03rd week of 2010 patent applcation highlights part 44 |
Patent application number | Title | Published |
20100015784 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - In a semiconductor device manufacturing method in which a wafer formed with devices in a plurality of areas sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided into the individual devices along the streets, when the wafer is divided into the individual devices by exposing cut grooves formed along the streets by a dicing before grinding process, a rigid plate is applied to the front surface of the wafer and an adhesive film is attached to the rear surface of the wafer. Thereafter, a separation groove forming step is performed in which a laser beam is directed to the adhesive film along the cut grooves form the dicing tape side applied with the wafer attached with the adhesive film to form separation grooves in the adhesive film along the cut grooves. | 2010-01-21 |
20100015785 | Method for reducing a reset current for resetting a portion of a phase change material in a memory cell of a phase change memory device and the phase change memory device - According to one embodiment, at least a portion of the phase change material including a first crystalline phase is converted to one of a second crystalline phase and an amorphous phase. The second crystalline phase transitions to the amorphous phase more easily than the first crystalline phase. For example, the first crystalline phase may be a hexagonal closed packed structure, and the first crystalline phase may be a face centered cubic structure. | 2010-01-21 |
20100015786 | VAPOR GROWTH APPARATUS, VAPOR GROWTH METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A vapor growth apparatus forming a film on a substrate using a first source gas and a second source gas different form the first source gas, includes: a reaction chamber in which the substrate is disposed; a first source gas introduction path that communicates with the reaction chamber and introduces the first source gas; a second source gas introduction path that communicates with the reaction chamber and introduces the second source gas; and a separation gas introduction path that communicates with the reaction chamber between the first source gas introduction path and the second source gas introduction path and introduces a separation gas. The separation gas has a reaction rate with the first source gas and a reaction rate with the second source gas lower than the reaction rate between the first source gas and the second source gas. | 2010-01-21 |
20100015787 | Realizing N-Face III-Nitride Semiconductors by Nitridation Treatment - A method of forming a semiconductor structure includes providing a substrate; forming a buffer/nucleation layer over the substrate; forming a group-III nitride (III-nitride) layer over the buffer/nucleation layer; and subjecting the III-nitride layer to a nitridation. The step of forming the III-nitride layer comprises metal organic chemical vapor deposition. | 2010-01-21 |
20100015788 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Plasma doping is performed by exposing a support substrate | 2010-01-21 |
20100015789 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A semiconductor device | 2010-01-21 |
20100015790 | TiC AS A THERMALLY STABLE p-METAL CARBIDE ON HIGH k SiO2 GATE STACKS - A compound metal comprising TiC which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the TiC compound metal. Furthermore, the TiC metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (pMOS) device. | 2010-01-21 |
20100015791 | SUPPLY APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - A film of uniform thickness can be formed on the entire surface of a substrate. A processing solution supply apparatus includes: a nozzle provided with a supply hole for discharging a plating solution toward a processing surface of a substrate held in a substantially horizontal direction; a temperature controller for accommodating therein the plating solution in an amount necessary for processing a preset number of substrates, for controlling a temperature of the accommodated plating solution up to a preset temperature; a heat insulator disposed between the nozzle and the temperature controller, for maintaining the plating solution, whose temperature has been controlled by the temperature controller, at the preset temperature; and a transporting mechanism for transporting the plating solution, whose temperature has been controlled up to the preset temperature by the temperature controller, toward the supply hole of the nozzle via the heat insulator. | 2010-01-21 |
20100015792 | Bonding Metallurgy for Three-Dimensional Interconnect - A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate. | 2010-01-21 |
20100015793 | CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR - A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad. | 2010-01-21 |
20100015794 | PACKAGING CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME - A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays the metallic layer of the semiconductor substrate and has a receiving space. The lifting layer and conductive layer are formed in the receiving space, wherein the conductive layer extends for connection to a bump. The lifting layer is partially connected to the dielectric layer. As a result, the conductive layer can be stably deposited on the edge of the dielectric layer for enhancing the reliability of the packaging conductive structure. | 2010-01-21 |
20100015795 | SEMICONDUCTOR DEVICE HAVING PROJECTING ELECTRODE FORMED BY ELECTROLYTIC PLATING, AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a semiconductor substrate, and a plurality of wiring lines provided on one side of the semiconductor substrate, each of the wiring lines having a connection pad portion. An overcoat film is provided on the wiring lines and the one side of the semiconductor substrate. The overcoat film has a plurality of openings in parts corresponding to the connection pad portions of the wiring lines. A plurality of foundation metal layers are respectively provided on inner surfaces of the openings of the overcoat film and electrically connected to the pat portions of the wiring lines. A plurality of projecting electrodes are respectively provided on the foundation metal layers in the openings of the overcoat film. | 2010-01-21 |
20100015796 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD AND APPARATUS FOR THE SAME - A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and diffusion of tin into tin-based lead free solder is thinly formed on a UBM layer. The tin-based solder is supplied in solder paste or solder ball form. A combined solder alloy layer composed of a combination of intermetallic compounds, one of tin and the solder alloy making layer, and one of tin and the UBM layer, is formed by heating and melting. | 2010-01-21 |
20100015797 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - When a tungsten film ( | 2010-01-21 |
20100015798 | METHOD FOR FORMING A RUTHENIUM METAL CAP LAYER - A method for integrating ruthenium (Ru) metal cap layers and modified Ru metal cap layers into copper (Cu) metallization of semiconductor devices to improve electromigration (EM) and stress migration (SM) in bulk Cu metal. In one embodiment, the method includes providing a planarized patterned substrate containing a Cu metal surface and a dielectric layer surface, depositing first Ru metal on the Cu metal surface, and depositing additional Ru metal on the dielectric layer surface, where the amount of the additional Ru metal is less than the amount of the first Ru metal. The method further includes at least substantially removing the additional Ru metal from the dielectric layer surface to improve the selective formation of a Ru metal cap layer on the Cu metal surface. Other embodiments further include incorporating one or more types of modifier elements into the dielectric layer surface, the Cu metal surface, the Ru metal cap layer, or a combination thereof. | 2010-01-21 |
20100015799 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS, COMPUTER PROGRAM AND STORAGE MEDIUM - A semiconductor device, which suppresses formation of an organic impurity layer and has excellent adhesiveness to a copper film and a metal to be a base, is manufactured. A substrate (wafer W) coated with a barrier metal layer (base film) | 2010-01-21 |
20100015800 | METHOD FOR FORMING METAL FILM USING CARBONYL MATERIAL, METHOD FOR FORMING MULTI-LAYER WIRING STRUCTURE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A film forming method includes a first step of supplying a carbonyl material including a metallic element onto a surface of a substrate to be processed in a form of gas phase molecules along with a suppressor gas suppressing a decomposition of the carbonyl material, wherein a partial pressure of the suppressor gas is set to a first partial pressure at which the decomposition of the carbonyl material is suppressed; and a second step of changing the partial pressure of the suppressor gas in the surface of the substrate to a second partial pressure which causes the decomposition of the carbonyl material to thereby deposit the metallic element on the surface of the substrate. | 2010-01-21 |
20100015801 | Method of forming a seam-free tungsten plug - A plug comprises a first insulating interlayer, a tungsten pattern and a tungsten oxide pattern. The first insulating interlayer has a contact hole formed therethrough on a substrate. The tungsten pattern is formed in the contact hole. The tungsten pattern has a top surface lower than an upper face of the first insulating interlayer. The tungsten oxide pattern is formed in the contact hole and on the tungsten pattern. The tungsten oxide pattern has a level face. | 2010-01-21 |
20100015802 | DYNAMIC SCHOTTKY BARRIER MOSFET DEVICE AND METHOD OF MANUFACTURE - A device for regulating a flow of electric current and its manufacturing method are provided. The device includes metal-insulator-semiconductor source-drain contacts forming Schottky barrier or Schottky-like junctions to the semiconductor substrate. The device includes an interfacial layer between the semiconductor substrate and a metal source and/or drain electrode, thereby dynamically adjusting a Schottky barrier height by applying different bias conditions. The dynamic Schottky barrier modulation provides increased electric current for low drain bias conditions, reducing the sub-linear turn-on characteristic of Schottky barrier MOSFET devices and improving device performance. | 2010-01-21 |
20100015803 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING DUAL DAMASCENE PROCESS - A method for fabricating a semiconductor device using a dual damascene process is provided. The method includes forming a dielectric layer over a conductive layer, forming a via hole exposing the conducting layer by selectively etching the dielectric layer, projecting a portion of the dielectric layer at an edge of the via hole by selectively etching the dielectric layer to a first depth, and forming a trench by selectively etching the dielectric layer to a second depth, wherein the trench is overlapped with the via hole to form a dual damascene pattern. | 2010-01-21 |
20100015804 | METHODS FOR REMOVING A METAL-COMPRISING MATERIAL FROM A SEMICONDUCTOR SUBSTRATE - Methods for removing metal-comprising materials from semiconductor materials are provided. In accordance with an exemplary embodiment, a method comprises providing a metal-comprising material overlying a semiconductor material and exposing the metal-comprising material to an aqueous non-chlorine-comprising acid solution having a pH of about less 7. | 2010-01-21 |
20100015805 | Wet Etching Methods for Copper Removal and Planarization in Semiconductor Processing - Exposed copper regions on a semiconductor substrate can be etched by a wet etching solution comprising (i) one or more complexing agents selected from the group consisting of bidentate, tridentate, and quadridentate complexing agents; and (ii) an oxidizer, at a pH of between about 5 and 12. In many embodiments, the etching is substantially isotropic and occurs without visible formation of insoluble species on the surface of copper. The etching is useful in a number of processes in semiconductor fabrication, including for partial or complete removal of copper overburden, for planarization of copper surfaces, and for forming recesses in copper-filled damascene features. Examples of suitable etching solutions include solutions comprising a diamine (e.g., ethylenediamine) and/or a triamine (e.g., diethylenetriamine) as bidentate and tridentate complexing agents respectively and hydrogen peroxide as an oxidizer. In some embodiments, the etching solutions further include pH adjustors, such as sulfuric acid, aminoacids, and carboxylic acids. | 2010-01-21 |
20100015806 | CMP POLISHING SLURRY, ADDITIVE LIQUID FOR CMP POLISHING SLURRY, AND SUBSTRATE-POLISHING PROCESSES USING THE SAME - The invention relates to a CMP polishing slurry containing cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer includes a polymer obtained by polymerizing a monomer including at least one of a carboxylic acid having an unsaturated double bond and a salt thereof, using a reducing inorganic acid salt and oxygen as a redox polymerization initiator; an additive liquid for CMP polishing slurry; and substrate-polishing processes using the same. This makes it possible to polish a silicon oxide film effectively in a CMP technique for planarizing an interlayer dielectric, a BPSG film or a shallow trench isolating insulated film. | 2010-01-21 |
20100015807 | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite - The present invention relates to a CMP slurry composition for polishing a copper film in a semiconductor device fabricating process. The CMP composition for polishing a substrate comprising copper comprises zeolite, an oxidizer and a complexing agent and a content of the complexing agent is 0.01˜0.8 weight % with respect to an entire weight of the polishing composition. | 2010-01-21 |
20100015808 | Impact sensor and method for manufacturing the impact sensor - An impact sensor comprises a silicon substrate; an insulating layer formed over the silicon substrate; a plurality of beams having flexibility that are formed of conductive silicon material; a fixing portion to fix a fixed end of each of the beams, the fixing portion being formed of conductive silicon material; a fixed end line at whose one end is formed the fixing portion, the fixed end line being formed of conductive silicon material on the insulating layer; and a free end line having a pressing portion that faces a free end of each of the beams via a space, the free end line being formed of conductive silicon material on the insulating layer. Respective beam widths, each measured in a direction orthogonal to a length direction joining the fixed end and the free end, of the plurality of beams are set different from each other, thus reducing the space occupied by the sensor. | 2010-01-21 |
20100015809 | ORGANIC LINE WIDTH ROUGHNESS WITH H2 PLASMA TREATMENT - A method for reducing very low frequency line width roughness (LWR) in forming etched features in an etch layer disposed below a patterned organic mask is provided. The patterned organic mask is treated to reduce very low frequency line width roughness of the patterned organic mask, comprising flowing a treatment gas comprising H | 2010-01-21 |
20100015810 | SURFACE PROCESSING METHOD AND SURFACE PROCESSING APPARATUS - A processing object | 2010-01-21 |
20100015811 | SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR FORMING FILM - Provided is a substrate processing apparatus. The substrate processing apparatus includes a process chamber, a gas supply system, a gas discharge system, an RF (radio frequency) unit, an electrode, and a control device. The control device controls the gas supply system, the gas discharge system, and the RF unit. While the control device controls the RF unit to apply predetermined RF power to the electrode for generating plasma, the control device controls the gas supply system to supply a process gas to the process chamber alternately at a first flowrate and at a second flowrate greater than the first flowrate. | 2010-01-21 |
20100015812 | METHOD AND APPARATUS FOR PROCESSING WORKPIECE - The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus. | 2010-01-21 |
20100015813 | GAP PROCESSING - Among various methods, devices, and apparatuses, a number of methods are provided for forming a gap between circuitry. One such method includes depositing a first oxide precursor material on at least two conductive lines having at least one gap between the at least two conductive lines, and forming a breadloaf configuration with the first oxide precursor material on a top of each of the at least two conductive lines that leaves a space between a closest approach of at least two adjacent breadloaf configurations. The method also includes depositing a second oxide precursor material over the first oxide precursor material, where depositing the second oxide precursor material results in closing the space between the closest approach of the at least two adjacent breadloaf configurations. | 2010-01-21 |
20100015814 | MOSFET Device With Localized Stressor - MOSFETs having localized stressors are provided. The MOSFET has a stress-inducing layer formed in the source/drain regions, wherein the stress-inducing layer comprises a first semiconductor material and a second semiconductor material. A treatment is performed on the stress-inducing layer such that a reaction is caused with the first semiconductor material and the second semiconductor material is forced lower into the stress-inducing layer. The stress-inducing layer may be either a recessed region or non-recessed region. A first method involves forming a stress-inducing layer, such as SiGe, in the source/drain regions and performing a nitridation or oxidation process. A nitride or oxide film is formed in the top portion of the stress-inducing layer, forcing the Ge lower into the stress-inducing layer. Another method embodiment involves forming a reaction layer over the stress-inducing layer and performing a treatment process to cause the reaction layer to react with the stress-inducing layer. | 2010-01-21 |
20100015815 | PLASMA OXIDIZING METHOD, PLASMA PROCESSING APPARATUS, AND STORAGE MEDIUM - A plasma oxidizing method includes a step of placing an object to be processed and having a surface containing silicon on a susceptor disposed in a processing vessel of a plasma processing apparatus, a step of producing a plasma from a processing gas containing oxygen in the processing vessel, a step of supplying high-frequency electric power to the susceptor and applying a high-frequency bias to the object to be processed when the plasma is produced, and a step of forming a silicon oxide film by oxidizing silicon in the surface of the object to be processed by the plasma. | 2010-01-21 |
20100015816 | METHODS TO PROMOTE ADHESION BETWEEN BARRIER LAYER AND POROUS LOW-K FILM DEPOSITED FROM MULTIPLE LIQUID PRECURSORS - A method for processing a substrate is provided, wherein a first organosilicon precursor, a second organosilicon precursor, a porogen, and an oxygen source are provided to a processing chamber. The first organosilicon precursor comprises compounds having generally low carbon content. The second organosilicon precursor comprises compounds having higher carbon content. The porogen comprises hydrocarbon compounds. RF power is applied to deposit a film on the substrate, and the flow rates of the various reactant streams are adjusted to change the carbon content as portions of the film are deposited. In one embodiment, an initial portion of the deposited film has a low carbon content, and is therefore oxide-like, while successive portions have higher carbon content, becoming oxycarbide-like. Another embodiment features no oxide-like initial portion. Post-treating the film generates pores in portions of the film having higher carbon content. | 2010-01-21 |
20100015817 | VERTICAL HEAT TREATMENT BOAT AND HEAT TREATMENT METHOD FOR SEMICONDUCTOR WAFER - The present invention provides a vertical heat treatment boat that has at least four or more support portions per processing target substrate to be supported, the support portions horizontally supporting the processing target substrate, support auxiliary members on which the processing target substrate is mounted being detachably attached to the four or more support portions, respectively, wherein flatness obtained from all surfaces of the respective support auxiliary members on which the processing target substrate is mounted is adjusted by adjusting thicknesses of the support auxiliary members or interposing spacers between the support portions and the support auxiliary members in accordance with respective shapes of the four or more support portions. As a result, it is provided the vertical heat treatment boat and a heat treatment method for a semiconductor wafer that can readily improve flatness in support of the processing target substrate and effectively prevent occurrence of slip dislocation when performing a heat treatment to the processing target substrate such as a semiconductor wafer by using a vertical heat treatment furnace. | 2010-01-21 |
20100015818 | Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone - A method for producing a buried stop zone in a semiconductor body and a semiconductor component having a stop zone, the method including providing a semiconductor body having a first and a second side and a basic doping of a first conduction type. The method further includes irradiating the semiconductor body via one of the sides with protons, as a result of which protons are introduced into a first region of the semiconductor body situated at a distance from the irradiation side. The method also includes carrying out a thermal process in which the semiconductor body is heated to a predetermined temperature for a predetermined time duration, the temperature and the duration being chosen such that hydrogen-induced donors are generated both in the first region and in a second region adjacent to the first region in the direction of the irradiation side. | 2010-01-21 |
20100015819 | Power Supply Connection Apparatus - A power supply connection apparatus ( | 2010-01-21 |
20100015820 | CARD EDGE CONNECTOR - The present invention provides a card edge connector. The card edge connector comprises a bar insulator base which is provided with a plurality of sockets, a group of connecting terminals arrayed in parallel, and two arm base supports arranged between both ends of the insulator base. The connecting terminals are inserted into the sockets of the insulator base to constitute a group of socket electrodes electrically connected with a circuit board. The arm base supports are respectively provided with an auxiliary supporting bracket connected with the circuit board. Each auxiliary supporting bracket is mutually sheathed, articulated and connected with one respective arm base support. | 2010-01-21 |
20100015821 | SOCKET WITH AN IMPROVED COVER LID | 2010-01-21 |
20100015822 | ELECTRICAL CONNECTOR HAVING VARIABLE LENGTH MOUNTING CONTACTS - An electrical connector is provided for mounting on a circuit board having first and second vias. The electrical connector includes a housing having a mounting face for mounting along the circuit board, and first and second signal terminals held by the housing. The first and second signal terminals include respective first and second mounting contacts extending outward from the mounting face of the housing. The first and second mounting contacts are configured to be received within the first and second vias, respectively, of the circuit board. The first mounting contact extends a different length from the mounting face of the housing than the second mounting contact. | 2010-01-21 |
20100015823 | SOLDER BALL SOCKET CONNECTOR - A socket connector ( | 2010-01-21 |
20100015824 | ELECTRICAL CARD CONNECTOR - An electrical card connector includes an insulating housing ( | 2010-01-21 |
20100015825 | Retractable Connector for an Electronic Device - A retractable connector device having an inner housing, a cover belt, and two sidewalls. The device may comprise electronic components for electronic devices including computer peripheral devices such as serial bus devices, Universal Serial Bus (USB) devices, or IEEE 1394 devices. The belt surrounds a portion of the inner housing. The belt is for moving the device between at least two positions, a deployed position where the connector extends through a hole in the inner housing to connect to a receiving device, and a stored position where the connector is within the housing, separated and protected from external elements by, at least in part, the belt. | 2010-01-21 |
20100015826 | SEALED CONNECTOR ASSEMBLY - A sealed connector system and components thereof is disclosed. The sealed connector system has a sealed cable assembly and a printed circuit board header assembly. The sealed cable assembly has a cable housing and a cable terminated thereto. A cover, as described above, is overmolded over a portion of the cable housing and a portion of the cable. The cover is one continuous member that acts as a seal to prevent contaminants from entering the cable housing. A printed circuit board header assembly is mated to the cable housing. The header assembly has recesses provided proximate a circuit board mounting surface, with the recesses being configured to provide additional space on a circuit board on which the header assembly is mounted. Legs or ribs may be provided proximate the ends of the circuit board contact area. The ribs provide stability to the printed circuit board connector and prevent the printed circuit board connector from being rotated relative to the printed circuit board. The sealed connector system may be provided with a cable housing ground shield proximate the header mating end of the cable housing and a header assembly ground shield may be provided in a cable housing receiving opening of the header assembly, whereby the cable housing ground shield and the header assembly ground shield are placed in electrical engagement with each other. | 2010-01-21 |
20100015827 | CONNECTOR - Male and female connectors ( | 2010-01-21 |
20100015828 | SPEAKER CONNECTING SEAT - A speaker connecting seat mainly includes a retainer and an adjusting sleeve. Separated paths are formed inside the retainer for respectively receiving a first conducting component and a second conducting component so as to provide different conductions and simplify the complicated wiring. By selectively connecting one of the two ends of the adjusting sleeve to a contacting sheet formed to one of the conducting components, the adjusting sleeve can be slid into a connecting portion of another conducting component so as to conveniently switch a conducting path. | 2010-01-21 |
20100015829 | Separable Loadbreak Connector and System for Reducing Damage Due to Fault Closure - Separable loadbreak connectors include an interference element spaced about the contact tube that is configured to engage a portion of a connector piston. | 2010-01-21 |
20100015830 | ELECTRICAL AND PNEUMATIC CONNECTION DEVICE - The invention relates to a device for connecting an item of equipment and two cables, one of which carries electrical data and the other of which carries pneumatic data. The device comprises an electrical socket and a pneumatic socket, both mounted on an item of equipment, an electrical plug secured to a cable, the electrical plug being intended to be connected to the electrical socket, and a pneumatic plug secured to a cable, the pneumatic plug being intended to be connected to the pneumatic socket. According to the invention, when the pneumatic plug is in a connected but unlocked position, the electrical plug cannot be plugged in. | 2010-01-21 |
20100015831 | Connector - It is an object of the invention to provide a connector in which a plurality of stationary contacts | 2010-01-21 |
20100015832 | FLUORESCENT LAMPHOLDER - A fluorescent lampholder with a top portion for supporting a fluorescent lamp and a base portion with a wire opening located on the bottom surface of the base that receives wires without exposing the wires to the exterior surface of a fixture. The lampholder is capable of supporting various types and/or sizes of fluorescent lamps such as “tall”, “medium” and “small” T-8 fluorescent lamps as well as other types and/or sizes of fluorescent lamps. | 2010-01-21 |
20100015833 | HIGH DENSITY SPRING CONTACT CONNECTOR - A densely populated micro miniature connector includes a plug and a receptacle configured to securely mate with each other. Connector plugs include an insert assembly having at least one double-ended pin, a housing, and a coupling ring. Connector receptacles include an insert assembly having at least one spring probe and a housing. The double-ended pin contacts the spring probe when the plug and the receptacle are connected. | 2010-01-21 |
20100015834 | Locking Pin - A high voltage electrical connector that includes a male interconnect, a female interconnect and a locking pin assembly. The male interconnect includes a contact pin with a locking groove and the female interconnect includes a socket with an axial bore, a transverse passage and an opening connecting the bore to the passage. The locking pin assembly is installed in the passage and has a recessed section and a cylindrical section. The locking pin assembly is movable between a first position, wherein the bore is unobstructed and the contact pin can be freely inserted and removed, and a second position, wherein the cylindrical section of the locking pin extends into the bore. After the contact pin is inserted in the bore and the locking groove aligned with the opening, the locking pin assembly is moved from the first position to the second position and secures the contact pin in the socket. | 2010-01-21 |
20100015835 | Edge Connector With Preload Caps - A circuit board edge connector includes an insulative housing and two opposing mating ends with a plurality of conductive terminals supported by the housing and extending between the two ends. One end of the connector mates with an opposing connector and the other end has a slot disposed therein that receives the mating edge of a printed circuit card or board. The terminals at the end of the connector extend outwardly in a cantilevered fashion and they terminate in free ends that contact conductive pads on the edge of the circuit card. A preload cap is provided that includes two parts that interfit with each other and with the circuit card mating end of the connector. These preload caps engage the terminal free ends and impart a preload to the terminals so that the circuit card may be easily inserted into the connector slot and the caps are subsequently removed from the connector. | 2010-01-21 |
20100015836 | ELECTRICAL CONNECTOR WITH LATCHING MEMBERS - An electrical connector ( | 2010-01-21 |
20100015837 | ELECTRICAL CONNECOTR HAVING STIFFENER WITH ELASTIC LATCHES - An electrical connector for electrically connecting an IC package to a printed circuit board is provided, which includes an insulative housing including a main body for supporting the IC package and four straight peripheral sidewalls surrounding the main body; a stiffener having a base separably disposed around the insulative housing. The base defines an opening for receiving the insulative housing. And the stiffener further includes four elastic latches extending upwardly from inner sides of the opening for engaging with the insulative housing, and the insulative housing corresponding defines four slots on outside surfaces of the sidewalls for being resisting against the elastic latches. | 2010-01-21 |
20100015838 | Positive locking mechanism for USB connected devices - The present invention is a positive locking mechanism for a universal serial bus (USB) connector which includes at least one mounting portion connected to the USB connector with the mounting portion having an aperture. The present invention also includes at least one flange in proximity to the mounting portion, with the flange having an aperture, as well as a fastener inserted through the aperture of the flange and the aperture of the mounting portion, where the fastener is used to connect the mounting portion to a structure. | 2010-01-21 |
20100015839 | Lever waterproof wire connectors - A lever push-in wire connector having a sealant therein to enable formation of a waterproof electrical connection by axial insertion of a wire into a chamber contained a resilient conductor protected by the sealant with the resilient conductor displaceable into a waterproof electrical contact with the wire while both the resilient conductor and the wire remain in the presence of the sealant. | 2010-01-21 |
20100015840 | ADJUSTABLE PLUG - An adjustable plug includes a main body, a connecting end, and an adjustable end sleeve. The adjustable end sleeve is slidably positioned on the main body. The connecting end protrudes from the main body. The connecting end extends through the adjustable end sleeve, and protrudes out of the adjustable end sleeve. | 2010-01-21 |
20100015841 | Electric plug connector having a guiding - The invention relates to a plug ( | 2010-01-21 |
20100015842 | POWER CONNECTOR AND A METHOD OF ASSEMBLING THE POWER CONNECTOR - A power connector ( | 2010-01-21 |
20100015843 | END CAP, SOCKET, AND ADAPTORS FOR USE WITH A LAMP - An end cap and socket system for use with a lamp bulb may include an end cap and a socket body. The end cap may include a first cylindrical portion with a first diameter, and a second cylindrical portion with a second diameter smaller than the first cylindrical portion. The socket may a key portion projecting from a front face of the socket. A adaptor for use with a socket may include a key portion. Alternatively, the end can may include a key disk with a key groove cut into the key disk, and the socket may include a key piece with a key rib structured to couple with the key groove. An adaptor for use with an end cap may include an adaptor body portion and a whole, wherein a contact pin can be inserted through the hole. | 2010-01-21 |
20100015844 | CONNECTOR FOR USE IN TERMINATING COMMUNICATIONS CABLES - A connector for use in terminating communications cables including electrical contacts ( | 2010-01-21 |
20100015845 | MODIFIED INSULATION DISPLACEMENT CONNECTOR BLOCK - A modified insulation displacement connector block ( | 2010-01-21 |
20100015846 | High-speed cable assembly with protective member - A cable assembly ( | 2010-01-21 |
20100015847 | Intelligent Inter-Connect and Cross-Connect Patching System - An intelligent network patch field management system is provided that includes electronic hardware, firmware, mechanical assemblies, cables, and software that provide visible and audible cues for connecting and disconnecting patch cords in an interconnect or cross-connect patching environment. Systems of the present invention also monitor patch cord connections in a network. | 2010-01-21 |
20100015848 | Adapter capable of storing and positioning cables, and adapter having a cable organizing device - An adapter capable of storing and positioning cables comprises a main body, a cable, and a casing. The cable is connected to the main body, and the main body is wrapped by the casing. The casing comprises a cable organizing portion comprising a plurality of elastic loop grooves, and a guiding groove. By the above-mentioned structure, the guiding groove can guide the cable to the cable organizing portion. The plurality of elastic loop grooves is applied for organizing the cable. | 2010-01-21 |
20100015849 | COAXIAL CONNECTING DEVICE - A coaxial connecting device is provided for making an electrical connection between a coaxial cable and a device under test. A coaxial connecting device electrically connects a coaxial cable to a signal pad and a ground pad. The coaxial contractor of the present invention includes a signal pin for electrically connecting a signal conductor of the coaxial cable to the signal pad; a ground connector for electrically connecting a ground conductor of the coaxial cable to the ground pad; a cylindrical guide tube surrounding the ground conductor for elastically contacting the ground connector while maintaining a predetermined distance with the signal pin; and a dielectric member surrounding a part of the signal pin for electrically isolating the cylindrical guide tube and the signal pin from each other and coaxially maintaining the guide tube and the signal pin. The coaxial connecting device of the present invention minimizes a contact path between the ground conductor of a coaxial cable and a ground pad and provides impedance matched coaxial signal transmission link, resulting in improvement of frequency characteristics. | 2010-01-21 |
20100015850 | LOW-PROFILE MOUNTED PUSH-ON CONNECTOR - An electrical connector has an outer shroud and a center conductor. The outer shroud has an opening with a first diameter in a center portion of the outer shroud and a second diameter adjacent a second end thereof, the first diameter being smaller than the second diameter. The outer shroud also has a first end providing a physical stop for a female connector that mates with the electrical connector. The female connector has a distal end of an outer conductor that does not engage the outer shroud of the electrical connector. | 2010-01-21 |
20100015851 | CABLE ASSEMBLY HAVING IMPROVED CONFIGURATION FOR SUPPRESSING CROSS-TALK - A cable assembly ( | 2010-01-21 |
20100015852 | ELECTRICAL CONNECTOR ASSEMBLY HAVING IMPROVED SUBSTRATE - An electrical connector assembly has an insulative housing ( | 2010-01-21 |
20100015853 | Structure for USB bluetooth wireless connectors - An improved structure for a USB bluetooth wireless connector includes a circuit board, a body, and a housing. The circuit board includes a top surface and a bottom surface. The body includes an upper board and a lower bracket, and that the circuit board is interposed between the upper board and the lower bracket. The housing includes a top surface, a bottom surface, and two side surfaces. The body is provided with at least one anchoring hole; and the housing is provided with at least one engaging portion for engaging and securing together the body and the housing. A plurality of connecting terminals are integrally arranged on the circuit board so as to greatly reduce volume of the USB bluetooth wireless device and to lower the possibility of damage on the device or USB receptacle due to impact thereon. | 2010-01-21 |
20100015854 | Connectors for electrically active grid - The invention includes an electrified framework system having a plurality of grid members which form a grid framework. A conductive material is disposed on a surface of at least one of the plurality of grid members as shown throughout the drawings. The system includes connectors which provide low voltage power connections. For example, the connectors bring power from a power supply to the conductive material disposed on the grid framework and/or the connectors provide electrical connections between the conductive material on the grid framework and various devices. | 2010-01-21 |
20100015855 | RECEPTACLE CONNECTOR - A receptacle connector has a housing, an eSATA terminal set, a first USB terminal set and a second USB terminal set. The housing has a socket space and a tongue formed in the socket space. The eSATA terminal set has eSATA terminals mounted on the tongue. The first USB terminal set has multiple first USB terminals mounted on the tongue opposite to the eSATA terminals for USB 2.0 signal transmission. The second USB terminal set has multiple second USB terminals mounted on the tongue opposite to the eSATA terminals for USB 3.0 signal transmission. The receptacle connector capable of providing eSATA, USB 2.0 or USB 3.0 signal transmission has high applicability. | 2010-01-21 |
20100015856 | BALANCED TRANSMISSION CONNECTOR - A balanced transmission connector includes an insulation block including a contact connecting part for connecting with another connector at a front part of the insulation block and connecting with a substrate at a bottom part of the insulation block, a first signal contact including an upper contact portion projecting from the front of the insulation block and a first lead portion projecting from the rear of the insulation block and extending toward the substrate, a second signal contact including a lower contact portion projecting from the front of the insulation block and a second lead portion projecting from the rear of the insulation block and extending toward the substrate, retaining portions formed on a rear part of the insulation block retaining the first and second lead portions from both sides. The first and second lead portions extend substantially in parallel while maintaining a shortest distance with respect to the substrate. | 2010-01-21 |
20100015857 | Connector and a Method of Manufacturing the Same - The invention discloses a connector that comprises an insulation body and one or more conductive terminals within the insulation body. The one or more conductive terminals comprise at least one clamping portion to clamp onto the insulation body. The invention further discloses an endoscope, which comprises a telescope, an imaging means, an image sensor that transforms optical signals from the imaging means into electrical signals and a PCB board that organizes and outputs the electrical signals, the imaging means, image sensor and PCB board being located in the telescope, wherein the endoscope further comprises the connector that electrically connects the image sensor and the PCB board to form a first assembly. The invention further discloses a method to make the connector. | 2010-01-21 |
20100015858 | ADAPTER AND PLUG-IN CONNECTION SYSTEM - A device which on the one side (socket side) includes a plug portion which may be inserted into the standardised plug socket. A plurality of chambers ( | 2010-01-21 |
20100015859 | CONNECTOR JACK WITH REDUCED HOST PCB FOOTPRINT ASSEMBLY-THEREOF AND FABRICATION METHOD OF THE SAME - A connector jack with reduced host PCB footprint and an assembly of the same are provided. The provided connector jack is constructed based on a housing defining at least a front face with a plug receiving cavity on the surface thereof and with a plurality of electrical contacts positioned within the cavity, and a bottom face having a recess area on the surface thereof and adapted for mounting on a circuit board. In the present invention, at least a portion of the housing is made of a transparent or translucent material so that the status indicators located within the recess will be visible through the transparent portion of the front face of the jack housing, and the recess area occupies a substantial portion of the bottom face and allows to place at least one status indicator and at least one additional component on the circuit board and at least partially within the recess area. | 2010-01-21 |
20100015860 | STRIP CONNECTORS FOR MEASUREMENT DEVICES - Devices including strip connectors in measurement devices are provided. Also provided are systems, kits and methods. | 2010-01-21 |
20100015861 | CONTACT HAVING LEAD-IN ARRANGEMENT IN BODY PORTION FACILITATING SMOOTH AND RELIABLE INSERTION - An electrical connector includes a base defining at least a passageway extending from an upper surface of the base to a bottom surface of the base. An electrical contact is inserted into the passageway from the bottom surface and includes a retention portion engaging with an inner wall of the passageway. A lead-in chamfer is formed on an edge of the retention portion and toward the inner wall such that the lead-in chamfer is offset away an edge of the inner wall of the passageway and the contact is inserted by guiding of the chamfer. | 2010-01-21 |
20100015862 | TRANSVERSE WEDGE CONNECTOR - An electrical connector assembly includes a first conductive member and a second conductive member. The first conductive member includes a first channel portion extending from a first wedge portion, with the first channel portion configured to receive a first conductor therein. The first conductive member includes a jaw movably coupled to the first channel portion and being positioned between the first channel portion and the first wedge portion. The second conductive member includes a second channel portion extending from a second wedge portion where the second channel portion configured to receive a second conductor. The first wedge portion and the second wedge portion are assembled such that the second wedge portion engages the jaw and moves the jaw to the closed position. The jaw engages the first conductor in the closed position. Optionally, the first channel portion may have a contoured shape. | 2010-01-21 |
20100015863 | Female type terminal pin - An electric contact part | 2010-01-21 |
20100015864 | MANUFACTURING METHOD OF PIN-LIKE MALE TERMINAL FOR BOARD-MOUNTING CONNECTOR - A method of manufacturing a terminal for a board-mounting connector, wherein the terminal includes two L-shaped bent portions formed at its intermediate portion between its front and rear ends, a straight electrical contact portion formed at its front end, and a straight rear leg portion, the method includes a stamping operation applied to a stock to form a stamped-out terminal including the two bent portions, the electrical contact portion and the rear leg portion. | 2010-01-21 |
20100015865 | SWIMMING FIN OF THE KIND PROVIDED WITH A FOOT POCKET OPEN AT THE HEEL ZONE - Swimming fins of the kind comprising a foot pocket provided with a outsole and an upper closed at the tip and open at the heel zone, for lodging with slight clearance the feet of a scuba diver wearing diving booths, characterised by the fact that the outsole and/or the upper sections of the said fins are provided with a number of through holes. | 2010-01-21 |
20100015866 | STRUCTURE OF COMPONENT FOR FLOATING PRODUCTS AND METHOD THEREFOR - Structure of semifinished product ( | 2010-01-21 |
20100015867 | PERSONAL FLOTATION DEVICE - A personal flotation device may include a chest portion, an abdominal portion, and a connecting portion positioned between the chest portion and the abdominal portion. The width of the connecting portion may be smaller than the width of both the chest portion and the abdominal portion. The connecting portion may extend only from a center region of the chest portion. The chest portion, abdominal portion and connecting portion may be arranged to together form an approximately I-shaped portion. The personal flotation device may be secured to a garment. | 2010-01-21 |
20100015868 | REINFORCED COMPOSITE IMPLANT - Multilayer structures including a porous layer and a non-porous layer having a reinforcement member are useful as implants. | 2010-01-21 |
20100015869 | Articles Containing Functional Polymeric Phase Change Materials and Methods of Manufacturing the Same - An article comprises a substrate and a functional polymeric phase change material bound to the substrate. In some aspects the functional polymeric phase change material is chemically bound to the substrate and can be accomplished by at least one of covalent bonding or electrovalent bonding. The functional polymeric phase change material can comprise a reactive function selected from the group consisting of an acid anhydride group, an alkenyl group, an alkynyl group, an alkyl group, an aldehyde group, an amide group, an amino group and their salts, a N-substituted amino group, an aziridine, an aryl group, a carbonyl group, a carboxy group and their salts, an epoxy group, an ester group, an ether group, a glycidyl group, a halo group, a hydride group, a hydroxy group, an isocyanate group, a thiol group, a disulfide group, a silyl or silane group, an urea group, and an urethane group, and wherein the substrate comprises at least one of cellulose, wool, fur, leather, polyester and nylon. Methods of producing the articles are also disclosed. | 2010-01-21 |
20100015870 | Printed fabric and a manufacturing process thereof - A manufacturing process for a printed fabric includes the following steps. A substrate layer and a fabric are provided and the fabric is pasted onto the substrate layer. The substrate layer and the fabric are sent to the printer to perform a UV printing. Thereby, the UV ink printed on the fabric can be suddenly dried to prevent the UV ink from expanding. Therefore, the figures on the printed fabric can be more dedicate, beautiful and clear. The printed fabric can be mass produced by machine to reduce the cost and the manufacturing time. A printed fabric is also provided. | 2010-01-21 |
20100015871 | MOLDED ARTICLE, PROCESS FOR PRODUCING THE SAME, AND CROSSLINKED MOLDED ARTICLE AND COPPER-CLAD LAMINATE EACH OBTAINED THEREFROM - The present invention intends to provide a crosslinkable molded article and a crosslinked molded article free from molding failures, wherein their coefficient of thermal expansion is sufficiently low, their dimensional accuracy is high and a polymerizable composition is sufficiently filled in a fibrous material; a process for producing the same; and a use of such molded articles. | 2010-01-21 |
20100015872 | METHOD OF PREPARING FLAME-RETARDANT POLYESTER FIBER AND FLAME-RETARDANT POLYESTER FIBER - The present invention provides a method of preparing a flame retardant polyester fiber that makes it possible to prepare a flame retardant polyester fiber having excellent shape stability while preventing a lumping phenomenon and reducing powder generation and discoloration during the preparing process of the flame retardant polyester fiber, and a flame retardant polyester fiber prepared therefrom. | 2010-01-21 |
20100015873 | Phthalate-free isocyanurate preparations - The present invention relates to novel low-monomer-content, low-viscosity preparations composed of isocyanurates which contain isocyanate groups and of phthalate-free plasticizers, to their use as adhesion promoters for coating compositions based on plasticized polyvinyl chloride, and also to coatings and to coated substrates. | 2010-01-21 |
20100015874 | POLYESTER WOVEN FABRIC - A polyester garment material including a set of 100% polyester warp yarns and a set of 100% polyester weft yarns, wherein the warp and weft yarns are interlaced to form the garment material. The warp and weft yarns comprise of air-jet spun polyester fibers that wisk moisture away from an individual wearing the garment material and, therefore, provide a quick-drying, breathable garment material that simulates the absorbency characteristics of cotton yarns. The set of polyester warp yarns and the set of polyester weft yarns may be interlaced to form a ground fabric, where a set of polyester pile yarns may then be interlaced with the ground fabric so that the pile yarns extend outwardly (e.g., forming a plurality of loops) on the front side, back side, or both sides of the ground fabric. | 2010-01-21 |
20100015875 | METHOD AND DEVICE FOR THE PRODUCTION OF A ONE-LAYERED OR MULTILAYERED NONWOVEN FABRIC - The invention relates to a method for the production of a one-layered or multilayered nonwoven fabric, a machine for the production of such a nonwoven fabric, and a correspondingly produced nonwoven fabric. The task of improving such a method and a production apparatus underlies the invention to the effect that projecting loops and fibrils no longer stick out, and thus individual filaments can be prevented from pulling out during the use of the nonwoven fabric. According to the invention, this is achieved in that the nonwoven fabric is smoothed after water needling by the use of a calendar. The machine according to the invention is characterized by the fact that the machine has a spun bonded fabric, at least one subsequent needling device, a dryer connected thereto, and thereafter at least one calendar. | 2010-01-21 |
20100015876 | METHOD FOR REPARING DEFECTIVE LINE OF ORGANIC LIGHT EMITTING DISPLAY DEVICE - A method of repairing a defective line of an organic light emitting display device which repairs a short defect occurring between a bidirectional line and an adjacent line includes separating a portion where a short defect occurs from the bidirectional line by cutting a portion of the bidirectional line; and applying a signal toward an end of the cut portion from both sides of the bidirectional line. | 2010-01-21 |
20100015877 | METHOD FOR PRODUCING PLASMA DISPLAY PANEL - A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed. | 2010-01-21 |
20100015878 | METHOD FOR ASSEMBLING INDIRECTLY-HEATED CATHODE ASSEMBLY - A width of a groove of a cathode holder and a thickness of a cathode conductor are determined so that a dimension which is obtained by subtracting the thickness from the width is equal to a gap length which has a predetermined length, and which is between a filament and a cathode. Then, the cathode holder is rearward pushed to cause a front end face of the groove | 2010-01-21 |
20100015879 | VORTEX RING PRODUCING GUN - A gun for producing a ring of fluid is described. The gun comprises a body defining a bore therethrough; a moveable member positioned at least partially within the bore; and a nozzle assembly coupled with the body and positioned at a bore opening. The nozzle assembly defines one or more fluid entrapment regions adjacent an opening of the nozzle assembly. | 2010-01-21 |
20100015880 | Smoke production system for model locomotive - A smoke production system for a model locomotive capable of accurately simulating the exhaust characteristics of an actual locomotive. The present invention accomplishes this by monitoring the rotation to the flywheel of the electric motor used to drive the drive wheels of the model locomotive. Various devices may be used to monitor the rotation of the flywheel. For example, a magnet is employed on the flywheel and a magnetically-reactive element such as a reed switch or Hall effect sensor is positioned adjacent to the flywheel. Alternatively, an opticoupler or cam may be used to track the rotations of the flywheel. A controller counts the rotations of the flywheel and actuates a smoke production device to emit smoke four discrete times for every rotation of the model locomotive's drive wheel. | 2010-01-21 |
20100015881 | RECIRCULATING WATER BATH TOY - The invention provides a water bath toy having a pump that draws water from a bath tub or pool and discharges the water back into the source. The pump is battery powered or hand powered. The invention includes a plurality of output options and a selector for choosing the active output feature, These features may include a narrow spray nozzle, a wide spray nozzle, a flexible hose, and a cascade with configurable obstructions that affect the water flow. The outer body of the water bath toy is configured to fit over the sidewall of a pool or bath tub. | 2010-01-21 |
20100015882 | PORTABLE ACTIVITY PLAY TABLE TOY - A portable activity play table which can be easily transported from the home and used while a child is seated in an airplane seat, an automobile seat, a high chair, and the like, while providing intellectual stimulation and learning and hours of safe, enjoyable play for a child is disclosed. The portable activity play table toy has a table portion with a play surface area, and a strap with fasteners for securing the play table toy. The table portion has features that entertains and/or educates a child. | 2010-01-21 |
20100015883 | Magic Button - A rotatable disk string toy has a disk rotatably mounted on a continuous loop of string. A holder device which includes two connected rings is mounted on each other end of the loop of string to facilitate handling of the toy. The holder device includes a first ring having a central aperture for receiving the fingers of the user. | 2010-01-21 |