Class / Patent application number | Description | Number of patent applications / Date published |
156703000 | Using solvent during delaminating (e.g., water dissolving adhesive at bonding face during delamination, etc.) | 32 |
20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
20120000613 | DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER - Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with: | 01-05-2012 |
20120018098 | Removable Adhesive Label Containing Inherently Shrinkable Polymeric Film - An adhesive label includes a polymeric first film layer that is nonoriented and has a significant inherent shrinkage when heated above ambient temperature. The label is useful in various labeling applications and especially adhesive labeling of reusable and recyclable containers which require removal of the label during a washing process in a warm or hot washing fluid. | 01-26-2012 |
20120247685 | SYSTEM AND METHOD FOR IMPROVED EPITAXIAL LIFT OFF - An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced. | 10-04-2012 |
20130000852 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 01-03-2013 |
20130008613 | Removable Adhesive Label Containing High Tensile Modulus Polymeric Film Layer - An adhesive label includes a polymeric first film layer that has a high tensile modulus. The label is useful in various labeling applications and especially in adhesive labeling of reusable and recyclable containers which require removal of the label during a washing process in a warm or hot washing fluid. | 01-10-2013 |
20130025796 | DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE - Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate. | 01-31-2013 |
20130048221 | Adhesive Acrylate-Olefin Copolymers, Methods for Producing Same and Compositions Utilizing Same - The present invention relates to an adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), or others of all plastic types), or even glass bottles. In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled. | 02-28-2013 |
20130139972 | METHOD FOR STRIPPING A WAFER FROM A CARRIER - Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means. | 06-06-2013 |
20130213581 | LABELS - The present invention provides a film of an oriented material which exhibits the property of expansion in at least one of its machine and transverse directions at a first temperature and of shrinkage at a second, higher, shrink onset temperature, the film having been annealed after orientation at a temperature above the first temperature and selected with reference to an intended recycling wash-off process to promote expansion of the film at the selected temperature of the wash-off process. | 08-22-2013 |
20130276990 | DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE - Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate. | 10-24-2013 |
20130340947 | DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 12-26-2013 |
20140069587 | Labels Compatible with Recycling - The present invention relates to adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), recycled polyethylene terephthalate (rPET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), polyesters, recycled polyesters, polylacticacid (PLA), biopolymers, cellulose or other types of polymers or plastics). In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled and/or subjected to multi-generational recycling. | 03-13-2014 |
20140076499 | Compositions And Methods For Selective Deposition Modeling - There is provided compositions and methods for producing three-dimensional objects by selective deposition modeling with a polar build material and a non-polar support material. The build material comprises a hydrocarbon wax material and a viscosity modifier, and the support material comprises a hydrocarbon alcohol wax material and a viscosity modifier. After the selective deposition modeling process has been completed, the object can be placed in a bath of polar solvent to remove the support material. The particular materials provided herein, and the post-processing methods associated therewith, provide for improved part quality of the three-dimensional object and for improved post-processing techniques. The three-dimensional objects can subsequently be used in a number of applications, such as patterns for investment casting. | 03-20-2014 |
20140130986 | WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD - A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank. | 05-15-2014 |
20140144591 | METHOD FOR SEPARATION OF RUBBER FROM METAL - A method for separating metal-rubber bonded parts can save money, time, ecology and doesn't change the quality and structure of the metal. The method uses heated oil to easily separate rubber from metal parts without damaging the part or requiring restoration thereof. | 05-29-2014 |
20140251547 | EPITAXIAL LIFT OFF SYSTEMS AND METHODS - Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process. | 09-11-2014 |
20140262052 | DETAPING PROCESS FOR FOILS TAPED ON SEMICONDUCTOR WAFERS - The invention concerns a detaping process for a protective foil taped onto a front-side of a semiconductor wafer, this detaping process comprising the successive steps of:
| 09-18-2014 |
20150013917 | PROCESSING METHOD AND PROCESSING APPARATUS - A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. | 01-15-2015 |
20150053352 | APPARATUS AND METHOD FOR SEPARATING A STACKED ARRANGEMENT - In various embodiments, an apparatus for separating a stacked arrangement including a first layer, a second layer and a release layer between the first layer and the second layer may be provided. The apparatus may include an attachment surface configured to suspend the stacked arrangement by attaching to the first layer. The apparatus may further include an actuating mechanism configured to form a curvature of the first layer by bending the attachment surface. The apparatus may also include a holder to hold an etchant for etching the release layer to separate the first layer from the second layer. | 02-26-2015 |
20150096690 | METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 04-09-2015 |
20150325465 | SUPPORTING MEMBER SEPARATION METHOD - A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment. | 11-12-2015 |
156704000 | Using specified organic delamination solvent | 10 |
20110240231 | STRIPPING METHOD AND STRIPPING SOLUTION - A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent. | 10-06-2011 |
20110259528 | Method and additive composition for spraying water to prevent dust scattering - [Object] To provide an additive for dust scattering preventing coating water of which the coating water can permeate into a mineral-fiber-containing installation layer of asbestos, etc., to suppress scattering of dust and thereby enable stripping removal of the mineral-fiber-containing installation layer to be performed efficiently, at low cost, and safely. | 10-27-2011 |
20110308737 | TREATMENT OF SYNTHETIC QUARTZ GLASS SUBSTRATE - A synthetic quartz glass substrate having a resist film coated thereon is treated by immersing it in a terpene-containing solvent until the resist film is released, and rinsing the substrate with water. | 12-22-2011 |
20120103535 | EXFOLIATION OF GRAPHENE BY MULTILAYER COEXTRUSION - Exfolilation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material. | 05-03-2012 |
20120118510 | METHOD FOR DEBONDING COMPONENTS IN A CHAMBER - Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components. | 05-17-2012 |
20120312480 | Mechanical abrasive surface conditioning for wallcovering removal - The present invention provides a system and method of mechanical abrasive surface conditioning for wallcovering removal. The method employs a system of mechanized sanding tools and dust collection means that are used to prepare a wallcovering surface for application of an adhesive removing mixture that allows for relatively quick and easy removal of various kinds, styles, ages, etc. of wallcoverings with a minimum of time, effort, and damage to the underlying wall. A key component to the system is the proper marriage of sanding tools utilizing relatively course grit size and the application of the random orbital and/or oscillating motion. The system can thereby reduce the physical effort required to properly abrade the wallcovering surface in order to allow a wetting solution to adequately penetrate the wallcovering such that removal of the wallcovering can be accomplished more easily. | 12-13-2012 |
20130032296 | CLEANING COMPOSITION FOR TEMPORARY WAFER BONDING MATERIALS - A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates. | 02-07-2013 |
20130118691 | Methods and Systems for Recycling of Laminated Materials - In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. | 05-16-2013 |
20130319618 | Separating Fluid, Method And System For Separating Multilayer Systems - A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof. | 12-05-2013 |
20150027642 | METHOD FOR ISOLATING FLEXIBLE FILM FROM SUPPORT SUBSTRATE - Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated. | 01-29-2015 |