08th week of 2013 patent applcation highlights part 13 |
Patent application number | Title | Published |
20130043578 | PRESSPIN, POWER SEMICONDUCTER MODULE AND SEMICONDUCTER MODULE ASSEMBLY WITH MULTIPLE POWER SEMICONDUCTER MODULES - A first presspin includes a foot, whereby a base of the foot is provided for contacting a contact element of a power semiconductor device, such as within a power semiconductor module including a base plate and at least one power semiconductor device, which is arranged on the base plate and contacted by at least one further presspin. An insulation means is provided for electrically an outer surface of the foot. A power semiconductor module is also provided including a base plate, at least one power semiconductor device arranged on the base plate, and at least one of the aforementioned first presspin provided with the aforementioned insulation means. A power semiconductor module assembly is also provided including multiple power semiconductor modules as specified above, whereby the power semiconductor modules are arranged side by side to each other with electric connections between adjacent power semiconductor modules. | 2013-02-21 |
20130043579 | POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES - A power semiconductor arrangement includes a base plate having a molybdenum layer, and a power semiconductor device mounted to a top side of the base plate and electrically and thermally coupled thereto. The base plate includes a metallic mounting base, which is arranged between the semiconductor device and the molybdenum layer and prevents the molybdenum layer from forming highly resistive intermetallic phases with the semiconductor device. A semiconductor module, such as a power semiconductor module, includes multiple semiconductor arrangements, whereby the base plate of the semiconductor arrangements is a common base plate. A module assembly, such as a power semiconductor module assembly, includes multiple semiconductor modules, whereby the semiconductor modules are arranged side by side to each other with electric connections between adjacent semiconductor modules. | 2013-02-21 |
20130043580 | DIODE STRUCTURE - A diode structure includes a body, a first electrode, and a second electrode. The body has a longitudinal length and a transverse length. The first electrode has an end extending into the body along the longitudinal length, and has another end extending outwardly and horizontally from the body for a predetermined length. The second electrode lying on another side of the body to oppose the first electrode, has a tail extending into the body, and has another tail extending outward and horizontally from the body for the predetermined length. The predetermined length of the first electrode and the second electrode is no less than the longitudinal length of the body. Therefore, the diode structure features two electrodes with increased exposed surfaces and better heat dissipation. | 2013-02-21 |
20130043581 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring substrate, a first semiconductor chip mounted on the wiring substrate, and a second semiconductor chip mounted on the wiring substrate. The second semiconductor chip generates less heat than the first semiconductor chip. A heat dissipation plate is arranged on the wiring substrate and partially at a higher location than the first and second semiconductor chips. The heat dissipation plate is connected to the first semiconductor chip and includes an opening formed at a location corresponding to an upper surface of the second semiconductor chip. The upper surface of the second semiconductor chip is entirely exposed from the heat dissipation plate through the opening. | 2013-02-21 |
20130043582 | MULTIPLE DIE IN A FACE DOWN PACKAGE - A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements. | 2013-02-21 |
20130043583 | Dummy Flip Chip Bumps for Reducing Stress - A device includes a metal pad over a substrate. A passivation layer includes a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI comprises a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A dummy bump is over the polymer layer, wherein the dummy bump is electrically insulated from conductive features underlying the polymer layer. | 2013-02-21 |
20130043584 | SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES, PACKAGE STACK STRUCTURES, AND ELECTRONIC SYSTEMS HAVING FUNCTIONALLY ASYMMETRIC CONDUCTIVE ELEMENTS - A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit. | 2013-02-21 |
20130043585 | SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND ELECTRONIC APPARATUS - A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump. | 2013-02-21 |
20130043586 | METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER - A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips. | 2013-02-21 |
20130043587 | PACKAGE-ON-PACKAGE STRUCTURES - Embodiments of the present disclosure provide a package on package arrangement comprising a bottom package and a second package. The first package includes a substrate layer including (i) a top side and (ii) a bottom side that is opposite to the top side. Further, the top side defines a substantially flat surface. The first package also includes a die coupled to the bottom side of the substrate layer. The second package includes a plurality of rows of solder balls, and the second package is attached to the substantially flat surface of the substrate layer via the plurality of rows of solder balls. | 2013-02-21 |
20130043588 | SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUDING SUCH SEMICONDUCTOR DICE, AND INTERMEDIATE PRODUCTS MADE WHILE FORMING AT LEAST ONE BLIND HOLE IN A SUBSTRATE - Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. At least one blind hole extends from a back surface of the semiconductor die opposing the active surface, through a thickness of the semiconductor die, to an underside of the at least one bond pad. At least one quantity of passivation material covers at least a sidewall surface of the at least one blind hole. At least one conductive material is disposed in the at least one blind hole adjacent and in electrical communication with the at least one bond pad and adjacent the at least one quantity of passivation material. | 2013-02-21 |
20130043589 | Methods of Forming a Non-Planar Cap Layer Above Conductive Lines on a Semiconductor Device - Disclosed herein are various methods of forming methods of forming a non-planar cap layer above a conductive line on a semiconductor device, and to devices incorporating such a non-planar cap layer. In one illustrative example, the method includes forming a conductive structure in a layer of insulating material, recessing an upper surface of the conductive structure relative to an upper surface of the layer of insulating material such that the recessed upper surface of the conductive structure and the upper surface of the layer of insulating material are positioned in different planes and, after recessing the upper surface of the conductive structure, forming a first cap layer on the conductive structure and the layer of insulating material. In another example, the device includes a conductive structure positioned in a layer of insulating material and a first cap layer formed on the layer of insulating material and the conductive structure, wherein a first interface between the first cap layer and the layer of insulating material is located in a first plane and a second interface between the first cap layer and the conductive structure is located in a second plane that is different from the first plane. | 2013-02-21 |
20130043590 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING - The present application discloses a method of manufacturing a semiconductor structure. According to at least one embodiment, a first etch stop layer is formed over a conductive feature and a substrate, and the conductive feature is positioned over the substrate. A second etch stop layer is formed over the first etch stop layer. A first etch is performed to form an opening in the second etch stop layer, and the opening exposes a portion of the first etch stop layer. A second etch is performed to extend the opening downwardly by removing a portion of the exposed first etch stop layer, and the extended opening exposes a portion of the conductive feature. | 2013-02-21 |
20130043591 | TUNGSTEN METALLIZATION: STRUCTURE AND FABRICATION OF SAME - A local interconnect structure is provided in which a tungsten region, i.e., tungsten stud, that is formed within a middle-of-the-line (MOL) dielectric material is not damaged and/or contaminated during a multiple interconnect patterning process. This is achieved in the present disclosure by forming a self-aligned tungsten nitride passivation layer within a topmost surface and upper sidewalls portions of the tungsten region that extend above a MOL dielectric material which includes a first interconnect pattern formed therein. During the formation of the self-aligned tungsten nitride passivation layer, a nitrogen enriched dielectric surface also forms within exposed surface of the MOL dielectric material. A second interconnect pattern is then formed adjacent to, but not connect with, the first interconnect pattern. Because of the presence of the self-aligned tungsten nitride passivation layer on the tungsten region, no damaging and/or contamination of the tungsten region can occur. | 2013-02-21 |
20130043592 | Methods of Forming a Replacement Gate Comprised of Silicon and a Device Including Same - Disclosed herein are various methods of forming a replacement gate comprised of silicon and various semiconductor devices incorporation such a replacement gate structure. In one example, the method includes removing a sacrificial gate electrode structure to define a gate opening, forming a replacement gate structure in the gate opening, the replacement gate structure including at least one metal layer and a silicon-containing gate structure that is at least partially made of a metal silicide and forming a protective layer above at least a portion of the replacement gate structure. | 2013-02-21 |
20130043593 | Semiconductor Arrangement - A semiconductor arrangement includes a circuit carrier, a bonding wire and at least N half bridge circuits. N is an integer that amounts to at least 1. The circuit carrier includes a first metallization layer, a second metallization layer, an intermediate metallization layer arranged between the first metallization layer and the second metallization layer, a first insulation layer arranged between the intermediate metallization layer and the second metallization layer, and a second insulation layer arranged between the first metallization layer and the intermediate metallization layer. Each of the half bridge circuits includes a first circuit node, a second circuit node and a third circuit node, a controllable first semiconductor switch and a controllable second semiconductor switch. The controllable first semiconductor switch has a first main contact electrically connected to the first circuit node, a second main contact electrically connected to the third circuit node, and a gate contact for controlling an electric current between the first main contact and the second main contact. Accordingly, the controllable second semiconductor switch has a first main contact electrically connected to the second circuit node, a second main contact electrically connected to the third circuit node, and a gate contact for controlling an electric current between the first main contact and the second main contact. The first semiconductor switch and the second semiconductor switch of each of the half bridge circuits are arranged on that side of the first metallization layer facing away from the second insulation layer. The bonding wire is directly bonded to the intermediate metallization layer at a first bonding location. | 2013-02-21 |
20130043594 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - According to one embodiment, between the mounting substrate and the semiconductor chip, there is a joint support layer including a metal or its alloy selected from the group of Cu, Al, Ag, Ni, Cr, Zr and Ti and a melt layer laminated across the joint support layer, and formed of a metal selected from the group of Sn, Zn and In or of an alloy of at least two metals selected from the same metals. The process of joining the mounting substrate and the semiconductor chip includes intervening a joining layer which is formed, at least for its outermost layer, by the melt layer, maintaining the temperature to be higher than the melting point of the melt layer, then forming an alloy layer which has a higher melting point than the melt layer by liquid phase diffusion. | 2013-02-21 |
20130043595 | Semiconductor Package Containing Silicon-On-Insulator Die Mounted In Bump-On-Leadframe Manner To Provide Low Thermal Resistance - Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure. | 2013-02-21 |
20130043596 | SEMICONDUCTOR DEVICE - A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern. | 2013-02-21 |
20130043597 | Semiconductor Constructions and Methods of Forming Interconnects - Some embodiments include methods of forming interconnects. A first circuitry level may be formed, and a first dielectric region may be formed over such first level. A second level of circuitry may be formed over the first dielectric region. An interconnect may be formed to extend through such second level. A second dielectric region may be formed over the second level of circuitry, and a third level of circuitry may be formed over the second dielectric region. The third level of circuitry may be electrically connected to the first level of circuitry through the interconnect. Some embodiments include constructions having interconnects extending from a first level of circuitry, through an opening in a second level of circuitry, and to a third level of circuitry; with an individual interconnect including multiple separate electrically conductive posts. | 2013-02-21 |
20130043598 | BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION - Mechanisms of forming a bond pad structure are provided. The bond pad has a recess region, which is formed by an opening in the passivation layer underneath the bond pad. An upper passivation layer covers at least the recess region of the bond pad to reduce trapping of patterning and/or etching residues in the recess region. As a result, the likelihood of bond pad corrosion is reduced. | 2013-02-21 |
20130043599 | CHIP PACKAGE PROCESS AND CHIP PACKAGE STRUCTURE - Chip package processes and chip package structures are provided. The chip package structure includes a substrate, a chip, an insulating layer, a third patterned conductive layer and an electronic element. The substrate has a first patterned conductive layer. The chip is disposed on the substrate. A second patterned conductive layer of the chip is bonded to the first patterned conductive layer of the substrate. The chip has a first through hole. The insulating layer is disposed on the chip and filled into the first through hole. The insulating layer has a second through hole which passes through the first through hole. The third patterned conductive layer is disposed on the insulating layer and filled into the second through hole to electrically connect to the first patterned conductive layer. The electronic element is disposed on the third patterned conductive layer and electrically connects to the third patterned conductive layer. | 2013-02-21 |
20130043600 | BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEMICONDUCTOR STRUCTURES CARRIED BY A COMMON SUBSTRATE - Methods of forming semiconductor devices include providing a substrate including a layer of semiconductor material on a layer of electrically insulating material. A first metallization layer is formed over a first side of the layer of semiconductor material. Through wafer interconnects are foamed at least partially through the substrate. A second metallization layer is formed over a second side of the layer of semiconductor material opposite the first side thereof. An electrical pathway is provided that extends through the first metallization layer, the substrate, and the second metallization layer between a first processed semiconductor structure carried by the substrate on the first side of the layer of semiconductor material and a second processed semiconductor structure carried by the substrate on the first side of the layer of semiconductor material. Semiconductor structures are fabricated using such methods. | 2013-02-21 |
20130043601 | UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME - Disclosed is a memory card which includes a universal PCB including a first pad group and a second pad group, the first and second pad groups being connected to each other via one or more PCB wires, a first semiconductor chip electrically connected with at least one pad of the first pad group via a first bonding wire, and a second semiconductor chip electrically connected with at least one pad of the second pad groups via a second bonding wire, wherein the first bonding wire or the second bonding wire is changed according to a combination of the first and second semiconductor chips without a change in the PCB wires. | 2013-02-21 |
20130043602 | METHOD AND APPARATUS OF CORE TIMING PREDICTION OF CORE LOGIC IN THE CHIP-LEVEL IMPLEMENTATION PROCESS THROUGH AN OVER-CORE WINDOW ON A CHIP-LEVEL ROUTING LAYER - A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic. | 2013-02-21 |
20130043603 | METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE - The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material. | 2013-02-21 |
20130043604 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a first insulating layer provided in a first area and in a second area, a line-and-space-like second insulating layer formed on the first insulating layer provided in the first area, and a third insulating layer formed on the first insulating layer provided in the second area and which is substantially identical to the second insulating layer in height. | 2013-02-21 |
20130043605 | Natural evaporation humidifier - The present invention provides a natural evaporation humidifier which is space and energy efficient and maximizes humidification efficiency by enhancing diffusion of the moistened air. It is much easy and convenient for users to use, operate and carry the natural evaporation humidifier. The natural evaporation humidifier comprises a container, a plurality of inner support portions, a plurality of tunnels, a plurality of auxiliary support portions, a plurality of evaporation filters, and a plurality of support legs. The container, having a front and back wall, bottom, and side walls, forms an interior compartment and a water reservoir with the inner support portions. The inner support portions are shaped in curve, vertically attached to the bottom of the container, arranged in parallel along the length direction of the container to form a plurality of tunnels and evaporation filter housing areas. The inner support portions have a plurality of spacers inside each tunnel. Bulges are arranged at each end of both sides of the spacers. Evaporation filters are firmly fixed by the bulges and are in contact with water in the water reservoir of the container so that each evaporation filter becomes wetted through capillary action. Both the front and back walls of the container have a plurality of apertures on their upper region above the the maximum water level of the water reservoir to facilitate enhanced diffusion of the moisture air as it exits the humidifier. Aqueduct slots are arranged to the bottom of the container to facilitate the movement of water from one side to other side of the container. | 2013-02-21 |
20130043606 | Laser Sintering of Ceramic Fibers - A method and system for generating an optical fiber is provided. The method includes creating a green fiber consisting primarily of a ceramic material and sintering the green fiber with a laser by moving the green fiber through a beam of the laser to increase the density of the fiber after sintering. The system for creating a continuous optical fiber includes an extruder, a processing chamber and a laser. The extruder is configured to extrude a ceramic slurry as a green fiber. The processing chamber is configured to receive and process the green fiber. And, the laser is configured to direct a laser spot on the green fiber exiting the processing chamber to sinter the green fiber. | 2013-02-21 |
20130043607 | APPARATUS AND METHOD FOR CORRECTING WARPING OF LIGHT GUIDE PLATE - An apparatus for correcting any warping of a light guide plate includes a retaining device and a heating device. The retaining device includes a top pressing plate, a bottom supporting plate and an oil hydraulic cylinder on the top pressing plate. The oil hydraulic cylinder applies a pressing force on the top pressing plate, and the top pressing plate and the bottom supporting plate cooperatively sandwich and retain a light guide plate. The heating device has a coil of wire for surrounding the light guide plate. The coil of wire is configured for heating the light guide plate, the pressure and the heat thereby correcting the warp of the light guide plate. A method for correcting a warp of a light guide plate is also provided. | 2013-02-21 |
20130043608 | METHOD OF MANUFACTURING OPTICAL MEMBER - The purpose of the present invention is to make a change in the chromaticity of an optical member due to use unlikely to occur. A method of manufacturing a prism sheet | 2013-02-21 |
20130043609 | CONTACT LENS AND METHOD OF PRODUCING CONTACT LENS - A contact lens of novel structure that can be produced with enhanced production efficiency and that has an enhanced water retainability on the lens surface so as to realize a superior wear feeling. At least one of convex lens anterior surface and concave lens posterior surface is provided with treated face having a periodic structure of minute projections and depressions of a size producing no tactile and visual effects during wear. | 2013-02-21 |
20130043610 | METHOD OF MANUFACTURING GEL PARTICLES, AND DRIVE SIGNAL GENERATION DEVICE FOR LIQUID EJECTION HEAD - A method of manufacturing gel particles adapted to apply a voltage to a liquid ejection head to eject a liquid including a polymeric material toward an ejection target liquid to thereby manufacture the gel particles, includes: raising the voltage from a first voltage to a second voltage at a first gradient; raising the voltage from the second voltage to a third voltage at a second gradient steeper than the first gradient at which the voltage is raised from the first voltage to the second voltage, and then holding the voltage at the third voltage; dropping the voltage from the third voltage to a fourth voltage, and then holding the voltage at the fourth voltage; raising the voltage from the fourth voltage to a fifth voltage at a third gradient, wherein the third gradient is gentler than the second gradient. | 2013-02-21 |
20130043611 | Method For Encapsulating Substances With Formation Of The Capsule Shell By Interfacial Reaction In The Centrifugal Reactor - Provided are methods for encapsulating substances. In certain methods, the capsule walls are obtained by interfacial reaction, wherein the interfacial reaction is carried out in a centrifugal reactor with rotating packing. | 2013-02-21 |
20130043612 | METHODS AND APPARATUS FOR DETERMINING FORMULATION ORIENTATION OF MULTI-LAYERED PHARMACEUTICAL DOSAGE FORMS - Rapid and accurate determination of the formulation orientation of multi-layer capsule-shaped tablets with respect to different internal formulation layers proximate to the opposite narrow and rounded ends of the tablets is required. By including an appropriate color scheme in multi-layer osmotic tablets, detection of the formulation orientation is achieved by detecting the color at a spot location on a side of the tablet corresponding to one or another formulation layer or to one or another interface of two formulation layers depending on the formulation orientation of the tablet. | 2013-02-21 |
20130043613 | Method for Producing Polyolefin Microporous Membrane - A method for producing a polyolefin microporous membrane, comprising the following steps (A) to (D):
| 2013-02-21 |
20130043614 | METHOD FOR MANUFACTURING ENDLESS BELT - A method for manufacturing an endless belt includes coating a solution containing a polyimide precursor and conductive particles on the circumferential surface of a core to form a first coating film, drying the first coating film so that the residual amount of a solvent of the first coating film falls within a range of from about 10% to about 20% in respective portions, coating a solution containing a polyimide precursor and conductive particles on the dried first coating film to form a second coating film, drying the second coating film, heating the first dried coating film and the dried second coating film so that the polyimide precursors are imidized, and removing the first coating film and the second coating film heated in the heating of the first coating film and second coating film from a core. | 2013-02-21 |
20130043615 | INJECTION MOLDING FABRICATION METHOD - A method of forming a composite article by injecting at least two composite materials comprising metal carbides into a mold to form a green compact is disclosed. The composite materials may be metal powders comprising a binder metal, a hard particle. The composite material may further comprise a plastic binder. The two different composite materials are injected into the mold to form the green compact. Additionally, the composite materials may be injected through a die before entering the mold. In a specific embodiment, the die forms at least one internal channel within the green compact. | 2013-02-21 |
20130043616 | DEVICE AND METHOD FOR PRODUCING PELLETS - A device and a method for producing pellets from a melt, having a perforated plate with melt nozzles located therein from which nozzles the melt emerges. The perforated plate is located opposite a cutter arrangement with a cutter head with at least one blade, and a cutter shaft driven by a motor so that the at least one blade passes over the melt nozzles in the perforated plate in a rotating manner and in doing so severs pellets of the melt material emerging there. The cutter shaft is at least axially displaceable relative to a process chamber housing by means of at least one adjustable bearing. The position of the at least one blade can be determined and adjusted using a position sensing and adjusting device. | 2013-02-21 |
20130043617 | METHOD OF MANUFACTURING COMPRESSED WOOD PRODUCT - A method of manufacturing a three-dimensional wood product including a curved face includes: softening a blank formed of a bowl-shaped wood; compressing the blank, the compressing being deforming the softened blank into a bowl shape different from that before the softening, by applying a compressive force to the blank; fixing the shape of the deformed blank by applying the compressive force; drying the fixed blank; and heat-shaping the blank, the heat-shaping being shaping the dried blank into a shape similar to the shape of the blank while heating the blank in the ambient air. The blank after the drying and before the heat-shaping has an inner face of the bowl shape, the inner face having a shape closer to a final shape to be achieved after the heat-shaping than a shape of an outer face of the bowl shape, and a surface area of the outer face is larger than that of an outer face of the final shape. | 2013-02-21 |
20130043618 | PROCESS FOR MANUFACTURING GOLF BALLS HAVING MULTI-LAYERED COVERS - The invention is directed to a processes for manufacturing golf balls having multi-layered covers including a very thin outermost thermoplastic cover layer and a thermoset uniformly contoured inner cover layer having a uniform thickness. | 2013-02-21 |
20130043619 | Seal And Procedure For Its Production - A seal comprising a sealing ring ( | 2013-02-21 |
20130043620 | CYLINDRICAL CORE MEMBER AND METHOD OF MANUFACTURING TUBULAR MEMBER - A cylindrical core member for manufacturing a tubular member by curing a resin solution coated on an outer circumferential surface thereof, includes a substrate, a releasing layer that is formed on the outer circumferential surface including a central portion of the substrate in the axial direction, and plural low releasing portions having lower releasing properties than the releasing layer at both end portions of the substrate in the axial direction, the plural low releasing portions being intermittently disposed on the outer circumferential surface in the circumferential direction, and present in some places in the axial direction of the core member main body at the circumferential of the core member main body at both end portions of the substrate in the axial direction. | 2013-02-21 |
20130043621 | TONER CONTAINER AND IMAGE FORMING METHOD - The method to make the toner container provides a toner container exhibiting reduced environmental load and excellent strength together with moldability. The method is a blow molding method. The method employs a resin containing at least one of polyethylene and polypropylene formed from raw material prepared via a fermentation method. | 2013-02-21 |
20130043622 | APPARATUS FOR SHAPING PLASTICS MATERIAL PRE-FORMS INTO PLASTICS MATERIAL CONTAINERS WITH PRESSURE PADS - An apparatus for shaping plastics material pre-forms into plastics material containers with a blow mould which has at least two blow mould parts which are arranged so as to be movable with respect to each other on first and second blow mould carrier parts. A pressure pad arrangement is arranged between at least one blow mould carrier part and the blow mould part. The pressure pad arrangement is designed in such a way that the force acting between the blow mould carrier part and the blow mould part has a first force component which acts in a first pre-set region in the peripheral direction of the blow mould part and a second force component which acts in a second pre-set region in the peripheral direction of the blow mould part | 2013-02-21 |
20130043623 | Plain Bearing Having a Hard/Soft Pairing - The invention relates to a plain bearing for an underwater power plant, comprising at least one plain bearing segment for forming a first plain bearing shell; at least one running element of a second plain bearing shell, the running element forming the counter bearing surface to the plain bearing segment, the sliding surface of the running element having a higher hardness than the sliding surface of the plain bearing segment; a carrying element for the running element; characterized in that an intermediate layer having an adjustable plastic deformability is arranged between the running element and a carrying element. | 2013-02-21 |
20130043624 | GREEN COMPACT AND METHOD FOR PRODUCING ALUMINUM TITANATE SINTERED BODY - A green molded body comprises an organic binder and an inorganic compound source powder containing an aluminum source powder and a titanium source powder, wherein the organic binder is such that the viscosity at 20° C. of a 2 wt % aqueous solution of the organic binder is 5000 mPa·s or higher. A method for producing an aluminum titanate fired body includes the steps of molding a raw material mixture comprising an organic binder and an inorganic compound source powder containing an aluminum source powder and a titanium source powder to obtain a green molded body; heating the green molded body obtained at 150° C. to 900° C. to remove the organic binder; and firing the green molded body from which the organic binder has been removed, at 1300° C. or higher, wherein the organic binder is such that the viscosity at 20° C. of a 2 wt % aqueous solution of the organic binder is 5000 mPa·s or higher. | 2013-02-21 |
20130043625 | Stop Cap - A cap for mounting on a damper tube of a vibration damper, having an outer shell region that is cylindrical at least in sections and at least one elastic spring tongue. At least one positively locking element is arranged on the spring tongue in order to produce a positively locking connection between the cap and a protective element of the vibration damper. The at least one spring tongue has a region which, in the non-mounted state of the cap, is set back inwardly in the radial direction with respect to the outer shell region. The set- back region has a spreading element, by way of which the spring tongue is spread outwardly in the radial direction during the mounting of the cap. | 2013-02-21 |
20130043626 | LIQUID SEALED VIBRATION ISOLATING DEVICE - A partition member for partitioning a primary liquid chamber and a secondary liquid chamber is provided with a damping orifice passage and an elastic partition member. A stopper leg portion is integrally formed with and projects from a lower wall of an elastic diaphragm portion provided in a central region of the elastic partition member | 2013-02-21 |
20130043627 | Crash pad with pelletized and shredded form filling - This present invention addresses the need for more shock-absorbing crash pad. Most traditional crash pads use box-type stiffer, thinner, closed-cell foam sheet over, sometimes under, too, a squishier, thicker, open-cell solid foam base. However, traditionally, most inner form are solid box type and still too hard to soften the landings in case of a fall of climber because most impact goes to downward. This present invention uses forms which were shredded and chunked to ¼″ to ½″ varied pieces packed in enclosed baffles instead of box-type solid form, allowing air among forms and more shock-absorbing baffle effect to minimize the impact to falling climbers. When hit by a falling climber, the impacts are dispersed to both side-way and downward minimizing the impact to the falling climber. | 2013-02-21 |
20130043628 | CUSHIONING ELEMENTS COMPRISING BUCKLING WALLS AND METHODS OF FORMING SUCH CUSHIONING ELEMENTS - Cushioning elements having a top cushioning surface and a bottom base surface include an elastomeric cushion member and a stabilizing material. The elastomeric cushion member includes a first plurality of interconnected buckling walls having a first mean height and a second plurality of buckling walls having a second mean height. Each buckling wall of the second plurality intersects and connects to at least two buckling walls of the first plurality. A surface of the stabilizing material on a side thereof opposite the elastomeric cushion member defines the bottom base surface of the cushioning element. The first ends of the first plurality of interconnected buckling walls and the first ends of the second plurality of buckling walls define the top cushioning surface of the cushioning element. Methods of forming cushioning elements include securing a stabilizing material to ends of the first plurality of interconnected buckling walls. | 2013-02-21 |
20130043629 | Spring with adjustable spring constant - A spring comprising a spring itself and end seat plates and a mount. In the spring seat plates are mechanically connected (constantly, variably, or actuable to connect) to each other and to the mount, so when a force or moment is applied to one of those seat plates its movement induce the movement of other seat plate as well, changing the total movement of the spring. Furthermore, there are provided mechanical means (a cams, a gears, a levers etc.) for changing the linkage between the end seat plates and the mount, which result in increasing, remaining the same (constant spring) or decreasing the spring constant. So, the spring constant of the spring can be controlled as to be adjustable. | 2013-02-21 |
20130043630 | MAGNETIC WORKTABLE - A magnetic worktable includes a worktable body and a plurality of magnetic devices disposed at a worktable body. Positions of the magnetic devices at the worktable body are variable. The magnetic devices are electrically connected to each other via a circuit, such that the magnetic devices can generate a magnetic attraction force when magnetized. The total area of the magnetic devices accounts for a small portion of the worktable body area, allowing a user to change the arrangement and quantity of the magnetic devices by modularization and according to the shape and processing method of a workpiece. Therefore, any workpieces can be fixed to the magnetic devices by magnetic attraction. Accordingly, the magnetic worktable incurs a low manufacturing cost and advantageously features high practicability. | 2013-02-21 |
20130043631 | AUTOMATIC TRUSS JIG SETTING SYSTEM - A automatic truss jig setting system is disclosed that includes a table including a plurality of segments with a side edge of adjacent segments defining a slot. At least one pin assembly, and optionally a pair of pin assemblies, is movable independently of each other along the slot. Movement apparatus is provided for independently moving the pin assemblies along the slot. Each of the side edges of the segments associated with the slot defines a substantially vertical plane with a zone being defined between the substantially vertical planes of the side edges, and the movement apparatus is located substantially outside of the zone of the slot. The invention may optionally include a system for handling the obstruction of pin assembly movement, and a system for keeping track of the position of the pin assembly when the pin assembly has encountered an obstruction. | 2013-02-21 |
20130043632 | RAPID THERMAL PROCESSING CHAMBER WITH MICRO-POSITIONING SYSTEM - Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support. | 2013-02-21 |
20130043633 | CUTTING BOARD WITH MAGNETS - Embodiments are directed towards a kitchen cutting board that is configured to securely, but removably affix a knife to the cutting board when the knife is not being used. The cutting board may include several cutting surfaces, a shelf that has at least one wall that abuts at least one of the cutting surfaces. A plurality of magnets are disposed within at least one wall and arranged to magnetically affix a ferrous utensil, such as a knife blade, to the wall. | 2013-02-21 |
20130043634 | OBJECTING POSITIONING / FIXING DEVICE - An object positioning/fixing device is capable of generating a clamping force by clamp bolts capable of being fastened manually and realizes high operability of the clamp bolts. A simple clamp mechanism comprises the clamp bolts as major components. The object positioning/fixing device has a cooperative assembly of the positioning mechanism and the clamp bolts. | 2013-02-21 |
20130043635 | STAGE HEATER AND METHOD OF MANUFACTURING SHAFT - A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon. | 2013-02-21 |
20130043636 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - While a sheet on an intermediate processing tray is being processed, a plurality of sheets to be processed next are kept on standby by a standby portion arranged between the intermediate processing tray and a conveyance roller and a separation roller. When conveying the plurality of sheets that have been kept on standby in an overlapped state while successively shifting the sheets from each other in the sheet conveyance direction, the shift amount is successively reduced. | 2013-02-21 |
20130043637 | POST-PROCESSING DEVICE AND IMAGE FORMING APPARATUS - The post-processing device includes: a binding unit that forms a cut in a sheet stack and cuts a part of the sheet stack into a predetermined shape to form a tongue portion in the sheet stack, the tongue portion having a part where one end part of the tongue portion is not separated from the sheet stack, and binds the sheet stack by bending the tongue portion and inserting the other end part of the tongue portion into the cut; and a sheet stack transport unit that transports the sheet stack in an orientation such that the one end part of the tongue portion in the sheet stack bound by the binding unit is on a downstream side of the other end part of the tongue portion in the sheet stack transport direction. | 2013-02-21 |
20130043638 | Image Forming Device - An image forming device, comprising: a main body; an image formation unit; and a re-carrying path along which a sheet-like medium on which the image has been formed is carried again to the image formation unit. In this configuration, the re-carrying path comprises: a first path formed to extend downward; a bending part formed to bend from a lower end of the first path toward an upstream side of the image formation unit; and a second path formed to extend from the bending part toward the upstream side of the image formation unit. A pair of re-carrying rollers which carry the sheet-like medium are provided on the second path. A recessed part formed to be recessed downward with respect to a common tangential line of the pair of re-carrying rollers is provided on the second path between the bending part and the pair of re-carrying rollers. | 2013-02-21 |
20130043639 | PRINTING APPARATUS AND METHOD FOR CONVEYING SHEET - The present invention provide a printing apparatus and a method for conveying a sheet wherein generation of noise is minimized using a simple configuration, wherein, during sheet discharging, a sheet is discharged at a speed suitable for the sheet discharging, and wherein the sheet is aligned at a sheet discharging position. The printing apparatus controls conveyance of sheets as follows. A first sheet and a second sheet fed subsequently to the first sheet are conveyed at a relatively low conveying speed until an upstream trailing end of the first sheet is placed at a sheet discharging standby position. Then, the first sheet is discharged to the sheet discharging position, and the first sheet and the second sheet are conveyed at a relatively low conveying speed until a downstream leading end of the second sheet is placed at a sheet feeding control position. | 2013-02-21 |
20130043640 | CONVEYING APPARATUS AND RECORDING APPARATUS - A conveying apparatus has a sheet conveying path, a first pair of rollers, which is positioned in the conveying path and which has a drive roller and a pinch roller and conveys the sheet, a second pair of rollers, which is positioned downstream relative to the first pair of rollers in the conveying direction and conveys the sheet conveyed by the first pair of rollers, and a mechanism which reduces the force for sandwiching the sheet by the drive roller and the pinch roller of the first pair of rollers or which moves both away from each other. After the sheet is conveyed by the first pair of rollers while the leading edge of the sheet is being stopped by the second pair of rollers, the second pair of rollers starts conveying the sheet, and the mechanism is actuated thereafter. | 2013-02-21 |
20130043641 | CONVEYING APPARATUS - A conveying apparatus has first and second conveying roller pairs pair; a first conveying path through which a sheet is conveyed in such a manner that the first conveying roller pair is placed downstream of the second conveying roller pair; and a second conveying path through which the sheet is conveyed in such a manner that the first conveying roller pair is placed upstream of the second conveying roller path. |V | 2013-02-21 |
20130043642 | CONVEYING APPARATUS - When continuous-conveying control is executed in a conveying apparatus which can handle various sizes of sheet, a conveying apparatus which can efficiently detect a conveying error by a required minimum conveyed amount or conveying time according to a sheet size is provided. For that purpose, a maximum conveyed amount from start of sheet feeding of the subsequent page to determination to be a sheet-feeding error is set based on a detection result of a rear end portion on a previous page by a PE sensor. The maximum conveyed amount when the rear end portion of the previous page is detected is set smaller than the maximum conveyed amount when not detected. | 2013-02-21 |
20130043643 | SHEET FEEDING DEVICE AND RECORDING APPARATUS - There is disclosed a sheet feeding device which feeds a plurality of stacked sheet-like recording media one by one from a tray containing the recording media, including a sheet feeding roller which comes in contact with the uppermost layer of the recording media contained in the tray, and rotates to feed the recording medium; an inclined member including an inclined surface which is positioned on a downstream side in a feeding direction of the recording media, and inclined at an obtuse angle to the feeding direction of the recording media, and on which the fed recording media abuts; and a separating member having an uneven surface, to separate the one fed recording medium, wherein the separating member is configured to be movable between a position projecting to the inclined member and a position retreated from the projecting position, while maintaining the same inclining angle as that of the inclined member. | 2013-02-21 |
20130043644 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A movable side regulating plate is provided on a frame body. The movable side regulating plate regulates side edges in a width direction of sheets stacked on a sheet stacking plate, and is movable in the width direction. A sheet pressing portion configured to press the side edges of the sheets and press the sheets onto a stationary side regulating plate is provided on the movable side regulating plate. The sheet pressing portion has a relief shape for reducing a pressing force exerted on the sheets when an amount of the sheets stacked on the sheet stacking plate becomes equal to or smaller than a predetermined amount. The relief shape is formed so that a downstream edge in a sheet feeding direction of a lower surface is located higher than an upstream edge in the sheet feeding direction of an upper surface. | 2013-02-21 |
20130043645 | CONVEYING APPARATUS AND RECORDING APPARATUS - A conveying apparatus includes a sheet conveyance path including a curved portion, and a roller pair that is located along the conveyance path and conveys a sheet. At least one of rollers of the roller pair moves such that the orientation of conveying force exerted onto the sheet by the roller pair at its nip point is changed after the roller pair pinches the sheet. | 2013-02-21 |
20130043646 | CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A conveying apparatus includes a first pair of rollers having a drive roller and a pinch roller driven by the drive roller, a second pair of rollers provided downstream of the first pair of rollers, and an arm member supporting the drive roller and adapted to be swingable such that a force for pressing the drive roller against the pinch roller increases as a conveyance resistance of the sheet increases. The force for pressing the drive roller against the pinch roller decreases if driven by the moving sheet. The conveying speed of the second pair of rollers is set to be higher than the conveying speed of the drive roller so as to cause the drive roller to be driven by the sheet in the case where a skew of the sheet has been corrected and the sheet having the skew corrected is conveyed by the second pair of rollers. | 2013-02-21 |
20130043647 | IMAGE FORMING APPARATUS - An image forming apparatus includes an image forming unit to form an image on a sheet-shaped recording medium; a registration roller pair to convey the recording medium to the image forming unit; a sheet feed roller to convey the recording medium to the registration roller pair; and a controller to control driving of the registration roller pair and the sheet feed roller. In such an image forming apparatus, the controller starts driving of the sheet feed roller to feed the recording medium and stops driving of the sheet feed roller before the sheet feed roller has completed conveyance of the recording medium for a distance equal to a length of the settable minimum-sized recording medium in the conveyance direction. | 2013-02-21 |
20130043648 | CONVEYING APPARATUS AND RECORDING APPARATUS - A conveying apparatus including a conveying path with a curved path through which a sheet is passed, a main conveying roller provided downstream of the conveying path in a conveying direction of the sheet, the roller being rotated in a first direction to perform a conveying operation of conveying the sheet in the conveying direction and being rotated in a second direction opposite to the first direction to perform an skew correcting operation of forming a loop of the sheet, and an auxiliary guide member which supports the sheet using an inner side of a curvature of the conveying path and which is tilted toward the conveying direction side during the conveying operation when subjected to a force of the sheet which is stronger than during the skew correcting operation. | 2013-02-21 |
20130043649 | INPUT TRAY CAPABLE OF ALIGNING PAPER - A paper input tray includes a support plate for holding the sheets of paper, two latching members slidably connected to the support plate, a cover rotatably connected to the support plate, and a driving mechanism. Each latching member includes a latching plate. The cover is capable of being rotated open and rotated closed. When the cover is down in the closed position, the distance between the two latching plates is slightly less than that of the sheets. When the cover is rotated open, the two latching members are driven by the driving mechanism so as to increase the distance between the two latching plates. | 2013-02-21 |
20130043650 | SHEET COMPRESSION APPARATUS AND IMAGE FORMING APPARATUS - A sheet compression apparatus includes a pair of nipping members configured to be movable so as to contact and separate from each other and to compress a sheet while the sheet is nipped, and a contact/separation mechanism configured to perform a contact/separation operation of the pair of nipping members, and the contact/separation mechanism separates the nipping members from each other until a leading edge of the sheet fed by the sheet feeding unit passes between the nipping members, and then relatively moves the pair of nipping members closer to each other to start the nipping of the sheet so the sheet is compressed. | 2013-02-21 |
20130043651 | Method For Playing A Wagering Game - An instant lottery ticket game includes the steps of removing a first opaque covering surface to reveal a first set of indicia indicative of a plurality of player's hands of cards wherein each player's hand of cards has four cards, removing a second opaque covering surface to reveal a second set of indicia indicating a set of community cards wherein the set of community cards has three cards, removing a third opaque covering surface to reveal a third set of indicia indicative of a plurality of winning hands, removing a third opaque covering surface to reveal a fourth set of indicia indicative of a plurality of payouts wherein each payout corresponds to a one of the plurality of winning hands, and determining, for each player's hand of cards, if the combination of the player's hand of cards with one or more of the community cards yields a winning hand. | 2013-02-21 |
20130043652 | RACING GAME - A racing game and a method for playing the game. The method includes providing the racing game, generating the at least two random numbers, wherein an at least one player uses the at least two random number generators to generate the at least two random numbers, and advancing the at least one game piece representing the at least one player that corresponds to the at least two random numbers generated. One of the random number generators is used to determine lane choice for at least one player, along which the at least one game piece is advanced during game play. | 2013-02-21 |
20130043653 | GIDDY UP BOARD GAME - The invention provides an equestrian board and dice game in which the winner successfully navigates a horse around a race track and the winner is the first horse to reach the finish line. Appropriate for children and adults, the Giddy Up is created for two or more players, approximately ages six and older. Designed to be played on any flat surface, this game is comprised of a playing board, a pair of six-sided dice, and horse playing pieces | 2013-02-21 |
20130043654 | Building Base Plates Assembled to Build Blocks Set in Cube Dimensional Configurations - A set of overturn building block cube, including building block and flat for overturn, which is characterized in that: Said building block is consisted of two to eight cubes, including at least eight corners and twelve ridges; said ridges is designed with balls outside and every balls has the same diameter outside; said flat has the same distance with said hole, which is a dimple, and the distance between two holes equals to the side length of cube ball; thus balls of the building block can function with hole and makes building block stands on the flat after the ball is inserted into the hole; said building block can work with any two balls as rotate axis to rotate 90 degrees of front, back, right and left side on the flat; through many times of overturn, the building block can go from beginning place to the end and reach the effect of fun competition and brain exercise. | 2013-02-21 |
20130043655 | Bean bag basketball - A simulated game of Basketball that is played using an existing Basketball hoop, Basketball and specialized marked deck of cards comprising of multiple cards marked 1 2 3 4 5 6 7 8 and Wild Card. Also, the game incorporates eight bean bags numbered 1 2 3 4 5 6 7 and 8. The game is played using an existing Basketball hoop and Basketball. The scoring is determined by the points on the specialized deck of cards that corresponds to the bean bags the player shoots the ball from. The player with the highest score at the end of the game wins. | 2013-02-21 |
20130043656 | Pipe Joint Gasket and Method of Using Same - A gasket for preventing separation of interconnected pipes without damaging the pipes. The gasket includes a compressible body having a plurality of metal segments partially embedded therein. Each of the metal segments includes a row of exposed teeth configured for engaging a spigot end of a pipe and a trough configured for pivotably engaging a bead on a bell. The trough is further configured for shearing or deforming the bead and inhibiting over-pivoting of the segment about the bead when the pipes are partially withdrawn away from one another, for example, during over-pressurization of the pipes. | 2013-02-21 |
20130043657 | S-SEAL - An S-seal for sealing an annulus between and mandrel outer surface and a tube inner surface. In one embodiment, the S-seal includes a ring comprising a seal face, a gland face, opposing side faces. The gland face is opposite the seal face. The side faces extend between the seal face and the gland face. A spring is embedded in the ring at an intersection of each side face with the seal face. Each side face comprises a groove disposed between the spring and an intersection of the gland face and the side face. | 2013-02-21 |
20130043658 | BRUSH SEAL WITH BACKING PLATE TOOTH - A brush seal assembly is provided, including a sealing surface, a side plate, a backing plate, a plurality of bristles, and a biasing member. The backing plate is selectively located in a stationary position and has at least one backing tooth and a backing tip. The backing tooth has a tooth surface and the backing tip has a tip surface. A tooth clearance is measured between the tooth surface and the sealing surface. A tip clearance is measured between the tip surface and the sealing surface. The tooth clearance is less than the tip clearance. The bristles are located between the side plate and the backing plate. The bristles include an end portion for sealing to the sealing surface. The biasing member exerts a biasing force upon the backing plate in a direction towards the sealing surface. The backing tooth is configured for selectively contacting the sealing surface. | 2013-02-21 |
20130043659 | PISTON RING - Provided is a piston ring such that it is possible to sufficiently inhibit adhesive wear when the piston ring is mounted to a piston for a diesel engine in which at least the piston ring groove in the piston is formed from steel or cast iron. Disclosed is a piston ring mounted to a piston for a diesel engine, wherein the load length ratio (Rmr2) (in accordance with JIS B0601:2001) of the top surface and bottom surface of the piston ring satisfies each of the following conditions: Rmr2 (0.5%, 0.3[mu]m)=20% and Rmr2 (0.5%, 0.4[mu]m)=40%. | 2013-02-21 |
20130043660 | SEAL FOR SEALING A SEALING GAP AND METHOD FOR PRODUCING A SEAL OF THIS TYPE - In order to provide a seal for sealing a sealing gap between a first component and a second component, comprising a seal body with at least one sealing portion and at least one spring element for biasing the sealing portion against at least one of the components to be sealed, the spring element being at least partially arranged in a receiving space of the seal body, which seal is simply constructed and easily producible and nevertheless ensures a secure retention of the spring element in the receiving space, it is proposed that the spring element has at least one claw element, by means of which the spring element is interlocked with the seal body. | 2013-02-21 |
20130043661 | RECIPROCATING SEAL FOR HIGH PULSATING PRESSURE - Device, system, and method are described directed to seal assemblies with support to reduce seal extrusion under high to very high pressure changes due to repeated piston reciprocating movement. In some examples, concave features are incorporated on the inner and outer edges of support and backup ring elements to support and hug the preceding element and constrain extrusion, as well as utilizing multiple contact points on certain elements in order to reduce friction against the dynamic surface. The seal assemblies described herein can also incorporate bearing surfaces to reduce damage to seal ID due to off-axis floating rod, such as incorporating one or more multi-point contacts to reduce friction. | 2013-02-21 |
20130043662 | IMMOBILIZER FOR SHOPPING CARTS - To generally prevent people from being able to take out and move shopping carts from shopping cart parking areas at times when the store is not open, the blocking devices on the shopping carts are activated when the shopping carts are parked in shopping cart parking areas when the store is not open. | 2013-02-21 |
20130043663 | Dolly Transport Systems - A dolly transport system includes a dolly cart assembly having a dolly frame having at least one gripping handle, at least one lifting fork extending from the dolly frame to a distal end, and a handle grip structure located at the distal end of the lifting fork. The dolly cart assembly includes a first supporting location that includes the gripping handle and a second supporting location remote from the first supporting location that includes the handle grip structure. | 2013-02-21 |
20130043664 | CONVERTIBLE BEACH CART - The present invention relates to utility carts and hand trucks. More particularly, the present invention relates to easily assembled, low cost, durable convertible beach carts adaptable for a wide variety of uses including as beach furniture. A preferred embodiment of the invention includes a convertible hand truck with three main components: a hand truck body with dual use as a table, a load platform with dual use as an extended surface of the table, and a rack with dual use as support legs for the table. | 2013-02-21 |
20130043665 | TOOL-LESS PEDAL ASSEMBLY - A pedaled vehicle includes a frame, a wheel rotatably coupled to the frame, a crank assembly operatively coupled to the wheel and having a bore, a pedal received in the bore, and a spring clip for securing the pedal to the crank assembly. The spring clip includes at least one flexible tab or leg capable of flexing between a first configuration, where the spring clip allows a shaft of the pedal to pass through the bore, and a second configuration, where the pedal shaft is prevented from being removed from the bore. A method for coupling a pedal to a vehicle in a tool-less manner is also disclosed. | 2013-02-21 |
20130043666 | Orthopedic Mobility Device - An adult scale three-wheeled device facilitates movement for mobility challenged persons. The device is foot propelled while seated either through walking while seated or pedaling. The device is provided with a limited footprint for navigating confined areas while the individual is seated in a substantially standing position, with the pedals being repositionable so as to allow unobstructed walking while remaining seated. A lockable braking system prevents one or more wheels from turning. The device is collapsible for storage. | 2013-02-21 |
20130043667 | BICYCLE FRAME AND DRIVE LINK CASE THEREFORE - A bicycle frame includes a front section and a rear section. The front section includes a front frame portion having a front coupling configured to receive a front wheel support member and to allow rotation between the front coupling and the front wheel support member, the front frame portion defining a central vertical plane of the frame. The rear section includes a drive link case having an upper tube, a lower tube, a rear hub housing, and a front housing integrally arranged with each other to form a rigid drive link case having an opening disposed between the upper and lower tubes, the drive case being connected to the front frame portion via the front sprocket housing. The drive link case is disposed eccentric to the central vertical plane and is cantilevered rearward from the front housing. The front frame portion extends forward from the front housing. | 2013-02-21 |
20130043668 | MOTORCYCLE FOOTREST PEG REINFORCEMENT - A footrest peg reinforcement is designed for use on motorcycles. The reinforcement includes an expansion plug, a fastener, such as a threaded stud or a bolt, and a support plate added to a standard footrest peg assembly. In a preferred embodiment, the support plate is made from carbon fiber. | 2013-02-21 |
20130043669 | ADHESIVE CASUALTY AND TRIAGE CARD - A casualty and triage information collection form and record sheet of flexible plastic film including a writing surface and backed by a layer of an adhesive by which the record sheet can be attached to a patient's clothing or skin. The flexible plastic film is strong enough and elastic enough to serve as a wound dressing. The adhesive is protected before use by a release liner sheet. | 2013-02-21 |
20130043670 | SECURITY DEVICE - A security device includes a transparent, coloured element in a first region of the device and in a surface of which a first optically variable effect generating relief structure is formed. A reflection enhancing layer extends over the first optically variable effect generating relief microstructure and follows the contour of the relief, the reflection enhancing layer also being provided in a second region of the device laterally offset from the first region. | 2013-02-21 |
20130043671 | TERMINATION COLLAR FOR AIR DUCT - The apparatus disclosed herein serves as a termination point for a connection of metal pipe, plastic pipe, flexible pipe, or duct elbows to a diffuser through a wall, ceiling, or similar surface structure. The projection portion of the apparatus into which the diffuser is installed is substantially rigid, and thus generally prohibits deformation and damage as the apparatus and surrounding surface/structure is installed. For modification, break points and tear-away markers may be provided to aid in removal of portions for specific applications such as low internal clearance. | 2013-02-21 |
20130043672 | Fluidic Coupler Assembly With Conical Ferrule - A fluidic coupler assembly ( | 2013-02-21 |
20130043673 | CONNECTING ASSEMBLY AND METHODS FOR USING THE SAME - A thin-wall tube connecting assembly includes a connecting bar, and a tightening nut connected to the connecting bar through threads. The connecting bar is in a hollow tube-shape. One end of the connecting bar includes an expansion cone having an exterior diameter that is larger than that of other parts of the connecting bar. Another end of the connecting bar includes exterior threads. An elastic tube sits between the expansion cone of the connecting bar and a tightening nut. A rigid ring wraps around the exterior of the elastic tube, which shares a same axis with the tightening nut. A tube to be connected has an interior diameter that is equal to or larger than the exterior diameter of the expansion cone of the connecting bar. The rigid ring has an interior diameter that is equal to or larger than an exterior diameter of the tube to be connected. | 2013-02-21 |
20130043674 | PIPE CONNECTION OR HOSE CONNECTION - A pipe/hose connection includes a pipe/hose end attached exterior to a pipe socket, and a clamp securing the pipe/hose end on the pipe socket. The pipe/hose end has a radially inwardly protruding, circumferential first ring collar, and the pipe socket has an outwardly protruding circumferential second ring collar. The second circumferential ring collar extends along a first plane that is perpendicular to a longitudinal center axis of the pipe socket, whereas the first circumferential ring collar intersects at least at two locations with a second plane that is perpendicular to a longitudinal center axis of the pipe/hose end. The two ring collars are then not simultaneously in contact along their entire length when the first ring collar moves across the second ring collar when the pipe/hose end is attached on the pipe socket. The pipe/hose end can be secured on the pipe socket with a clamp. | 2013-02-21 |
20130043675 | PIPE-FITTING WITH ADAPTOR ASSEMBLY AND RELATED METHODS - A pipe-fitting adaptor assembly connectable to the coupling end of a pipe fitting is provided for reconfiguring existing pipe fittings with alternate pipe coupling ends. The fitting adaptor assembly has a tubular receptacle member configured to fit over and seal against an insert member of the fitting. A sliding retention ring carried along a ramped section of the fitting insert member interlocks with an opening formed in the sidewall of the receptacle member of the fitting adaptor assembly, such that decoupling forces tend to expand the locking ring further into the sidewall opening of the fitting adaptor assembly. The fitting adaptor assembly has a coupling end configured differently than the insert member for connection to otherwise incompatible alternative pipe sizes and/or pipe coupling configurations. | 2013-02-21 |
20130043676 | OVERMOLDED SEAL FOR BARBED TUBING CONNECTION - A barbed fitting tubing assembly utilizes a thermoplastic tube which is pressed onto a barbed thermoplastic fitting of a device, for example, such as a filter. A thermoplastic sleeve is molded over the tubing where it engages the barbed fitting as well as the end of the fitting where it connects to the device such that the overmolded sleeve engages in an over-mold groove in the fitting so that it is form-locked in position. The tubing, the barbed fitting and the overmolded thermoplastic sleeve are all made of a thermoplastic material and the overmolded thermoplastic sleeve is installed such that such that at least one of a cross-linked chemical bond or a physical mechanical interlocked connection is formed to provide a leak-proof connection. | 2013-02-21 |
20130043677 | TUBE AND PIPE END CARTRIDGE SEAL - Described is a sealing system for use at high pressure. End-face seals minimize the sealing radius and therefore allow various fittings—including known ferrule fittings—to be used in high-pressure systems. End-face seals at such high pressure may require smooth surfaces. In order to reduce cost, an end-face preparation tool forges a dimple into the end face to mechanically deform and smooth the surface. | 2013-02-21 |