19th week of 2011 patent applcation highlights part 26 |
Patent application number | Title | Published |
20110109992 | METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM, MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING AND REPRODUCING APPARATUS - The present invention relates to a method for manufacturing a magnetic recording medium having magnetically separated magnetic recording patterns, such a magnetic recording medium, and a magnetic recording and reproducing apparatus. | 2011-05-12 |
20110109993 | PERPENDICULAR MAGNETIC RECORDING WRITE HEAD WITH ENHANCEMENT CAPACITOR ON SLIDER BODY FOR WRITE CURRENT OVERSHOOT AT WRITE CURRENT SWITCHING - Write enhancement circuitry on the head carrier of a magnetic recording disk drive provides additional write current overshoot beyond that provided by the write driver circuitry. An enhancement capacitor is formed with a dielectric layer between two layers of electrically-conductive magnetically-permeable shield material that serve as the capacitor plates. The write enhancement circuitry may also include an enhancement resistor. The enhancement capacitor and resistor are connected between the two terminals on the head carrier that connect to the write head coil. The capacitor and resistor are fabricated on the head carrier at the same time and in the same process as the read head. The first and second capacitor plates are generally coplanar with and formed of the same electrically-conductive magnetically-permeable material that forms the first and second magnetic shields for the read head. The enhancement resistor is a stack of layers that is coplanar with and formed of the same materials as the stack of layers that form the sensor portion of the read head between the two magnetic shields. | 2011-05-12 |
20110109994 | SUBSTRATE FOR MAGNETIC DISK AND MAGNETIC DISK - The shape and number of surface defects are controlled so that the occurrence of failure is suppressed in an HDD device in which a magnetic head with a very small flying height, such as a DFH head, is mounted. | 2011-05-12 |
20110109995 | BEARING LUBRICANT, BEARING AND DISK DRIVE DEVICE - A bearing lubricant includes a base oil containing an ester compound consisting of 2-ethyl-2-methyl-1,3-propanediol and at least one of carboxylic acids having 5 to 12 carbon atoms, the ester compound being represented by the following formula (1), in which the base oil has a kinetic viscosity at approximately 40° C. of approximately 7 to 15 mPa, and has a pour point of approximately −60° C. or less: | 2011-05-12 |
20110109996 | MANUFACTURING METHOD FOR A HEAD-STACK ASSEMBLY, APPARATUS FOR INTERCONNECTION OF THE HEAD-STACK ASSEMBLY, AND HEAD-STACK ASSEMBLY - A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining. | 2011-05-12 |
20110109997 | DISK DRIVE INCLUDING A LATCH CONFIGURED TO LOCK AN ACTUATOR IN RESPONSE TO AN EXTERNAL FORCE - A disk drive. The disk drive includes: a head for accessing a data recording area of a disk; an actuator for pivoting to move the head; a voice coil motor; and, a latch configured to lock the actuator from pivoting toward the data recording area in response to an external force. The voice-coil motor includes a voice coil, a magnet, and a yoke. The latch is positioned at a closed position when the actuator is positioned at a stand-by position, and is configured to pivot by application of a magnetic bias force with pivoting of the actuator from the stand-by position into proximity with the data recording area such that the latch is configured to stop at an open position. The yoke includes a protrusion which protrudes toward the magnetic body at the open position. | 2011-05-12 |
20110109998 | RECORDING HEAD WITH TILTED ORIENTATION - In one embodiment, a read sensor for a recording head for a magnetic media storage system, has first and second shields, and a magneto-resistive sensor disposed between and shielded by the first and second shields in which the sensing axis of the sensor is tilted with respect to the recording surface of the head. In one embodiment, the sensing axis is oriented at an angle between 10 and 60 degrees with respect to the normal of the recording surface. Other embodiments are described and claimed. | 2011-05-12 |
20110109999 | MAGNETIC SHIELD STRUCTURE - An apparatus and associated method for a magnetic shield structure for data transduction from a recordable media in a data storage device. Various embodiments of the present invention are generally directed to a data transducer and a magnetic shield structure comprising a write shield magnetic material constructed of exchange decoupled material. | 2011-05-12 |
20110110000 | Power System Having Voltage-Based Monitoring for Over Current Protection - A power control system reduces power losses by utilizing an over current protection method that detects an over current event based on a power utilization factor P | 2011-05-12 |
20110110001 | MOTOR OVERLOAD PROTECTING DEVICE, MOTOR START DEVICE, BACKUP PROTECTING ELEMENT AND PROCESS FOR OBTAINING A BACKUP PROTECTING ELEMENT - The present invention refers to an electric overload protecting device ( | 2011-05-12 |
20110110002 | ELECTRIC POWER SUPPLY DEVICE - An electric power supply device capable of miniaturizing an FET and wiring and reducing the amount of heat generation even when a motor load goes into a lock state is provided. It is determined whether or not a lock current flows in a motor M | 2011-05-12 |
20110110003 | WIRING DEVICE HAVING LEAKAGE DETECTION FUNCTION - In a wiring device which detects a leakage current in an electrical path connecting a commercial power supply and a load to interrupt the electrical path, the electrical leakage can reliably be interrupted even when the leakage current has a distorted waveform. A wiring device ( | 2011-05-12 |
20110110004 | Circuit Arrangement for Protection from Electrostatic Discharges and Method for Operating Same - A circuit arrangement for protection against electrostatic discharges has a diverting structure (ESD | 2011-05-12 |
20110110005 | FAULT PROTECTOR FOR OPTO-ELECTRONIC DEVICES AND ASSOCIATED METHODS - A fault protector for an opto-electronic device includes a MOSFET having an integral body-diode. A capacitor is connected between a drain and a gate of the MOSFET, and a resistor is connected between the gate and a source of the MOSFET. The drain of the MOSFET is connectable to a first terminal of an opto-electronic device, and the source of the MOSFET is connectable to a second terminal of the opto-electronic device. The device overcomes problems of previously known techniques by preventing a reverse-bias voltage from exceeding an absolute maximum specified by a manufacturer, and also prevents ESD or other power-related faults from exceeding the maximum forward-bias voltage of the laser diode, while not adding significant resistance or capacitance to the laser diode, thereby not complicating the task of driving the laser diode. | 2011-05-12 |
20110110006 | METHOD FOR SELECTIVELY TRIGGERING CIRCUIT BREAKERS IN THE EVENT OF A SHORT CIRCUIT - A method is disclosed for selectively triggering circuit breakers in the event of a short circuit, wherein an upstream circuit breaker and at least one downstream circuit breaker on the output side are provided. In at least one embodiment, the upstream circuit breaker monitors as to whether the or one of the downstream circuit breakers is already in the process of opening the switch contacts thereof to interrupt the circuit on the output side, while forming a switch arc. In order to reliably determine whether a downstream circuit breaker is already in the process of opening, according to at least one embodiment of the invention the upstream circuit breaker, so as to detect a switch arc on the output side, checks whether the ohmic resistance of the short circuit loop produced by a short circuit has an exponential curve over time in that an exponent is continually computed and based on the computer exponent the switch arc is determined if the computed exponent exceeds a threshold. | 2011-05-12 |
20110110007 | LATCH-CONTROL PROTECTION CIRCUIT - A latch-control protection circuit applied in a power converter is provided. The protection circuit has a comparing circuit unit and a logic gate. The comparing circuit unit is utilized to selectively output a default signal or a comparing signal according to a state signal from the logic gate, wherein the default signal is utilized for latching the state signal and the comparing signal is corresponded to the power condition of the power converter. The logic gate generates the state signal according to the output signal of the comparing circuit unit and a system judging signal. The output signal may be the default signal or the comparing signal. The system judging signal indicates the condition of the power converter. | 2011-05-12 |
20110110008 | OVER CURRENT PROTECTION CIRCUIT - An over current protection circuit controls connection and disconnection of an electronic device. When the electronic device is turned off because of over current, the over current protection circuit automatically resets the electronic device after a delay time. | 2011-05-12 |
20110110009 | SWITCH CIRCUIT HAVING OVERCURRENT DETECTION FUNCTION - A first overcurrent detecting circuit outputs a first time-up signal when a time period, in which an electric current flowing into the wire harness is greater than the first threshold, reaches a first duration time, which corresponds to a first threshold. A second overcurrent detecting circuit outputs a second time-up signal when a time period, in which an electric current flowing into the wire harness is greater than the second threshold, reaches a second duration time, which corresponds to a second threshold. The second threshold is less than the first threshold. The second duration time is longer than the first duration time. A determination circuit determines that an overcurrent flows into the wire harness and cause a control circuit to deactivate the switching element when inputting at least one of the first and second time-up signals. | 2011-05-12 |
20110110010 | WALL CRAWLING ROBOTS - Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion voltage, which is applied using electrodes in an electroadhesive device. The electrostatic adhesion voltage produces an electric field and electrostatic adherence forces. When the electroadhesive device and electrodes are positioned near a surface of an object such as a vertical wall, the electrostatic adherence forces hold the electroadhesive device in position relative to the surface and object. This can be used to increase traction or maintain the position of the electroadhesive device relative to a surface. Electric control of the electrostatic adhesion voltage permits the adhesion to be controllably and readily turned on and off. | 2011-05-12 |
20110110011 | Clock-Pulsed Safety Switch - Embodiments related to operating a high-side switch in a safety-related application are described and depicted. | 2011-05-12 |
20110110012 | BIPOLAR LAYERED TYPE ELECTRIC DOUBLE LAYER CAPACITOR - There is provided a bipolar layered type electric double layer capacitor capable of suppressing upsizing of the capacitor unit and enhancing sealability of adjacent capacitor cells. The present invention relates to a bipolar layered type electric double layer capacitor including a multi-layered type body comprising a plurality of capacitor cells | 2011-05-12 |
20110110013 | STACKED ELECTRIC DOUBLE LAYER CAPACITOR - A stacked electric double layer capacitor includes a capacitor unit, an aluminum laminate film, and a current collector terminal. The capacitor unit includes a pressure plate, and a current collector plate arranged inside the pressure plate. The aluminum laminate film wraps the capacitor unit, and includes a periphery that defines and surrounds a hole at a side surface of the capacitor unit. The current collector terminal is L-shaped, and includes a contact portion in contact with the current collector plate, and a terminal portion arranged perpendicular to the contact portion, wherein at least a part of the terminal portion is exposed through the hole of the aluminum laminate film, and connected to an external circuit, and the terminal portion is heat-welded to the aluminum laminate film. | 2011-05-12 |
20110110014 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40° C./second or more. | 2011-05-12 |
20110110015 | Methods to improve the efficiency and reduce the energy losses in high energy density capacitor films and articles comprising the same - A multilayer film useful for capacitive applications comprises a high energy density layer and a dielectric blocking layer. In some embodiments, a conducting film is located between the high energy density layer and the blocking layer. The high energy density layer may be a fluoropolymer, such as a polymer or copolymer of poly-1,1-difluoroethene or a derivative thereof. The multilayer film may have high energy density (for example,. >8 J/cm | 2011-05-12 |
20110110016 | THIN-FILM CAPACITOR - A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part. | 2011-05-12 |
20110110017 | HEXAGONAL TYPE BARIUM TITANATE POWDER, PRODUCING METHOD THEREOF, DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT - Dielectric ceramic composition includes a hexagonal type barium titanate as a main component shown by a generic formula of (Ba | 2011-05-12 |
20110110018 | HEXAGONAL TYPE BARIUM TITANATE POWDER, PRODUCING METHOD THEREOF, DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT - Dielectric ceramic composition includes a hexagonal type barium titanate as a main component shown by a generic formula (Ba | 2011-05-12 |
20110110019 | Composition Of Electrode Material In The Form Of A Coating And A Process Theeof - The present invention is in relation to a composition of electrode material in the form of a coating, said composition represented by formula Mn | 2011-05-12 |
20110110020 | Water-Based Electrolyte for Electric Double Layer Capacitor and Electric Double Layer Capacitor having the Same - Disclosed herein is a water-based electrolyte for an electric double layer capacitor. The water-based electrolyte includes a solution having a first salt and a second salt. The cation of the first salt may be Li | 2011-05-12 |
20110110021 | Modularly Constructed Converter Arrangement - A converter arrangement comprising a switchgear cabinet for a plurality of converter assemblies forming respective main modules and each consisting of submodules, formed as a switching module and a capacitor module. The switchgear cabinet has connection devices for electrical connection of the converter assemblies and also, for each converter assembly, a rail system for the mechanical arrangement thereof. The capacitor module has a DC voltage contact device for electrical connection to the assigned switching module, and also sliding elements. The switching module has a cooling device, power semiconductor modules and also dedicated sliding elements. The sliding elements of the submodules are arranged in a stacked manner in the same rails of the rail system of the switchgear cabinet. | 2011-05-12 |
20110110022 | PORTABLE TERMINAL DEVICE WITH WATERPROOF STRUCTURE - A portable terminal apparatus for implementing a sure waterproof function with small components and a small number of components is provided. | 2011-05-12 |
20110110023 | THERMOSTAT WITH INTERCHANGEABLE INSERT - A thermostat includes a housing having a generally rectangular frame-shaped surface that extends around a display device, and first and second side walls on opposing sides of the housing. The first and second side walls of the housing each include at least one recessed notch therein. The various thermostat embodiments further include a colored insert having a generally rectangular frame-shaped configuration, which matches the generally rectangular frame-shaped surface of the housing. The colored insert is disposed over the housing so as to substantially cover the generally rectangular frame-shaped surface of the housing. The various thermostat embodiments further include a single translucent faceplate having an aperture therein, a generally rectangular frame-shaped surface extending around the aperture, and first and second side walls on opposing sides of the single translucent faceplate that include at least one engaging clip configured to engage the recessed notches in the housing. | 2011-05-12 |
20110110024 | COMPUTER SYSTEM - A computer system includes a motherboard, a power supply unit, an interconnect card, and a chassis. The motherboard includes a power connector capable of transmitting power to the motherboard. The power supply unit includes a power supply unit connector. The interconnect card includes a first connector and a second connector. The power supply unit and the motherboard are mounted in the chassis. The first connector is connected with the power supply unit connector, and the second connector connected with the power connector. | 2011-05-12 |
20110110025 | HOST COMPUTER ATTACHED TO MONITOR - A computer includes a monitor and a host computer coupled to a monitor. The monitor includes a back cover and a plurality of sides extending forwards form the back cover. The host computer includes a computer enclosure and a plurality electronic element. The computer enclosure includes a bottom board and a plurality of sideboard extending forward from the bottom board to abut against the plurality of sides of the monitor. A receiving space is formed between the back cover of the monitor and the bottom board of the computer enclosure. The number of electronic elements are received in the receiving space and mounted on the bottom board of the computer enclosure. | 2011-05-12 |
20110110026 | Wall Mounted Modular Workstation System and Method - A wall mounted modular workstation system utilizes individually mountable modules, such as a keyboard/monitor module, a CPU module, and a medical supply module, that may be each be selectively positioned, mounted, rearranged, used or not used, and/or added or removed at a later time. The individually mountable modules are formed with mountings and vertically located openings for electrical lines and module to module ventilation, which reduce/prevent creation of dust during mounting or later modification of the system. | 2011-05-12 |
20110110027 | Rotation Angle Limitation Device and Portable Electronic Device Having The Same - A rotation angle limitation device is used for a portable electronic device. The rotation angle limitation device comprises a base comprising a placed portion and at least one positioning portion; a driven element connected to the placed portion capable of being rotated relative to the base, the driven element having a first position and a second position, and the driven element is secured by the positioning portion when the driven element is in the second position; an elastic element is disposed between the placed portion and the driven element; a first rotation shaft is pivotally connected to the placed portion; the first rotation shaft is capable of rotating along a first direction, and the first rotation shaft and the driven element move simultaneously; a second rotation shaft is pivotally connected to the first rotation shaft; the second rotation shaft is capable of rotating along a second direction; at least one cam is connected to the second rotation shaft, and at least one cam and the second rotation shaft move simultaneously, each cam comprising a first protruding portion and a concave arc which is adjacent to the first protruding portion. | 2011-05-12 |
20110110028 | COMPUTER SYSTEM WITH FRAME FOR DISK DRIVE - A computer system includes a chassis and a frame. The chassis includes a chassis bottom wall, a first chassis sidewall connected to the chassis bottom wall, and a second chassis sidewall connected to the chassis bottom wall. The frame includes a mounting bracket and a retaining bracket. The mounting bracket is secured to at least one of the chassis bottom wall and the first and second chassis sidewalls. The mounting bracket defines a through opening configured for to have a disk drive inserted through the opening. The retaining bracket defines a holding space configured for receiving the disk drive. The through opening is in communication with the holding space. The mounting bracket includes a mounting bracket top wall. The retaining bracket includes a retaining bracket top wall. The retaining bracket top wall extends from the mounting bracket top wall. | 2011-05-12 |
20110110029 | Dedicated Air Inlets And Outlets For Computer Chassis Chambers - A computer chassis comprises a plurality of chambers. Each of the chambers comprises a hardware group, an aft inlet exposed to air external to the chassis and dedicated to the chamber, and an air outlet exposed to air external to the chassis and dedicated to the chamber. Airflow between the air net and the air outlet cools the hardware group. | 2011-05-12 |
20110110030 | COMPUTER SYSTEM WITH HEAT SINK - A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are located on the motherboard and adjoin two opposite edges of the opening. Each positioning post defines a fastener hole. A heat sink includes a main body and a fin portion located on the fin portion. The main body defines two through holes. The fin portion defines two recesses to expose the through holes. The heat sink is secured to the securing component, by two fasteners engaged in the through holes and the fastener holes. | 2011-05-12 |
20110110031 | Apparatuses And Methods For Dissipating Heat From A Computer Component - Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component. | 2011-05-12 |
20110110032 | BRACKET ASSEMBLY - A bracket assembly is used for an expansion card. The bracket assembly includes a panel and a handle. The panel includes a top edge. The handle is attached to a side of the panel. The handle is capable of pivoting about a pivot axis perpendicular to the panel. The handle includes a lifting arm, a blocking arm, and a connecting arm. The lifting arm, the blocking arm and the connecting arm are connected end to end. An opening is defined by the lifting arm, the blocking arm and the connecting arm. The handle is capable of being rotated between a first position where the handle is urged to reside under the top edge of the panel and a second position where the opening extend above the top edge of the panel. | 2011-05-12 |
20110110033 | MOUNTING APPARATUS FOR PCI CARD - A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion. | 2011-05-12 |
20110110034 | FASTENER FOR SECURING COMPUTER STORAGE DEVICE - A fastener for securing computer storage devices is revealed. The fastener is arranged at a storage device of computers. The fastener for securing computer storage devices consists of a first fix member, a second fix member and a connection part. The first fix member and the second fix member respectively are disposed on two sides of the storage device. The first fix member as well as the second fix member respectively has at least one first groove and at least one second groove. A first mount member and a second mount member of a housing respectively are mounted into the first groove and the second groove. The storage device is fixed by the first fix member and the second fix member. The storage device is mounted in the housing of computers more stably by the assembling of the first mount member and the second mount member with the first groove and the second groove respectively. | 2011-05-12 |
20110110035 | ELECTRONIC DEVICE WITH HEAT DISSIPATING STRUCTURE - An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage. | 2011-05-12 |
20110110036 | PASSIVE COOLING SYSTEM FOR PHOTO VOLTAIC MODULES - The present invention discloses a cooling fin assembly for Photo Voltaic Solar (PVS) panels providing an improved passive cooling of the PVS panels. Cooling fins as such do provide a good local cooling effect underneath the contacting surface of the fins. However, due to uneven air streams around the cooling fins, the temperature difference across a transversal direction relative to the direction of the fins may be high. This causes a severe degradation of the cooling systems effectiveness, and the resulting output form the PVS panel. According to the disclosure of this invention, an arrangement of transversal heat conducting materials provides a heat bridge providing a thermal relaxation time below a predefined threshold across the whole back side of the PVS panel, thereby improving the overall cooling effect of the PVS panel. | 2011-05-12 |
20110110037 | DRIVER MODULE STRUCTURE - Provided is a driver module structure capable of ensuring high reliability. | 2011-05-12 |
20110110038 | COOLING CONFIGURATION FOR COMMUNICATION BOARDS - A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards. | 2011-05-12 |
20110110039 | INVERTER SYSTEM - A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber. | 2011-05-12 |
20110110040 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a fan having a plurality of first fixing cylinders, a heat sink having a plurality of second fixing cylinders, and a plurality of fasteners fixing the fan to the heat sink. Each of the fasteners includes a screwing post, an elastic member encircling the screwing post, and an annular fastening collar engaging with the screwing post. Each of the fasteners extends through a corresponding first fixing cylinder of the fan and a corresponding second fixing cylinder of the heat sink. The elastic member of each fastener is compressed between the corresponding first fixing cylinder and the corresponding second fixing cylinder. | 2011-05-12 |
20110110041 | HEAT DISSPATION STRUCTURE OF ELECTRONIC APPARATUS - A heat dissipation structure of an electronic apparatus includes a bendable vapor chamber with a large area. A small section of the vapor chamber is arranged to contact with the heat source of the electronic apparatus and a large remaining section of the vapor chamber contacts with an internal wall of the chassis of the electronic apparatus through appropriate bending. The working fluid in the vapor chamber absorbs the heat generated by the heat source and vaporizes. The heat-carrying vapor spreads within the vapor chamber to condense on a large condensation zone. The released heat is then dissipated to the atmosphere via the large area of the chassis and the heat dissipating fin structure thereon. Therefore, the heat dissipation structure provides efficient passive heat dissipation. | 2011-05-12 |
20110110042 | ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATION DEVICE - An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the heat sink. The heat sink includes a main body defining a transverse channel therethrough and an injection aperture at a top of the main body to communicate the channel and an exterior of the main body. The heat pipe is pivotably engaging in the channel of the main body. A gap is defined between the heat pipe and the heat sink. Heat conductive grease is injected into the channel and filled in the gap between the heat pipe and the heat sink to thermally connect the heat sink with the heat pipe. | 2011-05-12 |
20110110043 | ELECTRONIC APPARATUS - An electronic apparatus includes, an apparatus casing detachably connected to another electronic apparatus, a heat receiver having a flow passage of a cooling medium and assembled in the apparatus casing, and an cooling-medium input and output unit connecting the flow passage of the heat receiver to a circulatory pathway of the cooling medium, the circulatory pathway including a heat exchange taking heat from the cooling medium outside the apparatus casing. | 2011-05-12 |
20110110044 | HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE - A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing. | 2011-05-12 |
20110110045 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device includes a liquid crystal display panel and a backlight disposed at the back of the liquid crystal display panel. The backlight includes a frame, a light source, a reflective sheet, and a heat dissipating plate formed in a rectangular shape and housing the light source, the reflective sheet, and the heat dissipating plate. The heat dissipating plate is disposed between the reflective sheet and a bottom surface of the frame and includes a first portion and a second portion facing the first portion, and has a plurality of first openings at the first portion and at least one second opening at the second portion. The plurality of first openings are formed along the first portion, and each of the first openings has a first edge and a first fin formed at a part of the first edge. | 2011-05-12 |
20110110046 | REINFORCEMENT FRAME, COMPONENT UNIT, AND DISPLAY - Disclosed is a reinforcement frame ( | 2011-05-12 |
20110110047 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages. | 2011-05-12 |
20110110048 | THERMAL INTERFACE MEMBERS FOR REMOVABLE ELECTRONIC DEVICES - In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive. | 2011-05-12 |
20110110049 | MOTOR CONTROL CENTER UNIT WITHDRAW WITH DOOR CLOSED - An electrical enclosure wherein an electrical component can be moved between various positions (e.g., connected, disconnected, test, etc.) without opening an enclosure door. The electrical enclosure supports a component for movement between a withdrawn position, a test position, and an inserted position. A handle is accessible by an operator from an exterior of the enclosure and is configured to move the component between the respective positions without having to open the enclosure. The handle is integral with the enclosure and thus an operator needs no special tool or other device to effect movement of the electrical component between its respective positions. | 2011-05-12 |
20110110050 | STRUCTURE WITH ELECTRONIC COMPONENT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH STRUCTURE - A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component. | 2011-05-12 |
20110110051 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for an expansion card with a blocking piece is disclosed. The mounting apparatus includes a mounting bracket and a fixing piece. The mounting bracket includes a support plate with two bent portions. The fixing piece is pivotably mounted on the mounting bracket. The fixing piece includes a resisting piece, two resilient pressing pieces, and an engaging portion. The resisting piece secures the blocking piece to the support plate. The two resilient pressing pieces are connected to the resisting piece. The engaging portion retains the fixing piece to the mounting bracket. A pivot portion protrudes from each pressing piece and is received in each bent portion. The two pressing pieces are oppositely pressed to disengage the pivot portion from the bent portion. | 2011-05-12 |
20110110052 | MULTILAYER WIRING BOARD - A multilayer wiring board | 2011-05-12 |
20110110053 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD USING THE SAME - A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires. | 2011-05-12 |
20110110054 | COMPACT DISPLAY FLEX AND DRIVER SUB-ASSEMBLIES - Compact sub-assemblies of flexible circuits and drivers are provided. The sub-assemblies can occupy less space in an electronic device than conventional sub-assemblies. In one or more embodiments of the present invention, the flexible circuits can be attached to or wires can be disposed on portions of the substrate that previously were unoccupied in conventional sub-assemblies. In one or more embodiments, the sub-assemblies of the present invention also can have wires disposed underneath the driver or vary the width of the wires. In one or more embodiments, the sub-assemblies of the present invention also can have composite wires that occupy less space than wires of conventional sub-assemblies, while still maintaining similar energy flux. | 2011-05-12 |
20110110055 | GUIDE FRAME FOR A PLUGGABLE MODULE - A guide frame is provided for receiving a pluggable module having guide members that include upper and lower surfaces. The guide frame includes side segments extending lengths from loading ends to mating ends. The side segments are spaced apart from each other to define a receptacle extending therebetween. The receptacle is configured to receive the pluggable module therein. The side segments include upper and lower guide rails for guiding the pluggable module within the receptacle. The upper and lower guide rails are configured to engage the upper and lower surfaces, respectively, of the guide members of the pluggable module when the pluggable module is received within the receptacle. The guide frame also includes a cross member extending from, and interconnecting, the side segments. | 2011-05-12 |
20110110056 | MOUNTING APPARATUS FOR PCI CARD - A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a base and a blocking plate bent from the base. The mounting piece includes an elongated body and a mounting end bent from the elongated body. The elongated body adjoins the base and the mounting end abuts on the blocking plate. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion extending from the pivoting portion, and a securing portion extending from the pressing portion. The pressing portion elastically abuts against the mounting end, thereby sandwiching the mounting end between the blocking plate and the pressing portion. The securing portion is for driving the pressing portion to move away from the mounting end by handling the securing portion. | 2011-05-12 |
20110110057 | CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME - A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules. | 2011-05-12 |
20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 2011-05-12 |
20110110059 | APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES - An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad. | 2011-05-12 |
20110110060 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component | 2011-05-12 |
20110110061 | Circuit Board with Offset Via - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes first and second conductor structures in spaced apart relation, a first via in ohmic contact with the first conductor structure and a second via in ohmic contact with the second conductor structure. A second interconnect layer is formed on the first interconnect layer. The second interconnect layer includes third and fourth conductor structures in spaced apart relation and offset laterally from the first and second conductor structures, a third via in ohmic contact with the third conductor structure and a fourth via in ohmic contact with the fourth conductor structure. | 2011-05-12 |
20110110062 | Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same - A stack-type semiconductor device including semiconductor chips having different backside structures and an electronic apparatus including the stack-type semiconductor device include: a base frame for a semiconductor device; a first semiconductor chip that is mounted on the base frame and has a bottom surface having a first surface roughness; and a second semiconductor chip that is mounted on the first semiconductor chip and has a bottom surface having a second surface roughness, wherein the second surface roughness is greater than the first surface roughness by 1.2 nm or more. The stack-type semiconductor device is manufactured to be thin while cracking of the first semiconductor chip is prevented. In addition, changes in data caused by charge loss resulting from diffusion of metal ions, which can occur when a stack-type semiconductor device is a memory device, is prevented. | 2011-05-12 |
20110110063 | Robust Consumer Electronic Device - A method includes providing a molded elastomeric mat having an input protrusion, an output device receiving surface including an output device contact, and a battery receiving indentation including a power supply contact. The method further includes insert molding an output conductive path into the elastomeric mat, the output conductive path electrically coupling a circuit carrier output contact to an output device contact, and insert molding a power supply conductive path into the elastomeric mat, the power supply conductive path electrically coupling a circuit carrier power contact to the power supply contact. The method includes interfacing the elastomeric mat with a circuit carrier, aligning the input protrusion with a circuit carrier input contact, interfacing a display device with the output device receiving surface, electrically connecting the display device with the output device contact, and positioning the elastomeric mat into a housing. | 2011-05-12 |
20110110064 | Integrating Circuit Die Stacks Having Initially Identical Dies Personalized With Fuses - Integrated circuit die stacks having a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the first die personalized by blowing fuses on the first die, converting the TSVs previously connected through the blown fuses into pass-through vias (‘PTVs’), each PTV implementing a conductive pathway through the first die with no connection to any circuitry on the first die; and the second die, manufactured to be initially identical to the first die and later personalized by blowing fuses on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die. | 2011-05-12 |
20110110065 | Integrated Circuit Die Stacks Having Initially Identical Dies Personalized With Switches - Integrated circuit die stacks having a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the first die personalized by opening switches on the first die, converting the TSVs previously connected through the open switches into pass-through vias (‘PTVs’), each PTV implementing a conductive pathway through the first die with no connection to any circuitry on the first die; and the second die, manufactured to be initially identical to the first die and later personalized by opening switches on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die. | 2011-05-12 |
20110110066 | ANISOTROPIC CONDUCTIVE FILM - A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition. | 2011-05-12 |
20110110067 | ELECTRONIC DEVICE - An electronic device includes a shell, a circuit board, a triggering element, a light-transmissive button and an optical sensor. The shell defines a button hole in an edge thereof and forms a receiving space therein. The circuit board module is installed in the receiving space. The triggering element is fixed on and electronically connected with the circuit board module. The light-transmissive button is received in the button hole, and is depressible for turning on and off the triggering element. The optical sensor is positioned beneath the light-transmissive button for detecting intensity of the ambient light passing through the light-transmissive button. The appearance of the electronic device is not affected by the optical sensor. | 2011-05-12 |
20110110068 | COMPOSITE SEMICONDUCTOR DEVICE - To provide a composite semiconductor device capable of preventing malfunction of preventing electrical circuits and contributing to miniaturization of a power converter. | 2011-05-12 |
20110110069 | DISPLAY MODULE - A display module includes a display panel, an external frame, and a pad structure. The external frame is disposed at a side of the display panel. The pad structure is disposed between the display panel and the external frame. A panel-absorbing portion is formed on a surface of the pad structure facing the display panel. The panel-absorbing portion is used for absorbing the display panel so as to fix the pad structure on the display panel. | 2011-05-12 |
20110110070 | REFLECTING CAP FOR ENHANCING ILLUMINANCE OF ILLUMINATION - The present invention relates to a reflecting cap for enhancing an illuminance of an illumination, which can enhancing the illuminance, protect skin by UV blocking, prevent dazzling, used with being inserted on lamp of various existing illuminations and adjust an irradiation angle of the light freely. To this end, the present invention provides a reflecting cap for enhancing an illuminance of an illumination, which includes a sheet having a shape that is inserted on a lamp of an illumination so as to enhance an illuminance of the illumination. In accordance with the present invention, an illuminance is increased and an economic effect can thus be expected. Further, it is possible to adjust an irradiation angle of the illumination light by adjusting an angle of the sheet inserted on the lamp of the illumination. | 2011-05-12 |
20110110071 | RADIAL LIGHT-EMITTING DIODE LAMP IN FLAT PRINTED CIRCUIT BOARD FORM FACTOR - The present invention is embodied in a radial light-emitting diode (“LED”) lamp in a flat printed circuit hoard (“PCB”) form factor. In one embodiment, the LED lamp comprises a single, two-sided PCB having one or more LEDs on each side of the PCB. Each LED is encapsulated within a casing generally shaped as a linear dome or half cylinder having an axis. The casing may be a substantially homogenous, molded phosphor mixture that emits light upon exposure to the electromagnetic radiation emitted by the LED inside the casing. Because of phosphorescence and surface reflections in the casing, each LED emits light through an angle greater than 180 degrees transverse to the axis of the casing. | 2011-05-12 |
20110110072 | SAFE ILLUMINATING FRAGRANT DEVICE - A safe illuminating fragrant device has a base, electric circuit, case body, and an electrothermal unit. The base has a through hole, and the electric circuit is arranged in the base. The electric circuit has a plurality of lighting components capable of emitting light in predetermined color. The case body covers the base. A plurality of apertures is arranged around a peripheral of the case body with a predetermined interval. Lights from the lighting components will go into the case body and project out through the apertures. A receiving slot is formed to a top of the case body for receiving spices, and the electrothermal unit will heat up a bottom of the receiving slot. A safety and visual effect are improved by above assembly. | 2011-05-12 |
20110110073 | KINETIC FLAME DEVICE - An apparatus creating a flickering flame effect. The apparatus includes a housing with an interior space with first and second stages. A drive mechanism generates a time varying electromagnetic field extending into the first stage. A first pendulum member is pivotally mounted in the interior space of the first stage and includes first and second magnets on first and second ends, with the first end proximate to the drive mechanism such that the first magnet interacts with the varying electromagnetic field to cause movement of the pendulum member. The apparatus includes a second pendulum member pivotally mounted in the second stage with a magnet on a first end proximate to the second end of the first pendulum member. A flame silhouette element extends from the second pendulum member, and a light source transmits light onto the flame silhouette, which is moving due to the magnetic coupling of the pendulum members. | 2011-05-12 |
20110110074 | GLOVELIGHT, AKA SUPERLIGHT - SUPERSPOT - The Glovelight, aka Superlight-Superspot is a portable hands-free, multi-directional flashlight affixed to a spandex, Lycra, fingerless glove/stretchable band utilizing LED technology to produce a bright, efficient light source that renders both hands empty for performing any task. | 2011-05-12 |
20110110075 | STORAGE SYSTEMS - A furniture article that comprises a furniture housing which is configured to rest on a surface, and a cord-retractor that is configured to supply power from a wall outlet to an outlet located in or on the furniture housing. | 2011-05-12 |
20110110076 | Foil Cushion Arrangement - A foil cushion is described, in particular, a building envelope element with at least one foil cushion that has two outer foil layers that form, between themselves, a cavity that is advantageously closed in an essentially fluid-tight way and that contains a fluid medium, in particular, air. The special feature of the invention consists in that in the cavity there is a carrier on which a group of light-emitting diodes displaying advantageously alphanumeric symbols and/or images is attached on this carrier. Advantageously, the carrier can be arranged as an additional foil layer. | 2011-05-12 |
20110110077 | SPECIAL PURPOSE LED-BASED LINEAR LIGHTING APPARATUS - A linear lighting apparatus is disclosed. The apparatus includes an elongated element having a substantially U-shaped cross-section and an LED strip placed longitudinally along a bottom of the elongated element. The apparatus further includes a first flange located on both sides of an exterior of the elongated element and a second flange located on both sides of the exterior of the elongated element. The apparatus further includes a gutter located on both sides of an interior of the elongated element and a first optical element comprising an elongated planar element composed of optical material. The apparatus further includes a rim located on a top of both sides of the elongated element and a second optical element comprising an elongated planar element for placement on top of the horizontal surface of the rim. | 2011-05-12 |
20110110078 | SOLAR-POWERED ILLUMINATION DEVICE - A solar-powered illumination device includes a solar-thermal-electric power system transforming solar power into electric energy, an illumination module electrically connecting with the solar-thermal-electric power system, a heat dissipation device dissipating heat generated by the illumination module and a heat-collection box receiving at least a part of the heat dissipation device therein. The solar-thermal-electric power system drives the illumination module to illuminate. The heat dissipated by the at least a part of the heat dissipation device is collected by the heat-collection box and transferred into the solar-thermal-electric power system. The solar-thermal-electric power system transforms the heat dissipated by the at least a part of the heat dissipation device into electric energy. | 2011-05-12 |
20110110079 | LIGHT GUIDE ILLUMINATION DEVICE - A light guide illumination device is provided. The light guide illumination device includes a light guide shade configured with a spherical shape. The light guide shade includes a light inputting aperture and a light outputting aperture. The light inputting aperture is adapted for receiving a light emitting unit therein. The light emitting unit is adapted for emitting a light therefrom. The light guide shade has an inner spherical surface serving as a light reflecting surface. The light reflecting surface is adapted for reflecting the light for one or more times and outputting the reflected light out from the light outputting aperture. The outputted light is then projected from the light outputting aperture to the ambient space. | 2011-05-12 |
20110110080 | Modular Light Reflectors and Assemblies for Luminaire - A reflector assembly for a lighting apparatus, the reflector assembly comprising two or more reflector modules configured for associating with one or more light sources, each reflector module comprising one or more reflectors for being located adjacent to a light source when the reflector module is associated with the one or more light sources, the one or more reflectors configured to reflect light from the adjacent light source. The reflector modules may further comprising a cover plate defining a plurality of light source apertures for allowing a light source to protrude through the cover plate, at least a first of the one or more light source apertures disposed adjacent to an overhead reflector and at least a second of the one or more light source apertures disposed adjacent to a lateral reflector. The reflector assembly can comprising any number of reflector modules and the reflector modules can be arranged in different configurations to create different light distributions with the same reflector modules. | 2011-05-12 |
20110110081 | LED LIGHT FIXTURE - An LED light fixture and methods are provided in which the light from central portions of the LED light sources are reflected to illuminate areas on the periphery of an associated area, while less intense light from the sides of the LED light sources illuminate interior portions of the associated area to produce a uniform illumination, both horizontally and vertically, while minimizing direct glare from the light sources. The LED light fixture includes a heat sink having cooling fins on the periphery of the housing. | 2011-05-12 |
20110110082 | Gain Structure For Improving Luminance Of Road Lamp - A gain structure for improving a luminance of a road lamp is disclosed. The gain structure includes a plurality of lamps and a plurality of reflecting shades. The lamps are secured to an end surface of a body of the road lamp. The lamps arranged at an outer side are arranged with an oblique angle toward the lamp arranged at a middle side of the lamps, so that the illumination range can be enlarged. Each of the reflecting shades is provided for accommodating a plurality of light emitting units therein for improving the efficiency of each of the light emitting units. In such a way, the present invention is adapted for providing a solution for the problems of the conventional technology, and is further adapted for improving the entire light emitting efficiency and lowering the glare. | 2011-05-12 |
20110110083 | LIGHTING MODULE, LAMP AND LIGHTING METHOD - A lighting module may include a light source; a lens arranged at a distance from the light source; and a reflector; wherein the lens is configured and arranged to have a wide-angle emission characteristic and to direct a proportion of the light incident from the light source onto the reflector, wherein the proportion is at least 30%. | 2011-05-12 |
20110110084 | LIGHTING APPARATUS - A lighting apparatus may include a housing and an illuminating member. The housing may include sequentially stacked shades. Each of the shades may have a central portion and an edge portion extending from the central portion. The central portions of the shades may be stacked. The edge portions of the shades may have an annular shape. The edge portions of the shades may be arranged spaced apart from each other. The shades may include a material having a high thermal conductivity. The shades may include aluminum, copper, an alloy thereof, etc. The edge portions of the shades may function as heat dissipating fins for dissipating a heat in the illuminating member. The illuminating member may be installed at the housing. | 2011-05-12 |
20110110085 | Light Emitting Diode Module - A light fixture includes multiple light emitting diode (“LED”) modules. Each LED module includes a substrate on which one or more LED's are disposed. The LED modules can interface with one another in a variety of different configurations including an end-to-end configuration in which adjacent ends of the LED modules interface with one another. When adjacent LED modules interface with one another, there is a substantially continuous array of LED's across the LED modules. For example, one or more rows or alignment patterns of the LED's may continue, substantially uninterrupted, within and across the LED modules. Electrical connectors or other means for powering the LED modules are disposed remote from the interfacing locations. For example, electrical connectors may couple to side ends of the LED modules, away from interfacing ends of the LED modules. Thus, the electrical connectors do not impact the continuity of light across adjacent LED modules. | 2011-05-12 |
20110110086 | LUMINAIRE ASSEMBLIES AND APPLICATIONS THEREOF - The present invention provides luminaire light source assemblies incorporating LEDs as light sources for use in various lighting applications. | 2011-05-12 |
20110110087 | LIGHT ENGINE WITH ENHANCED HEAT TRANSFER USING INDEPENDENT ELONGATED STRIPS - A light emitting assembly ( | 2011-05-12 |
20110110088 | System in Package High Power Highly Efficient Diode Lamp - A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin. | 2011-05-12 |
20110110089 | 360-DEGREE ANGLE LED ILLUMINATION DEVICE - A 360-degree angle LED (light-emitting diode) illumination device comprises a copper base plate, a plurality of LED chips, and a flexible PCB circuit layer. The copper base plate is electroplated with a layer of silver thereon. The plurality of LED chips is provided on the peripheries of the copper base plate. The flexible PCB circuit layer is provided on the peripheries of the copper base plate and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide 360-degree angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use. | 2011-05-12 |
20110110090 | AN INTEGRATED MULTIPLE OUTPUT LUMINAIRE - The present invention provides multiple projection systems within a single automated luminaire. The invention provides means for aligning the output of the multiple automated luminaries on a projection surface. | 2011-05-12 |
20110110091 | DUST MITE KILLING CARPET - The invention provides a light source carpet construction ( | 2011-05-12 |