19th week of 2012 patent applcation highlights part 17 |
Patent application number | Title | Published |
20120112316 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME - Openings are formed by lithography and subsequent dry etching at the portions of a first protective film which correspond to connecting holes of second plugs which will be described later, namely at the portions thereof which align with first plugs, wherein the openings have a diameter greater than that of connecting holes by about 0.4 μm. | 2012-05-10 |
20120112317 | INTEGRATED CIRCUIT CAPACITORS HAVING SIDEWALL SUPPORTS - In a method of forming a capacitor, a first mold layer pattern including a first insulating material may be formed on a substrate. The first mold layer pattern may have a trench. A supporting layer including a second insulating material may be formed in the trench. The second insulating material may have an etching selectivity with respect to the first insulating material. A second mold layer may be formed on the first mold layer pattern and the supporting layer pattern. A lower electrode may be formed through the second mold layer and the first mold layer pattern. The lower electrode may make contact with a sidewall of the supporting layer pattern. The first mold layer pattern and the second mold layer may be removed. A dielectric layer and an upper electrode may be formed on the lower electrode and the supporting layer pattern. | 2012-05-10 |
20120112318 | TRANSISTOR AND PROCESS OF PRODUCING THE SAME, LIGHT-EMITTING DEVICE, AND DISPLAY - A transistor capable of modulating, at low voltages, a large current flowing between an emitter electrode and a collector electrode. A process of producing the transistor, a light-emitting device comprising the transistor, and a display comprising the transistor. The transistor comprises an emitter electrode and a collector electrode. Between the emitter electrode and the collector electrode are situated a semiconductor layer and a sheet base electrode. It is preferred that the semiconductor layer be situated between the emitter electrode and the base electrode and also between the collector electrode and the base electrode to constitute a second semiconductor layer and a first semiconductor layer, respectively. It is also preferred that the thickness of the base electrode be 80 nm or less. Furthermore, a dark current suppressor layer is situated at least between the emitter electrode and the base electrode, or between the collector electrode and the base electrode. | 2012-05-10 |
20120112319 | EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING SAME - It is an object to provide an epitaxial silicon wafer that is provided with an excellent gettering ability in which a polysilicon layer is formed on the rear face side of a silicon crystal substrate into which phosphorus (P) and germanium (Ge) have been doped. A PBS forming step for growing a polysilicon layer is executed on the rear face side of a silicon crystal substrate into which phosphorus and germanium have been doped at a high concentration to execute a baking treatment. After a surface layer of the silicon crystal substrate is then polished up to a predetermined amount, a silicon epitaxial layer is grown by a CVD method. By the above steps, the number of LPDs (caused by an SF) that occur on the surface of the epitaxial silicon wafer due to the SF can be greatly reduced. | 2012-05-10 |
20120112320 | NITRIDE SEMICONDUCTOR CRYSTAL AND PRODUCTION PROCESS THEREOF - A production process for a nitride semiconductor crystal, comprising growing a semiconductor layer on a seed substrate to obtain a nitride semiconductor crystal, wherein the seed substrate comprises a plurality of seed substrates made of the same material, at least one of the plurality of seed substrates differs in the off-angle from the other seed substrates, and a single semiconductor layer is grown by disposing the plurality of seed substrates in a semiconductor crystal production apparatus, such that when the single semiconductor layer is grown on the plurality of seed substrates, the off-angle distribution in the single semiconductor layer becomes smaller than the off-angle distribution in the plurality of seed substrates. | 2012-05-10 |
20120112321 | ALKALINE ETCHING LIQUID FOR TEXTURING A SILICON WAFER SURFACE - An etching liquid for texturing a silicon wafer surface is provided. The etching liquid may include an aqueous solution of at least one alkaline etching agent and at least one polysaccharide or derivative thereof. Also provided is a process for texture etching a silicon wafer using the etching liquid of the invention. | 2012-05-10 |
20120112322 | Seal Ring in an Integrated Circuit Die - The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connections between components in different dies of the 3D stacking die structure. A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the formation of the TSVs, preventing moistures or other undesired chemical agents from diffusing into the active circuit region during the subsequent processes of forming TSVs. | 2012-05-10 |
20120112323 | APPARATUS AND METHOD FOR CONTROLLED PARTICLE BEAM MANUFACTURING - A chamber for exposing a workpiece to charged particles includes a charged particle source for generating a stream of charged particles, a collimator configured to collimate and direct the stream of charged particles from the charged particle source along an axis, a beam digitizer downstream of the collimator configured to create a digital beam including groups of at least one charged particle by adjusting longitudinal spacing between the charged particles along the axis, a deflector downstream of the beam digitizer including a series of deflection stages disposed longitudinally along the axis to deflect the digital beams, and a workpiece stage downstream of the deflector configured to hold the workpiece. | 2012-05-10 |
20120112324 | THROUGH-WAFER INTERCONNECTION - A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array. | 2012-05-10 |
20120112325 | Integrated Circuit Device, System, and Method of Fabrication - A semiconductor device ( | 2012-05-10 |
20120112326 | Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die - A semiconductor device has a plurality of semiconductor die mounted to a temporary carrier. A prefabricated shielding frame has a plate and integrated bodies extending from the plate. The bodies define a plurality of cavities in the shielding frame. A penetrable material is deposited in the cavities of the shielding frame. The shielding frame is mounted over the semiconductor die such that the penetrable material encapsulates the die. The carrier is removed. An interconnect structure is formed over the die, shielding frame, and penetrable material. The bodies of the shielding frame are electrically connected through the interconnect structure to a ground point. The shielding frame is singulated through the bodies or through the plate and penetrable material to separate the die. TIM is formed over the die adjacent to the plate of the shielding frame. A heat sink is mounted over the plate of the shielding frame. | 2012-05-10 |
20120112327 | Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die - A semiconductor device has a plurality of semiconductor die mounted to a temporary carrier. A prefabricated shielding frame has a plate and integrated bodies extending from the plate. The bodies define a plurality of cavities in the shielding frame. A penetrable material is deposited in the cavities of the shielding frame. The shielding frame is mounted over the semiconductor die such that the penetrable material encapsulates the die. The carrier is removed. An interconnect structure is formed over the die, shielding frame, and penetrable material. The bodies of the shielding frame are electrically connected through the interconnect structure to a ground point. The shielding frame is singulated through the bodies or through the plate and penetrable material to separate the die. TIM is formed over the die adjacent to the plate of the shielding frame. A heat sink is mounted over the plate of the shielding frame. | 2012-05-10 |
20120112328 | Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die - A semiconductor device includes a pre-fabricated shielding frame mounted over a sacrificial substrate and semiconductor die. An encapsulant is deposited through an opening in the shielding frame around the semiconductor die. A first portion of the shielding frame to expose the encapsulant. Removing the first portion also leaves a second portion of the shielding frame over the semiconductor die as shielding from interference. A third portion of the shielding frame around the semiconductor die provides a conductive pillar. A first interconnect structure is formed over a first side of the encapsulant, shielding frame, and semiconductor die. The sacrificial substrate is removed. A second interconnect structure over the semiconductor die and a second side of the encapsulant. The shielding frame can be connected to low-impedance ground point through the interconnect structures or TSV in the semiconductor die to isolate the die from EMI and RFI, and other inter-device interference. | 2012-05-10 |
20120112329 | CHIP PACKAGE - An embodiment of the invention provides a chip package, which includes: a semiconductor substrate having a device region and a non-device region neighboring the device region; a package layer disposed on the semiconductor substrate; a spacing layer disposed between the semiconductor substrate and the package layer and surrounding the device region and the non-device region; a ring structure disposed between the semiconductor substrate and the package layer, and between the spacing layer and the device region, and surrounding a portion of the non-device region; and an auxiliary pattern including a hollow pattern formed in the spacing layer or the ring structure, a material pattern located between the spacing layer and the device region, or combinations thereof. | 2012-05-10 |
20120112330 | SEMICONDUCTOR DEVICE - A semiconductor device, such as a semiconductor device of chip on film package, is provided. The semiconductor device includes at least an integrated circuit formed on a film base, each integrated circuit includes a chip and a plurality of leads formed interior to a boundary of a predetermined range, each lead is formed with a predetermined distance from the boundary. While the integrated circuit is punched from the film base along the boundary, conductive residue of leads left on the puncher is therefore reduced or avoided. | 2012-05-10 |
20120112331 | Dual Lead Frame Semiconductor Package and Method of Manufacture - A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time. | 2012-05-10 |
20120112332 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A resin-sealed semiconductor device includes a power element ( | 2012-05-10 |
20120112333 | SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS - A molded surface mount semiconductor device has electrical contact elements disposed in a set of pairs of zigzag rows extending adjacent and generally parallel to opposite edges of an active face of a semiconductor die. Each of the pairs of rows includes an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements. The electrical contact elements of the inner and outer zigzag rows are partially inter-digitated. A lead frame used in making the device also has a die pad located inside the set of pairs of zigzag rows, and an outer frame element located outside the set of pairs of zigzag rows, and which support the electrical contact elements of the inner and outer zigzag rows respectively. | 2012-05-10 |
20120112334 | PACKAGING STRUCTURE OF A MICRO-DEVICE INCLUDING A GETTER MATERIAL - A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material. | 2012-05-10 |
20120112335 | NOVEL BONDING PROCESS AND BONDED STRUCTURES - A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described. | 2012-05-10 |
20120112336 | ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE - An encapsulated die ( | 2012-05-10 |
20120112337 | Optoelectronic Component, and Method for the Production of an Optoelectronic Component - An optoelectronic component ( | 2012-05-10 |
20120112338 | HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS - An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices are attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages. | 2012-05-10 |
20120112339 | SEMICONDUCTOR DEVICE - A semiconductor device and a method of forming the same are disclosed, which forms a low-dielectric-constant oxide film only at a peripheral part of a bit line conductive material, resulting in reduction in parasitic capacitance of the bit line. The semiconductor device includes a bit line formed over a semiconductor substrate, a first spacer formed over sidewalls of the bit line, and a second spacer formed over sidewalls of the first spacer, configured to have a dielectric constant lower than that of the first spacer. | 2012-05-10 |
20120112340 | Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief - A semiconductor device has a semiconductor die and conductive layer formed over a surface of the semiconductor die. A first channel can be formed in the semiconductor die. An encapsulant is deposited over the semiconductor die. A second channel can be formed in the encapsulant. A first insulating layer is formed over the semiconductor die and first conductive layer and into the first channel. The first insulating layer extends into the second channel. The first insulating layer has characteristics of tensile strength greater than 150 MPa, elongation between 35-150%, and thickness of 2-30 micrometers. A second insulating layer can be formed over the semiconductor die prior to forming the first insulating layer. An interconnect structure is formed over the semiconductor die and encapsulant. The interconnect structure is electrically connected to the first conductive layer. The first insulating layer provides stress relief during formation of the interconnect structure. | 2012-05-10 |
20120112341 | METHOD AND DEVICE FOR SELECTIVELY ADDING TIMING MARGIN IN AN INTEGRATED CIRCUIT - A method, system, and integrated circuit including selectively added timing margin. The method, for integrating statistical timing and automatic test pattern generation (ATPG) to selectively add timing margin in an integrated circuit, includes identifying, while a chip is in design, paths that are unable to be robustly tested “at speed” during manufacturing test, running statistical timing to calculate a margin to be applied to the paths, updating design specifications for margin to be applied to the paths, and optimizing chip logic based on updated design specifications. | 2012-05-10 |
20120112342 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE - A semiconductor device includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first electrode pads on the first surface, a stress buffer layer formed on the first electrode pads and the first surface of the first structural body, and having a plurality of holes which expose the first electrode pads, and a plurality of bumps formed to be electrically connected with the first electrode pads through the plurality of holes, wherein the plurality of bumps include first bumps which are filled in corresponding holes of the plurality of holes and second bumps which are formed on the first bumps and the stress buffer layer and are disposed over the first electrode pads and portions of the first surface outside the first electrode pads. | 2012-05-10 |
20120112343 | ELECTROPLATED POSTS WITH REDUCED TOPOGRAPHY AND STRESS - Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height. | 2012-05-10 |
20120112344 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF - Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the semiconductor package includes a coplanar waveguide including a signal and ground electrodes on the mounting substrate, the signal electrode flip-chip connected to the semiconductor element, the ground electrodes arranged on both sides of the signal electrode with intervals therebetween. A step part is formed in the ground electrodes in an outer circumferential part of a mounting region of the semiconductor element, the step part having a larger distance between upper surfaces of the mounting substrate and the ground electrode in the outer circumferential part of the mounting region than such distance in the mounting region, and an insulator for covering the signal electrode in the outer circumferential part of the mounting region is formed. | 2012-05-10 |
20120112345 | HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE - A high bandwidth semiconductor printed circuit board assembly (PCBA) providing a layer of dielectric substrate containing plated vias with an upper and lower surface plated with etched copper, mated with a second layer of etched copper plated dielectric containing plated vias that is placed on the top surface of the first layer. A third layer of etched copper plated dielectric containing plated vias may be placed on the bottom layer of etched copper foil. A base layer of etched copper plated thick dielectric containing plated vias is laminated simultaneously with the preceding layers to provide the high bandwidth digital and RF section of the assembly. | 2012-05-10 |
20120112346 | THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Provided are a thin-film transistor (TFT) substrate and a method of manufacturing the same. The method includes: forming a passivation film by forming an insulating film on a substrate; forming a photoresist pattern by forming a photoresist film on the passivation film, exposing the photoresist film to light, and developing the photoresist film; performing a first dry-etching by dry-etching the passivation film using the photoresist pattern as an etch mask; performing a baking to reduce a size of the photoresist pattern; performing a second dry-etching to form a contact hole by dry-etching the passivation film again using the photoresist pattern as a mask; removing the photoresist pattern; and forming a pixel electrode of a carbon composition that includes carbon nanotubes and/or graphene on a top surface of the passivation film. | 2012-05-10 |
20120112347 | FLEXIBLE ELECTRONIC DEVICES AND RELATED METHODS - A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends. | 2012-05-10 |
20120112348 | DEVICES, METHODS, AND SYSTEMS FOR WAFER BONDING - Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material. | 2012-05-10 |
20120112349 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed, which reduces the depth of a metal contact so that an etching margin is increased in forming a contact hole. In addition, the semiconductor device and the method for forming the same increase a contact area between a plate electrode and a metal contact so that a power source can be more easily provided to the plate electrode. Thus, a sensing noise is reduced and a process margin is improved, resulting in improvement of device operation characteristics. | 2012-05-10 |
20120112350 | Semiconductor structure and method for making same - Embodiments relate to a method for making a semiconductor structure, the method comprising: forming a seed layer in direct contact with a dielectric material; forming a masking layer over the seed layer; patterning the masking layer to expose the seed layer; forming a fill layer over the exposed seed layer; and causing the seed layer to react with the dielectric layer to form a barrier layer between the fill layer and the dielectric layer | 2012-05-10 |
20120112351 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a method of manufacturing a discrete semiconductor device package ( | 2012-05-10 |
20120112352 | INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY - An integrated circuit system having an interposer and an integrated circuit with first and second bond pads, the integrated circuit die bonded to the interposer using the first bond pads. The integrated circuit having circuit blocks, that operate at different operating voltages and voltage regulator modules die bonded to the second bond pads of the integrated circuit. The voltage regulator modules converting a power supply voltage to the operating voltage of a respective circuit block and supply the respective operating voltage to the circuit block via the second bond pads. | 2012-05-10 |
20120112353 | ORGANIC ELECTRONIC CIRCUIT - A multi-layer film body comprises a plastic substrate strip conveyed in a first direction in a roll-to-roll process for printing electronic organic components on the substrate. A first electrically conducting layer is on the substrate, a semiconductor layer is on the first layer, an insulator layer is on the semiconductor layer and a second electrically conducting layer is on the insulator layer, the layers comprising a first interconnection assembly portion and a second electronic assembly portion successively positioned in the first direction, each portion comprising a central zone and a respective conductor tract input zone and conductor tract output zone bordering the respective central zones, the input, central and output zones of each portion each comprising parallel conductor tracts in the first conducting layer. Electrical connectors in the second conducting layer interconnect selected ones of the conductor tracts in the two portions. Regions of the semiconductor and insulating layers in the second portion are juxtaposed with electrodes formed from the first and second conducting layers in the central zone, forming organic electronic components comprising one or more of transistors, diodes, resistors and capacitors. The conductive tracts of the input zone of the first portion and the conductive tracts of the output zone of the second portion form the component inputs and outputs. | 2012-05-10 |
20120112354 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first interconnect layer and a second interconnect layer provided above or under the first interconnect layer. The first interconnect layer includes a plurality of first interconnect blocks, and in each of the first interconnect blocks, a first interconnect has a first potential, and extends in at least two or more directions, and a second interconnect has a second potential, and extends in at least two or more directions. The second interconnect layer includes a third interconnect which electrically connects the first interconnect of one of a pair of adjacent first interconnect blocks and the first interconnect of the other of the pair of adjacent first interconnect blocks, and a fourth interconnect which electrically connects the second interconnect of one of the pair of adjacent first interconnect blocks and the second interconnect of the other of the pair of adjacent first interconnect blocks. | 2012-05-10 |
20120112355 | Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die - A semiconductor die has a first semiconductor die mounted to a carrier. A plurality of conductive pillars is formed over the carrier around the first die. An encapsulant is deposited over the first die and conductive pillars. A first stepped interconnect layer is formed over a first surface of the encapsulant and first die. The first stepped interconnect layer has a first opening. A second stepped interconnect layer is formed over the first stepped interconnect layer. The second stepped interconnect layer has a second opening. The carrier is removed. A build-up interconnect structure is formed over a second surface of the encapsulant and first die. A second semiconductor die over the first semiconductor die and partially within the first opening. A third semiconductor die is mounted over the second die and partially within the second opening. A fourth semiconductor die is mounted over the second stepped interconnect layer. | 2012-05-10 |
20120112356 | SYSTEM AND METHOD FOR RELIEVING STRESS AND IMPROVING HEAT MANAGEMENT IN A 3D CHIP STACK - The present disclosure provides a system and method for relieving stress and providing improved heat management in a | 2012-05-10 |
20120112357 | SYSTEM AND METHOD FOR RELIEVING STRESS AND IMPROVING HEAT MANAGEMENT IN A 3D CHIP STACK HAVING AN ARRAY OF INTER-STACK CONNECTIONS - The present disclosure provides a system and method for relieving stress and providing improved heat management in a 3D chip stack of a multichip package. A stress relief apparatus is provided to allow the chip stack to adjust in response to pressure, thereby relieving stress applied to the chip stack. Additionally, improved heat management is provided such that the chip stack adjusts in response to thermal energy generated within the chip stack to remove heat from between chips of the stack, thereby allowing the chips to operate as desired without compromising the performance of the chip stack. The chip stack also includes an array of flexible conductors disposed between two chips, thereby providing an electrical connection between the two chips. | 2012-05-10 |
20120112358 | STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A stack-type semiconductor device includes a semiconductor substrate; and a plurality of wafer assemblies arranged in various levels on the semiconductor substrate, in which the wafer assembly in each level includes an active part and an interconnect part, and the active part and the interconnect part each have conductive through vias, wherein the conductive through vias in the active part are aligned with the conductive through vias in the interconnect part in a vertical direction, so that the active part in each level is electrically coupled with the active part in the previous level and/or the active part in the next level by the conductive through vias. Such a stack-type semiconductor device and the related methods can be applied in a process after the FEOL or in a semiconductor chip packaging process and provide a 3-dimensional semiconductor device of high integration and high reliability. | 2012-05-10 |
20120112359 | Semiconductor Devices and Fabrication Methods thereof - A semiconductor device includes a first semiconductor chip, a first connection structure disposed on a first side of the first semiconductor chip, a second semiconductor chip disposed on a second side of the first semiconductor chip, and a second connection structure disposed between the first and second semiconductor chips, wherein a number of the second connection structures is less than a number of the first connection structures. | 2012-05-10 |
20120112360 | SEMICONDUCTOR CHIP, STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME, AND METHOD FOR MANUFACTURING STACKED SEMICONDUCTOR PACKAGE - A semiconductor chip includes a semiconductor chip body including a peripheral region, a first region and a second region, and having a plurality of memory banks formed in each of the first region and the second region; a plurality of first through electrodes formed in the peripheral region; and a plurality of second through electrodes formed in the first and second regions along a direction parallel to a minor axis of the semiconductor chip body. | 2012-05-10 |
20120112361 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A semiconductor device is provided. The semiconductor device includes a substrate having a via hole comprised of a first region having a first width and a second region having a second width greater than the first width, wherein at least a portion of the substrate is exposed in the via hole, and an insulating region having an air gap spaced apart from and surrounding the first region of the via hole. | 2012-05-10 |
20120112362 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first line pattern and a second line pattern formed in parallel on a semiconductor substrate, third line patterns formed in parallel between the first line pattern and the second line pattern, fourth line patterns formed in parallel between the first line pattern and the second line pattern, a first connection structure configured to couple a first of the third line patterns with a first of the fourth lines patterns, which are adjacent to the first line pattern, and a second connection structure configured to couple a second of the first lines patterns with a second of the fourth lines patterns, which are adjacent to the second line pattern. | 2012-05-10 |
20120112363 | CHIP STRUCTURE HAVING REDISTRIBUTION LAYER - A chip structure having a redistribution layer includes: a chip with electrode pads disposed on an active surface thereof; a first passivation layer formed on the active surface and the electrode pads; a redistribution layer formed on the first passivation layer and having a plurality of wiring units, wherein each of the wiring units has a conductive pad, a conductive via and a conductive trace connecting the conductive pad and the conductive via, the conductive trace having at least a first through opening for exposing a portion of the first passivation layer; and a second passivation layer disposed on the first passivation layer and the redistribution layer, the second passivation layer being filled in the first through opening such that the first and second passivation layers are bonded to each other with the conductive trace sandwiched therebetween, thereby preventing delamination of the conductive trace from the second passivation layer. | 2012-05-10 |
20120112364 | WIRING STRUCTURE OF SEMICONDUCTOR DEVICE - A wiring structure may include a first wiring having a first width that extends in a first direction, and a second wiring intersecting the first wiring, the second wiring extending in a second direction and having a second width that is equal to or less than the first width. Furthermore, the first wiring may have a third width that is smaller than the first width and the second wiring may have a fourth width that is smaller than the second width. Portions of the first and second wirings having the third and fourth widths may extend from an intersecting region in which the first wiring and the second wiring intersect each other. | 2012-05-10 |
20120112365 | Semiconductor Packages and Methods For Producing The Same - In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container. | 2012-05-10 |
20120112366 | Power Electronic Module - The invention relates to a power electronic module comprising a plurality of bridge arms mounted in parallel and a plurality of output terminals (BS) connected to the middle points of said bridge arms, characterized in that it comprises at least two semi-conductor chips (P | 2012-05-10 |
20120112367 | CHIP CARD, AND METHOD FOR THE PRODUCTION THEREOF - A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound ( | 2012-05-10 |
20120112368 | MEMS SENSOR PACKAGE - An MEMS sensor package includes an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed onto the same mounting surface made of a given package material, wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface, a die attach metalized layer is formed on a package material of the driving IC mounting area, the driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area. | 2012-05-10 |
20120112369 | SILICON STRUCTURE HAVING BONDING PAD - A silicon structure includes a silicon substrate having an electric element; a wiring conductor and a bonding pad, connecting the electric element and an external circuit; a protective layer disposed on the silicon substrate; and a pad opening pattern provided in the protective layer to exposed the bonding pad, wherein a probe mark position and a wire bonding position differ, without increasing the size of the bonding pad in plan view. A substrate exposure part, which is not covered with the protective layer, is provided at part of an outer edge of the bonding pad disposed inside the pad opening pattern in the protective film, and the wiring conductor is not exposed through substrate exposure part. | 2012-05-10 |
20120112370 | TEMPLATE, METHOD OF FORMING TEMPLATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a template includes a pattern part which is provided on a substrate and corresponds to a pattern of a semiconductor device, the pattern of the semiconductor device being to be transferred to a wafer, and an alignment mark part which is provided on the substrate, used for positioning of the substrate with respect to the wafer. The alignment mark part has a refractive index that is higher than a refractive index of the substrate. | 2012-05-10 |
20120112371 | COMBINATION WARM AND COOL MIST HUMIDIFIER - A humidifier includes a housing with a substantially open top portion. Water can be added to the humidifier by pouring the water into a water reservoir through an open top. The water is pumped from the water reservoir to an upper portion of the humidifier where it is dispersed into the environment by a flow of air. The humidifier may include both an ultrasonic nebulizer and a heater to provide a warm mix of cool mist and hot vapor. Alternatively, a warm mist can be provided by dispersed water from an ultrasonic nebulizer in combination with warm air. The humidifier may also solely provide a cool mist from an ultrasonic element, or the water can be dispersed using a wicking filter. | 2012-05-10 |
20120112372 | INSULATION FOR A STEAM CARRYING APPARATUS AND METHOD OF ATTACHMENT THEREOF - A steam dispersion system including insulation is disclosed. The steam dispersion system may include a steam dispersion tube with at least one opening defined on an outer surface of the steam dispersion tube and a hollow interior. The insulation covers at least a portion of the steam dispersion tube, the insulation defining an opening aligned with the opening of the steam dispersion tube, wherein the insulation meets 25/50 flame/smoke indexes for UL723/ASTM E-84 and has a thermal conductivity less than about 0.35 Watts/m-K (2.4 in-hr/ft̂2 deg F.). A nozzle defining a throughhole may be placed within the opening of the steam dispersion tube, the throughhole being in fluid communication with the hollow interior of the steam dispersion tube to provide a steam exit. | 2012-05-10 |
20120112373 | METHOD FOR MAKING CONTACT LENSES - The instant invention pertains to a method and a fluid composition for producing contact lenses with improved lens quality and with increased product yield. The method of the invention involves adding a Butylated Polyvinylpyrrolidone into a fluid composition including a lens-forming material in an amount sufficient to reduce an averaged mold separation force by at least about 20% in comparison with that without the Butylated Polyvinylpyrrolidone. | 2012-05-10 |
20120112374 | METHOD FOR PRODUCING PARTICLES, METHOD FOR PRODUCING TONER, AND APPARATUS FOR PRODUCING PARTICLES - A method for producing particles, including: bringing a compressive fluid into contact with a pressure plastic material, so as to produce a melt of the pressure plastic material; and discharging the melt of the pressure plastic material by differential pressure to a space, so as to form particles, wherein the discharging includes at least one of (A) discharging the melt of the pressure plastic material while a compressive fluid is supplied to the melt of the pressure plastic material, and (B) discharging the melt of the pressure plastic material through one or more through-holes, to which vibration is applied, so as to change the shape of the melt of the pressure plastic material from a columnar shape, through the columnar shape with constrictions, into a particle shape. | 2012-05-10 |
20120112375 | METHOD AND MEANS OF LINING A MANHOLE - An apparatus and method is provided for lining the wall of a manhole. The apparatus may include a liner assembly, which includes an expansion device, an auxiliary bladder, a primary bladder, and a liner. The auxiliary bladder is first inflated near the top of the manhole. Next the primary bladder may be expanded to press the liner against the wall of the manhole. The liner, being impregnated with a resinous material, is pressed against the wall until the resinous material cures and hardens. The expansion device, auxiliary bladder, and primary bladder are then removed from the manhole. The result is a repaired manhole wall. | 2012-05-10 |
20120112376 | SLAB FORMWORK SYTEM - A slab formwork system ( | 2012-05-10 |
20120112377 | TOOL AND METHOD FOR THE MANUFACTURE OF COMPOSITE STRUCTURES - A tool comprising a support section, a plurality of tool sections beatable around the core section to define one or more tool surfaces on which structure material is beatable to be moulded to form a composite structure, the support section and enclosure means being sealingly engagable to enclose the tool sections and structure material therebetween, thus allowing air to be withdrawn from between the enclosure means and the support section as part of the cure process of the structure material. Sealing the enclosure means directly against the support section obviates the need for the tool sections to be sealingly interconnected. | 2012-05-10 |
20120112378 | STYLUS AND METHOD OF MANUFACTURING THE SAME - The present disclosure relates to a method of manufacturing a stylus pen configured to select one of plural pieces of content installed in advance in a communication terminal. Examples of the method comprise preparing a protective cap of a conductive fiber material by sequentially stacking nickel, copper and nickel on both sides of a polyester fiber by deposition coating, placing the protective cap on a mold, applying a bonding agent to an internal surface of the protective cap, and injecting a non-conductive liquid onto the internal upper portion of the protective cap. | 2012-05-10 |
20120112379 | PROCESS FOR PRODUCING POSITIVE ELECTRODE MATERIAL FOR SECONDARY CELL AND POSITIVE ELECTRODE FOR SECONDARY CELL - A process for producing a positive electrode material for a secondary cell, by melting a material containing from 5 to 40 mol % of A | 2012-05-10 |
20120112380 | Apparatus and Method for Inflation Extrusion Molding of Pressure-Sensitive Adhesive Sheet - The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials. | 2012-05-10 |
20120112381 | METHOD AND DEVICE FOR MELT SPINNING AND COOLING A PLURALITY OF MONOFILAMENTS - The invention relates to a method and a device for melt spinning and cooling a plurality of monofilaments which are extruded through a plurality of openings of a spinneret and guided into a cooling bath. The removal process consists of redirecting the monofilaments within the cooling bath. According to the invention, in order to prevent adhesion and an oblique pull-off, the monofilaments are divided into multiple filament groups after extrusion, said groups consisting of multiple monofilaments, and the filament groups are individually redirected independently of each other within the cooling bath into multiple redirecting positions by separate redirecting sheaves. | 2012-05-10 |
20120112382 | DIAPHRAGM FOR SPEAKER, FRAME FOR SPEAKER, DUST CAP FOR SPEAKER, SPEAKER AND APPARATUS USING THEM, AND METHOD FOR MANUFACTURING COMPONENT FOR SPEAKER - A speaker diaphragm is configured by a compound mixed with resin and bamboo fiber. The diaphragm satisfying the advantage of the bamboo fiber of high sound quality and a large degree of freedom in the setting of the characteristic value of the diaphragm and the advantage of the diaphragm made of a resin with improved humidity resistance reliability and strength, excellent external appearance, and enhanced productivity and dimension stability is obtained. | 2012-05-10 |
20120112383 | OVERMOLDED FENESTRATION BUILDING PRODUCT AND METHOD OF MANUFACTURE - A method for manufacturing a fenestration article includes placing a light transmitting pane on a first conformable seal in a first mold portion. The pane has an overmold flange. The method also includes placing a second conformable seal is situated opposed to and positioned on the second side of the pane, the second seal positioned in cooperation with the first conformable seal and a second mold portion to form a center opening in the pane. The first and second portions of the mold are closed, defining a mold cavity therebetween, into which a plastic material is introduced encapsulating the overmold flange and forming in the mold cavity a frame about the light transmitting pane with the center opening situated further away from the wall than the frame, when the fenestration article is installed in the wall. | 2012-05-10 |
20120112384 | METHOD AND APPARATUS FOR SPACING CELLULAR MATTER IN A CELL BLOCK - Methods and apparatus for bonding block of paraffin having cellular material embedded at one end thereof with an additional amount of paraffin are disclosed, including a method comprising placing the paraffin block in a well of a mold with the paraffin-embedded cellular material positioned on a support structure that elevates the cellular matter from a bottom surface of the well; heating the mold to thereby soften and at least partially melt and blend together the embedding paraffin and additional paraffin located in the well, the support structure sized such that some of the additional paraffin flows on the bottom surface of the well at least partially surrounding the support structure; and cooling the mold to thereby bond the additional paraffin to the embedding paraffin and re-solidify the paraffin block, wherein the retained cellular matter is spaced apart from an end of the re-solidified paraffin block defined by the bottom surface of the well. | 2012-05-10 |
20120112385 | PATTERNING OF NON-CONVEX SHAPED NANOSTRUCTURES - Methods of making nano-scale structures with geometric cross-sections, including convex or non-convex cross-sections, are described. The approach may be used to directly pattern substrates and/or create imprint lithography templates or molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates, such as into a functional or sacrificial resist to form functional nanoparticles. | 2012-05-10 |
20120112386 | METHOD FOR PRODUCING A SHAPED OBJECT OF A COMPOSITE MATERIAL, A SHAPED OBJECT PRODUCED ACCORDING TO THIS METHOD - A method for manufacturing a shaped object from a composite material which includes thermoset particles as filler material, fibers as reinforcement material and polyurethane as binder. The method includes the steps of: a) providing a dry mixture of fiber material and thermoset particles with a predefined moisture content; b) the addition and uniform distribution of polyol and isocyanate to the dry mixture; c) curing the mixture in a mould at 15-60° C. under a pressure of at least 50 bar. A shaped object produced with this method. | 2012-05-10 |
20120112387 | MOLD FOR THERMAL NANOIMPRINT LITHOGRAPHY, PROCESS FOR FABRICATING THE SAME, AND NANOIMPRINT PROCESS USING THE SAME - A heating mold for thermal nanoimprint lithography comprising resistive heating means and collecting means for collecting the electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold, said collecting means being connected to said resistive heating means (34) in which said energy is dissipated. | 2012-05-10 |
20120112388 | MANUFACTURING METHOD OF HYDROPHOBIC AEROGEL AND ITS MANUFACTURING APPARATUS - A method of manufacturing a hydrophobic aerogel using a process of reforming a wet gel into a hydrophobic aerogel by a generally known normal temperature and pressure method, including: directly providing a reticular basket in a reactor; introducing a wet gel into the basket; providing an ultrasonic generator under the reactor to emit ultrasonic waves; and providing a nitrogen injection unit under the ultrasonic generator to inject nitrogen into the reactor upwards, thereby accelerating a reaction. An apparatus for manufacturing a hydrophobic aerogel, including: a reactor for reforming a wet gel into a hydrophobic gel, the reactor being provided therein with a support to allow a basket to be disposed therein, an ultrasonic generator which is provided under the reactor; and a nitrogen injection unit which is provided under the ultrasonic generator. | 2012-05-10 |
20120112389 | ELECTROSPINNING MEMBRANE MACHINE IN WARP AND WEFT DIRECTIONS AND APPLICATION PROCESS THEREOF - The present invention relates to an electrospinning device for fabricating a membrane, in particular, to an electrospinning device for fabricating membrane by using spinnerets aligned in machine direction (MD) and transverse direction (TD) in a high-voltage DC electric field, and to method for using the same. In addition to producing a single-layer nanofiber membrane from a polymer composite, the electrospinning device according to the present invention can also conveniently produce a multilayer composite nanofiber membrane from more than one polymer composites. The electrospinning device comprises a control section, an electrospinning section and an ancillary section. The electrospinning section comprises a MD spinnerets set and a TD spinnerets set that are alternately arranged and moves above a membrane collecting device in a to-and-fro scanning manner so as to improve the evenness and strength of the obtained membrane. The high-voltage DC electric field is applied between the MD and TD spinnerets sets and a stainless steel conveyer belt for collecting the membrane. A polymer solution supplied to the MD and TD spinnerets sets is split into nanoflows under the action of the electric field, accumulated on the stainless steel conveyer belt to form a membrane and carried to a collecting roller to be collected. | 2012-05-10 |
20120112390 | STRETCH ROD FOR A TWO-STAGE BLOW MOLDING MACHINE - A stretch rod for a blow molding machine is disclosed, the stretch rod having an elongate member having spaced apart ends and a generally conically-shaped end formed on an end of the elongate member. The end has a tip having a first radius of curvature, a first portion adjacent the tip having a second radius of curvature, a second portion adjacent the first portion having a third radius of curvature, and a third portion adjacent the second portion fixing the end to the elongate member having a fourth radius of curvature. | 2012-05-10 |
20120112391 | CRUCIBLE FOR MASTER ALLOYING - A crucible includes a composite of least two materials. The two materials are selected from a group consisting of alumina, calcia, yttria, erbia, gadolinia, magnesia, hafnia, and zirconia in a composition that has better resistance to reaction with hafnium from a molten hafnium-containing alloy than a nominal crucible composition of 70 wt % magnesia and 30 wt % alumina. | 2012-05-10 |
20120112392 | AIR SPRING DEVICE - An air spring device having a folding bellows which protects the rolling fold against contaminants, the folding bellows being fastened to that end of the rolling piston which lies opposite the rolling fold, and surrounding the outer guide at least over the length of the latter. | 2012-05-10 |
20120112393 | NON-LINEAR SPRING STRUCTURE AND PRESSURE SPACER USING THE SAME - A pair of pressure plates and a spring unit situated between the pair of pressure plates. The spring unit includes plural springs. Each spring includes, in a longitudinally sectional shape, a curved central portion having substantially arc shape projecting in a direction perpendicular to an expansion/contraction direction, a pair of curved end portions each having substantially arc shape projecting at extensions of both ends of the curved central portion in a direction opposite to the projecting direction of the curved central portion, and base portions formed by extending edges of the curved end portions in substantially parallel with the direction perpendicular to the expansion/contraction direction. The base portions are respectively secured to the pair of pressure plates so the spring is located between the pair of pressure plates. The spring length in natural state has linear straight portions between the curved central portion and the curved end portions. | 2012-05-10 |
20120112394 | DAMPENING DEVICE - An assembly for dampening vibration movement between a cylinder and a concentric duct, where the cylinder is positioned radially inside the duct, includes a damper attached to the duct. The damper includes a housing attached to the duct, a contact member positioned at least partially inside the housing and having a contact surface adjacent an outer surface of the cylinder, and a cap threadedly engaged with the housing for applying a load on the contact member in a direction toward the cylinder. | 2012-05-10 |
20120112395 | ANTI-VIBRATION CONNECTING ROD - A first elastic member | 2012-05-10 |
20120112396 | SPRING COILS FOR INNERSPRING ASSEMBLIES AND METHODS OF MANUFACTURE - A progressive spring coil comprises a first spring portion comprising a top end and a bottom end and having a first spring rate, wherein the first spring rate is substantially linear or substantially nonlinear; a second spring portion comprising a top end and a bottom end and having a second spring rate, wherein the second spring rate is substantially linear or substantially nonlinear; and a third spring portion disposed between the first spring portion and the second spring portion, wherein the third spring portion has a third spring rate, wherein the third spring rate is substantially linear or substantially nonlinear. | 2012-05-10 |
20120112397 | Linkage Clamp - A clamp has a powered actuator that includes an arm moving between a first and a second position. A linkage mechanism has a link and a base. The link and base are pivotally connected with one another. The link couples with the arm of the cylinder. The bracket couples with the actuator and the base. The bracket is movable along the base for adjusting the angle opening between the link and the base. | 2012-05-10 |
20120112398 | ARTICLE POSITIONING MECHANISM - An article positioning mechanism for positioning an article comprising a component or a tool with respect to a mounting portion of a movable member of a mechanical device and also restraining rotation thereof includes a holder member to which the article is fixed and a frame shaped member that is fixed to the mounting portion, the holder member including position regulation surfaces and a tapered male engagement portion that is formed as a regular polygon and also is sloped so as to approach its axis in the direction towards the mounting portion, the frame shaped member including a reference surface that receives the position regulation surfaces and positions them in the axial direction, and a tapered female engagement portion that is formed as a regular polygon and also is sloped in the same direction as the tapered male engagement portion. | 2012-05-10 |
20120112399 | PRINTING MEDIUM SUPPLYING APPARATUS AND IMAGE FORMING APPARATUS HAVING THE SAME - A printing medium supplying apparatus for an image forming apparatus includes an apparatus main body, and a printing medium aligning unit which is disposed on the apparatus main body to move between an aligning position at which the printing medium aligning unit aligns a printing medium and a distanced position at which the printing medium aligning unit is distanced from the aligning position. | 2012-05-10 |
20120112400 | IMAGE FORMING APPARATUS - An image forming apparatus includes a fixing device including a pair of first rotating members; a first transport path having a curved portion where a recording medium is curved, the first transport path being for transporting the recording medium to which the image is fixed by the pair of first rotating members; a first transporting section including a pair of second rotating members provided downstream from the curved portion of the first transport path; and a controller that controls so that, while the recording medium is interposed between the pair of first rotating members and the pair of second rotating members, a peripheral velocity of the second rotating members and a peripheral velocity of the first rotating members are reduced at the same time, or the peripheral velocity of the second rotating members is reduced before reducing the peripheral velocity of the first rotating members. | 2012-05-10 |
20120112401 | AUTO-DOCUMENT FEEDER AND IMAGE READING APPARATUS - An auto-document feeder includes: a paper feeding section configured to feed original documents one by one; a first feeding section configured to feed the fed original document through a first feeding path; a second feeding section configured to feed the fed original document through a second feeding path; a third feeding section configured to alternately nip one by one the fed original documents; a determining section configured to determine that the original document is nipped by the third feeding section; and a document diverting and feeding section configured to alternately divert and feed, into the first feeding path and the second feeding path, the fed original documents and, if the preceding original document is present, after the preceding original document is detected by the determining section, feed the following original document into the first or second feeding path into which the preceding original document is not fed. | 2012-05-10 |
20120112402 | RECORDING MEDIUM DELIVERY DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet delivery device ( | 2012-05-10 |
20120112403 | SHEET FEED ASSEMBLY - A sheet feed assembly with a pair of rollers to feed sheets of media along a feed path. The roller pair has a drive roller and an idler roller. The drive roller is mounted between two bearings and for rotation about its longitudinal axis. The idler roller is shorter than the drive roller and is held against the drive roller by two guide formations and at either end. The guide formations bias the idler roller against the drive roller while allowing some lateral displacement of the idler roller from the drive roller. | 2012-05-10 |
20120112404 | Device For Directing Sheets In Arrival From Lines Angularly Arranged Towards An Output Line - A device is described for directing sheets ( | 2012-05-10 |
20120112405 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A registration portion which conveys a sheet toward an image forming portion forming an image on the sheet includes a controlling portion which regulates a sheet skew feeding correction amount by the skew feeding correcting portion based on the sheet right angle degree detected by the end detection sensor. The controlling portion automatically calculates, from the sheet right angle degree detected by the end detection sensor, a skew feeding regulation amount used for making any one of the two sides, forming the corner of the sheet, parallel to the image and corrects the skew feeding of the sheet by the skew feeding correcting portion with the use of the skew feeding regulation amount so that any one of the two sides forming the corner of the sheet is parallel to the image. | 2012-05-10 |
20120112406 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - The sheet conveying apparatus includes first to third pairs of skew conveying rollers conveying a sheet, a reference portion, in which the reference portion corrects a skew feeding of the sheet by abutting a side edge of the sheet conveyed by the first to third pairs of skew conveying rollers against a reference surface placed in parallel with the sheet conveying direction, and a guide groove provided on the reference portion, which guides the side edge of the sheet skew-conveyed by the first to third pairs of skew conveying rollers to the reference surface, wherein a vertical width of an opening portion of the guide groove in an upstream area of the reference portion is wider than that of the guide groove in a downstream area of the reference portion, in the sheet conveying direction. | 2012-05-10 |
20120112407 | RECORDING MATERIAL FEEDING APPARATUS AND IMAGE FORMING APPARATUS - In a sheet feeding cassette which lifts up and lifts down a bottom plate each time when a paper is fed, a recording material sensor detects that no recording materials exist when the bottom plate rises over a predetermined position. Accordingly, by measuring a period of time when it is detected that no recording materials exist during a sheet feeding operation, a stacking amount of the recording materials in a sheet feeding cassette can be detected. | 2012-05-10 |
20120112408 | Apparatus and method of playing a multiple-wheel roulette game - The invention provides a game apparatus having five roulette wheels rotatable on a common axle with a plurality of wheel sections representing Alphabet letters and numbers, an indicator mechanism randomly selecting one wheel section in each wheel by a spin of the wheels, and a playing surface comprising a plurality of betting terminals for placing wagers on the randomly selected wheel sections. The invention also can generate large payouts without the necessity of large wagers. | 2012-05-10 |
20120112409 | BILLIARD BALL MIXING DEVICE AND WAGERING GAME - A billiard ball mixing device and wagering game provide an entertaining and enticing wagering game that utilizes billiard balls during play. The wagering game may utilize billiard balls to determine winning and losing outcomes. The mixing device may accept the billiard balls via an access point and have one or more stationary or movable agitators to mix the billiard balls, placing the balls into a random order. In one or more embodiments, the billiard balls may be removed from the mixing device preserving the random order. In this manner, winning and losing outcomes may be determined based on the randomized billiard balls. | 2012-05-10 |
20120112410 | METHOD AND APPARATUS FOR PLAYING A GAME - A method and apparatus for playing a game, where at step ( | 2012-05-10 |
20120112411 | MODIFIED CHESS GAME - A chess-like game having pieces and rules similar to conventional chess but which includes a new piece having powers and limitations not present in conventional chess pieces | 2012-05-10 |
20120112412 | METHOD OF PLAYING A CARD GAME WITH BONUS BET OPTIONS ("BLACKJACK BONUS3") AND SYSTEMS FOR PLAYING SAME - A method of playing a card game includes the steps of providing one or more decks of playing cards, requiring a player to place a blackjack wager before cards are dealt, affording the player an opportunity to place a bonus wager before cards are dealt, dealing out two cards to each of a plurality of hands, thereby forming a dealer's initial hand and a player's initial hand, determining whether the player's initial hand is a Blackjack hand, determining whether the dealer's initial hand is a Blackjack hand, and if it is determined that neither the player's initial hand nor the dealers initial hand is a Blackjack hand, affording the player an opportunity to draw an additional card, and if the player elects to draw an additional card, determining the outcome of a three-card bonus hand consisting of the player's initial hand and the additional card. | 2012-05-10 |
20120112413 | METHOD OF AND MACHINE FOR PLAYING GAMBLING GAME WITH MULTIPLE WINNING THRESHOLDS - A method for playing a game wherein a positive outcome for a player requires both a superior ranking over other players or fixed outcomes, and an absolute minimum ranking, is disclosed. A machine incorporating the method described is also disclosed. | 2012-05-10 |
20120112414 | CARD GAME - A game is provided. The game includes a plurality of playing cards that each includes an illustration. A plurality of game dice includes illustrations that correspond to the illustrations of the playing cards. A game figure is operable to be hit by at least one of the plurality of game dice. | 2012-05-10 |
20120112415 | ROTATING SEAL RING WITH TARGETED SPLIT SURFACE ORIENTATION - A seal assembly includes a first component, a second component that defines an outer surface and is located radially inward from the first component, a groove defined in the second component and arranged to face the first component, and a seal ring positioned between the first and second components and extending at least partially into the groove. The seal ring defines an outer diameter surface and a first lateral surface adjoining the outer diameter surface. The seal ring is split to define a first free end and a second free end, and the first and second free ends are configured to overlap along a split surface that extends from the first lateral surface to the outer diameter surface. | 2012-05-10 |