signal plate for a railway signal, a casting mold corresponding to an external form of the signal plate is provided. At least one luminous point is inserted into the casting mold, and the casting mold is filled with a free-flowing curable plastic to create a casting. The plastic is cured, and the casting is removed. | 2009-05-28 |
20090134549 | Molding Apparatus - An improved molding apparatus and method of use thereof that inhibits unsightly blemishes that may be formed in molded plastic parts in caused by confined crevices of the molding apparatus. A mold cavity is formed by at least two mold portions and one of said mold portions has a molten plastic flow diverter positioned adjacent the confined crevice. The charge of molten plastic is injected into said cavity such that a portion of the charge of plastic flows over the diverter and into the confined crevice of the mold cavity. The diverter creates a narrow restriction adjacent the crevice such that the mold cavity has a larger cross-sectional area on either side of the diverter. | 2009-05-28 |
20090134550 | Die for producing very wide, flat, plastic-based structures - A die for producing wide, flat, plastic-based structures including a base and a cover. The die includes a plurality of ducts for feeding molten plastic, opening into a distribution channel, and a longitudinal outflow slot for outputting the molten plastic in a form of a substantially flat structure. The distribution channel and the outflow slot communicate via a plurality of distributors of generally triangular section having a downstream apex, near to which a feed duct emerges, and two upstream apexes forming intersections of the distribution channel and of the outflow slot, each feed duct being fed with molten plastic via an upstream orifice of the die that is specific thereto. | 2009-05-28 |
20090134551 | Mouldable material - A method of providing a self-adhesive mouldable pad comprises mixing: a) a first component comprising room temperature vulcanising silicone composition; and b) a second component, one of the first and second components comprising a moist, powdered filler, and the other of the first and second components comprising a hydrolysable cross-linking agent, to produce a self-adhesive RTV silicone elastomer composition, applying the RTV moisture cure silicone elastomer composition to a substrate, and moulding it by hand to form a pad. | 2009-05-28 |
20090134552 | Method For Predicting and Optimizing System Parameters for Electrospinning System - An electrospinning system using a spinneret and a counter electrode is first operated for a fixed amount of time at known system and operational parameters to generate a fiber mat having a measured fiber mat width associated therewith. Next, acceleration of the fiberizable material at the spinneret is modeled to determine values of mass, drag, and surface tension associated with the fiberizable material at the spinneret output. The model is then applied in an inversion process to generate predicted values of an electric charge at the spinneret output and an electric field between the spinneret and electrode required to fabricate a selected fiber mat design. The electric charge and electric field are indicative of design values for system and operational parameters needed to fabricate the selected fiber mat design. | 2009-05-28 |
20090134553 | Producing method for film - A polymer solution ( | 2009-05-28 |
20090134554 | DRIVE APPARATUS FOR INSTALLING FLEXIBLE PIPE THROUGH IN-SITU PIPE - Pusher apparatus and a method of using the apparatus inserts a flexible liner into an in-situ pipe. At least a pair of contra-rotating resilient drive assemblies, having a nip therebetween, drive the liner into the pipe. A guide tube can extend between the drive assemblies and the pipe. A pull head can be affixed to a leading end of the liner and adapted for sealing within a bore of the pipe and pressured fluid can be applied to pull a leading end of the liner into the pipe while the pusher pushes. The contra-rotating resilient drive assemblies can be one or more pair of opposing wheels or opposing tracks. Track assemblies can be mounted to a frame which is movable on rails and restrained with a load cell for measuring reactive forces while pushing. The rails can be angled for aligning the nip with the pipe. | 2009-05-28 |
20090134555 | Steel Coil Cutting Apparatus and Method - A method of cutting a steel coil with an axial center located within a bore of the steel coil. The method comprises the steps of positioning a cutting apparatus near the axial center of the steel coil, utilizing an imaging device as a sensor that is attached to the cutting apparatus for detecting the axial center of the steel coil, and aligning the cutting apparatus to be co-axial with the axial center. The method further comprises the steps of providing the cutting apparatus with a cutting device, radially directing the cutting device, and axially cutting an entire length of the steel coil by activating the cutting device, and axially moving the cutting device through the bore of the steel coil from a first end of the steel coil to a second end of the steel coil. | 2009-05-28 |
20090134556 | LIQUID ENCLOSING TYPE VIBRATION ISOLATING APPARATUS - To provide a liquid enclosing type vibration isolating apparatus capable of achieving two resonance characteristics by one orifice path, in a liquid enclosing type vibration isolating apparatus including a main liquid chamber a portion of a chamber wall of which is constituted by a vibration isolating base member, an auxiliary liquid chamber a portion of a chamber wall of which is constituted by a first diaphragm | 2009-05-28 |
20090134557 | Electromagnetic suspension system for a seat assembly and machine using same - A suspension system for a seat assembly of a machine includes an upper support member and a lower support member. A pair of scissors linkages interconnect the upper and lower support members. Each of the scissors linkages includes first and second arms pivotably attached at central portions thereof. An electronic controller is in communication with a pair of electromagnetic devices positioned at first ends of the first arms. The electronic controller is configured to energize the electromagnetic devices in response to a sensor output. | 2009-05-28 |
20090134558 | Vehicle loading dock fender assembly - The invention relates to a loading dock fender unit ( | 2009-05-28 |
20090134559 | Spring Assembly - To provide a spring assembly whose production cost is low. | 2009-05-28 |
20090134560 | METHOD AND APPARATUS FOR FIXING, ON A PREPARATION AND SUPPORT PLATE, WORKPIECES TO BE MACHINED BY MACHINE TOOLS - The invention concerns a method and apparatus for fixing precisely with adhesive, on a preparation and support plate or base ( | 2009-05-28 |
20090134561 | Work support - Work support arrangements | 2009-05-28 |
20090134562 | Clamping Element for Workpieces, in Particular a Vice - This invention relates to a clamping element for workpieces, in particular a vice ( | 2009-05-28 |
20090134563 | SHEET STACKING APPARATUS, SHEET PROCESSING APPARATUS, AND IMAGE FORMING APPARATUS - A sheet stacking apparatus includes an alignment roller which conveys a sheet to a sheet positioning member and an opening and closing shutter which is disposed so as to face a sheet stack surface of a sheet stack guide. The sheet positioning member abuts a sheet end in a sheet conveying direction to align the sheet. The sheet is stacked on the sheet stack guide. The opening and closing shutter has a regulating area where sheet conveying guide and buckling of the sheet are regulated from an upstream side to a downstream side in the sheet conveying direction of the alignment roller. A guide interval formed between the opening and closing shutter and the sheet stack surface can be changed. Therefore, in sheet conveying positioning, the buckling can securely be prevented in the sheet stack guide. | 2009-05-28 |
20090134564 | Sheet feeder - A sheet feeder ( | 2009-05-28 |
20090134565 | Sheet Stabilizer with Suction Nozzle having Center Protrusion - This invention is related to suction nozzles having a center protrusion for stabilizing a continuous web for various web property measurements. Suction nozzles blow air out of the nozzle, yet produce a vacuum proximate thereto. Two nozzles are disclosed, a single sided sheet-contact stabilizer and a non-contact sheet stabilizer. An air-bearing may be formed between the end surface of the center protrusion and the moving web. | 2009-05-28 |
20090134566 | Photosensitive Material Conveying System and Image Forming Apparatus - The photosensitive material conveying system is configured so that a feed out roller is contacted on a stack of sheets having a plurality of stacked photosensitive sheet films each of which is provided with an emulsion layer and a first protective layer provided on one side of a supporting base and a second protective layer provided on the other side with matting agent dispersed in the second protective layer, and the topmost sheet film in the stack of sheets is fed out by the rotation of the feeding out roller, wherein the matting agent has a spherical shape, a hardness softer than the first protective layer, and particle diameter in the range of 8 to 12 μm, and the contact pressure of the feeding out roller is 0.49 N/cm or less. | 2009-05-28 |
20090134567 | SHEET HANDLING DEVICE - [Problem] The present invention has as an object to reduce the occurrence of jamming of sheet within a sheet handling device. | 2009-05-28 |
20090134568 | Device for transporting and weighing letters - Device for the transport and weighing of letters, wherein the letter is conveyed between at least two conveyance elements and is stabilized laterally outside the conveyance elements by at least one guide element so that a deflection or fluttering of the letter can be reduced or avoided, at least when the letter is seized at its front edge by the transport elements. | 2009-05-28 |
20090134569 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus includes a sheet conveying part that conveys sheets; a detection part that outputs a signal according to a position of each sheet conveyed by the sheet conveying part in a lateral direction orthogonal to a conveying direction; a lateral shift part that shifts the conveyed sheet in the lateral direction; and a control part that controls an operation of the lateral shift part based on an output of the detection part. Then, after lateral shift operation is ended by the lateral shift part, detection is performed again by the detection part, and based on a detection result thereof, the control part controls an operation of the lateral shift part so that the conveyed sheet is shifted again in the lateral direction. | 2009-05-28 |
20090134570 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus includes a plurality of skew feeding correction rollers, a detection portion and a control portion which controls each sheet conveying speed of the plurality of skew feeding correction rollers so as to perform skew feeding correction of the sheet depending on the output from the detection portion. The control portion controls the plurality of skew feeding correction rollers so as to perform skew feeding correction of the sheet while the sheet is conveyed in a state in which the sheet conveying speed of the plurality of skew feeding correction rollers is slower than that when the amount of skew feeding of the sheet is less than a predetermined amount of skew feeding when the amount of skew feeding exceeds the predetermined amount of skew feeding. | 2009-05-28 |
20090134571 | RECORDING MEDIUM TRANSPORTING DEVICE AND RECORDING APPARATUS - A recording medium transporting device includes a transporting unit that transports a recording medium; a guide member that supports and guides the recording medium in a downstream direction, the guide member being disposed downstream of the transporting unit; and a restraining unit that includes a restraining member having a restraining section, the restraining section being movable relative to the guide member. The restraining section imposes a restraint on the recording medium to prevent the recording medium from rising above the guide member at a position downstream of the transporting unit. A restriction state of the restraining member is switchable between at least two states, and the restriction state is switched so that a degree of the restraint is reduced or the restraint is removed before a trailing edge of the recording medium passes the restraining section. | 2009-05-28 |
20090134572 | SHEET STACKING DEVICE AND IMAGE FORMING APPARATUS - A stacker includes a plurality of sheet stacking units individually movable upward and downward. Sheets are selectively stacked onto either of the stacker trays. To remove the sheets stacked on one of the stacker trays, a door is opened. In a state where the door is open, the stacker trays moved by respective elevation units are movable only downward. In this manner, accidental upward movement of each of the stacker trays caused by a malfunction of a motor or the like is regulated, whereby damage to the stacker is prevented. | 2009-05-28 |
20090134573 | Casting lots - A NEW ENJOYMENT, IN ORDER, TO BE ENTERTAIN PEOPLE WITH A NEW GAME. | 2009-05-28 |
20090134574 | GAME SYSTEM - A game apparatus with: (a) an indicia selecting means including a rotatable wheel ( | 2009-05-28 |
20090134575 | PLAYING CARD VAULT - A card vault for attachment to an automatic card shuffling machine, card shoe, card verifying machine and card discard rack is disclosed. The card vault facilitates a system of reducing human handling of cards thereby reducing human error and cheating. Cards may be transferred in a card vault directly from the card verifying machine to an automatic card shuffling machine. After being dealt during one or more table games, the cards are placed in a discard rack and transferred to the card vault for transport to a card verifying machine where the deck is verified. The card vault and contained cards are tracked in substantially real-time using wireless technology such as a RFID transmitter and receiver. | 2009-05-28 |
20090134576 | Tile Game Apparatus and Method for Learning Alphabet-based Symbolic Notation - A tile-based game is used for teaching symbolic notation corresponding to alphabetical notation, such as found in music and code or sign language, by having players attempt to spell word with the symbolic notations that appear on one side of the tiles. Players are given points for the correct assembly or deciphering of a word with the tiles and check for correct answers by viewing the corresponding alphabetical notations on an opposite side of the tiles. The game can be implemented virtually on a computer. | 2009-05-28 |
20090134578 | 2 BET BLACKJACK - A gaming method and system that allows a player to wager varying amounts on whether that player will win or lose an additional bet, contingent on the makeup of the first two cards dealt to a player in the game of blackjack. The first two cards will fall under predetermined, posted category of “Good Hand” or “Bad Hand.” Each category will be made up of playing card combinations that most players would view as good or bad playing card point totals in the game of blackjack. The player will have three wagering options: (1) make only a conventional bet; (2) make only the additional bet by selecting either the “Good Hand” or the “Bad Hand” from the posted categories of “Good Hands” and “Bad Hands”; or (3) Make both a conventional blackjack bet and an additional bet. | 2009-05-28 |
20090134579 | Lottery card holding and marking apparatus and associated method - An apparatus for holding and marking a lottery ticket during playing conditions includes a base plate with a planar top surface provided with upwardly extending walls contiguously surrounding a periphery thereof. A lid is pivotally coupled to the base plate in such a manner that the lid and base plate pivot about a fulcrum axis extending along respective proximal latitudinal edges of the lid and the base plate. The apparatus further includes a plurality of brackets attached to opposed ones of the walls of the lid. Each of such brackets is linearly slidable along a corresponding edge of the lid, and the brackets are slidable along mutually exclusive linear paths defined along the corresponding lids respectively. The apparatus further includes a scratching implement removably coupled to one of the brackets, and a marking implement removably coupled to another one of the brackets. | 2009-05-28 |
20090134580 | Ball game kit - A ball game kit is easily carried and readily assembled to facilitate play in recreational areas such as parks or beaches. The kit includes a container housing paddles, balls, and a unilateral court assembly appointed to be laid on a ground surface and secured thereto by way of securing mechanism to yield a playing field. The playing field is divided into two opposing player courts separated by a middle zone or dead zone. The court assembly includes a continuous rope or cord-like member. The court can be readily and accurately adjusted from a singles playing court to a doubles playing court by condensing and/or expanding the court assembly, without having to add sections or dismantle the court assembly. Glow in the dark properties may be provided to the court assembly, paddles, and/or balls for play in dimly lit or foggy conditions. | 2009-05-28 |
20090134581 | ARCHERY TARGET AND METHOD OF MAKING THE SAME - An archery target configured to absorb an impact of an associated arrow. The target having a stand having a top side and a bottom side and the bottom side including a support structure for supporting the archery target on an associated surface. The top side including a target rest shaped to receive a portion of an outer perimeter of a cylindrical target portion in shaped engagement. The target portion having a front side and a back side which extend between the outer perimeter and define a target depth and including a central core extending between front and back sides of the target. The core defining a target axis coaxial with the outer perimeter and the target portion further including at least one general planar sheet having side edges defining a sheet width that is generally equal to the target depth and a sheet surface between the side edges. The at least one sheet being wrapped about the core and the target axis and the side edges at least partially forming the arrow receiving zone wherein a portion of the sheet surface forms the outer perimeter. | 2009-05-28 |