12th week of 2010 patent applcation highlights part 28 |
Patent application number | Title | Published |
20100075469 | Method for making thin transistor - A method for making a thin film transistor, the method comprising the steps of: (a) providing a carbon nanotube array and an insulating substrate; (b) pulling out a carbon nanotube film from the carbon nanotube array by using a tool; (c) placing at least one carbon nanotube film on a surface of the insulating substrate, to form a carbon nanotube layer thereon; (d) forming a source electrode and a drain electrode; wherein the source electrode and the drain electrode being spaced therebetween, and electrically connected to the carbon nanotube layer; and (e) covering the carbon nanotube layer with an insulating layer, and a gate electrode being located on the insulating layer. | 2010-03-25 |
20100075470 | METHOD OF MANUFACTURING SOI SUBSTRATE - After a single crystal semiconductor layer provided over a base substrate by attaching is irradiated with a laser beam, characteristics thereof are improved by first heat treatment, and after adding an impurity element imparting conductivity to the single crystal semiconductor layer, second heat treatment is performed at lower temperature than that of the first heat treatment. | 2010-03-25 |
20100075471 | Recessed Gate Silicon-On-Insulator Floating Body Device With Self-Aligned Lateral Isolation - Embodiments of a manufacturing process for recessed gate devices on silicon-on-insulator (SOI) substrate with self-aligned lateral isolation are described. This allows the creation of true in-pitch recessed gate devices without requiring an extra isolation dimension. A lateral isolation trench is formed between pairs of recessed gate devices by etching the silicon-on-insulator area down to a buried oxide layer on which the silicon-on-insulator layer is formed. The position of the trench is self-aligned and defined by the gate width and the dimension of spacers disposed on either side of the gate. The isolation trench is filled with a dielectric material and then etched back to the middle of the SOI body and the remaining volume is filled with a doped conductive material. The doped conductor is subject to a thermal cycle to create source and drain regions of the device through out-diffusion of the doped material. | 2010-03-25 |
20100075472 | TFT array substrate and the fabrication method thereof - A TFT array substrate includes: a gate electrode connected to a gate line; a source electrode connected to a data line crossing the gate line to define a pixel region; a drain electrode which is opposite to the source electrode with a channel in between; a semiconductor layer defining the channel between the source electrode and the drain electrode; a pixel electrode in the pixel region and connected to the drain electrode; a channel passivation layer on the channel of the semiconductor layer; a gate pad extending from the gate line, where a semiconductor pattern and a transparent conductive pattern are formed; a data pad connected to the data line, where the transparent conductive pattern is formed; and a gate insulating layer formed under the semiconductor layer, the gate line and the gate pad, and the data line and the data pad. | 2010-03-25 |
20100075473 | Transistor Forming Methods - A transistor forming method includes forming a dielectric spacer in a trench surrounding an active area island, forming line openings through the spacer, and forming a gate line extending through the line openings, over opposing sidewalls, and over a top of the fin. Source/drain regions are in the fin. Another method includes forming an interlayer dielectric over areas of the fin intended for source/drain regions, forming contact openings through the interlayer dielectric, and forming a source/drain plug in contact with an exposed portion of the spacer and in electrical connection with the top, one of opposing endwalls, and both of the opposing sidewalls of the fin. | 2010-03-25 |
20100075474 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - A gate electrode | 2010-03-25 |
20100075475 | METHOD FOR PRODUCING A THIN FILM TRANSISTOR AND METHOD FOR FORMING AN ELECTRODE - An electrode is prevented from being peeled from a substrate or a silicon layer. After the surface of a first copper thin film composed mainly of copper is treated by exposing it to an ammonia gas, a film of silicon nitride is formed on the surface of the first copper thin film by generating a plasma of a raw material gas containing a silane gas and an ammonia gas in an atmosphere in which an object to be processed is placed. Since the surface is preliminarily treated with the ammonia gas, the silane gas is prevented from being diffused into the first copper thin film. Therefore, an electrode constituted by the surface-treated first copper thin film is not peeled from the glass substrate or the silicon layer. In addition, its electric resistance value does not rise. | 2010-03-25 |
20100075476 | SEMICONDUCTOR DEVICE FABRICATION METHOD - A method of manufacturing a semiconductor device which includes forming first and second gate patterns, forming first and second sidewall spacers on sidewalls of the first and second gate patterns respectively, implanting a first impurity into the semiconductor substrate, forming a third sidewall spacer on the first sidewall spacer and a fourth sidewall spacer on the second sidewall spacer in such a manner that the third sidewall spacer is in contact with the fourth sidewall spacer between the first and second gate patterns, implanting a second impurity into the semiconductor substrate, and removing the third and the fourth sidewall spacers. | 2010-03-25 |
20100075477 | Method of Manufacturing Semiconductor Device - An embodiment of the disclosure relates to a method of manufacturing semiconductor devices. According to this embodiment, a tunnel insulating layer, a conductive layer for a floating gate, and a hard mask layer are sequentially formed over a semiconductor substrate. Isolation trenches are formed by etching the hard mask layer, the conductive layer for the floating gate, the tunnel insulating layer, and the semiconductor substrate. Isolation structures are formed by filling the isolation trenches with an insulating layer. Upper sidewalls of the isolation trenches are exposed by etching predetermined thickness of the isolation structures. Ion implantation regions are formed in the exposed upper sidewalls of the isolation trenches by performing an ion implantation process. | 2010-03-25 |
20100075478 | METHOD FOR PHOTORESIST PATTERN REMOVAL - The present disclosure provides a method for making a semiconductor device. The method includes forming a sacrificial layer on a substrate; forming a patterned resist layer on the sacrificial layer; performing an ion implantation to the substrate; applying a first wet etch solution to remove the patterned photoresist layer; and applying a second wet etch solution to remove the sacrificial layer. | 2010-03-25 |
20100075479 | Semiconductor Device and Method of Forming the Same - A method of forming a semiconductor device includes forming a trench on a semiconductor substrate to define an active region, forming a radical oxide layer on a sidewall and a bottom surface of the trench, and forming a nitride layer on the radical oxide layer. The conduction band offset of the radical oxide layer is greater than the conduction band offset of a thermal oxide layer having the same thickness as the radical oxide layer. | 2010-03-25 |
20100075480 | STI STRESS MODULATION WITH ADDITIONAL IMPLANTATION AND NATURAL PAD SIN MASK - A method of manufacturing a semiconductor structure is provided. The method includes forming a hard mask pattern on a semiconductor substrate, wherein the hard mask pattern covers active regions; forming a trench in the semiconductor substrate within an opening defined by the hard mask pattern; filling the trench with a dielectric material, resulting in a trench isolation feature; performing an ion implantation to the trench isolation feature using the hard mask pattern to protect active regions of the semiconductor substrate; and removing the hard mask pattern after the performing of the ion implantation. | 2010-03-25 |
20100075481 | METHOD AND STRUCTURE OF MONOLITHICALLY INTEGRATED IC-MEMS OSCILLATOR USING IC FOUNDRY-COMPATIBLE PROCESSES - The present invention relates to integrating an inertial mechanical device on top of an IC substrate monolithically using IC-foundry compatible processes. The IC substrate is completed first using standard IC processes. A thick silicon layer is added on top of the IC substrate. A subsequent patterning step defines a mechanical structure for inertial sensing. Finally, the mechanical device is encapsulated by a thick insulating layer at the wafer level. Compared with the incumbent bulk or surface micromachined MEMS inertial sensors, vertically monolithically integrated inertial sensors provided by embodiments of the present invention have one or more of the following advantages: smaller chip size, lower parasitics, higher sensitivity, lower power, and lower cost. | 2010-03-25 |
20100075482 | Bonded Wafer Assembly System and Method - A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing. | 2010-03-25 |
20100075483 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE - A method for manufacturing a nitride semiconductor device, includes forming a p-type nitride semiconductor layer on a substrate, from an organic metal compound as a group III element source material, ammonia and a hydrazine derivative as group V element source materials, and a Mg source material gas as a p-type impurity source material. The flow velocity of the source material gases including the group III element source material, the group V element source materials, and the p-type impurity source material is more than 0.2 m/sec. | 2010-03-25 |
20100075484 | SOI DEVICE WITH CONTACT TRENCHES FORMED DURING EPITAXIAL GROWING - A method for manufacturing an integrated electronic device. The method includes providing an SOI substrate having a semiconductor substrate, an insulating layer on the semiconductor substrate, and a semiconductor starting layer on the insulating layer; epitaxially growing the starting layer to obtain a semiconductor active layer on the insulating layer for integrating components of the device, and forming at least one contact trench extending from an exposed surface of the starting layer to the semiconductor substrate before the step of epitaxially growing the starting layer, wherein each contact trench clears a corresponding portion of the starting layer, of the insulating layer and of the semiconductor substrate, the epitaxial growing being further applied to the cleared portions thereby at least partially filling the at least one contact trench with semiconductor material. | 2010-03-25 |
20100075485 | INTEGRATED EMITTER FORMATION AND PASSIVATION - Embodiments of the present invention provide a method for forming an emitter region in a crystalline silicon substrate and passivating the surface thereof by depositing a doped amorphous silicon layer onto the crystalline silicon substrate and thermally annealing the crystalline silicon substrate while oxidizing the surface thereof. In one embodiment, the deposited film is completely converted to oxide. In another embodiment, the doped amorphous silicon layer deposited onto the crystalline silicon substrate is converted into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon substrate upon which the amorphous silicon was initially deposited during emitter formation. In one embodiment, at least a portion of the converted crystalline silicon is further converted into silicon dioxide during the emitter surface passivation. | 2010-03-25 |
20100075486 | FORMATION OF SINGLE CRYSTAL SEMICONDUCTOR NANOWIRES - A method is provided for growing mono-crystalline nanostructures onto a substrate. The method comprises at least the steps of first providing a pattern onto a main surface of the substrate wherein said pattern has openings extending to the surface of the substrate, providing a metal into the openings of the pattern on the exposed main surface, at least partly filling the opening with amorphous material, and then annealing the substrate at temperatures between 300° C. and 1000° C. thereby transforming the amorphous material into a mono-crystalline material by metal mediated crystallization to form the mono-crystalline nanostructure. | 2010-03-25 |
20100075487 | Crystallization method - To crystallize a material, a thin layer of amorphous or polycrystalline material is deposited on at least one area of the surface of a top part of a substrate. A metal layer is then deposited on at least one area of the thin layer. Thermal treatment is then performed to enable crystalline growth of the material of the thin layer, resulting in:
| 2010-03-25 |
20100075488 | CVD REACTOR WITH MULTIPLE PROCESSING LEVELS AND DUAL-AXIS MOTORIZED LIFT MECHANISM - An apparatus for processing a substrate, comprising a processing chamber and a substrate support and lift pin assembly disposed within the chamber. The substrate support and lift pin assembly are coupled to a lift mechanism that controls positioning of the substrate support and the lift pins and provides rotation for the substrate support. The lift mechanism includes at least one sensor capable of generating a signal when clearance between the substrate support and the lift pins allows rotation of the substrate support to begin. The substrate support capable of concurrent axial motion and rotation may be used in a processing chamber comprising multiple processing zones separated by edge rings. Substrates may be subjected to successive or cyclical processes by moving between the multiple processing zones. | 2010-03-25 |
20100075489 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRODUCING APPARATUS - A plasma of a gas containing an impurity is produced through a discharge in a vacuum chamber, and a plurality of substrates are successively doped with the impurity by using the plasma, wherein a plasma doping condition of a subject substrate is adjusted based on an accumulated discharge time until the subject substrate is placed in the vacuum chamber. | 2010-03-25 |
20100075490 | DEFECT-FREE JUNCTION FORMATION USING LASER MELT ANNEALING OF OCTADECABORANE SELF-AMORPHIZING IMPLANTS - A method and apparatus for implanting a semiconductor substrate with boron clusters. A substrate is implanted with octadecaborane by plasma immersion or ion beam implantation. The substrate surface is then melted, resolidified, and annealed to completely dissociate and activate the boron clusters. | 2010-03-25 |
20100075491 | DRY ETCHING METHOD OF SILICON COMPOUND FILM - A silicon compound film is dry etched by parallel-plate type dry etching using an etching gas including at least COF | 2010-03-25 |
20100075492 | Nonvolatile semiconductor memory and method of fabrication thereof - A method of fabricating a semiconductor memory having word lines and bit lines disposed on a semiconductor substrate, with memory cells being formed at intersecting portions of the word lines and the bit lines. The method includes forming a first insulating film on the semiconductor substrate, forming a first polysilicon film on the first insulating film, patterning the first polysilicon film to form floating gates of the memory cells and an etching stop layer covering and surrounding contact portions of the word lines in a plan view, forming a second insulating film on the first polysilicon film, forming a conductive film on the second insulating film, patterning the conductive film to form control gates of the memory cells and strip-shaped regions as the word lines, accumulating an interlayer insulating film on the conductive film, and etching the interlayer insulating film, and opening contact holes for the contact portions. | 2010-03-25 |
20100075493 | METHOD OF FORMING ELECTRODE CONNECTING PORTION - A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet. | 2010-03-25 |
20100075494 | INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION - A method and apparatus for depositing a tantalum nitride barrier layer is provided for use in an integrated processing tool. The tantalum nitride is deposited by atomic layer deposition. The tantalum nitride is removed from the bottom of features in dielectric layers to reveal the conductive material under the deposited tantalum nitride. Optionally, a tantalum layer may be deposited by physical vapor deposition after the tantalum nitride deposition. Optionally, the tantalum nitride deposition and the tantalum deposition may occur in the same processing chamber. | 2010-03-25 |
20100075495 | Method Of Selectively Plating Without Plating Lines - A method of selectively plating without plating lines is provided. The method employs a loading plate having a metalized temporary conductive layer. The loading plate and the temporary conductive layer are adapted for transmitting a plating current. A patterning photoresist layer is accorded for selectively and sequentially plating a separating metal layer, a plating protection layer, and a connection pad layer on to the temporary conductive layer. Then, the loading plate is further used for supplying current to form other circuit layers by a pressing lamination process. And when the plate process is completed or it is not need to plate, the loading plate and the temporary conductive layer can be removed, for further completing for example the solder mask process, and thus achieving the objective of plating without plating lines. | 2010-03-25 |
20100075496 | SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION - A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon. | 2010-03-25 |
20100075497 | Non-Plating Line Plating Method Using Current Transmitted From Ball Side - A non-plating line (NPL) plating method is provided. The NPL plating method is featured in that at first it forms a circuit layer on a bump side only, and therefore a plating current can be transmitted via a plating metal layer on a ball side to the circuit layer (enclosed by an insulation layer, e.g., a solder resist or a photoresist) on the bump side, and thus forming a protection layer, e.g., plating gold, on the plating metal layer on the circuit layer and the ball side. In such a way, the plating gold is formed after the insulation layer, so that there won't be any plating gold existed beneath the insulation layer of the bump side (connected with dies). Hence, the insulation layer can be prevented from dropping off from the protection layer, i.e., the plating gold, and thus the reliability of the products can be improved. | 2010-03-25 |
20100075498 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING LIQUID - A semiconductor device has interconnects protected with an alloy film having a minimum thickness necessary for producing the effect of preventing diffusion of oxygen, copper, etc., formed more uniformly over an entire surface of a substrate with less dependency to the interconnect pattern of the substrate. The semiconductor device includes, embedded interconnects, formed by filling an interconnect material into interconnect recesses formed in an electric insulator on a substrate, and an alloy film, containing 1 to 9 atomic % of tungsten or molybdenum and 3 to 12 atomic % of phosphorus or boron, formed by electroless plating on at least part of the embedded interconnects. | 2010-03-25 |
20100075499 | METHOD AND APPARATUS FOR METAL SILICIDE FORMATION - Embodiments described herein include methods of forming metal silicide layers using a diffusionless annealing process. In one embodiment a method for forming a metal silicide material on a substrate is provided. The method comprises depositing a metal material over a silicon containing surface of a substrate, depositing a metal nitride material over the metal material, depositing a metallic contact material over the metal nitride material, and exposing the substrate to a diffusionless annealing process to form a metal silicide material. The short time-frame of the diffusionless annealing process reduces the time for the diffusion of nitrogen to the silicon containing interface to form silicon nitride thus minimizing the interfacial resistance. | 2010-03-25 |
20100075500 | Metal polishing slurry and chemical mechanical polishing method - The invention provides a metal polishing slurry containing a compound represented by the general formula (1): (X | 2010-03-25 |
20100075501 | CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION AND CHEMICAL MECHANICAL POLISHING METHOD - A chemical mechanical polishing aqueous dispersion is used to polish a polishing target that includes an interconnect layer that contains tungsten. The chemical mechanical polishing aqueous dispersion includes: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica particles. The content (M | 2010-03-25 |
20100075502 | Barrier slurry for low-k dielectrics - The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises silica, a compound selected from the group consisting of an amine-substituted silane, a tetraalkylammonium salt, a tetraalkylphosphonium salt, and an imidazolium salt, a carboxylic acid having seven or more carbon atoms, an oxidizing agent that oxidizes a metal, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. | 2010-03-25 |
20100075503 | INTEGRAL PATTERNING OF LARGE FEATURES ALONG WITH ARRAY USING SPACER MASK PATTERNING PROCESS FLOW - Embodiments of the present invention pertain to methods of forming patterned features on a substrate having an increased density (i.e. reduced pitch) as compared to what is possible using standard photolithography processing techniques using a single high-resolution photomask while also allowing both the width of the patterned features and spacing (trench width) between the patterned features to vary within an integrated circuit. | 2010-03-25 |
20100075504 | METHOD OF TREATING A SEMICONDUCTOR SUBSTRATE - A method of treating a semiconductor substrate has forming convex patterns over the semiconductor substrate by dry etching, cleaning and modifying a surface of the convex patterns by using chemical, forming a hydrophobic functional surface on the modified surface of the convex patterns, after forming the hydrophobic functional surface, rinsing the semiconductor substrate by using water, drying the semiconductor substrate, and removing the hydrophobic functional group from the hydrophobic functional surface of the convex patterns. | 2010-03-25 |
20100075505 | PLASMA PROCESSING APPARATUS AND METHODS FOR REMOVING EXTRANEOUS MATERIAL FROM SELECTED AREAS ON A SUBSTRATE - Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure. | 2010-03-25 |
20100075506 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT MANUFACTURED BY THE METHOD - An apparatus for manufacturing a semiconductor element includes processing chambers arranged to accommodate a flexible substrate which is step-transferred by one effective region each time; a first electrode and a second electrode which are provided in the processing chamber; and a mask portion having an opening so as to expose the effective region when each effective region of the flexible substrate is transferred between the first electrode and the second electrode. Each processing chamber includes a plasma processing portion arranged to perform plasma processing on an effective region of the flexible substrate which is exposed from the opening of the mask portion, a first standby portion which overlaps a carry-in side of the mask portion, and in which an effective region of the flexible substrate prior to the plasma processing is positioned, and a second standby portion which overlaps a carry-out side of the mask portion, and in which an effective region of the flexible substrate after the plasma process is positioned. | 2010-03-25 |
20100075507 | Method of Fabricating a Gate Dielectric for High-K Metal Gate Devices - The present disclosure provides a method of fabricating a semiconductor device. The method includes providing a substrate, forming an interfacial layer on the substrate by treating the substrate with radicals, and forming a high-k dielectric layer on the interfacial layer. The radicals are selected from the group consisting of hydrous radicals, nitrogen/hydrogen radicals, and sulfur/hydrogen radicals. | 2010-03-25 |
20100075508 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A dielectric insulating film including HfO or the like is formed by: cleaning a surface of a semiconductor substrate by exposing the substrate surface to a fluorine radical; performing hydrogen termination processing with a fluorine radical or a hydride (SiH | 2010-03-25 |
20100075509 | MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE - A manufacturing method for a semiconductor device, including: loading a wafer into a reaction chamber; placing the wafer on a push-up shaft moved up; preheating the wafer under controlling an in-plane temperature distribution of the wafer to be a recess state under a state of placing the wafer on the push-up shaft moved up; lowering the push-up shaft with the wafer kept in the recess state to hold the wafer on a wafer holding member; heating the wafer to a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer. | 2010-03-25 |
20100075510 | Method for Pulsed plasma deposition of titanium dioxide film - A method for pulsed plasma deposition of titanium dioxide film is revealed. The method includes the steps of: (1) set a substrate into a chamber and the chamber is pumped down to a certain vacuum level. (2) Introduce titanium tetraisopropoxide gas and gas containing oxygen into the chamber and a RF (radio frequency) pulse power supply is turned on to create a glow discharge for generating pulsed plasma. (3) A layer of titanium dioxide film is deposited on the substrate by the pulsed plasma. The TiO | 2010-03-25 |
20100075511 | VELCRO CONNECTOR - The present invention relates to a velcro connector, which uses a hook of a velcro tape attached to a garment, etc. and a loop to transfer electric signals by being electrically connected upon coupling the hook and the loop. With the present invention, the difficulty of the line connection upon implementing electronic circuits on a garment can be solved by providing an integrated connector rather than separately mounting a mechanical connector on a garment. Therefore, it makes it possible to easily implement a wearable computer by using an integrated connector on a garment, etc. In addition, a plurality of electronic circuits mounted on a garment, etc. and the existing electronic devices are freely connected to each other by providing the connector that can be easily separated and coupled, thereby making it possible to increase user convenience. | 2010-03-25 |
20100075512 | ROTATABLE CONNECTOR - A rotatable connector includes a first rotating member, a second rotating member rotatable relative to the first rotating member, at least one conductive connecting member sandwiched between the first rotating member and the second rotating member, and a shaft. The first rotating member includes a first rotating body and a first flexible printed circuit board fixed to the first rotating body. The first rotating body includes at least one conductive portion electrically connected to the first flexible printed circuit board. The second rotating member includes a second rotating body and a second flexible printed circuit board fixed to the second rotating body. The second rotating body includes at least one conductive protrusion. The at least one conductive connecting member electrically connects the least one conductive protrusion to the at least one conductive portion. The shaft extends through the first rotating body, the second rotating body and the second flexible printed circuit board. | 2010-03-25 |
20100075513 | ORIENTATIONLESS SPRING PROBE RECEPTACLE ASSEMBLY - An electrical connector assembly for establishing an electrical connection (for signal or current transfer) between two circuits or wiring assemblies. | 2010-03-25 |
20100075514 | Method of making electrical connector on a flexible carrier - A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive layers and holes through the substrate. The first and second conductive layers are adhered to opposite sides of the flexible substrate and have a plurality of raised contact elements in registration with at least a subset of the holes. At least some contact elements on the first and second conductive layers that oppose each other are in electrical communication with one another by way of the plating. | 2010-03-25 |
20100075515 | Electrical Connector - An electrical connector capable of being connected with a FPCB and a PCB stably, includes an insulating housing defining a receiving space at a top portion thereof. A plurality of terminals is received in the insulating housing and each terminal has a contacting portion projecting into the receiving space for being connected with the FPCB. A reinforcement board is received in the receiving space for being fastened together with the FPCB. A slide cover slidably covers on the insulating housing and presses against the reinforcement board. When the electrical connector is soldered to the PCB, the FPCB is electrically connected with the PCB stably for the slider cover pressing against the reinforcement board to make the FPCB connected with the terminals steadily. | 2010-03-25 |
20100075516 | Hermaphroditic Electrical Connector - An electrical connector assembly is provided having first and second electrical connectors configured for mating. Each connector includes a housing that supports a plurality of electrical contacts. The contacts are arranged in first and second rows, and define a first terminal end extending from the housing and configured to connect with an electrical component, and a second hermaphroditic terminal end extending from the housing. | 2010-03-25 |
20100075517 | Flash Drive With Spring-Loaded Swivel Connector - A swivel-type computer peripheral device includes a housing and a swivel rack assembly that swivels relative to the housing between a retracted position, in which a PCBA having a plug connector mounted on the swivel rack assembly is disposed inside the housing, and a deployed position, in which the swivel rack assembly is rotated outside of the housing such that the plug connector is positioned for insertion into a host computer socket. A torsion spring is connected between the housing and the swivel rack assembly and arranged to bias the swivel rack assembly either into the deployed position or into the retracted position. A locking mechanism controlled by a push button or another actuating mechanism is used to selectively lock the swinging rack in a retracted position and a deployed position. | 2010-03-25 |
20100075518 | POWER CONNECTOR - A power connector includes a socket, an insulating member, a handle, a plug, and a blocking plate mounted between the handle and the insulating member to limit movement of the insulating member. The insulating member is received in the socket and includes a first through hole extending therethrough and an opening communicating with the first through hole. The handle includes a second through hole for receiving a part of the insulating member and with a diameter thereof being less than an outer diameter of the part of the insulating member so that the insulating member can rotate with the handle. The plug includes an end portion and an inserting portion received in the first through hole. Rotation of the handle with the insulating member relative to the socket either allows or disallows an electrical connection to be established between the socket and the inserting portion via the opening. | 2010-03-25 |
20100075519 | CARD FIXING MODULE - A card fixing module for fixing a card is provided. The card fixing module comprises a housing, a card holder and an elastic element. The housing comprises an opening and a through hole, wherein the through hole corresponds to the opening. The card holder comprises a body portion, an abutting portion and a post, wherein the abutting portion is connected to the body portion, the post is connected to the body portion, the post passes through the through hole, the card holder is moved between a first position and a second position, and wherein when the card holder is in the first position, the abutting portion abuts the housing, and the card is received in the housing. The elastic element is telescoped on the post, an end of the elastic element contacts the housing, and the other end of the elastic element contacts the body portion, wherein the elastic element applies an elastic force to the card holder to move the card holder from the first position to the second position to push the card out of the opening. | 2010-03-25 |
20100075520 | Separable Insulated Connector System - Separable insulated connector systems for power distribution systems wherein the interfaces of the mating connectors are modified to reduce mating and separation force. | 2010-03-25 |
20100075521 | CONDUCTIVE DEVICE FOR COLD CATHODE FLUORESCENT LAMP - A conductive device for electrically connecting to a conductive element of at least one cold cathode fluorescent lamp (CCFL) includes at least one coupling terminal and at least one extended conductive segment. The coupling terminal is in the form of an elongated column structure and provided with an insertion bore for receiving the conductive element of the CCFL therein. The extended conductive segment is provided along outer and inner longitudinal edges with a plurality of spaced pairs of upward projected conductive clips. The conductive clips in each pair can hold one coupling terminal therein while the conductive element of the CCFL is received in the insertion bore of the coupling terminal, so that the CCFL conductive device is associated with the CCFL. When a high voltage is applied to the CCFL via the conductive device, discharge occurs in the CCFL to emit light. | 2010-03-25 |
20100075522 | WATERPROOF DEVICE AND A WATERPROOF DEVICE PRODUCING METHOD - A terminal fitting ( | 2010-03-25 |
20100075523 | RESILIENT PLUG AND A WATERPROOF CONNECTOR - A waterproof connector ( | 2010-03-25 |
20100075524 | ELECTRICAL CONNECTOR COMPRISING A MAT SEAL - The electrical connector includes an insulative housing having a rear skirt extending rearward with respect to the rear face of the insulative housing, a mat seal disposed in the rear skirt against the rear face, a rear grid, disposed in the rear skirt, against the mat seal. The electrical connector includes a mobile part, a guide rail that is transverse to the front-rear direction (XX′), for transversally guiding the mobile part, and a ramp system such that, when the mobile part is guided by the guide rail, the ramp system pushes the rear grid against the mat seal so as to compress the mat seal. | 2010-03-25 |
20100075525 | Card Mounting Apparatus - A card mounting apparatus | 2010-03-25 |
20100075526 | ELECTRONIC DEVICE ASSEMBLY - An electronic device assembly includes an electronic device and a mini connector. The electronic device includes a first housing. The first housing includes an assembling opening, a first positioning portion located adjacent to the assembling opening, and a first connecting terminal set located in the assembling opening. The mini connector includes a second housing, a connecting wire, and a second connecting terminal set. The second housing includes a second positioning portion having a shape complementary to that of the first positioning portion. The connecting wire passing through the second housing is electrically connected to the second connecting terminal set located in the second housing. The second positioning portion is located at one side of the second connecting terminal set. With the complementary relationship between the shapes of the second positioning portion and the first positioning portion, the mini connector is configured to be connected only to the electronic device. | 2010-03-25 |
20100075527 | CONNECTOR ASSEMBLY FOR CONNECTING AN ELECTRICAL LEAD TO AN ELECTRODE - A connector assembly is provided for connecting an electrical lead to the electrical contact of an electrode. The connector assembly includes a retention plate having an opening configured to receive the electrical contact of the electrode therethrough such that the retention plate is held on the electrode, and a housing including a body and a receptacle extending into the body. The receptacle includes a size and shape that is complimentarily to the electrical contact of the electrode such that the receptacle is configured to receive at least a portion of the electrical contact therein. The receptacle is configured such that when the electrical contact is received within the receptacle, the receptacle is configured to hold a portion of the electrical lead within the receptacle between the electrical contact and the body of the housing such that the electrical lead is engaged with and electrically connected to the electrical contact. A connection member is configured to hold the housing on the retention plate. | 2010-03-25 |
20100075528 | CABLE CONNECTOR - A cable connector includes an electrical contact configured to receive a cable at one end, and an electrical component at another end. The contact can be constructed as a one-piece contact body or a two-piece contact body, and the contact body can include a cable lock that assists in retaining the cable in the contact body. | 2010-03-25 |
20100075529 | TERMINAL ASSEMBLY AND FLAT CABLE CONNECTOR - A connector for connecting together two ends of flat flexible cable includes a base member and a cover member. The base member has a plurality of slots that receive a corresponding number of conductive terminals. The terminals have two upward bends in them near their midpoint and these bends are spaced apart longitudinally along the terminals so as to mate with exposed ends of the lengths of flat cable. Two projections serve as press arms to retain a cover in place upon the base member. The cover exerts a pressure on the cable ends and the terminals to provide a reliable electrical contact between them. | 2010-03-25 |
20100075530 | TERMINAL STRIP - The invention relates to a terminal strip ( | 2010-03-25 |
20100075531 | ELECTRICAL CONNECTOR ARRANGEMENT FOR FLAT CONDUCTORS - A connector arrangement connects the flat conductors that extend upwardly from a horizontal photovoltaic cell panel with the insulated conductors of a cable via the circuits of a printed circuit board, respectively. A flat conductor support member is adhesively secured to the upper surface of the horizontal photovoltaic cell panel and includes upwardly extending bridge portions having flat upper edges about which are reversely bent the upper free ends of the flat conductors. A hollow sectional connector housing includes a lower body section containing a bottom opening that receives the flat conductor support member when the lower body section is seated on the panel upper surface. Bifurcated resilient contacts mounted on the lower section have first portions that engage the bent flat conductor ends, respectively, and second portions that engage the circuits on a replaceable printed circuit board carried by the removable upper cover section of the housing. | 2010-03-25 |
20100075532 | Fluorescent Marker for Detecting Gel or Lack of Gel - A conductive composition having a transparent and colorless appearance under normal or ambient lighting and at least a dyed, translucent or fluorescent appearance under artificial lighting is provided. The composition includes a photo-reactive quantity of a dye-marker. | 2010-03-25 |
20100075533 | RANDOMLY-ACCESSIBLE ELECTRICAL BUSBAR WITH PROTECTIVE COVER AND ASSOCIATED MATING CONNECTOR - Apparatus and systems described herein provide for a randomly-accessible electrical busbar with a protective cover and an associated mating connector. Both the busbar and the associated mating connector have multiple, electrically conductive bristles protruding from a surface. The busbar is protected by a nonconductive fabric cover to reduce the risk of a person from accidentally contacting the electrically conductive bristles. A connection is made between the mating connector and the busbar by the bristles of the mating connector penetrating the protective fabric cover and interdigitating with the bristles of the busbar. | 2010-03-25 |
20100075534 | PICK AND PLACE SUPPORT CLIP FOR COMPONENTS WITH COMPLEX GEOMETRIES AND METHOD THEREOF - A component assembly ( | 2010-03-25 |
20100075535 | CONNECTOR - A connector ( | 2010-03-25 |
20100075536 | Floating Connector - A floating connector is provides that enables impedance matching in the entire contact without hindrance of the movement of a movable housing. The floating connector includes a contact, a movable housing, a fixed housing, and an impedance adjusting member. The contact includes a contact portion to be mated with a mating contact, a board connecting portion to be connected to a circuit board, and a flexible coupling portion that is flexible and that couples the contact portion and the board connecting portion. The movable housing receives the contact portion of the contact therein, while the fixed housing secures the board connecting portion of the contact thereto. The movable housing is stacked over the fixed housing, with each being spaced apart from each other by a given distance. The impedance adjusting member is arranged and receives the coupling portion. The flexible coupling portion is formed in such a way to have an S-shape. The flexible coupling portion includes a first curved portion, a second curved portion, and a linear coupling portion. The second curved portion bends in a reversed direction from a direction that the first curved portion bends, while the linear coupling portion connects the first curved portion and the second curved portion. | 2010-03-25 |
20100075537 | CONNECTOR FOR TERMINATING A RIBBON CABLE - A connector is provided for terminating a ribbon cable having a plurality of electrical leads. Each electrical lead includes a mating portion. The connector includes a housing having a wall and a cavity. The housing is configured to hold the mating portion of each electrical lead within the cavity. The housing includes a hole extending through the wall of the housing and communicating with the cavity. The hole exposes the mating portion of at least one electrical lead through the wall. | 2010-03-25 |
20100075538 | ELECTRICAL CONNECTOR - An electrical connector for connecting a circuit board includes a plurality of blades; a plurality of terminals disposed on each of the blades and extending in parallel to each other; and a holding member for holding the blades next to each other to be situated on a same plane. Further, each of the blades includes a base member, and the terminals are integrated with the base member. | 2010-03-25 |
20100075539 | ELECTRICAL CONNECTOR AND THE TERMINAL THEREOF - An electrical connector is disclosed, which is configured with an insulating frame for carrying a speaker while arranging terminals at two sides of the insulating frame. Each of the terminals further comprises a vertical-extending fixing part for holding securely on the insulating frame, and a movable part connected to the fixing part while parallel-extending from the same. With the aforesaid structure, as the terminals only occupy a small space available on the insulating frame comparing with those conventional connectors, the electrical connector of the invention is able to carry a speaker with larger magnet so that the aforesaid electrical connector is preferred as it can, in a way, enhance the electrical performance of the speaker. | 2010-03-25 |
20100075540 | Socket assembly - A socket assembly includes a socket body, a connecting wire, and an electrical connector. The socket body has at least one socket unit and a connector receiving groove. One end of the connecting wire extends to the inside of the socket body and the other end of the connecting wire connects the electrical connector. The connecting wire can be routed around the fringe of the socket body, and the electrical connector can be stored in the connector receiving groove. Thereby, the connecting wire and the electrical connector can be stored inside the socket body when they are not used. Thus, the connecting wire and the electrical connector are convenient to use. | 2010-03-25 |
20100075541 | RELAY CONNECTOR FOR FLEXIBLE CABLES - A connector ( | 2010-03-25 |
20100075542 | Electrical connector - An electrical connector includes an insulating housing, a plurality of terminals fixed in the insulating housing and a shell mated with the insulating housing. The insulating housing has a base portion and a mating portion extending from a front surface of the base portion. The mating portion defines a plurality of terminal grooves penetrating through a rear surface of the base portion. Each terminal has a fixed portion received in the corresponding terminal groove and two shoulder portions respectively projecting sideward from two opposite sides of one end of the fixed portion. The base portion defines a receiving trough communicate rear ends of the terminal grooves and outside of the base portion for receiving the shoulder portions. Thus, the terminals can be assembled to the insulating housing conveniently and rapidly during using a tool to push the shoulder portions to insert the terminals into the terminal grooves. | 2010-03-25 |
20100075543 | SYMMETRICAL ELECTRIC CONTACT - For the transmission of high-frequency signals >2,5 GHz or 5 Gbps by means of a separable plug connection, the invention proposes a symmetrically shaped electric contact ( | 2010-03-25 |
20100075544 | Electrical connector assembly with improved connecting means for grounding - An electrical connector assembly ( | 2010-03-25 |
20100075545 | CONTACT FOR ELECTRICAL CONNECTOR - The present invention relates to contact, including a mating end for mating to two or more contacts and a conductive section. The conductive section includes a crimping end which is adapted to receive an electrical conductor and for being crimped thereto and a shaft section which extends between the crimping end and the mating end and includes two legs. | 2010-03-25 |
20100075546 | Retainer, Lay-in Lug Assembly Nut Plate Retainer - The present invention relates generally to a lay-in lug nut plate retainer. More particularly, the invention encompasses a nut plate retainer for a lay-in lug assembly nut plate. The present invention is also directed to a novel lay-in nut plate retainer which provides an alternative way to secure a nut plate to a lay-in lug body during shipping and/or the installation process. The inventive nut plate retainer has a cover with an open area and at least two legs to surround a portion of the lay-in lug and the nut plate. | 2010-03-25 |
20100075547 | HOLDING DEVICE FOR PROBE CONNECTOR - A holding device adapted for holding a probe connector includes a holding portion. The holding portion includes a substantially cylinder-shaped sidewall. A recess is surrounded by the sidewall and extends along an axial direction of the holding portion. At least one pair of outlets adjacent to each other is defined in the sidewall and extends along the axial direction of the holding portion to pass through an end of the sidewall. A cantilever arm is formed between the pair of outlets. A hook is defined in substantially a free end of an inner surface of the cantilever arm. The holding device defines at least one pair of outlets in the holding portion, the air in the recess of the holding portion can be exhausted through the outlets when the holding device holding the probe connector, which prevents the probe connector being pushed out from the holding portion by the inflated air in the recess. | 2010-03-25 |
20100075548 | COMPLIANT PIN FOR RETAINING AND ELECTRICALLY CONNECTING A SHIELD WITH A CONNECTOR ASSEMBLY - A compliant pin is configured to be press-fit into a cavity of at least one of a connector assembly and a substrate to retain the pin in the cavity. The pin includes a neck, a plurality of compliant beams, and an insertion tip. The neck interconnects the pin with the connector assembly. The beams are configured to engage an inner surface of the cavity to retain the pin in the cavity. The beams are arranged side-to-side and project along a longitudinal plane in a loading direction. The beams have arcuate portions that are arched in different directions transverse to the longitudinal plane. The arcuate portions are shaped to deflect toward the longitudinal plane without substantially engaging one another. The insertion tip interconnects the ends of the beams. | 2010-03-25 |
20100075549 | TERMINATION CAP FOR TERMINATING AN ELECTRICAL LEAD TO A STUD OF AN ELECTRODE AND AN ELECTRODE LEAD ASSEMBLY CONTAINING SUCH TERMINATION CAP - A termination cap is provided for terminating an electrical lead to a stud of an electrode. The termination cap includes a body and a receptacle extending into the body. The receptacle includes a size and shape that is complimentary to the stud of the electrode such that the receptacle is configured to receive at least a portion of the stud therein. The receptacle is configured such that when the stud is received within the receptacle, the receptacle is configured to hold a portion of the electrical lead between the body and the stud such that the electrical lead is engaged with and electrically connected to the stud. | 2010-03-25 |
20100075550 | MANUALLY OPERATED WATERCRAFT - A personal watercraft ( | 2010-03-25 |
20100075551 | WATER JET PROPULSION WATERCRAFT - A water jet propulsion watercraft includes a main engine body, a rotor chamber disposed at a rear portion of the main engine body, a crankshaft disposed so as to extend penetratingly through the rotor chamber such that a rear end portion thereof protrudes to an outer side of the rotor chamber, a rotor unit coupled to the crankshaft inside the rotor chamber, a drive shaft connected to the rear end portion of the crankshaft and rotated together with the crankshaft, and a jet propulsion unit, having an impeller that is coupled to the drive shaft, and arranged to suck in and jet out water. The crankshaft includes a flange portion that is integral with the crankshaft inside the rotor chamber. The rotor unit is fixed to the flange portion. | 2010-03-25 |
20100075552 | MARINE PROPULSION AND CONSTRUCTIONAL DETAILS THEREOF - A propeller ( | 2010-03-25 |
20100075553 | LINE CUTTER - A line cutter | 2010-03-25 |
20100075554 | SWIM FINS - Swim fins that attach to the legs of a swimmer to aid movement through the water. In one example embodiment, a swim fin includes an upper support frame, a lower support frame, a lower blade attached to the lower support frame, and at least one hinge assembly connecting the upper support frame to the lower support frame. The upper support is configured to be generally positioned along and attached to the front of a swimmer's lower leg between the swimmer's knee and ankle The lower support frame is configured to extend, in a swimming position, from a position proximate the swimmer's ankle to a position beyond the end of the swimmer's foot. The at least one hinge assembly allows the lower support frame to be rotated upward from the swimming position to a walking position. The walking position enables the swimmer to walk barefoot on a surface without the lower support frame nor the lower blade substantially contacting the surface. | 2010-03-25 |
20100075555 | Surfboard having maneuvering structure and pressure dispersion plate - A surfboard includes a board member for supporting a user and having two depressions formed in the rear portion and the upper portion of the board member and inclined rearwardly from a front end toward a rear end, and having a swelling formed between the depressions of the board member, and a performance enhancing device is formed in an outer side portion of each of the depressions of the board member for enhancing performance and higher directional control, increasing power when exiting a turn and the ability to hold its place higher upon the wave face, reducing sideslip, thereby allowing the board member to be effectively maneuvered or controlled by the user. | 2010-03-25 |
20100075556 | Buoyant Cushion - The present invention relates generally to buoyant cushions for use in a pool and being adaptable for use as outdoor furniture or in cooperation with outdoor furniture. The physical properties of the buoyant cushion having physical properties that include buoyancy, weather-resistance, and malleability that allow the buoyant cushion to be used dually as a lounging floatation device, in bodies of water such as pools, lakes, or the ocean, and as a cushion adapted to compliment outdoor furniture or to be used independently. | 2010-03-25 |
20100075557 | WOVEN FABRIC - A woven fabric is provided that incorporates multiple systems of fibers into a unitary fabric and presents the fibers of only one of the warp systems on a first surface of the fabric. The fabric structure comprises first, second, and third warp systems that are interlaced with weft fibers such that, of the three warp systems, the first surface of the fabric comprises only the first warp system and thus “hides” the second and third warp systems, which are not interwoven with the fibers of the first warp system. In this way, the effect of the appearance of the second and third warp systems on the overall appearance of the fabric is reduced. The three warp systems may include fibers made of different materials to provide different characteristics to each layer of the fabric, or the warp systems may include fibers made of the same material. | 2010-03-25 |
20100075558 | MULTILAYER LAMINATED MATERIAL WITH INHERENTLY LATENT PROTECTION AGAINST DEFORMATION UNDER THERMAL ACTION FOR COMPENSATING THE BIMETALLIC EFFECT - A solvent-free multilayer laminated material comprises a lower substrate layer comprising a thermoplastic polymer or a mixture of thermoplastic polymers, an intermediate layer arranged thereon and comprising a flexible material, a further fibrous intermediate layer comprising plastic, which is provided with an adhesive material and an upper layer comprising metal, comprising plastic or comprising wood or wood-like materials. It does surprisingly not show any deformation even under exposure to temperatures of about 80° C. over a period of up to 40 days and can be used for the production of articles of furniture, floor coverings, wall panels or shaped articles for the electrical, construction or automotive industry. | 2010-03-25 |
20100075559 | SYNTHETIC RESIN LEATHER - The present invention provides a novel and improved synthetic resin leather comprising a substrate and a synthetic resin layer, wherein it has reduced difference of elongations between in a longitudinal direction and in a transverse direction, desirable thickness, no melting during combustion and excellent feelings and good flame retardant property, which is suitable for use in general applications such as interior finishing materials and/or seats for automobile. More particularly, with respect of the leather of the present invention comprising a substrate | 2010-03-25 |
20100075560 | Ligand Graft Functionalized Substrates - Polyethyleneimine and polyalkylene biguanide ligand functionalized substrates, methods of making ligand functionalized substrates, and methods of using functionalized substrates are disclosed. | 2010-03-25 |
20100075561 | FRAGRANCE EMITTING PATCH - A fragrance emitting patch including a primary porous layer having a top and a bottom surface, a secondary layer having a top and a bottom surface, a construction adhesive arranged between the primary layer and the secondary layer for securing the primary and secondary layers to one another, the primary layer being provided with a fragrance, and an absolute difference of a Hildebrand solubility parameter of the construction adhesive and the Hildebrand solubility parameter of the fragrance is greater than 1.5. | 2010-03-25 |
20100075562 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR REPAIRING LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - A thin film transistor (TFT) array panel, a liquid crystal display (LCD), and a method of repairing a TFT array panel with a defective pixel is disclosed. When a white defect occurs such that a pixel is always in a white state, a corresponding pixel electrode is supplied with the predetermined voltage applied to a corresponding storage electrode line so that the pixel becomes permanently dark, which may not be easily detected. The connection between the pixel electrode and the storage electrode line is provided by illuminating a laser beam from a common electrode panel through a contact hole in the TFT array panel to electrically couple the storage electrode and the pixel electrode. Advantageously, a backlight unit or chassis does not need to be separated or disassembled from the LCD when repairing the defect. Furthermore, the color filter stripes and the light blocking member are not damaged, thereby improving the reliability of the repair. | 2010-03-25 |
20100075563 | METHOD OF MANUFACTURING FLAT-PANEL DISPLAY DEVICE, APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY DEVICE, AND FLAT-PANEL DISPLAY DEVICE - Disclosed is a method of manufacturing a flat-panel display device, includes: laminating a thermosetting resin film on a sealing substrate; stacking the sealing substrate having the thermosetting resin film laminated thereon, and an element substrate having a light-emitting element together under a vacuum atmosphere with the thermosetting resin film and the light-emitting element facing inwardly, and with a frame-shaped sealing material around the thermosetting resin film interposed between the two substrates; joining the sealing substrate and the element substrate together under a vacuum atmosphere by the sealing material situated between the sealing substrate and the element substrate stacked together; and heat-curing the thermosetting resin film situated between the sealing substrate and the element substrate stacked together, under an air atmosphere. | 2010-03-25 |
20100075564 | DISPLAY PANEL ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A display panel assembly includes a first substrate having an effective display region for displaying an image and a non-effective display region positioned at a peripheral region outside of the effective display region, a second substrate facing the first substrate, a sealing member disposed along a boundary between the effective display region and the non-effective display region between the first and second substrates, the sealing member including a thermosetting material, and an exothermic member interposed between the sealing member and the first substrate to generate heat for curing the sealing member. | 2010-03-25 |
20100075565 | COMBINATION PLAY SET AND EXCERCISING STATION - A combination play set and exercise station having a base supported by a ground support surface. A platform is disposed above and supported by the base while at least one swing support is attached to and extends outwardly from the platform. At least one hook is attached to the base, platform, or swing support and an exercise strap is engageable with the hook to perform at least one exercise routine. | 2010-03-25 |
20100075566 | SELF-STORING TOY KIT - A self-storing toy kit having a container that serves as the main body of the toy and adorning inserts that are secured to the main body. The main body has a plurality of walls that define an interior storage compartment for holding the adorning inserts. The walls have narrow slits on its exterior surface for receiving adorning inserts. The adorning inserts are dimensioned to fit tightly within the slits of the main body to ensure secure retention of the adorning inserts. The adorning inserts have a distal end that is resilient and a body that is flexible to allow the adorning inserts to cantilever from the slits. The main body has closing means for the interior storage compartment. The compartment allows for storage of the adorning inserts within the main body and eliminates the need for a separate carrying case for the adorning inserts. | 2010-03-25 |
20100075567 | MAGNETIC BLOCK TOY - The present invention relates to a magnetic block toy that is provided with a body part having at least two or more end portions and with a magnet-mounting part adapted to mount magnets having different polarities on the upper and lower surfaces thereof in such a manner as to be rotatably supported by means of a shaft formed on the both sides of the outer periphery thereof to each end portion of the body part, so that when the magnetic block approaches another magnetic block, the magnets are rotated to cause the magnetic blocks to be coupled to each other irrespective of the coupling direction, and once the magnetic blocks are coupled to each other, they are not slid against and separated from each other. | 2010-03-25 |
20100075568 | CHILD SEAT ATTACHMENT - A child seat attachment that can be releasably attached to a child seat handle side bar having a narrow portion and a wider portion using one hand, and removed with one hand. The child seat attachment provides visual, audible, and/or tactile stimulation for the child. The child seat attachment includes a bracket portion and a child amusement device coupled to the bracket portion. The coupling between the bracket portion and the child amusement device may be releasable, extendable, and/or articulatible. The bracket portion includes a panel coupled to a pair of opposed, spaced apart wings that may include multiple webs, including arcuate webs. The wings are spaced apart a distance greater than the width of the narrow portion of the child seat handle side bar and less than the width of the wider portion of the child seat handle side bar. | 2010-03-25 |