| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 524404000 | Boron atom DNRM | 72 |
| 20130030105 | HEAT-DISSIPATING RESIN COMPOSITION USED FOR LED LIGHT HOUSING AND HEAT-DISSIPATING HOUSING FOR LED LIGHTING - Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K. Also, disclosed is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. | 01-31-2013 |
| 20090264570 | Heat-Conductive Resin Composition and Plastic Article Including the Same - A thermal-conductive resin composition and a plastic article are provided. The thermal-conductive resin composition comprises about 30 to about 60% by weight of a thermoplastic resin and about 40 to about 70% by weight of a thermal-conductive filler comprising about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio (length/height) of about 7,000 to about 40,000 and about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000. | 10-22-2009 |
| 20100160522 | CROSSLINKED POLYCYCLOOCTENE - Chemically crosslinked polycyclooctene having excellent shape recovery properties is prepared by ring-opening metathesis polymerization of cis-cyclooctene followed by chemical crosslinking. The crosslinked polycyclooctene can be shaped, the shape memorized, a new shape imparted with the original shape being recoverable by suitable temperature adjustment. The dependence of shape memory characteristics on degree of crosslinking was established. In addition to polycyclooctene, blends thereof with other materials such as SBR, EVA, polyurethane rubbers, and inorganic fillers can be utilized to provide chemically crosslinked products having excellent and tailored shape memory properties. | 06-24-2010 |
| 20100113669 | THERMOPLASTIC COMPOSITION INCLUDING HYPERBRANCHED AROMATIC POLYAMIDE - Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C., at least one hyperbranched aromatic polyamide having terminal alkylcarboxamide groups, and, optionally a thermally conductive filler; and molded articles made therefrom. | 05-06-2010 |
| 20100041808 | ARMOUR - A dough moulding composition for use in the manufacture of ballistic armour comprising a boron carbide particulate and a polymeric binder, wherein the boron carbide particulate exhibits a particle size distribution in which some of the particles have a particle size of 100 μm or more and some of the particles have a particle size of 50 μm or less. | 02-18-2010 |
| 20090156726 | COMPOSITION, ARTICLE, AND ASSOCIATED METHOD - A composition includes a post-cured polymer. A post-cured polymer includes a reaction product of a first cycloolefin and a metathesis catalyst having ruthenium, osmium, or both ruthenium and osmium. The post-cured polymer has a glass transition temperature in a range that is greater than 340 degrees Celsius. An associated article and a method are also provided. | 06-18-2009 |
| 20090306263 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE - A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED. | 12-10-2009 |
| 20090093578 | TRANSPARENT STRETCHED ACRYLIC SHEETS FOR AIRCRAFT WINDOW SYSTEMS HAVING CONTROLLED SOLAR TRANSMITTANCE PROPERTIES - A biaxially stretched transparent acrylic sheet having a controlled solar energy transmittance properties for aircraft window systems is described. The biaxially stretched transparent acrylic sheet includes a thermoplastic acrylic polymer, and from about 0.003 percent by weight to about 0.1 percent by weight of an IR absorbing material, the weight percentage based on the a total weight of the acrylic polymer and the IR absorbing material. The IR absorbing material preferentially absorbs energy having wavelengths from about 700 nm to about 1100 nm. The IR absorbing material is selected from the group consisting of perylene based dyes, nanoparticle hexaboride based IR absorbers, and mixtures thereof. | 04-09-2009 |
| 20090292051 | HIGH DIELECTRIC CONSTANT LASER DIRECT STRUCTURING MATERIALS - High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications. | 11-26-2009 |
| 20110040007 | HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS - Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications. | 02-17-2011 |
| 20100036032 | Vanish, heat-dissipation prepreg, and manufacturing method thereof - A vanish, a heat-dissipation prepreg, and the manufacturing method thereof are disclosed. The vanish has a curing agent with structure as indicated in formula (1). The vanish based on this curing agent will improve thermal stability and peel strength. Glass fabric cloth is dipped into the vanish having the curing agent to form a heat-dissipation prepreg with better thermal stability and peel strength. Furthermore, the curing agent has polarity so that inorganic powders are uniformly distributed in the prepreg. Therefore, the dissipation efficiency of the heat-dissipation prepreg is improved. | 02-11-2010 |
| 20100113668 | THERMOPLASTIC COMPOSITON INCLUDING THERMALLY CONDUCTIVE FILLER AND HYPERBRANCHED POLYESTERAMIDE - Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF | 05-06-2010 |
| 20100113667 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability. | 05-06-2010 |
| 20090062446 | COMPOSITION AND ASSOCIATED METHOD - A composition includes a coupling agent composition and a polymer precursor. The coupling agent composition includes an aromatic amine and a first cycloolefin substituted with at least one epoxy group. The polymer precursor includes a second cycloolefin and an epoxy compound. The coupling agent composition is capable of bonding to a filler having a corresponding binding site and the coupling agent composition is compatible with a metathesis catalyst capable of catalyzing a ring-opening metathesis polymerization reaction when contacted to the first cycloolefin or the second cycloolefin. An associated method is also provided. | 03-05-2009 |
| 20110077337 | METHOD FOR PREPARING A HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS - A method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up (combining) additional insulation layers is disclosed, where the adhesive varnish is used for high-density interconnected printed circuit boards or package substrates. The method comprises steps of: selecting at least two epoxy resins from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin; adding selected epoxy resins into a pre-treatment vessel with a certain ratio; heating and mixing them well to form an epoxy resin precursor; cooling the epoxy resin precursor; during the cooling process, adding a solvent to the epoxy resin precursor to adjust the viscosity of the epoxy resin precursor; adding a bi-hardener solution, a catalyst, a solvent, and a flow modifier and mixing them well with the epoxy resin precursor; adding an inorganic filler with high thermal conductivity and mixing it with the mixture in step (d) in vacuum to obtain a suitable viscosity value; and leaving the mixture in step (e) undisturbed for a period of time to form the high thermal conductivity and low dissipation factor adhesive varnish for build-up (combining) additional insulation layers. | 03-31-2011 |
| 20090275685 | SELF-LUBRICATING SURFACE COATING COMPOSITION - A bearing having a surface and a self-lubricating surface coating composition deposited on the surface, wherein the self-lubricating surface coating composition includes a curable acrylate composition having a metallic composition. The metallic composition having a metallic acrylate compound according to Formula I: | 11-05-2009 |
| 20090286914 | SEMI-CRYSTALLINE POLYMER COMPOSITION AND ARTICLE MANUFACTURED THEREFROM - Polymer composition comprising (i) at least one semi-crystalline polymer (SCP) chosen from polyamides, polyaryletherketones, liquid crystal polymers, polyalkylene phthalates, polycarbonates, polyarylene sulphides and polyarylene oxides, and (ii) at least one oxide (OX) chosen from acid oxides of an element having an electronegativity of at most 2.2 and amphoteric oxides, and (iii) at least one nitride (NJ) of an element having an electronegativity of from 1.3 to 2.5. Article comprising at least one part comprising the polymer composition as above described. Part of an article comprising the polymer composition as above described. | 11-19-2009 |
| 20090292050 | Kind of Prepolymer and Its Product-Thermosetting Resins Composite - The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4′-diphenylmethane-amino-di-malays polyimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC). | 11-26-2009 |
| 20090326124 | ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN COMPOSITION OF LOW CARBOXYLIC ACID CONTENT - An ethylene-vinyl alcohol copolymer resin having low odor of acetic acid and good long-run workability is provided. The ethylene-vinyl alcohol copolymer resin which contains an alkali metal salt (A) and has a very low extractable carboxylate content is obtained by a method including contacting the ethylene-vinyl alcohol copolymer resin with an aqueous solution containing carbon dioxide gas. | 12-31-2009 |
| 20110224345 | NOVEL LOW DIELECTRIC RESIN VARNISH COMPOSITION FOR LAMINATES AND THE PREPARATION THEREOF - This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. | 09-15-2011 |
| 20090253842 | SHAPE MEMORY POLYMERS BASED ON SEMICRYSTALLINE THERMOPLASTIC POLYURETHANES BEARING NANOSTRUCTURED HARD SEGMENTS - Thermoplastic polyurethanes having an alternating sequence of hard and soft segments in which a nanostructured polyhedral oligosilsesquioxane diol is used as a chain extender to form a crystalline hard segment constituting SMPs. The polyurethanes are formed by reacting a polyol, a chain extender dihydroxyl-terminated polyhedral oligosilsesquioxane and a diisocyanate. The polyurethanes have multiple applications including for example, implants for human health care, drug delivery matrices, superabsorbant hydrogels, coatings, adhesives, temperature and moisture sensors, etc. | 10-08-2009 |
| 20090221734 | RESIN COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF - The object of this invention is to provide a polyamide resin composition excellent in insulating properties, mechanical properties and dimensional stability. This invention is a resin composition containing 100 parts by weight of a polyamide resin and 0.01 to 50 parts by weight of boron nitride nanotubes. The invention also includes a formed article from the resin composition and processes for the production of the resin composition and the formed article. | 09-03-2009 |
| 20100331468 | BORON NITRIDE FILLED PTFE - A composition is provided that, in one aspect, may be used in the production of sealing materials, such as gaskets. The composition includes a polytetraflouroethylene matrix and a Boron Nitride filler. In one aspect, the Boron Nitride filler may be provided as a hexagonal, close-packed, Boron Nitride filler that is homogeneously dispersed within the polytetraflouroethylene matrix. In at least one embodiment, the composition is formed by combining quantities of polytetraflouroethylene, Boron Nitride filler, hydrocarbon liquid, and solvent. The liquid and solvent may be removed through various processes prior to sintering the composition to form a full-density, Boron Nitride filled, polytetraflouroethylene matrix that exhibits improved sealability, greater resistance to permeation, and less color contamination. | 12-30-2010 |
| 20100063192 | POLYARYLENE SULFIDE RESIN COMPOSITION AND A MOLDED ARTICLE FORMED THEREFROM - A resin composition including the following components (A) to (C):
| 03-11-2010 |
| 20090215942 | MELT-MOLDED ARTICLE CONTAINING AN ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN COMPOSITION OF LOW CARBOXYLIC ACID CONTENT - A melt-molded article containing an EVOH resin composition of low acetic acid odor and good long run workability is provided. | 08-27-2009 |
| 20110086965 | BORON NITRIDE NANOSHEET, METHOD FOR PRODUCING BORON NITRIDE NANOSHEET THEREOF AND COMPOSITION CONTAINING BORON NITRIDE NANOSHEET THEREOF - A boron nitride nanosheet containing three-layered hexagonal boron nitride, which is in a form of multi-layered hexagonal boron nitride with some its layers peeled, can be produced by dispersing pristine hexagonal boron nitride powder in an organic solvent and by subjecting the fluid dispersion to ultrasonication. | 04-14-2011 |
| 20110077338 | COMPOSITE ELECTROLESS PLATING WITH PTFE - This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals. | 03-31-2011 |
| 20080249221 | POLYMERIC ADHESIVE INCLUDING NANOPARTICLE FILLER - Disclosed is a novel polymeric nanoparticle adhesive composite including a nanoparticle filler and method for the production thereof. More particularly, the disclosure describes the use of nanoparticle fillers, including a novel halloysite nanoparticle filler which utilizes generally cylindrical or tubular nanoparticles (e.g. rolled scroll-like shape). The filler is effectively employed in a polymer nanoparticle adhesive composite, containing the halloysite nanoparticle or other equivalent naturally occurring nanotubular filler, in which the advantages of the nanoparticle filler are provided (e.g., reinforcement, flame retardant, etc.) while maintaining or improving mechanical performance of the adhesive composite (e.g., adhesive strength and tack) | 10-09-2008 |
| 20090176918 | METAL-CLAD LAMINATES HAVING IMPROVED PEEL STRENGTH AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF - In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like. | 07-09-2009 |
| 20110218286 | MOLYBDENUM COMPRISING NANOMATERIALS AND RELATED NANOTECHNOLOGY - Nanoparticles comprising molybdenum, methods of manufacturing nanoparticles comprising molybdenum, and nanotechnology applications of nanoparticles comprising molybdenum, such as electronics, optical devices, photonics, reagents for fine chemical synthesis, pigments and catalysts, are provided. | 09-08-2011 |
| 20090099289 | Fire Resistant Compositions - A fire resistant polymeric composition which forms a target mineral on firing of the polymeric composition including 20-60 wt % of an organic polymer; 2-30 wt % of a magnesium compound that oxidises to form MgO; and 5 to 30 wt % silica. The composition preferably includes an alkaline earth metal borosilicate compound, the alkaline earth metal borosilicate compound forming a ceramic composition at an elevated temperature. | 04-16-2009 |
| 20090018246 | Stable aqueous particle dispersion the use thereof and method for producing said dispersion - A stabilizer or a dispersant from the group of the polycarboxylates for the preparation of stable aqueous dispersions of particles. | 01-15-2009 |
| 20100249306 | HYDROPHOBIC SURFACE COATING FOR ELECTRONIC AND ELECTRO-TECHNICAL COMPONENTS AND USES THEREOF - A hydrophobic surface coating, in particular for electronic and electrotechnical components, can be produced easily and inexpensively. For this purpose, particles and micro powders, hydrophobic particles in particular, are incorporated into the protective lacquer. | 09-30-2010 |
| 20100222480 | COMPOSITIONS USEFUL FOR NON-CELLULOSE FIBER SIZING, COATING OR BINDING COMPOSITIONS, AND COMPOSITES INCORPORATING SAME - Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film fowling polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof. | 09-02-2010 |
| 20110166278 | METHOD FOR IMPREGNATING CONTINUOUS FIBRES WITH A COMPOSITE POLYMER MATRIX CONTAINING A GRAFTED FLUORINATED POLYMER - The invention relates to a method for the impregnation of continuous fibers that comprises coating said fibers with a polymer matrix containing: (a) at least one fluorinated polymer grafted with at least one carboxylic polar function and (b) optionally at least one fluorinated nongrafted polymer. The invention also relates to the composite fibers that can be obtained by said method and to the use thereof. | 07-07-2011 |
| 20110166279 | CLEAN FLAME RETARDANT INSULATION COMPOSITION TO ENHANCE MECHANICAL PROPERTIES AND FLAME RETARDANCY FOR WIRE AND CABLE - One of the major problems of commercial clean flame retardant materials is unstable mechanical properties because of high filler loadings. Clean flame retardant compositions having very low smoke and toxicity generation are invented by a method based on partial cross-linking of polymers. These composites are processed by routine thermoplastic extruder and do not use post curing system. Composition mainly contain 100 parts by weight (p/w) of resin (polyolefin or 100 p/w of polyolefin/ethylene propylene diene monomer rubber (EPDM rubber)), 90-150 p/w of non halogen content main flame retardants, 0.1-0.5 parts by weight of crosslinking agent, 1-20 p/w of auxiliary secondary flame retardant agents and 0.2-1.0 p/w of antioxidants. Clean flame retardant compositions use peroxide composite as a crosslinking agent and metal hydroxide composite as a flame retardant. The present invention demonstrates more reliable method for producing clean flame retardant insulations for wire and cable without deterioration of mechanical properties. | 07-07-2011 |
| 20120022200 | Filled Fluororesin Sheet, Process for Producing the Same, and Gasket - Provided is a filled fluororesin sheet excellent in stress relaxation properties, in particular stress relaxation properties at a high temperature. The filled fluororesin sheet includes a fluororesin and an inorganic filler having a revised Mohs hardness of not less than 8, in a fluororesin:inorganic filler volume ratio of 30-55:70-45 (wherein the total of the two is 100). | 01-26-2012 |
| 20120309885 | SILICONE RESIN COMPOSITION AND THERMAL CONDUCTIVE SHEET - A silicone resin composition contains a borosiloxane resin containing a B—O—Si bond and boron nitride. A silicone resin composition contains an aluminosiloxane resin containing an Al—O—Si bond and aluminum nitride. | 12-06-2012 |
| 20110065853 | POLYMERS CONTAINING HEXAGONAL BORON NITRIDE PARTICLES COATED WITH TURBOSTRATIC CARBON AND PROCESS FOR PREPARING SAME - The present invention describes polymer compositions containing boron nitride particles that are encapsulated in layers of turbostratic carbon. The polymers so prepared exhibit enhanced thermal conductivity. | 03-17-2011 |
| 20100048789 | Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof - A resin composition includes brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0-20 wt %, high thermal conductivity powder of 5-85 wt % and a processing aid of 0-10 wt %. The resin composition possesses high glass transition temperature, high thermal conductivity, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved. | 02-25-2010 |
| 20120252951 | THERMALLY CONDUCTIVE POLYMER COMPOSITIONS HAVING LOW THERMAL EXPANSION CHARACTERISTICS - An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/° C. and 2 ppm/° C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2W/m° K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials. | 10-04-2012 |
| 20120225986 | POLYMERIC MATERIALS AND ADDITIVES THEREFOR - A polymer additive for improving the reheat characteristics of a polymer or polymeric composition comprises an inorganic material which is such that a 2.5 mm thick polyethylene terephthalate plaque incorporating the inorganic material has, when tested, an absorption ratio of less than 0.9, wherein the absorption ratio is either the ratio of A | 09-06-2012 |
| 20120095147 | WHITE POLYIMIDE FILM AND MANUFACTURE THEREOF - A white polyimide film comprises a polyimide base polymer and a coloration filler homogeneously distributed in the white polyimide film by reacting a diamine component with a dianhydride component and a coloration filter. The diamine component can include 2,2′-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO | 04-19-2012 |
| 20120101206 | METHOD OF IMPARTING CORROSION RESISTANCE TO A SUBSTRATE SURFACE, AND COATED SUBSTRATES PREPARED THEREBY - The disclosure provides methods and materials for imparting corrosion resistance to a substrate, as well as the corrosion-resistant substrates prepared accordingly. Compositions and methods include nonpyrolyzed, silicon-based polymer coatings prepared on substrates. The prepared coatings are highly stable and resistant to corrosion. The invention finds utility, for example, in the fields of surface and coating chemistry. | 04-26-2012 |
| 524405000 | Boron directly bonded to oxygen | 28 |
| 20100076137 | FLAME -RETARDANT POLYAMIDE COMPOSITION - Disclosed is a flame-retardant polyamide composition excellent in fluidity during molding and granulation ability on a twin-screw extruder or the like. A molded article produced from the composition is excellent in mechanical properties including stiffness, heat resistance and flame retardancy during a reflow soldering process, and shows low warpage. Specifically disclosed is a flame-retardant polyamide composition comprising 20 to 80 mass % of a specific polyamide resin (A), 1 to 40 mass % of a flame retardant (B), 5 to 60 mass % of a glass fiber (C), and 0.5 to 5 mass % of an auxiliary flame retardant (D), which can be molded in an article having reduced warpage. Preferably, the glass fiber (C) has a cross section having an aspect ratio of greater than 3. | 03-25-2010 |
| 20090326125 | Flame retardant non halogenated silicone composition for high temperature and automotive and building construction applications - Blends of a non-halogenated, formaldehyde-cured silicone rubber are described. The blend includes magnesium oxide and zinc borate. The compositions exhibit thermal stability at high temperatures as well as improved chemical resistance. | 12-31-2009 |
| 20090012222 | LOW INDIVIDUAL COLOUR THERMOPLASTIC MOLDING COMPOSITION - A thermoplastic molding composition comprising A) 2.5 to 50 wt. % of a rubber modified styrenic resin; B) 50 to 97.5 wt. % of a polycarbonate resin; C) 0.001 to 1 wt. % of an inorganic boron compound; D) 0 to 25 wt. % of further polymer resins; and E) 0 to 45 wt. % additives, shows excellent thermal stability at high temperatures and impact resistance, and no thermal discolouration during processing. | 01-08-2009 |
| 20100004370 | FLAME RETARDANT ADDITIVE FOR POLYMERS, FREE OF HALOGENS, ANTIMONY OXIDE AND PHOSPHORUS CONTAING SUBSTANCES - A flame retardant additive for polymers is disclosed which additive comprises a polyacrylate in combination with a) at least one zinc borate, b) at least one silicone resin, and c) alumina trihydrate or magnesium hydroxide or a mixture thereof, said additive being free of halogens, antimony oxide and phosphorus-containing substances. A flame retardant composition comprising a polymer and a flame retardant additive is also disclosed as well as a method of reducing the flammability of a polymer by mixing said polymer with said flame retardant additive. | 01-07-2010 |
| 20090192250 | THERMOPLASTIC ELASTOMER COMPOSITION AND COMPOSITE MOLDING - A thermoplastic elastomer composition is provided that contains 1 to 20 parts by weight of component (E), wherein the thermoplastic elastomer composition is provided by a process for producing a thermoplastic elastomer composition including the steps of: (1) dynamically heat treating 5 to 25 parts by weight of component (A), 10 to 70 parts by weight of component (B), 3 to 25 parts by weight of component (C), and 10 to 70 parts by weight of component (D) in the presence of a crosslinking agent to obtain a mixture, wherein component (A) is a polypropylene resin, component (B) is an ethylene-α-olefin copolymer rubber, component (C) is a hydrogenated vinyl aromatic compound-conjugated diene block copolymer, component (D) is a mineral oil, component (E) is an inorganic filler having an aspect ratio of at least 2, and the total amount of components (A) to (D) is 100 parts by weight. | 07-30-2009 |
| 20080234420 | HIGH PERMEABILITY SUPERABSORBENT POLYMER COMPOSITIONS - The invention relates to absorptive, crosslinked polymeric composition that are based on partly neutralized, monoethylenically unsaturated monomer carrying acid groups wherein the absorptive crosslinked polymer may be coated with a polymeric coating, and have improved properties, in particular in respect of their capacity for transportation of liquids in the swollen state, and which have a high capacity and a high gel bed permeability. | 09-25-2008 |
| 20090054576 | Intermediate Transfer Belt and Manufacturing Method Thereof - Disclosed are an intermediate transfer belt for use in a laser printer, a fax machine and a copier, and a production method thereof. Specifically, an intermediate transfer belt including silicone modified polyimide resin and a production method thereof are provided, thereby realizing a monolayer intermediate transfer belt having excellent electrical properties, water repellency and heat dissipation properties and good mechanical strength. Further, even without the additional use of an adhesive layer for adhesion to a fluorine resin layer and fluorine resin, the intermediate transfer belt can exhibit satisfactory properties, and process efficiency can be maximized. | 02-26-2009 |
| 20090239986 | Flame Retardant Thermoplastic Polyester Resin Composition - Disclosed herein is a flame retardant thermoplastic polyester resin composition comprising: (A) about 100 parts by weight of a polyester resin; (B) about 1 to about 60 parts by weight of a cyclic oligomeric phosphazene compound; (C) about 1 to about 50 parts by weight of a melamine compound; (D) about 1 to about 20 parts by weight of a inorganic metal compound; and (E) about 0.1 to about 5 parts by weight of a fluorinated polyolefin resin. The thermoplastic polyester resin composition may further contain a filler (F). | 09-24-2009 |
| 20120172512 | FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION - Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A). | 07-05-2012 |
| 20090069480 | Perfluoropolymer Composition - The invention concerns a composition comprising:
| 03-12-2009 |
| 20090111926 | LIQUID-CRYSTALLINE POLYESTER BLEND - The present invention provides a liquid-crystalline polyester blend, which is obtained by combining a liquid-crystalline polyester (A) and a liquid-crystalline polyester (B) such that the ratio by weight of (A)/(B) is 99/1 to 80/20:
| 04-30-2009 |
| 20090069478 | Flame-Retardant Polyamide Composition - To provide a polyamide resin composition which inhibits generation of a gas, formation of decomposition products and discoloration of molded articles even under high molding temperature conditions, is excellent in incombustibility and toughness, and heat resistance in a reflow soldering step being required for surface mounting. The present invention provides a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.01 to 0.45% by mass of an antimony compound (C) and 0.5 to 10% by mass of a salt of zinc or calcium (D). | 03-12-2009 |
| 20090069479 | Flame-retardant polyamide composition - A flame-retardant polyamide composition having excellent properties in mechanical properties such as toughness, in heat resistance, incombustibility and flowability in a reflow soldering process, and in heat stability during molding. There is provided a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide resin (A), 5 to 40% by mass of flame retardant with specific bromine content and molecular weight (B) and 0.5 to 10% by mass of flame retardant auxiliary agent (C) optionally together with hydrotalcite compound of specific composition (D). | 03-12-2009 |
| 20110040008 | POLYMER CONCENTRATES WITH IMPROVED PROCESSABILITY - New polymer concentrates on the basis of polymer additives, like e.g. fillers and flame-retardants, are provided which have in particular an increased bulk density compared to the polymer additives as such. This increased bulk density leads to a substantial improvement in the processability of such concentrates, their dispersibility during compounding and the properties of the resulting polymer compound. Processing improvements include less dust, faster processing and more homogeneous additive dispersion. The invention also provides a process for preparing such new polymer concentrates, a process for preparing polymer compounds containing the new polymer concentrates, the respective polymer compounds and a process for preparing formed parts thereof. Such formed parts have more uniform properties such as density, wall thickness, and in case of the flame-retardants more homogeneous and consistent flame retardancy. | 02-17-2011 |
| 20100004369 | LOW DENSITY VISCOELASTIC COMPOSITION HAVING DAMPING PROPERTIES - Curable compositions are provided comprising:
| 01-07-2010 |
| 20090215943 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components. | 08-27-2009 |
| 20110152426 | NANO-MODIFIED WIRE ENAMELS AND ENAMELLED WIRES THEREOF - Nano-modified wire enamels based on polyester, polyesterimide, polyamideimide and/or polyurethane resins, which contain one or more of the resins as binders, nanomaterials, organic solvents, catalysts and additives. Wires coated with these enamels show after curing improved thermal and mechanical properties. | 06-23-2011 |
| 20110257320 | COMPOSITE REPAIR RESINS CONTAINING MINIMAL HAZARDOUS AIR POLLUTANTS AND VOLATILE ORGANIC COMPOUND - The present invention relates to a composition and method for fabricating composite resins that produce either reduced or zero volatile organic compound (VOC) and zero hazardous air pollutant (HAP) emissions. The non-volatile reactive diluents of the composite resin, fatty acid monomers, enhance the stability, shelf-life, flexibility and strength of the composite resin. The resins incorporating fatty acid monomers may be used to repair military equipment or for any commercial repair purposes. | 10-20-2011 |
| 20100324187 | Silicone Resin Composites for High Temperature Durable Elastic Composite Applications and Methods for Fabricating Same - This invention relates to composites for use in high temperature elastic composite applications. Most particularly, this invention relates to elastic composites formed with a silanol-silanol condensation reaction mixture of silsesquioxane silicone resins thermally stabilized by boron nitride, silica and boron oxide additives as their matrix. The polymer matrix composite comprise a matrix of cured high, intermediate and optionally low molecular weight silicone resins including boron nitride and silica additives and reinforcing material. | 12-23-2010 |
| 20090176919 | FLAME RETARDANT POLYAMIDE MOLDING COMPOSITION - The invention relates to a flame retardant polyamide composition comprising a thermoplastic polyamide, a flame retardant system comprising a halogenated flame retardant compound and a flame retardant synergist, and a phosphite stabilizer and the polyamide composition is essentially free of antimony containing compounds. | 07-09-2009 |
| 20110263773 | Smoke Suppressants - The smoke suppressant comprises a molybdate precipitate on the surface of a borate core. The precipitate increases surface area of the core and provides improved smoke suppression relative to a mixture of the molybdate and borate core. The suppressants can be incorporated into polymer compositions to improve their smoke suppression capability. | 10-27-2011 |
| 20100016489 | AROMATIC POLYCARBONATE RESIN COMPOSITION AND MOLDING THEREOF - An aromatic polycarbonate resin composition exhibiting small molding shrinkage anisotropy, high dimensional stability, and high flowability, and a molded article produced therefrom, wherein the aromatic polycarbonate resin composition, and the molding thereof, each comprise 100 parts by mass of an admixture comprising: (A) 40-99 mass % aromatic polycarbonate resin, or a mixture of 60 mass % or more aromatic polycarbonate resin and 40 mass % or less flowability improver and/or impact modifier; (B) 60-1 mass % silicate-containing inorganic filler, or a mixture of 35 mass % or more silicate-containing inorganic filler and 65 mass % or less fibrous filler; and (C) 0.05-3 parts by mass of mono- or di-ester of phosphoric acid having a polyoxyalkylene alkyl ether or polyoxyalkylene alkylaryl ether group represented by formula [R | 01-21-2010 |
| 20120041124 | COMPOSITE REPAIR RESINS CONTAINING MINIMAL HAZARDOUS AIR POLLUTANTS AND VOLATILE ORGANIC COMPOUND - The present invention relates to a composition and method for fabricating composite resins that produce either reduced or zero volatile organic compound (VOC) and zero hazardous air pollutant (HAP) emissions. The non-volatile reactive diluents of the composite resin, fatty acid monomers, enhance the stability, shelf-life, flexibility and strength of the composite resin. The resins incorporating fatty acid monomers may be used to repair military equipment or for any commercial repair purposes. | 02-16-2012 |
| 20120059104 | Flame Resistant Polyolefin Compositions and Methods for Making the Same - A flame-retardant composition having (a) a copolymer comprising at least about 50 wt. % of propylene-derived units, and about 5-35 wt. % of units derived from at least one of ethylene or a C | 03-08-2012 |
| 20100144944 | JOINT FILLING COMPOSITION - The present invention provides compositions used for filling joints in construction applications that remain hard yet pliable over time, even in gaps larger than 1.2 centimeters and methods of making the same. | 06-10-2010 |
| 20120232204 | LASER-TRANSPARENT POLYESTERS WITH INORGANIC SALTS - Use of thermoplastic molding compositions comprising, as essential components,
| 09-13-2012 |
| 20120329932 | METHOD FOR INCREASING THE RECYCLABILITY OF A POLYAMIDE USED IN SINTERING - The present invention relates to a method for increasing the recyclability of a polyamide in a sintering process, wherein at least 4000 ppm of at least one acid is incorporated in the polyamide, said acid being selected from: the acids of general formula HxPyOz in which x, y and z are integers selected in the range from 1 to 7, boric acid, the salts of these acids, their esters, their anhydrides and mixtures thereof. | 12-27-2012 |
| 20080319112 | GEOTECHNICAL ARTICLES - A multiphase polymeric material comprises a first rigid continuous phase and a second elastic phase dispersed in the first phase. The multiphase polymeric material may be formed into polymeric strips and used to make a cellular confinement system which is suitable for use in cold areas. | 12-25-2008 |
