Class / Patent application number | Description | Number of patent applications / Date published |
702132000 | Thermal protection | 17 |
20080208513 | Protection of an Integrated Circuit and Method Thereof - An integrated circuit comprises a power device located on a die. The power device is operably coupled to a processing function, wherein the signal processing function is operably coupled to two or more temperature sensors. A first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located, such that it measures a substantially ambient temperature related to the die. The signal processing function determines the temperature gradient therebetween. | 08-28-2008 |
20080281551 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS - An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center. | 11-13-2008 |
20080306704 | THERMAL MANAGEMENT COMPUTING SYSTEM AND METHOD - A thermal management method of operation to cool critical heat generating components and when a critical electronic component approaches its designated maximum operation temperature or its rate of temperature increase is determined to be in excess a predetermined level, its operating speed is reduced in small increments (1% to 5%), and/or a cooling fan speed it increased in small increments, (1% to 5%), and, if necessary, operation of a variable capacity heat transfer component is induced to cool the critical component. | 12-11-2008 |
20090024349 | ADJUSTING VOLTAGE FOR A PHASE LOCKED LOOP BASED ON TEMPERATURE - A mechanism for utilizing a single set of one or more thermal sensors, e.g., thermal diodes, provided on the integrated circuit device, chip, etc., to control the operation of the integrated circuit device, associated cooling system, and high-frequency PLLs is provided. By utilizing a single set of thermal sensors to provide multiple functions, e.g., controlling the operation of the integrated circuit device, the cooling system, and the PLLs, silicon real-estate usage is reduced through combining circuitry functionality. Moreover, the integrated circuit device yield is improved by reducing circuitry complexity and increasing PLL robustness to temperature. Furthermore, the PLL circuitry operating range is improved by compensating for temperature. | 01-22-2009 |
20090093989 | Method for determining the exhaust gas temperature of an internal combustion engine - A method for determining an exhaust gas temperature of an internal combustion engine, which is performed by measuring a lambda value of the exhaust gas of the internal combustion engine and calculating a calculated exhaust gas temperature as a function of the measured lambda value, and comparing the calculated exhaust gas temperature with a measured exhaust gas temperature and adapting a function used for the calculation as a function of the comparison. | 04-09-2009 |
20090099807 | Extended thermal management - A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component. | 04-16-2009 |
20090271141 | WORKLOAD SCHEDULING IN MULTI-CORE PROCESSORS - A computer system that schedules loads across a set of processor cores is described. During operation, the computer system receives thermal measurements from sensors associated with the set of processor cores, and removes noise from the thermal measurements. Then, the computer system analyzes thermal properties of the set of processor cores based on the thermal measurements. Next, the computer system receives a process to be executed, and schedules the process to be executed by at least one of the processor cores based on the analysis. This scheduling is performed in a manner that reduces spatial and temporal thermal variations in the integrated circuit. | 10-29-2009 |
20090281761 | Detecting An Increase In Thermal Resistance Of A Heat Sink In A Computer System - Methods, apparatus, and products for detecting an increase in thermal resistance of a heat sink in a computer system, the heat sink dissipating heat for a component of the computer system, the computer system including a fan controlling airflow across the heat sink, the computer system also including a temperature monitoring device, including: measuring, by a monitoring module through use of the temperature monitoring device during operation of the computer system, thermal resistance of the heat sink; determining whether the measured thermal resistance of the heat sink is greater than a threshold thermal resistance, the threshold thermal resistance stored in a thermal profile in non-volatile memory, and if the measured thermal resistance of the heat sink is greater than the threshold thermal resistance, notifying a system administrator. | 11-12-2009 |
20110131004 | DIE TEMPERATURE ESTIMATOR - A temperature estimation circuit for estimating a temperature of an integrated circuit die comprises a temperature increase estimation circuit, the circuit has one or more inputs operable to receive one or more notification signals corresponding to command signals passed to the integrated circuit, and an output providing a sum of one or more temperature increase values, corresponding to temperature increase of the integrated circuit due to one of the command signals. The circuit may further have a temperature decrease estimation circuit, comprising an input operable to receive a calculated die temperature value, and an output providing a temperature decrease value depending on a mathematical model of temperature decrease when no command signal is applied. The circuit may have a temperature calculation circuit, comprising a first input connected to the output of the temperature increase estimation circuit, a second input connected to the output of the temperature decrease estimation circuit, and an output providing the calculated die temperature value. | 06-02-2011 |
20110320161 | POWER CUT-OFF BASED ON CURRENT - This document discusses, among other things, a method for heat management in a portable electronic device. The method includes measuring a current in the portable electronic device and determining, as a function of the current, whether the portable electronic device may overheat. When the portable electronic device may overheat, at least one component in the portable electronic device can be turned off. | 12-29-2011 |
20120101768 | DIAGNOSIS OF STATOR THERMAL ANOMALIES IN AN ELECTRICAL MACHINE - A system, method and computer program for diagnosing thermal anomalies in a stator of an electrical machine. A first system is provided that includes an input system for obtaining RTD readings over time from at least one sensor in a stator winding; a normalization system for normalizing each RTD reading with respect to armature current; and an analysis system for analyzing a trend in a set of normalized RTD readings to indicate thermal behavior of the stator winding. A second system is provided that includes an input system for obtaining a set of RTD readings from a plurality of sensors in a common axial location in a stator winding; a calculation system for calculating a difference value between a maximum value and a median value from the set of RTD readings; and an analysis system for analyzing a trend over time in a set of difference values to indicate thermal behavior of the stator winding. | 04-26-2012 |
20120221287 | System and Methods for Improving Power Handling of an Electronic Device - There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, and a third dual IGBT coupled to the heatsink and common to the field exciter and the battery charger. The exemplary electronic device also includes a single temperature sensor disposed in the heatsink, a controller configured to receive a temperature reading from the single temperature sensor and, based on the temperature reading, estimate a junction temperature of at least one of the first, second, or third dual IGBT. | 08-30-2012 |
20130110449 | METHOD AND DEVICE FOR DETECTING WINDING TEMPERATURE, METHOD AND DEVICE FOR THERMAL PROTECTION OF A MOTOR | 05-02-2013 |
20130238275 | THERMAL PROTECTION CRITICAL TEMPERATURE SETTING DEVICE, SYSTEM AND METHOD - A device for setting a thermal protection critical temperature of a switching power supply, the switching power supply including a plurality of power supply elements and a temperature-sensing element. A temperature measurement element of the device measures temperatures of the power supply elements. Difference in temperature between the temperature of each of the power supply elements and a reduced rated temperature of each of the power supply elements is calculated, and a largest difference in temperature from the temperature of the temperature-sensing element is calculated. | 09-12-2013 |
20140330534 | Apparatus and Method For Measurement of the Film Cooling Effect Produced By Air Cooled Gas Turbine Components - A method for measurement of a film cooling effect is disclosed. Film cooling is a technique developed to protect gas turbine engine components from the extremely high temperatures created during its operation. A controlled air pressure is ducted into the hollow interior of the component and the mass rate of air flowing through the plurality of film cooling features or openings is measured. A coolant is then injected into the hollow interior of the component and allowed to flow out of a film cooling feature onto the heated outer surface of the component. The resulting infrared signature is a measure of the relative cooling effect generated by the individual film cool feature. The film cooling effect for an individual feature is quantified as the proportion of mass rate of airflow contributed by its relative individual cooling effect. The area, location and shape of the cooling effect are further classified to determine the degree of conformance to its design intent. | 11-06-2014 |
20150066419 | ELECTRONICS ENCLOSURE WITH REDUNDANT THERMAL SENSING ARCHITECTURE - A computer program product for redundant thermal sensing is configured to determine, based on component temperature information of a thermal sensor associated with a component, that a temperature of the component has surpassed a temperature threshold. The program code can be configured to identify a thermal sensor that is downstream from the component as defined by airflow. The program code can determine downstream temperature information as measured by the downstream sensor. The program code can be configured to compare the downstream temperature information and the component temperature information. | 03-05-2015 |
20150066420 | ELECTRONICS ENCLOSURE WITH REDUNDANT THERMAL SENSING ARCHITECTURE - Embodiments include determining, based on component temperature information of a thermal sensor associated with a component, that a temperature of the component of a computer system has surpassed a temperature threshold. A thermal sensor that is downstream from the component is identified, wherein the downstream thermal sensor is downstream from the component as defined by airflow through the computer system. Downstream temperature information as measured by the downstream sensor is determined. The downstream temperature information and the component temperature information are compared. | 03-05-2015 |