15th week of 2014 patent applcation highlights part 13 |
Patent application number | Title | Published |
20140097501 | INTEGRATED POWER MODULE FOR MULTI-DEVICE PARALLEL OPERATION - An integrated power module having a dielectric substrate, a source conductor trace formed on the dielectric substrate, a drain conductor trace formed on the dielectric substrate, a gate conductor trace formed on the dielectric substrate, a transistor chip having a top surface and a bottom surface connected to the drain conductor trace, a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace, and a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor. | 2014-04-10 |
20140097502 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - A semiconductor device has gate-all-around devices formed in respective regions on a substrate. The gate-all-around devices have nanowires at different levels. The threshold voltage of a gate-all-around device in first region is based on a thickness of an active layer in an adjacent second region. The active layer in the second region may be at substantially a same level as the nanowire in the first region. Thus, the nanowire in the first region may have a thickness based on the thickness of the active layer in the second region, or the thicknesses may be different. When more than one active layer is included, nanowires in different ones of the regions may be disposed at different heights and/or may have different thicknesses. | 2014-04-10 |
20140097503 | MEMORY CELL ARRAY WITH SEMICONDUCTOR SELECTION DEVICE FOR MULTIPLE MEMORY CELLS - A memory array that includes access devices that are each electrically coupled to more than one memory cell. The memory cells are coupled to the access devices via diode devices. The access devices include vertical semiconductor material mesas upstanding from a semiconductor base that form a conductive channel between first and second doped regions, and also planar access devices. | 2014-04-10 |
20140097504 | METHOD FOR DEPOSITING A LOW-DIFFUSION TIALN LAYER AND INSULATED GATE COMPRISING SUCH A LAYER - A method for forming an aluminum titanium nitride layer on a wafer by plasma-enhanced physical vapor deposition including a first step at a radio frequency power ranging between 100 and 500 W only, and a second step at a radio frequency power ranging between 500 and 1,000 W superimposed to a D.C. power ranging between 500 and 1,000 W. An insulated gate comprising such an aluminum titanium nitride layer. | 2014-04-10 |
20140097505 | SEMICONDUCTOR DEVICE HAVING NITRIDE LAYERS - According to one embodiment, a second nitride semiconductor layer is provided on a first nitride semiconductor layer and has a band gap wider than that of the first nitride semiconductor layer. A third nitride semiconductor layer is provided above the second nitride semiconductor layer. A fourth nitride semiconductor layer is provided on the third nitride semiconductor layer and has a band gap wider than that of the third nitride semiconductor layer. A fifth nitride semiconductor layer is provided between the second and the third nitride semiconductor layers. A first electrode contacts the second, the third and the fourth nitride semiconductor layers. A second electrode is provided on the fourth nitride semiconductor layer. A gate electrode is provided on a gate insulating layer between the first and the second electrodes. A third electrode is in contact with the second nitride semiconductor layer. | 2014-04-10 |
20140097506 | FIN FIELD EFFECT TRANSISTOR, AND METHOD OF FORMING THE SAME - The description relates to a fin field effect transistor (FinFET). An exemplary structure for a FinFET includes a fin having a first height above a first surface of a substrate, where a portion of the fin has first tapered sidewalls, and the fin has a top surface. The FinFET further includes an insulation region over a portion of the first surface of the substrate, where a top of the insulation region defines a second surface. The FinFET further includes a gate dielectric over the first tapered sidewalls and the top surface. The FinFET further includes a conductive gate strip over the gate dielectric, where the conductive gate strip has second tapered sidewalls along a longitudinal direction perpendicular to the first height, and a first width between the second tapered sidewalls in the longitudinal direction is greater at a location nearest to the substrate than a second width at a location farthest from the substrate. | 2014-04-10 |
20140097507 | Semiconductor Device Having a Metal Gate and Fabricating Method Thereof - The present invention provides a method of forming a semiconductor device having a metal gate. A substrate is provided and a gate dielectric and a work function metal layer are formed thereon, wherein the work function metal layer is on the gate dielectric layer. Then, a top barrier layer is formed on the work function metal layer. The step of forming the top barrier layer includes increasing a concentration of a boundary protection material in the top barrier layer. Lastly, a metal layer is formed on the top barrier layer. The present invention further provides a semiconductor device having a metal gate. | 2014-04-10 |
20140097508 | ACCELEROMETER AND ITS FABRICATION TECHNIQUE - An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame. The range-of-motion stops are coupled to the support frame by connection beams, and the mass is coupled with the range-of-motion stops by groups of E-shaped resilient beams. The ends of each resilient beam are connected to the range-of-motion stops, and the middle of each resilient beam is connected to the mass. | 2014-04-10 |
20140097509 | MAGNETIC MEMORY ELEMENT AND MAGNETIC MEMORY - A disclosed magnetic memory element includes: a magnetization free layer formed of a ferromagnetic substance having perpendicular magnetic anisotropy; a response layer provided so as to be opposed to the magnetization free layer and formed of a ferromagnetic substance having perpendicular magnetic anisotropy; a non-magnetic layer provided so as to be opposed to the response layer on a side opposite to the magnetization free layer and formed of a non-magnetic substance; and a reference layer provided so as to be opposed to the non-magnetic layer on a side opposite to the response layer and formed of a ferromagnetic substance having perpendicular magnetic anisotropy. The magnetization free layer includes a first magnetization fixed region and a second magnetization fixed region which have magnetization fixed in directions antiparallel to each other, and a magnetization free region in which a magnetization direction is variable. | 2014-04-10 |
20140097510 | PHOTODIODE AND METHOD FOR PRODUCING THE SAME, PHOTODIODE ARRAY, SPECTROPHOTOMETER AND SOLID-STATE IMAGING DEVICE - Provided is a photodiode having a high-concentration layer on its surface, in which the high-concentration layer is formed so that the thickness of a non-depleted region is larger than the roughness of an interface between silicon and an insulator layer, and is smaller than a penetration depth of ultraviolet light. | 2014-04-10 |
20140097511 | INTEGRATED DIODE ARRAY AND CORRESPONDING MANUFACTURING METHOD - An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them. | 2014-04-10 |
20140097512 | HYBRID SEMICONDUCTOR MODULE STRUCTURE - Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights. | 2014-04-10 |
20140097513 | Package-on-Package Type Package Including Integrated Circuit Devices and Associated Passive Components on Different Levels - A package-on-package (PoP)-type package includes a first semiconductor package having a first passive element and a first semiconductor device mounted on a first substrate, and a second semiconductor package having a second semiconductor device mounted on a second substrate. The first passive element is electrically connected to the second semiconductor device. Related devices are also discussed. | 2014-04-10 |
20140097514 | Semiconductor Package and Method for Fabricating the Same - A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material. | 2014-04-10 |
20140097515 | COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THREE-DIMENSIONALLY FORMED COMPONENTS - A compound semiconductor integrated circuit with three-dimensionally formed components, such as three-dimensionally formed bond pads or inductors, positioned above an electronic device. The dielectric layer inserted between the electronic device and the bond pads or inductors thereon has a thickness between 10 to 30 microns, so that it can effectively mitigate the effect of the structure on the device performance. A SiN protection layer can be disposed to cover the electronic devices to prevent contamination from the bond pad or inductor material to the electronic device, and therefore the lower cost copper can be used as the bond pad and inductor material. The three-dimensional bond pad can be used in wire bonding or bump bonding technology. | 2014-04-10 |
20140097516 | HIGH-VOLTAGE INTEGRATED METAL CAPACITOR AND FABRICATION METHOD - A high-voltage metal capacitor with easy integration into existing semiconductor manufacturing processes can provide isolation capacitors up to several kilovolts. The capacitor includes a support layer with internal structure, including a lower place, a bond pad on the support layer, an upper plate disposed on the support layer, the upper plate being arranged above the lower plate, a dielectric layer, at least part of which is between the lower and upper plates, and a passivation layer, at least part of which covers at least part of the upper plate and part of the dielectric layer. A first opening extends from the surface through the passivation and dielectric layers to the lower plate, and a second opening extends from the surface through the passivation layer to the upper plate. A method of manufacturing the capacitor. | 2014-04-10 |
20140097517 | SEMICONDUCTOR DEVICE HAVING LOCALIZED CHARGE BALANCE STRUCTURE AND METHOD - In one embodiment, a semiconductor substrate is provided having a localized superjunction structure extending from a major surface. A doped region is then formed adjacent the localized superjunction structure to create a charge imbalance therein. In one embodiment, the doped region can be an ion implanted region formed within the localized superjunction structure. In another embodiment, the doped region can be an epitaxial layer having a graded dopant profile adjoining the localized superjunction structure. The charge imbalance can improve, among other things, UIS performance. | 2014-04-10 |
20140097518 | SEMICONDUCTOR ALLOY FIN FIELD EFFECT TRANSISTOR - Semiconductor alloy fin structures can be formed by recessing a semiconductor material layer including a first semiconductor material to form a trench, and epitaxially depositing a semiconductor alloy material of the first semiconductor material and a second semiconductor material within the trench. The semiconductor alloy material is epitaxially aligned to the first semiconductor material in the semiconductor material layer. First semiconductor fins including the first semiconductor material and second semiconductor fins including the semiconductor alloy material can be simultaneously formed. In one embodiment, the first and second semiconductor fins can be formed on an insulator layer, which prevents diffusion of the second semiconductor material to the first semiconductor fins. In another embodiment, shallow trench isolation structures and reverse biased wells can be employed to provide electrical insulation among neighboring semiconductor fins. | 2014-04-10 |
20140097519 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming a first semiconductor wafer, in which a circuit part and a first bonding layer are stacked, on a first semiconductor substrate, forming a second semiconductor wafer, which includes structures and an insulating layer for gap-filling between the structures, on a second semiconductor substrate, the structures including a pillar and bit lines stacked therein, bonding the first semiconductor wafer with the second semiconductor wafer so that the first bonding layer faces the insulating layer, and separating the second semiconductor substrate from the bonded second semiconductor wafer. | 2014-04-10 |
20140097520 | METHODS OF FORMING AN ARRAY OF OPENINGS IN A SUBSTRATE, RELATED METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE, AND A RELATED SEMICONDUCTOR DEVICE STRUCTURE - A method of forming an array of openings in a substrate. The method comprises forming a template structure comprising a plurality of parallel features and a plurality of additional parallel features perpendicularly intersecting the plurality of additional parallel features of the plurality over a substrate to define wells, each of the plurality of parallel features having substantially the same dimensions and relative spacing as each of the plurality of additional parallel features. A block copolymer material is formed in each of the wells. The block copolymer material is processed to form a patterned polymer material defining a pattern of openings. The pattern of openings is transferred to the substrate to form an array of openings in the substrate. A method of forming a semiconductor device structure, and a semiconductor device structure are also described. | 2014-04-10 |
20140097521 | Silicon on Nothing Devices and Methods of Formation Thereof - In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a first cavity within a substrate. The first cavity is disposed under a portion of the substrate. The method further includes forming a first pillar within the first cavity to support the portion of the substrate. | 2014-04-10 |
20140097522 | METHODS AND APPARATUS FOR IDENTIFYING AND REDUCING SEMICONDUCTOR FAILURES - The present disclosure provides multi-junction solar cell structures and fabrication methods thereof that improve electrical testing capability and reduce chip failure rates. In the present invention a special masking pattern is used in the layout such that all or some of the epitaxial layers are etched away in the corner areas of each solar cell. Consequently, the semiconductor substrate or one or more of the interconnections between junctions become accessible from the top (the side facing the sun) to make electrical connections. | 2014-04-10 |
20140097523 | METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER - A method for manufacturing a bonded wafer includes: an ion implantation step of using a batch type ion implanter; a bonding step of bonding an ion implanted surface of a bond wafer to a surface of a base wafer directly or through an insulator film; and a delamination step of delaminating the bond wafer at an ion implanted layer, thereby manufacturing a bonded wafer having a thin film on the base wafer, wherein the ion implantation into the bond wafer carried out at the ion implantation step is divided into a plurality of processes, the bond wafer is rotated on its own axis a predetermined rotation angle after each ion implantation, and the next ion implantation is carried out at an arrangement position obtained by the rotation. | 2014-04-10 |
20140097524 | COPLANAR WAVEGUIDE FOR STACKED MULTI-CHIP SYSTEMS - An approach for a coplanar waveguide structure in stacked multi-chip systems is provided. A method of manufacturing a semiconductor structure includes forming a first coplanar waveguide in a first chip. The method also includes forming a second coplanar waveguide in a second chip. The method further includes directly connecting the first coplanar waveguide to the second coplanar waveguide using a plurality of chip-to-chip connections. | 2014-04-10 |
20140097525 | CIRCUIT BOARDS, METHODS OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE CIRCUIT BOARDS - Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer. The through via may be formed through soldering. Since the base layer is not damaged during the soldering, the through via may include various conductive materials. The through via makes it possible to easily connect the conductive circuits having different functions to one another. Accordingly, the circuit board may have multi functions. Thicknesses of the conductive circuits may be adjusted to protect the conductive circuits from folding or bending of the base layer. The circuit board having a multi-layered structure can function not only as a fabric or clothes but also as an electronic circuit. | 2014-04-10 |
20140097526 | PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD - A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe. | 2014-04-10 |
20140097527 | METHOD OF MANUFACTURE INTEGRATED CIRCUIT PACKAGE - An integrated circuit package may be formed using a leadframe having an open space extending therethrough. A shunt is located within the open space such that it is not in contact with any portion of the leadframe. Tape may be applied to the lower surface of the leadframe to support the shunt and hold it in place relative to the leadframe until wirebonding and encapsulation have been completed. Thereafter, the tape may be removed. | 2014-04-10 |
20140097528 | CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT - A chip package is provided. The chip package includes a chip carrier, a voltage supply lead, a sensing terminal and a chip disposed over the chip carrier. The chip includes a first terminal and a second terminal, wherein the first terminal electrically contacts the chip carrier. The chip package also includes an electrically conductive element formed over the second terminal, the electrically conductive element electrically coupling the second terminal to the voltage supply lead and the sensing terminal. | 2014-04-10 |
20140097529 | SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME - Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as first partial etch forming a trench. A non-conductive material that is adhesive to the lead frame is applied in the trench, such that the non-conductive material extends across the trench to form the solder flow-impeding plug. One or more components are attached to the internal surface of the lead frame and encapsulated. An external surface of the lead frame is etched at the dividing lines to disconnect different sections of lead frame as a second partial etch. | 2014-04-10 |
20140097530 | INTEGRATED CIRCUIT PACKAGE - An integrated circuit package and a manufacturing method thereof are provided. The integrated circuit package can include a substrate provided with a circuit pattern, a first set of bonding fingers and a second set of bonding fingers, a first chip stack mounted on the substrate and having a plurality of first semiconductor chips stacked in a first direction in a stepped manner, each of the first semiconductor chips being provided with a first bonding pad at an end thereof on one side, a second chip stack mounted on the first chip stack and having a plurality of second semiconductor chips stacked in a second direction opposite to the first direction in a stepped manner. | 2014-04-10 |
20140097531 | Power Quad Flat No-Lead (PQFN) Package in a Single Shunt Inverter Circuit - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a driver integrated circuit (IC) situated on a leadframe. The PQFN package further includes low-side U-phase, low-side V-phase, and low-side W-phase power switches situated on the leadframe. A logic ground of the leadframe is coupled to a support logic circuit of the driver IC. A power stage ground of the leadframe is coupled to sources of the low-side U-phase, low-side V-phase, and low-side W-phase power switches. The power stage ground can further be coupled to gate drivers of the driver IC. | 2014-04-10 |
20140097532 | Thermally Enhanced Package-on-Package (PoP) - A method and structure for providing improved thermal management in multichip and package on package (PoP) applications. A first substrate attached to a second smaller substrate wherein the second substrate is encircled by a heat ring attached to the first substrate, the heat ring comprising heat conducting materials and efficient heat dissipating geometries. The first substrate comprises a heat generating chip and the second substrate comprises a heat sensitive chip. A method is presented providing the assembled structure with increased heat dissipation away from the heat sensitive chip. | 2014-04-10 |
20140097533 | Pop Package Structure - A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages. | 2014-04-10 |
20140097534 | DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FABRICATING THE SAME - Provided are a dual-phase intermetallic interconnection structure and a fabricating method thereof. The dual-phase intermetallic interconnection structure includes a first intermetallic compound, a second intermetallic compound, a first solder layer, and a second solder layer. The second intermetallic compound covers and surrounds the first intermetallic compound. The first intermetallic compound and the second intermetallic compound contain different high-melting point metal. The first solder layer and the second solder layer are disposed at the opposite sides of the second intermetallic compound, respectively. The first intermetallic compound is adapted to fill the micropore defects generated during the formation of the second intermetallic compound. | 2014-04-10 |
20140097535 | STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE - A multi-chip integrated circuit (IC) package is provided which is configured to protect against failure due to warpage. The IC package may comprise a substrate, a level-one IC die and a plurality of level-two IC dies. The level-one IC die having a surface that is electrically coupled to the substrate. The plurality of level-two IC dies is stacked above the level-one IC die. The plurality of level-two IC dies may each have an active surface that is electrically coupled to the substrate. The plurality of level-two IC dies may be arranged side by side such that the active surfaces of the plurality of level-two IC dies are positioned substantially in a same plane. Relative to a single die configuration, the level-two IC dies are separated thereby inhibiting cracking, peeling and/or other potential failures due to warpage of the IC package. | 2014-04-10 |
20140097536 | TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD - A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die. | 2014-04-10 |
20140097537 | THIN FILM COMPOSITIONS AND METHODS - Certain embodiments of the present invention include a versatile and scalable process, “patterned regrowth,” that allows for the spatially controlled synthesis of lateral junctions between electrically conductive graphene and insulating h-BN, as well as between intrinsic and substitutionally doped graphene. The resulting films form mechanically continuous sheets across these heterojunctions. These embodiments represent an element of developing atomically thin integrated circuitry and enable the fabrication of electrically isolated active and passive elements embedded in continuous, one atom thick sheets, which may be manipulated and stacked to form complex devices at the ultimate thickness limit. | 2014-04-10 |
20140097538 | SEMICONDUCTOR DEVICE HAVING A SELF-FORMING BARRIER LAYER AT VIA BOTTOM - An approach for forming a semiconductor device is provided. In general, the device is formed by providing a metal layer, a cap layer over the metal layer, and an ultra low k layer over the cap layer. A via is then formed through the ultra low k layer and the cap layer. Once the via is formed, a barrier layer (e.g., cobalt (Co), tantalum (Ta), cobalt-tungsten-phosphide (CoWP), or other metal capable of acting as a copper (CU) diffusion barrier) is selectively applied to a bottom surface of the via. A liner layer (e.g., manganese (MN) or aluminum (AL)) is then applied to a set of sidewalls of the via. The via may then be filled with a subsequent metal layer (with or without a seed layer), and the device may the then be further processed (e.g., annealed). | 2014-04-10 |
20140097539 | TECHNIQUE FOR UNIFORM CMP - Pitch-dependent dishing and erosion following CMP treatment of copper features is quantitatively assessed by atomic force microscopy (AFM) and transmission electron microscopy (TEM). A new sequence of processing steps presented herein is used to prevent dishing and to reduce significantly the local pitch- and pattern density-induced CMP non-uniformity for copper metal lines having widths and spacing in the range of about 32-128 nm. The new process includes a partial copper deposition step followed by deposition of a silicon carbide/nitride (SiC | 2014-04-10 |
20140097540 | SEMICONDUCTOR STRUCTURE - A semiconductor structure includes a silicon substrate, a titanium layer, a nickel layer, a silver layer and a metallic adhesion layer, wherein the silicon substrate comprises a back surface, and the titanium layer comprises an upper surface. The titanium layer is formed on the back surface, the nickel layer is formed on the upper surface, the silver layer is formed on the nickel layer, and the metallic adhesion layer is formed between the nickel layer and the silver layer. | 2014-04-10 |
20140097541 | Multilayer line trimming - Substantially simultaneous plasma etching of polysilicon and oxide layers in multilayer lines in semiconductors allows for enhanced critical dimensions and aspect ratios of the multilayer lines. Increasing multilayer line aspect ratios may be possible, allowing for increased efficiency, greater storage capacity, and smaller critical dimensions in semiconductor technologies. | 2014-04-10 |
20140097542 | FLIP PACKAGING DEVICE - Disclosed is a flip chip packaging device and structure of interconnections between a chip and a substrate. In one embodiment, a flip chip packaging device can include: (i) a chip and a substrate; (ii) a plurality of first connecting structures and a plurality of second connecting structures that are aligned and configured to electrically connect the chip and the substrate; and (iii) where each of the plurality of first connecting structures comprises a first metal, and each of the plurality of second connecting structures comprises a second metal, and where a hardness of the first metal is less than a hardness of the second metal. | 2014-04-10 |
20140097543 | BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH METAL RAISED ABOVE DIELECTRIC AND STRUCTURES SO FORMED - Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One structure includes: a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including: a metal having a concave upper surface; and a dielectric having a substantially uniform upper surface, wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including: a dielectric; and a metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate. | 2014-04-10 |
20140097544 | Side Stack Interconnection for Integrated Circuits and The Like - In an illustrative embodiment, a plurality of integrated circuits are stacked one on top of the other in a block. A plurality of leads on each integrated circuit is made accessible on a first side of the block. An insulating layer is formed on the first side of the block; electrically conducting vias are formed in the insulating layer and coupled to the leads; a conducting layer is formed on the insulating layer and coupled to the conducting vias; and conducting paths are formed in the conducting layer. Additional layers of insulating layer, conducting vias and conducting layer may be formed on top of the first insulating layer and first conducting layer so as to form more complicated interconnection paths to the leads from the integrated circuits. | 2014-04-10 |
20140097545 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE - Disclosed herein is a method for manufacturing a package structure. According to an exemplary embodiment of the present invention, the method for manufacturing a package structure includes: preparing a die having a metal pillar disposed on one surface thereof; bonding the die on the metal plate to allow the metal pillar to face the outside; forming an insulating film covering the metal plate and the die; buffing the insulating film so as to expose the metal pillar; and manufacturing a first package structure by forming a circuit structure electrically connected to the metal pillar on the insulating film. | 2014-04-10 |
20140097546 | MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS - A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element. | 2014-04-10 |
20140097547 | SEMICONDUCTOR DEVICE - This invention is to improve noise immunity to the power supply and ground of a wiring board and a second semiconductor chip in an interior of a semiconductor device. A first semiconductor chip is mounted over a wiring board, and a second semiconductor chip is mounted in a central part located over the first semiconductor chip. Bottom surface electrodes of power and ground systems in the second semiconductor chip are led to their corresponding external coupling electrodes formed in the central part of the wiring board though chip through vias formed in the central part of the first semiconductor chip. The power and ground system bottom surface electrodes, the through vias and the external coupling electrodes are respectively arranged discretely from each other between the power and ground systems. | 2014-04-10 |
20140097548 | SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM - A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content. | 2014-04-10 |
20140097549 | Carbonation Device - A domestic carbonation appliance has a replaceable CO | 2014-04-10 |
20140097550 | 3D BLAZE HUMIDIFIER - A 3D blaze humidifier includes a box body. The box body is divided into an upper portion and a lower portion. The upper and lower portions are one-piece. The lower portion includes a fog generator, a closed chamber to collect fog and a separate water bottle. The upper portion includes an imitational charcoal bed, an elongated fog outlet, and an illumination unit under the elongated fog outlet. The separate water bottle can be taken out for replacement and cleaning and is a normal water bottle. The illumination unit generates fluttering blaze so that the blaze effect is almost real. The humidifier combines with the imitational blaze. The humidifier improves the function and single structure of the normal humidifier, and is novel, convenient for use and environment-friendly. | 2014-04-10 |
20140097551 | Process for Producing Non-Detonable Training Aid Materials for Detecting Explosives - A method for manufacturing training aid materials for detecting homemade explosives includes spreading an explosive powder on a porous surface, storing the surface in a container that facilitates sublimation of the explosive powder such that the explosive powder redeposits onto the surface and into the pores over a period of time, and removing the surface from the container after the period of time to yield training aid materials. An additional method includes preparing a dilute solution of an explosive reaction mixture, and depositing the dilute solution on a surface prior to formation of an explosive product by the explosive reaction mixture. The surface is stored in a contain that facilitates formation of the explosive product, and removed after a period of time and cleaned to remove unreacted precursors to yield training aid materials. | 2014-04-10 |
20140097552 | MOLD SCRAP SEPARATING APPARATUS AND METHOD OF USING THE APPARATUS - An apparatus for separating mold scrap from a mold and having a first plate with a first engaging edge and a second plate with a second engaging edge. The plates are in overlying relationship. A grip actuating assembly moves at least one of the first and second plates relative to the other of the first and second plates in a first path to change the apparatus between: a) starting state wherein a projecting piece of mold scrap can be directed to between the first and second engaging edges; and b) a gripping state wherein the projecting piece of mold scrap is gripped. The first and second plates can be repositioned in a second path to separate the gripped projecting piece of mold scrap from an associated mold. | 2014-04-10 |
20140097553 | COMPOSITE ARTICLE WITH COOLANT CHANNELS AND TOOL FABRICATION METHOD - Embodiments of the present invention include composite articles comprising at least a first region and a second region and methods of making such articles. The first region may comprise a first composite material, wherein the first region comprises less than 5 wt. % cubic carbides by weight, and the second region may comprise a second composite material, wherein the second composite material differs from the first composite material in at least one characteristic. The composite article may additionally comprise at least one coolant channel. In certain embodiments, the first and second composite material may individually comprise hard particles in a binder, wherein the hard particles independently comprise at least one of a carbide, a nitride, a boride, a silicide, an oxide, and solid solutions thereof and the binder comprises at least one metal selected from cobalt, nickel, iron and alloys thereof. In specific embodiments, the first composite material and the second composite material may individually comprise metal carbides in a binder, such as a cemented carbide. | 2014-04-10 |
20140097554 | MATERIALS, METHODS AND DEVICES FOR JOINING LINES - A hand-held device for joining fishing line segments of monofilament, fluorocarbon, and/or braid lines of similar or differing sizes or combinations or securing hooks or other components to at least one line. The device includes an encasement for orienting the fishing line segments in a closed chamber in close, non-contacting orientation. A material is injected into the closed chamber to encase the lines. This material can be adhesive material or a flowable polymer material having a melting temperature lower than the line segments to be bonded. A pre-formed, flexible polymer sheath is used to retain the line segments in the chamber. A heater heats the polymer sheath within the encasement to allow the polymer to flow and encase the line segments without melting the line segments. Bonding of the line segments can be achieved without melting, abrading, compressing, or impairing the integrity the line segment(s) to be encased. | 2014-04-10 |
20140097555 | MOLDING DEVICE AND METHOD OF MANUFACTURING MOLDED PRODUCT - A molding device for manufacturing a molded product having an inner space bent in a circular arc shape includes: a set of molds joinable to and separable from each other, the set of molds being capable of forming a cavity having a shape corresponding to an outer shape of the molded product in a joined state at the time of molding; a core having an outer shape corresponding to an inner shape of the molded product for use in a state where the core is arranged in the inside of the cavity formed by the set of molds at the time of molding; and an ejector plate having a core through hole through which the core passes for ejecting the molded product formed around the core along the circular arc shape in a separated state where the set of molds is separated from each other. | 2014-04-10 |
20140097556 | METHOD FOR FABRICATION OF STRUCTURES USED IN CONSTRUCTION OF TOWER BASE SUPPORTS - Disclosed are apparatus and corresponding methodologies for providing a base support, such as including concrete, and used such as for a wind-driven generator. Precast concrete cylinders are stacked in place upon a platform that may be partially precast and partially cast in place during assembly and supported, in certain embodiments, by plural concrete legs, the other ends of which are supported on a unitary or subdivided concrete foundation. In other embodiments, the platform may be supported by ribbed concrete panels. The concrete cylinders are glued together using an epoxy and then secured by an internal vertical post tension system extending from the platform to the upper most cylinder. Methodologies and apparatus for fabrication of concrete structure used in constructing the base support are also disclosed, with a focus on staves and various ring piece constructions. | 2014-04-10 |
20140097557 | CEMENT COMPOSITION CONTAINING DUNE SAND AND LIMESTONE POWDER, CONCRETE PRODUCTS AND METHOD FOR MAKING CONCRETE PRODUCTS - A raw batch composition for concrete or concrete wherein the raw batch composition comprises Portland cement of about 15 wgt. % to about 45 wgt. % and dune sand preferably red dune sand is present in an amount of about 40 wgt. %. The dune sand has a particle size of less than or equal to 45 microns. The composition also includes limestone powder ranging from about 15 wgt. % to 45 wgt. % with particle sizes less than or equal to 45 microns to form a base material. To this base material suitable amounts of fine aggregate, coarse aggregate, water and superplasticizer are added. A method for producing a cast concrete product having a compressive strength of between 62 MPa and 90 MPa is disclosed. The method comprises a step of providing Portland cement, dune sand and limestone powder. | 2014-04-10 |
20140097558 | NANOFIBER FILTERING MATERIAL FOR DISPOSABLE/REUSABLE RESPIRATORS - Embodiments relate generally to methods of manufacture of a filtration media, such as a personal protection equipment mask or respirator, which may incorporate an electrospinning process to form nanofibers. Some embodiments may comprise electrospinning material onto a convex mold, which may, for example, be in the shape of a human face. Other embodiments may comprise electrospinning material onto an inner and/or outer shell of a personal protective equipment mask, such as a flat fold mask. In an embodiment, the electrospun nanofibers may be functionalized, and therefore may, for example, be operable to capture one or more gases. | 2014-04-10 |
20140097559 | METHODS FOR MAKING OXIDATION-RESISTANT CROSS-LINKED POLYMERIC MATERIALS - The present invention relates to methods for making cross-linked oxidation-resistant polymeric materials and preventing or minimizing in vivo elution of antioxidant from the antioxidant-containing polymeric materials. The invention also provides methods of doping polymeric materials with a spatial control of cross-linking and antioxidant distribution, for example, vitamin E (α-Tocopherol), and methods for extraction/elution of antioxidants, for example, vitamin E (α-tocopherol), from surface regions of antioxidant-containing polymeric materials, and materials used therewith also are provided. | 2014-04-10 |
20140097560 | METHOD FOR FABRICATING SMALL-SCALE, CURVED, POLYMERIC STRUCTURES - A method is proposed for fabricating small-scale, curved, polymeric structures. Firstly, desired patterns are created from droplets of photocurable PDMS after using ink or wax to create the desired patterns on a flexible material such as papers or plastic films. The photocurable PDMS droplets are then activated by UV light to form a small-scale polymeric mold. Next, polymeric curved structures can be obtained at millimeter scale by casting and curing thermocurable PDMS on the mold. | 2014-04-10 |
20140097561 | BLOW MOULDING MACHINE WITH DAMPING FOR THE CONTROL THEREOF - An apparatus for shaping plastics material preforms into plastics material containers includes a plurality of shaping stations each having two blow mould parts which are movable with respect to each other and which can be moved between a closed and an opened state. In the closed state the shaping station form a cavity, inside which the plastics material pre-forms are shaped. The shaping stations have a stressing device which acts upon the preforms with a gaseous medium to expand them, and stretch bars which are capable of being inserted into the preforms to stretch them in the longitudinal direction. The shaping stations each have at least one drive device which drives a movement necessary for the shaping procedure, as well as a control device for controlling this drive device. The control device is arranged on the apparatus through a damping device. | 2014-04-10 |
20140097562 | TUNABLE PASSIVE VIBRATION SUPPRESSOR - An apparatus and method for vibration suppression using a granular particle chain. The granular particle chain is statically compressed and the end particles of the chain are attached to a payload and vibration source. The properties of the granular particles along with the amount of static compression are chosen to provide desired filtering of vibrations. | 2014-04-10 |
20140097563 | MECHANICAL TENSIONER STRUT WITH UNI-DIRECTIONAL FRICTION DAMPING - A strut including a housing, a plunger within a space in the housing and including a tapered outer circumferential surface, a primary spring engaged with the housing, a wedge element within the space and including a tapered inner circumferential surface engageable with the outer circumferential surface, and a secondary spring engaged with the wedge element and the plunger to urge the plunger in an axial direction. The primary spring urges the plunger in the axial direction with a first force. In a fully extended mode, the plunger is maximally displaced in the axial direction. In a contracted mode, the plunger is displaced in an opposite axial direction in response to application of a second force, sufficiently greater than the first force, on the plunger in the opposite axial direction. When the second force is sufficiently decreased, the plunger displaces with respect to the housing in the axial direction. | 2014-04-10 |
20140097564 | LIQUID SEALED VIBRATION ISOLATING DEVICE - A partition member for partitioning a primary liquid chamber and a secondary liquid chamber is provided with a damping orifice and an elastic partition member. A leg portion integrally projects from a lower surface of the movable diaphragm so as to be pressed vertically against a stopper surface formed on an upper surface of the bottom portion of a frame member. A third liquid chamber is defined between an outer circumferential portion of the leg portion and the support wall. When a bottom surface of the leg portion is pressed against the stopper surface, the third liquid chamber is sealed to confine a hydraulic fluid thereby increasing the internal pressure. When the leg portion is brought out of contact with the stopper surface, the third liquid chamber is opened to the secondary liquid chamber, thereby allowing the hydraulic fluid to flow out of the third liquid chamber. | 2014-04-10 |
20140097565 | GUIDING SYSTEM - A guiding system for portable machine tools has at least one guiding apparatus which is fixable on a portable machine tool. The guiding system also has at least one positive guidance unit to which the at least one guiding apparatus is connectable in a positive-locking manner to positively guide the portable machine tool. The guiding system also has at least one position fixing unit configured to fix a position of the at least one guiding apparatus on the at least one positive guidance unit. The at least one position fixing unit has at least one fastening unit configured to releasably fix the at least one position fixing unit on the at least one guiding apparatus. | 2014-04-10 |
20140097566 | CUTTING BOARD ASSEMBLY - The present invention provides cutting board assemblies for food preparation. The devices of the invention can be used for cutting food, storing food, and transport cut food items. The devices of the invention include removable food containment trays with lids. The devices of the invention can also include at least one storage drawer for knives or food. Also provided are cutting board holders and space saver for being mounted under a kitchen cabinet, on walls, or on pantry doors. | 2014-04-10 |
20140097567 | GLASS BASE MATERIAL HANGING MECHANISM - Provided is a glass base material hanging mechanism that, when hanging a starting member or a glass base material, can tightly (solidly) connect the hanging shaft tube and the hanging component and can vertically align the hanging component and the center of the glass base material. | 2014-04-10 |
20140097568 | LIFTING APPARATUS - This invention provides a lifting apparatus which holds a work by clamping the work vertically, and lifts the work. The lifting apparatus includes upper and lower clamping units, a guide mechanism which guides lifting movements of the upper and lower clamping units, a driving mechanism which drives the lower clamping unit to lift along the guide mechanism, and a stopper which is set so that the upper clamping unit is stopped before the lower clamping unit reaches a downward movement lower limit during the downward movement of the units, and which defines a downward movement lower limit of the upper clamping unit. | 2014-04-10 |
20140097569 | LEAD EDGE MECHANICAL BINDING DEVICE AND METHOD - A cutting cylinder pair for cutting a substrate in a folder of a printing press is provided which includes a cutting cylinder, the cutting cylinder including a knife and a binding pin adjacent the knife in a circumferential direction of the cutting cylinder; and an anvil cylinder, the anvil cylinder including a cutting rubber, the cutting rubber engaging the knife and the binding pin as the cutting cylinder and anvil cylinder rotate, the binding pin positioned on the cutting cylinder to impart a dimple to a substrate passing between the cutting cylinder and anvil cylinder. | 2014-04-10 |
20140097570 | Floating Game System - The present invention relates to a game system that can be used in or out of the water, it can be constructed in two ways | 2014-04-10 |
20140097571 | GAMING TABLES HAVING A TABLE TOP EXCHANGEABLE INSERT - A gaming table comprises a table top having a top and a bottom surface adapted to receive an exchangeable insert. For instance, the top surface is configured to receive gaming accessories and defines an exchangeable insert bed. A base is connected to and configured to support the table top. A table top exchangeable insert is configured to be located within the exchangeable insert bed, wherein the insert includes a securing structure, for releasably securing the table top exchangeable insert to the table top to provide the ability to conveniently change the insert as desired. | 2014-04-10 |
20140097572 | Radial Shaft Seal Assembly With Snap In Auxillary Member - A shaft seal assembly includes a metal case having a wall extending cylindrically about a central axis with an annular leg extending radially inwardly from the wall toward the central axis. An elastomeric material is bonded to the leg and a primary seal lip is operably attached to the elastomeric material. The primary seal lip separates an oil side of the assembly from an air side of the seal assembly. The elastomer material has an annular groove formed on the air side of the primary seal lip. The assembly further includes an auxiliary lip subassembly including an annular metal washer with at least one auxiliary lip fixed thereto as a one-piece subassembly. The annular metal washer has an annular outer periphery snappingly received within the annular groove. | 2014-04-10 |
20140097573 | SEALING ARRANGEMENT FOR A ROTATING SHAFT - The invention relates to a sealing system, in particular for sealing pump shafts of vertically arranged pumps for conveying for example liquefied natural gas (LNG) or other cryogenic fluids below −80° C. The sealing system has a mechanical seal arrangement which is flowed through by a barrier fluid at a barrier fluid pressure. The mechanical seal arrangement prevents an exiting of a sealing fluid from a sealing chamber, wherein the barrier fluid pressure is higher than a sealing fluid in the sealing chamber. | 2014-04-10 |
20140097574 | SEAL RING - The objective of the present invention is to provide a seal ring having excellent dimensional stability and fitting properties with an opposing member, is able to effectively prevent leakage of oil even at very low hydraulic pressure, and also having excellent sliding properties. The seal ring is produced from a resin composition comprising (A) a poly(phthalamide) and (B) at least one component selected from among elastomers, crosslinked rubbers and dynamically crosslinked resins. There may further be added to the resin composition (C) at least one filler selected from among carbon fibers, glass fibers, alumina fibers, potassium titanate fibers, boron fibers, silicon carbide fibers, carbon nanotubes, montmorillonite, bentonite, talc, isinglass, mica, molybdenum disulfide, glass beads, graphite, fullerene, anthracite powder, aluminum oxide, titanium oxide, magnesium oxide, potassium titanate, boron nitride and PTFE powder. | 2014-04-10 |
20140097575 | CYLINDER HEAD GASKET - A cylinder head gasket includes a metallic gasket layer having through-openings and, at its peripheral outer margin, a first sealing element for providing a seal. The first sealing element forms a sealing line extending circumferentially about the gasket layer and surrounding the through-openings. The side of the first sealing element facing away from the peripheral outer margin of the gasket layer includes a vent hole arranged adjacent to a sealing line break and located in a first gasket layer region which is, on only a first side of the gasket layer, on both sides of the sealing line break, continuously bounded by the first sealing element and a second sealing element. The first sealing element and the second sealing element extend around the first gasket layer region such that a fluid flow path extending from the sealing line break to the vent hole has at least one change in direction. | 2014-04-10 |
20140097576 | METAL GASKET - There is provided a metal gasket that is at low cost yet with high sealing performance. A metal gasket | 2014-04-10 |
20140097577 | SEAL DEVICE FOR CONDUIT IN A FUEL DISPENSING UNIT - Embodiments of seal device prevent migration of vapor into compartments that house electronics in a fuel dispensing unit. These embodiments deploy about conduits in a vapor barrier to seal gaps between the conduit and opening in plates of the vapor barrier and/or other components that separate the electronics from fuel-handing components. In one or more embodiments, the sealing device forms a radial seal about the conduit and a planar seal with the vapor barrier, where the sealing device is configured to maintain the planar seal and to allow relative movement of the conduit with respect to the vapor barrier in the opening. This relative movement can occur as a result of connection of the conduit to the fuel-handling components, e.g., a motor that can change position due to operation and/or natural settling of the support structure that supports the motor in the dispensing unit. | 2014-04-10 |
20140097578 | SEALING SYSTEM FOR SLIDE OUT ROOMS - A seal useful in sealing slide out rooms used in recreational vehicles. The seal may be used singularly or in pairs to straddle a wall through which the opening is located. A bulb is attached to the base in a cantilevered manner over the base. The bulb has an outer arcuate portion that is integrally joined to opposing sidewall portions. The sidewall portions extend into an inner wall that defines an enclosed space within the bulb portion. The bulb portion may also have a protrusion that can touch the base. A wiper extends from the base substantially co-linearly to the base and opposite the offsetting member. A locating leg extending from the base is movable between a first position and a second position. The first position has the locating leg perpendicular to the base and the second position places the locating leg parallel to the base. | 2014-04-10 |
20140097579 | TWO SHOT DOUBLE INVERTED ACOUSTIC HOOD TO COWL SEAL - A seal adapted to extend along an interface between a vehicle hood and cowl. A profile has a base layer seating upon a flattened lip edge of the cowl, the base layer being supported upon the cowl lip edge from a rear edge to an intermediate underside stepped protrusion. The base layer further exhibits having a forward bottom projecting portion. A first upwardly/rearwardly and substantially linear angled blade extends from a first location of the base layer, with a second upwardly/forwardly and arcuately shaped blade extending from a second forward spaced location of the base layer, such that said blades project relative to underside opposing locations of the hood in contacting fashion and in order to both prevent admittance of engine exhaust into an adjoining passenger compartment and to provide optimum resistance to sound transfer. | 2014-04-10 |
20140097580 | APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES - Apparatus for processing wafer-shaped articles comprises a chuck adapted to hold a wafer-shaped article of a predetermined diameter during a processing operation to be performed on the wafer-shaped article. The chuck comprises a chuck body having an outer surface that faces a wafer-shaped article when positioned on the chuck. The outer surface comprises a first electrically conductive material and the chuck body further comprises a first conductive pathway between the first conductive material and ground. | 2014-04-10 |
20140097581 | ROTARY CHUCK FOR A MACHINE TOOL - A rotary chuck includes a housing for rotation about an axis, keyways in the housing which extend radially away from the axis, jaw assemblies slidably received in the keyways and an actuatuing mechanism as well as a speed ring for moving the jaw assemblies along the keyways in accordance with different gear ratios. Each jaw assembly includes an inner jaw keyed to the associated keyway adjacent to the bottom thereof and an outer jaw keyed to the associated keyway near a mouth thereof so that the jaws can slide independently along their respective keyways. Each jaw assembly also has a locking device for locking its jaws together when they are opposite one another to prevent their relative radial movement and means enabling release of the locking device from the outside to permit ready removal of the outer jaw from its keyway. | 2014-04-10 |
20140097582 | TOOL ADAPTER - A tool adapter includes a first sleeve received in a movable sleeve. The movable sleeve is movable in an axial direction to control movement of a first ball in a first through-hole in the first sleeve for controlling engagement with or detachment from a screwdriver shank of an automatic tool. A coupling rod is coaxial to the first sleeve and includes a rear section engaged with the first sleeve. A second sleeve includes a front end for coupling with a tool, such as a socket. The second sleeve includes an engagement groove receiving the coupling rod. The second sleeve is movable in the axial direction to control movement of a second ball in a second through-hole in the second sleeve for controlling engagement with or detachment from the tool. | 2014-04-10 |
20140097583 | Goalie Skate - The inventive skate consists of an upper that is designed to accept the foot of the user. Other portions of the upper are preferably constructed using a semi-rigid material, such as fiberglass, nylon, plastic, etc. These semi-rigid portions of the upper decrease the flexibility of the upper in certain sections, thus increasing performance. The inventive skate also includes a blade chassis. The chassis includes a lower portion that is adapted to hold the skate's blade and an upper portion that is adapted to cover a portion of the upper. The inventive skate is configured so that the center of gravity of the skater is disposed generally centrally along the length of the skate chassis. This skate configuration is generally referred to as neutral pitch. | 2014-04-10 |
20140097584 | ADJUSTABLE LIFT ASSEMBLY FOR HAND TRUCKS - A system is provided for temporarily converting a conventional hand truck to provide an adjustable platform. The system may comprise a shelving unit and a control unit, where the control unit is configured to raise and lower the shelving unit on the frame of the transporting device. The shelving unit may comprise a platform for supporting removable items thereon, and a back plate configured to engage a portion of the transporting device frame, where the back plate comprises a plurality of rollers that minimize lateral movement of the shelving unit when it is being raised or lowered during operation. The control unit may comprise a drive unit and a cable system configured to permit the drive unit to direct movement of the shelving unit, the cable system comprising at least one cable, at least one pulley, and a winch upon which a portion of the cable may be radially wound. | 2014-04-10 |
20140097585 | DK3D Dolly - A load bearing dolly securely attached, via lashing straps, to opposite ends of any moveable object such as: household furniture items, appliances, or various manufacturing/industrial equipment. Each rectangular dolly frame being carpeted on all contact surfaces creating friction and containing two 360 degree swivel casters of various sizes and optional locking brakes. Designed to accommodate even items of irregular shape and fixedly secured to dollies to maneuver over various terrains. Specifically, having a platform that will be parallel to the ground or continue to rise until it makes contact with moveable object at any varying degree of angle, then securing through points of contact on the platform frame, as well as, secured from above via the strapping. | 2014-04-10 |
20140097586 | ROLLABLE PAINT BUCKET - A rollable paint bucket which will be maneuvered on a floor by the painter manipulating an extended handle of a paint roller assembly is disclosed. The bucket will have a body, a plurality of rolling members and a structural configuration which permits placement of the paint roller on the bucket where it will remain in contact during maneuvering of the bucket on the floor by the painter. The body has a paint containment area and a rolling surface. The painter may easily replenish fresh paint on the paint roller and roll the paint roller to obtain a desired quantity and uniformity of coverage on the paint roller. The bucket permits the painter to paint a large area, along a great distance, while remaining standing straight. This eliminates the conventional need for the painter to manually move their supply of fresh paint which often involves bending or squatting. | 2014-04-10 |
20140097587 | UNIVERSAL PAINT TRAY CART - The disclosed universal paint tray cart has a top surface for setting various sizes of paint trays on, wheels for moving the universal paint tray cart and one or more paint tray coupling devices. Each paint tray coupling device is coupled to a slot opening in the universal paint tray cart body. Each paint tray coupling device has a first end that is coupled to the slot opening of the universal paint tray cart, and a second end which couples to a paint tray. The paint tray coupling devices hold the paint tray to the universal paint tray cart so that the cart and the paint tray can be moved about without the paint tray falling off of the universal paint tray cart. The paint tray coupling devices slide along the length of the slot openings to adjust to the size of the paint tray being held. | 2014-04-10 |
20140097588 | WIND-UP CONTROL LINK - A vehicle suspension may include a leaf spring, a link member and a bumper. The leaf spring may include first and second ends and a body extending between the first and second ends. The first end may be pivotably coupled to a first mounting structure and may be configured to pivot relative to a vehicle chassis. The second end may be pivotably coupled to a second mounting structure and may be configured to pivot relative to the vehicle chassis. The body may engage a third mounting structure configured to secure the body relative to a vehicle axle. The link member may include a first end pivotably coupled to the first mounting structure and a second end pivotably coupled to the third mounting structure. The bumper may extend downward from the link member toward the leaf spring. | 2014-04-10 |
20140097589 | METHODS OF VEHICLE SUSPENSION - A method is provided, including providing a hub for mounting a wheel to a frame; providing a first mounting pivotally connected at one end to a first position on the frame; providing a second mounting pivotally connected at one end to a second position on the frame; providing a first arm which is coupled at a first position to the top of the hub and pivotally connected at a second position to the other end of the first mounting; providing a second arm which is coupled at a first position to the bottom of the hub and pivotally connected at a second position to the other end of the second mounting; and providing a shock absorber coupled at one end to a third position on the second arm between the first and second positions on the second arm and at the other end to a third position on the frame. | 2014-04-10 |
20140097590 | REINFORCEMENT OF SHOCK ABSORBER MOUNT - A reinforcement is installed in a mounting portion of a shock absorber of a vehicle to improve strength of a vehicle body. The reinforcement realizes a new type of a reinforcement which covers a mounting portion affected most by an excitation force from a shock absorber and is simultaneously coupled to a mounting cover, which is a peripheral member, and a front side upper member, such that road noise can be improved by improvement of Z-direction input point strength. (vehicle body strength) of a shock absorber housing portion. | 2014-04-10 |
20140097591 | Working Vehicle - The cover member has an outer edge portion configured by the upper end extending portion, the front end extending portion, and the rear end extending portion in which a front end of the upper end extending portion and an upper end of the front end extending portion are connect to each other, and a rear end of the upper end extending portion and an upper end of the rear end extending portion are connected to each other. | 2014-04-10 |
20140097592 | KNEE-WALKER - Knee-walkers allow amputees and individuals with injuries to maintain independent movement. Their stability and steering is very important. The invention comprises a knee-walker ( | 2014-04-10 |
20140097593 | MOVEMENT DAMPING APPARATUS AND VALVE - In a movement damping apparatus, a magnetorheological fluid is pressed through a flow path. A device generating a variable magnetic field comprises a core around which a coil is wound as well as pole surfaces in the flow path, the magnetic field acting on the magnetorheological fluid by means of said pole surfaces. The coil is arranged within the flow path along with the core, the axis of the coil extending perpendicular to the direction of flow of the magnetorheological fluid. The flow path has a jacket made of a magnetically conducting material. | 2014-04-10 |
20140097594 | FOLDABLE TRICYCLE WITH SEAT ACTUATION - A foldable tricycle includes a first frame, a second frame movably coupled to the first frame, and a seat for supporting a rider, wherein the seat operates as an actuator for moving the first and second frames relative to each other. Additionally, a method of handling a foldable tricycle movable between a first position and a second position includes applying a force to the seat of the tricycle, wherein the applied force on the seat causes the tricycle to move from the first position to the second position. | 2014-04-10 |
20140097595 | ARTICULATING HITCH APPARATUS FOR VEHICLES - A hitch apparatus includes a frame configured to be secured to a vehicle and that is pivotable about a first axis, a guide that is movably secured to the frame and pivotable about a second axis substantially transverse to the first axis, and a tow bar movably secured to the guide and movable relative to the guide between retracted and extended positions. The hitch apparatus includes a user controlled positioning system with a user input device that is configured to allow a user to extend and retract the tow bar and to articulate the tow bar up-down and left-right so as to position the tow bar distal end at a desired position within a three-dimensional coordinate system. | 2014-04-10 |
20140097596 | SNOWBOARD BINDING WITH IMPROVED DECK CONNECTION - A snowboard binding, comprising a base plate which has a cavity for accommodating a disk adapted to allow the connection between the base plate and the snowboard deck, the disk having an elongated shape with the central regions provided with recesses, the cavity of the base plate having complementary protrusions adapted to mate with the recesses of the disk. | 2014-04-10 |
20140097597 | TRANSPORT CHAIR ALLOWING TRANSPORT OF MULTIPLE PASSENGERS - A transport chair enables one person to provide mobility to two passengers simultaneously. The transport chair can include two seats, allowing a care giver to provide a fast, safe and less stressful solution for providing mobility to multiple passengers. The transport chair can collapse similar to a conventional wheelchair to provide for ease of storage. | 2014-04-10 |
20140097598 | COMPACTIBLE STROLLER - A collapsible stroller includes a mobile base and a juvenile seat coupled to the mobile base. The mobile base includes a foldable frame and wheels. | 2014-04-10 |
20140097599 | Collapsible Utility Cart - A cart includes a platform assembly, a handle assembly, first wheel assembly and a second wheel assembly. In use, the cart may folded from a deployed position in which it rolls along a surface to transport items, to a stowed position, in which it is collapsed in a compact geometry for storage. The cart may be further integrated into a chair, chaise lounge, garden cart, bicycle utility cart or a bicycle passenger cart. | 2014-04-10 |
20140097600 | AIRBAG DEVICE - An airbag device includes an airbag, an inflator, a retainer and an airbag cover. The airbag is usually folded, and expands and develops in an emergency. The inflator supplies gas to the airbag. The retainer secures the airbag and the inflator. The airbag cover houses the airbag. The airbag cover has a plate-like part and an inner case. The plate-like part constitutes the interior surface of a vehicle. The inner case is disposed on the rear surface of the plate-like part and constitutes an expansion and development path for the airbag. The inner case has a plurality of retaining holes for retaining the retainer. The retainer has a roughly planar-shaped support body capable of being stored within the inner case and an annular belt-like body inserted into the retaining holes and attached to the support body. | 2014-04-10 |