16th week of 2011 patent applcation highlights part 4 |
Patent application number | Title | Published |
20110089549 | SEMICONDUCTOR DEVICE - A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties. | 2011-04-21 |
20110089550 | PRODUCTION DEVICE, PRODUCTION METHOD, TEST APPARATUS AND INTEGRATED CIRCUIT PACKAGE - Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package. | 2011-04-21 |
20110089551 | SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD - According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surface of a resin which seals the LSI chip connected to the multilayer wiring. The wiring traces are connected to terminal wiring traces connected to the multilayer wiring on the front face of the package substrate and to front-face bump electrodes for external connection on the upper surface of the resin. On the back face side of the package substrate, back-face bump electrodes for external connection are formed and connected to the multilayer wiring. | 2011-04-21 |
20110089552 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system including: forming a top package including: providing a through silicon via interposer having a through silicon via; coupling a stacked integrated circuit die to the through silicon via, and testing a top package; forming a base package including: providing a substrate, coupling a base integrated circuit die to the substrate, and testing a base package; and coupling a stacked interconnect between the top package and the base package. | 2011-04-21 |
20110089553 | STACK-TYPE SOLID-STATE DRIVE - Provided are a stack-type solid-state drive (SSD) capable of reducing a size thereof by mounting semiconductor chips in a recess region formed in a substrate, and a method of fabricating the stack-type SSD. The stack-type SSD includes a substrate including one or more recess regions; one or more passive electronic elements mounted in the one or more recess regions; one or more control semiconductor chips mounted in the one or more recess regions; one or more non-volatile memory semiconductor chips mounted on a first surface of the substrate so as to overlap the one or more passive electronic elements, the one or more control semiconductor chips, or all the passive electronic elements and the control semiconductor chips; and an external connection terminal located on a side of the substrate. | 2011-04-21 |
20110089554 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CAVITY AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed. | 2011-04-21 |
20110089555 | AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS - Using side-wall conductor leads insulated by side-wall insulators to form package level conductor leads for active circuits manufactured on silicon substrate, the preferred embodiments of the present invention significantly reduces the areas of surface mount package chips. Besides area reduction, these methods also provide significant cost saving and reduction in parasitic impedance. | 2011-04-21 |
20110089556 | LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY - Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 2011-04-21 |
20110089557 | Area reduction for die-scale surface mount package chips - Using side-wall conductor leads to form package level conductor leads for active circuits manufactured on silicon substrate, the preferred embodiments of the present invention significantly reduces the areas of die-scale surface mount package chips. Besides area reduction, these methods also provide significant cost saving and reduction in parasitic impedance. | 2011-04-21 |
20110089558 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF - There is provided a technology capable of reducing the mounting burden on the part of a customer which is a recipient of a package. Over a metal board, a single package and another single package are mounted together via an insulation adhesion sheet, thereby to form one composite package. As a result, as compared with the case where six single packages are mounted, the number of packages to be mounted is smaller in the case where three sets of the composite packages are mounted. This can reduce the mounting burden on the part of a customer. | 2011-04-21 |
20110089559 | METHOD AND INSTALLATION FOR PRODUCING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A method of producing a semiconductor device is provided, the semiconductor device including a substrate, a semiconductor layer and at least one metallization layer adjacent to at least one element chosen from the substrate and the semiconductor layer, the method including forming at least one metallization layer which, adjacent to at least one element chosen from the substrate and the semiconductor layer, includes oxygen. | 2011-04-21 |
20110089560 | Non-Uniform Alignment of Wafer Bumps with Substrate Solders - An integrated circuit structure includes a work piece selected from the group consisting of a semiconductor chip and a package substrate. The work piece includes a plurality of under bump metallurgies (UBMs) distributed on a major surface of the work piece; and a plurality of metal bumps, with each of the plurality of metal bumps directly over, and electrically connected to, one of the plurality of UBMs. The plurality of UBMs and the plurality of metal bumps are allocated with an overlay offset, with at least some of the plurality of UBMs being misaligned with the respective overlying ones of the plurality of metal bumps. | 2011-04-21 |
20110089561 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package has: a first chip; and a second chip. The first chip has: an insulating resin layer formed on a principal surface of the first chip; a bump-shaped first internal electrode group that is so formed in a region of the insulating resin layer as to penetrate through the insulating resin layer and is electrically connected to the second chip; an external electrode group used for electrical connection to an external device; and an electrostatic discharge protection element group electrically connected to the external electrode group. The first internal electrode group is not electrically connected to the electrostatic discharge protection element group. | 2011-04-21 |
20110089562 | SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE - A semiconductor device including a semiconductor substrate with circuit elements and electrode pads formed on one surface. The surface is covered by a dielectric layer with openings above the electrode pads. A metal layer is included on the dielectric layer and patterned to form a conductive pattern with traces leading to the electrode pads. A protective layer is included as having openings exposing part of the conductive pattern. Each opening is covered by an electrode such as a solder bump, which is electrically connected through the conductive pattern to one of the electrode pads. The thickness of the protective layer, which may function as a package of the semiconductor device, is thus reduced. The protective layer may be formed from a photosensitive material, simplifying the formation of the openings for the electrodes. | 2011-04-21 |
20110089563 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step. | 2011-04-21 |
20110089564 | ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE - A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof. | 2011-04-21 |
20110089565 | Semiconductor Device and Electronic Apparatus Equipped with the Semiconductor Device - A semiconductor device comprises an IC chip body and a package substrate that has thereon many external electrodes arranged in a two-dimensional grid configuration. Groups of signal lines that are likely to emit noise (noisy signal lines) are separated and spaced apart from groups of signal lines that are susceptible to noise (noise susceptible signal lines). Each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated IC pad group separated and spaced apart from other IC pad groups. Further, each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated external electrode group selected from the multiplicity of external electrodes arranged in a two-dimensional grid configuration on the package substrate. Thus, groups of potentially interfering signal lines are mutually separated and spaced apart from one another, thereby suppressing the noise. | 2011-04-21 |
20110089566 | WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BONDABLE FINISH AND REDUCES BONDING PITCH ON SUBSTRATES - A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a stitch bond. The second bonding site has a bond finger formed on the substrate, a conductive layer in direct physical contact with the bond finger, and a bond stud coupled to the bond wire and in direct physical contact with the conductive layer to conduct an electrical signal from the semiconductor die to the bond finger. The bond finger is made of copper. The conductive layer is made of copper or gold. The bond stud is made of gold and overlies a side portion and top portion of the copper layer. | 2011-04-21 |
20110089567 | Production Method and Production Apparatus of Tin or Solder Alloy for Electronic Components, and Solder Alloy - The invention provides a technique and a device that dramatically improve joint reliability of miniature joints of fine electronic components. According to the invention, when producing a tin or a solder alloy used for electronic components, an ingot of a tin or a solder alloy is heated, melted and delivered to a reactor. Also, a solution containing organic acid having a carboxyl group (—COOH) is delivered to the reactor. After stirring and mixing the two liquids intensively, the mixed liquid is separated into a molten tin or a molten solder alloy liquid and an organic acid solution according to the difference in specific gravity. Then, the respective liquids are circulated to the reactor, and the metal oxides and the impurities existing in the molten tin or the molten solder alloy are removed, and the molten tin or the molten alloy is purified to have oxygen concentration of 5 ppm or less. | 2011-04-21 |
20110089568 | POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive. | 2011-04-21 |
20110089569 | Multilayer wiring, method for placing dummy wiring in multilayer wiring, semiconductor device, and semiconductor device manufacturing method - A multilayer wiring in which plural metal wirings and plural interlayer insulating films are layered, each interlayer insulating film being planarized each time formed, is divided into plural regions. The percentage of an area occupied by each of the metal wirings within each region is obtained for each of the metal wirings. An integral percentage is obtained per region by integrating, the percentages. The integral percentages are used to calculate the relative positional relationship of upper surfaces of the interlayer insulating films of plural regions, from the relative values of the integral percentages obtained beforehand and relative positions of the upper surfaces. In regions where the upper surface is of a height lower than a predetermined value, a dummy wiring is disposed, and in regions where the upper surface is of a height equal to or greater than the predetermined value, a dummy wiring is not disposed. | 2011-04-21 |
20110089570 | Multi-Layer Connection Cell - A semiconductor multi-layer connection cell is disclosed that includes configuration layers and “via” layers disposed between the configuration layers to allow configuration of signals at any layer in the connection cell. The layers include column structures extending through the layers. Each column structure includes a hole in a layer that can be filled to form an electrical connection between layers. | 2011-04-21 |
20110089571 | SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE - A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side. | 2011-04-21 |
20110089572 | METHOD FOR FABRICATING THROUGH SUBSTRATE VIAS - A method of fabricating through substrate vias is disclosed. In one aspect, vias are etched from the backside of the substrate down to shallow trench isolation (STI) or the pre-metal dielectric stack (PMD). Extra contacts between metal 1 contact pads and the through-wafer vias are fabricated for realizing the contact between the through wafer vias and the back-end-of-line of the semiconductor chips. | 2011-04-21 |
20110089573 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a first interposer provided with a first chip first interconnection; a first chip arranged to contact the first interposer in one surface of the first chip; a second interposer arranged to contact the other surface of the first chip and provided with a first chip second interconnection; and a second chip group mounted on the second interposer. The first chip has a circuit forming surface on which a circuit element is formed, as one of the surfaces of the first chip, and the first chip first interconnection and the first chip second interconnection are electrically connected with the circuit element. A through electrode is formed to pass from the one of the surfaces of the first chip to the other surface, and one of the first chip first interconnection and the first chip second interconnection is electrically connected with the circuit element through the through electrode. | 2011-04-21 |
20110089574 | SEMICONDUCTOR DEVICE - A semiconductor device having a multilayer interconnect structure allowing heat in an interconnect layer at an intermediate level to be effectively dissipated is provided. A lower-layer interconnect ( | 2011-04-21 |
20110089575 | MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes at least one semiconductor chip mounted to a circuit board and separated from the circuit board by a predetermined distance. A support located between the circuit board and the first semiconductor chip supports the first semiconductor chip. The support has first and second ends fixed with respect to the circuit board and a center portion between the first and second ends to contact the first semiconductor chip. | 2011-04-21 |
20110089576 | PAD LAYOUT STRUCTURE OF A DRIVER IC CHIP - A pad layout structure of a driver IC chip to be mounted to a liquid crystal display panel. The pad layout structure includes power pad sections placed at respective four corners of the driver IC chip and each having a first power pad for supplying first power to the driver IC chip, a second power pad for supplying second power to the driver IC chip, a third power pad for supplying third power to the driver IC chip and a fourth power pad for supplying fourth power to the driver IC chip. | 2011-04-21 |
20110089577 | METHOD AND STRUCTURE FOR BONDING FLIP CHIP - Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes. | 2011-04-21 |
20110089578 | WAFER STRUCTURE - A wafer structure includes a plurality of dies, an edge portion, a passivation layer, and a UV-blocking metal layer. Each of the dies having an integrated circuit formed thereon, and the circuit includes an upmost metal layer that includes bonding pads. A composite dielectric layer corresponding to dielectric layers of the integrated circuit is disposed on the edge portion, and a cavity is formed in the composite dielectric layer over the edge portion. The passivation layer is located over the whole wafer and covers the upmost metal layer. The UV-blocking metal layer is located on the passivation layer and covers the edge portion and at least a portion of each of the dies. The cavity, the passivation layer, and the UV-blocking metal layer result in an alignment mark. | 2011-04-21 |
20110089579 | MULTI-CHIP MODULE - A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board. | 2011-04-21 |
20110089580 | SEMICONDUCTOR DEVICE COMPRISING HIGH PERFORMANCE ENCAPSULATION RESINS - A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4 | 2011-04-21 |
20110089581 | SEMICONDUCTOR WAFER HAVING SCRIBE LANE ALIGNMENT MARKS FOR REDUCING CRACK PROPAGATION - A wafer including at least a first die and at least a second die, wherein the first die and the second die are separated from each other by an area located between the first die and the second die, is provided. The wafer further includes an alignment mark group used for aligning the wafer to a tool used for patterning the wafer. The alignment mark group is located entirely within the area between the first die and the second die and the alignment mark group includes a plurality of alignment lines, and wherein each line of the plurality of alignment lines is formed using a plurality of segments separated from each other by a plurality of gaps filled with an insulating material. | 2011-04-21 |
20110089582 | SYSTEM FOR FEEDING GAS INTO LIQUID - A liquid aeration system comprising: an intermittent liquid feeding means ( | 2011-04-21 |
20110089583 | DUST REMOVING AND COOLING APPARATUS - Provided is a dust removing and cooling apparatus. The dust removing and cooling apparatus includes: a body comprising a first storage space in which water is stored and a second storage space in which a lower portion of the body communicates with the first storage space, wherein an inlet that communicates with the first storage space and an outlet that communicates with the second storage space are formed in an upper portion of the body; a water tank disposed in the first storage space and below the inlet; a first water flow sheet which is disposed below the water tank and has a tapered shape that becomes gradually narrower towards a lower portion of the first water flow sheet, and in which a first discharge hole is formed on a lower end of the first water flow sheet; a mixture tube disposed below the first discharge hole; a dust collecting and cooling portion which is disposed below the mixture tube, has a tapered shape that becomes gradually narrower towards a lower portion of the dust collecting and cooling portion and comprises a second water flow sheet in which a second discharge hole is formed on a lower end of the second water flow sheet; a gas inflow portion connected to the inlet and allowing contaminated harmful gases to be flowed into the first storage space; a water circulation portion having one end connected to an upper portion of the body and the other end connected to a lower portion of the body and pumping water stored in the lower portion of the first storage space into the upper portion of the first storage space; and a gas exhaust portion generating a suction force in a state where the gas exhaust portion is connected to the outlet and allowing gas stored in the second storage space to be exhausted as water stored in the first storage space rises into the second storage space due to an internal pressure differential between the first storage space and the second storage space. High temperature dust-containing harmful gases are exhausted in a state where 99.9% of airborne particulates are removed from the high temperature dust-containing harmful gases at a temperature that is similar to the air so that dust collecting efficiency is very high and white plume can be prevented from occurring. | 2011-04-21 |
20110089584 | DEMOLDING OF OPHTHALMIC LENSES DURING THE MANUFACTURE THEREOF - Methods, devices, and systems for demolding lens mold assemblies are described in which the lens mold assemblies are positioned below a puncher header each with at least one punch pin. The puncher header is then moved against the lens mold assemblies so that the at least one punch pin of each puncher punches through a lens mold layer of a first mold part to then push against a second lens mold layer of a second mold part to separate the two parts in a demolding process. | 2011-04-21 |
20110089585 | Method for the Simultaneous Manufacture of Ophthalmic Lenses, in Particular Contact Lenses, with Different Parameters on the Same Production Line - There is described a method for the simultaneous manufacture of contact lenses having different lens parameters on the same production line, where a number of molds, each comprising male and female mold halves, are transported in sequential rows of and in each row in side by side configuration through a series of treatment stations, which are arranged sequentially along a production line, in which lenses of specific parameters are manufactured from a lens forming material. During manufacture each lens is associated with a lens identification code. There is also described a closed cycle production line for carrying out the method. | 2011-04-21 |
20110089586 | Process For Manufacturing An Ophthalmic Lens - There is described a process for manufacturing an ophthalmic lens and an apparatus for forming an ophthalmic lens, in particular a silicone hydrogel contact lens, wherein in a mold assembly a first and a second mold half ( | 2011-04-21 |
20110089587 | METHODS FOR ASSEMBLING AN OPTOELECTRONIC DEVICE - Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area. | 2011-04-21 |
20110089588 | WATER-BLOCKED OPTICAL CABLE AND PROCESS FOR THE PRODUCTION THEREOF - An optical cable for communication includes at least one retaining element blocked with respect to the water propagation as well as a process for manufacturing such an optical cable. The optical cable includes, in addition to the retaining element, at least two transmission elements housed within the retaining element and a water swellable yarn housed within the retaining element. The water swellable yarn is selected according to the following equation: | 2011-04-21 |
20110089589 | SPIN-MOUNTED FABRICATION OF INJECTION MOLDED MICRO-OPTICS - Methods and systems for fabrication of injection molded optical components are disclosed. In one embodiment, a moldplate having one or more cavities is configured to receive injected optical material within walls of the cavities. The cavities are designed with a predetermined geometric profile approximately corresponding to a predetermined optical profile of an optical element to be formed therein. When molten optical material is injected into the cavities of the moldplate, the injected optical material forms a meniscus due to surface tension between the optical material and the wall of the cavities. The meniscus thus provides a shape corresponding to the predetermined optical profile. The optical material is then rapidly cured with actinic radiation, and a desired optical element with high-precision dimensions is formed within the cavities of the moldplate. In some embodiments, the moldplate is spun around a spin axis such that the meniscus is adjusted to match the predetermined optical profile within a certain tolerance. | 2011-04-21 |
20110089590 | ENHANCED SEPARATION OF INJECTION MOLDED MICROLENSES FOR HIGH VOLUME MANUFACTURING - A method and system for enhanced demolding of injection molded optical devices are disclosed. In one embodiment the system includes a metal moldplate without a coat of release layer and a curing device that generates high intensity pulses of UV light. The method includes: providing a moldplate made of a predetermined moldplate material; directly injecting optical material into cavities of a moldplate without a release layer; rapidly curing the injected optical material with high intensity pulses of UV light such that a predetermined optical device is formed; and separating the thus formed optical device from the cavities of the moldplate due to a differential thermal expansion between the optical device material and the moldplate material. | 2011-04-21 |
20110089591 | Methods and Systems for Manufacturing Composite Parts - Methods and apparatuses for manufacturing a composite part are provided. One method includes cutting a material into a plurality of pieces and marking each of the plurality of pieces of material with a unique indicium. This method also includes placing one of the pieces of material in a mold cavity, detecting a signal from the indicium on the piece of material, and verifying that the piece of material was placed in the mold cavity in the correct location based on the signal from the indicium. The placing, detecting, and verifying steps are performed for each of the plurality of pieces of material. The pieces of material are then molded together to form the composite part. | 2011-04-21 |
20110089592 | METHOD OF MAKING POROUS SELF-COHERED WEB MATERIALS - The present invention is directed to a method of making implantable bioabsorbable non-woven self-cohered web materials having a high degree of porosity. The web materials are very supple and soft, while exhibiting proportionally increased mechanical strength in one or more directions. The web materials often possess a high degree of loft. The web materials can be formed into a variety of shapes and forms suitable for use as implantable medical devices or components thereof. | 2011-04-21 |
20110089593 | CONJUGATE FIBER FOR AIR-LAID NONWOVEN FABRIC MANUFACTURE AND METHOD FOR MANUFACTURING A HIGH-DENSITY AIR-LAID NONWOVEN FABRIC - Provided is a conjugate fiber for air-laid nonwoven fabric manufacture having a planar zig-zag crimp shape before a thermal treatment, such that a uniform web is obtained by air laying with high processability and productivity, and the conjugate fiber develops a spiral crimp when the web is subjected to a thermal treatment to thereby enable the web to shrink significantly, as a result of which a nonwoven fabric can be obtained in which fibers are amassed to a high density. | 2011-04-21 |
20110089594 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are multicomponent fibers derived from a blend of a sulfopolyester with a water non-dispersible polymer wherein the as-spun denier is less than about 6 and wherein the water dispersible sulfopolyester exhibits a melt viscosity of less than 12,000 poise measured at 240° C. at a strain rate of | 2011-04-21 |
20110089595 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are multicomponent fibers derived from a blend of a sulfopolyester with a water non-dispersible polymer wherein the as-spun denier is less than about 6 and wherein the water dispersible sulfopolyester exhibits a melt viscosity of less than 12,000 poise measured at 240° C. at a strain rate of 1 rad/sec, and wherein the sulfopolyester comprising less than about 25 mole % of residues of at least one sulfomonomer, based on the total moles of diacid or diol residues. The multicomponent fiber is capable of being drawn at a relatively high fiber speed, particularly at least about 2000 m/min, and may be used to produce microdenier fibers. Fibrous articles may be produced from the multicomponent fibers and microdenier fibers. Also disclosed is a process for multicomponent fibers, nonwoven fabrics, and microdenier webs. | 2011-04-21 |
20110089596 | Method and apparatus for the production of high tenacity polyolefin sheet - A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced. According to a highly preferred embodiment, initially, the nip is set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder and once a coherent sheet of polyolefin exits the nip the temperature in the nip is lowered to a temperature below the melting point of the polyolefin powder and the gap increased to a desired level above the thickness of the largest powder particle. | 2011-04-21 |
20110089597 | Method and apparatus for the production of high tenacity polyolefin sheet - A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls initially set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced: and c) once a coherent sheet of polyolefin exits the nip lowering the temperature in the nip to a temperature below the melting point of the polyolefin powder and increasing the gap to a desired level above the thickness of the largest powder particle. Apparatus for the performance of such a process is also described. | 2011-04-21 |
20110089598 | METHOD FOR MAKING CONTOURED DECORATIVE GRASS - Method for producing decorative grass, such as Easter grass, from a material, wherein the strips of decorative grass have a decorative pattern thereon. The decorative pattern may be printed material and/or embossed patterns thereon, or the decorative pattern may be a non-linear side edge that provides the decorative grass with a contoured configuration. | 2011-04-21 |
20110089599 | METHODS FOR FORMING IMPLANTS WITH SELECTIVELY EXPOSED MESH FOR FIXATION AND RELATED IMPLANTS - Methods for forming molded orthopaedic implants with at least one mesh substrate having opposing upper and lower primary surfaces. At least a major portion of the mesh substrate lower primary surface is integrally moldably attached to the molded implant body. The methods are carried out so that the mesh substrate has at least one selectively exposed region devoid of molded material that exposes at least a portion of the mesh substrate upper surface to at least a partial thickness of the mesh substrate so as to allow for tissue in-growth in the at least one exposed region of the mesh substrate. | 2011-04-21 |
20110089600 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are multicomponent fibers derived from a blend of a sulfopolyester with a water non-dispersible polymer wherein the as-spun denier is less than about 6 and wherein the water dispersible sulfopolyester exhibits a melt viscosity of less than 12,000 poise measured at 240° C. at a strain rate of 1 rad/sec, and wherein the sulfopolyester comprising less than about 25 mole % of residues of at least one sulfomonomer, based on the total moles of diacid or diol residues. The multicomponent fiber is capable of being drawn at a relatively high fiber speed, particularly at least about 2000 m/min, and may be used to produce microdenier fibers. Fibrous articles may be produced from the multicomponent fibers and microdenier fibers. Also disclosed is a process for multicomponent fibers, nonwoven fabrics, and microdenier webs. | 2011-04-21 |
20110089601 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are multicomponent fibers derived from a blend of a sulfopolyester with a water non-dispersible polymer wherein the as-spun denier is less than about 6 and wherein the water dispersible sulfopolyester exhibits a melt viscosity of less than 12,000 poise measured at 240° C. at a strain rate of 1 rad/sec, and wherein the sulfopolyester comprising less than about 25 mole % of residues of at least one sulfomonomer, based on the total moles of diacid or diol residues. The multicomponent fiber is capable of being drawn at a relatively high fiber speed, particularly at least about 2000 m/min, and may be used to produce microdenier fibers. Fibrous articles may be produced from the multicomponent fibers and microdenier fibers. Also disclosed is a process for multicomponent fibers, nonwoven fabrics, and microdenier webs. | 2011-04-21 |
20110089602 | Extruder And Process For Preparing A Mixture Of Polymer And Diluent - The invention relates to a twin screw extruder for preparing a polymeric solution. The extruder includes an elongated housing having an inlet end, an outlet end, an extruder shaft length L and a pair of interconnecting bores disposed within the housing, a pair of elongated extruder shafts, each having an axis of rotation, the pair of elongated extruder shafts disposed within the pair of interconnecting bores and drivable in at least one direction of rotation, a plurality of extruder screw segments positioned along the pair of elongated extruder shafts in a fixed angular relationship therewith, the plurality of extruder screw segments selected to form multiple extruder stages. The invention also relates to a process for extruding a mixture of polymer and diluent. | 2011-04-21 |
20110089603 | Fiber and Nanofiber Spinning Method - The present invention relates to a method for spinning fibers, or fiberizers, using a rotary fiber-making die system made up of thin plates, embodied by a housing fixture, configured and stacked to define slots, channels and/or grooves through which the material used to make the fibers will flow. The die system allows for the production of different size and types of fibers, including nanofibers having a diameter of less than 1 micron, and facilitates a variety of cost effective methods for extrusion. The use of plates means the dies can be manufactured cost effectively, with easier clean-outs, replacements and/or variations. | 2011-04-21 |
20110089604 | METHOD OF MANUFACTURING PRODUCTS HAVING A METAL SURFACE - The method for manufacturing products having a metal surface by imparting microfeatures onto the metal surface. The method if further described as the steps of: creating a transfer tool from a microstructured intermediate fabricated from a microstructured prototype having microfeatures; and, transferring the microfeatures to said metal surface using the transfer tool. | 2011-04-21 |
20110089605 | Method for manufacturing biodegradable cinerary urns - A method that comprises the use of materials selected from amongst aggregates, aromatic plants, vegetal organic matter, plant earth, beach sand, marine salt, and combinations thereof, that are then mixed with vegetal agglutinant agents and the resulting mixture poured inside molds that are subjected to a pressure treatment and then, once they have had time to dry, to a heat application which purpose is to consolidate the urn ( | 2011-04-21 |
20110089606 | METHOD AND AN APPARATUS FOR INJECTION MOULDING - A method of manufacturing a packaging container from a packaging laminate sleeve with at least one inner layer of thermoplastic, the packaging container including a shoulder portion connected to the packaging laminate sleeve and a neck portion connected to the shoulder portion, with associated pouring aperture, comprising:
| 2011-04-21 |
20110089607 | MULTI-LAYERED GOLF BALLS HAVING A THIN OUTER COVER - Multi-layered golf balls having an inner core, at least one intermediate layer, and outer cover are provided. The outer cover is made from am ultra-low melt index (ULMI) thermoplastic material using an in-molding coating process that involves applying a thin layer of the material to the interior surface of the cover mold members. Preferably, the ultra-low melt index material is a highly neutralized ionomer ethylene-based copolymer. The cover layers made from these highly neutralized polymers (HNPs) are thin and uniform and provide the golf ball with good playing performance properties. Yet, the cover layers also are tough and provide the golf ball with good impact durability. | 2011-04-21 |
20110089608 | Composite material - An embodiment of the present invention relates to a composite material including a hydrophobic porous organic polymer bead. An embodiment further relates to a method of obtaining the composite material as well as the use thereof. | 2011-04-21 |
20110089609 | LASER-ABLATABLE ELEMENTS AND METHODS OF USE - A laser-ablatable element for direct laser engraving has a laser-ablatable, relief-forming layer that has a relief-image forming surface and a bottom surface. This relief-forming layer includes a laser-ablatable polymeric binder and an infrared radiation absorbing compound that is present at a concentration profile such that its concentration is greater near the bottom surface than the image-forming surface. This arrangement of the infrared radiation absorbing compound provides improved ablation efficiency, particularly when laser exposure is carried out adiabatically. | 2011-04-21 |
20110089610 | Resin Solidification Substrate and Assembly - A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section. | 2011-04-21 |
20110089611 | METHOD AND DEVICE FOR PREHEATING A PRESSED MATERIAL MAT DURING MANUFACTURE OF WOOD MATERIAL BOARDS - The invention relates to a method for preheating a pressed material mat ( | 2011-04-21 |
20110089612 | TIO2-CONTAINING QUARTZ GLASS SUBSTRATE - An object of the present invention is to provide a TiO | 2011-04-21 |
20110089613 | Process and Device for the Manufacture of a Particularly Heat-Resistant Hollow Body - A process and a device for the manufacture of a hollow body, particularly of a heat-resistant hollow body, which is molded out of a heated preform of thermoplastic plastic in a contoured blow mold through the introduction of a first medium into the preform, which medium is stored in a first medium storage unit and is under a pressure (p | 2011-04-21 |
20110089614 | Process and Device for the Manufacture of a Particularly Heat-Resistant Hollow Body - A process and a device for the manufacture of a hollow body, particularly of a heat-resistant hollow body, which is molded out of a heated preform of thermoplastic plastic in a contoured blow mold through the introduction of a first medium into the preform, which medium is stored in a first medium storage unit and is under a pressure (p1) (preblowing phase), and the more or less simultaneous stretching of the hollow body through a stretching rod and the introduction of a second medium in the hollow body, which medium is stored in a second medium storage unit and the pressure of which (p2) is higher than the pressure of the first medium (p1) (final blowing phase), and which is cooled by a third medium, which is medium stored in a third medium storage unit (rinsing phase), whereby the preblowing medium is under a pressure of approximately 2-20 bar, the final blowing medium is under a pressure of approximately 15-45 bar, and the cooling medium is under a pressure of approximately 30-45 bar. | 2011-04-21 |
20110089615 | AUXILIARY DEVICE AND METHOD FOR FINISHING PREFORMS - An auxiliary device and a method for finishing and calibrating preforms that are removed from a multiple tool in an unstable shape, the calibration process being performed with compressed air immediately after removing and withdrawing the preforms from the multiple tool. Nipples that can be inserted into the preforms are provided with expandable press rings or sealing rings in order to seal the interior of the blow-molded part of the preforms. The compressed air is introduced via the nipples, the sealing process being performed by radially expanding the press rings or sealing rings in analogy to the closing process of thermoses, thus protecting the preforms from adverse forces. The sealing point can be randomly selected in the transition zone from the threaded part to the blow-molded part of the preforms. The interior of the blow-molded part is optimally sealed without affecting the form stability and dimensional stability of the preforms. | 2011-04-21 |
20110089616 | METHOD FOR PURDUCING A MOLDED WOOD MATERIAL PART - A method for producing a molded wood material part with the use of a basic wood material and a heat-curable binding agent by way of pressing. In order to cure the binding agent, heat is transferred into the molded wood material part in the form of a steam shock. In order to shorten the pressing time, the process air pressure prevailing in the pressing chamber is increased before the transfer of heat in the form of a steam shock in relation to the atmospheric air pressure prevailing outside the pressing chamber, but without also supplying moisture, in particular in the form of water vapor, to the molded wood material part. | 2011-04-21 |
20110089617 | DEVICE FOR ADJUSTING THE LOCKING POINT OF AN ELECTRODE - A device for adjusting a locking point of an electrode of a smelting furnace including: a vice for supporting the electrode and supplying the electrode with power, and a structure coupled with the vice and including a support mechanism of the electrode and a mechanism moving the electrode vertically. | 2011-04-21 |
20110089618 | OVERHEAD WIRE TENSION BALANCER AND WATERPROOF COVER FOR OVERHEAD WIRE TENSION BALANCER - An overhead wire tension balancer can prevent an oil component in the tension balancer from scattering to the outside due to entry of rainwater. In an overhead wire tension balancer for supporting a spanned overhead wire while applying tension thereto, a gap that easily allows entry of rainwater is covered by a waterproof cover. As a result, the rainwater can be prevented from entering the inside of the overhead wire tension balancer, and the oil component separated from grease by entering rainwater can be prevented from scattering to the outside. | 2011-04-21 |
20110089619 | WINDSHIELD INSTALLATION DEVICE AND METHOD OF USE - A windshield installation device for use by a single technician in replacing a vehicle windshield. The device includes a first assembly attachable to a side window of the vehicle and a second assembly attachable to the windshield to be placed on the vehicle. The second assembly is adapted to couple to the first assembly and pivot with respect to the first assembly. | 2011-04-21 |
20110089620 | RAPID-RELEASE BELT SPLICER AND METHOD OF OPERATION - A belt splicer for butt-welding conveyor belts and methods for its operation. The belt splicer has clamp jaws that close to contact the butt edges of two belt sections against opposite ends of a heating wand and to hold the two melted butt edges together as they weld to each other. A toggle linkage assembly locks the clamped jaws closed and stores energy in a spring mechanism. The toggle linkage assembly allows the rapid release of the spring energy to accelerate the clamp jaws open to pull the melted butt ends rapidly away from the sides of the wand to avoid sticking. In another version, an air cylinder is used instead of the toggle linkage assembly and spring mechanism to close and rapidly open the splicer. | 2011-04-21 |
20110089621 | BAR CLAMP ASSEMBLY AND WORKPIECE SUPPORT MEMBERS - The present invention relates to bar clamp assemblies and workpiece support members configured for use with bar clamp assemblies. In one aspect, the present invention provides a workpiece support member for a bar clamp assembly. The workpiece support member include a base including an engagement feature configured for engagement with a guide rail of the bar clamp assembly. The workpiece support member also includes a first finger extending from the base and a second finger extending from the base. The first and second fingers are disposed apart with respect to one another to form a slot having a substantially continuous width. The first, second or both fingers form an abutment surface and a support surface, the abutment surface and the support surface are generally perpendicular with respect to one another. | 2011-04-21 |
20110089622 | Cutting Board - A cutting board includes a main body provided with a first plane and a second plane of N-gon shape (N is an integer not less than 4), the first plane and the second plane being mutually disposed at front and back. | 2011-04-21 |
20110089623 | SHEET PROCESSING APPARATUS WITH IMPROVED PRODUCTIVITY, IMAGE FORMING SYSTEM AND IMAGE FORMING APPARATUS - A sheet processing apparatus which is capable of improving the productivity of sheet processing as much as possible. An image forming apparatus forms an image on a sheet. A finisher is connected downstream of the image forming apparatus and performs post processing on the sheet. The finisher moves at least one of the sheet and a punching unit to adjust a position for punching holes in the sheet. The finisher determines whether or not a post-processing apparatus connected upstream of the finisher is provided with a correction mechanism for correcting a position of a sheet in a direction orthogonal to a sheet conveying direction. When the post-processing apparatus is provided with the correction mechanism, the finisher causes the image forming apparatus to be set such that a sheet conveying interval becomes shorter than when the post-processing apparatus is not provided with the correction mechanism. | 2011-04-21 |
20110089624 | ROTARY DIVERTER WITH FUNNEL SECTION - System for directing media from one an input media path to one of multiple output paths using a rotary diverter. The rotary diverter is a cylinder mounted for rotation at a crossover point, where input media paths and output media paths cross. The rotary diverter includes a funnel-shaped section longitudinally cut through the cylinder, the sides of the funnel-shaped section lying at an acute angle. A relatively narrow output end of the funnel-shaped section lies toward the apex of the angle, and a relatively wide input end lies opposite the apex. The input end is thus configured to receive media, and the output end is configured to output media. The rotary diverter can accept input media from one input media path, or from several paths, given the wide input section. | 2011-04-21 |
20110089625 | CONNECTION APPARATUS FOR CONNECTING IMAGE FORMING APPARATUS AND SHEET POST-PROCESSING APPARATUS - A sheet post-processing apparatus or a connection apparatus has a flexible paper guide provided in a position of the inlet rollers, having a length ranging from an upstream side of the sensor to a downstream side of the sensor with respect to the conveying path, having a cut off in a portion corresponding to the sensor. | 2011-04-21 |
20110089626 | IMAGE FORMING APPARATUS - An image forming apparatus allowing a printing section inside of a casing to print paper and discharging the printed paper from the casing through a discharge port of the casing includes a discharge tray configured such that the position thereof is switchable from a placement position for covering the surface of a feeding belt and receiving the paper discharged from the casing to an exposure position for exposing the surface of the feeding belt, and vice versa, wherein a surface of the discharge tray has a coefficient of friction lower than the surface of the feeding belt. | 2011-04-21 |
20110089627 | GATE SYSTEM DIVERTING SHEETS INTO MULTI-WAYS - According to aspects illustrated herein, there are provided systems for conveying a sheet article into an intended pathway. The multi-way gate system for diverting sheets into multiple pathways in a sheet conveying device includes at least three pathways for directing the sheet from the sheet conveying member in a particular direction. A single gate plate is between the sheet conveying member and the pathways. The single gate plate is rotatable about a single axis to direct the sheet exiting the sheet conveying member toward one of the pathways. | 2011-04-21 |
20110089628 | SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS - A sheet conveying device includes a blocking member having a blocking surface with which a leading end of a sheet that is being conveyed comes into contact for obliquity correction. The blocking member is rotated by being pushed by the sheet against an urging force of a positioning unit that positions the blocking member to be in the standby position. The blocking member is rotatable to be in a sheet-passage-allowing orientation in which the sheet is allowed to pass. When a trailing end of the sheet that is being conveyed has passed the blocking member, the blocking member that is in the sheet-passage-allowing orientation rotates in a same direction as a sheet conveyance direction and is positioned to be in a standby position. | 2011-04-21 |
20110089629 | SHEET DETECTING DEVICE AND IMAGE FORMING APPARATUS - A sheet detecting device includes a rotation unit having an abutment surface, a positioning unit configured to position the rotation unit in a standby position where the leading edge of the conveyed sheet abuts the abutment surface, and a detecting unit configured to detect the conveyed sheet on the basis of the rotation of the rotation unit pressed by the conveyed sheet, wherein the rotation unit rotates to a sheet passage posture where the sheet is allowed to pass after being pressed by the leading edge of the conveyed sheet and, when the trailing edge of the conveyed sheet passes the rotation unit, the rotation unit is rotated from the sheet passage posture in the same direction as a sheet conveying direction and is positioned in the standby position. | 2011-04-21 |
20110089630 | Validator drive roller release mechanism - The drive arrangement of a currency validator includes a drive roller release mechanism that provides release of the rollers from a drive shaft. This release allows a banknote to be forcibly withdrawn without damaging a drive train or the drive roller. The drive roller is supported on and rotatable about a drive shaft. The drive shaft includes an intermediary drive ring secured on the shaft and in engagement with the drive roller. A spring bias urges the drive roller to engage and rotate with rotation of the shaft and the intermediary drive ring secured on the shaft. When necessary the drive roller can rotate relative to the shaft by overcoming the spring bias. | 2011-04-21 |
20110089631 | Sheet Post-Process Apparatus Including Movable Stack Tray, and Sheet Post-Process Method - A sheet post-process apparatus according to one example of the present invention includes a movable stack tray for stacking a sheet that is elevated in a vertical direction; a movable tray position detection unit that detects a vertical position of the movable stack tray while a request command for post-processing of the sheet is not received; an upper surface sensor that senses either an upper surface of the movable stack tray or an upper surface of the sheet stacked on the movable stack tray when a first position of the movable stack tray detected by the movable tray position detection unit is lower than or equal to a predetermined first height; and a movable tray moving unit that moves the movable stack tray upward when either the upper surface of the movable stack tray or the upper surface of the sheet stacked on the movable stack tray is not sensed by the upper surface sensor. | 2011-04-21 |
20110089632 | PUZZLE, PUZZLE PIECE AND METHOD FOR MAKING PUZZLE - The present invention aims to provide a jigsaw puzzle in which pieces are kept at a certain size or smaller and can interlock with other pieces, even if rotated, and to enhance a game-playing property and an interlocking property at the time of assembling such a jigsaw puzzle. A jigsaw puzzle piece | 2011-04-21 |
20110089633 | Bingo table topper - The Table Topper is a lightweight, storage, organization, and functional device that creates an ergonomic surface suitable for reading, writing, and drawing and is especially suitable for the playing of Bingo. The system consists of a one-piece slanted playing surface with optional well inserts and spacing inserts. | 2011-04-21 |
20110089634 | SHAPE CONTROL OF MAGENTIC FIELDS FOR TABLE GAMES - A gaming table with an upper surface that includes a gaming chip placement area and a lower surface opposite the upper surface is provided. The gaming table also includes a housing coupled to one of the upper surface and the lower surface of the gaming table, an antenna coupled to the housing, wherein the antenna is configured to form an electromagnetic field that defines a zone of communication in which a gaming chip including a radio frequency identification (RFID) tag can be read. The gaming table also includes a substantially-contiguous highly permeable magnetic material layer coupled to the antenna, the highly permeable magnetic material layer defining an outermost boundary of the zone of communication of the antenna, such that a strength of the electromagnetic field at any region beyond the defined boundary of the zone of communication is below a threshold level for communication with an RFID gaming chip, and a reading device coupled to the housing, wherein the RFID reading device is configured to read data transmitted by an RFID gaming chip when the RFID gaming chip is in the zone of communication. | 2011-04-21 |
20110089635 | Strategy War Game - A strategy war game is disclosed. In a particular embodiment, a game board is covered by sixty-four squares forming a checkered pattern. Each game piece of a first set of game pieces is adapted to subsequently move only within a first set of squares representing land. Each game piece of a second set of game pieces is adapted to subsequently move only within a second set of squares representing water. Each game piece of a third set of game pieces is adapted to subsequently move within a third set of squares representing air. The strategy war game further includes a point system, wherein a first player is given a predetermined number of points for capturing a game piece during a turn by moving a game piece of the first player to a square occupied by the game piece of the second player. | 2011-04-21 |
20110089636 | Blackjack-type game with modified deck - A wagering game of at least one player hand against a dealer hand with playing card symbols is played using blackjack rule of play. At least one player makes a first wager on an underlying playing card symbol game from a set of playing card symbols. The set of playing card symbols has one of more sets of card symbols with each set having exactly thirty-six cards of count values between 1 and 9 and only twelve cards of count values of ten, suits among all cards are evenly distributed. The player is dealt exactly an initial 2-card hand. The dealer being dealt exactly an initial 2-card hand, only one dealer card dealt face-up. The player is always paid on the first wager for at least the following events, payment made before completion of blackjack play:
| 2011-04-21 |
20110089637 | Card game called "52" - This is a newly invented card game requiring a unique deck of 52 playing cards. Each card is individually numbered from one to fifty-two. Each card has the same three numbers printed on it. Two smaller numbers will be printed in the upper left hand and lower right hand corners of the card. A larger third number will be centered in the middle of the card. | 2011-04-21 |
20110089638 | Football Game - A game is provided that simulates American style football. Action cards include offensive plays and defensive outcomes. Skill is introduced by the offensive play chosen by an offensive player. Chance is introduced by the defensive outcome corresponding to the offensive play selected by the offensive player. The game lacks dice, spinners, or other random number generators. The game includes one set of action cards, which are selected consecutively by the offensive player. As preferably listing only offensive plays, only the defensive outcomes, thus the results of the offensive plays, vary from card to card. The game includes a field with markers that may be used to track the progress of the game. | 2011-04-21 |
20110089639 | Remote control target base - A remotely controlled, motorized shooting practice platform is described that includes a chassis with a bottom wall having an upper surface, and a removable top wall with an upper surface; a plurality of wheels carried on fixed axles supporting the chassis; a plurality of DC powered motors operatively attached to the axles, whereby the wheels rotate when the motors are energized; a battery mounted on the bottom wall upper surface; a controller mounted on the bottom wall upper surface for controlling the amount of current from the battery to each of the motors; a receiver mounted on the bottom wall upper surface providing control signals to the controller; a transmitter remote from the chassis to transmit control signals to the receiver; target attachment means mounted upon the top wall upper surface of the chassis; and a target extending about the chassis and attached to the chassis with the target attachment means. | 2011-04-21 |
20110089640 | EDUCATIONAL GAME - In one aspect, the present invention is directed to an educational game comprising: a structure rotating around a vertical axis; a plurality of frames, each connected to the structure, each of the frames having a geometrical form, each of the frames having a basket suspended therefrom; and a plurality of bricks, each having a form corresponding to the geometrical form of one of the frames. According to one embodiment of the invention, each of the bricks has a prism form. According to one embodiment of the invention, the bricks are of polyhedron form. The structure may comprise a central pole on which the baskets hang, each via a rod. A base may be employed for holding the central pole upright. | 2011-04-21 |
20110089641 | TWO-PIECE SEALING DEVICE - A method for installing an auxiliary ring around a shaft. The method comprises providing an auxiliary ring comprising a plurality of ring elements, wherein each ring element includes at least one radial joint. Each ring element is installed around the shaft and positioned such that the radial joint of at least one of the ring elements is rotationally offset from the radial joint of each adjacent ring element. The plurality of ring elements are then secured to each other by adhesive, welding, or a fastener. Each ring element may include an aperture wherein the aperture of each ring element is aligned with the aperture of each adjacent ring element. | 2011-04-21 |
20110089642 | Bearing Seal - A bearing seal of pack seal type used for a bearing unit rotatably supporting a rotary side member on an inner ring side relative to a stationary side member on an outer ring side. The bearing seal comprising a first slinger member having a cylindrical part fitted onto the rotary side member and an outward flange part extended from one end of the cylindrical part of the first slinger member, a second slinger member having a cylindrical part fitted onto the cylindrical part of the first slinger member and an outward flange part extended from one end of the cylindrical part of the second slinger member, a core member having a cylindrical part fitted into the stationary side member and an inward flange part extended from one end of the cylindrical part of the core member, a stationary side seal lip member fixed to the core member and having a seal lip contacting elastically and slidably with the second slinger member, a rotary side seal lip member fixed to the second slinger member and having a seal lip contacting elastically and slidably with the core member, and an annular multipolar magnet attached to the outward flange part of the first slinger member. | 2011-04-21 |
20110089643 | Fuel Line Gasket For Use With A Diesel Fuel Injector - Disclosed is a gasket for sealing a fuel connection for a diesel fuel injector. The gasket resides between the filter caps and the jumper block. The gasket includes a pair of holes having frustoconical shaped sidewalls designed to fit within the chamfer walls of the filter caps. The gasket further includes an aperture designed to fit over the threaded injector stud. | 2011-04-21 |
20110089644 | BOOT WITH AN AXIALLY DISPLACED FIRST FASTENING REGION - A boot which has reduced deformations during operation is disclosed. The boot includes a first fastening region, wherein the first fastening region is displaced axially, with respect to the direction of a main axis of the boot, and with respect to a housing part on which the boot can be mounted, in such a way that the first fastening region at least partially projects beyond an edge of the housing part. | 2011-04-21 |
20110089645 | UNDERWATER SWIMMING POOL LIGHT REPAIR DEVICE - A sealing ring repair device for underwater swimming pool lights is designed to fit on the water side of a sealing ring. The repair device includes a top plate with a plurality of top plate screw holes sized and positioned to match the sealing ring screw holes. The top plate has an inner side, and a repair tab extends from the top plate inner side. The repair tab can be used to secure an underwater swimming pool light in place when the ring tab of the sealing ring is damaged. | 2011-04-21 |
20110089646 | GASKET MATERIAL - The present invention relates to a gasket material including a steel plate and a foamed rubber layer formed on one or both sides of the steel plate, in which the foamed rubber layer is obtained from a rubber composition containing: at least one of NBR, H-NBR or functional group-modified NBR, as a rubber compound; and a crosslinking agent, and in which the foamed rubber layer has a quinoid crosslinking structure. | 2011-04-21 |
20110089647 | Variable Chassis Adjustment System - In an example embodiment, an adjustment apparatus for varying the ground clearance of a vehicle includes an adjustable leg configured to couple to a chassis and wheel of a vehicle, and a removable stop to releasably fix the adjustable leg in a desired condition. The adjustable leg may include a main leg and a drop leg that is movable within the leg, the main leg configured to couple to a chassis of a vehicle and the drop leg configured to couple to a vehicle wheel. | 2011-04-21 |
20110089648 | Interchangeable in-line roller/ice skate assembly - The present invention relates to a skate assembly which allows interchange of in-line rollers and ice blades, and more particularly to an interchangeable in-line roller/ice skates which provides for such interchange through the use of simple and affordable means and without the necessity of buying new and customized skates. The assembly comprises a regular in-line roller skate including a boot or shoe with a sole to which a wheel frame is attached; said wheel frame is defined by two parallel lateral walls each of which includes a set of equally-spaced orifices into which wheels are rotatable mounted by inserting an axle bolt through said aligned orifices and through the central orifice of each wheel; the replacement assembly comprises an upper longitudinal bar portion including equally-spaced orifices and to which an ice blade is attached, the arrangement of said orifices coincides with the arrangement of the orifices in the wheel frame so as to align them during the replacement maneuver and insert a retaining bolt through them. | 2011-04-21 |