17th week of 2010 patent applcation highlights part 43 |
Patent application number | Title | Published |
20100105197 | WIDE-BANDGAP SEMICONDUCTOR DEVICES | 2010-04-29 |
20100105198 | Gate Electrode of semiconductor device and method of forming the same - A method of forming a gate electrode of a semiconductor device includes forming a first polysilicon layer in a peripheral circuit region of a substrate, forming a barrier layer on the first polysilicon layer, the barrier layer providing an ohmic contact, forming a stack structure including a tunneling insulation layer, an electric charge storing layer, and a blocking insulation layer in a memory cell region of the substrate, forming a second polysilicon layer on the barrier layer and the blocking insulation layer, and siliciding the second polysilicon layer and forming a silicide gate electrode. | 2010-04-29 |
20100105199 | NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE - A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation. | 2010-04-29 |
20100105200 | Semiconductor Package with Passivation Island for Reducing Stress on Solder Bumps - A flip chip style semiconductor package has a substrate with a plurality of active devices formed thereon. A contact pad is formed over the substrate. An under bump metallization (UBM) layer is in electrical contact with the contact pad. A passivation layer is formed over the substrate. In one case, the UBM layer is disposed above the passivation layer. Alternatively, the passivation layer is disposed above the UBM layer. A portion of the passivation layer is removed to create a passivation island. The passivation island is centered with respect to the contact pad with its top surface devoid of the UBM layer. A solder bump is formed over the passivation island in electrical contact with the UBM layer. The passivation island forms a void in the solder bump for stress relief. The UBM layer may include a redistribution layer such that the passivation island is offset from the contact pad. | 2010-04-29 |
20100105201 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved. | 2010-04-29 |
20100105202 | METHOD OF FORMING AN INTERCONNECT STRUCTURE - A method of forming an interconnect structure in a semiconductor device in which via holes ( | 2010-04-29 |
20100105203 | METHODS FOR REDUCING DAMAGE TO SUBSTRATE LAYERS IN DEPOSITION PROCESSES - Methods of processing a substrate are provided herein. In some embodiments, a method of processing a substrate may include providing a substrate to a process chamber comprising a dielectric layer having a feature formed therein. A barrier layer may be formed within the feature. A coating of a first conductive material may be formed atop the barrier layer. A seed layer of the first conductive material may be formed atop the coating. The feature may be filled with a second conductive material. In some embodiments, the seed layer may be formed while maintaining the substrate at a temperature of greater than about 40 degrees Celsius. | 2010-04-29 |
20100105204 | METHOD TO MODULATE COVERAGE OF BARRIER AND SEED LAYER USING TITANIUM NITRIDE - Methods for processing substrates are provided herein. In some embodiments, a method for processing substrates includes providing to a process chamber a substrate comprising an exposed dielectric layer having a feature formed therein. A mask layer comprising titanium nitride may be selectively deposited atop corners of the feature. A barrier layer may be selectively deposited atop the mask layer and into a bottom portion of the feature. The barrier layer deposited on the bottom portion of the feature may be etched to redistribute at least a portion of the barrier layer onto sidewalls of the feature. | 2010-04-29 |
20100105205 | CLEANING SOLUTION AND SEMICONDCUTOR PROCESS USING THE SAME - A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a cleaning solution is used to clean the opening. The cleaning solution includes a triazole compound with a content of 0.00275 to 3 wt %, sulfuric acid with a content of 1 to 10 wt %, hydrofluoric acid with a content of 1 to 200 ppm and water. | 2010-04-29 |
20100105206 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device of which cost can be suppressed by using a nanoimprinting method is provided. In the invention, a gate insulating film, a conductive film, and a resist are formed in sequence over a semiconductor film and a resist is hardened while pressing a mold formed with a pattern to the resist. Therefore, the pattern is transferred to the resist, the surface of the resist to which the pattern is transferred is ashed until a part of the conductive film is exposed, the resist having the ashed surface is used a mask, and the conductive film is etched. | 2010-04-29 |
20100105207 | METHOD FOR FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE - A method for forming a fine pattern of a semiconductor device includes forming an insulating layer and an etch layer over a semiconductor substrate, coating a photoresist layer over the etch layer, forming a photoresist pattern by performing a photolithography process for the photoresist layer, forming spacers at sidewalls of the photoresist pattern by performing a primary etching process using the photoresist pattern as a mask, and forming an etch layer pattern and an insulating layer pattern by performing a secondary etching process using the photoresist pattern and the spacers as a mask. | 2010-04-29 |
20100105208 | SILICON ETCH WITH PASSIVATION USING CHEMICAL VAPOR DEPOSITION - A silicon layer is etched through a patterned mask formed thereon using an etch chamber. A fluorine (F) containing etch gas and a silicon (Si) containing chemical vapor deposition gas are provided in the etch chamber. The fluorine (F) containing etch gas is used to etch features into the silicon layer, and the silicon (Si) containing chemical vapor deposition gas is used to form a silicon-containing deposition layer on sidewalls of the features. A plasma is generated from the etch gas and the chemical vapor deposition gas, and a bias voltage is provided. Features are etched into the silicon layer using the plasma, and a silicon-containing passivation layer is deposited on the sidewalls of the features which are being etched. Silicon in the passivation layer primarily comes from the chemical vapor deposition gas. The etch gas and the chemical vapor deposition gas are then stopped. | 2010-04-29 |
20100105209 | SILICON ETCH WITH PASSIVATION USING PLASMA ENHANCED OXIDATION - A method and apparatus for etching a silicon layer through a patterned mask formed thereon are provided. The silicon layer is placed in an etch chamber. An etch gas comprising a fluorine containing gas and an oxygen and hydrogen containing gas is provided into the etch chamber. A plasma is generated from the etch gas and features are etched into the silicon layer using the plasma. The etch gas is then stopped. The plasma may contain OH radicals. | 2010-04-29 |
20100105210 | Method of making pillars using photoresist spacer mask - A method of making a device includes forming a first hard mask layer over an underlying layer, forming first features over the first hard mask layer, forming a first spacer layer over the first features, etching the first spacer layer to form a first spacer pattern and to expose top of the first features, removing the first features, patterning the first hard mask using the first spacer pattern as a mask to form first hard mask features, removing the first spacer pattern. The method also includes forming second features over the first hard mask features, forming a second spacer layer over the second features, etching the second spacer layer to form a second spacer pattern and to expose top of the second features, removing the second features, etching the first hard mask features using the second spacer pattern as a mask to form second hard mask features, and etching at least part of the underlying layer using the second hard mask features as a mask. | 2010-04-29 |
20100105211 | NANO-CRYSTAL ETCH PROCESS - A method for selectively removing nano-crystals on an insulating layer. The method includes providing an insulating layer with nano-crystals thereon; exposing the nano-crystals to a high density plasma comprising a source of free radical chlorine, ionic chlorine, or both to modify the nano-crystals; and removing the modified nano-crystals with a wet etchant. | 2010-04-29 |
20100105212 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a device, including a semiconductor device. A method of fabricating a semiconductor device may include forming a photoresist pattern on and/or over a substrate, which may expose a predetermined region supposed to include a metal line thereover. A method of fabricating a semiconductor device may include etching a substrate, for example using reactive ion etching, which may use a photoresist pattern. A method of fabricating a semiconductor device may include cleaning a substrate using a liquid inorganic compound. An apparatus may include a photoresist pattern over a substrate, and may include a substrate etched by reactive ion etching using a photoresist pattern and/or cleaned using a liquid inorganic compound. | 2010-04-29 |
20100105213 | FORMING METHOD OF AMORPHOUS CARBON FILM, AMORPHOUS CARBON FILM, MULTILAYER RESIST FILM, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM - An amorphous carbon film forming method is performed by using a parallel plate type plasma CVD apparatus in which an upper electrode and a lower electrode are installed within a processing chamber, and the method includes: disposing a substrate on the lower electrode; supplying carbon monoxide and an inert gas into the processing chamber; decomposing the carbon monoxide by applying a high frequency power to at least the upper electrode and generating plasma; and depositing amorphous carbon on the substrate. It is desirable that the upper electrode is a carbon electrode. | 2010-04-29 |
20100105214 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Passivation films including first and second layers (first passivation film) are formed on a GaAs substrate (semiconductor substrate). A SiN film (second passivation film) is formed on the passivation films as a top layer passivation film by catalytic chemical vapor deposition. The SiN film formed by catalytic chemical vapor deposition has a lower degree of hygroscopicity than that of a conventional SiN film formed by plasma chemical vapor deposition. | 2010-04-29 |
20100105215 | METHOD OF MODIFYING INSULATING FILM - An insulting film is modified by subjecting the insulting film to a modification treatment comprising a combination of a plasma treatment and a thermal annealing treatment. There is provided a method of enhancing the characteristic of an insulating film by improving deterioration in the characteristic of the insulating film due to carbon, a suboxide, a dangling bond or the like contained in the insulating film. | 2010-04-29 |
20100105216 | PLASMA OXIDIZING METHOD, STORAGE MEDIUM, AND PLASMA PROCESSING APPARATUS - A plasma oxidizing method in which a plasma is produced in a processing chamber of a plasma processing apparatus under a processing condition that the proportion of oxygen in the processing gas is 20% or more and the processing pressure is 400 to 1333 Pa, and silicon exposed from the surface of an object to be processed is oxidized by the plasma to form a silicon oxide film. | 2010-04-29 |
20100105217 | DEFECTIVITY OF POST THIN LAYER SEPARATION BY MODIFICATION OF ITS SEPARATION ANNEALING - A method of detaching two substrates at the embrittlement zone situated at a given depth of one of the two substrates. The method includes a separation annealing step implemented in a furnace, wherein the annealing includes a first phase during which the temperature changes along an upgrade allowing a high temperature to be reached and annealing at this high temperature to be stabilized, and a second phase during which the temperature changes along a downgrade, at the end of which the furnace is opened to unload the substrates from the furnace. The second phase is regulated so as to minimize temperature inhomogeneities such as cleavage defects at the detached surfaces of the substrates when the furnace is opened. | 2010-04-29 |
20100105218 | ELECTRICAL CONNECTOR FOR RECEIVING CPU - An electrical connector ( | 2010-04-29 |
20100105219 | BOARD-TO-BOARD CONNECTOR AND ARRANGEMENT WITH TWO CIRCUIT BOARDS - A board-to-board connector and an arrangement with two circuit boards. A body of the connector is provided with one or more electrically conductive contacts. Such a contact includes a soldering surface for the contact to be attached to a conductive pattern of a first circuit board. The contact further includes a contact surface to be arranged in contact with the conductive pattern of a second circuit board. The second circuit board is arranged at a distance from the first circuit board and substantially parallel therewith. The contact still further includes a spring part arranged between the soldering surface and the contact surface. The contact surface is in immediate contact with a part of the conductive pattern on the surface of the second circuit board and the spring part allows resilience between the soldering surface and the contact surface in a perpendicular direction with respect to a plane of the soldering surface. | 2010-04-29 |
20100105220 | MINIATURE ELECTRICAL BALL AND TUBE SOCKET ASSEMBLY WITH SELF-CAPTURING MULTIPLE-CONTACT-POINT COUPLING - A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube. | 2010-04-29 |
20100105221 | Electrical connection box and method of assembling the electrical connection box - An electrical connection box in which operability is improved such that even if distortion or flexure occurs in a case, a boss protruding from the case can easily pass through an elongate hold provided in an internal circuit body. A first boss and a second boss protrude from the inner surface of one of a lower case and an upper case. The first boss protrudes and the second boss protrude toward the inner surface of the second of the lower case and the upper case. The first boss and the second boss are cylindrical. First holes through which the first boss pass are aligned with each other in an internal circuit body that is installed in the case. The first holes have a completely cylindrical shape concentric with the first boss. Second holes through which the second boss | 2010-04-29 |
20100105222 | Electrical junction box - Bus bars to be contained in an electrical junction box are secured to insulation plates without caulking. An electrical junction box contains bus bars in a casing. The bus bars are disposed on an inner surface of the casing. Attaching pieces provided on the bus bars are inserted into and secured to receiving apertures provided in the casing. The attaching piece of each bus bar has a rectangular shape in cross section. Each receiving aperture in the casing is a circular aperture or a rectangular aperture. At least a part of an outer peripheral wall of each attaching piece contacts with an inner peripheral surface of each receiving aperture to restrain the attaching piece from moving in the aperture. | 2010-04-29 |
20100105223 | ELECTRIC CONNECTION BOX - There is provided an electric connection box, including: a terminal mounting portion which includes a connection portion and a fastening portion provided on the connection portion; a metal terminal slid to be held and fixed between the connection portion and the fastening portion; a pair of restricting walls which are upstandingly provided on the connection portion, and abut respectively against opposite side edges of the metal terminal to restrict the rotation of the metal terminal; a retaining rib which is disposed on a surface of the connection portion and projects from the surface; and a retaining groove which is formed in the metal terminal, and is engaged with the retaining rib to prevent the metal terminal from being disengaged from the connection portion. | 2010-04-29 |
20100105224 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting device includes a supporting substrate, a plate spring arranged on the supporting substrate, an assembling device for assembling the plate spring to the supporting substrate, a block having a mounting surface facing down, and a flexible circuit board whereupon a plurality of contacts are formed. The block has the mounting surface which protrudes downward from the supporting substrate, for mounting the circuit board. The plate spring is applied with an initial load to be in a status where at least a center region whereupon the block is mounted is urged upward. Thus, excellent electric contact status can be obtained without increasing an over drive quantity. | 2010-04-29 |
20100105225 | Socket having clip with hook portion - A socket adapted for electrically connecting an IC package and a PCB, comprising: a body mounted on the PCB for electrically connecting the IC package, a holder mounted on the PCB and beside the body and a clip for retaining the IC package in the body. The clip has two hook portions by which the clip pivotally assembles to the holder. The hook portion has an arched portion and a tab extending from the arched portion, the tab can abut against the holder to prevent the clip from over-rotation. | 2010-04-29 |
20100105226 | POWER SOCKET WITH ANTI-MISMATING MEANS - A power socket ( | 2010-04-29 |
20100105227 | Trailer Tow Connector Assembly - An electrical connector including a first connector portion and a second connector portion, and interface electronics for providing an interface between terminals associated with the first and second connector portions and a vehicle bus. | 2010-04-29 |
20100105228 | Circuit board module and connector protecting cover thereof - A connector protecting cover and a circuit board module using the same are provided. The circuit board module includes a circuit board, a plurality of electronic devices, a connector, and a connector protecting cover. The electronic devices are disposed on the circuit board. The connector is disposed on the circuit board and includes a plurality of connecting terminals connected to the circuit board. The connector protecting cover includes a top wall, a circular side wall connected to the top wall, and a partition. The partition is connected to the circular side wall. The top wall, the circular side wall, and the partition define a plurality of accommodation spaces. The partition and the circular side wall are together used for clipping the connecting terminals, such that the connecting terminals are located in the accommodation spaces. | 2010-04-29 |
20100105229 | ELECTRICAL CONNECTOR AND TERMINAL FOR ELECTRICAL CONNECTOR - An electrical connector includes a housing and a terminal. The housing includes a terminal hole and a lance portion disposed in the terminal hole. The lance portion includes a guide surface; an engaging front edge surface; and a regulated surface. The terminal includes a contact portion; a connection portion; an engaging portion; a curved portion; and a regulating portion. The engaging portion pushes the guide surface to deform and is guided with the guide surface when the terminal is inserted into the terminal hole. When the terminal is completely fitted in the terminal hole, the engaging portion faces the engaging front edge surface and engages the lance portion. | 2010-04-29 |
20100105230 | CONNECTOR - The present invention relates to a method and to a radio communication terminal comprising a flex film and a electrical connector, wherein the flex film comprises at least one connector portion, the connector portion is adapted to be electronically connected to the electrical connector, the electrical connector comprises a guide, the connector portion of the flex film comprises a guide follower, and the guide and the guide follower are adapted to interact to connect the flex film to the electrical connector. | 2010-04-29 |
20100105231 | Submersible Electrical Connector - A connector for use underwater or in a wet or severe environment comprises first and second connector parts adapted to be interengaged to establish an electrical connection. The first connector part has at least one pin, and the second connector part has at least one electrical contact for engagement by the pin when the connector parts are interengaged. The pin comprises an axially extending electrically conductive portion and an axially extending electrically insulating sleeve around said conductive portion, and the pin is supported by and projects axially forwardly from a support whereby its insulating sleeve is exposed along a longitudinally extending portion thereof to ambient conditions when the connector parts are disengaged. The connector part has a protective rigid metal sleeve member arranged to extend at least partly along the first portion of the insulating sleeve and at least partly along the second portion thereof. | 2010-04-29 |
20100105232 | Power supply and retention bar for a power supply - A power supply has an outer shell and a retention bar. The outer shell has a rear panel and a cover. The rear panel has a socket and two guide slots. The cover has two pivot slots and two pivot mounts. Each pivot slot is formed through the cover adjacent to a corresponding guide slot. The pivot mounts are formed from and protrudes inwardly from the cover and have pivot holes formed therethrough. The retention bar is mounted in the pivot holes of the pivot mounts and has a clip and two protrusions. Therefore, when the power supply is mounted in a casing of a machine, the retention bar simultaneously fastens the power supply to the casing and a plug to the power supply. | 2010-04-29 |
20100105233 | Subsea Electrical Connector and Method - A subsea electrical connector for connecting a first cable and a second cable. A first insulator has an outer face, possibly an inner face, and a pin portion transverse to the outer face. A second insulator has a mating outer face, an inner face, and a pin receptacle. At least one face seal ring is positioned between the first insulator outer face and the second insulator outer face. At least one pin seal ring is positioned between the pin portion and the pin receptacle. Preferably, an interference fit is provided between the pin and pin receptacle. A preferred seating angle seal has an angled surface adjacent the end of the pin portion and within the pin receptacle. First and second electrical connectors are mounted within the first insulator and the second insulator. The first and second metal electrical connectors each have a socket for receiving the first and second cables. A preferred embodiment includes receptacles for the fasteners with stop members, which limit the relative rotation to align the fasteners with the receptacles. | 2010-04-29 |
20100105234 | COAXIAL PLUG FOR CONNECTING TO A BNC COAXIAL SOCKET - The invention relates to a coaxial plug for connecting to a high-frequency transmission line. The housing of the coaxial plug has two slits arranged opposite each other, extending from the plug-side end in the axial direction, and both arranged and designed to form an axial abutment for receiving a BNC pin. A latching fork is arranged on the housing with two latching prongs tangentially overlapping an axial slit of the housing. between the abutment and the plug-side end Each BNC pin is held between a latching prong and an abutment of the axial slit, creating a locked connection between the coaxial plug and the BNC coaxial socket. The latching fork is pivotably arranged between a locking position in which the latching prongs tangentially overlap the axial slits, and a clearing position in which the latching prongs clear the axial slits over the entire length thereof. | 2010-04-29 |
20100105235 | CONNECTOR ELEMENT - The invention relates to a connector element ( | 2010-04-29 |
20100105236 | ELECTRICAL CONNECTOR WITH PIVOTALLY MOVABLE COVER - An electrical connector ( | 2010-04-29 |
20100105237 | QUICK LOCK CONNECTOR ASSEMBLY AND A PROCESS FOR COUPLING AND UNCOUPLING SUCH ASSEMBLY - A quick lock connector assembly includes of a first electrical connector or receptacle connector, of a complementary electrical connector or plug, of a system for locking and unlocking connectors forming the connection assembly in order to allow its coupling and uncoupling, in which the receptacle connector and the plug each have at their respective ends a system of integrated sleeves and spring housings actuated by a push force. The disclosed embodiments have a particular application in severe environments. | 2010-04-29 |
20100105238 | SOLAR LAMINATE CONNECTOR - A low profile photovoltaic connector for placement in space restricted areas. The connector includes a plug and receptacle for interconnecting PV solar arrays. The receptacle is mechanically secured to a solar array. The mechanical connection between the receptacle and the solar array may be a staking process (e.g., ultrasonic, heat). The plug and receptacle may be locking, where only an extraction tool or other similar device may remove the plug from the receptacle. The plug and receptacle may also be non-locking. | 2010-04-29 |
20100105239 | Battery connection device - The invention discloses a battery connection device comprising a connection block positioned at an electrode end of a battery; the connection block is provided with a series connection mechanism at both ends respectively, and with a parallel connection mechanism at all sides respectively; the series connection mechanism is provided inside with a conductive slice electrically connected with the electrode end of the battery; the conductive slice is further led out to a fitting face of the parallel connection mechanism; and thus the conductive slices on the two connection blocks are electrically connected when the two batteries respectively fitted with the connection block are parallel. The invention can make each unit battery connected modularly in series or parallel like a building block; the battery does not further need electrode connection by welding or battery fixing by assembling, which is convenient for operation as well as safe and reliable. | 2010-04-29 |
20100105240 | POSITIONING STRUCTURE FOR USB CONNECTOR - An exemplary positioning structure is used for a USB connector assembled with an electronic device including a main body. The positioning structure includes a through hole defined in the main body, and a guiding portion configured on a periphery of an inner sidewall of the through hole. | 2010-04-29 |
20100105241 | Cable positioner - A cable positioner is formed integrally with a connector and/or a plug, or is shaped and sized to matingly engage a connector and/or a plug. The connector cable positioner can define at least one groove. The groove is sized to secure the cable in a desired position and direct it in a desired direction. The positioner may define at least one retaining tab, or lip, at the extent of at least one groove wall to produce an interference fit with the cable when pushed through the retaining tab, while surrounding the groove enough to effectively create a groove wall more than 180 degrees around the grove to retain the cable in the groove. The at least one tab can pinch, or otherwise secure, at least a portion of the cable to hold the cable in desired position and direction. | 2010-04-29 |
20100105242 | CORD ACCOMMODATION MEMBER AND ITS MANUFACTURING METHOD - A cord accommodation member is able to easily accommodate a connecting cord for a thin TV and video equipment in a hidden place under a glass shelf, having a hard-to-fall-off structure, and can be cut in the desired size for each type in order to cope with the development of various types different in lateral width, without need of raising the die every type, and its manufacturing method. The cord accommodation member comprises a cord accommodating portion for accommodating a connecting cord, a fixing arm for fixing the cord accommodating portion, which is attached to a glass shelf of a TV stand for mounting a television and video equipment, and a fixing rubber for increasing the fixing force for the glass shelf and the fixing arm. | 2010-04-29 |
20100105243 | JUNCTION BLOCK AND LINK BAR - The invention relates to a junction block that comprises a housing for receiving a conducting linking rod ( | 2010-04-29 |
20100105244 | Telecommunications Patching Systems with Obliquely-Angled Patching Modules - A telecommunications patching system includes: a carrier having a generally vertically disposed carrier panel, the carrier panel including a cutout area; and a plurality of patching modules. Each of the patching modules has a main panel and a plurality of telecommunications connectors mounted thereon. The patching modules are inserted into the cutout area so that the main panels thereof are substantially parallel to each other, and so that the main panels define an oblique angle relative to vertical. In such a configuration port density can be increased over typical systems. | 2010-04-29 |
20100105245 | PHOTOVOLTAIC MODULE CONNECTOR ASSEMBLY - A connector assembly includes a housing, a contact, a support plate, and posts. The housing extends between a mounting side and an opposite side. The mounting side is configured to be mounted to a first side of a photovoltaic module. The contact is held by the housing and is configured to be electrically coupled with the photovoltaic module. The support plate is configured to be mounted to a second side of the photovoltaic module. The posts are coupled with at least one of the housing and the support plate and extend through an opening in the photovoltaic module that extends therethrough and joined with the other of the housing and the support plate. The posts secure the housing to the photovoltaic module. | 2010-04-29 |
20100105246 | RF Terminator With Improved Electrical Circuit - An RF coaxial terminator includes an impedance match element mounted within a housing. The impedance match element includes a central conductive pin, a supportive element, a ring, and a resistor, wherein the resistor longitudinally extends in a direction that is not coaxial with the longitudinal axis of the central conductive pin. | 2010-04-29 |
20100105247 | STACKED CARD CONNECTOR - A stacked card connector ( | 2010-04-29 |
20100105248 | CARD EDGE CONNECTOR WITH AN EJECTOR RETAINED AT A SIDE WALL THEREOF - A card edge connector ( | 2010-04-29 |
20100105249 | CONNECTOR APPARATUS - An electrical connector for coupling two electrical connectors is described, the electrical connector configured to couple with a first complementary connector by means of a tongue portion and a pair of end walls, the tongue portion comprising first, second and third tongue sections; a plurality of contacts positioned in the connector housing; and wherein the contacts are grouped into first set and second sets of contacts positioned in the first and second tongue sections respectively. In another embodiment, the contacts are grouped into first, second and third sets of contacts positioned in the first, second and third tongue sections respectively. In another embodiment, an interconnect system having at least one electrical connector coupled to two electrical connectors is described. | 2010-04-29 |
20100105250 | ELECTRICAL CONNECTOR - An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a socket shaped to at least partially receive a plug of said first data cable; a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; and a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; and insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable, wherein the insulation displacement contact slots are arranged so that adjacent pairs of insulation displacement contacts open in different directions. | 2010-04-29 |
20100105251 | Micro-SD To Secure Digital Adaptor Card And Manufacturing Method - A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding. | 2010-04-29 |
20100105252 | CONNECTORS INCLUDING SPRING TABS FOR HOLDING A CONTACT MODULE - A connector configured to hold a contact module. The connector includes a housing that has an interior surface defining a cavity that extends between first and second ends of the housing. The cavity is configured to receive and hold the contact module therein. The connector also includes a spring tab that is located in the cavity and oriented to project from the interior surface toward the first end of the housing. The spring tab is integrally formed with the housing. Also, the connector includes a ridge portion that is located in the cavity and oriented to project from the interior surface. The contact module is retained between the ridge portion and the spring tab. | 2010-04-29 |
20100105253 | Electrical connection structure - An electrical connection structure that includes a first connection portion of the connection member that is fixedly fastened to the first terminal by a fastening bolt, and a second connection portion of the connection member that is connected to the second terminal through an insertable/removable plug, the first connection portion is fixedly fastened to the first terminal by inserting the fastening bolt through an insertion hole provided in one of the connection member and the first terminal, and fastening the fastening bolt in a fastening hole provided in the other of the connection member and the first terminal, the insertion hole is formed larger than a diameter of a shaft-like portion of the fastening bolt, and an inserting/removing direction of the plug and an axial direction of the fastening bolt are substantially parallel to each other. | 2010-04-29 |
20100105254 | ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY - The present invention relates to an electrical connector, which comprises means for preventing terminals from being deformed during connection of the connector. The electrical connector of the present invention comprises: a terminal position assuring member mounted to a connector housing; and a terminal protecting plate mounted to the terminal position assuring member. The terminal protecting plate comprises a first engaging element and the terminal position assuring member comprises a second engaging compactly configured since there is no need to provide any means for mounting or retaining the terminal protecting plate to the connector housing. | 2010-04-29 |
20100105255 | CONDUCTOR BASE AND FINGER MODULE OF AIR CIRCUIT BREAKER - A conductor base coupled to a finger module of an air circuit breaker. Since the connector of the conductor base has the curved surface formed on a side of an end portion thereof and tooth-coupled with the contactor of the finger module, the contactor of the finger module has another curved surface corresponding to the curved surface of the connector and the contactor is elastically supported in a vertical direction by the plate spring to allow both end portions of the contactor to perform a vertical elastic movement relative to a longitudinal center of the contactor. The present invention can prevent damages due to a mechanical impact between the connector of the conductor base and the contactor of the finger module, which may occur while the breaker terminal is inserted into the finger module, to thereby extend the lifespan of the conductor base and the finger module. | 2010-04-29 |
20100105256 | Electrical Contact Assembly and Method of Manufacture - An electrical contact assembly has a plurality of formed elongate closed seam tubular elements attached to a carrier with each of the elongate tubular elements attached to the carrier via a tab. Scored creases are formed in the tabs for separating the elongate tubular elements from the assembly and scored creases are formed in the carrier for defining carrier strips. The carrier strip had a plurality of grouped elongate tubular elements. The electrical contact assembly is placed in a crimping die where at least one or more wires are inserting into selected elongate tubular elements. Pressure is applied to least one or more of the selected elongate tubular elements to produce bulk material deformation along a substantial portion of the elongate tubular elements to crimp the elongate tubular elements to the wires as electrical contacts. | 2010-04-29 |
20100105257 | CRIMP TERMINAL AND METHOD OF PRODUCING CRIMP TERMINAL - A crimp terminal includes a bottom plate portion for mounting a wire conductor of a wire thereon, a pair of press-fastening portions extended respectively from opposite side edges of the bottom plate portion to press-fasten the wire conductor, a raised portion provided on the bottom plate portion, and that has slanting surfaces slanting along an axis of the wire conductor mounted on the bottom plate portion to form a curved shape projecting toward the wire conductor, and an auxiliary contact portion protrudingly formed on at least one of the slanting surfaces. The auxiliary contact portion is moved in a direction along the axis of the wire conductor by a pressing load applied for crimping the wire conductor so that the wire conductor is elongated. | 2010-04-29 |
20100105258 | INTERCONNECT DEVICE FOR BATTERY CELL ASSEMBLIES - An interconnect device for battery cell assemblies is provided. The interconnect device couples a first set of electrodes at a first polarity in series with a second set of electrodes at a second polarity in a battery module. | 2010-04-29 |
20100105259 | PROPULSION ARRANGEMENT - A propulsion arrangement for a marine vessel is disclosed. The propulsion arrangement comprises an engine ( | 2010-04-29 |
20100105260 | Waterjet Unit Impeller - A variable rating impeller ( | 2010-04-29 |
20100105261 | POWER STEERING APPARATUS OF WATERCRAFT WITH PROPELLER - In a power steering apparatus of a watercraft | 2010-04-29 |
20100105262 | THROTTLE VALVE DRIVE MECHANISM OF OUTBOARD ENGINE UNIT - Pivot arm supported by a base is pivotable about an arm support shaft by being pulled via a throttle cable, and a throttle cam supported by the base via a cam support shaft and having a guide groove that has a guide section of the pivot arm movably therein. The arm support shaft and the cam support shaft are disposed in non-parallel relation to a valve shaft of the throttle valve and at such positions as not to overlap the throttle valve as viewed from a lateral side of the throttle valve drive mechanism. | 2010-04-29 |
20100105263 | WATER SPORT TRAINING DEVICE - A water sport training device is disclosed comprising, in one embodiment, a raft having a distal nose portion and a proximal rear portion. A relatively rigid platform is positioned within the raft and configured to provide a stable surface for the person during use of the device. A tow rope attachment means is secured to the raft for selectively towing the device over a body of water, the attachment means comprising at least one tow rope attachment point located on the nose portion of the raft, below a nose portion mid-plane. The device is configured such that a back half of the device has a center buoyancy sufficient for providing a stable surface to support the weight of a person while floating on water both at standstill and as being pulled through the water as by a boat. | 2010-04-29 |
20100105264 | GASKET RELEASE AGENT - Various gasket release agents and methods of providing and using the same are provided with a gasket body having a release agent coating on one or more surfaces that contact mating surfaces of a joining assembly. The coating may be provided as a mixture of constituents including hexagonal boron nitride. Other constituents may include a release agent and a binding material that enhances the adhesion of the release agent to the gasket body surfaces. A binding material may include, for example, organic or inorganic materials. Surfactants, in some embodiments, may be added to a gasket release agent dispersion in addition to binder materials and fillers. | 2010-04-29 |
20100105265 | STRETCHABLE SHEET AND METHOD FOR PRODUCING THE SAME - A sheet is produced by (i) producing a sheet by entangling woven or knitted material including a thread composed of a composite fiber such that two kinds or more of polyethylene terephthalate polymers different in intrinsic viscosity are stuck together in a side-by-side type along the fiber length direction and/or of a core-in-sheath type composite fiber such that two kinds or more of polyethylene terephthalate polymers different in intrinsic viscosity form an eccentric core-in-sheath structure, with a fiber capable of converting into ultra fine fibers composed of two kinds or more of polymeric substances different in solubility in solvent, (ii) developing an ultra fine fiber with an average single fiber fineness of 0.001 dtex or more and 0.5 dtex or less by treating the sheet with a solvent to thereafter provide elastomer having polyurethane as a main component by impregnating and solidifying solvent solution of elastomer having polyurethane as a main component into the sheet, or of providing elastomer having polyurethane as a main component by impregnating and solidifying solvent solution of elastomer having polyurethane as a main component into the sheet to thereafter develop an ultra fine fiber with an average single fiber fineness of 0.001 dtex or more and 0.5 dtex or less by treating the sheet with a solvent, and (iii) rubbing and shrinking the woven or knitted material under the condition of 110° C. or more. | 2010-04-29 |
20100105266 | COMPOSITE FIRE SHIELD - A fire-critical aircraft or other component within a fire-risk zone includes a protective fire shield directly exposed to the fire-risk zone and separating the fire-critical component therefrom. The fire shield has an entirely composite construction composed of fibre cloth impregnated with a sacrificial resin which has a melting point that is below that of the fibre cloth. When exposed to fire, the fibre cloth remains substantially intact for at least the minimum period of time while the sacrificial resin is allowed to be at least partially consumed by the fire, such that the protective fire shield is partially sacrificed. | 2010-04-29 |
20100105267 | METHOD FOR PRODUCING A REINFORCED POLYESTER NON-WOVEN MATERIAL - A method for producing a reinforced polyester non-woven material suitable for use as a roofing material, comprising: forming a mixture comprising glass fibers and a liquid binder; applying the mixture to a polyester non-woven material; and curing the liquid binder to form a layer comprising glass fibers that is attached to the polyester non-woven material. | 2010-04-29 |
20100105268 | Pi-Preform with Variable Width Clevis - A woven preform for a reinforced composite material, which may be woven flat and folded into shape. The preform has a three-dimensional weave architecture with fill fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. At least two legs extend from a base, the base and legs each having at least two layers of warp fibers. The legs may be parallel or angled to each other, or may have a variable width clevis in between. The outer ends of the base and/or the legs preferably have tapers formed from terminating layers of warp fibers in a stepped pattern. | 2010-04-29 |
20100105269 | Pi-Shaped Preform - A woven preform for a reinforced composite material, which may be woven flat and folded into shape. The preform has a three-dimensional weave architecture with weft fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. One or more legs extend from a base, the base and legs each having at least two layers of warp fibers. The legs may be parallel or angled to each other and/or may move along a sine wave in the warp and/or weft direction. The outer ends of the base and/or the legs preferably have tapers formed from terminating layers of warp fibers in a stepped pattern. | 2010-04-29 |
20100105270 | Fabric structure - A fabric structure includes a plurality of first light-reflecting units, a plurality of light-guiding units, and a plurality of second light-reflecting units. The cross-section of the first light-reflecting units and the second light-reflecting units is triangular or square, and the brightness of the first light-reflecting unit and the second light-reflecting units is between level | 2010-04-29 |
20100105271 | PH Buffering Hybrid Material and the Forming Method Thereof - The present invention discloses a pH buffering hybrid material and the forming method thereof. The pH buffering hybrid material comprises a substrate, a conductive polymer layer on the substrate, and a ZnO nanorod layer produced by deposition of ZnO particles as nucleuses on the conductive polymer layer, and the ZnO particles growing into the ZnO nanorods via hydrothermal reaction. The pH buffering hybrid material has the pH turning ability and the potential of conductivity. | 2010-04-29 |
20100105272 | ROOFING MAT USING UREA-FORMALDEHYDE BINDER OF PARTICULAR VISCOSITY AND SURFACE TENSION - Provided is thermosetting urea-formaldehyde (UF) resin binder formulation, preferably prepared with modified styrene-maleic anhydride. The formulation has a viscosity in the range of from 3 to 10 cP and a surface tension of from 35 to 50 mN/m, and is prepared using a UF resin composition exhibiting a viscosity of from 175 to 250 cP. | 2010-04-29 |
20100105273 | NON-WOVEN FABRIC LAMINATE - An object of the present invention is to develop a non-woven fabric laminate that is excellent in stretchability, flexibility, and bulkiness, and that is less sticky and is suitable for a mechanical fastening female material. | 2010-04-29 |
20100105274 | Polypropylene Fibers and Spunbond Nonwoven with Improved Properties - The present invention relates to a process for the production of polypropylene fibers and polypropylene spunbond nonwoven comprising a degradation step, wherein the melt flow of the polypropylene is increased, and a fiber or filament extrusion step. The present invention also relates to the fibers and nonwoven produced with said process and to composites and laminates comprising said fibers and nonwoven. | 2010-04-29 |
20100105275 | ORGANIC ELECTROLUMINESCENCE DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic EL display panel, the method includes: a step of forming a first electrode on a substrate; a step of forming an organic functional layer; and a step of forming a second electrode comprising a plurality of stripe-shape electrodes, wherein the step of forming the second electrode includes: a step of pressing a sealing substrate, which has an insulating blade portion protruding toward this substrate, toward the substrate, so that the blade portion mechanically severs a conductive thin film deposited on the organic functional layer, thereby causing separation of adjacent stripe-shape electrodes among the plurality of stripe-shape electrodes, with the blade portion being enclosed therebetween; and a step of fixing the sealing substrate to the substrate. | 2010-04-29 |
20100105276 | APPARATUS AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY PANEL - In a method for manufacturing a liquid crystal display panel, a sealant having a cut-out formed at least on the other end side of a display region is provided on one film substrate. A liquid crystal material is supplied to one end side of the display region in the one film substrate or the other film substrate. An apparatus for manufacturing a liquid crystal display panel includes a bonding unit arranged to bond the pair of film substrates to each other through the sealant and the liquid crystal material by pressing respective surfaces of the film substrates so that a pressure in a middle of the film substrates becomes higher than that at both ends thereof, and a sealing unit arranged to seal the cut-out of the sealant to the pair of film substrates bonded in the bonding unit. | 2010-04-29 |
20100105277 | FLAT DISPLAY PANEL SEALING APPARATUS AND METHOD OF THE SAME - A flat display panel sealing device that can prevent separation of a sealant by applying pressure to a first substrate and a second substrate with the sealant therebetween is disclosed. While the pressure is applied, light is irradiated to the sealant, whereby the first and second substrates are sealed together. | 2010-04-29 |
20100105278 | ELECTRONIC TOY CAPABLE OF AUTOMATICALLY OPENING MOUTH AND STICKING TONGUE OUT - A toy includes a head, a tongue, and a driving unit. The head includes a skull, an upper jaw fixed to the skull, and a lower jaw rotatably coupled to the skull and facing the upper jaw to cooperatively define an oral cavity. The tongue received in the oral cavity includes a tongue tip and a guiding rod assembly. The driving unit includes a driving shaft fixed to the skull, a rotatable disk rotatably coupled to the driving shaft, a first lever pivotally coupled between the rotatable disk and the lower jaw, a second lever pivotally coupled between the rotatable disk and the guiding rod assembly and a motor. One end of the guiding rod assembly is received in the tongue. The motor drives the rotatable disk to rotate such that the lower jaw rotates away from the upper jaw and the tongue tip protrudes out from the oral cavity. | 2010-04-29 |
20100105279 | SIMULATIVE EYE FOR TOY - A simulative eye is capable of being operated between a normal state and a dilated state. The simulative eye includes an eyeball, a pupil disposed on the eyeball, an iris surrounding the pupil, and a light source. When the simulative eye is in a normal state, a color of the iris is different from that of the pupil when the iris is not irradiated by the light emitted from the light source. When the iris is irradiated by the light emitted from the light source, the color of the iris is almost the same as that of the pupil. As a result, the simulative eye is changed from the normal state to the dilated state. | 2010-04-29 |
20100105280 | SIMULATED EYE FOR TOY - A simulated eye is capable of being changed between a contracted state and a dilated state. The simulated eye includes a shell defining an opening, an eyeball, and a driving device. The eyeball is received in the shell and exposed at the opening, the eyeball includes a lens and a pupil, the pupil is visible through the lens, and a virtual image of the pupil formed via the lens. The driving device is configured to drive the pupil to move toward and backward the lens. When the transmission member drives the pupil to move, the virtual image of the pupil is changeable, and the simulated eye changed between a contracted state and a dilated state. | 2010-04-29 |
20100105281 | SIMULATED EYE - A simulated eye includes a spherical cap eyeball, a resilient film, a driving mechanism, and a transmission mechanism. The eyeball includes a plurality of guide arms on an inner surface thereof. The resilient film received in the eyeball includes a pupil portion and an iris portion surrounding the pupil portion. The driving mechanism provides a first driving force and a second force opposite to the first driving force in direction. The transmission mechanism arranged between the driving mechanism and the resilient film includes a plurality of transmission members received and movable in the corresponding guide arms. | 2010-04-29 |
20100105282 | BEE HOUSE - A bee house for housing a plurality of bee hives includes a generally rectangular frame and four upwardly extending opaque fixed walls fixed to the frame and a gable roof having a generally triangular cross-section. The roof has a peak and a pair of eaves or outer edges below its peak and defines a longitudinally extending opening between a pair of roof panels at or along the peak. The bee house also includes a plurality of shelves for holding three bee hives on each shelf and an air-conditioner for maintaining the bee house at a temperature of between about 25° C. and 35 C. | 2010-04-29 |
20100105283 | SURGICAL GARMENT - A surgical garment includes an undergarment and an outer garment configured to be worn over the undergarment. The undergarment includes a brassiere including a front panel, a back panel, a shoulder strap extending from a top portion of a first side of the front panel to a top portion of a first side of the back panel, a width of elastic material extending along a bottom of the front and back panels, and a releasable fastening system releasably coupling a side portion of the first side of the front panel with a side portion of the first side of the back panel. The outer garment includes a torso portion and removable shoulder portions extending from the torso portion. | 2010-04-29 |
20100105284 | GARMENT - Certain embodiments of the disclosure relate to a garment comprising:
| 2010-04-29 |
20100105285 | MICRO-CURRENT MASSAGING BRASSIERE PAD - A micro-current massaging brassiere pad includes a flexible pad, a controller mounted in the pad and having a control IC for outputting a pulse waveform and two lead wires for connection to the positive pole and the negative pole of a power source respectively, an electrically insulative outer cover layer covered on the outer side of the pad, and an inner cover layer covered on the inner side of the pad for direct contact with one breast of a female user, the inner cover layer having two isolated conducting zones respectively connected to the two lead wires of the controller such that when electricity is connected through the lead wires of the controller, a medium or low frequency pulse is discharged through the inner cover layer to stimulate the breast of the female user. | 2010-04-29 |
20100105286 | COMFORT BRA LINER - A foldable one-piece insert worn between the bra and the body having irritation reducing and/or absorbent material portions which line the bra cup and that lie under the supported breast, and portions which extends toward the torso rear under the bra side straps and a portion extending below the bra line along the torso. The invention further includes a material tab disposed between the material portions lining the bra cups, which can optionally be worn up to bridge the area between the bra cups for added protection, comfort and absorption of perspiration, or be folded down and out of sight when worn with lower cut neckline outer garments. | 2010-04-29 |
20100105287 | COMPACT ELECTRIC GRINDING MACHINE - The present invention particularly relates to a hand-held sanding machine with an outer housing ( | 2010-04-29 |
20100105288 | MULTIPLE LIBRARIES FOR SPECTROGRAPHIC MONITORING OF ZONES OF A SUBSTRATE DURING PROCESSING - Methods, systems, and apparatus, including computer program products, for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes receiving a first sequence of current spectra of reflected light from a first zone of a substrate. A second sequence of current spectra of reflected light from a second zone of the substrate is received. Each current spectrum from the first sequence of current spectra is compared to a plurality of reference spectra from a first reference spectra library to generate a first sequence of best-match reference spectra. Each current spectrum from the second sequence of current spectra is compared to a plurality of reference spectra from a second reference spectra library to generate a second sequence of best-match reference spectra. The second reference spectra library is distinct from the first reference spectra library. | 2010-04-29 |
20100105289 | GRINDING MACHINE AND GRINDING METHOD - A grinding machine includes: a workhead ( | 2010-04-29 |
20100105290 | METHODS AND APPARATUS FOR INDICATING A POLISHING TAPE END - Apparatus and methods are provided for polishing a substrate with a polishing tape. The polishing tape includes a first surface adapted to contact a substrate; and a second surface, wherein at least one of the first and second surfaces include a feature adapted to indicate an end condition. Numerous other aspects are provided. | 2010-04-29 |
20100105291 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided. | 2010-04-29 |
20100105292 | METHOD FOR MACHINING THAT COMBINES FINE BORING AND HONING AND MACHINING EQUIPMENT FOR THE EXECUTION OF THE METHOD - According to a method for the fine machining of internal surfaces of bore holes in tools by fine boring and subsequent honing, the following steps are executed: Fine boring of at least one bore hole ( | 2010-04-29 |
20100105293 | SPECTACLE LENS EDGING METHOD - A lens holder ( | 2010-04-29 |
20100105294 | METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING - Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided. | 2010-04-29 |
20100105295 | POLISHING PAD SEASONING METHOD, SEASONING PLATE, AND SEMICONDUCTOR POLISHING DEVICE - A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate. | 2010-04-29 |
20100105296 | ULTRA SMOOTH FACE SPUTTER TARGETS AND METHODS OF PRODUCING SAME - A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium. | 2010-04-29 |