Class / Patent application number | Description | Number of patent applications / Date published |
523440000 | Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range | 40 |
20100036022 | EPOXY RESIN COMPOSITION - This invention relates to an epoxy resin composition which has better adhesive performance and flexibility at low temperatures (about −20° C.) to normal temperature as well as elevated temperatures (about 80° C.) and is suitable for use as a structural adhesive. The epoxy resin composition includes 100 mass parts epoxy resin, 5 to 100 mass parts core-shell particles, and a curing agent. 1 to 50 mass % of the epoxy resin is a urethane-modified epoxy resin and the core-shell particles include acrylonitrile in the monomer used during the production of the shell layer, and/or comprise a structure having at least three layers of a core layer, an interlayer, and a shell layer. | 02-11-2010 |
20100130646 | METHOD FOR MANUFACTURING EPOXY NANOCOMPOSITE MATERIAL CONTAINING VAPOR-GROWN CARBON NANOFIBERS AND ITS PRODUCTS THEREBY - Disclosed is a method for producing an epoxy nanocomposite material containing vapor-grown carbon nanofibers and an epoxy nanocomposite material produced thereby. The method comprises physically mixing 0.1-5.0 parts by weight of vapor-grown carbon nanofibers as reinforcing materials with 100 parts by weight of an epoxy matrix resin to disperse the carbon nanofibers in the epoxy matrix resin, adding a curing agent to the mixture, and curing the mixture. According to the disclosed method, the vapor-grown carbon nanofibers are physically mixed with an epoxy matrix resin without using any solvent. Thus, the vapor-grown carbon nanofibers are sufficiently dispersed in the epoxy matrix resin compared to the case of using a solvent. Therefore, it is possible to produce an epoxy nanocomposite material having excellent mechanical strength and low friction/wear properties at room temperature and excellent thermal properties even at high temperature. Also, the vapor-grown carbon nanofibers are cost-effective and, at the same time, used in an amount smaller than the amount of carbon nanotubes used to improve the physical properties of epoxy resin in the prior art, thus effectively reducing the production cost of the nanocomposite material. | 05-27-2010 |
20110046267 | ALUMINA POWDER, PROCESS FOR ITS PRODUCTION AND RESIN COMPOSITION EMPLOYING IT - To provide an alumina powder having an improved flowability, a process for its production, and a resin composition employing it. | 02-24-2011 |
20110245378 | NANOMATERIAL-REINFORCED RESINS AND RELATED MATERIALS - Provided are nanomaterial-reinforced resin compositions and related methods. The compositions include a reinforcing material, such as graphene, polyamic acid, carbon nanotubes, or dimethylacetamide that is dispersed into a resin. The reinforcing material is present in the resin at from about 0.001 to about 10 wt %. Also provided are methods of fabricating these compositions and methods of tailoring a composition to achieve a particular set of mechanical properties. | 10-06-2011 |
20120142821 | NANOCOMPOSITE MATERIAL CONTAINING POLYMER BINDERS - The invention relates to a nanocomposite material that contains a polymer binder, a filler and a fraction of nanoparticles, characterized in that the fraction of nanoparticles comprises multi-layered carbon particles having a toroidal shape with a size of 15 to 150 nm, wherein the ratio between the outer diameter and the thickness of the torus body is in a range of (10−3):1. This nano-modification makes it possible to obtain an efficient compaction and hardening of the nanocomposite material close to the filler/binder inter-phase barrier, and accordingly to increase the average density, elasticity, hardness and resistance of the material. The invention can be used for making various parts and articles for use in mechanical engineering and transport, including instrument holders for the precise surface treatment of parts. | 06-07-2012 |
20120184646 | SEMICONDUCTOR-ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A semiconductor-encapsulating liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine curing agent, and (C) an inorganic filler comprising an inorganic filler A which is a silica having an average particle size of 0.1 to 3 μm, and an inorganic filler B which is an amorphous nanosilica having an average particle size of 5 to 70 nm and having its surface treated with a coupling agent represented by the following formula (1) and/or (2): | 07-19-2012 |
20130035421 | COATING COMPOSITIONS EXHIBITING CORROSION RESISTANCE PROPERTIES, RELATED COATED SUBSTRATES, AND METHODS - Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed. | 02-07-2013 |
20130296466 | PROCESS FOR PREPARING ALUMINIUM TRIHYDROXIDE - The invention relates to a process for the milling-drying of a raw mixture containing aluminum trihydroxide having an average particle size D | 11-07-2013 |
20140121300 | CARBON FIBROUS CONJUNCT AND COMPOSITE MATERIAL USING THEREOF - The disclosed is a carbon fibrous conjunct in a granule form which comprises carbon fibrous structures and a binder by which the carbon fibrous structures are bound together,
| 05-01-2014 |
20140235759 | CURABLE MONOMERS - The invention relates to methods and a novel powdered curable monomer which may be used to manufacture bulk polymers, adhesives and coatings composite materials with high percentage weight inclusions of particulate filler materials, more specifically to fibre reinforced polymer composite materials with high percentage weight inclusions of particulate filler materials. The preferred particulate filler materials are carbon nanotubes. The method according to the invention allows greater than 0.5 wt % of carbon nanotubes, typically greater 10% wt of carbon nanotubes or other high aspect ratio fillers to be readily incorporated in the resin matrix, before being applied to the fibre reinforcing plys. | 08-21-2014 |
20160068676 | Hybridized Insulating Resin Material for High Voltage Equipment and High Voltage Equipment Using the Same - An object of the present invention is to provide a hybridized insulating resin material, in which a viscosity is low to ensure a molding ability and the occurrence of voids is suppressed with respect to a resin material to which 2 to 20 wt % of fine particles of 100 nm or less are added, and a high voltage equipment including the hybridized insulating resin material. The object is achieved by providing a hybridized insulating resin material for a high 1.0 voltage equipment, which contains 2 to 20 wt % of fine particles having a particle size of 100 nm or less and contains a nonion surfactant having an HLB value of 2 to 8, and a high voltage equipment including the hybridized insulating resin material. | 03-10-2016 |
20160177084 | REINFORCING MATERIAL, REINFORCED MATRIX RESIN, FIBER-REINFORCED RESIN COMPOSITE, AND METHOD FOR MANUFACTURING REINFORCING MATERIAL | 06-23-2016 |
20160251493 | HYDROTALCITE-CONTAINING SEALING RESIN COMPOSITION AND SEALING SHEET | 09-01-2016 |
20160376412 | POLYETHERIMIDE-FIBER COMPOSITES - Described herein is a composite comprising a matrix comprising a polymeric material; and at least one sized fiber selected from the group consisting of polyetherimide-sized fibers, epoxy-sized fibers, and combinations thereof. | 12-29-2016 |
523442000 | Heavy or transition metal or compound thereof | 7 |
20090111912 | LOW TEMPERATURE, MOISTURE CURABLE COATING COMPOSITIONS AND RELATED METHODS - Disclosed are low temperature, moisture curable coating compositions, related coated substrates, and methods for coating a substrate. The coating compositions include an ungelled, secondary amine-containing Michael addition reaction product of reactants including a compound comprising more than one site of ethylenic unsaturation, and an aminofunctional silane. | 04-30-2009 |
20100227951 | POLYMER CONCRETE ELECTRICAL INSULATION - Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (μm) to 100 micron (μm) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)]. The inorganic filler with an average grain size within the range of 1 micron (μm) to 100 micron (μm) [component c(i)] can be present in an amount within the range of 22% to 42%, calculated to the total weight of the polymer concrete electrical insulation system; and (e) the inorganic filler with an average grain size within the range of 0.1 mm to 2 mm [component c(ii)] is present within the range of 41% to 61% by weight, calculated to the total weight of the polymer concrete electrical insulation; and method of producing said electrical insulation. | 09-09-2010 |
20100311871 | COLLOIDAL SILICA PARTICLES, PROCESS FOR PRODUCING THE SAME, AND ORGANIC SOLVENT-DISPERSED SILICA SOL, POLYMERIZABLE COMPOUND-DISPERSED SILICA SOL, AND DICARBOXYLIC ANHYDRIDE-DISPERSED SILICA SOL EACH OBTAINED FROM THE SAME - There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm | 12-09-2010 |
20110224330 | FIBERS COATED WITH NANOWIRES FOR REINFORCING COMPOSITES - Fiber reinforced composites fabricated using a low-temperature, solution-based growth of nanowires such as ZnO nanowires on the surface of the reinforcing fibers such as carbon fibers and functionalized aramid fibers. The composites with nanowire interphase may have an enhanced fiber/matrix interface strength and a comparable in-plane strength, as compared to similar composites without such nanowire interphase. | 09-15-2011 |
20110257298 | COATING COMPOSITION CONTAINING HIGH-REFRACTIVE-INDEX METAL OXIDE FINE PARTICLES, AND CURABLE COATING FILM OBTAINED BY APPLYING THE COATING COMPOSITION ONTO BASE - The present invention relates to a coating composition containing metal oxide particles with a high refractive index and low photocatalytic activity and a coating film obtained by applying the coating composition onto a substrate. The coating composition contains metal oxide particles with a high refractive index obtained by coating the specific fine particles of the titanium-based oxide on their surfaces with at least a silica-based oxide or a silica-based composite oxide, and the coating film is obtained by applying the coating composition onto a substrate. The metal oxide particles with not only a high refractive index but also low photocatalytic activity, and therefore a coating film with excellent weathering resistance and light resistance can be formed on a substrate. | 10-20-2011 |
20120270968 | ANTICORROSION COATING COMPOSITION, AN ANTICORROSION FILM AND AN ANTICORROSIVE ARTICLE - A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent. | 10-25-2012 |
20140039094 | EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator. | 02-06-2014 |
523443000 | Silicon | 19 |
20100249279 | THERMALLY CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF - A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions. | 09-30-2010 |
20100305237 | SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT - The present invention provides an epoxy curing agent comprising colloidal silica particles, which is a liquid having low viscosity and excellent transparency and is suitable as a curing agent for a resin composition for sealing optical semiconductor elements. | 12-02-2010 |
20110021666 | AMORPHOUS SILICA POWDER, PROCESS FOR ITS PRODUCTION, AND SEALING MATERIAL FOR SEMICONDUCTORS - To provide an amorphous silica powder suitable for a sealing material for semiconductors having improved HTSL properties and HTOL properties, and a process for its production. | 01-27-2011 |
20110077329 | AMORPHOUS SILICEOUS POWDER, PROCESS FOR PRODUCTION THEREOF, RESIN COMPOSITION, AND SEMICONDUCTOR ENCAPSULATION MATERIAL - A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20. | 03-31-2011 |
20110082239 | THERMOSETTING EPOXY COMPOSITION WITH LOW EXPANSIBILITY - A thermosetting epoxy composition contains a modified silicon dioxide and is suitable for use in preparing an epoxy laminate having a low coefficient of thermal expansion and good drilling workability, which modified silicon dioxide contains no crystal water, has low expansibility, and contains 40% to 80% by weight of silicon dioxide and 60% to 20% by weight of an inorganic additive, and the modified silicon dioxide is obtained by a high-temperature (above 1000° C.) sintering process followed by a crushing process. | 04-07-2011 |
20110172331 | Reactive monomer-dispersed silica sol and production method thereof, and curable composition and cured article thereof - A reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed. A reactive monomer-dispersed silica sol containing a colloidal silica particle in which an alkaline earth metal ion is bonded to a surface of the colloidal silica particle. | 07-14-2011 |
20110313082 | EPOXY ADHESIVE COMPOSITIONS WITH HIGH MECHANICAL STRENGTH OVER A WIDE TEMPERATURE RANGE - A heat-curable adhesive composition comprising an epoxy-resin, a combination of core-shell toughening agents, a first curing agent being a linear aliphatic amined and a second curing agent being a cyclic aliphatic amine and a filler wherein the composition can be cured to form structural adhesives of high mechanical strength over a temperature range from −55° C. to up to 135° C. | 12-22-2011 |
20120022184 | Direct Overmolding - Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components. | 01-26-2012 |
20120046390 | EPOXY RESIN COMPOSITION - An epoxy resin composition has a glass transition temperature between 20° C. and 75° C. The epoxy resin composition includes an epoxy resin, a plurality of water vapor-proof particles, and at least two kinds of amino-functional curing agents. One of the amino-functional curing agents is a polyamine-type curing agent. The weight percent of the curing agent corresponding to the epoxy resin is between 10% and 95%. | 02-23-2012 |
20130005856 | Nano-Composite - There is provided a method of making a nano-composite having individual nano-sized silica particles dispersed in a polymer matrix, the method comprises the step of curing a substantially homogeneous mixture of surface-functionalized nano-sized silica particles, a polymerizable resin and a curing agent, wherein said substantially homogeneous mixture is substantially free of alcoholic solvent to form the nano-composite. | 01-03-2013 |
20130109786 | EPOXY RESIN COMPOSITION | 05-02-2013 |
20140187675 | Insulation Resin Material for High Voltage Equipment and High Voltage Equipment Using the Same - The present invention provides an insulation resin material containing a filler for high voltage equipment includes a polar resin, a hardener, a filler, and fine particles added to at least one of the polar resin and the hardener, and having polar organic substituents exposed at the surface thereof. According to this invention, an insulation resin material for high voltage equipment which is easy to control viscosity, does not cause a problem of filler settling, and provides easy handling in the molding process such as molding, and high voltage equipment using the insulation resin material can be provided. | 07-03-2014 |
20140275344 | EPOXY RESIN COMPOSITION, AND METHOD FOR PRODUCING THE SAME - An epoxy resin composition is provided which includes a polycrystalline structure comprised of a plurality of monocrystalline structures. The plurality of monocrystalline structures are respectively comprised of a plurality of silicon oxide colloidal particles regularly aligned in epoxy resin. The plurality of silicon oxide colloidal particles are not contacted with each other. The mean distance between the silicon oxide colloidal particles adjacent to each other is less than 330 nm. The mean particle size of the plurality of silicon oxide colloidal particles is less than 290 nm. The concentration of the plurality of silicon oxide colloidal particles is 10-50% by mass. A relative permittivity of 4 or more is ensured. A method for producing the epoxy resin composition is provided. Building materials, ornaments and optical materials, each using the epoxy resin composition, are also provided. | 09-18-2014 |
20140343193 | PRIMER COMPOSITION - Disclosed herein is a primer composition capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various materials that may be bonded with an epoxy-based adhesive. The primer composition includes: an epoxy resin containing at least a bisphenol A-type epoxy resin and a phenol novolac-type epoxy resin; a curing agent being dicyandiamide; a curing catalyst being imidazole; and an inorganic oxide filler containing fumed silica, at least a surface of which is hydrophobic and which has a primary particle diameter of 7 to 40 nm and a specific surface area of 50 to 380 m | 11-20-2014 |
20160068664 | SILICA SOL AND SILICA-CONTAINING EPOXY RESIN COMPOSITION - The silica sol of the invention contains silica particles having a mean primary particle size of 20 to 100 nm and which has a silica particle size/mean primary particle size ratio, determined through dynamic light scattering, of 3.0 or less, wherein the silica particles are surface-treated with an organic silane compound and have an α-ray emission rate of 0.005 counts/cm | 03-10-2016 |
20160194479 | NANOCOMPOSITES CONTAINING LAYERED NANOPARTICLES AND DISPERSANT, COMPOSITES, ARTICLES, AND METHODS OF MAKING SAME | 07-07-2016 |
20160200898 | NANOCOMPOSITES CONTAINING SILICA NANOPARTICLES AND DISPERSANT, COMPOSITES, ARTICLES, AND METHODS OF MAKING SAME | 07-14-2016 |
523444000 | Glass | 2 |
20120225975 | Method for Treating Reinforcing Fibre and Method for Producing a Reinforced Composite Article from the Treated Fibre - The present invention relates to a reinforced composite material and a method for its production. The composite material comprises at least one cured resin having a reinforcing material. Preferably the reinforcing material is a plurality of glass fibres which are treated such that the properties of the interphase substantially surrounding each fibre are substantially equivalent to those of the bulk cured resin. The fibre treatment may be selected from the group consisting of a polymeric coating, a hydrophilic surface coating, a surface coating of a free radical inhibitor, or a reduction in the total surface area of the fibres. The reinforced composite material of the invention provides improved long-term mechanical properties compared to traditional glass fibre reinforced materials. | 09-06-2012 |
20120252932 | COMPOSITE FORMING MATERIAL - A composite forming material of the present invention in which a fiberglass and a thermoplastic resin are compounded, where the fiberglass is a glass wool and a surface treatment is performed on the glass wool by spraying a solution which includes a silane coupling agent and/or a film former, a weight percent of the silane coupling agent to the glass wool is 0.24 wt %, and a weight percent of the film former to the glass wool is 2.4 wt %, the mean length of the glass wool is 600 μm, and the diameter is 3.4 μm. | 10-04-2012 |