Class / Patent application number | Description | Number of patent applications / Date published |
324750190 | Adjustable support for device under test | 31 |
20100271058 | SYSTEM AND METHOD FOR PROBING WORK PIECES - A system and method of probing work pieces is described. A first and second arm each having a pivot point and a guide end are pivotally coupled together at the respective pivot points. A probe tip holder is coupled to at least one of the first arm or the second arm. A guide means guides movement of the guide ends of the pivotally coupled arms, such that movement of the guide end of the first arm and the second arm move the probe tip holder in a plane parallel to the work piece surface. | 10-28-2010 |
20110025355 | APPARATUS FOR ADJUSTING DIFFERENTIAL PROBE - An apparatus for adjusting a differential probe includes a regulator arranged therein capable of adjusting a distance between two tips of the probe. The probe is supported on the apparatus. The apparatus includes a rotatable shaft and a rotatable disk. The rotatable shaft engages with the regulator of the probe. The rotatable disk is mounted surrounding the rotatable shaft and rotatable together with the rotatable shaft. An angular ruler or a radian ruler is described on an outer surface of the rotatable disk to indicate a rotation angle or a rotation radian of the rotatable shaft, therefore the distance between the two tips of the probe are accurately adjusted. | 02-03-2011 |
20110156734 | TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES - Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell. | 06-30-2011 |
20110156735 | WAFER TEST CASSETTE SYSTEM - Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface. | 06-30-2011 |
20120025858 | PROBE CARD HOLDING APPARATUS - A probe card holding apparatus is provided and may be configured to hold a probe card in a test head. The probe card may include a clamp head formed at a center part of a back surface of the probe card, and a holding device provided at the test head and configured to engage with the clamp head. | 02-02-2012 |
20120043983 | INSPECTION DEVICE OF SEMICONDUCTOR INTEGRATED CIRCUIT, INSPECTION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT, AND CONTROL PROGRAM OF INSPECTION DEVICE OF SEMICONDUCTOR INTEGRATED CIRCUIT - An inspection device of a semiconductor integrated circuit includes a drive unit that moves a probe card back and forth and from side to side, a storage unit that stores arrangement of the semiconductor integrated circuit and a shape of the pads, and a control unit that controls the drive unit. The control unit controls the drive unit, performs an apex detection processing pressing the probe pin to the semiconductor integrated circuit, detecting positions of the probe pin where conduction is detected or not detected, and calculating coordinates of one apex of a inspection pad from detected positions, and calculates central coordinates of the inspection pad from information of the shape of the inspection pad based on the coordinates of the apex of the inspection pad. The drive unit presses the probe pin to the calculated central coordinates of the inspection pad to perform inspection. | 02-23-2012 |
20120126841 | PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card. | 05-24-2012 |
20120153978 | RIBBON TERMINAL CONNECTING APPARATUS - A ribbon terminal connecting apparatus for connecting a ribbon terminal of a photovoltaic device panel to an inspection apparatus terminal automatically when inspecting or measuring a photovoltaic device panel is provided. The ribbon-shaped terminal connecting apparatus includes a stand-up means, a base pressing means, a terminal connecting means and a moving means. The stand-up member of the stand-up means is lowered onto and contacted against the backing material of the photovoltaic device panel. The base portion of the ribbon terminal extended from the backing material is held down by the pressing means for pressing down on the base portion of the ribbon terminal. The moving means moves the stand-up member so that a leading edge of the ribbon terminal extending across the backing material is placed on the stand-up member. The terminal connecting means connects the terminal of the inspection apparatus to the ribbon terminal placed on the stand-up member. | 06-21-2012 |
20120206159 | INTERFACE - Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other. | 08-16-2012 |
20120326741 | APPARATUS FOR TRANSMISSION TESTING OF A TELECOMMUNICATIONS JACK - Apparatus ( | 12-27-2012 |
20130106453 | JIG FOR USE IN SEMICONDUCTOR TEST AND METHOD OF MEASURING BREAKDOWN VOLTAGE BY USING THE JIG | 05-02-2013 |
20140062516 | Apparatus for the Automated Testing and Validation of Electronic Components - An automatic test equipment (ATE) unit, which incorporates a mass interconnect system. The mass interconnect system is provided with a universal mounting table for use with receiver and test interface modules for electronically mounting and testing a variety of different types of electronic components or unit under test thereon. The mounting table test interface module incorporates MEMS based spring contacts to provide high-speed micro test-channels in order to establish signal connectivity between the components or unit under test and the tester, and which maintain the signal integrity up to 50 GHz without significant signal loss distortion. | 03-06-2014 |
20140210501 | TEST APPARATUS HAVING A PROBE CARD AND CONNECTOR MECHANISM - A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder. | 07-31-2014 |
20150015285 | PROBE APPARATUS - A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device | 01-15-2015 |
20150109011 | CONTROLLING ALIGNMENT DURING A THERMAL CYCLE - A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction. | 04-23-2015 |
20150145541 | INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus and an inspection method capable of reducing the effect of noises are provided. An inspection apparatus according to the present invention includes a work table | 05-28-2015 |
20150362553 | Alignment Support Device and Alignment Support Method for Probe Device - The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user. | 12-17-2015 |
20150377921 | THROUGH PROCESS FLOW INTRA-CHIP AND INTER-CHIP ELECTRICAL ANALYSIS AND PROCESS CONTROL USING IN-LINE NANOPROBING - System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached to the ceiling. The nanoprobe positioners have one nanoprobe configured for physically contacting selected points on the wafer. A force (or touch) sensor measures contact force applied by the probe to the wafer (or the moment) when the probe physically contacts the wafer. A plurality of drift sensors are provided for calculating probe vs. wafer alignment drift in real-time during measurements. | 12-31-2015 |
20160116501 | SEMICONDUCTOR EVALUATION APPARATUS AND SEMICONDUCTOR EVALUATION METHOD - A back surface potential lead-out portion has one end portion disposed in a side of a back surface of a semiconductor wafer held by a semiconductor wafer holding portion and the other end portion disposed in a side of a front surface of the semiconductor wafer held by the semiconductor wafer holding portion. The semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are movable in an in-plane direction of the semiconductor wafer. In a case where the semiconductor wafer and the semiconductor wafer holding portion that holds the semiconductor wafer are moved in the in-plane direction, a portion of the back surface potential lead-out portion located in the in-plane direction from the semiconductor wafer is fixed close to the outside of a movement region of the semiconductor wafer. | 04-28-2016 |
324750200 | Vacuum support | 12 |
20120074971 | MEASURING DEVICE FOR ELECTRICALLY MEASURING A FLAT MEASUREMENT STRUCTURE THAT CAN BE CONTACTED ON ONE SIDE - A measuring device for electrically measuring a measurement structure that can be electrically contacted at one measuring side, in particular an optoelectronic element, such as a solar cell, including at least two contacting units for electrically contacting the measurement structure and at least one support element for supporting the measurement structure with the measuring side on the support element. It is essential that the measuring device includes at least one suction line for the connection to the suction unit and at least one suction opening that is connected in a fluid-conducting manner to the suction line, wherein the suction opening is arranged in and/or on the support element such that the measurement structure can be pressed against the support element by suctioning via the suction opening. When the measurement structure rests on the support element, the contacting unit can be pressed against the measuring side of the measurement structure for the electrical contacting thereof. | 03-29-2012 |
20150028907 | PROBE APPARATUS - A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top | 01-29-2015 |
20150054533 | SIDE GRIPPING MECHANISM AND DEVICE HANDLERS HAVING SAME - An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position. | 02-26-2015 |
20160003897 | Contactor Arrangement, IC Test Handler and IC Test Arrangement - Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit. | 01-07-2016 |
20160047843 | PROBE CARD AND TEST EQUIPMENT WITH THE SAME - A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card. | 02-18-2016 |
20160054375 | WAFER INSPECTION APPARATUS - A wafer inspection apparatus includes a probe card, a chuck top, and a vacuum mechanism for evacuating a surrounding space surrounded by the chuck top and the probe card to a set pressure. The vacuum mechanism includes an electropneumatic regulator having a proportional control valve, a pressure sensor, and a valve control unit to control the proportional control valve such that a pressure measured by the pressure sensor becomes close to or equal to a set pressure; and a gas channel network switched between first mode in which a second port of the proportional control valve is connected to the surrounding space via the pressure sensor and second mode in which the second port of the proportional control valve is connected to the surrounding space and the pressure sensor is connected to the surrounding space in parallel with the proportional control valve. | 02-25-2016 |
20160069951 | METHOD FOR DETERMINING SET VALUE OF PRESSURE FOR INSPECTION IN WAFER INSPECTION APPARATUS - In a method for determining a set value of a pressure for inspection in a wafer inspection apparatus, a surrounding space sealable between a chuck top and a probe card by a vacuum mechanism is evacuated and a highest negative pressure in the surrounding space is measured as a reference pressure when the chuck top has floated by the evacuation. Then as a reference height position, a height position of the chuck top corresponding to the reference pressure is obtained. Further, a pressure in the surrounding space is decreased to a level lower than the reference pressure, the pressure in the surrounding space, when the chuck top reaches a target height position obtained by adding a preset overdrive amount for a press-contact state between the probe card and the wafer to the reference height position, is measured and the measured pressure is set as the set value of the pressure. | 03-10-2016 |
20160109512 | SEMICONDUCTOR PACKAGE TEST BLADE AND SEMICONDUCTOR PACKAGE TEST APPARATUS INCLUDING THE SAME - A semiconductor package test blade and a semiconductor package test apparatus may prevent damage to a semiconductor package and occurrence of failures in the semiconductor package during a pass/fail test on the semiconductor package. The semiconductor package test blade includes a blade body formed at a lower end portion of a pusher for testing a semiconductor package, the blade body having a first surface contacting the semiconductor package and a groove dented upward from the first surface, a vacuum suction picker configured to penetrate a central portion of the blade body and suck and pick up the semiconductor package in vacuum, and a flexible silicone layer filling the groove. A bottom surface of the flexible silicone layer may be positioned at substantially the same level as the first surface of the blade body. | 04-21-2016 |
20160154023 | SEMICONDUCTOR CHIP TESTING APPARATUS | 06-02-2016 |
20160161527 | PROBER - A prober in which a probe head can be easily replaced is provided. A prober | 06-09-2016 |
20160377653 | NON-PERMANENT TERMINATION STRUCTURE FOR MICROPROBE MEASUREMENTS - A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT. | 12-29-2016 |
20160377654 | NON-PERMANENT TERMINATION STRUCTURE FOR MICROPROBE MEASUREMENTS - A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT. | 12-29-2016 |