08th week of 2012 patent applcation highlights part 13 |
Patent application number | Title | Published |
20120043629 | Surface Mount Silicon Condenser Microphone Package - The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. | 2012-02-23 |
20120043630 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In MRAM, a write wiring clad in a ferromagnetic film has been used to reduce a write current or avoid disturbances. Besides, a CuAl wiring obtained by adding a trace of Al to a Cu wiring has been used widely to secure reliability of a high reliability product. There is a high possibility of MRAM being mounted in high reliability products so that reliability is important. Clad wiring however increases the resistance of the CuAl wiring, which is originally high, so that using both may fail to satisfy the specification of the wiring resistance. In the semiconductor device of the invention having plural copper-embedded wiring layers, copper wiring films of plural copper-embedded clad wirings configuring a memory cell matrix region of MRAM are made of relatively pure copper, while a CuAl wiring film is used as copper wiring films of copper-embedded non-clad wirings below these wiring layers. | 2012-02-23 |
20120043631 | MAGNETIC MEMORY ELEMENT - A magnetic memory element includes a memory layer, a reference layer, and a spin-injection layer provided between the memory layer and the reference layer. The reference layer has a structure in which at least two CoPt layers containing 20 atomic % or more and 50 atomic % or less of Pt and having a thickness of 1 nm or more and 5 nm or less are stacked with a Ru layer provided therebetween. The thickness of the Ru layer is 0.45±0.05 nm or 0.9±0.1 nm. In addition, the axis of 3-fold crystal symmetry of the CoPt layers is oriented perpendicularly to the film surface. The reference layer includes a high spin polarization layer of 1.5 nm or less containing Co or Fe as a main component at an interface with the spin-injection layer. | 2012-02-23 |
20120043632 | METHOD TO PLANARIZE THREE-DIMENSIONAL STRUCTURES TO ENABLE CONFORMAL ELECTRODES - Methods for fabricating three-dimentional PIN structures having conformal electrodes are provided, as well as the structures themselves. The structures include a first layer and an array of pillars with cavity regions between the pillars. A first end of each pillar is in contact with the first layer. A segment is formed on the second end of each pillar. The cavity regions are filled with a fill material, which may be a functional material such as a neutron sensitive material. The fill material covers each segment. A portion of the fill material is etched back to produce an exposed portion of the segment. A first electrode is deposited onto the fill material and each exposed segment, thereby forming a conductive layer that provides a common contact to each the exposed segment. A second electrode is deposited onto the first layer. | 2012-02-23 |
20120043633 | RADIATION DETECTOR - According to a radiation detector of this invention, a common electrode for bias voltage application and a lead wire for bias voltage supply are connected through a conductive plate as a planarly formed plate interposed therebetween. Since the conductive plate is connected instead of connecting the lead wire directly onto the common electrode, it can prevent damage to a radiation sensitive semiconductor and avoid performance degradation. Since the conductive plate is formed planarly, even if a conductive paste with high resistance is used, connection resistance can be lowered to be comparable to the use of silver paste. That is, the range of selection of the conductive paste is broadened. Also, connection can be made without using an insulating seat and performance degradation can be avoided. As a result, performance degradation can be avoided, without using an insulating seat. | 2012-02-23 |
20120043634 | METHOD OF MANUFACTURING MICROLENS ARRAY, METHOD OF MANUFACTURING SOLID-STATE IMAGE SENSOR, AND SOLID-STATE IMAGE SENSOR - A method of manufacturing a microlens array includes forming a resist film on a structure including a plurality of light-receiving portions, exposing the resist film using a photomask in which a plurality of lens patterns for forming a plurality of microlenses are arranged, forming a resist pattern by developing the exposed resist film, and forming the plurality of microlens by annealing the resist pattern, wherein the plurality of lens patterns include lens patterns having exposure light transmittance distributions different from each other. | 2012-02-23 |
20120043635 | Image Sensor Package with Dual Substrates and the Method of the Same - The image sensor package with dual substrates comprises a first substrate with a die receiving opening and a plurality of first through hole penetrated through the first substrate; a second substrate with a die opening window and a plurality of second through hole penetrated through the second substrate, formed on the first substrate. A part of the second wiring pattern is coupled to a part of the third wiring pattern; an image die having conductive pads and sensing array received within the die receiving opening and the sensing array being exposed by the die opening window; and a through hole conductive material refilled into the plurality of second through hole, some of the plurality of second through hole coupling to the conductive pads of the image sensor. | 2012-02-23 |
20120043636 | SOLID-STATE IMAGE SENSING APPARATUS - This invention provides a solid-state image sensing apparatus in which a sensor portion that performs photo-electric conversion and plural layers of wiring lines including a signal line for the sensor portion are formed on a semiconductor substrate; which includes an effective pixel portion configured such that light enters the sensor portion, and an optical black portion shielded so that the light does not enter the sensor portion; and which has a light-receiving surface on the back surface side of the semiconductor substrate. The optical black portion includes the sensor portion, a first light-shielding film formed closer to the back surface side of the semiconductor substrate than the sensor portion, and a second light-shielding film formed closer to the front surface side of the semiconductor substrate than the sensor portion. | 2012-02-23 |
20120043637 | IMAGE SENSOR COMPRISING ISOLATED GERMANIUM PHOTODETECTORS INTEGRATED WITH A SILICON SUBSTRATE AND SILICON CIRCUITRY - In accordance with the invention, an improved image sensor comprises an array of germanium photosensitive elements integrated with a silicon substrate and integrated with silicon readout circuits. The silicon transistors are formed first on a silicon substrate, using well known silicon wafer fabrication techniques. The germanium elements are subsequently formed overlying the silicon by epitaxial growth. The germanium elements are advantageously grown within surface openings of a dielectric cladding. Wafer fabrication techniques are applied to the elements to form isolated germanium photodiodes. Since temperatures needed for germanium processing are lower than those for silicon processing, the formation of the germanium devices need not affect the previously formed silicon devices. Insulating and metallic layers are then deposited and patterned to interconnect the silicon devices and to connect the germanium devices to the silicon circuits. The germanium elements are thus integrated to the silicon by epitaxial growth and integrated to the silicon circuitry by common metal layers. | 2012-02-23 |
20120043638 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first insulating layer; a semiconductor layer provided on the first insulating layer; a first semiconductor region selectively provided in the semiconductor layer; a second semiconductor region selectively provided in the semiconductor layer and spaced from the first semiconductor region; a first main electrode provided in contact with the first semiconductor region; a second main electrode provided in contact with the second semiconductor region; a second insulating layer provided on the semiconductor layer; a first conductive material provided in the second insulating layer above a portion of the semiconductor layer located between the first semiconductor region and the second semiconductor region; and a second conductive material provided in a trench provided in a portion of the semiconductor layer opposed to the first conductive material, being in contact with the first conductive material, and reaching the first insulating layer. | 2012-02-23 |
20120043639 | FABRICATING METHOD AND STRUCTURE OF SUBMOUNT - A fabricating method and structure of a submount are provided. The submount includes a semiconductor substrate, a first electrode, a second electrode and a first insulating adhesive member. The fabricating method of the submount includes the following steps. A semiconductor substrate is provided. An isolating groove is formed on a first surface of the semiconductor substrate, thereby defining a first region and a second region. A first electrode is formed on the first surface in the first region and a second electrode is formed on the first surface in the second region. A first insulating adhesive member is filled in the isolating groove. The semiconductor substrate is thinned from the second surface so as to expose the first insulating adhesive member from the second surface, thereby insulating the first region of the semiconductor substrate from the second region of the semiconductor substrate. | 2012-02-23 |
20120043640 | MATERIAL HAVING A LOW DIELECTRIC KONSTANT AND METHOD OF MAKING THE SAME - There is disclosed a method for producing a highly cross-linked polypropylene material by plasma polymerisation of a carbon containing gas, not specifically propylene, exhibiting low relative permittivity, high thermal stability and enhanced mechanical properties, said method and material being suitable for application not limited to interlayer dielectric deposition in microchip fabrication. | 2012-02-23 |
20120043641 | Epitaxy Silicon on Insulator (ESOI) - Methods and structures for semiconductor devices with STI regions in SOI substrates is provided. A semiconductor structure comprises an SOI epitaxy island formed over a substrate. The structure further comprises an STI structure surrounding the SOI island. The STI structure comprises a second epitaxial layer on the substrate, and a second dielectric layer on the second epitaxial layer. A semiconductor fabrication method comprises forming a dielectric layer over a substrate and surrounding a device fabrication region in the substrate with an isolation trench extending through the dielectric layer. The method also includes filling the isolation trench with a first epitaxial layer and forming a second epitaxial layer over the device fabrication region and over the first epitaxial layer. Then a portion of the first epitaxial layer is replaced with an isolation dielectric, and then a device such as a transistor is formed second epitaxial layer within the device fabrication region. | 2012-02-23 |
20120043642 | Semiconductor device - A semiconductor device includes a first signal wiring, a first dummy wiring, and a second dummy wiring. The first signal wiring is configured to be supplied with a first signal potential. The first dummy wiring is insulated from the first wiring. The first dummy wiring is configured to be supplied with a fixed potential. The second dummy wiring is disposed between the first signal wiring and the first dummy wiring. The second dummy wiring is insulated from the first dummy wiring. The second dummy wiring is configured to be supplied with substantially the same potential as the first signal potential. | 2012-02-23 |
20120043643 | ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE, METHOD OF FABRICATING THE DEVICE, AND ELECTRONIC APPARATUS INCLUDING THE DEVICE - An electrostatic discharge (EDS) device includes a substrate, an external well of a first conductivity type in the substrate, and an internal well of a second conductivity type in the external well, the first conductivity type opposite the second conductivity type. The EDS device further includes a first heavily doped region of the first conductivity type located at a surface of the internal well, a second heavily doped region of the second conductivity type located at a surface of the internal well, and a third heavily doped region of the first conductivity type located at a surface of the external well. The second heavily doped region is interposed between and spaced from each of the first and third heavily doped regions, and at least one of a space between the first and second heavily doped regions and a space between the second and third heavily doped regions is devoid of a device isolation structure of electrical isolation material. | 2012-02-23 |
20120043644 | SILICON WAFER AND MANUFACTURING METHOD - A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process. | 2012-02-23 |
20120043645 | METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE - A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 diamond granules and 0 wt %-40 wt % oxide granules, grinding and polishing a top surface of the wafer, etching the top surface for eliminating a top process-induced degradation layer and maintaining a 0.5 μm-10 μm thick edge process-induced degradation layer. | 2012-02-23 |
20120043646 | SPACER DOUBLE PATTERNING THAT PRINTS MULTIPLE CD IN FRONT-END-OF-LINE - A semiconductor device is formed with sub-resolution features and at least one additional feature having a relatively larger critical dimension using only two masks. An embodiment includes forming a plurality of first mandrels, having a first width, and at least one second mandrel, having a second width greater than the first width, overlying a target layer using a first mask, forming sidewall spacers along the length and width of the first and second mandrels, forming a filler adjacent each sidewall spacer, the filler having the first width, removing the filler adjacent sidewall spacers along the widths of the first and second mandrels using a second mask, removing the sidewall spacers, and etching the target layer between the filler and the first and second mandrels, thereby forming at least two target features with different critical dimensions. Embodiments further include using a third mask to form a semiconductor device having further features with a different critical dimension, but the same pitch, as the sub-resolution features. | 2012-02-23 |
20120043647 | LOW-TEMPERATURE BONDING PROCESS - The invention relates to a process for assembling a first element that includes at least one first wafer, substrate or at least one chip, and a second element of at least one second wafer or substrate, involving the formation of a surface layer, known as the bonding layer, on each substrate, at least one of these bonding layers being formed at a temperature less than or equal to 300° C.; conducting a first annealing, known as degassing annealing, of the bonding layers, before assembly, at least partly at a temperature at least equal to the subsequent bonding interface strengthening temperature but below 450° C.; forming an assembling of the substrates by bringing into contact the exposed surfaces of the bonding layers, and conducting an annealing of the assembled structure at a bonding interface strengthening temperature below 450° C. | 2012-02-23 |
20120043648 | Electronic component and method of manufacturing electronic component - In order to solve the above problem, provided is an electronic component having an authentication pattern formed on an exposed surface, in which the authentication pattern includes a base section including a resin and colored particles having a hue that can be identified in the base section, and the colored particles are dispersed so as to form dotted pattern in the base section. | 2012-02-23 |
20120043649 | Method for making microchannels on a substrate, and substrate including such microchannels - The present invention relates to a process for fabricating microchannels on a substrate and to a substrate comprising these microchannels, the invention being especially applicable to the fabrication of microstructured substrates for microelectronic, microfluidic and/or micromechanical systems. | 2012-02-23 |
20120043650 | Packaging Integrated Circuits - An integrated circuit | 2012-02-23 |
20120043651 | LEADFRAME, LEADFRAME TYPE PACKAGE AND LEAD LANE - A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads and a first power lead arranged between the pair of first and second differential signal leads. One of the pairs of differential signal leads has half-double function transmission mode and two of the other pairs of differential signal leads have double function transmission mode. | 2012-02-23 |
20120043652 | SEMICONDUCTOR POWER MODULE - A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element. | 2012-02-23 |
20120043653 | LEAD PIN FOR PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE WITH THE SAME - Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate. | 2012-02-23 |
20120043654 | MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES - The mechanisms of preparing bump structures described by using patterned anodes may simplify bump-making process, reduce manufacturing cost, and improve thickness uniformity within die and across the wafer. In addition, the mechanisms described above allow forming bumps with different heights to allow bumps to be integrated with elements on a substrate with different heights. Bumps with different heights expand the application of copper post bumps to enable further chip integration. | 2012-02-23 |
20120043655 | WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER - A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an upper surface of the wafer. Prior to singulating the semiconductor wafer, a plurality of corresponding stud bumps on the plurality of bonding pads with a wire bonding tool are formed. Thereafter, a molding encapsulation layer is applied over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed. | 2012-02-23 |
20120043656 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE - An improvement is achieved in the mounting reliability of a semiconductor device. A semiconductor chip is mounted over an upper surface of a wiring substrate. A plurality of solder balls are disposed individually over a plurality of lands formed on a lower surface of the wiring substrate. The plural lands include a first land group arranged in a plurality of rows and arranged along a peripheral edge portion of the lower surface of the wiring substrate, and a second land group arranged inside the first land group in the lower surface of the wiring substrate. The lands in the first land group are arranged with a first pitch, and the lands in the second land group are arranged with a second pitch higher than the first pitch. | 2012-02-23 |
20120043657 | METHOD FOR FABRICATING CONDUCTIVE LINES - Methods for fabricating conductive metal lines of a semiconductor device are described herein. In one embodiment, such a method may comprise depositing a conductive material over a substrate, and depositing a first barrier layer on the conductive layer. Such a method may also comprise patterning a mask on the first barrier layer, the pattern comprising a layout of the conductive lines. Such an exemplary method may also comprise etching the conductive material and the first barrier layer using the patterned mask to form the conductive lines. In addition, a low temperature post-flow may be performed on the structure. The method may also include depositing a dielectric material over and between the patterned conductive lines. | 2012-02-23 |
20120043658 | Semiconductor Constructions; And Methods For Providing Electrically Conductive Material Within Openings - Some embodiments include methods for depositing copper-containing material utilizing physical vapor deposition of the copper-containing material while keeping a temperature of the deposited copper-containing material at greater than 100° C. Some embodiments include methods in which openings are lined with a metal-containing composition, copper-containing material is physical vapor deposited over the metal-containing composition while a temperature of the copper-containing material is no greater than about 0° C., and the copper-containing material is then annealed while the copper-containing material is at a temperature in a range of from about 180° C. to about 250° C. Some embodiments include methods in which openings are lined with a composition containing metal and nitrogen, and the lined openings are at least partially filled with copper-containing material. Some embodiments include semiconductor constructions having a metal nitride liner along sidewall peripheries of an opening, and having copper-containing material within the opening and directly against the metal nitride liner. | 2012-02-23 |
20120043659 | INTERCONNECTS WITH IMPROVED TDDB - A method for forming a semiconductor device is presented. A substrate prepared with a dielectric layer formed thereon is provided. A first upper etch stop layer is formed on the dielectric layer. The first upper etch stop layer includes a first dielectric material. The dielectric layer and first upper etch stop layer are patterned to form an interconnect opening. The interconnect opening is filled with a conductive material to form an interconnect. The interconnect and first upper etch stop layer have coplanar top surfaces. A second upper etch stop layer is formed over the coplanar top surfaces. The second upper etch stop layer includes a second material having sufficient adhesion with the first material to reduce diffusion of the conductive material. | 2012-02-23 |
20120043660 | THIN FOIL SEMICONDUCTOR PACKAGE - One aspect of the present invention involves a foil-based method for packaging integrated circuits. Initially, a metallic foil and a photoresist layer are attached with a carrier. The photoresist layer is exposed and patterned. Afterward, multiple integrated circuit dice are connected to the foil. The dice and portions of the foil are encapsulated in a molding material. The foil is then etched based on the patterned photoresist layer to define multiple device areas in the foil, where each device area supports at least one of the integrated circuit dice. Some aspects of the present invention relate to panel arrangements that are involved in the aforementioned method. | 2012-02-23 |
20120043661 | INTEGRATED CIRCUITS AND METHODS OF FORMING CONDUCTIVE LINES AND CONDUCTIVE PADS THEREFOR - Integrated circuits and methods for forming conductive lines and conductive pads of integrated circuits are disclosed. One such integrated circuit includes circuitry, a first conductor coupled to the circuitry, a conductive pad coupled to the first conductor, and a second conductor spaced apart from the first conductor and coupled to the conductive pad. The second conductor would be floating but for its coupling to the conductive pad. | 2012-02-23 |
20120043662 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE - A purpose of the application is to provide a semiconductor device production method capable of reducing complexity of production operations and keeping production costs low, and enhancing reliability, and a semiconductor device. One aspect of the invention provides a method of producing a semiconductor device, the method including a first bonding step of bonding a first electrode plate and a semiconductor device portion, and a second bonding step of bonding the semiconductor device portion and a second electrode plate. The method includes a sealing step of forming a sealed composite body by covering target surfaces of a composite body formed by the first bonding step with resin, the target surfaces being surfaces other than a second surface of the first electrode plate and the second surface of the semiconductor device portion. The second bonding step is performed after the sealing step. | 2012-02-23 |
20120043663 | POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE - An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and a plurality of first conductive layers; a first passivation layer overlying the plurality of IMD layers and the first conductive layers; at least a first power/ground mesh wiring line in a first aluminum layer overlying the first Insulating layer; and at least a second power/ground mesh wiring line in a second aluminum layer overlying the first aluminum layer. | 2012-02-23 |
20120043664 | IMPLEMENTING MULTIPLE DIFFERENT TYPES OF DIES FOR MEMORY STACKING - A method and structure are provided for implementing multiple different types of dies for memory stacking. A common wafer is provided with a predefined reticle type. The reticle type includes a plurality of arrays, and a plurality of periphery segments. A plurality of through-silicon-vias (TSVs) is placed at boundaries between array and periphery segments. Multiple different types of dies for memory stacking are obtained based upon selected scribing of the dies from the common wafer. | 2012-02-23 |
20120043665 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A semiconductor device according to the present invention is a semiconductor device that includes: a semiconductor substrate having metal wiring formed on a bottom surface of the semiconductor substrate; and a plurality of wiring layers formed above the semiconductor substrate. The wiring layers include a first wiring layer and a second wiring layer that is formed above the first wiring layer. The semiconductor device further includes: a first through electrode which electrically connects the first wiring layer and the metal wiring; a second through electrode which electrically connects the second wiring layer and the metal wiring; and at least one layer difference adjustment film formed between the semiconductor substrate and the wiring layers. The at least one layer difference adjustment film includes a layer difference adjustment film formed on a region excluding a region corresponding to the second through electrode. | 2012-02-23 |
20120043666 | Semiconductor Device and Method of Fabricating the Same - For forming a semiconductor device, a via structure is formed through at least one dielectric layer and at least a portion of a substrate. In addition, a protective buffer layer is formed onto the via structure. Furthermore, a conductive structure for an integrated circuit is formed over the substrate after forming the via structure and the protective buffer layer, with the conductive structure not being formed over the via structure. Thus, deterioration of the conductive and via structures is minimized. | 2012-02-23 |
20120043667 | COMPLIANT PRINTED CIRCUIT SEMICONDUCTOR PACKAGE - A package for at least one semiconductor device and a method for making the package. At least one dielectric layer is selectively printed on at least a portion of the semiconductor device creating first recesses aligned with a plurality of the electrical terminals. A conductive material is printed in the first recesses forming contact members on the semiconductor device. At least one dielectric layer is selectively printed on at least a portion of the package to create a plurality of second recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the second recesses to create a circuit geometry. The circuit geometry includes a plurality of exposed terminals electrically coupled to the electric terminals on the semiconductor device. | 2012-02-23 |
20120043668 | STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT - A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture. | 2012-02-23 |
20120043669 | STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT CIRCUIT BOARD - A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip. | 2012-02-23 |
20120043670 | Semiconductor Module System Having Stacked Components With Encapsulated Through Wire Interconnects (TWI) - A semiconductor module system includes a module substrate and first and second semiconductor components stacked on the module substrate. The stacked semiconductor components include through wire interconnects that form an internal signal transmission system for the module system. Each through wire interconnect includes a via, a wire in the via and first and second contacts on the wire. | 2012-02-23 |
20120043671 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD - A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips which configure a second chip group are stacked in a step-like shape on the first chip group with the direction reversed. The electrode pads of the first memory chips are electrically connected to the connection pads arranged on the first pad region, and the electrode pads of the second memory chips are electrically connected to the connection pads arranged on the second pad region. | 2012-02-23 |
20120043672 | Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate - A semiconductor device has a first substrate and first conductive pillars formed over the first substrate. Second conductive pillars are formed over the first substrate alternating with the first conductive pillars. The second conductive pillars are vertically offset with respect to the first conductive pillars. First BOT interconnect sites are formed over a second substrate. Second BOT interconnect sites are formed over the second substrate alternating with the first interconnect sites. The second interconnect sites are vertically offset with respect to the first interconnect sites. The first substrate is mounted to the second substrate such that the first conductive pillars are aligned with and electrically connected to the first interconnect sites and the second conductive pillars are aligned with and electrically connected to the second interconnect sites. An underfill material is deposited between the first and second substrates. The first substrate can be a flipchip type semiconductor device. | 2012-02-23 |
20120043673 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE - Provided are three-dimensional semiconductor devices. A device includes an electrode structure including conductive patterns sequentially stacked on a substrate, a semiconductor pattern penetrating the electrode structure and including channel regions adjacent to the conductive patterns and vertical adjacent regions between the channel regions, and a semiconductor connecting layer extending from an outer sidewall of the semiconductor pattern to connect the semiconductor pattern to the substrate. | 2012-02-23 |
20120043674 | AIR SCAVENGING CARBURETOR - In one form, a carburetor may include an air passage, a fuel and air mixing passage, a throttle valve, an air valve and a lost motion coupler interconnecting the air valve and the throttle valve. The throttle valve may be disposed in communication with the fuel and air mixing passage and moveable between an idle position and an open position permitting an at least somewhat less restricted fluid flow therethrough than when the throttle valve is in the idle position. The air valve may be disposed in communication with the air passage, and moveable between closed and fully open positions to control air flow through the air passage. The lost motion coupler may permit a limited movement of the throttle valve away from its idle position without a corresponding movement of the air valve, and may also permit movement of the air valve along with the throttle valve after said limited movement and until the air valve is fully open, and may also permit further movement of the throttle valve to its wide open position after the air valve is fully open. | 2012-02-23 |
20120043675 | ROTARY CARBURETOR - A rotary carburetor in which a cam mechanism for causing the throttle valve to move in the direction of the valve stem can be accommodated without the accompanying enlargement of the main section of the carburetor. The carburetor comprises a columnar throttle valve ( | 2012-02-23 |
20120043676 | COPOLYMERS COMPRISING POLYAMIDE BLOCKS AND POLYETHER BLOCKS AND HAVING IMPROVED OPTICAL PROPERTIES - The invention relates to a process for producing a shaped article having improved optical properties compared to a polyamide 12/polytetramethylene block copolymer. The article is made from a block copolymer PAX.Y/PE where polyamide (PA) blocks are selected from PA 10,12; PA 6,18; PA 10,14; and PA 12.12; alternating with polyether (PP blocks, selected front the group consisting of: PE blocks comprising hydroxyl ends, and PE blocks comprising NH | 2012-02-23 |
20120043677 | Method for Making a Combined Light Coupler and Light Pipe - A method for making a combined light coupler and light pipe comprises providing a mold with an elongated chamber having two ends and having an appropriate shape to form the combined light coupler and light pipe. The formed light pipe has an elongated shape. The formed light coupler has an inlet end for receiving light and an outlet end for transmitting light to the light pipe, and is shaped in such a way as to transform at least 70% of the light it receives into an appropriate angular distribution needed for total internal reflection within the light pipe. A cross-linkable polymer having a weight average molecular weight ranging from about 2,000 to about 250,000 daltons is provided. At least part of the chamber of the mold is filled and contacted with the polymer, which is then cross-linked, such that the formed light coupler and light pipe have a unitary construction. | 2012-02-23 |
20120043678 | Color Filterless Display Device, Optical Element, and Manufacture - A method of forming an optical element for a color display device includes forming a lens shaped die, coating a low refractive index photo-setting resin on the lens shaped die, pasting the lens shaped die to a substrate, and irradiating the coated low refractive index photo-setting resin so as to set the low refractive index resin and form a low refractive index layer. The lens shaped die is removed from the low refractive index layer set on the substrate, a high refractive index photo-setting resin is coated on the low refractive index layer by use of a planarizing die, and the coated high refractive index photo-setting resin is irradiated so as to set the high refractive index resin and form a high refractive index layer. The planarizing die is then from the high refractive index layer set on the low refractive index layer. | 2012-02-23 |
20120043679 | METHOD AND DEVICE FOR MAKING AN OPTICAL PLATE FORMED WITH A MICROSTRUCTURE - A method for making an optical plate formed with a microstructure includes: extruding a substrate material and advancing the same to pass through a first nip formed between an embossing roller and a first pressing roller, the embossing roller having a micropatterned surface formed with a plurality of protrusions and a plurality of grooves, the protrusions and the grooves cooperatively defining a microstructure-forming space; applying a photosensitive resin to the micropatterned surface and filling the same into the microstructure-forming space upstream of the first nip to form a plurality of microelements respectively in the microstructure-forming space; allowing the photosensitive resin applied to the micropatterned surface to pass through the first nip together with the substrate material, thereby bonding the microelements to the substrate material; and irradiating and curing the photosensitive resin downstream of the first nip to form the optical plate. | 2012-02-23 |
20120043680 | METHOD AND APPARATUS FOR FABRICATION OF STRUCTURES USED IN CONSTRUCTION OF TOWER BASE SUPPORTS - Disclosed are apparatus and corresponding methodologies for providing a base support, such as including concrete, and used such as for a wind-driven generator. Precast concrete cylinders are stacked in place upon a platform that may be partially precast and partially cast in place during assembly and supported, in certain embodiments, by plural concrete legs, the other ends of which are supported on a unitary or subdivided concrete foundation. In other embodiments, the platform may be supported by ribbed concrete panels. The concrete cylinders are glued together using an epoxy and then secured by an internal vertical post tension system extending from the platform to the upper most cylinder. Methodologies and apparatus for fabrication of concrete structure used in constructing the base support are also disclosed, with a focus on staves and various ring piece constructions. | 2012-02-23 |
20120043681 | DEVICE FOR FORMING THERMOSETTING RESIN FOAM PLATE AND METHOD OF MANUFACTURING THERMOSETTING RESIN FOAM PLATE - There are provided a forming device capable of drying at a high speed and of manufacturing a thermosetting resin foam plate more efficiently and stably without multilayering any unnecessary surface material, and a method of efficiently manufacturing a thermosetting resin foam plate therefor. A thermosetting resin foam plate is manufactured by: mixing a resin composition containing at least a thermosetting resin, a foaming agent and a curing agent in a mixer; continuously discharging the resin composition on a traveling air-permeable and flexible surface material, and at the same time covering the upper surface of the resin composition with an air-permeable and flexible surface material; and passing the covered resin composition through a forming device equipped with conveyors having apertures having an aperture area ratio of 15% or more and 80% or less to form and cure the resin composition. | 2012-02-23 |
20120043682 | PROCESS FOR PRODUCING A MATERIAL SIMILAR TO LEATHER - Process for producing a material similar to leather, which foresees:
| 2012-02-23 |
20120043683 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are water-dispersible fibers derived from sulfopolyesters having a Tg of at least 25° C. The fibers may contain a single sulfopolyester or a blend of a sulfopolyester with a water-dispersible or water-nondispersible polymer. Also disclosed are multicomponent fibers comprising a water dispersible sulfopolyester having a Tg of at least 57° C. and a water non-dispersible polymer. The multicomponent fibers may be used to produce microdenier fibers. Fibrous articles may be produced from the water-dispersible fibers, multicomponent fibers, and microdenier fibers. The fibrous articles include water-dispersible and microdenier nonwoven webs, fabrics, and multilayered articles such as wipes, gauze, tissue, diapers, panty liners, sanitary napkins, bandages, and surgical dressings. Also disclosed is a process for water-dispersible fibers, nonwoven fabrics, and microdenier webs. The fibers and fibrous articles have further applications in flushable personal care and cleaning products, disposable protective outerwear, and laminating binders. | 2012-02-23 |
20120043684 | METHOD OF PRODUCING ANODE MATERIAL FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY - Provided is a method of producing an anode material for a non-aqueous electrolyte secondary battery having battery characteristics equivalent to those of a conventional product by simpler production steps than those of a conventional method. | 2012-02-23 |
20120043685 | POWDER PARTICLE SHAPING DEVICE AND METHOD - A powder particle shaping device is provided, which includes a closed cavity capable of changing between multiple shapes as an external pressure changes, and the closed cavity compresses and moves powder particles with which the closed cavity is filled full while the shape changes. A powder particle shaping method is further provided, which includes a. filling a closed cavity full with powder particles to be shaped; and b. applying a varying external pressure to the closed cavity, such that the closed cavity changes repeatedly between multiple shapes, thereby making the powder particles under compression move and be subject to friction. The shaping device and method according to present invention have highly controllable shaping processing intensity of powder particles and stable processing strength, and thus are applicable to shaping and pulverization of various powder particles, and also applicable to pulverization and further shaping processing of dispersed agglomerates. | 2012-02-23 |
20120043686 | Golf Balls including Multiple Dimple Types and/or Multiple Layers of Different Hardnesses - Golf balls may include a first pole, a second pole, and a seam located between the first and second poles. Dimples are formed on a surface of the ball in a pattern that includes a plurality of repeating sectors around each pole of the ball. The sectors on one ball half are rotationally offset across the seam line from the sectors on the other ball half. Additionally, each individual sector includes a line of symmetry over which the dimple pattern on one half of the sector is mirrored on the other half. A variety of different dimple types also may be arranged on a golf ball surface, e.g., within the sectors described above. Additional aspects of this invention relate to the features of various layers of a multi-piece golf ball and to methods of making golf balls having at least some of the features mentioned above. | 2012-02-23 |
20120043687 | PROCESS FOR THE PRODUCTION OF WATER AND SOLVENT-FREE POLYMERS - The present invention relates to water and solvent-free polymers, in particular water and solvent-free synthetic rubber products like non-halogenated and halogenated butyl rubber products as well as a process for the production thereof. The invention further relates to a device suitable to accomplish said process. | 2012-02-23 |
20120043688 | METHOD AND DEVICE FOR PRODUCING MARKING LABELS - The invention relates to a method for producing marking labels for marking electronic components, wherein a mat-shaped injection molded part ( | 2012-02-23 |
20120043689 | METHOD FOR MANUFACTURING COMPOSITE OF METAL AND RESIN - A method for manufacturing a composite of metal and resin includes steps of: providing a metal piece; cleaning the metal piece in a degreasing agent solution; partially shielding the metal piece and remaining portions of the metal surface uncovered; blasting the metal piece with hard particles to form a plurality of micro pores in the uncovered portion; inserting the metal piece into a mold; injecting molten resin material on the metal piece, the resin material combined with the metal piece when the resin material is cool. | 2012-02-23 |
20120043690 | MTHODE FOR MAKING CARBON NANOTUBE COMPOSITE WIRE STRUCTURE - A method for making a carbon nanotube composite wire structure comprises the following steps. A supply unit, a collecting unit, and a wrapping unit are provided. The wrapping unit comprises a hollow rotating shaft, and a face plate mounted on the hollow rotating shaft. A linear structure is provided by the supply unit. The linear structure passes through the hollow rotating shaft and is fixed on a collecting unit. A carbon nanotube structure is drawn from a carbon nanotube array. The carbon nanotube array is loaded on the face plate. One end of the carbon nanotube structure is adhered to the linear structure. The face plate is rotated, and the linear structure is pulled along a fixed direction. As such the carbon nanotube structure is wrapping around the linear structure | 2012-02-23 |
20120043691 | MULTILAYERED POLYIMIDE FILM - A multilayered polyimide film including a polyimide layer (b), and a pigment-containing polyimide layer (a) stacked on one surface or both surfaces of the polyimide layer (b), wherein the polyimide layer (b) is formed of a polyimide including an aromatic tetracarboxylic acid unit containing a 3,3′,4,4′-biphenyltetracarboxylic acid unit in an amount of 70 to 100 mol %, and an aromatic diamine unit containing a p-phenylenediamine unit in an amount of 70 to 100 mol %. | 2012-02-23 |
20120043692 | NUCLEATING AGENT AND THERMOPLASTIC COMPOSITIONS COMPRISING THE SAME - A composition comprises a thermoplastic and a nucleating agent. The thermoplastic can be a polyolefin selected from the group consisting of polypropylene homopolymers, polypropylene copolymers, polyethylene, polyethylene copolymers, polybutylene, poly(4 methyl 1 pentene) and mixtures thereof. The nucleating agent can comprise a metal salt of a phenylphosphonic acid. The nucleating agent can comprise primary particles having a mean aspect ratio of about two or more. The composition can also comprise an acid scavenger, such as one or more metal salts of stearic acid. The composition can be used to produce thermoplastic articles using, for example, injection molding and thermoforming techniques. | 2012-02-23 |
20120043693 | Methods for Fabricating Microstructures - Described herein are casting and molding methods useful for making microstructured objects. By including a plurality of microfeatures on the surface of an object, other characteristics may be imparted to the object, such as increased hydrophobicity. Some of the casting and molding methods described herein further allow for manufacture of objects having both microfeatures and macro features, for example microfeatures on or within macro features or selected macro feature regions. | 2012-02-23 |
20120043694 | CURING AGENT COMPOSITION - A curing agent composition for a water-soluble phenol resin used to produce a mold, which comprises a branched ester compound that is derived from a carboxylic acid having a branched chain, and an alcohol, and has 5 to 13 carbon atoms. | 2012-02-23 |
20120043695 | METHOD FOR FORMING A DISPENSER - A method of producing a dispenser for a viscous substance comprising forming a barrel having a top surface with plurality of apertures at one end, directly molding a thermoplastic seal unit onto said top surface, said thermoplastic flowing into said plurality of apertures during molding to form a seal unit having a substantially planar section and a plurality of depending projections. The seal unit can be removable and usually not replaceable after each use of the dispenser. The seal unit can have pull tabs for the easy removal of the seal unit. This seal unit provides a positive seal for the lotion or gel substance that is to be dispensed from the barrel. | 2012-02-23 |
20120043696 | METHOD OF INJECTION MOLDING - An injection molded article with which a sheet material is integrated is manufactured without causing damage to the sheet material. A molten resin injected into a mold cavity, passes smoothly a peripheral edge of the mold cavity, and flows into a groove portion without accumulating in the vicinity of the peripheral edge. When cooling the molten resin, the temperature of the molten resin in the groove decreases more quickly than the temperature of the molten resin in the mold cavity, because the volume of the groove portion is small. The viscosity of the molten resin is increased rapidly, preventing further molten resin from flowing into the groove portion. The sheet material in the vicinity of the peripheral edge is covered and protected against exposure to heat and/or pressure of the molten resin. | 2012-02-23 |
20120043697 | FLUID FLOW FILTER AND METHOD OF MAKING AND USING - A filter well suited for paint arrestor usage having a monolithic high loft manmade fiber body with a convoluted flow contact surface. The filter is preferably formed by a convoluter as in one with a roller set and blade cutter to form mirror image fiber filter sheets from a received fiber batt. Provided is a well mixed proper fiber blend, such as one having a set of fibers made of a majority of course fibers joined by way of thermal bonding fibers which facilitate, during convoluting, formation of a crisp cut and high integrity three dimensional surface, as in one of rows of peaks separated by valleys. The projection/recess arrangement over the flow contact surface as well as the thickness and relative projection-to-base dimensions are arranged to provide a high paint holding capacity without too fast a load up of, for example, paint particles and while avoiding too great of a pressure drop within that load up time. | 2012-02-23 |
20120043698 | METHODS FOR CONSTRUCTION OF SLAB TRACK RAILROADS - A method for construction of a concrete platform for use in slab track railroads, comprising supporting a tie plate and rail on a concrete form for casting the concrete platform. The concrete form includes a horizontal form positioned below the tie plate, that supports a cast in place fastener system that is imbedded in the surface of the concrete platform and secures the tie plate to the concrete platform. The horizontal form comprises a removable or sacrificial insert that is cast into the surface of the concrete platform. Materials such as expanded polystyrene can be used to make sacrificial inserts that can be removed by dissolving with solvents such as dibasic esters. After the concrete platform is cast, the removable insert is removed and the resulting cavity is filled with a filler material, all without the need to disassemble the tie plate and rail. | 2012-02-23 |
20120043699 | METHOD FOR PRODUCING ENDLESS BELT - A method for producing an endless belt includes partially covering a circumferential surface of a cylindrical mold with a covering film member nonadhesive to the mold by fixing the covering film member with a fixing member, applying a resin material to the circumferential surface of the mold, curing the resin material to form a resin film, and removing the resin film from the mold by blowing a gas into a gap between the circumferential surface of the mold and the covering film member. | 2012-02-23 |
20120043700 | PROCESS FOR PREPARING INJECTION MOLDED PARTS WITH DECREASED GLASS FIBER READ OUT - The present invention relates to a process for preparing an injection molded part, comprising the following steps: a preparing a glass fiber reinforced polyamide-6 composition with a relative viscosity of less than 2.4; b heating a such composition to obtain a viscous liquid; c filling a mold cavity with the viscous liquid with a filling time of at least 0.8 s; d leaving the viscous liquid in the mold under pressure until it cools to form a part; e opening the mold; f ejecting the part; wherein the polyamide-6 composition has a crystallization temperature under hyper DSC conditions of less than 168° C. The invention also relates to an injection molded part a having a maximum wall thickness of at least 2.5 mm; and/or b a part weight of at least 100 g per injection point; wherein the part consists of a glass fiber reinforced semi-crystalline polyamide-6 composition having a relative solution viscosity of less than 2.4, wherein the polyamide-6 composition has a crystallization temperature under hyper DSC conditions of less than 168° C. | 2012-02-23 |
20120043701 | METHOD FOR LASER ENGRAVING FLEXOGRAPHIC PRINTING ARTICLES BASED ON MILLABLE POLYURETHANES - A flexographic printing sleeve or plate is made by a method that includes providing a millable polyurethane, crosslinking the millable polyurethane, and forming a relief by at least laser engraving the crosslinked millable polyurethane. For example, crosslinking may be accomplished by a peroxide-based process or by a vulcanization process using sulfur. A relief in one example is formed by extruding the millable polyurethane, thermally crosslinking the polyurethane after the extrusion step and laser engraving the crosslinked millable polyurethane. A printing article is formed into the shape of a flat printing plate or a continuous in-the-round printing sleeve. | 2012-02-23 |
20120043702 | PROCESSING METHOD FOR IN-MOLD COATING INTEGRATIVE SYSTEM - A processing method for in-mold coating integrative system is used in cooperation with an injection molding machine. The injection molding machine comprises a rotatable work platform and a combination of at least one male mold and at least two female molds. The rotatable work platform is divided averagely into several work areas, and the processing proceeds sequentially in each work area by the rotation of the rotatable work platform. The processing method comprises following steps: injection molding a solid workpiece firstly, and leaving the solid work-piece on the male mold; rotating the rotatable work platform; performing surface coloring; rotating the rotatable work platform; injecting UV top-coat, the top-coat female mold is made of light-directing material and has a die cavity and a UV paint cavity on the surface of the solid workpiece, and a UV top-coat layer is injected into the UV paint cavity through a paint channel; irradiating the UV top-coat layer by a UV top-coat hardening lamp; and demolding to achieve a finished product. The method is of benefit to mass production, and can reduce labor cost and processing cost. | 2012-02-23 |
20120043703 | METHOD OF FABRICATING AN INTRALUMINAL SCAFFOLD WITH AN ENLARGED PORTION - Devices and methods for treating veins and venous conditions, such as chronic cerebrospinal venous insufficiency, are provided. In one aspect, the disclosed subject matter provides an intraluminal scaffold having a generally tubular body with a lumen defined therethrough, the tubular body having a compressed condition for delivery and an expanded condition for implant within a vessel having a distended portion, at least a length of the tubular body configured to form an enlarged portion in the expanded condition to engage a wall of the distended portion of the vessel. Methods for fabricating and using the scaffold, methods for remodeling a vein, and methods of deploying a medical device in a vessel without negatively impacting the function of a valve of the vessel, are also provided. | 2012-02-23 |
20120043704 | BULK RESIN INFUSION - A method for performing resin infusion into a dry reinforcement on a layup mandrel comprises placing resin at a resin zone on the mandrel; bagging the reinforcement and the resin with a bagging film; heating the resin while applying compaction pressure to the bagging film to cause the resin to be infused into the reinforcement; and creating a pressure differential outside of the bagging film over the resin zone to control rate and pressure at which the resin is infused into the reinforcement. As a result, the resin pressure and infusion rate are controlled independently of the compaction pressure on the reinforcement. | 2012-02-23 |
20120043705 | METHOD FOR FEEDING A BURDEN TO A BLAST FURNACE - The present invention proposes a method for feeding a burden to a blast furnace ( | 2012-02-23 |
20120043706 | CARRIAGE TO TRANSPORT A LADLE AND TO TRANSFER MOLTEN METAL INTO EQUIPMENT FOR POURING AND TRANSPORTATION LINE FOR TRANSPORTING MOLTEN METAL - The present invention provides a carriage to transport a ladle and to transfer molten metal into equipment for pouring (hereafter, transfer carriage) whereby the investment cost can be reduced by having the equipment made compact, and the temperature of the molten metal can be maintained high, and the cycle time can be reduced, because the time to transport the molten metal can be less. Further, the present invention provides a transportation line for transporting the molten metal. This line requires a smaller space for its installation. The transfer carriage of the present invention comprises a transportation means that runs along the rails for transporting a ladle; a shifting means disposed on the transportation means, which shifting means moves in the direction that is perpendicular to the rails for transporting a ladle; a lifting mechanism attached to a pillar set upright on the shifting means, a tilting means disposed at a lifting member of the lifting mechanism; and a ladle-holding member that is supported by the tilting means at the axis of the tilting means, which member is tilted by the tilting means, and which can hold or release a receiving ladle, wherein the carriage transfers the molten metal in the receiving ladle into the ladle for pouring. | 2012-02-23 |
20120043707 | SUSPENSION APPARATUS - A suspension apparatus | 2012-02-23 |
20120043708 | DAMPING ELEMENT HAVING A WAVY SUPPORTING RING - Damping element comprising a hollow cylindrical spring element ( | 2012-02-23 |
20120043709 | HOLDER FOR FRAMING MEMBERS AND METHOD OF USE - A tool for spacing and holding a first framing member relative to a second framing member has a first bar and a second bar that are slidably interconnected. A first stop and a second stop are connected to the first bar and a first and second counter-stop are connected to the second bar. The first stop and first counter-stop form a first jaw and the second stop and the second counter-stop form a second jaw. A mechanism is provided for moving the second bar relative to the first bar. Movement of the handle from an open position to a closed position moves the first and second jaws from the open position to the closed position. | 2012-02-23 |
20120043710 | ADJUSTABLE TRACK CLAMP - An assembly comprises a platform including a first clamping surface, a track proximate to an edge of the first clamping surface, and a clamp mechanism including a second clamping surface. The clamp mechanism is configured to clamp a workpiece between the first clamping surface and the second clamping surface. The clamp mechanism is mounted to the track. The clamp mechanism is positionable at different locations along the track. The assembly may further comprise one or more adjustable spacer blocks mountable to the track to facilitate precisely positioning a workpiece proximate to the track at least two different spacings. | 2012-02-23 |
20120043711 | FIVE AXIS MACHINE VISE - A five axis vise includes two separated vise body portions that are supported on a machine tool table or other support that fixes the vise body portions in position. The vise body portions have jaws spaced up from the machine tool table sufficiently to permit machining five surfaces of a work piece held in the jaws. A vise screw is rotatably mounted in one of the vise body portions, and extends to the other vise body portion to actuate a movable jaw on the other vise body portion. The vise screw is threaded into a jaw nut that has a drive surface that engages and drives a driven surface on the movable jaw, with the drive and driven surfaces being inclined relative to the axis of force application to provide a downward force component on the movable jaw as it is tightened. The vise screw is an assembly of a threaded shank or shaft and a hub that is rotatably mounted in one of the body portions, with the threaded shank or shaft being locked in position in the hub. | 2012-02-23 |
20120043712 | MECHANISM AND METHOD FOR ALIGNING A WORKPIECE TO A SHADOW MASK - A workpiece support is disclosed in which the platen, and thus the workpiece, can be tilted about at least two axis, which allows gravity to align the workpiece with a shadow mask in two orthogonal directions. In some embodiments, the workpiece support utilizes an axis of rotation that is orthogonal to the surface of the workpiece, in conjunction with a second axis that is parallel to the surface of the workpiece. Additionally, a method of aligning the workpiece using this workpiece support is also disclosed. Further, the workpiece support can be utilized to remove the workpiece from the support after implantation is completed. | 2012-02-23 |
20120043713 | Sheet Processing Apparatus and Image Forming System - A finisher according to an aspect of the invention includes an intermediate tray that collects sheets to form a sheet bundle, a sheet gripping member that grips one end of the sheet bundle in a conveying direction and a positioning member that grips the other end of the sheet bundle in a conveying direction, a moving portion that moves the sheet gripping member and the positioning member to come close each other, a pair of folding rollers that folds the sheet bundle while conveying the sheet bundle, a projecting member that projects a part between the one end and the other end of the gripped sheet bundle toward the pair of folding rollers, a controller that controls the moving portion, such that the sheet gripping member and the positioning member come close each other in synchronization with an operation of projecting the projecting member toward the sheet bundle S. | 2012-02-23 |
20120043714 | Sheet Conveying Device - A sheet conveying device to convey a sheet in a sheet path is provided. The sheet conveying device includes a separator roller, which is arranged to be rotatably in contact with the sheet to apply conveying force to the sheet, a pad assembly including a separator pad, which is arranged to be in contact with the sheet stack to apply convey resistance to the sheet stack, and a holder, which is swingably attached to a base member and holds the separator pad, the base member being in a fixed position with respect to the separator roller, a spring, which urges the pad assembly toward the separator roller, and a slidable member, which is attached to the pad assembly to be integrally movable with the pad assembly and to be slidably in contact with a first slidable section in the base member. | 2012-02-23 |
20120043715 | IMAGE PROCESSING APPARATUS - An image processing apparatus according to the present invention has: an apparatus main body whose external appearance is configured from an upper casing, a lower casing, and a link casing that vertically links the upper casing and the lower casing and that has a paper discharge opening for discharging paper on one side face; a paper discharge portion that is formed as a space between the upper casing and the lower casing and that is to store paper discharged from the paper discharge opening; and an operation panel portion that is disposed in a vertically tiltable manner on a front face of the upper casing. When viewing the apparatus main body from the front side, an open space that allows paper discharged to the paper discharge portion to be viewed is provided between the operation panel portion and the link casing. | 2012-02-23 |
20120043716 | ROTATION TRANSMISSION MECHANISM AND PAPER FEEDER - A one-way clutch is mounted on an outer periphery of a rotary shaft in a manner to place a clutch needle bearing in contact with the outer periphery of the rotary shaft. A rotary member is disposed on one side of the one-way clutch and engaged with the one-way clutch to be subjected to the rotation of the rotary shaft transmitted thereto. A retaining member is mounted on the outer periphery of the rotary shaft and located on the opposite side of the one-way clutch from the rotary member, while an urging unit is provided for urging the one-way clutch to abut against the retaining member. | 2012-02-23 |
20120043717 | Puzzle With Washable Pieces - An educational toy includes a container in which washable puzzle pieces are housed. The washable puzzle pieces may be assembled and disassembled, and can be painted, colored, marked, penciled, or otherwise decorated. The washable puzzle pieces may be washed and redecorated. | 2012-02-23 |
20120043718 | Pyramid game - A three-dimensional game shaped as a pyramid or prism with four or more faces, in which each face has nine terraced levels that attenuate to the peak of the pyramid. Each level has a plurality of circular depressions for the placement of each player's playing pieces. The corresponding level of each face has the same number of circular depressions, and each consecutive higher level has two fewer depressions than its immediate lower level. The peak of the pyramid is truncated and has a single circular depression. The peak can only be occupied by one playing piece at a time. | 2012-02-23 |
20120043720 | PLAYING CARDS OF COMPARISON BETWEEN ALCOHOLIC BEVERAGES CONTAINING INFORMATION ABOUT ITS FEATURES, MANUFACTURING QUALITIES AND CONSUMPTION - Playing cards of comparison between alcoholic beverages containing information about its features, manufacturing qualities and consumption” are disclosed. Playing cards, boards or plates containing information, quantitative and qualitative features as well as geographic indications of alcoholic beverages generally, and may be divided in groups or sets used as a manner of entertainment or also as a means to diffuse specific information about said alcoholic products, and the conception of each game will be constituted by a set of cards ( | 2012-02-23 |
20120043721 | Double Denomination Playing Card Deck - The present invention provides a deck of double denomination playing cards, there being 1,378 cards in the deck, with each card having a front playing face divided into a first playing field and a second playing field whereby the deck has a total of 1,378 first playing fields and 1,378 second playing fields, with each playing field containing one of four non-denominational suits selected from the group comprising: Hearts; Clubs; Diamonds; and Spades, with each playing field further containing one of thirteen value designations selected from the group comprising: 2; 3; 4; 5; 6; 7; 8; 9; 10; Jack; Queen, King; and Ace, whereby each playing field contains a said non-denominational suit and a said value designation. In the deck the first and a second (e.g. ‘top’ and ‘bottom’) playing field of any of the double denomination cards are separate entities in their own right. Their value and operation is restricted to interaction with other double denomination cards along the first/top and second/bottom playing field to ensure that the cards can be rotated at all times. The deck uniquely allows parallel games to be run on the respective fields of the double denomination cards and also a wide range of sub-decks to be formed that allow the same symmetric function as the full deck. | 2012-02-23 |
20120043722 | SMART SHOOTING RANGE - An intelligent shooting having features and props able to be control and monitored wirelessly and remotely is disclosed. Further novel shooting target designs are additionally disclosed herein having external power supplies configured therewith. In a preferred embodiment, a first target of the present invention can be rotated in either direction about a vertical axis to optionally simulate friendly or unfriendly target. Also in this embodiment the target can rotate about a horizontal axis to simulate an engaged or unengaged target, or target eliminated. The present invention also contemplates wireless control and monitoring of target range features such as lighting systems, feedback alarms, and motion sensors, in addition to scene props such as smoke and acoustical simulators. | 2012-02-23 |
20120043723 | Tossing Game - Embodiments of the present invention provide an object tossing game, which can be used for example outdoors during tailgate parties and backyard barbeques. Specific game embodiments comprise a convenient and portable carrying case for storage of the game pieces, which doubles as the playing surface. In particular embodiments, the game includes saddle-shaped bird seed filled bags which can be tossed using a player's foot and directed toward a game board that comprises three scoring areas. | 2012-02-23 |
20120043724 | INTER STAGE SEAL HOUSING HAVING A REPLACEABLE WEAR STRIP - An inter stage seal housing for a turbine engine having upper and lower half inter stage seal housings in which a contact sealing surface of the seal housing is restored after an interval of engine operation. The contact sealing surface is restored by fitting a replaceable wear strip on the downstream sealing surface of the seal housing. In order to fit the replaceable wear strip, a circumferential groove is machined along an outer peripheral edge of the seal housing. The groove is machined to include axial location and radial retention such that the wear strips can be slid into the upper half and lower half inter stage seal housing circumferentially from the horizontal joint. The groove includes through holes and the wear strips include corresponding threaded holes such that the wear strips can be fastened in the groove by fasteners and fastener retention hardware. | 2012-02-23 |
20120043725 | INTERSHAFT SEAL - An intershaft seal for inner and outer coaxial shafts which rotate relative to each other. The seal is located in an annular space between the shafts and maintains an axial pressure differential between a fluid pressure on the first side of the seal and a fluid pressure on the other, second side of the seal. The seal comprises a sealing ring which is coaxial with the shafts and which forms a sealing contact with the outer shaft to maintain the pressure differential. | 2012-02-23 |
20120043726 | MULTIPLE SEALING ELEMENT ASSEMBLY - A seal assembly, method for sealing a seal assembly and a modular seal unit for a rotating control device for use in an offshore environment. The modular seal unit includes a first outer housing, a first seal housing lockable within the first outer housing, and a first sealing element disposed on a lower end of the first seal housing. The first sealing element includes a throughbore configured to receive a drill pipe, and a sealing surface configured to seal against the drill pipe. The modular seal unit also includes a first connector configured to couple the first seal housing to the first outer housing, and a second connector configured to couple the first seal housing to one selected from a second outer housing of a second modular seal unit or a running tool adapter. | 2012-02-23 |
20120043727 | Shaft seal for a turbomachine - A shaft seal for a turbomachine is provided for sealing process side of the turbomachine against the atmosphere. The shaft seal includes a process gas seal which is acted upon by a process gas and be blocked on the process side, an atmosphere seal which is acted upon by air and be blocked on the atmosphere side, and a ventilation chamber extending around the shaft of the turbomachine. The ventilation chamber is arranged between the process gas seal and the atmosphere seal for collecting and discharging a process gas leakage that has passed through the process gas seal and an air leakage that has passed through the atmosphere seal. The ventilation chamber includes a radially inner leakage inlet, a radially outward leakage outlet and built in components that are dimensioned to as to provide a flame blocking function with regard to ignition of the leakage at the leakage inlet. | 2012-02-23 |
20120043728 | TURBINE ENGINE SEALS - A seal is provided for preventing axial leakage through a radial gap between a stationary structure and a rotating structure. The radial gap is defined by an inner radial surface opposing an outer radial surface across the radial gap. The seal includes at least one land disposed on one of the inner radial surface and outer radial surface. At least one first tooth and at least one second tooth project from the other of the radial surfaces. The second tooth is shorter than the first tooth. At least one of the first tooth and second tooth, is configured to extend at an angle upstream. This angle is defined between a radial surface from which the first or second tooth projects and an upstream surface of the same tooth. The angle is less than or equal to about 80 degrees. | 2012-02-23 |
20120043729 | CARRIAGE SEALING STRUCTURE FOR REFRIGERATOR CAR AND WORKING METHOD THEREOF - A carriage sealing structure for refrigerator car is disclosed. The carriage is composed of core carriage plates provided with a heat preservation layer that is made of polyurethane. The carriage plates include a left side plate ( | 2012-02-23 |