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Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof

Subclass of:

523 - Synthetic resins or natural rubbers -- part of the class 520 series

523000000 - SYNTHETIC RESINS (CLASS 520, SUBCLASS 1)

523001000 - PROCESSES OF PREPARING A DESIRED OR INTENTIONAL COMPOSITION OF AT LEAST ONE NONREACTANT MATERIAL AND AT LEAST ONE SOLID POLYMER OR SPECIFIED INTERMEDIATE CONDENSATION PRODUCT, OR PRODUCT THEREOF

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
523427000 Composition wherein two or more polymers or a polymer and a reactant all contain more than one 1,2-epoxy group, or product thereof 47
523402000 Product contains water per se or water of hydration as designated nonreactive material (DNRM) 39
523451000 Phosphorus DNRM 35
523466000 Inorganic SI-O bond DNRM 34
523456000 Organic chalcogen compound DNRM 28
523435000 Solid polymer derived from reactant containing element other than C, H, O, or N or chlorine-containing reactant of three or more carbon atoms 27
523457000 Elemental metal or metal compound other than as silicate DNRM 27
523440000 Designated nonreactive material (DNRM) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range 24
523468000 Elemental carbon DNRM 17
523455000 Carboxylic acid or derivative devoid of heavy metal atom DNRM 14
523437000 Two or more polymers derived from ethylenic reactants only 12
523447000 Carbohydrate or derivative including tannin or derivative DNRM 9
523401000 Contains inorganic water settable material NRM 9
523436000 Polymer is graft, graft-type, block, or block-type 8
523445000 Boron DNRM 7
523454000 Ketone or aldehyde DNRM 6
523453000 Organic sulfur compound DNRM 6
523461000 Organic nitrogen compound DNRM 4
20120165432SELF HEALING POLYMER MATERIALS - The present invention generally relates to self healing polymer materials comprising thermoset and thermoplastic polymers. The present invention also relates to a method of manufacturing self healing polymer materials, methods of post-curing and healing the self healing polymer materials, composite materials comprising self healing polymer materials and methods of preparing the composite materials. In an attempt to develop improved structural materials, polymers and polymer materials have been identified that can be used in materials to act as self healing agents to repair structural damage occurring in the materials. The self healing polymer materials that have been identified are capable of being healed under post-curing or healing conditions.06-28-2012
20100016475IMIDAZOLE SALTS, METHOD FOR PRODUCING THEM, USE THEREOF AND EPOXY RESINS CONTAINING SAID SALTS - The invention refers to salts of at least one imidazole of the general formula (I), in which R01-21-2010
20100010119Corrosion-Resistant Epoxy Nanocomposite Coatings containing Submicron Emeraldine-Base Polyaniline and Organomodified Montmorrilonite - Disclosed is a method of preparation of corrosion-resistant epoxy coatings. The coating composition contains two main corrosion resistant factors: The first one was Eemeraldine-Base polyaniline (EB-PANi), dissolved in the aminic hardener of epoxy. The other one was montmorrilonite clay, dispersed or exfoliated in the base component of epoxy resin. The hardener composition was prepared via dissolution of EB-PANi in functional amines like 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine adopting sonication and nanoscale filtering methods. The base component was prepared via gradual charging of MMT clay in epoxy resin via high-shear mixing plus sonication method. The morphology of the coatings during different stages of preparation was studied by optical microscopy and scanning electron microscopy and TEM. The corrosion-protective performance of the resultant coatings was evaluated by electrochemical impedance spectroscopy and salt spray tests. The results were compared with those of conventional epoxy zinc-chromate and neat resin coatings. Superior corrosion resistance was achieved via dissolution of 0.5-2.5 wt % of EB-PANi in the aminic hardener and 2-4 WT % of organomodified MMT in base component of coating.01-14-2010
20120277349FLAME RETARDANT AGENTS AND FLAME RETARDANT MATERIALS COMPRISING THE SAME - Disclosed is a flame retardant agent, including a nitrogen-based lignin formed by reacting 1 part by weight of lignin, 0.8 to 2.4 parts by weight of a nitrogen-containing compound, and 0.3 to 0.9 parts by weight of an aldehyde under an alkaline condition. The flame retardant agent can be added to thermoplastic or thermosetting resins to form flame retardant materials.11-01-2012
523450000 Coal, asphaltic, or bituminous material DNRM 3
20120238669ASPHALTENES-BASED POLYMER NANO-COMPOSITES - Inventive composite materials are provided. The composite is preferably a nano-composite, and comprises an asphaltene, or a mixture of asphaltenes, blended with a polymer. The polymer can be any polymer in need of altered properties, including those selected from the group consisting of epoxies, acrylics, urethanes, silicones, cyanoacrylates, vulcanized rubber, phenol-formaldehyde, melamine-formaldehyde, urea-formaldehyde, imides, esters, cyanate esters, allyl resins.09-20-2012
20090247670Epoxy Resin Molding Material for Sealing, and Electronic Component Device - The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×1010-01-2009
20090131558METHOD FOR PREPARING COMPLEX STYRENIC BLOCK COPOLYMER AND ASPHALT COMPOSITION CONTAINING IT - Disclosed is a modified asphalt composition obtained by blending asphalt with a complex block copolymer, which is prepared by polymerizing styrene in the presence of an anionic polymerization initiator to prepare a polystyrene solution, adding butadiene to the polystyrene solution, and then further polymerizing styrene, and wherein a triblock copolymer and diblock copolymer are present at a specific proportion. The modified asphalt composition of the present invention exhibits superior ductility at low temperature, while exhibiting comparable or better softening point as compared to conventional compositions, and, thus, is applicable to road paving, waterproof sheets and sealants.05-21-2009
523446000 Biologically derived cellular material other than cereal, cotton, or diatomaceous earth DNRM 3
20110028603HYPERBRANCHED POLYMERS AND OLIGOMERS COMPRISING TERMINAL AMINO GROUPS AS CURING AGENTS FOR EPOXY RESINS - The invention relates to the use of hyperbranched polymers or oligomers comprising terminal primary and/or secondary amino groups as curing agents for epoxy resins. The invention further relates to a composition containing such polymers or oligomers, an uncured or only partially cured epoxy resin, and at least one optional curing agent for epoxy resins, as well as a cured epoxy resin that can be obtained by curing said components. The invention finally relates to a method for curing epoxy resins. In said method, an uncured or only partially cured epoxy resin is brought to a temperature of 5 to 150° C. or is exposed to microwave radiation along with at least one polymer or oligomer according to the definition above and at least one optional conventional curing agent for epoxy resins.02-03-2011
20120172494METHOD FOR PRODUCING WOOD FIBRE-PLASTICS COMPOSITE PRODUCTS - A process for producing a composite product comprising fibres of a lignocellulosic material or natural fibres and a plastics material utilises a liquid or particulate binder formulation comprising a thermoset resin and a thermoplastic polymer, monomer, or oligomer. A composite product is formed for use as or in forming a feedstock in plastics manufacture may be broken down under heat and mechanical shearing in a plastics extrusion machine to release the major fraction of the fibres, or the product may be useful as an intermediate product in other form or as an end product.07-05-2012
20110319524Epoxy Acid Thermoset Resins and Composites that Can Be Hot-Fashioned and Recycled - Resins and thermoset composites comprising them, these materials being able to be hot-fashioned. These compositions resulting from placing at least one thermosetting resin precursor, this thermosetting resin precursor comprising hydroxyl functions and/or epoxy groups, and optionally ester functions, in contact with at least one hardener chosen from carboxylic acids, in the presence of at least one transesterification catalyst whose total molar amount is between 5% and 25% of the total molar amount of hydroxyl and epoxy contained in the thermosetting resin precursor. Process for manufacturing these materials, process for transforming and process for recycling these materials. New solid forms of resins and of thermoset composites that may be used in the implementation of these processes.12-29-2011
523463000 Hydrocarbon other than xylenes, benzene, or toluene DNRM 1
20100168280Process for preparing a self-healing composite material - The process for preparing a self-healing composite material comprising a matrix of epoxy polymer, in which a catalyst of ring opening metathesis reaction and microcapsules containing a cyclic olefin having 7 to 40 carbon atoms are dispersed, comprises the steps of: 07-01-2010
523439000 Polymer derived from ethylenic reactants only derived from heterocyclic reactant other than 1,2-epoxy solely 1
20110288205POLYMER DISPERSIONS OF NARROW PARTICLE SIZE DISTRIBUTION - A process for the manufacture of a polymer dispersion comprising the steps of i) providing a mixture comprising from 2 to 60 parts by weight of a first polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and from 40 to 98 parts by weight of a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene ii) causing the polymers to melt at a chosen temperature under conditions of high shear in an extruder to form an intimate mixture of the polymers iii) causing some of the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene to react with at least some of the functional groups of the second polymer to form a reaction mixture, under conditions of high shear in an extruder iv) rapidly cooling the reaction mixture outside the extruder to form a solid product v) optionally breaking up the solid product into smaller pieces vi) contacting the solid product with an organic liquid wherein the organic liquid is chosen to be a good solvent for the second polymer and a poor solvent for the polypropylene polymer whereby a dispersion comprising polypropylene particles in a solution of the second polymer dissolved in the organic liquid is formed.11-24-2011
Entries
DocumentTitleDate
20120202920COATING COMPOSITIONS CONTAINING TETRAMETHYL CYCLOBUTANEDIOL - Disclosed are solvent borne thermosetting coating compositions that contain a curable polyester resin blended with an acrylic copolymer, a crosslinker, and a solvent. The polyester resin contains 2,2,4,4-tetramethyl-1,3-cyclobutanediol and exhibits good dry time, compatibility with acrylic resins, sag resistance and hardness development in a coating composition. The coating compositions can be used to prepare clear coat or pigmented coatings for automotive OEM, auto refinish, and other applications.08-09-2012
20100022685RAPID DRY FIBERGLASS STAIN - A portion of the linseed oil ingredient used in fiberglass composite stains is replaced with a modified Cashew Nut Shell Liquid (CNSL) resin. As a result, the drying time of the stain is shortened considerably yet is still long enough to allow working of the stain into the composite for developing a simulated wood appearance.01-28-2010
20120184644Biaxially stretched polyester film which comprises a chain extender, and process for production thereof and use thereof - The invention relates to biaxially oriented polyester films that include a chain extender in addition to the polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor films, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.07-19-2012
20100076119ADHESIVE FOR ELECTRONIC COMPONENTS - The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.03-25-2010
20130079437EPOXIDE/(METH) ACRYLATE COMPOSITION - A composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.03-28-2013
20130079435Benzylated Polyamine Curing Agents - A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula:03-28-2013
20130079436CURING OF EPOXY RESIN COMPOSITIONS COMPRISING CYCLIC CARBONATES USING MIXTURES OF AMINO HARDENERS - A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I:03-28-2013
20130210961Epoxy Composition with Crystallization Inhibition - An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite.08-15-2013
20100144926EPOXY RESIN COMPOSITION - A resin composition comprising an epoxy compound denoted by the formula (1):06-10-2010
20100041794HYDROXYL-TERMINATED OR CARBOXYLIC ACID-TERMINATED REACTIVE MONOMER COMPOSITIONS, THEIR PREPARATION AND THEIR USE - The present invention relates to new reactive monomer compositions that have a plurality of reactive, functional moieties, such as one or both of a hydroxyl moiety or a carboxylic acid moiety. The present invention also further relates to use of such reactive monomer compositions as a component of curable coating compositions, especially curable powder coating compositions.02-18-2010
20100331453Waterborne Polymeric Dispersions - A polymeric composition for making aqueous polymeric dispersions, comprises hydrophilic macromonomer (I), hydrophobic polymer (II) and bridging monomer (III), wherein the hydrophilic macromonomer (I) and hydrophobic polymer (II) are grafted together in the presence of bridging monomer (III) and the hydrophilic macromonomer (I) has a structure according to formula (1): R—C(X)═CH12-30-2010
20130090412ANTICRATER AGENT FOR ELECTROCOATING COMPOSITION - The present disclosure relates to an improved electrocoating coating composition wherein the improvement is the addition of a non-water reducible anticrater agent. The non-water reducible anticrater agent is a polyesterurethane that is the reaction product of an aliphatic carboxylic acid anhydride, a monofunctional epoxy compound, a monofunctional alcohol and a diisocyanate and/or a polyisocyanate. The improved electrocoating composition provides cured coatings that have fewer craters and have a smooth surface when compared to coatings utilizing other anticrater additives.04-11-2013
20130165548SIZING COMPOSITIONS AND SIZED PRODUCTS FOR THERMOPLASTIC COMPOSITES - Sizing compositions to size fibers or particles used in plastic composites are described. The compositions may include a solution with a polymerization compound selected from: (a) at least one non-isocyanate-containing polymerization initiator (PI) for initiating the polymerization of caprolactam monomers; or (b) at least one precursor for a non-isocyanate-containing PI for initiating the polymerization of caprolactam monomers. Methods of making the sizing the composition, as well as methods of making reinforced thermoplastic composites from sized fibers or particles, are also described.06-27-2013
20090093569Novel Dispersant And Compositions Thereof - A composition comprising a particulate Solid, an organic medium and a compound with an alkyleneoxy compound with an inorganic acidic polar head group (Z), wherein the compound is defined by Formula (1) and salts thereof: U—(Y)04-09-2009
20130072595CURING OF EPOXY RESIN COMPOSITIONS COMPRISING CYCLIC CARBONATES USING MIXTURES OF AMINO HARDENERS AND CATALYSTS - A process for curing epoxy resins which comprises curing epoxy resin compositions comprising 03-21-2013
20130059942CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME - Disclosed is an epoxy or epoxy-polyester curable powder coating composition which can form a favorable cured coating film excellent in adhesion and solvent resistance and is excellent in storage stability. The curable powder coating composition of the present invention contains the following component (A) and component (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate complex which contains (b1) at least one selected from the group consisting of a carboxylic acid compound and a tetrakisphenol compound represented by the following formula (I), and (b2) at least one selected from compounds represented by formula (II). The carboxylic acid compound preferably includes an aromatic carboxylic acid.03-07-2013
20120190773COMPOSITE SURFACING FILM WITH ULTRAVIOLET LIGHT AND ABRASION RESISTANCE - The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.07-26-2012
20120115987RADIATION CURABLE COMPOSITIONS - The invention relates to radiation curable compositions comprising at least one radiation curable (meth)acrylic copolymer A prepared by reacting a copolymer P obtained from copolymerizing monomers comprising (i) from 10 to 50 mole % of at least one (meth)acrylate (a1) comprising a first functional group, and (ii) from 50 to 90 mole % of at least one alkyl(meth)acrylate (a2) having at least 6 carbon atoms in the alkyl chain, with at least one (meth)acrylate (a3) comprising a second functional group which can react with the first functional group of (meth)acrylate (a1), said radiation curable (meth)acrylic copolymer A having a number average molecular weight Mn of 1000 to 23000, and their use for making inks, varnishes, adhesives and coatings.05-10-2012
20120115985PROCESS FOR FORMING A HYDROPHILIC COATING AND HYDROPHILIC COATING, AND PROCESS FOR FORMING AN INK JET RECORDING HEAD AND INK JET RECORDING HEAD - A process for forming a hydrophilic coating, including (1) forming, on a substrate, coating resin layer including a cationic polymerization resin having an acid-cleavable linkage in its main chain, and a photoacid generator which generates antimonic acid or an acid having a weaker acid strength than that of antimonic acid by irradiation with active energy ray including ultraviolet light; (2) laminating, on the resin layer, a photoacid generator holding layer including a photoacid generator which generates an acid having a stronger acid strength than that of antimonic acid by irradiation with the energy ray, and a holder which holds the photoacid generator and can be removed in step (3); (3) removing the holding layer and curing the resin layer through exposure of those layers to the energy ray to conduct development; and (4) forming a hydrophilic coating by hydrophilizing a surface of the resin layer through heat treatment thereof.05-10-2012
20100016474LIQUID EPOXY RESIN COMPOSITION - A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an amine curing agent, and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B).01-21-2010
20120238667CHIPPING-RESISTANT COATING COMPOSITION - The present invention provides a chipping-resistant coating composition including a hydroxyl group-containing urethane resin (A) obtained by reacting a polyol component (a) composed of a cyclic polyol compound (a1) having a nurate structure and another polyol compound (a2) with a polyisocyanate compound (b), and a curing agent (B). This chipping-resistant coating composition is capable of forming a coated film excellent in chipping resistance and water resistance. Furthermore, the present invention also provides an article coated with the chipping-resistant coating composition.09-20-2012
20120238666Direct-To-Metal and Exterior Durable Non-Skid Coating - A non-skid coating described herein attempts to overcome the deficiencies of the conventional coatings with improved external durability and color retention, a reduced level of VOCs, and direct-to-metal (DTM) adhesion using organo-siloxane chemistry. The non-skid coating has a first component having an amino-functional siloxane resin; a second component having a non-aromatic epoxy resin; a spherical filler for lowering viscosity; a pigment; a coarse aggregate; and a thixotropic agent. The amino-functional siloxane resin can be an amino-functional methyl phenyl polysiloxane, diphenyl polysiloxane or silsesquioxane-based resin. The non-aromatic epoxy resin can be cycloaliphatic or aliphatic. The first component is about 09-20-2012
20090264558Capped polyurethane prepolymers and heat-curable epoxy resin compositions - The invention relates to differently blocked polyurethane polymers of formula, to their use as impact resistance modifiers, to heat-curable epoxy resin compositions containing said impact resistance modifiers and to methods for the production of said compositions. The invention also relates to bonding methods using said compositions and to articles produced by said methods.10-22-2009
20110281972POWDER COATING COMPOSITIONS FOR LOW TEMPERATURE CURING AND HIGH FLOW - The present invention relates to powder coating compositions and to components and ingredients for incorporation therein, suitable for low temperature curing schedule and with excellent resistance to outside aging. The powder coating composition can be cured at a temperature from 140° C. to lead to a coating with excellent flow and high gloss.11-17-2011
20100160494AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE - The present invention provides an amine based epoxy resin curing agent containing an epoxy resin and an amine compound capable of imparting a high gas barrier performance and a long pot life, in addition to excellent performances which an epoxy resin conventionally possesses, and an epoxy resin composition with a high gas barrier performance and a long pot life, which contains the subject curing agent. Also, the present invention provides an adhesive for laminate with excellent adhesiveness to various polymers, papers, metals, etc., which contains, as a main component, an epoxy resin composition containing an amine based resin curing agent with a high gas barrier performance and a long pot life.06-24-2010
20110288203FIRE RESISTANT MATERIAL AND FORMULATION THEREOF - The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.11-24-2011
20110288202HEAT-CURING POWDER-LACQUER COMPOSITIONS YIELDING A MATTE SURFACE AFTER CURING OF THE COATING, AS WELL AS A SIMPLE METHOD FOR PRODUCTION OF SAME - The invention relates to heat-curing powder-lacquer compositions exhibiting a matte surface after curing of the coating, as well as to a simple method for production of the same.11-24-2011
20110082237Liquid crystal alignment agent, liquid crystal alignment film formed therefrom, and liquid crystal display element provided with the liquid crystal alignment film - The present invention provides a liquid crystal alignment agent and a liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film. More specifically, the present invention provides a liquid crystal alignment agent and liquid crystal alignment film formed therefrom, as well as a liquid crystal display element provided with the liquid crystal alignment film without image sticking problems and having superior voltage holding ratio. The liquid crystal alignment agent includes: a polymer (A) obtained from a reaction between tetracarboxylic dianhydride compound and diamine compounds, an epoxy compound (B), and an organic solvent (C). Wherein the liquid crystal alignment agent is coated on a glass substrate, and heated for 15 minutes at 220° C. to forth a hard coating film. The hard coating film is extracted for 72 hours by using acetone at 60° C. to obtain an extract, an epoxy value on the extract is designated O, and based on 100 parts by weight of the solid content of the liquid crystal alignment agent, the parts by weight of the epoxy compound (B) is designated W, the O and W conform to the following equation:04-07-2011
20110294918ANTI-CORROSIVE PAINTINGS AND COATINGS CONTAINING NANOPARTICLES - The present invention refers to a formulation for anticorrosion paints and coatings, based on epoxy, polyurethane, acrylic, alkylic, polyester resins and mixtures thereof, dissolved in organic or inorganic solvent and comprising a multitude of mostly bi-dimensionally developed nanoparticles, with a few hundred and about one nanometer, respectively, as to lateral dimensions and thickness, wherein the viscosity of the formulation is lower than 55000 mPa·s.12-01-2011
20110098380POLYPHENOLIC COMPOUNDS AND EPOXY RESINS COMPRISING CYCLOALIPHATIC MOIETIES AND PROCESS FOR THE PRODUCTION THEREOF - Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures.04-28-2011
20090253829PROCESS FOR THE MANUFACTURING OF SLABS OR BLOCKS OF CONGLOMERATE OF STONE GRANULATE AND POLYESTER RESIN - In the manufacture of articles in slabs or blocks according to so-called Bretonstone technology, a polyester resin is employed, free of reactive solvents, formed by the reaction between an epoxidised triglyceride and at least one carboxylic anhydride.10-08-2009
20100063182EPOXY COMPOSITION - There is disclosed an epoxy composition containing at least two kinds of epoxy compounds selected from the epoxy compounds of the formula (1):03-11-2010
20100249276CURATIVES FOR EPOXY COMPOSITIONS - The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.09-30-2010
20130217803NOVEL RESIN CURING AGENTS - A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.08-22-2013
20110196067WATER/OIL REPELLENT COMPOSITION AND METHOD FOR ITS PRODUCTION - To provide a water/oil repellent composition which is capable of imparting sufficient dynamic water repellency and post-air-drying water repellency to the surface of an article and which presents a low environmental impact, and a method for its production.08-11-2011
20120108699Composite Compositions - In one embodiment, the present invention provides an uncured composite composition. The uncured composite composition includes an uncured resin and a triaxial braid. The triaxial braid includes a longitudinal axis, a first bias fiber extending in a first bias direction at a first bias angle to the longitudinal axis, a second bias fiber extending in a second bias direction at a second bias angle to the longitudinal axis, and an axial fiber extending in a direction parallel to the longitudinal axis; wherein the first bias fiber, the second bias fiber, and the axial fiber have a substantially same tow size, and the tow size is in a range of from about 1 k to about 11 k. A cured composite and a method of making the cured composite are also provided.05-03-2012
20110077328USE OF FILLER THAT UNDERGOES ENDOTHERMIC PHASE TRANSITION TO LOWER THE REACTION EXOTHERM OF EPOXY BASED COMPOSITIONS - Disclosed are curable epoxy-based resins having a lower peak exotherm during cure, as well as thermoset resins and epoxy-based parts formed from the curable epoxy-based compositions. The epoxy-based compositions having a lower peak exotherm during cure may include: at least one epoxy resin, at least one hardener, and at least one endothermic transition additive. The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm during cure, which may be useful when forming large epoxy-based parts, such as those including 200 grams or more of the thermoset resin. Also disclosed is a process for forming curable epoxy-based resins having a lower peak exotherm during cure, including: admixing at least one epoxy resin; at least one hardener; and at least one endothermic transition additive; to form a curable composition. The resulting curable composition may then be thermally cured at a temperature of at least 60° C. to form a thermoset resin.03-31-2011
20110172330POLYPROPYLENE OXIDE-CONTAINING POLYETHERS AND MIXTURES THEREOF WITH POLY(METH)ACRYLATES AS POWDER COATING LEVELING AGENTS - The invention relates to powder coating leveling agents comprising (a) at least one polypropylene oxide-containing polyether having a weight-average molecular weight of more than 1000 g/mol and a polypropylene oxide fraction of more than 75% by weight, and optionally (b) at least one poly(meth)acrylate. The invention further relates to the preparation of such leveling agents and to their use in powder coating materials, and also to powder coating materials comprising the leveling agents.07-14-2011
20120296011PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF - A phenolic compound which can be obtained by reacting the compound of the formula (1):11-22-2012
20100144927THERMAL CURABLE POWDER COATING COMPOSITION - A powder coating composition based on including at least one specific kind of the polyuretdione resin having a carboxyl value in the range of 20 to 300 mg KOH/g which exhibits higher crosslinking density in thin films, high flexibility, and excellent weather resistance.06-10-2010
20090137702COATING SYSTEM - A curable composition comprising 05-28-2009
20090062430Epoxy Resin Composition for Sealing and Electronic Component Device - The invention relates to an epoxy resin composition for sealing comprising (A) an epoxy resin, and (B) a curing agent, wherein the following is comprised as the curing agent (B): (C) a compound or compounds represented by the following general formula (I) in which n is or n's are each an integer of 1 to 10, and m is or m's are each an integer of 1 to 10:03-05-2009
20080262128Polymer Brushes - Polymer brushes (10-23-2008
20120077903EPOXY RESIN-BASED COATING COMPOSITION - The present invention relates to epoxy resin coating composition which comprises, at least, epoxy resin, a thiol-type curing agent and a curing assistant, being composed of two liquids of liquid (A) containing epoxy resin and a thiol-type curing agent and liquid (B) containing a curing assistant, which liquids are mixed just before using, wherein the thiol-type curing agent contains a branched compound containing a thiol group (P), which compound is an ester of polyhydric alcohol with thiol group-containing carboxylic acid represented by formula (1)03-29-2012
20110060076EPOXY RESINS DERIVED FROM SEED OIL BASED ALKANOLAMIDES AND A PROCESS FOR PREPARING THE SAME - An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.03-10-2011
20100227950COMB-LIKE POLYETHERALKANOLAMINES IN INKS AND COATINGS - Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.09-09-2010
20100227949CURABLE COMPOSITION - Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).09-09-2010
20130217804CURABLE AND CURED COMPOSITIONS - Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.08-22-2013
20100120947Biaxially stretched polyester film which comprises a chain extender, and process for production thereof and use thereof - The invention relates to biaxially oriented polyester films that include a chain extender in addition to polyester. Such films find use in all applications typical of biaxially oriented polyester films, especially in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.05-13-2010
20120142818WATERBORNE, RADIATION-CURABLE COATING COMPOSITIONS AND RELATED METHODS - Disclosed are waterborne, radiation-curable coating compositions. These coating compositions include a water-dispersible polymer and a hydrophobic multi-functional ethylenically unsaturated compound. The compositions are characterized by being viscosity stable at elevated temperatures and alkaline conditions.06-07-2012
20120142817ONE COMPONENT EPOXY STRUCTURAL ADHESIVE COMPOSITION PREPARED FROM RENEWABLE RESOURCES - Curable, one-package, stable adhesive compositions are provided comprising: 06-07-2012
20120142816Novel epoxy hardeners with improved cure and polymers with enhanced coating properties - A hardener composition for epoxy resins, the hardener composition including a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane. A prepolymer hardener composition for epoxy resins, the prepolymer hardener composition comprising the reaction product of an epoxy with a mixture of 1,3-bis(aminomethyl)cyclohexane; and 1,4-bis(aminomethyl)cyclohexane.06-07-2012
20100298469EFFECT PIGMENTS BASED ON SUBSTRATES FORMED FROM INORGANIC-ORGANIC MIXED PHASES, PRODUCTION AND USE THEREOF - Effect pigments with a platelet-shaped substrate provided on at least one side with at least one coating of semitransparent metal and/or at least one high-index coating having a refractive index≧2.0. The platelet-shaped substrate includes at least one mixed inorganic/organic phase. Also, a method of producing effect pigments including the following steps: 11-25-2010
20120123024AMINE FUNCTIONAL ADDUCTS AND CURABLE COMPOSITIONS COMPRISING SAME - A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.05-17-2012
20130137795EPOXYSILICONE CONDENSATE, CURABLE COMPOSITION COMPRISING CONDENSATE, AND CURED PRODUCT THEREOF - There is provided an epoxy group-containing silicone condensate that yields cured products with excellent transparency, thermal resistance and gas barrier properties. An epoxysilicone condensate which is the product of hydrolytic condensation of an epoxy group-containing alkoxysilane compound represented by formula (1):05-30-2013
20110009527THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions.01-13-2011
20100160495EMULSION PAINT TYPE DAMPING COATINGS - Emulsion paint type damping coatings show an excellent film forming property even if it leaves at low temperature from 5 to 20° C. It does not generate a defective coated film like swellings after baking drying and brings out an excellent damping performance within a range of 20 to 60° C. That is, it contains one or more than two kinds of organic chemicals within a range of 0.5% to 5% by weight in total and the MFT, the minimum film forming temperature of the entire resin emulsion is within a range of 5 to 15° C. and the boiling point for a film forming assistant is within a range of 150 to 240° C., thus, it enables to obtain an excellent film forming property at 5° C. and even in baking drying and does not generate a defective coated film like swellings as well. As a result, emulsion paint type damping coatings bring out an excellent damping performance within a range of 20 to 60° C.06-24-2010
20110245376NANOCALCITE COMPOSITES - Compositions comprising surface-modified nanocalcite particles dispersed in a curable resin, and to coatings and fibrous composites incorporating such compositions are described. The surface-modifying agents include a binding group ionically associated with the calcite and a compatiblizing segment, compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites and coating a fibrous composites prepared from such nanocalcite composites are also described.10-06-2011
20110118385PROCESS FOR PREPARING SELF-HEALING COMPOSITE MATERIALS OF HIGH EFFICIENCY FOR STRUCTURAL APPLICATIONS - A process is for preparing a self-healing composite material including a matrix of epoxy polymer in which a catalyst of ring opening metathesis reaction and vessels containing at least one monomer able to polymerize due to a ring opening metathesis reaction are dispersed. The process includes the preliminary step of dispersing at molecular level the catalyst in a mixture containing at least one precursor of the epoxy polymer, and then the steps of dispersing, in the mixture, the vessels and a tertiary amine acting as curing agent of the precursor, and the step of curing the mixture by at least a first heating stage performed at a temperature between 70 and 90° C. for a time between 1 and 5 hours, and a second heating stage performed at a temperature between 90 and 170° C. for a time between 2 and 3 hours.05-19-2011
20110245375CURABLE COMPOSITION COMPRISING A THERMOLATENT BASE - The present invention relates to curable compositions comprising a thermolatent amidine base and an organic material which is polymerisable or crosslinkable with a basic or nucleophilic catalyst. In particular, the invention relates to curable coating compositions, especially powder coating compositions, and curable adhesive compositions, as well as to the use a thermo-latent amidine base as a curing catalyst for thermally induced base- catalyzed polymerisation or crosslinking reactions.10-06-2011
20110086946INK COMPOSITION FOR FORMING INSULATING FILM AND INSULATING FILM FORMED FROM THE INK COMPOSITION - An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×1004-14-2011
20120035298POLYHYDROXY-DIAMINES AS MULTI-FUNCTIONAL ADDITIVES FOR PAINTS, COATINGS AND EPOXIES - Provided are polyhydroxy-diamine compounds of the formula I: or salt thereof, wherein R02-09-2012
20080262127FLAME RESISTANT RESIN COMPOSITION - A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability. Therefore, the resin composition is particularly useful in composite materials, forming materials or semiconductor packaging materials.10-23-2008
20120245252OXAZOLIDONE RING CONTAINING ADDUCTS - Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct.09-27-2012
20100056671POLYFUNCTIONAL EPOXY OLIGOMERS - The present invention provides epoxy functional oligomeric compounds, methods of preparation and uses therefor. In particular, the present invention provides to oligomeric epoxy compounds derived from allyl glycidyl ether.03-04-2010
20100063181COATING SYSTEM - A curable composition comprising 03-11-2010
20110082238JETTABLE COMPOSITIONS - A fully curable jettable composition having a viscosity less than 30 cps at a temperature within the range of 15° C.-180° C. comprising (i) at least one low viscosity reactive resin; (ii) at least one higher viscosity resin having a viscosity greater than twice that of the low viscosity resin and a functionality of greater than or equal to 2; (iii) at least one curable toughener, (iv) at least one initiator for the polymerisation of the resins, and (v) at least one stabiliser for delaying the curing of the resins of the composition. The composition can be jetted from piezo electric printing heads under the control of a computer program to form a multi-layered article, for example, a three dimensional article, in which the adjacent droplets merge and are cured homogeneously together.04-07-2011
20110039981EPOXY RESINS DERIVED FROM NON-SEED OIL BASED ALKANOLAMIDES AND A PROCESS FOR PREPARING THE SAME - An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one non-seed oil based alkanolamide; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.02-17-2011
20110039982EPOXY RESINS AND PROCESSES FOR PREPARING THE SAME - Epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety and processes for preparing the epoxy resins. The process of preparation of the epoxy resins comprises reacting (a) a mixture of a cis-1,3-cyclohexanedimethanol, a trans-1,3-cyclohexanedimethanol, a cis-1,4-cyclohexanedimethanol, and a trans-1,4-cyclohexanedimethanol, (b) an epihalohydrin, (c) a basic acting substance, (d) optionally, a solvent, (e) optionally, a catalyst, and/or (f) optionally, a dehydrating agent. The process may be a slurry epoxidation process, an anhydrous epoxidation process, or a Lewis acid catalyzed coupling and epoxidation process.02-17-2011
20110257296TUNABLE POLYMER COMPOSITIONS - The present invention provides polymer compositions having a tunable decomposition temperature. Suitable additives are disclosed for lowering the decomposition temperature of polymer compositions. The invention further provides methods of preparing such polymer compositions with tunable decomposition temperatures.10-20-2011
20110213052Method for Producing Dialkylphosphinic Acids and Esters and Salts Thereof by Means of Acrylic Acid Derivatives and Use Thereof - The invention relates to a method for producing mono-carboxyfunctionalized dialkylphosphinic acids and esters and salts thereof, characterized in that a) a phosphinic acid source (I) is reacted with olefins (IV) to yield an alkylphosphonic acid, salt or ester (II) thereof in the presence of a catalyst A, b) the alkylphosphonic acid thus obtained, salt or ester (II) thereof is reacted with an α,β-unsaturated carboxylic acid derivative (V) to yield a mono-carboxyfunctionalized dialkylphosphinic acid derivative (III) in the presence of a catalyst B, wherein R09-01-2011
20100063183INTERCALATION AGENT FREE COMPOSITIONS USEFUL TO MAKE NANOCOMPOSITE POLYMERS - A two step method for preparing a filler composition, the filler composition useful to prepare a nanocomposite polymer. The first step is to disperse a water dispersible filler material in a liquid comprising water to form a dispersion. The second step is to replace at least a portion of the water of the liquid with an organic solvent to form the filler composition, the water concentration of the liquid of the filler composition being less than six percent by weight, the average size of at least one dimension of the filler material being less than two hundred nanometers upon examination by transmission electron microscopy of a representative freeze dried sample of the dispersion of the first step. A nanocomposite polymer can be prepared by mixing the above-made filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing a filler having an average size of at least one dimension of the filler of less than two hundred nanometers upon examination by transmission electron microscopy of a representative sample of the polymer. In addition, an epoxy resin composition useful for making a cured epoxy nanocomposite polymer, the epoxy resin composition made by a two step process. The first step is to mix an epoxy resin with the filler composition to form an epoxy resin mixture. The second step is to remove organic solvent from the epoxy resin mixture to form the epoxy resin composition. And, a nanocomposite polymer, made by the step of mixing the filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing a filler having an average size of at least one dimension of the filler of less than two hundred nanometers upon examination by transmission electron microscopy of a representative sample of the polymer.03-11-2010
20110054075Dispersants From Linear Polyurethanes - The present invention provides a non-aqueous composition containing a particulate solid, an organic medium and polyurethane dispersant with a substantially linear anchoring segment pendant tertiary amine group(s) from said anchoring segment and terminally attached solvent-solubilising terminal chains of a polyester, polyether, or polyacrylate including mixtures of such terminal chains.03-03-2011
20110054074ADHESIVE - The present invention relates to an adhesive comprising at least one matrix material and core/shell particles comprising cores having a diameter in the range from 1 nm to 1 μm with a shell comprising oligomers and/or polymers, and to a process for the preparation thereof.03-03-2011
20110054073CURABLE COMPOSITION AND USE THEREOF - This invention relates to a curable composition comprising one or more of organic metal compounds as resin bleed-out controller and its application in semiconductor packages. Particularly, the organic metal compound is an organic titanate. In some embodiments, the organic titanates include, but are not limited to tetraalkyl titanates and titanate chelates. The composition shows excellent performance in bleeding-out control and thus can reduce the occurrence of failure, such as die top delamination, in semiconductor packages.03-03-2011
20110065836POLYCOSANOL-BASED ASSOCIATIVE MONOMERS, CORRESPONDING ASSOCIATIVE THICKENING AGENTS AND THEIR USES - The present invention relates to new associative monomers, terminated by a hydrophobic chain with a base of polycosanols, which can be bio-resourced raw materials, and notably of octacosanol. It also concerns the HASE-type associative copolymers manufactured from these monomers, from (meth)acrylic acid and from an ester of one of these acids. The invention also concerns the use of these copolymers as thickening agents for water-based formulations.03-17-2011
20100298468EPOXY RESINS WITH IMPROVED FLEXURAL PROPERTIES - Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.11-25-2010
20100324174THERMOPLASTIC RESIN COMPOSITION AND SHAPED ARTICLE THEREFROM - Disclosed are a thermoplastic resin composition which has a reduced tendency to mold staining while being shaped and a high flowability, and a shaped article which, when used as a lamp component, has good surface appearance and generates little volatiles by the heat of the lamp. Specifically disclosed are a thermoplastic resin composition containing a polyester resin (A), a cresol novolac epoxy resin (B), and a vinyl cyanide-aromatic vinyl copolymer containing epoxy group (C), and a shaped article shaped therefrom, wherein the cresol novolac epoxy resin (B) and the vinyl cyanide-aromatic vinyl copolymer containing epoxy group (C) are compounded in amounts of 0.01 to 3 parts by mass and 2 to 12 parts by mass, respectively, relative to 100 parts by mass of the polyester resin (A).12-23-2010
20110136940Coating Compositions for Containers and Methods of Coating - This invention provides a coating composition for use on a food-contact surface of a container (e.g., a food or beverage can) that includes a polymer having one or more segments of Formula I:06-09-2011
20110190418Cationic Polymerization Ink - A cationic polymerization ink that can be hardened by cationic polymerization, includes monomers. The monomers include an epoxy monomer having an epoxy group as a functional group and an oxetane monomer having an oxetane group as the functional group. The monomers include a monofunctional monomer having one functional group and a polyfunctional monomer having at least two functional groups. A total functional group equivalent weight, which is a total of a functional group equivalent weight of the monofunctional monomer and a functional group equivalent weight of the polyfunctional monomer, is not less than 130 and not greater than 144. A ratio of the functional group equivalent weight of the polyfunctional monomer to the total functional group equivalent weight is not less than 23 percent and not greater than 38 percent.08-04-2011
20110190419BLENDS COMPRISING EPOXY RESINS AND MIXTURES OF AMINES WITH GUANIDINE DERIVATIVES - The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.08-04-2011
20110201724Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof - There is provided herein a curable epoxy resin composition comprising at least one curable epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.08-18-2011
20110218270USE OF LINEAR TRIETHYLENTETRAMINE AS CURING AGENT FOR EPOXY RESINS - The present invention relates to an amine composition comprising linear triethylene-tetramine and one or more amine compounds selected from the group consisting of tertiary amines derived from the condensation of ethylenediamine and methyl-substituted compounds derived from linear triethylenetetramine as well as a method of production for said composition.09-08-2011
20100016473CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME - Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH01-21-2010
20100204363COATING COMPOSITIONS CONTAINING TETRAMETHYL CYCLOBUTANEDIOL - Disclosed are solvent borne thermosetting coating compositions that contain a curable polyester resin blended with an acrylic copolymer, a crosslinker, and a solvent. The polyester resin contains 2,2,4,4-tetramethyl-1,3-cyclobutanediol and exhibits good dry time, compatibility with acrylic resins, sag resistance and hardness development in a coating composition. The coating compositions can be used to prepare clear coat or pigmented coatings for automotive OEM, auto refinish, and other applications.08-12-2010
20100120946Mitsubishi polyester film GmbH - The invention relates to biaxially oriented polyester films which contain 0.1-5.0% by weight (based on the weight of the film) of a hydrolysis stabilizer based on epoxidized fatty acid esters and 0.2-10% by weight (based on the weight of the film) of epoxidized fatty acid glycerides, the epoxidized fatty acid esters having a mean molecular weight of at least 425 g/mol. Such films find use in outdoor applications, as a ribbon cable, as a backside laminate of solar modules and in electrical insulation applications.05-13-2010
20110118386Prepreg Containing Epoxy Resin With Improved Flexural Properties - Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4′-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.05-19-2011
20120149803AUTOXIDISABLE AQUEOUS COATING COMPOSTIONS - An autoxidisable aqueous varnish composition comprising: a) film forming polymer latex binder system comprising, on a non-vol basis, i) 40-60 wt % soft autoxidisable polymer particles of Fox Tg less than 5° C., ii) 60-40 wt % hard polymer particles of Fox Tg at least 40° C. wherein the soft autoxidisable polymer particles comprise at least 60 wt % gel b) a carrier liquid comprising at least 50 wt % water and an amount of a volatile organic material of from 0 to 2 wt % when calculated on the total liquid varnish composition, c) optionally pigment at a pigment to binder weight ratio up to 0.05:1 calculated on a non-vol basis.06-14-2012
20110152407Novel diamino-alcohol compounds, their manufacture and use in epoxy resins - A new class of compounds, namely diamino alcohols, is described, along with a process for their production and their use as hardeners, or curing agents, for epoxy resin systems, some of which have high glass transition temperatures, Tgs, such as greater than about 120° C.06-23-2011
20110306703THERMALLY CURABLE SOLDER RESIST COMPOSITION - A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R12-15-2011
20110306702USE OF CYCLIC CARBONATES IN EPOXY RESIN COMPOSITIONS - The present invention relates to the use of cyclic carbonates of the formula I or a mixture thereof in epoxy resin compositions and also to epoxy resin compositions which comprise such cyclic carbonates.12-15-2011
20120041101CATALYSIS OF EPOXY RESIN FORMULATIONS - The present invention relates to epoxy resin formulations comprising a specific catalyst mixture for enhancing the reactivity thereof.02-16-2012
20120208924EPOXY RESIN COMPOSITION - An exemplary curable epoxy resin composition is disclosed which includes at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride; (b) an optional glycol or polyglycol; (c) or a compound containing two carboxylic groups is included; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10% of reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition.08-16-2012
20120046389High pH Process Resistant Coating For Metal Food Containers - Disclosed is an improved coating composition for food containers that is resistant to high pH processing environments. The improved coating composition is based upon an epoxy-amino resin coating composition that has been modified with other components to improve its performance in high pH environments balanced with flexibility, formability and abrasion resistance. Typically, the coating composition includes an epoxy resin, an amino resin cross-linking agent, a blocked polyisocyanate and a saturated polyester.02-23-2012
20120046388Liquid Monobenzoxazine Based Resin System - The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.02-23-2012
20110034591Thermosetting Resin Containing Irradiated Thermoplastic Toughening Agent - Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent and which have reduced levels of solvent-induced micro crack formation. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause a reduction in solvent-induced micro crack formation in the cured resin when compared to the same toughened thermosetting resin in which the non-irradiated version of the thermoplastic toughening agent is used.02-10-2011
20110039980Solvent-Promoted Self-Healing Materials - A composite material includes a solid polymer matrix, a plurality of capsules and a liquid, in the capsules. The liquid includes from 50 to 100 wt % of a solvent, and from 0 to 50 wt % of a polymerizer. There is no polymerizer outside of the capsules. The solid polymer matrix may include a native activating moiety for the polymerizer. The solvent may have a swelling ratio with the solid polymer matrix of at least 1.1 and/or may have a polarity ET of from 0.10 to 0.50. A composite material includes a solid polymer matrix, a plurality of capsules and a liquid, in the capsules. The liquid includes from 50 to 100 wt % of a solvent, and from 0 to 50 wt % of a polymerizer. There is no polymerizer outside of the capsules. The solid polymer matrix may include a native activating moiety for the polymerizer. The solvent may have a swelling ratio with the solid polymer matrix of at least 1.1 and/or may have a polarity ET of from 0.10 to 0.50.02-17-2011
20120115988CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS - The present invention relates to epoxy resin formulations having a specific sparingly soluble catalyst mixture for enhancing reactivity.05-10-2012
20120208925USE OF GUANIDINE DERIVATIVES AS CURING ACCELERATORS FOR EPOXY RESINS - The present invention describes guanidine derivatives of the general formula (I)08-16-2012
20120115986AMINE FUNCTIONAL ADDUCTS AND CURABLE COMPOSITIONS COMPRISING SAME - A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: 05-10-2012
20090203813Epoxy Resin, Epoxy Resin Composition Having the Same, Paint Composition and Method of Forming a Coating Layer Using the Same - In an epoxy resin having a low viscosity and excellent water resistance, an epoxy resin composition having the same, a paint composition and a method of forming a coating layer using the same, the epoxy resin composition includes an epoxy resin prepared by a reaction of a cashew nut shell liquid (CNSL) selected from cardol, cardanol, anacardic and an alkyl cardol, and a haloalkylene oxide. The paint composition having such epoxy resin composition may have excellent working efficiency and low-temperature curability, and may form a coating layer having improved water resistance.08-13-2009
20110166258RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF - Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.07-07-2011
20120022183EPOXIDE (METH) ACRYLATE COMPOSITION - The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.01-26-2012
20120157573MOLDED PRODUCT PRODUCTION DEVICE, MOLDED PRODUCT PRODUCTION METHOD, AND MOLDED PRODUCT - A molded product production device that includes a molding die having an inner circumferential surface defining a cavity with upper and lower openings, the cavity into which the molding material is to be filled, a lower punch provided so as to be inserted into the cavity from the lower opening thereof and vertically move, the lower punch having a lower punch surface and a lower punch release agent holding portion which is provided at a lower side of the lower punch surface and capable of holding a release agent, an upper punch provided so as to be inserted into the cavity from the upper opening thereof and vertically move, the upper punch having an upper punch surface, and a lower punch release agent supply means which supplies the release agent to the lower punch release agent holding portion when being exposed outside the cavity.06-21-2012
20120157572CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.06-21-2012
20120108702PROCESS FOR THE PREPARATION OF RADIATION CURABLE COMPOSITIONS - The present invention relates to a process for the preparation of radiation curable compositions comprising at least one radiation curable (meth)acrylic copolymer A and at least one (meth)acrylated epoxy compound B, said process comprising:—the preparation of a copolymer P by copolymerization of monomers comprising: (i) from 0.1 to 50 mole % of at least one epoxy (meth)acrylate (a1), and (ii) from 50 to 99.9 mole % of at least one other copolymerizable monomer (m) different from (a1) in the presence of at least one non-copolymerizable epoxy compound (b1) and—further reacting copolymer P thereby obtained and the non-copolymerizable epoxy compound (b1) with at least one carboxylic (meth)acrylate (a3).05-03-2012
20120108701COMPOSITION OF A BLEND OF POLYAMIDE AND POLYESTER RESINS - A resin blend composition of a polyamide resin and a polyester resin is described, which includes a polyamide resin, a polyester resin and an epoxy resin. The resin blend composition can have improved compatibility between the polyamide resin and the thermoplastic polyester resin, and therefore mechanical properties (strength, bending strength, elasticity, abrasion resistance, impact strength), chemical properties (solvent resistance), thermal resistance, dimensional stability, and paintability.05-03-2012
20120108700AIR-DRYING POLYESTER (METH)ACRYLATE RESIN COMPOSITION, STRUCTURE, AND METHOD FOR APPLYING THE RESIN COMPOSITION - An object of the present invention is to provide an air-drying polyester (meth)acrylate resin composition in a curing system of a ketone peroxide curing agent and a cobalt-based curing accelerator, the resin composition being used as a topcoat in the field of civil engineering and construction, and having such good properties as, when coated or stacked, being capable of forming a cured coating film with no bubbles remaining therein due to non-bubbling properties of suppressing the generation of bubbles in the course of the curing reaction and being free from problems related to room-temperature curability such as a retarded gelation time, even after being stored for about one month; a structure coated with the resin composition; and a method for applying the resin composition.05-03-2012
20120123023(METH)ACRYLATE POLYMER, A RESIN COMPOSITION AND A SHAPED ARTICLE - Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more.05-17-2012
20090131557SHAPE MEMORY RESIN - A shape memory resin of the present invention contains a network polymer and a thermoplastic polymer, and the thermoplastic polymer is dissolved in the network polymer. The shape memory resin of the present invention can be produced by a simple process of simply dissolving the thermoplastic polymer in a network polymer precursor and cross-linking this network polymer precursor. In the present invention, an epoxy compound is preferably used as the network polymer precursor.05-21-2009
20120316262NOVEL CURING AGENTS - The invention relates to a resin curing agent having the formula (I), wherein R12-13-2012
20120165430NON-AQUEOUS DISPERSIONS COMPRISING A NONLINEAR ACRYLIC STABILIZER - A non-aqueous dispersion comprising the dispersion polymerization reaction product of an ethylenically unsaturated monomer and a nonlinear, random acrylic polymer stabilizer wherein the polymerization reaction product comprises epoxy functionality is disclosed. Related coatings, methods, and substrates are also disclosed.06-28-2012
20120165429NOVEL METHODS FOR PRODUCING THERMOSETTING EPOXY RESINS - The present application relates to a method for preparing epoxy resins from a mixture of epoxidized phenolic compounds, wherein said epoxidized phenolic compounds are obtained by the epoxidation of natural phenolic compounds selected from the group comprising simple phenol, acid-phenol, coumarin, naphthoquinone, stillbenoid, flavonoid, isoflavanoid, anthocyanin, condensed tannin and hydrolyzable tannin.06-28-2012
20120165428Polymer for Extending the Open Time of Waterborne Architectural Coatings - The present invention relates to water soluble open time extenders, which are mixed with an architectural coating, such as aqueous latex paints, to increase the coating's open time and crosslink to the architectural coating upon drying. The open time extender comprises neutralized water soluble polymers with hydrophobic, hydrophilic and cross-linkable monomers, and at least one crosslinking agent. The open time extender also comprises water and the total solid content of the open time extender is less than about 25% by weight.06-28-2012
20120214905PROCESS OF RECYCLING POWDER COAT MATERIAL AND COMPONENT MADE THEREOF - A process for making a solid component out of recycled powder coat is provided. The process can include providing a powder coat material and providing a second material. Thereafter, the powder coat and the second material are mixed to produce a powder coat-second material mixture. The powder coal-second material mixture is processed in order to produce a polymer containing precursor. The processing can include granulating or densifying the powder coat-second material mixture. After the precursor has been produced, it can be placed within a molding machine and a solid component is molded. The molding machine can be an injection molding machine, an extrusion molding machine or a blow molding machine.08-23-2012
20120129977COLOR POWDER FOR COATING - A method for producing a color powder, the method comprising dry mixing a pigment powder with a base powder while applying heat, so as to bring the base powder to an adhesive state while the pigment powder remains in a stable state, thereby forming a color powder having agglomerates essentially each comprising a component of the base powder and a component of the ground pigment powder.05-24-2012
20120129976Polyoxymethylene Polymer Compositions Having Improved Creep - Processes of making articles of a melt mixed polyoxymethylene composition comprising polyoxymethylene polymer and polyoxymethylene terpolymer in which the melt mixed composition is maintained above the crystallization temperature of the polyoxymethylene polymer. Such processes impart improved creep resistance compared to that of articles made of the same melt mixed composition but which has been cooled below crystallization temperature of the polyoxymethylene polymer during manufacture. These articles are useful for making plastic gears having high heat resistance.05-24-2012
20100087567EPOXY GROUP-TERMINATED POLYMERS, THE COMPOSITIONS THEREOF AND THE USE THEREOF AS IMPACT RESISTANCE MODIFIERS - The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compostions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compostions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures.04-08-2010
20120136092THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.05-31-2012
20120136093INTERCALATION AGENT FREE COMPOSITIONS USEFUL TO MAKE NANOCOMPOSITE POLYMERS - A two step method for preparing a filler composition, the filler composition useful to prepare a nanocomposite polymer and an epoxy nanocomposite coating. First, disperse a water dispersible filler material in a liquid comprising water, but without any added intercalation agent, to form a dispersion. Second, replace at least a portion of the water of the liquid with an organic solvent so that the water concentration of the liquid is less than six percent by weight to form the filler composition, the average size of at least one dimension of the filler material being less than two hundred nanometers upon examination by transmission electron microscopy of a representative freeze dried sample of the dispersion of the first step. A nanocomposite polymer can be prepared by mixing the filler composition with one or more polymer, polymer component, monomer or prepolymer to produce a polymer containing the filler composition.05-31-2012
20120252930RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF - The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.10-04-2012
20120178852PROCESS FOR PREPARING EPISULFIDE RESINS - A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.07-12-2012
20120178851RESIN WITH HIGH HEAT TRANSFER - A resin with high heat transfer and potential is specially designed to transfer heat between two layers of different nature. One of the layers acts as an energy receiver via the outer face thereof and an energy emitter via the inner face thereof, and the other layer acts as a receiver of the accumulated energy in the resin, acting as connecting bridge between the two layers. The resin with high heat transfer of the invention includes granular particles of slate and preferably granular particles of a metallic nature, in a polymeric matrix.07-12-2012
20120083551MODIFIED EPOXIDE PRIMERS - Telechelic resins with reactive end groups (e.g., epoxy phosphate and epoxy ester) were synthesized using bisphenol-A (BPA) epoxide. The bisphenol-A based epoxide and the telechelic resins were all modified with tetraethylorthosilicate (TEOS) oligomers to produce epoxide/polysilicate (organic/inorganic) hybrid systems. The modified epoxides were thermally cured with a melamine-formaldehyde resin, cast on steel substrates and salt spray analysis revealed that the inorganically modified epoxides provided improvement over unmodified epoxide resins with respect to both corrosion resistance and adhesion to steel substrates.04-05-2012
20120259040CURABLE COMPOSITIONS - Embodiments include curable compositions including a resin component and a hardener component. The resin component can include an epoxy compound that is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, and a reactive diluent that includes a polymeric glycidyl ether. The hardener component can include an adduct and a Mannich base.10-11-2012
20100004356Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.01-07-2010
20100004355ANTICORROSIVE COATING COMPOSITION - The anticorrosive coating composition of the present invention is characterized by comprising (A) an epoxy resin, (B) an amine curing agent and (C) a hydroxyl group-containing coumarone resin wherein the hydroxyl group-containing coumarone resin (C) is contained in an amount of 1 to 500 parts by weight based on 100 parts by weight of the epoxy resin (A). The hydroxyl group-containing coumarone resin (C) preferably has a hydroxyl group content in one molecule of 1 to 5% and a softening point of not higher than 200° C. The anticorrosive coating composition can form a coating film in which the plural resin components are homogeneously mixed and which are excellent in anticorrosion properties, water resistance and adhesion. Further, since the coating composition is free from tar unlike conventional anticorrosive coating compositions, it can form a clear coating film free from bleeding out of any component, and safety and hygiene problems at the time of coating operation thereof do not occur.01-07-2010
20110046266EPOXY RESIN REACTIVE DILUENT COMPOSITIONS - An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.02-24-2011
20110046265New and novel engineering resin thermoplastic silicone vulcanizates - A method for preparing a modified thermoplastic resin by mixing a thermoplastic resin having a t02-24-2011
20120270967LOW-VISCOSITY EPOXY RESIN COMPOSITION WITH LOW BLUSHING - A two-component epoxy resin composition, including: a resin component which includes at least one epoxy resin and at least one aldehyde, and a hardener component which includes at least one polyamine having at least one primary amino group.10-25-2012
20120322915PARTICLE PRODUCTION APPARATUS, PARTICLE PRODUCTION METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION - A particle production apparatus 12-20-2012
20100197830ADHESIVE FOR ELECTRONIC COMPONENT - The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.08-05-2010
20120289624COMPOSITE COMPOSITIONS - A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.11-15-2012
20100168277CURING AGENTS FOR EPOXY-FUNCTIONAL COMPOUNDS - The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an α-β unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relates to coating compositions comprising these curing agents.07-01-2010
20100168278One-Solution Type Thermosetting Composition for Protective Film of Color Filter, and Color Filter Using Same - The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.07-01-2010
20130012619EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for electronic component encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: an allylated phenol resin containing a structural unit (1) shown below and a structural unit (2) shown below, in which a molar ratio [structural unit (1)/[structural unit (1)+structural unit (2)]×100] of the structural unit (1) to a total amount of the structural unit (1) and the structural unit (2) is from 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler, in which the allylated phenol resin as the component (B) has a glass transition temperature of −5° C. to 70° C. as measured by a differential scanning calorimetry (DSC) method:01-10-2013
20130012620CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.01-10-2013
20130012618RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART - Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent,01-10-2013
20130018126POLYETHER-MODIFIED EPOXY AMINE ADDUCTS AS WETTING AND DISPERSING AGENTSAANM Orth; UlrichAACI WeselAACO DEAAGP Orth; Ulrich Wesel DEAANM Holtkamp; HeribertAACI WeselAACO DEAAGP Holtkamp; Heribert Wesel DEAANM Omeis; JurgenAACI Dorsten-LembeckAACO DEAAGP Omeis; Jurgen Dorsten-Lembeck DE - Addition compound suitable as wetting and dispersing agent, obtainable from the reaction of 01-17-2013
20110160341COMPOSITION FOR FIXING WOUND ITEMS - The invention provides a composition for fixing wound items comprising at least one α,β-unsaturated polyester, and at least two different monomeric or oligomeric ethylenically unsaturated components. The composition of the present invention provides a composition having low curing emissions, low viscosities and excellent impregnation properties. After curing, these impregnation materials show high mechanical toughness levels even at elevated temperatures.06-30-2011
20130178558THERMOSET DAMPENER MATERIAL - Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.07-11-2013
20130096232CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM - A diluent-free curable epoxy resin composition for preparing a composite comprising: (A) at least one epoxy resin composition comprising a blend of: (A1) at least one epoxy resin, and (A2) at least one divinylarene dioxide; and (B) at least one hardener composition; and (C) at least one reinforcement materials; wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5° C. as compared to a curable composition having a reactive diluent.04-18-2013
20130131215NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD - There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility.05-23-2013
20130143982COATING COMPOSITIONS - A coating composition comprising an advanced epoxy resin polymeric composition having the following chemical structure:(formula) I where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH06-06-2013
20110224328METHOD OF MAKING A CYCLIC GUANIDINE FROM A GUANIDINIUM SALT AND A WEAK ACID AND COATING COMPOSITIONS CONTAINING THE SAME - The present invention is directed to a method for preparing a cyclic guanidine comprising reacting (i) a guanidinium, (ii) a polyamine, and (iii) a weak acid. The present invention is also directed to a coating composition comprising the cyclic guanidine.09-15-2011
20110275739EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN - An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).11-10-2011
20130150485CATHODIC ELECTROCOATING COMPOSITIONS - Disclosed herein are functionalized polymers comprising ethylene and substituted ethylene segments, which have been modified by epoxidation to enhance their crosslinking ability. These functionalized polymers are useful as film forming resins in cathodic electrocoating compositions. Also disclosed herein are aqueous dispersion compositions comprising the functionalized polymers and a process for coating various electrically conductive substrates.06-13-2013
20130150486CATALYST FOR URETHANE BOND FORMATION - The invention relates to titanium compounds ABC comprising tetravalent titanium A, a moiety derived from a glycol B by removing two hydrogen atoms from hydroxyl groups, and a moiety derived from an N-alkylol-β-hydroxyamine C synthesised by reacting a β-hydroxyamine C12 with an aldehyde C3, to a process for their preparation, and to a method of use thereof as a curing catalyst in coating compositions.06-13-2013
20120259039RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF - The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.10-11-2012
20100317767FULLERENE FILM AND FULLERENE POLYMER BOTH PRODUCED FROM FULLERENE DERIVATIVE AND PROCESSES FOR PRODUCING THESE - Disclosed is a fullerene film which can be easily formed by a wet process without deteriorating the intrinsic properties of a fullerene by using a fullerene derivative as a raw material. Also disclosed are a fullerene polymer, a method for producing a fullerene film, and a method for producing a fullerene polymer. A fullerene film or a fullerene polymer maintaining the intrinsic properties of the fullerene is obtained by coating a base with a solution of a fullerene derivative which is decomposed at a temperature lower than the thermal decomposition temperature of the fullerene, for example one represented by the formula below, and then heating the thus-obtained coating film at a temperature higher than the thermal decomposition temperature of the fullerene derivative but lower than the thermal decomposition temperature of the fullerene.12-16-2010
20120283357CURABLE PHOSPHORUS-CONTAINING FLAME RETARDANT EPOXY RESIN - This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.11-08-2012
20120283356THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior.11-08-2012
20130184376THERMOSET RESIN COMPOSITIONS WITH INCREASED TOUGHNESS - Disclosed herein is a block copolymer (M) suitable for toughening a thermoset resin (R). The block copolymer (M) has at least one block derived from a thermoplastic aromatic polymer (A) which exhibits a glass transition temperature (Tg) of at least about 150° C. and at least one block derived from a low Tg polymer (B) wherein: 07-18-2013
20130184377CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.07-18-2013
20130123389COMPOSITIONS AND PROCESSES FOR PRODUCING DURABLE HYDROPHOBIC AND/OR OLEPHOBIC SURFACES - A method for forming a coating composition for application to a surface. The method includes forming conglomerates by providing a plurality of nano-sized particles having a mean diameter in a range from about 1 to about 500 nanometers, the nano-sized particles having hydrophobic, super-hydrophobic, olephobic, or super-olephobic properties; mixing the plurality of nano-sized particles with a binding material to form a mixture and heating the mixture to induce curing to bind the nano-sized particles to form a consolidated cake-form material; cooling the consolidated cake-form material and grinding the cake-form material to produce conglomerates having a size in a range from about 1 micron to about 40 microns; and b) mixing the conglomerates with a coating material to be applied to a surface, the binding material being one of a thermosetting resin and a thermoplastic resin having a melting temperature higher than a curing temperature of the coating composition.05-16-2013
20110313080BENZOXAZINE RESIN COMPOSITION - The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the composition. The composition contains (A) a compound having in its molecule a benzoxazine ring represented by the formula (1), (B) an epoxy resin, (C) a curing agent, and (D) a toughness improver:12-22-2011
20130190424MELAMINE EPOXY RESIN MONOMER AND RESIN COMPOSITION - A melamine epoxy resin monomer including: a glycidyl group; and a structural unit having a melamine residue and being represented by the following Formula (I) is disclosed. In Formula (I), each of R07-25-2013
20120296010ENCAPSULATING SHEET AND ELECTRONIC DEVICE - An encapsulating sheet is obtained by subjecting a kneaded material to plastic working, the kneaded material including an epoxy resin represented by General Formula (1) below, a curing agent, and an inorganic filler,11-22-2012
20130203894CYCLOALIPHATIC CARBONATES AS REACTIVE DILUENTS IN EPOXY RESINS - Embodiments of the present invention disclose a method for limiting peak exotherm temperatures in epoxy systems comprising the step of: combining an amine hardener, an epoxy and a diluent to form an epoxy system, wherein the diluent is selected from the group consisting of: ethylene carbonate, propylene carbonate, butylene carbonate, delta-valerolactam, delta-valerolactone, gamma valerolactone, butyrolactam, beta butyrolactone, gamma butyrolactone, and combinations thereof.08-08-2013
20130203895CURING AGENTS FOR EPOXY RESINS - The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same, methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that posses a combination of excellent cure latency as well as low cure temperature onset.08-08-2013

Patent applications in class Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof

Patent applications in all subclasses Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof