21st week of 2013 patent applcation highlights part 53 |
Patent application number | Title | Published |
20130130485 | METHOD FOR FABRICATING SCHOTTKY DEVICE - A method for fabricating a Schottky device includes the following sequences. First, a substrate with a first conductivity type is provided and an epitaxial layer with the first conductivity type is grown on the substrate. Then, a patterned dielectric layer is formed on the epitaxial layer, and a metal silicide layer is formed on a surface of the epitaxial layer. A dopant source layer with a second conductivity type is formed on the metal silicide layer, followed by applying a thermal drive-in process to diffuse the dopants inside the dopant source layer into the epitaxial layer. Finally, a conductive layer is formed on the metal silicide layer. | 2013-05-23 |
20130130486 | METHOD OF FORMING SILICIDE LAYERS - A method of forming silicide layers is disclosed, the method including: providing a silicon substrate which includes at least one first region and at least one second region; depositing a dielectric layer over the silicon substrate; forming at least one opening having a great width/depth ratio in the dielectric layer above the at least one first region, and forming at least one opening having a small width/depth ratio in the dielectric layer above the at least one second region; depositing a metal and performing a high-temperature annealing to form a thick silicide layer in each of the at least one opening above each of the at least one first region and to form a thin silicide layer in each of the at least one opening above each of the at least one second region; removing the remaining metal not formed into the silicide layers. | 2013-05-23 |
20130130487 | Integrated Circuit with Metal and Semi-Conducting Gate - A method for forming an integrated circuit system is provided including forming a semi-conducting layer over a substrate, forming a spacer stack having a gap filler adjacent to the semi-conducting layer and a inter-layer dielectric over the gap filler, forming a transition layer having a recess over the semi-conducting layer and adjacent to the spacer stack, and forming a metal layer in the recess. | 2013-05-23 |
20130130488 | Method of Patterning a Metal Gate of Semiconductor Device - Provided are methods of patterning metal gate structures including a high-k gate dielectric. In an embodiment, a soluble hard mask layer may be used to provide a masking element to pattern a metal gate. The soluble hard mask layer may be removed from the substrate by water or a photoresist developer. In an embodiment, a hard mask including a high-k dielectric is formed. In a further embodiment, a protection layer is formed underlying a photoresist pattern. The protection layer may protect one or more layers formed on the substrate from a photoresist stripping process. | 2013-05-23 |
20130130489 | SEALED AIR GAP FOR SEMICONDUCTOR CHIP - A method for forming a sealed air gap for a semiconductor chip including forming a gate over a substrate; forming a sacrificial spacer adjacent to the gate; forming a first dielectric layer about the gate and the sacrificial spacer; forming a contact to the gate; substantially removing the sacrificial spacer, wherein a space is formed between the gate and the first dielectric layer; and forming a sealed air gap in the space by depositing a second dielectric layer over the first dielectric layer. | 2013-05-23 |
20130130490 | COMBINATORIAL APPROACH FOR SCREENING OF ALD FILM STACKS - In some embodiments of the present invention, methods of using one or more small spot showerhead apparatus to deposit materials using CVD, PECVD, ALD, or PEALD on small spots in a site isolated, combinatorial manner are described. The small spot showerheads may be configured within a larger combinatorial showerhead to allow multi-layer film stacks to be deposited in a combinatorial manner. | 2013-05-23 |
20130130491 | DISPLAY PANEL MANUFACTURING METHOD, DISPLAY PANEL, AND DISPLAY APPARATUS - A method of manufacturing a display panel having a display part and a terminal part each formed on a different area on a TFT substrate, comprising: a step of forming the display part on the TFT substrate; a step of forming a conductive layer of a conductive metal oxide or a metal on an area where the terminal part is to be formed; a step of forming a chemical vapor deposition layer of an inorganic compound by a chemical vapor deposition method so that the chemical vapor deposition layer covers the display part and comes into contact at least with an upper surface of the conductive layer and so that the upper surface of the conductive layer alters; and a step of removing a portion of the chemical vapor deposition layer on the conductive layer. | 2013-05-23 |
20130130492 | SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTEGRATED CIRCUIT PACKAGE - Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package. | 2013-05-23 |
20130130493 | CONNECTING PAD PRODUCING METHOD - A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member. The conductive layer with which the insulating member is coated is removed so as not to reach the conductive layer surface in a region adjacent to the insulating member in the third process. | 2013-05-23 |
20130130494 | EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF - An embedded semiconductor device substrate having a semiconductor device integrated therein is formed by disposing a semiconductor device in an opening provided on an insulating resin, and sandwiching the semiconductor device and the insulating resin with a front surface wiring layer and a rear surface wiring layer and performing heat pressing. Connection between bumps of the semiconductor device and the front surface wiring layer is made with a connection wiring pattern. The connection wiring pattern is formed by patterning a resist film by direct exposure thereof with a light beam, and then performing etching. Thereby, it becomes possible to absorb a mounting error of a semiconductor device to a printed wiring board and a positional error of electrodes between semiconductor devices accompanying the tendency of reduction of the pitch of a semiconductor device, and to perform electric connection with a wiring pattern securely. | 2013-05-23 |
20130130495 | Method For Fabricating A Metal Silicide Interconnect In 3D Non-Volatile Memory - A method for fabricating a metal silicide interconnect in a stacked 3D non-volatile memory array. A stack of alternating layers of undoped/lightly doped polysilicon and heavily doped polysilicon is formed on a substrate. Memory holes are etched in cell areas of the stack while an interconnect area is protected. Slits are etched in the cell areas and the interconnect areas. A wet etch is performed via the slits or the memory holes in the cell area to remove portions of the undoped/lightly doped polysilicon layers in the cell area, and dielectric is deposited. Silicidation transforms portions of the heavily doped polysilicon layers in the cell area to metal silicide, and transforms portions of the heavily doped and undoped/lightly doped polysilicon layers in the interconnect area to metal silicide. The metal silicide interconnect can be used for routing power and control signals from below the stack to above the stack. | 2013-05-23 |
20130130496 | SEMICONDUCTOR APPARATUS - A method for fabricating a semiconductor apparatus including providing a first silicon substrate having a first contact, wherein providing the first silicon substrate comprises forming a silicide layer between the first silicon substrate and a first metal layer. The method further includes providing a second silicon substrate having a second contact comprising a second metal layer and placing the first contact in contact with the second contact. The method further includes heating the first and second metal layers to form a metallic alloy, whereby the metallic alloy bonds the first contact to the second contact. | 2013-05-23 |
20130130497 | PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE - Provided is a production method for a semiconductor device comprising a metal silicide layer. According to one embodiment of the present invention, the production method for a semiconductor device comprises the steps of: forming an insulating layer on a substrate, on which a polysilicon pattern has been formed, in such a way that the polysilicon pattern is exposed; forming a silicon seed layer on the exposed polysilicon pattern that has been selectively exposed with respect to the insulating layer; forming a metal layer on the substrate on which the silicon seed layer has been formed; and forming a metal silicide layer by carrying out a heat treatment on the substrate on which the metal layer has been formed. | 2013-05-23 |
20130130498 | REDUCING PATTERNING VARIABILITY OF TRENCHES IN METALLIZATION LAYER STACKS WITH A LOW-K MATERIAL BY REDUCING CONTAMINATION OF TRENCH DIELECTRICS - Generally, the present disclosure is related to various techniques that may be used for forming metallization systems in a highly efficient manner by filling via openings and trenches in a common fill process, while reducing negative effects during the patterning of the via opening and the trenches. One illustrative method disclosed herein includes, among other things, forming a via opening in a first dielectric material of a metallization layer of a semiconductor device. Moreover, a second dielectric material is formed above the first dielectric material, wherein the second dielectric material fills the via opening. Furthermore, the method also includes forming a trench in the second dielectric material so as to connect to the via opening, and filling the trench and the via opening with a metal in a common fill process. | 2013-05-23 |
20130130499 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method for removing an Si-based film on a surface of a substrate accommodated in a processing chamber includes a first step in which the Si-based film on the surface of the substrate is transformed into a reaction product by a gas containing a halogen element and an alkaline gas in the processing chamber and a second step in which the reaction product is vaporized in the processing chamber which is depressurized to a pressure lower than a pressure during the first step. The first step and the second step are repeated two or more times. | 2013-05-23 |
20130130500 | COMPOSITION FOR REMOVAL OF NICKEL-PLATINUM ALLOY-BASED METALS - A composition for the removal of nickel-platinum alloy metal, said composition being characterised by including 3-55 mass % of at least one kind selected from the group consisting of hydrochloric acid, hydrobromic acid, and nitric acid, 0.5-20 mass % of a chelating agent other than oxalic acid, 0.1-4 mass % of an anionic surfactant, and water; and also characterised by not including fluorine-containing compounds or hydrogen peroxide, and having a pH of 1 or less. Nickel-platinum alloy metal can be selectively removed without damaging silicon substrate material. | 2013-05-23 |
20130130501 | SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE - The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b).
| 2013-05-23 |
20130130502 | MICROMECHANICAL MEMBRANES AND RELATED STRUCTURES AND METHODS - Micromechanical membranes suitable for formation of mechanical resonating structures are described, as well as methods for making such membranes. The membranes may be formed by forming cavities in a substrate, and in some instances may be oxidized to provide desired mechanical properties. Mechanical resonating structures may be formed from the membrane and oxide structures. | 2013-05-23 |
20130130503 | METHOD FOR FABRICATING ULTRA-FINE NANOWIRE - Disclosed herein is a method for fabricating an ultra-fine nanowire by combining a trimming process and a mask blocking oxidation process. The ultra-thin nanowire is fabricated by a combination of performing a trimming process on a mask to reduce a width of the mask and blocking an oxidation through the mask. A diameter of the floated ultra-thin nanowire fabricated by the method is controlled to 20 nm below by a thickness of a deposited silicon oxide film, a width of the silicon oxide nanowire after trimming, and a time and a temperature for performing a wet oxidation process. Also, since a speed of the wet oxidation process is faster, the width of the nanowire obtained by a conventional photolithography is reduced faster. Moreover, when fabricating an ultra-thin nanowire by using the method, the cost is reduced and it is more feasible to be implemented. | 2013-05-23 |
20130130504 | METHOD OF MANUFACTURING NON-PHOTOSENSITIVE POLYIMIDE PASSIVATION LAYER - A method of manufacturing non-photosensitive polyimide passivation layer is disclosed. The method includes: spin-coating a non-photosensitive polyimide layer over a wafer and baking it; depositing a silicon dioxide thin film thereon; spin-coating a photoresist layer over the silicon dioxide thin film and baking it; exposing and developing the photoresist layer to form a photoresist pattern; etching the silicon dioxide thin film by using the photoresist pattern as a mask; removing the patterned photoresist layer; dry etching the non-photosensitive polyimide layer by using the patterned silicon dioxide thin film as a mask; removing the patterned silicon dioxide thin film; and curing to form a imidized polyimide passivation layer. The method addresses issues of the traditional non-photosensitive polyimide process, including aluminum corrosion by developer, tapered profile of non-photosensitive polyimide layer and generation of photoresist residues. | 2013-05-23 |
20130130505 | Method for the purification of fluorine - Elemental fluorine is often manufactured electrochemically from a solution of KF in hydrogen fluoride and contains varying amounts of entrained electrolyte salt in solid form as impurity. The invention concerns a process for the purification of such impure elemental fluorine by contact with liquid hydrogen fluoride, e.g., in a jet gas scrubber or by bubbling the raw fluorine through liquid hydrogen fluoride. After this purification step, any entrained hydrogen fluoride is removed by adsorption, condensing it out or both. After passing through a filter with very small pores, the purified fluorine is especially suited for the semiconductor industry as etching gas or as chamber cleaning gas in the manufacture of semiconductors, TFTs and solar cells, or for the manufacture of micro-electromechanical systems (“MEMS”). | 2013-05-23 |
20130130506 | SELECTIVE SUPPRESSION OF DRY-ETCH RATE OF MATERIALS CONTAINING BOTH SILICON AND NITROGEN - A method of suppressing the etch rate for exposed silicon-and-nitrogen-containing material on patterned heterogeneous structures is described and includes a two stage remote plasma etch. The etch selectivity of silicon relative to silicon nitride and other silicon-and-nitrogen-containing material is increased using the method. The first stage of the remote plasma etch reacts plasma effluents with the patterned heterogeneous structures to form protective solid by-product on the silicon-and-nitrogen-containing material. The plasma effluents of the first stage are formed from a remote plasma of a combination of precursors, including nitrogen trifluoride and hydrogen (H | 2013-05-23 |
20130130507 | DRY-ETCH FOR SILICON-AND-NITROGEN-CONTAINING FILMS - A method of etching exposed silicon-and-nitrogen-containing material on patterned heterogeneous structures is described and includes a remote plasma etch formed from a fluorine-containing precursor and an oxygen-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the exposed regions of silicon-and-nitrogen-containing material. The plasmas effluents react with the patterned heterogeneous structures to selectively remove silicon-and-nitrogen-containing material from the exposed silicon-and-nitrogen-containing material regions while very slowly removing other exposed materials. The silicon-and-nitrogen-containing material selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region. The ion suppression element reduces or substantially eliminates the number of ionically-charged species that reach the substrate. The methods may be used to selectively remove silicon-and-nitrogen-containing material at more than twenty times the rate of silicon oxide. | 2013-05-23 |
20130130508 | Compositions and Methods for Texturing of Silicon Wafers - Texturing composition for texturing silicon wafers having one or more surfactants. Methods of texturing silicon wafers having the step of wetting said wafer with a texturing composition having one or more surfactants. | 2013-05-23 |
20130130509 | COMBINATORIAL SPOT RASTERING FOR FILM UNIFORMITY AND FILM TUNING IN SPUTTERED FILMS - A substrate clamped to a stage is moved in a rastering motion in a site-isolated deposition chamber. The raster pattern may be a radial pattern, predetermined X-Y pattern, horizontal/vertical pattern or random (free-form) pattern. The chamber includes a sputter source to generate the sputtered material which is delivered through an aperture positioned over the substrate. By moving the substrate in a rastering motion, the sputtered material is deposited more equally and uniformly. | 2013-05-23 |
20130130510 | Semiconductor Substrate Transfer/Processing-tunnel -arrangement, with Successive Semiconductor Substrate - Sections - Semiconductor substrate transfer treatment/processing tunnel-arrangement, containing such means, that thereby also during the uninterrupted operation thereof the uninterruptedly taking place of the establishing of a (sub) micrometer high layer of semiconductor substances with an optimum uniform height thereof upon the successive semiconductor substrate-sections, uninterruptedly displacing therethrough and such by means of through a strip-shaped supply-section of the uppertunnelclock in its central semiconductor section the uninterruptedly taking place of a supply of the combination of fluidic support-medium and parts of a semiconductor substance in a solid- or fluidic form thereof and in the thereupon following strip-shaped semiconductor treatment/processing section underneath a vibrating transducer-arrangement, located in a transducer-compartment of this block, the also by means of the in addition developed heat of this vibrating transducer the taking place of evaporation of this support-medium under an at-least almost uniform deposition of these particles of a semiconductor substance upon these successive semiconductor substrate-sections, displacing underneath, and the discharge of the established vapor through a thereupon following strip-shaped discharge-section in this block. | 2013-05-23 |
20130130511 | Coarse Grid Design Methods and Structures - A layer of a mask material is deposited on a substrate. A beam of energy is scanned across the mask material in a rasterized linear pattern and in accordance with a scan pitch that is based on a pitch of conductive structure segments to be formed on the substrate. The beam of energy is defined to transform the mask material upon which the beam of energy is incident into a removable state. During scanning the beam of energy across the mask material, the beam of energy is turned on at locations where a conductive structure is to be formed on the substrate, and the beam of energy is turned off at locations where a conductive structure is not to be formed on the substrate. | 2013-05-23 |
20130130512 | FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS - A film deposition method including: a step of carrying a substrate into a vacuum chamber, and placing the substrate on a turntable; a step of rotating the turntable; and an adsorption-formation-irradiation step of supplying a first reaction gas to the substrate from a first reaction gas supply part to adsorb the first reaction gas on the substrate; supplying a second reaction gas from a second reaction gas supply part so that the first reaction gas adsorbed on the substrate reacts with the second reaction gas so as to form a reaction product on the substrate; and supplying a hydrogen containing gas to a plasma generation part that is separated from the first reaction gas supply part and the second reaction gas supply part in a circumferential direction of the turntable so as to generate plasma above the turntable and to irradiate the plasma to the reaction product. | 2013-05-23 |
20130130513 | INTERLAYER INSULATING LAYER FORMING METHOD AND SEMICONDUCTOR DEVICE - The interlayer insulating layer forming method for forming an interlayer insulating layer of a semiconductor device via a plasma CVD method includes: carrying a substrate into a depressurized processing container; supplying a plasma generating gas to a first space spaced apart from the substrate; exciting the plasma generating gas in the first space; and supplying a raw material gas including a boron compound that includes at least a hydrogen group or hydrocarbon group, to a second space between the first space and the substrate. Also, a semiconductor device is interconnected in a multilayer through an interlayer insulating layer having an amorphous structure including boron, carbon, and nitrogen, wherein, in the interlayer insulating layer, a hydrocarbon group or an alkyl amino group is mixed in the amorphous structure comprising hexagonal boron nitride and cubic boron nitride. | 2013-05-23 |
20130130514 | CRYSTALLIZATION METHOD OF AMORPHOUS SILICON LAYER - A crystallization method is disclosed. In one embodiment, the method includes providing a substrate having an amorphous silicon layer, wherein the substate has first and second sides opposing each other and irradiating a laser beam onto the substrate so as to have an inclined angle with respect to the first and second sides of the substrate. The method further includes relatively moving one of the laser beam and the substate with respect to the other i) in a first direction from the first side to the second side of the substate and ii) in a second direction which crosses the first direction. | 2013-05-23 |
20130130515 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 2013-05-23 |
20130130516 | MODULAR CONNECTOR FOR A CABLE-LESS PATCHING DEVICE - Embodiments of the present invention are directed to a modular jack or modular connector mountable on a patch panel and having two openings. A first opening may receive a standard modular plug and a second opening may enable access to the resilient part of the conductive contacts inside the jack by a conductive element. The conductive element may electrically connect the connector to a second connector. The connector may be disconnected from the second connector when a communication plug is inserted into the first opening of the connector. | 2013-05-23 |
20130130517 | USB APPLICATION DEVICE AND METHOD FOR ASSEMBLING USB APPLICATION DEVICE - The present invention discloses a USB application device including a body, a circuit board, a pins plate and a plurality of first electrical pins. The plurality of first electrical pins are enclosed previously by the pins plate, and a first end of each one of the plurality of first electrical pins is connected on the circuit board, so that the plurality of first electrical pins pass over a first surface of the circuit board and thus extend in suspension. The circuit board is disposed within the body and the pins plate is combined with the body, so that the plurality of first electrical pins are partly exposed by the body. The present invention also discloses a method for assembling a USB application device, which is capable of simplifying the process of disposing the plurality of first electrical pins on the circuit board. | 2013-05-23 |
20130130518 | Flexible Printed Circuit Connector - The present invention relates to an electrical connector for connecting flexible printed circuit (FPC) boards. The connector has a housing and contact terminals disposed in the housing. An actuator is pivotally attached to the housing. The housing has a pair of retaining members between which a holding portion is defined. An FPC board is inserted into the holding portion and fixed to the housing by the actuator to establish electrical connection with the contact terminals. Each retaining member is supported by a metal bracket which is attached to the housing to increase the holding strength. The metal bracket has a main portion, a fixing portion and a support portion both expending perpendicularly from the main portion. A pair of lugs formed at side edges of the FPC board engage with the retaining members such that back movement of the FPC board from the housing is prevented. | 2013-05-23 |
20130130519 | COUPLING MECHANISM FOR A PCB MOUNTED MICROWAVE RE-ENTRANT RESONANT CAVITY - The microwave signals are coupled from a transmission line embedded in a Printed Circuit Board PCB to a resonant cavity mounted on an external metalized surface of this PCB. The coupling mechanism implements an easy-to-fabricate mechanism leading to high-quality filtering owing to the fact that the end of the transmission line is provided with a metalized feeding pad located at the external layer of the PCB inside the resonant cavity. The resonant cavity is provided with a re-entrant inner stub orthogonal to the PCB and separated from the PCB by a capacitive gap. The metalized feeding pad is facing the inner stub in the area of the capacitive gap and is offset from the axial direction of this inner stub. The metalized feeding pad is further separated from the external metalized surface of the PCB by a surface capacitive gap. | 2013-05-23 |
20130130520 | Connector, PCB for LED Light Bar and LED Light Bar - The present invention discloses a connector, PCB for LED Light Bar and LED Light Bar. The connector comprises the weld legs and stitches fixed to the shell of the connector, and the weld legs are arranged on the side of the connector and are higher than the bottom surface. A PCB for LED light bar is provided with the installing groove for installing the connector. Because the present invention arranges the weld legs of the connector on positions which are higher than the bottom surface of the shell and arranges the installing groove corresponding to the bottom shape of the connector on the PCB, the bottom of the connector can be arranged in the installing groove, thus the protrusion height of the connector in the LED light bar is reduced. The LGP is not cut again when installing the LGP, thereby reducing the processing step. In addition, the depth that the connector sinks into the installing groove is rationally designed, so that the sufficient safe distance is remained when the LGP is heated and expended, thereby avoiding the LGP bumping into and damaging the connector. | 2013-05-23 |
20130130521 | USB FEMALE CONNECTOR - The USB female connector contains an insulating base and a shielding casing enclosing the insulating base. On the insulating base, there is mainly a ground terminal having a flat ground contact section at an end on the insulating base. From the ground contact section, the ground terminal is extended away from the insulating base and forked into a first ground extension section, a second ground extension section, and a third ground extension section. Through the forked first, second, and third ground extension sections, the high-frequency crosstalk problem is effectively resolved. | 2013-05-23 |
20130130522 | ELECTRICAL CONNECTORS | 2013-05-23 |
20130130523 | STRUCTURE OF LIFT COVER CONNECTOR - An improved structure of a lift cover connector includes a base, a cover, a main body, a terminal module and a plurality of positioning members. The cover is rotatably pivoted to one end of the base, and the cover can be opened or closed relative to the base. The terminal module is received in the base, and is inserted and positioned in the main body. The base and the main body are engaged with each other, and the positioning members are inserted in the main body. This design enables the cover to automatically close the base in a normal state by a resilient function of the positioning members, thereby to facilitating reducing product loss and improving the overall yield. | 2013-05-23 |
20130130524 | ELECTRICAL DEVICE WITH A CLAMSHELL ELECTRICAL CONNECTOR - An electrical device includes an upper shell facing a user, a lower shell engaged with the upper shell to commonly define a mounting space, a mother board mounted in the mounting space, a receptacle portion and a rotating cover rotating about the receptacle portion. The upper shell defines a first opening for an insertion of a mating plug. The mother board defines a notch, wherein the receptacle portion is holding conductive terminals therein, the receptacle portion is assembled in the notch of the mother board and between the mother board and the upper shell. Wherein the lower shell defines a second opening, the rotating cover is received in the second opening and a front portion of the rotating cover is actuated in to the first opening of the receptacle portion. | 2013-05-23 |
20130130525 | SOCKET - The present invention relates to a socket for connecting a plug in the external region of a motor vehicle, comprising a socket housing, in which a plug-receiving opening having electric contacts for plugging in a plug and establishing an electric connection is formed, and comprising a cover, which is hinge-mounted on the socket housing and closes the plug-receiving opening in the closed position of the cover and which is preloaded in the closing direction, wherein a hold-closed mechanism that increases the holding force of the cover in the closed position thereof is provided. | 2013-05-23 |
20130130526 | CARD EDGE CONNECTOR - A card edge connector ( | 2013-05-23 |
20130130527 | CARD INSERT/EJECT MECHANISM HAVING A POSITION-LIMITING PLATE ENGAGING A SLIDING BLOCK - The present invention is to provide a card insert/eject mechanism, which includes an insulating seat formed with a receiving space and a track groove; a metal housing covering the receiving space and track groove and having a position-limiting resilient plate at a bottom surface thereof; a sliding block slidable along the track groove and laterally provided with a pushing portion that extends into the receiving space thereby, when an electronic card pushes the pushing portion, the sliding block is moved against rear end of the insulating seat; a resilient element provided in the track groove for applying a force to rear end of the sliding block; and a release bar disposed in the track groove for releasing the position-limiting resilient plate and enabling the sliding block to push the electronic card out of the receiving space, so as to effectively solve the insecure card engagement problem in conventional push-push connectors. | 2013-05-23 |
20130130528 | DUAL-CAM EJECTOR ASSEMBLY - A dual-cam ejector assembly for a card, such as a line card, is provided. The ejector assembly comprises an elongated ejector arm having its distal end coupled to the line card so as to provide a first axis of rotation for the ejector arm. The ejector assembly further comprises an ejector cam coupled to the line card so as to provide a second axis of rotation for the ejector cam. The ejector assembly also comprises a cam pin extending from the ejector cam that couples the ejector cam to the ejector arm such that pivoting of the ejector arm around the first axis of rotation causes the ejector cam to pivot around the second axis of rotation. | 2013-05-23 |
20130130529 | Flexible Sealing Connector - A flexible sealing connector for conveying an electrical signal from a first tool portion to a second tool portion, at least one of the first tool portion and the second tool portion having a receiver with a surface defining a receiver passageway, includes a deformable boot in sealing engagement with the surface of the receiver passageway, the deformable boot having a surface defining a boot passageway. The connector further includes an electrical coupler in sealing engagement with the surface of the boot passageway, the coupler having a first end electrically connected to a first electrical line extending from the first tool portion and a second end electrically connected to a second electrical line extending from the second tool portion whereby the first line and the second line are electrically connected, the receiver passageway is sealed by the boot and the boot passageway is sealed by the coupler. | 2013-05-23 |
20130130530 | Electrical Connector Assembly - An electrical connector assembly including a first connector and a second connector. The first connector includes a socket and the second connector including a sleeve, the socket being adapted to surround the sleeve. A sealing system includes a frontward portion surrounding the sleeve and a rearward portion surrounding a rear housing of the second connector. | 2013-05-23 |
20130130531 | LOCKING MECHANISM AND PLUG DEVICE USING THE SAME - A plug device includes a plug base, a plug detachably mounted on the plug base, and a locking mechanism positioned on the plug base. The plug defines an engaging slot. The locking mechanism includes a latching component mounted on the plug base. When the latching component moves to an unlocking position, the latching component disengages from the engaging slot for allowing the plug being detached from the plug base. When the latching component moves to a locking position, the latching component is capable of being received in the engaging slot for locking the plug to the plug base. | 2013-05-23 |
20130130532 | DOCKING STATION FOR CONNECTOR FOR ELECTRIC VEHICLE CHARGING STATION - A docking station for stowing an electrical connector adapted to connect a power source to a re-chargeable battery in a vehicle powered at least partially by the battery. The connector has a first end connected to a power cable for coupling the connector to the power source, and a second end that includes multiple first electrical terminals adapted to engage mating second electrical terminals in a receptacle. The second end also includes a protruding latching element adapted to engage a cooperating latching element in a receptacle for latching the connector to the receptacle. A stowing receptacle adapted to receive the second end of the connector when the connector is not in use includes an elongated recess adapted to receive the protruding latching element when the protruding latching element is located anywhere along the length of the elongated recess. | 2013-05-23 |
20130130533 | WIRING CONNECTION ASSEMBLY FOR MALE AND FEMALE WIRING CONNETORS - Disclosed are a male wiring connector, a female wiring connector for use with the male wiring connector, and a wiring connector assembly composed of the male wiring connector and the female wiring connector. The male wiring connector includes a main body and two engaging levers. The main body includes wiring terminals and is bilaterally provided with grooved extension seats that extend rearward of, and beyond the rear end of, the main body. Each engaging lever has a first end inserted in the corresponding grooved extension seat and a second end extending forward of and spaced from the main body. Each engaging lever also has an engaging hook between the first and second ends. The male wiring connector can be conveniently connected with and disconnected from the female wiring connector to increase wiring efficiency. | 2013-05-23 |
20130130534 | CONNECTOR - A connector is configured such that parts of the connector bodies will be placed in openings of a substrate and that other parts of the connector bodies, i.e., parts placed on the substrate, will be equal in a height dimension to LEDs placed on the substrate. This makes it possible to reduce the overall thickness of the substrate including the connector bodies. Consequently, the substrate with the connectors mounted thereon can be installed without being restricted by substrate installation space even in a small device, which has a small substrate installation space in a thickness direction of the substrate. | 2013-05-23 |
20130130535 | ELECTRICAL CONNECTOR WITH AN OUTER HOUSING, AN INNER HOUSING AND AN INDICATOR SLEEVE - The invention relates to an electrical connector ( | 2013-05-23 |
20130130536 | CONNECTOR STRUCTURE - A connector structure includes a clamping terminal including a first terminal part and a second terminal part which project from a terminal base, and an insertion space which is formed between the first terminal part and the second terminal part. An insertion member is formed with a fixing slope part, which is inclined with respect to an insertion direction, at a front end part of the insertion member in the insertion direction. A conductor exposed from the circuit body is fixed to the fixing slope part. A connecting protrusion is formed on one of the first terminal part and the second terminal part. The connecting protrusion is formed with a connecting slope part which is inclined in accordance with the fixing slope part. | 2013-05-23 |
20130130537 | TERMINAL STRUCTURES FOR WIRING DEVICES - Terminal structures for wiring devices, such as receptacle assemblies, are disclosed having first and second spring assemblies constructed of a first metal and each having at least one spring finger with the first and second spring assemblies being connected to respective first and second conductive contacts that are constructed of a second metal, wherein the terminal structures are configured for push-in termination of conductive stripped ends of respective first and second wires between the at least one spring finger of the respective first and second spring assemblies and the respective first and second conductive contacts, and wherein the first and second conductive contacts are configured to be connected to respective first and second separate conductive elements. Such a terminal structure is shown for example within a receptacle assembly in the form of a grounding duplex plug outlet or switch. | 2013-05-23 |
20130130538 | INSULATION PIERCING CONNECTOR ASSEMBLIES AND METHODS AND CONNECTIONS INCLUDING SAME - An electrical connector assembly for mechanically and electrically connecting first and second cables each including an elongate electrical conductor covered by an insulation layer includes a housing configured to receive the cables, an electrically conductive bus member in the housing, an electrically conductive first and second blade members in the housing each having an inner end, an outer end and an insulation piercing feature on the outer end. The inner ends are coupled to the bus member and the insulation piercing features each include at least one tooth configured to pierce through the insulation covers of the cables and electrically engage the cable conductor. The bus member provides electrical continuity between the first and second blade members and thereby the conductors of the first and second cables when the conductors are engaged by the insulation piercing feature of the first and second blade members. | 2013-05-23 |
20130130539 | CONNECTOR - A connector has a first housing ( | 2013-05-23 |
20130130540 | WIRING HARNESS FOR CLOTHING, ELECTRONIC DEVICES INCLUDING SUCH A WIRING HARNESS, AND GARMENTS INCORPORATING SUCH A WIRING HARNESS AND ELECTRONIC DEVICE - A wiring harness for clothing, and garments so equipped. The wiring harness is of asymmetrical configuration, and may extend through channels positioned substantially along reinforced portions of the garment. The wiring harness includes a T-junction from which extend a male media connector and two media cables, a first media cable extending along seams of one side of the garment, and a second media cable extending along a neck portion of the garment from the T-junction at one side to another side, both media cables terminating in male media connectors. The male media connector of the T-junction and the male media connector of the second media cable connect to female media connectors of earphone cables, while the male media connector of the first media cable connects to a female media connector of a portable media device, which may be disposed within a pocket of the garment. | 2013-05-23 |
20130130541 | ELECTRICAL SIGNAL CONNECTOR - An electrical connector includes a locknut having an annular locating flange, a core tube for receiving the copper core, inner dielectric insulator and aluminum foil shield of a coaxial cable and supporting the braided metal wrapper and outer plastic sheath of the coaxial cable, a casing surrounding the core tube and having first and second tubular deformable portions and a vertical rear stop edge, and a barrel mounted on the casing between the first tubular deformable portion and the locknut and having a tapered inner surface portion and movable to compress the first and second tubular deformable portions against the coaxial cable and the core tube and an annular front stop edge for stopping a crimping tool used to crimp the casing. | 2013-05-23 |
20130130542 | COAXIAL CABLE CONNECTION MODULE, MULTIPOLE CONNECTOR FOR COAXIAL CABLE, AND MULTIPOLE COMPOSITE CONNECTOR - A coaxial cable connection module including a body; a first signal terminal including a first flat signal contact face; a first ground terminal including a first flat ground contact face; a second signal terminal including a second flat signal contact face; and a second ground terminal including a second flat ground contact face. The first signal contact face and the first ground contact face are arranged, on the first surface of the body, in parallel with each other with a predetermined pitch defined therebetween. The second signal contact face and the second ground contact face are arranged, on the second surface of the body opposite to the first surface, in parallel with each other with the predetermined pitch defined therebetween. The first signal contact face is located opposite to the second ground contact face. The first ground contact face is located opposite to the second signal contact face. | 2013-05-23 |
20130130543 | CONTINUITY CONNECTOR - A male coaxial cable connector includes spring with tines and a fastener wherein the spring is housed by the fastener and distal ends of the spring tines are arranged to provide a spring mouth. | 2013-05-23 |
20130130544 | ELECTRICAL SIGNAL CONNECTOR - An electrical signal connector for assembly with a coaxial cable includes a locknut defining an abutment flange at the front side, an inner tube fastened to the rear side of the locknut opposite to the abutment flange and defining a bearing surface portion for receiving the coaxial cable, a cylindrical casing fastened to the rear side of the locknut around the inner tube and defining a first deformable body portion and a second deformable body portion, a barrel and a torque sleeve attached to the locknut and the cylindrical casing. The barrel defines a front end edge stopped against an inside stop flange of the torque sleeve which can be moved to force a rear inside bearing surface of the barrel over the first deformable body portion and second deformable body portion of the cylindrical casing, thereby tightening up the engagement between the electrical signal connector and the coaxial cable. | 2013-05-23 |
20130130545 | Electrical Signal Connector - An electrical connector for use with coaxial cables includes deformable cylindrical casing and a slidably engaged barrel. | 2013-05-23 |
20130130546 | CABEL END CONNECTOR WITH CONNECTING BAR - A cable end connector includes an insulating housing defining a rear cable-location portion thereof, a plurality of conductive terminals including contacting portions and terminal portions located in the rear cable-location portion, a plurality of cables each having wires and a connecting bar defining a first touching end and a second touching end. The wires of the cable overlap the terminal portions one by one except one wire and one terminal portion. The first touching end overlaps one terminal portion and the second touch end overlaps said one wire so as to establish an electrical connection through the connecting bar between said one terminal portion and one wire. | 2013-05-23 |
20130130547 | ELECTRICAL CONNECTOR CONFIGURED TO SHIELD CABLE-TERMINATION REGIONS - An electrical connector including a dielectric body and electrical contacts held by the dielectric body. The electrical contacts have a pair of signal contacts with respective mating ends configured to engage a communication connector and also with respective wire-terminating ends. The wire-terminating ends are located proximate to each other in a cable-termination region and are configured to mechanically and electrically couple to corresponding signal conductors of a cable. The electrical connector also includes a ground shield having a cover extension that extends over the cable-termination region. The cover extension is configured to shield the cable-termination region. | 2013-05-23 |
20130130548 | CABLE ASSEMBLY WITH NEW ARRANGEMENT OF TERMINALS - A cable assembly comprises a housing, a plurality of terminals received in the housing and divided into several terminal groups and a cable electrically connected with the plurality of terminals. Each terminal group comprises a pair of signal terminals and a grounding terminal. Each terminal defines a body portion, a mating portion extending forwardly from a front end of the body portion, and a terminating portion extending rearwardly from a rear end of the body portion. The two mating portions of the pair of signal terminals and a mating portion of the grounding terminal of each terminal group are located on two different rows, and two terminating portions of the pair of signal terminals and a terminating portion of the grounding terminal of each terminal group are located on a same row. | 2013-05-23 |
20130130549 | CABLE ASSEMBLY WITH NEW ARRANGEMENT OF TERMINALS - A cable assembly comprises a housing defining a receiving space; a spacer assembled to a rear end of the housing; a plurality of terminals integrated with the spacer, and arranged into two rows and received into the housing. And each row of terminals comprises at least two grounding terminals and a connecting piece connecting with rear ends of at least two grounding terminals. A metallic plate is received into the spacer and contacted to the connecting piece. And a cable is electrically connected with the plurality of terminals. | 2013-05-23 |
20130130550 | CONNECTOR SHIELD WAFER HAVING IMPROVED PIN CONDUCTOR - This invention relates generally to an electrical connector assembly for interconnecting printed circuit boards. More specifically, this invention relates to a high speed, high density electrical connector and connector assembly having wafers with an improved pin conductor. The connector contains a shield plate having at least one contact end that is bent in a direction perpendicular to the plane of the shield plate. | 2013-05-23 |
20130130551 | Blade and Housing Assembly - The invention provides an improved method of routing power from a power source such as an AC power source directly to a printed circuit board and then to an appliance that interfaces with one or more appliance claws that are connected directly or indirectly to the circuit board. Various embodiments offer superior durability, manufacturability, and cost-effectiveness. They may also decrease the dimensions, cost, and complexity of a robust assembly. | 2013-05-23 |
20130130552 | BATTERY ADAPTER - A battery adapter can include a plurality of machine-side-connecting sections capable of being connected to a plurality of battery-connecting ports provided on an electric machine, and a battery-side-connecting section(s) to which a battery or batteries can be connected. The number of the machine-side-connecting sections is preferably configured to be larger than the number of the battery-side-connecting section(s). Further, the electric machine is preferably connected to the machine-side-connecting sections of the battery adapter through its battery-connecting ports. The electric machine can be driven by the battery or batteries connected to the battery-side-connecting section(s) of the battery adapter. | 2013-05-23 |
20130130553 | ELECTRICAL CONNECTOR MOUNTING SYSTEM - A flexible connector system that includes a multi-terminal conductor, a housing that at least partially houses the multi-terminal conductor, a base member and complementary connection elements for connecting the housing and the base member. | 2013-05-23 |
20130130554 | ELECTRICAL CONNECTOR HAVING IMPEDANCE MATCHED INTERMEDIATE CONNECTION POINTS - An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector. | 2013-05-23 |
20130130555 | ELECTRICAL CONNECTOR AND CONNECTOR - There is provided an electrical connector including; a first connector having a first housing, a second connector which is mated with the first connector to be electrically connected thereto, a plurality of first connector terminals which are attached to the first housing, a plurality of through-holes which are formed in the first housing so as to be arranged in a predetermined direction and into which the first connector terminals are inserted; and a recess formed adjacently to the through-holes in the first housing. Accordingly, appearance of crack is suppressed even after the contact terminals are pressed-in by suppressing appearance of weld lines in the vicinity of through-holes. | 2013-05-23 |
20130130556 | HIGH-CURRENT PLUG-IN CONNECTOR - A high-current plug-in connector for transmitting electrical currents, having a housing made of electrically conducting material, designed to mechanically and electrically connect to a cable, the housing having at least one open side for inserting a mating plug-in connector made of an electrically conducting material, and forming a chamber for accommodating the mating plug-in connector, and at least one contact element, which is arranged on the housing and designed so that the contact element establishes an electrical contact having a contact area and a contact pressure between the housing and the mating plug-in connector inserted into the housing, wherein the contact element is designed as a coil spring. | 2013-05-23 |
20130130557 | TERMINAL CONNECTION STRUCTURE - A terminal connection structure which enables miniaturization and reliable connection of terminal fittings to each other is provided. A terminal connection structure | 2013-05-23 |
20130130558 | HIGH FREQUENCY ADAPTER - A high frequency adapter electrically connecting a docking device to a circuit board. The high frequency adapter includes an insulating body, a high frequency signal terminal conductively connected to the circuit board, and two grounding terminals located at two sides of the high frequency signal terminal and conductively connected to the circuit board. Lateral projections of the high frequency signal terminal and the two grounding terminals are approximately the same and overlapping. Both the high frequency signal terminal and the two grounding terminals are pressed by the docking device. | 2013-05-23 |
20130130559 | CONNECTOR ASSEMBLY - A connector assembly includes a plurality of connectors with a wire connecting rear ends of the connectors, and a frame receiving the connectors. The frame is made of insulated material. The frame has edges each defining a round corner to avoid harming the wire. | 2013-05-23 |
20130130560 | Compensation Network Using an Orthogonal Compensation Network - In one embodiment, the present invention is a communication connector, comprising a compensation circuit for providing a compensating signal to approximately cancel an offending signal over a range of frequency, the compensation circuit including a capacitive coupling with a first magnitude growing at a first rate over the range of frequency and a mutual inductive coupling with a second magnitude growing at a second rate over the range of frequency, the second rate being greater than the first rate (e.g., the second rate approximately double the first rate). | 2013-05-23 |
20130130561 | MODULAR JACK WITH ENHANCED SHIELDING - An electrical connector includes a dielectric housing having a mating face, a plurality of openings therein configured as pairs of aligned openings and a receptacle for receiving a plurality of internal modules therein. A plurality of electrically conductive contacts are positioned within the housing with a portion of each contact extending into one of the openings for engaging contacts of a mateable connector. At least one conductive inter-module shield is located within the receptacle and extends generally towards the mating face to define a plurality of module receiving cavities. | 2013-05-23 |
20130130562 | CONNECTOR - To obtain a connector capable of efficiently enhancing a shear strength to increase a holding force against a reduction in a lance holding force which is caused by a decrease in a size. | 2013-05-23 |
20130130563 | Electrically Conducting Screw Connection And Special Screw For Such A Screw Connection - The invention relates to an electrically conducting screw connection between two parts ( | 2013-05-23 |
20130130564 | CRIMPED TERMINAL - A conductor crimp portion (11) before being crimped to a conductor (Wa) of an electric wire includes, in an inner surface (11R) of the conductor crimp portion (11), circular recesses (20) as serrations of the conductor crimp portion (11) scattered to be spaced from each other. At an inner periphery corner portion where an inner bottom surface (20A) and an inner periphery side surface (20B) of each of the recesses (20) intersect with each other, a roundness portion (20C) for connecting the inner bottom surface (20A) with the inner periphery side surface (20B) by a smooth continuous curved surface are provided. | 2013-05-23 |
20130130565 | CRIMP-STYLE TERMINAL - A crimp-style terminal ( | 2013-05-23 |
20130130566 | CRIMP TERMINAL - A crimp terminal ( | 2013-05-23 |
20130130567 | CRIMPED TERMINAL - In a crimp terminal ( | 2013-05-23 |
20130130568 | CRIMP TERMINAL - A conductor crimp portion ( | 2013-05-23 |
20130130569 | STRUCTURE FOR CONNECTING ELECTRIC WIRE TO CRIMP TERMINAL - The present invention is intended for pursuing cost cutting by making an exposed conductor of an electric wire smaller through use of a cover and enhancing electric connectivity between a crimp terminal and an electric wire. A metallic cover ( | 2013-05-23 |
20130130570 | CRIMP TERMINAL - Disclosed is a crimp terminal ( | 2013-05-23 |
20130130571 | LOW-PROFILE CONNECTION SYSTEM - A high-voltage electric machine has one or more terminals at which wires are to be electrically connected to the machine. The machine's housing includes a cable entrance leading to the terminal(s) through which the wire is inserted. Access holes through the housing enable a technician to reach the terminals (for example, with a tool, such as a screwdriver) to connect each wire to a terminal. In some embodiments, the direction of the access through the hole to the terminal is substantially perpendicular to the direction from which the wire reaches the terminal. A plug may be inserted into each access hole to prevent accidental contact with the terminal(s), such as screw-type or friction-fit plugs. | 2013-05-23 |
20130130572 | ELECTRICALLY CONDUCTIVE CONNECTING MEMBER, PRODUCTION METHOD FOR THE ELECTRICALLY CONDUCTIVE CONNECTING MEMBER, AND BATTERY EQUIPPED WITH THE ELECTRICALLY CONDUCTIVE CONNECTING MEMBER AS ELECTRODE - An electrically conductive connecting member which can be used for a battery having a positive output terminal and a negative output terminal composed of different metals from each other and which does not undergo electrolytic corrosion and reduction in electric resistance and has excellent mechanical strength. This electrically conductive connecting member is used for a battery in which a pair of output terminals are composed of different metals from each other, and includes an electrode section (a bar-shaped section) connected to one of the output terminals and composed of the same metal as that used for one of the output terminals and a bus bar section (a band-plate-shaped section) connected to the electrode section and composed of the same metal as that used for the other output terminal, wherein the electrode section and the bus bar section are integrated with each other through diffusion bonding. | 2013-05-23 |
20130130573 | OUTBOARD MOTOR - In an outboard motor having a prime mover, a gear mechanism transmitting a driving force of the prime mover to a propeller, and a gear case housing the gear mechanism, it is configured to have a drain bolt fastened to a drain hole bored at the gear case and constituted as a magnetic member; a stacked portion provided at an exposed part of the drain bolt in an inside of the gear case and having a conductor, an insulator and a resistive element partially making contact with the conductor that are stacked in a gravitational direction; a current detector detecting a current value conducted from the conductor to the drain bolt under a condition where voltage is applied to the conductor; and a wear debris amount detector adapted to detect an amount of wear debris of the gear mechanism deposited at the drain bolt based on the conducted current value. | 2013-05-23 |
20130130574 | DRIVE MEANS FOR AMPHIBIOUS EQUIPMENT - Amphibious construction equipment comprising a working unit supported on a pair of elongate, parallel, buoyant pontoons ( | 2013-05-23 |
20130130575 | AMPHIBIAN - An amphibious motorcycle with a hull that provides desirable buoyancy for the vehicle to float while in the water and yet allows the vehicle to lean/turn during use on land is provided. The amphibious motorcycle has a front wheel with a front suspension system and a rear wheel with a rear suspension system. Also included can be at least one wheel retraction system that is operable to move the front wheel and/or the rear wheel between a deployed position for use of the amphibious motorcycle on land and a retracted position for use of the amphibious motorcycle on or in the water. The amphibious motorcycle also has a hull that can have a center portion with a center bow and two oppositely disposed and spaced apart side portions each with a side bow. | 2013-05-23 |
20130130576 | ENGINE, OUTBOARD MOTOR, AND WATERCRAFT - An engine includes a cylinder block including a plurality of cylinders, an exhaust manifold, and an exhaust pipe. The exhaust manifold includes a first passage and a second passage. The first passage includes a plurality of first inflow ports into which exhaust gases flow from the plurality of cylinders, a first collecting portion that collects exhaust gases that have flowed into the plurality of first inflow ports, and a first exhaust port through which exhaust gases collected by the first collecting portion are discharged. The second passage includes a second inflow port into which exhaust gases flow and a second exhaust port through which exhaust gases that have flowed into the second inflow port are discharged. The exhaust pipe includes a connection passage through which the first exhaust port and the second inflow port are connected together. | 2013-05-23 |
20130130577 | ENGINE, OUTBOARD MOTOR, AND WATERCRAFT - An engine includes a cylinder block including a plurality of cylinders disposed along a V-shaped line, a pair of exhaust manifolds disposed inside the V-shaped line, and an exhaust pipe disposed inside the V-shaped line. Each of the pair of exhaust manifolds includes a first passage that includes a plurality of inflow ports into which exhaust gases from the cylinders flow, a collecting portion at which exhaust gases are collected, and an exhaust port from which exhaust gases are discharged. The exhaust pipe includes a connection passage that includes a pair of intermediate inflow ports that are connected to the exhaust ports, at least one intermediate exhaust port from which exhaust gases are discharged. The connection passage is arranged to connect the pair of intermediate inflow ports and the at least one intermediate exhaust port. | 2013-05-23 |
20130130578 | Self-cleansing retractable handle assembly for water craft - A concealably retractable handle is ensconced into the core or hull of a recreational or utilitarian floatation structure such as a canoe, kayak, surfboard, sailboard, paddle board or the like, where it lies below the outer surface without interfering with normal use of the structure. The handle can be conveniently extracted and secured in an operational position to facilitate handling and carrying the structure or securing it the a vehicle. The housing of the handle is bonded into the body of the floatation device through a padding sleeve which absorbs stress forces that could damage the solidity of the bond and the integrity of the whole structure. During handle retraction structures encourage agitation of water located inside the housing to facilitate water and debris evacuation. | 2013-05-23 |
20130130579 | SURFBOARD LEASH - A surfboard leash is provided including a first end configured to be mounted to a surfboard and a second end including a cuff to releasably couple the leash to a user (e.g., a surfer) of the surfboard. The cuff may include a board attachment structure for releasably coupling the cuff directly to the surfboard, for example for storage and/or transport of the surfboard. For example, the board attachment structure may include one or more suction cups disposed on an outer surface of the cuff. | 2013-05-23 |
20130130580 | Hand-held portable and inflatable Personal flotation device - This stick type portable inflatable personal floating device is designed to help a victim escape from under the water quickly or to keep him/her at the surface of the water easily until rescuers come. This device is designed by minimizing size to maximize portability. Thus, because of the small size, it can save a lot of space to store and enable to give a lot of freedom for those who carry it. All of the structures and parts are designed to be simplified and hand-worked for minimizing the possibility of malfunction in use. The usage is also simple and can be earned intuitively. Because of the minimal size, it can be stored even in a small vehicle such as a boat or car. And, because of the light weight, it can be stored in airplane as a lifesaver. And, a diver can carry it conveniently when diving because of the compact size. | 2013-05-23 |
20130130581 | THERMOPLASTIC POLYOLEFIN MEMBRANE WITH ENHANCED THERMAL RESISTANCE - Disclosed herein are thermoplastic olefin (TPO) membranes with enhanced thermal resistance. In an embodiment, the disclosed may include a cap layer, a core layer, and a scrim layer disposed therebetween. The cap layer may be formulated with TPO resins and a UV stabilizer package comprising ultrafine TiO | 2013-05-23 |
20130130582 | MODIFIED UREA-FORMALDEHYDE BINDERS FOR NON-WOVEN FIBER GLASS MATS - Urea-formaldehyde (UF) resin binder compositions modified with a starch are described. The binder compositions may include about 1 wt. % to about 10 wt. % of a starch. In addition, fiber reinforced composites are described. The composites may include organic or inorganic fibers and a polymer matrix formed from a binder composition. The binder composition may include a UF resin and about 1 wt. % to about 10 wt. % of a starch. | 2013-05-23 |
20130130583 | METHOD FOR PRODUCING A COMPOSITE MATERIAL - A method includes a step of bringing a plastic matrix substance in contact with a reinforcement fiber structure to form an intermediate material. Further, the method includes a step of curing the matrix substance of the intermediate material to form a composite material. Before the plastic matrix substance is brought into contact with the reinforcement fiber structure, it is mixed with a diluent to form a mixture. | 2013-05-23 |
20130130584 | PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND PROCESS FOR PRODUCING PREPREG - There is provided a prepreg which contains components (A) to (C) as mentioned below, wherein the component (A) is arranged on one surface or both surfaces of a layer comprising the components (B) and (C): (A) a nonwoven fabric comprising a thermoplastic elastomer and/or a polyolefin each of which has a value of tan θ of 0.06 or more at 10° C. as measured in a viscoelasticity measurement and is incompatible with the component (B); (B) a first epoxy resin composition; and (C) a reinforcing fiber. There are also provided a fiber-reinforced composite material which has excellent rigidity, strength, and vibration-damping performance, a prepreg which can be used suitably for the production of the fiber-reinforced composite material, and a process for producing the prepreg. | 2013-05-23 |