08th week of 2013 patent applcation highlights part 33 |
Patent application number | Title | Published |
20130045579 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device includes the following steps. A semiconductor substrate having a first strained silicon layer is provided. Then, an insulating region such as a shallow trench isolation (STI) is formed, where a depth of the insulating region is substantially larger than a depth of the first strained silicon layer. Subsequently, the first strained silicon layer is removed, and a second strained silicon layer is formed to substitute the first strained silicon layer. | 2013-02-21 |
20130045580 | METHODS FOR FABRICATING FINFET INTEGRATED CIRCUITS IN BULK SEMICONDUCTOR SUBSTRATES - Methods are provided for fabricating FinFETs that avoid thickness uniformity problems across a die or a substrate. One method includes providing a semiconductor substrate divided into a plurality of chips, each chip bounded by scribe lines. The substrate is etched to form a plurality of fins, each of the fins extending uniformly across the width of the chips. An oxide is deposited to fill between the fins and is etched to recess the top of the oxide below the top of the fins. An isolation hard mask is deposited and patterned overlying the plurality of fins and is used as an etch mask to etch trenches in the substrate defining a plurality of active areas, each of the plurality of active areas including at least a portion of at least one of the fins. The trenches are filled with an insulating material to isolate between adjacent active areas. | 2013-02-21 |
20130045581 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - The present invention discloses a method of manufacturing semiconductor devices. The method includes a step of performing a chemical mechanical planarization processing on a poly-silicon layer before fabricating a poly-silicon gate such that the poly-silicon gates obtained in subsequent fabrication process are kept at the same height, which thus avoids the silicon nitride residues issue that occurs in the prior art. Therefore, the present invention is capable of enhancing product yield of semiconductor devices and improving device performances. | 2013-02-21 |
20130045582 | CAPACITOR INSULATING FILM, METHOD OF FORMING THE SAME, CAPACITOR AND SEMICONDUCTOR DEVICE USING THE CAPACITOR INSULATING FILM - A capacitor insulating film may include, but is not limited to, strontium, titanium, and oxygen. The capacitor insulating film has a ratio of a spectrum intensity of ( | 2013-02-21 |
20130045583 | METHOD FOR MEASURING DEFECTS IN A SILICON SUBSTRATE - A method for measuring defects in a silicon substrate obtained by silicon ingot pulling, wherein the defects have a size of less than 20 nm. The method includes applying a first defect consolidation heat treatment to the substrate at a temperature of between 750 and 850° C. for a time of between 30 minutes and 1 hour to consolidate the defects; applying a second defect enlargement heat treatment to the substrate at a temperature of between 900 and 1000° C. for a time of between 1 hour and 10 hour to enlarge the defects to a size of greater than or equal to 20 nm, with the enlarged defects containing oxygen precipitates; measuring size and density of the enlarged defects in a surface layer of the substrate; and calculating the initial size of the defects on the basis of the measurements of the enlarged defects. | 2013-02-21 |
20130045584 | METHOD OF ELIMINATING FRAGMENTS OF MATERIAL PRESENT ON THE SURFACE OF A MULTILAYER STRUCTURE - The invention relates to a method of eliminating fragments of material present on the exposed surface of a first wafer bonded to a second wafer, the method including a step consisting of placing the first wafer in a liquid solution and propagating ultrasonic waves in the solution. The invention also relates to a process for manufacturing a multilayer structure comprising the following successive steps: bonding of a first wafer to a second wafer so as to form a multilayer structure; annealing of the structure; and thinning of the first wafer, including at least one step of chemically etching the first wafer. The process further includes, after the chemical etching step, the elimination of fragments of material present on the exposed surface of the thinned first wafer. | 2013-02-21 |
20130045585 | ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 2013-02-21 |
20130045586 | Process Of Internal Gettering For Czochralski Silicon Wafer - An internal gettering process for a Czochralski silicon wafers comprises: (1) heating a Cz silicon wafer to 1200-1250° C. at a heating rate of 50-100° C./s under a nitrogen atmosphere, maintaining for 30-150 seconds, cooling the Cz silicon wafer to 800-1000° C. first at a cooling rate of 5-50° C./s, and then cooling the Cz silicon wafer naturally; (2) annealing the Cz silicon wafer obtained in the step (1) at 800-900° C. under an argon atmosphere for a period of 8-16 hours. The present invention only involves two heat treatment steps which require lower temperature and shorter time comparing to the conventional processes. The density of the bulk microdefects and the width of the denuded zone can be easily controlled by the temperature, duration and cooling rate of rapid thermal processing in the first step. | 2013-02-21 |
20130045587 | LOW TEMPERATURE MIGRATION ENHANCED Si-Ge EPITAXY WITH PLASMA ASSISTED SURFACE ACTIVATION - Epitaxial films are grown by alternately exposed to precursor dosing regions, inert gas plasma regions, hydrogen-containing plasma regions, chlorine-containing plasma and metrology regions, or regions where an atomic hydrogen source is located. Alternately, laser irradiation techniques may be substituted for the plasma energy in some of the processing regions. The film growth process can be implemented at substrate temperatures between about 25 C and about 600 C, together with optional exposures to laser irradiation to cause the surface of the film to melt or to experience a near-melt condition. | 2013-02-21 |
20130045588 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is disclosed, comprising: providing a substrate, a gate region on the substrate and a semiconductor region at both sides of the gate region; forming sacrificial spacers, which cover a portion of the semiconductor region, on sidewalls of the gate region; forming a metal layer on a portion of the semiconductor region outside the sacrificial spacers and on the gate region; removing the sacrificial spacers; performing annealing so that the metal layer reacts with the semiconductor region to form a metal-semiconductor compound layer on the semiconductor region; and removing unreacted metal layer. By separating the metal layer from the channel and the gate region of the device with the thickness of the sacrificial spacers, the effect of metal layer diffusion on the channel and the gate region is reduced and performance of the device is improved. | 2013-02-21 |
20130045589 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A method of manufacturing a transistor of a semiconductor device, the method including forming a gate pattern on a semiconductor substrate, forming a spacer on a sidewall of the gate pattern, wet etching the semiconductor substrate to form a first recess in the semiconductor substrate, wherein the first recess is adjacent to the spacer, and wet etching the first recess to form a second recess in the semiconductor substrate. | 2013-02-21 |
20130045590 | CARBON TAPE INTENDED TO RECEIVE A LAYER OF A SEMICONDUCTOR MATERIAL - A carbon ribbon ( | 2013-02-21 |
20130045591 | NEGATIVE TONE DEVELOP PROCESS WITH PHOTORESIST DOPING - A method of semiconductor processing includes coating a top surface of a substrate having a semiconductor surface with a positive photoresist layer. The positive photoresist layer is exposed using a reticle or a mask that defines a pattern. The positive photoresist layer is doped by introducing at least one material modifying species after exposing. The positive photoresist layer is developed with a negative tone developer to form a patterned positive photoresist layer which provides masked portions of the top surface and unmasked portions of the top surface. A selective process is then performed to the unmasked portions of the top surface. | 2013-02-21 |
20130045592 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND DEVICE FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A method for manufacturing a SiC semiconductor device includes: a step of forming an oxide film on a surface of a SiC substrate; and a step of removing the oxide film. In the step of forming the oxide film, ozone gas is used. In the step of removing the oxide film, it is preferable to use halogen plasma or hydrogen plasma. In this way, problems associated with a chemical solution can be reduced while obtaining a method and device for manufacturing a SiC semiconductor device, by each of which a cleaning effect can be improved. | 2013-02-21 |
20130045593 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A silicon carbide substrate having a surface is prepared. A coating film made of a first material is formed directly on the surface of the silicon carbide substrate. A mask layer made of a second material is formed on the coating film. The first material is higher in adhesiveness with silicon carbide than the second material. A first opening is formed in the mask layer. First impurity ions for providing a first conductivity type are implanted into the silicon carbide substrate by using ion beams passing through the first opening in the mask layer and through the coating film. | 2013-02-21 |
20130045594 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE HAVING METAL GATE - A manufacturing method for a semiconductor device having a metal gate includes providing a substrate having at least a first semiconductor device formed thereon, forming a first gate trench in the first semiconductor device, forming a first work function metal layer in the first gate trench, and performing a decoupled plasma oxidation to the first work function metal layer. | 2013-02-21 |
20130045595 | METHOD FOR PROCESSING METAL LAYER - The method for processing a metal layer including the following steps is illustrated. First, a semiconductor substrate is provided. Then, a metal layer is formed over the semiconductor substrate. Furthermore, a microwave energy is used to selectively heat the metal layer without affecting the underlying semiconductor substrate and other formed structures, in which the microwave energy has a predetermined frequency in accordance with a material of the metal layer, and the predetermined frequency ranges between 1 KHz to 1 MHz. | 2013-02-21 |
20130045596 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND POLISHING APPARATUS - According to one embodiment, a semiconductor device manufacturing method is provided. In the semiconductor device manufacturing method, a process target film is formed on a semiconductor substrate, and the surface of the process target film is polished by a CMP method. The CMP method comprises heating a rotating polishing pad from a first temperature to a second temperature higher than the first temperature, and bringing the surface of the process target film into contact with the polishing pad heated to the second temperature. | 2013-02-21 |
20130045597 | LIQUID COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE AND METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE USING THE SAME - [Problems] An object of the present invention is to provide a cleaning liquid composition which removes residual liquid and contaminants after chemical-mechanical polishing (CMP) of the surface of a semiconductor substrate in the production process of a semiconductor circuit device; and a cleaning method using the cleaning liquid composition. | 2013-02-21 |
20130045598 | Method for chemical mechanical polishing tungsten - A method for chemical mechanical polishing of a substrate comprising tungsten using a nonselective chemical mechanical polishing composition. | 2013-02-21 |
20130045599 | Method for chemical mechanical polishing copper - A method for chemical mechanical polishing of a copper substrate, is provided, comprising: providing a copper substrate; providing slurry composition comprising, as initial components: water; 0.1 to 20 wt % abrasive; 0.01 to 15 wt % complexing agent; 0.02 to 5 wt % inhibitor; 0.01 to 5 wt % phosphorus containing compound; 0.001 to 3 wt % polyvinyl pyrrolidone; >0.1 to 1 wt % histidine; >0.1 to 1 wt % guanidine; optional oxidizing agent; optional leveling agent; optional biocide; and, optional pH adjusting agent; wherein the slurry composition provided has pH of 9 to 11; providing a chemical mechanical polishing pad with a polishing surface; dispensing the slimy composition onto the polishing surface at or near the interface between the polishing surface and the substrate; and, creating dynamic contact at an interface between the polishing surface and the substrate with a down force of 0.69 to 34.5 kPa; wherein the substrate is polished. | 2013-02-21 |
20130045600 | METHOD FOR FORMING FIN-SHAPED SEMICONDUCTOR STRUCTURE - A method for fabricating a fin-shaped semiconductor structure is provided, including: providing a semiconductor substrate with a semiconductor island and a dielectric layer formed thereover; forming a mask layer over the semiconductor island and the dielectric layer; forming an opening in the mask layer, exposing a top surface of the semiconductor island and portions of the dielectric layer adjacent to the semiconductor island; performing an etching process, simultaneously etching portions of the mask layer, and portions of the semiconductor island and the dielectric layer exposed by the opening; and removing the mask layer and the dielectric layer, leaving an etched semiconductor island with curved top surfaces and various thicknesses over the semiconductor substrate. | 2013-02-21 |
20130045601 | COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS USING THE SAME - A composition for forming a silicon-containing resist underlayer film that contains: a component (A) including at least one or more compounds selected from the group consisting of a polymer having repeating units shown by the following general formulae (1-1a) and (1-1b) and being capable of generating a phenolic hydroxyl group, a hydrolysate of the polymer, and a hydrolysis-condensate of the polymer, and a component (B) which is a silicon-containing compound obtained by hydrolysis-condensation of a mixture containing, at least, one or more hydrolysable silicon compounds represented by the following general formula (2) and one or more hydrolysable silicon compounds represented by the following general formula (3). | 2013-02-21 |
20130045602 | METHOD FOR FORMING CONTACT HOLES - A method for forming contact holes is applied in a transistor array substrate. The transistor array substrate includes first contact pads, second contact pads located over the first contact pads, a first insulation layer covering the first contact pads, and a second insulation layer covering the second contact pads. Firstly, a photoresist pattern layer having recesses and first openings is formed on the second insulation layer. The first openings expose the second insulation layer partially. Then, the first insulation layer and the second insulation layer inside the first openings are removed partially, to expose the first contact pads. Then, the thickness of the photoresist pattern layer is reduced, so that the recesses form a plurality of second openings which expose the second insulation layer partially. After that, a part of the second insulation layer which is located inside the second openings is removed, to expose the second contact pads. | 2013-02-21 |
20130045603 | SEMICONDUCTOR PROCESS - A semiconductor process is described as follows. A material layer is provided on a substrate. A low-temperature oxidation treatment is performed to the material layer. A photoresist layer is formed on the material layer after the low-temperature oxidation treatment. The photoresist layer is patterned. | 2013-02-21 |
20130045604 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A plasma processing apparatus which can adjust ion energy on a wafer to a value in a desired range to perform machining with high precision or processing stably for a long time is provided. To the plasma processing apparatus which processes a wafer mounted on a mounting surface of an upper portion of a stage using plasma formed in a processing chamber while supplying radio frequency power from a power supply to an electrode disposed in the stage a detector disposed on an outer circumferential side of the mounting surface of the stage to detect a differential component Vpp between the maximum value and the minimum value and a DC component Vdc from a value of a bias voltage formed thereabove and a controller to adjust an output of the radio frequency bias power to make a value of Vpp/2+|Vdc| constant based on an output from the detector are provided. | 2013-02-21 |
20130045605 | DRY-ETCH FOR SILICON-AND-NITROGEN-CONTAINING FILMS - A method of etching exposed silicon-and-nitrogen-containing material on patterned heterogeneous structures is described and includes a remote plasma etch formed from a fluorine-containing precursor and an oxygen-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the exposed regions of silicon-and-nitrogen-containing material. The plasmas effluents react with the patterned heterogeneous structures to selectively remove silicon-and-nitrogen-containing material from the exposed silicon-and-nitrogen-containing material regions while very slowly removing other exposed materials. The silicon-and-nitrogen-containing material selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region. The ion suppression element reduces or substantially eliminates the number of ionically-charged species that reach the substrate. The methods may be used to selectively remove silicon-and-nitrogen-containing material at more than twenty times the rate of silicon oxide. | 2013-02-21 |
20130045606 | SEMICONDUCTOR DEVICE CLEANING METHOD AND APPARATUS - A method includes providing a wafer and providing a first spray bar spaced a distance from the wafer. A first spray is dispensed from the first spray bar onto a first portion (e.g., half) of the wafer. Thereafter, the wafer is rotated. A second spray is dispensed from the first spray bar onto a second portion (e.g., half) of the rotated wafer. In embodiments, a plurality of spray bars are positioned above the wafer. One or more of the spray bars may be tunable in separation distance and/or angle of dispensing. | 2013-02-21 |
20130045607 | PATTERN GENERATING APPARATUS, PATTERN GENERATING PROGRAM, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - According to one embodiment, a pattern generating apparatus includes a light intensity calculating part that calculates light intensity at a pattern to be formed based on exposure and light intensity at the periphery of the pattern, a light intensity evaluating part that evaluates the light intensities at the pattern and the periphery of the pattern, and a data output part that outputs correction data for the pattern based on the results of the evaluation by the light intensity part. | 2013-02-21 |
20130045608 | REDUCTION OF PORE FILL MATERIAL DEWETTING - In one embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, includes operations comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent (e.g., a high boiling point solvent); and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer. | 2013-02-21 |
20130045609 | METHOD FOR MAKING A SEMICONDUCTOR DEVICE BY LASER IRRADIATION - A method for making a semiconductor device including the steps of exposing a semiconductor substrate to a process step or sequence of process steps of which at least one process performance parameter is determined in a region of the semiconductor substrate, and irradiating the region with a laser having laser irradiation parameters; wherein the irradiation parameters are determined based on the at least one process performance parameter. | 2013-02-21 |
20130045610 | CONTACT ELEMENT INCLUDING HELICAL ARRANGEMENT DEFINED IN INTERNAL SURFACE - An electrically-conducting contact element includes a section of the contact element defining an aperture. The section is configured to receive a wire cable within the aperture for attachment thereto. The section includes an internal surface with at least one cutout arrangement formed thereon. A wire assembly that includes the electrically-conducting contact and a method to construct the electrically-conducting contact are also presented. The method includes a step of providing the contact element and forming at least one cutout arrangement on the internal surface of the contact element. A further step in the method includes altering material on the internal surface of the contact element by a forming means. The forming means may be one of milling, rifling, machining, cutting, indenting, or stamping. A wire assembly and a vehicular electrical wiring harness that respectively include the contact element are also further presented. | 2013-02-21 |
20130045611 | ELECTRONIC MODULE PACKAGES AND COMMUNICATION ASSEMBLIES - An electronic module package including an electronic module configured to receive input signals and process the input signals to provide output signals. The electronic module package also includes an interposer that has a substrate with opposite board and module surfaces. The electronic module is mounted to the module surface. The interposer includes electrical contacts along the module surface that are communicatively coupled to the electronic module through the substrate. The electronic module package also includes a connector receptacle having a receptacle housing coupled to the interposer. The receptacle housing defines a reception space that is located over and permits access to the electrical contacts. The connector receptacle is configured to receive an electrical connector within the reception space to electrically couple the electrical contacts and the electrical connector. The connector receptacle holds the electrical connector therein in a mated position. | 2013-02-21 |
20130045612 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 2013-02-21 |
20130045613 | MOUNTING RAIL BUS SYSTEM - A mounting rail bus system for supplying power voltage and data signals to a plurality of modules, including a plurality of longitudinally-arranged bus devices mounting the modules in parallel spaced transverse relation on a mounting rail, each of the bus devices including a printed circuit board having parallel strip conductors for transmitting data signals, and a pair of power contact pins for transmitting a power voltage, characterized by the provision of a plurality of generally L-shaped double bushing contact elements have module bush segments for respectively connecting the strip conductors and the contact pins of the bus device with the associated module, and orthogonally arranged partner bush segments for connecting together the strip conductors and pin contacts of adjacent bus devices, respectively, whereby power voltage and data signals are transmitted from the bus device both to the associated module and to the adjacent partner bus device. | 2013-02-21 |
20130045614 | LOCK-RELEASE ADAPTER AND COMMUNICATION CABLE UNIT - A lock-release adapter attached to a first connector, the first connector being put into a locked state with a second connector upon the first connector being fitted with the second connector, the locked state being released when a lock-release projection of the first connector is depressed, the lock-release adapter includes a holder fitted with the first connector, and an axial member pivotally supported by the holder, the axial member including, at one end in a direction of the pivot axis of the axial member, a projection portion that projects in a direction perpendicular to the pivot axis, the projection portion depressing the lock-release projection to release the locked state when the axial member is in a first pivot position. | 2013-02-21 |
20130045615 | CARD CONNECTOR - A card connector is disclosed. The card connector comprises an insulative base, a plurality of connecting terminals, a card ejecting mechanism and a shielding case. The shielding case covers the insulative base. A card insertion region is formed between the insulative base and the shielding case. A plurality of terminal slots is defined on a surface of the insulative base facing the card insertion region. The connecting terminals are received in the terminal slots. The tray comprises an inner tray and an outer tray. The outer tray is pivotally connected to the inner tray. The inner tray and the outer tray are connected together to form a receiving groove for receiving a SIM card. The tray is formed by pivotally connecting the inner tray to the outer tray, therefore, the card connector according to the present invention can be used more conveniently. | 2013-02-21 |
20130045616 | Plug Connector With Latch Guard and Removal Tools - A modular connector is provided having a connector plug, which may be inserted into an associated socket in a first longitudinal direction, a resilient leg, depending at a first end thereof from the connector plug, and having a depressible part, distal therefrom, depressible towards the connector plug, and a guard cover, configured to prevent access to the depressible part of the resilient leg in its direction of depression, but to permit access to the resilient leg in the longitudinal direction through an access aperture, the access aperture being aligned with the depressible part of the resilient leg on an axis parallel with the longitudinal direction, to allow depression of the resilient leg through the access aperture directly. A corresponding extraction tool and methods, loopback connector, blanking plug, blanking plate and patch panel are also provided. | 2013-02-21 |
20130045617 | CONTACT AND METHOD FOR MANUFACTURING METAL COMPONENT - A method for manufacturing a metal component includes the steps of forming a resist film on a surface of an electrode plate, making the resist film exposed to light by use of a photomask having a mask pattern, in at least part of a rim of which a fine concavity and convexity are drawn, developing the resist film, to form an opening for molding in the resist film, and epositing an electroforming material by electroforming inside the opening for molding, to mold the material. | 2013-02-21 |
20130045618 | LATCHING MECHANISM FOR A CONNECTOR - A connector ( | 2013-02-21 |
20130045619 | CARD EDGE CONNECTOR WITH IMPROVED BOARD-RETAINING MEMBER AND ASSEMBLY OF THE SAME - A card edge connector comprises an insulative housing defining an inserting slot along a longitudinal direction thereof and a key lying in the inserting slot; a plurality of contacts retained in the insulative housing, the contacts including retaining portions retained in the insulative housing, soldering portions extending from the retaining portions and contacting portions extending from the retaining portion and located at two sides of the inserting slot; a pair of locking members disposed at two opposite ends of the insulative housing in the longituderinal direction and perpendicularly to the insulating housing; and a pair of the board-retaining members retained on two opposite ends of the insulative housing or the locking members in the longitudinal direction, the board-retaining members comprising board-retaining portions bending inward and approaching to the soldering portions of two outermost contacts along the longitudinal direction of the insulating housing. | 2013-02-21 |
20130045620 | ELECTRICAL CONNECTOR WITH ELASTIC LOCKING MECHNISM AND ELECTRICAL CONNECTOR ASSEMBLY THEREOF - An electrical connector ( | 2013-02-21 |
20130045621 | INTERCONNECTION SYSTEMS - Interconnection systems are shown that include communication contacts, and a guide. Configurations are shown with a guide that locates a male portion with respect to a female portion and guides their engagement before any communication contacts are engaged. Configurations are also shown with a guide that includes one or more power contacts. | 2013-02-21 |
20130045622 | CONTACT REGION OF AN ELECTRICALLY CONDUCTIVE MEMBER - A contact region of an electrically conductive member includes a contact area, a shroud and at least one projection. The contact area is provided to electrically engage a mating connector. The shroud is positioned proximate the contact area and is dimensioned to cooperate with a portion of the mating connector to align the mating connector in the contact area. The at least one projection is provided proximate the contact area, such that the at least one projection cooperates with a mating connector to limit the rotation of the mating connector relative to the contact area. | 2013-02-21 |
20130045623 | LANDSCAPE LIGHTING SYSTEMS - A connector includes a cable tray configured to receive and retain a cable in a stable position and couple with a top cap configured to create an electrical connection with the cable as the top cap is manipulated in a predetermined manner while coupled with the cable tray. An upper surface of the cable tray is configured to receive the cable (e.g., while the cable is generally parallel with the longitudinal axis of the cable tray). The cable tray also includes a finger extending beyond the first end for some distance longitudinally. The finger includes a protrusion that protrudes to some extent in a transverse direction so that a cable-accommodating gap is defined between the protrusion and the first end. The protrusion is configured to bear against the cable and retain the cable in the stable position when the cable is inserted between the protrusion and the first end. | 2013-02-21 |
20130045624 | PRE-WIRED ELECTRICAL DEVICE - Disclosed embodiments describe pre-wired electrical devices for simplifying and expediting the wiring of structures. Much time and expense is devoted to wiring of structures during construction. Devices which can facilitate and speed-up this process are needed in the construction industry. Disclosed embodiments describe an apparatus designed to allow an electrician to install a pre-wired outlet and quickly connect it to an electrical power source during the early stages of construction. The apparatus then allows for a quick modification to complete the outlet for use, after the walls of the structure are complete. It accomplishes this by providing outlets with a pre-wired outlet within the housing, connected via relay wires to a connector housing that is adapted to quickly receive and secure transmission wires. Moreover, the apparatus comprises simplified connection port for accepting transmission wiring coupled to a pre-wired outlet. | 2013-02-21 |
20130045625 | FLEXIBLE ORGANIZATIONAL CONNECT - A flexible organizational connect is shown and described. In one embodiment, the device comprises a flexible receiver assembly for receiving an interchangeable test adapter for a mass interconnect device. Typically, the flexible receiver assembly includes an integral structural unit and an interchangeable connection assembly. In other embodiments, a mass interconnect device includes an interchangeable test adapter and a flexible receiver assembly. | 2013-02-21 |
20130045626 | POWER STRIP AND ELECTRICAL POWER MEASUREMENT SYSTEM - A power strip includes a casing including a plurality of plug insertion portions each having a first insertion port and a second insertion port into which first and second plug blades of a socket plug are to be respectively inserted, a magnetic core which is provided in each of the plurality of plug insertion portions and includes a first opening into which the first plug blade is to be inserted, a second opening into which the second plug blade is to be inserted, and a slit to communicate between the first plug blade and the second plug blade, and a magnetic sensor provided inside the slit. | 2013-02-21 |
20130045627 | COAXIAL CABLE CONTINUITY CONNECTOR - A coaxial cable continuity connector comprising a connector body, a post engageable with connector body, wherein the post includes a flange having a tapered surface, a nut, wherein the nut includes an internal lip having a tapered surface, wherein the tapered surface of the nut oppositely corresponds to the tapered surface of the post when the nut and post are operably axially located with respect to each other when the coaxial cable continuity connector is assembled, and a continuity member disposed between and contacting the tapered surface of the post and the tapered surface of the nut, so that the continuity member endures a moment resulting from the contact forces of the opposite tapered surfaces, when the continuity connector is assembled, is provided. | 2013-02-21 |
20130045628 | ELECTRIC PLUG - A plug including a shell and a mounting body disposed inside the shell. The mounting body is provided with a first movable contact spring and a second movable contact spring, a phase contact and a zero contact, and a button assembly. A transverse block disposed above the first movable contact spring and the second movable contact spring includes a phase terminal and a zero terminal. The button assembly includes an electric magnet disposed on the mounting body and a sliding part having a cavity. The cavity of the sliding part is provided with a reset spring. A hook is disposed in a lower part of the cavity. The transverse block is connected with a pull block. An upper part of the pull block is connected with the electric magnet. The center of the pull block includes a limiting hole for accommodating the hook. | 2013-02-21 |
20130045629 | USB CONNECTOR APPARATUS - An improved Universal Serial Bus (USB) connector apparatus is provided. In one embodiment, the USB connector apparatus comprises a top wall; a bottom wall having one or two openings; two side walls; an internal cavity with a rectangular cross section enclosed by the top wall, the bottom wall and the two side walls; a gasket disposed within the internal cavity; and a first connecting piece made of a conductive material and positioned at the one or more openings of the bottom wall and at least partially covering the one or more openings of the bottom wall, wherein the top wall, bottom wall, two side walls, internal cavity and gasket are configured to comply with a USB interface standard. The USB connector apparatus ensures that a bottom wall elastic sheet of the USB socket effectively contacts with the bottom wall of the USB connector, thereby providing higher grounding performance. Further, it improves on the conventional USB connector without much additional cost. | 2013-02-21 |
20130045630 | TOUCH PROOF END CAP FOR A LEADING END OF A CONDUCTING CONNECTOR - A touch proof connector is contemplated. The connector may be comprised of a conducting body with a non-conducting end cap. The touch-proof connector may be included within a charging receptacle of a vehicle to facilitate establishing electrical connection with a connector assembly of a plug-in charging system. The non-conducting end cap may be configured to facilitate insulating a tip of the touch-proof connector from human contact. | 2013-02-21 |
20130045631 | SOCKET CONNECTOR - Disclosed is a socket connector, which includes an insulative body, conductive terminals, and a protective shell. A recess is defined in the insulative body. A plurality of terminal slots is defined in and perforated through four side walls of the insulative body. Each conductive terminal has a welding portion and an elastic contacting portion, in which the welding portion horizontally extends outside the side wall, and the elastic contacting portion extends to the recess. The protective shell is disposed around the insulative body. The welding portion is electrically coupled to an external circuit board. The lens module is inserted into the recess, thereby significantly reduces the height that the socket connector protrudes from the circuit board for reducing the vertical space usage of the socket connector. | 2013-02-21 |
20130045632 | User-Friendly No-Metal Shell USB male Connector - This present invention is for a new user-friendly, thin, slim, no-metal shell USB male connector that is able to be inserted into a standard USB female receptacle in either orientation. | 2013-02-21 |
20130045633 | CONNECTOR AND VEHICLE INCLUDING CONNECTOR - A connector includes: a first connector terminal to which a first electric cable is to be connected; a second connector terminal to which a second electric cable is to be connected; a sidewall that surrounds the first connector terminal and the second connector terminal; a protection cover; and an interlock mechanism. The interlock mechanism includes an interlock connector and an interlock pin. The interlock connector is disposed between the first connector terminal and the second connector terminal, and the interlock pin is provided at the protection cover and is positioned such that the interlock pin is inserted into the interlock connector when the protection cover is attached to the sidewall. | 2013-02-21 |
20130045634 | CONNECTOR - A connector includes: a housing; and a connector module; the connector module including: a projection portion that projects outside from the housing; a substrate composed of a material with thermal conductivity; and a terminal that is fixed to a lower part of the substrate and contacts on an external substrate. | 2013-02-21 |
20130045635 | HIGH-SPEED INTERFACE CONNECTOR - A high-speed interface connector is used for connecting a cable or a memory card each having a differential transmission system signal pin arrangement including a pair of differential transmission signaling pins that are adjacent to each other and two stable potential pins provided on both sides of the pair of differential transmission signaling pins, the two stable potential pins having potentials different from each other. The connector includes: a first and a second contact terminals for differential transmission respectively connected to the pair of differential transmission signaling pins; and a third and a fourth contact terminals provided on both sides of the first and the second contact terminal, the third contact terminal adjacent to the first contact terminal being connected to one of the two stable potential pins, and the fourth contact terminal adjacent to the second contact terminal having a potential identical to that of the third contact terminal. | 2013-02-21 |
20130045636 | TERMINAL CONNECTED TO PRINTED CIRCUIT BOARD AND CONNECTOR INCLUDING THE SAME - A terminal connected to a printed circuit board by sandwiching the printed circuit board therebetween includes a first contact part making contact with an upper surface of the printed circuit board, and a second contact part making contact with a lower surface of the printed circuit board, the second contact part being in facing relation with the first contact part, the first contact part including a resilient contact piece making contact with the upper surface, and a support part for supporting the contact piece, the contact piece having a width smaller than a width of the support part, the second contact part having a width smaller than a width of the support part, the contact piece having a length greater than a length of the second contact part, the lengths being measured in a direction perpendicular to a plane defined by the printed circuit board. | 2013-02-21 |
20130045637 | Card Connector - A card connector includes a body, a first contact, and a second contact. The body includes an electrical card receiving groove with an upper sidewall and a lower sidewall. The upper sidewall includes a first contact slot, while the lower sidewall includes a second contact slot. The first contact is positioned in the first contact slot and includes a first securing portion secured to the body, a first elastic portion extending from the first securing portion, and a first contact portion positioned at an end of the first elastic portion. The second contact is positioned in the second contact slot and includes a second securing portion secured in the second contact slot, a second elastic portion extending from the second securing portion, and a second contact portion positioned at an end of the second elastic portion and extending away from the second securing portion and the second elastic portion. | 2013-02-21 |
20130045638 | CABLE CONNECTOR, RECEPTACLE CONNECTOR AND CONNECTOR ASSEMBLY THEREOF WITH IMPROVED CONTACT ARRANGEMENT - A connector assembly includes a cable connector and a receptacle connector. The receptacle connector includes a receptacle housing defining a receiving slot and a number of contacts including multiple first contacts and multiple second contacts. The second contacts include a number of differential signal contacts and ground contacts among which the differential signal contacts are paired and the ground contacts are located at opposite lateral sides of each paired differential signal contacts. The first contacts are ordinally arranged as GGVV, or VGVG, or VVGG, or GVGV, or GVVG, or VGGV, or VSSG, or GSSV. The second contacts are compatible to USB 3.0 protocol for high-speed signal transmission. As a result, it is easy to control the impedance of the whole transmission system so as to decrease signal attenuation and signal reflection. | 2013-02-21 |
20130045639 | ELECTRICAL CONNECTOR WITH SOLDER BALL POSITIONED IN AN INSULATIVE HOUSING ACCURATELY - An electrical connector includes an insulative housing having a top surface, a bottom surface opposite to the top surface and a number of receiving holes penetrated the top surface and the bottom surface, a number of terminals receiving in the receiving holes and a number of solder balls assembled to the receiving holes from a bottom surface thereof and contacting with the corresponding terminals. The receiving hole includes an inner wall and a core, the inner wall has a pair of ribs extending toward to the core and the movement of the solder ball in a vertical direction is limited by the pair of ribs in a vertical direction and the solder ball is positioned by the terminal. | 2013-02-21 |
20130045640 | MALE CONNECTOR AND A METHOD OF PRODUCING THE MALE CONNECTOR - The present invention relates to an elongated male connector ( | 2013-02-21 |
20130045641 | ELECTRIC CIGAR LIGHTER, UNIVERSAL POWER SOCKET AND ACCESSORY PLUG - An electrical socket for powering an electrical/electronic accessory device having an electrical plug that is received in the socket, comprising: an electrically conductive socket well for slidably receiving the electrical plug of the electrical/electronic device; an electrical connector portion disposed distally on the socket well and comprising an insulator fastened to the socket well at a distal end thereof and having at least two electrical terminals for connecting to a vehicle electrical power source; a plurality of first electrical contacts disposed at a distal end of said socket well and extending radially and proximally from the center of said well and being electrically connected to a first of said electrical terminals of said electrical connector portion; a second of said electrical terminals of said electrical connector portion being electrically connected to said socket well; and said plurality of first electrical contacts being adapted to electrically slidably engage with an inner periphery of a hollow cylindrical electrical contact of said electrical plug. | 2013-02-21 |
20130045642 | CONNECTOR WITH GROUNDING AND POWER CONTACTS - A connector comprises an insulative housing having a main body with an inserting cavity and a plurality of contacts received in the insulative housing. The contacts have two grounding contacts and two power contacts, each grounding contact is formed with a plurality of first contacting portion, and each power contact is formed with a plurality of second contacting portion. The first contacting portions of the first and the second grounding contacts are alternately disposed within the inserting cavity and located in a first row, the second contacting portions of the first and the second power contacts are alternately disposed within the inserting cavity and located in a second row, the first row is closer to a front opening of the inserting cavity than the second row. | 2013-02-21 |
20130045643 | MODULAR JACK CIRCUIT AND MODULAR JACK USING THE SAME - A modular jack circuit ( | 2013-02-21 |
20130045644 | CRIMPING TERMINAL, AND CRIMPING STRUCTURE OF CRIMPING TERMINAL AGAINST ELECTRIC WIRE - The upper surface panel | 2013-02-21 |
20130045645 | Electrical Connector Adapted To Receive Various Diameter Cable - An electrical connector includes a body having a crimpable tubular portion. A bore is formed in the tubular portion. A plurality of partially cylindrical jaw segments are disposable in the bore. The plurality of jaw segments form an opening for receiving a cable. A nose guide is disposable in the bore to facilitate retaining the plurality of jaw segments in the body. | 2013-02-21 |
20130045646 | BEARING APPARATUS FOR A POLE TERMINAL - The invention relates to a bearing apparatus for a pole terminal (b 2, 3) in a housing wall ( | 2013-02-21 |
20130045647 | CONTACTING ASSEMBLY FOR CONDUCTORS PRESENT ON FLAT STRUCTURES, IN PARTICULAR GLASS PANELS - The present invention relates to a contacting assembly for conductors that are present on flat structures, in particular glass panels, and have a contact point in the connection section. According to the invention, an end of a connecting cable or of another connecting means, for example, a connecting plug, is connected electrically and mechanically to a pad made of a conductive nonwoven fabric. The connecting cable thus assembled is introduced into a casting block which is open on one side and which has a frame that is provided with adhesive and encloses the nonwoven fabric. The surface of the conductive nonwoven fabric which is delimited laterally by the frame is matched to the area of the contact point, in order to produce, via an adhesive bond between the frame and the flat structure, a contacting connection created by surface pressing between the contact point and the nonwoven fabric surface, wherein the frame together with the casting body seals the contact point with respect to the surrounding area. | 2013-02-21 |
20130045648 | ELECTRIC OUTBOARD MOTOR - Provided is an electric outboard motor that includes a drive motor, which is an AC motor, as a drive source. The electric outboard motor includes: an outboard motor main body that includes the drive motor and an inverter that converters a direct current to an alternating current to supply the alternating current to the drive motor; a control/power supply unit that is formed separately from the outboard motor main body and that can supply the direct current to the inverter; and a connection cable that electrically connects the outboard motor main body and the control/power supply unit. The inverter and the drive motor are stacked and arranged in an axial direction of a rotation output axis of the drive motor. Part of the inverter falls within an outline of the drive motor in a view in the axial direction of the rotation output axis of the drive motor. | 2013-02-21 |
20130045649 | Amphibious Protection Apparatus - An amphibious protection apparatus including wall members, an occupancy space, and an access region is provided. Each of the wall members is foldably and detachably connected to the other wall members. Each of the wall members has an enclosed space that is inflatable by a fluid injected into the enclosed space. The inflation of each of the detachably connected wall members forms a buoyant enclosure of a predefined configuration, which bounces on land and floats on water. The occupancy space is defined by the detachably connected wall members and accommodates the users. The access region defined by opening one of the detachably connected wall members provides access to the occupancy space. The amphibious protection apparatus inflated to form the buoyant enclosure protects the users accommodated within the occupancy space from impacts from different directions on land and water and provides safety to the accommodated users on land and water. | 2013-02-21 |
20130045650 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I): | 2013-02-21 |
20130045651 | INTEGRATED, WASHABLE AND REUSABLE THREE-DIMENSIONAL (3D) MULTIFUNCTIONAL KNITTED FABRIC STRUCTURE AND METHOD TO PRODUCE THE SAME - This invention provides a three-dimensional (3D) multifunctional knitted fabric structure comprising two independent layers ( | 2013-02-21 |
20130045652 | METHOD FOR PRODUCING STORAGE-STABLE POLYURETHANE PREPREGS AND MOLDINGS PRODUCED THEREFROM - The invention relates to a method for producing storage-stable polyurethane prepregs and moldings produced therefrom and moldings produced therefrom (composite components), which can be obtained by a direct melt impregnation method of woven fabrics and laid scrim using reactive polyurethane compositions. | 2013-02-21 |
20130045653 | PROTECTIVE SUIT FABRIC AND SPUN YARN USED FOR THE SAME - A heat-resistant flame-retardant protective suit fabric of the present invention is formed of a uniform blended spun yarn including 25 to 75 mass % of polyetherimide fiber, 20 to 50 mass % of at least one fiber selected from wool and flame-retardant rayon, and 5 to 25 mass % of para-aramid fiber when the spun yarn is 100 mass %. The fabric experiences no heat shrinkage when exposed to a heat flux at 80 kW/m | 2013-02-21 |
20130045654 | FELTING DEVICE FOR FELTING FIBER MATERIALS - The present invention concerns a felting device for felting fiber materials including a needle receiving means for receiving and holding a felting needle for performing the felting operation, a drive motor for moving the needle receiving means for moving the inserted felting needle and a housing for movably holding and guiding the felting device with a hand. | 2013-02-21 |
20130045655 | White-Light Emitting Device And Preparation Method And Application Of The Same - A white-light emitting device and its preparation method are provided. The white-light emitting device comprises an ultraviolet (UV) light emitting diode (LED) chip, a first phosphor, and a second phosphor, wherein the UV LED chip generates a first radiation; the first phosphor is composed of Zn(C | 2013-02-21 |
20130045656 | INTERACTIVE TOY - An interactive toy train system including a track layout, a plurality of vehicles configured to travel along the track, and a plurality of destinations removeably coupled to the track. The vehicles are configured to communicate with one another and the vehicles are further configured to communicate with one or more of the destinations. The system includes an infrared toy network having a network protocol, which determines who is present and who is not present thereby allowing multiple vehicles and destinations to converse intelligently and without interference. | 2013-02-21 |
20130045657 | MULTIPLE REED GAME CALL - A game call having a plurality of reeds is provided for simulating the sound of a game animal. The call provides sounding board with first and second opposing faces and at least one reed associated with the first face and the second face. A user may selectively operate one or more of the reeds in order to simulate the call or sound of one or more animals. | 2013-02-21 |
20130045658 | Customizable Yo-Yo System - The customizable yo-yo system of the present invention makes available a plurality of yo-yos, e.g. two yo-yos or three or more yo-yos, which can easily be disassembled and reassembled to make a set of custom yo-yos. Each of the custom yo-yo has a unique set of performance characteristics selected by the user's preference and skill level. In addition, each of the yo-yos parts are color coded to indicate its associated skill level. | 2013-02-21 |
20130045659 | BOBBLE DOLL WITH MOVABLE LOWER BODY - A bobble doll device is formed and configured to include a base, a support stanchion, a stationary upper body portion and a movable lower body portion. The support stanchion extends outwardly from the base and supports the upper body portion to remain stationary. An elastic object (such as a spring) is attached to a bottom part of the upper body portion and to an top part of the lower body portion such that the lower body portion is movable in a reciprocating motion in relation to the upper body portion. In a further embodiment, a motion sensor detects motion of the lower body portion and triggers activation of a sound producing device that emits audio from a speaker in the base. In yet a further embodiment, the lower body portion may be caused to move by an actuator located in the base or an actuator in the upper body portion. | 2013-02-21 |
20130045660 | BALL COMPRISING A DISCONTINUOUS BALL SURFACE LAYER | 2013-02-21 |
20130045661 | Natural Support Garment - A natural support garment is provided. The natural support garment is comprised of an outer garment layer, a support housing, a support attachment, a connection support attachment, an internal support layer, and an internal support band. | 2013-02-21 |
20130045662 | SURFACE CLEANING SYSTEM AND METHOD - A surface cleaning system includes a retainer having a non-absorbing retaining surface and a surface cleaning compound retained at the retaining surface of the retainer and formed a cleaning surface overlapped thereat. The surface cleaning compound is a polymer having high density and high adhesive ability for removing imbedded contaminants from a working surface and grabbing the contaminants therefrom. The retainer is made of non-absorbing material that prevents lubricant and the surface cleaning compound being absorbed through the retainer. | 2013-02-21 |
20130045663 | METHOD AND APPARATUS FOR OPTICALLY MEASURING BY INTERFEROMETRY THE THICKNESS OF AN OBJECT - Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object ( | 2013-02-21 |
20130045664 | SANDBLASTING APPARATUS - A sandblasting apparatus comprises a sand tube for the input of sand particles, a fluid tube for the input of a fluid substance, the fluid tube and the sand tube cooperatively defining an acute angle; a mixing chamber communicating with the sand tube and the fluid tube, a major output tube communicating with the mixing chamber; and an auxiliary output tube including a first part and a second part. The first part communicates with the mixing chamber and the second part. The second part extends towards the major output tube, offset from the axial direction of the first part. The axis of the second part and the axis of the major output tube cooperatively define an acute angle. | 2013-02-21 |
20130045665 | SIMULTANEOUS GRINDING MACHINE - An apparatus for grinding an elongated workpiece having a plurality of outer surfaces of revolution all centered on a common workpiece axis has a frame and means such as a headstock and tailstock for rotating the workpiece about the workpiece axis. Two grinders on the frame diametrally flank the workpiece axis and are displaceable radially of the workpiece axis. They each have a respective set of axially spaced grinding wheels. Actuator means serves for displacing the grinders in respective diametrally opposite directions for engaging the grinding wheels with the surfaces of the rotating workpiece grinder. The axial spacing and dimensions of the wheels correspond to the axial spacing and dimensions of the surfaces such that all the surfaces of the workpiece can be ground simultaneously. | 2013-02-21 |
20130045666 | Grinding Machine - A grinding machine includes a pair of workpiece support devices ( | 2013-02-21 |
20130045667 | GEAR PROCESSING MACHINE - Provided is a gear processing machine which has a simple configuration, and is capable of processing a gear with high accuracy. For this purpose, a gear grinding machine wherein a tooth alignment operation is performed prior to grinding, is equipped with a workpiece processing rotation shaft ( | 2013-02-21 |
20130045668 | MULTI-SIDED SHAPED ABRASIVE SANDING AID - A hand tool comprising at least a single member having a top surface, a bottom surface, and opposing edges; and a fastener system disposed on the underside of the at least one member that is adapted to adhere an abrasive media, wherein the at least one member is bent at an angle upward from horizontal. | 2013-02-21 |
20130045669 | OMNIDIRECTIONAL VENT CAP - An omnidirectional vent cap for venting holding tanks is provided. By providing a 360 degree venturi channel, the present invention can use a small movement of air to reduce the air pressure above the exhaust port to draw out vapors or gasses. Since the device is symmetrical about the central axis the movement of air can be from any direction relative to the device. | 2013-02-21 |
20130045670 | AIR CONDITIONER FOR VEHICLE - The present invention relates to an air conditioner for a vehicle that includes: a mode door having a thin plate member, solidly operating inside an air-conditioning case to control the degree of opening of a defrost vent, a face vent and floor vents, and a gear shaft, engaged with the thin plate member for its operating; and constant discharging means disposed at a rail portion of the thin plate member and at a guide part of an air-conditioning case overlapped with the rail portion, so that air of a fixed quantity is discharged to side vents of the face vent, thereby providing a simple structure and reducing manufacturing costs because the gear holes of the rail portion and the cut portions of the guide portion serve as the constant discharging means, without a need for additional structure to constantly discharge air toward the side vent. | 2013-02-21 |
20130045671 | SYSTEM USING OUTDOOR AMBIENT AIR TO COOL WALK IN COOLERS AND OTHER AREAS - A system cools a desired region, such as a walk-in cooler, by taking cool ambient outdoor air and delivering that air into the desired region. The system uses an outdoor temperature sensor so that any time the outdoor temperature falls below a desired degree, the thermostat can turn on fans and open backdraft dampers to bring in cold air. This process by-passes existing coolers, compressors and the like of an existing system, saving the user the high cost associated with conventional walk-in coolers. | 2013-02-21 |
20130045672 | Media Radio with User Selectable Content - A media radio system with user selectable content is provided, comprising a data storage system for storing a plurality of content files, each of the content files being categorized based on select criteria, and wherein each content file contains content information associated with one of a plurality of interest areas; a processing device operatively coupled to the data storage system for processing requests for the content files and the content information; a user interface operatively coupled to the processing device for communicating the requests for the content files and the content information, and for communicating the content files and content information to a system user; an access control system operative with the processing device for enabling access to the stored content file by an authorized system user; and a system for enabling the system user to select predetermined content files for broadcasting over radio frequencies to subscribing customers. | 2013-02-21 |
20130045673 | Media Rating - A method and system for rating media. The media is one or a combination of audio, video and textual data. The media rating method comprises surveying at least a portion of media data received from a device and detecting generation of rating data, the rating data for appraising the media data. The method further comprises transmitting the rating data to the device. The system comprises a device-readable medium having programming instructions stored therein. The instructions when executed on a first device cause the first device to survey at least a portion of media data received from a second device, detect generation of rating data and transmit the rating data to the second device. | 2013-02-21 |
20130045674 | Relay Station, Mobile Station, Wireless Communication System, And Load Distribution Method - A relay station includes a load measuring unit configured to measure a load of the relay station; a load calculating unit configured to calculate, based on the load of the relay station and based on a load of an upstream base station or an upstream relay station directly connected to the relay station, a load reflecting a load of an upstream station; and a reporting unit configured to report the calculated load as load information to a mobile station or a downstream relay station. | 2013-02-21 |
20130045675 | APPARATUS AND METHOD FOR SELECTING SPOT BEAM BASED ON TRAFFIC DEMANDS AND CHANNEL CONDITIONS FOR MULTI-SPOT BEAM SATELLITE SYSTEM - Disclosed is an apparatus and method of selecting spot beams to be actually used based on a traffic demand and a signal attenuation of each spot beam, and activating the selected spot beams in a satellite communication system having multiple spot beams. | 2013-02-21 |
20130045676 | ELECTRONIC SYSTEM AND CONTROLLING METHOD THEREOF - An electronic system includes a first wireless transceiving module having a device identification code and a portable device. The portable device may include a second wireless transceiving module, and a processor. The second wireless transceiving module obtains the device identification code from the first wireless transceiving module. When the second wireless transceiving module obtains the device identification code from the first wireless transceiving module, the processor checks whether the device identification code matches to a pre-built identification code; and when the device identification code matches to the pre-built identification code, the portable device automatically determines a position of the portable device, and displays a map related to the position of the portable device in a display. | 2013-02-21 |
20130045677 | Telematics System and Related Mobile Device and Method - A method of interaction for a mobile device in a telematics system is disclosed. The method includes the steps of establishing connections with a plurality of vehicle head-units and processing a plurality of interaction streams with the plurality of vehicle head-units independently. | 2013-02-21 |
20130045678 | APPARATUS AND METHOD FOR DETERMINING GROUP OWNER IN ESTABLISHMENT OF WI-FI DIRECT CONNECTION - A method and a first device for determining a group owner during establishment of a local-wireless communication connection are provided. The method includes searching for a second device that supports the local-wireless communication connection; searching, if the second device is found, for services supportable by the second device; determining an intent value of the first device corresponding to a group owner authority with respect to a service to be connected among the found supportable services; transmitting, to the second device, a negotiation message including the determined intent value of the first device; receiving, from the second device, a negotiation message including an intent value of the second device; and determining, from among the first device and the second device, a device having the group owner authority by comparing the determined intent value of the first device with the intent value of the second device. | 2013-02-21 |