| 17th week of 2013 patent applcation highlights part 17 |
| Patent application number | Title | Published |
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| 20130099359 | SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip having a plurality of bonding pads, dielectric members formed over the semiconductor chip in such a way as to expose portions of respective bonding pads and having a trapezoidal sectional shape, and bumps formed to cover the exposed portions of the respective bonding pads and portions of the dielectric members and having a step-like sectional shape. | 2013-04-25 |
| 20130099360 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package includes a semiconductor chip having a front surface and a back surface facing away from the front surface; a through electrode formed in the semiconductor chip and passing through the front surface and the back surface; and a contamination preventing layer formed in the semiconductor chip, the through electrode passing through the contamination preventing layer. | 2013-04-25 |
| 20130099361 | Semiconductor Structure and Method for Manufacturing the Same - The present invention provides a method for manufacturing a semiconductor structure, comprising the steps of: providing a semiconductor substrate, forming an insulating layer on the semiconductor substrate, and forming a semiconductor base layer on the insulating layer; forming a sacrificial layer and a spacer surrounding the sacrificial layer on the semiconductor base layer, and etching the semiconductor base layer by taking the spacer as a mask to form a semiconductor body; forming an insulating film on sidewalls of the semiconductor body; removing the sacrificial layer and the semiconductor body located under the sacrificial layer to form a first semiconductor fin and a second semiconductor fin. Correspondingly, the present invention further provides a semiconductor structure. In the present invention, an oxide film is formed on the sidewalls of the two semiconductor fins that are far away from each other, while only the sidewalls of the two semiconductor fins that are opposite to each other are exposed, such that conventional operations may be easily performed to the sidewalls opposite to each other in the subsequent process. | 2013-04-25 |
| 20130099362 | METHOD OF FORMING SELF-ASSEMBLED PATTERNS USING BLOCK COPOLYMERS, AND ARTICLES THEREOF - A method of forming a block copolymer pattern comprises providing a substrate comprising a topographic pre-pattern comprising a ridge surface separated by a height, h, greater than 0 nanometers from a trench surface; disposing a block copolymer comprising two or more block components on the topographic pre-pattern to form a layer having a thickness of more than 0 nanometers over the ridge surface and the trench surface; and annealing the layer to form a block copolymer pattern having a periodicity of the topographic pre-pattern, the block copolymer pattern comprising microdomains of self-assembled block copolymer disposed on the ridge surface and the trench surface, wherein the microdomains disposed on the ridge surface have a different orientation compared to the microdomains disposed on the trench surface. Also disclosed are semiconductor devices. | 2013-04-25 |
| 20130099363 | Molecular Self-Assembly in Substrate Processing - Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, fluoroalkyl groups, heteroaryl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming. | 2013-04-25 |
| 20130099364 | Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method - A top-side cooled semiconductor package with stacked interconnection plate is disclosed. The semiconductor package includes a circuit substrate with terminal leads, a semiconductor die atop the circuit substrate, a low thermal resistance intimate interconnection plate for bonding and interconnecting a top contact area of the semiconductor die with the circuit substrate, a low thermal resistance stacked interconnection plate atop the intimate interconnection plate for top-side cooling, a molding encapsulant for encapsulating the package except for exposing a top surface of the stacked interconnection plate to maintain effective top-side cooling. The top portion of the stacked interconnection plate can include a peripheral overhang above the intimate interconnection plate. The peripheral overhang allows for a maximized exposed top surface area for heat dissipation independent of otherwise areal constraints applicable to the intimate interconnection plate. The stacked interconnection plate can be partially etched or three dimensionally formed to create the peripheral overhang. | 2013-04-25 |
| 20130099365 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME LEAD ARRAY ROUTING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a leadframe with a grid lead and a support pad; connecting a redistribution layer to the grid lead, the redistribution layer over the support pad; mounting an integrated circuit over the redistribution layer; applying an encapsulation on the redistribution layer, the redistribution layer in an interior area of the leadframe and the interior area under the integrated circuit; forming a support pad residue on the bottom surface of the redistribution layer by removing the support pad under the encapsulation and the interior redistribution layer; and forming an insulation layer on the support pad residue and the grid lead. | 2013-04-25 |
| 20130099366 | SYSTEMS AND METHODS FOR LEAD FRAME LOCKING DESIGN FEATURES - Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle. | 2013-04-25 |
| 20130099367 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLANARITY CONTROL AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation. | 2013-04-25 |
| 20130099368 | CHIP CARRIERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME - Chip carriers are provided. The chip carrier includes a carrier body having a cavity therein and at least one conductive through silicon via (TSV) penetrating the carrier body under the cavity. The cavity includes an uneven sidewall surface profile. The at least one conductive through silicon via (TSV) is exposed at a bottom surface of the carrier body opposite to the cavity. Related methods are also provided. | 2013-04-25 |
| 20130099369 | Hermetic Surface Mount Packages for Diodes and Transistors - A discrete semiconductor package includes a discrete semiconductor device disposed upon a non-conductive substrate, with via-connected upper and lower conductive ports. By utilizing a plurality of vias to connect the ports within the non-conductive substrate, and by depositing metals directly upon the surface of the substrate, manufacturing of such semiconductor packages is cheaper and more effective. | 2013-04-25 |
| 20130099370 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm. | 2013-04-25 |
| 20130099371 | SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT - A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The silver (Ag) content in the solder layer is between 0.5 and 1.8 weight percent. | 2013-04-25 |
| 20130099372 | Methods of Forming Bump Structures That Include a Protection Layer - One illustrative method disclosed herein includes forming a conductive pad in a layer of insulating material, forming a passivation layer above the conductive pad, performing at least one etching process on the passivation layer to define an opening in the passivation layer that exposes at least a portion of the conductive pad, forming a protective layer on the passivation layer, in the opening and on the exposed portion of the conductive pad, forming a heat-curable material layer above the protective layer, performing an etching process to define a patterned heat-curable material layer having an opening that exposes a portion of the protective layer, performing an etching process on the protective layer to thereby expose at least a portion of the conductive pad and forming a conductive bump that is conductively coupled to the conductive pad. | 2013-04-25 |
| 20130099373 | SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR DEVICES ON A LOWER SEMICONDUCTOR DEVICE - Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other. | 2013-04-25 |
| 20130099374 | PACKAGE OF ELECTRONIC DEVICE INCLUDING CONNECTING BUMP, SYSTEM INCLUDING THE SAME AND METHOD FOR FABRICATING THE SAME - A package of an electronic device, a system including the same and a method for fabricating the same are provided. The package of the electronic device includes a substrate, a step difference layer and a connecting bump. The substrate allows a connecting contact part to be exposed on a surface thereof. The step difference layer covers the substrate so as to leave the connecting contact part exposed. The connecting bump is connected to the connecting contact part so that one end part of the connecting bump is extended on the step difference layer, and has a sloped upper surface formed by a step difference formed by the step difference layer. | 2013-04-25 |
| 20130099375 | SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A semiconductor package substrate including a substrate body having a front surface configured for mounting a semiconductor chip on the front surface and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body. | 2013-04-25 |
| 20130099376 | MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CONNECTORS - A packaged microelectronic element includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. A substrate has a major surface and a plurality of conductive elements exposed at the major surface and joined to the first solid metal posts. In particular examples, the conductive elements can be bond pads or can be second posts having top surfaces and edge surfaces extending at substantial angles away therefrom. Each first solid metal post includes a base region adjacent the microelectronic element and a tip region remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces. Each first solid metal post has a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region. | 2013-04-25 |
| 20130099377 | Molded Chip Interposer Structure and Methods - Apparatus and methods for providing a molded chip interposer structure and assembly. A molded chip structure having at least two integrated circuit dies disposed within a mold compound is provided having the die bond pads on the bottom surface; and solder bumps are formed in the openings of a dielectric layer on the bottom surface, the solder bumps forming connections to the bond pads. An interposer having a die side surface and a board side surface is provided having bump lands receiving the solder bumps of the molded chip structure on the die side of the interposer. An underfill layer is formed between the die side of the interposer and the bottom surface of the molded chip structure surrounding the solder bumps. Methods for forming the molded chip interposer structure are disclosed. | 2013-04-25 |
| 20130099378 | Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die - A semiconductor device has an interposer frame mounted over a carrier. A semiconductor die has an active surface and bumps formed over the active surface. The semiconductor die can be mounted within a die opening of the interposer frame or over the interposer frame. Stacked semiconductor die can also be mounted within the die opening of the interposer frame or over the interposer frame. Bond wires or bumps are formed between the semiconductor die and interposer frame. An encapsulant is deposited over the interposer frame and semiconductor die. An interconnect structure is formed over the encapsulant and bumps of the first semiconductor die. An electronic component, such as a discrete passive device, semiconductor die, or stacked semiconductor die, is mounted over the semiconductor die and interposer frame. The electronic component has an I/O count less than an I/O count of the semiconductor die. | 2013-04-25 |
| 20130099379 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT - A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions. | 2013-04-25 |
| 20130099380 | WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF - The present invention discloses a wafer level chip scale package device. The device includes: a chip including at least one bonding pad; a UBM layer disposed on the bonding pad; a pre-solder layer disposed on the UBM layer; and a bump melted and combined with the pre-solder layer. | 2013-04-25 |
| 20130099381 | SEMICONDUCTOR DEVICE AND CONNECTION CHECKING METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate, a first land formed in a first surface of the substrate, a second land formed in a second surface of the substrate, a first terminal coupled to the second land, a line coupled to the first land and the second land, a second terminal formed in the second surface of the substrate and a branch line coupled to the line and the second terminal. The second terminal is coupled to the first land and the second land and is not coupled to other lands in the first surface. The second surface is different surface from the first surface. | 2013-04-25 |
| 20130099382 | METHOD FOR PRODUCING AN ELECTRICAL FEEDTHROUGH IN A SUBSTRATE, AND A SUBSTRATE HAVING AN ELECTRICAL FEEDTHROUGH - A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the substrate on the first side; forming a second printed conductor on a second side of a substrate which electrically connects a second contact area of the substrate on the second side; forming an annular trench in the substrate, a substrate punch being formed which extends from the first contact area to the second contact area; and selectively depositing an electrically conductive layer on an inner surface of the annular trench, the substrate punch being coated with an electrically conductive layer and remaining electrically insulated from the surrounding substrate due to the annular trench. | 2013-04-25 |
| 20130099383 | Semiconductor Device and Method - An electrical device includes a semiconductor chip. The semiconductor chip includes a routing line. An insulating layer is arranged over the semiconductor chip. A solder deposit is arranged over the insulating layer. A via extends through an opening of the insulating layer to electrically connect the routing line to the solder deposit. A front edge line portion of the via facing the routing line is substantially straight, has a concave curvature or has a convex curvature of a diameter greater than a maximum lateral dimension of the via. | 2013-04-25 |
| 20130099384 | Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV - A stacked integrated circuit (IC) device with at least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) including a tip protruding beyond the bottom surface to a tip length is provided. The tip has an outer dielectric tip liner, and an electrically conductive portion within the outer dielectric tip liner. A compliant layer is applied to the bottom surface of the IC die. The dielectric tip liner is removed from a distal portion of the tip to expose an electrically conductive tip portion. A solder material is deposited on the exposed distal portion of the tip. The solder material is reflowed and coalesced to form a solder bump on the distal portion of the tip. | 2013-04-25 |
| 20130099385 | Packages and Methods for Forming the Same - A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size. | 2013-04-25 |
| 20130099386 | SEMICONDUCTOR MEMORY DEVICE HAVING CELL PATTERNS ON INTERCONNECTION AND FABRICATION METHOD THEREOF - A semiconductor memory device having a cell pattern formed on an interconnection and capable of reducing an interconnection resistance and a fabrication method thereof are provided. The semiconductor device includes a semiconductor substrate in which a cell area, a core area, and a peripheral area are defined and a bottom structure is formed, a conductive line formed on an entire structure of the semiconductor substrate, a memory cell pattern formed on the conductive line in the cell area, and a dummy conductive pattern formed on any one of the conductive line in the core area and the peripheral area. | 2013-04-25 |
| 20130099387 | MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METHOD FOR MANUFACTURE THEREOF - A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metallized vias and traces formed in contact with the second chip contacts. | 2013-04-25 |
| 20130099388 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package includes a first semiconductor chip having one surface, and an other surface which faces away from the one surface, and first through electrodes which pass through the one surface and the other surface and project out of the other surface; a second semiconductor chip stacked over the one surface of the first semiconductor chip and having second through electrodes which are connected with the first through electrodes; a heat dissipation member disposed over the second semiconductor chip; and a first heat absorbing member disposed to face the other surface of the first semiconductor chip and defined with through holes into which projecting portions of the first through electrodes are inserted. | 2013-04-25 |
| 20130099389 | MULTILAYERED CIRCUIT TYPE ANTENNA PACKAGE - A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer. | 2013-04-25 |
| 20130099390 | ELECTRONIC DEVICE - In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer. | 2013-04-25 |
| 20130099391 | CHAMFERED CORNER CRACKSTOP FOR AN INTEGRATED CIRCUIT CHIP - A corner crackstop is formed in each of the four corners of an integrated circuit (IC) chip, in which the corner crackstop differs structurally from a portion of the crackstop disposed along the sides of the IC chip. Each corner crackstop includes a plurality of layers, formed on a top surface of a silicon layer of the IC chip, within a perimeter boundary region that comprises a triangular area, in which a right angle is disposed on a bisector of the corner, equilateral sides of the triangle are parallel to sides of the IC chip, and the right angle is proximate to the corner relative to a hypotenuse of the triangle. The plurality of layers of the corner crackstop include crackstop elements, each comprising a metal cap centered over a via bar, in which the plurality of layers of the corner crackstop is chamfered to deflect crack ingress forces by each corner crackstop. | 2013-04-25 |
| 20130099392 | Support mounted electrically interconnected die assembly - Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder. | 2013-04-25 |
| 20130099393 | Stacked Semiconductor Package - Provided is a stacked semiconductor package. The present invention includes: a substrate having first and second connective pads provided on an upper surface thereof; a first cascade chip laminate which is loaded on the substrate and in which a plurality of first semiconductor chips are stacked in multiple stages to externally expose a first bonding pad wire-bonded through the first connective pad and a first conductive wire; a second cascade chip laminate in which a plurality of second semiconductor chips are stacked in the multiple stages to externally expose a second bonding pad wire-bonded through the second connective pad and a second conductive wire to an area corresponding to the first bonding pad; and a joint part for joining the first cascade chip laminate and the second cascade chip laminate. | 2013-04-25 |
| 20130099394 | FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR - The film for back surface of flip-chip semiconductor according to the present invention is a film for back surface of flip-chip semiconductor to be formed on a back surface of a semiconductor element having been flip-chip connected onto an adherend, wherein a tensile storage elastic modulus at 23° C. after thermal curing is 10 GPa or more and not more than 50 GPa. According to the film for back surface of flip-chip semiconductor of the present invention, since it is formed on the back surface of a semiconductor element having been flip-chip connected onto an adherend, it fulfills a function to protect the semiconductor element. In addition, since the film for back surface of flip-chip semiconductor according to the present invention has a tensile storage elastic modulus at 23° C. after thermal curing of 10 GPa or more, a warp of the semiconductor element generated at the time of flip-chip connection of a semiconductor element onto an adherend can be effectively suppressed or prevented. | 2013-04-25 |
| 20130099395 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. | 2013-04-25 |
| 20130099396 | WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE - A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation. | 2013-04-25 |
| 20130099397 | Humidifier - A domestic humidifier ( | 2013-04-25 |
| 20130099398 | MICROBUBBLE-GENERATING APPARATUS - The micro bubble generator comprises a gas-liquid generating tank and an outer shell tank and the space there between is configured as a channel for the liquid. A plurality of liquid supply ports are provided in the channel and supply liquid through the channel into the gas-liquid generating tank from the liquid supply ports. Inside the gas-liquid generating tank, a swirling flow is generated by the supplied liquid and a negative pressure cavity is thereby generated near the axis of the cylinder axis. From the gas supply portion, gas is supplied from the outside by the action of the negative pressure cavity or by additionally forcing the gas supply. The supplied gas is formed into micro bubbles by the swirling liquid flow and is discharged from the gas-liquid outlet discharging port as a gas-liquid. | 2013-04-25 |
| 20130099399 | CARBURETOR INCLUDING ONE-PIECE FUEL-METERING INSERT - A carburetor includes a body having an inner wall and an air/fuel passageway. An insert includes a base having a shape that closely matches the inner wall and a first tower having a first end disposed within the air/fuel passageway. A main circuit passageway is at least partially formed within the first tower and has a first end in fluid communication with the air/fuel passageway and a second end in fluid communication with the fuel bowl chamber. The main circuit passageway carries fuel from the fuel bowl chamber to the air/fuel passageway during engine operation when the throttle valve is opened. A second tower has a first end coupled to the base and a second end spaced away from the base. The first end of the first tower, the second end of the second tower, and the base are the sole engagement points between the insert and the body. | 2013-04-25 |
| 20130099400 | MODULAR ELECTRONIC CARBONATOR FLUID LEVEL CONTROL MECHANISM - A carbonator tank assembly is disclosed for use in a beverage machine wherein the beverage dispensed therefrom is a carbonated beverage. The carbonator tank includes walls defining a carbonator tank interior. A probe assembly is provided for coupling in a gaseous and fluid-type manner to the walls of the carbonator tank. The probe assembly has no floats but includes elongated probes having removed ends configured to extend into the interior of the carbonator tank and near ends exposed exteriorly. An electronics module is adapt to fluidly enclose an electronics assembly therein. The electronics module includes walls adapted to receive an electrical cable carrying electrical energy from a remote source. | 2013-04-25 |
| 20130099401 | MEMBRANE FOR AIR DIFFUSER - A membrane for use in an air diffuser. The membrane includes a nub with a perforation. The nub and perforation and arranged and sized to create smaller bubbles of gas in a liquid column above the membrane. | 2013-04-25 |
| 20130099402 | VALVE TRAY - The present invention relates to a valve tray for mass transfer columns having a base plate, at least one liquid intake and at least one liquid outlet for forming a liquid flow having a direction of flow on the base plate, a plurality of gas entry orifices formed in the base plate and also a plurality of fixed valves covering the gas entry orifices, which fixed valves are formed in one piece with the base plate and in each case include a valve roof at a distance to the base plate and also a valve rear side and a valve front side, wherein between the base plate, the valve rear side, the valve front side and the valve roof of each fixed valve, at least one side gas outlet orifice is formed in each case. The side gas outlet orifices of the fixed valves can taper in the direction of flow of the liquid flow. | 2013-04-25 |
| 20130099403 | SEMEN CASSIAE SOFT CAPSULE FOR REDUCING FAT AND LOSING WEIGHT AND PREPARATION METHOD THEREOF | 2013-04-25 |
| 20130099404 | SULFUR GRANULATOR SYSTEM AND METHOD - Sulfur (or sulphur) spray nozzles disposed with a tank spray liquid molten sulfur into the cooling liquid in the tank. Solid sulfur seeds are formed in the cooling liquid and settle in the tank. The tank may be a spiral dewaterer tank that has a screw conveyor at the bottom of the tank that moves the seeds to a granulating drum for enlargement into sulfur granules. The tank may also be used to capture and remove sulfur dust from a slurry of sulfur dust and water recycled from the granulating drum. The sulfur dust in the cooling tank may be captured by contact with molten sulfur droplets streaming down the cooling liquid column such that the dust particles become incorporated into the droplet, thereby being converted to seed. The granulating drum may be equipped with two or more sets of segmented lifting flights. The sets of flights may not be in alignment. The flights may be spaced apart from the inside surface of the drum with segmented rib members. The rib members may allow for the movement of sulfur seeds and granules between the flights and the inside surface of the drum as the drum rotates. | 2013-04-25 |
| 20130099405 | Apparatus for Carrying Out a Resin Transfer Moulding (RTM) Process and Resin Transfer Moulding (RTM) Process - Apparatus for resin transfer molding (RTM) and an RTM process for producing integral components. The apparatus has a closable mold (W) with a mold cavity (F), and an injection unit ( | 2013-04-25 |
| 20130099406 | METHOD FOR MANUFACTURING A FRICTION TRANSMISSION BELT - A method for manufacturing a friction drive belt for transmitting power while being wound around a pulley such that a compression rubber layer provided on an inner periphery of a belt body is in contact with the pulley enables both of noise reduction during the run of the belt and greater durability. A plurality of pores | 2013-04-25 |
| 20130099407 | Apparatus, Kits and Methods for the Production of Biomimetic Constructs - This invention relates to apparatus, kits and methods for the production of biomimetic constructs by plastically compressing a gel, such as a collagen gel, in a well using a plunger, which may be porous. The apparatus, kits and methods allow biomimetic constructs to be produced in a controlled and reproducible manner and are suitable for the production of multilayered constructs. | 2013-04-25 |
| 20130099408 | Soft Extensible Nonwoven Webs Containing Multicomponent Fibers with High Melt Flow Rates - The present invention provides nonwoven webs comprising multicomponent fibers that enable the nonwoven web to possess high extensibility. The multicomponent fibers will comprise a first component comprising a polypropylene composition having a melt flow rate of from about 100 to about 2000 grams per 10 minutes and a second component comprising a polymer composition having a melt flow rate lower than the melt flow rate of the first component. The first component comprises at least about 10% of a surface of the multicomponent fiber. | 2013-04-25 |
| 20130099409 | Apparatus and Method for Guiding and Depositing Synthetic Fibers to Form a Nonwoven Web - An apparatus and a method for guiding and depositing synthetic fibers to form a nonwoven web is described. The apparatus has a drawing device, a deposit belt, and a plurality of guidance means disposed between the drawing device and the deposit belt, which form in pairs numerous merging guidance pathways for the guidance of a fiber curtain formed by the fibers. The guidance means have numerous air intake slits beneath the drawing device, which enable an introduction of a secondary airstream. Numerous air conducting elements disposed on one of the guidance means are associated with at least one of the air intake slits. In this manner at least one of the sub-streams of the secondary airstream laterally adjacent to the fiber curtain can be introduced to the fiber stream at an inflow angle that is at a right angle to the deposit belt. | 2013-04-25 |
| 20130099410 | EXTENDED RELEASE TABLET AND METHOD FOR MAKING AND USING SAME - Provided are cap layer compositions and base layer compositions, providing quick and extended release of an active ingredient, respectively, when placed in water. Further provided are dual release compositions including a base composition and a cap composition. The base composition may include a plaster and an active agent, and it may further include at least one of a water-soluble binder, a non-water-soluble binder, and a lubricant. The cap composition may include a plaster and an active agent, and it may further include at least one of a disintegrating agent, a non-water-soluble binder, and a lubricant. The compositions may be heated and mixed and formed into a tablet. Further provided are methods of making the compositions. Further provided are methods of controlling or eliminating pests and methods of increasing the potability of water. The compositions are effective for controlling or eliminating pests such as mosquitoes when applied at an application site. | 2013-04-25 |
| 20130099411 | WATER-PROOF SOUND-TRANSMITTING MEMBRANE, METHOD FOR PRODUCING WATER-PROOF SOUND-TRANSMITTING MEMBRANE, AND ELECTRICAL APPLIANCE USING THE MEMBRANE - A water-proof sound-transmitting membrane | 2013-04-25 |
| 20130099412 | EXTRUSION-MOLDING DEVICE AND METHOD FOR PRODUCING MOLDED BODY USING SAME - The extrusion-molding device of the invention includes a flow passage for transporting a paste raw material composition; a screw provided at an upstream side of the flow passage to knead the raw material composition and transport it to a downstream side; a die provided at a downstream side of the flow passage to extrude a molded body composed of the raw material composition therefrom; a resistive tube for connecting the flow passage and the die; and a current plate provided between the screw and the die. The current plate comprises a plurality of through-holes that penetrate from a upstream end side to a downstream end side, and an opening of the through-hole on the upstream end side has a larger open area than an opening on the downstream end side. | 2013-04-25 |
| 20130099413 | FILM PRODUCTION APPARATUS AND METHOD FOR PRODUCING FILM - Provided is a film production apparatus and a method for producing film capable of exerting a good effect of preventing necking-in by minimizing the length of molten resin after extrusion through a die exit and before a contact with the surface of a chill roll. A film production apparatus configured to take up molten resin extruded downward from an exit bored in a die by a rotating chill roll located below the exit and to cool the molten resin for solidification by the chill roll to produce a film further includes a fluid providing unit that provides fluid to a space between the exit and the chill roll located below. The film production apparatus is configured to apply fluid pressure in a direction pushing back the molten resin existing in the space against displacement of the molten rein taken up in a rotational direction of the chill roll. | 2013-04-25 |
| 20130099414 | PROCESS FOR MOLDING A CLOSURE-SUPPORT RING OF A CONTAINER LID - A process is disclosed for forming a brim-mount ring included in a container lid. The brim-mount ring is configured to mount on the brim of the container and to have a core made of a first material and a surrounding skin made of a second material | 2013-04-25 |
| 20130099415 | DEVICE FOR HOLDING A COMPONENT TO BE SHEATHED IN PLASTIC, AND METHOD FOR SHEATHING A COMPONENT - A device for holding a component to be sheathed with plastic includes a holding element for producing a releasable mechanical keyed connection with an affixation region of the component, which holding element has a push-twist locking element. | 2013-04-25 |
| 20130099416 | APPARATUS AND METHOD FOR EDGE SEALING OF FOAM BOARDS - A method and machine for sealing at least one cut edge of a foam board is disclosed. The foam board has a top surface, a bottom surface and at least one cut edge extending between the top surface and the bottom surface. The cut edge is passed over a heated roller to soften the edge and then passed over a second roller having a temperature that is lower than the temperature of the first roller which seals the edge. The cut edge may be milled to square the edge relative to the top and bottom of the board before the cut edge is passed over the heated roller. Additional pairs of rollers may be provided to seal the top surface and the bottom surface of the foam board. | 2013-04-25 |
| 20130099417 | EMBOSSING UNIT AND EMBOSSING METHOD - An embossing unit including at least one embossing roller, provided with embossing protrusions or recesses on a cylindrical surface; at least one pressure roller coated with an elastically yielding material and cooperating with the embossing roller; at least one actuator that presses the pressure roller and the embossing roller against each other; an automatic position adjustment system, to adjust the reciprocal position of the pressure roller and the embossing roller. | 2013-04-25 |
| 20130099418 | MULTI-PIECE MOLD AND METHOD OF MAKING SLURRY DISTRIBUTOR - A multi-piece mold for use in a method for making a slurry distributor includes a plurality of mold segments adapted to be removably secured together. The mold segments are configured such that, when the mold segments are assembled together, the assembled mold segments define a substantially continuous exterior surface adapted to be a negative image of an interior flow region of a slurry distributor molded thereupon. Each mold segment has a maximum cross-sectional area in a plane substantially transverse to a direction of movement of the mold segment along a removal path out of a respective opening of the molded slurry distributor. The maximum cross-sectional area of each mold segment is up to about 150% of the smallest area of the interior flow region of the molded slurry distributor through which the mold segment traverses when moving along the respective removal path. | 2013-04-25 |
| 20130099419 | CONVERTIBLE TWO PIECE SIDEPLATE - Provided is a tire mold. The tire mold may comprise a top primary plate, a bottom primary plate, a first sidewall mold part, and a second sidewall mold part. The first sidewall mold part may comprise a first sidewall mold plate adapted for interchangeable engagement with both the top primary plate and the bottom primary plate, or a first sidewall removable component adapted for interchangeable engagement with both the top primary plate and the bottom primary plate. The second sidewall mold part may comprise a second interchangeable sidewall mold plate adapted for interchangeable engagement with both the top primary plate and the bottom primary plate, or a second sidewall removable component adapted for interchangeable engagement with both the top primary plate and the bottom primary plate. | 2013-04-25 |
| 20130099420 | PICKING TOOL - Disclosed herein is, amongst other things, a picking tool ( | 2013-04-25 |
| 20130099421 | PLASTICIZING SCREW FOR INJECTION MOLDING AND INJECTION MOLDING METHOD USING SAME - A plasticizing screw for injection molding according to the present invention is installed in an injection molding machine that performs injection molding by plasticizing thermoplastic resin feedstock containing reinforcement fibers, and includes a shaft, a main flight, and a sub-flight. The protrusion height of the main flight from the circumferential surface of the shaft is formed to be constant in at least an area in which the sub-flight is provided. The sub-flight includes a flat surface portion which is provided on the rear end side in a winding direction and in which a protrusion height from the circumferential surface of the shaft is lower than that of the main flight and is constant, and an inclined surface portion which is provided to extend continuously from a leading end in the winding direction of the flat surface portion and in which a protrusion height from the circumferential surface of the shaft gradually increases toward the leading end side in the winding direction and is less than the protrusion height of the main flight. | 2013-04-25 |
| 20130099422 | Process for Selectively Removing a Coating Layer - A method of at least partially removing at least one of a coating and a masking layer from an area of at least one part, including the steps of orienting the at least one part; and removing the area of the at least one of coa tmg and masking layer from the at least one part using at least one removal device. In a preferred embodiment, the method includes a plurality of parts, orienting the plurality of parts and removing the area of the at least one coating and masking layer from each of the plurality of parts using a plurality of removal devices. A system for at least partially removing at least one of a coating and masking layer from an area of at least one part is also provided. In a preferred embodiment, the removal device(s) are lasers. | 2013-04-25 |
| 20130099423 | PHOTOCURABLE COMPOSITION FOR IMPRINT AND METHOD FOR FORMATION OF PATTERN USING THE COMPOSITION - Disclosed is a photocurable composition for imprint which has good pattern-transferring property and good detachability from mold (pattern formation surface) regardless of the type of polymerizable monomer to be used, whereby it is possible to form a pattern having a shape with excellent reproducibility; and a method for forming a pattern on a substrate by photoimprint using the composition. The photocurable composition for imprint includes (A) polymerizable monomer having (meth)acrylic group, (B) photoinitiator, and (C) hyperbranched polymer obtained by polymerizing polymerizable monomer having (meth)acrylic group. Preferably, the composition includes 0.1-10 parts by mass of the photoinitiator (B) and 0.1-10 parts by mass of the hyperbranched polymer (C) relative to 100 parts by mass of the polymerizable monomer (A). | 2013-04-25 |
| 20130099424 | SYSTEM AND METHOD FOR BLENDING POLYMERS - The present techniques provide an extruder screw comprising a high shear melting and mixing zone starting a distance away from an entry point of the screw corresponding to 35%-50% of the overall screw L/D. The extruder screw may also include elements capable of increasing a degree of fill of the high shear melting and mixing zone. In accordance with present techniques, the extruder screw is configured to blend two or more polyolefin polymers having greater than about a 200,000 difference in weight-average molecular weight in a single extrusion step. The extruder screw of the present techniques may be used in a single screw or twin screw extruder, and may be incorporated into a polyolefin production plant for producing multi-modal resins. | 2013-04-25 |
| 20130099425 | METHOD FOR PRODUCING A PLASTIC ARTICLE AND BLOW MOULD FOR CARRYING OUT THE METHOD - The invention relates to a method for producing a plastics material article, said method including the extruding of a tube-shaped parison and the re-forming of the parison into a hollow body within a blow mold by applying differential pressure. The method includes initially a first expanding and partial shaping of the parison with the blow mold not completely closed. Then at least one opening is provided on the circumference of the pre-expanded parison. In a further step at least one part to be built-in is introduced through the opening into the interior of the partially shaped plastics material article. In a final step the blow mold is closed completely and the blow molding of the plastics material article is completed. | 2013-04-25 |
| 20130099426 | INFUSION METHOD AND FLOW AID - Disclosed is an infusion method for the manufacture of a fibre-reinforced composite component with a flow promoter | 2013-04-25 |
| 20130099427 | METHOD AND DEVICE FOR PRODUCING A COMPOSITE MOLDED PART FROM FIBER-REINFORCED PLASTIC - A method for producing a composite molded part from fiber-reinforced plastics material includes providing a prepreg semi-finished product including fibers that are pre-impregnated with a matrix material and encasing the semi-finished product with a flexible sheet material to form an inner arrangement. The flexible sheet material includes a gas-permeable membrane and an inner planar gas-conducting element. The inner arrangement is encased with a first gas-tight casing and positioned on a molding surface of a mold. The inner arrangement and molding surface is encased with a second gas-tight casing. A first negative pressure is applied to the inner planar gas-conducting element and the inside of the first gas-tight casing, and the entire arrangement is heated for a first time at a first temperature. A second negative pressure is applied to an inside of the second gas-tight casing and the entire arrangement is heated for a second time at a second temperature. | 2013-04-25 |
| 20130099428 | Composite Material and Method for Making - This invention relates to an improved method for making composite structures by dispersing a high tenacity fiber such as aramid in a polymeric matrix to form a premix, combining the premix with a natural fiber such as wood flour and extruding the resulting mixture through a fiber alignment plate and die such that the fibers are substantially aligned in the flow direction of the extrudate. | 2013-04-25 |
| 20130099429 | Mold for Producing Fiber-Reinforced Components - A mold for a production device for production of fiber-reinforced components by means of an injection process is provided. The mold has a mold surface to form a surface of the fiber-reinforced component, the mold surface having a first partial area and a second partial area and in which the mold has an injection area for injection of matrix material into fibrous material situated on the mold surface through the second partial area of the mold surface and evacuation area for evacuation of a mold volume bounded by the mold through the first partial area of the mold surface. | 2013-04-25 |
| 20130099430 | ELASTICALLY INTERCONNECTED COOLER COMPRESSED HEARTH AND WALLS - An elastically interconnected cooler compressed hearth comprises a concave dished bottom lined with a sub-layer and a working layer of hearth bricks. Cylindrical walls that rise up from the rim of the concave dished bottom are constructed with one or more tiers of coolers shaped into arc segment blocks that are joined together by their flanges to form complete rings. The outer perimeter of the hearth brick within the ringed tiers is inwardly compressed toward the center to disallow any leaks from forming between the separate bricks. The coolers are elastically interconnected at their flanges by fasteners and springs. Each spring can be individually adjusted to obtain optimal working pressures on the whole of the core wall and hearth floor bricks. | 2013-04-25 |
| 20130099431 | SUSPENSION SMELTING FURNACE AND A CONCENTRATE BURNER - The invention relates to a suspension smelting furnace comprising a reaction shaft ( | 2013-04-25 |
| 20130099432 | FURNACE REFRACTORY BRICK HEARTH TAP HOLE - A method for accommodating increasing outward pressures in the tap holes of a hearth furnace includes configuring a tap hole lining and disposing it inside a hollow cylindrical conduit such that the tap hole lining can slide in response to outward pressures and growth in the hearth brick. The tap hole lining is retained inside the hollow cylindrical conduit with a retaining ring and spring assemblies. | 2013-04-25 |
| 20130099433 | RECOIL SPRING ASSEMBLY - A recoil spring assembly includes a rod which has a flange at one end and a groove spaced apart from the flange. A first collar receives the rod and is mounted adjacent to the flange. A compressed spring engages the first collar. A second collar receives the rod and engages a second end of the spring. A pair of retainer clips is releasably received by the groove to retain the second collar to maintain compression of the spring. | 2013-04-25 |
| 20130099434 | SILENCER FOR A MULTI-LEAF SPRING - A silencer for a leaf spring assembly. The silencer is disposed between end portions of leaf springs. The silencer has a two-layer structure which has a fixing layer and a sliding layer which are integrally formed. The fixing layer has a projection portion, and the projection portion has an engagement portion at a leading end portion thereof. The fixing layer, which is fixed at the fixing side leaf spring, has a tensile strength higher than the sliding layer. The sliding layer, which abuts the sliding side leaf spring, has a hardness lower than the fixing layer. The projection portion of the fixing layer can have sufficient strength to resist the shearing force. In the sliding layer, undesirable noise generation is difficult, and even when a load transmission portion of an end portion of the sliding side leaf spring partially abuts the sliding layer, undesirable noise generation can be prevented. | 2013-04-25 |
| 20130099435 | Coil Spring - A coil spring has an effective section that functions as a spring when a load in a coil axis direction has been applied, end turn sections that are formed on both ends of the effective section, and rising sections that are formed between the effective section and the end turn sections, wherein the rising sections are formed in such a way that, when θ1 represents the pitch angle of the rising sections and θ2 represents the pitch angle of the effective section, pitch angle θ1> pitch angle θ2 holds true in at least one of the rising sections. | 2013-04-25 |
| 20130099436 | BICYCLE DAMPING ENHANCEMENT SYSTEM - A bicycle shock absorber and methods for differentiating between rider-induced forces and terrain-induced forces includes a first fluid chamber having fluid contained therein, a piston for compressing the fluid within the fluid chamber, a second fluid chamber coupled to the first fluid chamber by a fluid communication hose, and an inertial valve disposed within the second fluid chamber. The inertial valve opens in response to terrain-induced forces and provides communication of fluid compressed by the piston from the first fluid chamber to the second fluid chamber. The inertial valve does not open in response to rider-induced forces. | 2013-04-25 |
| 20130099437 | QUICK CLAMP - A quick clamp includes a first jaw, a second jaw, a crank, an operating handle, a shaft assembly and a slide rail. The crank is arranged in a cover plate of the second jaw with the operating handle rotatably screwed to an upper end of the crank, the shaft assembly connected to a through bore formed at a middle portion of the crank and the slide rail extended through a slide rail slot formed near a lower end of the crank. By turning the operating handle in one direction, the crank is brought to pivot with the slide rail slot thereof becoming inclined to press against the slide rail, so that the slide rail is stopped from moving relative to the second jaw. When the operating handle is turned reversely, the slide rail is released, and the second jaw is movable along the slide rail. | 2013-04-25 |
| 20130099438 | Magnetic Ruler and Cutting Mat - This document discloses magnetic sewing rulers, cutting mats, magnetic holders and magnetic ruler sewing kits are disclosed that provide tools to securely and easily hold fabrics and other sewing materials in place on a cutting mat for laying out, measuring, cutting, pinning, etc. when engaged in sewing projects. The magnetic rulers, cutting mats, and magnetic holders provide security in holding projects to allow a person to use their hands freely during sewing projects. | 2013-04-25 |
| 20130099439 | DEVICE FOR DISBURSING VALUE NOTES COMPRISING A STATIONARY SUPPORT ELEMENT - The invention relates to a device ( | 2013-04-25 |
| 20130099440 | PRINTING SYSTEM AND CONTROL METHOD THEREOF - In a printing system which feeds a sheet from a plurality of sheet storage units and prints an image on the fed sheet, and a control method thereof, when a sheet storage unit selected as a paper feed source does not store sheets of a size designated by a print job, and a sheet storage unit which stores sheets of the size designated by the print job does not exist in a group to which the selected sheet storage unit belongs, the user is notified of a sheet storage unit in the group as a sheet storage unit which should store sheets. | 2013-04-25 |
| 20130099441 | RECORDING PAPER CONVEYING DEVICE, DOCUMENT FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THESE DEVICES - A recording paper conveying device includes a registration roller pair and a conveyor roller pair adjacent to the registration roller pair. By rotating the conveyor roller pair, a sheet of recording paper is fed until leading edge of the sheet abuts the registration roller pair in stationary state so that the sheet is deflected by a prescribed amount. Then, conveyor roller pair is rotated at the constant velocity, and while the sheet is kept deflected, rotation of the registration roller pair is started, to start feeding of the sheet by the registration roller pair. While the registration roller pair is kept rotating, rotation of the conveyor roller pair is suspended, and then, the conveyor roller pair is returned to the state of rotation before suspension. Thus, unnecessary deflection of the sheet just in front of the registration roller pair can be prevented. | 2013-04-25 |
| 20130099442 | MEDIUM ACCUMULATING DEVICE - A medium accumulating device has an accumulation table on which a medium is accumulated, an elastic member that supports the accumulation table, and an accumulation table detector that detects lowering of the accumulation table. It is sensed that the accumulation table inclined with respect to a lifting and lowering direction of the accumulation table lowers below a predetermined position to thereby determine whether or not a medium is accumulated on the accumulation table. This provides the medium accumulating device capable of determining whether or not a medium is accumulated whatever position the accumulation table may occupy. | 2013-04-25 |
| 20130099443 | GAME APPARATUS - A game apparatus ( | 2013-04-25 |
| 20130099444 | INTEGRATED BLACKJACK HOLE CARD READERS AND CHIP RACKS, AND IMPROVED COVERS FOR CHIP RACKS - Integrated blackjack hole card readers and chip racks, and novel locking cover assemblies, are disclosed. In one embodiment of the hole card reader and chip rack, a chip rack of standard configuration is provided, and defines a cutout into which the reader can be placed. In another embodiment, the chip rack and reader are molded as a single unit. A removable locking cover is also disclosed which can be used to cover chip racks any time they are not in use. | 2013-04-25 |
| 20130099445 | GAMING TOKEN - A chip member and method of constructing a chip member including an outer portion surrounding an inner portion. The outer portion has a first outer side. The inner portion forms a first cavity opening to the first outer side. The first outer side has a first lip overlying the first cavity. A first flexible tab is secured within the first cavity by the first lip. | 2013-04-25 |
| 20130099446 | Closable-type game board for basic symbol recognition - My child educational board game, “Word Battle Junior”, embodies a configuration requiring players to approach the fundamentals of literacy and numeracy by simply calling out spaces in a competition of take away so that, once all prepositioned and hidden game elements on opponents' targeted regions are found, the last player with symbol marked blocks in his/her playing field wins. | 2013-04-25 |
| 20130099447 | CARD HAVING A FLEXIBLE, DYNAMICALLY CHANGEABLE DISPLAY, A SET OF SUCH CARDS AND RELATED SYSTEM AND METHOD - A dynamically changeable, flexible card is set forth such as a playing card or a set of playing cards. The cards have one or more flexible displays controlled by a controller to change the display(s). The controller may interface with a wireless communication device to control the displays For card games, the electronic display can be changed so that only several such cards need be used to play the game. The face value content of the display can be changed by contact or wirelessly. | 2013-04-25 |
| 20130099448 | AUTOMATIC CARD SHUFFLER WITH PIVOTAL CARD WEIGHT AND DIVIDER GATE - A playing card handling device is disclosed. The device includes a first side and a second opposite side. Components of the device include a card infeed tray, a card output tray and a card handling zone. The card infeed tray and card output tray are on the same first side of the device and an upper surface of the card infeed tray and an upper surface of the card output tray are in the same plane. Card handling devices of the present invention also include a touch screen display, as well as a movable card gate. | 2013-04-25 |
| 20130099449 | SEAL - The present disclosure relates to seals and sealing arrangements, especially those used in wireline valves. The seal comprises an elastomeric seal body with a sealing surface, a plurality of generally planar inserts embedded within the elastomeric seal body adjacent the sealing surface, and having elastomeric seal material disposed between the plurality of generally planar inserts. The generally planar inserts may have a slightly wedge shape and may be embedded into the elastomeric seal body in a generally fan-shaped orientation. They may be orientated such that upon contacting a substantially tubular shaped body to be sealed around and the subsequent deformation of the seal body about said substantially tubular shaped body, the plurality of generally planar inserts become orientated such that they extend radially from the substantially tubular shaped body. | 2013-04-25 |
| 20130099450 | SEALING DEVICE - The present invention provides a sealing device in which frictional resistance is further reduced while a sealing property is maintained. | 2013-04-25 |
| 20130099451 | SELF-SEALING GASKET - A system may include a first member, a second member, a gasket and a pressurized fluid. The first member may include a first recess. The second member may include a second recess adjacently opposing the first recess. The second member may matingly engage the first member and may define a volume therebetween. The gasket may include a cross section having opposing first and second legs and a central portion disposed therebetween. The first leg may be received in the first recess. The second leg may be received in the second recess. The pressurized fluid may be disposed between the first and second legs and may urge the first and second legs into sealing engagement with the first and second recesses, respectively. | 2013-04-25 |
| 20130099452 | SEALING ELEMENT - The invention relates to a sealing element ( | 2013-04-25 |
| 20130099453 | VARIABLE WIDTH GAP SEAL - A seal for bridging an interface between an aircraft exhaust deck and a trailing edge of an aircraft exhaust system includes a sheet, a spacing element, and a tensioning element. The sheet has a fixed end, a cover portion, a movable portion, and a free end. The fixed end is anchored to the trailing edge. The cover portion extends upstream from the fixed end and across the interface. The movable portion is located adjacent the aircraft exhaust deck. The spacing element engages the movable portion and defines a gap for cooling air between the movable portion and the aircraft exhaust deck. The tensioning element is attached to the free end and provides tensioning force keep the cover portion taut. | 2013-04-25 |
| 20130099454 | TOOL HOLDER - A tool holder for holding a cutting tool comprises a housing, a sleeve received in one end of the housing, a switch fastened in the other end of the housing, a cover fastened at an end of the housing adjacent to the sleeve to prevent the sleeve from being taken out of the housing, and an elastic member sleeved on the sleeve. The switch is electrically connected to a control system of a main spindle of a CNC turning machine and is applied for controlling the movement of the main spindle. The elastic member is compressed to elastically resist with the sleeve and generates an elastic force to make the sleeve move away from the switch, and the sleeve is slidably configured along the inner surface of the housing to contact the switch to stop the movement of the main spindle of the CNC turning machine. | 2013-04-25 |
| 20130099455 | ROLL STABILIZER FOR INSTALLATION TO A WHEEL SUSPENSION OF A MOTOR VEHICLE - A roll stabilizer for installation to a wheel suspension of a motor vehicle includes a transverse torsion bar rotatably mounted to a body of the motor vehicle and two longitudinal arms which are connected to the torsion bar to thereby establish a substantially U shaped configuration. The longitudinal arms are articulated directly or indirectly to wheel control elements of the wheel suspension. A servomotor is arranged at one end of the torsion bar between one of the longitudinal arms and the torsion bar for adjusting the longitudinal arms in relation to one another to thereby stabilize a rolling motion. | 2013-04-25 |
| 20130099456 | SUSPENSION CONTROL APPARATUS FOR A VEHICLE - A first communication passage is coupled to a left wheel cylinder pressure chamber at an upper vehicle side and a right wheel cylinder pressure chamber at a lower vehicle side to be communicated with each other, and a second communication passage is coupled to a left wheel cylinder pressure chamber at the lower vehicle side and a right wheel cylinder pressure chamber at the upper vehicle side to be communicated with each other. Between the first and second communication passages is a valve mechanism so that the first and second communication passages are normally communicated with each other, and fluid flow from one of the first communication passage and the second communication passage to the other is blocked, when a pressure difference, caused when fluid moves from one of the first communication passage and the second communication passage to the other, becomes equal to or greater than a predetermined value. | 2013-04-25 |
| 20130099457 | INLINE SKATE WHEEL - A wheel for an inline skate that may reduce rolling friction and provide a wider rolling base giving more stability. The wheel comprises a hub for receiving an axle and a wheel body defining a circumference of the wheel. The wheel body comprises a circumferential surface extending along the circumference of the wheel. The circumferential surface comprises a first contact surface and a second contact surface for being in rolling contact with a skating surface on which the inline skate moves. The wheel body also comprises a receding surface extending from the first contact surface to the second contact surface and forming a recess between the first contact surface and the second contact surface. | 2013-04-25 |
| 20130099458 | Nail tech./manicurist mobile cart - A lockable nail supplies cart for use in beauty/nail salons. Includes lockable double doors that are hinged at the sides to move from a horizontally aligned closed position, behind the doors are drawers for storing nail/manicuring supplies. | 2013-04-25 |
