Class / Patent application number | Description | Number of patent applications / Date published |
324750140 | Environmental control | 13 |
20110095774 | TESTING A NONVOLATILE CIRCUIT ELEMENT HAVING MULTIPLE INTERMEDIATE STATES - A test circuit tests a nonvolatile circuit element having multiple intermediate states. The test circuit includes a waveform generator configured to apply a waveform to the circuit element connected to the test circuit. The waveform includes stress pulses applied to the circuit element over time. A detector detects a parameter of the circuit element as the waveform is applied to the circuit element. | 04-28-2011 |
20110309850 | Testing device and testing method - A testing device includes a pressure vessel, a mounting stand disposed in an internal space of the pressure vessel, on which a device to be tested is mounted, test electrodes, disposed in the internal space of the pressure vessel, that supply a test voltage to the device to be tested mounted on the mounting stand, and a pressurization unit that raises the pressure of the internal space of the pressure vessel. The test voltage is supplied from the test electrodes to the device to be tested mounted on the mounting stand, and testing of the device to be tested is carried out, in a condition that the pressure of the internal space of the pressure vessel is raised by the pressurization unit. | 12-22-2011 |
20120032696 | DEVICE AND METHOD FOR TESTING SEMICONDUCTOR DEVICE - A testing method for testing a semiconductor device includes heating the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature; conducting other functional tests other than testing of the overheat protection function in a second step after the temperature of the semiconductor device has reached the predetermined temperature; allowing the semiconductor device to generate heat by itself such that the overheat protection function of the semiconductor device is activated, detecting a first diode forward voltage of a desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is activated and computing a first computational temperature of the semiconductor device based on the detected first diode forward voltage of the desired diode contained in the semiconductor device; and determining whether the computed first computational temperature of the semiconductor device resides in the overheat protection function activating temperature range. | 02-09-2012 |
20120169364 | COMPUTER TESTING SYSTEM AND METHOD - A system for testing a computer includes a single chip microcontroller (SCM), an environmental test chamber, and a control device connected to the SCM and the environmental test chamber. The SCM repeatedly switches the computer on and off and monitors the computer's response. The environmental test chamber accommodates the computer. The control device receives monitored data from the SCM and controls temperature and humidity in the environmental test chamber. | 07-05-2012 |
20120249171 | METHOD AND DEVICE FOR THE QUALITY CONTROL OF SUPERCONDUCTING BANDS - The invention relates to a method and a device for the quality control of superconducting bands with regard to the critical current carrying capacity of the band, wherein the method comprises the following steps: a) cooling a section of the superconducting band to a temperature at which said band section becomes superconducting, wherein the length of the band equals a multiple of the band section length, b) generating an electrical transport current in the superconducting band section in the longitudinal direction of the band by contacting with a contact assembly, which comprises electrical feed and dissipation contacts spaced apart in the longitudinal direction of the band in order to generate the transport current between them, c) contacting the cooled band section with the electrical contacts of the contact assembly, which are spaced apart from one another in the longitudinal direction of the band, in order to form a measurement section over a partial length of the band section to which the transport current applied, d) continuously moving at least one part of the band in the longitudinal direction of the band through the contact section and/or through the measurement section to electrically contact the moving band so as to generate a transport current progressing through the band in the longitudinal direction of the band, e) detecting a physical measured variable on the basis of the generated transport current in relation to the measurement section by means of the measurement contacts during the movement of at least one part of the band through the measurement section, wherein the physical measured variable is a measure of the superconducting electrical transport properties of the band section or a part of the band. | 10-04-2012 |
20130147503 | Liquid Cooled Planer - A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer. | 06-13-2013 |
20140125368 | Apparatus And Method For Obtaining Uniform Light Source - An apparatus and method for increasing uniformity in light from a light source at a plurality of targets of the light include a plurality of movable aperture elements, locatable between the light source and the targets, each aperture element defining an aperture through which the light passes from the light source to an associated one of the plurality of targets associated with the aperture element along a longitudinal axis of the aperture element. A holder movably holds the plurality of aperture elements, each of the plurality of aperture elements being movable within the holder along the longitudinal axis of the aperture element to change a feature of light incident on the target associated with the aperture element. | 05-08-2014 |
20140167799 | THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTECTION AND PREVENTION TEST INTERFACE - The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection. | 06-19-2014 |
20140176170 | TEST TABLE WITH DRY ENVIRONMENT - A test table including a chuck base, a flow guide mechanism and a dry air generator is provided. The chuck base includes a test area. The flow guide mechanism is disposed around the chuck base. The dry air generator connects to the flow guide mechanism for generating a dry air. The flow guide mechanism guides the dry air to flow toward the test area to cover the test area and the object to be tested and to create a dry environment to prevent dew condensation. | 06-26-2014 |
20140210500 | SEMICONDUCTOR EVALUATING DEVICE AND SEMICONDUCTOR EVALUATING METHOD - A semiconductor evaluating device includes a chuck stage for holding a semiconductor device serving as a measuring object, a contact probe for evaluating an electrical characteristic of the semiconductor device by getting contact with the semiconductor device held on the chuck stage, and a fluid spraying portion for spraying a fluid onto the semiconductor device. | 07-31-2014 |
20150054535 | SEMICONDUCTOR TESTING APPARATUS - Provided is a probing testing apparatus of a semiconductor wafer with excellent repeatability and ease of maintenance. A gas injection port supplying oxidation preventing gas for preventing oxidation of a probe needle is provided on an inner side wall of a shielding structure mounted to a wafer probing stage within a prober so as to surround an outer side surface of a wafer. By allowing an oxidation preventing gas to flow to a part of the probe needle that is brought into contact with the wafer through an outer circumference and an upper surface of the wafer, a gas atmosphere around the probe needle is maintained by the oxidation preventing gas. With this configuration, since it is unnecessary to provide a spray nozzle above a probe card, position adjustment of the nozzle accompanying replacement of the probe card is not needed. Further, regardless of a configuration of the probe card, it is possible to blow the oxidation preventing gas even in a vertical-type probe card. | 02-26-2015 |
20150109010 | ELECTROSTATIC DISCHARGE TEST APPARATUS - An electrostatic discharge (ESD) test apparatus includes a chamber with a supporting plate, a test bench mounted on the supporting plate, a first supporting bracket, a camera installed in the chamber, and a control apparatus. The first supporting bracket includes a first rail mounted on the supporting plate, a supporting pole movably connected to the first rail, a first adjusting pole movably installed to the supporting pole, an ESD gun rotatably installed to the first adjusting pole, a first driving assembly driving the supporting pole, a second driving assembly driving the first adjusting pole, and a third driving assembly driving the ESD gun to rotate. The camera captures images and further transmits the images to the control apparatus. The control apparatus controls the first driving assembly, the second driving assembly, and the third driving assembly. | 04-23-2015 |
20160131689 | REVERBERATION CHAMBER WITH IMPROVED ELECTROMAGNETIC FIELD UNIFORMITY - The reverberation chamber comprises a shielded enclosure ( | 05-12-2016 |