Entries |
Document | Title | Date |
20090034171 | INFORMATION PROCESSING DEVICE AND MANUFACTURING METHOD OF THE INFORMATION PROCESSING DEVICE - An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to supply an airflow to the cooling unit; and an airflow limitation member configured to limit the airflow supplied by the airflow supplying member. A part of the cooling unit, the airflow limitation member, and the airflow supplying member are arranged in series. An air intake part is provided in one surface of the housing part so as to intake air into the airflow limitation member. An air discharge part is provided in another surface of the housing part so as to discharge air cooling the part of the cooling unit. An air discharge unit is provided at an air discharge opening provided at one side surface of the airflow limitation member. | 02-05-2009 |
20090080150 | Heat dissipation device for portable computer - This invention relates to a heat dissipation device for portable computer. The heat dissipation device comprises: a housing including at least one fan casing and at least one duct, said fan casing having an air suction opening which communicates with said duct, at least one air outlet communicating with said fan casing being provided at the front end of said housing, at least one air inlet communicating with said fan casing being provided at the rear end of said housing; and at least one side-blow fan provided within the fan casing, the air suction face of the side-blow fan being opposite to the air suction opening, the air introducing from the air inlet into the duct passes being sucked by the side-blow fan into the fan casing after passing through the air suction opening and blowing out through the air outlet. In this manner, excellent heat dissipation effect collocating with the use of a portable computer can be obtained. In addition, noise generation is effectively prevented. Therefore, the effectiveness in practical application and the product quality can be further enhanced positively. | 03-26-2009 |
20090154090 | HEAT DISSIPATING STRUCTURE OF 1U POWER SUPPLY - A heat dissipating structure of a 1 U power supply is installed in an industrial computer host system of a universal standard specification 1 U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1 U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk. | 06-18-2009 |
20090154091 | COOLING SYSTEMS AND HEAT EXCHANGERS FOR COOLING COMPUTER COMPONENTS - Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path. | 06-18-2009 |
20090257188 | Docking Plenum for a Rack - A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum. Each rack may include wheels. | 10-15-2009 |
20090262497 | Duct System For High Power Adapter Cards - Method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet. | 10-22-2009 |
20090268391 | DISK ARRAY DEVICE AND ELECTRONIC DEVICE - Provided is a disk array device or an electronic device having an enhanced cooling performance with lower noises. The disk array device has doors in the front side and in the rear side of the device, each of the doors is formed with outside openings which are louver-like or bend-like, the louver- or bend-like openings in the doors being directed in directions which are opposite to each other between the door on the suction side and the door on the exhaust side. | 10-29-2009 |
20090303679 | MEMORY MODULE - A memory module includes a circuit board and a heat sink. The circuit board is disposed with multiple chip packages separated from each other by a spacing. The heat sink is attached to the chip packages and opened with multiple holes corresponding to the spacings. Thereby, a thermal air flow chamber is formed for an airflow to enter the spacings and exchange heat with the chip packages. | 12-10-2009 |
20090310296 | HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS - A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan. | 12-17-2009 |
20100002375 | COMPUTER ENCLOSURE WITH HEAT DISSIPATING ASSEMBLY - A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably securied to the second side of the fan. | 01-07-2010 |
20100014245 | COMPUTER ENCLOSURE WITH AIRFLOW-GUIDING DEVICE - A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot. | 01-21-2010 |
20100020486 | TECHNIQUES UTILIZING THERMAL, EMI AND FIPS FRIENDLY ELECTRONIC MODULES - An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream. | 01-28-2010 |
20100020487 | AIRFLOW CONDUCTING APPARATUS - An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct. | 01-28-2010 |
20100027216 | Cooling Systems and Electronic Apparatus - Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air. | 02-04-2010 |
20100079940 | DUAL CHAMBER SEALED PORTABLE COMPUTER - In general, in one aspect, the disclosure describes a laptop computer that can allow for enhanced cooling of a passively cooled notebook while maintaining the desired waterproof and dust resistance of the design. This is achieved by creating a separate cooling channel where air can flow through to provide cooling to an electronics enclosure connected thereto. The cooling channel may utilize membranes (e.g., hydrophobic membranes) to protect again water and dust penetration. In some cases, two fans are used in opposite directions in order to automatically clean the membranes from dust accumulation. | 04-01-2010 |
20100091449 | Modular Computing Environments - A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releasably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid. | 04-15-2010 |
20100097754 | COMPUTER ENCLOSURE WITH AIRFLOW GUIDE - A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis. | 04-22-2010 |
20100134972 | Information Handling Center Cooling System - An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor. In response to the pressure sensor determining a pressure change in the pressurized plenum, the fluid flow control adjusts the flow rate of the fluid passing through the cooling fluid supply unit to adjust the pressure in the pressurized plenum. | 06-03-2010 |
20100165568 | AIRFLOW CONDUCTING APPARATUS - An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct. | 07-01-2010 |
20100188810 | SELF-CONTAINED AND MODULAR AIR-COOLED CONTAINERIZED SERVER COOLING - A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity. | 07-29-2010 |
20100238625 | COMPUTER SYSTEM WITH FAN MODULE - A computer system includes a chassis and a fan module attached to the chassis. The fan module includes a rotor, a side panel coaxial with the rotor, and a cylindrical cover extending from the side panel for encasing the rotor. One side of the rotor is covered and protected by the side panel, while another side of the rotor is bare. The chassis includes an air vent for exposing the bare side of the rotor. An airflow-guiding part inwardly protrudes from an edge of the air vent and abuts the cylindrical cover of the fan module. | 09-23-2010 |
20100302727 | Onboard Computer Equipped with a Stand-Alone Aeraulic Cooling Device - The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. | 12-02-2010 |
20110103010 | ELECTRONIC DEVICE WITH EXPANSION CARD - An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct. | 05-05-2011 |
20110261527 | COMPUTER SYSTEM WITH WASTE HEAT RECYCLING DEVICE - A waste heat recycling device includes an air-duct, a fan and a retaining mechanism. The air-duct is connected to a heat air. The fan communicates with the air-duct. The retaining mechanism clasps the air-duct and retains the fan. The retaining mechanism includes a clip and a support ring. An edge of the air-duct is sandwiched between the clip and the support ring. | 10-27-2011 |
20110267770 | SERVER HEAT DISSIPATION SYSTEM - A server heat dissipating system includes two server assemblies, an airflow producing device configured to produce airflow, and a main airflow guiding pipe. Each server assembly includes a server cabinet configured to receive a first server and an airflow guiding device. The airflow guiding device is configured to guide airflow to the first server to dissipate heat generated by the first server. The main airflow guiding pipe is connected to the two airflow guiding devices to guide airflow from the airflow producing device to the airflow guiding devices. | 11-03-2011 |
20110292594 | Scalable Space-Optimized and Energy-Efficient Computing System - A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame. | 12-01-2011 |
20110299239 | Computer Case with Upwardly Oriented Add-On Cards and Vertical Airflow - Embodiments of the disclosed technology comprise a method of dissipating heat from within a case of a computer, and a computer case designed therefor, which functions by placing add-on cards into the computer housing or case. In this manner, convection aids in cooling off the interior of the computer as the add-on cards, which generate significant amounts of heat in some computer systems, are placed at the top. As it is unsightly to have add-on cards and their corresponding cables, and the like, exiting from the top of a computer case, in embodiments of the disclosed technology, an air channel is created between the top of the case, comprising portals for add-on cards, and a top panel. A fan may be used to aid in pushing air out of the top channel. | 12-08-2011 |
20110299240 | OPERATION PROCESSOR - A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit. | 12-08-2011 |
20120026679 | DATA CENTER - A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan. | 02-02-2012 |
20120026680 | AIR DUCT AND ELECTRONIC DEVICE INCORPORATING THE SAME - An air duct defines a first air vent and a second air vent at opposite ends thereof, respectively. The air duct includes a duct body and a movable plate. The duct body defines a through opening in a side thereof. The through hole intercommunicates an interior and an exterior of the air duct. The movable plate is mounted on the side of the duct body adjacent to the through opening. By moving the movable plate, the through opening can be changed between an open state and a closed state freely. An electronic device incorporating the air duct is also provided. | 02-02-2012 |
20120039037 | ALL-IN-ONE COMPUTER - A computer includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a base board defining a motherboard, a plurality of drive devices, a heat sink device and a fan thereon. The heat sink device includes a heat sink having a plurality of fins and a heat pipe. The base board is divided into a first part and a second part. The motherboard is located in the first part, and the drive devices are located in the second part. The fan is located between the first and second parts. The heat pipe transmits heat from a heat source on the motherboard to the plurality of fins. The fan blows air to the plurality of fins to cool the heat source on the motherboard. | 02-16-2012 |
20120044634 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a computer case having a base plate, a motherboard positioned on the base plate, and a heat sink. The motherboard includes a first heat source positioned thereon. The heat sink is positioned on the first heat source and thermally contacts with the first heat source. The motherboard includes a second heat source located on a first side of the heat sink. An angle between the second heat source and a motherboard plane is greater than 0 degrees and less than 90 degrees. Airflow from outside of the computer case is able to flow through a top surface and a bottom surface of the second heat source to dissipate heat for the first and second heat sources. | 02-23-2012 |
20120057298 | SERVER SYSTEM WITH HEAT DISSIPATION APPARATUS - An exemplary server system includes a server cabinet defining a space therein; a number of racks arranged in the space, a number of servers mounted in the racks, and a heat dissipation apparatus arranged under the racks. A channel is defined between the racks. Each of the servers includes a drawing fan. The heat dissipation apparatus includes a fan module and two heat exchangers respectively arranged at opposite sides of the fan module. The fan module is aligned with the channel for generating upward a flow of cooling air upward to the channel. During operation of the server system, the cooling air is drawn across the servers by the drawing fans to evacuate heat from the servers and becomes heated air, and the heated air flows down to the heat exchangers where the heat is dissipated from the heated air such that the heated air become the cooling air again. | 03-08-2012 |
20120099270 | HEAT DISSIPATING APPARATUS AND ELECTRONIC DEVICE WITH HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a first fan and a second fan. A clipping portion with a block is located on the first fan. A receiving hole is defined in the second fan, and two first retaining panels and a second retaining panel extend from the second fan. The two first retaining panels are substantially parallel to each other and perpendicular to the second retaining panel. The clipping portion is located between the two retaining panels and abuts the first retaining panel, and the block is engaged in the receiving hole. | 04-26-2012 |
20120134108 | RACK MOUNTED COOLING UNIT - A cooling unit ( | 05-31-2012 |
20120140407 | CONTAINER DATA CENTER AND VENTILATING SYSTEM THEREOF - An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers. | 06-07-2012 |
20130114205 | LAPTOP COOLING PAD WITH HEAT-DISSIPATING FAN ADJUSTABLE IN POSITION - A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing nodes of the fan support so that a user can push the pushing nodes to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad. | 05-09-2013 |
20130188311 | COOLING AND NOISE-REDUCTION APPARATUS - A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system. | 07-25-2013 |
20130242504 | COOLING AN ELECTRONIC ASSEMBLY USING POSITION VARIABLE FLOW RESTRICTORS - A plenum provides cooled air to an inlet of an enclosure. An electronics assembly within the enclosure includes temperature sensors. Each of a plurality of position variable flow restrictors is positioned to control flow of the cooled air to a portion of the electronics assembly. A controller individually positions each flow restrictor based on temperature measurements provided by the temperature sensors associated with the portion of the electronics assembly for which cooled air is provided via the flow restrictor. | 09-19-2013 |
20140002988 | BLADE COMPUTER SYSTEM | 01-02-2014 |
20140049906 | COMPACT FAN ASSEMBLY WITH THRUST BEARING - A fan assembly for a computing device is disclosed. The device can include an impeller having a number of blades and a motor for turning the blades. The motor can turn the blades via a magnetic interaction between the impeller and the motor. A fluid dynamic thrust bearing can be used to control a position of the impeller relative to the motor. In particular, the impeller can be configured to rotate around an axis and the thrust bearing can be used to control movement of the impeller in a direction aligned with the rotational axis. In one embodiment, the thrust bearing can be configured to stabilize the impeller when vibratory forces act upon the fan assembly. More particularly, parameters associated with the thrust bearing can be selected to counteract vibratory forces emitted by a speaker system. | 02-20-2014 |
20140071618 | Heat Dissipating Device and Blade Server - Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board. | 03-13-2014 |
20140085812 | Arrangement of Computing Assets in a Data Center - A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure. | 03-27-2014 |
20140098488 | APPARATUS, SYSTEM AND METHOD FOR CONCEALED VENTING THERMAL SOLUTION - Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described. | 04-10-2014 |
20140240919 | TARGETED COOLING TO SPECIFIC OVERHEATING RACK-MOUNTED SERVERS - A system selectively cools a set of at least one rack-mounted server in a chassis. The system comprises: a chassis; a chassis manager; a set of at least one thermal sensor coupled to each rack-mounted server in the chassis; a cold air source; a cold air conduit coupled to the cold air source; a plurality of cold air valves coupled to the cold air conduit; and an expandable tube of flexible memory material coupled to each of the plurality of cold air valves, where the expandable tube inflates with cold air from the cold air source to expose directional holes, and thus cold air, across a specific predetermined sub-area of a particular overheating rack-mounted server in response to the chassis manager detecting that the particular overheating rack-mounted server is exceeding a predetermined temperature. | 08-28-2014 |
20140254090 | MANAGING AIRFLOW SUPPLIED THROUGH SOFT DUCTS - A system for conveying air from one location to another includes a soft duct having a passage and an air flow control device. The air flow control device can be operated to vary a cross sectional area of a portion of the passage of the soft duct. | 09-11-2014 |
20150016056 | MODULE-TYPE DATA CENTER - A module type data center includes: a casing having an intake vent and an exhaust vent; a rack accommodating an electronic device; an air blower configured to introduce outside air into the casing through the intake vent and pass air through the rack from one of surfaces of the rack to another one of the surfaces of the rack; a shielding-slat unit including a plurality of shielding slats configured to change between an open state and a closed state and drive devices configured to drive the corresponding shielding slats. An inner space of the casing is divided into a first space defined between the one surface of the rack and the intake vent, a second space defined between the other surface of the rack and the exhaust vent, and a third space defined above the rack and allowing the second space to communicate with the first space. | 01-15-2015 |
20150062805 | ELECTRONIC DEVICE - An electronic device includes: a fan; a housing configured to houses the fan, the housing including a vent hole configured to introduce outside air, a first air outlet configured to open to a blowing path from the fan, and a second air outlet configured to open at a different position with respect to the blowing path; and an opening and closing member configured to open and close the first air outlet. | 03-05-2015 |
20150305206 | STORAGE APPARATUS AND STORAGE CONTROLLER OF STORAGE APPARATUS - A storage apparatus configured to provide an external apparatus with a logical storage area as a data storage area, the storage apparatus having a physical storage medium configured to generate the logical storage area, and a storage controller communicatively coupled to the physical storage medium to control data input/output processing between the external apparatus and the logical storage area, wherein the storage controller includes a circuit package including a circuit board which implements a predetermined function of the storage controller and a circuit board case to accommodate the circuit board, a plurality of cooling fan units that generate cooling air for cooling a circuit component mounted on the circuit board of the circuit package, and a chassis having a structure for accommodating the circuit package and the cooling fan units, at least some of the plurality of circuit packages are inserted to be accommodated in the chassis from one opening thereof and are arranged side by side across a width direction of the chassis. | 10-22-2015 |
20150316967 | APPARATUS, SYSTEM AND METHOD FOR CONCEALED VENTING THERMAL SOLUTION - Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described. | 11-05-2015 |
20150334878 | COOLING UNIT AND METHOD - A cooling unit including at least one heat exchanger is provided. The heat exchanger comprises an inlet for receiving coolant from a coolant supply and an outlet to exhaust coolant to a coolant return, an input line in fluid communication with the coolant supply and the inlet of the heat exchanger, an output line in fluid communication with the outlet of the heat exchanger and the coolant return, a transfer line comprising a component configured to allow fluid communication from the output line to the input line, and a controller configured to control a flow rate of coolant delivered by the transfer line. | 11-19-2015 |
20150342096 | MODULAR SYSTEM FOR DATA CENTER - A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another. | 11-26-2015 |
20150382512 | Data Centre - A data centre ( | 12-31-2015 |
20160021790 | COMPUTING RACK AIRFLOW DIRECTING SYSTEM AND METHOD - A computing rack airflow directing system includes upper and lower rails configured for releasable attachment to a computing rack, and a flexible curtain suspended between the upper and lower rails at upper and lower edges of the curtain, respectively. The curtain is movable along the rails from a retracted position proximate a first end of the rails to provide access to one or more equipment modules mounted in the computing rack to an extended position to form a plenum for directing an airflow between the equipment modules and an airflow port. The airflow port is formed at either the upper edge or the lower edge of the curtain. | 01-21-2016 |
20160081229 | STALL CONTAINMENT OF RACK IN A DATA CENTER - A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of the rack computing systems and the panels of the stalls. An air moving system moves air from the cold aisle through cold-aisle facing air inlets of the computing devices. The filler elements inhibit air moving toward the cold aisle-facing inlets from leaking through gaps between the computing devices of the rack computing systems and the stall panels such that the filler elements inhibit air moving toward inlets in the computing devices from leaking through the gaps between the computing devices in the rack and the stall panels. | 03-17-2016 |
20160081232 | Fan Control Method and Network Device - A fan control method and a network device. The method includes acquiring a temperature of a target position in the network device, determining, according to the temperature of the target position, that one air duct in a first air duct corresponding to a first air vent of the network device and a second air duct corresponding to a second air vent of the network device is a cold air duct, and that the other air duct is a hot air duct, where the first air vent and the second air vent are air vents for heat dissipation disposed for the network device in advance, and setting a rotation direction of a fan of the network device, so that cold air is inhaled from an air vent corresponding to the cold air duct, and hot air is exhausted from an air vent corresponding to the hot air duct | 03-17-2016 |
20160095250 | AIRFLOW CONTROL SYSTEM - An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate. | 03-31-2016 |
20160095262 | ELECTRONIC DEVICE - An electronic device includes a group of first cards and a group of second cards, wherein the group of first cards and the group of second cards are arranged orthogonally. An air path extends between a front part and a rear part of a chassis and a fan is positioned on at least one side of the group of second cards. An opening is formed in a second card to connect an air inlet of the fan with the air path extending between the front part and the rear part of the chassis. | 03-31-2016 |
20160124473 | COMPUTER DEVICE WITH HEAT-DISSIPATION CHANNELS - A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough. | 05-05-2016 |
20160170455 | ELECTRONIC DEVICE | 06-16-2016 |
20160198593 | MIXED/MULTI-MODE COOLING USING AIR HANDLING UNITS (AHU) PROVIDING DIRECTED CONTROLLED COOLING TO A MODULAR DATA CENTER | 07-07-2016 |
20160381837 | EXHAUST AIR DEFLECTING SYSTEM - An air deflecting system includes an air deflector that is physically mounted against a hot air exhaust vent of a network equipment element using a rack coupling mechanism that is adjustable to accommodate a variable lateral distance of the hot air exhaust vent from the computing rack. The air deflector receives an airflow from the hot air exhaust vent at a first direction and deflects the airflow in a second direction. | 12-29-2016 |
20190146562 | COMPUTER ARRANGEMENT WITH AIR-CONDUCTING ELEMENT, AND AIR-CONDUCTING ELEMENT | 05-16-2019 |