09th week of 2013 patent applcation highlights part 10 |
Patent application number | Title | Published |
20130049099 | Semiconductor Device - A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section. | 2013-02-28 |
20130049100 | METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE - The invention relates to a power semiconductor device and its preparation methods thereof. Particularly, the invention aims at providing a method for reducing substrate contribution to the Rdson (drain-source on resistance) of power MOSFETs, and a power MOSFET device made by the method. By forming one or more bottom grooves at the bottom of Si substrate, the on resistance of the power MOSFET device attributed to the substrate is effectively reduced. A matching lead frame base complementary to the substrate with bottom grooves further improves the package of the power MOSFET device. | 2013-02-28 |
20130049101 | SEMICONDUCTOR DEVICES UTILIZING PARTIALLY DOPED STRESSOR FILM PORTIONS AND METHODS FOR FORMING THE SAME - A semiconductor structure and method for forming the same provide a high mobility stressor material suitable for use as source/drain regions or other active devices. The structure is formed in a substrate opening and is doped with an impurity such as boron in upper portions but is void of the impurity in regions that contact the surfaces of the opening. The structure is therefore resistant to out-diffusion of the dopant impurity during high temperature operations and may be formed through selective deposition using reduced pressure chemical vapor deposition or reduced pressure epitaxial deposition. | 2013-02-28 |
20130049102 | Buried field ring field effect transistor (BUF-FET) integrated with cells implanted with hole supply path - This invention discloses a semiconductor power device formed in a semiconductor substrate comprises a highly doped region near a top surface of the semiconductor substrate on top of a lightly doped region. The semiconductor power device further comprises a body region, a source region and a gate disposed near the top surface of the semiconductor substrate and a drain disposed at a bottom surface of the semiconductor substrate. The semiconductor power device further comprises source trenches opened into the highly doped region filled with a conductive trench filling material in electrical contact with the source region near the top surface. The semiconductor power device further comprises a buried field ring regions disposed below the source trenches and doped with dopants of opposite conductivity from the highly doped region. In an alternate embodiment, the semiconductor power device further comprises doped regions surrounded the sidewalls of the source trenches and doped with a dopant of a same conductivity type of the buried field ring regions to function as a charge supply path. | 2013-02-28 |
20130049125 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device structure and a method for manufacturing the same are disclosed. In one embodiment, the method comprises: forming a fin in a first direction on a semiconductor substrate; forming a gate line in a second direction crossing the first direction on the semiconductor substrate, the gate line intersecting the fin via a gate dielectric layer; forming a dielectric spacer surrounding the gate line; forming a conductive spacer surrounding the dielectric spacer; and performing inter-device electrical isolation at a predetermined region, wherein isolated portions of the gate line form gate electrodes of respective unit devices, and isolated portions of the conductive spacer form contacts of the respective unit devices. | 2013-02-28 |
20130049126 | Methods of Forming a Semiconductor Device with Recessed Source/Drain Regions, and a Semiconductor Device Comprising Same - In one example, a method disclosed herein includes forming a gate electrode structure for a PMOS transistor and a gate electrode structure for a NMOS transistor, forming a plurality of cavities in the substrate proximate the gate electrode structure of the PMOS transistor and performing an epitaxial deposition process to form raised silicon-germanium regions is the cavities. The method concludes with the step of performing a common etching process on the PMOS transistor and the NMOS transistor to define recessed regions in the substrate proximate the gate electrode structure of the NMOS transistor and to reduce the amount of the silicon-germanium material positioned above the surface of the substrate for the PMOS transistor. | 2013-02-28 |
20130049133 | SEMICONDUCTOR DEVICE - A semiconductor device that includes transistors having the same polarity consumes less power and can prevent a decrease in amplitude of a potential output. The semiconductor device includes a first wiring having a first potential, a second wiring having a second potential, a third wiring having a third potential, a first transistor and a second transistor having the same polarity, and a plurality of third transistors for selecting supply of the first potential to gates of the first transistor and the second transistor or supply of the third potential to the gates of the first transistor and the second transistor and for selecting whether to supply one potential to drain terminals of the first transistor and the second transistor. A source terminal of the first transistor is connected to the second wiring, and a source terminal of the second transistor is connected to the third wiring. | 2013-02-28 |
20130049134 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME - In a semiconductor device and a method of making the same, a first transistor has a gate stack comprising an underlying layer formed of a first material and an overlying layer formed of a second material. A second transistor has a gate stack comprising an underlying layer formed of a third material and an overlying layer formed of the second material. A third transistor has a gate stack comprising an underlying layer formed of the first material and an overlying layer formed of a fourth material. A fourth transistor has a gate stack comprising an underlying layer formed of the third material and an overlying material formed of the fourth material. Each of the first through fourth materials has a respectively different work function, so that each of the first through fourth transistors has a respectively different threshold voltage. | 2013-02-28 |
20130049141 | METAL GATE STRUCTURE AND FABRICATION METHOD THEREOF - A metal gate structure located on a substrate includes a gate dielectric layer, a metal layer and a titanium aluminum nitride metal layer. The gate dielectric layer is located on the substrate. The metal layer is located on the gate dielectric layer. The titanium aluminum nitride metal layer is located on the metal layer. | 2013-02-28 |
20130049142 | TRANSISTOR WITH REDUCED PARASITIC CAPACITANCE - Scaled transistors with reduced parasitic capacitance are formed by replacing a high-k dielectric sidewall spacer with a SiO | 2013-02-28 |
20130049145 | RADIATION DETECTOR AND A METHOD FOR PRODUCING A METALCARBON JUNCTION FOR A RADIATION DETECTOR - A radiation detector comprising a metal-carbon junction wherein a layer of carbon ( | 2013-02-28 |
20130049146 | DETECTOR ELEMENT, RADIATION DETECTOR AND MEDICAL DEVICE CONTAINING THE DETECTOR ELEMENTS, AND METHOD FOR PRODUCING A DETECTOR ELEMENT - A detector element is disclosed with a semi-conductive converter element and metal contacts arranged thereon for at least one anode and at least one cathode, wherein at least one of the metal contacts comprises a contact layer made from a contact material based on precious metal and ruthenium as its mixed component. Moreover, an embodiment of the invention concerns a radiation detector with the detector element with a ruthenium-containing contact layer and, optionally, with an evaluation unit to read out a detector signal, as well as a medical device with the radiation detector. Furthermore, a method for the production of a detector element is described which includes the installation step of a contact material of at least one of the metal contacts on the converter element, wherein the contact material includes a precious metal base with ruthenium as its mixed component. | 2013-02-28 |
20130049149 | METHOD OF FORMING PATTERN, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND ACTINIC-RAY- OR RADIATION-SENSITIVE FILM - Provided is a method of forming a pattern, including forming an actinic-ray- or radiation-sensitive resin composition into a film, the actinic-ray- or radiation-sensitive resin composition including a resin (A) including a repeating unit containing a group that when acted on by an acid, is decomposed to thereby produce a polar group and including an aromatic group, which resin when acted on by an acid, decreases its solubility in an organic solvent, a nonionic compound (B) that when exposed to actinic rays or radiation, generates an acid and a solvent (C), exposing the film to actinic rays or radiation, and developing the exposed film with a developer including an organic solvent to thereby form a negative pattern. | 2013-02-28 |
20130049150 | FORMATION OF METAL NANOSPHERES AND MICROSPHERES - Hemispheres and spheres are formed and employed for a plurality of applications. Hemispheres are employed to form a substrate having an upper surface and a lower surface. The upper surface includes peaks of pillars which have a base attached to the lower surface. The peaks have a density defined at the upper surface by an array of hemispherical metal structures that act as a mask during an etch to remove substrate material down to the lower surface during formation of the pillars. The pillars are dense and uniform and include a microscale average diameter. The spheres are formed as independent metal spheres or nanoparticles for other applications. | 2013-02-28 |
20130049153 | LIGHT PIPE ETCH CONTROL FOR CMOS FABRICATION - In accordance with at least some embodiments of the present disclosure, a process for fabricating a light pipe (LP) is described. The process may be configured to construct a semiconductor structure having an etch-stop layer above a photodiode region and a first dielectric layer above the etch-stop layer. The process may be configured to etch a LP funnel through the first dielectric layer. And the process may be further configured to stop the etching of the LP funnel upon reaching and removing of the etch-stop layer. | 2013-02-28 |
20130049154 | DEVICE AND METHOD FOR INDIVIDUAL FINGER ISOLATION IN AN OPTOELECTRONIC DEVICE - An optoelectronic device including at least one of a solar device, a semiconductor device, and an electronic device. The device includes a semiconductor unit. A plurality of metal fingers is disposed on a surface of the semiconductor unit for electrical conduction. Each of the metal fingers includes a pad area for forming an electrical contact. The optoelectronic device includes a plurality of pad areas that is available for connection to a bus bar, wherein each of the metal fingers is connected to a corresponding pad area for forming an electrical contact. | 2013-02-28 |
20130049155 | PHOTOSITE WITH PINNED PHOTODIODE - A photosite is formed in a semiconductor substrate and includes a photodiode confined in a direction orthogonal to the surface of the substrate. The photodiode includes a semiconductor zone for storing charge that is formed in an upper semiconductor region having a first conductivity type and includes a main well of a second conductivity type opposite the first conductivity type and laterally pinned in a first direction parallel to the surface of the substrate. The photodiode further includes an additional semiconductor zone including an additional well having the second conductivity type that is buried under and makes contact with the main well. | 2013-02-28 |
20130049156 | SOLID-STATE IMAGING APPARATUS - In a region of a weak internal electric field, photocharges generated in a region deeper than the photodiode are diffused laterally to lower the sensitivity by photoelectrons flowing into adjacent pixels, etc (crosstalk). An anti-crosstalk layer is disposed in the photodiode forming portion, and between a pixel region and a peripheral circuit region. Crosstalk between a pixel and a pixel or between a pixel region and a peripheral circuit region is decreased to improve the photosensitivity. | 2013-02-28 |
20130049167 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a semiconductor device including a metal dummy pattern and a thin film resistor. In detail, a semiconductor device includes a semiconductor substrate, a thin film resistor, and a metal dummy pattern. The thin film resistor disposed over the semiconductor substrate and extending in a first direction relative to the semiconductor substrate. The metal dummy pattern disposed between the semiconductor substrate and the thin film resistor, the metal dummy pattern including a reflective pattern extending in the first direction semiconductor substrate and spatially corresponding to a periphery of the thin film resistor. | 2013-02-28 |
20130049168 | RESISTOR AND MANUFACTURING METHOD THEREOF - A method for forming a resistor integrated with a transistor having metal gate includes providing a substrate having a transistor region and a resistor region defined thereon, forming a transistor having a polysilicon dummy gate in the transistor region and a polysilicon main portion with two doped regions positioned at two opposite ends in the resistor region, performing an etching process to remove the polysilicon dummy gate to form a first trench and remove portions of the doped regions to form two second trenches, and forming a metal gate in the first trench to form a transistor having the metal gate and metal structures respectively in the second trenches to form a resistor. | 2013-02-28 |
20130049173 | WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING - A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits. | 2013-02-28 |
20130049174 | WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING - A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits. | 2013-02-28 |
20130049175 | WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING - A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits. | 2013-02-28 |
20130049176 | METHOD FOR PRODUCING A SEMICONDUCTOR - A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a target depth of the semiconductor body; bonding the first side of the semiconductor body to a carrier substrate; forming an n-doped zone in the semiconductor body by heating the semiconductor body such that a pn junction arises in the semiconductor body; and removing the second side of the semiconductor body at least as far as a space charge zone spanned at the pn junction. | 2013-02-28 |
20130049177 | WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING - A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits. | 2013-02-28 |
20130049178 | WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING - A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits. | 2013-02-28 |
20130049179 | LOW COST HYBRID HIGH DENSITY PACKAGE - A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly. | 2013-02-28 |
20130049180 | QFN DEVICE AND LEAD FRAME THEREFOR - A lead frame for a quad flat no-lead (QFN) type semiconductor device package includes a die pad, a plurality of leads that surround the die pad. The outer edge of leads includes a channel that extends from a lower surface to an upper surface of the leads. A semiconductor die is attached to the die pad. An inner edge of each lead is electrically connected to a corresponding bonding pad on the semiconductor die. The assembly is covered with an encapsulation material except that the outer edge of each lead and the corresponding channel are exposed. The channel allows solder to flow up the outer edge of a lead when the QFN device is soldered to a substrate, which improves the ability to perform visual inspection of the solder-lead connection. | 2013-02-28 |
20130049183 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 2013-02-28 |
20130049184 | ELECTRIC DEVICE AND PRODUCTION METHOD THEREFOR - An electronic device includes a support substrate | 2013-02-28 |
20130049189 | SEMICONDUCTOR FLIP-CHIP SYSTEM HAVING THREE-DIMENSIONAL SOLDER JOINTS - A solder joint between a trace ( | 2013-02-28 |
20130049190 | METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES - Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes depositing a layer of a first metallic material on a semiconductor chip. The first layer has a first physical quantity. A layer of a second metallic material is deposited on the layer of the first metallic material. The second layer has a second physical quantity. The first and second layers are reflowed to form a solder structure with a desired ratio of the first metallic material to the second metallic material. | 2013-02-28 |
20130049193 | FORMATION OF THROUGH-SILICON VIA (TSV) IN SILICON SUBSTRATE - To form a through-silicon via (TSV) in a silicon substrate without using plating equipment or using sputtering equipment or small metal particles, and form an interlayer connection by stacking a plurality of such silicon substrates, a through hole of a silicon substrate is filled using molten solder itself. In detail, solid solder placed above the through hole of the silicon substrate is molten and the molten solder is guided to and filled in the internal space. A metal layer can be deposited on an internal surface of the through hole beforehand, and also an intermetallic compound (IMC) can be formed in a portion other than the metal layer. | 2013-02-28 |
20130049194 | SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE - A semiconductor device including a semiconductor substrate and a conductive post overlying and electrically connected to the substrate. The semiconductor device further includes a manganese-containing protection layer on a surface of the conductive post. A method of forming a semiconductor device. The method includes forming a bond pad region on a semiconductor substrate. The method further includes forming a conductive post overlying and electrically connected to the bond pad region. The method further includes forming a protection layer on a surface of the conductive post, wherein the protection layer comprises manganese (Mn). | 2013-02-28 |
20130049195 | Three-Dimensional Integrated Circuit (3DIC) Formation Process - A method includes performing a laser grooving to remove a dielectric material in a wafer to form a trench, wherein the trench extends from a top surface of the wafer to stop at an intermediate level between the top surface and a bottom surface of the wafer. The trench is in a scribe line between two neighboring chips in the wafer. A polymer is filled into the trench and then cured. After the step of curing the polymer, a die saw is performed to separate the two neighboring chips, wherein a kerf line of the die saw cuts through a portion of the polymer filled in the trench. | 2013-02-28 |
20130049196 | THROUGH INTERPOSER WIRE BOND USING LOW CTE INTERPOSER WITH COARSE SLOT APERTURES - A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts arranged so as to have a pitch of 200 microns or less. First and second microelectronic elements are respectively electrically connected to the first and second contacts. Wire bonds may be used to connect the second element contacts with the second contacts. A second substrate may underlie either the first or the second microelectronic elements and be electrically interconnected with the first substrate. The second substrate may have terminals configured for electrical connection to a component external to the microelectronic package. A monolithic encapsulant may contact the first and second microelectronic elements and the first and second substrates. | 2013-02-28 |
20130049197 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of semiconductor package structure includes: providing a first dielectric layer having multiple through holes; providing a second dielectric layer having multiple conductive vias and a chip-containing opening; laminating the second dielectric layer onto the first dielectric layer; disposing a chip in the chip-containing opening and adhering a rear surface of the chip onto the first dielectric layer exposed by the chip-containing opening; forming a redistribution circuit layer on the second dielectric layer wherein a part of the redistribution circuit layer extends from the second dielectric layer onto an active surface of the chip and the conductive vias so that the chip electrically connects the conductive vias through the partial redistribution circuit layer; forming multiple solder balls on the first dielectric layer wherein the solder balls are in the through holes and electrically connect the chip through the conductive vias and the redistribution circuit layer. | 2013-02-28 |
20130049198 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor package structure is provided. A chip is provided. An active surface of the chip is disposed on a carrier. A molding compound is formed on the carrier with a metal layer disposed thereon. The metal layer has an upper and lower surface, multiple cavities formed on the upper surface and multiple protrusions formed on the lower surface and corresponding to the cavities. The protrusions are embedded in the molding compound. The metal layer is patterned to form multiple pads on a portion of the molding compound. The carrier and the molding compound are separated. Multiple through holes are formed on the molding compound exposing the protrusions. A redistribution layer is formed on the molding compound and the active surface of the chip. Multiple solder balls are formed on the redistribution layer. A portion of the solder balls are correspondingly disposed to the pads. | 2013-02-28 |
20130049205 | Semiconductor Device and Method of Manufacturing a Semiconductor Device Including Grinding Steps - A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time. | 2013-02-28 |
20130049206 | Bond Pad Configurations for Controlling Semiconductor Chip Package Interactions - Generally, the subject matter disclosed herein relates to sophisticated semiconductor chips that may be less susceptible to the occurrence of white bumps during semiconductor chip packaging operations, such as flip-chip or 3D-chip assembly, and the like. One illustrative semiconductor chip disclosed herein includes at least one integrated circuit device and a bond pad that is electrically connected to the at least one integrated circuit device. Furthermore, the bond pad has an irregular overall configuration when viewed from above that corresponds to a first area portion that is defined by a first substantially regular geometric shape when viewed from above and a second area portion adjacent to the first area portion. Additionally, the second area portion is located at a greater distance from a centerline of the semiconductor chip than any part of the first area portion when viewed from above, and the bond pad is electrically connected to the at least one integrated circuit device. | 2013-02-28 |
20130049207 | MULTIPLE STEP ANNEAL METHOD AND SEMICONDUCTOR FORMED BY MULTIPLE STEP ANNEAL - A method of annealing a semiconductor and a semiconductor. The method of annealing including heating the semiconductor to a first temperature for a first period of time sufficient to remove physically-adsorbed water from the semiconductor and heating the semiconductor to a second temperature, the second temperature being greater than the first temperature, for a period of time sufficient to remove chemically-adsorbed water from the semiconductor. A semiconductor device including a plurality of metal conductors, and a dielectric including regions separating the plurality of metal conductors, the regions including an upper interface and a lower bulk region, the upper interface having a density greater than a density of the lower bulk region. | 2013-02-28 |
20130049208 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REDISTRIBUTION LAYER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a peripheral interconnect having a bond finger and a contact pad with a trace in direct contact with the bond finger and the contact pad, the bond finger vertically offset from the contact pad; connecting an integrated circuit die and the bond finger; and forming a module encapsulation on the integrated circuit die, the bond finger and the trace exposed from the module encapsulation. | 2013-02-28 |
20130049209 | SEMICONDUCTOR DEVICE WITH DAMASCENE BIT LINE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes first conductive patterns adjacent to each other and isolated by a trench including first and second trenches, a second conductive pattern formed in the first trench, and an insulating pattern partially filling the second trench under the second conductive pattern and formed between the first conductive patterns and the second conductive pattern. | 2013-02-28 |
20130049210 | SEMICONDUCTOR WAFER AND LAMINATE STRUCTURE INCLUDING THE SAME - According to one embodiment, a semiconductor wafer includes a semiconductor substrate and an interconnect layer formed on the semiconductor substrate. In the semiconductor wafer, the semiconductor substrate includes a first region that is located on the outer periphery side of the semiconductor substrate and that is not covered with the interconnect layer. The interconnect layer includes a second region where the upper surface of the interconnect layer is substantially flat. A first insulating film is formed in the first region. The upper surface of the interconnect layer within the second region and the upper surface of the first insulating film substantially flush with each other. | 2013-02-28 |
20130049217 | SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION USING DROP-IN SIGNAL CONDUITS - A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequently embedded in an encapsulated semiconductor device package. The ends of the signal conduits are exposed and the signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package. Holders can be provided in a variety of geometries and materials, depending upon the nature of the application. Further, multiple holders with signal conduits can be provided in a single package to provide for more complex interconnect configuration demands in, for example, system-in-a-package applications. | 2013-02-28 |
20130049218 | SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION - A method for forming signal conduits before encapsulation for incorporation as through vias in a semiconductor device package is provided. One or more signal conduits are formed through photolithography and metal deposition on a metal film or substrate. After removing photoresistive material, the semiconductor device package is built by encapsulating the signal conduits along with any semiconductor die and other parts of the package. The ends of the signal conduits are exposed and the signal conduits can then be used as through vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package, and electrical contacts of the semiconductor die. Using this method, signal conduits can be provided in a variety of geometric placings in the semiconductor device package. A semiconductor device package including the signal conduits made from the above method is also provided. | 2013-02-28 |
20130049219 | Semiconductor Device and Method for Forming the Same - A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate. | 2013-02-28 |
20130049220 | Through Silicon Via Keep Out Zone Formation Method and System - Keep out zones (KOZ) are formed for a through silicon via (TSV). A device can be placed outside a first KOZ of a TSV determined by a first performance threshold so that a stress impact caused by the TSV to the device is less than a first performance threshold while the first KOZ contains only those points at which a stress impact caused by the TSV is larger than or equal to the first performance threshold. A second KOZ for the TSV can be similarly formed by a second performance threshold. A plurality of TSVs can be placed in a direction that the KOZ of the TSV has smallest radius to a center of the TSV, which may be in a crystal orientation [010] or [100]. A plurality of TSV stress plug can be formed at the boundary of the overall KOZ of the plurality of TSVs. | 2013-02-28 |
20130049221 | SEMICONDUCTOR PACKAGE HAVING PLURAL SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE SAME - A semiconductor package includes a first semiconductor chip mounted to a substrate, a first encapsulant covering the first semiconductor chip and have first to fourth sidewall surfaces, and a chip stack mounted to the substrate and disposed on the first encapsulant. The chip stack includes a plurality of second semiconductor chips. A second encapsulant covers the chip stack. The second encapsulant may cover the first sidewall surface of the first encapsulant and expose the third sidewall surface of the first encapsulant. | 2013-02-28 |
20130049222 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes forming select lines extending in a second direction crossing a first direction on a semiconductor substrate, wherein the semiconductor substrate has active regions separated by an isolation layer and extending in the first direction, forming junctions by implanting first impurities into the active regions, respectively, between the select lines and forming a plurality of oxide layers filled between the select lines, forming contact holes exposing the junctions by etching at least one of the plurality of oxide layers, forming junction extensions by implanting second impurities into the active regions of the semiconductor substrate exposed due to loss of the isolation layer while the contact holes are formed, and forming contact plugs for filling the contact holes. | 2013-02-28 |
20130049227 | PACKAGE STACKS AND METHOD OF MANUFACTURING THE SAME - A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member. | 2013-02-28 |
20130049228 | SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME - A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate. | 2013-02-28 |
20130049229 | SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION - Various methods and apparatus for establishing thermal pathways for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor chip that has a substrate and a first active circuitry portion extending a first distance into the substrate. A barrier is formed in the first semiconductor chip that surrounds but is laterally separated from the first active circuitry portion and extends into the substrate a second distance greater than the first distance. | 2013-02-28 |
20130049230 | STACKING METHOD AND STACKING CARRIER - A stacking carrier and a stacking method are provided. The stacking method is used between a wafer and a stacking carrier having the same shape. The stacking method includes the following steps. Firstly, an adhesive layer is coated on a surface of the carrier. Then, the adhesive layer corresponding to an edge of the carrier is partially removed, thereby defining at least one adhesive layer indentation. Afterwards, the wafer is stacked on the carrier through the adhesive layer having the adhesive layer indentation. | 2013-02-28 |
20130049235 | AERATION DEVICE - Aeration devices for generating bubbles in a flow of water are disclosed including an aerator body ( | 2013-02-28 |
20130049236 | Device and Method for Dispensing Volatile Compounds and Cartridge for Use Therewith - A device for dispensing and/or diffusing a volatile compound such as a fragrance, or other similarly volatile compounds, comprises a controller unit connected to a motorized fan unit for producing an airflow in an airflow path between an air inlet and an air outlet. The device also comprises a removable cartridge containing a substrate bearing the volatile compound(s); the cartridge being generally located in the airflow path, typically downwind from the fan unit. The airflow flowing through the device picks up the volatile compound molecules from the substrate, typically from its surface, and carries them such as to dispense them in the air. The cartridges are provided with a computer-readable unit having stored therein information which can be retrieved by the controller unit, the controller unit being configured for retrieving and updating the information and for driving the fan unit based on the information retrieved from the computer-readable unit. | 2013-02-28 |
20130049239 | LENS FABRICATION APPARATUS AND LENS FABRICATION METHOD USING THE SAME - A lens fabrication apparatus includes: a lens mold having a connection portion formed on one side thereof and disposed on a light emission surface of a light emitting unit; and a vacuum forming unit discharging air from within the lens mold to the outside through the connection portion or injecting a material into the lens mold through the connection portion. | 2013-02-28 |
20130049240 | ENCAPSULATED MATERIALS AND METHODS FOR ENCAPSULATING MATERIALS - A system that incorporates teachings of the present disclosure may include, for example, a method for applying a force to at least one of an inner stream, an outer stream or both of a combined stream to produce a plurality of capsules, receiving image data, processing the image data, detecting undesirable capsules from the processed image data, applying a bias charge only to the detected undesirable capsules, and segregating the biased undesirable capsules from the unbiased desirable capsules. Additional embodiments are disclosed. | 2013-02-28 |
20130049243 | Control of Fired Shape by Piece Orientation - A method of making ceramic bodies includes systematically orienting the bodies during firing relative to a temperature gradient in a kiln. The systematic orientation of the bodies relative to the temperature gradient can allow for an average deviation of a measured shape of the ceramic bodies from a predetermined target contour shape to be less than what they would be if the bodies were oriented randomly relative to the temperature gradient. | 2013-02-28 |
20130049244 | LYOCELL METHOD COMPRISING AN ADJUSTMENT OF THE PROCESSING DURATION BASED ON THE DEGREE OF POLYMERIZATION - The invention relates to a method and a device for producing Lyocell fibres which are extruded from a cellulose solution of water, cellulose and tertiary amine oxide in a spinning head ( | 2013-02-28 |
20130049247 | Preparation of Inorganic Samples by Fusion - In a process for the preparation of inorganic sample disks for analysis, the sample, in powdered form, is mixed with a powdered reagent flux which has been pre-melted. In an inert gas atmosphere, the mixture is placed in a graphite crucible and heated to a temperature slightly above 1000° C. After the flux dissolves the sample, a homogenous mix is produced. This mix is then poured into a graphite mold, the bottom of which contains a molten pool of an inert metal, such as gold, which acts as a smooth receiving surface. Upon cooling, the material in the mold solidifies, resulting in a glassy disk that can be analyzed. Cooling can be accelerated by making use of a cooling fluid that has a substantially higher thermal capacity than air. | 2013-02-28 |
20130049248 | Method of Producing Artificial Stones with Aluminum residues - The present disclosure uses aluminum residues to fabricate artificial stones. The aluminum residues are obtained from a recycle process of aluminum scrap. The aluminum residues is made into dross and baghouse dust as raw materials for the artificial stones. The artificial stones thus made are improved in characteristics of mechanical strength, hardness, abrasion resistance, flame resistance and anti-oxidation. Hence, the present disclosure reduces impacts to the nature; obtains derived products from recycled aluminum residues; increases commercial income; decreases cost for handling aluminum residues; and saves the use of aluminum oxide, aluminium hydroxide or silicon oxide on making artificial stones. The artificial stones thus made are fit to be used in fields of green material, green construction and green industry. | 2013-02-28 |
20130049253 | Process and Apparatus for Melt-Spinning, Drawing and Winding Multiple Synthetic Threads - The invention relates to a process for melt-spinning, drawing and winding multiple synthetic threads and to an apparatus for performing the process. The synthetic threads are spun concurrently side by side through extrusion of fine filamentous strands, cooled down and hauled off to be then collectively drawn as a sheet of threads and wound up on bobbins. To obtain ideally identical physical properties in the collective treatment of the threads, the threads are hauled off independently of each other by separate individual godets after extrusion and before collective drawing. This makes it possible to realize for each thread the same conditions during extrusion, cooling and hauling off. The apparatus includes multiple individual godets arranged side by side, which are arranged upstream of the drawing facility and are each associated with one of the threads. To pull off the threads, the individual godets are configured to be individually driveable. | 2013-02-28 |
20130049254 | Tire Molding Apparatus - A tire mold apparatus is provided along with methods of retrofitting a tire mold, such that a tire mold of the type traditionally utilized in a dome type curing press can be modified to have external steam tracings allowing the mold to be utilized in a platen press. | 2013-02-28 |
20130049257 | METHOD OF MANUFACTURING SOLE ASSEMBLY FOR ARTICLE OF FOOTWEAR - A method of forming a midsole includes the steps of placing a first mold member and a second mold member in contact with one another, injecting a first material into the first mold member to form first and second portions of a midsole preform, positioning the first and second portions in a third mold member of a second mold assembly; placing a second material in the third mold member; placing the third mold member and a fourth mold member in contact with one another, subjecting the second material and the first and second portions to heat to form a midsole preform, placing the midsole preform in a fifth mold member, placing the fifth mold member and a sixth mold member in contact with one another; and subjecting the midsole preform to heat and pressure to form a midsole. | 2013-02-28 |
20130049258 | Method and Apparatus for Fabricating Variable Gauge, Contoured Composite Stiffeners - Tooling apparatus for forming a composite charge into a contoured composite blade stringer includes an elongate punch and an elongate die flexible along their lengths. The charge is press formed by using the punch to drive the charge into the die. The punch and the die are mounted between a pair of flexible plates. A press coupled with the plates contours the charge by bending the plates into a desired contour. | 2013-02-28 |
20130049261 | METHOD AND DEVICE FOR STAMPING MARKINGS, IN PARTICULAR MOTOR VEHICLE MARKINGS - A method and apparatus for the use of a handling device, which is preferably configured as a data robot, in order to assemble embossing tools for embossing the desired character sequence into a blank. The handling device preferably also serves to position the respective blank in front of the embossing tools assembled in accordance with the desired character sequence and/or to center or orient the embossing tools with respect to the blank. The method and apparatus can be used in connection with the production of motor vehicle license plates in which an individual character sequence is embossed into a blank. | 2013-02-28 |
20130049262 | Use of Fluoropolymers for Rotomolding - The present invention discloses the use in rotomolding or slush molding applications of a composition comprising a polyolefin, a processing aid and optionally a UV-stabilizer. | 2013-02-28 |
20130049263 | INJECTION MOLDING MOLD DEVICE FOR MANUFACTURING CABINET FOR THIN DISPLAY DEVICE AND METHOD FOR MANUFACTURING CABINET FOR THIN DISPLAY DEVICE - Disclosed is an injection molding mold device for manufacturing a cabinet for a thin display device that allows the cabinet to be molded with no appearance defects being caused on the front face part, even in a case where bosses and ribs are disposed on the rear face part of the cabinet. The injection molding mold device | 2013-02-28 |
20130049264 | PROCESS FOR PRODUCING FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR MAKING FLEXOGRAPHIC PRINTING PLATE - Disclosed are a process for producing a flexographic printing plate precursor for laser engraving, the method comprising, in the following order:
| 2013-02-28 |
20130049267 | DECORATIVE SHEET AND IN-MOLD FORMING METHOD - Provided are a decorative sheet having stretchability and heat resistance and an in-mold forming method capable of forming in-mold injection formed products having an excellent decorative image. | 2013-02-28 |
20130049268 | MANUFACTURING METHOD OF HONEYCOMB STRUCTURE - The manufacturing method of the honeycomb structure includes a forming step of a honeycomb formed body with non-fired electrodes where there is performed twice a non-fired electrode forming operation in which an electrode paste is attached to a plate including a printing screen, a side surface of a honeycomb formed body, the side surface being a curved side surface, is brought into a pressed state by a squeegee via the printing screen of the plate, in the state, the body is rotated and the plate is linearly moved along the side surface of the body, and the squeegee allows the electrode paste to permeate the printing screen and coat the side surface of the body; and a forming step of the honeycomb structure where the body with the non-fired electrodes is fired to obtain the honeycomb structure. | 2013-02-28 |
20130049271 | Leaf Spring for Motor Vehicles - The invention relates to a leaf spring ( | 2013-02-28 |
20130049272 | ELASTIC BEARING BUSH CONFIGURATION, ELASTIC BEARING, AND METHOD FOR PRODUCING THE ELASTIC BEARING BUSH CONFIGURATION - An elastic bearing bush configuration is to be installed in a receptacle in particular for use in a suspension of a motor vehicle. The elastic bearing bush configuration contains an inner core, an outer sleeve, and an elastomer body connecting the inner core and the outer sleeve to each other. The outer sleeve is made of plastic. The elastic bearing bush configuration is characterized in that the outer sleeve has a press fit reinforcing element for fixing the outer sleeve in the receptacle by a force exerted directly on the receptacle by the press fit reinforcing element. | 2013-02-28 |
20130049281 | IMAGE RECORDING DEVICE, IMAGE RECORDING METHOD AND COMPUTER-READABLE MEDIUM - An image recording device including a recording unit that records an image on a paper sheet conveyed in a conveying direction along a conveyance path, a paper feed tray that feeds the paper sheet to the conveyance path, a stopper unit that holds the paper sheet to stop the conveyance of the paper sheet, a notifying unit that issues a notification requesting removal of the paper sheet held by the stopper unit, and a control unit that controls at least one of the notifying unit to issue the notification requesting the removal of the paper sheet and the stopper unit to release the paper sheet to allow the conveyance of the paper sheet, based on where an instruction for recording an image on another paper sheet is originated, when the paper sheet is held by the stopper unit. | 2013-02-28 |
20130049282 | APPARATUS FOR PULLING BILLS AND CHECKS IN BUNDLE BILL AND CHECK ACCEPTOR - An apparatus for pulling a paper medium, e.g., a bill or a check in a bundle bill and check acceptor includes a transfer roller unit transferring the paper medium that is vertically introduced into a storage cassette, a transfer belt unit provided to be rotated so that the paper medium that has passed through the transfer roller unit is horizontally transferred to a rear of the storage cassette, and a clamping roller unit having first and second elastic clamps. Each of the clamps is configured to clamp and pull the front end of the paper medium, and release the paper medium at the rear of the storage cassette depending on rotation of the transfer belt unit, so that the paper medium is stacked in the storage cassette. | 2013-02-28 |
20130049283 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - A controller controls operations of a sheet conveying portion and a sheet feeding portion in such a manner that an operation for feeding a preceding sheet by the sheet feeding portion is started after a downstream portion of a subsequent sheet conveyed by the sheet conveying portion is overlapped an upstream portion of the preceding sheet stacked on the stacking portion, and the downstream edge of the preceding sheet is caused to abut against the reference member by the sheet feeding portion in a state where the upstream portion of the preceding sheet and the downstream portion of the subsequent sheet are maintained in an overlapped state. | 2013-02-28 |
20130049284 | MEDIA TRANSPORT SYSTEM WITH COORDINATED TRANSFER BETWEEN SECTIONS - A media transport apparatus and method includes a first media transport having a first drive unit, configured and operative to convey the substrate media through a marking zone to be marked by a print head. A first motion encoder is operatively connected with the first media transport, configured and operative to output a first signal dependent upon the motion of the first media transport surface. A second media transport with a second drive unit and second motion encoder is configured and operative to receive the substrate media from the first media transport and to convey the substrate media. The second drive unit drives the motion of the second media transport with substantially the same surface velocity as the first media transport. The first and second media transports are each operative to hold the substrate media in contact therewith, with respective first and second hold-down forces that may be different magnitudes, including the first hold down force of the first media transport having a greater magnitude than the second hold down force of the second media transport while the substrate media is at least partially within the marking zone and is subjected to both the first and second hold down forces. | 2013-02-28 |
20130049289 | Sheet Feeder and Image Forming Apparatus Having the Same - A sheet feeder is provided that includes a friction member that includes a contact pressure surface that is configured to contact a feed roller when there is no sheet between the friction member and the feed roller and disposed closer to the feed roller than an upper surface of a supporting member supporting the friction member such that a virtual tangential plane, which is such a virtual plane as if the contact pressure surface were extended toward an upstream side and a downstream side in a sheet feeding direction, does not intersect with the supporting member, and a slanted guide surface that is disposed upstream relative to the contact pressure surface in the sheet feeding direction and slanted with respect to the virtual tangential plane so as to be farther away down from the virtual tangential plane toward the upstream side in the sheet feeding direction. | 2013-02-28 |
20130049290 | MEDIUM STACKING DEVICE AND IMAGE FORMING APPARATUS - A medium stacking device includes a medium stacking part stacking a medium, and a first movement part movably provided with respect to the medium stacking part. The first movement part has a first medium restriction part restricting a position of the medium, and a first movement restriction parts including a plurality of restriction members, each of which engaging with the medium stacking part and restricting a direction of the movement of the first movement part. | 2013-02-28 |
20130049291 | PAPER FEEDER AND IMAGE FORMING APPARATUS - A paper feeder according to the present invention includes a paper entrance block arranged above a flapper on au upstream side of a paper feed roller in a paper feeding direction. The flapper is configured to be capable of swinging in a vertical direction so as to alter its position between a first position in which part of a top face thereof on a downstream side in the paper feeding direction comes into contact with the paper feed roller and a second position in which the part thereof is located lower than the first position. The paper entrance block is configured so that when the flapper is in the first position, the lower end thereof comes into contact with the flapper and when the flapper is in the second position, a clearance is formed in a vertical direction between the paper entrance block and the flapper. | 2013-02-28 |
20130049292 | MEDIA CASSETTE HOUSING SYSTEM AND IMAGE FORMATION APPARATUS - A media cassette housing system, which may be usable in an image formation apparatus such as a printer or copier, includes: a guide member configured to guide an insertion of a media cassette from an entrance into an installed position of a cassette housing unit and to guide a pulling out of the media cassette from the installed position to the entrance of the cassette housing unit; and a swingable member provided to the guide member and swingable in inserting and pulling directions of the media cassette. The swingable member includes a slide guide surface configured to come into sliding contact with a slide surface of the media cassette upon the insertion and pulling of the medium cassette. | 2013-02-28 |
20130049293 | Media Actuated Media Diverter for an Imaging Device - A media actuated, media diverter mounted on a guide member positioned between the output of a simplex path and the entrance of a duplex path in an imaging device. The media diverter comprises a first plate having a media contact surface, a biasing member for biasing the first plate, and a second plate having a media guiding surface. First plate and second plate are movable in a slot through the guide member and are biased in first positions where media contact surface extends into the duplex path and media guiding surface extends into the simplex path while second plate remains movable from its first position to a second position. A media sheet fed into the duplex path moves first plate to its second position blocking movement of second plate from its first position allowing a following media sheet in the simplex path to the exit of the imaging device. | 2013-02-28 |
20130049294 | IMAGE FORMING APPARATUS CAPABLE OF FORMING IMAGES ON BOTH FACES OF RECORDING MEDIA - An image forming apparatus includes a plurality of rotary members, a conveyance belt, an image forming device, and a switchback device. The conveyance belt is looped around the plurality of rotary members so as to circulate to intermittently feed a sheet in a sheet transport direction. The image forming device is disposed opposing the conveyance belt to form an image on the sheet fed by the conveyance belt. The switchback device is disposed downstream from the image forming device in the sheet transport direction to feed the sheet having passed the image forming device to a position downstream from the conveyance belt in the sheet transport direction and switch back the sheet. When the sheet is fed by the conveyance belt and the switchback device, a drive start timing of the switchback device is delayed from a drive start timing of the conveyance belt. | 2013-02-28 |
20130049295 | PAPER FEEDING MODULE AND MULTI-FUNCTION PRINTER USING THE SAME - A paper feeding module and multi-function printer using the same are provided. The multi-function printer includes a body, a paper transferring passage and a paper feeding module. The paper transferring passage includes an entrance. The paper feeding module includes a photoreceptor axle, a transferring axle and a skew correction axle. The photoreceptor axle is disposed on the paper transferring passage. The transferring axle is disposed next to the photoreceptor axle and contacts the photoreceptor axle. The skew correction axle is disposed between the entrance of the paper transferring passage and the photoreceptor axle. The skew correction axle contacts the transferring axle. The axes of the photoreceptor axle, the transferring axle and the skew correction axle are parallel to one another. | 2013-02-28 |
20130049296 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus including: a sheet conveying unit; an upstream side guiding member that forms an upstream side conveying route of a sheet; a downstream side guiding member that forms a downstream side conveying route of the sheet; an upstream side detection unit; and a downstream side detection unit, wherein a detection position of the sheet for the upstream side detection unit is set between the sheet conveying unit and a position where the sheet is in contact with the upstream side guiding member, and a detection position of the sheet for the downstream side detection unit is set between the sheet conveying unit and a position where the sheet is in contact with the downstream side guiding member. | 2013-02-28 |
20130049297 | ACTIVE DECURLER ADJUSTMENT USING ELECTRICALLY CONDUCTIVE PRESSURE ROLLERS - A system and method for decurling a sheet medium including a first penetrating roller and a second elastomeric roller mounted substantially parallel. A pressure-sensitive electrically conductive material has properties that vary with its state of compression. An actuator is operative for moving the first penetrating roller and the second elastomeric roller in a direction towards each other, to penetrate the body of the second elastomeric roller with the body of the first penetrating roller. The pressure-sensitive electrically conductive material is subject to pressure by the penetration of the first penetrating roller into the second elastomeric roller. A pair of electrical terminals applies an electrical charge across the pressure-sensitive electrically conductive material. In further embodiments, an electrical property is substantially continuously measured and the depth of penetration is substantially continuously controlled based upon closed-loop feedback of the substantially continuously measuring. | 2013-02-28 |
20130049298 | Fibonacci game - A game of skill and chance for one or more players which utilizes a single set of numbered pieces. Each number on each piece corresponds to a number in the Fibonacci series, for example: 8, 13, 21, 34, 55 and 89 or a similar series: 2, 3, 5, 8, 13 and 21 where each number is equal to the sum of the prior two numbers. Individual game pieces are identified by a number and a corresponding color and may also be of a corresponding size. A player obtains a game piece at each turn without knowing which numbered piece will be received. A player assembles groups of pieces on a game board or on a play area during and between turns with the objective of collecting six groups of numbers that add to the highest number in the series with each group starting with one number in the series being employed in the game. A player's game is completed when the six groups have been assembled. Players compete with each other to finish first, each player taking a piece from the shared set in turn. A player, when playing alone, can compete against the clock or attempt to complete the six groups in a minimum of plays. The game can be played with tiles, playing cards or on a computer, a smartphone or a tablet. | 2013-02-28 |
20130049299 | SPORTS NET WITH SOCKS - A net or barrier has strategically located pocket(s) attached to the net over holes(s) in the net/barrier in order to catch a ball or projectile that passes through the hole(s). A computer-assisted method displays information, more particularly advertisement, onto a net or barrier. The computer-assisted display is viewable by a TV or video audience. | 2013-02-28 |
20130049300 | GAME MACHINE - A prize-displaying apparatus includes a wall, two mounts, two boards, two axles and a motor. The wall includes two apertures defined therein. Each mount includes a horizontal section between two vertical sections. Each vertical section of each mount includes an aperture defined therein. Each board includes a sleeve formed thereon. Each axle is inserted in a related aperture of the wall, the apertures of a related mount and the sleeve of a related board. The motor is operatively connected to one of the axles so that the related board can be pivoted between a supporting position where it supports the other board and a releasing position where it leaves and allows the other board to fall. | 2013-02-28 |
20130049303 | Pressure Balanced Shaft Seal Assembly - A pressure balanced shaft seal assembly that allows a seal to dynamically respond to angular or radial misalignment of a shaft includes a fixed stator, a floating stator, and a labyrinth seal. In one embodiment, the floating stator and labyrinth seal are mounted within an annular groove formed in the fixed stator such that the floating stator and labyrinth seal may move a predetermined amount in the radial direction with respect to the fixed stator. A spherical interface between the labyrinth seal and floating stator may allow the labyrinth seal to pivot with respect to the floating stator during angular misalignment of a shaft around which the pressure balanced shaft seal assembly is mounted. A pressure balancing annular channel formed in the floating stator allows pressurized seal fluid to balance the axial pressure exerted on the floating stator by the process fluid. | 2013-02-28 |
20130049304 | NITRIDED PISTON RING RESISTANT TO THE PROPAGATION OF CRACKS - This invention refers to the solution of problem of spalling of the nitrided layer in piston rings for Flex-fuel engines, without jeopardizing the wear resistance, suggesting for such purpose a nitrided piston ring ( | 2013-02-28 |
20130049305 | INTERNAL COMBUSTION ENGINE OIL RING - An internal combustion engine oil ring which stably retains, for a long period, the function of scraping excess oil from a cylinder inner wall surface and letting the excess oil flow down to an underside of a piston and ensures reduction in the amount of oil consumption when an internal combustion engine is driven. An internal combustion engine oil ring is provided, whose main body includes, along an inner peripheral surface, a coil expander receiving recess having a generally semicircular shape in cross-section in an oil ring axial direction, an inner peripheral surface of the coil expander receiving recess has an oil return groove formed along an inner peripheral direction for smoothly returning scraped oil to an underside of a piston, and an outer peripheral shape of the groove is composed of a straight line and a curved line continuous therewith in cross-section in the oil ring axial direction. | 2013-02-28 |
20130049306 | RADIAL SHAFT SEAL WITH DUST EXCLUSION AND HYDRODYNAMIC SEALING FEATURE - A radial shaft seal configured for receipt in a housing and about a shaft to sealingly isolate an air-side of the shaft seal from an oil-side of the shaft seal is provided. The seal includes an annular mounting portion and a seal lip operably attached to the mounting portion. The seal lip has an annular inner sealing surface extending axially between an oil-side end and a free air-side end. The inner sealing surface has a first groove region extending along the shaft in sealed engagement therewith and a second groove region extending along the shaft in sealed engagement therewith. The first groove region and the second groove region are spaced axially from one another by an intermediate non-grooved region. The first groove region is configured to direct contamination toward the air-side of the seal and the second groove region is configured to direct lubrication toward the oil-side of the seal. | 2013-02-28 |
20130049307 | Molded Deformable Shape Gasket For Molding Large Gaskets In A Deformed Shape - A gasket is provided including a plurality of corner sections each having a cross-section having a width of at least a first dimension. A plurality of deformable sections are disposed between a pair of the plurality of corner sections, each of the plurality of deformable sections have a plurality of reduced width segments. The plurality of deformable sections have a curved shaped that is deformable to a straight shape in its installed condition, wherein the deformable sections allow the gasket to be formed with a smaller molding footprint than the assembled gasket shape and the plurality of corner sections have a same angled orientation in its installed and un-installed molded positions. | 2013-02-28 |
20130049308 | Gasket Design For Molding Large Gaskets In A Deformed Shape - A gasket includes a plurality of corner sections each having a cross-section having a width of at least a first dimension. A plurality of deformable sections are disposed between a pair of the plurality of corner sections, each of the plurality of deformable sections having a cross-section having a width less than the first dimension and having a curved shape that is deformable to a straight shape in its installed condition. The deformable sections allow the gasket to be formed with a smaller molding footprint than the assembled gasket shape and the plurality of corner sections have a same angled orientation in its installed and un-installed positions. | 2013-02-28 |
20130049309 | Access port seal - An apparatus and kit for sealing an opening in an insulated covering. The kit comprises a gasket securable around the interior edge of the opening in the insulated covering and an apparatus for sealing the opening. The apparatus comprises a waterproof body locatable within the opening, the body having a periphery therearound and a groove located within the periphery. The groove is sized and shaped to closely and sealably receive the opening or the gasket therein. The gasket may have a slot therein sized to be frictionally received over a sheath layer of the insulated covering. | 2013-02-28 |
20130049310 | SELF-PUMPING SUSPENSION STRUT - A self-pumping suspension strut with internal level regulation, for example for motor vehicles having a fluid-filled working cylinder pressurized with the pressure of the fluid acting as a spring. A hollow piston rod is guided, in a sealed manner, within the working space, into which projects a pump piston attached to the working cylinder. During relative movements between the working cylinder and the piston rod, fluid is delivered from the working space into a pressure chamber in which a pressure is higher than the pressure of the working space. Flow connections between the pressure chamber and the working space selective set a specifiable dynamic level, determined by the extension length of the piston rod, such that the piston rod can be rotated, by a rotating device, for selective cooperation of the axially and the circumferentially spaced flow connections to control flow. | 2013-02-28 |
20130049311 | Wheeled Personal Grocery Basket and Cart System - Disclosed is a separable shopping basket and cart system, comprising a wheeled basket having sidewalls and a base forming a largely rectangular structure with an open upper, which is securable to a wheeled cart adapted to accept and support the basket in an elevated position while shopping within a store. The cart comprises a wheeled base, a basket-supporting frame and a user push handle. When shopping, the basket is joined with the cart for the collection and purchasing of goods, after which the basket is separated from the cart and taken to the user's car or transported to its intended location. Purchased articles are supported within the basket during transit, while the basket wheels and extended user handle allows the basket and contents to be pulled and not physically carried. The basket is further stowable, wherein the basket walls disconnect to fold into a planar, collapsed state. | 2013-02-28 |
20130049312 | Bowling Ball Bag - A bowling ball bag includes a bag proper loaded on a cart which is equipped with two wheels at its one side, and a yoke extended from the other said thereof. The bag proper is provided with a side pocket in the direction of the yoke of the cart to be developed on the yoke to form a securely supported loading space. The loading space may be used to preserve a spare ball for the player in case of need. | 2013-02-28 |