Class / Patent application number | Description | Number of patent applications / Date published |
324755110 | Elongated pin or probe | 15 |
20100327894 | Dual Tip Test Probe Assembly - A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip configured to make contact with a device under test. An electrically-insulating material is disposed between but not in contact with the body portions of the first and second elongated test probes to electrically isolate the first and second elongated test probes. The first and second elongated test probes are held in alignment with respect to each other so that the tip of the first elongated test probe is adjacent to and not in contact with the tip of the second elongated test probe for making simultaneous contact with the device under test. The dual tip test probe assembly provides a low inductance and a small, stable footprint for testing small and/or non-flat test points. | 12-30-2010 |
20110012634 | Test probe - A test probe is provided. The test probe includes a group of shielding boards and two probe pins. The group of shielding boards has two opposite surfaces. The group of shielding boards includes at least two insulation boards and at least one metal board. The metal board is formed between the two insulation boards. The two probe pins are formed on the two surfaces of the group of shielding boards and have a distance between each other. | 01-20-2011 |
20110043235 | SEMICONDUCTOR DEVICE HAVING A PLURALITY OF PADS - A semiconductor device includes a plurality of sensor pads configured to receive a probe signal from a testing apparatus, and a plurality of normal pads configured to receive a driving signal to drive the semiconductor device. In the plurality of sensor pads and the plurality of normal pads, a length in a direction corresponding to one of progress directions of a plurality of needles of the testing apparatus is longer than a length in another progress direction of the plurality of needles. | 02-24-2011 |
20110133767 | SILVER ALLOY HAVING EXCELLENT CONTACT RESISTANCE AND ANTIFOULING PROPERTY AND SUITABLE FOR USE IN PROVE PIN - The present invention is a silver alloy suitable for use in a probe pin made of an Ag—Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy further comprises 2 to 10% by weight of Ni to further improve strength. A probe pin made of these materials has stable contact resistance even under low contact pressure. The probe pin has excellent strength and antifouling property to adhesion of a foreign matter from a contact object due to repetitive use. Thereby, the probe pin usable in a stable manner for a long period of time can be obtained. | 06-09-2011 |
20110316575 | PIN ELECTRONICS CIRCUIT - An I/O pin is connected to a DUT via a transmission line. A driver generates a test signal to be supplied to the DUT. A driver-side switch and an output resistor are arranged in series between the driver and the I/O pin. A comparator is arranged such that the input terminal thereof is connected to the I/O pin, and configured to judge the level of a signal output from the DUT. A short-circuit switch is arranged between the I/O pin and the ground terminal. | 12-29-2011 |
20120086466 | Semiconductor test probe apparatus and method - An improved probe card system includes a probe assembly having a cantilever probe with a contact arm integral with and extending from a distal end of the probe, wherein the contact arm is oriented substantially parallel to a die or other material to be tested. The contact arm may be an elongated tip of the probe configured to contact a bumped pad or other contact on an outer surface of the arm. Inherent cantilever action of the probe may translating to a scrubbing action of the side of a contact arm on a test pad or solder ball. Some embodiments employ two or more probes for Kelvin-type probing, and the contact arm at the end of the probe can incorporate a substantially straight arm or a bent arm to follow the contour of a solder bump. | 04-12-2012 |
20120126842 | TEST PROBE - A test probe for testing an object electrically includes a main body, a first probe pin mounted to and protruding out of the main body, and at least one second probe pin coupled to the main body. The at least one second probe pin is changeable from a first state of being folded into the main body to a second state of being unfolded to protrude out of the main body. When the at least one second probe pin is in the first state, the first probe pin is used to contact the object, and when the at least one second probe pin is in the second state, the at least one second probe pin takes the place of the first probe pin in making electrical connection with the object. | 05-24-2012 |
20130106457 | TEST PROBE FOR TEST AND FABRICATION METHOD THEREOF | 05-02-2013 |
20130113512 | PROBE BLOCK, PROBE CARD AND PROBE APPARATUS BOTH HAVING THE PROBE BLOCK - The present invention provides a probe block, which comprises 1) a conductive base on which a first groove is formed, 2) a pair of signal transmitting probes which have dielectric covers and are placed parallel to each other in the first groove, and 3) a ground probe which is in contact with the conductive base, wherein front portions of the signal transmitting probes and the ground probe protrude from the conductive base to form signal transmitting probe needles and a ground probe needle, respectively. The probe block of the present invention has excellent high frequency responses characteristics and is easy for maintenance. | 05-09-2013 |
20130271173 | RHODIUM ALLOY WHICH HAS EXCELLENT HARDNESS, PROCESSABILITY AND ANTIFOULING CHARACTERISTICS AND IS SUITABLE FOR WIRE ROD FOR PROBE PINS - The present invention is a rhodium alloy suitable for wire for a probe pin, the rhodium alloy comprising 30 to 150 ppm of Fe, 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements, and the balance being Rh. A probe pin composed of the material maintains processability of rhodium, has stable contact resistance even at a low contact pressure, and has excellent strength and antifouling properties, and therefore, can be used in a stable manner for a long period. | 10-17-2013 |
20140091824 | MECHANISM FOR FACILITATING A DYNAMIC ELECTRO-MECHANICAL INTERCONNECT HAVING A CAVITY FOR EMBEDDING ELECTRICAL COMPONENTS AND ISOLATING ELECTRICAL PATHS - A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor. | 04-03-2014 |
20140266280 | PROBE CARD, PROBE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A probe structure is disclosed which includes a metal needle, a soft insulative tube and a metal layer. The metal needle has a first end-portion and a second end-portion opposite to each other. The first end-portion has a tip. The soft insulative tube has a through hole in which the metal needle is partially inserted. The tip of the metal needle protrudes from the through hole. The metal layer is coated on the outer surface of the soft insulative tube and is electrically isolated from the metal needle; the thickness of the metal layer has a thickness no larger than 10 micrometers. Therefore, good resilience and signal integrity could coexist in the probe structure. A probe card including several above-mentioned probe structures and a method for manufacturing the above-mentioned probe structure are also disclosed. | 09-18-2014 |
20160154024 | INSPECTION UNIT | 06-02-2016 |
20160187384 | VERTICAL PROBE DEVICE HAVING POSITIONING FILM - A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes, and a dividing film disposed between the lower positioning film and the upper die and having through holes and dividing ribs. The needle tail is individually inserted through a lower installing hole. The needle head is individually inserted through an upper installing hole. Each lower positioning hole is located under at least one dividing rib and capable of accommodating a plurality of needle heads. Each needle head is inserted through a lower positioning hole and a through hole. Therefore, the films are easily installed, free of irregular hole but passable by narrow needle bodies, and facilitate easy and fast installation and less damage to the probe needles that are well positioned, and facilitate easy installation of the upper die. | 06-30-2016 |
20170234907 | INSPECTION TERMINAL UNIT, PROBE CARD, AND METHOD FOR MANUFACTURING INSPECTION TERMINAL UNIT | 08-17-2017 |