| 11th week of 2013 patent applcation highlights part 15 |
| Patent application number | Title | Published |
|---|
| 20130062762 | IN-GRID ON-DEVICE DECOUPLING FOR BGA - Embodiments of the invention place surface-mount such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, between BGA pads. | 2013-03-14 |
| 20130062763 | DE-POP ON-DEVICE DECOUPLING FOR BGA - Embodiments of the invention place surface-mount devices such as decoupling capacitors, resistors or other devices directly on the underside of a ball grid array (BGA) electronic integrated circuit (EIC) package, in place of de-populated BGA pads. | 2013-03-14 |
| 20130062764 | SEMICONDUCTOR PACKAGE WITH IMPROVED PILLAR BUMP PROCESS AND STRUCTURE - A flip chip structure formed on a semiconductor substrate includes a first plurality of copper pillars positioned directly over, and in electrical contact with respective ones of a plurality of contact pads on the front face of the semiconductor substrate. A layer of molding compound is positioned on the front face of the substrate, surrounding and enclosing each of the first plurality of pillars and having a front face that is coplanar with front faces of each of the copper pillars. Each of a second plurality of copper pillars is positioned on the front face of one of the first plurality of copper pillars, and a solder bump is positioned on a front face of each of the second plurality of pillars. | 2013-03-14 |
| 20130062765 | LOW LOOP WIRE BONDING - A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die. | 2013-03-14 |
| 20130062766 | System and Method for 3D Integrated Circuit Stacking - A method and system of stacking and aligning a plurality of integrated circuits. The method includes the steps of providing a first integrated circuit having at least one funnel-shaped socket, providing a second integrated circuit, aligning at least one protrusion on the second integrated circuit with the at least one funnel-shaped socket, and bonding the first integrated circuit to the second integrated circuit. The system includes a first integrated circuit having at least one funnel-shaped socket, a metallization-diffusion barrier disposed on the interior of the funnel-shaped socket, and a second integrated circuit. The at least one funnel-shaped socket is adapted to receive a portion of the second integrated circuit. | 2013-03-14 |
| 20130062767 | VIA STRUCTURE AND VIA ETCHING PROCESS OF FORMING THE SAME - An integrated circuit structure includes a semiconductor substrate and a hard mask layer formed on the semiconductor substrate. The integrated circuit structure further includes at least a conductive layer formed in the hard mask layer and a via extending from the hard mask layer to at least a portion of the semiconductor substrate, wherein the via has a round corner and a tapered sidewall. | 2013-03-14 |
| 20130062768 | METHOD FOR THE PRODUCTION OF A SUBSTRATE HAVING A COATING COMPRISING COPPER, AND COATED SUBSTRATE AND DEVICE PREPARED BY THIS METHOD - A method for producing a substrate with a copper or a copper-containing coating is disclosed. The method comprises a first step wherein a first precursor, a second precursor and a substrate are provided. The first precursor is a copper complex that contains no fluorine and the second precursor is selected from a ruthenium complex, a nickel complex, a palladium complex or mixtures thereof. In the second step, a layer is deposited at least on partial regions of a surface of the substrate by using the first precursor and the second precursor by means of atomic layer deposition (ALD). The molar ratio of the first precursor:second precursor used for the ALD extends from 90:10 to 99.99:0.01. The obtained layer contains copper and at least one of ruthenium, nickel and palladium. Finally, a reduction is performed step in which a reducing agent acts on the substrate obtained after depositing the copper-containing layer. | 2013-03-14 |
| 20130062769 | Microstructure Modification in Copper Interconnect Structures - A metal interconnect structure and a method of manufacturing the metal interconnect structure. Manganese (Mn) is incorporated into a copper (Cu) interconnect structure in order to modify the microstructure to achieve bamboo-style grain boundaries in sub-90 nm technologies. Preferably, bamboo grains are separated at distances less than the “Blech” length so that copper (Cu) diffusion through grain boundaries is avoided. The added Mn also triggers the growth of Cu grains down to the bottom surface of the metal line so that a true bamboo microstructure reaching to the bottom surface is formed and the Cu diffusion mechanism along grain boundaries oriented along the length of the metal line is eliminated. | 2013-03-14 |
| 20130062770 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a semiconductor structure, comprising: a barrier layer overlying a workpiece surface; a seed layer overlying the barrier layer; an inhibitor layer overlying said seed layer, the inhibitor layer having a opening exposing a portion of the seed layer, and a fill layer overlying the exposed portion of the seed layer. | 2013-03-14 |
| 20130062771 | DESIGN METHOD OF WIRING LAYOUT, SEMICONDUCTOR DEVICE, PROGRAM FOR SUPPORTING DESIGN OF WIRING LAYOUT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a design method of layout formed by a sidewall method is provided. The method includes: preparing a base pattern on which a plurality of first patterns extending in a first direction and arranged at a first space in a second direction intersecting the first direction and a plurality of second patterns extending in the first direction and arranged at a center between the first patterns, respectively, are provided; and drawing a connecting portion which extends in the second direction and connects two neighboring first patterns sandwiching one of the second patterns, and separating the one of the second patterns into two patterns not contacting the connecting portion. | 2013-03-14 |
| 20130062772 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - In a method for fabricating a semiconductor device, first, a first metal interconnect is formed in an interconnect formation region, and a second metal interconnect is formed in a seal ring region. Subsequently, by chemical mechanical polishing or etching, the upper portions of the first metal interconnect and the second metal interconnect are recessed to form recesses. A second insulating film filling the recesses is then formed above a substrate, and the upper portion of the second insulating film is planarized. Next, a hole and a trench are formed to extend halfway through the second insulating film, and ashing and polymer removal are performed. Subsequently to this, the hole and the trench are allowed to reach the first metal interconnect and the second metal interconnect. | 2013-03-14 |
| 20130062773 | CONTACT FOR A NON-VOLATILE MEMORY AND METHOD THEREFOR - A semiconductor device is disclosed that comprises a first non-volatile memory cell, a second non-volatile memory cell, an active region between the first and second memory cells, and an electrically conductive contact touching the active region, wherein the contact has a horizontal cross-section that is at least five percent smaller in a first dimension than in a second dimension. | 2013-03-14 |
| 20130062774 | Semiconductor Device and Method for Forming the Same - A method includes forming a metal hard mask over a low-k dielectric layer. The step of forming the metal hard mask includes depositing a sub-layer of the metal hard mask, and performing a plasma treatment on the sub-layer of the metal hard mask. The metal hard mask is patterned to form an opening. The low-k dielectric layer is etched to form a trench, wherein the step of etching is performed using the metal hard mask as an etching mask. | 2013-03-14 |
| 20130062775 | Strain-Compensating Fill Patterns for Controlling Semiconductor Chip Package Interactions - Generally, the subject matter disclosed herein relates to sophisticated semiconductor chips that may be less susceptible to the occurrence of white bumps during semiconductor chip packaging operations, such as flip-chip or 3D-chip assembly, and the like. One illustrative semiconductor chip disclosed herein includes, among other things, a bond pad and a metallization layer below the bond pad, wherein the metallization layer is made up of a bond pad area below the bond pad and a field area surrounding the bond pad area. Additionally, the semiconductor device also includes a plurality of device features in the metallization layer, wherein the plurality of device features has a first feature density in the bond pad area and a second feature density in the field area that is less than the first feature density. | 2013-03-14 |
| 20130062776 | ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR STACKING ERROR MEASUREMENT - A 3D integrated circuit including a first wafer and a second wafer is provided. The first wafer includes a first conduction pattern. The second wafer includes a second conduction pattern which is electrically connected to the first conduction pattern. A displacement between the first wafer and the second wafer is determined by a resistance of the first conduction pattern and the second conduction pattern. | 2013-03-14 |
| 20130062777 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Also in a semiconductor integrated circuit device including a copper embedded wiring as a main wiring layer, generally, the uppermost-layer wiring layer is often an aluminum-based pad layer in order to ensure wire bonding characteristics. The aluminum-based pad layer is also generally used as a wiring layer (general intercoupling wiring such as power source wiring or signal wiring). However, such a general intercoupling wiring has a relatively large wiring length. This causes a demerit for the device to be susceptible to damages during a plasma treatment due to the antenna effect, and other demerits. With the present invention, in a semiconductor integrated circuit device including a metal multilayer wiring system having a lower-layer embedded type multilayer wiring layer and an upper-layer non-embedded type aluminum-based pad metal layer, the non-embedded type aluminum-based pad metal layer substantially does not have a power supply ring wiring. | 2013-03-14 |
| 20130062778 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a flat-plate shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a flat-plate shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a first signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode. | 2013-03-14 |
| 20130062779 | BONDING CONTACT AREA ON A SEMICONDUCTOR SUBSTRATE - A bonding contact area on a semiconductor substrate is provided that includes a reinforcing structure having at least one conductive material layer arranged on the semiconductor substrate to receive the patterned reinforcing structure, a metal layer formed as a bonding contact layer with a bonding surface and arranged on a conductive material layer. Whereby, below the bonding surface, an oxide layer having at least about a 2 μm thickness is arranged, which extends beyond the edge of the bonding surface. The reinforcing structure is arranged in the oxide layer, when viewed looking down onto the bonding surface, outside the bonding surface within the oxide layer. | 2013-03-14 |
| 20130062780 | CHIP STACKING STRUCTURE - A chip stacking structure includes a first chip and a second chip. The first chip includes a surface having a first group of pads formed thereon, and the second chip includes a surface having a second group of pads formed thereon. The second group of pads is bonded onto the first group of pads to define a plurality of capillary passages extending in a same direction. The chip stacking structure further includes an underfill filling up interspaces between the first chip and the second chip. The chip stacking structure is capable of avoiding chip deformation and cracking during a bonding process. | 2013-03-14 |
| 20130062781 | CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT - A chip arrangement includes semiconductor chips coupled to opposing sides of an insulating layer. The arrangement includes a first semiconductor chip having a first chip surface presenting a first chip conductive region. An electrically insulating layer includes a first layer surface presenting a first layer conductive region, and a second, opposing surface presenting a second layer conductive region. The electrically insulating layer is coupled to the first semiconductor chip by applying the first layer conductive region to the first chip conductive region. The electrically insulating layer is then coupled to the second chip conductive region by applying the second layer conductive region to the second chip conductive region. | 2013-03-14 |
| 20130062782 | STACKED SEMICONDUCTOR DEVICES AND FABRICATION METHOD/EQUIPMENT FOR THE SAME - After formation of an opening by exposing and development of the photosensitive surface protection film and adhesive layer which is formed on the circuit side of the semiconductor wafer, the semiconductor chips having a photosensitive surface protection film and adhesive layer thereon is fabricated by cutting individual chips from the semiconductor wafer. After the second semiconductor chip is placed over the first semiconductor chip up by the suction collet, the second semiconductor chip is bonded with the first semiconductor chip by the first surface protection film and adhesive layer. The suction side of the suction collet has lower adhesion to the second semiconductor chip than that between the now bonded semiconductor chips. | 2013-03-14 |
| 20130062783 | CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - A chip packaging structure and a manufacturing method for the same are provided. The chip packaging structure includes a first chip, a second chip and a transfer component. The first chip has a plurality of first bonding pads formed on the top surface of the first chip. The second chip has a plurality of second bonding pads formed on the top surface of the second chip. The first chip and the second chip are arranged abreast and electrically connected to each other. The transfer component is disposed on the top surface of the first chip and electrically connected with the first chip. Via these arrangements, the chip packaging structure can have smaller dimensions. | 2013-03-14 |
| 20130062784 | MULTI-CHIP PACKAGES PROVIDING REDUCED SIGNAL SKEW AND RELATED METHODS OF OPERATION - A packaged integrated circuit device includes a substrate, and a conductive pad and a chip stack on the substrate. A primary conductive line electrically connects the pad on the substrate to a conductive pad on one of the chips in the chip stack. Secondary conductive lines electrically connect the pad on the one of the chips to respective conductive pads on ones of the chips above and below the one of the chips in the chip stack. The primary conductive line may be configured to transmit a signal from the pad on the substrate to the pad on the one of the chips in the chip stack, and the secondary conductive lines may be configured to transmit the signal from the one of the chips to the ones of the chips thereabove and therebelow at a same time. | 2013-03-14 |
| 20130062785 | TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF - A transistor structure includes a chip package and two pins, wherein the chip package includes a transistor die and a molding compound encapsulating the transistor die. One of the pins is electrically connected to a first bonding pad and a second bonding pad of the transistor die, and another of the pins is electrically connected to a third bonding pad of the transistor die. The transistor structure may be employed in a snubber circuit to connect an active component or a load in parallel to absorb spikes or noise generated by the active component while the active component is switching at a high frequency. Therefore, the packaging of the transistor structure could simplify the process, reduce size, increase the withstanding voltage, and improve the efficiency and reduce the spike voltage of the power supply of the snubber circuit. | 2013-03-14 |
| 20130062786 | SOLDER MASK WITH ANCHOR STRUCTURES - Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site. | 2013-03-14 |
| 20130062787 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 2013-03-14 |
| 20130062788 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a semiconductor chip, a lead frame that has a first surface having the semiconductor chip mounted thereover and a second surface opposite to the first surface, a bonding wire that couples the semiconductor chip and the lead frame, and a high-dielectric layer that is disposed over a surface of the lead frame opposite to a surface having the semiconductor chip mounted thereover and that has a relative permittivity of 5 or more. The lead frame includes a source electrode lead coupled to the source of a semiconductor device formed over the semiconductor chip and a source-wire junction at which the source electrode lead and the bonding wire are coupled together. The high-dielectric layer is disposed in a region including at least a position corresponding to the source-wire junction over the second surface of the lead frame. | 2013-03-14 |
| 20130062789 | MANUFACTURING A FILLING OF A GAP REGION - A method of manufacturing a filling of a gap region. The method includes the steps of: applying a carrier fluid and filler particles in a gap region between a first surface and a second surface; exposing the filler particles to a force field for driving the filler particles towards a preferred direction; and withholding the filler particles in a gap region by using a barrier element for forming a path of attached filler particles between the first surface and the second surface. | 2013-03-14 |
| 20130062790 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which R | 2013-03-14 |
| 20130062791 | DISC ASSEMBLY OF AIR CLEANING HUMIDIFIER - A disc assembly of an air cleaning humidifier includes a disc member provided with assembly parts formed by cutting parts of the disc member; first and second plate members respectively disposed at both sides of the disc member; at least one fixing member inserted into a corresponding one of the assembly parts between the first and second plate members to fix the disc member; and water storage parts formed in the at least one fixing member. | 2013-03-14 |
| 20130062792 | CO-CURRENT VAPOR-LIQUID CONTACTING APPARATUSES FOR OFFSHORE PROCESSES - An offshore co-current vapor-liquid contacting apparatus includes stages having contacting modules. Each contacting module includes a downcomer extending in a direction and has downcomer baffles distanced from each other in the direction to define downcomer cells within the downcomer. Each downcomer includes an outlet proximate to a co-current flow channel. A receiving pan extends substantially parallel to the downcomer and has receiving pan baffles distanced from each other in the direction to define receiving pan sections within the receiving pan. A vapor-liquid separation device has an inlet surface proximate to the co-current flow channel and an outlet surface above the receiving pan. Ducts are provided, with each duct having an upper end in fluid communication with a respective receiving pan section and a lower end in fluid communication with a selected downcomer cell in an immediately inferior stage. | 2013-03-14 |
| 20130062793 | CONTACT TRAY FOR A MASS TRANSFER COLUMN - The valve cover has a guide vane extending laterally and downwardly from the central portion towards and in spaced relation to the tray deck for deflecting a majority of the vapor passing upwardly through an orifice downward towards the tray deck. A de-entrainment device with a downwardly angled deflector in vertical alignment with an orifice in the tray deck may be integrated or not with the valve cover below the tray deck. | 2013-03-14 |
| 20130062794 | DEVICE FOR DILUTING A VISCOUS SUBSTANCE - Provided is a device for diluting a viscous substance which is advantageous in spreading a viscous substance to increase its area and allow efficient dilution of the viscous substance with a diluent. The device comprises a base body having a treatment chamber to be supplied with a viscous substance and a diluent for diluting the viscous substance; a surface element having a coating surface to be attached by the viscous substance supplied to the treatment chamber of the base body; and a movable member movable along the coating surface of the surface element and a coating element. The coating element is provided on the movable member and mechanically spreads the viscous substance attached to the coating surface of the surface element on the coating surface of the surface element in association with movement of the movable member to increase area of the viscous substance. | 2013-03-14 |
| 20130062795 | METHOD FOR MANUFACTURING OPTICAL ELEMENT, AND APPARATUS FOR MANUFACTURING OPTICAL ELEMENT - A method for manufacturing an optical element includes floating an optical element material in gas to heat the optical element material, and thereafter making first and second shaping molds contact the floating optical element material at the same time, and pressurizing the optical element material by using the first and second shaping molds. | 2013-03-14 |
| 20130062796 | Method for Fabrication of an Optically Transparent and Electrically Conductive Structural Material - A method for fabrication of an optically transparent and electrically conductive structural material, that includes electrospinning a nanofibrillar mat of a polymer, casting a conductive material nanowire network onto the electrospun mat, embedding the electrospun mat containing the conductive material nanowire network into a mold with bulk monomer, and polymerizing the bulk monomer with the embedded electrospun mat containing the conductive material nanowire network to create an optically transparent and electrically conductive polymer. | 2013-03-14 |
| 20130062797 | METHOD FOR MANUFACTURING LENS WITH LIGHT SHIELD - A method for manufacturing a lens includes: providing a metal sheet and a stamping mold; forming a light shield of a predetermined shape and size from the metal sheet using the stamping mold; providing an injection mold, the injection mold defining a mold cavity, the mold cavity defining a molding surface that corresponds to the light shield in shape and size; placing the light shield in the mold cavity, wherein the light shield is pasted to the molding surface; and forming a lens with the light shield using the injection mold. | 2013-03-14 |
| 20130062798 | Method for manufacturing a modified optical fiber - A modified optical fiber comprises one Surface Light Field Emulation (s-LiFE) segment, comprising a core; a cladding; and multiple controlled nanoscale diffusion centers to emit light through the side of the optical fibers. Optionally, the modified optical fiber has a coating. The nanoscale diffusion centers are physical geometric patterns or composition patterns in the cladding or the coating. The s-LiFE optical fiber is a member of an illumination system further comprising a light source. The method of making of said s-LiFE optical fiber comprises a fiber spooning step. | 2013-03-14 |
| 20130062799 | METHOD FOR MANUFACTURING A TWO-DIMENSIONAL POLYMER OPTICAL WAVEGUIDE - The present invention relates to a method for manufacturing a two-dimensional polymer optical waveguide, which is used for manufacturing a two-dimensional optical waveguide through simplified processes using a single imprint original master. The method includes: replicating a pattern through a first hot-embossing process on a thermoplastic polymer sheet using a single original master; forming a buffer layer on the surface of the replicated pattern; manufacturing a polymer mold having a cladding pattern on the other side without a buffer layer through a second hot-embossing process using the original master; replicating a pattern by molding the polymer mold out of an elastic material and forming an upper elastic mold and a lower elastic mold by vertically separating the elastic material; and forming middle cladding using the upper and lower elastic molds, filling regions on and below the middle cladding with core resin patterns, and performing a curing process after stacking upper and lower cladding to form a two-dimensional optical waveguide. | 2013-03-14 |
| 20130062800 | Method for Producing Wafer Lens - A method for producing a wafer lens provided with a lens portion made of a photo-curable resin on one face of a substrate. The method includes a dispensing step, a curing step and a releasing step. In the dispensing step, a photo-curable resin material is dispensed on at least one of (i) a mold having a molding surface in a shape corresponding to an optical surface shape of the lens portion and (ii) the one face of the substrate. The photo-curable resin material has a viscosity of 10000 cP or more at 25° C. In the dispensing step, the photo-curable resin material is heated so that the viscosity of the photo-curable resin material becomes between 1000 cP and 10000 cP, and dispensed. | 2013-03-14 |
| 20130062801 | MULTICOLOR DENTAL BLANKS AND RELATED METHODS - A dental blank has at least an inner zone (or layer) of a first color and an outer zone (or layer) of a second color, wherein the inner and outer zones are concentric. The inner zone can be surrounded in its entirety by the outer zone such that only the outer zone is visible on all surfaces of the blank. Alternatively, the inner zone and the outer zone can extend to a same single surface of the blank, such that only the outer zone covers all remaining surfaces. The blank may also have an intermediate zone between the inner and outer zones. A method of fabrication includes solid free form processes, such as robocasting, laser sintering and 3D printing that allow for placement of multiple colors. A dental restoration made from the blank can have a variety of shades depending on a ratio of milled outer layers to internal layers. | 2013-03-14 |
| 20130062802 | MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR ABSORBENT - An absorbent manufacturing device forms an absorbent by depositing a liquid absorbent fiber and a super absorbent polymer in a deposition part. The absorbent manufacturing device includes: a plurality of suction holes that are provided in the deposition part, wherein the liquid absorbent fiber and the super absorbent polymer flowing inside a scattering duct are deposited in the deposition part by suction; a suction duct that is provided in communication with the suction holes and draws air so that the suction holes perform suction; and a separator that separates a super absorbent polymer of size equal to or larger than a certain size from a flow of air flowing in the suction duct and returns the separated super absorbent polymer to the scattering duct. | 2013-03-14 |
| 20130062803 | TIRE VULCANIZING METHOD, AND TIRE VULCANIZER - A tire vulcanizing method reduces consumption energy and increases productivity of vulcanization. This method involves supplying an inert gas to an internal space of the tire via a supply pipe, discharging the gas from the internal space via a return pipe, and supplying the gas from the return pipe to the supply pipe by a rotation type circulation device. A heating device heats the circulated gas. An internal outlet gas temperature sensor detects a temperature of the gas in the return pipe. A controller decreases a rotating speed of the circulation device when the return pipe gas temperature is a rotating speed decrease temperature or more. | 2013-03-14 |
| 20130062804 | GRANULATION METHOD AND GRANULATION APPARATUS - An object of the invention is to provide a granulation method and a granulation apparatus that can reduce the manufacturing costs of pellets. There is provided a granulation method which uses an underwater cutting (UWC) device | 2013-03-14 |
| 20130062805 | METHOD FOR PREPARATION OF IMITATION METAL ENGINEERING PLASTIC COMPOSITE MATERIAL - Plastic and metal are combined while maintaining the advantages of a method for preparation of an imitation metal engineering plastic composite material. The composition of the composite material comprises an engineering thermoplastic, a high-density filler, a mineral powder, a glass fiber, a toughener, a coupling agent, a lubricant and an antioxidant. The composite material features a high density, a high mechanical performance, an excellent thermal deformation temperature, and good plastic injection molding manufacturability. The method of combining the coupling agent and the optimal conditions of the particles are adopted to make the manufacturing simpler and easier, and a general twin-screw granulator can be used for producing granules, and a general plastic injection molding machine can be used in the plastic injection molding process. | 2013-03-14 |
| 20130062806 | POLYAMIDE RESIN-TYPE COMPOSITE MATERIAL AND METHOD OF PRODUCING SAME - A xylylenediamine-based polyamide resin/fiber composite material and molding are provided that do not exhibit a decline in properties under high temperatures and high humidities, and that exhibit a high elastic modulus and present little warping, and exhibit better recycle characteristics, a better moldability, and a better productivity than for thermosetting resins. | 2013-03-14 |
| 20130062807 | PROCESS FOR PRODUCING BIOPOLYMER NANOPARTICLES - In a process for producing a biopolymer nanoparticles, biopolymer feedstock and a plasticizer are fed to a feed zone of an extruder and the biopolymer feedstock is processed using shear forces. A crosslinking agent is added to the extruder downstream of the feed zone. The process has a production rate of at least 1.0 metric tons per hour. The feedstock and the plasticizer are preferably added separately to the feed zone. The extruder may have single flight elements in the feed zone. The temperatures in the intermediate section of the extruder are preferably kept above 100 C. The screw configuration may include two or more steam seal sections. Shear forces in a first section of the extruder may be greater than shear forces in an adjacent downstream section of the first section. In a post reaction section, water may be added to improve die performance. | 2013-03-14 |
| 20130062808 | CONFORMAL DELTOID NOODLE FOR A COMPOSITE STRUCTURE - A method of fabricating a conformal deltoid noodle includes providing a composite prepreg material having a predetermined length and a width, the predetermined length being aligned along a longitudinal axis; subjecting the composite prepreg material to a cutting process to form a notched section coextensive along the predetermined length; and rolling the composite prepreg material along its width to create the conformal deltoid noodle. | 2013-03-14 |
| 20130062809 | Sustained Release Ocular Drug Delivery Devices and Methods of Manufacture - A method for forming an ocular drug delivery device includes the steps of: (1) forming a drug core containing an active agent, wherein the drug core has a barrier disposed all surfaces thereof except for a drug release surface which is left free of the barrier; (2) forming a drug release membrane over the drug release surface; and (3) forming the remaining portion of the device body by an overcast (overmold) process. | 2013-03-14 |
| 20130062810 | INSERT MOLDING METHOD FOR CONNECTOR - To provide an insert molding method for a connector which enables terminals to be inserted easily into insertion destination places for the terminals. An insert-molding method for insert molding a connector | 2013-03-14 |
| 20130062811 | PLASTIC PUMP HOUSING AND MANUFACTURE THEREOF - A method of making a pump housing that is net-molded and immediately assumes its final shape and design specification without requiring more than de minimis secondary machining processes. The method utilizes molds and cores configured such that none of the fluid ports of the housing produced using the molds and cores have any intersecting geometry. | 2013-03-14 |
| 20130062812 | PRESS FOR PRODUCING A TAMPON - The invention relates to a method and a press ( | 2013-03-14 |
| 20130062813 | PLASTIC INJECTION PRODUCT MANUFACTURING SYSTEM AND METHOD - A plastic injection product manufacturing system includes a forming machine, a PLC module, an oil output module, an oil vat, and a cutter. The forming machine includes a mold cavity for forming a plastic injection product. The mold cavity defines a gate for receiving molten plastic material. The PLC module is connected to the forming machine. The oil output module is connected to the PLC module. The oil vat is connected to the oil output module. The oil vat includes a vat body and a piston slidably mounted in the vat body. The cutter is connected to the piston. The PLC module controls the oil output module to output hydraulic pressure oil, after receiving a control signal from the forming machine, to the vat body of the oil vat to drive the piston to move. The cutter is driven to move to cut off plastic material out of the gate. | 2013-03-14 |
| 20130062814 | INJECTION MOLDING MACHINE AND METHOD FOR MANUFACTURING PRODUCT - A method for manufacturing a product is provided. Inject a molten plastic in a cavity via a channel and a gate of a mold. Form a molten plastic product with a configuration of the cavity. Maintain a preset pressure in the cavity to maintain the configuration of the molten plastic product in the cavity. Slide a dam to into a position of the gate and remove the gate marks from the molten plastic products. Cool and harden the molten plastic product to form a solid product. Release the preset pressure. Move the dam away from the cavity. Eject the solid product out of the cavity. | 2013-03-14 |
| 20130062815 | ELECTROMAGNETICALLY ABSORBING COMPOSITION AND MANUFACTURING METHOD THEREOF - An electromagnetically absorbing composition and a manufacturing method thereof are provided. The manufacturing method includes steps of: a) 40 wt %-80 wt % of a fluid resin and 20 wt %-60 wt % of coffee grounds; b) mixing the fluid resin and the coffee grounds into homogeneous slurry through a mixing process; c) placing the slurry into a mold assembly; d) after curing and cooling, removing from the mold assembly the composition of a thickness of 0.5 mm-5.0 mm, with a reflection loss above 10 dB from 2 to 18 GHz. | 2013-03-14 |
| 20130062816 | Light irradiation molding apparatus and light irradiation molding method - A light irradiation molding apparatus includes a pair of rubber die units, which are formed of a rubber material having a property of transmitting light therethrough and form a cavity between facing sides which face each other, and a light irradiation device, which applies light to a particulate or solid thermoplastic resin arranged in the cavity through surfaces of a pair of the rubber die units. In the light irradiation molding apparatus a pair of the rubber die units are made to come close to each other while the thermoplastic resin arranged in the cavity is molten by the light applied from the light irradiation device, and a molded article of the thermoplastic resin is formed in the cavity having a reduced volume. | 2013-03-14 |
| 20130062817 | METHODS FOR MAKING OXIDATION RESISTANT POLYMERIC MATERIAL - The present invention relates to methods for making oxidation resistant medical devices that comprise polymeric materials, for example, ultra-high molecular weight polyethylene (UHMWPE). The invention also provides methods of making antioxidant-doped medical implants, for example, doping of medical devices containing cross-linked UHMWPE with vitamin E by diffusion, post-doping annealing, and materials used therein. | 2013-03-14 |
| 20130062818 | INJECTION MOLDING PROCESS AND COMPOSITIONS WITH IMPROVED SEALING CHARACTERISTICS FOR MOLD-IN-PLACE GASKETS - The present disclosure relates to liquid injection molding of a curable gasket composition to form mold-in-place gaskets. The curable gasket composition is prepared from at least an actinic radiation curable acrylic component and (meth)acrylate-functionalized silica. | 2013-03-14 |
| 20130062819 | APPARATUS AND METHODS FOR PRODUCING A CERAMIC GREEN BODY - An apparatus for producing a green body of ceramic-forming material can comprise a support device including at least one air bearing including a support surface with a plurality of apertures. In one example, the support surface is configured to circumscribe greater than 180° of a support area for the green body. In another example, the plurality of apertures include at least a quantity of apertures oriented with a fluid emitting axis extending at an oblique angle with respect to an extrusion axis. In still another example, the air bearing is adjustable. Methods for producing a green body also provide an air cushion between a support surface and the green body. | 2013-03-14 |
| 20130062820 | BINDER AND PROCESS FOR PRODUCING METALLIC OR CERAMIC MOLDINGS IN POWDER INJECTION MOLDING - The invention relates to binders for pulverulent metals, metal alloys or ceramics based on polyacetals, polyethers and polyesters, to thermoplastic compositions comprising these binders for the production of metallic or ceramic moldings, to the use thereof and to processes for production of moldings therefrom. | 2013-03-14 |
| 20130062821 | COIL SPRING FORMING APPARATUS AND COIL SPRING FORMED THEREBY - A coil spring forming apparatus including a core bar | 2013-03-14 |
| 20130062822 | FLUID-FILLED CYLINDRICAL VIBRATION-DAMPING DEVICE - A fluid-filled cylindrical vibration-damping device including at least one orifice member attached to an inside of an outer cylindrical member so as to straddle openings of pocket portions and extend in a circumferential direction. An orifice passage is defined by covering an orifice forming groove of the orifice member with the outer cylindrical member. A stopper mechanism is constituted by contact between an inner shaft member and the outer cylindrical member via the orifice member. A reinforcing rib is formed in the orifice member so as to project from a bottom face of the orifice forming groove and extend in the circumferential direction while a projecting distal end face thereof is in contact with the outer cylindrical member. The reinforcing rib partitions at least a portion of a circumference of the orifice passage into a plurality of passages that have same fluid flow characteristics. | 2013-03-14 |
| 20130062823 | Workbench - The workbench includes one or more trestle units ( | 2013-03-14 |
| 20130062824 | LIFT DEVICE FOR POWER TOOL - A lift device for selectively adjusting a vertical position of a power tool relative to a working surface of a plate of a work bench includes a carriage assembly securable to an underside of the plate. The carriage assembly includes a securement mechanism selectively adjustable for interchangeably securing a plurality of power tools of different cross-sectional dimensions to the carriage assembly. A drive assembly selectively moves the securement mechanism upward and downward relative to the plate to adjust the vertical position of the power tool relative to the working surface when the power tool is secured to the carriage assembly. A drive-locking mechanism selectively locks the drive assembly. The drive-locking mechanism includes a cam lock for selectively engaging the drive shaft to inhibit rotation of the drive shaft. | 2013-03-14 |
| 20130062825 | SHEET FINISHING APPARATUS AND SHEET FINISHING METHOD - According to one embodiment, a sheet finishing apparatus includes a finishing section configured to apply finishing to a sheet placed on a processing tray, a sheet discharging section configured to discharge the sheet subjected to the finishing to a stack tray via a discharge port, a roller attached to a shaft provided in parallel to the discharge port and which rotate in a first direction for guiding the sheet in the direction of the finishing section and a second direction for discharging the sheet, and an arm attached to the shaft to extend in the centrifuging direction from the shaft, rotate with the torque of the shaft, and idly rotate when force for regulating the torque acts. The arm flaps down the trailing end of the sheet on the stack tray onto the stack tray. | 2013-03-14 |
| 20130062826 | SHEET FEED ROLLER - A noncircular sheet feed roller includes a core and a rubber belt mounted on the core. The core includes a peripheral member having a peripheral surface which is arcuate about a center axis thereof, and a pair of support ribs which are provided opposite from the arcuate peripheral surface of the peripheral member to be spaced from the peripheral member by a space and extend parallel to the center axis symmetrically with respect to the center axis. The rubber belt is a looped belt which has a predetermined width as measured along the center axis and has an inner peripheral surface and an outer peripheral surface. The peripheral member is inserted in the rubber belt, and a portion of the rubber belt is fitted in the space between the peripheral member and the support ribs. | 2013-03-14 |
| 20130062827 | SHEET FEEDER AND IMAGE FORMING SYSTEM - A sheet feeder is disclosed for feeding sheets from a stack by one sheet in a sheet feeding direction, the one sheet being an uppermost sheet of the sheet stack. The sheet feeder includes: a sheet stacker for accommodating the sheet stack therein; a side fence to regulate side ends of the sheets and movable in a direction perpendicular to the sheet feeding direction; a slide shaft arranged in the side fence and extending in a vertical direction; a link member that swings as the side fence moves, a first end of the link member configured to be slidable along the slide shaft, and a second end of the link member configured to be pivotable about a pivot point, which is arranged on a side wall of the sheet stacker at a position lower than the first end; and a swing stopper unit that stops swing of the link member. | 2013-03-14 |
| 20130062828 | CUBE-SHERMAN SNAKE - An apparatus comprising: a plurality of sub-units; and one or more connecting members for connecting the plurality of sub-units together in a chain, wherein the plurality of sub-units is held together in the chain by the one or more connecting members disposed between the sub-units, wherein each sub-unit comprises at least one groove through which the connecting member, or one of the connecting members, is movable to allow adjacent sub-units to be rotated around at least one rotational axis relative to each other by a user, and wherein the apparatus further comprises a locking mechanism to lock adjacent sub-units together resisting rotation and resisting disengagement. | 2013-03-14 |
| 20130062829 | Apparatus for Betting-Type Card Game or Simulated Card Game - A game and method are described. The game includes a surface having a first set of betting areas, each area displaying a different representation of a playing card combination and a second set of betting areas each displaying a different representation of a card combination. There is also a card deck containing all of the cards of a standard deck but for those in the first and second sets. This deck is used during play to deal community cards. There are also sets of betting chips for the players to place bets on the betting areas, each set having means for distinguishing the chips of one set from chips of the other sets so that each betting chip indicates the player to whom it belongs. In one embodiment, there are low and high card betting areas for side bets on the denomination of a community card to be dealt. | 2013-03-14 |
| 20130062830 | Ring Toss Game - A disc toss game that comprises a ball placed in the center of a ring that can be knocked out of the ring to score points, with additional points and bonuses being awarded if the disc stays within the ring is disclosed in various embodiments of the present invention. The game of the present invention comprises a plurality of parts and can be adapted for indoor as well as outdoor enjoyment. | 2013-03-14 |
| 20130062831 | Table Game with Surface and Air Components - This invention is directed toward a table game with, optionally, both an “air game” and a “ground game”. This invention relates to the general field of table games, and more specifically to a large table game, similar in size to a ping pong or pool table, playable by one or more people. The theory behind the invention is to combine an “air game” (such as ping pong) with a “ground game” (such as pool) and do so in a flexible format that allows a number of people to participate in the game. The game can be played in an active fashion, similar to Ping-Pong, or as more of a set-up and strategy game, as in pool. A unique paddle-shaped hitting device with a hockey-stick like projection on its bottom portion allows for a player to play both the air game and the ground game using the same hitting device. | 2013-03-14 |
| 20130062832 | FLOW MACHINE, SLIDE RING SEAL THEREOF, BODY PART FOR SAID SLIDE RING SEAL AND METHOD OF FASTENING SAID SLIDE RING SEAL TO SAID FLOW MACHINE - Disclosed is a slide ring seal, which is used, for example, for sealing a shaft space of a centrifugal pump in relation to a pumping space thereof and to centering the mechanical seal and/or fastening the seal to the casing of the centrifugal pump and a body part used for the attachment. A feature of the disclosed seal, including at least one rotary slide ring unit, a body part by means of which the seal is attached to the casing, and at least one either separate counter ring unit or a counter ring unit stationarily attached to the body part, is that the body part is provided with inclined fastening means by means of which the body part ( | 2013-03-14 |
| 20130062833 | DEVICE FOR FIXING ELASTIC ELEMENTS - The invention relates to a device for sealing a gap between parts that are moved relative to one another, namely a fixing part, for fixing at least one elastic sealing element at an edge thereof, and a stop part along which another edge of at least one elastic sealing element runs, wherein the fixing part comprises, running along the gap, at least one groove in which are inserted one or more anchoring parts that engage through or around the sealing element and/or a retaining element that retains same. | 2013-03-14 |
| 20130062834 | BRUSH SEAL - An annular brush seal is disclosed including first and second annular clamp plates, each clamp plate including an opposed annular clamping surface, and a pack of radially extending bristles clamped between the clamping surfaces of the clamp plates. The clamping surface of at least one of the clamp plates is profiled, such that a separation between the clamping surfaces increases with decreasing radius. A brush seal is also disclosed including first and second clamp plates, each clamp plate including an opposed clamping surface, and a bristle pack clamped between the clamping surfaces of the clamp plates, wherein the clamping surface of at least one of the clamp plates includes a linear surface feature extending across the clamping surface and causing a step change in the profile of the clamping surface. | 2013-03-14 |
| 20130062835 | COMPRESSION RING AND ITS PRODUCTION METHOD - To provide a price-competitive compression ring having excellent thermal conductivity and thermal sag resistance, which can be used in a high-thermal-load environment of high-compression-ratio engines, steel identified by the material number of SUP10 in JIS G 4801, which contains small amounts of alloying elements, is used, and a piston ring wire is annealed before an oil-tempering treatment such that spheroidal cementite having an average particle size of 0.1-1.5 μm is dispersed in a tempered martensite matrix, thereby suppressing the movement of dislocation and creep even at 300° C., and improving thermal sag resistance. | 2013-03-14 |
| 20130062836 | SEALING STRUCTURE FOR LIQUID PASSAGE CONNECTION PART - When a sealing member held in a cavity of a housing is pressed by a cap toward the bottom of the cavity, the side surface of the sealing member is inclined to laterally expand. As a result, in the opening-side portion of the sealing member, the side surface is strongly pressed on the wall surface of the cavity, causing a strong friction force at the contact surface, which prevents the pressing force applied from the opening side from being transmitted to the bottom side. Therefore, at the beginning of the pressing operation, the internal stress of the sealing member is higher in the opening-side portion than in the bottom-side portion. With the lapse of time from the beginning of the pressing operation, the opening-side portion of the sealing member under the higher internal stress gradually moves toward the bottom side against the friction force. | 2013-03-14 |
| 20130062837 | SEAL STRUCTURE - Provided is a seal structure which can reduce the thickness of an electronic device, can be easily assembled and disassembles, and can exhibit an excellent seal performance. Thus, the seal structure for an electronic device, which seals a gap between a flexible wiring substrate inserted to a through-hole provided in a case member of an electronic device and the through-hole, is comprised of an annular gasket composed of a rubber elastic material, a part of which is integrally molded with the flexible wiring substrate, and a retainer plate for retaining the gasket in conjunction with the case member. | 2013-03-14 |
| 20130062838 | Wrench for Rotary Tool - A rotary tool includes a housing, a tool holder, and a wrench assembly. The housing includes an end portion having external threads. The tool holder extends from the end portion and includes a fastening member configured for movement between an unclamped position and a clamped position in which the tool holder can engage a tool. The wrench assembly includes a body portion and a wrench member. The body portion includes (i) a plurality of internal threads configured to meshingly engage the external threads and (ii) an opening through which a portion of the tool holder extends when the internal threads are meshingly engaged to the external threads. The wrench member includes a wrench surface configured to engage the fastening member. | 2013-03-14 |
| 20130062839 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber. | 2013-03-14 |
| 20130062840 | ICE SKATE - The center point of an ice skate rocker with respect to the plane of the skater's foot, in a skating position, is adjusted without changing the contour or profile of the skate blade. This is done by adjusting the angular position of the foot inside the skating boot with a shim placed under the heel or under the ball of the foot. | 2013-03-14 |
| 20130062841 | Off-road vehicle - Invented are narrow vehicles for operation on soft surfaces for agricultural use. These would enhance worker productivity and make the work more attractive. It is essential that such vehicles be simple and low cost to enable wide adaptation. | 2013-03-14 |
| 20130062842 | COMPACT, CARRY-ON BICYCLES HAVING A SHARED DRIVE-AND-CHASSIS SPACE - The teachings provided herein are generally directed to compact vehicle drive mechanisms that can be used in the design of a foldable, carry-on vehicle. The compact drive mechanisms presented herein, for example, have contributed to the advent of the compact, carry-on bicycles set-forth in the teachings which include drive-and-steering units and drive-and-chassis units. | 2013-03-14 |
| 20130062843 | Wheeled apparatus for transporting loads - Carts, trolleys, luggage or like load-carrying apparatus, are disclosed which incorporate two wheels which rotate about separate axes of rotation which are coplanar fixed relative to one another, and inclined to one another, preferably at an angle between 50° and 100°. They are mounted in such a way that when the apparatus rests with its wheels on horizontal ground, the plane containing the axes of rotation of the wheels may be moved to be vertical to allow the wheels to turn easily as the apparatus is moved along the ground, and moved away from vertical to cause the apparatus to be braked (as the wheels then try to travel in different directions). The assembly of wheels may be able to swivel over a narrow angular range relative to a base structure or frame. This principle may also be applied to three and four-wheeled load-carrying apparatus. | 2013-03-14 |
| 20130062844 | Wheelbarrow Configuration - Disclosed is a wheelbarrow that is easily moved and can be unloaded at either the front or rear end. One example embodiment of the wheelbarrow provides a frame and a container. A pivoting mechanism pivotally secures the container to the frame such that the container can be pivoted relative to the frame. A pair of handles is attached to the frame and a pair of wheels is coupled to the frame. A stabilizing assembly is coupled between the handles and the frame. The stabilizing assembly is selectively engaged during unloading of the wheelbarrow. | 2013-03-14 |
| 20130062845 | ROLLATOR WITH IMPROVED BRAKE DEVICE - A rollator includes a support frame assembly, a handgrip unit pivotable relative to the support frame assembly between depressed and non-depressed positions, at least three wheels mounted pivotally to a bottom portion of the support frame assembly, and at least one braking device including a brake wire unit connected to the handgrip unit, and a brake fixed to the support frame assembly at a location proximate to one of the wheels and connected to the brake wire unit. The brake includes a casing, a stop member, and a gear connected coaxially to one of the wheels. The stop member is movable between free and braking positions where the stop member is spaced apart from and is engaged with the gear, respectively. | 2013-03-14 |
| 20130062846 | COLLAPSIBLE FRAME STRUCTURE OF SCOOTER - A collapsible frame structure of a scooter is provided with a front and a rear frame mutually overlapped with each other and a collapsible unit is provided at the abutment between the front and the rear frame. The collapsible unit includes two connecting plates provided respectively at both sides of the front and the rear frames. Both ends of each connecting plate are pivotally connected respectively to the front and the rear frames. Further, latches and strikes capable of locking correspondingly with each other are respectively provided at both sides of the front and the rear frames. By this simple-design collapsible unit, manufacturing cost of the collapsible frame structure of scooter can be decreased, unfolding and collapsing of the front and the rear frame can be facilitated and robustness after the unfolding of the front and the rear frames can be ensured. | 2013-03-14 |
| 20130062847 | Interchangeable Deck and Neck System for Scooters - An interlocking neck and deck system for scooters includes an elongate deck having a front end with a longitudinal neck-receiving slot with a first profile and at least one lateral locking member receiver. A removable and interchangeable neck is engageable with the deck. The neck includes a lower mounting portion with a second profile complementary to the first profile of the neck-receiving slot and at least one lateral locking member receiver complementary to the at least one lateral locking member receiver of the deck. The neck also includes an upper stem-receiving portion comprising a bore. At least one lateral locking member is engageable with the lateral locking member receivers of the deck and neck when the removable neck is mated with the longitudinal neck-receiving slot of the deck. | 2013-03-14 |
| 20130062848 | ROLLATOR HAVING AN ADJUSTABLE SEAT ORIENTATION - A rollator includes a support frame assembly, a seat having first and second positioning notches, and a backrest unit including a backrest frame having two opposite ends pivoted to the support frame assembly, and a positioning frame having two opposite ends pivoted to the backrest frame. The positioning frame is engageable with a selected one of the first and second positioning notches. The backrest frame cooperates with the seat unit to define a seating space that faces rearward when the positioning frame is engaged with the first positioning notch, and cooperates with the seat unit to define a seating space that faces forward when the positioning frame is engaged with the second positioning notch. | 2013-03-14 |
| 20130062849 | CTBA WITH IMPROVED COMPLIANCE CHARACTERISTICS - A CTBA with improved compliance characteristics has a simple structure and can control a tow value of a rear wheel to be towed in while steering is performed in. The CTBA may include trailing arms and carriers on which rear wheels are mounted via carrier brackets at both ends of a torsion beam, a mounting bracket fixed to the bottom of a vehicle body, and a steering rod of which one end is linked to the carrier and the other end is linked to the mounting bracket. | 2013-03-14 |
| 20130062850 | CTBA WITH IMPROVED COMPLIANCE CHARACTERISTICS - A coupled torsion beam axle (CTBA) has improved compliance characteristics that can control a tow value of a rear wheel to be towed in during steering when the steering is performed in a simple structure. The CTBA includes trailing arms and carriers on which rear wheels are mounted via carrier brackets at both ends of a torsion beam, respectively, a center pipe penetrating in a longitudinal direction of a vehicle at the center of the torsion beam, and a steering rod of which one end is linked to the carrier and the other end is linked to the center pipe. | 2013-03-14 |
| 20130062851 | VEHICLE SUSPENSION DEVICE - Four electromagnetic shock absorbers ( | 2013-03-14 |
| 20130062852 | DEVICE FOR ATTACHING A SUSPENSION TO A VEHICLE FRAME AND RELATED METHOD - A method for securing a suspension may include attaching a frame interface device to a vehicle frame and aligning a first connector set. Two first connectors may straddle a second connector, or a first connector may be straddled by two second connectors, when the connector set is aligned. These aligned connectors may be secured by a fastener, thereby securing the suspension to the frame. A suspension attachment system may include a hanger bracket of a suspension, a frame interface device, and a connector set. Two first connectors may straddle a second connector when the connector set is aligned. The suspension may be secured to the frame as a result of the aligned and secured connector set. | 2013-03-14 |
| 20130062853 | SUSPENSION ARM ATTACHMENT STRUCTURE - A suspension arm attachment structure provided with a cylindrical vibration-damping bush which is attached to the side of a vehicle body via a core member. The attachment structure is provided with: a suspension arm having an attachment tube part fitted with a vibration-damping bush; and a retaining member which regulates the movement of the attachment tube part in the axial longitudinal direction. The retaining member is provided with: facing walls on sides thereof which respectively face end surfaces of the vibration-damping bush; a linking part which integrally links the facing walls; and an attachment part on one end and an attachment part on the other end which respectively extend in the axial longitudinal direction of a core member from the facing surface on one side and the facing surface on the other side and which are attached to the side of a vehicle body. | 2013-03-14 |
| 20130062854 | TORSION SUSPENSION SYSTEM - A torsion suspension system of the present disclosure includes a vehicle frame and a bar group rotatably coupled to the vehicle frame. In an embodiment, the bar group includes a bolster tube. The bolster tube has an opening through an elongated side of the bolster tube. A torsion bar is positioned through the opening and has opposite ends extending outward of the opening. A plurality of elastomeric cords are positioned adjacent the torsion bar in the opening. The cords are sized to resist and dampen relative rotation between the opening and the torsion bar. The opposite ends of the torsion bar couple with the vehicle frame. | 2013-03-14 |
| 20130062855 | SEPARATED PRIMARY SPRING AND SECONDARY LEAF SUSPENSION FOR VEHICLE - A suspension for a vehicle having a chassis rail and a longitudinal axle arranged substantially orthogonal thereto. The vehicle suspension has a primary spring, which may be a leaf spring having a first end for pivotally coupling to the chassis of the vehicle at a first primary pivot coupling, and a distal second end for pivotally coupling to the chassis of the vehicle at a second primary pivot coupling. The primary spring can be a coil spring. A secondary leaf spring has a first end for pivotally coupling to the chassis of the vehicle at a secondary pivot coupling, and a second end for coupling to the axle. The longitudinal configuration of the secondary leaf spring is arranged to be angularly displaced with respect to the longitudinal configuration of the primary leaf spring. The first primary pivot coupling and the secondary pivot coupling are arranged to be substantially coplanar. | 2013-03-14 |
| 20130062856 | Load Cushion for Vehicle Suspension - A tie-plate comprising a lower mounting flange that is removably attachable to a first frame hanger and to a second frame hanger, wherein the lower mounting flange includes a first set of attachment holes that correspond to a set of attachment holes at the first frame hanger, wherein the lower mounting flange includes a second set of attachment holes that correspond to a set of attachment holes at the second frame hanger, an extending member having a first end that extends at an angle from the lower mounting flange; and an upper mounting flange extending from a second end of the extending member, wherein the upper mounting flange has one or more mounting holes adapted for attachment of the tie-plate to an undercarriage of a vehicle. | 2013-03-14 |
| 20130062857 | WHEELCHAIR WITH LEVER DRIVETRAIN - A manually powered wheelchair includes a first lever associated with a first rear wheel and demountably coupled to a first drivetrain, the first lever having a first brake thereon. The wheelchair also includes a second lever associated with a second rear wheel and demountably coupled to a second drivetrain, the second lever having a second brake thereon. Each drivetrain includes a chainring, a chain, and a freewheel, and each drivetrain has a fixed gear ratio. The freewheel of each drivetrain is actuated by manual pivoting of the lever associated therewith. In use, the wheelchair achieves changes in mechanical advantage when a user shifts the user's hands up and down the first and second levers. | 2013-03-14 |
| 20130062858 | RECONFIGURABLE TILT WHEELCHAIR - A modular wheelchair assembly is adapted to be reconfigured between a fixed angle of tilt, a dynamically adjustable tilt-in-space configuration with the tilt axis being near the user's knees and a dynamically adjustable tilt-in-space configuration with the tilt axis being near the user's center of gravity. The reconfiguration is achieved by modifying a limited number of selectively removable components of the support assembly or the pivot assembly of the wheelchair. | 2013-03-14 |
| 20130062859 | DRIVE-AND-STEERING MECHANISMS USED IN THE DESIGN OF COMPACT, CARRY-ON VEHICLES - The teachings provided herein are generally directed to compact vehicle drive mechanisms that can be used in the design of a foldable, carry-on vehicle. The compact drive mechanisms presented herein, for example, have contributed to the advent of the compact, carry-on bicycles set-forth in the teachings which include drive-and-steering units and drive-and-chassis units. | 2013-03-14 |
| 20130062860 | Articulated Chassis System of Large Articulated Vehicle - The present invention relates to an articulated chassis system of large articulated vehicle, which comprises a front beam, a spherical hinge connecting structure, a front frame, a turnplate bearing, a rear frame, a rear beam and a turning angle sensing means, the front beam is connected with the front frame through the spherical hinge connecting structure, the turnplate bearing comprises an inner ring and an outer ring, the front frame is connected fixedly with the outer ring/the inner ring, the rear frame is connected fixedly with the inner ring/the outer ring, the inner ring and the outer ring can rotate relatively, the rear frame is connected with the rear beam, the turning angle sensing means is arranged between the inner ring/the outer ring and the front frame/the rear frame. Preferably, the articulated chassis system of large articulated vehicle further comprises a hydraulic damping buffer system arranged between the front frame and the rear frame, the turning angle sensing means comprises an angle sensor, a first angle sensor and a second angle sensor, the spherical hinge connecting structure comprises a spherical hinge bracket structure and a spherical hinge. The present invention is designed uniquely and skillfully, has a simple and compact structure, is easy to install, so as to enhance the safety, stability and durability of the articulated chassis system of large articulated vehicle, and lower the cost, therefore the present invention is suitable for large-scale popularization. | 2013-03-14 |
| 20130062861 | BRAKING DEVICE FOR A BINDING FOR A GLIDING BOARD - A braking device for a gliding board, such as a ski, that includes a plate adapted to be fixed on an upper surface of the gliding board; two braking arms movable between a gliding position and a braking position; and two flanges, each guiding a braking arm. Each flange is rotationally movable in relation to the plate about separate axes of rotation. | 2013-03-14 |
