Entries |
Document | Title | Date |
20100289511 | METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER - In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant. | 11-18-2010 |
20100327891 | METHOD AND APPARATUS FOR THERMALLY CONDITIONING PROBE CARDS - Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester. | 12-30-2010 |
20110012631 | Conductive Heating - A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device. The storage device transporter also includes a conductive heating assembly that is associated with the frame. The conductive heating assembly is arranged to heat a storage device supported by the frame by way of thermal conduction. | 01-20-2011 |
20110012632 | Conductive Heating - A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a conductive heating assembly. The conductive heating assembly is arranged to heat a storage device by way of thermal conduction. | 01-20-2011 |
20110025354 | INSPECTION APPARATUS FOR PHOTOVOLTAIC DEVICES - The present invention provides an inspection apparatus for photovoltaic devices which electrifies the photovoltaic devices in a forward direction thereof to make the photovoltaic devices emit electro-luminescence light and which has a simple-structured and cheap darkroom. The inspecting apparatus of the present invention includes a darkroom ( | 02-03-2011 |
20110068813 | IN-LINE CHARACTERIZATION - An apparatus is provided and includes a thermally isolated device under test to which first and second voltages are sequentially applied, a local heating element to impart first and second temperatures to the device under test substantially simultaneously while the first and second voltages are sequentially applied, respectively and a temperature-sensing unit to measure the temperature of the device under test. | 03-24-2011 |
20110115508 | DETERMINING CRITICAL CURRENT DENSITY FOR INTERCONNECT - Solutions for determining a critical current density of a line are disclosed. In one embodiment a method of determining a critical current density in a line includes: applying a temperature condition to each of a plurality of samples including the line; calculating a cross-sectional area of the line for each of the plurality samples using data about an electrical resistance of the line over each of the temperature conditions; measuring an electrical current reading through the line for each of the plurality of samples; determining a current density through the line for each of the plurality of samples by dividing each electrical current reading by each corresponding cross-sectional area; determining an electromigration (EM) failure time for each of the plurality of samples; and determining the critical current density of the line using the current density and the plurality of EM failure times. | 05-19-2011 |
20110115510 | System and Method for Gradient Thermal Analysis by Induced Stimulus - A thermal gradient is induced in a device-under-test (DUT) and used to determine the location of a defect. In one embodiment, a laser creates a moving thermal gradient from a test site on the DUT and a respective time of flight for the thermal gradient to trigger a condition associated with the defect is determined. Repeating the time of flight testing at additional test site provides information used to trilaterate the defect in three dimensions. Alternately, a static thermal gradient is induced across at least a portion of the DUT along a first axis. The thermal gradient is incrementally walked along the first axis until the condition associated with the defect is triggered, thereby defining a first region. The thermal gradient is then induced along a second axis of the DUT and the process is repeated to define a second region. The location of the defect is determined to be the intersection of the first region with the second region. | 05-19-2011 |
20110128023 | PROBE INSPECTING METHOD AND CURABLE RESIN COMPOSITION - Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe. | 06-02-2011 |
20110181313 | EVALUATION DEVICE AND EVALUATION METHOD FOR SUBSTRATE MOUNTING APPARATUS AND EVALUATION SUBSTRATE USED FOR THE SAME - There are provided an evaluation device and an evaluation method for a substrate mounting apparatus capable of simply evaluating a temperature control function of the substrate mounting apparatus depending on evaluation conditions or circumstances and an evaluation substrate used for the same. The substrate mounting apparatus holds a target substrate mounted on a mounting surface and controls a temperature of the target substrate. The evaluation device includes an evacuable airtight chamber in which the substrate mounting apparatus is provided; an evaluation substrate which is mounted on the mounting surface instead of the target substrate and includes a self-heating resistance heater; and a temperature measurement unit which measures a temperature of the evaluation substrate. | 07-28-2011 |
20110204909 | SOLAR MODULE TEST CONTROL - A method for conditioning a photovoltaic module for testing includes setting an effective irradiance of a continuous light source at a target plane, configuring a test photovoltaic module to operate at a substantially maximum power point configuration, positioning the test photovoltaic module adjacent to the target plane, and configuring the test photovoltaic module for testing by removing the light source, cooling the test module to a testing temperature, and reversing the substantially maximum power point configuration. | 08-25-2011 |
20110221461 | METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS - The invention relates to a method for testing several electronic components ( | 09-15-2011 |
20110241711 | METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS - A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate. | 10-06-2011 |
20110248734 | ELECTRONIC DEVICE TEST APPARATUS - An electronic device test apparatus which can optimize throughput and costs is provided. | 10-13-2011 |
20110267082 | Methodologies and Test Configurations for Testing Thermal Interface Materials - Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state. | 11-03-2011 |
20110267083 | METHOD FOR MEASURING TRANSISTOR - An object is to provide a measuring method with high reproducibility in a bias-temperature stress test of a transistor in which an oxide semiconductor is used for a semiconductor layer. Provided is a measuring method of a transistor, which includes the steps of disposing a transistor in which an oxide semiconductor is used for a semiconductor layer in a measurement room having a light-blocking property, introducing dry air, nitrogen, or argon into the measurement room, and applying a predetermined voltage to a gate electrode of the transistor in the measurement room kept under an atmosphere where the dew point is greater than or equal to −110° C. and less than or equal to −60° C., whereby the amount of change in threshold voltage over time is measured. | 11-03-2011 |
20110309849 | INSPECTION METHOD FOR INSPECTING ELECTRIC CHARACTERISTICS OF DEVICES FORMED ON TARGET OBJECT - An inspection method for inspecting electric characteristics of devices formed on a target object using an apparatus including a vertical drive mechanism for lifting and lowering a movable mounting table and a control unit for controlling the vertical drive mechanism. The vertical drive mechanism includes an elevation shaft connected to the mounting table and a servo motor for driving the elevation shaft to lift and lower the mounting table. The control unit has a servo driver including a position control part for controlling a position of the motor, a torque control part for controlling a torque of the motor as a probe card is expanded or contracted by a change in temperature and a switching part for switching the position control part and the torque control part. The method includes heating or cooling the target object, controlling a position of the motor, and controlling a torque of the motor. | 12-22-2011 |
20120019274 | ELECTRONIC APPARATUS HAVING IC TEMPERATURE CONTROL - The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins. | 01-26-2012 |
20120025856 | TEMPERATURE CONTROL DEVICE AND TEMPERATURE CONTROL METHOD - Pressing an electronic device ( | 02-02-2012 |
20120098558 | CONCENTRATOR PHOTOVOLTAIC MEASURING DEVICE - A concentrator photovoltaic measuring device includes a platform, an enclosing mask, a converging lens, a concentration unit, a first temperature regulation unit, a second temperature regulation unit, a temperature detection unit, a data transmission unit, and an electricity transmission unit. With its temperature regulation function, the concentrator photovoltaic measuring device simulates the effect of seasonal temperature variation on the energy conversion efficiency of a solar cell, so as to be effective in measuring the energy conversion efficiency of the solar cell in real environment and environment having a specific variable. Also, the concentrator photovoltaic measuring device accommodates a single solar cell, so as to be capable of measuring the single solar cell. | 04-26-2012 |
20120105087 | APPARATUS FOR TESTING CIRCUIT BOARDS OF COMPUTING DEVICES AND METHODS FOR SAME - Embodiments provide apparatus for testing a primary PCB of a native computing device, the apparatus including a plurality of fixture mounting posts selectively positionable in alignment with mounting holes for the fixture mounting posts to be received in the mounting holes to support the primary PCB on the apparatus, and a fixture frame configured to support the plurality of fixture mounting posts in a plurality of selected mounting post locations, and embodiments provide methods for testing a primary PCB. | 05-03-2012 |
20120119767 | POWER CYCLING TEST ARRANGEMENT - A device instructs a power supply to provide a current to a power cycling test structure that includes a heat source interconnected with a package, via a first level interconnect mechanism, and a printed circuit board (PCB) interconnected with the package, via a second level interconnect mechanism. The device also monitors thermal feedback associated with the heat source, and monitors, based on the provided current, voltage feedback associated with the power cycling test structure. The device further determines a thermal profile of the power cycling test structure based on the thermal feedback and the voltage feedback. | 05-17-2012 |
20120119769 | APPARATUS FOR THERMAL TESTING OF A PRINTED CIRCUIT BOARD - An apparatus for thermal testing of a printed circuit board being electrically energized and being unpopulated or populated with electrical or electronic components is disclosed. The apparatus includes a device for pyrometrical scanning of surface temperatures, wherein the scanning device comprises a pyrometric sensor being movable for the purpose of scanning and being adjustable with respect to its distance from the printed circuit board. A method for operating such an apparatus is disclosed. The method includes adjusting the distance between the sensor and the printed circuit board during scanning. | 05-17-2012 |
20120212246 | METHOD AND APPARATUS FOR TESTING IC - A testing method includes measuring an electrical parameter of a device under test (DUT) and a corresponding temperature of the DUT one or more times, determining coefficients in a pre-constructed model based on a plurality of measured values of the electrical parameter and corresponding measured temperatures to characterize a relationship of the electrical parameter to the temperature, and determining a quality of the DUT based on the model and a limit value of the electrical parameter at a specified temperature. The model is pre-constructed to characterize the relationship of the electrical parameter to the temperature with the coefficients that are DUT-dependent variables. | 08-23-2012 |
20120299608 | METHOD OF TESTING RELIABILITY OF SEMICONDUCTOR DEVICE - The invention provides a method of testing reliability of a semiconductor device, wherein the semiconductor device has negative bias temperature instability NBTI. The method comprises steps of: measuring a NBTI curve of a first set of semiconductor devices; measuring 1/f noise power spectrum density and drain current at a predetermined frequency for the first set of the semiconductor devices, under a condition that the first set of the semiconductor devices are biased at a gate electric field; measuring an equivalent oxide thickness EOT of gate dielectric of the first set of the semiconductor devices; measuring 1/f noise power spectrum density and drain current at the predetermined frequency for a second set of semiconductor devices, under a condition that the second set of the semiconductor devices are biased at the gate electric field; measuring an EOT of gate dielectric of the second set of the semiconductor devices; and evaluating a degradation characteristic of the second set of the semiconductor devices by using the NBTI curve of a first set of the semiconductor devices. The method saves the time required for testing the reliability of a large numbers of semiconductor devices, and will not cause damages to the second set of semiconductor devices. | 11-29-2012 |
20120299609 | POSITIONING AND SOCKETING FOR SEMICONDUCTOR DICE - Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided. | 11-29-2012 |
20130015869 | TEMPERATURE MEASUREMENT OF ACTIVE DEVICE UNDER TEST ON STRIP TESTERAANM Francisco; RonaldoAACI ChandlerAAST AZAACO USAAGP Francisco; Ronaldo Chandler AZ USAANM Wong; Chi LungAACI GilbertAAST AZAACO USAAGP Wong; Chi Lung Gilbert AZ USAANM Messang; TimAACI GilbertAAST AZAACO USAAGP Messang; Tim Gilbert AZ USAANM Aberra; Ezana HaileAACI ChandlerAAST AZAACO USAAGP Aberra; Ezana Haile Chandler AZ US - A plurality of devices under test (DUT) are arranged in a strip tester having a temperature controlled heater block. Each DUT has a respective set of electrical test probes and a thermally conductive test probe for electrically and thermally coupling, respectively, of the strip tester to the DUTs. Temperature measurement of each of the plurality of DUTs is performed by a temperature measuring device. The temperature measuring device can be part of the test board of the strip tester and will be in thermal communications with the DUT through the thermally conductive test probe, or temperature of the DUT can be measurement with an RTD embedded in the thermally conductive test probe, thereby providing faster thermal response time. | 01-17-2013 |
20130027068 | APPARATUS AND METHOD FOR TESTING OPERATION PERFORMANCE OF AN ELECTRONIC MODULE UNDER SPECIFIED TEMPERATURE - An apparatus includes a predetermined function circuit board having a primary area for accepting an electronic module to be tested, a secondary area coupled electrically with the primary area, and one cooperation electronic module installed on the secondary area and coupled electrically to the electronic module to define a predetermined function circuit. A thermal insulation device is installed in the primary area and is formed with a thermal insulation chamber for accepting the electronic module and thermally insulating the electronic module from the cooperation electronic module. A thermal control chip is disposed to control a testing temperature of the insulation chamber TIC, thereby providing a testing environment. The electronic module is electrically connected to the apparatus upon the predetermined function circuit performs a predetermined function, thereby carrying out the testing of the operation performance of the tested electronic module within the thermal insulation chamber TIC under a specified temperature. | 01-31-2013 |
20130033277 | THERMAL AND STRESS GRADIENT BASED RC EXTRACTION, TIMING AND POWER ANALYSIS - Timing, power and SPICE analysis are performed on a circuit layout, based on temperature and stress variations or gradient across the circuit layout. Specifically, the temperature and stress values of individual window locations across the layout are used to obtain temperature and stress variation aware resistance/capacitance (RC), timing, leakage and power values. In addition, in 3D integrated circuits (IC), the stress and thermal variations or gradients of one die may be imported to another die located on a different tier. | 02-07-2013 |
20130076381 | Threshold-Based Temperature-Dependent Power/Thermal Management with Temperature Sensor Calibration - A method and apparatus for temperature sensor calibration is disclosed. In one embodiment, an integrated circuit (IC) is tested at a first known temperature corresponding to a first temperature threshold. During the test, a first temperature reading is obtained from a temperature sensor. A first offset is calculated by determining the difference between the first known temperature and the first temperature reading. The first offset is recorded in a storage unit for later use during operation of the IC. During operation, the first offset may be added to temperature readings obtained from a temperature sensing unit to produce an adjusted temperature value. The adjusted temperature value may be compared to one or more temperature thresholds. Based on the comparisons, a power management unit may perform power control actions. | 03-28-2013 |
20130076382 | Apparatus and Method for Measurement of Radiation Intensity for Testing Reliability of Solar Cell, and Method for Testing Reliability of Solar Cell - An apparatus and method for measurement of radiation intensity for testing reliability of a solar cell, and a method for testing the reliability of the solar cell. The apparatus includes a first solar cell receiving a predetermined intensity of radiation or more to generate electricity, a second solar cell receiving a predetermined intensity of radiation or more to generate electricity; a temperature sensor sensing a temperature of the second solar cell; a cooler cooling the first solar cell; and a controller measuring the intensity of radiation applied to the first solar cell, and controlling the cooler to prevent the temperature of the first solar cell from increasing above a predetermined temperature depending on the temperature of the second solar cell sensed by the temperature sensor. | 03-28-2013 |
20130113509 | Temperature Control System for IC Tester - A temperature control system for IC tester, comprising: a test socket; a compressing device including a heat exchanger and a thermoelectric cooler (TEC); and a test head having a temperature sensor. The test head is configured at the front end of the compressing device such that, upon placing at least one device under test (DUT) onto the test socket, the test head coerces tightly one of the DUTs through downward pressure from the compressing device thereby allowing the temperature sensor to detect the surface temperature of the DUT to obtain a temperature signal, and then feed such a temperature signal back to a control processing unit for operations to generate a linear control signal thus that, through the control of the linear control signal, the heat absorption and heat discharge functions of the TEC are enabled to further control the temperature of the DUT within a determined range. | 05-09-2013 |
20130141126 | SIMULATION TEST CARD - A simulation test card to simulate a peripheral card to be inserted into a system to be tested includes a board, an edge connector formed on a bottom side of the board, and a first heating circuit. The first heating circuit includes a number of first switches, a number of first resistors, and a heating element. First terminal of the first switches are connected to a power pin of the edge connector. A first terminal of each first switch is connected to a first terminal of the first heating element through a corresponding first resistor. A second terminal of the first heating element is connected to a ground pin of the edge connector. Each of the switches can be selectively switched to make the first heating circuit generate different heat. | 06-06-2013 |
20130141127 | PROBE ASSEMBLY FOR INSPECTING POWER SEMICONDUCTOR DEVICES AND INSPECTION APPARATUS USING THE SAME - The present invention provides a probe assembly for inspecting power semiconductor devices, which comprises (1) a probe block having more than one probe holding hole, (2) more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and (3) one or more cooling means which cool the probe block. According to the probe assembly and the inspection apparatus having the prove assembly of the present invention, it is possible to inspect characteristics of power semiconductor devices accurately by suppressing temperature rises of the probes as well as the power semiconductor device under test. | 06-06-2013 |
20130181732 | METHODS OF PREVENTING FREEZING OF RELAYS IN ELECTRICAL COMPONENTS - Disclosed herein are methods of preventing freezing of relays in electrical components operated in specific atmospheric conditions. One such method described herein comprises monitoring a temperature of a relay with a thermocouple located on a contact of the relay while monitoring ambient temperature within the relay. Operation of the electrical component is simulated in a sub-zero temperature and high humidity condition. A freeze potential of the relay is determined by plotting a temperature cross-over curve, wherein both the ambient temperature and the contact temperature are plotted during the operation and cool down period. If the high freeze potential is determined, one or both of the relay and the electrical component are modified with a modification configured to decrease the high freeze potential. | 07-18-2013 |
20130181733 | HANDLER APPARATUS AND TEST METHOD - Provided is a handler apparatus which can connect devices under test to sockets of a test apparatus quickly and with low power consumption. The handler apparatus for conveying and connecting a plurality of devices under test to a plurality of sockets provided on a test head of a test apparatus, includes a position adjusting section that moves each of the plurality of devices under test on the test tray and adjusts the position thereof to a corresponding one of the plurality of sockets; and a device mounting section that mounts the plurality of devices under test whose positions have been adjusted by the position adjusting section, to the plurality of sockets | 07-18-2013 |
20130234744 | Diagnosis method and control unit for performing a diagnosis of a lambda sensor of the UEGO type of an exhaust system for an internal combustion engine - A method performs a diagnosis of a lambda sensor of a “UEGO” type of an exhaust system for an internal-combustion engine. The lambda sensor includes a series of pins. The diagnosis method comprises steps of: heating the lambda sensor to cause the lambda sensor to reach an inner temperature that is higher than about 600° C.; polarizing a first one of the pins by connecting the first pin to a supply voltage through a first limiting resistance; measuring a voltage of all of the pins while the first pin is connected to the supply voltage; and diagnosing a presence of a short circuit to an electrical ground if the voltage of at least one of the pins is lower than a predetermined threshold. A control unit performs the diagnosis. | 09-12-2013 |
20130249577 | ACCELERATED LIFETIME TESTING APPARATUS AND METHODS FOR PHOTOVOLTAIC MODULES - Methods and apparatus for performing an accelerated lifetime test on a photovoltaic device are provided. The method can include positioning a first photovoltaic device in a first holder adjacent to a light guide such that a transparent surface of the photovoltaic device faces the light guide, directing light emitted from a first light source into the light guide, and redirecting the light emitted from the first light source within the light guide to illuminate the transparent surface of the photovoltaic device. | 09-26-2013 |
20130271169 | Apparatus and Method for Electronic Sample Preparation - A method and apparatus for preparing electronic samples for a subsequent treatment, e.g., application of a failure analysis treatment. In one embodiment, an electronic device is mounted on a thermally controlled plate and a select temperature is applied thereto. While maintaining the select temperature applied to the thermally controlled plate, a sample preparation process is performed on the electronic device, such as, e.g., performing polishing, thinning, milling, lapping or extracting one or more semiconductor dies that form the electronic device. | 10-17-2013 |
20130278279 | METHOD FOR THERMAL STABILIZATION OF PROBE CARD AND INSPECTION APPARATUS - In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable. | 10-24-2013 |
20130285684 | INSPECTION APPARATUS - An inspection apparatus includes a probe substrate, a socket secured to the probe substrate, a heating element wire wound around the socket, a probe tip detachably connected to the socket, a stage on which an object to be measured is mounted, and a heating unit for heating the stage. | 10-31-2013 |
20130307572 | BATTERY SIMULATION CIRCUIT - A battery simulation circuit simulates a rechargeable battery. The battery simulation circuit includes an integrated amplifier, a voltage adjustment unit, a current limitation unit, and a feedback unit. The voltage adjustment unit provides a reference voltage for the integrated amplifier; the current limitation unit provides a reference current for the integrated amplifier and the feedback unit provides a negative feedback signal for the integrated amplifier to control the integrated amplifier working in a linear state. The integrated amplifier outputs an output signal according to the reference voltage and the reference current; the battery simulation circuit supplies power for an electronic device. When the output terminal is connected to a DC power source and a voltage of the DC power source is greater than the output voltage of the output terminal, the battery simulation circuit simulates a battery being recharged by the DC power source via the output terminal. | 11-21-2013 |
20130342230 | High Throughput Current-Voltage Combinatorial Characterization Tool and Method for Combinatorial Solar Test Substrates - Measuring current-voltage (I-V) characteristics of a solar cell using a lamp that emits light, a substrate that includes a plurality of solar cells, a positive electrode attached to the solar cells, and a negative electrode peripherally deposited around each of the solar cells and connected to a common ground, an articulation platform coupled to the substrate, a multi-probe switching matrix or a Z-stage device, a programmable switch box coupled to the multi-probe switching matrix or Z-stage device and selectively articulating the probes by raising the probes until in contact with at least one of the positive electrode and the negative electrode and lowering the probes until contact is lost with at least one of the positive electrode and the negative electrode, a source meter coupled to the programmable switch box and measuring the I-V characteristics of the substrate. | 12-26-2013 |
20140015556 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COMPLIANT PEDESTALS - A test socket assembly, useful in association with a thermal control unit used to maintain a set point temperature on an IC device under test, has at least one compliant pedestal is configured to facilitate the testing of integrated circuits where the device under test comprises a substrate having multiple IC chips with different heights and testing requirements. | 01-16-2014 |
20140015557 | Measurement Apparatus and Method - A method and apparatus for extracting the contents ( | 01-16-2014 |
20140021972 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH SOCKETS HAVING SECURED AND REPLACEABLE BUSHINGS - A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing. | 01-23-2014 |
20140021973 | APPARATUS AND METHOD FOR POWER CYCLE TEST - Provided is a power cycle test apparatus that eliminates the need to measure a thermal resistance in a power cycle test and that pursues power saving in the evaluation of IGBT reliability by exactly applying a required thermal stress through the automatic adjustment of a stress current. The power cycle test apparatus performs a power cycle test for an IGBT to be tested by applying a thermal stress to the IGBT to be tested through the intermittent application of a stress current thereto. The apparatus applies the stress current to the IGBT to be tested and thereafter applies a current for measurement to the IGBT to be tested to measure a collector-emitter voltage of the IGBT to be tested. The apparatus further obtains a junction temperature of the IGBT to be tested from the measured collector-emitter voltage and a temperature coefficient of the IGBT to be tested. | 01-23-2014 |
20140021974 | APPARATUS AND METHOD FOR POWER CYCLE TEST - Provided are a power cycle test apparatus and a power cycle test method that can efficiently reproduce nearly a level of stress that may occur in failure mode in actual environments, the apparatus which is a test apparatus for performing a power cycle test for a power semiconductor device to be tested by applying a thermal stress to the power semiconductor device through the application of a stress current thereto in predefined ON/OFF cycles executes a thermal cycle test in temperature rise-fall cycles longer than the ON/OFF cycles by using an apparatus configured to change an external environmental temperature and further executes the power cycle test while executing the thermal cycle test in synchronization with execution phases of the thermal cycle test. | 01-23-2014 |
20140028337 | METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER - In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant. | 01-30-2014 |
20140043052 | Integrated Chip with Heating Element and Reference Circuit - Some aspects of the present disclosure relate to an apparatus that includes an integrated chip having a bandgap reference circuit and one or more heating elements. The bandgap reference circuit is located within a subset of the integrated chip and outputs a reference voltage having a temperature dependence. The one or more of the heating elements vary the temperature of the subset of the integrated chip. | 02-13-2014 |
20140055154 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH EJECTION MECHANISMS - A test pusher assembly, useful in association with a thermal control unit used to maintain a set point temperature on an integrated circuit device under test, is provided with ejection mechanisms configured to facilitate the disengagement of the DUT at the end of the test. One example of the ejection mechanisms is to provide the substrate pusher assembly with spring-loaded pins that can push the substrate of the DUT away from the pedestal at the end of the test. Another example of the ejection mechanisms is to use a pressurized fluid that can push the substrate of the DUT away from the pedestal at the end of the test. | 02-27-2014 |
20140062513 | Integrated Circuit Test Temperature Control Mechanism - A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature. | 03-06-2014 |
20140084952 | SYSTEM AND METHOD FOR ANALYZING ELECTRONIC DEVICES HAVING OPPOSING THERMAL COMPONENTS - A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device. | 03-27-2014 |
20140097860 | THERMALLY ADAPTIVE IN-SYSTEM ALLOCATION - An integrated circuit device comprises component devices (that include primary and alternate devices) and storage elements connected to the component devices. The storage elements store different sets of repair addresses indicating which of the primary devices and alternate devices are to be enabled. Further, a controller is connected to the storage elements, and a temperature sensor is connected to the controller. The temperature sensor senses the temperature. The controller selects one of the different storage elements to select at least one of the sets of repair addresses based on the temperature sensed by the temperature sensor. The sets of repair addresses share use of at least one of the alternate devices and at least one of the primary devices. | 04-10-2014 |
20140111233 | APPARATUS, SYSTEMS AND METHODS FOR ENVIRONMENTAL CONTROLLED TESTING - Apparatus, systems and methods are provided for controlling a radio frequency board on an individualized basis and with respect to one or more environmental conditions, for example, temperature, pressure, humidity. In one embodiment, an enclosure configured to hold a single board includes one or more access portals and one or more interfaces, wherein the environment within the enclosure may be modified by applying one or more environmental modifiers to the enclosure through an access portal, and the operation of the board may be modified utilizing the one or more interfaces. In another embodiment, a system for testing a plurality of boards, each in their own enclosure is provided. | 04-24-2014 |
20140125364 | SYSTEM AND METHOD FOR COMPENSATING MEASURED IDDQ VALUES - An IDDQ test system and method that, in one embodiment,deg includes 1) an empirical extraction subsystem operable to generate an IDDQ versus temperature model for a given semiconductor device design, 2) an automatic test equipment (ATE) test subsystem operable to obtain a measured IDDQ value (IDDQ | 05-08-2014 |
20140125365 | Testing Electronic Components on Electronic Assemblies with Large Thermal Mass - An approach is provided in which a system under test is subjected to thermal cycling that include transferring the system under test between two different environments that generate two different ambient temperatures. In turn, a test system tests the electronic assembly in response to the electronic assembly being subjected to the thermal cycles. | 05-08-2014 |
20140125366 | METHOD FOR ESTIMATING THE END OF LIFETIME FOR A POWER SEMICONDUCTOR DEVICE - The invention regards an method for estimating the end of lifetime for a power semiconductor device, such as an IGBT power module, comprising the steps of; establishing the temperature of the power semiconductor device, determining the voltage drop over the power semiconductor device for at least one predetermined current where the current is applied when the power semiconductor device is not in operation, wherein the end of lifetime is established dependent on the change in a plurality of determined voltage drops. | 05-08-2014 |
20140167795 | ACTIVE FEEDBACK SILICON FAILURE ANALYSIS DIE TEMPERATURE CONTROL SYSTEM - Fault analysis of high power integrated circuits face thermal management challenges. This invention employs thermal diodes incorporated in the device undergoing fault analysis, and a closed loop microprocessor controlled feedback system for thermal control during test and fault analysis. | 06-19-2014 |
20140176165 | Apparatus for Three Dimensional Integrated Circuit Testing - A three-dimensional integrated circuit testing apparatus comprises a probe card configured to couple a device-under-test of a three-dimensional integrated circuit with an automatic testing equipment board having a plurality of testing modules, wherein the probe card comprises a plurality of known good dies of the three-dimensional integrated circuit, a plurality of interconnects of the three-dimensional integrated circuit and a plurality of probe contacts, wherein the probe contacts are configured to couple the probe card with testing contacts of the device-under-test of the three-dimensional integrated circuit. | 06-26-2014 |
20140176166 | ELECTRONIC LOAD MODULE AND A METHOD AND A SYSTEM THEREFOR - The present invention relates to an electronic load module and to a method and a system therefor. The method comprises receiving control data ( | 06-26-2014 |
20140210498 | ELECTRONIC APPARATUS HAVING IC TEMPERATURE CONTROL - The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins. | 07-31-2014 |
20140239990 | TESTING CONTAINER - A testing container includes a right-parallelepiped-like container, electrical components of a transformer test system which are arranged in the container and which represent a respective heat source during a testing operation, and a cooling system including at least one heat exchanger. In addition, the testing container includes a movement apparatus configured to move the at least one heat exchanger from a transport position within the container into a working position which is located at least partially outside the container. Thus, the at least one heat exchanger is movable by means of the movement apparatus from the transport position within the container into the working position which is located at least partially outside the container. | 08-28-2014 |
20140253154 | PROBING METHOD, PROBE CARD FOR PERFORMING THE METHOD, AND PROBING APPARATUS INCLUDING THE PROBE CARD - A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate. | 09-11-2014 |
20140253155 | ADAPTIVE THERMAL CONTROL - An adaptive thermal control system maintains and regulates an accurate and stable thermal environment for a device under test. The adaptive thermal control system includes (i) pre-trigger communications from automatic test equipment (ATE) to automatic thermal control (ATC) allowing slow-responding ATC to start responding to an imminent thermal change before the thermal change occurs, (ii) a control profile which indicates to the ATC, prior to anticipated thermal change, that a change is imminent and the nature of the change over time. The generation and fine-tuning of the control profile can be done by two different methods (i) with the semi-automatic approach the tester does some pre-tests in order to determine a typical response profile which the test program then adjusts using adaptive techniques, (ii) With the fully automatic adaptive circuitries same typical response profile is algorithmically adjusted and utilized to control the ATC. | 09-11-2014 |
20140300378 | System and Method for Gradient Thermal Analysis by Induced Stimulus - A thermal gradient is induced in a device-under-test (DUT) and used to determine the location of a defect. In one embodiment, a static thermal gradient is induced across at least a portion of the DUT along a first axis. The thermal gradient is incrementally walked along the first axis until the condition associated with the defect is triggered, thereby defining a first region. The thermal gradient is then induced along a second axis of the DUT and the process is repeated to define a second region. The location of the defect is determined to be the intersection of the first region with the second region. | 10-09-2014 |
20140327460 | Test Apparatus and Method for Determining Long Term Reliability of an Implantable Device - The present invention is a system and method for testing the long term reliability of an implantable device. The system provides a vessel containing temperature controlled buffered saline. A support structure suspends a test device in the vessel so it is submerged in the buffered saline and provides mechanical stress on the implantable devices. The test device is eclectically connected to a programmable signal generator and sensors to actively determine the integrity of the device during active testing. | 11-06-2014 |
20140333333 | SUBSTRATE EVALUATION APPARATUS AND SUBSTRATE EVALUATION METHOD USING THE SAME - A substrate evaluation apparatus and method which includes a substrate storage portion accommodating a substrate, first and second fastening portions are arranged in the substrate storage portion and are each fastened to a side of the substrate, a driving portion driving the first and second fastening portions, and a measurement portion measuring electrical characteristics of the substrate through application of an electrical signal to the substrate. | 11-13-2014 |
20140354312 | TEST HANDLER, TEST CARRIER AND TEST METHOD THEREOF - The present invention provides a test handler for various IC tests, which includes a chamber and a test carrier. The chamber is controllable to present a dry status. The test carrier is made of a high thermal-conductive material and includes plural positioning structures for respectively accommodating plural IC chips. The test carrier is disposed on and in thermal contact with a temperature-adjustment device in the chamber, and the temperature-adjustment device controls the temperature of the IC chips on the test carrier by thermal conduction through the test carrier. The invention also provides a test carrier used in the test handler and a test method thereof. | 12-04-2014 |
20150008945 | ELECTRIC CONNECTING APPARATUS - An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads. | 01-08-2015 |
20150008946 | ELECTRIC CONNECTING APPARATUS - An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths. | 01-08-2015 |
20150022226 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COAXIAL SOCKET - A coaxial socket useful in association with an integrated circuit (IC) device tester and having a conducting pin surrounded by an insulating layer and embedded in a conducting base. This coaxial pin configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits. | 01-22-2015 |
20150084657 | HEATING SYSTEM AND METHOD OF TESTING A SEMICONDUCTOR DEVICE USING A HEATING SYSTEM - A heating system is described for generating heat and bringing heat to a semiconductor device under test. The heating system comprises a conduction heating unit comprising a heating resistor, a thermal contact area for thermally contacting the semiconductor device under test, and a thermally conductive and electrically insulating connection between the heating resistor and the thermal contact area. The heating resistor is operable to generate a user-defined amount of heat and arranged to provide a part of the heat generated by the heating resistor to the thermal contact area via the thermally conductive and electrically insulating connection. It is also described that the heating system may further comprise a convection heating chamber operable to provide a user-defined heat-controlled convection to the semiconductor device under test. A method of testing a semiconductor device using a heating system is also described. | 03-26-2015 |
20150109009 | Systems and Methods for Conforming Device Testers to Integrated Circuit Device With Pressure Relief Valve - The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system. | 04-23-2015 |
20150137842 | PROBER - A prober includes: a wafer chuck having a conductive support surface; a movement rotation mechanism which moves and rotates the wafer chuck; a head stage which holds a probe holding portion; a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck; and a contactor which is fixed to a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member; and a back-surface electrode of a chip is electrically connected with a tester through the wafer chuck, a wiring, the stage member and the contactor. | 05-21-2015 |
20150137844 | HANDLER APPARATUS AND TEST METHOD - Provided is a handler apparatus which can connect devices under test to sockets of a test apparatus quickly and with low power consumption. The handler apparatus for conveying and connecting a plurality of devices under test to a plurality of sockets provided on a test head of a test apparatus, includes a position adjusting section that moves each of the plurality of devices under test on the test tray and adjusts the position thereof to a corresponding one of the plurality of sockets; and a device mounting section that mounts the plurality of devices under test whose positions have been adjusted by the position adjusting section, to the plurality of sockets. | 05-21-2015 |
20150145540 | SEMICONDUCTOR INSPECTION SYSTEM AND METHOD FOR PREVENTING CONDENATION AT INTERFACE PART - Provided are a semiconductor inspection system and a method for preventing condensation at an interface part. The inspection system is characterized by being equipped with: a probe apparatus configured to bring a probe into contact with a target object whose temperature is controlled so that the probe is electrically connected with the target object; a tester configured to inspect the target object by supplying an inspection signal to the target object and detect an output signal outputted from the target object; an interface part which electrically connects the probe with the tester; a vacuum seal mechanism configured to seal the interface part in an airtight state; a gas exhaust unit configured to evacuate the interior of the interface part to a depressurized atmosphere; and a dry gas supply unit configured to supply a dry gas into the evacuated interface part while controlling a flow rate of the dry gas. | 05-28-2015 |
20150309114 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE WITH HEATER SOCKET - A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits. | 10-29-2015 |
20150346242 | High di/dt Capacity Measurement Hardware - Hardware test systems are provided that have an electrical test loop with a minimum length of less than 200 mm, a maximum di/dt capacity of at least 1500A/μs and a minimum parasitic inductance of less than 100 nH. The hardware tests systems can be used for commutation measurement or other test applications requiring low stray inductance. | 12-03-2015 |
20150377946 | STRUCTURE FOR TRANSMITTING SIGNALS IN AN APPLICATION SPACE BETWEEN A DEVICE UNDER TEST AND TEST ELECTRONICS - An example structure for transmitting signals in an application space between a device under test (DUT) and test electronics includes: a circuit board that is part of an application space between test electronics and a device under test (DUT); and a coaxial structure to pass signals along electrical pathways between the test electronics and the DUT. The coaxial structure includes a signal line at least partially surrounded by a return line. | 12-31-2015 |
20150377956 | METHOD AND APPARATUS FOR INLINE DEVICE CHARACTERIZATION AND TEMPERATURE PROFILING - A methodology for inline characterization and temperature profiling that enables parallel measurement of device characteristics at multiple temperatures and the resulting device are disclosed. Embodiments may include calibrating a first device under test (DUT) with respect to at least one heating structure in a metal layer of an integrated circuit (IC), applying a heater voltage to the at least one heating structure, and measuring at least one characteristic of the first DUT at a first temperature corresponding to the heater voltage. | 12-31-2015 |
20160003894 | TESTING SYSTEM WITH DIFFERING TESTING SLOTS - A testing environment may have at least one controller connected to at least first and second testing slots positioned in a housing. The first testing slot can be configured with a first thermal range capability and the second testing slot may be configured with a second thermal range capability that differs from the first thermal range capability. | 01-07-2016 |
20160025801 | PROBE STATION FOR THE SIMULTANEOUS MEASUREMENT OF THERMAL AND ELECTRICAL CHARACTERISTICS OF THERMOELECTRIC MODULE - The present invention relate to a probe station system which can measure thermal distribution and thermographic images, and more particularly, to such an probe station which can detect an electrical characteristics change according to the supply of heat to an element, for example a thermoelectric element to measure the characteristics of the element. The probe station for the simultaneous measurement of thermal and electrical characteristics of a thermoelectric element includes: a chamber, a base, a platform, a probe unit, a heat source, and an infrared image detection unit and the thermographic image and the voltage signal of the element are synchronized in real time. | 01-28-2016 |
20160027705 | METHODS AND STRUCTURES FOR DETECTING LOW STRENGTH IN AN INTERLAYER DIELECTRIC STRUCTURE - A method for manufacturing a semiconductor device is disclosed. The method includes generating a thermo-mechanical stress within a plurality of layers of a wafer, and after generating the thermo-mechanical stress, testing an interfacial strength level associated with one or more of the plurality of layers. | 01-28-2016 |
20160047856 | PROBE DEVICE - A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction. | 02-18-2016 |
20160054377 | TESTING AND SETTING PERFORMANCE PARAMETERS IN A SEMICONDUCTOR DEVICE AND METHOD THEREFOR - A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges. | 02-25-2016 |
20160054378 | TESTING AND SETTING PERFORMANCE PARAMETERS IN A SEMICONDUCTOR DEVICE AND METHOD THEREFOR - A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges. | 02-25-2016 |
20160054379 | TESTING AND SETTING PERFORMANCE PARAMETERS IN A SEMICONDUCTOR DEVICE AND METHOD THEREFOR - A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges. | 02-25-2016 |
20160054380 | TESTING AND SETTING PERFORMANCE PARAMETERS IN A SEMICONDUCTOR DEVICE AND METHOD THEREFOR - A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges. | 02-25-2016 |
20160061885 | SEMICONDUCTOR DEVICE - A semiconductor device including: an insulating substrate; a semiconductor element mounted on the insulating substrate; an internal printed circuit board disposed on the semiconductor element; and a sealing member that seals the semiconductor element, the internal printed circuit board, and at least a portion of the insulating substrate. The sealing member is made of a sealant that includes a resin and a pigment, and that initially has a chromatic, white, or gray color, and the sealing member degrades, thereby causing color of a front surface thereof to change to a degree recognizable by a user after the semiconductor device has been in use under a prescribed condition for a prescribed duration. | 03-03-2016 |
20160109485 | ATE THERMAL OVERLOAD DETECTION AND RECOVERY TECHNIQUES - A system including an automated test equipment (ATE) and an interface board. The interface board includes a temperature monitor that compares a sensor temperature to a predetermined temperature. The associated temperature sensor may be located near one or more selected components on the device under test or the interface board. If the sensor temperature exceeds the predetermined temperature the temperature monitor turns off one or more power supplies of the ATE. | 04-21-2016 |
20160109496 | MEASUREMENT METHOD AND MEASUREMENT SYSTEM - A measurement method includes: obtaining a first temperature characteristic of a crystal oscillator based on a plurality of oscillating frequencies observed when the crystal oscillator is temporarily energized at each of a plurality of temperatures around the crystal oscillator; observing a first oscillating frequency obtained by maintaining energization of the crystal oscillator after setting the temperature around the crystal oscillator to a first temperature of the plurality of temperatures; obtaining a second temperature characteristic of a oscillating frequency when energization of the crystal oscillator is maintained based on the first temperature characteristic and the first oscillating frequency; and normalizing the first temperature characteristic at a given temperature. | 04-21-2016 |
20160109508 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD - A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel. | 04-21-2016 |
20160116528 | Thermal Control - An example test system includes: a heating mechanism; a cooling mechanism; an instrument module having one or more interfaces to receive signals from a device under test (DUT), where the instrument module includes one or more electrical components to affect the signals, where the instrument module is between the heating mechanism and the cooling mechanism, and where the heating mechanism and the cooling mechanism are each configured to operate to maintain the instrument module within a target temperature range. | 04-28-2016 |
20160131702 | ASSEMBLING DEVICES FOR PROBE CARD TESTING - An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice; and using a probe card that is matched to a pattern of dice in connection with the second wafer. | 05-12-2016 |
20160146882 | METHOD OF CONTACTING INTEGRATED CIRCUIT COMPONENTS IN A TEST SYSTEM - The invention provides a method of contacting integrated circuit components in a test system for testing integrated circuit components comprises the steps of providing an atmosphere comprising an inert gas; and contacting tips of a contactor of the test system with respective contacting areas of an integrated circuit component to be tested, the contacting being performed in the provided atmosphere comprising the inert gas. The invention further provides a test system for testing integrated circuit components that comprises means for providing an atmosphere comprising an inert gas; wherein the test system is configured to contact tips of a contactor of the test system with respective contacting areas of an integrated circuit component to be tested, and the test system is configured to perform the contacting in the provided atmosphere under operating conditions. | 05-26-2016 |
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20180024162 | TEMPERATURE-CONTROLLED MODULE FOR ELECTRONIC DEVICES AND TESTING APPARATUS PROVIDED WITH THE SAME | 01-25-2018 |
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