Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Probe structure

Subclass of:

324 - Electricity: measuring and testing

324500000 - FAULT DETECTING IN ELECTRIC CIRCUITS AND OF ELECTRIC COMPONENTS

324537000 - Of individual circuit component or element

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
324755040 Force absorption 25
324755070 Cantilever 12
324755110 Elongated pin or probe 8
324755100 Dendritic structure 4
20120187970Methods for making contact device for making connection to an electronic circuit device and methods of using the same - A method for manufacturing an electronic device is disclosed. A design description of the electronic device is generated using one or more computer aided design tools. Physical device data are generated that represent a physical description of the electronic device, which includes data determining connection points for connecting the electronic device to one or more external circuits. A physical embodiment of the electronic device is produced in accordance with the physical device data. Physical test member data is determined that represents conductors and contact points of a test member for testing the electronic device. The test member is produced in accordance with the test member data. The electronic device is tested with the test member.07-26-2012
20120256650TEST APPARATUS - A test apparatus includes a circuit board. The circuit board includes a number of first golden fingers arranged on a first side of the circuit board, and a first test circuit. The first test circuit includes a first capacitor. A first terminal of the first capacitor is grounded. A second terminal of the first capacitor is electrically connected to a first pin of the first golden fingers. A first test pad is connected to the second terminal of the first capacitor. A second test pad is connected to a second pin of the first golden fingers. The second pin is grounded.10-11-2012
20120319715PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices.12-20-2012
20120242362TEST APPARATUS - A test apparatus includes a circuit board and an expansion slot. A number of golden fingers are arranged on a first side of the circuit board. A second side of the circuit board is connected to a bottom of the expansion slot. The golden fingers are electrically connected to the expansion slot. A number of first test pads and second test pads are arranged on the circuit board between the first side and the second side. The first and second test pads have different shapes, sizes, and/or colors. The first and second test pads are electrically connected to pins in the expansion slot.09-27-2012
324755020 Coaxial 4
20110102007Calibrated wideband high frequency passive impedance probe - A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50Ω and 75Ω environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors. The probe includes a semi-rigid coaxial cable assembly filled with dielectric material, a silver plated center conductor, and silver plated ground outer conductor having an SMA male connector on one end and exposed center conductor at the opposite end and having uniform characteristic impedance of 50Ω or 75Ω along the cable length; a hexagonal shaped body made of anodized aluminum having raised texture on the surface for sure handling; a probe tip of gold plated aluminum with two spring loaded ground pins; a four-finger threaded cable catch for locking semi-rigid coaxial cable assembly inside the tip and for ground continuity from cable to spring loaded pins; an interface RF connector-adapter including SMA female-SMA female, BNC-SMA female, or Type N-SMA female; a locking nut to hold and lock cable assembly and connector-adapter inside the probe body; and 50Ω and 75Ω precision loads for probe calibration.05-05-2011
20120306524High Temperature- Low Leakage Probe Apparatus and Method of Manufacturing Same - In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.12-06-2012
20130015873CABLE ASSEMBLY, CONNECTOR AND SEMICONDUCTOR TESTERAANM Suzuki; TeruhitoAACI YamatoAACO JPAAGP Suzuki; Teruhito Yamato JPAANM Sakiyama; ShinAACI TokyoAACO JPAAGP Sakiyama; Shin Tokyo JP - In a cable assembly, when auxiliary ground conductor is provided so as to face the lower surface of supporting insulating member, elastically-deformed piece in an elastically deformed status comes in contact with the tip of ground terminal protruding from the lower surface of supporting insulating member.01-17-2013
20120274347INTEGRATED HIGH-SPEED PROBE SYSTEM - An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.11-01-2012
324755090 Membrane 3
20110043234SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER - A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug.02-24-2011
20110133766TRANSFORMER WITHIN WAFER TEST PROBE - A wafer test probe for testing integrated circuitry on a die is disclosed. The wafer test probe includes a membrane core. The wafer test probe also includes circuitry within the membrane core. The circuitry within the membrane core includes at least one portion of an inductor. The wafer test probe further includes a probe tip.06-09-2011
20120062261Electrically Conductive Pins For Microcircuit Tester - The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.03-15-2012
324755030 Rigid 3
20130069683TEST PROBE CARD - A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining03-21-2013
20110043233WAFER LEVEL CONTACTOR - A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.02-24-2011
20120081140PROBE CARD - Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer. The probe card for testing a semiconductor chip on a wafer includes: a space transformer body in which a plurality of unit probe modules are arranged at intervals; a main circuit board to which an electrical signal is applied from an external test device; a reinforcement plate for supporting the main circuit board such that the unit probe modules become stable against an external effect; a standing conductive medium which is inserted into a penetration portion provided in the space transformer body; a lower surface circuit board in which the standing conductive medium is electrically connected to the unit probe module as a flexible conductive medium and the standing conductive media are mounted; and a mutual connection member for electrically connecting the lower surface circuit board to the main circuit board.04-05-2012
324755080 Elastomeric 1
20110062980Probe device having first and second probe pins - A probe device includes a probe body having a plurality of first holes extending through a first face thereof and a plurality of second holes aligned with the first holes and extending through an opposite second face thereof, a plurality of spaced-apart first probe pins inserted fittingly and removably into respective first holes and each including a first contact portion extending out of the first face, and a first connecting portion extending into the respective first hole, and a plurality of spaced-apart second probe pins inserted fittingly and removably into respective second holes and each including a second contact portion extending out of the second face, and a second connecting portion extending into the respective second hole and having an insert space. The first connecting portion is inserted fittingly and removably into the insert space, and mates with the second connecting portion.03-17-2011
Entries
DocumentTitleDate
20130027072PROBING APPARATUS FOR SEMICONDUCTOR DEVICES - A probing apparatus for semiconductor devices comprises a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.01-31-2013
20130082728CIRCUIT-TEST PROBE CARD AND PROBE SUBSTRATE STRUCTURE THEREOF - A circuit-test probe card and a probe substrate structure thereof are disclosed herein to effectively narrow down the pitch of testing points of the circuit-test probe card. The circuit-test probe card utilizes the top and bottom surfaces of the probe substrate to respectively electrically connect with a circuit board and a plurality of probes. The probe substrate includes a main body having a plurality of upper contacts arranged on an upper surface thereof; and a plurality of wires penetrating the main body. Two ends of each wire are respectively exposed on the upper surface and a lower surface of the main body. The pitch of the wires exposed on the upper surface is larger than the pitch of the wires exposed on the lower surface. The wires are respectively electrically connected with the upper contacts.04-04-2013
20130033281PROBE ASSEMBLY - A probe assembly includes a probe, a transducer, and a cable electronically connecting the probe with the transducer. The cable has a jacket made of an extreme-environment resistant material.02-07-2013
20130033282CONTACT STRUCTURE AND METHOD OF MANUFACTURING CONTACT STRUCTURE - A contact structure has a probe and a housing disposed on an outer circumference thereof. The housing has a housing main body in which a hollow section vertically penetrating the same is formed, and a conductive coat film with which an inner wall surface of the hollow section is coated. The probe has a base end portion fixed in place on one end side of the housing, a conductive leading end portion that is movable in the hollow section while being in contact with the coat film and has, on a leading end thereof, a contact that comes into contact with a subject to be inspected, and an elastic portion that connects together the base end portion and the leading end portion, is disposed in the hollow section, and has elasticity.02-07-2013
20130033280SELF-RETAINING VIA PROBE - A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.02-07-2013
20130076385Semiconductor Test Structures - A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.03-28-2013
20110309853SECTIONAL TEST PROBE ASSEMBLY FOR ELECTRIC METER - The test probe assembly of the invention is used for an electric meter such as a multimeter or the like. The electric meter has a main body. The test probe assembly includes a pair of insulated rods, a pair of probe tips and a pair of leads. The insulated rods are separately provided with two corresponding engaging portions, so that the insulated rods can be combined or detached. One end of each probe tip is fixed in one of the insulated rods and the other ends are protrudent. The leads connect between the insulated rods and main body. The combination or detachment of the test probe assembly may form a variety of configurations for different measured objects.12-22-2011
20130038345PROBE STRUCTURE, PROBE APPARATUS, PROBE STRUCTURE MANUFACTURING METHOD, AND TEST APPARATUS - Probes are arranged precisely and at a narrow pitch. Provided is a probe structure receiving and transmitting an electric signal from/to a device. The probe structure includes a contact point that transmits an electric signal, a probe on which the contact point is formed, a probe pad section that is electrically coupled to the contact point, and an insulating section that is provided on the probe and that insulates a bonding wire connected to the probe pad section from the probe. A probe apparatus, a manufacturing method of a probe structure, and a test apparatus are also provided.02-14-2013
20130038344PROBE ASSEMBLY - A probe assembly includes probe heads, a first connector, and groups of second connectors. Each probe head includes a first connection portion defining two first holes, and a data cable connected to an oscilligraph. The first connector includes a fixing portion and groups of rods fixed to the fixing portion. Each group of rods includes two rods. First ends of each group of rods are detachably inserted into the first holes to electrically connect the corresponding data cable. Each group of second connectors includes a second connection portion defines two second holes, and a connection cable. Second ends of the group of rods are detachably inserted into the second holes to connect the connection cable.02-14-2013
20130069682CIRCUIT STRUCTURE OF TEST-KEY AND TEST METHOD THEREOF - A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on.03-21-2013
20130057308CONNECTION TERMINAL AND CONNECTION JIG - Provided is a connection terminal that maintains an approximately circular shape before or after a cylindrical part is fixed by resistance welding. The connection terminal used for a connection jig interconnecting target points includes a small-diameter conductive part and a large-diameter cylindrical part disposed to surround the small-diameter conductive part. The small-diameter conductive part has a front end protruding from a front end of the large-diameter cylindrical part. A part of the small-diameter conductive part is joined to a part of the large-diameter cylindrical part. A cutout part is formed in a part of a strip portion around an axis of the cylindrical part that at least includes the portion of the large-diameter cylindrical part which is joined to the small-diameter conductive part.03-07-2013
20110057675PERPENDICULAR FINE-CONTACT PROBE HAVING A VARIABLE-STIFFNESS STRUCTURE - An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.03-10-2011
20120229156TESTING APPARATUS AND RELATIVE METHOD - Embodiments of the invention may provide a testing apparatus that is used to test solar cells or other electronic devices. The testing apparatus may comprise a substantially flat support that is configured to support a substrate or other device that is to be electrically tested and a plurality of testing probes. The support comprises a plurality of through holes, each suitable for the insertion of a corresponding testing probe, to allow each probe to make contact with a testing area formed on the substrate. The testing apparatus may comprise a suction device that is associated or associable with the support, and is able to exert a holding force on the substrate that counteracts the thrusting force exerted by the testing probes.09-13-2012
20120235698TEST PROBE WITH CERAMIC COATING AND TEST INSTRUMENT - The present invention discloses a test probe including a conductive member having a first end defined by an electrically conductive tip, and an insulative member surrounding a first portion of the conductive member. The second portion of the conductive member between the first end and the first portion is coated with a layer of insulative material. The test probe in the present invention does not require separate probe tips to be carried for use on various test applications but still meet the safety requirement of IEC standard.09-20-2012
20130162278PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD - There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves.06-27-2013
20120112779RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME - Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.05-10-2012
20110279138Identifying A Signal On A Printed Circuit Board Under Test - Identifying a signal on a printed circuit board (‘PCB’) under test, including a test probe with a radio transmitter and transmitter antenna, the test probe positioned with the transmitter antenna at a test point on the PCB, the test probe transmitting a radio signal; at least two radio receivers, each receiver having a receiver antenna, each receiver antenna positioned at predetermined, separate physical locations with respect to the PCB, the receivers coupled to at least one signal strength meter, each receiver receiving the transmitted radio signal; and a signal-identifying controller connected to the signal strength meter, the signal-identifying controller reading, from the signal strength meter, signal strengths of the transmitted radio signal as received at the radio receivers; determining, in dependence upon the read signal strengths, a test signal identifier; and displaying the test signal identifier.11-17-2011
20120286817PROBE HEAD ASSEMBLIES, COMPONENTS THEREOF, TEST SYSTEMS INCLUDING THE SAME, AND METHODS OF OPERATING THE SAME - Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.11-15-2012
20120286816PROBES WITH HIGH CURRENT CARRYING CAPABILITY AND LASER MACHINING METHODS - The present invention is a probe having a distal end made of one material, a tip and a portion disposed between the distal end and the tip that is a different second material. The probe is laser machined manufactured using a nanosecond or picosecond laser.11-15-2012
20110291685PROBE12-01-2011
20120098562PROBE TIP COATING STRUCTURE FOR TEST PROBES - A probe tip coating structure for test probes includes a probe tip body and a coating element, and the probe tip body includes a rod and a probe head integrally formed a front end of the rod, and the external diameter of the rod is not greater than the external diameter of a base of the probe head, and the coating element is coated on the rod and forms a continuing section securely combined with the exterior of the rod, and a seat is coupled to an end of the continuing section and provided for assembling the test probe, such that the coating element is formed on the probe tip, and the external diameter of the coating element is close to that of the probe tip and the coating element can be securely combined with the probe tip without the risk of getting loosened or falling apart.04-26-2012
20120098561Test probe with dual switching probe tip - A test probe with a dual switching probe tip includes an insulating sheath, a conductive wire and a complex probe tip, and an end of the conductive wire is passed and connected into the insulating sheath. The complex probe tip includes a connecting section, and a first measuring head and a second measuring head extended in opposite directions from both ends of the connecting section respectively, and the first and second measuring heads are measuring heads of two different specifications and electrically connected with each other, and the connecting section is selectively combined with the insulating sheath, and the first measuring head is exposed from the insulating sheath or accommodated in the insulating sheath and electrically connected to the conductive wire. The probe tip can be switched and installed at the insulating sheath to extend the using life of the test probe or meet the requirements of fitting different specifications.04-26-2012
20110291686ELECTRIC CONTACT AND SOCKET FOR ELECTRICAL PART - A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.12-01-2011
20110291684SWITCH PROBE AND DEVICE AND SYSTEM FOR SUBSTRATE INSPECTION - A switch probe for use in a substrate inspection device to inspect a substrate includes a first tubular element, a first rod element partially accommodated in the first tubular element, and pressed into the first tubular element when the certain part is mounted for substrate inspection, a second tubular element fixed in the first tubular element, a second rod element partially accommodated in the second tubular element which is inside the first tubular element, and contacting with the first rod element when the first rod element is pressed into the first tubular element, and a fixing mechanism configured to temporarily fix the second rod element in a position so that the second rod element does not contact with the first rod element even when the first rod element is pressed into the first tubular element.12-01-2011
20110062979TEST SYSTEM AND PROBE APPARATUS - A probe apparatus includes a wire substrate with terminals; a wafer tray forming a hermetically sealed space with the wire substrate and for mounting a semiconductor wafer; a probe wafer provided between the wire substrate and the wafer tray, having an apparatus connection terminal electrically connected to a terminal of the wire substrate and wafer connection terminals electrically connected to the semiconductor chips respectively and collectively; an apparatus anisotropic conductive sheet provided between the wire substrate and the probe wafer; a wafer anisotropic conductive sheet provided between the probe wafer and the semiconductor wafer; and a decompressing section that decompresses the hermetically sealed space between the wire substrate and the wafer tray, to cause the wafer tray to move to a predetermined position from the wire substrate, to electrically connect the wire substrate and the probe wafer, and to electrically connect the probe wafer and the semiconductor wafer.03-17-2011
20110062978MULTIPLE CONTACT PROBES - The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.03-17-2011
20110199111CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT - A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.08-18-2011
20100271060MEMBRANE PROBING METHOD USING IMPROVED CONTACT - A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.10-28-2010
20120068727COMPLIANT WAFER LEVEL PROBE ASSEMBLY - A probe assembly that acts as a temporary interconnect between terminals on a circuit member and a test station. The probe assembly can include a base layer of a dielectric material printed onto a surface of a fixture. The surface of the fixture can have a plurality of cavities. A plurality of discrete contact members can be formed in the plurality of cavities in the fixture and coupled to the base layer. A plurality of conductive traces can be printed onto an exposed surface of the base layer and electrically coupled with proximal ends of one or more of the discrete contact members. A compliant layer can be deposited over the conductive traces and the proximal ends of the contact members. A protective layer can be deposited on the compliant layer such that when the probe assembly is removed from the fixture the distal ends of the contact members contact terminals on the circuit member and the conductive traces electrically couple the circuit member to a test station. Electrical devices on the probe assembly can communicate with the test station to provide adaptive testing.03-22-2012
20120068726ELECTRICAL TEST PROBE AND PROBE ASSEMBLY - An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas.03-22-2012
20120229157PROBE CARD AND MANUFACTURING METHOD THEREOF - In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.09-13-2012
20110221463SCANNING CANNULA - A scanning cannula for scanning an electrosurgical instrument for electrical insulation defects includes an elongated sleeve having a receiving end, an opposite exit end, and a passageway extending from the receiving end to the exit end. At least one sweeping contact is disposed in the passageway. A circuit in the sleeve is electrically connected to the at least one sweeping contact. A communication device is connected to the circuit to transmit signals from the circuit to a switchbox of a surgical instrument. An electrosurgical instrument inserted into the receiving end of the sleeve passes through the at least one sweeping contact, and any electrical defect of the electrosurgical instrument detected by the at least one sweeping contact is relayed as an error signal to the circuit, which communicates the error signal to the switchbox. The switchbox cuts current to the electrosurgical instrument and signals an alarm.09-15-2011
20110025358PROBE UNIT - A probe unit includes: large diameter probes; a small diameter probes; a large-diameter probe holder having large hole portions which individually hold the large diameter probes, and hole portions which have diameters smaller than those of the large hole portions, communicate with the large hole portions, and receive end portions of the small diameter probes so that the end portions come into contact with the large diameter; and a small-diameter probe holder probes having small hole portions which individually hold the small diameter probes The central axes of the large hole portion and the small hole portion that communicate with each other are separated from each other, and the small hole portions include two small hole portions which are adjacent to each other and of which central axes are separated from each other by a distance shorter than a distance between the central axes of two large hole portions that are corresponding to the two small hole portions.02-03-2011
20110043232CONTACT STRUCTURE FOR INSPECTION - A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal plates 3002-24-2011
20110115515PROBE FOR ELECTRICAL TEST, ELECTRICAL CONNECTING APPARATUS USING THE SAME, AND METHOD FOR MANUFACTURING PROBE - The embodiment of the subject matter provides a probe that is good both in mechanical characteristics and electrical characteristics. A probe for an electrical test comprises a probe main body portion made of a nickel-boron alloy, and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from that for the probe main body portion. The crystal size of the nickel-boron alloy is 50 nm at the maximum, and the contained amount of the boron is 0.02 wt % or more and 0.20 wt % or less.05-19-2011
20110241714RESISTIVE PROBING TIP SYSTEM FOR LOGIC ANALYZER PROBING SYSTEM - The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head.10-06-2011
20110080186CONTACTING COMPONENT, METHOD OF PRODUCING THE SAME, AND TEST TOOL HAVING THE CONTACTING COMPONENT - A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.04-07-2011
20110175635PROBE FOR ELECTRICAL TEST AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRICAL CONNECTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A probe for an electrical test has a foot portion coupled with a board, an arm portion extending laterally from a lower end portion of the foot portion, and a needle tip portion projecting downward from a tip end portion of the arm portion. At least one selected from a group consisting of the foot portion, the arm portion, and the needle tip portion comprises a symbol specifying a position of the probe on the board.07-21-2011
20120169366SOCKET CONTACT FOR TESTING A SEMICONDUCTOR - A socket contact for testing a semiconductor. The socket contact includes a first contact portion, a second contact portion, and first and second body portions connecting the first contact portion and the second contact portion, wherein each of the first and second body portions has a first end, a second end opposite to the first end, and a connecting portion between the first and second ends, the first end of the first body portion and the first end of the second body portion contact the first contact portion, the second end of the first body portion and the second end of the second body portion contact the second contact portion, and the connecting portion of the first body portion and the connecting portion of the second body portion are spaced apart from each other.07-05-2012
20120146677Probe Card - A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested.06-14-2012
20100277192MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.11-04-2010
20100321056SYSTEM AND METHOD OF MEASURING PROBE FLOAT - A system and method allow accurate calculation of probe float through optical free-hanging and electrical planarity measurement techniques. In accordance with an examplary embodiment, probe float may be determined by acquiring a free-hanging planarity measurement, obtaining a first electrical contact planarity measurement, and calculating probe float using results of the acquiring and the obtaining operations.12-23-2010
20110148447MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME - There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.06-23-2011
20110148448LOADED PRINTED CIRCUIT BOARD TEST FIXTURE AND METHOD FOR MANUFACTURING THE SAME - A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board.06-23-2011
20120306523PROBE CARD - There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.12-06-2012
20120306522PROBING TIP FOR A SIGNAL ACQUISITION PROBE - A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.12-06-2012
20120038381TEST PROD FOR HIGH-FREQUENCY MEASUREMENT - A test prod for high-frequency measurement having a contact-side end for electrically contacting planar structures and a cable-side end, for connecting to a cable, wherein between the contact-side end and the cable-side end a coplanar conductor structure having at least two conductors is arranged, wherein on the coplanar conductor structure a dielectric is arranged over a predetermined section between the cable-side end and the contact-side end, wherein the test prod is between the dielectric and the contact-side end such that the conductors of the coplanar conductor structure are arranged freely in space and relative to the dielectric in a suspending manner, wherein on one side of the test prod facing towards the planar structure a shielding element is arranged extending into the area of the coplanar conductor structure.02-16-2012
20110156738SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.06-30-2011
20120013358PROBING APPARATUS FOR INTEGRATED CIRCUIT TESTING - A probing apparatus for integrated circuit testing at least includes a substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a first electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate.01-19-2012
20120153980PROBE ASSEMBLY - A probe assembly includes a transducer, a cable, and a probe. A cover of the cable is made of pliable metal material or a flexible metal conduit. Opposite ends of the cable are respectively coupled to the transducer and the probe.06-21-2012
20120025859COMBINED PROBE HEAD FOR A VERTICAL PROBE CARD AND METHOD FOR ASSEMBLING AND ALIGNING THE COMBINED PROBE HEAD THEREOF - A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided.02-02-2012
20110089965PROBE CARD ANALYSIS SYSTEM AND METHOD - A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.04-21-2011
20120249173SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN VEHICLE FOR HIGH DENSITY CONNECTIONS - A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.10-04-2012
20120313658Dual Probing Tip System - A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.12-13-2012
20120212249HARD AND WEAR-RESISTING PROBE AND MANUFACTURING METHOD THEREOF - The present invention relates to a hard and wear-resisting probe and manufacturing method thereof, and particularly relates to a hard and wear-resisting probe comprising tungsten steel (WC) and manufacturing method thereof. This hard and wear-resisting probe is substantially made of a tungsten steel with high hardness and wear resistance so that the probe is difficult to be worn and the lifetime of the probe is longer. Furthermore, the frequencies for changing the probe and the cost of testing are reduced, and the testing efficiency can be improved.08-23-2012
20100321057PROBE PIN AND METHOD OF MANUFACTURING THE SAME - A probe pin having a bent portion at its tip end portion is used for a probe card, the probe pin is configured such that an angle constituted by a direction of work groove generated at a time of machine-working of a tip end portion of the probe pin and a longitudinal direction of a metal wire is set to 45 degree or less, or both directions are set to be almost parallel to each other. Due to above configuration, even if the tip end portion of the probe pin is subjected to a bending work and a worked surface is formed with recessed portion, a breakage of the probe pin caused by the recessed portion existing on the worked surface and functioning as a starting point of the breakage can be effectively prevented whereby a lowering of a production yield of the probe pin can be greatly suppressed.12-23-2010
20110121849PROBE WITH PRINTED TIP - The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.05-26-2011
20120319716PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices.12-20-2012
20110241713TEST STRUCTURE ACTIVATED BY PROBE NEEDLE - A test structure (10-06-2011
20120326743SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME - A semiconductor device includes a unit region including a circuit test region and a probe test region. The circuit test region includes a test circuit and a plurality of circuit test pads operatively coupled to the test circuit. The probe test region includes first and second probe test pads insulated from the circuit test pads, and a first resistance pattern operatively coupled to the first and second probe test pads.12-27-2012
20120280703TESTING HEAD FOR A TEST EQUIPMENT OF ELECTRONIC DEVICES - A testing head for a test equipment of electronic devices comprises a plurality of contact probes inserted into guiding holes made in at least one upper guide and in a lower guide, separate from one another by an air zone, the contact probes comprising at least one enlarged portion suitable for preventing the escape of such probes from the guiding holes. Conveniently, the enlarged portions of the contact probes adjacent according to a direction of distribution of contact pads of an integrated device to be tested have respective larger sides orthogonal to one another.11-08-2012
20110285416MULTI-POINT PROBE FOR TESTING ELECTRICAL PROPERTIES AND A METHOD OF PRODUCING A MULTI-POINT PROBE - A multi-point probe for testing electrical properties of a number of specific locations of a test sample comprises a supporting body defining a first surface, a first multitude of conductive probe arms (11-24-2011
20120286815Inspection Device Applying Probe Contact for Signal Transmission - An inspection device applying probe contact for signal transmission includes an inspection panel board; a probe base disposed on the inspection panel board and having a plurality of probes; a receiving moldboard disposed on the inspection panel board and including a fillister for receiving inspected portable electronic apparatus, and an open slot allocated facing the plurality of probes of the probe base, thereby enabling the plurality of probes to contact with corresponding signal terminals of the portable electronic apparatus; and a clamp unit disposed on the inspection panel board and consisting of an adjustable rod and a clamp block allocated at one end of the adjustable rod, the adjustable rod adjusting position of the clamp block, thereby clamping and properly positioning the portable electronic apparatus in the receiving moldboard.11-15-2012
20130009656TEST PAD STRUCTURE ON WAFER - A test pad structure on a wafer includes at least a scribe line positioned on a wafer, a pad region defined in the scribe line, and a metal pad positioned in the pad region. An area of the metal pad and an area of the pad region include a ratio, and the ratio is lower than equal to 50%.01-10-2013
20130009657DETECTION DEVICE - A detection device includes a first rod including a first contact pad, a second rod including a second contact pad, an adjusting rod fixed to the first rod, and a threaded rod fixed to the second rod, the threaded rod being screwed on the adjusting rod. The adjusting rod screws relative to the threaded rod, which causes the distance between the first contact pad and the second contact pad to be adjusted.01-10-2013
20130169304PITCH CHANGING APPARATUS, ELECTRONIC DEVICE HANDLING APPARATUS, AND ELECTRONIC DEVICE TESTING APPARATUS - There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system.07-04-2013
20110273199VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.11-10-2011
20130113511DC-AC PROBE CARD TOPOLOGY - A DC-AC probe card for testing a DUT includes: a plurality of probe needles, each probe needle having a distal end for contacting said DUT; and a plurality of connection pathways operable to connect test instrumentation to the probe needles, wherein each connection pathway provides both a desired characteristic impedance for AC measurements and a guarded pathway for DC measurements between respective test instrument connections and probe needles.05-09-2013
20130093450VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION - Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.04-18-2013
20130099813CONTACT TERMINAL FOR A PROBE CARD, AND THE PROBE CARD - A contact terminal for a probe card includes a cylindrical main body. The main body includes a pillar-shaped central portion formed of a first material and an outer housing which is formed of a second material and covers a lateral surface of the central portion, and hardness and resistivity of the second material are different from hardness and resistivity of the first material. The hardness of the second material is higher than that of the first material and the resistivity of the first material is lower than that of the second material, or the hardness of the first material is higher than that of the second material and the resistivity of the second material is lower than that of the first material.04-25-2013
20130099812Probe Cards for Probing Integrated Circuits - A device includes a probe card, which further includes a chip. The chip includes a semiconductor substrate, a test engine disposed in the chip, wherein the test engine comprises a device formed on the semiconductor substrate, wherein the device is selected from the group consisting essentially of a passive device, an active device, and combinations thereof. A plurality of probe contacts is formed on a surface of the chip and electrically connected to the test engine.04-25-2013
20130141130Wafer Probe Card - A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, all components are unnecessarily to be detached entirely, thereby improving the operational speed and efficiency.06-06-2013
20110210760PROBE AND METHOD FABRICATING THE SAME - A probe and a method fabricating the same are disclosed. The probe includes a wire and a bump, wherein the wire is formed on a substrate; and the bump is formed upon the wire. In addition, a probe block is disclosed. The probe block includes a plurality of probes disposed on a substrate, so that the probe block is composed of a plurality of wires and bumps. The wires are disposed on the substrate and each bump is disposed accurately upon an end of each wire. The bump and the wire of the probe in accordance with the present invention are formed jointlessly. The method of fabricating the probe is characterized in that a grayscale mask is utilized to form the wire on the substrate and form the bump upon the wire by using a single masking process.09-01-2011
20130147505TEST PROBING STRUCTURE - A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.06-13-2013
20110234250PROBE - A probe for testing electronic properties of a circuit board by contacting with a weld bead on the circuit board is provided. The probe includes a main body. The main body includes an end surface, a receiving portion defined on the center of the end surface, and four positioning slots communicating with the receiving portion.09-29-2011
20120019276Operation control structure for a continuity test device - There is provided an operation control structure for a continuity test device for performing lock of a connector and actuation of a continuity test part timely, low cost, easily, and surely including a connector attachment part 01-26-2012
201302009103-DIMENSIONAL INTEGRATED CIRCUIT TESTING USING MEMS SWITCHES WITH TUNGSTEN CONE CONTACTS - A test system for testing a multilayer 3-dimensional integrated circuit (IC), where two separate layers of IC circuits are temporarily connected in order to achieve functionality, includes a chip under test with a first portion of the 3-dimensional IC, and a test probe chip with a second portion of the 3-dimensional IC and micro-electrical-mechanical system (MEMS) switches that selectively complete functional circuits between the first portion of the 3-dimensional IC in a first IC layer to circuits within the second portion of the 3-dimensional IC in a second IC layer. The MEMS switches include tungsten (W) cone contacts, which make the selective electrical contacts between circuits of the chip under test and the test probe chip and which are formed using a template of graded borophosphosilicate glass (BPSG).08-08-2013
20120299611PROBE ASSEMBLY - A probe assembly includes a probe and an assistant measuring device. The probe includes a main body, a metal tip, a first cable, and a second cable. The assistant measuring device includes a base, a first pole, a second pole, an annular wall, a first input line, and a second input line. The first input line is connected to the first pole. The second input line is connected to the base. When the metal tip is inserted into the hole of the second pole, the metal tip is engaged with the second pole. The main body is engaged with the annular wall. The first cable is connected to the first input line through the metal tip, and the second and first poles. The second cable is connected to the second input line through the main body, the annular wall, and the base.11-29-2012
20120074979PROBE BLOCK - There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.03-29-2012

Patent applications in class Probe structure

Patent applications in all subclasses Probe structure