Class / Patent application number | Description | Number of patent applications / Date published |
324750110 | Thermoelectric | 7 |
20130027069 | TEST JIG FOR ABLATOR - In techniques for testing and calibrating an ablator, a tissue probe emulator is connectable to a tissue ablator being tested. The emulator includes a temperature sensor, a thermoelectric unit operative to vary a temperature sensed by the temperature sensor, an adjustable electrical load, electrical control circuitry connected to the thermoelectric unit and the electrical load and operative to independently adjust the electrical load and an output of the thermoelectric unit. The emulator conveys signals emitted by the temperature sensor to the tissue ablator and conveys an ablation energy output of the tissue ablator to the electrical load. | 01-31-2013 |
20130049781 | Semiconductor Devices with Self-heating Structures, Methods of Manufacture Thereof, and Testing Methods - Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods are disclosed. In one embodiment, a semiconductor device includes a workpiece, an active electrical structure disposed over the workpiece, and at least one self-heating structure disposed proximate the active electrical structure. | 02-28-2013 |
20130234745 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface | 09-12-2013 |
20140239992 | PROBE CARD AND TEST APPARATUS INCLUDING THE SAME - A probe card including a multi-layered substrate, a plurality of needles, and a temperature controlling unit may be provided. The multi-layered substrate may include a test pattern through which a test current passes. The needles may be provided on the multi-layered substrate. The needles may be electrically connected to the test pattern and may be configured to contact an object so that the test current may be supplied to the object. The temperature controlling unit may provide the multi-layered substrate with at least one of a first temperature and a second temperature, the first temperature being higher than the second temperature. Thus, a time for setting a test temperature may be shortened. As a result, thermal deformation of the probe card and/or the object may be reduced or suppressed, and thus reliability of test result may be improved. | 08-28-2014 |
20140361799 | APPARATUS FOR TEMPERATURE CONTROLLED ELECTRICAL AND OPTICAL PROBE FAULT CHARACTERIZATION OF INTEGRATED CIRCUITS - An apparatus includes an electrically insulating thermally conductive carrier for supporting a device under test (DUT), one or more thermo-electric devices arranged with the carrier, and one or more conductive vias in the carrier to make electrical connection to the DUT for coupling to an external test apparatus. A method of testing a device under test (DUT) includes supporting the DUT on an electrically insulating thermally conductive carrier, arranging one or more thermo-electric devices coupled to the carrier to control the temperature of the DUT, connecting the DUT electrically to an external test apparatus through one or more conductive vias in the carrier, connecting the one or more thermo-electric devices to the external test apparatus, and characterizing with the external apparatus the DUT on the basis of the temperature of the DUT. | 12-11-2014 |
20160003882 | Thermoelectric System and Method - A method for detecting a fault in a thermoelectric device ( | 01-07-2016 |
20160041202 | TEST FIXTURE WITH THERMOELECTRIC COOLER AND SPRING-OPERATED HOLDING PIN - A test fixture generally includes a thermoelectric cooler (TEC) configured to regulate the temperature of a device under test (DUT). The test fixture may further include a device carrier configured to secure the DUT in a desired position relative to the TEC and a spring-operated pin configured to generate a desired contact pressure between the DUT and the TEC. The desired contact pressure may be selected to achieve a thermal coupling between the DUT and the TEC that maintains the temperature of the DUT at a desired operation level. | 02-11-2016 |