11th week of 2011 patent applcation highlights part 14 |
Patent application number | Title | Published |
20110062573 | Double-side mountable MEMS package - The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate. | 2011-03-17 |
20110062574 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exposed interconnect to the base substrate, a portion of the exposed interconnect having the buffer layer attached thereon, mounting a base component over the base substrate, forming a base encapsulation over the base substrate and the exposed interconnect using the encapsulation system; and releasing the encapsulation system providing the portion of the exposed interconnect exposed from the base encapsulation, the exposed interconnect having characteristics of the buffer layer removed. | 2011-03-17 |
20110062575 | Semiconductor Device and Method of Forming Cavity in PCB Containing Encapsulant or Dummy Die Having CTE Similar to CTE of Large Array WLCSP - A semiconductor device has a PCB with a cavity formed in a first surface of the PCB. A stress compensating structure, such as an encapsulant or dummy die, is disposed in the cavity. An insulating layer is formed over the PCB and stress compensating structure. A portion of the insulating layer is removed to expose the stress compensating structure. A conductive layer is formed over the stress compensating structure. A solder masking layer is formed over the conductive layer with openings to the conductive layer. A semiconductor package is mounted over the cavity. The semiconductor package is a large array WLCSP. Bumps electrically connect the semiconductor package and conductive layer. The semiconductor package is electrically connected to the conductive layer. The CTE of the stress compensating structure is selected substantially similar to or matching the CTE of the semiconductor package to reduce stress between the semiconductor package and PCB. | 2011-03-17 |
20110062576 | INTEGRATED CIRCUIT PACKAGE AND DEVICE - An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package. | 2011-03-17 |
20110062577 | SUBSTRATE AND PACKAGE WITH MICRO BGA CONFIGURATION - A substrate of a micro-BGA package is revealed, primarily comprising a substrate core, a first trace, and a second trace where the substrate core has a slot formed between a first board part and a second board part. The first trace is disposed on the first board part and has a suspended inner lead extended into the slot where the inner lead has an assumed broken point. The second trace is disposed on the second board part and is integrally connected to the inner lead at the assumed broken point. More particularly, a non-circular through hole is formed at the assumed broken point and has two symmetric V-notches away from each other and facing toward two opposing external sides of the inner lead so that the inner lead at two opposing external sides does not have the conventional V-notches cutting into the inner lead from outside. Moreover, the inner lead will not unexpectedly be broken and the inner lead can easily and accurately be broken at the assumed broken point during thermal compression processes. | 2011-03-17 |
20110062578 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip having a connection electrode on a surface side, and a resin substrate sealing a periphery of the semiconductor chip and formed to have a thickness from a back surface of the semiconductor chip to a lower side thereof, and the resin substrate whose lower surface is positioned to a lower side than the back surface of the semiconductor chip. A wiring layer is connected directly to the connection electrode of the semiconductor chip without the intervention of solder. | 2011-03-17 |
20110062579 | GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR FABRICATING - A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device. | 2011-03-17 |
20110062580 | PROTECTION LAYER FOR PREVENTING UBM LAYER FROM CHEMICAL ATTACK AND OXIDATION - A protection layer formed of a CuGe | 2011-03-17 |
20110062581 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate, a first semiconductor chip module attached to the substrate, a conductive connection member attached to the first semiconductor chip module, and a second semiconductor chip module attached to the conductive connection member. The first and second semiconductor chip modules are formed to have step like shapes to and extend laterally in opposite directions so as to define a zigzag arrangement together. | 2011-03-17 |
20110062582 | Display device - A display device includes a display panel, and a semiconductor chip having plural bump electrodes and mounted on a substrate constituting the display panel. The plural bump electrodes include a first bump electrode arranged in the vicinity of a center for a longitudinal direction of the semiconductor chip, and a second bump electrode arranged in the vicinity of an end portion in the longitudinal direction of the semiconductor chip. The semiconductor chip has one or more than one conductive layer inside. Assuming that a surface of the semiconductor chip having the bump electrodes formed thereon is a lower side, the number of the conductive layers formed on the second bump electrode is greater than the number of the conductive layers formed on the first bump electrode. The conductive layer formed on the first and the second bump electrode includes a dummy conductive layer. Further, the plural bump electrodes are electrically connected to a wiring layer formed on a substrate constituting the display panel through an anisotropic conductive film. | 2011-03-17 |
20110062583 | STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE - An assembly method is disclosed that includes providing a substrate, securing a first semiconductor device on a first surface thereof, and superimposing at least a second semiconductor device at least partially over the first semiconductor device. An outer peripheral portion of the second semiconductor device overhangs both the first semiconductor device and the substrate. Discrete conductive elements are placed between the outer peripheral portion of the second semiconductor device and a second surface of the substrate. Intermediate portions of the discrete conductive elements pass outside of a side surface of the substrate. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed. | 2011-03-17 |
20110062584 | THREE-DIMENSIONALLY INTEGRATED SEMICONDUTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate has, on each of opposite faces thereof, connection pad portions to which various circuit elements are connected, and wiring traces for connecting the connection pad portions. The wiring substrate also has a through wiring portion for establishing mutual connection between the connection pad portions and the wiring traces on the front face and those on the back face. A post electrode component is formed such that it includes a plurality of post electrodes supported by a support portion. A semiconductor chip is attached to the back face of the wiring substrate, and is connected to the connection pad portions on the back face. After the post electrode component is fixed to and electrically connected to the wiring traces at predetermined positions, and resin sealing is performed, the support portion is separated so as to expose end surfaces of the post electrodes or back face wiring traces connected thereto. Another circuit element is disposed on the front face of the wiring substrate, and is connected to the connection pad portions on the front face. | 2011-03-17 |
20110062585 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip, an electrode pad provided in the semiconductor chip, in which the electrode pad includes Al as a major constituent and further includes Cu, a coupling member coupled to the electrode pad, in which the coupling member primarily includes Cu, a plurality of layers of Cu and Al alloys formed between the electrode pad and the coupling member, and an encapsulating resin that includes a halogen of less than or equal to 1000 ppm, in which the encapsulating resin encapsulates the semiconductor chip, the electrode pad, and the coupling member. The plurality of layers of Cu and Al alloys includes a CuAl | 2011-03-17 |
20110062586 | Chip for Reliable Stacking on another Chip - A chip includes a device, a passivation layer, two dielectric layers, at least one upper redistribution layer, at least one lower redistribution layer, at least one tunnel, at least one conductor, a redistribution passivation layer and at least one solder ball. The device includes at least one pad. The tunnel is defined in the upper redistribution layer, the first dielectric layer, the passivation layer, the pad, the device, the chip, the second dielectric layer and the lower redistribution layer. The conductor is located in the tunnel and connected to the upper and lower redistribution layers. The redistribution passivation layer is located on the second dielectric layer, the lower redistribution layer and the conductor. The solder ball is located on a portion of the lower redistribution layer through an aperture defined in the redistribution passivation layer. The chip can be connected to a printed circuit board by the solder ball. | 2011-03-17 |
20110062587 | LARGE GRAIN SIZE CONDUCTIVE STRUCTURE FOR NARROW INTERCONNECT OPENINGS - An interconnect structure having reduced electrical resistance and a method of forming such an interconnect structure are provided. The interconnect structure includes a dielectric material including at least one opening therein. The at least one opening is filled with an optional barrier diffusion layer, a grain growth promotion layer, an agglomerated plating seed layer, an optional second plating seed layer a conductive structure. The conductive structure which includes a metal-containing conductive material, typically Cu, has a bamboo microstructure and an average grain size of larger than 0.05 microns. In some embodiments, the conductive structure includes conductive grains that have a (111) crystal orientation. | 2011-03-17 |
20110062588 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device includes: a trench formed on an interlayer insulating film on a semiconductor substrate; a first barrier metal film formed to cover the bottom and sidewalls of the trench, the first barrier metal film being comprised of an electric conductor containing a platinum-group element, a refractory metal, and nitrogen; and a metal film formed on the first barrier metal film in the trench. The amount of nitrogen decreases in the thickness direction of the first barrier metal film toward the metal film. | 2011-03-17 |
20110062589 | SEMICONDUCTOR DEVICE HAVING COPPER WIRING WITH INCREASED MIGRATION RESISTANCE - A semiconductor device has: a semiconductor substrate formed with a plurality of semiconductor elements, a plurality of interlevel insulating films laminated above the semiconductor substrate, including a first and a second interlevel insulating films adjacent to each other; a first wiring trench formed in the first interlevel insulating film; and a first damascene wiring including: a first barrier metal film having a diffusion preventive function, formed covering inner surface of the first wiring trench and defining a first main wiring trench; and a first main wiring layer filling the first main wiring trench, formed of first metal element, and added with second metal element having migration suppressing function, at spatially different concentration. | 2011-03-17 |
20110062590 | Chip Stacking Device Having Re-Distribution Layer - A chip stacking device uses nano particle silver paste for re-distribution interconnection to form a structure having low resistance through trench filling or printing. Thus, due to its low resistance, it can effectively reduce the electrical instability due to voltage drop after current flows. Furthermore, power consumption is reduced too, with energy saved. With its stable electrical signal, its utilization scope can be further expanded to high frequency product. | 2011-03-17 |
20110062591 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation. | 2011-03-17 |
20110062592 | Delamination Resistance of Stacked Dies in Die Saw - An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding compound including a portion over the first die and the second die. The molding compound contacts the surface of the second die. Further, the molding compound includes a portion extending below the surface of the second die. | 2011-03-17 |
20110062593 | SEMICONDUCTOR PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE - A semiconductor packaging substrate with a plurality of pads arranged in a square grid pattern thereon, in which among the pads, two pads obliquely adjacent to each other are connected with through-holes respectively and another through-hole is provided between the through-holes connected with the two pads obliquely adjacent to each other. | 2011-03-17 |
20110062594 | THROUGH HOLE ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING THE THROUGH HOLE ELECTRODE SUBSTRATE, AND SEMICONDUCTOR DEVICE USING THE THROUGH HOLE ELECTRODE SUBSTRATE - To provide a through hole electrode substrate and a semiconductor device which uses the through hole electrode substrate which have improved electrical properties in a conductive part which passes through the front and back of a substrate, a through hole electrode substrate | 2011-03-17 |
20110062595 | PATTERN STRUCTURES IN SEMICONDUCTOR DEVICES - A pattern structure in a semiconductor device includes an extending line and a pad connected with an end portion of the extending line. The pad may have a width that is larger than a width of the extending line. The pad includes a protruding portion extending from a lateral portion of the pad. The pattern structure may be formed by simplified processes and may be employed in various semiconductor devices requiring minute patterns and pads. | 2011-03-17 |
20110062596 | SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME - A method of making a semiconductor chip stacked structure includes dicing a semiconductor wafer into semiconductor chips, the semiconductor chips respectively having a first surface and a second surface opposite thereto, the semiconductor chips having integrated circuits and pads on the first surfaces, arranging the semiconductor chips at intervals on a film having adhesive property, connecting the pads through joining members, sealing with resin the joining members and surfaces of the semiconductor chips excluding the second surfaces to produce a chip sealing structure, dividing the chip sealing structure to produce separate chip sealing structures having ends of the joining members exposed at surfaces thereof, removing the film to expose the second surfaces, stacking the chip sealing structures one over another and connecting the exposed ends of the joining members through a bonding wire to produce a chip stacked structure, and mounting the chip stacked structure on a wiring substrate. | 2011-03-17 |
20110062597 | PACKAGE STRUCTURES - A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die. | 2011-03-17 |
20110062598 | STACKED-DIE PACKAGE INCLUDING SUBSTRATE-GROUND COUPLING - Method and apparatus are provided for semiconductor device packages. In an example, an apparatus can include a first semiconductor device, a ground pad situated on an uppermost portion of the first semiconductor device and configured to electrically couple portions of the first semiconductor device to aground potential, and a second semiconductor device having at least a portion in electrical communication with an uppermost face of the first semiconductor device through a first electrically-conductive adhesive. In an example, the first electrically-conductive adhesive can be electrically coupled to the ground bond pad on the first semiconductor device. | 2011-03-17 |
20110062599 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base package substrate; mounting a flip chip integrated circuit die on the base package substrate; applying a flip chip protective layer on the flip chip integrated circuit die including covering only a back side of the flip chip integrated circuit die; and mounting an upper package on the base package substrate including positioning an upper package substrate adjacent to the flip chip protective layer. | 2011-03-17 |
20110062600 | SEMICONDUCTOR ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME - An object is to provide a semiconductor element module having high reliability, superior electric connection and thermal connection and capable of securing sufficient cooling performance, and also to provide a method for manufacturing the same. The semiconductor element module ( | 2011-03-17 |
20110062601 | GENERATING AN INTEGRATED CIRCUIT IDENTIFIER - The generation of a chip identifier supporting at least one integrated circuit, which includes providing a cutout of at least one conductive path by cutting the chip, the position of the cutting line relative to the chip conditioning the identifier. | 2011-03-17 |
20110062602 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; connecting a base component directly to the base substrate; mounting a stack component over the base component; attaching a flattened exposed interconnect directly on the stack component; and applying an encapsulant over the stack component with a portion of the flattened exposed interconnect exposed. | 2011-03-17 |
20110062603 | Encapsulation architectures for utilizing flexible barrier films - An article and method of using spacer layer regions is provided, containing a gas compound, to reduce gas permeation through barrier films overlying a substrate comprising creating a spacer layer between one or more of the barrier films, wherein the spacer layer comprises at least one inert gaseous compound. In another embodiment, an article and method is provided comprising creating alternating thin films of hybridized sol-gel spin-on glass and PDMS based and olefin based elastomers. | 2011-03-17 |
20110062604 | SCRATCH-RESISTANT COATINGS FOR PROTECTING FRONT-SIDE CIRCUITRY DURING BACKSIDE PROCESSING - Scratch-resistant coatings for protecting front-side microelectromechanical and semiconductor device features during backside processing are provided, along with methods of using the same. The coatings are non-photosensitive, removable, and tolerate high processing temperatures. These coatings also eliminate the need for a separate etch stop layer in the device design. The coatings are formed from a composition comprising a component dissolved or dispersed in a solvent system. The component is selected from the group consisting of styrene-acrylonitrile copolymers and aromatic sulfone polymers. | 2011-03-17 |
20110062605 | SPLASH SUPPRESSING DEVICE FOR WATER TANK - A splash suppressing device for a water tank is provided with a housing mounted inside a water tank, having a cavity therein, having an opening in a portion of the bottom side thereof which is submerged under water in the water tank, and having a closed upper side; a fixing member for fixing the housing to the inner wall of the water tank; an air stone mounted in the cavity of the housing; a connecting section provided to a part of the housing and connected to an air tube from an external air pump; and an air introducing path for interconnecting the connecting section and the air stone to allow flow of gas. The air introducing path can be easily replaced. | 2011-03-17 |
20110062606 | METHOD FOR PRODUCING ELEMENTS COMPRISING FIBER OPTICS, DEVICE FOR IMPLEMENTING SAID METHOD, OPTICAL FIBERS ELEMENT AND OPTICAL ARRANGEMENT COMPRISING SUCH AN ELEMENT - A method for producing an optical fiber element provided with several optical fibers disposed in a matrix, including: a) placing and maintaining the several optical fibers in grooves formed in a mould plate, said grooves being in different planes, b) injecting a hardenable material adhering to the several optical fibers, c) solidifying the hardenable material to maintain the several optical fibers in a position set by the grooves, and d) removing at least the mould plate. | 2011-03-17 |
20110062607 | METHODS, DEVICES, AND SYSTEMS FOR MOVING WET OPHTHALMIC LENSES DURING THEIR MANUFACTURE - Methods, devices, and systems for moving wet ophthalmic lenses are described in which the ophthalmic lenses are first placed in wells of lens carriers and are centered by the structure of the wells. The carriers are then moved to a transfer module of a packaging system for transferring the ophthalmic lenses in blister packages. The transfer from the carriers to the blister packages are performed by a pick and place robot having pickup heads sized and configured for suctioning the ophthalmic lenses from the lens carriers. | 2011-03-17 |
20110062608 | MULTI-PHASIC NANOPARTICLES - A method of forming mufti-phasic nano-objects involves the jetting of two or more different liquids in side-by-side capillaries thereby generating a composite liquid stream. The composite then exposed to a force field which causes the composite liquid stream to at least partially solidify into a nano-object. The method forms a nano-object having a number of morphologies such as rods, spheres, and fibers. | 2011-03-17 |
20110062609 | Methods of Making Orthodontic Appliances - Methods of making a removable dental positioning appliance include forming a sheet of transparent crystalline polymeric material into a shell having cavities shaped to receive and reposition teeth from a first orientation to a successive orientation. The polymeric material may then be annealed at a temperature above its glass transition temperature or cured if a curable material to enhance characteristics of the polymeric material. The polymeric material may be coated with a second transparent material. | 2011-03-17 |
20110062610 | EXTRUSION BLOW MOLDING METHOD FOR PLASTIC CONTAINERS, ESPECIALLY PLASTIC BOTTLES - An extrusion blow-molding method for plastic containers, for example, plastic bottles, is disclosed, wherein a one- or multi-layer plastic tube is extruded with a predetermined extrusion pressure through an annular gap, which is delimited by an extrusion die provided on an extrusion head and a axially adjustable mandrel and which can be adjusted with regard to the width thereof. The extruded plastic tube is introduced into a mold cavity of a blow-molding tool arrangement, blow-molded into a plastic container in accordance with the mold cavity by overpressure and then demolded. Additional plastic material is added in metered quantity to the extruded plastic tube at least in some regions in the direct vicinity of the mouth of the extrusion die. The additional plastic material is introduced through one or more discharge nozzles distributed across the circumference with a pressure that is higher than the extrusion pressure such that the plastic material is locally compressed and that, after passing the extrusion die, the plastic tube in the regions provided with the additional plastic material has a greater wall thickness than the remaining plastic tube. | 2011-03-17 |
20110062611 | METHOD AND APPARATUS FOR PROVIDING AN INTERNAL SURFACE TEMPERATURE PROFILE OF A THERMOPLASTIC PREFORM DURING A STRETCH BLOW MOULDING PROCESS - A method for providing an internal surface temperature profile of a thermoplastic preform ( | 2011-03-17 |
20110062612 | METHODS OF QUALITY CONTROL IN CONCRETE BLOCK PRODUCTION - The invention relates to a method of controlling the quality of blocks that are produced front face-up in a mold, and verifying the accuracy of the production of such blocks, to ensure that the blocks are manufactured with consistent quality and minimal block-to-block variability. Measurement locations are formed on the front faces of predetermined blocks. By measuring the distances between the measurement locations and the rear faces and comparing with a target distance, any variation provides an indication that the blocks are not being properly formed. The process variables, such as the alignment of the compression head and/or the pressure plates to the mold, can then be adjusted accordingly. | 2011-03-17 |
20110062613 | FOAM MOLDING MOLD AND FOAM MOLDING METHOD - A mold for foam molding which can sufficiently prevent burrs from being formed on a molded product, and a foam molding method using the mold are provided. A groove | 2011-03-17 |
20110062614 | MOLD AND METHOD FOR MOLDING RESIN FOAMED MOLDING - Provided is a mold which can be configured to be able to properly exhaust gas from a cavity and to prevent resin from entering into a vent hole, and a method for molding resin foamed molding using the mold. The mold | 2011-03-17 |
20110062615 | MALE SURFACE FASTENER MEMBER FOR USE IN A CUSHION BODY MOLD AND MANUFACTURING METHOD THEREOF - Various embodiments include a male surface fastener member configured for being molded onto a surface of a foaming resin mold body. The male surface fastener member includes a plurality of male surface fastener strips connected with each other in an end-to-end relationship via a connecting portion that is integrally formed with at least the end portions of each male surface fastener strips. Each male surface fastener strip includes a base material having a first surface from which a plurality of engaging elements extend upwardly and first and second substantially lateral resin intrusion prevention walls that upwardly from the first surface along a width direction of the base material between the first and second longitudinal resin intrusion prevention walls. Each of the lateral resin intrusion prevention walls comprises a plurality of engaging elements that are arranged in series in a width direction of the first surface. | 2011-03-17 |
20110062616 | TEST PAPER AND POROUS MEMBRANE - A test paper includes a porous membrane capable of separating an object that should be filtered out of a sample by filtration, the porous membrane carrying a reagent capable of reacting with a specified component of the sample to result in coloring. The porous membrane includes a first layer having a surface on which the sample is supplied and a second layer having a surface at which sample percolation and measuring are effected, the first layer composed of large pore portions, the surface of the first layer consisting of a smooth surface having open pore portions, the second layer composed of minute pore portions the surface of the second layer consisting of a surface having open pore portions. The porous membrane has a thickness of 50 to 200 μm and a porosity of 60 to 95%. | 2011-03-17 |
20110062617 | METHOD OF FIXATION FOR A MECHANICAL DOWELL - An anchoring method of anchoring an anchoring element in a construction object is provided, where a surface of which object has at least one of pores in a surface, structures in a surface(such as an arrangement of ridges with undercut), a inhomogeneous characteristic with makes the penetration of a surface by a liquid under pressure possible, thereby creating pores filed by the liquid underneath the surface, and of a cavity. The method includes the steps of: providing a first element and a second element, the first element comprising a thermoplastic material; positioning the first element in a vicinity of said surface and/or of said cavity, respectively, and positioning the second element in contact with the first element; and causing a third element to vibrate while loading the first element with a force, thereby applying mechanical vibrations to the first element, and simultaneously loading the first element with a counter-force by the second element. | 2011-03-17 |
20110062618 | Collapsible Nested Container - A collapsible container comprising detachable nested sections. The nested sections are tapered and coaxially disposed. Nested sections can be disposed within the largest section in its collapsed position. In its expanded position, the lower portion of a section engages with the top portion of the section immediately below the upper section to mechanically lock the sections into its expanded formation, such that the container is self supporting. The sections are detachable, and when overturned and removed, can be used as a mold for creating parts of a sand castle. The removed sections can be joined in sequence to other removed section to vary the volume of sand being molded. The sides of each section comprise decorative molding shapes or patterns for creating parts of a sand castle. The bottom surface of the mold further comprises mold shapes for creating part of a sand castle when overturned. | 2011-03-17 |
20110062619 | SILSESQUIOXANE DERIVED HARD, HYDROPHOBIC AND THERMALLY STABLE THIN FILMS AND COATINGS FOR TAILORABLE PROTECTIVE AND MULTI-STRUCTURED SURFACES AND INTERFACES - A method of forming a coating comprising the steps of dissolving an silsesquioxane (e.g., one that is primarily a cage compound with 8, 10, 12, 14 or related complete cages or with partially condensed cages containing primarily Si(O) | 2011-03-17 |
20110062620 | Process for Making a Pellet - The invention comprises a shaping process for making pellets of a thermoplastic extrudable resin composition. The resin composition comprises a thermoplastic polymer, plasticiser and optionally further additives. The plasticiser comprises a component which is solid at room temperature. The process is run at a temperature above the melting point of the plasticiser and below the melting/plastification temperature of the thermoplastic polymer. | 2011-03-17 |
20110062621 | APPARATUS FOR AND METHOD OF FORMING FOOD INTO DOUGHNUT SHAPE - The present invention is directed to provide an apparatus and method for forming food into doughnut shape that is capable of forming food into rings with a simple structure. The apparatus includes a supplying unit supplying a food material | 2011-03-17 |
20110062622 | Extruded Structure With Equilibrium Shape - An extrusion head is disposed over a substrate, and material is extruded through an oblique (e.g., semi-circular or tapered) outlet orifice of the extrusion head to form an associated extruded structure having an equilibrium shape that resists settling after being deposited on the substrate. The extrusion head includes fluidic channels having a flat surface formed by a flat first (e.g., metal) sheet, and an oblique (e.g., substantially semi-cylindrical) surface formed by elongated oblique trenches that are etched or otherwise formed in a second sheet. The fluidic channel communicates with the outlet orifice, which has a flat edge formed by the first sheet, and an oblique edge formed by an end of the oblique trench. The material is extruded through the outlet orifice such that its flat lower surface contacts the substrate, and its oblique upper surface faces away from the substrate. Two materials are co-extruded to form high aspect-ratio gridlines. | 2011-03-17 |
20110062623 | METHOD OF FORMING A PATTERN FORMATION TEMPLATE - According to one embodiment, a concavo-convex pattern of a first template where a concavo-convex main pattern has been formed in a main pattern region and a concavo-convex peripheral pattern has been formed in a peripheral region is transferred to a second template substrate by imprint techniques. Then, a second template with a step between a region corresponding to the main pattern region and a region corresponding to the peripheral region is formed by retreating the peripheral region of the second template substrate by etching. | 2011-03-17 |
20110062624 | METHOD OF MANUFACTURING EXPENDABLE SALT CORE FOR CASTING - A melt is made by heating a salt mixture containing a salt of sodium. The melt is set at a temperature higher than the liquidus temperature of the salt mixture, and poured into a mold for expendable core molding. The temperature when the melt is completely poured into the mold is set within a range not exceeding the liquidus temperature of the salt mixture by 30° C. An expendable salt core for casting is molded by solidifying the melt inside the mold. This makes it possible to more stably obtain the strength of a water-soluble expendable salt core for casting made of a salt cast product obtained by melting and molding salts of sodium and the like. | 2011-03-17 |
20110062625 | Device and Method for Producing a Tread - Device for manufacturing the tread of a tire, said tread comprising a plurality of relief tread elements of height h whose radially outer surface is designed to be in contact with the ground when the tire is rolling on the road surface, comprising a rotary support suitable for supporting a base strip (MB) forming a receiving surface (S), an extrusion die ( | 2011-03-17 |
20110062626 | FELT BODY MANUFACTURING METHOD - A method for the manufacture of spatial objects of a fleece or felt, wherein the fibers are deposited on a mold that is preferably air-permeable. The fibers may be attracted to the mold by a vacuum applied to the underside of said mold. Preferably, the mold has several spatial structures that define the shape of the fiber web that is being formed and that correspond at least approximately to the desired final shape. By subsequent compacting of the thusly obtained fiber web, a spatially three-dimensional felt object is obtained. In this method, subsequent deforming steps are unnecessary or reduced to a minimum, so that the material to be produced does not experience any substantial distortion. | 2011-03-17 |
20110062627 | CUTTING TOOLS AND METHODS OF MAKING THE SAME - A method of making a cutting tool includes disposing a mandrel in a form; disposing at least one watercourse insert between the form and the mandrel; placing a matrix material in the form and about the mandrel. | 2011-03-17 |
20110062628 | METHOD FOR MOLDING COSMETIC COMPOSITE PANELS WITH VISIBLE CARBON FIBER WEAVES - One embodiment of the invention provides a method for compression molding cosmetic panels with visible carbon fiber weaves using clear or lightly filled resins. The method uses a modified, two-step compression molding process to reflow the surface of a partially cured preform of carbon fiber weave and epoxy resin. | 2011-03-17 |
20110062629 | APPARATUS AND METHODS FOR MODULAR PREFORM MOLD SYSTEM - Apparatus and methods for a preform mold system include multiple preform core side modules having preform mold cores, a core side clamp plate connectable to a moving platen of an injection mold machine and operable to receive the preform core modules, multiple preform cavity side modules having preform mold cavities, each of the preform cavity side modules operable to matingly engage a respective core side module to form multiple preform molds having a respective preform design, and multiple ejector housing assemblies for connecting the core side modules to an ejector platen of the mold machine, each of the ejector housing assemblies corresponding to a respective core side module. The preform mold system may also include a manifold and valve gate assembly connectable to a stationary platen of an injection mold machine and operable to receive the cavity side modules and place the mold cavities in fluid communication with an injector of the mold machine to control the injection of fluidized plastic in a uniform flow into the preform molds, simultaneously. | 2011-03-17 |
20110062630 | CELLULOSE POWDER HAVING EXCELLENT SEGREGATION PREVENTIVE EFFECT, AND COMPOSITIONS THEREOF - With regard to compositions derived from active ingredients and other additives in medical, food and industrial fields, there have been problems that the active ingredients cannot be uniformly mixed, and that the active ingredients become segregated and lose uniformity as the active ingredients undergo transport, input, and filling processes. There is provided a cellulose powder which improves the uniformity of compositions containing active ingredients or other additives to prevent segregation of the active ingredients, wherein the cellulose powder contains cellulose I type crystals, has an average particle diameter of less than 30 μm, a powder density of 0.1 to 0.45 g/cm | 2011-03-17 |
20110062631 | Curing Pin Material Optimization - A method to cure a non-uniform rubber article uses one or more high thermal diffusivity pins in a mold to direct heat to the cure-limiting parts of the article to reduce the total cure time in the mold and increase the uniformity of the cure of the article. Reductions in cure time of up to 20% or more are achieved without substantially changing the function or degrading the performance of the article. The method is particularly useful for curing tires and treads for tires. Finite element analysis or thermocouple probes can used to determine the cure-limiting part(s) for the tire or tread. Using this knowledge, one or more of the high thermal diffusivity pins are located in the mold at positions to transfer heat into the cure-limiting part(s). | 2011-03-17 |
20110062632 | TEMPLATE WITH IDENTIFICATION MARK AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a template with an identification mark for use in SFIL includes a pattern formation template including a main pattern region where a desired pattern is formed as a convex/concave pattern on the upper surface of a light-transmitting substrate, and an identification mark that is formed on the lower surface of the substrate to partially overlap the main pattern region, and makes the template identifiable. | 2011-03-17 |
20110062633 | PROCESS FOR THE PRODUCTION OF A THREE-DIMENSIONAL OBJECT WITH AN IMPROVED SEPARATION OF HARDENED MATERIAL LAYERS FROM A CONSTRUCTION PLANE - The invention relates to a process or a device for the production of a three-dimensional object by layer-wise solidification of a photo-polymerizable resin by means of a planar or essentially planar construction/reference plane, at which the photo-polymerizable resin contained in the liquid material is to be hardened by electromagnetic irradiation, and wherein the material application for the subsequent layer automatically results from the separation of the last hardened layer from the construction/-reference plane, whereby the construction/reference plane is formed by an elastic film. The film is fixed in a frame, and the height position of the frame with the film is adjusted in a basin containing the liquid material such that the pressure of the liquid material compensates the sagging of the film (formation of a negative meniscus), and that the lower side of the film is permanently in contact with the material during the whole construction process. | 2011-03-17 |
20110062634 | THERMAL NANOIMPRINT LITHOGRAPHY MOULD, PROCESS FOR PRODUCING IT, AND THERMAL NANOIMPRINT PROCESS EMPLOYING IT - A heating mould for thermal nanoimprint lithography, a process of producing the mould, and a process for producing a nanostructured substrate employing the mould. The heating mould includes a substrate having a first principal surface and a second principal surface, and a through-cavity extending from a first orifice in the first principal surface up to a second orifice in the second principal surface. The heating mould also includes a thermally conducting layer that mechanically supports the second membrane, an insulating layer beneath the thermally conducting mechanical support layer, heating means and an electrically and thermally insulating layer which covers the heating means and, at least partially, the second membrane, imprint patterns on the electrically and thermally insulating layer, and means for supplying an electric current to the heating means. | 2011-03-17 |
20110062635 | Stimuli-responsive surfaces and related methods of fabrication and use - Biomimetic stimuli-responsive surfaces and articles of manufacture, together with methods of fabrication and related methods of use. | 2011-03-17 |
20110062636 | BINDING OF PARTICULATE MATERIALS TO MANUFACTURE ARTICLES - Methods and apparatus are disclosed for binding of particulate materials to manufacture articles including continuous panels or sheets ( | 2011-03-17 |
20110062637 | LOCAL SYSTEM FOR THE RELEASE OF ACTIVE PRINCIPLE AND PROCESS FOR ITS MANUFACTURE - A local system for the release of active principle is described which consists of approximately spherical or rotation symmetrical bodies which are composed essentially of polymethyl methacrylate or polymethyl methacrylate co-methyl acrylate, zirconium dioxide or barium sulphate and one or more pharmaceutical active principles, in particular antibiotics, and which are produced by radical polymerisation, radical polymerisation activators effective in the temperature range of 10-80° C. or residues of these polymerisation activators from the groups of aromatic amines, heavy metal salts and barbiturates not being contained therein. | 2011-03-17 |
20110062638 | Controlling Crystalline Morphology Of A Bioabsorbable Stent - Methods to expand polymer tubing with desirable or optimum morphology and mechanical properties for stent manufacture and fabrication of a stent therefrom are disclosed. | 2011-03-17 |
20110062639 | Process and Apparatus for Vacuum-Assisted Resin Transfer Molding of Very Tall Articles - A method and apparatus for maintaining constant compaction pressure in a vertically oriented resin transfer molding apparatus. | 2011-03-17 |
20110062640 | VARIABLE CANTED COIL SPRING CROSS SECTION - A canted coil spring includes a plurality of canted coils generally canted relative to a centerline extending through the coils. At least one coil when viewed in the direction of the centerline appears to have a non-elliptical shape and a non-circular shape when the at least one coil is in the unbiased state. The plurality of coils is generally canted at a first coil angle relative to the center line. The at least one coil includes at least one section canted at a second coil angle relative to the centerline. The second coil angle is different from the first coil angle when the at least one coil is in an unbiased state. | 2011-03-17 |
20110062641 | STAGE EQUIPPED WITH ALIGNMENT FUNCTION, PROCESSING APPARATUS HAVING THE STAGE EQUIPPED WITH ALIGNMENT FUNCTION, AND METHOD OF ALIGNING SUBSTRATE - There is provided an inexpensive stage which is equipped with an alignment function and is capable of easily performing high-accuracy alignment especially in a θ direction even in case an object to be processed is large in weight. The stage equipped with an alignment function has a stage main body for holding a substrate while leaving a processing surface thereof open to access. The stage is provided with: a suction means capable of sucking that surface of the substrate which lies opposite to the processing surface; a gas supply means for supplying a gas to such a region of the substrate as is other than a portion sucked by the suction means; and a drive means to give a rotating force to the suction means so that the substrate can be rotated on the same plane by causing the suction means to serve as the center of rotation. | 2011-03-17 |
20110062642 | Workpiece Mounting Block and Machine Tool - A workpiece mounting block and a machine tool are provided that permit a plurality of workpieces to be mounted and machined without giving rise to interference between the workpiece or a table and a main spindle. Work mounting section ( | 2011-03-17 |
20110062643 | Apparatus for mounting workpieces to be measured - Disclosed is an apparatus for mounting workpieces to be measured, in particular sheet metal parts of a vehicle body, in a reference position, comprising a plurality of mounts each of which has a support column and can be moved on a support surface into a desired position, and further comprising connecting devices which can be fixed to the support columns and comprise an element for connecting to a support head which rests against the workpiece and is disposed in accordance with the desired position. The connecting element can be adjusted while compensating for deviation of the mount from the desired position. | 2011-03-17 |
20110062644 | CONVEYOR BELT CLAMP - A conveyor belt clamp and method may comprise: first and second clamp beams for being placed against a conveyor belt, one or both of the clamp beams may be pre-stressed for deflecting a central region along its length. First and second end clamps are placed over the ends of the clamp beams, and each of the end clamps includes a tightening device for forcing the ends of the clamp beams closer together. The pre-stressed clamp beam is placed with its convex side against the conveyor belt. A conveyor belt clamp may comprise: first and second clamp beams for being placed against a conveyor belt, one or both of the clamp beams may include a center clamp for applying clamping force to the conveyor belt. | 2011-03-17 |
20110062645 | SHEET FINISHING APPARATUS AND SHEET FINISHING METHOD - The sheet finishing apparatus according to the embodiment includes a main body configured to fold a bundle of sheets to form a booklet, a base plate extending obliquely downward from a side wall of the main body to allow loading of a plurality of the booklets discharged in sequence from a discharging port provided in the side wall, a discharging roller pair configured to push the booklet out from the discharging port to discharge the booklet on the base plate, and a projecting member configured to project from the side wall substantially horizontally and support the lower portion of the booklet between the discharging port and the base plate when the discharging roller pair pushes the booklet out. | 2011-03-17 |
20110062646 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - The present invention provides a sheet processing apparatus and an image forming apparatus in which even if the apparatus includes a gripping apparatus gripping one side of a sheet bundle to be stapled, the sheet bundle can be stapled in a portion thereof in which the gripping apparatus is located. A gripper unit is moved in a direction crossing one side of sheets and placed in a discharge position in which the gripper unit discharges the gripped sheets and in a coupling position where the gripper unit is coupled to a staple unit. The gripper unit is thus moved in the same direction as that in which the staple unit coupled to the gripper unit at the coupling position moves. Thus, the staple unit can be moved to a stapling position without the need to ensure a retract space. | 2011-03-17 |
20110062647 | Sheet Processing Apparatus and a Sheet Processing Method - According to an embodiment, a sheet processing apparatus includes: a processing tray on which a sheet conveyed from an image forming apparatus is placed; a lateral alignment unit which has a pair of movable alignment boards, holds and the sheet on the processing tray between the pair of alignment boards, and aligns the sheet; a stapler which staples the sheet placed on the processing tray; a sheet discharge unit which discharges the stapled sheet from the processing tray to a discharge port; and a control unit which control so that the sheet is stapled after an operation of holding the sheet between the pair of alignment boards and then opening the alignment boards is performed plural times, when the sheet is inserted to the stapler from the discharge port and manually stapled. | 2011-03-17 |
20110062648 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - A sheet processing apparatus that processes sheets transported in a transport direction and stacked on a tray, including: a sheet moving device configured to be brought into contact with an upper surface of a sheet stacked on the tray and to be moved in a width direction intersecting with the transport direction to move the sheet in the width direction; an alignment member against which a side edge of the sheet moved in the width direction by the sheet moving device is brought into abutment, to align the sheet; and a guide member configured to hold down the sheet between the sheet moving device and the alignment member with the sheet moving device in contact with the upper surface of the sheet, wherein the guide member is moved integrally with the sheet moving device in the width direction. | 2011-03-17 |
20110062649 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS HAVING SAME - A sheet feeding device includes first and second sheet feeding stocker provided in a main body and placed side by side in a horizontal direction, in which sheets are taken out from the first sheet feeding stocker and conveyed through a horizontal conveyance unit provided above the second sheet feeding stocker. The respective first and second sheet feeding stockers can independently be pulled out forward from the main body in a direction intersecting with a sheet conveying direction in the horizontal conveyance unit. The sheet feeding device includes an engaging mechanism for engaging the horizontal conveyance unit and the first sheet feeding stocker so that the first sheet feeding stocker is pulled out integrally with the horizontal conveyance unit when the horizontal conveyance unit is pulled out forward from the main body. | 2011-03-17 |
20110062650 | SHEET TAKE-OUT APPARATUS WITH GAP COUNTER - A sheet take-out apparatus includes a first separation unit, a second separation unit, a drawing roller for drawing sheets from a nip of the second separation unit, and a pinch roller rotating in contact with it. Overlapping sheets which pass the first and second separation units and are not separated are detected to be overlapped in a state that they are clamped by the nip of the drawing roller and pinch roller. When overlapping is detected, in a state that the rear ends of the overlapping sheets in the conveying direction are restricted by the nip, the drawing roller and pinch roller are stopped and the overlapping sheets are re-separated. | 2011-03-17 |
20110062651 | Image forming apparatus - An image forming apparatus includes an image forming device, a sheet feeding unit, a belt pressing member, and a moving unit. The sheet feeding unit includes an endless, dielectric belt to contact and attract the uppermost sheet to a surface thereof and feed in a sheet feeding direction, and an electric potential pattern forming unit to form an electric potential pattern on a surface of the dielectric belt. The moving unit moves the belt pressing member between a sheet attracting position and a sheet feeding position. The dielectric belt attracts the uppermost sheet at the sheet attracting position, the moving unit moves the belt pressing member to the sheet feeding position, and an entire flat portion of the dielectric belt feeds the uppermost sheet in the sheet feeding direction while carrying the uppermost sheet thereon as the dielectric belt rotates. | 2011-03-17 |
20110062652 | VACUUM LEVEL SWITCH FOR A VACUUM CORRUGATED FEEDER - This invention provides a simple vacuum level switch to be used inside the feedhead's vacuum plenum to detect when the vacuum level exceeds a predefined threshold. This switch is composed of an opening in the plenum that is covered by a cap which is in turn spring-loaded against the opening. The mechanical properties of the spring are such that the cap is pushed away from the opening by ambient air pressure at the point when the vacuum threshold has been reached during sheet acquisition. A Hall Effect or optical sensor is used to detect this motion and the corresponding signal is sent to the feeder controller. This enables more intelligent control of the feeder while also providing an inexpensive method for tracking sheet acquisition times. | 2011-03-17 |
20110062653 | MEDIA STOCKER AND PAPER FEEDER - A media stocker includes a feeder plate configured to maintain a plurality of recording media in a stacked state thereon, a vertically elevating device configured to cantilever-support the feeder plate, and a guide member disposed vertically to face a free end of the feeder plate and configured to guide the recording media stacked on the feeder plate. And the media stocker includes a roller attached to the free end side of the feeder plate and rotatable around a horizontal shaft, the outer circumferential surface of the roller being in contact with the guide member at a position higher than the position of the uppermost support point of the feeder plate by the elevating device. | 2011-03-17 |
20110062654 | PAPER FEEDING CASSETTE AND PAPER FEEDING DEVICE - An aspect of the invention provides a paper feeding cassette that comprises a cassette body; a front face wall disposed at a front end of the cassette body so as to be elevated from a bottom wall of the cassette body; a medium-stacking member disposed so as to be swingable about a support shaft relative to the cassette body by using the support shaft as a swinging center, the medium-stacking member configured to have a medium thereon stacked inside the cassette body; and a biasing unit configured to bias the medium-stacking member so as to bring the medium into contact with a feeder, wherein the front face wall comprises a face which regulates the medium along a trajectory drawn by a front end of the medium-stacking member in accordance with a swinging movement of the medium-stacking member. | 2011-03-17 |
20110062655 | Image forming apparatus - A sheet separating and feeding unit incorporable in an image forming apparatus includes an image forming device, a sheet container, a sheet feeding unit including an endless, dielectric belt and an electric potential pattern forming unit, a belt supporting mechanism including a first supporting roller and a second supporting roller, and a moving unit. The first supporting roller rotates to rotatably move the second supporting roller between a sheet attracting position and a sheet feeding position so that the flat portion of the dielectric belt moves between the sheet contact position and the sheet pick-up position. | 2011-03-17 |
20110062656 | MEDIA STOCKER, PAPER FEEDING DEVICE, AND METHOD OF CONTROLLING POSTURE OF RECORDING MEDIA - A media stocker includes: a paper feeding table configured to support plural recording media in a stacked state; a lifting and lowering mechanism configured to lift and lower the paper feeding table; a bottom plate attached to the paper feeding table and configured to receive the recording media placed thereon and support the recording media such that a downstream side end in a conveying direction of the recording media on the paper feeding table moves up and down relatively to an upstream side end in the conveying direction; and a control section configured to make an angle of the bottom plate adjustable such that a surface of the recording medium at the top extends along a direction substantially orthogonal to a lifting and lowering direction of the paper feeding table. | 2011-03-17 |
20110062657 | SIDE EDGE SHEET CURLER FOR SHEET HOLD DOWN DEVICES - A device is provided for curling side edges of a sheet of media to be held down by a hold down system in an image production system. The device has a first shaped element having an outer section, the outer section of the first shaped element pointing in a first direction; a second shaped element having an outer section, the outer section of the second shaped element pointing in a second direction opposite the first direction; a first pinching element adjacent to the first shaped element, a first pathway being formed between the first pinching element and the first shaped element; and a second pinching element adjacent to the second shaped element, a second pathway being formed between the second pinching element and the second shaped element. The first pathway is for forming an edge curl on a first side edge of the sheet of media, the second pathway is for forming an edge curl on a second side edge of the sheet of media, the second side edge is parallel to the first side edge, and the first and second side edges are parallel to a process direction in which the sheet of media is fed into the device. | 2011-03-17 |
20110062658 | APPARATUS AND METHOD FOR HANDLING STACKS OF PRINTING MEDIA - An apparatus for handling stacks ( | 2011-03-17 |
20110062659 | ENCODER IDLER ROLL - An encoder idler roll includes an integral idler roll/encoder structure that forms an enclosed housing with a portion of the surface of the idler roll becoming the inner race for the encoder, as well as, the media encoding surface. Additionally, this integral idler/encoder configuration minimizes run out, improves tolerances between parts and stabilizes clearances between the idler roll and its support shaft. | 2011-03-17 |
20110062660 | Sheet Feeding Device and Image Forming Apparatus Having the Same - A sheet feeding device for use in an apparatus body of an image forming apparatus may include a sheet holder configured to be removed from and attached to the apparatus body and to hold a stack of sheets therein; an actuator including a base portion pivotally attached to the apparatus body via a first shaft and a movable portion pivotally attached to the base portion via a second shaft and extending toward the sheet holder; and a detector configured to detect a position of the base portion. The actuator may be configured such that the base portion and the movable portion pivot in response to the detector detecting the position of the base portion. The movable portion may be configured to pivot in a removal direction in which the sheet holder is removed from the apparatus body. | 2011-03-17 |
20110062661 | MEDIUM-DIRECTING DEVICE AND IMAGE-FORMING APPARATUS - A medium-directing device includes: first-third roll members, the third roll member contacting the first and second roll members in first and second regions, respectively; and a directing member having first and second directing surfaces and being rotatable between first and second positions such that the directing member, when located at the first position, directs a medium conveyed along a first conveyance path toward the first region via the first directing surface and directs a medium conveyed from the second region toward a second conveyance path via the second directing surface, the directing member including a region of the second directing surface on a side closer to the second region relative to a bent portion, in which, when the directing member is at the first position, a distance between the second directing surface and a tangential line between the second and third roll members increases toward the second region. | 2011-03-17 |
20110062662 | CARD ISSUING DEVICE - A card issuing machine may include a card storage part, a card reader part, a housing accommodating the card storage part and the card reader part, and a lock mechanism for locking the housing in a closed state. The housing may include a first case body provided as at least a front face of the card issuing machine, a second case body structured to cover an upper side of the card storage part, and a third case body structured to cover an upper side of the card reader part. The third casing may be engaged with the first casing so that the third casing does not move away from the first casing at the upper, lower, left, right, and front sides, and may also be engaged with the second casing so that the third casing does not move away from the first casing at the rear side. | 2011-03-17 |
20110062663 | GAME APPARATUS AND METHOD OF PLAYING A GAME - A game apparatus includes (i) a game board having a major game track with several segments, a bad fate block randomly disposed in each segments and between adjacent pair segments, and a bright future block to set out along the major game track, each of the several segments including several sequential blocks respectively having indicia representing specific characters and an opportunity block, the game board further having a minor game track into which an individual player will be confined upon stepping onto the bad fate block and in which the confined player continues to proceed along the minor game track; (ii) a set of vision cards each for distribution to each individual player at the beginning of the game, each vision card designating an ultimate goal, required points and a set of treasured items for each player such that whoever obtaining the required points and the set of treasured items first will be declared a first winner of the game. | 2011-03-17 |
20110062664 | Don't Get it, Board Game of infectious diseases of the world - A board game wherein the board represents a map of the world and each of several countries are visited by the players is provided. The countries are identified by infectious diseases, and the players are challenged to identify the appropriate treatment. The players are challenged to avoid or treat infectious diseases found in particular countries of the world. | 2011-03-17 |
20110062665 | TEXAS PAI GOW - A method for playing a card game between a dealer and each of at least one players includes dealing by the dealer, from a deck of cards, a hand of cards to the dealer and to each of the at least one players. At least one card of the dealer's hand is exposed. Each of the players' hands is arranged into a high hand and a low hand. The low hand has fewer player cards than the high hand. The dealer's hand is arranged into a high hand and a low hand. The low hand has fewer player cards than the high hand. An outcome of the card game is determined by comparing the arranged dealer's low hand and the arranged dealer's high hand with the corresponding arranged low and high hands of each of the at least one players. | 2011-03-17 |
20110062666 | COMMUNICATIONS GAME AND METHOD OF PLAYING THE SAME - A communications game including topic cards for displaying one of a question or requirement to one or more players; and a plurality of containers configured to resemble mailboxes, each of the containers defining an interior area for receiving a written response from one or more of the players to the question or requirement. | 2011-03-17 |
20110062667 | REALITY BASED TRAINING TARGET TRAP - A target trap having improved portability is provided. The target trap is suitable for use in reality-based training methods and may advantageously capture pellets and marking rounds for improved clean-up and cost-saving re-use of ammunition. The target trap has a replaceable strike panel and face panel and allows for paper or cardboard targets of various dimensions to be hung on its front surface by using clamps or tacks or other type of clips. | 2011-03-17 |
20110062668 | Projectile Target Game - Reactive targets and target frames are provided that react to being impacted by a projectile in such a manner as to cause longitudinal movement and/or rotation of the target frame. The movement, in turn, exposes different primary targets and/or a secondary target(s) to the participant. Participants can take either offensive shots against the competitor's targets or defensive shots to protect their targets from being impacted by the competitor. | 2011-03-17 |
20110062669 | METHOD FOR CAVITY SEALING - The invention relates to a method of cavity sealing a motor vehicle component, which comprises the following steps: | 2011-03-17 |
20110062670 | LOAD DELAYED SEAL ELEMENT, SYSTEM, AND METHOD - A seal assembly including, a deformable force transmission portion having an inner surface and an outer surface, the force transmission portion operative to transmit an applied force to a component linked to the seal assembly, and deformable in a direction transverse to a main axis of the seal assembly in response to a increased applied force greater than a threshold setting force, and a flexible outer seal portion attached to the outer surface and method. | 2011-03-17 |
20110062671 | SYSTEMS, METHODS, AND APPARATUS FOR PROVIDING A MAGNETIC SEAL - Embodiments of the invention can provide systems, methods, and an apparatus for providing a magnetic seal. According to one embodiment, a system having a magnetic seal can be provided. The system can include a rotary machine having a first component and a second component. A magnetic seal can be mounted to the first component and positioned relative to the second component to provide a gap between the magnetic seal and the second component. The magnetic seal can include a first magnetic element and a compliant material adapted to adjust in response to a force exerted on the magnetic seal by a second magnetic element. The second magnetic element can be mounted to the second component so that the gap between the magnetic seal and the second component can be modified in response to the force exerted by second magnetic element on the magnetic seal. | 2011-03-17 |
20110062672 | Tubular shaft seal - The invention describes a leak proof shaft seal for valves and other pressurized vessels, wherein the shaft seal can deform elastically by either stretching or twisting without loosing its ability to seal all, or a portion, of said shaft from harmful fluids. Furthermore, the elastic shaft seal is immune to static pressures, since it closely surrounds a shaft and thus is protected from collapse. | 2011-03-17 |