| 07th week of 2011 patent applcation highlights part 7 |
| Patent application number | Title | Published |
|---|
| 20110037130 | METHOD AND STRUCTURE FOR SELF ALIGNED CONTACT FOR INTEGRATED CIRCUITS - A high voltage integrated circuit device includes a semiconductor substrate having a surface region with a contact region, which is coupled to a source/drain region. The device has a plasma enhanced oxide overlying the surface region, a stop layer overlying the plasma enhanced oxide, and a contact opening through a portion of the stop layer and through a portion of the plasma enhanced oxide layer. The contact opening exposes a portion of the contact region without damaging it. The device has a silicide layer overlying the contact region to form a silicided contact region and an interlayer dielectric overlying the silicided contact region to fill the contact opening and provide a thickness of material overlying the stop layer. An opening in the interlayer dielectric layer is formed through a portion of the thickness to expose a portion of the silicided contact region and expose a portion of the stop layer. | 2011-02-17 |
| 20110037131 | GATE STRUCTURE FOR FIELD EFFECT TRANSISTOR - A field effect transistor having a gate structure that comprises an interfacial layer positioned in between the transistor channel region and a high-K dielectric layer of the gate stack. The interfacial layer comprises Al | 2011-02-17 |
| 20110037132 | MEMS PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A method for fabricating MEMS package structure includes the following steps. Firstly, a substrate is provided. Next, a plurality of lower metallic layers and first oxide layers are formed to compose a MEMS structure and an interconnecting structure. Next, an upper metallic layer is formed on the MEMS structure and the interconnecting structure. The upper metallic layer has a first opening and a second opening. Next, the first opening and the second opening are employed as etching channels to remove a portion of the first oxide layers so as to form a first cavity surrounding the MEMS structure and form a second cavity above the interconnecting structure. The first cavity communicates with the second cavity. Next, the second opening is sealed in a vacuum environment. Next, a packaging element is formed on the upper metallic layer in a non-vacuum environment to seal the first opening. | 2011-02-17 |
| 20110037133 | Semiconductor Photodetector Structure and the Fabrication Method Thereof - A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant. | 2011-02-17 |
| 20110037134 | Solid-State Image Sensor Device - In a solid-state image sensor device, the efficiency of light collection to a light-receiving region of a photodiode PD through a microlens is enhanced by arranging a wiring line configuration. Each of the first metal layer and the second metal layer is arranged to have a ring-like portion formed along a profile of the light-receiving region of the photodiode PD in a fashion that an upper position over the photodiode PD is surrounded by the first and second metal layers and a third metal layer. | 2011-02-17 |
| 20110037135 | INTEGRATED CIRCUIT MANUFACTURING METHOD - A method of providing a dielectric material ( | 2011-02-17 |
| 20110037136 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM - An integrated circuit package system includes: an integrated circuit die including an image sensor system having interconnects connected thereto; and a transparent encapsulant on the integrated circuit die with portions of the interconnects exposed and with only the transparent encapsulant over the image sensor system to comprise an image sensor device. | 2011-02-17 |
| 20110037137 | BACK-SIDE ILLUMINATED IMAGE SENSOR PROTECTED AGAINST INFRARED RAYS - An image sensor including a first substrate having a first surface intended to be illuminated and a second surface on the side of which is formed a plurality of photodetection areas, said second surface being covered with a stack of interconnect levels including metal layers topped with insulating material, and of a second substrate placed on the insulating material of the last interconnect level, in which are formed vias in contact with connection elements of the interconnect levels, at least one of the interconnect levels including conductive shielding areas aligned with the photodetection areas. | 2011-02-17 |
| 20110037138 | Semiconductor Device having variable parameter selection based on temperature and test method - A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, or a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined. | 2011-02-17 |
| 20110037139 | SCHOTTKY BARRIER DIODE (SBD) AND ITS OFF-SHOOT MERGED PN/SCHOTTKY DIODE OR JUNCTION BARRIER SCHOTTKY (JBS) DIODE - A merged PN/Schottky diode is provided having a substrate of a first conductivity type and a grid of doped wells of the second conductivity type embedded in the substrate. A Schottky barrier metal layer makes a Schottky barrier contact with the surface of the substrate above the grid. Selected embedded wells in the grid may make electrical contact to the Schottky bather metal layer, while most embedded wells do not. The diode forward voltage drop is reduced for the same diode area with reverse blocking benefits similar to a conventional JBS structure. | 2011-02-17 |
| 20110037140 | INTEGRATED CIRCUIT SYSTEM WITH SEALRING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture an integrated circuit system includes: forming an insulation region in a base layer; filling an insulator in the insulation region around a perimeter of a main chip region; forming a contact directly on and within planar extents of the insulator; and forming an upper layer over the contact to protect the main chip region. | 2011-02-17 |
| 20110037141 | Semiconductor Device and Method of Fabricating the Same - A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region. | 2011-02-17 |
| 20110037142 | SOI WAFER AND METHOD FOR FORMING THE SAME - An SOI wafer and a method for forming the same, where the method for forming an SOI wafer includes: preparing a monocrystalline silicon wafer on which a mask layer is formed; etching the mask layer and the monocrystalline silicon wafer to form several trenches; forming a first insulating layer on the sidewalls and the bottoms of the trenches; etching and removing the first insulating layer on the bottoms of the trenches; etching along the trenches the monocrystalline silicon wafer beneath the trenches to form cavities; processing the inner walls of the cavities to form a second insulating layer; and filling up the trenches and the cavities with an insulating material layer. The process of the invention is easy to be implemented at a low manufacturing cost and an SOI wafer being formed is of high quality while being capable of being compatible with a standard process of manufacturing a bulk silicon CMOS. | 2011-02-17 |
| 20110037143 | Semiconductor Device Using An Aluminum Interconnect To Form Through-Silicon Vias - An aluminum lateral interconnect of a Back End of the Line (BEOL) is used to define the x and y dimensions of a through-silicon via in a semiconductor chip formed in a silicon substrate. The TSV includes one or more aluminum annulus formed on a surface of the substrate, and a deep trench in the substrate having a diameter that is determined by the diameter of the aluminum annulus. The annulus can also be provided with a conductive strap upon which a capacitor can be formed. The strap can also be used to provide a connection of the TV to other BEOL interconnects. | 2011-02-17 |
| 20110037144 | Method for fabricating a decoupling composite capacitor in a wafer and related structure - According to an exemplary embodiment, a method for fabricating a decoupling composite capacitor in a wafer that includes a dielectric region overlying a substrate includes forming a through-wafer via in the dielectric region and the substrate. The through-wafer via includes a through-wafer via insulator covering a sidewall and a bottom of a through-wafer via opening and a through-wafer via conductor covering the through-wafer via insulator. The method further includes thinning the substrate, forming a substrate backside insulator, forming an opening in the substrate backside insulator to expose the through-wafer via conductor, and forming a backside conductor on the through-wafer via conductor, such that the substrate backside conductor extends over the substrate backside insulator, thereby forming the decoupling composite capacitor. The substrate forms a first decoupling composite capacitor electrode and the through-wafer via conductor and substrate backside conductor form a second decoupling composite capacitor electrode. | 2011-02-17 |
| 20110037145 | WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND METHOD OF FABRICATING THE SAME - Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided. | 2011-02-17 |
| 20110037146 | Capacitors and Methods of Manufacture Thereof - Capacitors are formed in metallization layers of semiconductor device in regions where functional conductive features are not formed, more efficiently using real estate of integrated circuits. The capacitors may be stacked and connected in parallel to provide increased capacitance, or arranged in arrays. The plates of the capacitors are substantially the same dimensions as conductive features, such as conductive lines or vias, or are substantially the same dimensions as fill structures of the semiconductor device. | 2011-02-17 |
| 20110037147 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An improved manufacturing method of a semiconductor device is provided. The method includes preparing a semiconductor substrate having an integrated circuit together with connection pads. The method also includes forming a dielectric film on the semiconductor substrate. The method also includes forming connection wires having a predetermined pattern on the dielectric film such that the connection wires are electrically connected to the connection pads. The method also includes forming a surface resin layer to partially cover the connection wire. The method also includes forming a metal film over the exposed connection wires. The method also includes forming a display unit having through holes to present identification information in a region corresponding to the center area of the semiconductor substrate on the surface resin layer. The forming of the metal film and the forming of display unit are carried out simultaneously. | 2011-02-17 |
| 20110037148 | PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE - An integrated circuit apparatus is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires. | 2011-02-17 |
| 20110037149 | METHOD OF CUTTING A WAFER-LIKE OBJECT AND SEMICONDUCTOR CHIP - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 2011-02-17 |
| 20110037150 | SUBSTRATE COMPRISING DIFFERENT TYPES OF SURFACES AND METHOD FOR OBTAINING SUCH SUBSTRATES - A support having a larger density of crystalline defects, an insulating layer disposed on a first region of a front face of the support, and a superficial layer disposed on the insulating layer. An additional layer can be disposed at least on a second region of the front face of the support has a thickness sufficient to bury crystalline defects of the support. A substrate can also include an epitaxial layer arranged at least over the first region of the front face of the support, between the support and the insulation layer. Also, a method of making the substrate by forming a masking layer on the first region of the superficial layer and removing the superficial layer and the insulating layer in the second region uncovered by the masking layer. The additional layer is formed in the second region and then planarized. | 2011-02-17 |
| 20110037151 | Multiple Substrate Electrical Circuit Device - In one embodiment of the disclosure, a method includes providing a carrier substrate, forming a first region over an upper surface of the substrate, creating an electrical component using a planar process, embedding the electrical component in the dielectric layer, and removing a substrate portion of the electrical component. The first region includes a dielectric layer and may be made of any material that electrically isolates the electrical component from the carrier substrate. The electrical component may be created using a planar process thereby having an epitaxial surface that is embedded in the dielectric layer. | 2011-02-17 |
| 20110037152 | DROP-MOLD CONFORMABLE MATERIAL AS AN ENCAPSULATION FOR AN INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect. | 2011-02-17 |
| 20110037153 | HIGH BOND LINE THICKNESS FOR SEMICONDUCTOR DEVICES - Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described. | 2011-02-17 |
| 20110037154 | Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier - An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each having a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure. | 2011-02-17 |
| 20110037155 | Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage - A semiconductor device has a temporary carrier with a designated area for a first semiconductor die. A dam material is deposited on the carrier around the designated area for a first semiconductor die. The first semiconductor die is mounted to the designated area on the carrier. An encapsulant is deposited over the first semiconductor die and carrier. The dam material is selected to have a CTE that is equal to or less than the CTE of the encapsulant. The carrier is removed to expose the encapsulant and first semiconductor die. A first interconnect structure is formed over the encapsulant. An EMI shielding layer can be formed over the first semiconductor die. A second interconnect structure is formed over a back surface of the first semiconductor die. A conductive pillar is formed between the first and second interconnect structures. A second semiconductor die is mounted to the second interconnect structure. | 2011-02-17 |
| 20110037156 | Variable Feature Interface That Induces A Balanced Stress To Prevent Thin Die Warpage - A packaged semiconductor product includes a packaging substrate coupled to a semiconductor die through an interconnect structure with elements of variable features. The interconnect structure may be bumps or pillars. The variable features of the interconnect structure induce a reverse bend on the semiconductor die that mitigates warpage of the semiconductor die during semiconductor assembly by balancing bending of the packaging substrate during reflow. The variable features can be variable height and/or variable composition. | 2011-02-17 |
| 20110037157 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a component over a side of the substrate; forming an interface module having a module via in any location for connectivity to the substrate; and mounting the entirety of the interface module over a portion of the side of the substrate next to the component. | 2011-02-17 |
| 20110037158 | BALL-GRID-ARRAY PACKAGE, ELECTRONIC SYSTEM AND METHOD OF MANUFACTURE - A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups. | 2011-02-17 |
| 20110037159 | Electrically Interconnected Stacked Die Assemblies - In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected. | 2011-02-17 |
| 20110037160 | MICROELECTRONIC DEVICE AND FABRICATING METHOD THEREOF AND MEMS PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF - A fabricating method of a microelectronic device including the following steps is provided. First, a substrate is provided. Second, a semi-conductor element is formed in a CMOS circuit region of the substrate. Next, a plurality of metallic layer, a plurality of contact plugs and a plurality of oxide layer are formed on the substrate. The metallic layers and the oxide layers are interlaced with each other and the contact plugs are formed in the oxide layers and connected with the metallic layers correspondingly so as to form a micro electromechanical system (MEMS) structure within a MEMS region and an interconnecting structure within the CMOS circuit region. Then, a first protective layer is formed on at least one of the oxide layers and a second protective layer is formed on the interconnecting structure. Predetermined portions of the oxide layers located within the MEMS region are removed and thereby the MEMS structure is partially suspended above the substrate. The present invention also provides a microelectronic device, a MEMS package structure and a fabricating method thereof | 2011-02-17 |
| 20110037161 | ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE - A back of a dielectric transparent handle substrate is coated with a blanket conductive film or a mesh of conductive wires. A semiconductor substrate is attached to the transparent handle substrate employing an adhesive layer. The semiconductor substrate is thinned in the bonded structure to form a stack of the transparent handle substrate and the semiconductor interposer. The thinned bonded structure may be loaded into a processing chamber and electrostatically chucked employing the blanket conductive film or the mesh of conductive wires. The semiconductor interposer may be bonded to a semiconductor chip or a packaging substrate employing C4 bonding or intermetallic alloy bonding. Illumination of ultraviolet radiation to the adhesive layer is enabled, for example, by removal of the blanket conductive film or through the mesh so that the transparent handle substrate may be detached. The semiconductor interposer may then be bonded to a packaging substrate or a semiconductor chip. | 2011-02-17 |
| 20110037162 | HERMETIC PACKAGING AND METHOD OF FORMING THE SAME - The invention relates to a hermetically sealed semiconductor module and more particularly to repacking a non-hermetically sealed semiconductor module thereby forming a hermetically sealed semiconductor module. | 2011-02-17 |
| 20110037163 | DEVICE INCLUDING A RING-SHAPED METAL STRUCTURE AND METHOD - A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external contact pads attaches to the second main surface of the encapsulation body, and at least one external contact pad of the array of external contact pads electrically couples to the ring-shaped metal structure. | 2011-02-17 |
| 20110037164 | THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING PASSIVE DEVICE APPLIED TO THE THREE-DIMENSIONAL PACKAGE MODULE - Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer. | 2011-02-17 |
| 20110037165 | Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die - A semiconductor device is made by forming a heat spreader over a temporary carrier. A semiconductor die is mounted to the heat spreader. A first polymer layer is formed over the semiconductor die and heat spreader. A first conductive layer is formed over the first polymer layer. The first conductive layer is connected to the heat spreader and contact pads on the semiconductor die. A second polymer layer is formed over the first conductive layer. A second conductive layer is formed over the second polymer layer. The second conductive layer is electrically connected to the first conductive layer. Bumps are formed through a solder masking layer on the second conductive layer. The temporary carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first and second conductive layers. | 2011-02-17 |
| 20110037166 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The object of the present invention is to efficiently dissipate heat from the upper and lower main surfaces of a semiconductor device carrying a semiconductor element. A semiconductor device ( | 2011-02-17 |
| 20110037167 | METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING - A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the circuit chip in thermal contact with the chip; a metal lid having (i) a third CTE that is different from the first CTE and (ii) a bottom edge region, where the metal lid is disposed on the metal foil in thermal contact with the metal foil; and an adhesive layer along the bottom edge of the metal lid, cured at a first temperature, bonding the lid to the substrate, producing an assembly which, at a second temperature, is transformed to a bent circuit chip package. | 2011-02-17 |
| 20110037168 | Semiconductor Device and Method of Providing a Thermal Dissipation Path Through RDL and Conductive Via - A semiconductor device has a conductive via formed around a perimeter of the semiconductor die. First and second conductive layers are formed on opposite sides of the semiconductor die and thermally connected to the conductive via. An insulating layer is formed over the semiconductor die. Openings in the insulating layer expose the first conductive layer and a thermal dissipation region of semiconductor die. A thermal via is formed through the insulating layer to the first conductive layer. A thermally conductive layer is formed over the thermal dissipation region and thermal via. A thermal conduction path is formed from the thermal dissipation region through the thermally conductive layer, thermal via, first conductive layer, conductive via, and second conductive layer. The thermal conduction path terminates in an external thermal ground point. The thermally conductive layer provides shielding for electromagnetic interference. | 2011-02-17 |
| 20110037169 | Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structures - A semiconductor device has dual-molded semiconductor die mounted to opposite sides of a build-up interconnect structure. A first semiconductor die is mounted to a temporary carrier. A first encapsulant is deposited over the first semiconductor die and temporary carrier. The temporary carrier is removed. A first interconnect structure is formed over a first surface of the first encapsulant and first semiconductor die. The first interconnect structure is electrically connected to first contact pads of the first semiconductor die. A plurality of conductive pillars is formed over the first interconnect structure. A second semiconductor die is mounted between the conductive pillars to the first interconnect structure. A second encapsulant is deposited over the second semiconductor die. A second interconnect structure is formed over the second encapsulant. The second interconnect structure is electrically connected to the conductive pillars and first and second semiconductor die. | 2011-02-17 |
| 20110037170 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - Reduction of the size of and enhancement of the reliability, mounting strength, and mounting reliability of a semiconductor module are achieved. The semiconductor module includes: a wiring substrate; an electronic component placed over the upper surface of the wiring substrate; an electronic component placed over the under surface of the wiring substrate; a lead placed over the under surface of the wiring substrate; and encapsulation resin covering the under surface of the wiring substrate including the electronic component and the lead. The lead includes: a first portion coupled to an electrode pad via a joining material; a second portion bent from the first portion; and a third portion bent from the second portion. The third portion is positioned closer to the peripheral edge portion side of the under surface of the wiring substrate than the first portion. At the same time, the third portion is arranged at a position farther from the under surface of the wiring substrate than the first portion. The third portion of the lead is exposed from the main surface and side surface of the encapsulation resin and functions as a terminal for external coupling. | 2011-02-17 |
| 20110037171 | Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods - An electronic device may include a substrate, a seed layer on the substrate, a barrier layer on the seed layer opposite the substrate, and an oxidation barrier on the barrier layer opposite the seed layer. The barrier layer and the seed layer comprise different materials, and the oxidation barrier and the barrier layer may comprise different materials. The seed layer may be undercut relative to the barrier layer and/or relative to the oxidation barrier so that the barrier layer and/or the oxidation barrier define a lip extending beyond the seed layer in a direction parallel with respect to a surface of the substrate. Related methods are also discussed. | 2011-02-17 |
| 20110037172 | Ultra Thin Bumped Wafer With Under-Film - A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer. | 2011-02-17 |
| 20110037173 | SEMICONDUCTOR DEVICE - Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex. | 2011-02-17 |
| 20110037174 | METHOD OF MANUFACTURING SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT - A method of manufacturing a semiconductor component of the present invention has: obtaining a semiconductor wafer having stud electrodes formed on a functional surface thereof, and a circuit board having solder bumps on one surface and having electrode pads on the other surface thereof; bonding the semiconductor wafer and the circuit board, while providing a resin layer having a flux activity between the semiconductor wafer and the circuit board, and so as to bring the stud electrodes into contact with the solder bumps, while penetrating the resin layer having a flux activity, to thereby obtain a bonded structure; applying a solder material onto the electrode pads of the bonded structure; and dicing the bonded structure to obtain a plurality of semiconductor components. | 2011-02-17 |
| 20110037175 | INTERCONNECTION BETWEEN SUBLITHOGRAPHIC-PITCHED STRUCTURES AND LITHOGRAPHIC-PITCHED STRUCTURES - An interconnection between a sublithographic-pitched structure and a lithographic pitched structure is formed. A plurality of conductive lines having a sublithographic pitch may be lithographically patterned and cut along a line at an angle less than 45 degrees from the lengthwise direction of the plurality of conductive lines. Alternately, a copolymer mixed with homopolymer may be placed into a recessed area and self-aligned to form a plurality of conductive lines having a sublithographic pitch in the constant width region and a lithographic dimension between adjacent lines at a trapezoidal region. Yet alternately, a first plurality of conductive lines with the sublithographic pitch and a second plurality of conductive lines with the lithographic pitch may be formed at the same level or at different. | 2011-02-17 |
| 20110037176 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE MODULE, SEMICONDUCTOR DEVICE CONNECTING DEVICE, SEMICONDUCTOR DEVICE MODULE MANUFACTURING DEVICE, SEMICONDUCTOR DEVICE MODULE - A method of forming a semiconductor device module including a number of n semiconductor devices is provided, n being an integer ≧2, the method including: providing a substrate coated with a first contact layer, having a semiconductor layer formed on the first contact layer, and having a second contact layer formed on the semiconductor layer; and forming a connection of the first contact layer and the second contact layer by forming a number of n-1 conductive paths in a material of the semiconductor layer for connecting the n semiconductor devices. | 2011-02-17 |
| 20110037177 | DEVICE UNDER BONDING PAD USING SINGLE METALLIZATION - An integrated circuit device comprising an improved bonding pad structure. The device has a semiconductor substrate. A plurality of active MOS devices are formed on the semiconductor substrate. The device has an interlayer dielectric layer overlying the plurality of active MOS devices and at least one single metal bonding pad formed on the interlayer dielectric layer and directly over at least one of the active devices. At least four edge regions are formed on a square shape of the at least one single metal bonding pad. An angled cut region is formed on each of the four edge regions. Preferably, the angled cut region is within a periphery of the square shape of the at least one single metal bonding pad. A passivation layer having an opening is formed over the at least single metal bonding pad. The device has a buffer metal layer free region between the plurality of active MOS devices and the at least one single metal bonding pad. The buffer metal layer free region is within an entirety of the interlayer dielectric layer. The passivation is substantially free from the buffer metal layer underlying the single metal bonding pad. | 2011-02-17 |
| 20110037178 | INTEGRATED CIRCUIT - An integrated circuit connection is disclosed. The integrated circuit connection comprises a substrate | 2011-02-17 |
| 20110037179 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures. | 2011-02-17 |
| 20110037180 | DICING DIE BONDING FILM HAVING EXCELLENT BURR PROPERTY AND RELIABILITY AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad. | 2011-02-17 |
| 20110037181 | UNDERFILL METHOD AND CHIP PACKAGE - A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material. | 2011-02-17 |
| 20110037182 | Backlight Module and the Method for Manufacturing the Same - A backlight module and a manufacture method thereof are provided. The backlight module includes a frame body and an optical plate. The frame body includes a first material frame and a second material frame, and the second material frame is embedded in the first material frame and the strength of the second material frame is higher than that of the first material frame. The first material frame enwraps part of the second material frame to form at least one connection part, and the optical plate is disposed in the frame body and is connected with at least one connection part. | 2011-02-17 |
| 20110037183 | Self-Compensating Multi-Mode Fiber - An improved multimode fiber optic cable is designed to compensate for the wavelength distribution and emission pattern of laser sources used in high-speed communication systems. The improved multimode fiber optic cable compensates for the wavelength dependent VCSEL polar emission pattern to reduce modal dispersion. Techniques for reducing the modal dispersion within the improved multimode fiber optic cable allow for improved Bit Error Rate (BER) system performance and/or to achieve greater reach in high bandwidth optical channel links are disclosed. Considerable efforts have been undertaken in the design and production of an improved multimode fiber optic cable to minimize modal dispersion, ignoring the effects of wavelength dependent polar emission patterns in lasers. Material dispersion effects have a significant impact on modal dispersion and by modifying a standard parabolic refractive index profile to compensate for material dispersion effects, overall modal dispersion can be reduced. | 2011-02-17 |
| 20110037184 | Method of Producing Intraocular Lens - To provide a manufacturing method of an intraocular lens wherein by using a mold having an optical part molding part for forming a member becoming the optical part by molding, and a support part molding part for forming a member becoming the support part by molding, in which the front optical surface and the rear optical surface can be directly obtained by molding the optical molding part, and the support part can be obtained by applying a additional machining to the member obtained by molding, the method comprises the steps of: injecting a raw material of an intraocular lens into the mold, then polymerizing and hardening the raw material, then machining the member becoming the support part into a shape of the support part in a state that at least the front optical surface and the rear optical surface in the polymerized or hardened members are covered with the optical part molding part of the mold, and releasing the optical part molding part from the mold. | 2011-02-17 |
| 20110037185 | CONTINUOUS PROCESS FOR MAKING PHARMACEUTICAL COMPOSITIONS - A process for manufacturing solid oral dosage forms in an equipment train that comprises multiple pieces of apparatus designed for unit operations, such as blending, extruding, cooling, milling and finishing. The equipment in the equipment train allow for the transfer of raw materials and intermediate-processed materials from one apparatus to the next using transfer means, for example, gravity, vacuum, belts, and the like. | 2011-02-17 |
| 20110037186 | Formwork And Formwork Method Of A Concrete Construction - In a formwork in concrete construction, particularly for a round vessel, in which, for a further construction section, formwork elements enclose an upper edge of a completed wall portion, are secured to this completed wall portion, and protrude over this wall portion for filling with concrete, vertical members are arranged parallel to, and at a distance from, the wall portion, and a slide is displaceable at every vertical member, and formwork elements are connected to the slide. | 2011-02-17 |
| 20110037187 | BLOW MOULDING MACHINE WITH CLEANING SYSTEM - An apparatus for transforming plastic preforms into containers may include at least one blow mould which forms a cavity, inside which the plastic preforms can be transformed into containers. The apparatus may include a pressure application device for applying a medium to the plastic preforms in order to expand the preforms against an inner wall of the blow mould delimiting the cavity. The apparatus may include a stretching rod for stretching the plastic preforms in the longitudinal direction. The apparatus may include a cleaning device for cleaning regions of the blow mould. The cleaning device may include at least one outlet opening for a cleaning medium for cleaning the blow mould, and this outlet opening is arranged at least at times inside the blow mould. | 2011-02-17 |
| 20110037188 | BLOW MOULDING MACHINE WITH ARRANGEMENT FOR CLEANING THE BLOW MOULD - An apparatus ( | 2011-02-17 |
| 20110037189 | METHOD AND DEVICE FOR BLOW-MOLDING CONTAINERS - The method and the device are used for blow-molding containers. A preform made of a thermoplastic material is first subject to a thermal conditioning operation along a transport path in the region of a heating section. Thereafter, the preform is formed into the container inside a blowing mold by applying blowing pressure. While the preform is shaped into the container, at least one parameter ( | 2011-02-17 |
| 20110037190 | Method to manufacture at least a component of a blade of a wind-turbine - A method, machine and blade of a wind-turbine are disclosed. At least a component of a blade includes at least one layer of a composite structure. The layer is built up by a number of unconnected single roving-bundles, which are aligned unidirectional and which shows a common direction. The roving-bundles are laid down automatically into a fanning tool. | 2011-02-17 |
| 20110037191 | Method and Arrangement to Produce a Wind-Turbine-Blade - A method and arrangement to produce a wind-turbine-blade are disclosed. A bottom layer is laid down into a forming tool. The bottom layer is used as a base of a pile. A predefined number of additional layers is stacked vertically on top of the basis to form the pile, while the pile is used as a separate module for the production of the blade. The bottom layer is made of a nearly airtight material, to prevent that surrounding air is allowed to flow vertically through the pile. An extraction of air is applied by a machine to a topmost layer of the pile in a way that the pile is sucked towards the machine. This allows to lift up the pile and to bring it into a mould for the further production of the blade. | 2011-02-17 |
| 20110037192 | FLEXIBLE LIP EXTRUDER, AND METHODS - An extrusion die or extruder having a flexible lip that is moveable by a geared mechanism. A shaft is operably connected to at least one gear, which in turn is operably connected to a movable lip of the extruder. Rotation of the shaft results in movement of the extruder lip. | 2011-02-17 |
| 20110037193 | METHOD FOR PRODUCING POLYARYLENE SULFIDE RESIN COMPOSITION - A method is provided for obtaining a polyarylene sulfide resin composition with a low chlorine content, which has high fluidity and high quality and produces less burrs. Specifically, a method is provided wherein a polyarylene sulfide resin composition is produced by melting and mixing (A) a polyarylene sulfide resin, (B) an inorganic filler, and (C) an alkoxysilane compound. In this method, (A) a polyarylene sulfide resin having a melt viscosity of 80-400 Pa·s (at a temperature of 310° C. and a shear rate of 1200/sec) and a chlorine content of 1000-2000 ppm is supplied from a raw material feed port of a specific extruder, and then extruded at two kneading parts within the range of [shear rate (1/sec)×kneading time (sec)=1600-6000], thereby producing a polyarylene sulfide resin composition having a melt viscosity of 150-330 Pa·s (at a temperature of 310° C. and a shear rate of 1200/sec) and a chlorine content of not more than 950 ppm. | 2011-02-17 |
| 20110037194 | DIE ASSEMBLY AND METHOD OF USING SAME - A die assembly suitable for spinning filaments and more particularly to a die assembly having a fluid environment around the die assembly's filament exit holes is provided. | 2011-02-17 |
| 20110037195 | Continuous Cast Silicon Strip Apparatus and Method - A continuous cast silicon strip apparatus including a drum rotatably mounted on an axle supported by a framework, a motor operatively connected to the axle to cause rotation of the drum about the axle, a crucible mounted relative to the drum to dispense liquid silicon onto a peripheral surface of the drum as the drum rotates to continuously cast a silicon strip onto the peripheral surface and a segmenting mechanism for segmenting the continuous cast silicon strip into silicon segments to a desired length. | 2011-02-17 |
| 20110037196 | INSTALLATION, OVEN AND METHOD FOR HEATING PREFORM TUBES PRIOR TO THE MOLECULAR ORIENTATION THEREOF - The facility is comprised of an oven ( | 2011-02-17 |
| 20110037197 | APPARATUS FOR MOLDING AND ASSEMBLING A CHAMBER UNIT FOR BIOMEDICAL USE, AND ASSOCIATED METHOD - An apparatus ( | 2011-02-17 |
| 20110037198 | Method of forming a molded plastic article having at least one molded extension - A method of forming a molded plastic article having at least one molded extension extending from a second surface, and a first surface that is substantially free of sink mark defects. The method involves providing a mold (that includes a first mold portion with a recess. Part of the base of the recess is defined by the upper surface of a part ejector. A first plastic material is introduced into the recess to form a molded extension. After at least partial solidification of the molded extension, the part ejector is positioned to push the upper surface and upper portion of the molded extension out of the recess while a lower portion of the molded extension remains within the recess. A second plastic material is introduced into the mold so as to form a molded body in which the upper surface and upper portion of the molded extension are immersed and embedded. As a result the first surface of the molded body is substantially free of sink mark defects opposite the molded extension. | 2011-02-17 |
| 20110037199 | RESIN CONTAINMENT AND INJECTION SYSTEM AND METHOD - A resin containment and injection system includes a tool, a resin storage well provided in the tool, a composite layup location provided on the tool and a vacuum bagging film provided over the resin storage well. The vacuum bagging film is configured to define a volume in the resin storage well responsive to establishment of a pressure equilibrium across the vacuum bagging film and substantially eliminate the volume responsive to application of positive pressure against the vacuum bagging film. | 2011-02-17 |
| 20110037200 | Method of producing a cementitious sheet-form material having a high level of glass aggregate and a solid surface - A method of producing a sheet-form material having an exposed solid surface comprises pre-mixing cement with at least one pozzolan to provide a cement/pozzolan mixture with a high pozzolan to cement ratio, adding to the cement/pozzolan mixture an aqueous solution comprised of water and a high range water reducer to produce a cement/pozzolan dough-like substance, adding and mixing a sufficient quantity of glass aggregate to said cement/pozzolan dough-like substance to produce a moldable composition, wherein, after adding and mixing in the glass aggregate, the pozzolan is present in the composition at about 5% to about 20% by weight, the cement is present in the composition at about 3% to about 20% by weight, and the aggregate glass is by weight a relatively high percentage of the composition. The moldable composition is placed into a mold and vibrated, and is allowed to cure. | 2011-02-17 |
| 20110037201 | IMPRINT LITHOGRAPHY APPARATUS AND METHOD - An imprint lithography method is disclosed for forming a patterned layer from a UV-curable, imprintable liquid medium on a substrate by means of an imprint template with a patterned surface. The method involves bringing together the patterned surface and the UV-curable medium for a filling period, illuminating the UV-curable medium with UV-radiation for an illumination period, holding the patterned surface and the UV-curable imprintable liquid medium together for a holding period such that the UV-curable medium has formed a self-supporting patterned layer, and separating the patterned surface and the patterned layer at the end of the holding period. The start time of the illumination period is earlier than the end time of the filling period by a pre-cure period. Also, a method is disclosed where the end time of the illumination period is earlier than the end time of the holding period. | 2011-02-17 |
| 20110037202 | METHOD AND DEVICE FOR SPINNING OF POLYMER MATRIX IN ELECTROSTATIC FIELD - The present disclosure relates to the method for spinning of polymer matrix in an electrostatic field induced in a spinning space between a spinning electrode and a collecting electrode, at which the polymer matrix is delivered from a matrix reservoir into the electrostatic field on surface of the spinning electrode or by the spinning elements of the spinning electrode, whose principle consist in that the temperature of the spinning electrode or spinning elements of the spinning electrode, and/or reservoir, and/or of polymer matrix is increased above the surrounding temperature by means of resistance heating. The disclosure further relates to the device for performing of this method. | 2011-02-17 |
| 20110037203 | INSERT PART WELD MOLDING METHOD - To provide an insert part weld molding method for reliably welding an insert part to a blow molded object while preventing an unwelded portion from being created at a circumferential edge of the insert part in a thickness direction thereof. An insert part weld molding method welds a blow molded object to an insert part | 2011-02-17 |
| 20110037204 | METHOD OF PRODUCING BIAXIALLY STRETCHED POLYESTER BOTTLES - In effecting the stretching by using a stretch rod in a method of producing a biaxially stretched polyester bottle, the air is blown into the preform at such a flow rate that the preform does not come in contact with the stretch rod but the end thereof and does not come in contact with the surfaces of the mold, either. There can be produced a biaxially stretched polyester bottle having an average thickness of about 0.05 to about 0.2 mm or having a further decreased thickness using a resin in decreased amounts and having a decreased weight without developing burst or whitening caused by over-stretching, without forming ring-like thick portion yet maintaining a good yield and efficiency. | 2011-02-17 |
| 20110037205 | FOAM COSTUMES - A three dimensional foam costume molded from a vacuum molding or thermoforming machine which simultaneously molds two sheets of plastic. The machine is comprised of two female concave molds which are positioned one over the other and an opening mechanism to open and close the two molds. The machine accepts two sheets of plastic at one time and air is provided between the two sheets to force each sheet of plastic into one of the molds to form a three-dimensional costume in which the edges of the costume are sealed. | 2011-02-17 |
| 20110037206 | METHOD OF PRODUCTION OF CEMENT BONDED AGGLOMERATED ORE - A method of production of cement bonded agglomerated ore not depending on yard curing which can improve the environment, save labor, and improve yield is provided, that is, a method of production of cement bonded agglomerated ore which adds Portland cement as a binder to dust produced from an iron works and/or fine powder ore, treats the same by mixing, moisture adjustment, and kneading steps, then pelletizes it by a pan pelletizer and suitably thereafter cures it to produce blast furnace-use cold pellets or sintering-use minipellets having the required crushing strength, which method charges the raw pellets from the top of a vertical type container and discharges them from the bottom end to form a moving bed and cures the raw pellets in the period from charging to discharging. | 2011-02-17 |
| 20110037207 | HYBRID METHOD MANUFACTURING APPARATUS FOR TORSION BEAM - A hybrid method manufacturing apparatus for a torsion beam according to an exemplary embodiment of the present invention includes a pair of side punch molds where a semi-finished product material heated to approximately 880 to 800° C. is molded and a press mold where a cooling water circulation line decreasing the temperature of the processed finished product to approximately 750 to 450° C. while the semi-finished product material is molded to a processed finished product is installed, an advantage of high-temperature molding having high dimensional accuracy is maintained at the time of manufacturing the torsion beam and additional heat treatment such as tempering is selectively performed only when additional heat treatment such as tempering increases toughness because only a martensite structure is not formed in quenching treatment. | 2011-02-17 |
| 20110037208 | GAS SPRING WITH SPEED CONTROL FUNCTION - In a gas spring which includes a cylinder member slide-engaged in upward and downward directions in the interior of an outer body, an inner pipe which is engaged to an inner wall of the cylinder member and forms a gas flow path in upward and downward directions between itself and the inner wall of the same, a valve member which is provided in the upper sides of the cylinder member and the inner pipe and includes a gas guide flow path for controlling the flow of gas via the gas flow path depending on an operation of a valve pin, and a piston rod of which a head part is air-tightly slide-engaged in the interior of the inner pipe, and a rod part is vertically rotatably engaged to a bottom of the outer body, there is provided a gas spring with a speed control function which comprises a speed control guider disposed between a head part provided on an upper side of the piston rod and the valve member for thereby controlling the flow of a gas via a gas flow path when the cylinder member is lowered, which leads to controlling a lowering speed. The present invention is basically directed to allowing a user to sit on a chair without feeling an impact which might occur due to the lowering of a seat plate of a chair with a gas spring adapted to control the height of a chair. | 2011-02-17 |
| 20110037209 | Vibration Damping Construction System - The present invention provides a vibration damping construction system including a first construction body, a second construction body, and a damping unit. The first construction body includes a reaction surface. The second construction body is accommodated in the first construction body. The damping unit is disposed between the second construction body and the reaction surface of the first construction body for reducing the vibration transferred from the first construction body. | 2011-02-17 |
| 20110037210 | STACKABLE BELLEVILLE SPRING - Disc springs that are resistant to premature failure caused by friction wear, disc spring assemblies and disc spring stacks comprising said disc springs, and methods of making and using said assemblies and stacks are disclosed. | 2011-02-17 |
| 20110037211 | Counter culture corner cutter (C4 corner cutter, for short) - A board wargaming hobbyist's tool constructed of .22-.25″ thick plexiglass, consisting of two 1″×¾″ beveled flanges glued on a 1-½″ square base. Either a self-adhesive felt or high-density foam piece is affixed to the bottom to provide scratch protection and to add color to the piece (not part of functionality). When used with a hobby knife it allows up to 10 cardboard counters (square game pieces) to be stacked with ragged corners protruding through the bevels, so that they can be trimmed off quickly and consistently. This greatly decreases preparation time of game pieces. | 2011-02-17 |
| 20110037212 | SUPPORT ASSEMBLIES FOR A FLEXIBLE FIXTURE - A system and method for supporting a workpiece includes a plurality of support assemblies with movable heads. Positional errors are ascertained for the heads based on different positions thereof and used to properly position the heads to support the workpiece. Other inventive aspects are directed to features of the support assemblies and heads thereof. | 2011-02-17 |
| 20110037213 | FLEXIBLE FIXTURE - A system and method for supporting a workpiece includes a plurality of support assemblies with movable heads. Positional errors are ascertained for the heads based on different positions thereof and used to properly position the heads to support the workpiece. Other inventive aspects are directed to features of the support assemblies and heads thereof. | 2011-02-17 |
| 20110037214 | IN-LINE SHELL PROCESSING - A system is provided for printing and assembling printed products. The system includes a binding line and a plurality of pockets for delivering signatures to the binding line. A personalization line is associated with one of the plurality of pockets. The personalization line includes a printer configured to print variable information on a substrate and a converter positioned downstream of the printer and configured to convert the substrate into a variable signature including the variable information | 2011-02-17 |
| 20110037215 | SHEET PROCESSING APPARATUS AND IMAGE FORMING DEVICE HAVING THE SAME - A sheet processing apparatus staples a bundle of sheets, folds the sheets into two to make a book, and presses the folded sheets. | 2011-02-17 |
| 20110037216 | BOOKBINDING APPARATUS AND IMAGE FORMING SYSTEM - A bookbinding apparatus including: a gathering tray device that collates sheets sequentially fed thereto into a sheet bundle; a sheet bundle conveying device that conveys the sheet bundle collated by the gathering tray device to an adhesive coating position located downstream of the gathering tray device; an adhesive coating device that coats the sheet bundle located at the adhesive coating position with an adhesive; a cover sheet stitching device that stitches a cover sheet with the sheet bundle; and a control device that controls a bookbinding process executed by the sheet bundle conveying device, the adhesive coating device, and the cover sheet stitching device, wherein, upon receiving a bookbinding process stopping signal before the sheet bundle is coated with the adhesive by the adhesive coating device, the control device controls the adhesive coating device to coat the sheet bundle in process with the adhesive. | 2011-02-17 |
| 20110037217 | OFFICE MACHINE - An office machine includes a housing, a support member, a first restraining member and a first roller assembly. The housing has an acting surface with a first end point. An acting point is defined on the support member. The first restraining member has a first restraining point and a second restraining point. The first roller assembly has a first nip point. The second restraining point is not lower than the first end point. The acting point is located between the first end point and the first restraining point. Furthermore, the first restraining point is located between the acting point and the first nip point. | 2011-02-17 |
| 20110037218 | METHOD FOR LOADING A FOLDED SHEET BUNDLE - A method for loading a folded sheet bundle provided from a sheet bundle provider with a folded edge of the folded sheet bundle in the lead, including: supporting an undersurface of the folded sheet bundle so that the folded edge is lower than a trailing edge of the folded sheet bundle by a hill, the hill including a slope between a folded edge support and the sheet bundle provider, the hill further including a valley wall declined steeper than the slope from the higher side to the lower side between the slope and the folded edge support; supporting the folded edge of the folded sheet bundle by the folded edge support; and moving the folded edge support without rotation in a direction declined from a higher side near the sheet bundle provider to a lower side farther from the sheet bundle provider than the higher side. | 2011-02-17 |
| 20110037219 | MEDIA STACKER - A media stacker unit comprises: (i) at least one stacker wheel and (ii) a detent. The stacker wheel includes: a hub for mounting on an axle, and a plurality of arcuate tines, each tine being coupled to the hub at a hub end and extending transverse to the axle to a point radially spaced from the axle at a capture end. When the stacker wheel is rotated about the axle, the capture ends traverse a capture circumference. Each tine further comprises a resilient tine portion. The detent partially extends within the capture circumference for engaging with and temporarily retarding a capture end as the stacker wheel is rotated. This reduces the time during which that capture end blocks a media transport path, thereby reducing the possibility of a media item colliding with a capture end and jamming the media stacker unit. | 2011-02-17 |
| 20110037220 | PAPER SUPPLY APPARATUS, IMAGE FORMING APPARATUS, AND IMAGE READING APPARATUS - A paper supply apparatus includes: a placement surface on which paper to be transported is placed; a fixed guide that guides the transport of the paper; a movable guide whose distance to the fixed guide in the widthwise direction of the paper is capable of being adjusted and that guides the transport of the paper; a paper supply roller that abuts the paper in a position, on the side where the fixed guide is located, and that is rotationally driven so as to transport the paper; an abutment member, provided on the movable guide. The abutment member is disposed in a position so that a second abutment point where the abutment member abuts the surface of the paper is further downstream in the transport direction of the paper than a first abutment point where the paper supply roller abuts the surface of the paper. | 2011-02-17 |
| 20110037221 | Paper-Handling Installation and Method of Automatically Controlling the Processing Speed Thereof - A paper-handling installation is initially set for executing a job to process a predetermined number of articles during a predetermined time period. During the processing, the number of articles detected which are processed during the predetermined time period is detected. If the detected number of articles is larger than or equal to the predetermined number, the speed at which articles are processed in a section of the paper-handling installation will be increased. If the detected number of articles is smaller than the predetermined number, it will be detected which of the sections of the installation caused a reduction of the throughput, and which installation parameters and/or article parameters existed at that point in time. On the basis of the parameters detected, an installation parameter of the section is then set, and/or the speed is reduced in at least that section. This procedure is repeated until the job has been executed. | 2011-02-17 |
| 20110037222 | Game table - A game table including a table body which has two mutually opposite inner sides each being provided with a scoring unit, two players in game competition can be decided of winning by the two scoring units that count the times of receiving a game utensil. Wherein the table body is provided thereon with two bubble generating devices that are respectively connected to and controlled by the two scoring units, so that that when either of the two scoring units receives a game utensil, one of the bubble generating devices is controlled to blow bubbles out. | 2011-02-17 |
| 20110037223 | Magnetic house puzzle - A take-apart puzzle consisting of a small number of identical looking bricks which are held together by the mutual magnetic attraction of their internally hidden magnets. The puzzle is disassembled by separating the bricks from one another. Upon separation it will be found that one or more of the magnets within the bricks have moved and/or rotated thereby causing one or more of the bricks to now mutually repel one another. The bricks will not be attracted to each other, thus forcing the so-moved magnets back into their original positions. The puzzle is made all the more tantalizing to solve by the fact that magnetic fields cannot be readily seen and the puzzle only consists of a small number of separate pieces. | 2011-02-17 |
| 20110037224 | METHODS AND APPARATUS FOR PLAYING WORD GAMES - A method and apparatus for playing a word game with two, three or four players competing to spell as many words as possible within a period of one minute. The game includes a deck of 59 cards, each having two or three letters on its face. Words must start with the letters shown on a, card which is drawn from the deck. Each syllable of a word counts one point. Selected words must comply with specified rules. The players decide in advance whether bonus words are to be included in the game. The score is doubled for a bonus word. If bonus words are included, selected words must also comply with additional specified rules. The players agree in advance on a dictionary to be consulted, if necessary. The winner is the player with the highest score. | 2011-02-17 |
| 20110037225 | PROJECTILE GOLF GAME - Embodiments of projectile golf game may include a variety of targets, each of them representing a “hole” to imitate playing traditional golf. For example, nine different “hole” targets having different configurations similar to a golf course layout may be provided. Scoring is accomplished based, at least in part, by the locations at which projectiles hit the targets and/or the number of projectiles used. Additionally, a handicap target may be used to determine the skills of each participant to level the skill levels of various participants. | 2011-02-17 |
| 20110037226 | ILLUMINATED BALL TOSS GAME - A ball toss game includes a target that includes a first upright and a second upright. A base is adapted to support the first upright and the second upright and a cross piece is supported by the first upright and the second upright. The ball toss game includes an electrically powered light source located inside the target and configured to illuminate a portion of the target. The light from the light source is visible through the illuminated portion of the target. A switch is configured to be operable to turn the light source on and off. The ball toss game also includes a projectile adapted to be thrown at the target. The projective includes two weights joined by a flexible member. | 2011-02-17 |
| 20110037227 | PORTABLE PROJECTILE TRAP ASSEMBLY - A portable projectile trap assembly includes a modular target assembly having a frame configured to retain a plurality of backstop panels. The plurality of backstop panels are removably mounted on a front side of the frame forming a planar backstop, and a front panel of resilient material is removably mounted to and covers the front side of the planar backstop opposite the frame. The front panel is spaced from the planar backstop to form an air gap between the backstop and the front panel. When a projectile is fired at the target assembly, the projectile passes through the front panel and impacts against and is stopped by the backstop. The target assembly is attached to a support mast at the rear side of the frame; the support mast is attached to a mobile base supporting the target assembly in a vertical orientation above the mobile base. | 2011-02-17 |
| 20110037228 | BLADE SEAL WITH IMPROVED BLADE SEAL PROFILE - The present invention provides a blade seal for use with a blade that compresses the blade seal to form a seal across a sealing junction. The blade seal includes a recessed ridge for receiving the blade and having a plurality of ridge contact points. When the blade compresses the blade seal to form the seal, the plurality of ridge contact points contacts the blade. The blade seal also may include side lobes extending from the recessed ridge and having respective lobe contact points. When the blade compresses the blade seal, the lobe contact points also contact the blade. The blade seal also includes a secondary sealing portion. When the blade compresses the blade seal to form the seal, the recessed ridge presses against the secondary sealing portion. The multiple contact points between the blade seal and blade, and the presence of a secondary sealing portion, enhance the efficacy of the seal. | 2011-02-17 |
| 20110037229 | PACKING ELEMENT - A sealing element for a packer is described. The sealing element comprises an annular body having an internal surface defining a throughbore, the internal surface adapted to engage a mandrel having a mandrel diameter. The annular body internal surface defines first and second regions, the throughbore diameter of the regions being less than the mandrel diameter. | 2011-02-17 |
