Entries |
Document | Title | Date |
20100271060 | MEMBRANE PROBING METHOD USING IMPROVED CONTACT - A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process. | 10-28-2010 |
20100277192 | MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet. | 11-04-2010 |
20100321056 | SYSTEM AND METHOD OF MEASURING PROBE FLOAT - A system and method allow accurate calculation of probe float through optical free-hanging and electrical planarity measurement techniques. In accordance with an examplary embodiment, probe float may be determined by acquiring a free-hanging planarity measurement, obtaining a first electrical contact planarity measurement, and calculating probe float using results of the acquiring and the obtaining operations. | 12-23-2010 |
20100321057 | PROBE PIN AND METHOD OF MANUFACTURING THE SAME - A probe pin having a bent portion at its tip end portion is used for a probe card, the probe pin is configured such that an angle constituted by a direction of work groove generated at a time of machine-working of a tip end portion of the probe pin and a longitudinal direction of a metal wire is set to 45 degree or less, or both directions are set to be almost parallel to each other. Due to above configuration, even if the tip end portion of the probe pin is subjected to a bending work and a worked surface is formed with recessed portion, a breakage of the probe pin caused by the recessed portion existing on the worked surface and functioning as a starting point of the breakage can be effectively prevented whereby a lowering of a production yield of the probe pin can be greatly suppressed. | 12-23-2010 |
20110025358 | PROBE UNIT - A probe unit includes: large diameter probes; a small diameter probes; a large-diameter probe holder having large hole portions which individually hold the large diameter probes, and hole portions which have diameters smaller than those of the large hole portions, communicate with the large hole portions, and receive end portions of the small diameter probes so that the end portions come into contact with the large diameter; and a small-diameter probe holder probes having small hole portions which individually hold the small diameter probes The central axes of the large hole portion and the small hole portion that communicate with each other are separated from each other, and the small hole portions include two small hole portions which are adjacent to each other and of which central axes are separated from each other by a distance shorter than a distance between the central axes of two large hole portions that are corresponding to the two small hole portions. | 02-03-2011 |
20110043232 | CONTACT STRUCTURE FOR INSPECTION - A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal plates 30 | 02-24-2011 |
20110057675 | PERPENDICULAR FINE-CONTACT PROBE HAVING A VARIABLE-STIFFNESS STRUCTURE - An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression. | 03-10-2011 |
20110062978 | MULTIPLE CONTACT PROBES - The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus. | 03-17-2011 |
20110062979 | TEST SYSTEM AND PROBE APPARATUS - A probe apparatus includes a wire substrate with terminals; a wafer tray forming a hermetically sealed space with the wire substrate and for mounting a semiconductor wafer; a probe wafer provided between the wire substrate and the wafer tray, having an apparatus connection terminal electrically connected to a terminal of the wire substrate and wafer connection terminals electrically connected to the semiconductor chips respectively and collectively; an apparatus anisotropic conductive sheet provided between the wire substrate and the probe wafer; a wafer anisotropic conductive sheet provided between the probe wafer and the semiconductor wafer; and a decompressing section that decompresses the hermetically sealed space between the wire substrate and the wafer tray, to cause the wafer tray to move to a predetermined position from the wire substrate, to electrically connect the wire substrate and the probe wafer, and to electrically connect the probe wafer and the semiconductor wafer. | 03-17-2011 |
20110080186 | CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT - A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive. | 04-07-2011 |
20110089965 | PROBE CARD ANALYSIS SYSTEM AND METHOD - A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process. | 04-21-2011 |
20110115515 | PROBE FOR ELECTRICAL TEST, ELECTRICAL CONNECTING APPARATUS USING THE SAME, AND METHOD FOR MANUFACTURING PROBE - The embodiment of the subject matter provides a probe that is good both in mechanical characteristics and electrical characteristics. A probe for an electrical test comprises a probe main body portion made of a nickel-boron alloy, and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from that for the probe main body portion. The crystal size of the nickel-boron alloy is 50 nm at the maximum, and the contained amount of the boron is 0.02 wt % or more and 0.20 wt % or less. | 05-19-2011 |
20110121849 | PROBE WITH PRINTED TIP - The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention. | 05-26-2011 |
20110148447 | MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME - There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided. | 06-23-2011 |
20110148448 | LOADED PRINTED CIRCUIT BOARD TEST FIXTURE AND METHOD FOR MANUFACTURING THE SAME - A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board. | 06-23-2011 |
20110156738 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal. | 06-30-2011 |
20110175635 | PROBE FOR ELECTRICAL TEST AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRICAL CONNECTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A probe for an electrical test has a foot portion coupled with a board, an arm portion extending laterally from a lower end portion of the foot portion, and a needle tip portion projecting downward from a tip end portion of the arm portion. At least one selected from a group consisting of the foot portion, the arm portion, and the needle tip portion comprises a symbol specifying a position of the probe on the board. | 07-21-2011 |
20110199111 | CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT - A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive. | 08-18-2011 |
20110210760 | PROBE AND METHOD FABRICATING THE SAME - A probe and a method fabricating the same are disclosed. The probe includes a wire and a bump, wherein the wire is formed on a substrate; and the bump is formed upon the wire. In addition, a probe block is disclosed. The probe block includes a plurality of probes disposed on a substrate, so that the probe block is composed of a plurality of wires and bumps. The wires are disposed on the substrate and each bump is disposed accurately upon an end of each wire. The bump and the wire of the probe in accordance with the present invention are formed jointlessly. The method of fabricating the probe is characterized in that a grayscale mask is utilized to form the wire on the substrate and form the bump upon the wire by using a single masking process. | 09-01-2011 |
20110221463 | SCANNING CANNULA - A scanning cannula for scanning an electrosurgical instrument for electrical insulation defects includes an elongated sleeve having a receiving end, an opposite exit end, and a passageway extending from the receiving end to the exit end. At least one sweeping contact is disposed in the passageway. A circuit in the sleeve is electrically connected to the at least one sweeping contact. A communication device is connected to the circuit to transmit signals from the circuit to a switchbox of a surgical instrument. An electrosurgical instrument inserted into the receiving end of the sleeve passes through the at least one sweeping contact, and any electrical defect of the electrosurgical instrument detected by the at least one sweeping contact is relayed as an error signal to the circuit, which communicates the error signal to the switchbox. The switchbox cuts current to the electrosurgical instrument and signals an alarm. | 09-15-2011 |
20110234250 | PROBE - A probe for testing electronic properties of a circuit board by contacting with a weld bead on the circuit board is provided. The probe includes a main body. The main body includes an end surface, a receiving portion defined on the center of the end surface, and four positioning slots communicating with the receiving portion. | 09-29-2011 |
20110241713 | TEST STRUCTURE ACTIVATED BY PROBE NEEDLE - A test structure ( | 10-06-2011 |
20110241714 | RESISTIVE PROBING TIP SYSTEM FOR LOGIC ANALYZER PROBING SYSTEM - The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head. | 10-06-2011 |
20110273199 | VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. | 11-10-2011 |
20110279138 | Identifying A Signal On A Printed Circuit Board Under Test - Identifying a signal on a printed circuit board (‘PCB’) under test, including a test probe with a radio transmitter and transmitter antenna, the test probe positioned with the transmitter antenna at a test point on the PCB, the test probe transmitting a radio signal; at least two radio receivers, each receiver having a receiver antenna, each receiver antenna positioned at predetermined, separate physical locations with respect to the PCB, the receivers coupled to at least one signal strength meter, each receiver receiving the transmitted radio signal; and a signal-identifying controller connected to the signal strength meter, the signal-identifying controller reading, from the signal strength meter, signal strengths of the transmitted radio signal as received at the radio receivers; determining, in dependence upon the read signal strengths, a test signal identifier; and displaying the test signal identifier. | 11-17-2011 |
20110285416 | MULTI-POINT PROBE FOR TESTING ELECTRICAL PROPERTIES AND A METHOD OF PRODUCING A MULTI-POINT PROBE - A multi-point probe for testing electrical properties of a number of specific locations of a test sample comprises a supporting body defining a first surface, a first multitude of conductive probe arms ( | 11-24-2011 |
20110291684 | SWITCH PROBE AND DEVICE AND SYSTEM FOR SUBSTRATE INSPECTION - A switch probe for use in a substrate inspection device to inspect a substrate includes a first tubular element, a first rod element partially accommodated in the first tubular element, and pressed into the first tubular element when the certain part is mounted for substrate inspection, a second tubular element fixed in the first tubular element, a second rod element partially accommodated in the second tubular element which is inside the first tubular element, and contacting with the first rod element when the first rod element is pressed into the first tubular element, and a fixing mechanism configured to temporarily fix the second rod element in a position so that the second rod element does not contact with the first rod element even when the first rod element is pressed into the first tubular element. | 12-01-2011 |
20110291685 | PROBE | 12-01-2011 |
20110291686 | ELECTRIC CONTACT AND SOCKET FOR ELECTRICAL PART - A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat. | 12-01-2011 |
20110309853 | SECTIONAL TEST PROBE ASSEMBLY FOR ELECTRIC METER - The test probe assembly of the invention is used for an electric meter such as a multimeter or the like. The electric meter has a main body. The test probe assembly includes a pair of insulated rods, a pair of probe tips and a pair of leads. The insulated rods are separately provided with two corresponding engaging portions, so that the insulated rods can be combined or detached. One end of each probe tip is fixed in one of the insulated rods and the other ends are protrudent. The leads connect between the insulated rods and main body. The combination or detachment of the test probe assembly may form a variety of configurations for different measured objects. | 12-22-2011 |
20120013358 | PROBING APPARATUS FOR INTEGRATED CIRCUIT TESTING - A probing apparatus for integrated circuit testing at least includes a substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a first electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate. | 01-19-2012 |
20120019276 | Operation control structure for a continuity test device - There is provided an operation control structure for a continuity test device for performing lock of a connector and actuation of a continuity test part timely, low cost, easily, and surely including a connector attachment part | 01-26-2012 |
20120025859 | COMBINED PROBE HEAD FOR A VERTICAL PROBE CARD AND METHOD FOR ASSEMBLING AND ALIGNING THE COMBINED PROBE HEAD THEREOF - A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided. | 02-02-2012 |
20120038381 | TEST PROD FOR HIGH-FREQUENCY MEASUREMENT - A test prod for high-frequency measurement having a contact-side end for electrically contacting planar structures and a cable-side end, for connecting to a cable, wherein between the contact-side end and the cable-side end a coplanar conductor structure having at least two conductors is arranged, wherein on the coplanar conductor structure a dielectric is arranged over a predetermined section between the cable-side end and the contact-side end, wherein the test prod is between the dielectric and the contact-side end such that the conductors of the coplanar conductor structure are arranged freely in space and relative to the dielectric in a suspending manner, wherein on one side of the test prod facing towards the planar structure a shielding element is arranged extending into the area of the coplanar conductor structure. | 02-16-2012 |
20120068726 | ELECTRICAL TEST PROBE AND PROBE ASSEMBLY - An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas. | 03-22-2012 |
20120068727 | COMPLIANT WAFER LEVEL PROBE ASSEMBLY - A probe assembly that acts as a temporary interconnect between terminals on a circuit member and a test station. The probe assembly can include a base layer of a dielectric material printed onto a surface of a fixture. The surface of the fixture can have a plurality of cavities. A plurality of discrete contact members can be formed in the plurality of cavities in the fixture and coupled to the base layer. A plurality of conductive traces can be printed onto an exposed surface of the base layer and electrically coupled with proximal ends of one or more of the discrete contact members. A compliant layer can be deposited over the conductive traces and the proximal ends of the contact members. A protective layer can be deposited on the compliant layer such that when the probe assembly is removed from the fixture the distal ends of the contact members contact terminals on the circuit member and the conductive traces electrically couple the circuit member to a test station. Electrical devices on the probe assembly can communicate with the test station to provide adaptive testing. | 03-22-2012 |
20120074979 | PROBE BLOCK - There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip. | 03-29-2012 |
20120098561 | Test probe with dual switching probe tip - A test probe with a dual switching probe tip includes an insulating sheath, a conductive wire and a complex probe tip, and an end of the conductive wire is passed and connected into the insulating sheath. The complex probe tip includes a connecting section, and a first measuring head and a second measuring head extended in opposite directions from both ends of the connecting section respectively, and the first and second measuring heads are measuring heads of two different specifications and electrically connected with each other, and the connecting section is selectively combined with the insulating sheath, and the first measuring head is exposed from the insulating sheath or accommodated in the insulating sheath and electrically connected to the conductive wire. The probe tip can be switched and installed at the insulating sheath to extend the using life of the test probe or meet the requirements of fitting different specifications. | 04-26-2012 |
20120098562 | PROBE TIP COATING STRUCTURE FOR TEST PROBES - A probe tip coating structure for test probes includes a probe tip body and a coating element, and the probe tip body includes a rod and a probe head integrally formed a front end of the rod, and the external diameter of the rod is not greater than the external diameter of a base of the probe head, and the coating element is coated on the rod and forms a continuing section securely combined with the exterior of the rod, and a seat is coupled to an end of the continuing section and provided for assembling the test probe, such that the coating element is formed on the probe tip, and the external diameter of the coating element is close to that of the probe tip and the coating element can be securely combined with the probe tip without the risk of getting loosened or falling apart. | 04-26-2012 |
20120112779 | RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME - Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers. | 05-10-2012 |
20120146677 | Probe Card - A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested. | 06-14-2012 |
20120153980 | PROBE ASSEMBLY - A probe assembly includes a transducer, a cable, and a probe. A cover of the cable is made of pliable metal material or a flexible metal conduit. Opposite ends of the cable are respectively coupled to the transducer and the probe. | 06-21-2012 |
20120169366 | SOCKET CONTACT FOR TESTING A SEMICONDUCTOR - A socket contact for testing a semiconductor. The socket contact includes a first contact portion, a second contact portion, and first and second body portions connecting the first contact portion and the second contact portion, wherein each of the first and second body portions has a first end, a second end opposite to the first end, and a connecting portion between the first and second ends, the first end of the first body portion and the first end of the second body portion contact the first contact portion, the second end of the first body portion and the second end of the second body portion contact the second contact portion, and the connecting portion of the first body portion and the connecting portion of the second body portion are spaced apart from each other. | 07-05-2012 |
20120212249 | HARD AND WEAR-RESISTING PROBE AND MANUFACTURING METHOD THEREOF - The present invention relates to a hard and wear-resisting probe and manufacturing method thereof, and particularly relates to a hard and wear-resisting probe comprising tungsten steel (WC) and manufacturing method thereof. This hard and wear-resisting probe is substantially made of a tungsten steel with high hardness and wear resistance so that the probe is difficult to be worn and the lifetime of the probe is longer. Furthermore, the frequencies for changing the probe and the cost of testing are reduced, and the testing efficiency can be improved. | 08-23-2012 |
20120229156 | TESTING APPARATUS AND RELATIVE METHOD - Embodiments of the invention may provide a testing apparatus that is used to test solar cells or other electronic devices. The testing apparatus may comprise a substantially flat support that is configured to support a substrate or other device that is to be electrically tested and a plurality of testing probes. The support comprises a plurality of through holes, each suitable for the insertion of a corresponding testing probe, to allow each probe to make contact with a testing area formed on the substrate. The testing apparatus may comprise a suction device that is associated or associable with the support, and is able to exert a holding force on the substrate that counteracts the thrusting force exerted by the testing probes. | 09-13-2012 |
20120229157 | PROBE CARD AND MANUFACTURING METHOD THEREOF - In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card. | 09-13-2012 |
20120235698 | TEST PROBE WITH CERAMIC COATING AND TEST INSTRUMENT - The present invention discloses a test probe including a conductive member having a first end defined by an electrically conductive tip, and an insulative member surrounding a first portion of the conductive member. The second portion of the conductive member between the first end and the first portion is coated with a layer of insulative material. The test probe in the present invention does not require separate probe tips to be carried for use on various test applications but still meet the safety requirement of IEC standard. | 09-20-2012 |
20120249173 | SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN VEHICLE FOR HIGH DENSITY CONNECTIONS - A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures. | 10-04-2012 |
20120280703 | TESTING HEAD FOR A TEST EQUIPMENT OF ELECTRONIC DEVICES - A testing head for a test equipment of electronic devices comprises a plurality of contact probes inserted into guiding holes made in at least one upper guide and in a lower guide, separate from one another by an air zone, the contact probes comprising at least one enlarged portion suitable for preventing the escape of such probes from the guiding holes. Conveniently, the enlarged portions of the contact probes adjacent according to a direction of distribution of contact pads of an integrated device to be tested have respective larger sides orthogonal to one another. | 11-08-2012 |
20120286815 | Inspection Device Applying Probe Contact for Signal Transmission - An inspection device applying probe contact for signal transmission includes an inspection panel board; a probe base disposed on the inspection panel board and having a plurality of probes; a receiving moldboard disposed on the inspection panel board and including a fillister for receiving inspected portable electronic apparatus, and an open slot allocated facing the plurality of probes of the probe base, thereby enabling the plurality of probes to contact with corresponding signal terminals of the portable electronic apparatus; and a clamp unit disposed on the inspection panel board and consisting of an adjustable rod and a clamp block allocated at one end of the adjustable rod, the adjustable rod adjusting position of the clamp block, thereby clamping and properly positioning the portable electronic apparatus in the receiving moldboard. | 11-15-2012 |
20120286816 | PROBES WITH HIGH CURRENT CARRYING CAPABILITY AND LASER MACHINING METHODS - The present invention is a probe having a distal end made of one material, a tip and a portion disposed between the distal end and the tip that is a different second material. The probe is laser machined manufactured using a nanosecond or picosecond laser. | 11-15-2012 |
20120286817 | PROBE HEAD ASSEMBLIES, COMPONENTS THEREOF, TEST SYSTEMS INCLUDING THE SAME, AND METHODS OF OPERATING THE SAME - Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip. | 11-15-2012 |
20120299611 | PROBE ASSEMBLY - A probe assembly includes a probe and an assistant measuring device. The probe includes a main body, a metal tip, a first cable, and a second cable. The assistant measuring device includes a base, a first pole, a second pole, an annular wall, a first input line, and a second input line. The first input line is connected to the first pole. The second input line is connected to the base. When the metal tip is inserted into the hole of the second pole, the metal tip is engaged with the second pole. The main body is engaged with the annular wall. The first cable is connected to the first input line through the metal tip, and the second and first poles. The second cable is connected to the second input line through the main body, the annular wall, and the base. | 11-29-2012 |
20120306522 | PROBING TIP FOR A SIGNAL ACQUISITION PROBE - A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate. | 12-06-2012 |
20120306523 | PROBE CARD - There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board. | 12-06-2012 |
20120313658 | Dual Probing Tip System - A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members. | 12-13-2012 |
20120319716 | PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices. | 12-20-2012 |
20120326743 | SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME - A semiconductor device includes a unit region including a circuit test region and a probe test region. The circuit test region includes a test circuit and a plurality of circuit test pads operatively coupled to the test circuit. The probe test region includes first and second probe test pads insulated from the circuit test pads, and a first resistance pattern operatively coupled to the first and second probe test pads. | 12-27-2012 |
20130002284 | TEST PROBE WITH INTEGRATED TEST TRANSFORMER - A measuring device used for registering a test signal originating from a circuit structure applied to a wafer. The measuring device provides at least one test probe and at least one test transformer. The at least one test transformer is connected to the at least one test probe in an electrically conductive manner. In this context, the test transformer is arranged on the test probe. | 01-03-2013 |
20130009656 | TEST PAD STRUCTURE ON WAFER - A test pad structure on a wafer includes at least a scribe line positioned on a wafer, a pad region defined in the scribe line, and a metal pad positioned in the pad region. An area of the metal pad and an area of the pad region include a ratio, and the ratio is lower than equal to 50%. | 01-10-2013 |
20130009657 | DETECTION DEVICE - A detection device includes a first rod including a first contact pad, a second rod including a second contact pad, an adjusting rod fixed to the first rod, and a threaded rod fixed to the second rod, the threaded rod being screwed on the adjusting rod. The adjusting rod screws relative to the threaded rod, which causes the distance between the first contact pad and the second contact pad to be adjusted. | 01-10-2013 |
20130027072 | PROBING APPARATUS FOR SEMICONDUCTOR DEVICES - A probing apparatus for semiconductor devices comprises a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board. | 01-31-2013 |
20130033280 | SELF-RETAINING VIA PROBE - A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops. | 02-07-2013 |
20130033281 | PROBE ASSEMBLY - A probe assembly includes a probe, a transducer, and a cable electronically connecting the probe with the transducer. The cable has a jacket made of an extreme-environment resistant material. | 02-07-2013 |
20130033282 | CONTACT STRUCTURE AND METHOD OF MANUFACTURING CONTACT STRUCTURE - A contact structure has a probe and a housing disposed on an outer circumference thereof. The housing has a housing main body in which a hollow section vertically penetrating the same is formed, and a conductive coat film with which an inner wall surface of the hollow section is coated. The probe has a base end portion fixed in place on one end side of the housing, a conductive leading end portion that is movable in the hollow section while being in contact with the coat film and has, on a leading end thereof, a contact that comes into contact with a subject to be inspected, and an elastic portion that connects together the base end portion and the leading end portion, is disposed in the hollow section, and has elasticity. | 02-07-2013 |
20130038344 | PROBE ASSEMBLY - A probe assembly includes probe heads, a first connector, and groups of second connectors. Each probe head includes a first connection portion defining two first holes, and a data cable connected to an oscilligraph. The first connector includes a fixing portion and groups of rods fixed to the fixing portion. Each group of rods includes two rods. First ends of each group of rods are detachably inserted into the first holes to electrically connect the corresponding data cable. Each group of second connectors includes a second connection portion defines two second holes, and a connection cable. Second ends of the group of rods are detachably inserted into the second holes to connect the connection cable. | 02-14-2013 |
20130038345 | PROBE STRUCTURE, PROBE APPARATUS, PROBE STRUCTURE MANUFACTURING METHOD, AND TEST APPARATUS - Probes are arranged precisely and at a narrow pitch. Provided is a probe structure receiving and transmitting an electric signal from/to a device. The probe structure includes a contact point that transmits an electric signal, a probe on which the contact point is formed, a probe pad section that is electrically coupled to the contact point, and an insulating section that is provided on the probe and that insulates a bonding wire connected to the probe pad section from the probe. A probe apparatus, a manufacturing method of a probe structure, and a test apparatus are also provided. | 02-14-2013 |
20130057308 | CONNECTION TERMINAL AND CONNECTION JIG - Provided is a connection terminal that maintains an approximately circular shape before or after a cylindrical part is fixed by resistance welding. The connection terminal used for a connection jig interconnecting target points includes a small-diameter conductive part and a large-diameter cylindrical part disposed to surround the small-diameter conductive part. The small-diameter conductive part has a front end protruding from a front end of the large-diameter cylindrical part. A part of the small-diameter conductive part is joined to a part of the large-diameter cylindrical part. A cutout part is formed in a part of a strip portion around an axis of the cylindrical part that at least includes the portion of the large-diameter cylindrical part which is joined to the small-diameter conductive part. | 03-07-2013 |
20130069682 | CIRCUIT STRUCTURE OF TEST-KEY AND TEST METHOD THEREOF - A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on. | 03-21-2013 |
20130076385 | Semiconductor Test Structures - A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension. | 03-28-2013 |
20130082728 | CIRCUIT-TEST PROBE CARD AND PROBE SUBSTRATE STRUCTURE THEREOF - A circuit-test probe card and a probe substrate structure thereof are disclosed herein to effectively narrow down the pitch of testing points of the circuit-test probe card. The circuit-test probe card utilizes the top and bottom surfaces of the probe substrate to respectively electrically connect with a circuit board and a plurality of probes. The probe substrate includes a main body having a plurality of upper contacts arranged on an upper surface thereof; and a plurality of wires penetrating the main body. Two ends of each wire are respectively exposed on the upper surface and a lower surface of the main body. The pitch of the wires exposed on the upper surface is larger than the pitch of the wires exposed on the lower surface. The wires are respectively electrically connected with the upper contacts. | 04-04-2013 |
20130093450 | VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. | 04-18-2013 |
20130099812 | Probe Cards for Probing Integrated Circuits - A device includes a probe card, which further includes a chip. The chip includes a semiconductor substrate, a test engine disposed in the chip, wherein the test engine comprises a device formed on the semiconductor substrate, wherein the device is selected from the group consisting essentially of a passive device, an active device, and combinations thereof. A plurality of probe contacts is formed on a surface of the chip and electrically connected to the test engine. | 04-25-2013 |
20130099813 | CONTACT TERMINAL FOR A PROBE CARD, AND THE PROBE CARD - A contact terminal for a probe card includes a cylindrical main body. The main body includes a pillar-shaped central portion formed of a first material and an outer housing which is formed of a second material and covers a lateral surface of the central portion, and hardness and resistivity of the second material are different from hardness and resistivity of the first material. The hardness of the second material is higher than that of the first material and the resistivity of the first material is lower than that of the second material, or the hardness of the first material is higher than that of the second material and the resistivity of the second material is lower than that of the first material. | 04-25-2013 |
20130113511 | DC-AC PROBE CARD TOPOLOGY - A DC-AC probe card for testing a DUT includes: a plurality of probe needles, each probe needle having a distal end for contacting said DUT; and a plurality of connection pathways operable to connect test instrumentation to the probe needles, wherein each connection pathway provides both a desired characteristic impedance for AC measurements and a guarded pathway for DC measurements between respective test instrument connections and probe needles. | 05-09-2013 |
20130141130 | Wafer Probe Card - A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, all components are unnecessarily to be detached entirely, thereby improving the operational speed and efficiency. | 06-06-2013 |
20130147505 | TEST PROBING STRUCTURE - A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps. | 06-13-2013 |
20130162278 | PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD - There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves. | 06-27-2013 |
20130169304 | PITCH CHANGING APPARATUS, ELECTRONIC DEVICE HANDLING APPARATUS, AND ELECTRONIC DEVICE TESTING APPARATUS - There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. | 07-04-2013 |
20130200910 | 3-DIMENSIONAL INTEGRATED CIRCUIT TESTING USING MEMS SWITCHES WITH TUNGSTEN CONE CONTACTS - A test system for testing a multilayer 3-dimensional integrated circuit (IC), where two separate layers of IC circuits are temporarily connected in order to achieve functionality, includes a chip under test with a first portion of the 3-dimensional IC, and a test probe chip with a second portion of the 3-dimensional IC and micro-electrical-mechanical system (MEMS) switches that selectively complete functional circuits between the first portion of the 3-dimensional IC in a first IC layer to circuits within the second portion of the 3-dimensional IC in a second IC layer. The MEMS switches include tungsten (W) cone contacts, which make the selective electrical contacts between circuits of the chip under test and the test probe chip and which are formed using a template of graded borophosphosilicate glass (BPSG). | 08-08-2013 |
20130222005 | CONTACT PROBE PIN - The present invention provides a contact probe pin in which a carbon film having both of conductivity and durability is formed on a base material with a tip divided, wherein Sn adherence can be reduced as much as possible to be able to maintain stable electrical contact over a long period of time, even under such circumstances that the temperature of a usage environment becomes high. The present invention relates to a contact probe pin, including a tip divided into 2 or more projections and repeatedly coming into contact with a test surface at the projection, wherein a carbon film containing a metal element is formed at least on a surface of the projection, and a radius of curvature at an apex part of the projection is 30 μm or more. | 08-29-2013 |
20130265074 | PROBE AND PROBE CARD - A probe is provided with a linear main body portion having a tip in contact with an electrode of a member to be tested in a state where a board-side end is in contact with the circuit board side of a probe card. An elastic support portion is provided on a board-side end portion of the main body portion and elastically supports the main body portion on the probe card side. The support portion has its base end side integrally fixed to the board-side end portion and is formed with the distal end side directed toward the tip portion of the main body portion and curved having an arc shape toward the main body portion side. Two pieces of the support portion are provided symmetrically on both sides sandwiching the board-side end portion and are configured by being curved, each having an arc shape with the same radius of curvature. | 10-10-2013 |
20130271172 | PROBE APPARATUS AND METHOD - A probe tip may include a plurality of spaced projections adapted to contact the input/output lands of an integrated circuit device. | 10-17-2013 |
20130314117 | SOLDER BUMP TESTING APPARATUS AND METHODS OF USE - A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in X, Y, Z dimensions, relative to the frame. A probe tip is fixed to the frame. A measuring device is mounted to the frame and maintains a spacing with relationship to the probe tip and which has an initial, known height above the chuck base. | 11-28-2013 |
20130321016 | ELECTRICAL TEST PROBE - An electrical test probe according to an embodiment includes a probe main body portion having a connection end to a circuit of a probe base plate and made of a first metal material with resiliency, and a probe tip portion having a probe tip, made of a second metal material with higher hardness than that of the first metal material for the probe main body portion, and communicating with the probe main body portion, wherein the probe main body portion and the probe tip portion are provided with a current path made of an equal metal material extending from the probe tip to the connection end. | 12-05-2013 |
20130321017 | SENSOR AND TRANSPORTING DEVICE INCLUDING THE SAME - A sensor detects a workpiece ready for transportation by means of an outwardly hanging contact arm which, when the workpiece is dropped or placed on a carrying frame, is pushed back into a groove in the body of the sensor and in that location gives a contact signal to start the transport, avoiding damage to the hanging arm or to its mechanism otherwise caused by the continuing weight or impact of the dropped or placed workpiece. | 12-05-2013 |
20130335111 | EDDY CURRENT INSPECTION PROBE - A probe for transporting a nondestructive inspection sensor through a tube, that employs wheels to reduce friction. The radial travel of the wheels are mechanically linked through a cam and axially reciprocal plunger arrangement that centers the probe at tube diameter transitions. Internal wire bending is minimized and a dynamic seal is provided to facilitate an insertion force at the probe and reduce or eliminate compressive load buckling of the flexible cable carried by the probe. Like the wheel arrangement, radial travel of the seal segments are mechanically linked to provide probe centering. | 12-19-2013 |
20130335112 | DEVICE FOR TESTING ELECTRONIC COMPONENT DEVICES - A device for testing electronic component devices mounted on a substrate, having test pins which can be placed on contact surfaces of the substrate. A frame-like support structure is provided, which supports the substrate such that the individual component devices are located in open spaces of the support structure. | 12-19-2013 |
20130342234 | PROBE-ON-SUBSTRATE - Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls. | 12-26-2013 |
20140015558 | CURRENT APPLYING DEVICE - A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device | 01-16-2014 |
20140035609 | PROBE CARD WITH SIMPLIFIED REGISTRATION STEPS AND MANUFACTURING METHOD THEREOF - A probe card is provided. The probe card includes a probe module and a first carrier board. The probe module has a plurality of probes. The probe module is disposed on the first carrier board. The first carrier board is at least partially light-transmitted and has a plurality of vias and a plurality of conductive fillers. The vias are filled with the conductive fillers, respectively. The probe module is electrically connected to the conductive fillers. With the first carrier board being partially light-transmitted, not only is it feasible to simplify the steps of registering the probe card and a device under test, but it is also feasible for an inspector to inspect the contact between the probe card and the device under test synchronously. | 02-06-2014 |
20140062518 | ADJUSTABLE MEASUREMENT DEVICE - An adjustable measurement device includes a case, a positive contact portion, a negative contact portion, a test probe, a first wire, and a second wire. The positive contact portion is positioned on an end of the case and electrically connected to the first wire. The negative contact portion is movably received in the case and electrically connected to the second wire. A receiving hole is defined in the negative contact portion for the test probe. The test probe includes a main body electrically connected to the negative contact portion, a tip portion electrically connected to the positive contact portion, and an insulating portion positioned between the main body and the tip portion. A distance between the positive contact portion and the negative contact portion is adjustable by moving the negative contact portion. The negative contact portion and the positive contact portion are isolated from each other. | 03-06-2014 |
20140091822 | BLADE TYPE MICRO PROBE AND METHOD OF MANUFACTURING THE SAME - A blade type micro probe and a method of manufacturing the same are disclosed. The method includes forming a plating seed layer on a substrate, a first blade structure on the plating seed layer and a second blade structure on the first blade structure, wherein the first blade structure includes a first second patterned photo resist layer and a metal layer filling up the voids in the first second patterned photo resist layer and the second blade structure includes a second patterned photo resist layer and an another metal layer filling up the voids in the second patterned photo resist layer, then removing the first and second patterned photo resist layers, and finally removing the plating seed layer and the substrate, thereby forming the blade type micro probe. The first patterned photo resist layer is different from the second patterned photo resist layer in shape. | 04-03-2014 |
20140091823 | ELECTRICAL CONTACT MEMBER - Provided is an electrical contact member which is capable of maintaining stable conductivity over a long period of time, while achieving low adhesion to a test subject, in particular, an electrical contact member which is capable of maintaining stable electrical contact over a long period of time by suppressing increase in the contact resistance, while achieving low adhesion to a test subject even after repeated contact at high temperatures around 85° C. or after being left in the atmosphere for a long period of time. The present invention relates to an electrical contact member, which repeatedly comes into contact with a test subject, and wherein the surface of the electrical contact member, said surface coming into contact with the test subject, is configured of a carbon coating film that contains Pd. | 04-03-2014 |
20140103951 | AUTOMATIC PROBE GROUND CONNECTION CHECKING TECHNIQUES - A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid. | 04-17-2014 |
20140103952 | GROUND CONTACT OF AN INTEGRATED CIRCUIT TESTING APPARATUS - A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material. | 04-17-2014 |
20140139249 | APPARATUS AND A METHOD FOR DETECTING DEFECTS WITHIN PHOTOVOLTAIC MODULES - An apparatus and a method for detecting defects within a photovoltaic module are provided. To detect defects within the photovoltaic module, light from a light source is directed towards the photovoltaic module. The light generates a voltage within each solar cell of the photovoltaic module. The generated voltages are measured and compared in order to detect defects within the solar cells of the photovoltaic module. | 05-22-2014 |
20140159760 | CONNECTOR FOR ACTUATOR OF CAMERA - A connector includes a support and an arm. The support is to support a to-be-test workpiece. The arm is rotatably connected to the support and includes a number of probes. Pinheads of the probes faces the support. When the arm is rotated to a predetermined position relative to the support, the pinheads of the probes contacts with a flexible printed circuit (FPC) of the to-be-tested workpiece. | 06-12-2014 |
20140184260 | CONDUCTIVE TEST PROBE - A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node. | 07-03-2014 |
20140197859 | Probe Head - A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer. | 07-17-2014 |
20140292364 | SEMICONDUCTOR CHIP PROBE AND THE CONDUCTED EME MEASUREMENT APPARATUS WITH THE SEMICONDUCTOR CHIP PROBE - The present invention discloses a semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die and a conducted EME measurement apparatus with the semiconductor chip probe. The semiconductor chip probe comprises a substrate, a dielectric layer, an impedance unit, a measuring unit and a connection unit. The measurement apparatus comprises a semiconductor chip probe, a high frequency probe, a signal cable and a test receiver. The integrated passive component network designed and embedded inside the semiconductor chip probe forms the 1Ω or 150Ω impedance network. And the semiconductor chip probe is able to directly couple the EME conducted current or voltage from the test pin of the flipped chip under test to the test receiver for measurement. | 10-02-2014 |
20140320158 | Electrical Probe for Testing Electronic Device - An electrical probe comprises a cylindrical body which has a first end including a plurality of claws and a second end opposite to the first end for cooperating with an electrical test machine, wherein a concave contact surface conforming with the curvature of a solder ball of an electronic device under test is formed between the claws, whereby the first end of the cylindrical body can be brought into line contact with the solder ball at a predetermined length to ensure a proper electrical connection, so that the accuracy of an electrical test can be increased. | 10-30-2014 |
20150008950 | MANUFACTURING ADVANCED TEST PROBES - Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed. | 01-08-2015 |
20150130490 | PROBE APPARATUS FOR TESTING CHIPS - The present invention relates to a probe apparatus for testing the quality of semiconductor chips, wherein the probe apparatus for testing chips has superior reliability and durability. The probe apparatus of the present invention comprises: a printed circuit board having a center with a through-hole; a pin holder which is attached to the front surface of the printed circuit board and which has a plurality of pinholes; a plurality of probe pins, each of which has an L-shape with a horizontal end connected to one side end of a circuit pattern formed on the printed circuit board, and a vertical end exposed outwardly from the upper surface of the pinhole; and a back cover attached to the back surface of the printed circuit board. | 05-14-2015 |
20150145546 | COATED PROBE AND METHOD OF FABRICATING THE SAME - A coated probe is provided. The probe includes a probe body and a cladding layer. The probe body has a terminal. The cladding layer covers the surface of the terminal of the probe body, wherein the cladding layer includes a carbon nano-material layer, and the carbon nano-material layer includes a carbon nano-material. | 05-28-2015 |
20150293148 | Electrical Circuit Tester with an Edge Lit Display - A circuit tester is provided in which an edge lit display is incorporated into the handle of a circuit tester and the indicators lights are arranged in the handle, and the handle is formed in such a manner, that the indicator lights can also illuminate the work area of the circuit tester. | 10-15-2015 |
20150293149 | Test probe and method of manufacturing a test probe - A test probe for testing a chip package s provided, wherein the test probe comprises a test probe body comprising a conductive material; and a probe tip arranged on an end of the test probe body and comprising carbon nano tubes. | 10-15-2015 |
20150301081 | ELECTRICAL CONTACT MEMBER AND INSPECTION CONNECTION DEVICE - An electrical contact member repeatedly contacts a subject. The surface of the electrical contact member that contacts a subject is configured from a metallic-element-containing carbon coating film containing a metallic element. The surface roughness of the metallic-element-containing carbon coating film formed at an inclined surface that is at 45° with respect to the axial line of the electrical contact member is no greater than a certain value. As a result, it is possible to achieve low adhesiveness to the subject, an increase in contact resistance is stably suppressed over the long term, and it is possible to maintain a stable electrical contact. | 10-22-2015 |
20150309074 | PROBE CARD - In some embodiments, a probe card includes a PCB, a substrate, a pair of probes, a capacitive device and a first part. The PCB includes a pair of conductive paths through a first surface and a second surface of the PCB. The substrate includes a pair of conductive paths through a first surface and a second surface of the substrate. The conductive paths of the substrate and the corresponding conductive paths of the PCB are coupled between the first surface of the substrate and the second surface of the PCB. The probes and the corresponding conductive paths of the substrate are coupled beyond the second surface of the substrate. The capacitive device is coupled between a first conductive path and a second conductive path through the PCB, the substrate and the probes. The first part is configured beyond the second surface of the PCB, and holds the capacitive device. | 10-29-2015 |
20150338441 | MEASURING TIP - The present invention relates to a measuring tip having a base body, at least two measuring conductors that are connected to the base body, and at least two connecting conductors, a first connecting conductor being electrically conductively connected to one first measuring conductor of the measuring conductors and a second connecting conductor being electrically conductively connected to one second measuring conductor of the measuring conductors, the measuring conductors being fastened on a support element, and the support element being fastened on the base body by a detachable fastener so as to be replaceable. | 11-26-2015 |
20160033551 | SOCKET FOR TESTING SEMICONDUCTOR DEVICE - A socket for testing a semiconductor to electrically connect electrodes of a test device and contact balls of a semiconductor device with each other, including: contactors each of which has an upper end portion protruding to one side from a vertical line and a lower end portion protruding to the other side in such a way as to have elasticity by a structure that the upper end portion and the lower end portion are symmetric with each other; insulation parts each of which is made of an insulating elastic material and is formed integrally with the contactor to absorb the force generated when coming in contact with the contactor; and guide films each of which is made with an insulating elastic body and is formed on an upper layer of the insulation part in order to align the contact balls of the semiconductor device and the contactors. | 02-04-2016 |
20160098949 | LIQUID CRYSTAL ALIGNMENT TEST APPARATUS AND METHOD - A liquid crystal alignment test method includes: connecting a liquid crystal array substrate to be tested with a liquid crystal alignment test apparatus; applying corresponding voltages to signal input ports of the liquid crystal array substrate via a voltage providing device and then to execute an image check for the liquid crystal array substrate; and detecting resistance values of each two signal input ports of the liquid crystal array substrate via s resistance detection device to judge whether each two of the signal input ports are short-circuited. | 04-07-2016 |
20160164493 | HIGH FREQUENCY ATTENUATOR - An attenuator includes: a first circuit including a common collector or common drain amplifier formed of a first transistor having its control node connected to an input of the attenuator and its emitter or source connected to an intermediate node of the attenuator; and a second circuit including a common collector or common drain amplifier formed of a second transistor having its emitter or source connected to the intermediate node and its control node connected to an output of the attenuator. | 06-09-2016 |
20160178692 | CONTACT ASSEMBLY IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS | 06-23-2016 |