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With cooling means

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679010 - For electronic systems and devices

361679020 - Computer related housing or mounting assemblies

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
361679480 Fan 226
361679470 Plural diverse cooling means integrated into one system; e.g., fan with heat pipe or heat sink, etc. 154
361679540 Thermal conduction; e.g., heat sink 69
361679530 Liquid 32
361679520 Heat pipe 20
Entries
DocumentTitleDate
20090195977DATA CENTER COOLING - A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.08-06-2009
20110194244REMOVABLE MODULE FOR A CONSOLE - A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.08-11-2011
20100073863ELECTRONIC APPARATUS - An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.03-25-2010
20130033815AIRFLOW ADJUSTMENT DEVICE AND BLADE SERVER - An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.02-07-2013
20090190301Server device - The present invention relates to a server device which comprises a case having two symmetric slots disposed on the top and a first handle disposed in each of the slots to make it easier to lift up the server device, a horizontal partition disposed in the case and dividing the inner space of the case into upper and lower parts, wherein the upper part is a first holding space capable of holding at least an electronic device, a first heat dissipation unit is disposed at the front of the electronic, the lower part of the case is a second holding space capable of holding at least a server, and a second heat dissipation unit may be disposed at one side of the second holding space, such that a plurality of servers, electronic devices and heat dissipation units may be integrated into the server device for easily and conveniently being moved.07-30-2009
20130027873ELECTRONIC DEVICE - An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.01-31-2013
20110002098CIRCUIT, SYSTEM AND METHOD FOR CONTROLLING HEAT DISSIPATION FOR MULTIPLE UNITS ON A CIRCUIT BOARD - A circuit for controlling heat dissipation means for multiple units on a circuit board may comprise a first logical OR operation unit connected to said multiple units. The first logical OR operation unit is for performing a logical OR operation on a first set of signals output from the multiple units that represents whether any one of the multiple units has reached an overheated status. A resultant signal is output from the first logical OR operation to control an overheat protection unit connected to the first logical OR operation unit. A second logical OR operation unit is for performing a logical OR operation on a set of signals from the multiple units representing a relationship between the workload and the core temperature of a unit, whether a unit has reached an alert status and whether any of the multiple units has reached an overheated status.01-06-2011
20120218706KEYBOARD WITH ADJUSTING FUNCTION AND COMPUTER SYSTEM UTILIZING THE SAME - A keyboard adjusting heat dissipation efficiency of a heat dissipation unit disposed in a host device and including a switching unit, a control unit, and a communication port is disclosed. The switching unit is switched to different states. The control unit generates a control signal according to the state of the switching unit. The communication port transmits the control signal to the host device. The host device adjusts the heat dissipation efficiency of the heat dissipation unit according to the control signal.08-30-2012
20130058037Presence Detectable Baffle For Electrical Components In A Computing System - A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.03-07-2013
20130163190Blade And Air Deflector In A Plenum - A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.06-27-2013
20090231802CARD FIXING STRUCTURE - A card fixing structure includes a card holder for disposing at least one card. The card holder has an air deflector clamped on its one side. The air deflector catches the card to securely fix the card in the card holder, thereby reducing the number of fixing members and the manufacturing cost. Also, the card, the air deflector, and the card holder are easy to be assembled or disassembled.09-17-2009
20130163191COMPUTER SYSTEM WITH AIR DUCT - A computer system includes an enclosure, a printed circuit board, and an air duct. The enclosure comprises a bottom panel, a rear panel, and a mounting panel. The printed circuit board is mounted on the bottom panel and is located between the rear panel and the mounting panel. A plurality of expansion cards is inserted in the printed circuit board. The plurality of expansion cards is substantially parallel to each other. The air duct is placed on the rear panel and the mounting panel. The air duct comprises an air duct body and a guiding plate. The guiding plate comprises a securing portion secured to the air duct body and a plurality of bent elastic tabs extending from the securing portion at an angle. The plurality of bent elastic tabs resists the plurality of expansion cards, thereby guiding air to flow to the plurality of the expansion cards.06-27-2013
20130163189Hand-Held Electronic Devices and Related Methods for Improving Thermal Behavior of Such Devices - Hand-held electronic devices and methods for improving thermal behavior of such devices are provided. In this regard, a representative hand-held electronic device includes: a processor operative to execute instructions; a kinetic energy harvester operative to generate electrical power responsive to movement of the hand-held electronic device; and a Peltier component in thermal communication with the processor, the Peltier component being operative to receive power from the kinetic energy harvester and to remove heat from the processor.06-27-2013
20090141442Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal - A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the first and second thermal duct portions such that the block can be secured at least partially to either/or thermal duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.06-04-2009
20100202107ELECTRONIC BUILT-IN SYSTEM - An electronic built-in system for installation in a support structure mounted in a passenger compartment of a vehicle. The system includes at least one electronic module and a housing for receiving the electronic modules. The housing is mounted to the support structure of the vehicle and includes a front control panel with operating elements for operating the electronic system. The front control panel faces the passenger compartment. A cooling unit is provided in the housing for guiding cooling air through the housing for cooling the electronic modules. At least one first opening in an outer wall portion of the housing supplies cooling air to the housing. At least one second opening in an outer wall portion of the housing removes the cooling air from the housing. The first and second openings are arranged at different wall portions of the housing, which are separated from the passenger compartment by the support structure when the built in system is installed in the support structure.08-12-2010
20110279967Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.11-17-2011
20110292592THERMAL MANAGEMENT SYSTEMS AND METHODS - A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.12-01-2011
20100033920Aeraulic Cooling Device for a "Full ARINC" Computer - The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains.02-11-2010
20090168328SERVER CHASSIS WITH ACCESS FLAP - The invention relates to an access flap for shielding an opening defined in a server chassis. that the access flap includes a rotating plate, a sliding plate, and a resilient member. The rotating plate is pivotably mounted to a side of the opening of the server chassis. The rotating plate defines a plurality of first air holes therein. The sliding plate is slidably attached to the rotating plate. The sliding plate defines a plurality of second air holes therein. The resilient member includes two ends connected to the rotating plate and the sliding plate. The rotating plate can rotate and the sliding plate can slide when a functional module passes through the opening to enter into the server chassis. Thereby, he second air holes of the sliding plate are aligning with the first air holes of the rotating plate.07-02-2009
20090147465COMPUTER - A computer storing an operating system therein and including a first case, a second case, a driving mechanism and a starting unit is provided. The driving mechanism is connected between the first case and the second case. The starting unit is disposed at the first case, electrically connected to the driving mechanism, and used to start the operating system. When the starting unit starts the operating system, the driving mechanism drives a relative movement between the first case and the second case to enhance heat dissipation efficiency of the computer.06-11-2009
20110149503MULTI-SPECIFICATION FIXING MODULE AND MOTHERBOARD WITH MULTI-SPECIFICATION FIXING MODULE - A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each of the fixing sheets has a fixing hole. The specification adjusting base plate includes a plurality of adjusting portions at a periphery of the specification adjusting base plate. Each of the adjusting portions has an adjusting guiding rail group and an adjusting portion hole. The positions of the fixing sheets are adjusted according to the size of the cooler body to install the fixing sheets in the adjusting guiding rail groups, and the installing fixing accessories are connectedly fixed at the motherboard holes via the fixing holes and the adjusting portion holes to fix and install the cooler body above the socket.06-23-2011
20110267767SERVER ASSEMBLY - A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.11-03-2011
20090296343HEAT DISSIPATION SYSTEM - A heat dissipation system for an electronic device comprises a base, a fan, a pulse width modulation speed control circuit controlling the speed of the fan, a converter outputting a voltage signal, a selection switch connected to the motor, and a control element provided on the base, connected to the switch and to the converter. When the control element is operated, the switch selectively enables the motor be connected to the output of the pulse width modulation speed control circuit or to the output of the converter, and when the motor is electrically connected to the converter, the control element can modify the output voltage of the converter.12-03-2009
20090296342Reducing Maximum Power Consumption Using Environmental Control Settings - A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.12-03-2009
20120170205SYSTEM AND METHOD FOR SEQUENTIAL PLACEMENT OF COOLING RESOURCES WITHIN DATA CENTER LAYOUTS - A computer-implemented method for sequential placement of cooling resources in a data center comprises: defining a weighted, higher-order cooling metric, 07-05-2012
20090109610Symmetric Multiprocessing Computer and Star Interconnection Architecture and Cooling System Thereof - A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane.04-30-2009
20090097197SIDE PLATE OF HOUSING - A side plate that allows the locations of heat-dissipating holes to be arranged includes a plate, a plurality of sealed sealing blocks and a plurality of air-hole blocks having air holes. The plate is provided with a through hole occupying a considerable area thereof and a plurality of sliding rails that are arranged at intervals to straddle on the through hole. Each of the sealing blocks and each of the air-hole blocks have substantially the same size and the same shape. Two adjacent sliding rails have a predetermined pitch therebetween to accommodate the air-hole blocks or the sealing blocks, whereby the air-hole blocks and the sealing blocks are arranged in array fashion to cover the through hole.04-16-2009
20130120929Flexible Tier Data Center - A server cooling system includes: a flex-switch with one or more flexible building bridges; one or more utility farms coupled with the flex-switch; a power distribution unit operably connected to the flex-switch; and a server POD including one or more racks operably connected to the power distribution unit. The flex-switch is configurable to include additional utility farms, one or more generator farms, and one or more UPS farms.05-16-2013
20090244826AIRFLOW MANAGEMENT APPARATUS FOR COMPUTER CABINETS AND ASSOCIATED METHODS - Airflow management apparatuses for computer cabinets and associated methods are disclosed herein. The computer cabinets include a plurality of computer modules positioned between an air inlet and an air outlet and an air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet. The computer cabinets carry an airflow restrictor positioned proximate to the air outlet. The airflow restrictor is configured to restrict the flow of cooling air through a portion of the computer cabinet to achieve a desired temperature profile in the computer cabinet.10-01-2009
20100157521Blocking device adapted in a blade server and blade server - A blocking device adapted in a blade server and a blade server are provided. The blade server comprises a chassis and a plurality of blocking devices. The chassis comprises an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect a CPU blade respectively. Each convection holes are corresponding to a connecting interface. Each of the blocking devices is corresponding to a convection hole and comprises two blocking plates and a pushing means. The two blocking plates blocks the convection hole and comprises a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing means displaces to make the two blocking plates rotate about the hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole.06-24-2010
20100002372COMPUTER ENCLOSURE WITH AIRFLOW-GUIDING DEVICE - A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.01-07-2010
20100254081Heat exchange system with a heat exchanger and a method for the manufacture of a heat exchange system - The invention relates to a heat exchange system (10-07-2010
20090116183Gas Assisted Thixotropic Molded Chassis For Cooling A Computer Chassis - A housing including a housing portion having a reinforcing rib including a cylindrical cross-section. The rib provides reinforcing for the housing and may simultaneously provide a cooling passage for the housing. A cooling path is defined through the housing by the cylindrical cross-section of the rib.05-07-2009
20090323271Round Housings for Virtual computing systems with Stylesheets - A computer system that has an outer shape that is round in outer cross-section. The computer housing can be formed of first and second housing parts that are each round in outer cross-section where one unscrews relative to another like taking the lid off a jar. The inside of the housing can store various kinds of nonvolatile memory and a processor. The user's entire processing environment may be stored within the memory and processor, and part of that environment may include stylesheet that represents specific styles of the user.12-31-2009
20090168329Devices with faraday cages and internal flexibility sipes - A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising a semiconductor wafer having a multitude of microchips. The multitude of microchips forming a plurality of independently functioning computers, each computer having independent communication capabilities.07-02-2009
20100321880MODULAR DATA PROCESSING COMPONENTS AND SYSTEMS - Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same.12-23-2010
20110026218THERMAL MANAGEMENT OF BATTERIES USING SYNTHETIC JETS - A thermally managed power source (02-03-2011
20130148291MODULAR DATA CENTER - Described are methods, systems, and apparatus relating to a modular data center. In some embodiments, a modular data center includes one or more data modules. The modular data center includes a network module connected to the one or more data modules, the network module containing equipment for facilitating data communications by the one or more data modules. The modular data center includes a power module connected to the one or more data modules and the network module, the power module containing electronics equipment for conditioning and distributing power to the one or more data modules and the network module. In the modular data center, each module of the one or more data modules, the network module, and the power module comprises: an enclosure defining an internal space; a floor within the enclosure separating the internal space into an above-floor space and a sub-floor space; and a plurality of bays in the subfloor space, each bay of the plurality of bays configured to contain a field-replaceable environmental management component.06-13-2013
20110128698INFORMATION PROCESSING APPARATUS - According to one embodiment, an information processing apparatus includes a cooling module configured to cool an electronic component, a thermoelectric element configured to absorb heat generated from the electronic component, and to generate first electricity by performing a thermoelectric conversion by use of the heat, a determination module configured to determine whether the supply source is a battery, and a switcher configured to switch between a first mode and a second mode, the thermoelectric element performing the thermoelectric conversion and the cooling module is driven by the first driving electricity generated from the first electricity in the first mode, and the thermoelectric element absorbing the heat and the cooling module is driven by the second driving electricity generated by use of second electricity from a supply source includes a battery in the second mode.06-02-2011
20110128697REGULATION OF AIR FLOW THROUGH A COMPUTER BLADE CHASSIS USING MECHANICALLY ACTUATED VARIABLE AIR FLOW DAMPERS - A server blade chassis having at least one mechanically actuated variable air flow damper is presented. One or more variable air flow dampers are aligned with server blades in the server blade chassis. When a server blade is pressed into a slot in the server blade chassis, one or more of the variable air flow dampers are mechanically opened, to variable degrees of movement, by the server blade pressing against the variable air flow dampers.06-02-2011
20090323273SUPPORT DEVICE AND ELECTRONIC DEVICE USING SAME - A support device used to support a circuit board includes a substrate, a plurality of protrusions, and a plurality of electrical-conductive pads. The protrusions are perpendicularly extending from a surface of the substrate and arranged as a matrix and each of the protrusions defines a threaded hole therein. The electrical-conductive pads are mounted on the substrate around the corresponding protrusions and grounding the circuit board.12-31-2009
20090147464Ventilation Assembly for Computer Hardware Systems - An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second row of vent holes is staggered with respect to the first row of vent holes such that the larger vent holes are aligned with smaller vent holes, preferably in a ratio of two smaller vent holes per one larger vent hole. Such a perforation arrangement of vent holes may be provided on a blindswap cassette for securing and aligning computer cards for mounting in a housing, such as a sled for use in computer systems.06-11-2009
20110242756COMPUTER HINGE HAVING A HOLLOW CLUTCH - A hinge assembly having a hollow clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least a hollow cylindrical portion that includes an annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow cylindrical portion such that space, size and part count are minimized. The integrally formed fastening region(s) can be flat with holes dispersed therethrough for screws, bolts or the like. The central bore can also support a heat transfer element and can also serve as a lubricant reservoir.10-06-2011
20090323272Electronic apparatus - An electronic apparatus that includes: a housing having two surfaces extending in parallel, and a side surface connecting edges of the two surfaces; a circuit board placed in the housing and extends in parallel with the two surfaces; a plate member that extends to face a first surface of the circuit board; and a fan provided on a second surface of the circuit board, wherein the circuit board has a heat-generating electronic component mounted on the first surface and an opening through which air flows to the second surface side, and the plate member includes a concave groove formed in the first surface; a convex line formed on the second surface facing the circuit board on a portion corresponding to a back surface of the concave groove; and a guiding inclined surface formed on the back of the convex line to guide air to the opening.12-31-2009
20100053883METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES THROUGH USER INTERFACES - An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.03-04-2010
20120243173Individually Cooling One Or More Computers In A Rack Of Computers In A Data Center - Individually cooling one or more computers in a rack of computers in a data center including an air intake chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center and a plurality of openings at a top end for providing air into a plurality of flexible air channels; and a plurality of flexible air channels, each air channel having a first end opening into the air intake chamber and having an opening at a second end and having a connector to connect the second end of the flexible air chamber to a particular position in the rack corresponding to the location of a particular computer in the rack.09-27-2012
20110075352Electronic Device With Deployable Air Flow Enhancing Support - An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.03-31-2011
20090161310SERVER CHASSIS WITH ACCESS FLAP - A server chassis includes a base defining an opening, a rotating plate, a sliding plate, and first and second elastic members. The base includes a middle plate opposite to the opening and defines a space communicating with the opening. The rotating plate defines a plurality of first air holes. The sliding plate defines a plurality of second air holes. The rotating plate is rotated toward the middle plate when the functional module is inserted into the space, the sliding plate abuts against the middle plate and slides toward the opening, and the second air holes align with the first air holes. The second elastic member restores the rotating plate to obstruct the opening when the functional module is drawn out, and the first elastic member restores the sliding plate to make the second air holes be staggered with the first air holes.06-25-2009
20110019358ALL-IN-ONE COMPUTER - An all-in-one computer includes a front enclosure and a rear enclosure fixed together. The front enclosure includes a rear piece opposite to the front enclosure, and two side pieces extending forwards from left and right ends, respectively. The rear piece defines an air outlet including a number of first holes each having a width or diameter between 1 mm and 2 mm. Each side piece defines an air intake including a number of vertically spaced elongated second holes. The front enclosure and the rear enclosure cooperatively bound an airtight space except communicating with outside via the air intakes and the air outlet. Each second hole is slanted lengthwise down towards the front enclosure with a first slanting angle of not less than 15 degrees. A bottom wall of each second hole is slanted down outwards with a second slanting angle of not less than 30 degrees.01-27-2011
20100214734HEAT DISSIPATING MECHANISM HAVING ENHANCED HEAT DISSIPATING EFFICIENCY WITH JETS AND RELATED ELECTRONIC DEVICE - A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel.08-26-2010
20100214733AIRFLOW BYPASS DAMPER - Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.08-26-2010
20100165565DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.07-01-2010
20100067191THERMAL MANAGEMENT SYSTEM FOR EMBEDDED ENVIRONMENT AND METHOD FOR MAKING SAME - A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.03-18-2010
20110116225SPOT-COOLING FOR AN ELECTRONIC DEVICE - In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube.05-19-2011
20110063793SERVER CABINET - A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.03-17-2011
20110063792Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System - A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.03-17-2011
20120044629MOUNTING ASSEMBLY FOR PACKAGING AND SHIPPING COMPUTER COMPONENTS - An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.02-23-2012
20130148290AIR DUCT AND COMPUTER SYSTEM WITH AIR DUCT - An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.06-13-2013
20120155015HEAT DISSIPATION UNIT FOR A WIRELESS NETWORK DEVICE - According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.06-21-2012
20090135558AIRFLOW MODULE, DATA STORAGE DEVICE ENCLOSURE AND METHOD OF COOLING ELECTRONICS MODULE - An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face; and, an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening. The first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use. The airflow channel is free from components that generate substantial amounts of heat in their normal operation.05-28-2009
20110090640METHOD AND APPARATUS FOR EXTERNAL PROCESSOR THERMAL CONTROL - A system and method for throttling a slave component of a computer system to reduce an overall temperature of the computing system upon receiving a first signal is disclosed. The first signal may be from a master component indicating that a temperature for the master component has exceeded its threshold temperature. The slave component or the master component may be a central processing unit, a graphics memory and controller hub, or a central processing unit memory controller hub. The slave component may send a second signal to indicate that a temperature for the slave component has exceeded its temperature. The master component would then initiate throttling of the master component to reduce the overall temperature of the computing system. The master component may be throttled to a degree less than the slave component. A first component may be designated the master component and the second component may be designated the slave component based on a selection policy. The selection policy may be received from a user through a graphical user interface. The selection policy may be based on an action being performed by the computing system.04-21-2011
20110103005AIRFLOW RESTRICTOR DOOR - An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay.05-05-2011
20120120593APPARATUS AND ARTICLE FOR SEPARATING INTAKE AIR FROM EXHAUST AIR - An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent.05-17-2012
20120127653SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.05-24-2012
20120127652ELECTRONIC APPARATUS WITH IMPROVED HEAT DISSIPATION - An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.05-24-2012
20110182028COOLING SYSTEM - A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.07-28-2011
20110182027AIR FLOW DUCTS FOR COOLING ELECTRONIC DEVICES WITHIN A DATA PROCESSING UNIT - Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.07-28-2011
20120134103SERVER CABINET FOR SERVER SYSTEM - A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate adjacent to the top plate is different from a total area of the through holes in a lower half portion of the front side plate adjacent to the bottom plate.05-31-2012
20120134104DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.05-31-2012
20120162903ELECTRO-HYDRODYNAMIC COOLING FOR HANDHELD MOBILE COMPUTING DEVICE - Embodiments of the invention are directed towards passive cooling systems for handheld mobile computing devices. An electro-hydrodynamic air mover (EAM) may be included in a handheld mobile computing device, the EAM to include an inlet and an outlet. The inlet and outlet are each included in at least one surface side of the handheld mobile computing device.06-28-2012
20120229972HOT AISLE CONTAINMENT COOLING SYSTEM AND METHOD - An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.09-13-2012
20120229971INFORMATION HANDLING SYSTEM SHARED INFRASTRUCTURE CHASSIS WITH FLEXIBLE DEPTH - An information handling system tray component is selected for a depth to fit into chassis support components to provide processing resources in a space having different depths. An end user selects a chassis component having a depth that fits a data center and then installs tray components into the chassis component by selecting the tray component depths to fit in that of the chassis component. The tray component supports different processing components depending upon the selected depth so that information handling system features are adapted to chassis depth while using a common infrastructure component.09-13-2012
20110122570APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK - Disclosed is both a method and apparatus for delivering cooling air to an electronics rack in a data room in an energy efficient manner. The present apparatus provides directionally delivered cooling air to an electronics rack with usage rates up to 90%. The tiles utilize angled directional vanes for delivering the cooling air. The tiles both conserve energy and increase the overall possible power usage for each cabinet. The tiles greatly increase the cooling efficiencies in the data room and conserve energy.05-26-2011
20120087085Disaster resistant server enclosure with cold thermal storage device and server cooling device - A disaster resistant server enclosure is provided. A fire resistant outer enclosure is provided, and may be made of gypsum. A water resistant, thermally conductive container is mounted within the outer enclosure. A server is mounted within the water resistant container. A cold thermal storage device, such as a block of ice, is also mounted within an insulating cover inside said outer enclosure. When a fire is sensed outside the outer enclosure, an actuator thermally connects the cold thermal storage device to the water resistant container to cool the server during the fire.04-12-2012
20110157813FLOW TUBE APPARATUS - A flow tube apparatus may include a flow tube having a first opening and a second opening, a corona electrode provided in the flow tube, a collecting electrode provided in the flow tube, and at least one focusing electrode provided in the flow tube to guide ions and thereby provide an ionic wind. In at least one embodiment, the flow tube apparatus may be provided in an electronic apparatus to provide an air flow.06-30-2011
20130176678RACK LEVEL HOT AISLE CONTAINMENT SYSTEM - A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack.07-11-2013
20130170132Electronic Computer Comprising an Air Channeling System for Cooling Electronic Boards - The electronic computer according to the invention comprises: 07-04-2013
20130128450AIR VENT - A removable vent (05-23-2013
20110242755COOLING SYSTEM - According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.10-06-2011
20110255237COMPUTER CABINETS HAVING PROGRESSIVE AIR VELOCITY COOLING SYSTEMS AND ASSOCIATED METHODS OF MANUFACTURE AND USE - Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.10-20-2011
20120281353COMPUTER POWER SYSTEM - A computer power system includes a first power supply unit having a first output end, and a second power supply unit stacked on the first power supply unit and having a second output end adjacent to the first output end, a first power interface board electrically connected to the first output end and perpendicular to an end surface of the first output end, a second power interface board electrically connected to the second output end and perpendicular to an end surface of the second output end, and an electrical connection device. The electrical connection device connects the first power interface board and the second power interface board, such that the first power supply unit and the second power supply unit are electrically connected in parallel to the second power interface board.11-08-2012
20120281352Data center aisle containment system utilizing a movable sash that is integral to the computer rack cabinet - An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems.11-08-2012
20130155605ELECTRONIC APPARATUS - An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.06-20-2013
20130188307Synthetic Jet Ejector For The Thermal Management of PCI Cards - A method for constructing a thermal management system is provided herein. In accordance with the method, a fan (07-25-2013
20120020012STORAGE MODULE FOR COMPUTER SYSTEMS - A storage module for computer systems includes a housing defining an opening, a power supply unit and an air cooling unit, a storage unit detachably received in the housing through the opening, a bracket for mounting the storage unit, and a magnetic member. The bracket includes a tray plate defining a plurality of heat dissipation holes, a first side plate, an opposite second side plate, a stop plate including a first end detachably coupled to the second side plate and a second end pivotally connected to the first side plate, and a resilient member resiliently biasing the stop plate away from the first side plate. The storage unit is moveably and insertably positioned between the first and the second side plates. The magnetic member is positioned in one of the second side plate and the stop plate such that the second side plate and the stop plate are magnetically attracted.01-26-2012
20120020011DATA CENTER AND SERVER MODULE OF THE SAME - A data center includes a rack mounted with two first slide rails, a server module arranged in the rack. Two second slide rails are mounted on the top and bottom sidewalls of the server module, to mate with the first slide rails, thereby slidably attaching the server module to the rack.01-26-2012
20120020010NOTEBOOK COMPUTER HOUSING STRUCTURE - A notebook computer housing structure is described. The notebook computer housing structure includes a body, which is made of one of plastic, aluminum, and an aluminum magnesium alloy. A circuit board installed with electronic elements such as a CPU and an interface card is placed inside the body. The improvement lies in that a plurality of holes is disposed on the body to form a convection effect inside the body after cold air enters the body through the holes.01-26-2012
20120020009Computer Chassis Cooling Sidecar - A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.01-26-2012
20120020008UNIVERSAL RACK BACKPLANE SYSTEM - Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a plurality of partitions, a plurality of module bays, and two or more service unit backplanes. The power bus may be configured to provide power to the modules coupled to the universal backplane area.01-26-2012
20130201623DEVICES WITH FARADAY CAGES AND INTERNAL FLEXIBILITY SIPES - A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.08-08-2013
20120300391MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME - A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.11-29-2012
20130208418AFFIXABLE, DETACHABLE PLATFORM SET FOR PORTABLE COMPUTERS - Users of portable computers tend to carelessly place their usage of such where damage to their units become inevitable, unintentionally setting them in places which blocks air from circulating through such systems.08-15-2013

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