| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324755040 | Force absorption | 24 |
| 20110128026 | HELICAL SENSOR FOR TESTING A COMPOSITE MEDIUM - A sensor is provided for testing a composite medium. The sensor includes a tube and three or more conductors which are wound in a continuously parallel helix around the tube such that the conductors are interleaved. The tube is non-porous and electrically insulative. Both the proximal end and the distal end of the tube are open. Each turn of each conductor is equally spaced from the adjoining turns of the other conductors, and the conductors have a common helical length. The sensor can also include a first cap which seals the proximal end of the tube and a second cap which seals the distal end of the tube such that the interior of the tube is always filled with air. | 06-02-2011 |
| 20120038382 | PROBE AND METHOD OF MANUFACTURING SAME - A probe includes a plurality of boards each of which has a plurality of magnets, a plurality of the boards include a first board and a second board laid on the first board, a plurality of the magnets include a plurality of first magnets provided with the first board and a plurality of second magnets provided with the second board and arranged so as to respectively face a plurality of the first magnets, and the first magnet and the second magnet facing each other are provided so that mutually different magnetic poles face each other. | 02-16-2012 |
| 324755050 | Spring | 22 |
| 20110175636 | TERMINAL FOR FLAT TEST PROBE - A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle. | 07-21-2011 |
| 20130049785 | INSPECTION DEVICE FOR GLASS SUBSTRATE - Disclosed is an inspection device for a glass substrate, comprising at least one probe, a holder, a stretch controller and a control circuit. The probe is installed on the stretch controller, the stretch controller is employed to stretch the probe out of the holder as an electrical signal is received; and to retract the probe backward in the holder as the electrical signal stops. The present invention promotes the inspection efficiency for the glass substrate. | 02-28-2013 |
| 20130069684 | PROBE FOR INSPECTING ELECTRONIC COMPONENT - A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component. | 03-21-2013 |
| 20130057309 | MANUFACTURING METHOD FOR CONTACT FOR CURRENT INSPECTION JIG, CONTACT FOR CURRENT INSPECTION JIG MANUFACTURED USING SAID METHOD, AND CURRENT INSPECTION JIG PROVIDED WITH SAID CONTACT - Disclosed is a manufacturing method which enables manufacturing of an ultra-fine, thin contact for current inspection jigs. After a gold or gold alloy plating layer is formed, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer. | 03-07-2013 |
| 20130099814 | CONTACT PROBE AND PROBE UNIT - A contact probe includes a conductive first plunger including, on a same axis, a distal end portion, a flange portion, a boss portion, and a base end portion, a conductive second plunger including, on the same axis, a second distal end portion and a boss portion, and a coil spring including a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter equal to or larger than a diameter of the boss portion of the first plunger and a tightly wound portion formed by tightly winding with an inner diameter substantially equal to a diameter of the boss portion of the second plunger, so that the first plunger and the second plunger are connected to each other on the same axis. | 04-25-2013 |
| 20110298485 | SEMICONDUCTOR DEVICE TEST METHOD AND APPARATUS, AND SEMICONDUCTOR DEVICE - A method of testing a semiconductor device includes a conductive foreign matter test step of measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns, a first open circuit test step of measuring the resistance value between two points on the first conductive pattern to determine whether there is an open circuit in the first conductive pattern, and a second open circuit test step of measuring the resistance value between two points on the second conductive pattern to determine whether there is an open circuit in the second conductive pattern. The measurement of the resistance value in each of the test steps is accomplished by pressing probes vertically against the first conductive pattern or the second conductive pattern or both. | 12-08-2011 |
| 20110169516 | PROBE ELEMENT HAVING A SUBSTANTIALLY ZERO STIFFNESS AND APPLICATIONS THEREOF - A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range. | 07-14-2011 |
| 20120105090 | PROBE DEVICE FOR TESTING - The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the barrel resiliently supports the upper plunger during a testing process, thus enabling a test current to flow safely along the conductive silicon portion and improving test reliability. | 05-03-2012 |
| 20110221464 | CONTACT PROBE AND SOCKET, AND MANUFACTURING METHOD OF TUBE PLUNGER AND CONTACT PROBE - A contact probe has a tubular plunger which is not made by press working and rounding so that quality control of gold plating or the like is not necessary or not difficult. The tubular plunger is made of a metal tube with a tip that has a reduced outside diameter and notches spaced from the tip. The tip is bent inside the tube and an outer surface of the metal tube, from a bent part to a bottom side, with a small diameter defining a convex part having a larger diameter. The small diameter part of the metal tube is cut off at the end of the small diameter. | 09-15-2011 |
| 20120268154 | TESTING JIG FOR POGO PIN CONNECTOR - A testing jig of a pogo pin connector for testing a connection between at least one pogo pin and an electrical plug is disclosed. The testing jig includes a first support element, a second support element, and a platform. The first support element has a first groove and at least one opening defined therein. The second support element has a second groove corresponding to the first groove for receiving the electrical plug. The platform is disposed below the first support element, and at least one receiving hole is defined in the platform. The at least one pogo pin is disposed in the at least one receiving hole and exposed in the first groove through the at least one opening. The pogo pin is configured in various tilt angles through the platform with the opening for solving high cost of various mold developments. | 10-25-2012 |
| 20110057676 | UNIVERSAL SPRING CONTACT PIN AND IC TEST SOCKET THEREFOR - A universal spring contact pin for use in an IC test Socket includes a depressible probe member at one end and a fixed probe member at the other end. The fixed probe member preferably has a projection length chosen to allow z-axis loading of different surface mount package types within the same test socket. It also can have a relatively large tip angle which preferably terminates at a relatively sharp termination point. Preferably, the tip angle is about 90 degrees and the radius of the termination point of the tip is about 0.001 inches (0.0254 millimeters) or less. The large tip angle on the contact pin's fixed probe member provides the pin with a robust probe end that operates reliably over a large number of test cycles, is better adapted for effective use with different surface mount chip packages, and better supports a sharp tip radius. A sharp tip radius will, in turn, provide for better penetration of oxide coatings and/or foreign material on the leads of the chip packages. A test socket can be provided for the universal spring contact pins, which can include an interface wall configuration for retaining the contact pins in a z-axis alignment and for improving the signal performance of the socket at high frequencies. | 03-10-2011 |
| 20110031990 | Socketless Integrated Circuit Contact Connector - A socketless integrated circuit (IC) contact connector is provided with an electrically conductive support post. An electrically conductive spring has a first end connected to the post, and a second end. An electrically conductive first wire has a first end connected to the spring second end, and a second end. An electrically conductive loop with a loop neck is connected to the first wire second end. Typically, the loop is formed in the first wire second end. The spring and loop work in cooperation to engage an IC contact. | 02-10-2011 |
| 20110248736 | PROBE PIN AND AN IC SOCKET WITH THE SAME - The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other. | 10-13-2011 |
| 20110241715 | High Frequency Vertical Spring Probe - A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment. | 10-06-2011 |
| 20110050263 | PROBE AND METHOD OF MANUFACTURING PROBE - A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a sheet-metal plate which is bent multiple times, the sheet-metal plate having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together. | 03-03-2011 |
| 20120105089 | SEMICONDUCTOR PACKAGE HAVING TEST PADS ON TOP AND BOTTOM SUBSTRATE SURFACES AND METHOD OF TESTING SAME - A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto. | 05-03-2012 |
| 20120001650 | Test Probe - A test probe is configured to provide conductive contact with a surface on application of the probe to the surface. The probe includes a probe body having a proximal and distal end, a probe tip located at the distal end of the probe body, the probe being configured such that, when the probe tip is applied to the surface, the probe tip is moved to rotate about its axis, whereby the shaft tip can rotatably remove oxidation and/or contamination debris from between the shaft tip and the surface. | 01-05-2012 |
| 20120019277 | SPRING WIRE ROD, CONTACT PROBE, AND PROBE UNIT - A spring wire rod includes a wire core that is made of a conductive material having an electrical resistivity of equal to or lower than 5.00×10 | 01-26-2012 |
| 20120249174 | CONTACT PROBE AND SEMICONDUCTOR DEVICE SOCKET INCLUDING CONTACT PROBE - A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger. | 10-04-2012 |
| 20120313659 | Probe Card for Probing Integrated Circuits - An apparatus includes a metal housing, and a pogo pin penetrating through the metal housing. The pogo pin has a first end extending out of a first surface of the metal housing, and a second end extending out of a second surface of the metal housing, with the first and the second surfaces being opposite surfaces of the metal housing. A membrane is attached to the metal housing, wherein the membrane includes a metal line embedded therein. A metal pad is in physical contact with the pogo pin, wherein at least a portion of the metal pad is inside the membrane. | 12-13-2012 |
| 20120187971 | HIGH-FREQUENCY VERTICAL SPRING PROBE CARD STRUCTURE - The invention provides a high-frequency vertical spring probe card structure including a plurality of probes. Each of the probes includes at least one conducting layer and at least one insulating layer. The conducting layer includes a first contact end and a second contact end used for electrically contacting an external component while the probe is compressed and includes a probe body including at least one plate portion and at least one resilient portion connected to each other. The plate portion is used for supporting deformation of the resilient portion while the resilient portion is compressed vertically. The insulating layer includes at least one plate member tightly attached to the plate portion of the conducting layer correspondingly. The probe structure of the invention is simple and can be formed as multi-layer stack structure by electroplating through Lithographie GaVanoformung Abformung (LIGA) technology. | 07-26-2012 |
| 20130009658 | INSPECTION JIG AND CONTACT - In an inspection jig ( | 01-10-2013 |
