| 16th week of 2012 patent applcation highlights part 16 |
| Patent application number | Title | Published |
|---|
| 20120091568 | MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE - One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, incoluding a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers. | 2012-04-19 |
| 20120091569 | LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The package structure includes a metal sheet having a first central block, a plurality of first metal blocks, a second central block and a plurality of second metal blocks, a first finish layer and a second finish layer, at least a chip disposed on the metal sheet and a package body encapsulating the chip. The package structure may further include at least an area block for wire routing. | 2012-04-19 |
| 20120091570 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGING METHOD - A chip packaging method includes the steps of: attaching a first tape to a metal plate; patterning the metal plate to form a plurality of terminal pads and a plurality of leads, wherein the plurality of terminal pads and the plurality of leads are disposed on two opposite sides of a central void region, the plurality of terminal pads on each side are arranged in at least two rows spaced apart from each other in the direction away from the central void region, and each lead has a first end portion extending to the central void region and a second end portion connecting to a corresponding terminal pad; attaching a second tape having openings to the plurality of terminal pads, wherein each of the openings exposes the central void region and the first end portions of the leads; removing the first tape; attaching a chip to the plurality of terminal pads and the plurality of leads, wherein a plurality of bond pads on the chip are corresponding to the central void region; and connecting the bond pads to the first end portions of the leads with a plurality of bonding wires through the opening. | 2012-04-19 |
| 20120091571 | SEMICONDUCTOR DEVICE - A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire. | 2012-04-19 |
| 20120091572 | SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE - The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles. | 2012-04-19 |
| 20120091573 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet. | 2012-04-19 |
| 20120091574 | CONDUCTIVE PILLAR STRUCTURE - The invention relates to a bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate; a contact pad over the substrate; a passivation layer extending over the substrate having an opening over the contact pad; and a conductive pillar over the opening of the passivation layer, wherein the conductive pillar comprises an upper portion substantially perpendicular to a surface of the substrate and a lower portion having tapered sidewalls. | 2012-04-19 |
| 20120091575 | Semiconductor Package And Method For Making The Same - The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, at least one first chip, a dielectric layer and at least one second chip. The first chip is attached and electrically connected to the substrate. The first chip includes a first active surface and a plurality of first signal coupling pads. The first signal coupling pads are disposed adjacent to the first active surface. The dielectric layer is disposed on the first active surface. The second chip is attached and electrically connected to the substrate by metal bumps. The second chip includes a second active surface and a plurality of second signal coupling pads. The second active surface contacts the dielectric layer. The second signal coupling pads are disposed adjacent to the second active surface, and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the gap between the first signal coupling pads of the first chip and the second signal coupling pads of the second chip is controlled by the thickness of the dielectric layer. Therefore, the mass-production yield of the semiconductor package is increased. | 2012-04-19 |
| 20120091576 | UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME - An under-bump metallization (UBM) structure in a semiconductor device includes a copper layer, a nickel layer, and a Cu—Ni—Sn intermetallic compound (IMC) layer between the copper layer and the nickel layer. | 2012-04-19 |
| 20120091577 | COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION - An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a thermally reflow process is performed to form a solder bump and drive the Co element into the solder bump. Next, an oxidation process is performed to form a cobalt oxide layer on the sidewall surface of the Cu pillar. | 2012-04-19 |
| 20120091578 | SEMICONDUCTOR CHIP HAVING DIFFERENT PAD WIDTH TO UBM WIDTH RATIOS AND METHOD OF MANUFACTURING THE SAME - The present application describes an semiconductor chip having a substrate, a first conductive pad formed over the substrate, a second conductive pad formed over the substrate and positioned farther from a geometric center of the semiconductor chip than the first conductive pad, a first under bump metallurgy (UBM) structure formed over the first conductive pad, and a second UBM structure formed over the second conductive pad. The first conductive pad and the first UBM structure has a first pad width to UBM width ratio, and the second conductive pad and the second UBM structure has a second pad width to UBM width ratio that is greater than the first ratio. | 2012-04-19 |
| 20120091579 | Semiconductor Packages And Methods Of Fabricating The Same - A semiconductor package includes a wiring board including an upper connection pad provided on a first surface and a lower connection pad provided on a second surface opposite to the first surface, a semiconductor chip having a bonding pad area in which a bonding pad is provided and an adhesive area except the bonding pad area, and being mounted on the first surface of the wiring board in a flip-chip manner such that the bonding pad is electrically connected to the upper connection pad, a first molding layer provided between the adhesive area of the semiconductor chip and the first surface of the wiring board, and a second molding layer provided between the bonding pad area of the semiconductor chip and the first area of the wiring board while covering the first surface of the wiring board and the semiconductor chip. The first molding layer has a lower modulus than the second molding layer. | 2012-04-19 |
| 20120091580 | Semiconductor Devices And Methods Of Fabricating The Same - Provided is a semiconductor device. The semiconductor device may include a first semiconductor chip that includes a first through silicon via having a first protrusion height and a second through silicon via having a second protrusion height greater than the first protrusion height which are penetrating at least a portion of the first semiconductor chip, a second semiconductor chip may be electrically connected to the first through silicon via, and a third semiconductor chip may be electrically connected to the second through silicon via. | 2012-04-19 |
| 20120091581 | PACKAGE UNIT AND STACKING STRUCTURE THEREOF - A package unit and a stacking structure thereof are provided. The package unit includes a substrate, a first patterned circuit layer, a first conductive pillar, a semiconductor element, an insulation layer, a second conductive pillar, a third conductive pillar, a second patterned circuit layer and a conductive bump. The first patterned circuit layer is disposed on a surface of the substrate. The first conductive pillar is deposited through the substrate. The semiconductor element is disposed on the substrate. The insulation layer covers the semiconductor element and the substrate. The second conductive pillar is deposited through the insulation layer. The third conductive pillar is deposited through the insulation layer. The second patterned circuit layer is disposed on the insulation layer. The conductive bump is disposed on the second patterned metal layer. | 2012-04-19 |
| 20120091582 | MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR - A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. The compliant bumps have planar top surfaces which are accessible through the dielectric layer. Conductive traces may be electrically connected with contacts and extend therefrom to overlie the planar top surfaces of the compliant bumps. Conductive elements may overlie the planar top surfaces in contact with the conductive traces. | 2012-04-19 |
| 20120091583 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. | 2012-04-19 |
| 20120091584 | BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP, AND STACKED SEMICONDUCTOR PACKAGE - A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere. | 2012-04-19 |
| 20120091585 | LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD - A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided. | 2012-04-19 |
| 20120091586 | CONFORMAL COATING OF HIGHLY STRUCTURED SURFACES - Method of applying a conformal coating to a highly structured substrate and devices made by the disclosed methods are disclosed. An example method includes the deposition of a substantially contiguous layer of a material upon a highly structured surface within a deposition process chamber. The highly structured surface may be associated with a substrate or another layer deposited on a substrate. The method includes depositing a material having an amorphous structure on the highly structured surface at a deposition pressure of equal to or less than about 3 mTorr. The method may also include removing a portion of the amorphous material deposited on selected surfaces and depositing additional amorphous material on the highly structured surface. | 2012-04-19 |
| 20120091587 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A 3D IC based system comprising a first semiconductor layer comprising first transistors, wherein the first transistors are interconnected by at least one metal layer comprising aluminum or copper; a second mono-crystallized semiconductor layer comprising second transistors and overlaying the metal layer; wherein the second mono-crystallized semiconductor layer thickness is less than 150 nm, and wherein at least one of the second transistors is an N-type transistor and at least one of the second transistors is a P-type transistor. | 2012-04-19 |
| 20120091588 | BARRIER LAYER, FILM FORMING METHOD, AND PROCESSING SYSTEM - There is provided a film forming method for forming a film on a target object having thereon an insulating layer | 2012-04-19 |
| 20120091589 | METHOD TO ELECTRODEPOSIT NICKEL ON SILICON FOR FORMING CONTROLLABLE NICKEL SILICIDE - The present disclosure relates to an improved method of providing a Ni silicide metal contact on a silicon surface by electrodepositing a Ni film on a silicon substrate. The improved method results in a controllable silicide formation wherein the silicide has a uniform thickness. The metal contacts may be incorporated in, for example, CMOS devices, MEM (micro-electro-mechanical) devices, and photovoltaic cells. | 2012-04-19 |
| 20120091590 | Electroless Deposition of Platinum on Copper - Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices. | 2012-04-19 |
| 20120091591 | DISPLAY DEVICE AND SPUTTERING TARGET FOR PRODUCING THE SAME - A display device in which an Al alloy film and a conductive oxide film are directly connected without interposition of refractory metal and some or all of Al alloy components deposit or are concentrated at the interface of contact between the Al alloy film and the conductive oxide film. The Al alloy film contains 0.1 to 6 at % of at least one element selected from the group consisting of Ni, Ag, Zn, Cu and Ge, and further contains 1) 0.1 to 2 at % of at least one element selected from the group consisting of Mg, Cr, Mn, Ru, Rh, Pd, Ir, Pt, La, Ce, Pr, Gd, Tb, Sm, Eu, Ho, Er, Tm, Yb, Lu and Dy or 2) 0.1 to 1 at % of at least one element selected from the group consisting of Ti, V, Zr, Nb, Mo, Hf, Ta and W, as the alloy components. | 2012-04-19 |
| 20120091592 | Double Patterning Technology Using Single-Patterning-Spacer-Technique - A method of forming an integrated circuit structure includes forming a first and a second plurality of tracks parallel to a first direction and on a wafer representation. The first and the second plurality of tracks are allocated in an alternating pattern. A first plurality of patterns is laid out on the first plurality of tracks and not on the second plurality of tracks. A second plurality of patterns is laid out on the second plurality of tracks and not on the first plurality of tracks. The first plurality of patterns is extended in the first direction and in a second direction perpendicular to the first direction, so that each of the second plurality of patterns is surrounded by portions of the first plurality of patterns, and substantially none of neighboring ones of the first plurality of patterns on the wafer representation have spacings greater than a pre-determined spacing. | 2012-04-19 |
| 20120091593 | STRUCTURE AND METHOD FOR SIMULTANEOUSLY FORMING A THROUGH SILICON VIA AND A DEEP TRENCH STRUCTURE - A through silicon via (TSV) and a deep trench capacitor (DTCap) or a deep trench isolation (DTI) are simultaneously formed on the same substrate by a single mask and a single reactive ion etching (RIE). The TSV trench is wider and deeper that the DTCap or DTI trench. The TSV and DTCap or DTI are formed with different dielectric materials on the trench sidewalls. The TSV and DTCap or DTI are perfectly aligned. | 2012-04-19 |
| 20120091594 | Method of Producing a Chip Package, and Chip Package - A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material. | 2012-04-19 |
| 20120091595 | Layered Integrated Circuit Apparatus - A device having layered integrated circuit (IC) chips is provided. The chip comprises notches, conductive area, apertures, and routing pool. A conductive material is set in the apertures. The second chip is layered on the first chip. The notches of the second chip are corresponding to the first conducting area of the first chip. A conductive material is also set in the notch between the conductive area of the first chip and the notches of the second chip. Thus, a system is integrated by layering the first chip and the second chip for enhancing flexibility and reliability of circuit layout. | 2012-04-19 |
| 20120091596 | CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDUCTIVE LAYER - A chip-to-chip multi-signaling communication system with common conductive layer, which comprises a first chip, a second chip, and a common conductive layer, is disclosed. The first chip has at least a first metal pad and a second metal pad. The second chip has at least a first metal pad and a second metal pad. The common conductive layer is to a conductive material and glued directly to the first chip and the second chip. Wherein, the first metal pad of the second chip is aligned with the first metal pad of the first chip for receiving the signal from the first metal pad of the first chip through the common conductive layer. The interference generated by other pads of the first and the second chips is suppressed by the design of the pads and the common conductive layer. | 2012-04-19 |
| 20120091597 | STACKED SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE INCLUDING THE STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package has a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate, and a plurality of connections electrically connecting the first and second semiconductor packages. The connections are disposed on an outer region of the first package substrate outside the first semiconductor chip. The connections are disposed along opposite first longer sides and opposite shorter second sides of the first package substrate. The heights of those connections disposed along each longer first side gradually vary from a central to an outer region (i.e., the ends) of the longer first side. | 2012-04-19 |
| 20120091598 | HANDLING LAYER FOR TRANSPARENT SUBSTRATE - A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device. | 2012-04-19 |
| 20120091599 | Carburetor - A carburetor has a throttle element rotatably supported on a throttle shaft and a choke element rotatably supported on a choke shaft. A first coupling element is fixedly connected to the throttle shaft. A second coupling element is connected to the choke shaft. The first and second coupling elements define in a locked position a start position of throttle element and choke element. The locked position is released by rotation of the throttle shaft in opening direction of the throttle element. The locked position is released by rotation of the choke shaft in opening direction of the choke element. One of the first and second coupling elements is an at least partially elastic coupling element. Upon rotation of the choke shaft from the locked position into an open position, the elastic coupling element is elastically deformed and releases the locked position between the first and second coupling elements. | 2012-04-19 |
| 20120091600 | MEMBRANE BASED CONTACTOR MODULE FOR MASS AND HEAT TRANSFER - An apparatus for the transfer of mass and heat including a membrane having a hydrophilic surface and an opposing hydrophobic surface. The construction prevents transmission or leakage of fluids from one side of the membrane to the other regardless of pressure gradients within the membrane bubble point or water intrusion pressure range, but allows the transfer of vaporized fluid from one side of the membrane to the other. | 2012-04-19 |
| 20120091601 | FUEL BOOSTER FOR A CARBURETOR - A fuel booster is adapted for use with a carburetor. The carburetor receives a liquid, such as fuel for an internal combustion engine. The carburetor has a Venturi with a centerline. The booster includes a liquid supply port hole positioned at an end of the booster; and a plurality of liquid port exits positioned along a side of the booster. The booster is adapted to be located at the centerline so that that a liquid received by the carburetor is provided to the booster supply port hole at and below the centerline and generally no liquid is provided to the booster supply port hole above the centerline. A ledge around the liquid port exits may help expose the liquid port exits. An encapsulated O-ring may seal the booster within the carburetor. | 2012-04-19 |
| 20120091602 | INTEGRATED GAS SPARGER FOR AN IMMERSED MEMBRANE - A gas sparger produces an intermittent flow of bubbles even if provided with a continuous gas flow. The sparger has a housing to collect a pocket of gas and a conduit to release some of the gas from the pocket when the pocket reaches a sufficient size. The housing is integrated with the potting head of a module. The conduit passes through the potting head. | 2012-04-19 |
| 20120091603 | MOLDING OF NONUNIFORM OBJECT HAVING UNDERCUT STRUCTURE - Various embodiments are disclosed herein that relate to the molding of an item having a non-uniform thickness and an undercut structure. One disclosed embodiment provides an injection molding device for molding a part having a non-uniform thickness and an undercut structure, the injection molding device comprising a pair of opposing end walls, a first mold surface being stationary with respect to the pair of opposing end walls, and a second mold surface being movable toward the first mold surface such that a first end of the second mold surface is movable a larger travel distance toward the first mold surface than a second end during a molding process. Further, the pair of opposing end walls comprises a slider with an undercut mold surface that is movable in a direction transverse to a direction in which the second mold surface is movable toward the first mold surface. | 2012-04-19 |
| 20120091604 | MANUFACTURING METHOD FOR LIGHT GUIDE PLATE - A method for manufacturing a light guide plate, such as a sign or guide display board, that guides light incoming from a side surface of a substrate thereof and guides the light outgoing from a major surface thereof. The method includes arranging fabrication dots in a matrix shape at a rectangular distal surface of a ultrasonic fabrication horn, forming, on a major surface of the light guide plate substrate, reflection dots corresponding to the fabrication dots on the distal surface upon pressing the distal surface of the ultrasonic fabrication horn to the major surface of the light guide plate substrate, and forming the reflection dots in a prescribed range on the major surface of the light guide plate substrate by repeating formation of the reflection dot upon correlative movement of the ultrasonic fabrication horn within the major surface with respect to the light guide plate substrate. | 2012-04-19 |
| 20120091605 | Chewable Soft Capsule - A matrix formulation for a soft chewable capsule is provided which includes a gel-forming composition, a plasticizer, a polymer modifier, and water. The polymer modifier may be a carboxylic acid or other organic compound that alters the physical and/or chemical properties of the capsule formulation. A chewable soft capsule is also provided, having enhanced organo-leptic and processing properties. An active material may be delivered to a user using this dosage form. A method of forming the chewable soft capsule is also provided. | 2012-04-19 |
| 20120091606 | METHOD FOR MANUFACTURING FINE POLYMER, AND FINE POLYMER MANUFACTURING APPARATUS - A method for manufacturing a fine polymer including: generating superheated steam by a superheated steam generating unit ( | 2012-04-19 |
| 20120091607 | Escape Route Marking for an Aircraft and Method for Producing an Escape Route Marking - Escape route marking for an aircraft comprising photoluminescent pigments in a carrier material, which luminesce in the dark,
| 2012-04-19 |
| 20120091608 | PROCESS FOR PRODUCING REGENERATED ELASTIC ROLLER - There is provided a process for producing a regenerated elastic roller which can be again used for the formation of high-quality electrophotographic images by sufficiently relaxing a compression set of the elastic roller having the compression set caused in an elastic layer in usage. The process for producing a regenerated elastic roller includes a step of heating an elastic roller having a conductive mandrel and an elastic layer and having a compression set caused in the elastic layer, in a cylindrical mold to thermally expand the elastic layer and to cause a surface of the elastic roller to contact an inner wall of the cylindrical mold. | 2012-04-19 |
| 20120091609 | Method for recycling plastic materials - The invention relates to a method and to an assembly for recycling plastic materials, comprising the following processing steps: a) reprocessing the raw material, wherein the material, if necessary, is comminuted and brought into a fluid-like form and heated and permanently mixed, while preserving the lumpiness and pourability thereof, and optionally the viscosity thereof is increased and/or it is degassed, softened, dried and/or crystallized; b) melting the reprocessed material, at least so much that filtration is possible; c) filtering the melt in order to remove impurities; d) homogenizing the filtered melt; e) degassing the homogenized melt; and f) discharging and/or subsequently processing the melt, such as by granulation, blown film processing, with said processing steps being carried out consecutively in the order listed (FIG. | 2012-04-19 |
| 20120091610 | DEVELOPING BLADE AND ITS MANUFACTURING METHOD - A method for manufacturing a developing blade including a blade member located along one side edge of a support member, comprising providing a top mold with a cavity, sandblasting the cavity with an abrasive in a range of #150 to #1000, clamping together the top mold and a bottom mold while the top mold is in alignment with the bottom mold while at least a part of the support member is positioned in the cavity, and pouring a molding material from a gate to fill the cavity. | 2012-04-19 |
| 20120091611 | IMPRINT METHOD AND APPARATUS - An imprint apparatus includes a detection unit configured to detect a mark formed on the mold and a mark formed on the substrate corresponding to a target transfer position, and a control unit configured to obtain information indicating relative position between a mark formed on the mold and a mark formed on the substrate corresponding to the target transfer position. The detection unit detects a mark formed on the mold and a mark formed on the substrate corresponding to the target transfer position, in a state where position of the mold and the substrate is aligned. The control unit performs alignment between the mold and the substrate so that the relative position when the mold and the transfer material are in contact with each other at the target transfer position in the state. | 2012-04-19 |
| 20120091612 | THERMOPLASTIC RESIN FOAM AND PRODUCTION PROCESS THEREOF - A die plate for a die block can have a coat-hanger-shaped flow path for extruding a molten foamable thermoplastic resin in a form of a sheet. The die plate can be on a downstream side of the coat-hanger-shaped flow path to make a flow rate of the molten foamable thermoplastic resin uniform in a width direction. The die plate can have a multiplicity of delivery apertures. The delivery apertures in opposite side regions can have a diameter greater than a diameter which the delivery apertures in a center region have. A die unit can include a die block, which has a multiple bifurcated manifold terminating in plural coat-hanger-shaped flow paths at downward ends thereof, and a like plural number of similar die plates as described above. A process for producing a wide thermoplastic resin foam can use the die unit. | 2012-04-19 |
| 20120091613 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are water-dispersible fibers derived from sulfopolyesters having a Tg of at least 25° C. The fibers may contain a single sulfopolyester or a blend of a sulfopolyester with a water-dispersible or water-nondispersible polymer. Also disclosed are multicomponent fibers comprising a water dispersible sulfopolyester having a Tg of at least 57° C. and a water non-dispersible polymer. The multicomponent fibers may be used to produce microdenier fibers. Fibrous articles may be produced from the water-dispersible fibers, multicomponent fibers, and microdenier fibers. The fibrous articles include water-dispersible and microdenier nonwoven webs, fabrics, and multilayered articles such as wipes, gauze, tissue, diapers, panty liners, sanitary napkins, bandages, and surgical dressings. Also disclosed is a process for water-dispersible fibers, nonwoven fabrics, and microdenier webs. The fibers and fibrous articles have further applications in flushable personal care and cleaning products, disposable protective outerwear, and laminating binders. | 2012-04-19 |
| 20120091614 | HYDROENGORGED SPUNMELT NONWOVENS - A hydroengorged spunmelt nonwoven formed of thermoplastic continuous fibers and a pattern of fusion bonds. The nonwoven has either a percentage bond area of less than 10 percent, or a percentage bond area of at least 10% wherein the pattern of fusion bonds is anisotropic. | 2012-04-19 |
| 20120091615 | METHOD AND APPARATUS FOR PROVIDING REINFORCED COMPOSITE MATERIALS WITH EMI SHIELDING - A method of forming an item with electromagnetic interference shielding, the method including the steps of: inserting a first polymer into a first compounding extruder, wherein the first compounding extruder provides a first melted charge; inserting the first melted charge into a second compounding extruder, wherein the second compounding extruder introduces a plurality of conductive fibers into the first melted charge and wherein the second compounding extruder provides a second melted charge comprising the first melted charge and a plurality of conductive fibers; depositing the second melted charge onto a least one die of a compression mold; and closing the compression mold about the second melted charge in order to form the item. | 2012-04-19 |
| 20120091616 | STOPPERS OF COMPOSITE CORK MATERIAL FOR SPARKLING WINES AND THE PROCESS FOR THEIR PRODUCTION - Stoppers made from composite material for sparkling wines consisting of two types of cork agglomerate which are closely bonded and produced from two ranges of granulates of different granulometry, where the joining surface between the two agglomerates is irregular due to their interpenetration. A production process of such stoppers by individual moulding (piece by piece), where there is simultaneous feeding of two types of granulate and respective additives into a mould. The mould is then closed and the material compressed and heated for an appropriate time for polymerisation. The granulates used are normally treated with a reactive agglomerant consisting of, for example, quasi-prepolymer based on TDI or quasi-prepolymer based on MDI base. After de-moulding, the unfinished stopper is stabilised, and later machined to the final dimensions. | 2012-04-19 |
| 20120091617 | Method for making briquettes from comminuted straw and a device to produce briquettes - The subject of the invention is a method for the manufacture of briquettes from comminuted straw, as well as a device to manufacture briquettes from comminuted straw. The method consists in that comminuted straw is compressed in a continuous process using a screw-type extruder until the material reaches a temperature at which the material after pressing solidifies to a density exceeding 1.3 g/cm 3. The device has a screw ( | 2012-04-19 |
| 20120091618 | SYNTHETIC COMPOSITION OF MARBLE AND METHOD OF PRODUCTION - A method of producing a synthetic composition having properties of marble includes blending a polymer resin with a stone gravel bit to form a mixture. The method also includes processing the mixture of polymer resin with the stone gravel bit to produce a synthetic marble composition through a polymerization of the mixture that is cast in a casting cell. Further, the method may include preparing a mold to form a casting cell, removing air bubbles from the mixture of polymer resin with the stone gravel bit to enhance a physical property of the synthetic marble material, casting the mixture in the casting cell, polymerizing the cast mixture through an autoclave polymerization of the mixture at a pressure ranging from 1 to 10 atmospheres and a temperature ranging from 50° to 100° C. to prepare the synthetic marble material composition, and curing the synthetic marble sheet in an oven. | 2012-04-19 |
| 20120091619 | Method for Producing Components, Especially Structural Panels, from Solid Waste - A method for manufacturing building elements, in particular building panels, from solid waste is described, in which the latter is provided, sorted according to category, in different fractions of a specified particle size. The different fractions are mixed in specified proportions with addition of water and binder. The resulting mixture is subjected to a continuous extrusion process, in which a strand-like preproduct is produced. Through a cutting operation, the desired dimensions of the building element in the extrusion direction are at least approximately produced. The building-element blanks are then dried and the binder present therein is set. This continuously working process is much more economical compared with the prior art and can be carried out on a large-scale industrial basis. | 2012-04-19 |
| 20120091620 | CROSSLINKABLE POLYETHYLENE COMPOSITION - A combination of vinyl trimethoxysilane and vinyl triethoxysilane can be grafted onto polyethylene to produce a polyethylene graft terpolymer that can be crosslinked without a significant reduction in crosslinking rates relative to vinyl triemethoxysilane grafted polyethylene. The combination of vinyl trimethoxysilane and vinyl triethoxysilane apparently act synergistically. While byproduct methanol from crosslinking with trimethoxysilane is very undesirable in some products, byproduct ethanol from crosslinking is less hazardous, especially at ppm levels. | 2012-04-19 |
| 20120091621 | BIMODAL PIPE RESIN AND PRODUCTS MADE THEREFROM - Disclosed is a bimodal Ziegler-Natta catalyzed polyethylene, having a density of from 0.930 glee to 0.960 glee, and a molecular weight distribution of from 10 to 25, wherein an article formed therefrom has a PENT of at least 1500. Also disclosed is a method of preparing a tubular article including obtaining a bimodal polyethylene having a density of from 0.930 glee to 0.960 Wee and a molecular weight distribution of from 10 to 25, and processing the polyethylene under conditions where a specific energy input (SET) is less than 300 kW.h/ton, and wherein the article has a PENT of at least 1500. Further disclosed is a method for controlling the degradation of polyethylene including polymerizing ethylene monomer, recovering polyethylene, extruding the polyethylene, and controlling the degradation of polyethylene by measuring the SEI to the extruder and adjusting throughput and/or gear suction pressure keep SEI less than 300 kW.h/ton, and forming an article. | 2012-04-19 |
| 20120091622 | METHOD FOR MANUFACTURING FILM FOR FILM CAPACITOR - A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit. | 2012-04-19 |
| 20120091623 | METHOD TO MANUFACTURE CHROME BUTTONS WITH INTEGRATED LIGHT PIPE USING TWO SHOT MOLDING PROCESS - The present invention provides a method for molding and chrome plating a button having an integrated light pipe. The method utilizes a two shot molding process to create the button housing and the light pipe. The method includes the steps of injecting a first shot of resin A wherein resin A is a resin not allowing chrome to adhere to it, allowing resin A to cool, injecting a second shot of resin B into the mold, and continuing to chrome plate the entire button wherein chrome only adheres to resin B. A light pipe formed by resin A remains transparent or translucent allowing light to shine through from a light to the eye of a user. Chrome plating adheres to resin B providing for a polished finish. | 2012-04-19 |
| 20120091624 | Acrylic Rubber Composition - An acrylic rubber composition comprising 100 parts by weight of an ACM polymer, which contains monomers each having a carboxyl group(s) as crosslinking-site monomers, respectively, and 5 to 30 parts by weight of vein graphite or flake graphite. An acrylic rubber composition having 100 parts by weight of an ACM polymer, which contains monomers each having a carboxyl group(s) as crosslinking-site monomers, respectively, 5 to 30 parts by weight of vein graphite or flake graphite, and 0.5 to 1.5 parts by weight of a liquid paraffin. | 2012-04-19 |
| 20120091625 | FILM FOR PRODUCTION OF COMPOSITE MATERIAL ARTEFACTS, PRODUCTION METHOD OF SAID FILM AND PRODUCTION METHOD OF COMPOSITE MATERIAL ARTEFACTS USING SAID FILM - A resin constraint film to be used in production of composite material artefacts; the constraint film being formed by a supporting film made of biaxially oriented polypropylene, by an intermediate layer of release chemical product that coats the front face of the supporting film intended to come into contact with the semi-finished product which will give rise to the composite material artefact, and by a surface layer of metal coating material applied onto the intermediate layer via vacuum vaporisation deposition. | 2012-04-19 |
| 20120091626 | Process for fabricating an integral plastic faucet member - A process for fabricating an integral plastic faucet member contains two injection steps. A first plastic injection is used to mold a first part at a middle connecting part of a faucet member. The first part is then placed into a mold for a second plastic injection so as to mold a second part at two sides of the faucet member. The second part is properly wrapped around and bonded to the first part. Meanwhile, desired holes are reserved to serve as water inlets, water outlets, and valve seats. Through such a two-injection process, the conventional complicated and time-consuming copper casting process is simplified, which improves the production efficiency and product quality, lows the cost and defective ratio. Meanwhile, the product weight is also reduced, which greatly reduces the transportation cost. | 2012-04-19 |
| 20120091627 | METHOD FOR MANUFACTURING A WIND TURBINE ROTOR BLADE - A method for forming a profile for a hollow component is provided. A first composite fibre layer is laid out on a first surface corresponding to a first profile section of the component. A second composite fibre layer is laid out in a second surface corresponding to a second profile section of the component. A collapsed bag is laid out in onto the first composite fibre layer. The bag and the first composite fibre layer are fixed to the first surface. First and second mould elements are coupled such that the first surface and the second surface correspond to the first and second profiles. The bag is inflated such that the first composite fibre layer is pressed to the first surface and the second composite fibre layer is pressed to the second surface so that the first and second layers are coupled to form the profile. | 2012-04-19 |
| 20120091628 | HEAT TREATMENT OF THIN POLYMER FILMS - Stretch film is treated by passing a web of tackifier-containing, unbloomed thin polymer film through a heater so that the web is heated to a temperature sufficient to cause tackifier bloom prior to the web reaching a next stage in an in-line process. Also, a pattern can be applied to a thin polymer film. An oriented web of thin polymer film is passed across at least one heated roller having the pattern engraved thereon to define face regions and relief regions collectively conforming to the pattern. As the web contacts each roller surface, portions of the web positioned over the relief regions receive less heat than portions of the web positioned over the face regions, thereby causing the respective portions of the web to undergo differential, heat-induced shrinkage which imparts the pattern to the thin polymer film. | 2012-04-19 |
| 20120091629 | IMPRINT LITHOGRAPHY - An imprint lithography apparatus is disclosed that has a first array of template holders, a second array of template holders, and a substrate table arranged to support a substrate to be imprinted, wherein the first array of template holders is arranged to hold an array of imprint templates that can be used to imprint a first array of patterns onto the substrate, and the second array of template holders is arranged hold an array of imprint templates that can be used to imprint a second array of patterns onto the substrate, the patterns imprinted by the second array being interspersed between the patterns imprinted by the first array. | 2012-04-19 |
| 20120091630 | SYSTEM AND METHOD FOR EMBOSSING/DEBOSSING IMPRESSIONABLE MATERIAL - An embossing/debossing system and method for embossing or debossing an impressionable material, such as paper. The system may comprise a laser cutting apparatus and a stamping apparatus. The laser cutting apparatus may comprise a laser configured for cutting and/or ablating one or more patterns into a stencil material. The stamping apparatus may be configured to receive the stencil material from the laser cutting apparatus and may have an actuatable elastomeric press pad configured to press the impressionable material into the patterns formed in the stencil material by the laser cutting apparatus. The system may also comprise various feeding devices configured to feed the stencil material from the laser cutting apparatus to the stamping apparatus and/or configured to feed the impressionable material through the stamping apparatus. | 2012-04-19 |
| 20120091631 | RAPID-ASSEMBLY BASE MOULD WITH AN ENGAGEABLE HOLDING FORCE ASSIST - An apparatus for moulding plastic preforms into plastic containers, comprising at least one blow moulding station ( | 2012-04-19 |
| 20120091632 | METHOD OF SELECTIVE FOAMING FOR POROUS POLYMERIC MATERIAL - A selective high intensity ultrasonic foaming technique is described to fabricate porous polymers for biomedical applications. Process variables, including ultrasound power, scanning speed, and gas concentration have an affect on pore size. Pore size can be controlled with the scanning speed of the ultrasound insonation and interconnected porous structures could be obtained using a partially saturated polymers. A gas concentration range of 3-5% by weight creates interconnected open-celled porous structures. The selective high intensity ultrasonic foaming method can be used on biocompatible polymers so as not to introduce any organic solvents. The method has use in cell related biomedical applications such as studying cell growth behaviors by providing a porous environment with varying topological features. | 2012-04-19 |
| 20120091633 | Method To Minimize Chain Scission And Monomer Generation In Processing of Poly(L-Lactide) Stent - Methods of fabricating an implantable medical devices such as stents made from biodegradable polymers are disclosed that reduce or minimize chain scission and monomer generation during processing steps. The method includes processing a poly(L-lactide) resin having an number average molecular weight between 150 to 200 kD in an extruder in a molten state. A poly(L-lactide) tube is formed from the processed resin and a stent is fabricated from the tube. The number average molecular weight of the poly(L-lactide) of the stent after sterilization is 70 to 100 kD. | 2012-04-19 |
| 20120091634 | BLOWING MOLD ARRAY, STRECTH BLOW MOLDING MACHINE AND METHOD - The invention relates to a blowing mold array ( | 2012-04-19 |
| 20120091635 | STRETCH ROD SYSTEM FOR LIQUID OR HYDRAULIC BLOW MOLDING - A mold device and a method related thereto for forming a plastic container from a preform. The mold device comprises a mold defining a mold cavity, a stretch initiation rod system for engaging an interior portion of the preform to define a stretch initiation area, and a centrally disposed pressure source positionable within the preform for introducing a pressurized fluid. | 2012-04-19 |
| 20120091636 | Apparatus for Reshaping Plastic Preforms, Having a Heating Device - An apparatus for reshaping plastic preforms into plastic containers includes a plurality of blow-moulding stations that each have at least one receptacle space, within which the plastic preforms can be expanded into the plastic containers. The apparatus also includes a conveying device that conveys the containers along at least one specified travel path, wherein the apparatus has a plurality of heating devices that are arranged along the travel path of each container, upstream of the blow-moulding stations, wherein at least one heating device is allocated to at least one blow-moulding station. | 2012-04-19 |
| 20120091637 | APPARATUS FOR MANUFACTURING PLASTIC CONTAINERS WITH VARIABLE STATION DEACTIVATION - Apparatus ( | 2012-04-19 |
| 20120091638 | SHOCK ABSORBER USING AIR PRESSURE - The present invention provides a shock absorber, “AIR FORCE”, that uses air pressure to support the weight of a vehicle. The shock absorber of the present invention comprises of a damper, which is a cylinder filled with oil and gas pressure, and an air pressure adjusting assembly. During the use, the piston presses against the air inside the cylinder. The softness and the hardness of the shock absorber is adjustable using an adjuster. The present shock absorber of the present invention use air pressure to support the weight of the vehicle instead of the use of spring. By manipulating the air pressure inside the cylinder, the softness and the hardness of the shock absorber can be adjusted. In addition, it can be used accompany with a damper. | 2012-04-19 |
| 20120091639 | Fully Decoupled Hydraulic Torque Strut - A hydraulic device disposed in a torque strut so as to provide a fully decoupled hydraulic torque strut. A main rubber element vibrates in response to powertrain pitch torque. At high vibration amplitude, high hydraulic damping is provided via a pumping chamber, an inertia track and a bellowed compensation chamber, wherein a decoupler system hydraulically connected to the pumping chamber is passively disabled. At low vibration amplitude, minimal hydraulic damping is provided via the decoupler system which is connected by a decoupler track to the compensation chamber. | 2012-04-19 |
| 20120091640 | VIBRATION ABSORPTION DEVICE - A vibration absorption that is both capable of damping vibrations in two directions and high in durability. A pair of pressure receiving chambers ( | 2012-04-19 |
| 20120091641 | AIR PRESSURE BUFFER - An air pressure buffer includes a hollow tube, a first cap at one end of the tube, a shaft including a first section, a second section and a third section with the first section and/or third section extended outside the tube, a flexible valve which has an annular recess at one side to form an open space with the tube and second section extended to the third section and another side facing the first cap to form a closed space with the tube, the first cap and the second section extended to the first section, and a flexible compression member which has at least one axial ventilation groove on the outer surface thereof. The structure thus formed does not have buffer delay while being applied by an external force and provides enhanced buffer damping capability and steady and secure buffering effect. | 2012-04-19 |
| 20120091642 | VIBRATION ABSORPTION DEVICE - A floor portion ( | 2012-04-19 |
| 20120091643 | TUBULAR VIBRATION-DAMPING MOUNT - The present invention provides a tubular vibration-damping mount capable of securing durability against an input in a direction perpendicular to an axis. A tubular vibration-damping mount comprises a core member, a tubular member, a rubber member, an upper surface of which has, as viewed in a cross section including an axis of the core member, a recessed portion in a radially inner direction of the rubber member and an inclined portion whose inclination angle is smoothly and upwardly increased in the radially inner direction from a point on the tubular member as a starting point, and a bracket, wherein the tubular member has, in an area higher than a lower end of an adhesion surface between the tubular member and the rubber member and the upper surface of the rubber member starts from a point on the inner periphery of the diameter-enlarged portion of the tubular member, which the point agrees with the starting point. | 2012-04-19 |
| 20120091644 | POCKET SPRING STRUCTURE FOR BED MATTRESS - Disclosed herein is a pocket spring structure for a bed mattress, in which a rigid support capable of resisting compressive strength due to applied load is further integrally formed in a partial region of a spring mounted in a sealed pocket, thereby preventing deformation of the spring and increasing its durability. | 2012-04-19 |
| 20120091645 | Systems and Methods of Installing Skid Plates to Vehicles - An apparatus to support a skid plate during installation to an underside of a vehicle, the apparatus including a lower frame, a lifting apparatus mounted to the lower frame, and an upper frame mounted to the lifting apparatus such that the lifting apparatus selectively raises or lowers the upper frame relative to the lower frame to adjust the height of the skid plate relative to an installation surface of the vehicle. The upper frame can rotate about a longitudinal axis of the lifting apparatus and can pivot about an axis generally perpendicular to the longitudinal axis to orient the skid plate relative to the installation surface. | 2012-04-19 |
| 20120091646 | FOOD CUTTING BOARD - A cutting board wherein a pair of opposed posts are attached near an edge of a top cutting surface and include facing closed slots therein. A retaining bar is located in the slots in the opposed posts and a compression spring provides a downward bias to the retaining bar in a manner which enables the retaining bar to move vertically with respect to the cutting surface. The apparatus facilitates cutting a variety of items using a preferred type of knife commonly referred to as a chef's knife. When an item to be cut is placed on the cutting surface of the board, and the point of the knife engage the retaining bar, the cutting of an item is enhanced and facilitated through the lever action of the knife and the biased retaining bar serving as a fulcrum. | 2012-04-19 |
| 20120091647 | DEVICE AND METHOD FOR TRIMMING THE TOP EDGE, BOTTOM EDGE AND OPENING EDGE OF A PRINTED PRODUCT - In a device for trimming the top edge, bottom edge, and opening edge of a printed product, the printed product is transported through a cutting region of a connected cutting unit in a closed clamp of a synchronously driven conveying apparatus. The conveying apparatus is configured as a conveying rotor and the clamps are guided on a circulating path. The printed product is trimmed in the cutting region of the cutting unit which is arranged between a transfer station and a delivery station. In the cutting region, each clamp transitions from a circular control path section into an intermediate control path section in which the clamp is maintained substantially perpendicular relative to a tangent to a circular cutting path of the cutting unit during trimming of at least the top and bottom edges of the printed product. | 2012-04-19 |
| 20120091648 | Sheet Processing Device - A sheet processing device for performing various sheet post-processing functions at high speed and implementing a compact structure includes a compiler | 2012-04-19 |
| 20120091649 | SHEET FINISHING APPARATUS, SHEET FINISHING METHOD, AND IMAGE FORMING APPARATUS - A stapler is provided in a housing of a finisher. The stapler has a sheet insertion opening extending in a direction along conveyed sheets. The stapler staples the sheets inserted into the sheet insertion opening in the housing. The finisher includes a rotating mechanism that rotates, when the stapler is moved in a direction orthogonal to a conveying direction of the sheets and removed to the outside of the housing, the stapler such that the sheet insertion opening of the stapler faces a further upper side than the direction along the sheets. | 2012-04-19 |
| 20120091650 | IMAGE RECORDING DEVICE - An image recording device includes a first roller, a plurality of second rollers, a tray, and a recording portion. The tray includes a pair of thick-walled sections, a thin-walled section, and an accommodation portion. The pair of thick-walled sections extends in a lengthwise direction and protrudes from the first surface. The thin-walled section is positioned between the pair of thick-walled sections. The thin-walled section is thinner than the pair of thick-walled sections in a thickness direction of the tray. The accommodation portion is formed by a recess in the thickness direction in the thin-walled section. When the first roller and the plurality of second rollers nip the tray therebetween, the first surface of the tray does not contact any of the first roller or the plurality of second rollers, except at the pair of thick-walled sections of the tray. | 2012-04-19 |
| 20120091651 | AUTO-DOCUMENT FEEDER AND DOCUMENT FEEDING METHOD - An auto-document feeder includes: a document placing section on which an original document is placed; a sheet detection sensor configured to detect the original document, length in a feeding direction of the original document being first length larger than second length; a length detection sensor configured to detect the length of the original document while the original document is fed; a first feeding path for feeding the original document to a reading section for reading an image of the original document; a second feeding path for feeding the original document to the reading section, the second feeding path being different from the first feeding path; a switching section configured to selectively switch the first feeding path and the second feeding path; and a control section configured to divert, with the switching section, the original document to the first feeding path if the sheet detection sensor detects the original document. | 2012-04-19 |
| 20120091652 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus including, a conveying portion conveying a sheet; a rotation detection portion rotatably provided; a sensor portion detecting the conveyed sheet based on a rotational position of the rotation detection portion; a rotation transmission portion transmitting a rotational driving force to the rotation detection portion to rotate the rotation detection portion in a predetermined rotational direction after the rotation detection portion is rotated by being pushed by the leading end of the sheet; and an urging unit configured to apply an urging force to the rotation detection portion so that the rotation detection portion comes into contact with a surface of the sheet, thereafter the rotation detection portion is returned to a waiting position along with the passage of the rear end of the sheet through the rotation detection portion after the rotation detection portion is rotated by the rotational driving force of the rotation transmitting unit. | 2012-04-19 |
| 20120091653 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A skew feeding correction portion includes a first pair of skew-feed rollers that has rollers, a second pair of skew-feed rollers, a third pair of skew-feed rollers, as skewing at the downstream side of the second pair of skew-feed rollers, and a reference member that is arranged along a sheet conveying direction and that corrects the skew feeding of the sheet in such a manner that a side end of the sheet, which is conveyed as being skewed by the respective pairs of skew-feed rollers, is brought into contact with the reference member, wherein the first pair of skew-feed rollers releases the nip of the sheet by separating the rollers from each other before the sheet is nipped by the third pair of skew-feed rollers after the sheet is nipped by the second pair of skew-feed rollers. | 2012-04-19 |
| 20120091654 | ROLL NIP STRUCTURE HAVING ADAPTIVE PIVOT POSITION - A printing apparatus comprises a marking device, a media path positioned to supply sheets of media to the marking device, and a media supply tray positioned to supply the sheets of media to the media path. Further, a pair of rollers forms a nip adjacent the media supply tray. The rollers rotate in opposite directions to cause the sheets of media to move from the media supply tray to the media path. Additionally, a first frame structure supports a first roller of the pair of rollers. The first frame structure can be in a fixed position and holds the first roller in a fixed location. A second frame structure supports a second roller of the pair of rollers. The second frame structure is adjustable in a first direction toward the first roller and has a variable pivot position allowing the second frame structure to move in a second direction perpendicular to the first direction. | 2012-04-19 |
| 20120091655 | SHEET CONVEYING APPARATUS - A sheet conveying apparatus has a first pair of rollers which nip and convey a sheet; a second pair of rollers provided on a downstream side of the first pair of rollers in a conveying direction of the sheet, which nip and convey a sheet; and a position detecting sensor which detects a position of a sheet in a width direction which is perpendicular to the conveying direction. When the first pair of rollers and the second pair of rollers nip and convey the sheet, the first pair of rollers and the second pair of rollers are simultaneously moved according to a position detected by the position detecting sensor in the same direction of the width direction which is perpendicular to the conveying direction. | 2012-04-19 |
| 20120091656 | CARD HANDLING SYSTEMS, DEVICES FOR USE IN CARD HANDLING SYSTEMS AND RELATED METHODS - Card handling systems include shuffling devices, shoe devices, and a card transfer system for automatically transferring cards from the shuffling device into the shoe device. Shuffling devices may include a divider configured to contact at least one card positioned within a compartment of the shuffling device. Shoe devices may include a card loading system for loading cards into a card storage area through an opening in a base of the shoe device. Methods of providing cards during a casino table game play include identifying card information including a rank and a suit of each card in a shuffling device and a shoe device and transporting cards from the shuffling device to the shoe device. | 2012-04-19 |
| 20120091657 | Method and Apparatus for Card Handling Device Calibration - A device for automatically calibrating for card size and thickness during card handling is disclosed. The device includes a card receiving area, a card stacking area and a card moving system for moving cards from the card receiving area to the card stacking area. An elevator located in the card stacking area has a movable platform for moving a stack of cards. At least one sensor senses at least one of position of the platform, height of the platform, position of a card in the elevator, height of a card or cards in the elevator, pressure applied to a card in the elevator, presence of the platform at a predetermined height, presence of the platform at a predetermined position, presence of card(s) on the platform, and absence of card(s) on the platform. A method for calibrating a card-handling device during shuffling is also disclosed. | 2012-04-19 |
| 20120091658 | Puzzle with color rules - Puzzles characterized by colored pieced with unique shapes. The unique shapes of the pieces include more than one polygonal shape. The pieces can be jointly assembled into a tiling configuration in various ways allowing for large number of solutions. The puzzle pieces are placed on a flat board with a frame which matches the edges of the various pieces. The puzzle pieces can be jointly assembled to the frame. The object of the puzzle is to fill the board with all the pieces while following specific color restriction rule and predefined starting point. | 2012-04-19 |
| 20120091659 | INTERCHANGEABLE THREE DIMENSIONAL (3D) GLASSES AND THREE DIMENSIONAL 5 CONNECT-THE-DOTS DRAWINGS - Interchangeable glasses in accordance with one embodiment include a glasses frame; a first pair of lenses that are interchangeable with the glasses frame and have a first set of lenses that are a first color; a second pair of lenses that are interchangeable with the glasses frame and have a second set of lenses that are a second color; and a third pair of lenses that are interchangeable with the glasses frame and have a third set of lenses, where the third set of lenses includes a first lens that is the first color and a second lens that is the second color. | 2012-04-19 |
| 20120091660 | TARGET IMPACT-POINT SENSING SYSTEM - A target includes multiple segments that are vibrationaly isolated from each other. A vibration sensor is coupled to each segment to provide vibration signatures representative of a segment being impacted by a projectile. | 2012-04-19 |
| 20120091661 | Multifunction target actuator - A multifunction target actuator allows a bullet target to be selectively presented to a shooter such that a first side may be presented, a second side opposite the first side may be presented, and the target may be oriented so as not to be presented to the shooter. The actuator allows for quick and accurate movement of the target. | 2012-04-19 |
| 20120091662 | LABYRINTH SEAL SYSTEM - A labyrinth seal system is disclosed, including a stationary component having a plurality of radially inwardly projecting, axially spaced teeth extending therefrom; and a rotor having a plurality of radially outwardly projecting, axially spaced protrusions, each protrusion having a low pressure side and a high pressure side, wherein the low pressure side of at least one protrusion extends farther in a radial direction than the high pressure side. | 2012-04-19 |
| 20120091663 | Nitriding Grade Steel Material Composition for Manufacturing Piston Rings and Cylinder Liners - A steel material composition in particular for manufacturing piston rings and cylinder liners, which has a good nitriding capability, contains the following elements in the given proportion related to 100% by weight of the steel material composition: 0.5-1.2% by weight C, 4.0-20.0% by weight Cr, 45.30-91.25% by weight Fe, 0.1-3.0% by weight Mn, 0.1-3.0% by weight Mo, 2.0-12.0% by weight Ni, 2.0-10.0% by weight Si and 0.05-2.0% by weight V. It can be manufactured by manufacturing a melt of the starting materials and casting the melt into a prefabricated mould. Nitridation of the steel material composition which is obtained leads to a nitridized steel material composition which, by virtue of the manufacture with gravity casting, exceeds the properties of tempered cast iron with nodular graphite. | 2012-04-19 |
| 20120091664 | SEALING APPARATUS - A sealing apparatus includes: a case having a hollow portion; a shaft passing through the hollow portion; and a sealing member sealing between the case and the shaft, and including a resin ring and a ring-shaped rubber cap. The rubber cap includes a base portion and a lip portion. The lip portion includes a first lip contacting the resin ring and a second lip configured to contact an inner peripheral surface of the case. If a pressure of a first chamber of the lip portion side is lower than a pressure of a second chamber at the side of the base portion, the second lip is separated from the case to relieve the pressure of the second chamber to the first chamber. The base portion includes a first restricting surface for restricting the base portion from moving, and a second surface for restricting the base portion from moving. | 2012-04-19 |
| 20120091665 | Seal Structure - A seal structure for sealing a penetrated portion through which a rotary shaft passes between a cover member and the rotary shaft. A seal member is fitted onto the rotary shaft in a manner that the rotary shaft can rotate relative to the seal member, and the elastic buffer member is provided for connection between the seal member and the cover member at the penetrated portion. The seal structure can keep sealing performance by reducing the influence of movements such as vibration and thermal expansion of the cover member and the influence of process tolerance of the cover member on the sealing performance of the seal member attached to the penetrated portion between the cover member and the rotary shaft penetrating the cover member. | 2012-04-19 |
| 20120091666 | BRAKE CALIPER SEAL GROOVE - A seal groove comprising: a back wall; a front wall opposed to the back wall; a bottom wall connected to the front wall and the back wall; and a recess in the front wall connecting the front wall to the piston bore; wherein the recess includes a peak which comprises: a first angled portion and a second angled portion. | 2012-04-19 |
| 20120091667 | Seal assembly for relieving pressure - In a seal assembly ( | 2012-04-19 |
