11th week of 2013 patent applcation highlights part 41 |
Patent application number | Title | Published |
20130065365 | Method for Manufacturing Semiconductor Substrate of Large-power Device - The invention belongs to the technical field of high-voltage, large-power devices and in particular relates to a method for manufacturing a semiconductor substrate of a large-power device. According to the method, the ion implantation is carried out on the front face of a floating zone silicon wafer first, then a high-temperature resistant metal is used as a medium to bond the back-off floating zone silicon wafer, and a heavily CZ-doped silicon wafer forms the semiconductor substrate. After bonding, the floating zone silicon wafer is used to prepare an insulated gate bipolar transistor (IGBT), and the heavily CZ-doped silicon wafer is used as the low-resistance back contact, so the required amount of the floating zone silicon wafers used is reduced, and production cost is lowered. Meanwhile, the back metallization process is not required after bonding, so the processing procedures are simplified, and the production yield is enhanced. | 2013-03-14 |
20130065366 | SOI INTEGRATED CIRCUIT COMPRISING ADJACENT CELLS OF DIFFERENT TYPES - An integrated circuit on a semiconductor substrate has logic gates comprising FDSOI-type transistors made on said substrate, including at least one first transistor comprising a gate with a first work function, and including a transistor comprising a second work function, a memory including memory cells, each memory cell comprising FDSOI type transistors, including at least one third nMOS transistor with a gate presenting a third work function, the third transistor comprising a buried insulating layer and a ground plane at least one fourth pMOS transistor with a gate presenting said third work function, the fourth transistor comprising a buried insulating layer and a ground plane, the ground planes of the third and fourth transistors being made in a same well separating these ground planes from said substrate. | 2013-03-14 |
20130065367 | Methods of Forming Highly Scaled Semiconductor Devices Using a Reduced Number of Spacers - In one example, a method disclosed herein includes the steps of forming gate electrode structures for a PMOS transistor and for an NMOS transistor, forming a first spacer proximate the gate electrode structures, after forming the first spacer, forming extension implant regions in the substrate for the transistors and after forming the extension implant regions, forming a second spacer proximate the first spacer for the PMOS transistor. This method also includes performing an etching process with the second spacer in place to define a plurality of cavities in the substrate proximate the gate structure for the PMOS transistor, removing the first and second spacers, forming a third spacer proximate the gate electrode structures of both of the transistors, and forming deep source/drain implant regions in the substrate for the transistors. | 2013-03-14 |
20130065368 | NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE - A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of an optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation. | 2013-03-14 |
20130065369 | THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - Methods of forming vertical nonvolatile memory devices may include forming an electrically insulating layer, which includes a composite of a sacrificial layer sandwiched between first and second mold layers. An opening extends through the electrically insulating layer and exposes inner sidewalls of the first and second mold layers and the sacrificial layer. A sidewall of the opening may be lined with an electrically insulating protective layer and a first semiconductor layer may be formed on an inner sidewall of the electrically insulating protective layer within the opening. At least a portion of the sacrificial layer may then be selectively etched from between the first and second mold layers to thereby define a lateral recess therein, which exposes an outer sidewall of the electrically insulating protective layer. | 2013-03-14 |
20130065370 | Method for Fabricating Field Effect Transistor Devices with High-Aspect Ratio Mask - A method for forming feature on a substrate includes forming at least one layer of a feature material on a substrate, patterning a photolithographic resist material on the at least one layer of the feature material, removing portions of the feature material to define a feature, depositing a masking material layer over the resist material and exposed regions of the substrate, modifying a portion of the substrate, and removing the masking material layer and the resist material. | 2013-03-14 |
20130065371 | METHODS FOR FABRICATING INTEGRATED CIRCUITS - Methods are provided for fabricating integrated circuits. One method includes etching a plurality of trenches into a silicon substrate and filling the trenches with an insulating material to delineate a plurality of spaced apart silicon fins. A layer of undoped silicon is epitaxially grown to form an upper, undoped region of the fins. Dummy gate structures are formed overlying and transverse to the plurality of fins and a back fill material fills between the dummy gate structures. The dummy gate structures are removed to expose a portion of the fins and a high-k dielectric material and a work function determining gate electrode material are deposited overlying the portion of the fins. The back fill material is removed to expose a second portion and metal silicide contacts are formed on the second portion. Conductive contacts are then formed to the work function determining material and to the metal silicide. | 2013-03-14 |
20130065372 | METHOD FOR DECREASING POLYSILICON GATE RESISTANCE IN A CARBON CO-IMPLANTATION PROCESS - A method for decreasing polysilicon gate resistance in a carbon co-implantation process which includes: depositing a first salicide block layer on a formed gate of a MOS device and etching it to form a first spacer of a side surface of the gate of the MOS device; performing a P-type heavily doped boron implantation process and a thermal annealing treatment, so as to decrease the resistance of the polysilicon gate; removing said first spacer, performing a lightly doped drain process, and performing a carbon co-implantation process at the same time, so as to form ultra-shallow junctions at the interfaces between a substrate and source region and drain region below the gate; re-depositing a second salicide block layer on the gate and etching the mask to form a second spacer; forming a self-aligned silicide on the surface of the MOS device. The invention can decrease the resistance of the P-type polysilicon gate. | 2013-03-14 |
20130065373 | Methods and Systems for Forming Implanted Doped Regions for a Semiconductor Device Using Reduced Temperature Ion Implantation - In one example, a method disclosed herein includes reducing a temperature of at least an implant surface of a semiconducting substrate to a temperature less than −50° C. and after reducing the temperature of the implant surface, performing at least one ion implantation process to implant ions into the substrate with the implant surface at a temperature less than −50° C. | 2013-03-14 |
20130065374 | Fluorine Implant Under Isolation Dielectric Structures to Improve Bipolar Transistor Performance and Matching - A method of fabricating an integrated circuit including bipolar transistors that reduces the effects of transistor performance degradation and transistor mismatch caused by charging during plasma etch, and the integrated circuit so formed. A fluorine implant is performed at those locations at which isolation dielectric structures between base and emitter are to be formed, prior to formation of the isolation dielectric. The isolation dielectric structures may be formed by either shallow trench isolation, in which the fluorine implant is performed after trench etch, or LOCOS oxidation, in which the fluorine implant is performed prior to thermal oxidation. The fluorine implant may be normal to the device surface or at an angle from the normal. Completion of the integrated circuit is then carried out, including the use of relatively thick copper metallization requiring plasma etch. | 2013-03-14 |
20130065375 | Methods of Forming Semiconductor Devices Having Capacitor and Via Contacts - Disclosed herein are various methods of forming semiconductor devices that have capacitor and via contacts. In one example, the method includes forming a first conductive structure and a bottom electrode of a capacitor in a layer of insulating material, forming a layer of conductive material above the first conductive structure and the bottom electrode and performing an etching process on the layer of conductive material to define a conductive material hard mask and a top electrode for the capacitor, wherein the conductive material hard mask is positioned above at least a portion of the first conductive structure. This illustrative method includes the further steps of forming an opening in the conductive material hard mask and forming a second conductive structure that extends through the opening in the conductive material hard mask and conductively contacts the first conductive structure. | 2013-03-14 |
20130065376 | SEMICONDUCTOR CAPACITOR - A semiconductor capacitor and its method of fabrication are disclosed. A non-linear nitride layer is used to increase the surface area of a capacitor plate, resulting in increased capacitance without increase in chip area used for the capacitor. | 2013-03-14 |
20130065377 | INTERFACE LAYER IMPROVEMENTS FOR NONVOLATILE MEMORY APPLICATIONS - A resistive switching nonvolatile memory device having an interface layer disposed between a doped silicon electrode and a variable resistance layer fabricated in the nonvolatile memory device and methods of fabricating the same. In one embodiment, the interface layer is a high-k layer having a lower electrical EOT than native silicon oxide to act as a diffusion barrier between the variable resistance layer and the silicon electrode. Alternatively, the high-k interface layer may be formed by performing a nitrogen treatment on a fabricated silicon oxide layer. In another embodiment, the interface layer may be fabricated by performing a nitrogen or ozone treatment on the native oxide layer. In another embodiment, the interface layer is a fabricated silicon oxide layer resulting in an improved diffusion barrier between the variable resistance layer and the silicon electrode. In all embodiments, the interface layer also passivates the surface of the silicon electrode. | 2013-03-14 |
20130065378 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-03-14 |
20130065379 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a porous area of a semiconductor body. The semiconductor body includes a porous structure in the porous area. A semiconductor layer is formed on the porous area. Semiconductor regions are formed in the semiconductor layer. Then, the semiconductor layer is separated from the semiconductor body along the porous area, including introducing hydrogen into the porous area by a thermal treatment. | 2013-03-14 |
20130065380 | METHODS FOR MANUFACTURING INTEGRATED CIRCUIT DEVICES HAVING FEATURES WITH REDUCED EDGE CURVATURE - A structure, such as an integrated circuit device, is described that includes a line of material with critical dimensions which vary within a distribution substantially less than that of a mask element, such as a patterned resist element, used in etching the line. Techniques are described for processing a line of crystalline phase material which has already been etched using the mask element, in a manner which straightens an etched sidewall surface of the line. The straightened sidewall surface does not carry the sidewall surface variations introduced by photolithographic processes, or other patterning processes, involved in forming the mask element and etching the line. | 2013-03-14 |
20130065381 | VERTICAL-TYPE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - In a vertical-type memory device and a method of manufacturing the vertical-type memory device, the vertical memory device includes an insulation layer pattern of a linear shape provided on a substrate, pillar-shaped single-crystalline semiconductor patterns provided on both sidewalls of the insulation layer pattern and transistors provided on a sidewall of each of the single-crystalline semiconductor patterns. The transistors are arranged in a vertical direction of the single-crystalline semiconductor pattern, and thus the memory device may be highly integrated. | 2013-03-14 |
20130065382 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A method of manufacturing a silicon carbide semiconductor device of an embodiment includes: implanting ions in a silicon carbide substrate; performing first heating processing of the silicon carbide substrate in which the ions are implanted; and performing second heating processing of the silicon carbide substrate for which the first heating processing is performed, at a temperature lower than the first heating processing. | 2013-03-14 |
20130065383 | Fabrication methods for T-gate and inverted L-gate structure for high frequency devices and circuits - In high frequency circuits, the switching speed of devices is often limited by the series resistance and capacitance across the input terminals. To reduce the resistance and capacitance, the cross-section of input electrodes is made into a T-shape or inverted L-shape through lithography. The prior art method for the formation of cavities for T-gate or inverted L-gate is achieved through several steps using multiple photomasks. Often, two or even three different photoresists with different sensitivity are required. In one embodiment of the present invention, an optical lithography method for the formation of T-gate or inverted L-gate structures using only one photomask is disclosed. In another embodiment, the structure for the T-gate or inverted L-gate is formed using the same type of photoresist material. | 2013-03-14 |
20130065384 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A mask layer is formed on a silicon carbide layer by a deposition method. The mask layer is patterned. A gate trench having a side wall is formed by removing a portion of the silicon carbide layer by etching using the patterned mask layer as a mask. A gate insulating film is formed on the side wall of the gate trench. A gate electrode is formed on the gate insulating film. The silicon carbide layer has one of hexagonal and cubic crystal types, and the side wall of the gate trench substantially includes one of a{0-33-8} plane and a {01-1-4} plane in a case where the silicon carbide layer is of hexagonal crystal type, and substantially includes a {100} plane in a case where the silicon carbide layer is of cubic crystal type. | 2013-03-14 |
20130065385 | METHOD FOR PREPARING SPACER TO REDUCE COUPLING INTERFERENCE IN MOSFET - The present invention provides a method for preparing spacer to reduce coupling interference in MOSFET, which includes the steps of: forming a gate oxide layer on the semiconductor substrate; forming a gate on the gate oxide layer; and depositing a low-K dielectric material on the gate and the semiconductor substrate, and doping with carbon during deposition to form a carbon-containing low-K dielectric layer and then forming the spacer by an etching process. | 2013-03-14 |
20130065386 | MULTIPLE MOLD STRUCTURE METHODS OF MANUFACTURING VERTICAL MEMORY DEVICES - A first insulating interlayer is formed on a substrate including first and second regions. The first insulating interlayer has top surface, a height of which is greater in the first region than in the second region. A first planarization stop layer and a second insulating interlayer are formed. The second insulating interlayer is planarized until the first planarization stop layer is exposed. The first planarization stop layer and the first and second insulating interlayers in the second region are removed to expose the substrate. A lower mold structure including first insulation layer patterns, first sacrificial layer patterns and a second planarization stop layer pattern is formed. The first insulation layer patterns and the first sacrificial layer patterns are alternately and repeatedly formed on the substrate, and a second planarization stop layer pattern is formed on the first insulation layer pattern. | 2013-03-14 |
20130065387 | METHOD AND STRUCTURE OF MONOLITHICALLY INTEGRATED ESD SUPPERSSION DEVICE - A method of fabricating ESD suppression device includes forming conductive pillars dispersed in a dielectric material. The gaps formed between each pillar in the device behave like spark gaps when a high voltage ESD pulse occurs. When the voltage of the pulse reaches the “trigger voltage” these gaps spark over, creating a very low resistance path. In normal operation, the leakage current and the capacitance is very low, due to the physical gaps between the conductive pillars. The proposed method for fabricating an ESD suppression device includes micromachining techniques to be on-chip with device ICs. | 2013-03-14 |
20130065388 | SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD THEREOF - A substrate structure with compliant bump comprises a substrate, a plurality of bumps, and a metallic layer, wherein the substrate comprises a surface, a trace layer, and a protective layer. The trace layer comprises a plurality of conductive pads, and each of the conductive pads comprises an upper surface. The protective layer comprises a plurality of openings. The bumps are formed on the surface, and each of the bumps comprises a top surface, an inner surface and an outer surface and defines a first body and a second body. The first body is located on the surface. The second body is located on top of the first body. The metallic layer is formed on the top surface, the inner surface, and the upper surface. | 2013-03-14 |
20130065389 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a first interconnection and a second interconnection above a semiconductor substrate, forming a first sidewall insulating film on a side wall of the first interconnection, and a second sidewall insulating film on a side wall of the second interconnection, forming a conductive film above the semiconductor substrate with the first interconnection, the first sidewall insulating film, the second interconnection and the second sidewall insulating film formed on, and selectively removing the conductive film above the first interconnection and the second interconnection to form in a region between the first interconnection and the second interconnection a third interconnection formed of the conductive film and spaced from the first interconnection and the second interconnection by the first sidewall insulating film and the second sidewall insulating film. | 2013-03-14 |
20130065390 | CHIPS HAVING REAR CONTACTS CONNECTED BY THROUGH VIAS TO FRONT CONTACTS - A method of fabricating a microelectronic unit can include providing a semiconductor element having front and rear surfaces, a plurality of conductive pads each having a top surface exposed at the front surface and a bottom surface remote from the top surface, and a first opening extending from the rear surface towards the front surface. The method can also include forming at least one second opening extending from the first opening towards the bottom surface of a respective one of the pads. The method can also include forming a conductive via, a conductive interconnect, and a contact, the conductive via in registration with and in contact with the conductive pad and extending within the second opening, the contact exposed at an exterior of the microelectronic unit, the conductive interconnect electrically connecting the conductive via with the contact and extending away from the via at least partly within the first opening. | 2013-03-14 |
20130065391 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS AND COMPUTER-READABLE RECORDING MEDIUM - A method of manufacturing a semiconductor device, includes: alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate by a first predetermined number of times, and (ii) a second step of supplying a nitridation raw material to the substrate, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate. | 2013-03-14 |
20130065392 | METHOD FOR FORMING A SILICIDE LAYER AT THE BOTTOM OF A HOLE AND DEVICE FOR IMPLEMENTING SAID METHOD - A method for manufacturing a silicide layer in a hole formed across the entire thickness of a layer of a material deposited on a silicon layer, including: a first step of bombarding of the hole with particles to sputter the silicon at the bottom of the hole and deposit sputtered silicon on lateral walls of the hole; a second step of deposition in the hole of a layer of silicide precursor; a second step of bombarding of the hole with particles to sputter the silicon precursor at the bottom of the hole and deposit sputtered precursor on the internal walls of the hole; a second step of deposition in the hole of a layer of silicide precursor; and an anneal step to form a silicide layer in the hole. | 2013-03-14 |
20130065393 | METHODS OF FORMING SELF-ALIGNED THROUGH SILICON VIA - A method for forming a through silicon via (TSV) in a substrate may include forming a dielectric layer on the substrate; forming an opening through the dielectric layer and into the substrate using a single mask over the dielectric layer; expanding the opening in the dielectric layer, undercutting the single mask, to form an expanded upper portion; removing the single mask; and filling the opening, including the expanded upper portion, with a conductor. A resulting structure may include a substrate; a dielectric layer over the substrate; and a self-aligned through silicon via (TSV) extending through the dielectric layer and the substrate. | 2013-03-14 |
20130065394 | Process for Forming Contact Plugs - A method includes forming an etch stop layer over and contacting a gate electrode of a transistor, forming a sacrificial layer over the etch stop layer, and etching the sacrificial layer, the etch stop layer, and an inter-layer dielectric layer to form an opening. The opening is then filled with a metallic material. The sacrificial layer and excess portions of the metallic material over a top surface of the etch stop layer are removed using a removal step including a CMP process. The remaining portion of the metallic material forms a contact plug. | 2013-03-14 |
20130065395 | NEW METAL PRECURSORS FOR SEMICONDUCTOR APPLICATIONS - Methods and compositions for depositing metal films are disclosed herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver, or copper. More specifically, the disclosed precursor compounds utilize pentadienyl ligands coupled to a metal to increase thermal stability. Furthermore, methods of depositing copper, gold, or silver are disclosed in conjunction with use of other precursors to deposit metal films. The methods and compositions may be used in a variety of deposition processes. | 2013-03-14 |
20130065396 | APPARATUS INCLUDING GAS DISTRIBUTION MEMBER SUPPLYING PROCESS GAS AND RADIO FREQUENCY (RF) POWER FOR PLASMA PROCESSING - A plasma processing apparatus includes a gas distribution member which supplies a process gas and radio frequency (RF) power to a showerhead electrode. The gas distribution member can include multiple gas passages which supply the same process gas or different process gases at the same or different flow rates to one or more plenums at the backside of the showerhead electrode. The gas distribution member provides a desired process gas distribution to be achieved across a semiconductor substrate processed in a gap between the showerhead electrode and a bottom electrode on which the substrate is supported. | 2013-03-14 |
20130065397 | Methods to increase pattern density and release overlay requirement by combining a mask design with special fabrication processes - A novel process technique and mask design based on the optimized self-aligned triple patterning are invented for the semiconductor manufacturing. This invention pertains to methods of forming one and/or two dimensional features on a substrate having the feature density increased to three times of what is possible using optical lithography, and methods to release the overlay requirement when patterning the critical layers of semiconductor devices. | 2013-03-14 |
20130065398 | DRY METAL ETCHING METHOD - A method of etching an aluminum-containing layer on a substrate is described. The method includes forming plasma from a process composition containing a halogen element, and exposing the substrate to the plasma to etch the aluminum-containing layer. The method may additionally include exposing the substrate to an oxygen-containing environment to oxidize a surface of the aluminum-containing layer and control an etch rate of the aluminum-containing layer. The method may further include forming first plasma from a process composition containing HBr and an additive gas having the chemical formula C | 2013-03-14 |
20130065399 | PLASMA PROCESSING METHOD - A plasma processing method includes holding a wafer on a holding stage, generating plasma inside the processing chamber by a plasma generator to define a first processing region having an electron temperature higher than a predetermined value and a second processing region having an electron temperature lower than the predetermined value, moving the holding stage for the wafer to be positioned in the first processing region, performing the plasma processing of the wafer positioned in the first processing region, moving the holding stage for the wafer to be positioned in the second processing region, and stopping to generate plasma when the wafer is positioned in the second processing region after completion of the plasma processing. | 2013-03-14 |
20130065400 | ETCHING METHOD - According to one embodiment, an etching method includes: supplying an etching-resistant material; and etching the silicon nitride film. The supplying includes supplying the etching-resistant material to a processing surface including a surface of a silicon nitride film and a surface of a non-etching film, the non-etching film including a material different from the silicon nitride film. The etching includes etching the silicon nitride film using an etchant in a state of the etching-resistant material being formed relatively more densely on the surface of the non-etching film than on the surface of the silicon nitride film. | 2013-03-14 |
20130065401 | METHODS FOR DEPOSITING METAL-POLYMER COMPOSITE MATERIALS ATOP A SUBSTRATE - Methods for depositing metal-polymer composite materials atop a substrate are provided herein. In some embodiments, a method of depositing a metal-polymer composite material atop a substrate disposed in a hot wire chemical vapor deposition (HWCVD) chamber may include flowing a current through a plurality of filaments disposed in the HWCVD chamber, the filaments comprising a metal to be deposited atop a substrate; providing a process gas comprising an initiator and a monomer to the HWCVD chamber; and depositing a metal-polymer composite material on the substrate using species decomposed from the process gas and metal atoms ejected from the plurality of filaments. | 2013-03-14 |
20130065402 | CLEANING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM - A method of cleaning an inside of a processing chamber is provided according to an embodiment of the present disclosure. The method includes supplying a fluorine-based gas and a nitrogen oxide-based gas as the cleaning gas, into the processing chamber heated to a first temperature, and removing a deposit by a thermochemical reaction. The method further includes changing a temperature in the processing chamber to a second temperature higher than the first temperature, and supplying the fluorine-based gas and the nitrogen oxide-based gas as the cleaning gas, and removing extraneous materials, remaining on the surface of the member in the processing chamber, by a thermochemical reaction. | 2013-03-14 |
20130065403 | WAFER CARRIER WITH THERMAL FEATURES - A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface. | 2013-03-14 |
20130065404 | Carbosilane Precursors For Low Temperature Film Deposition - Provided are processes for the low temperature deposition of silicon-containing films using carbosilane precursors containing a carbon atom bridging at least two silicon atoms. Certain methods comprise providing a substrate; in a PECVD process, exposing the substrate surface to a carbosilane precursor containing at least one carbon atom bridging at least two silicon atoms; exposing the carbosilane precursor to a low-powered energy sourcedirect plasma to provide a carbosilane at the substrate surface; and densifying the carbosilanestripping away at least some of the hydrogen atoms to provide a film comprising SiC. The SiC film may be exposed to the carbosilane surface to a nitrogen source to provide a film comprising SiCN. | 2013-03-14 |
20130065405 | SHIELD STRUCTURE OF CONDUCTOR CABLE AND ELECTRICALLY DRIVEN VEHICLE - A shield structure of a conductor cable includes a first case that accommodates a rotating electrical machine, a first terminal block that is provided on the first case, a second case that accommodates an inverter, a second terminal block that is provided on the second case, a conductor cable that electrically connects the first terminal block and the second terminal block to each other, and a metal shell that is arranged across the first case and the second case and covers at least part of a periphery of the conductor cable. | 2013-03-14 |
20130065406 | MAGNETIC CONNECTOR FOR ELECTRONIC DEVICE - An electrical plug and receptacle relying on magnetic force from an electromagnet to maintain contact are disclosed. The plug and receptacle can be used as part of a power adapter for connecting an electronic device, such as a laptop computer, to a power supply. The plug includes electrical contacts, which are preferably biased toward corresponding contacts on the receptacle. The plug and receptacle each have a magnetic element. The magnetic element on one of the plug or receptacle can be a magnet or ferromagnetic material. The magnetic element on the other of the plug or receptacle is an electromagnet. When the plug and receptacle are brought into proximity, the magnetic attraction between the electromagnet magnet and its complement, whether another magnet or a ferromagnetic material, maintains the contacts in an electrically conductive relationship. | 2013-03-14 |
20130065407 | ELECTRICAL CONNECTION SYSTEM - An electrical connection system includes a plug having contact elements, and a socket having mating contact elements. The plug can be connected magnetically to the socket by means of a magnet device for transmitting signals or current. The magnet device has at least one connection pair, which comprises a magnet and a connecting element, which can be attracted by the magnet, but itself is not in the form of a permanent magnet, wherein respectively the magnet of a connection pair is arranged in the socket, and the connecting element which is not in the form of a permanent magnet is arranged in the plug. | 2013-03-14 |
20130065408 | FLEXIBLE PRINTED CIRCUIT BOARD WITH SHIELDED LAYER OF DATA PINS - An exemplary flexible printed circuit board (FPCB) includes a flexible printed circuit (FPC) body and a connector. The FPC body includes two ground layers and a signal layer sandwiched between and shielded by the two ground layers. The connector includes two layers of ground pins and a layer of data pins sandwiched between the two layers of ground pins. The layer of data pins are electrically connected to the signal layer, and the two layers of ground pins are electrically connected to the two ground layers, respectively. | 2013-03-14 |
20130065409 | CABLE INSTALLATION ASSEMBLY - A cable installation assembly includes a connector, a power wire, a ground wire and two signal wires. The connector includes a base, having a plurality of terminal containing grooves formed in the base and arranged separately adjacent to each other. The power wire includes a power core and a power terminal electrically coupled to power core, and each power terminal is plugged into each corresponding terminal containing groove. The ground wire includes a grounding core and a grounding terminal electrically coupled to the grounding core and plugged into the terminal containing groove. The signal wire includes a signal core and a signal terminal electrically coupled to signal core, and the two signal terminals are plugged into the terminal containing grooves respectively and not arranged adjacent to each other, so that signals can be transmitted without interfering with one another. | 2013-03-14 |
20130065410 | PLUG-TYPE CONNECTOR - The subject matter of the invention is a plug-type connector, comprising a contact carrier element ( | 2013-03-14 |
20130065411 | Card Connector - A card connector for receiving a card is provided. The card connector includes a housing a plurality of contacts, a slider and a stopper. The housing includes a front wall, a rear wall, and a card receiving passageway formed therein. The contacts are secured in the housing. The slider is positioned and slidable between the front wall and the rear wall. The stopper is supported by the slider and includes end sections positioned adjacent to the slider, such that a space is provided between one of the end sections and the slider. | 2013-03-14 |
20130065412 | CONNECTOR ENGAGEMENT BODY - A connector engagement body includes: a first connector including a first signal terminal and a first power supply terminal; a second connector including a power supply terminal locking portion, a signal terminal locking portion, a second signal terminal, and a second power supply terminal; and a lever including a signal terminal releasing portion, a power supply terminal releasing portion, a power supply terminal locked portion, and a signal terminal locked portion. The lever is engaged with the first connector and the second connector and causes a mating force and a separating force to act between the first connector and the second connector by moving between a mated position and a separated position relative to the first connector and the second connector. | 2013-03-14 |
20130065413 | ROTATABLE CONNECTOR DEVICE - A rotatable connector device includes a steering roll connector that accommodates a flat cable in an accommodation space in the state where the flat cable can be wound and unwound. Also, a plurality of rotatable rollers are located on a top surface of a retainer concentrically with the retainer at an equal interval in a circumferential direction of the retainer. A regulation section on which a reversed part is allowed to be pressed is provided on the top surface of the retainer at a position away from one of the plurality of rotatable rollers, namely, a rotatable roller, on the side of a part of the rotatable roller along which the reversed part can be wound. The regulation section is away from the part of the rotatable roller by a gap which allows the reversed part to contact or detached from the rotatable roller. | 2013-03-14 |
20130065414 | ELECTRICAL CONNECTOR - An electrical connector mounting on a printed circuit board includes an insulative housing and a number of power contacts received in the housing. The housing includes a main portion and a mating portion extending forwardly from the main portion. The mating portion has side walls and a receiving space surrounded by the side walls. The main portion has a mounting face and the mating portion has a mating face from which an opening is defined. The insulative housing defines at least one heat dissipation slot recessed from the mating face which extends inwards and communicating to the receiving space of the mating portion. | 2013-03-14 |
20130065415 | Blind Mate Capacitively Coupled Connector - A connector with a capacitively coupled connector interface for interconnection with a female portion is provided with an annular groove, with a sidewall, open to an interface end of the female portion. A male portion is provided with a male outer conductor coupling surface at an interface end, covered by an outer conductor dielectric spacer. The male portion is retained with a range of radial movement, with respect to a longitudinal axis of the male portion, by a bias web of a float plate. The male outer conductor coupling surface is dimensioned to seat, spaced apart from the sidewall by the outer conductor dielectric spacer, within the annular groove, when the male portion and the female portion are in an interlocked position. | 2013-03-14 |
20130065416 | BUSHING SEAL FOR REEFER PLUG - A bushing for a reefer plug includes an annular body having proximal and distal ends and an interior conduit for receiving an electrical cable. A distal circumferential seal portion is at the distal end, the distal circumferential seal inclining radially outwardly in the distal to proximal direction. A reefer plug assembly and method for connecting an electrical cable to a reefer plug are also disclosed. | 2013-03-14 |
20130065417 | ELECTRICAL CONNECTOR - An electrical connector including a housing provided thereon with an opening through which a flat circuit device is inserted into the housing, a plurality of conductive contacts arranged on the housing, and a holding member formed in a body on the housing to be operative to hold the flat circuit device inserted in the housing and then to release the flat circuit device from holding by the holding member, wherein the holding member has a movable arm portion extending from an inside surface portion of the housing, and the movable arm portion is provided thereon with an engaging portion operative to engage with the flat circuit device inserted in the housing for holding the same and a releasing portion protruding from the movable arm portion through an aperture provided on the housing toward the outside of the housing and is operative to move the movable arm portion for disengaging the engaging portion from the flat circuit device. | 2013-03-14 |
20130065418 | ROTARY LOCKING PUSH-ON CONNECTOR AND METHOD THEREOF - A coaxial cable connector for mating with an interface port having external threads, comprising a post configured to receive a center conductor surrounded by a dielectric of a coaxial cable, the post including a plurality of engagement fingers, a connector body attached to the post, a sleeve member attached to the post and having a first end and ascend end, wherein the sleeve member includes one or more protrusions proximate the first end configured to contact the plurality of engagement fingers to secure the connector in a locked position. Furthermore, associated methods are also provided. | 2013-03-14 |
20130065419 | LED Socket - An LED socket is provided for accommodating an LED module and connecting to a heat sink. The LED socket includes a socket housing and a contact. The socket housing includes an LED module receiving portion and a first LED module securing member projecting downward from a bottom surface of the LED module receiving portion. The contact includes a securing portion securable with the socket housing, a wire connecting portion extending from the securing portion and received by the socket housing, and a contact portion insertable into the socket housing and projecting into the LED module receiving portion. | 2013-03-14 |
20130065420 | Connector With Capacitively Coupled Connector Interface - A connector with a capacitively coupled connector interface for interconnection with a female portion is provided with an annular groove, with a sidewall, open to an interface end of the female portion. A male portion is provided with a male outer conductor coupling surface at an interface end, covered by an outer conductor dielectric spacer. The male outer conductor coupling surface is dimensioned to seat, spaced apart from the sidewall by the outer conductor dielectric spacer, within the annular groove, when the male portion and the female portion are in an interlocked position, secured by a releasable retainer dimensioned to secure the male portion and the female portion in the interlocked position. | 2013-03-14 |
20130065421 | COMMUNICATION CONNECTOR - A communication connector for connecting with a communication plug is disclosed. The communication connector includes a base, a set of conductive terminals, a case, and a cover, wherein the set of conductive terminals is situated on the base, and the case is used for accommodating the base and the set of conductive terminals. The case has a first incline with an opening. The cover has a second incline and a notch. The shape of the second incline matches the first incline to allow the cover to move upward or downward relative to the case. The shape of the notch matches the communication plug. When the cover moves upward, the communication plug passes the notch, enters the opening, and electrically connects to the set of conductive terminals. | 2013-03-14 |
20130065422 | Capacitively Coupled Flat Conductor Connector - A capacitively coupled flat conductor connector is provided with a male connector body and a female connector body. An alignment insert is coupled to the male connector body, the alignment insert dimensioned to support a predefined length of an inner conductor. An alignment receptacle is coupled to the female connector body, the alignment receptacle dimensioned to receive a connector end of the alignment insert to seat an overlapping portion of an inner conductor and an inner conductor trace parallel with one another against opposite sides of a dielectric spacer. An outer conductor dielectric spacer, which may be a ceramic coating, isolates the contacting elements of the outer conductor signal path between the male and female connectors. | 2013-03-14 |
20130065423 | CONNECTOR ASSEMBLY - The connector assembly for a printed circuit board includes a set of differential signal wires, a set of alternating current (AC) power wires, a ground wire, and a connector. The set of differential signal wires includes a plurality of signal wires, and each of the signal wires has an insulator and a conductor. The set of AC power wires includes a plurality of power wires, and each of the power wires has an insulator and a conductor. The connector includes an insulated shell and a plurality of conductive pins received therein, and each of the conductive pins has a nipper. An end of each of the set of differential signal wires and the set of AC power wires is electrically connected to the printed circuit board, and the other end thereof is electrically connected to the nipper. | 2013-03-14 |
20130065424 | Large Deflection Constrained Insulation Displacement Terminal and Connector - An improved insulation displacement terminal (IDT) includes opposed spaced fingers having outer edges with first and second abutment sections adjacent the ends of the outer edges. A resilient spring-like mid-section in the finger between the abutment sections applies a generally normal force to a wire captured between the inner edges of opposed fingers of the IDT. The resilient spring-like mid-section of each finger may be provided by narrowing the width of each finger between the abutment sections such as by recessing the outer edges from the outer edges of the abutment sections or by providing slots or openings in the mid-section of the fingers. Corners of inner edges of the fingers are smoother and inner edges are generally planar to provide a large contact area between the fingers and a wire disposed therebetween. The IDT is mounted within a housing to provide an insulation displacement connector (IDC). | 2013-03-14 |
20130065425 | ELECTRICAL CONNECTOR ASSEMBLY WITH FIELD TERMINABLE INSULATION DISPLACEMENT CONTACT - The electrical connector assembly for field terminable connections includes a housing, switch assembly, at least one open channel, at least one insulated wire, and removable cover. Switch assembly is arranged and disposed within housing and includes at least one contact. At least one open channel is disposed within housing and aligned with at least one contact. At least one insulated wire includes insulation layer and conductive core and is arranged and disposed within at least one open channel and is adjacent to at least one contact. Removable cover for housing includes at least one protrusion arranged and disposed to cooperate with at least one open channel, at least one contact and at least one insulated wire. Securing removable cover with housing causes protrusion to penetrate insulation layer on at least one insulated wire to form electrical contact between the respective conductive core and the respective contact. | 2013-03-14 |
20130065426 | CONNECTOR AND WIRE HARNESS - A connector includes one contact terminal including a contact portion to be in contact with an other contact terminal and a connecting portion to be connected to an electric wire, and a housing including a housing hole formed therein to house the contact portion of the one contact terminal. The one contact terminal contacts with the other contact terminal by inserting the other contact terminal into the housing hole, and the contact portion of the one contact terminal is housed in the housing hole so as to be movable in a direction of intersecting with the insertion direction of the other contact terminal into the housing hole. | 2013-03-14 |
20130065427 | MOTOR CONNECTION IN PARTICULAR FOR A RADIATOR FAN MOTOR FOR A MOTOR VEHICLE AND A RADIATOR FAN MOTOR - An electrical assembly connection, in particular a motor connection for an electrical radiator fan motor, for a motor vehicle, has a connected cable harness. The cable ends of the cable harness are connected to an assembly-end connection terminal. Two housing parts of a connection housing are combined so as to form a hollow space in the assembled state and accommodate the connection-end cable ends of the cable harness. Wherein one of the housing parts contains at least one cable bushing which has a conical guide inner contour which opens in the direction of the connection terminal. A clamping part rests against the guide inner contour, and wherein, as a result of tensile loading on the cable harness, the clamping part slides along the corresponding guide inner contour and increases the clamping action on the corresponding cable as the tensile loading increases. | 2013-03-14 |
20130065428 | ELECTRONIC DEVICE AND METHOD OF DETECTING A PROPER CABLE CONNECTION - An electronic device, systems and methods are described for detecting whether there has been a proper cable connection when a plug is inserted into a socket. A pressure sensor configured to measure air pressure within the socket generates one or more pressure signals as a function of the air pressure, and a processor determines whether a proper cable connection has been made (whether the plug has been fully inserted into the socket) as a function of the pressure signals. | 2013-03-14 |
20130065429 | HIGH TEMPERATURE, HIGH PRESSURE SUBSEA ELECTRICAL CONNECTOR SYSTEM - Each feed-through pin of a multiple-phase, high voltage plug-pin connector comprises at least one conductor having a first insulation layer extending along at least part of its length, the insulation layer having an enlarged, load-bearing portion of non-circular cross-section having oppositely directed projections, configured for engagement in a correspondingly shaped bore portion of the connector shell. The load-bearing portions may be of a rhomboidal cross sectional shape with rounded corners, with a first diagonal length shorter than a second diagonal length. The pins are spaced around the central longitudinal axis of the shell with the shorter diagonal of each load-bearing portion extending radially and the oppositely directed projections extending into the radial spaces in the shell between adjacent pins. This arrangement allows space within a limited diameter feed through hole for the enlarged, load-bearing shoulder portions of the insulation layer. | 2013-03-14 |
20130065430 | CONNECTOR - Provided is a connector capable of preventing an operator from touching a filler and reducing a filling amount of a filler to cut down the cost. A connector ( | 2013-03-14 |
20130065431 | INNER WIRE FOR INVERTER - An inner wire capable of power integration and power division and adapted for use with an inverter having a casing and a circuit board includes a female connector and a male connector. The female and male connectors are each disposed in the casing and each include power lines, at least two signal lines, and a ground line. The power lines each have one end electrically connected to power connectors in pairs and the other end to power terminals respectively. The signal lines have one end electrically connected to two signal connectors respectively and the other end to signal terminals. The ground lines have one end electrically connected to ground connectors and the other end to ground terminals. The power terminals, signal terminals, and ground terminals are disposed in the male and female connectors. The signal connectors, ground connectors, and power connectors are electrically connected to the circuit board. | 2013-03-14 |
20130065432 | FIXING APPARATUS FOR CONNECTOR - A fixing apparatus for fixing a connector includes a protrusion, a fixing plate, and a fastener. The protrusion protrudes from the connector, and is located at a side of the connecting portion. The protrusion includes a head portion and a pin connected between the head portion and the connector. The fixing plate defines an opening, a first hole, a second hole communicating with the first hole, and a positioning hole. The fastener is fixed to the connector and includes an extendable shaft. When the connecting portion extends through the opening, the protrusion extends through the first hole, and the shaft abuts against the fixing plate. The connector is moved to allow the pin to enter the second hole. The head portion is blocked by the fixing plate. The shaft engages in the positioning hole. | 2013-03-14 |
20130065433 | COAXIAL CABLE CONNECTOR WITH RADIO FREQUENCY INTERFERENCE AND GROUNDING SHIELD - A radio frequency interference (RFI) and grounding shield for a coaxial cable connector is disclosed. The shield comprises a circular inner segment and at least one arcuately shaped pre-formed cantilevered annular beam attached to the circular inner segment by a joining segment. The at least one pre-formed cantilevered annular beam extends angularly from a plane of the circular inner segment. The at least one pre-formed cantilevered annular beam applies a spring-force to a surface of the surface of a component of the coaxial cable connector establishing an electrically conductive path between the components. The at least one pre-formed cantilevered annular beam comprises an outer surface with a knife-like edge that provides a wiping action of surface oxides on component surfaces of the coaxial cable connector and allows for unrestricted movement when the coaxial cable connector is attached to an equipment connection port of an appliance. | 2013-03-14 |
20130065434 | COMPRESSION TYPE COAXIAL CABLE CONNECTOR - An electrical connector for use with coaxial cables includes a deformable cylindrical casing and a slidably engaged shell. | 2013-03-14 |
20130065435 | COAXIAL CABLE CONNECTOR HAVING ELECTRICAL CONTINUITY MEMBER - A coaxial cable connector comprising a connector body; a post engageable with the connector body, wherein the post includes a flange; a nut, axially rotatable with respect to the post and the connector body, the nut having a first end and an opposing second end, wherein the nut includes an internal lip, and wherein a second end portion of the nut corresponds to the portion of the nut extending from the second end of the nut to the side of the lip of the nut facing the first end of the nut at a point nearest the second end of the nut, and a first end portion of the nut corresponds to the portion of the nut extending from the first end of the nut to the same point nearest the second end of the nut of the same side of the lip facing the first end of the nut; and a continuity member disposed within the second end portion of the nut and contacting the post and the nut, so that the continuity member extends electrical grounding continuity through the post and the nut is provided. | 2013-03-14 |
20130065436 | TERMINAL FITTING AND CONNECTOR PROVIDED THEREWITH - A rectangular tube ( | 2013-03-14 |
20130065437 | SIMPLIFIED CONNECTOR RECEPTACLES - Connector receptacles that may be used in a variety of applications, may have a desirable aesthetic appearance, may be durable and reliable, and may be manufactured in a simplified manner. One example may provide a receptacle that may be used in a number of different devices to avoid having to redesign a receptacle for different devices. Another example may maintain a desirable appearance by reducing the chance of marring or functional damage during insertions of an insert. | 2013-03-14 |
20130065438 | ELECTRIC CONNECTOR WITH A MULTIPART SHIELD - An electrical connector having a generally tubular housing connects the conductors of an electrically-shielded cable with an electrical component, including a injection-molded electrically-conductive synthetic plastic bridge arrangement connecting the cable shield layer at a stripped end of the cable with a connector shield member arranged on the connector housing into one end of which the conductors are introduced. An injection-molded annular carrier layer of insulating synthetic plastic material is molded concentrically about the conductor ends, one end of the carrier layer extending within the conductive bridging layer, and the other end extending within the bore of the connector housing into which the conductor ends extend. Consequently, the connector is structurally reinforced to resist the forces and stresses of vibration and shock. | 2013-03-14 |
20130065439 | CONNECTOR STRUCTURE - A connector structure includes an enclosure; a plurality of ground units arranged in the enclosure and respectively including a carrier plate and a plurality of ground terminals electrically connected to one another and associated with the carrier plate; a plurality of signal units arranged in the enclosure side by side to locate between any two adjacent ones of the ground units, and the signal units respectively including a carrier plate and a plurality of signal terminals associated with the carrier plate; and a ground connecting member connected to the carrier plates of the ground units and the signal units. With these arrangements, the connector has simple structure and can be easily assembled for use, and the ground units are connected to the ground connecting member to thereby effectively prevent electromagnetic interference during signal transmission and ensure increased transmission rate. | 2013-03-14 |
20130065440 | CONNECTOR STRUCTURE - A connector structure includes an enclosure; a plurality of ground units arranged in the enclosure and respectively including a plate portion and a plurality of ground terminals electrically connected to one another and associated with the plate portion; a plurality of signal units arranged in the enclosure side by side to locate between the ground units, and respectively including a plate portion and a plurality of signal terminals associated with the plate portion; a ground connecting member connected to the plate portions of the ground units and the signal units; and a circuit board located at a bottom of the enclosure for engaging with the ground and signal terminals. With these arrangements, the connector has simple structure and can be easily assembled for use, and the ground units are connected to the ground connecting member to thereby effectively prevent electromagnetic interference during signal transmission and ensure increased transmission rate. | 2013-03-14 |
20130065441 | CONNECTOR STRUCTURE - A connector structure includes an enclosure; a plurality of ground units arranged in the enclosure and respectively including a carrier plate and a plurality of ground terminals electrically connected to one another and associated with the carrier plate; a plurality of signal units arranged in the enclosure side by side to locate between any two adjacent ones of the ground units, and the signal units respectively including a carrier plate and a plurality of signal terminals associated with the carrier plate; and a ground connecting member connected to the carrier plates of the ground units and the signal units. With these arrangements, the connector has simple structure and can be easily assembled for use, and the ground units are connected to the ground connecting member to thereby effectively prevent electromagnetic interference during signal transmission and ensure increased transmission rate. | 2013-03-14 |
20130065442 | CONNECTOR AND ELECTRONIC DEVICE HAVING THE SAME - The invention provides a connector including a case, a body, a contact, and an annular joint. The case includes a through hole and a periphery of the through hole. The body includes a main body, the main body including a front portion received in the through hole of the case and a rear portion continuous with the front portion. The contact includes an intermediate portion held in the main body, a contact portion received in the through hole of the case, and a tail portion located on an opposite side of the intermediate portion from the contact portion. The annular joint is made of an insulating resin and joins the rear portion of the main body and the periphery of the through hole of the case. | 2013-03-14 |
20130065443 | Method Of Making A Connector Head Of A Multipolar Lead Of An Active Implantable Medical Device - Forming a connector head for a generator of an active implantable medical device by providing a pin ( | 2013-03-14 |
20130065444 | CHARGING CONNECTION DEVICE WITH ILLUMINATION AND ASSOCIATED METHODS - A charging connection device includes a device connector configured to be coupled to a rechargeable electronic device, and a circuit board coupled to the connector and including charging circuitry and an associated light source, such as a light emitting diode (LED), thereon. A housing encloses the circuit board and includes a first end comprising a lens, with the connector extending from the first end. A touch switch, such as touch plates, is on the housing, coupled to the circuit board, and configured to activate the light source. A power source connector is coupled to the circuit board and associated with a second end of the housing. One of the touch plates and/or one side of the housing may include at least one opening therein to transmit light from the light source and indicate right-side-up. | 2013-03-14 |
20130065445 | CONNECTOR AND ELECTRONIC DEVICE HAVING THE SAME - The invention provides a connector including a body, a cover, a contact, and a molded portion. The body includes a connecting hole, and a housing hole or slit communicating with the connecting hole and being open to an outside of the body. The cover blocks the housing hole or slit of the body. The contact includes a fixed portion fixedly attached in the housing hole or slit of the body, a contact portion disposed in the connecting hole, and a connecting portion protruding from between the body and the cover to an outside of the body and the cover. The molded portion, formed of insulating resin, covers and blocks at least a boundary between the body and the cover, a boundary between the body and the connecting portion of the contact, and a boundary between the cover and the connecting portion of the contact. | 2013-03-14 |
20130065446 | Electrical Connector - An electrical connector is provided. The electrical connector includes a comprising a first housing, a second housing removably fittable to the first housing, and a lock block disposed on the second housing and engageable with the first housing to secure the second housing at a predetermined position with the first housing. The lock block includes a first groove extending along a length of the lock block, a side portion in contact with the first groove, an end portion in contact with the first groove and orthogonal to the side portion, a side lock disposed on the side portion and securable with the first housing, and a first lock that is provided integrally with the end portion and secured to the first housing. | 2013-03-14 |
20130065447 | COMPRESSION CONNECTOR CONFIGURED WITH THREE HOUSING FOR RETAINING TERMINALS THEREBETWEEN - A compression connector for connecting two PCBs includes an insulative housing and a plurality of terminals received in the housing. Each terminal includes a retaining section and two spring contacting sections extending from opposite ends of the retaining section and exposing beyond mating surface of the housing. The insulative housing includes a base housing and a pair of matching housing sandwich the base housing from opposite directions to retain the retaining sections in said three housings such that the terminals can be well retained therein. | 2013-03-14 |
20130065448 | ELECTRONIC CONNECTOR - An electronic connector comprises a housing and a printed circuit board. The housing defines an opening therein. The printed circuit board is mounted in the housing. The printed circuit board has a front portion located within the opening of the housing and a rear portion attached to the housing. A USB3.0 port interface and an eSATA port interface are provided at the front portion of the printed circuit board. A terminal section is provided at the rear portion of the printed circuit board. The terminal section includes a plurality of connecting pads. The two interfaces are electrically connected with the connecting pads via a plurality of conducting traces. Thereby, the USB port interface or the eSATA port interface can be individually selected for data transmission, and electrical coupling between differential signal pairs can be reduced. | 2013-03-14 |
20130065449 | CHARGER - A charger includes a female connector disposed in a mobile phone, and a male connector mated with the female connector and adapter for electrically connecting with an external power supply. The female connector includes an insulating housing defining a receiving chamber, and electrical terminals partially embedded in the insulating housing with one end thereof being exposed in the receiving chamber and the other end thereof projecting out of the insulating housing to be electrically connected with a printed circuit board of the mobile phone. The male connector has electrical contacts exposed outward. The male connector can be removably inserted in the receiving chamber of the female connector to realize an electrical connection between the electrical contacts and the corresponding electrical terminals. | 2013-03-14 |
20130065450 | USB APPLICATION DEVICE AND METHOD FOR ASSEMBLING USB APPLICATION DEVICE - The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced. | 2013-03-14 |
20130065451 | CONNECTOR - The invention provides a connector including a body of insulating material; a fourth signal terminal provided in the body; and fifth and sixth signal terminals arranged in a line along a first direction in the body, at a height position that is different from that of the fourth signal terminal. The sixth signal terminal is located in a region between the fourth signal terminal and the fifth signal terminal in the first direction. A frequency of a signal transmitted by the sixth signal terminal is about one tenth or lower of a frequency of a signal transmitted by the fourth signal terminal. | 2013-03-14 |
20130065452 | Contactors for Electric Vehicle Charging System - The general field of invention is electrical connectors and their conductor geometry. This patent teaches how to make the register-free charge couplers to have self-cleaning ability as well as tolerating operation under dirty environments such as underbelly of cars, while still delivering the requirements imposed by the register-free functionality. Although this invention can benefit many connector designs and applications, it is particularly beneficial when applied to hands free connectors for charging electric vehicles—also known in the industry as the Electric Vehicle Charge Couplers. The specific geometry taught in the patent satisfies the requirements of register-free connectors such as not to be able to short circuit supply conductors, provide at least one drain side conductor for every supply side conductor, permit easy sliding between supply and drain side conductors and provide at least one drain side contact with its centerline to overlap each supply side contact. Additional treads on the contacts provide self-cleaning ability without disturbing the register-free functionality by providing a path for loose dirt and oxides to escape, while the ridges between the grooves break the dirt into small pieces. The groove pitch is adjusted in relation to the sliding distance between the contacts such that every broken down piece of the dirt finds an escape path. | 2013-03-14 |
20130065453 | PLUG CONNECTOR - The instant disclosure relates to a plug connector for inserting into at least one hole of an electrical outlet. The plug includes a plug body, a switch, a pushing member, at least one conductive member, and at least one locking member. The plug body is constructed of at least one shell defining a via hole, where the via hole penetrates entirely through the shell. The switch has a connecting end inserted through the via hole for connecting pivotally to the pushing member. The conductive member protrudes from the plug body, and the locking member is arranged in close to the conductive member. Thus, when the switch is operated, the connecting end is driven to push the pushing member to move with respect to the conductive member, and the locking member is pushed by the pushing member to deform or move. | 2013-03-14 |
20130065454 | HIGH PERFORMANCE CABLE CONNECTOR - A cable connector with improved performance and ease of use. The connector has staggered ports to reduce crosstalk and to prevent incorrect insertion of a plug into a receptacle. The plug may be constructed with subassemblies, each of which has a lossy central portion. Conductive members embedded within an insulative housing of the subassemblies may be used to electrically connect ground conductors within the subassemblies. Further, the connector may have a quick connect locking screw that can be engaged by pressing on the screw, but requires rotation of the screw to remove. Additionally, a ferrule may be used in making a mechanical connection between a cable bundle and a plug and making an electrical connection between a braid of the cable bundle and a conductive shell of the plug. The ferrule may be in multiple pieces for easy attachment while precluding deformation of the cable, which disrupts electrical performance. | 2013-03-14 |
20130065455 | Contact Holder - To provides a contact holder, capable of compensating a change of signal transmission characteristic at the outer edge area of the substrate. A substrate | 2013-03-14 |
20130065456 | LEADFRAME AND CONNECTING SOCKET HAVING A LEADFRAME - The present invention relates to a leadframe having a plurality of connections for electrical conductors, a plurality of contacts and at least two outer current bars, and to a connecting socket having a leadframe as well as to a system for transmission of electrical power, in particular from a plurality of solar modules (photovoltaic modules), having a connecting socket such as this. In order to devise a leadframe which occupies as little space as possible, at least one connection ( | 2013-03-14 |
20130065457 | ELECTRICAL CONNECTING MEMBER FOR SECONDARY BATTERY - Disclosed herein is a connection member for secondary batteries to achieve the electrical connection in a battery pack including two or more cylindrical secondary batteries in a physical contact manner, the connection member including an outer circumferential contact part contacting an electrode terminal of a lower battery cell along the outer circumferential region of the electrode terminal of the lower battery cell, such that the outer circumferential contact part can be electrically connected to the electrode terminal of the lower battery cell in a surface contact manner and a central contact part contacting an electrode terminal of an upper battery cell or the central region of a sidewall of the battery pack for providing an elastic contact force to the entire connection member mounted between the electrode terminals of the respective battery cells or between the electrode terminals of the battery cells and the sidewall of the battery pack. | 2013-03-14 |
20130065458 | ELECTRICAL PLUG CONNECTION ELEMENT - The invention relates to an electrical plug connection element ( | 2013-03-14 |
20130065459 | TERMINAL FITTING - A terminal fitting (T) includes a locking plate ( | 2013-03-14 |
20130065460 | TERMINALS - A pair of terminals having a first terminal loaded in a first connector and a second terminal loaded in a second connector mated with the first connector, the terminals coming into contact with each other and being electrified, wherein the first terminal is equipped with a contact portion including a protruding contact protrusion, the second terminal is equipped with a contact portion including a contact recess engaging the contact protrusion, the contact protrusion is equipped with an oblique portion extending obliquely widthwise relative to the contact portion, the contact recess is equipped with an oblique portion extending obliquely widthwise relative to the contact portion, and the oblique portion of the first terminal and the oblique portion of the second terminal cross each other. | 2013-03-14 |
20130065461 | SMALL SIZE FLOATING VESSEL USING A DUAL FUEL SYSTEM - A small size floating vessel having a dual fuel system, optimized cargo capacity, and options for selectively operating on diesel fuel and natural gas for maximizing the range of vessel operation and reducing vessel emissions of nitrogen oxides and particulates. | 2013-03-14 |
20130065462 | OUTBOARD MOTOR - An outboard motor includes a cooling water passage that guides cooling water to cool an exhaust passage and a cylinder unit. A cooling water intake port draws external cooling water into the cooling water passage. A water pump draws cooling water into the cooling water intake port and supplies the cooling water to the cooling water passage. A thermostat is arranged in the cooling water passage downstream of the catalytic converter and the cylinder unit. A first bypass passage is connected to a first connecting section provided on the cooling water passage. The first connecting section is provided along the cooling water passage at a position farther downstream than the catalytic converter and farther upstream than the thermostat. | 2013-03-14 |
20130065463 | PADDLEBOARD - A paddleboard includes a hollow paddleboard body made of plastics by rotational forming and having an enclosed chamber defined in between opposing top wall and said bottom wall thereof and inflated with air, and a plurality of hollow posts connected between the opposing top wall and bottom wall of the hollow paddleboard body. Each hollow post has a bottom close end connected to the bottom wall of the hollow paddleboard body, and a top open end connected to the top wall of the hollow paddleboard body and exposed to the atmosphere. | 2013-03-14 |
20130065464 | Canine life vest with top dorsal fin - A pet life vest with a top dorsal fin is a safety floatation device for canines. The apparatus is comprised of two primary pieces; the life vest portion and the dorsal fin portion. Both portions contain internal closed cell structure floatation material and are flexible and form fitting. The life vest portion acts as a floatation device; the dorsal fin aids in floatation and visibility while also acting as a convenient handle to allow the owner easy access at anytime. | 2013-03-14 |