Class / Patent application number | Description | Number of patent applications / Date published |
324756050 | With electrical connectors | 45 |
20100327899 | DESIGN SUPPORT APPARATUS AND DESIGN SUPPORT METHOD - According to one embodiment, a design support apparatus includes a first detector configured to detect a cable connected to the printed circuit board, a second detector configured to detect a conducting component from components of a housing, a third detector configured to detect an electromagnetic wave radiating component from electronic components mounted on the printed circuit board, a fourth detector configured to detect a path which propagates the electromagnetic waves, a first setting module configured to set, as sources, the electromagnetic wave radiating component and the path, a second setting module configured to set, for the sources, intensity attributes corresponding to an operation clock frequency of the electromagnetic wave radiating component, a calculator configured to calculate spaces of the sources, the spaces includes volumes corresponding to the intensity attributes, and a determining module configured to determine whether at least one of the cable passes at least one of the spaces. | 12-30-2010 |
20110025361 | HIGH PERFORMANCE PROBE SYSTEM - A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. | 02-03-2011 |
20110095779 | ELECTRICAL CONNECTING APPARATUS AND TESTING SYSTEM USING THE SAME - An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled. | 04-28-2011 |
20110109341 | Apparatus for Contacting a T/R Module with a Test Device - An apparatus for making contact between a T/R module and a test device, the apparatus including a mechanically guided contact-making unit having a plurality of contact elements for contacting the T/R module. A triplate line substrate is arranged is electrically connected to the T/R module, via which the RF signals can be passed to the test device. One or more register pins for defined alignment of the T/R module with respect to the contact-making unit and a fixing unit for mechanical fixing of the T/R module are provided. A shifting device has a plurality of inclined planes that convert a shifting movement of the shifting device to a movement of the contact-making unit toward the T/R module at right angles to the shifting direction. When the contact-making unit reaches a defined final position the contact is made with the T/R module via the contact elements in one process. | 05-12-2011 |
20110133768 | TEST WAFER UNIT AND TEST SYSTEM - Provided is a test wafer unit that tests a plurality of devices under test formed on a wafer under test, the test wafer unit comprising a plurality of test circuits that are formed on the same semiconductor wafer, where a plurality of types of the test circuits having different functions are provided for each device under test; and a selecting section that selects which type of test circuit is electrically connected to each pad of a device under test. Therefore, the test wafer unit can select the test circuit corresponding to testing content to be performed and connect this test circuit to the device under test to perform testing on a variety of devices under test or to perform a variety of tests on a device under test. | 06-09-2011 |
20110148451 | WIRING BOARD FOR TESTING LOADED PRINTED CIRCUIT BOARD - A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin electrically connected to the external analyzer. | 06-23-2011 |
20110163775 | UNIVERSAL FRONT/BACK POST TERMINAL BLOCK AND TEST LINK - A terminal board is part of a terminal board assembly for terminating and testing of railroad wires. The board includes a first terminal block with a front post and a back post installed on a plane, along with a plurality of terminal blocks with front posts. A control test link, with an insulating material lining one of three holes, is installed on the front posts of terminal blocks. A test nut, connectable to the front post of the first terminal block, has a face with a depression formed therein to contact the test link when installed on the front post of the first terminal block over the insulating material. First wiring is attached on the plane's front, and second wiring is terminated on the plane's back. A surge protection component and the control test link are pre-installed on the front of the plane, providing for easy removal. | 07-07-2011 |
20110187401 | Test Couplet With Strip Conductor Technology - A test coupler for supplying a device under test with test signals contains a first coaxial connector, a waveguide port, and a first strip conductor. Test signals of a lower frequency range are supplied to the first coaxial connector. Test signals of an upper frequency range are supplied to the waveguide port. The test coupler guides the test signals on the first strip conductor to the device under test. | 08-04-2011 |
20110199112 | DETERMINATION OF PROPERTIES OF AN ELECTRICAL DEVICE - To determine electrical properties of an electrical device ( | 08-18-2011 |
20110260745 | CONNECTOR ATTACHING/DETACHING APPARATUS AND TEST HEAD - The connector attaching/detaching apparatus includes a plurality of fitting members that causes connectors to fit with or separate from one another by sliding, guiding members that sequentially causes the plurality of fitting members to slide by moving in an arrangement direction of the fitting means, and a moving apparatus that causes the guiding members to move in the arrangement direction of the fitting members. | 10-27-2011 |
20110279140 | Connector And Semiconductor Testing Device Having The Same - To provide a connector wherein ground terminals can be designed easily, which not only suppresses the occurrence of impedance mismatch and crosstalk, but which does not lead to interferences between contacting portions. A ground terminal for a connector has a cylindrical main body. A plurality of contacting portions, for contacting a circuit board, are formed on the bottom edge of the cylindrical main body. The ground terminal has, as contacting portions, inner contacting portions and outer contacting portions. The inner contacting portions extend toward the inside of the cylindrical main body and in the downward direction, and the outer contacting portions extend toward the inside of the cylindrical main body and in the downward direction. | 11-17-2011 |
20110316577 | SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE - A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction. | 12-29-2011 |
20120032698 | Test Device and Test Method for Multimedia Data Card and Mobile-Phone Multimedia Data Card - The present invention discloses a test device and test method for a multimedia data card and the multimedia data card of a mobile phone, wherein, the test device includes a printed circuit board (PCB) and the PCB is equipped with a detachable connection slot module which is used for connecting with each module to be tested; the test device for the multimedia data card includes a micro-connector and one end of the micro-connector connects with the connection slot module; the other end of the micro-connector connects with a PCB tester; the related data are transmitted to the PCB tester through the connection slot module and the micro-connector. By the present invention, the PCB can be tested once the PCB tester connects with the micro-USB-connector; the plug is convenient; operations such as windowing and positioning are not needed; test efficiency is improved; and the cost of developing test fixture for connecting these test points and the cost of test and manufacture are reduced. | 02-09-2012 |
20120119774 | ELECTRICAL TESTING APPARATUS FOR TESTING AN ELECTRICAL TEST SAMPLE AND ELECTRICAL TESTING METHOD - An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate which is electrically connected via a contact spacing converter to a test head. The conductor substrate is mechanically connected to a first stiffening device and is thereby stiffened. At least one spacer which penetrates the conductor substrate is mechanically connected to the contact spacing converter and is held on the first stiffening device via at least one tilt adjusting arrangement. | 05-17-2012 |
20120133385 | TEST APPARATUS, CIRCUIT MODULE AND MANUFACTURING METHOD - An apparatus comprising a test circuit that is provided on a test substrate and tests the device under test; a sealing section that covers a region of the test substrate on which the test circuit is formed, and seals the test circuit to form a sealed space that is filled with a cooling agent; and a through-connector that passes through the sealing section and electrically connects the test circuit to an element provided outside the sealing section, such that the connection is not through the test substrate. | 05-31-2012 |
20120176151 | Test Contact System For Testing Integrated Circuits With Packages Having An Array Of Signal and Power Contacts - A test fixture ( | 07-12-2012 |
20120217988 | FLEXIBLE TEST FIXTURE - A system for testing an electronic circuit board (ECB) having a plurality of test points in a pre-defined arrangement on a measurement device having a plurality of resources includes an interface fixture having a plurality of contact pads arranged in an array on a first surface. The contact pads can be electrically coupled to the plurality of resources of the measurement system according to a pre-defined pattern, where at least two of the contact pads are electrically coupled to one of the plurality of resources in a many-to-one relationship. The system also includes a test fixture removably attached to the first surface of the interface fixture. The test fixture includes an upper probe plate having a plurality of openings and a lower probe plate parallel to the upper probe plate. | 08-30-2012 |
20120242364 | FLEXIBLE CONNECTING CABLE FOR ELECTRICALLY CONNECTING A TRANSDUCER AND A TRANSMITTER OF A MEASUREMENT MODULE - The invention relates to a connection cable for an electric connection of a measuring sensor and an evaluation electronics package of a measuring module. More specifically, the present invention relates to a module for fill level measuring technology, with the connection cable being designed as a flexible circuit board with at least one conductor path. The invention moreover relates to a measuring module with a connection cable according and having a housing to accommodate a measuring sensor and an evaluation electronics circuit. According to the invention, it is provided that the circuit board is designed with first and second circuit board end sections and a number of 2n+1 (n≧1) circuit board sections of essentially the same length lying in between, the circuit board end sections being designed as connection points projecting above bending sections opposite in the direction of the circuit board sections. | 09-27-2012 |
20120268156 | TEST CARRIER - A test carrier | 10-25-2012 |
20120319717 | METHOD AND APPARATUS FOR 3D IC TEST - An apparatus comprises a die comprising a plurality of switch/router circuits; and a plurality of additional dies. Each respective one of the plurality of additional dies comprises: a respective network interface, which is electrically coupled to a respective one of the plurality of switch/router circuits; and a respective interconnection test logic, which is electrically coupled to the respective network interface and the interconnection test logic in at least one other one of the plurality of additional dies. | 12-20-2012 |
20130009660 | ELECTRICAL CONNECTING DEVICE - An electrical connecting device is provided. The electrical connecting device comprises at least one jig for electrically connecting and clamping at least one electrode of at least one electrical component. The jig comprises a first clamping portion, a second clamping portion and a first detecting elastic sheet. The second clamping portion is disposed opposite to the first clamping portion. The electrode is adapted to be electrically connected to and clamped between the first clamping portion and the second clamping portion. The first detecting elastic sheet is fixed with the first clamping portion. The first detecting elastic sheet is connected to a first sensor and formed with a first contact portion. The first sensor is used for sensing a first parameter of the electrical component and the first contact portion is used for contacting the electrode. | 01-10-2013 |
20130229201 | TEST ASSEMBLY FOR VERIFYING HEAT SPREADER GROUNDING IN A PRODUCTION TEST - A test assembly ( | 09-05-2013 |
20130229202 | POWER TEST APPARATUS FOR POWER SUPPLY - A power test board for a power supply includes a main board and a load circuit. The load circuit includes at least one switch, at least one control circuit, and at least one load resistor. A number of the load resistor being same with a number of the control circuit, each load resistor is electronically connected to one of the at least one control circuit. Toggling of the at least one switch to electronically connect to the control circuit causes the control circuit to be electronically connected to the power supply, the at least one control circuit is turned on, and the at least one load resistor is activated to serve as a load of the power supply. | 09-05-2013 |
20130271176 | Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface. | 10-17-2013 |
20140021977 | Storage Device Test System - A storage device test system includes: a storage device mounting unit configured to mount a storage device therein; a test control unit configured to transmit and/or receive test signals to and/or from the storage device; an interface plug that is electrically connected to the test control unit and coupled to the storage device mounted in the storage device mounting unit; and a plugging driving unit that controls a relative location between the interface plug and the storage device mounting unit. By using the storage device test system, the causes of defects that may occur while using a storage device may be easily detected. | 01-23-2014 |
20140084956 | PROBE HEAD TEST FIXTURE AND METHOD OF USING THE SAME - Various probe testing load board structures and methods of using the same are disclosed. In one aspect, a method of testing a load board of a probe testing system is provided. The method includes electrically engaging a shorting substrate with conductor structures of the load board. The shorting substrate is operable to establish one or more electrical pathways between the tester and at least one electronic component of the load board. An electrical test is performed on the at least one electronic component using the one or more electrical pathways. | 03-27-2014 |
20140167807 | PROBE FRAME FOR ARRAY SUBSTRATE DETECTING APPARATUS AND DETECTING APPARATUS HAVING THE SAME - The present invention discloses a probe frame for an array substrate detecting apparatus, the probe frame including a frame body and a signal distribution circuit board provided to the frame body, wherein the probe frame further includes: a circuit board provided to the frame body, the circuit board being provided with through holes, and the circuit board being provided therein with a plurality of signal transmission wires in a one to one correspondence with the through holes, one end of each signal transmission wire is inserted into its respective through hole and the other end thereof is electrically connected with an output end of the signal distribution circuit board; and a plurality of probes in a one to one correspondence with the through holes, wherein for each pair of the probe and the through hole, one end of the probe is inserted into the through hole so as to be electrically connected with the signal transmission wire within the through hole. Electrical connection between respective probes and the signal distribution circuit board are achieved through signal transmission wires in the circuit board, wiring on the probe frame is simple, and stability in signal connections between probes and the signal distribution circuit board can be improved. The present invention further provides an array substrate detecting apparatus including the above probe frame. | 06-19-2014 |
20140253167 | MEMORY CHIP TESTING SYSTEM AND CONNECTOR THEREOF - A memory chip testing system includes a computer, a rheostat, a voltmeter, and a connector. The computer includes a main board, a number of memory chip interfaces mounted on the main board. The computer runs a testing software to test the stability of a memory chip under different working voltages. The connector includes an insulating substrate and a number of conductive posts. The posts with ends fixed in the insulating substrate and arranged according to the pins of the memory chip interface. The connecter is connected to the pins of one of the number of the memory chip interfaces when testing a memory chip. The rheostat and the voltmeter are electrically connected to selected conductive posts on the insulating substrate, the rheostat adjusts the work voltage of the memory chip, and the voltmeter indicates the work voltage of the memory chip. | 09-11-2014 |
20140266284 | ISOLATION TESTING OF SEMICONDUCTOR DEVICES - Methods and apparatus for isolation testing of semiconductor devices are disclosed. One example apparatus may include an interface portion for making electrical contact with packaged semiconductor devices under test. The interface portion may include an insulating support configured and dimensioned to support multiple semiconductor device packages, each semiconductor device package having a plurality of electrical contacts. The interface portion may further include a first electrically conductive surface to electrically contact a first proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the interface portion and a second electrically conductive surface to electrically contact a second proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the insulating support. | 09-18-2014 |
20140266285 | INTEGRATED CIRCUIT TESTING ARCHITECTURE - In accordance with one aspect of the present description, an interface between an integrated circuit device and a test controller for testing the integrated circuit device includes a plurality of boards coupled together. In one embodiment, the test interface includes a plurality of interchangeable auxiliary boards, each having test circuitry, which may be coupled to a primary board and reused as appropriate to test various integrated circuits. Other aspects are described. | 09-18-2014 |
20140292365 | ELECTRICAL CIRCUIT TESTING - An electronics system module includes a primary electrical circuit including input connectors and output connectors and a filter circuit connected between the primary electrical circuit and ground. The module also includes a switch element connected between the primary electrical circuit and ground. The switch element is configured to be engaged by a test connector to open the switch to disconnect the primary electrical circuit from ground. The test connector includes electrical connectors configured to connect to the input connectors and the output connectors of the primary electrical circuit. The switch element is configured to automatically close based on the test connector being disengaged from the switch element | 10-02-2014 |
20140347086 | METHOD AND APPARATUS FOR MULTI-PLANAR EDGE-EXTENDED WAFER TRANSLATOR - An apparatus, suitable for coupling a pads of integrated circuits on wafer to the pogo pins of a pogo tower in a test system without the need of a probe card, includes a body having a first surface and a second surface, the body having a substantially circular central portion, and a plurality of bendable arms extending outwardly from the central portion, each bendable arm having a connector tab disposed at the distal end thereof; a first plurality of contact terminals disposed on the second surface of the central portion of the body, the first plurality of contact terminals arranged in pattern to match the layout of pads on a wafer to be contacted; at least one contact terminal disposed on the first surface of the plurality of connector tabs; and a plurality of electrically conductive pathways disposed in the body such that each of the first plurality of contact terminals is electrically connected to a corresponding one of the contact terminals on the first surface of the connector tabs. | 11-27-2014 |
20150109017 | TEST SYSTEM FOR HIGH-VOLTAGE COMPONENTS - An exemplary test arrangement for in-situ partial discharge measurements in distribution transformers has at least one test system with a plurality of test components including: an AC voltage source for producing a variable test voltage with a measuring apparatus for recording current pulses caused by partial discharge and with an evaluation apparatus for the recorded current pulses, a grounded test container in which at least some of the test components are arranged, and a distribution transformer connected to the AC voltage source as a test object. The test object is arranged on insulation means for electrically insulating the test object. Those parts of the test object which are grounded during normal operation being connected at least to the potential of the grounded test container. | 04-23-2015 |
20150123692 | APPARATUS AND METHOD OF TESTING AN ELECTRONIC DEVICE - An apparatus for testing an electronic device may include a field programmable gate array (FPGA), a test board, a test channel and a loop channel. The electronic device may be electrically connected to the test board. The test channel may be electrically connected between the electronic device and the FPGA via the test board. The loop channel may extend from the FPGA, may be connected to the FPGA via the test board, and may be used to test the test board. | 05-07-2015 |
20150123693 | INSPECTION JIG - An inspection jig may include a frame, an electrode body provided with electrodes, conductive contactors having a wire shape, a support block having a facing surface opposite to which an inspection circuit board is disposed, guiding one ends of the contactors to the inspection points of the circuit board mounted on the facing surface, guiding other ends to the electrodes, and configured to move relatively to the frame in a moving direction which crosses the facing surface, biasing parts configured to bias the support block in a direction moving away from the electrode body and close to the circuit board, and a regulating plate disposed between the support block and the frame so as to extend in a direction from the support block to the frame, having elasticity, and having regulation of deformation in a first direction which is parallel to the facing surface and which crosses the extending direction. | 05-07-2015 |
20150145548 | COMPACT ELECTRONICS TEST SYSTEM HAVING USER PROGRAMMABLE DEVICE INTERFACES AND ON-BOARD FUNCTIONS ADAPTED FOR USE WITH MULTIPLE DEVICES UNDER TEST AND IN VARIOUS ENVIRONMENTS INCLUDING ONES IN PROXIMITY TO A RADIATION FIELD - Various apparatus and methods associated with a compact electronics test system having user programmable device interfaces and on-board functions adapted for use in various environments are provided. Exemplary embodiments can include a variety of apparatuses and methods to realize an advanced field programmable gate array adapted to perform functional tests on digital electronics within an exemplary 48-pin DIP footprint. One aspect of the invention can include a testing device comprised of components to produce a product that is inexpensive and consumable. A small size of an exemplary embodiment of the invention further allows for desirable shielding to be placed around a highly portable and highly programmable and adaptable testing device in order to protect it from external dangers found in harsh environments (e.g., high levels of radiation when operating in space, etc). | 05-28-2015 |
20150323592 | CONNECTOR DISENGAGEMENT APPARATUS AND INSPECTION SYSTEM FOR LIQUID CRYSTAL DISPLAY MODULE - The present disclosure provides a connector disengagement apparatus and an inspection system for a liquid crystal display module. The connector disengagement apparatus comprises a first member, a second member, a third member, a rotation axle and a stiffener carrying a part of a connector, one end of the first member being connected to one end of the second member, the other end of the first member being arranged towards the stiffener, the other end of the second member being connected to the third member, wherein the second member is rotatable about the rotation axle. The connector disengagement apparatus acts on the stiffener in a down-to-up direction to lift the stiffener to interrupt efficiently the connection of the connector. In the disengagement process, the pins of the connector will not be damaged as the force of the disengagement apparatus is not directly applied onto the connector. | 11-12-2015 |
20150346272 | SYSTEM FOR TESTING INTEGRATED CIRCUIT - An integrated circuit (IC) is connected to an automated test equipment (ATE) with pogo pins. The IC includes an analog-to-digital converter (ADC), a voltage controlled oscillator (VCO), and a compensation circuit. The ATE provides reference voltage signals to the ADC by way of the pogo pins. A potential drop across a pogo pin introduces an error in a reference voltage signal that is reflected in a digital signal generated by the ADC. The VCO generates reference frequency signals corresponding to the reference voltage signals. The compensation circuit receives the reference frequency signals and the digital signal and generates a compensation factor signal. The compensation circuit multiplies the compensation factor signal and the digital signal to generate a compensated digital signal to compensate for the error introduced by the potential drop across the pogo pins. | 12-03-2015 |
20150355232 | TESTING INTERPOSER METHOD AND APPARATUS - The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer. | 12-10-2015 |
20160025804 | METHOD TO IMPROVE STRAIN RATE CONTROL OF SMALL LEAD FREE PRINTED CIRCUIT BOARD ASSEMBLY DURING IN CIRCUIT TEST PROCESS - An apparatus includes a top plate and an extension card surrounding a space for a small electronic assembly. The extension card and small electronic assembly are mounted to the top plate. The apparatus includes a plurality of test probes extending through the top plate and moving relative to the top plate. A portion of the test probes are positioned to contact the extension card and a portion are positioned to contact the small electronic assembly when the test probes move with respect to the top plate. The apparatus includes a vacuum box in contact with the top plate and surrounding the extension card and small electronic assembly. The top plate moves relative to the test probes so the test probes contact the extension card and the small electronic assembly in response to a vacuum force evacuating an area under the top plate and within the vacuum box. | 01-28-2016 |
20160054384 | SOCKET FOR SEMICONDUCTOR CHIP TEST AND METHOD OF MANUFACTURING THE SAME - Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip. | 02-25-2016 |
20160069949 | SEMICONDUCTOR TEST SYSTEM AND METHOD - A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test. | 03-10-2016 |
20160124015 | SOLDERLESS PIM TEST FIXTURE - A solderless test fixture, including a conductive base, a clamp, and a connector is described. The conductive base has at least one cable groove with a cable grounding portion. A clamp is mounted on the base and associated with the cable groove. A connector is associated with the cable groove and has a solderless center terminal aligned with the cable groove and an outer shield being mechanically and electrically connected to the base. | 05-05-2016 |
20160187378 | EXCHANGEABLE CONTACT UNIT AND INSPECTION JIG - An exchangeable contact unit which can be attached to or detached from a main body of an inspection jig, includes: a flexible board which is provided with a contact part with respect to an object to be inspected; and a coaxial connector which is directly and electrically connected to the flexible board. | 06-30-2016 |
20160252548 | TEST ASSEMBLY AND METHOD OF MANUFACTURING THE SAME | 09-01-2016 |