| 02nd week of 2013 patent applcation highlights part 26 |
| Patent application number | Title | Published |
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| 20130010435 | FRAME UNIT, MOUNTING SUBSTRATE UNIT, AND MANUFACTURING METHOD FOR THE SAME - Provided is a frame unit, a mounting substrate unit, and a mounting substrate that can achieve both high shield performance and reduction in the height of a shield member. The frame unit according to the present invention is a frame unit ( | 2013-01-10 |
| 20130010436 | CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component. | 2013-01-10 |
| 20130010437 | MOUNTING APPARATUS FOR CIRCUIT BOARD - A mounting apparatus for fixing a circuit board having a position block comprises an enclosure having a bottom plate; a first mounting member having a first securing portion, and a second mounting member having a first position portion and a first mounting portion. A first through hole is defined on the bottom plate. A first depressed portion is defined around the first through hole on the bottom plate. A first fixing hole is defined on the first securing portion. The first position portion is received in the first depressed portion to prevent the first position portion rotating relative to the bottom plate. The first mounting portion passes through the first through hole to be fixed in the first fixing hole. The bottom plate is fixed between the first securing portion and the first position portion. The position block engages the position slot to fix the circuit board on the enclosure. | 2013-01-10 |
| 20130010438 | ELECTRONIC DEVICE - An electronic device is provided. In the electronic device, a cover is securely fitted to a predetermined positioning hole formed in a printed board using a ready-made cover without using solder when the cover is installed in the printed board, so that the cover is prevented slipping from the printed board. The positioning hole is formed in a predetermined position of the printed board, and a cover claw that can be fitted to the positioning hole of the cover is formed in the cover, so that the cover covers the principal surface of the printed board to provide an electronic device. | 2013-01-10 |
| 20130010439 | Enclosures for Containing Transducers and Electronics on A Downhole Tool - A downhole tool for subsurface disposal is provided. The tool comprises an elongated tool body, an enclosure attached to an exterior surface of the tool body. The enclosure comprises at least one transducer disposed at an angle with respect to a longitudinal axis of the enclosure, and an electronics board coupled to and disposed adjacent to the at least one transducer. The enclosure also defines an internal cavity, and the internal cavity contains a fluid for insulating the at least one transducer from a downhole environment. The fluid is in direct contact with the at least one transducer and the electronics board. | 2013-01-10 |
| 20130010440 | Power Module and Method for Manufacturing the Same - Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area. | 2013-01-10 |
| 20130010441 | MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION - A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure. | 2013-01-10 |
| 20130010442 | CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE - The invention relates to a circuit arrangement comprising an electric and/or electronic circuit unit ( | 2013-01-10 |
| 20130010443 | ELECTRONIC COMPONENT - Disclosed is an electronic component which maintains good connection between a circuit board and connection terminals and provides size reduction. The electronic component includes a circuit board, a pair of connection terminals, and a housing with the pair of connection terminals mounted thereon. The circuit board is provided with a plurality of terminal sections connected to the connection terminals. Each connection terminal is provided with a spring member formed to be elastically deformable and which sandwich the terminal sections between them. A rib is provided in the housing, wherein the rib is provided between through-holes through which each of the pair of connection terminals pass, and whereby the rib is formed in convex shape, towards the circuit board and away from a bottom section of a substrate housing section in which the circuit board is housed, and the rib penetrates a plurality of terminal sections. | 2013-01-10 |
| 20130010444 | CHIP PACKAGE - A chip package includes a circuit board, a chip, and wires. The circuit board includes a metal layer, a middle layer formed on the metal layer, and a wire pattern layer formed on the middle layer. The metal layer is configured to be grounded. A through hole is defined through the wire pattern layer and the middle layer to expose the metal layer. The chip is mounted on the metal layer and received in the through hole. The wires interconnect the chip and the wire pattern layer. | 2013-01-10 |
| 20130010445 | REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION - An information handling system device includes a plurality of electronic components; an electric circuit including at least one trace for connecting two or more of the plurality of electronic components and transmitting data between the plurality of electronic components via at least one electric signal; and a substrate including an insulating material for serving as a base for the electric circuit, wherein each of the at least one electric signal transmitted between the plurality of electronic components is transmitted utilizing slope manipulation by manipulating each of the at least one electric signal to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes transmitted utilizing a particular reference voltage of n predetermined reference voltages. | 2013-01-10 |
| 20130010446 | LAMINATE ELECTRONIC DEVICE - A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip. | 2013-01-10 |
| 20130010447 | PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 2013-01-10 |
| 20130010448 | PAD MECHANISM CAPABLE OF ADJUSTING HEIGHT THEREOF AND ELECTRONIC DEVICE THEREWITH - A pad mechanism includes a step fixing structure having a plurality of step platforms. A height difference is formed between the two step platforms. A first engaging portion is formed on each step platform. The pad mechanism further includes a pad component having a pad body, a sleeve and a constraining portion. A second engaging portion is formed on the pad body for selectively engaging with the corresponding first engaging portion so as to adjust a height of the pad body protruding from the step fixing structure. The pad mechanism further includes a resilient component sheathing with the sleeve for driving the sleeve, and a constraining component installed on a side of the resilient component and connected to the constraining portion so as to prevent the resilient component from separating from the sleeve. | 2013-01-10 |
| 20130010449 | WIRE ROUTING DEVICE - A wire routing device includes a wire housing part, a terminal housing chamber part, and a plurality of wire lead-out parts. The terminal housing chamber part includes a plurality of terminal housing chambers. Each of the wire lead-out parts couples one of the housing grooves with one of the terminal housing chambers. Each of wire surplus length absorption spaces is formed inside of a substantially rectangle abcd defined by a section bc of an outer wall of the voltage detection wire housing part located at a side of the terminal housing chamber and a section ad of a wall of the housing groove which faces the section bc, which are cut by a line ab and a line cd. | 2013-01-10 |
| 20130010450 | JUNCTION BOX - A junction box includes a cable connecting box, a cover covering the cable connecting box and a cable electrically connecting with the cable connecting box. The cable connecting box including an insulative box and a wire connecting module, the insulative box comprising a plurality of walls extending upwardly and a receiving cavity surround by the walls, the walls including a front wall defining a plurality of mounting holes for the cable passing through. The cover includes a plurality of separating walls extending downwardly from a peripheral of the cover to engage with the walls of the insulative box and a pretending wall being parallel to the separating wall and located in front of the front wall. The adding pretending wall provides a longer distance for the junction box to ensure a safe creepage distance for the user to use the junction box. | 2013-01-10 |
| 20130010451 | LASER DIODE MODULE - A laser diode module includes a laser diode, a Faraday rotator, and a polarizer. The laser diode outputs an output laser beam which is linearly polarized light and is placed in TE mode. The Faraday rotator is disposed on the optical axis of the output laser beam and rotates the polarization direction of incident light by 45°. The polarizer is disposed on the side adjacent to an optical fiber, of the Faraday rotator, and the direction of the transmission axis thereof agrees with the polarization direction of the output laser beam having passed through the Faraday rotator. No selection element configured to selectively transmit only a laser beam traveling in a particular polarization direction is disposed on the side adjacent to the laser diode, of the Faraday rotator. | 2013-01-10 |
| 20130010452 | INSTRUMENT ILLUMINATION DEVICE - Disclosed is an instrument illumination device enabling homogeneous illumination light in a broad area, without increasing the number of light sources, and thereby enhancing the freedom degree of the ornamental designing process. An instrument housing includes a bottom face having LEDs disposed thereon and an illumination area including a main illumination area having a main dial for displaying a revolution on the dial plate covering a front opening and an auxiliary illumination area having an auxiliary dial for displaying water temperature. The main illumination area is in the shape of a ring having a cut-out at a lower part thereof, and the auxiliary illumination area fills the cut-out connecting the main illumination area. Illumination light from the LEDs illuminates an entire face of the illumination area in the ring shape from a rear side thereof as backlight. | 2013-01-10 |
| 20130010453 | COLOR COMPENSATION IN LED LUMINAIRES - A luminaire in which color or brightness differences of light sources are compensated is provided. The luminaire can include several LED packages providing light to a primary optical component, which directs the light out of the luminaire. Because individual LED packages may output light at slightly different colors and/or brightness, the luminaire can include a secondary optical component having different materials that modify the color, brightness, or both of the output light. The secondary optical component can serve as a filter positioned between the LED packages (e.g., between a LED module) and the primary optical component, or between the primary optical component and the user, or above the primary optical component. The secondary optical component can be constructed by providing colorfast inks, phosphors, or quantum dots on a clear substrate or on a surface of the primary optical component. The materials can be disposed in a non-uniform manner. | 2013-01-10 |
| 20130010454 | ILLUMINATING DEVICE - An illuminating device has a light source that includes a plurality of light emitting devices and a phosphor; and a lens sheet that stays on an optical axis of the light source, the lens sheet having a plurality of prisms that is symmetrically arranged with respect to the optical axis of the light source. The plurality of prisms is configured at least on a surface of the lens sheet in which to face the light source, and a plurality of light scattering elements is configured at least on a surface of the lens sheet in which not to face the light source. | 2013-01-10 |
| 20130010455 | LIGHT SOURCE DEVICE AND SURFACE LIGHT SOURCE DEVICE EQUIPPED WITH SAME - A light source device comprising: a point light source for emitting light; a light source substrate directly mounting the point light source; a light source substrate cover having a through hole or a notch in a position to which the point light source corresponds, the light source substrate cover arranged opposite to a surface of the light source substrate on which the point light source is mounted; and a support member for supporting the light source substrate, the support member arranged to be opposed to the reverse side of the mounting surface of the light source substrate, the support member has a substantially same size with the light source substrate; wherein the light source substrate cover and the support member sandwich the light source substrate to support the light source substrate. | 2013-01-10 |
| 20130010456 | WHITE LED LAMP, BACKLIGHT, LIGHT EMITTING DEVICE, DISPLAY DEVICE AND ILLUMINATION DEVICE - A white LED lamp including: a conductive portion; a light emitting diode chip mounted on the conductive portion, for emitting a primary light having a peak wavelength of 360 nm to 420 nm; a transparent resin layer including a first hardened transparent resin, for sealing the light emitting diode chip; and a phosphor layer covering the transparent resin layer, the phosphor layer being formed by dispersing a phosphor powder into a second hardened transparent resin, and the phosphor powder receiving the primary light and radiating a secondary light having a wavelength longer than that of the primary light. An energy of the primary light contained in the radiated secondary light is 0.4 mW/Im or less. | 2013-01-10 |
| 20130010457 | Backlight Device and Liquid Crystal Display Apparatus - Provided is a backlight device having: a light source element having light emitting diodes and a lens expanding light from the light emitting diodes; a housing containing the light source element; a diffuser plate covering an opening portion of the housing; and a reflection sheet reflecting light emitted from the light source element, toward the diffuser plate. In the light source element, the plurality of light emitting diodes and a plurality of the lenses are arranged at a central zone. The luminance distribution of a portion corresponding to the light source element as seen from the diffuser plate has a central region indicating a peak value of luminance, attenuation regions in which luminance gradually attenuates from the central region toward a right end and a left end, and end regions that include a distribution portion in which luminance does not attenuate. | 2013-01-10 |
| 20130010458 | Luminaire Having a Pivotable LED - In a luminaire, comprising a light source ( | 2013-01-10 |
| 20130010459 | LED TUBE LAMP - A LED tube lamp having a base defining a channel and a driver mounted within the channel. A lighting circuit removeably attaches to the base and operatively connects to the driver. A cover removeably attaches to the base. A connector removeably attaches to the base and cover, the connector being operatively connected to the lighting circuit. | 2013-01-10 |
| 20130010460 | LED LAMP FOR HOMOGENEOUSLY ILLUMINATING HOLLOW BODIES - A lighting device ( | 2013-01-10 |
| 20130010461 | Ballast Bypass Harness Assembly For Use With A Light Emitting Diode Fluorescent Tube Replacement Bulb - A flexible ballast bypass power harness assembly for LED fluorescent tube replacement bulb for unique and exclusive new way of powering a light emitting diode fluorescent tube replacement bulb by only using the bulb plug ends to hold the Bulb in the fixture only, the power will be supplied by the harness, thus saving the time and effort to rewire and remove the ballast from the fixture. The flexible ballast bypass power harness for LED fluorescent tube replacement bulbs generally includes a wiring harness and separable electrical plug. | 2013-01-10 |
| 20130010462 | DISPLAY DEVICE - There is provided a display device including a light-emitting element package, in which a plurality of light-emitting elements emitting light of different colors are arranged vertically and horizontally, is disposed on a base substrate having a plane shape in a vertical direction and an arc shape in a horizontal direction. | 2013-01-10 |
| 20130010463 | ILLUMINATION DEVICE - An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board. | 2013-01-10 |
| 20130010464 | HIGH INTENSITY LIGHTING FIXTURE - A high intensity lamp is described herein. The lamp comprises a LED array emitting a light and a two-phase cooling apparatus. The LED array includes a plurality of LEDs. The LEDs are arranged in close proximity so that a luminous emittance from a emitter area of the LED array is at least 1000 lumens per square centimeter. The two-phase cooling apparatus is thermally coupled to the LED array. A lumen-to-weight metric of the device is at least 4000 lumens per kilogram | 2013-01-10 |
| 20130010465 | LIGHT EMITTING BULB - A light emitting bulb is provided. The light emitting bulb comprises a light source and a cover. The light source is for emitting light. The cover defines an inner space and the light source is disposed inside the cover and heat conductively connected to the cover. The cover is made of heat conductive material and capable of reflecting the light emitted by the light source into the inner space. Therein, a plurality of apertures is formed on the cover to let the light emitted by the light source disposed within the cover emit out from the apertures. | 2013-01-10 |
| 20130010466 | STAGE LIGHT FIXTURE - A stage light fixture having a casing; a supporting structure supporting the casing; and a stroboscopic light source fitted integrally to the casing. | 2013-01-10 |
| 20130010467 | FLAT LIGHTING ASSEMBLY APPARATUS AND FLAT LIGHTING MODULE - The flat lighting assembly apparatus comprises: a ceiling member; a power supply controller disposed within the ceiling member; a connector coupled to the ceiling member and electrically connected to the power supply; and a flat lighting module coupled to the connector and comprising; a frame including a base, an extension portion extending from the base, a socket disposed on a rear surface of the base, and a guide disposed on the rear surface of the base and disposed around the socket; a light source disposed on a front surface of the base; and a diffusion plate disposed on the light source and coupled to the base, wherein the connector has a insertion groove electrically connected to the socket and comprises a coupling unit coupled to the guide. | 2013-01-10 |
| 20130010468 | LED ASSEMBLY FOR A SIGNAGE ILLUMINATION - An LED light source assembly for signage illumination includes one or more planar LED arrays located with respect to a light spreading system for uniformly distributing light onto a viewing surface. The light spreading system includes a plurality of reflectors in combination with a transverse deflector disposed directly above and in the light emanating path of a planar LED array. The transverse deflector is oriented angularly and projects at least a portion of light onto a lateral reflector of the light spreading system. In one embodiment, a heat dissipation fixture is supported external to a housing assembly for improved heat management. The LED arrays and the plurality of reflectors and transverse deflectors are affixed directly to the heat dissipation fixture. | 2013-01-10 |
| 20130010469 | LIGHT STRIPE AND MANUFACTURING OF LIGHT STRIPE - Light stripe ( | 2013-01-10 |
| 20130010470 | LIGHTING DEVICE - Disclosed is a lighting device including: a body; a light emitting module which is disposed on the body; an optical member which is disposed on the light emitting module and is installed to be movable up and down; and a reflector which is disposed between the body and the optical member and reflects light emitted from the light emitting module, wherein a shape of the reflector is changed according to the moving of the optical member, and wherein a light distribution angle and a light distribution range of light passing through the optical member are variable depending on the change of the shape of the reflector. | 2013-01-10 |
| 20130010471 | Belt Tensioning Means Integrated Into Illumination Device Shell Part - The present invention discloses an illumination device comprising a base, a yoke connected to and rotatable relative to the base and a head connected to and rotatable relative to the yoke. The head comprises at least one light source generating light and the yoke comprises at least one yoke shell part and at least one motor connected to a bearing through a belt. The yoke shell part comprises belt tensioning means adapted to tighten the belt upon mounting of said yoke shell part. The present invention discloses further a method of manufacturing such illumination device. The method comprises the steps of arranging at least one motor on the yoke, arranging at least one bearing on the yoke, connecting the motor and the bearing by arranging a belt there between and arranging a yoke shell part on the and tightening the belt using said belt tensioning means. | 2013-01-10 |
| 20130010472 | ILLUMINATION DEVICE AND ASSEMBLING METHOD THEREOF - An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided. | 2013-01-10 |
| 20130010473 | LED Lighting Device - An LED lighting device, in particular an LED retrofit lamp, comprising a light-emitting means ( | 2013-01-10 |
| 20130010474 | LIMITED F-CONE LIGHT SOURCE - A shutter includes micro-optics having first and second concentrator arrays. A transducer laterally displaces one of the first and second concentrator arrays between transmissive and shuttered modes. In the transmissive mode, the arrays of concentrators are optically aligned to permit electromagnetic energy passing through the first array of concentrators to pass through the second array of concentrators. In the shuttered mode, the electromagnetic radiation is blocked from passing through the second array of concentrators. The concentrators may be compound parabolic concentrators, or lenslets positioned on opposing plates with pinholes printed therethrough. The shutter may increase f-number of radiation passing therethrough, and may be used in a limited f-cone radiation source with shuttering abilities, for example reducing f-cone of radiation output from the radiation source. | 2013-01-10 |
| 20130010475 | JACKETED LED ASSEMBLIES AND LIGHT STRINGS CONTAINING SAME - A jacketed light emitting diode assembly is provided, which includes a light emitting diode including a set of positive and negative contacts, and a lens body containing a semiconductor chip and end portions of the contacts. An electrical wire set of first and second electrical wires are connected to the positive contact and the negative contact, respectively. A light transmissive cover receives the lens body, and has an opening through which at least one of the contact set and the electrical wire set passes. An integrally molded plastic jacket at the opening of the light transmissive cover provides a seal at the opening against moisture and airborne contaminants. A waterproof light string including one or more of the jacketed light emitting diode assemblies is also provided, as are related methods. | 2013-01-10 |
| 20130010476 | LENS AND TRIM ATTACHMENT STRUCTURE FOR SOLID STATE DOWNLIGHTS - A lighting device such as a solid state downlight includes a lens structure with at least one integrally formed trim retaining element, and a trim structure including at least one lens structure engaging element, wherein the at least one lens structure engaging element is arranged to removably engage the least one trim retaining element, such as by rotating the trim structure. A generally cylindrical portion of the trim structure may be arranged to surround a central portion of the lens structure, thereby reducing or eliminating light piping and eliminating visible attachment elements for the trim structure. | 2013-01-10 |
| 20130010477 | MAGNETIC LAMPSHADE FRAME ASSEMBLY - A magnetic lampshade frame assembly comprises: a frame device, including upper and lower frames; a hood device, including a hood, a connecting strip separately formed at upper and lower positions of an internal side of the hood, and an external side of the connecting strip being fixed to the hood, and an internal side of the connecting strip being magnetically coupled to the upper frame or the lower frame, and at least one of the connecting strip and the upper frame or at least one of the connecting strip and the lower frame is made of a magnetic material, so as to achieve the effects of saving the material of the lamp, assembling or disassembly a lampshade quickly and conveniently, avoiding damages of a lampshade, providing a secured connection between the hood and the frame, and improving the texture to enhance the added value of the lamp product. | 2013-01-10 |
| 20130010478 | DECORATIVE LUMINARY - Decorative luminary for providing an aesthetically pleasing ambiance. The decorative luminary may include a shade. The shade may be disposable. The decorative luminary may also include a base. A light source may also be included as well. The present invention also relates to a method for making a decorative luminary of the present invention. | 2013-01-10 |
| 20130010479 | LED LIGHT SOURCE - The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component comprises a plurality of fins, wherein the fins contacts the contact part respectively. The control circuit module is disposed between the energy conversion component and the cooling component. | 2013-01-10 |
| 20130010480 | PARTITIONED HEATSINK FOR IMPROVED COOLING OF AN LED BULB - A light emitting diode (LED) bulb has a shell. An LED is within the shell. The LED is electrically connected to a driver circuit, which is electrically connected to a base of the LED bulb. The LED bulb also has a heatsink between the shell and base. A thermal break partitions the heatsink into an upper partition adjacent the shell and a lower partition adjacent the base. | 2013-01-10 |
| 20130010481 | LED Lampwick, LED Chip, and Method for Manufacturing LED Chip - An LED lamp core, an LED chip, and a method for manufacturing the LED chip are provided. A heat conductive core ( | 2013-01-10 |
| 20130010482 | ORGANIC LIGHT EMITTING DIODE LIGHTING APPARATUS - An organic light emitting diode (OLED) lighting apparatus includes an OLED lighting module, and a socket board for mounting the OLED lighting module, wherein the OLED lighting module includes a substrate body including an emission region and a sealing region surrounding the emission region, an OLED on the substrate body, a sealant on the sealing region of the substrate body, and including a conductive member electrically coupled to the OLED, a printed circuit board (PCB) bonded to the substrate body by the sealant for sealing and covering the OLED, and including external input terminals electrically coupled to the conductive member, and an affixing unit on the external input terminals, and wherein the socket board has a supporting unit coupled to the affixing unit for attaching the OLED lighting module thereto. | 2013-01-10 |
| 20130010483 | AUTOMOTIVE HEADLAMP CONTROL DEVICE AND METHOD - An automotive headlamp control device capable of communicating with a vehicle to adjust aiming of headlamps of the vehicle includes a detecting module, a processing module, and a communication module. The detecting module detects any changes in angle of the vehicle in real time. The processing module obtains angle changes from the detecting module, determines whether adjustment of the aiming of the headlamps being needed, generates a control signal, when an adjustment being needed, according to predetermined adjustments associated with different angle changes and being stored in the processing module , to the vehicle to control the vehicle to adjust the aiming of the headlamps accordingly, and transmits the control signal to the vehicle through the communication module. | 2013-01-10 |
| 20130010484 | AUTOMOTIVE TURN SIGNAL LAMP AND CONTROLLING METHOD FOR THE SAME - The present invention relates to an automotive turn signal lamp and a method for controlling the same, and more particularly, to an automotive turn signal lamp allowing other drivers or pedestrians to easily detect a change in the traveling direction of a vehicle or a turning direction of a vehicle at an intersection even where it is difficult to see the turn signal lamp, and a method for controlling the same. The automotive turn signal lamp includes a detection unit which detects a change in a traveling direction of a vehicle, and a control unit which operates a turn signal lamp to irradiate light of a road pattern indicating the traveling direction to be changed. | 2013-01-10 |
| 20130010485 | LIGHTING ASSEMBLY FOR VEHICLE - The invention describes a lighting assembly ( | 2013-01-10 |
| 20130010486 | VEHICLE LAMP - A vehicle lamp includes a plurality of light sources, and a light guide plate configured to emit light to the front side of the lamp from a second surface facing a first surface by internally reflecting light, which is emitted from the respective light sources, by a plurality of reflective elements formed on the first surface after causing the light to enter the light guide plate from a rear end face of the light guide plate. The light guide plate is curved to the first surface and gradually becomes thinner toward the front side. The reflective elements are disposed at a predetermined interval in a longitudinal direction and extend in a direction crossing the longitudinal direction. | 2013-01-10 |
| 20130010487 | DEVICE FOR PROCURING AN INFINITY EFFECT FOR A MOTOR VEHICLE SIGNALING LIGHT - A device and corresponding module are for a signaling light and/or lighting an exterior or interior ambient of a motor-vehicle passenger compartment including a type of light source. The device comprises an optical assembly of a first reflector including a mirror and a second reflector including a semi-transparent mirror. Light emitted by an LED is diffused in a curtain diffuser of a transparent material. Planes or mid-planes of the mirror, the semi-transparent mirror, and the diffuser are mutually parallel. Light transmitted or reflected by the assembly is transmitted and visible to an observer from a surface of the second reflector that is opposite to that facing other elements of the assembly. The diffuser includes a lighting sub-assembly arranged in space between the mirror and semi-transparent mirror and having a transparent optical material and a light source arranged for emission of light rays propagated within a thickness of the optical material. | 2013-01-10 |
| 20130010488 | VEHICLE HEADLAMP - A vehicle headlamp has a first light source disposed on a first optical axis that extends in a front-to-rear direction of a vehicle, a first lens that projects light emitted from the first light source to a front of the vehicle, a second lens having a rear focal point on a second optical axis that is parallel to the first optical axis and disposed adjacent to the first lens, a second light source disposed on the second optical axis rearwards of the first light source, a reflector that reflects light emitted from the second light source towards the rear focal point of the second lens, and a sub-reflector disposed such that the sub-reflector does not interfere with an optical path which extends from the reflector to the second lens and that causes part of light emitted from the first light source to be incident on the second lens. | 2013-01-10 |
| 20130010489 | Vehicular LED Lamp - A vehicular LED lamp includes a mounting seat and a plurality of LED light-emitting units mounted on the mounting seat. Each LED light-emitting unit includes a carrier plate having inner and outer surfaces, a circuit board engaged on the outer surface of the carrier plate, and at least one LED mounted on the circuit board and in contact with the outer surface of the carrier plate. The mounting seat includes a plurality of mounting grooves each having a bottom wall and two side walls with inclined sections. The LED light-emitting units are received in the mounting grooves of the mounting seat, with the inner surface of each carrier plate in contact with the bottom wall of an associated mounting groove, with two sides of each carrier plate abutting the inclined sections of the associated mounting groove. | 2013-01-10 |
| 20130010490 | SUPPLEMENTAL BRAKE LIGHT - The present invention is a supplemental brake light in communication with a brake of a vehicle that includes an existing brake light, a triangular or inverted triangular casing that is disposed within the existing brake light and a plurality of LED lights that are housed within the casing. A second embodiment of the supplemental brake light includes an existing brake light, a plurality of LED lights that are housed within the existing brake light and a center LED light disposed within the center of the existing brake light. A third embodiment of the supplemental brake light includes a pair of existing brake lights, a generally rectangular casing positioned between the existing brake lights and a plurality of LED lights that are disposed within the generally rectangular casing. The LED lights become brighter and flicker as the brake is increasingly depressed in all three embodiments. | 2013-01-10 |
| 20130010491 | LIGHT GUIDE PLATE AND ELECTRONIC DEVICE WITH THE SAME - A light guide plate includes two opposite plate surfaces, two sides respectively connecting the plate surfaces. A light incident surface is defined in one side for allowing light from a light source to enter the light guide plate, and a light emission surface is defined in the other side for emitting the light. The distance between the light incident surface and the light emission surface gradually decreases as the distance between the light incident surface and the light source gradually increases. | 2013-01-10 |
| 20130010492 | LAMP COMPRISING A PHOSPHOR, RADIATION SOURCE, OPTICAL SYSTEM AND HEATSINK - A lamp comprises a thin layer of phosphor ( | 2013-01-10 |
| 20130010493 | LIGHTING APPARATUS, BACKLIGHT MODULE AND DISPLAY APPARATUS - A lighting apparatus includes a light-guiding plate and a lighting unit. The light-guiding plate includes a light-incident surface and a light-emitting surface. The lighting unit includes a first light source, a second light source and a circuit board. The first and second light sources are disposed on the circuit board, and the light emitted by the first and second light sources enters into the light-guiding plate through the light-incident surface and exits the light-guiding plate through the light-emitting surface. A first distance from the first light source to a reference line of the light-incident surface is not equal to a second distance from the second light source to the reference line. | 2013-01-10 |
| 20130010494 | BACKLIGHT DEVICE, LIGHT SOURCE DEVICE, LENS, ELECTRONIC APPARATUS AND LIGHT GUIDE PLATE - Disclosed herein is a backlight device. The device includes: a light emitting element; a lens having an incident surface on which light emitted by the light emitting element is incident, and an outgoing surface which has an ability to converge the light and from which the light incident on the incident surface goes out; a light guide plate having a light incidence plane and introducing through the incidence plane the light going out from the outgoing surface, so as to perform surface light emission; and a reflective member operative to reflect a portion of the light going out from the outgoing surface of the lens, toward the incidence plane of the light guide plate. | 2013-01-10 |
| 20130010495 | LIGHT EMITTING MODULE AND ILLUMINATION SYSTEM INCLUDING THE SAME - A light emitting module is disclosed. The light emitting module includes a circuit board, a plurality of light emitting devices mounted on the circuit board and spaced apart from each other, molding parts wrapping the respective light emitting devices, and a reflective member disposed on the circuit board to surround the light emitting devices. The reflective member has a height greater than that of each of the molding parts. The reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board. | 2013-01-10 |
| 20130010496 | LED BACKLIGHT - In an edge-light type LED backlight in which visible light LED light sources and non-visible light LED light sources are mounted on a FPC in a side-view type manner and light enters a light guide plate through a side surface, in order that visible light and non-visible light are efficiently guided into the light guide plate and the efficiency of light emission is enhanced, reflective members and that reflect and guide both the visible light and the non-visible light to an entrance portion are provided on a first surface side corresponding to the mounting surface side of the FPC and a second surface side corresponding to the back surface side of the FPC. | 2013-01-10 |
| 20130010497 | DISPLAY DEVICE - A display device includes: a first chassis including a bottom surface, and a side wall which extends from an edge of the bottom surface; a light guide plate in the first chassis; a first fixing member which overlaps the side wall of the first chassis and contacts an upper surface of the light guide plate; and a first fastening member which fastens the first fixing member to the side wall of the first chassis. The first chassis includes a groove which extends through the side wall of the first chassis, the light guide plate includes a first protrusion which protrudes from an edge of the light guide plate and extends into the groove, and the first fixing member contacts an upper surface of the first protrusion of the light guide plate. | 2013-01-10 |
| 20130010498 | LIGHT GUIDE PLATE AND A BACKLIGHT DISPLAY MODULE - The present invention provides a light guide plate. The light guide plate comprises at least two daughter light guide plates and a connection member. Each daughter light guide plate disposes two locating posts respectively on two sides thereof, which can be engaged with the connection member to make the two daughter light guide plates be interconnected so that forming one large area light guide plate. The present invention also relates to a backlight display module. The light guide plate and the backlight module of the present invention has a less manufacture difficulty and a low transportation cost and can realize the use of the large area light guide plate, so that avoiding the problems of the large area light guide plate being difficult to be manufactured and having the high transportation cost in the prior art. | 2013-01-10 |
| 20130010499 | BACKLIGHT MODULE AND A BACKLIGHT DEVICE - The utility model relates to a technology field of liquid crystal display, and more particularly to a backlight module and a backlight device. The backlight module provided by the utility model comprises a light guide plate, a printed circuit board, a heat-dissipating bracket and a first retaining member. There has an optical-coupling distance between a light incidence surface of the light guide plate and the printed circuit board. The light incidence surface of the light guide plate disposes more than two light guide plate protrusions thereon. The first retaining member retains the heat-dissipating bracket, the printed circuit board and the light guide plate together to form an independent module. The technical solution of the utility model can enhance the stability of the optical-coupling distance in the backlight module, realize a simple modularization assembly, simplify a mounting process of the back plate, and improve the assembly convenience. | 2013-01-10 |
| 20130010500 | CONVERTERS AND INVERTERS FOR PHOTOVOLTAIC POWER SYSTEMS - A power system includes a plurality of DC/DC converters and a DC/AC inverter. The plurality of DC/DC converters having outputs electrically connected in parallel for supplying a DC voltage bus to an input of the DC/AC inverter. The plurality of DC/DC converters each include a maximum power point tracker (MPPT). Various DC/DC converters and DC/AC inverters suitable for use in this system and others are also disclosed. | 2013-01-10 |
| 20130010501 | BISYNCHRONOUS RESONANT SWITCHING-TYPE DIRECT CURRENT POWER SUPPLY - A bisynchronous resonant switching-type direct current power supply includes a power supply unit, a power factor correcting unit, a resonant converting unit, and a synchronous rectifying unit. The power supply unit includes a power supply circuit to receive an alternating current signal, and a rectifying-and-filtering circuit operable to obtain a direct current voltage output from the alternating current signal. The power factor correcting unit includes a voltage booster, an active power factor correcting chip circuit and two transistor control circuits. The resonant converting unit includes a power switch circuit, a resonant chip circuit, and a voltage converting circuit. The voltage converting circuit has primary and secondary windings. The synchronous rectifying unit includes first and second resonant bridge rectifier circuits and a supply voltage output circuit. | 2013-01-10 |
| 20130010502 | SWITCHING REGULATOR AND CONTROL DEVICE THEREOF - A switching regulator related to aspects of the invention can include an auxiliary winding for monitoring the voltage across the primary winding of a transformer, a differentiation detecting circuit that detects the timing of reversal start or reversal end of the signal detected by the auxiliary winding and a dead time adjusting circuit that receives a signal to trigger turn OFF of a switch or a switch and, after passing a predetermined delay time from the detection of the signal, generates a signal to trigger turn ON of the switch or the switch. The differentiation detecting circuit can confirm current transfer between body diodes. The dead time adjusting circuit can adjust a dead time to deliver the signal after a predetermined time from the confirmation of the current transfer. In some aspects of the invention, occurrence of hard switching and short-circuit current can be suppressed. | 2013-01-10 |
| 20130010503 | HYBRID CONTROL TECHNIQUES FOR SERIES RESONANT CONVERTER - A DC to DC converter system, includes inverter circuitry having a first and a second switch, the inverter circuitry further configured to generate a first and a second gate control signal, the signals configured to open and close the first and second switch, respectively, and generate an AC signal from a DC input signal. The system further includes transformer circuitry configured to transform the AC signal into a sinusoidal AC signal, second stage circuitry configured to rectify the sinusoidal AC signal to a DC output signal, and hybrid control circuitry configured to modulate the first and second gate control signals, wherein the modulation comprises pulse frequency modulation (PFM) and pulse width modulation (PWM). | 2013-01-10 |
| 20130010504 | POWER CONVERTER AND INTEGRATED DC CHOKE THEREFOR - A power conversion system and a DC link choke therefore are presented, in which a continuous core structure is provided with first and second legs around which four or more windings are located, with one or more shunt structures providing a magnetic flux path between intermediate portions of the first and second legs. | 2013-01-10 |
| 20130010505 | METHOD FOR CONTROLLING A POWER CONVERTER IN A WIND TURBINE GENERATOR - A method for controlling a power converter in a wind turbine generator, the power converter being connected to a power grid, the method comprising obtaining an alternating current (AC) line voltage at a connection point between the power converter and the power grid, obtaining a frequency of the power grid based on the AC line voltage, dynamically adapting the AC line voltage to the frequency of the power grid, generating a reference signal based on at least the frequency-adapted AC line voltage, and determining a converter control signal to be provided to the power converter based on the reference signal and the grid frequency in order to generate a power at the frequency of the power grid. Further, a wind turbine generator implementing the method is provided. | 2013-01-10 |
| 20130010506 | LEAKAGE CURRENT REDUCING APPARATUS - First windings of a first common mode transformer and second windings of a second common mode transformer are connected in series via connection lines. The windings are connected to an AC power supply via connection lines. The first windings are connected to a three-phase motor via connection lines, a converter, and an inverter. High-frequency leakage currents flowing in the connection lines are detected as a common mode voltage by a winding for common mode voltage detection. An output voltage is inputted via a filter to a voltage amplifier unit that amplifies the output voltage, and the amplified voltage is applied to a winding via a capacitor in substantially a same direction as a direction of the common mode voltage. As a result, leakage currents are reduced by induced voltages on the windings. | 2013-01-10 |
| 20130010507 | PROTECTED POWER CONVERSION DEVICE AND CONTROL METHOD - A protected power conversion device ( | 2013-01-10 |
| 20130010508 | MAIN SUPPLY ZERO CROSSING DETECTION FOR PFC CONVERTER - A fault mode of a PWM module embedded in a microcontroller is used to detect main supply zero crossings for regulating output voltage of a PFC converter operating in BCM, without using an external detecting element or a comparator, ADC or other specialized component internal to the microcontroller. In some implementations, the end of decrease current flow in the energy storage inductor of the converter is used to reinitialize a PWM timer or counter (counting-up or counting-down timer). The current goes to zero for a time period when the main supply voltage goes to zero, resulting in the PWM timer or counter not being reinitialized prior to the end of the current PWM cycle. The failure to reinitialize the timer or counter can be used to generate a signal indicative of a zero voltage crossing of the main supply voltage. | 2013-01-10 |
| 20130010509 | POWER SUPPLY DEVICE - According to one embodiment, a power supply device includes a rectifying circuit configured to rectify an alternating-current power supply, a first capacitor configured to smooth a voltage after rectification, and a falling voltage chopper circuit configured to supply electric power to a load. The first capacitor is set to a capacity in which a section where a voltage after smoothing drops to an output voltage to the load is provided in a rectified half period of the alternating-current power supply. The falling voltage chopper circuit includes at least one switching element configured to receive an input of the voltage after smoothing, operate in a section where the voltage after smoothing exceeds the output voltage, and pause in a section of the output voltage and a second capacitor provided on an output side and having a capacity larger than the capacity of the first capacitor. | 2013-01-10 |
| 20130010510 | POWER GENERATION INPUT DEVICE AND ELECTRONIC-APPARATUS USING THE POWER GENERATION INPUT DEVICE - First and second opposing ends are formed in a magnetic path forming member on which a power generation coil is wound. A rotating body has a permanent magnet, a first magnetization member and a second magnetization member. When an operating force does not act on an operating member, an end surface of the first magnetization member is opposed to the first opposing end via a gap and an end surface of the second magnetization member is opposed to the second opposing end via a gap. When the operating member is pressed, the rotating body rotates and when the force to the operating member is released, the operating member and the rotating body return. Since the rotating body and the magnetic path forming member do not come into contact with each other, the force required to operate the operating member is relatively weak and large electromotive force can be obtained. | 2013-01-10 |
| 20130010511 | OUTPUT INDUCTOR VOLTAGE REGULATION - A power supply system and method are disclosed. The system includes a switching stage to provide an output current through an output inductor in response to a switching signal having a substantially fixed duty-cycle. The system also includes a load monitor to monitor a load of the power supply system. The system further includes a gate drive controller to generate the switching signal and to change operation of the switching stage from a normal operating mode to a light-load operating mode in response to the load being less than a predetermined threshold to substantially minimize a voltage across the output inductor in the light-load operating mode. | 2013-01-10 |
| 20130010512 | DC-AC CONVERTER - Disclosed is a DC-AC converter including a switch circuit for converting the DC power to output an AC voltage between a first output terminal and a second output terminal. The switch circuit includes a first switch branch having a first switch element and a second switch element; a second switch branch having a third switch element, a fourth switch element, and a fifth switch element; and a sixth switch element having one end connected between the third switch element and the fourth switch element and the other end connected between the first switch element and the second switch element. The first switch element, the second switch element, the third switch element, the fourth switch element, the fifth switch element, and the sixth switch element are configured to turn on/off to enhance the conversion efficiency of the DC-AC converter and subdue the occurrence of leak current in the DC-AC converter. | 2013-01-10 |
| 20130010513 | CONTENT ADDRESSABLE MEMORY - An entry including multiple bits of unit cells each storing data bit is coupled to a match line. The match line is supplied with a charging current having a restricted current value smaller than a match line current flowing in a one-bit miss state in one entry, but larger than a match line current flowing in an all-bit match state in one entry. A precharge voltage level of a match line is restricted to a voltage level of half a power supply voltage or smaller. Power consumption in a search cycle of a content addressable memory can be reduced, and a search operation speed can be increased. | 2013-01-10 |
| 20130010514 | SEMICONDUCTOR MODULE HAVING MODULE SUBSTRATE AND PLURAL SEMICONDUCTOR DEVICES MOUNTED THEREON - Disclosed herein is a semiconductor module that includes a module substrate and a plurality of semiconductor devices mounted on the module substrate. Among the semiconductor devices, two of the semiconductor devices adjacent in a first direction differ in a mounting direction by 180°. Among the semiconductor devices, two of the semiconductor devices adjacent in a second direction perpendicular to the first direction differing in a mounting direction by 180°. | 2013-01-10 |
| 20130010515 | SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM - A method includes preparing a chip-stack structure in which a first memory chip is stacked over a first main surface of a second memory chip, data electrodes of the first and second memory chips being electrically connected and a data signal outputted from the data electrode of the first memory chip being conveyed on a side of the second main surface of the second memory chip, accessing the first memory chip so that the data signal is outputted from the first memory chip and appears on the side of the second main surface of the second memory chip in first access time, accessing the second memory chip so that a data signal is outputted and appears on the side of the second main surface of the second memory chip in second access time, and setting output timing adjustment information into at least one of the first and second memory chips. | 2013-01-10 |
| 20130010516 | MEMORY CHIP WITH MORE THAN ONE TYPE OF MEMORY CELL - A semiconductor memory chip that has word lines driven by respective word line drivers and bit lines to carry signals to respective bit line amplifiers/drivers with memory cells at intersections of the word lines and bit lines memory cells. The semiconductor memory chip including various memory cell types, the type of memory cell at an intersection based on a position of the intersection among the word lines and bit lines. | 2013-01-10 |
| 20130010517 | SELF-DISABLING CHIP ENABLE INPUT - A multi-die memory package may have separate chip enable inputs for the respective memory dice. Individual chip enable inputs may be separated by other chip connections such as power and ground. The memory dice may include multiple chip enable inputs to allow easy wire bonding of the individual chip enable inputs to a die without requiring any jumpers within the package. Circuitry may be included so that undriven chip enable inputs are masked and driven chip enable inputs may be propagated to the memory die to enable memory accesses while a single chip enable input is only connected to the capacitance of a single bonding pad. | 2013-01-10 |
| 20130010518 | ANTI-FUSE MEMORY ULTILIZING A COUPLING CHANNEL AND OPERATING METHOD THEREOF - An anti-fuse memory with coupling channel is provided. The anti-fuse memory includes a substrate of a first conductive type, a doped region of a second conductive type, a coupling gate, a gate dielectric layer, an anti-fuse gate, and an anti-fuse layer. The substrate has an isolation structure. The doped region is disposed in the substrate. A channel region is defined between the doped region and the isolation structure. The coupling gate is disposed on the substrate between the doped region and the isolation structure. The coupling gate is adjacent to the doped region. The gate dielectric layer is disposed between the coupling gate and the substrate. The anti-fuse gate is disposed on the substrate between the coupling gate and the isolation structure. The anti-fuse gate and the coupling gate have a space therebetween. The anti-fuse layer is disposed between the anti-fuse gate and the substrate. | 2013-01-10 |
| 20130010519 | SYSTEM AND METHOD FOR UPDATING READ-ONLY MEMORY IN SMART CARD MEMORY MODULES - A storage device contains a smart-card device and a memory device, both connected to a controller. The storage device may be used in the same manner as a conventional smart-card device, or it may be used to store a relatively large amount of data in various partitions. One of these partitions may be a read-only partition that is normally accessible only for read accesses. However, it may sometimes be necessary to update or supplement the data stored in the read-only partition. This is accomplished by a host issuing an appropriate command to the storage device, which may be accompanied by an identifier for an appropriate level of authorization. The controller then changes the attribute of the read-only partition from “read-only” to “read/write” to allow data to be written to the partition. Upon completion, the controller changes the attribute of the partition back to read-only. | 2013-01-10 |
| 20130010520 | MEMORY DEVICE AND FABRICATING METHOD THEREOF - According to one embodiment, a memory device includes first interconnects, second interconnects, and a first memory cell. The first memory cell is located in an intersection of one of the first interconnects and one of the second interconnects. The first memory cell includes a first multilayer structure and a first variable resistance layer, the first multilayer structure including a first electrode, a first selector, and a first insulator which are stacked. The first selector and the first variable resistance layer are electrically connected in series between the one of the first interconnect and the one of the second interconnect. The first variable resistance layer is formed on a portion of a side surface of the first insulator to cover the portion without covering a residual portion. | 2013-01-10 |
| 20130010521 | SYSTEMS AND METHODS FOR ROW-WIRE VOLTAGE-LOSS COMPENSATION IN CROSSBAR ARRAYS - Embodiments of the present invention are directed systems and methods for reading the resistance states of crossbar junctions of a crossbar array. In one aspect, a system includes one or more sense amplifiers ( | 2013-01-10 |
| 20130010522 | NONVOLATILE MEMORY DEVICE AND METHOD FOR PROGRAMMING NONVOLATILE MEMORY ELEMENT - A nonvolatile memory device ( | 2013-01-10 |
| 20130010523 | MEMORY SYSTEM WITH DATA LINE SWITCHING SCHEME - A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines (e.g. bit lines) of a first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines that are connected to control circuitry. To increase the performance of memory operations, the second selection circuits can change their selections independently of each other. | 2013-01-10 |
| 20130010524 | MEMORY CELL - Methods, and circuits, are disclosed for operating a programmable memory device. One method embodiment includes storing a value as a state in a first memory cell and as a complementary state in a second memory cell. Such a method further includes determining the state of the first memory cell using a first self-biased sensing circuit and the complementary state of the second memory cell using a second self-biased sensing circuit, and comparing in a differential manner an indication of the state of the first memory cell to a reference indication of the complementary state of the second memory cell to determine the value. | 2013-01-10 |
| 20130010525 | REACTIVE METAL IMPLATED OXIDE BASED MEMORY - Methods, devices, and systems associated with oxide based memory can include a method of forming an oxide based memory cell. Forming an oxide based memory cell can include forming a first conductive element, forming an oxide over the first conductive element, implanting a reactive metal into the oxide, and forming a second conductive element over the oxide. | 2013-01-10 |
| 20130010526 | MULTI-LEVEL MEMORY CELL - Some embodiments include a memory device and methods of forming the same. The memory device can include an electrode coupled to a memory element. The electrode can include different materials located at different portions of the electrode. The materials can create different dielectrics contacting the memory elements at different locations. Various states of the materials in the memory device can be used to represent stored information. Other embodiments are described. | 2013-01-10 |
| 20130010527 | RESISTIVE MEMORY - The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states. | 2013-01-10 |
| 20130010528 | SENSING RESISTANCE VARIABLE MEMORY - The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (R | 2013-01-10 |
| 20130010529 | NONVOLATILE MEMORY ELEMENT, MANUFACTURING METHOD THEREOF, NONVOLATILE MEMORY DEVICE, AND DESIGN SUPPORT METHOD FOR NONVOLATILE MEMORY ELEMENT - A nonvolatile memory element includes a variable resistance layer located between a lower electrode and an upper electrode and having a resistance value that reversibly changes based on electrical signals applied between these electrodes. The variable resistance layer includes at least two layers: a first variable resistance layer including a first transition metal oxide; and a second variable resistance layer including a second transition metal oxide and a transition metal compound. The second transition metal oxide has an oxygen content atomic percentage lower than an oxygen content atomic percentage of the first transition metal oxide, the transition metal compound contains either oxygen and nitrogen or oxygen and fluorine, and the second transition metal oxide and the transition metal compound are in contact with the first variable resistance layer. | 2013-01-10 |
| 20130010530 | METHOD FOR DRIVING NON-VOLATILE MEMORY ELEMENT, AND NON-VOLATILE MEMORY DEVICE - Provided is a method for driving a non-volatile memory element in which a variable resistance element including a first electrode, a second electrode, and a variable resistance layer capable of reversibly changing between a high resistance state and a low resistance state with application of electrical signals having different polarities is connected in series with a current steering element having bidirectional rectifying characteristics with respect to an applied voltage. After the non-volatile memory element is manufactured, the resistance value of the variable resistance layer is reduced from a resistance value in the initial resistance state higher than that in the high resistance state by applying, to the non-volatile memory element, a voltage pulse having the polarity identical to that of the voltage pulse for changing the variable resistance layer from the low resistance state to the high resistance state in the normal operations. | 2013-01-10 |
| 20130010531 | MEMORY CIRCUIT AND WORD LINE CONTROL CIRCUIT - The invention provides a memory circuit. In one embodiment, the memory circuit comprises a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second PMOS transistor, and a memory cell array. The first PMOS transistor is coupled between a first voltage terminal and a first node. The second PMOS transistor is coupled between the first voltage terminal and a second node. The first NMOS transistor is coupled between a third node and a second voltage terminal. The second NMOS transistor is coupled between a fourth node and the second voltage terminal. The memory cell array comprises a plurality of memory cells, at least one comprising a first inverter and a second inverter. A positive power terminal of the first inverter is coupled to the first node, a negative power terminal of the first inverter is coupled to the third node, a positive power terminal of the second inverter is coupled to the second node, and a negative power terminal of the second inverter is coupled to the fourth node. | 2013-01-10 |
| 20130010532 | MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY USING THE SAME - According to one embodiment, a magnetoresistive element includes first and second magnetic layers and a first nonmagnetic layer. The first magnetic layer has an axis of easy magnetization perpendicular to a film plane, and a variable magnetization. The second magnetic layer has an axis of easy magnetization perpendicular to a film plane, and an invariable magnetization. The first nonmagnetic layer is provided between the first and second magnetic layers. The second magnetic layer includes third and fourth magnetic layers, and a second nonmagnetic layer formed between the third and fourth magnetic layers. The third magnetic layer is in contact with the first nonmagnetic layer and includes Co and at least one of Zr, Nb, Mo, Hf, Ta, and W. | 2013-01-10 |
| 20130010533 | DESCENDING SET VERIFY FOR PHASE CHANGE MEMORY - Subject matter disclosed herein relates to a memory device, and more particularly to write performance of a phase change memory. | 2013-01-10 |
| 20130010534 | Memory Element and Semiconductor Device and Method for Manufacturing the Same - It is an object to solve inhibition of miniaturization of an element and complexity of a manufacturing process thereof. It is another object to provide a nonvolatile memory device and a semiconductor device having the memory device, in which data can be additionally written at a time besides the manufacturing time and in which forgery caused by rewriting of data can be prevented. It is further another object to provide an inexpensive nonvolatile memory device and semiconductor device. A memory element is manufactured in which a first conductive layer, a second conductive layer that is beside the first conductive layer, and conductive fine particles of each surface which is covered with an organic film are deposited over an insulating film. The conductive fine particles are deposited between the first conductive layer and the second conductive layer. | 2013-01-10 |
