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Probe card

Subclass of:

324 - Electricity: measuring and testing

324500000 - FAULT DETECTING IN ELECTRIC CIRCUITS AND OF ELECTRIC COMPONENTS

324537000 - Of individual circuit component or element

324756010 - Support for device under test or test structure

Patent class list (only not empty are listed)

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Entries
DocumentTitleDate
20130027073INTEGRATED CIRCUIT COMPRISING AT LEAST AN INTEGRATED ANTENNA - An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.01-31-2013
20130088251PROBE CARD AND MANUFACTURING METHOD THEREOF - There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.04-11-2013
20130033283PROBING DEVICE - A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.02-07-2013
20110309854Probe Card for Simultaneously Testing Multiple Dies - In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure.12-22-2011
20100327897WIRING SUBSTRATE AND PROBE CARD - A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×1012-30-2010
20130069686PROBING DEVICE AND MANUFACTURING METHOD THEREOF - A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.03-21-2013
20120187972WAFER LEVEL TESTING STRUCTURE - A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober.07-26-2012
20130162281Probe Card and Fabricating Method Thereof - A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base.06-27-2013
20120223732TRANSMISSION DEVICE AND METHOD OF TESTING TRANSMISSION CHARACTERISTIC OF DUT - There is provided a transmission device. The transmission device includes: an adapter device (09-06-2012
20110037492WAFER PROBE TEST AND INSPECTION SYSTEM - An apparatus for electrically testing a semiconductor device is herein disclosed. The apparatus includes carriers for a semiconductor device and a probe card (02-17-2011
20110043238METHOD OF MANUFACTURING NEEDLE FOR PROBE CARD USING FINE PROCESSING TECHNOLOGY, NEEDLE MANUFACTURED BY THE METHOD AND PROBE CARD COMPRISING THE NEEDLE - Disclosed are probe card needles manufactured using microfabrication technology, a method for manufacturing the probe card needles, and a probe card having the probe card needles. The probe needles are manufactured by forming, on a ceramic board, probe needle bases made of conductive metal, and a polymeric elastomer layer, by using photolithography and a photoresist, and continuously depositing conductive metal layers on the probe needle bases in such a manner as to be supported by the polymeric elastomer layer. The probe card comprises: a printed circuit board (PCB) which is connected to a test head for transmitting an electrical signal from a tester; a ceramic board located below the PCB and electrically connected to the PCB by a plurality of interface pins; a jig for mechanically holding the interface pins and the multilayer ceramic board to the PCB; and a plurality of probe needles attached to the lower surface of the multilayer ceramic board and making contact with electrical/electronic devices.02-24-2011
20110031991PROBE BLOCK - A probe block mounted on a probe card is provided for achieving fine pitch probes. A probe block for a probe card of a semiconductor test device according to the present invention includes a guide member and a probe. A guide member includes pairs of upper and lower holes and middle holes each interconnecting the upper and lower holes of each pair. A probe includes a first pin tip protruded through a corresponding upper hole for contacting a pad of a device to be tested and a second pin tip protruded through a corresponding lower hole for transferring an electrical signal to the device and a bridge part situated within the middle hole for interconnecting the first and second pin tips. The upper, lower, and middle holes allow the probe to elastically moves in vertical direction. The probe block of the present invention is advantageous in that the probes are supported by guide members so as not to be bent while maintaining a fine pitch. Also, the probe block of the present invention is advantageous in fabrication and repair since probes are elastically contacted rather than directly bonded to the circuit substrate of the probe card.02-10-2011
20120112781CONTACTOR, CONTACT STRUCTURE, PROBE CARD, AND TEST APPARATUS - A contactor and an associated contact structure, probe card and test apparatus are provided. The contact may include a base part having three or more steps in a stairway state, a support part with a rear end side provided at the base part and a front end side sticking out from the base part, and a conductive part formed on a surface of the support part and electrically contacting a contact of a device under test.05-10-2012
20110279139PROBE CARD FOR TESTING HIGH-FREQUENCY SIGNALS - A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.11-17-2011
20130162280PROBE CARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad.06-27-2013
20120146679PROBE CARD STIFFENER WITH DECOUPLING - A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.06-14-2012
20110291687PROBE CARD FOR TESTING SEMICONDUCTOR DEVICE AND PROBE CARD BUILT-IN PROBE SYSTEM - A probe card is includes a wafer and a plurality of needle patterns penetrating the wafer. The needle patterns are configured to supply an electrical signal for testing a separate wafer. The probe card may be mounted to a printed circuit board in a manner in which conductive patterns of the probe card are electrically connected to conductive terminals of the printed circuit board. The needle patterns may protrude from a lower end of the wafer and be formed so that an interval between needle patterns is the same as an interval between pads of a wafer to be tested.12-01-2011
20110169517MEMS PROBE CARD AND METHOD OF MANUFACTURING SAME - Provided are a micro-electro-mechanical system (MEMS) probe card and a method for manufacturing thereof. The MEMS probe card includes a substrate provide with a via hole filler conductor or a via hole filled with the resistor, the resistive film formed on the via hole and the substrate, the insulating film and the resistive film formed on the resistive film and the substrate, and the electrode formed on the substrate to cover the insulating film07-14-2011
20110169519CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.07-14-2011
20110169518PROBE CARD, SEMICONDUCTOR INSPECTING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.07-14-2011
20110006798PROBE CARD CASSETTE AND PROBE CARD - A holding section (01-13-2011
20110221465PROBE CARD AND MANUFACTURING METHOD THEREOF - A probe card and a manufacturing method thereof are provided. To manufacture the probe card, via holes for receiving probe pins are formed in a plate-shaped or block-shaped probe substrate, and the probe pins are simultaneously inserted into the via holes. Then the probe substrate is bonded onto a supportable board having a thermal expansion coefficient similar to that of a wafer, and the probe substrate is separated into individual parts each having a specific size that disallows a deviation in location of the probe pins from chip pads of the wafer in spite of thermal expansion of the probe substrate. Therefore, the probe card can be manufactured through a simpler and more cost-effective process while preventing a location deviation of the probe pins due to a difference in thermal expansion coefficient between the probe card and the wafer. The probe substrate and a main circuit board are electrically connected through connecting members passing through openings in the supportable board. The connecting members may be directly or indirectly connected to the main circuit board, and the probe substrate may be composed of first and second probe substrates.09-15-2011
20110227596PROBE-UNIT BASE MEMBER AND PROBE UNIT - A probe-unit base member having high rigidity and requiring no troublesome operations for its manufacture and a probe unit are provided. To achieve the purpose, the probe-unit base member includes a conductive substrate 09-22-2011
20120194212Fine pitch guided vertical probe array having enclosed probe flexures - Probes suitable for use with densely packed fine-pitch 2-D contact arrays are provided by use of an electrically insulating guide plate in connection with vertical probes, where the vertical probes have probe flexures that are either vertically folded sections, or coils having a horizontal axis. Preferably, the probes are configured such that the probe flexures are inside the guide plate holes, and the parts of the probes extending past the guide plate are relatively rigid. This configuration alleviates problems associate with probe shorting, because the probe flexures are enclosed by the guide plate holes, and are therefore unable to come into contact with flexures from other probes during probing.08-02-2012
20120194213PROBE CARD - A probe card for testing electrical characteristics of an object to be tested includes a plurality of contactors for contacting the object during the testing; a plurality of tester chips configured to send and receive electric test signals to and from the object to test the electrical characteristics of the object; and a conductive portion electrically connecting the contactors with the corresponding tester chips, the contactors being arranged on a lower surface of the conductive portion. The probe card further includes a pressing portion configured to press the conductive portion against the object during the testing, so that a pressing force is applied between the contactors and the object.08-02-2012
20110057678Ceramic Substrate, Functional Ceramic Substrate, Probe Card and Method for Manufacturing Ceramic Substrate - A ceramic substrate has a base material composed of an amorphous phase and particles composed of a crystalline phase and dispersed in the base material. Some of the particles are permitted to protrude from at least one surface of the base material.03-10-2011
20110031992TESTER AND SEMICONDUCTOR DEVICE TEST APPARATUS HAVING THE SAME - Provided are a tester and a semiconductor device test apparatus having the tester. The tester includes a tested head configured to transfer electronic signals to a probe card. The tester also includes a leveling unit is provided on the tester head. The leveling unit is configured to apply a load to the probe card to maintain a level state of the probe card.02-10-2011
20110128028PROBE CARD, MAINTENANCE APPARATUS AND METHOD FOR THE SAME - A maintenance apparatus and a maintenance method for a probe card are provided. The maintenance apparatus includes a first supporting member, a second supporting member, a first clamping member, a second clamping member, and a plurality of locking units. In the maintenance method, the first supporting member and the second supporting member are initially positioned underneath below the two sides of a positioning slice, respectively, and then the first clamping member and the second clamping member are each disposed on the first supporting member and the second supporting member, respectively. First clamping member and first supporting member, and second clamping member and second supporting member are secured together respectively by locking units. Thus two sides of positioning slice are secured tightly and the positioning slice is well fastened. A probe card is also provided. The probe card includes a guide slot having a size corresponding to that of maintenance apparatus.06-02-2011
20100301888PROBE DEVICE - A reinforcing member is formed at a top surface side of a probe card including a support plate for supporting a contactor and a circuit board. A plurality of long guide holes are formed in an outer peripheral portion of the reinforcing member. Fixing members fixed to a holding member and collars formed around outer circumferences of the fixing members are formed in the guide holes. A length in a longitudinal direction of each of the guide holes is greater than a diameter of each of the collars, and a central line in the longitudinal direction of each of the guide holes passes through a center of the reinforcing member. Due to the guide holes, horizontal expansion of the reinforcing member itself is allowed.12-02-2010
20100301887PROBE CARD - A probe card according to the present invention includes a support plate for supporting probes that contact an object to be inspected, a circuit board, a holding member for holding a lower surface of an outer peripheral portion of the support plate, and an abutting member disposed between the lower surface of the outer peripheral portion of the support plate and the holding member and protruding upward to abut to the lower surface of the outer peripheral portion of the support plate. Accordingly, horizontal expansion of the support plate itself is allowed, and at the time of inspecting electrical characteristics of the object to be inspected, even though the temperature of the support plate is increased and the support plate expands, the support plate can expand in a horizontal direction, thereby suppressing vertical deformation of the support plate.12-02-2010
20110128029STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES - A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.06-02-2011
20110001506TESTING APPARATUS FOR INTEGRATED CIRCUIT - An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit.01-06-2011
20110001507SEMICONDUCTOR DEVICE AND METHOD OF PERFORMING ELECTRICAL TEST ON SAME - A semiconductor device comprises a substrate, a plurality of bonding pads formed on the substrate, a reference pad comprising a plurality of sensing lines located in a reference pad area of the substrate, and a plurality of detection wirings electrically connected to the respective sensing lines. The bonding pads are configured to make contact with a plurality of probe pins of a test apparatus to receive electrical test signals for an electrical test of the semiconductor device. The reference pad is configured to make contact with a reference pin of the test apparatus, and the reference pad area has substantially the same shape and size as the bonding pads such that positions in the reference pad area correspond one-to-one with positions in each of the bonding pads.01-06-2011
20110018568Semiconductor test equipment with concentric pogo towers - A semiconductor test equipment with concentric pogo towers is disclosed, which comprises a base, a tester head, an outer pogo tower, and an inner pogo tower. The inner pogo tower is concentrically received in the outer pogo tower, and a connecting slot of the inner pogo tower is correspondingly engaged with a connecting pin of the outer pogo tower. The outer pogo tower is fixed to the load board together with the inner pogo tower, whereby a plurality of outer pogo pins of the outer pogo tower and a plurality of inner pogo pins of the inner pogo tower are electrically connected to the load board respectively. Therefore, the present invention is capable of expanding the test specifications, but also to change rapidly from different test specifications through replacing a different probe card but without to modify any other hardware.01-27-2011
20110018569TEST APPARATUS OF SEMICONDUCTOR DEVICE AND METHOD THEREOF - A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship.01-27-2011
20110043237WAFER TRAY AND TEST APPARATUS - In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.02-24-2011
20110043239PROBE CARD - An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base.02-24-2011
20120119773Testing Auxiliary Apparatus - A testing auxiliary apparatus for assisting a testing apparatus to test signals of testing points of a circuit board, includes: a testing base having a testing platform with probes vertically disposed thereon and corresponding to the testing points, and extension testing points exposed from the testing platform and electrically connected to the probes so as for the testing apparatus to test signals; a carrier board disposed on the testing base and capable of ascending and descending relative to the testing platform and including a positioning portion for positioning the circuit board and through holes corresponding to the probes; and a pressing member disposed on the testing base for pressing the circuit board and driving the carrier board to descend such that the probes come into contact with the testing points through the through holes, thereby avoiding the inconvenience of searching for testing points on the circuit board with high-density pins.05-17-2012
20110025360SEMICONDUCTOR INTEGRATED CIRCUIT TEST DEVICE - A semiconductor IC test device includes: an IC tester providing first and second control signals (CS02-03-2011
20110025359BOND AND PROBE PAD DISTRIBUTION - An integrated circuit (IC) that includes a plurality of bond pads disposed on a surface of the IC and a plurality of probe pads disposed on the surface of the IC is provided. Each of the plurality of probe pads is in electrical communication with corresponding bond pads. The plurality of probe pads are linearly configured across the surface. In one embodiment, the probe pads are disposed along a diagonal of the surface of the die defined between opposing vertices of the die surface. In another embodiment, multiple rows of linearly disposed probe pads are provided on the surface.02-03-2011
20110163774PROBE CARD - In one embodiment, a probe card includes a substrate, a probe provided on the substrate, and a contact terminal. The contact terminal is provided at a position on the substrate where the contact terminal comes in contact with the probe when a shape anomaly is generated in the probe.07-07-2011
20110254578SPACE TRANSFORMER COMPRISING AN ISOLATION RESISTOR FOR A PROBE CARD, AND METHOD FOR MANUFACTURING SAME - The invention provides a space transformer for a probe card including an isolation resistor for isolating electrical effects between adjacent channels to perform tests on a plurality of devices under test (DUTs) formed on a wafer at one time, the space transformer including: a plurality of ceramic layers on which circuits for testing the DUTs are printed and which are stacked on one another; an isolation resistor disposed between the ceramic layers and formed by printing a resistance material so as not to be exposed to the outside. The invention also provides a method of manufacturing a space transformer for a probe card including an isolation resistor for isolating electrical effects between adjacent channels to perform tests on a plurality of devices under test (DUTs) formed on a wafer at one time, the method including the steps of: printing a resistance material to form the isolation resistor in a ceramic sheet; stacking a ceramic sheet on the ceramic sheet on which the resistance material is printed such that the resistance material is disposed between the ceramic sheets; and sintering the stacked ceramic sheets.10-20-2011
20110254577Non-Reflow Probe Card Structure - In accordance with an embodiment, a probe card structure comprises a base board, a connection interposer over the base board, a substrate over the connection interposer, and a fixture over the substrate securing the substrate and the connection interposer to the base board. The connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate.10-20-2011
20110006797PROBE CARD AND TEST EQUIPMENT - Provided are a probe card including a first area group including a plurality of first areas, each including a plurality of probes for input pad and probes for output pad, the first areas being aligned in L rows by M columns (L, M: natural number); and a second area group including a plurality of second areas, each including a plurality of probes for input pad, the second areas being aligned in (L×N) rows by M columns (N: natural number); and the first area group and the second area group are continuously connected in a column direction according to the chip alignment, such that the first areas and the second areas are aligned in {L+(L×N)} rows by M columns.01-13-2011
20110043240METHOD AND APPARATUS FOR PROVIDING ACTIVE COMPLIANCE IN A PROBE CARD ASSEMBLY - A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.02-24-2011
20110095778PROBE CARD - A probe card is provided. The probe card detaches or separates a probe assembly and a test signal generator which generates test signals from the tester and the printed circuit board, so as to form a probe system module. The probe system module is secured into a probe card module by one or more securing unit. The probe card module includes the printed circuit board. Control signals from the tester are wirelessly transmitted to the probe system module and drive the probe system module to generate the corresponding test signals. Therefore, the loss or distortion of the test signals due to having longer transmitting distances will be reduced and thus the test quality can be improved.04-28-2011
20110175637METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE - Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.07-21-2011
20120098563INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY - The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis.04-26-2012
20110260744PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.10-27-2011
20110148449CANTILEVER PROBE STRUCTURE FOR A PROBE CARD ASSEMBLY - A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.06-23-2011
20120038384PROBE BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe board and a method of manufacturing the same. The probe board includes a ceramic substrate having an uneven portion in one surface thereof, one or more electrode pads placed on the uneven portion, and a buffer portion placed along an outer circumferential surface of each of the electrode pads, the buffer portion being formed by melting the ceramic substrate.02-16-2012
20110050267ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card is proposed. The probe card comprises a plurality of probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. Said plurality of probes includes at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. Said probe card comprises at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.03-03-2011
20110050266Probe card - A probe card includes a plurality of probes that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head that holds the probes, a substrate having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member that electrically connects at least some of the probes with an external device via the wiring.03-03-2011
20110050265METHOD AND APPARATUS FOR MULTILAYER SUPPORT SUBSTRATE - Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.03-03-2011
20110316576Probe Card - Disclosed is a probe card including: a circuit board; a supporting plate installed below the circuit board and supporting a plurality of contact members contacting a subject to be inspected during inspection; an elastic member installed below the circuit board and above the supporting plate and having flexibility with gas filled therein, and applying a predetermined contact pressure to the plurality of contact members when the plurality of contact members contact the subject to be inspected; and a conductive section placed in the elastic member and electrically connecting the circuit board and the contact members during inspection, and the conductive section includes a conductive layer that includes an insulating layer having flexibility and a wiring layer formed on the insulating layer.12-29-2011
20120043987Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof - A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.02-23-2012
20110156740PROBE CARD - There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess.06-30-2011
20120007627PROBE HEAD OF PROBE CARD AND MANUFACTURING METHOD OF COMPOSITE BOARD OF PROBE HEAD - A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.01-12-2012
20120007626TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS - Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.01-12-2012
20120153982TESTER AND TEST SYSTEM INCLUDING THE SAME - Provided are a tester configured to test a semiconductor device and a test system including the same. The tester may include at least one contact unit and at least one memory controller. The contact unit is in contact with the semiconductor device. The memory controller is connected to the contact unit. The memory controller controls data input/output (I/O) operations of the semiconductor device and tests the semiconductor device.06-21-2012
20110089967MEMS PROBE CARD AND MANUFACTURING METHOD THEREOF - Provided are a micro-electro-mechanical system (MEMS) probe card and a method for manufacturing the same. The method includes preparing first to nth low-temperature co-fired ceramic (LTCC) substrates each having a via hole, filling each via hole with a via filler conductor or a resistor, stacking the first to nth LTCC substrates and firing the stacked substrates at a temperature of 1,000° C. or less to prepare a LTCC multilayer substrate, forming an insulating layer on the surface of the LTCC multilayer substrate, and forming a thin film conductive line on the surfaces of the insulating layer and the via filler conductor.04-21-2011
20110089966APPARATUS AND SYSTEMS FOR PROCESSING SIGNALS BETWEEN A TESTER AND A PLURALITY OF DEVICES UNDER TEST - Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. Other embodiments are also disclosed.04-21-2011
20120126843PROBE CARD HOLDING APPARATUS AND PROBER - A probe card holding apparatus which is provided at a prober and holds a probe card includes: a clamp mechanism which clamps a clamp head which is formed at the probe card; a clamp bar which is laid over an opening of the prober in which the probe card is inserted; and an elevator device which is provided at the clamp bar and moves up and down the clamp mechanism.05-24-2012
20110181314Member for adjusting horizontality, and probe card with the same - Disclosed herein are a member for adjusting horizontality and a probe card with the same. The member for adjusting horizontality according to the present invention horizontally couples a micro probe head to a probe substrate with an adhesive layer therebetween, and the member for adjusting horizontality which is coupled to the micro probe head does not have an edge of the coupling portion and an edge of the adhesive layer. Therefore, according to the member for adjusting horizontality and the probe card with the same of the present invention, it is possible to prevent the coupling portions of the micro probe head from being broken, by reducing stress applied to the micro probe head during the process of horizontally coupling the micro probe head to the probe substrate.07-28-2011
20120169367HIGH FREQUENCY PROBING STRUCTURE - The present disclosure provide a probe card for wafer level testing. The probe card includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch; a printed circuit board configured approximate the first surface of the space transformer; and a power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board.07-05-2012
20110109338INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING THE INTERPOSER - An interposer is disclosed. The interposer includes a substrate capable of being processed by dry etching. The substrate includes a plurality of conductive holes penetrating from one side to the other side of said substrate. Each of said plurality of conductive holes has one end provided with a contact element on at least one side of said conductive hole.05-12-2011
20110121852PROBE CARD AND TEST APPARATUS INCLUDING THE SAME - A probe card and a test apparatus including the probe card for improving test reliability. The probe card may include a first input terminal Microelectromechanical Systems (MEMS) switch that connects a first input terminal and a first input probe pin, wherein the first input terminal MEMS switch comprises a control portion that receives an operation signal and a connection portion that connects the first input terminal and the first input probe pin. The probe card may further include a first output terminal MEMS switch that connects a first output terminal and a first output probe pin, wherein the first output terminal MEMS switch comprises a control portion that receives the operation signal and a connection portion that connects the first output terminal and the first output probe pin.05-26-2011
20110121851PROBE CARD - A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals. In the probe card of the present invention, the probe units are independently supported by respective space transformers such that it is possible to reduce thermal distortion of the probe card and simplifying the manufacturing and repairing processes.05-26-2011
20100327898PROBE CARD AND INSPECTION APPARATUS - An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism.12-30-2010
20100327896PROBE ASSEMBLY AND MANUFACTURING METHOD THEREOF - A probe assembly has insertion holes formed in a base layer provided on a circuit board. Probe pins are inserted into the insertion holes and fixed by a conductive adhesive filled in the insertion holes. The probe pins can be arranged with small pitch without mechanically electrically interfering with neighboring pins using the insertion holes. Furthermore, the base layer is formed of a semiconductor material to prevent a problem caused by a difference in the coefficient of thermal expansion between the base layer and a wafer. Moreover, coplanarity and alignment accuracy of the probe pins can be improved using aligning mask layers or aligning mask in a process of manufacturing the probe assembly. In addition, probe assembly manufacturing time can be reduced by using a pin array frame into which a large number of probe pins are temporarily inserted.12-30-2010
20120280706CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TEST APPARATUS - Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less.11-08-2012
20130021053PROBE CARD HAVING ADJUSTABLE HIGH FREQUENCY SIGNAL TRANSMISSION PATH FOR TRANSMISSION OF HIGH FREQUENCY SIGNAL - A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.01-24-2013
20130169305WIRING BOARD AND PROBE CARD USING THE SAME - A wiring board 07-04-2013
20130176048Mullite-Based Sintered Body, Circuit Board Using Same and Probe Card - A mullite-based body including mullite, alumina, and titanium manganese oxide is disclosed. The mullite-based sintered body includes mullite of 79.3 to 85.2 mass %, alumina of 14.2 to 19.8 mass % and MnTiO07-11-2013
20130093453CONNECTING DEVICE, SEMICONDUCTOR WAFER TEST APPARATUS COMPRISING SAME, AND CONNECTING METHOD - A connecting device electrically connects a performance board which has PB terminals and a test head, and includes a sub board which is electrically connected to the test head and has sub terminals which face the PB terminals, a sealing mechanism which forms a sealed space between the sub board and the performance board, and a pressure reducing device which reduces the pressure of the sealed space. The pressure reducing device reduces the pressure of the sealed space so that the performance board and the sub board approach each other and the PB terminals and the sub terminals contact.04-18-2013
20130093452PROBE CARD PARTITION SCHEME - A method of probe card partitioning for testing an integrated circuit die includes providing a first probe card partition layout having a first number of distinct sections. Each distinct section uses a distinct probe card for testing. The first probe card partition layout is repartitioned into a second probe card partition layout having a second number of distinct sections. The second number is less than the first number.04-18-2013
20130099815PROBE CARD HANDLING CARRIAGE - A probe card handling carriage is applicable to various working environments. The probe card handling carriage includes a main body provided to be travelable on the ground, a drawer unit provided to be movable in a forward and backward direction with respect to the main body, and a transfer robot installed on the drawer unit to transfer a probe card.04-25-2013
20130120016PROBE CARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a probe card is provided wherein probes are held in a holding plate such that the respective probes correspond to through holes with their connecting end portions projected from one surface of the holding plate. A plate-like member including openings having larger diameters than diameters of the through holes and housing the connecting end portions in the openings is arranged by making one surface of the plate-like member abut the one surface of the holding plate. After supplying solder cream in the respective openings from the other surface of the plate-like member, a connection base plate and the holding plate are relatively fixed so that the solder cream, burying the connecting end portions of the respective probes held in the holding plate with the plate-like member removed, may abut the respective corresponding connection pads, and the solder cream is heated to melt the solder cream.05-16-2013
20130141132INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICES AND CHUCK STAGE USED FOR THE INSPECTIONAPPARATUS - The present invention provides an inspection apparatus, which comprises probes for front side electrodes, probes for back side electrodes, and a chuck stage, wherein the probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage. According to the inspection apparatus of the present invention, it is possible to inspect characteristics of semiconductor devices having electrodes on both side of a wafer more accurately in wafer state.06-06-2013
20130127488CONFIGURABLE TESTING PLATFORMS FOR CIRCUIT BOARDS WITH REMOVABLE TEST POINT PORTION - Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided.05-23-2013
20130200914Methods and Systems for Cleaning Needles of a Probe Card - A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles.08-08-2013
20110241716TEST HEAD AND SEMICONDUCTOR WAFER TEST APPARATUS COMPRISING SAME - [Object] Providing a test head capable of suppressing a probe card from bending.10-06-2011
20130147506WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - The wafer inspection interface 06-13-2013
20100308855PROBE CARD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.12-09-2010
20100308854PROBE CARD SUBSTRATE WITH BONDED VIA - The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.12-09-2010
20110234251PROBE CARD - A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.09-29-2011
20130154682PROBE ASSEMBLY, PROBE CARD INCLUDING THE SAME, AND METHODS FOR MANUFACTURING THESE - Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes.06-20-2013
20130187676INSPECTION APPARATUS - An inspection apparatus includes a probe card having a plurality of probes arranged to correspond to each chip of a semiconductor wafer under inspection and contacting a plurality of electrodes of each chip and a test head electrically connected to the respective probes of the probe card and applying test signals from a tester, and a plurality of tester lands of a probe substrate electrically connected respectively to the plurality of probes. A plurality of electrical connecting portions on the tester side of the test head, corresponding to the respective tester lands, are arranged to constitute a plurality of arrangement areas sectioned to correspond to the respective chips under inspection, and the plurality of probes of the probe substrate are connected to the corresponding tester lands provided in the arrangement areas in units of chips under inspection.07-25-2013
20120068728Probe Card - A probe card to be used with a tester that tests an electrical characteristic of an electronic circuit formed in in a wafer is disclosed. The probe card includes a first transmitter/receiver component that is mounted on a lower surface of a tester board and electrically connected to the tester; a second transmitter/receiver component that is provided to oppose the first transmitter/receiver component and carries out contactless transmission/reception of signals with the first transmitter/receiver component; plural probes that are configured to come in contact with corresponding electrode pads of the electronic circuit and electrically connect the corresponding electrode pads and the second transmitter/receiver component; an expandable chamber having flexibility so that the expandable chamber may be inflated by introducing gas thereinto, thereby moving the plural probes away from the tester board.03-22-2012
20130207683ELECTRICAL CONNECTING APPARATUS AND METHOD FOR ASSEMBLING THE SAME - An electrical connecting apparatus includes a wiring base plate having a first surface coupled with a reinforcing plate and provided on an opposite surface with first electrical connection portions, a probe base plate provided on a first surface with second electrical connection portions corresponding to the first electrical connection portions and provided on a second surface with probes electrically connected to the second electrical connection portions, anchor portions formed on the first surface of the probe base plate and provided with screw holes, cylindrical spacers having first ends removably coupled with the anchor portions, having screw grooves, and passing through the wiring base plate and the reinforcing plate, reference plates having reference planes to receive the spacers and removably coupled with the reinforcing plate, shims inserted between the respective reference plates and the reinforcing plate, and bolt screwed in the screw groove of the spacer.08-15-2013

Patent applications in class Probe card