13th week of 2014 patent applcation highlights part 31 |
Patent application number | Title | Published |
20140085807 | SERVER SYSTEM - A server system includes a rack, a server disposed in the rack, an electronic device and a power supply disposed in the rack. The rack includes a first side and a second side opposite to each other, two first brackets, two second brackets and two lateral rails. Each first brackets, disposed at the first side, includes a heat-dissipation part. Each heat-dissipation part includes at least one ventilating perforation. The second brackets are disposed at the second side. The electronic device is disposed between the lateral rails and at the first side. The power supply is disposed between the two lateral rails and at the second side and includes a main body and at least one fan. The main body includes a plurality of through openings facing the ventilating perforations. The at least one fan draws airstreams from the ventilating perforations via the through openings. | 2014-03-27 |
20140085808 | SERVER SYSTEM AND SERVER THEREOF - A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover. | 2014-03-27 |
20140085809 | SERVER CABINET - A server cabinet, for containing a removable server including a power input port and a connecting element, includes a container, an electrically conductive component, a power supply, a signal connecting base and a rack management controller. The electrically conductive component is connected to the power input port. The power supply is connected to the electrically conductive component to supply power. The signal connecting base includes connectors connected to the connecting element. With the server removed, the power input port and the connecting element are separated from the electrically conductive component and the connector, respectively. The rack management controller is electrically connected to the signal connecting base. With the connecting element electrically connected to the connector, the rack management controller communicates with the server via the connecting element and the one connector and determines the position of the server according to the position of the connector connected to the server. | 2014-03-27 |
20140085810 | SERVER SYSTEM - A server system includes a rack, at least one server, a power supply, a network switch device and a power cable and. The rack has a front side and a rear side disposed oppositely. The rack defines an upper area, a middle area and a lower area. The middle area is disposed between the upper and the lower area. The servers are detachably disposed in the upper or the lower area. Each server having a power input port. The power supply is disposed in the middle area and adjacent to the front side. The network switch device is disposed in the middle area and stacked with the power supply. A gap is disposed between the network switch device and the power supply. The power cable penetrates through the gap to the front side. The power supply converts an external alternating current from the power cable to the server. | 2014-03-27 |
20140085811 | RACK SERVER SYSTEM - A rack server system includes a container, an electrically conductive component, a power supply, a signal connecting base, a server, and an RMC. The electrically conductive component and the signal connecting base are fixed in the container. The power supply is electrically connected to the electrically conductive component for supplying a direct current power. The signal connecting base includes multiple connectors. The server, disposed in the container removably, includes a power input port and a connecting element. The power input port is electrically connected to the electrically conductive component removably. The connecting element is connected to the connector removably. When the connecting element is electrically connected to the connector, the RMC communicates with the server via the connecting element and the one of the connectors and determines the position of the server in the container according to another position of the connector which is electrically connected to the server. | 2014-03-27 |
20140085812 | Arrangement of Computing Assets in a Data Center - A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure. | 2014-03-27 |
20140085813 | FILM OR COMPOSITE THAT INCLUDES A NANOMATERIAL - The present disclosure relates to a film or a composite that provides excellent heat removal capabilities and improved chemical stability and methods of forming the film and the composite. The film can be a layer of a nanomaterial. The composite can include a nanomaterial and a thermal interface material (TIM). The methods generally involve dispersing the nanomaterial in a carrier when forming the film or the composite. | 2014-03-27 |
20140085814 | Portable Computer Support - A support for a pad computer and the like includes a body support strap which may be placed around the neck or shoulders of a user, and a body propping unit that positions a computer outwardly from the torso of the user. The body support strap connects to the body propping member preferably at a location proximately aligned with the center of gravity of the combined mass of the computer and computer support when the body popping member is deployed in its stand-off position. In a preferred variant the body propping member is a U-shaped strut assembly with two arms joined by a bridge. The body support strap connects to the arms. The arms are hinged at the sides of the computer. The bridge may be swung from an in-use orientation spacing the computer outwardly from a user, to a parked position wherein the bridge lies adjacent to an opposite transverse edge of the computer in the plane of the computer. | 2014-03-27 |
20140085815 | Personal Cloud With A Plurality Of Modular Capabilities - A personal cloud structure for a portable computing device such as a tablet personal computer (PC), mobile phones, portable media players, or the like. The personal cloud structure may be fitted with memory, a network connection, two-way wireless charging, external memory slots, external connections and other components to create a portable personal cloud. | 2014-03-27 |
20140085816 | PROTECTIVE ENCLOSURE FOR ELECTRONIC DEVICE - A chemically resistant protective cover for an electronic device that has an interactive control panel includes a protective shell having a first member and a second member. The second member is configured to join with the first case. An aperture defined by the protective shell aligns with the interactive control panel. A chemically resistant protective membrane for an electronic device includes a sheet of engineered thermoplastic having dimensions corresponding to features of a surface of the electronic device, and has a combination of sufficient thinness and a dielectric constant that together permit capacitive inputs on a front side of the protective membrane to be transmitted to the capacitance sensing interactive control panel. | 2014-03-27 |
20140085817 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 2014-03-27 |
20140085818 | ELECTRONIC COMPONENT ENCLOSURE VISUAL SHIELD AND METHOD - An electronic device includes one or more electronic components and an electronic enclosure enclosing the electronic components. The electronic enclosure includes venting holes and flaps blocking visibility of the electronic components through the venting holes and from outside the electronic device. In addition, air readily flows through the venting holes providing adequate cooling of the electronic device. | 2014-03-27 |
20140085819 | ELECTRONIC DEVICE - An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet. | 2014-03-27 |
20140085820 | MOTOR DRIVER AND CABINET - Provided is a motor driver including: a housing; an electronic component that is disposed inside the housing, and that drives or controls a motor; and a fan motor that is disposed below a top plate of the housing, and that causes air to pass from an opening in a bottom plate of the housing to an opening in the top plate. In the motor driver, an outer surface of the top plate is an inclined surface. | 2014-03-27 |
20140085821 | METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES - A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array. | 2014-03-27 |
20140085822 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 2014-03-27 |
20140085823 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 2014-03-27 |
20140085824 | MICRO-DIE NATURAL CONVECTION COOLING SYSTEM - A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region abutting the integrated circuit die, but are flexible between the heat exchanger region and the die region. | 2014-03-27 |
20140085825 | ELECTRONIC DEVICE AND HEAT CONDUCTION ELEMENT THEREOF - A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion. Each of the extending portions has a first surface facing the direction same as that of the pressing side and an oppositely disposed second surface. Each of the second ends has a fixing portion. At least one slot is formed between each of the extending portions and the pressing portion. The slot penetrates the first surface and the second surface. The shortest straight distance between each of the fixing portions and the pressing portion is smaller than or equal to the length extended from the first end to the second end of the extending portion. | 2014-03-27 |
20140085826 | ELECTRONIC DEVICE AND PLUG AND PLAY UNIT THEREOF - A plug and play unit is provided. The plug and play unit includes a unit housing, a joint, a substrate and a heat conductive member. The joint is connected to the unit housing. The substrate is disposed in the unit housing and the joint, wherein the substrate includes a heat conductive layer and a USB connection port. The heat conductive member thermally connects the joint to the heat conductive layer to transmit heat from the heat conductive layer to the joint. | 2014-03-27 |
20140085827 | CIRCUIT BOARD FOR ELECTRIC COMPONENTS AND CIRCUIT BOARD SYSTEM - A circuit board for electric components has at least one current conductor, which is configured as a molded part, and at least one unhoused electric component affixed to the current conductor. The circuit board exhibits improved operating reliability. | 2014-03-27 |
20140085828 | ELECTRONIC DEVICE WITH HEAT SINK - An electronic device includes a circuit board and a heat sink. A chip is mounted on the circuit board. The heat sink includes a base mounted on the chip and a number of heat-dissipation poles extending up from the base. Each pole defines a through hole extending through the base and a top end of the pole. | 2014-03-27 |
20140085829 | MULTI-LAYERED BOARD AND SEMICONDUCTOR PACKAGE - The invention provides a multi-layered board and a semiconductor package including the multi-layered board with improved heat dissipation performance of the semiconductor package. A multi-layered board includes an anisotropically-conductive member that includes an insulating base which is an anodized film of an aluminum substrate and in which through-holes are formed in a thickness direction and a plurality of conduction passages which are formed of a conductive material filled in the through-holes and which extend through the insulating base in the thickness direction with the conduction passages insulated from each other, a heat conducting layer that includes heat conducting portions and is disposed on at least one surface of the anisotropically-conductive member, and heat dissipating portions formed of the conductive material and protruding from the insulating base. | 2014-03-27 |
20140085830 | HEAT DISSIPATING SUBSTRATE, AND ELEMENT EQUIPPED WITH SAME - A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm. | 2014-03-27 |
20140085831 | CIRCUIT BOARD STRUCTURE HAVING MEASURES AGAINST HEAT - To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board. | 2014-03-27 |
20140085832 | ELECTRONIC DEVICE WITH EFFICIENT HEAT RADIATION STRUCTURE FOR ELECTRONIC COMPONENTS - An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic components, and a heat radiation member provided between the metallic body and the heat conduction member. The heat radiation member includes a heat introduction portion surface-contacted with the heat conduction member, a heat discharge portion surface-contacted with the metallic body, and a heat conduction portion that conducts the heat from the heat introduction portion to the heat discharge portion. The heat conduction portion is provided to be separated from the wiring conductors so as not to electromagnetically couple to the wiring conductors. | 2014-03-27 |
20140085833 | CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer. | 2014-03-27 |
20140085834 | DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE - In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities. | 2014-03-27 |
20140085835 | DC Link Capacitor Bank - A capacitor bank comprising at least two series chains each comprising a plurality of capacitors, wherein the series chains are coupled in parallel at corresponding points; and a fusible link arranged to form at least part of each coupling; wherein the corresponding points of each chain that are coupled to one another are at the same voltage when the capacitor bank is operational. | 2014-03-27 |
20140085836 | MOBILE TERMINAL - A mobile terminal is provided. The mobile terminal a case having an inner space where electronic components are mounted, a display arranged in the inner space of the case, the display being exposed at a front surface of the case, an audio output module arranged in the inner space of the case to output sound, a circuit board arranged in the inner space of the case, the circuit board having a circuit pattern to transmit an electric signal, a bracket coupled to a back surface of the display, the bracket including a metallic plate and an injection mold configured to partially cover the metallic plate and an electric current carrying structure configured to electrically connect the metal plate to at least one of the display, the audio output module and the circuit board. | 2014-03-27 |
20140085837 | METHOD OF FORMING FLEXIBLE CONDUCTION TRACE, FLEXIBLE CONDUCTION TRACE AND FLEXIBLE ELECTRONIC DEVICE USING THE SAME - A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line. | 2014-03-27 |
20140085838 | Monitor and Working Vehicle Provided with the Monitor - A monitor includes a display in a form of a liquid crystal display, a drive substrate that controls the liquid crystal display, a monitor substrate that is provided opposite to the drive substrate with a clearance, a resin-made holder that is disposed in the clearance between the drive substrate and the monitor substrate and holds the liquid crystal display, and a flat cable that electrically connects the drive substrate with the monitor substrate. In the holder, a cable-insertion hole into which the flat cable is inserted is provided. In the cable-insertion hole, first and second restrainers that are in parallel to a width direction of the flat cable to be inserted and are separated in a longitudinal direction of the cable are provided. | 2014-03-27 |
20140085839 | ELECTRONIC CONTROL DEVICE - An electronic control device has an enclosure accommodating therein a circuit board and having (a) a first enclosure member which is provided at a connecting part thereof with a seal groove and (b) a second enclosure member which is provided at a connecting part thereof with a convex line that is fitted into the seal groove of the first enclosure member; a protrusion formed on either one of an inner wall surface in the seal groove or an opposing surface, which faces the inner wall surface of the seal groove, of the convex line so as to protrude toward the other surface. The protrusion limits a movement, in a seal groove width direction, of the convex line fitted into the seal groove. The seal groove and the convex line are sealed with a sealant. | 2014-03-27 |
20140085840 | ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME - Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region. | 2014-03-27 |
20140085841 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component. | 2014-03-27 |
20140085842 | METHOD FOR FABRICATING GLASS SUBSTRATE PACKAGE - A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors. | 2014-03-27 |
20140085843 | METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE AND MULTI-LAYER SUBSTRATE - A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates. | 2014-03-27 |
20140085844 | CONDUCTING MEMBER AND ELECTRONIC DEVICE PROVIDED THEREWITH - A conducting member ( | 2014-03-27 |
20140085845 | THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME - A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving area and electrically connected to the first thick-film substrate. | 2014-03-27 |
20140085846 | MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTING STRUCTURES FOR HIGH DENSITY PACKAGING - Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure. | 2014-03-27 |
20140085847 | WIRING SUBSTRATE - A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. | 2014-03-27 |
20140085848 | ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT - An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board. | 2014-03-27 |
20140085849 | CIRCUIT BOARD SYSTEM COMPRISING A SPRING FASTENED ELEMENT - A circuit board system according to the invention comprises a circuit board ( | 2014-03-27 |
20140085850 | Printed circuit board with compact groups of devices - Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted. | 2014-03-27 |
20140085851 | SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE THE DISTANCE TO THE GROUND PLANE - The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit. | 2014-03-27 |
20140085852 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body in a length direction of the ceramic body; a first acoustic noise absorption layer formed on one surface of the ceramic body in a stacking direction of the dielectric layers and having a thickness of 3 μm to 500 μm; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes; and a printed circuit board having the first and second external electrodes mounted thereon while facing the first acoustic noise absorption layer. | 2014-03-27 |
20140085853 | DISPLAY APPARATUS - A display apparatus including a display and a waveguide plate is provided. The display panel includes multiple rows of display units and multiple rows of solar cell units. The display units and the solar cell units are substantially parallel to a first direction and alternately arranged along a second direction perpendicular to the first direction. The waveguide plate is disposed at one side of the display panel. A first side of the waveguide plate adjacent to the display panel includes multiple microstructures. First and second structure surfaces of each microstructure respectively correspond to one row of the display units and one row of the solar cell units. When the display apparatus is disposed such that the second direction is perpendicular to a ground surface, an inclination of the first structure surface makes a thickness of the waveguide plate gradually decrease along an upward direction from the ground surface. | 2014-03-27 |
20140085854 | CIRCUIT BOARD INCORPORATING SEMICONDUCTOR IC AND MANUFACTURING METHOD THEREOF - Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The prepreg has a through-hole surrounded by the core material and the resin so as to penetrate through the core material and the resin. The manufacturing method further includes a second step for housing a semiconductor IC in the through-hole, and a third step for pressing the prepreg so that a part of the resin flows into the through-hole to allow the semiconductor IC housed in the through-hole to be embedded in the resin. | 2014-03-27 |
20140085855 | ELECTRONIC DEVICE - An electronic device includes a first circuit board, a second circuit board, and a third circuit board. A plurality of loads are mounted on the first circuit board, a plurality of direct current (DC) to DC converters are mounted on the second circuit board, and an alternating current (AC) to DC converter is mounted on the third circuit board. The first circuit board is electrically connected to the second circuit board, the DC to DC converters are configured to convert an input DC voltage from the third circuit board to a plurality of output DC voltages correspondingly, and the output DC voltages power the loads correspondingly. The electronic device separates the voltage-conversion processes from other working components, thus the electronic device is protected from electromagnetic interference. | 2014-03-27 |
20140085856 | FLEXIBLE PRINTED CIRCUIT BOARD AND CIRCUIT-BOARD CONNECTION STRUCTURE - A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad. | 2014-03-27 |
20140085857 | ELECTRONIC MODULE AND METHOD FOR SAME - An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer. | 2014-03-27 |
20140085858 | HIGH-FREQUENCY PACKAGE - A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element. | 2014-03-27 |
20140085859 | Camera Light Source Mounting Structures - An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures. | 2014-03-27 |
20140085860 | LIGHT GUIDE MODULE FOR KEYPAD - A light guide module includes a touch plate, a light guide plate, an induction plate, a transparent double sided tape, a reflective double sided tape and a light source. The transparent double sided tape is adhered between the touch plate and the light guide plate. The reflective double sided tape is adhered between the light guide plate and the induction plate. The light source is located on the induction plate. The reflective double sided tape reflects light emitted by the light source to the light guide plate, the light guide plate directs the light to the touch plate through the transparent double sided tape. | 2014-03-27 |
20140085861 | LIGHTING DEVICES - A lighting device includes a cover portion configured to have a hinged connection for mounting on a housing. The cover portion includes a light emitting diode (LED) and a mixing chamber having a reflective internal surface for receiving light from the LED. A phosphorescent lens is disposed opposite the LED and is configured to reflect light from the LED back to the mixing chamber and to emanate absorbed light from the lens to a surrounding region outside of the mixing chamber. An LED driver circuit is configured to power the LED, the LED driver circuit being electrically connected to a power source. Other embodiments are also disclosed. | 2014-03-27 |
20140085862 | LIGHTING DEVICE - According to one embodiment, a lighting device includes a main body, a light source, a light transmitting cover, and a reflector. The main body is formed from metal. The light source has a substrate formed from ceramic and attached to the light source attachment portion of the main body, and a light emitting element mounted on the substrate. The light transmitting cover is formed from glass. The reflector is formed from metal. The reflector is held by the main body without contact with respect to the main body and the light source between the light source attachment portion and the light transmitting cover. Between the light source attachment portion and the light transmitting cover, parts irradiated with light emitted from the light emitting element do not contain resin except a part in the light source. | 2014-03-27 |
20140085863 | PROTECTION COVER AND BACKLIGHT MODULE - The present invention provides a protection cover and a backlight module. The protection cover comprises a cover main body. The cover main body includes a heat dissipation surface. Each side edge of the cover main body forms a sidewall protruding with respect to the heat dissipation surface. The heat dissipation surface disposes at least one heat dissipation hole thereon, and the sidewall disposes at least one vent hole thereon. The present invention may timely and fast dissipate the heat in the protection cover, and improve the heat dissipation efficiency. | 2014-03-27 |
20140085864 | LED Display Module with Quick Mounting-Dismounting Structure - A LED display module with a quick mounting-Dismounting structure comprising: a mask; a bottom shell; and an LED lamp board; the LED display module further comprises a quick mounting-dismounting unit, wherein the quick mounting-dismounting unit is adapted to be provided the LED display module to fixed to the frame of display screen or removed from the frame of display screen quickly. | 2014-03-27 |
20140085865 | MICROLENS ARRAY FILM AND DISPLAY DEVICE INCLUDING THE SAME - Provided are a microlens array film and a display device including the same. The microlens array film includes a first transparent electrode and a second transparent electrode facing each other and a flexible polymer layer placed between the first and the second transparent electrodes. Lenses may be freely deformed by regulating voltages applied to the first and second transparent electrodes. | 2014-03-27 |
20140085866 | ILLUMINATION DEVICE AND DISPLAY DEVICE - A backlight unit | 2014-03-27 |
20140085867 | Reflector, Backlight Module, and Liquid Crystal Display Device Thereof - The present invention provides a reflector, backlight module, and liquid crystal display device. The reflector, which includes: a first reflector element and a second reflector element. The first reflector element and the second reflector element consist of different materials; as a result, the first reflector element is more heat resistant than the second reflector element. In addition, the cost of the second reflector element is less than the cost of the first reflector element; thus, the normal function of the reflector is maintained while reducing the cost of the reflector; as a result, the cost of the backlight module and the liquid crystal display device is reduced. | 2014-03-27 |
20140085868 | OPTICAL SHEET AND METHOD OF MANUFACTURING THE SAME - An optical sheet includes a light-passing base sheet, a plurality of light-passing first patterns formed on a front major surface of the base sheet, and a plurality of light-passing second patterns formed on a rear major surface of the base sheet. The first patterns protrude from the front surface of the base sheet, a top portion of each of the second patterns makes contact with the rear surface of the second patterns while a larger lower surface of each of the second patterns is exposed to serve as a light receiving surface. Voids having relatively low refractive indices are formed between the light-passing second patterns. The optical sheet employs just one base sheet in one embodiment, thereby reducing a manufacturing cost of the optical sheet. | 2014-03-27 |
20140085869 | COMPACT FLASHLIGHT - A compact flashlight that allows a user to view documents in a dark situation without having to hold a flashlight. The pocket light fits easily over the top of the pocket and can be covered by a conventional pocket flap. The light is an LED display device that produces a significant amount of light so a user can check identification or documentation, as in a license check, or registration verification for police. The pocket light has a push button power switch that can be activated by the user through the fabric of their shirt. | 2014-03-27 |
20140085870 | RECHARGEABLE SOLAR CHIP BATTERY SYSTEM - A solar chip battery system including an interchangeable solar chip, a latch, and a battery unit suitable for use with an illumination means. The solar chip can be detached from the battery unit using the latch. The battery unit comprises at least one battery and a power switch. The battery unit is connected to an illumination means. The solar chip converts light energy into electric energy to recharge the battery unit, which stores the energy and provides power to the illumination means. The solar chip battery system can also provide power to an illumination means for use in portable applications, and can be recharged when not in use. | 2014-03-27 |
20140085871 | Illumination Device For A Cap - An illumination device for a cap contains: a cap including a receiving space defined on a front end of a shield portion thereof to retain an illuminating structure. The illuminating structure includes a seat, a control circuit fixed in the seat and having a switch, and at least one emitting element electrically connecting with the control circuit and extending out of a front end of the seat, such that the at least one emitting element is turned on by ways of the switch to emit lights in a night or in a dark place. | 2014-03-27 |
20140085872 | RECREATIONAL OR OCCUPATIONAL HEADLAMP USING MODULATED LIGHT COROLLARY TO HUMAN PERSISTENCE OF VISION FOR OPTIMIZED PATH ILLUMINATION - The invention relates to a novel recreational or occupational modulating light headlamp which works in conjunction with the mechanics of human vision to provide effective path lighting in very low light or dark. Applying flicker fusion rate and factoring in the acuity of the eye's rods and cones, lighting is applied to the range and capability of the ocular abilities and optimized for low light or dark. | 2014-03-27 |
20140085873 | Style Tyle - An illuminated tile device is disclosed that provides a simplified method of applying LED lighting so it can be used in residential and small-scale spaces. The illuminated tile device comprises a base layer, a top layer, and a plurality of light emitting diodes (LEDs) sandwiched there between. Furthermore, the gap between the top layer and the base layer comprises a filler material wherein the plurality of LEDs are embedded. The plurality of LEDs are in electrical communication via at least one electrical trace interconnecting the plurality of LEDs in series between two sets of electrical contacts positioned on perimeter edges of the base layer. The electrical contacts allow for the interconnection of multiple illuminated tile devices and enable electrical continuity between the devices and from a modulated power source. Additionally, a plurality of illuminated tile devices can be interconnected and secured together within a grid. | 2014-03-27 |
20140085874 | LUMINAIRE - A luminaire includes a light-emitting element, a side surface cover, a lower surface cover, a diffuser, and a prism, which is an example of an optical member. The light-emitting element emits light. The side surface cover is arranged a predetermined distance from the light-emitting element. The light emitted by the light-emitting element is transmitted through the side surface cover. The lower surface cover is provided at the lower end of the side surface cover. The light emitted by the light-emitting element is transmitted through the lower surface cover. The diffuser is a member provided between the lower surface cover and the light-emitting element to diffuse the light emitted by the light-emitting element. The prism adjusts a traveling direction of the light transmitted through the side surface cover to be different from a traveling direction of the light emitted by the light-emitting element and transmitted through the lower surface cover. | 2014-03-27 |
20140085875 | EMERGENCY LIGHTING DEVICE - An emergency lighting device includes a charging stand and a flashlight disposed upon the charging stand to charge. The charging stand includes a base, a circuit controller and several lights. A cavity is formed on the front of the base to hold the flashlight. The circuit control board is disposed within the base. The lights are installed on the front of the base and electrically connected to the output terminal of the circuit control board which controls the external power supply for charging the flashlight and a power source of the flashlight for discharging electricity to the lights. The flashlight includes an alarm mounted on a tail of the flashlight to alarm. The alarm includes a mounting base, a buzzer stand, a buzzer, a buzzer drive circuit board, a switch controller and a conductive assembly. The device is capable of charging a flashlight and providing emergency lighting and alarm. | 2014-03-27 |
20140085876 | HANDHELD WORK LIGHT INCLUDING ADJUSTABLE LIGHT FOCUSING OR SCATTERING MECHANISM - In accordance with various embodiments, there is provided a work light, which includes a housing, a light source including one of a light-emitting diode and a compact fluorescent light, and a light assembly including a plurality of light-emitting diodes. The work light further includes a power source, and a light focusing mechanism including a slide switch. The slide switch controls a focus distance of light emitted from the light source. The light focusing mechanism is configured to focus light emitted from the light source, when the slide switch is positioned in a first position, and configured to scatter light emitted from the light source, when the slide switch is positioned in a second position. | 2014-03-27 |
20140085877 | Heat Dissipation Device for Flashlight - The present invention provides a heat dissipation device for a flashlight, comprising a lighting portion and a handheld portion; said lighting portion is provided inside an outer housing and comprises a lighting source adjacent to a front light cover and a light reflector; an end of said lighting source is connected to a power supply end via power wires, and one side of said handheld portion is attached with an elastic clip; characterized in that: a heat dissipating fin is attached to a back portion of said lighting source inside said outer housing; air vents are formed on a rear side circumference of said outer housing; whereby heated air generated by said lighting source is exhausted rearward from a side of said heat dissipating fin and along said air vents on said rear side circumference of said flashlight to maintain good air circulation between said flashlight and the user's garment. | 2014-03-27 |
20140085878 | CYLINDRICAL FLASHLIGHT HAVING A ROLL-AWAY PREVENTION MECHANISM - The present invention relates to a cylindrical flashlight and a ring element for use as a roll-away safeguard of a cylindrical flashlight. In order to prevent a cylindrical flashlight from rolling away, the invention proposes a cylindrical flashlight having a ring element that is connected to the flashlight and has radially protruding elevations which have surface sections that are arranged at a distance from the surface of the cylindrical flashlight in some areas in the assembled state. Also proposed is a ring element for use as a roll-away safeguard of a cylindrical flashlight, which can be detachably connected to the flashlight and has radially protruding elevations which have surface sections that are arranged at a distance from the cylindrical surface of the flashlight in the assembled state. | 2014-03-27 |
20140085879 | Lighting apparatus - A lighting apparatus includes a lamp fixture; a bar-shaped lamp provided on the lamp fixture; a reflector, provided above the lamp fixture and below the bar-shaped lamp, including a first reflecting element, a second reflecting element opposite to the first reflecting element, and a reflector bottom connected to lower ends of the first and the second reflecting elements, so as to define a semi-closed internal space for containing the bar-shaped lamp, wherein the first and the second reflecting elements respectively have at least an outwardly-bent reflecting part for reflecting possibly much light out; a light sensor, clipping on the bar-shaped lamp, for detecting a change of ambient illuminance (LUX) and outputting a change signal; an electric power adjusting element, connected to the light sensor and the bar-shaped lamp, for receiving the change signal and accordingly adjusting the electric power of the bar-shaped lamp; and power connectors and emergency power connectors. | 2014-03-27 |
20140085880 | LIGHTING APPARATUS - According to an aspect, a lighting apparatus includes a lighting unit including a long-shaped housing that has upper and lower openings and has an outer surface formed as a convex surface when seen in a cross-section perpendicular to a longitudinal direction, and a semiconductor light emitting device disposed inside the housing so as to emit light toward the lower opening. Further, the lighting apparatus includes a holding unit including a holding member in which at least a portion of a surface is formed as a concave surface corresponding to the convex surface when seen in a cross-section perpendicular to the longitudinal direction of the lighting unit. When seen in the cross-section, the convex surface has, in a region that faces the concave surface, a portion that is brought into contact with the concave surface, and a portion that is not brought into contact with the concave surface. | 2014-03-27 |
20140085881 | LED WHIP LIGHT ASSEMBLY - A light emitting diode (LED) whip light assembly includes a base and an LED light assembly. The base is configured to mount to an elongate whip rod. The LED light assembly is mounted to the base and includes a plurality of LED lights, an LED circuit, and a lens. The LED circuit includes a circuit board to which the plurality of LED lights are mounted. The lens is mounted to the base with a releasable, liquid-tight connection and covers the plurality of LED lights. | 2014-03-27 |
20140085882 | LED WORK LIGHT - An LED work light assembly includes a housing defining light chamber, a plurality of LED lights positioned in the light chamber, and a lens assembly secured to the housing with a liquid-tight connection to create a waterproof environment in the light chamber. The LED work light assembly also includes a mounting arrangement carried by the housing and comprising a pivot mount that includes a spherical socket and a bolt having a spherical ball positioned at one end and a threaded shaft at an opposite end. The ball is positioned in the socket to provide a ball-and-socket interface, and the housing is pivotal about the ball-and-socket interface to adjust a position of the housing relative to the bolt. | 2014-03-27 |
20140085883 | LED HIGH BAY LIGHTING SOURCE - A lighting device includes a housing having an inner surface and outer surface and a plurality of LEDs mounted at the inner surface, the LEDs mounted in a radially symmetrical configuration. The inner surface may be made of or coated with reflective material. The lighting system may further include, individually or in any combination, following: heat sink fins mounted on the outer surface; a reflective plate for reflecting light in a desired direction; a reflective tube for redirecting light from the LEDs. The housing may include a cylindrical section and a conic section. | 2014-03-27 |
20140085884 | LED LIGHTING APPARATUS - An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads. | 2014-03-27 |
20140085885 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING COVER USED IN THE SAME - An object of the present invention is to preventing the propagation of light to improve the display quality of the light emitting device. A light emitting device according to an embodiment has a case, a base member disposed at a front side of the case, a plurality of light emitting elements mounted at the front side of the base member, and a cover covering the light emitting elements. The cover has a light transmissive member integrally covering the plurality of light emitting elements, and a light-blocking member disposed at a front side of the light transmissive member and having openings anterior to the light emitting elements respectively. Further, the light transmissive member has, on its back surface, a back-side rough surface portion in a region different from the region facing the front surfaces of the light emitting elements. | 2014-03-27 |
20140085886 | Light, Especially Headlights - The invention refers to a light, especially a spotlight ( | 2014-03-27 |
20140085887 | Lighting Device - Lighting device, usable for example with LED light sources, comprises a bowl-shaped body having a base surface with a plurality of mounting studs projecting from the base surface, together with one or more boards for the mounting of light radiation sources, provided with holes for the passage of respective mounting studs. The board has pairs of mounting locations for light radiation sources, each pair being arranged on opposite sides of a respective hole so as to be located on opposite sides of the stud which extends through said respective hole. A plurality of reflectors is provided in order to project the light radiation from the device. The reflectors each have an inlet opening for the light radiation and are capable of being mounted on the mounting studs selectively in one of at least two opposite mounting positions in which the inlet opening is placed at one of said mounting locations. | 2014-03-27 |
20140085888 | ILLUMINATION DEVICES USING ARRAY OF REFLECTORS - Embodiments of the present invention provide apparatuses and systems for providing illumination for projectors. Two or more sets of reflectors are used to combine light beams emitted by two or more two-dimensional arrays of light sources to provide a combined light beam with high brightness toward a pupil of a projection system. Solid state light sources, such as diode lasers and LEDs, may be used as light sources at relatively low cost and low powers, and with long lifetime. | 2014-03-27 |
20140085889 | TRACK ADAPTER AND LIGHTING FIXTURE - Described are track adapters for snap-fitting within a recess of a track, the track adapters including at least one manually-releasable spring tab comprising a lip and a release tab; and at least one slidably-releasable spring tab comprising a lip, wherein the at least one manually-releasable spring tab and the at least one slidably-releasable spring tab are adapted to deflect inwardly to permit snap-fit insertion of the track adapter into the recess. Also described are light fixtures including a fixture head comprising at least one lamp housing, wherein the at least one lamp housing supports at least one lamp; and a curved arm connecting the fixture head to a support surface. | 2014-03-27 |
20140085890 | LIGHT-EMITTING DEVICE, METHOD FOR ASSEMBLING SAME AND LUMINAIRE - According to one embodiment, a light-emitting device includes a substrate, a first light-emitting element group, a second light-emitting element group, and a terminal group. The first light-emitting element group includes plural first light-emitting elements mounted on the substrate. The second light-emitting element group is mounted on the substrate alongside the first light-emitting element group and includes plural second light-emitting elements. The terminal group includes plural terminals electrically connected to the first light-emitting element group and the second light-emitting element group, and is arranged on a side of the first light-emitting element group opposite to a side thereof facing the second light-emitting element group in a first direction in which the first light-emitting element group and the second light-emitting element group on the substrate are arranged side by side. | 2014-03-27 |
20140085891 | Light-Emitting Apparatus and Luminaire - A light-emitting apparatus may include a substrate (e.g., a ceramic substrate), a plurality of first light-emitting elements mounted on the substrate, and a plurality of receptacles of monopole connectors. In some examples, the light-emitting apparatus may further include a first line configured to connect anodes of the first light-emitting elements and a first receptacle from among the plurality of receptacles, and a second line configured to connect cathodes of the first light-emitting elements and a second receptacle from among the plurality of receptacles. The plurality of receptacles each may include a metallic base portion. | 2014-03-27 |
20140085892 | MEHTOD FOR MOUNTING LIGHTING MODULES AND EQUIPMENT THEREFOR - A method for mounting planar lighting modules on a mounting surface may include: providing on opposite sides of the lighting module fixing indentations opening toward the aforesaid sides, superimposing on said opposite sides of the lighting module stiffening bars having lateral lobes extending into said indentations, and fixing to the mounting surface the stiffening bars superimposed on the opposite sides of the lighting module with the opposite sides of the lighting module sandwiched between the stiffening bars and the mounting surface, whereby the stiffening bars urge the lighting module toward the mounting surface. | 2014-03-27 |
20140085893 | Thermally-Managed Electronic Device - A thermally-managed electronic device, such as a heat-generating lamp or microelectronic assembly, takes advantage of the latent heat of phase-change within a heat pipe and functions in cooperation with a plurality of heat-radiating elements to enhance heat removal capacity from a heat source. The device, which may be provided in a natural convection or forced air convection embodiment, improves the heat removal on the cold side of the heat pipe by providing a much larger heat-radiating surface area in the form of a plurality of heat-radiating elements that are each thermally connected by means of one or more thermal connecting elements. | 2014-03-27 |
20140085894 | LIGHTING APPARATUS WITH A BOOST - Lighting apparatus and structures are described to space electrical drivers from a light panel. In this way, a driver box housing the driver can be spaced from the light panel to communicate with pre-existing facilities (e.g. electrical wiring) and can serve the additional advantage of keeping the driver box out of standing water that may accumulate on the structure. | 2014-03-27 |
20140085895 | LED Bracket Apparatus for High-Output LED Lighting Systems - A bracket holds high-output LED lighting systems within existing light fixtures, such as, for example, shoe box parking lot fixtures, gas station canopy fixtures, and street light fixtures. Specifically, the bracket is adjustable to fit most light fixture housings so that the light fixture housings can be retrofitted and orientated with the high-output LED lighting systems without removal or replacement of components thereof, such as the housing, the cover, the lens, and/or other like components. | 2014-03-27 |
20140085896 | MODULAR LED LIGHTING SYSTEMS, INCLUDING FLEXIBLE, RIGID, AND WATERPROOF LIGHTING STRIPS AND CONNECTORS - Modular lighting systems are provided that comprise lighting strips physically and electrically connectable with one another by way of flexible connectors. The lighting strip devices can be made of flexible or rigid material to allow for applying the lighting devices along flat as well as contoured surfaces and can be waterproof or water resistant. A modular lighting strip system is provided comprising: two or more lighting strips comprising a non-conductive substrate strip with an electrical circuit; a plurality of light sources operably connected to the electrical circuit; a plug or socket at opposing ends of the strip; one or more connectors for providing electrical and physical interconnection of the lighting strips comprising: one or more plug and/or socket and one or more flexible wires interconnecting the plugs or sockets, which are operably configured to provide for side-by-side interconnection of lighting strips. | 2014-03-27 |
20140085897 | SOUND ACTIVATED FOAM STICK BATON - According to one aspect of the present disclosure, a sound activated object comprises an elongated foam element; a light module insertable at least partially into an interior cavity of the foam element; and a circuit configured to control illumination of one or more light elements of the light module via sound recognition. | 2014-03-27 |
20140085898 | FOCAL PLANE SHIFTING SYSTEM - Focal plane shift elements and optical systems with focal plane shifting features for illuminating flow-paths in a fluidic processing system are disclosed. An optical system may include a light source providing an incident first light beam. The optical system may include at least one optical element configured to collect and focus the incident first light beam to produce a second light beam having different portions simultaneously focused at two or more different locations along an optical path, with each location corresponding to a different flow-path of the fluidic processing system. The focal plane shift elements and optical systems with focal plane shifting features may be particularly useful in a microfluidic system. | 2014-03-27 |
20140085899 | LED LUMINAIRE - According to one embodiment, an LED luminaire includes a housing, an LED module mounted on one end of the housing, and a resin member configured to cover a peripheral portion of the LED module and fix the LED module to the housing. A wavelength conversion member, which is a cover member coupled to a peripheral portion of the resin member at an opening end thereof and covering the LED module, and including a wavelength conversion material on the surface or in the interior thereof, and a globe configured to cover the wavelength conversion member are also provided | 2014-03-27 |
20140085900 | Adjustable Framing Projector - An adjustable light shaping apparatus is disclosed that includes a shaping housing that receives a beam of light from a luminaire and outlines a source shape through which the beam of light emanates to illuminate a target shape. The adjustable light shaping apparatus further includes two or more adjustable paddles movably coupled to the shaping housing, wherein each of the adjustable paddles is independently adjustable and each adjustable paddle has a framing edge. Further, the adjustable paddles may be oriented so that the framing edges intersect the beam of light and collectively illuminate an outline, defined in the present disclosure as a paddle-framed shape. The adjustable light shaping apparatus also includes an iris assembly connected to the shaping housing. The iris assembly includes an expandable and contractible iris that may intersect the beam of light to illuminate an outline, defined in the present disclosure as an iris-framed shape. | 2014-03-27 |
20140085901 | Method and Apparatus for Controlling Diffusion and Color of a Light Beam - A light fixture includes a light source, a first flexible material coupled to a first scrolling mechanism, and a second flexible material coupled to a second scrolling mechanism. The first flexible material includes a first pattern generator and the first scrolling mechanism is operable to move the first pattern generator from a first position to a second position in a beam of light from the light source. The second flexible material includes a second pattern generator and the second scrolling mechanism is operable to move the second pattern generator to a third position in the beam of light. A changing pattern is produced in the beam of light. | 2014-03-27 |
20140085902 | LUMINAIRE - According to one embodiment, a luminaire includes a main body made of metal, a light source, a reflector made of metal, a translucent cover made of glass, and an insulating member. The main body includes a light-source attaching section, an opening opposed to the light-source attaching section, a sidewall section, and a reflector supporting section. The reflector includes a flange section supported by the reflector supporting section in a non-contact manner and a reflection surface expanding from a daylight opening toward a floodlight opening. The translucent cover is provided on the floodlight opening side. The insulating member is configured to hold the flange section of the reflector and an outer edge portion of the translucent cover, and interposed between the flange section and the outer edge portion, and between the flange section and the reflector supporting section. | 2014-03-27 |
20140085903 | IMPROVEMENTS TO A GUN-MOUNTED SEARCH LIGHT - The improvements include a reflector having an optical axis and a focus on the optical axis; a plasma lamp generating a light emitting plasma ball; and a G-force diaphragm shock mount coupling the lamp to the reflector while maintaining precise and stable positioning of the plasma ball of the lamp at or near the focus of the reflector to preserve optical performance despite application of G-force shocks to the apparatus. | 2014-03-27 |
20140085904 | LED LIGHT FIXTURE - The invention discloses an LED light fixture, which comprises a lamp body and a lamp handle connected therewith, wherein the lamp body adopts an AC (Alternating Current) LED as a light source. As the LED light fixture does not need a power supply, the light fixture has the advantages of being small, having a simple structure and saving materials; as a plurality of small planes are used for forming a complete multi-stage sagittal reflecting surface, the light fixture has higher reflection efficiency; as a gland strip and a shielding mechanism are adopted, the reverse side of the product has a complete structure and is lightproof; as non-through screwed connection holes are formed at positions of the lamp body, at which the lamp body is connected with the lamp handle, the light fixture has superior sealability and watertightness. | 2014-03-27 |
20140085905 | Method and System for Managing Light from a Light Emitting Diode - A light source, for example a light emitting diode, can emit light and have an associated optical axis. The source can be deployed in applications where it is desirable to have illumination biased laterally relative to the optical axis, such as in a street luminaire where directing light towards a street is beneficial. The source can be coupled to an optic that comprises a cavity. At least a portion of the cavity can have an outline that is egg-shaped in cross section. A backside of the cavity (or a backside portion of the optic) can have an irregular shape for receiving the light emitting diode, for example to form a receptacle shaped to fit a circuit board on which the light emitting diode is mounted. | 2014-03-27 |
20140085906 | LIGHT FIXTURE ACCESSORY - A portable light fixture accessory for diffusing or redirecting the light emitted from a recessed light fixture is disclosed. The apparatus consists of a longitudinally extending connector having a first magnetic flat end and a second end attached to an element. The longitudinally extending connector may be pivotable in at least one direction. | 2014-03-27 |